SG11201803037YA - Cooling device and cooling system - Google Patents

Cooling device and cooling system

Info

Publication number
SG11201803037YA
SG11201803037YA SG11201803037YA SG11201803037YA SG11201803037YA SG 11201803037Y A SG11201803037Y A SG 11201803037YA SG 11201803037Y A SG11201803037Y A SG 11201803037YA SG 11201803037Y A SG11201803037Y A SG 11201803037YA SG 11201803037Y A SG11201803037Y A SG 11201803037YA
Authority
SG
Singapore
Prior art keywords
cooling
cooling device
cooling system
Prior art date
Application number
SG11201803037YA
Inventor
Yasuhito Nakamura
Shunsuke Fujii
Original Assignee
Nec Platforms Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Platforms Ltd filed Critical Nec Platforms Ltd
Publication of SG11201803037YA publication Critical patent/SG11201803037YA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG11201803037YA 2015-10-15 2016-10-14 Cooling device and cooling system SG11201803037YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015203568A JP6034465B1 (en) 2015-10-15 2015-10-15 Cooling device and cooling system
PCT/JP2016/004593 WO2017064872A1 (en) 2015-10-15 2016-10-14 Cooling device and cooling system

Publications (1)

Publication Number Publication Date
SG11201803037YA true SG11201803037YA (en) 2018-05-30

Family

ID=57419810

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201803037YA SG11201803037YA (en) 2015-10-15 2016-10-14 Cooling device and cooling system

Country Status (5)

Country Link
US (1) US20180320982A1 (en)
EP (1) EP3364140B1 (en)
JP (1) JP6034465B1 (en)
SG (1) SG11201803037YA (en)
WO (1) WO2017064872A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5986064B2 (en) * 2013-12-25 2016-09-06 Ｎｅｃプラットフォームズ株式会社 Cooling system and electronic equipment
WO2016047099A1 (en) * 2014-09-26 2016-03-31 日本電気株式会社 Cooling device and method for manufacturing same
JP6424936B1 (en) * 2017-10-04 2018-11-21 日本電気株式会社 Gas-liquid separation device, rear door, cooling device, and gas-liquid separation method
JP6579633B2 (en) * 2017-10-20 2019-09-25 Ｎｅｃプラットフォームズ株式会社 apparatus
US11729940B2 (en) * 2021-11-02 2023-08-15 Oracle International Corporation Unified control of cooling in computers
US11711908B1 (en) * 2022-03-18 2023-07-25 Baidu Usa Llc System and method for servicing and controlling a leak segregation and detection system of an electronics rack

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5714453U (en) * 1980-06-30 1982-01-25
JPH0328282Y2 (en) * 1985-04-08 1991-06-18
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
DE202006007275U1 (en) * 2006-05-06 2006-09-07 Schroff Gmbh Sub-rack with housing for receiving plug-in modules, has liquid distributor joined to heat-sink via forward- and return-line
US7882890B2 (en) * 2007-07-13 2011-02-08 International Business Machines Corporation Thermally pumped liquid/gas heat exchanger for cooling heat-generating devices
US7950244B2 (en) * 2007-11-14 2011-05-31 International Business Machines Corporation Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger
JP2009193137A (en) * 2008-02-12 2009-08-27 Sanyo Electric Co Ltd Electronic equipment cooling system
US20090225514A1 (en) * 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
FR2931961B1 (en) * 2008-06-02 2010-06-11 Bull Sas DEVICE FOR COOLING A COMPUTER BAY AND COMPUTER-BASED INSTALLATION COMPRISING SUCH A DEVICE
JP2010041007A (en) * 2008-08-08 2010-02-18 Hitachi Information & Communication Engineering Ltd Cooling unit, electronic apparatus rack, cooling system, and construction method thereof
CN101814469A (en) * 2009-02-20 2010-08-25 王玉富 Gravity circulation evaporation cooling semiconductor power device package
US7965509B2 (en) * 2009-04-06 2011-06-21 International Business Machines Corporation High performance dual-in-line memory (DIMM) array liquid cooling assembly and method
US8077462B2 (en) * 2009-09-02 2011-12-13 International Business Machines Corporation Stress relieved hose routing to liquid-cooled electronics rack door
US9727101B2 (en) * 2010-03-30 2017-08-08 Nec Corporation Cooling apparatus and cooling system for electronic-device exhaustion
US8804334B2 (en) * 2011-05-25 2014-08-12 International Business Machines Corporation Multi-rack, door-mounted heat exchanger
US9167721B2 (en) * 2011-11-29 2015-10-20 International Business Machines Corporation Direct facility coolant cooling of a rack-mounted heat exchanger
US9459031B2 (en) * 2012-02-14 2016-10-04 Nec Corporation Cooling apparatus and cooling system
US9016352B2 (en) * 2012-05-21 2015-04-28 Calvary Applied Technologies, LLC Apparatus and methods for cooling rejected heat from server racks
US9877416B2 (en) * 2015-08-24 2018-01-23 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Heat management in a server rack

Also Published As

Publication number Publication date
US20180320982A1 (en) 2018-11-08
JP2017075737A (en) 2017-04-20
WO2017064872A1 (en) 2017-04-20
EP3364140A1 (en) 2018-08-22
JP6034465B1 (en) 2016-11-30
EP3364140A4 (en) 2019-06-19
EP3364140B1 (en) 2021-12-01

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