CN110007211A - Electronic component handling apparatus and electronic component inspection device - Google Patents
Electronic component handling apparatus and electronic component inspection device Download PDFInfo
- Publication number
- CN110007211A CN110007211A CN201811592175.0A CN201811592175A CN110007211A CN 110007211 A CN110007211 A CN 110007211A CN 201811592175 A CN201811592175 A CN 201811592175A CN 110007211 A CN110007211 A CN 110007211A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- equipment
- space
- sliding part
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 189
- 239000012530 fluid Substances 0.000 claims abstract description 117
- 238000012360 testing method Methods 0.000 claims description 27
- 230000006835 compression Effects 0.000 claims description 23
- 238000007906 compression Methods 0.000 claims description 23
- 230000000994 depressogenic effect Effects 0.000 claims 2
- 238000003825 pressing Methods 0.000 description 26
- 239000000523 sample Substances 0.000 description 22
- 238000005520 cutting process Methods 0.000 description 21
- 238000001514 detection method Methods 0.000 description 20
- 238000011084 recovery Methods 0.000 description 20
- 230000007246 mechanism Effects 0.000 description 19
- 239000000758 substrate Substances 0.000 description 16
- 238000003860 storage Methods 0.000 description 15
- 238000004064 recycling Methods 0.000 description 12
- 238000009434 installation Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000039 congener Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A kind of electronic component handling apparatus and electronic component inspection device are provided, electronic component handling apparatus has: delivery section, electronic component is delivered to inspection portion, delivery section has the first component and second component, the first component has the first base portion, the first sliding part relative to the sliding of the first base portion, and the first space delimited by the first base portion and the first sliding part, second component has the second base portion for being installed on the first sliding part, the second sliding part for sliding relative to the second base portion and being abutted with electronic component, and the second space delimited by the second base portion and the second sliding part；Pipe section has the flow path for being connected to second space and supplying working fluid to second space；Flow sensor is configured at flow path, detects the flow of working fluid；Pressure-regulating portion adjusts the pressure of working fluid；And control unit, so that the second sliding part is kept electronic component, makes the second sliding part that electronic component is pressed into inspection portion.
Description
Technical field
The present invention relates to electronic component handling apparatus and electronic component inspection devices.
Background technique
Conventionally, there is known the test device tested electronic components such as IC packages (for example, referring to patent document 1).
The test device recorded in patent document 1 has: the machine of promotion presses the electronic component in the state of keeping electronic component
To socket for inspection；And pressure sensing cell, with the connection of the machine of promotion, electronic component is pressed into socket in the promotion machine by detection
When pressure (pressing force).It, can when testing electronic component also, in test device described in Patent Document 1
Testing result based on pressure sensing cell detects whether promotion machine with scheduled pressure is pressed into socket for electronic component.
Patent document 1: Japanese Unexamined Patent Publication 2003-161758 bulletin
However, in the test device recorded in patent document 1, for example, due to the size (thickness) and shape of electronic component
Collimation etc. between shape (bending and inclined shape), electronic component mounting portion (socket) and promotion machine, each weldering of electronic component
The terminal of ball and each contact pilotage of socket be not limited to uniformly in contact with.If also, the terminal of each soldered ball and each contact pilotage are anisotropically
Contact, it is likely that can not correctly carry out the test to electronic component.
Summary of the invention
The present invention to solve the above problem for the purpose of, can be realized as mode below or application examples.
[application examples 1] electronic component handling apparatus of the present embodiment, which is characterized in that have: delivery section, it is described
Delivery section has the first component and second component, and the first component has the first base portion and slides relative to first base portion
The first dynamic sliding part, the second component, which has, is configured at removably the second base portion of the first sliding part and relative to described
The second sliding part that second base portion is slided and abutted with electronic component；Flow path is connected to second space, and to the second space
Supply working fluid；Flow sensor is set to the flow path, detects the flow of the working fluid；And pressure-regulating portion, adjustment
The pressure of the working fluid, the first component are formed with the first sky between first base portion and first sliding part
Between, the second component is formed with second space between second base portion and second sliding part, sliding with described second
Dynamic portion keeps the electronic component, and the electronic component is pressed into the probe in inspection portion.
According to the present embodiment, when inspection portion carries out the electric checking to electronic component, of electronic component can be ignored
Body difference abuts each terminal of electronic component equably with each terminal in inspection portion, therefore, can correctly carry out the inspection
It looks into.
[application examples 2] in the electronic component handling apparatus that above application examples is recorded, the preferably described working fluid can be into
First space and the second space out.
According to the application example, the first sliding part can be made to slide, and the second sliding part can be made to slide.
[application examples 3] preferably includes opening/closing portion, is set in the electronic component handling apparatus that above application examples is recorded
The flow path is simultaneously opened and closed the flow path；And judging part, based on the flow sensor detection flow judgement described in
The opening and closing of opening/closing portion.
According to the application example, the leakage of the working fluid from second space can be prevented.
[application examples 4] in the electronic component handling apparatus that above application examples is recorded, the preferably described flow sensor is configured
Between the opening/closing portion and the second space of the second component.
Error detection can be prevented since more front end is cut off than opening/closing portion according to the application example.
[application examples 5] is in the electronic component handling apparatus that above application examples is recorded, it is preferable that if the flow sensor
Detect the predetermined amount of flow of the working fluid, then the judging part output alarm.
It, can be according to alarm detection predetermined amount of flow according to the application example.
[application examples 6] in the electronic component handling apparatus that above application examples is recorded, preferably described second base portion can be with
The electronic component mounting portion for loading the electronic component abuts.
According to the application example, the posture of the second base portion can be made to become the state for copying the shape of electronic component mounting portion.
Therefore, the second sliding part can abut in the state that this is copied with electronic component.As a result, for example, being carried in electronic component
The portion of setting is when carrying out the device of electric checking to electronic component, even if between electronic component mounting portion (socket) and promotion machine not
In the case where with collimation, can also assist in comes into full contact with each terminal of electronic component and each terminal of mounting portion.
[application examples 7] in the electronic component handling apparatus that above application examples is recorded, preferably described second sliding part is abutted
It is different from the abutting force that second base portion is connected to the electronic component mounting portion in the abutting force of the electronic component.
According to the application example, for example, by making the second sliding part be connected to the abutting force of electronic component less than the second base portion
It is connected to the abutting force of electronic component mounting portion, said effect can be played, and prevents from excessively pressing electronic component.
[application examples 8] preferably has in the electronic component handling apparatus that above application examples is recorded to first space
The working fluid supply unit of the working fluid is supplied with the second space.
According to the application example, by the way that common working fluid supply unit, Neng Goujian are arranged in the first space and second space
Change apparatus structure.
[application examples 9] preferably has and the second space in the electronic component handling apparatus that above application examples is recorded
The third space of connection.
According to the application example, it is able to suppress the variation for being provided with the pressure of the second space of amount in third space.
[application examples 10] in the electronic component handling apparatus that above application examples is recorded, preferably described first sliding part is by institute
The area for stating the first compression face of working fluid is greater than second sliding part by the face of the second compression face of the working fluid
Product.
According to the application example, it is set as mutually when by the pressure in the first space and second space meanwhile, it is capable to make to be applied to first
The power of sliding part is greater than the power for being applied to the second sliding part.
[application examples 11] in the electronic component handling apparatus that above application examples is recorded, preferably described second base portion can be supported
It is connected to a part of the electronic component.
According to the application example, for example, in the state of a part of the second base portion pressing electronic component, the second sliding part energy
Enough press the remainder of electronic component.
[application examples 12] in the electronic component handling apparatus that above application examples is recorded, preferably described second sliding part is abutted
It is different in the abutting force that abutting force and second base portion of the electronic component are connected to the electronic component.
According to the application example, the load for the part that the second sliding part is abutted with electronic component in electronic component can be reduced,
Or reduce the load for the part that the second base portion is abutted with electronic component in electronic component.That is, can be according to the portion of electronic component
Position keeps abutting force different.
[application examples 13] in the electronic component handling apparatus that above application examples is recorded, preferably described second base portion and described
Second sliding part is abutted relative to the electronic component in different location.
According to the application example, for example, in the state of a part of the second base portion pressing electronic component, the second sliding part energy
Enough press the remainder of electronic component.
[application examples 14] is preferably able to change respectively and flows to institute in the electronic component handling apparatus that above application examples is recorded
It states the pressure of the working fluid in the first space and flows to the pressure of the working fluid of the second space.
According to the application example, the power for being applied to the first sliding part can be made different with the power for being applied to the second sliding part.
[application examples 15] preferably includes movable part, Neng Gouzai in the electronic component handling apparatus that above application examples is recorded
It sets and moves the electronic component；And power test section, it is set to the movable part, is able to detect power, the power test section energy
Enough it is connected to the electronic component abutted with second sliding part.
According to the application example, for example, can will be slided with second when inspection portion carries out the electric checking to electronic component
Actual abutting force when the electronic component that portion abuts is connected to inspection portion is replaced into the abutting force detected by power test section.And
And can according to the size of the abutting force detected by power test section, judge check electronic component when abutting force whether be for
It is both not excessively or without insufficient size for the electronic component.
[application examples 16] electronic component inspection device of the present embodiment, which is characterized in that have: delivery section, institute
Delivery section is stated with the first component and second component, the first component has the first base portion and relative to first base portion
First sliding part of sliding, the second component, which has, is configured at removably the second base portion of the first sliding part and relative to institute
The second sliding part stating the sliding of the second base portion and being abutted with electronic component；Flow path is connected to second space, and empty to described second
Between supply working fluid；Flow sensor is set to the flow path, detects the flow of the working fluid；Pressure-regulating portion adjusts institute
State the pressure of working fluid；And inspection portion, check the electronic component, the first component first base portion with it is described
The first space, second component shape between second base portion and second sliding part are formed between first sliding part
At there is second space, the electronic component is kept with second sliding part, and the electronic component is pressed into the inspection
The probe in portion.
According to the present embodiment, the pressure of the working fluid in the first space and second space can be adjusted.Also, example
Such as, when inspection portion carries out the electric checking to electronic component, the individual difference of electronic component can be ignored, make electronic component
Each terminal is equably abutted with each terminal in inspection portion, therefore, can correctly carry out the inspection.
[application examples 17] electronic component handling apparatus of the present embodiment, which is characterized in that convey electronic component
To the inspection portion for the electrical characteristic for checking the electronic component, the electronic component handling apparatus has: delivery section, by the electricity
Subassembly is delivered to the inspection portion, and the delivery section has the first component and a second component, and the first component has the
One base portion, relative to first base portion sliding the first sliding part and by first base portion and first sliding part
The first space delimited, the second component, which has, is installed on the second base portion of first sliding part, relative to described second
Base portion slides and the second sliding part for abutting with electronic component and by second base portion and second sliding part delimitation
Second space；Pipe section has the flow path for being connected to the second space and supplying working fluid to the second space；Flow
Sensor is configured at the flow path, detects the flow of the working fluid；Pressure-regulating portion adjusts the pressure of the working fluid；With
And control unit, so that second sliding part is kept the electronic component, presses second sliding part by the electronic component
To the inspection portion.
According to the present embodiment, when inspection portion carries out the electric checking to electronic component, of electronic component can be ignored
Body difference abuts each terminal of electronic component equably with each terminal in inspection portion, therefore, can correctly carry out the inspection
It looks into.
[application examples 18] electronic component inspection device of the present embodiment is it is characterized in that, have: inspection portion, checks
The electrical characteristic of electronic component；The electronic component is delivered to the inspection portion by delivery section, and the delivery section has first
Part and second component, the first component have the first base portion, relative to first base portion sliding the first sliding part, with
And the first space delimited by first base portion and first sliding part, the second component, which has, is installed on described first
Second base portion of sliding part slides and the second sliding part for abutting with electronic component and by institute relative to second base portion
State the second space that the second base portion and second sliding part delimited；Pipe section has and is connected to the second space and to institute
State the flow path of second space supply working fluid；Flow sensor is configured at the flow path, detects the stream of the working fluid
Amount；Pressure-regulating portion adjusts the pressure of the working fluid；And control unit, so that second sliding part is kept the electronic component,
Make second sliding part that the electronic component is pressed into the inspection portion.
According to the present embodiment, the pressure of the working fluid in the first space and second space can be adjusted.Also, example
Such as, when inspection portion carries out the electric checking to electronic component, the individual difference of electronic component can be ignored, make electronic component
Each terminal is equably abutted with each terminal in inspection portion, therefore, can correctly carry out the inspection.
Detailed description of the invention
Fig. 1 is the approximate stereogram for the electronic component inspection device that first embodiment is related to from face side.
Fig. 2 is the approximate vertical view for showing the action state of electronic component inspection device shown in FIG. 1.
Fig. 3 is the perspective view for showing the equipment delivery head of the inspection area setting in Fig. 2.
Fig. 4 is that the diagrammatic partial for the working condition of equipment delivery head for successively showing the inspection area setting in Fig. 2 hangs down
Straight cross-sectional view.
Fig. 5 is that the diagrammatic partial for the working condition of equipment delivery head for successively showing the inspection area setting in Fig. 2 hangs down
Straight cross-sectional view.
Fig. 6 is that the diagrammatic partial for the working condition of equipment delivery head for successively showing the inspection area setting in Fig. 2 hangs down
Straight cross-sectional view.
Fig. 7 is when showing that (adsorption plane) is as benchmark below by suction nozzle, even from following to each end of IC equipment
The distance of son is there are the IC equipment of deviation, the vertical sectional view for the state that each terminal and each probe in inspection portion can also contact.
Fig. 8 is when showing that (adsorption plane) is as benchmark below by suction nozzle, even from following to each end of IC equipment
The distance of son is there are the IC equipment of deviation, the vertical sectional view for the state that each terminal and each probe in inspection portion can also contact.
Fig. 9 is when showing that (adsorption plane) is as benchmark below by suction nozzle, even from following to each end of IC equipment
The distance of son is there are the IC equipment of deviation, the vertical sectional view for the state that each terminal and each probe in inspection portion can also contact.
Figure 10 is the flow chart for showing the opening and closing sequence of cutting solenoid valve.
Figure 11 is the diagrammatic partial vertical sectional view for the equipment delivery head that second embodiment is related to.
Figure 12 is the diagrammatic partial vertical sectional view for the equipment delivery head that third embodiment is related to.
Figure 13 is the diagrammatic partial vertical sectional view of equipment delivery head and movable part that the 4th embodiment is related to.
Figure 14 is the diagrammatic partial vertical sectional view for the equipment delivery head that the 5th embodiment is related to.
Figure 15 is the diagrammatic partial vertical sectional view for the equipment delivery head that sixth embodiment is related to.
Description of symbols
1 ... electronic component inspection device；3 ... suction units (second component) (delivery section)；5 ... (first, pose adjustment portions
Part)；6 ... insulation parts；7 ... X-direction mobile mechanisms；8 ... pipelines；9 ... power test sections；10 ... electronic component handling apparatus；11A,
11B ... conveyor pallet structure；12 ... temperature adjustment sections；13 ... equipment delivery heads；14 ... equipment supply units；15 ... conveyor pallets
Structure；16 ... inspection portions；17,17A, 17B ... equipment delivery head；18 ... equipment recoverers；Pallet is used in 19 ... recycling；20 ... equipment are defeated
Send head；21,22A, 22B ... conveyor pallet structure；30 ... movable parts；31 ... suction nozzles (the second sliding part) (delivery section)；32 ...
One block portion；33 ... second block portions；34 ... third block portions (the second base portion) (delivery section)；35 ... washers；36 ... connectors；37,38…
Washer；41,42 ... connectors；43 ... washers；51 ... the first adjustment mechanisms；52 ... second adjustment mechanisms；53 ... diaphragms；61 ... is heat-insulated
Component；71 ... pipelines；71A ... linear guide；72 ... injectors；72A ... supporting base；73 ... adjusters；73A ... cushion block；80,
81,82 ... pipelines (flow path)；83 ... storage tanks；84 ... adjusters (pressure-regulating portion)；85 ... working fluid supply units；86 ... branch points；
87 ... flow sensors；Solenoid valve (opening/closing portion) is used in 88 ... cuttings；89 ... branch points；90 ... IC equipment (electronic component)；141…
Recess portion (low-lying area hole)；150 ... slots；152 ... guide pins；161 ... inspection portion main bodys；162 ... abutting parts；163 ... probes；165 ... recess portions
(low-lying area hole)；166 ... electronic component force sections；171 ... linking parts；181 ... recess portions (low-lying area hole)；200 ... pallets；231 ... first every
Wall；232 ... second next doors；233 ... third next doors；234 ... the 4th next doors；235 ... the 5th next doors；241 ... front covers；242,
243 ... side covers；244 ... rear covers；245 ... top covers；300 ... monitors；301 ... display pictures；311 ... above；312 ... below；
313 ... inner cavities；314 ... opening portions (suction port)；315 ... flange parts；316 ... slots；321 ... above；322 ... below；324…
Inner cavity；325 ... recess portions；331 ... above；332 ... below；333 ... inner cavities；334 ... slots；336 ... inner cavities；338,
340 ... slots；341 ... above；342 ... below；344 ... through holes；346 ... protruding portions；348 ... recess portions；400 ... signal lamps；
500 ... loudspeakers；511 ... cylinder bodies (the first base portion)；512 ... pistons (the first sliding part)；513 ... inner cavities；514 ... flanges
Portion；515 ... piston rods；516 ... through holes；521 ... plate components；531 ... below；600 ... Mouse tables；700 ... operation panels；
711A ... guide rail；712A ... sliding block；800 ... control units；901 ... terminals；902 ... substrates；903 ... protruding portions；A1 ... pallet supplies
To region；A2 ... equipment supply area (supply area)；The inspection area A3 ...；A4 ... equipment recovery zone (recovery zone)；
A5 ... pallet removes region；F3, F3 ' ... attraction；F90 ... abutting force；H90 ... distance；The first space S1 ...；S2 ... second is empty
Between.
Specific embodiment
Hereinafter, preferred embodiment based on the figure is to electronic component handling apparatus and electronic component of the invention
Check device is described in detail.
< first embodiment >
Hereinafter, referring to Fig.1~Fig. 9, to the of electronic component handling apparatus and electronic component inspection device of the invention
One embodiment is illustrated.It should be noted that hereinafter, for purposes of illustration only, as shown in Figure 1, by three mutually orthogonal axis
It is set as X-axis, Y-axis and Z axis.In addition, the X/Y plane comprising X-axis and Y-axis is level, Z axis is vertical.In addition, will be parallel with X-axis
Direction be known as " X-direction (first direction) ", by the direction parallel with Y-axis be known as " Y-direction (second direction) ", will be put down with Z axis
Capable direction is known as " Z-direction (third direction) ".In addition, the direction of the arrow institute direction of all directions is known as " just ", Xiang Fanfang
To referred to as " negative ".In addition, the "horizontal" being referred to as in this specification is not fully defined in level, as long as not interfering electronic component
Conveying further includes relative to horizontal slightly (for example, degree less than 5 °) inclined state.In addition, (right in Fig. 1, Fig. 4~Fig. 9
It is also the same in Figure 11~Figure 15) upside be known as "upper" perhaps " top " downside be known as "lower" or " lower section ".
As shown in figure 4, electronic component handling apparatus 10 of the present embodiment has: delivery section has and is used as first
The pose adjustment portion 5 of component and suction unit 3 as second component, the pose adjustment portion 5 have the cylinder as the first base portion
Body 511 and piston 512 as the first sliding part slided relative to cylinder body 511, the suction unit 3 have as being configured at work
Plug 512 removably the second base portion third block portion 34 and as relative to third block portion 34 slide and abutted with electronic component
The second sliding part suction nozzle 31；Pipeline 81, as being connected to second space S2 and to second space S2 supply working fluid R
Flow path；Flow sensor 87 is set to pipeline 81, detects the flow of working fluid R；And adjuster 84, as adjustment work
The pressure-regulating portion of the pressure of fluid R, pose adjustment portion 5 are formed with the first space S 1, suction unit 3 between cylinder body 511 and piston 512
The second space S2 is formed between second base portion and second sliding part, and the electronics is kept by third block portion 34
Component, and probe 163 (referring to Fig. 5) pressing by electronic component to inspection portion 16 (referring to Fig. 5).
It, also can be by adjusting the first space S 1 and second space S2 even if electronic component has individual difference as a result,
The pressure of interior working fluid R offsets the difference.Also, for example, carrying out electricity to electronic component in inspection portion 16 (referring to Fig. 5)
When gas checks, the individual difference of electronic component can be ignored, keep each terminal of electronic component and each terminal in inspection portion 16 uniform
Ground abuts, and therefore, can correctly carry out the inspection.In addition, by the flow of working fluid R in detection pipeline 81, Neng Goujian
Survey whether working fluid R leaks from pipeline 81.
Electronic component inspection device 1 of the present embodiment has the electronic component handling apparatus 10 of present embodiment,
It is also equipped with the inspection portion 16 for checking electronic component.That is, the electronic component inspection device 1 of present embodiment has: delivery section,
With the pose adjustment portion 5 as the first component and as the suction unit 3 of second component, the pose adjustment portion 5 has conduct
The cylinder body 511 of first base portion and piston 512 as the first sliding part slided relative to cylinder body 511, the suction unit 3 has
It is slided as the third block portion 34 for removably the second base portion for being configured at piston 512 and as relative to third block portion 34, and
The suction nozzle 31 of the second sliding part abutted with electronic component；Pipeline 81 is connected to as with second space S2, and to second space S2
Supply the flow path of working fluid R；Flow sensor 87 is set to pipeline 81, detects the flow of working fluid R；Adjuster 84 is made
For the pressure-regulating portion of the pressure of adjustment working fluid R；And inspection portion 16, for checking electronic component, pose adjustment portion 5 is in cylinder body
The first space S 1 is formed between 511 and piston 512, suction unit 3 forms second space between third block portion 34 and suction nozzle 31
S2 keeps electronic component by suction nozzle 31, and electronic component is pressed to the probe 163 in inspection portion 16.
The electronic component inspection device 1 with electronic component handling apparatus 10 above-mentioned is obtained as a result,.In addition,
Electronic component can be transported to inspection portion 16, thereby, it is possible to the inspection to the electronic component is carried out in inspection portion 16.In addition,
Electronic component after inspection can be transferred out from inspection portion 16.
Hereinafter, being illustrated to the structure in each portion.Fig. 1 is the electronic component inspection of the present embodiment from face side
Look into the approximate stereogram of device.Fig. 2 is the approximate vertical view for showing the action state of electronic component inspection device shown in FIG. 1.
As shown in Figure 1 and Figure 2, the electronic component inspection device 1 of built-in electronic component conveying apparatus 10, e.g. conveying BGA (Ball
Grid Array) encapsulation the electronic components such as IC equipment and the electrical characteristic of electronic component is checked in the transmission process
Or the device of test (hereinafter simply referred to as " checking ").It should be noted that hereinafter, for purposes of illustration only, to use IC equipment
The case where as electronic component, is illustrated for representative, and is denoted as " IC equipment 90 ".In the present embodiment, IC equipment 90
In tabular.In addition, configured with multiple hemispherical terminals 901 below IC equipment 90 (referring to Fig. 5 and Fig. 6).
It should be noted that as IC equipment other than the equipment, such as " LSI (Large can be enumerated
Scale Integration) ", " CMOS (Complementary MOS) ", " CCD (Charge Coupled Device) " and
By " the module I C " after multiple IC EM equipment module encapsulations, in addition, " crystal equipment ", " pressure sensor ", " inertial sensor
(acceleration transducer) ", " gyro sensor ", " fingerprint sensor " etc..
In addition, electronic component inspection device 1 (electronic component handling apparatus 10) carries in advance and using by IC equipment 90
The external member for being referred to as " replacement external member " of variety exchanging.There is the mounting portion of mounting IC equipment 90, as this in the replacement external member
Mounting portion, such as have aftermentioned temperature adjustment section 12, equipment supply unit 14 etc..In addition, the mounting portion as mounting IC equipment 90,
Also there are the inspection portion 16 by user's preparation or pallet 200, separated with replacement external member as described above.In the present embodiment,
The second block portion 33 and third block portion 34 of suction unit 3 shown in Fig. 4 are equivalent to replacement external member.
Electronic component inspection device 1 has pallet supply area A1, the (hereinafter simply referred to as " supply of equipment supply area
Region ") A2, inspection area A3, equipment recovery zone (hereinafter simply referred to as " recovery zone ") A4 and pallet removal region
A5, as described later, these regions are separated by each wall portion.Also, for IC equipment 90, from pallet supply area A1 to support
Disk removes region A5 and presses arrow α90Each region is successively passed through in direction, and inspection area A3 on the way is checked.In this way, electronics
Component check device 1 has: electronic component handling apparatus 10 i.e. automatic letter sorting machine, conveys IC equipment 90 in each region；Inspection portion
16, it is checked in the A3 of inspection area；And control unit 800.In addition, in addition to this, electronic component inspection device 1 is also equipped with
Monitor 300, signal lamp 400 and operation panel 700.
It should be noted that being removed for electronic component inspection device 1 with tray supply area A1 and pallet
The side of region A5, i.e. downside in Fig. 2 are face side, the side of configuration inspection region A3, i.e. upside in Fig. 2 is as the back side
Side uses.
Pallet supply area A1 is supplied with the material supply for being arranged with the pallet 200 of IC equipment 90 of multiple non-inspection states
Portion.In the A1 of pallet supply area, multiple pallets 200 can be laminated.
Supply area A2 is will to convey respectively from multiple IC equipment 90 on the pallet 200 that A1 conveying in pallet supply area comes
And it supplies to the region of inspection area A3.It should be noted that according to the side for crossing over pallet supply area A1 and supply area A2
Formula is provided with conveyor pallet structure 11A, the 11B for conveying pallet 200 in the horizontal direction one by one.Conveyor pallet structure 11A is
Pallet 200 can be made together with the arrow α for being placed in the IC equipment 90 of pallet 200 to the positive side of Y-direction, i.e. in Fig. 211ADirection is moved
Dynamic moving portion.Thereby, it is possible to IC equipment 90 is steadily sent into supply area A2.In addition, conveyor pallet structure 11B is can
Make empty pallet 200 to the negative side of Y-direction, i.e. arrow α in Fig. 211BThe mobile moving portion in direction.Thereby, it is possible to make empty support
Disk 200 is moved to pallet supply area A1 from supply area A2.
Supply area A2 is provided with (ソ ー Network プ レ ー ト (the English statement: soak plate, Chinese statement of temperature adjustment section
(example): temperature-uniforming plate)) 12, equipment delivery head 13 and conveyor pallet structure 15.
Temperature adjustment section 12 is configured to load the mounting portion of multiple IC equipment 90, is known as that the IC of the mounting can be set
Standby 90 unified heating or cooling " temperature-uniforming plate ".IC equipment 90 by the temperature-uniforming plate, before capable of checking examined portion 16
The temperature for perhaps cooling down and being adjusted to suitable for the inspection (high temperature inspection or low temperature inspection) is heated in advance.Shown in Fig. 2
In structure, configuration there are two temperature adjustment section 12 and is fixed in the Y direction.Also, it will be supplied by conveyor pallet structure 11A from pallet
The IC equipment 90 on pallet 200 come to region A1 conveying is delivered to arbitrary temperature adjustment section 12.It should be noted that conduct
The temperature adjustment section 12 of the mounting portion can carry out stable temperature to the IC equipment 90 in temperature adjustment section 12 due to being fixed
Adjustment.
Equipment delivery head 13 is supported in a manner of it can move in X-direction and Y-direction in the A2 of supply area, also
Has part that can be mobile in Z-direction.Equipment delivery head 13 can undertake the support come from pallet supply area A1 conveying as a result,
The conveying of IC equipment 90 between disk 200 and temperature adjustment section 12 and temperature adjustment section 12 and aftermentioned equipment supply unit 14
Between IC equipment 90 conveying.It should be noted that the movement of the X-direction of equipment delivery head 13 is by arrow α in Fig. 213X
It indicates, the movement of the Y-direction of equipment delivery head 13 is by arrow α13YIt indicates.
Conveyor pallet structure 15 is the empty pallet 200 by the state after the removal of whole IC equipment 90 in the A2 of supply area
To X-direction positive side, i.e. arrow α15The mechanism of direction conveying.Also, after the conveying, empty pallet 200 passes through conveyor pallet
Structure 11B returns to pallet supply area A1 from supply area A2.
Inspection area A3 is the region for checking IC equipment 90.In the inspection area, A3, which is provided with, checks IC equipment 90
Inspection portion 16 and equipment delivery head 17 with suction unit 3.It is additionally provided with according to leap supply area A2 and test zone
The mobile equipment supply unit 14 of the mode of domain A3 and that moves in the way of across inspection area A3 and recovery zone A4 set
Standby recoverer 18.
Equipment supply unit 14 is configured to be placed with by the mounting portion of 12 temperature of temperature adjustment section IC equipment 90 adjusted, energy
It is enough that the IC equipment 90 is delivered near inspection portion 16, referred to as " supply shuttle plate " or simply " supply shuttle ".
In addition, the equipment supply unit 14 as the mounting portion, according to can between supply area A2 and inspection area A3
In X direction, i.e. arrow α14The mode that direction moves back and forth is supported.Equipment supply unit 14 can be by IC equipment 90 from confession as a result,
It is steadily transported near the inspection portion 16 of inspection area A3 to region A2, in addition it is possible to defeated by equipment in inspection area A3
Sending first 17 to remove, IC equipment is after 90s to again return to supply area A2.
In structure shown in Fig. 2, there are two equipment supply units 14 for configuration in the Y direction, by the IC in temperature adjustment section 12
Equipment 90 is delivered to arbitrary equipment supply unit 14.In addition, same as temperature adjustment section 12, equipment supply unit 14 is configured to add
Heat or the cooling IC equipment 90 for being placed in equipment supply unit 14.It is adjusted to temperature is carried out by temperature adjustment section 12 as a result,
IC equipment 90 is able to maintain that the temperature adjusts state, and is delivered near the inspection portion 16 of inspection area A3.
Equipment delivery head 17, which is to maintain, maintains the IC equipment 90 of temperature adjustment state, and IC equipment 90 is delivered to inspection
Operating member in the A3 of region, i.e. one kind of delivery section.The equipment delivery head 17 according in the A3 of inspection area can in the Y direction with
And the mode moved back and forth in Z-direction is supported, and a part of the mechanism of " index arm " is known as.Equipment delivery head as a result,
IC equipment 90 on the equipment supply unit 14 come from supply area A2 conveying can be conveyed and be loaded to inspection portion 16 by 17.It needs
It is noted that the round-trip of equipment delivery head 17 in the Y direction is by arrow α in Fig. 217YIt indicates.In addition, though equipment is defeated
First 17 are sent to be supported in the way of it can move back and forth in the Y direction and in Z-direction, but it is not limited to this, can also be according to
The mode that can also be moved back and forth in the X direction is supported.
In addition, same as temperature adjustment section 12, equipment delivery head 17 is configured to add the IC equipment 90 of holding
Heat is cooling.Thereby, it is possible to persistently maintain the temperature of IC equipment 90 to adjust state from equipment supply unit 14 to inspection portion 16.
Inspection portion 16 is configured to load electronic component i.e. IC equipment 90, and the electrical characteristic of IC equipment 90 is checked
Mounting portion.The multiple probes 163 being electrically connected with the terminal 901 of IC equipment 90 are provided with (referring to Fig. 5 and figure in the inspection portion 16
6).Also, it is contacted by the terminal 901 of IC equipment 90 and the electrical connection of probe 163, is able to carry out the inspection of IC equipment 90.IC
The inspection of equipment 90 is the program stored in the inspection control unit being had based on the analyzer (not shown) connecting with inspection portion 16
And carry out.It should be noted that inspection portion 16 is also same as temperature adjustment section 12, IC equipment 90 can be carried out heating or
It is cooling, IC equipment 90 is adjusted to the temperature of suitable inspection.
Equipment recoverer 18 is configured to be positioned in the IC equipment 90 that inspection portion 16 completes detection, and IC equipment 90 is defeated
It send to the mounting portion of recovery zone A4, be referred to as " recycling shuttle plate " or be referred to simply as " recycling shuttle ".
In addition, equipment recoverer 18 is according to can in X direction between inspection area A3 and recovery zone A4, i.e. arrow α18
The mode that direction moves back and forth is supported.In addition, in structure shown in Fig. 2, it is same as equipment supply unit 14, in the Y direction
There are two equipment recoverer 18, the IC equipment 90 in inspection portion 16 is conveyed and is placed in arbitrary equipment recoverer for configuration
18.The conveying is carried out by equipment delivery head 17.
Recovery zone A4 is to recycle to be examined and complete the region of multiple IC equipment 90 of the detection in inspection area A3.It should
Recovery zone A4 is provided with recycling pallet 19, equipment delivery head 20 and conveyor pallet structure 21.In addition, recovery zone A4 is also
Prepare free pallet 200.
Recycling pallet 19 is the mounting portion for being positioned in the examined IC equipment 90 in inspection portion 16, and according in recovery zone
Irremovable mode is fixed in A4.Even as a result, in returning configured with various movable parts such as more equipment delivery heads 20
Region A4 is received, the IC equipment 90 that inspection is completed also can be steadily loaded on recycling pallet 19.It should be noted that scheming
In structure shown in 2, there are three recycling pallets 19 for configuration in X direction.
In addition, also configuring in X direction, there are three empty pallets 200.The pallet 200 of the sky is also for being positioned in inspection portion
The mounting portion of 16 examined IC equipment 90.Also, the IC equipment 90 on the mobile next equipment recoverer 18 of recovery zone A4
Conveyed and be placed in any one in the pallet 200 of recycling pallet 19 and sky.IC equipment 90 is tied according to inspection as a result,
Fruit is classified and recycles.
Equipment delivery head 20 is supported in the way of it can move in X-direction and Y-direction in the A4 of recovery zone,
Also it is further equipped with the part that can be moved in z-direction.Equipment delivery head 20 can recycle IC equipment 90 from equipment as a result,
Portion 18 is delivered to the pallet 200 of recycling pallet 19 or sky.It should be noted that in Fig. 2, the X-direction of equipment delivery head 20
Movement by arrow α20XIt indicates, the movement of the Y-direction of equipment delivery head 20 is by arrow α20YIt indicates.
Conveyor pallet structure 21 be will be removed from pallet empty pallet 200 that A5 conveying in region comes in the A4 of recovery zone to
X-direction, i.e. arrow α21The mechanism of direction conveying.Also, after the conveying, empty pallet 200 can be configured to recycling IC to set
Standby 90 position, i.e. any one in the pallet 200 of three skies.
Pallet removal region A5 is to recycle and remove the pallet 200 for being arranged with multiple IC equipment 90 that inspection state is completed
Material removal portion.In pallet removal region A5, multiple pallets 200 can be laminated.
In addition, being provided with each pallet 200 in the way of across recovery zone A4 and pallet removal region A5 in Y
Conveyor pallet structure 22A, the 22B being just delivered up.Conveyor pallet structure 22A is can to make pallet 200 in the Y direction, i.e. arrow
α22AThe moving portion that direction moves back and forth.Thereby, it is possible to the IC equipment 90 that inspection is completed is delivered to pallet from recovery zone A4
Remove region A5.In addition, conveyor pallet structure 22B is able to use the empty pallet 200 in recycling IC equipment 90 to Y-direction just
Side, i.e. arrow α22BDirection is mobile.Thereby, it is possible to so that empty pallet 200 is moved to recovery zone A4 from pallet removal region A5.
Control unit 800 can control such as conveyor pallet structure 11A, conveyor pallet structure 11B, temperature adjustment section 12, set
Standby delivery head 13, conveyor pallet structure 15, inspection portion 16, equipment delivery head 17, equipment recoverer 18, is set equipment supply unit 14
The work in each portion of standby delivery head 20, conveyor pallet structure 21, conveyor pallet structure 22A and conveyor pallet structure 22B.Control
Portion 800 can judge the opening and closing of cutting solenoid valve 88 based on the flow that flow sensor 87 detects.Thereby, it is possible to prevent work
Make the leakage of fluid R from aftermentioned second space S2 and pipeline 81.
Operator can set by monitor 300 and confirm the operation condition etc. of electronic component inspection device 1.It should
Monitor 300 has the display picture 301 being for example made of liquid crystal panel, and is configured in electronic component inspection device 1 just
Surface side top.As shown in Figure 1, the right side in the figure of pallet removal region A5, is provided with the Mouse table 600 of mounting mouse.It should
Mouse in the picture that performance monitor 300 is shown for using.
In addition, being configured with operation panel 700 in the lower right of Fig. 1 relative to monitor 300.Operation panel 700 is to remove
Device other than monitor 300, for the desired movement of order electronic component inspection device 1.
In addition, signal lamp 400 can inform the working condition etc. of check device 1 by the combination of luminous color.Signal
Lamp 400 configures on the top of check device 1.It should be noted that loudspeaker 500 is built-in in electronic component inspection device 1,
The working condition etc. of check device 1 can also be informed by the loudspeaker 500.
In electronic component inspection device 1, divided between pallet supply area A1 and supply area A2 by the first next door 231
Every being separated between supply area A2 and inspection area A3 by the second next door 232, between inspection area A3 and equipment recovery zone A4
Separated by third next door 233, equipment recovery zone A4 and pallet remove and separated between the A5 of region by the 4th next door 234.In addition, for
Also separated by the 5th next door 235 between region A2 and equipment recovery zone A4.
1 most external of electronic component inspection device by lid cover, the lid for example have front cover 241, side cover 242, side cover 243, after
Lid 244 and top cover 245.
Fig. 3 is the perspective view for showing the equipment delivery head of the inspection area setting in Fig. 2.Fig. 4~Fig. 6 is successively to show
The diagrammatic partial vertical sectional view of the working condition of the equipment delivery head of inspection area setting in Fig. 2.It should be noted that figure
In 3, left side is shown mounted to the second block portion 33 of the first block portion 32 and the state of third block portion 34 in figure, and right side shows in figure
The state of the second block portion 33 and third block portion 34 that are removed out from the first block portion 32.
As previously mentioned, equipment delivery head 17 is supported in the way of it can move in the Y direction and in Z-direction.Equipment
Delivery head 17 is used to convey IC equipment 90 in the A3 of inspection area.As shown in Fig. 4~Fig. 6, equipment delivery head 17 has suction unit
3, pose adjustment portion 5 and insulation part 6.
Suction unit 3 is to be configured to keep the electronic component i.e. attraction unit of IC equipment 90 by attraction (absorption).
The suction unit 3 has suction nozzle 31, the first block portion 32, the second block portion 33 and third block portion 34.Second block portion 33 and third block portion
34 are equivalent to " replacement external member " above-mentioned.Second block portion 33 and third block portion 34 can be according to the variety exchangings of IC equipment 90, that is,
Handling.Although it should be noted that the second block portion 33 and third block portion 34 be it is independent, but it is not limited to this, also may be constructed
It is integrated.It should be noted that, although the setting quantity of suction unit 3 is one in Fig. 4~structure shown in fig. 6, but not
It is limited to this, is also possible to multiple.
Vacuum generates source, that is, injector 72 and grants attraction F3 to suction unit 3.Negative pressure is generated by the work of injector 72,
Suitable pressure is adjusted by pressure regulating device, that is, adjuster 73, by pipeline 71 and connector 36, makes inner cavity 324 and interior
Cavity portion 333 becomes negative pressure.The leakage of air can be prevented by connector 36.
Suction nozzle 31 can adsorb IC equipment 90, by having the cylinder of the inner cavity 313 in above 311 and following 312 opening
The component of shape is constituted.Inner cavity 313 is functioned as the flow path bypassed air through.Also, inner cavity 324 and inner cavity
333 become negative pressure, and the inner cavity 313 be connected to this is as negative pressure, that is, air by being flowed upwards in inner cavity 313, from
And below 312 opening portion (suction port) 314 generates attraction F3.Thereby, it is possible to adsorb IC using following 312 as adsorption plane
Equipment 90.Rise in addition, flowing into air and pressure to inner cavity 313, that is, by air to flowing underneath in inner cavity 313,
Alternatively, stopping the flowing of air upwards, so that attraction F3 reduces, until disappearing, IC equipment 90 can be made from following 312 solution
Except (disengaging).It should be noted that will attract the direction of IC equipment 90 later, i.e. the direction of attraction F3 effect is known as " inhaling
Draw direction α3".In addition, attracting direction α3Towards the positive side of Z-direction (referring to Fig. 5).
In addition, the maximum value (greatest attraction forces of suction unit 3) of attraction F3 and be not limited, for example, preferably -95kPa with
Upper -30kPa is hereinafter, more preferably -90kPa or more -50kPa or less.Further, it is configured to the pressure by adjuster 73
It sets to change the attraction F3 of suction unit 3.It should be noted that as adjuster 73, for example, it is preferable to which electropneumatic is adjusted
Device.Thereby, it is possible to stepless change attraction F3 (adjustment).Attraction F3 in this way, can adjust and be installed in suction
The vacuum degree in the region that the washer 35 (for example, o-ring in present embodiment) of mouth 31 is sealed.It should be noted that at this
In embodiment, the vacuum degree of suction nozzle 31 is set as constant.
In the peripheral part of suction nozzle 31, the flange part 315 of enlarged outside diameter is protrudedly formed in the way of its length direction.It is convex
Edge 315 is abutted with third block portion 34, can prevent suction nozzle 31 from falling off from suction unit 3 (referring to Fig. 4).It should be noted that convex
The peripheral part of edge 315 is formed with slot 340.Slot 340 is formed as cyclic annular along the circumferencial direction of flange part 315.Also, the slot 340
Configured with cricoid washer 43.Thereby, it is possible to keep the pressure of second space S2.In addition, being formed in the lower section of flange part 315
Slot 150.Form a slot 150.152 insertion groove 150 of guide pin of third block portion 34.Thereby, it is possible to prevent suction nozzle 31 relative to
The rotation of three block portions 34.
In addition, being formed with slot 316 than 315 more top of flange part in the peripheral part of suction nozzle 31.Circle of the slot 316 along suction nozzle 31
Circumferential direction is formed as cyclic annular.Also, cricoid washer 35 is configured in the slot 316.Washer 35 is in suction nozzle 31 and second piece as a result,
It is compressed between portion 33.
The first block portion 32 is configured in the top of suction nozzle 31.First block portion 32 is by with the upper surface of smooth 321 and following
The component of 322 bulk (or plate) is constituted.First block portion 32 has the recess portion 325 of 322 opening below.The ratio of suction nozzle 31
The partial insertion recess portion 325 of 315 upper side of flange part.Suction nozzle 31 can move in z-direction as a result,.In addition, the first block portion 32
The inner cavity 324 for having below 322 and above 321 openings.Same, 324 conduct of inner cavity with the inner cavity 313 of suction nozzle 31
The flow path bypassed air through functions.
In addition, connector 36 is airtightly connected to inner cavity 324 from 321 sides above.Connector 36 passes through pipeline 71 and injector
72 connections.In addition, being configured with adjuster 73 that is, between connector 36 and injector 72 in the way of pipeline 71.
In addition it is possible in the heating for example heated to the IC equipment 90 adsorbed by suction nozzle 31 built in the first block portion 32
Device (not shown).
The lower section of first block portion 32 is configured with the second block portion 33.Second block portion 33 by with the upper surface of smooth 331 and under
The component of the bulk (or plate) in face 332 is constituted, above 331 connect with below the first block portion 32 322.
Second block portion 33 has the inner cavity 333 in above 331 and following 332 opening.The ratio flange part 315 of suction nozzle 31 is more
The partial insertion of upside is to inner cavity 333.Suction nozzle 31 can move in z-direction as a result,.
In addition, inner cavity 333 is also functioned as the flow path bypassed air through, by the inner cavity 333, suction nozzle 31
Inner cavity 313 is connected to the inner cavity 324 of the first block portion 32.The a series of flow path bypassed air through is formed as a result,.
In 331 sides of the upper surface of the second block portion 33, above, 331 open slots 334 are formed as the ring concentric with inner cavity 333
Shape.The slot 334 is configured with cricoid washer 37.Washer 37 is compressed between the first block portion 32 and the second block portion 33 as a result, with
Washer 35 together, is able to maintain that the air-tightness of a series of flow path.
First block portion 32 and the second block portion 33 have the peripheral part of the first block portion 32 of connection and the periphery of the second block portion 33
The inner cavity 336 in portion.Connector 41 is airtightly connected to the inner cavity 336 from outside.Connector 41 passes through pipeline 8 (pipeline 81) and work
Make the connection of fluid supply unit 85.The leakage of air can be prevented by connector 41.
In 331 sides of the upper surface of the second block portion 33, above, 331 open slots 338 are formed as the ring concentric with inner cavity 336
Shape.The slot 338 is configured with cricoid washer 38.Washer 38 is compressed between the first block portion 32 and the second block portion 33 as a result, with
Washer 35 together, is able to maintain that the air-tightness of a series of flow path.
Working fluid supply unit 85 is (such as empty to aftermentioned first space S 1 and second space S2 supply working fluid R
Gas).By the way that common working fluid supply unit 85 is arranged in the first space S 1 and second space S2, apparatus structure can be made simple
Change.Further, in the first space S 1 and second space S2, it can omit and dedicated working fluid supply unit is respectively set.Cause
This, can be such that apparatus structure is further simplified.In addition, empty by enabling working fluid R to enter and leave the first space S 1 and second
Between S2 piston 512 can be made to slide in cylinder body 511 as described later, and suction nozzle 31 can be made to slide in through hole 344.
Here, although the pressure of the working fluid R supplied to the first space S 1 and second space S2 is in the present embodiment
It is uniform pressure, but can also be different.It should be noted that working fluid supply unit 85 other than the supply of working fluid, is gone back
It is able to carry out attraction (recycling of working fluid R).
The lower section of second block portion 33 is configured with third block portion 34.Third block portion 34 is by with the upper surface of smooth 341 and following
The component of 342 bulk (or plate) is constituted, above 341 connect with below the second block portion 33 332.
341 side of the upper surface of third block portion 34, which is formed with, to be opened and under vertical view above 341 than the flange part 315 of suction nozzle 31
Big recess portion 348.In the recess portion 348, flange part 315 can move in z-direction.
Also, as shown in figure 4, in the state that flange part 315 is abutted with the bottom of recess portion 348, in the downside of suction nozzle 31
The mobile boundary of position limited, therefore, falling off for suction nozzle 31 can be prevented.On the other hand, in flange part 315 and second
Below block portion 33 in the state of 332 abuttings, the mobile boundary of the position of the upside of suction nozzle 31 is limited.It should be noted that
The movable area that suction nozzle 31 can move substantially ensured, with can be corresponding with the thickness of various IC equipment 90.By second piece
332 spaces separated with the second compression face M2 are functioned as the second space S2 of supply working fluid R below portion 33.
In addition, the bottom of recess portion 348 is formed with the through hole 344 of perforation to following 342.No matter the position of suction nozzle 31 is such as
What, can be prominent from through hole 344 than the part of 315 lower side of flange part.
Third block portion 34 has guide pin 152.Guide pin 152 is corresponding with the slot 150 of suction nozzle 31, is configured at third block portion 34.
Guide pin 152 is fixed in third block portion 34, and protrudes upwards.Also, as previously mentioned, by the way that guide pin 152 is inserted into suction nozzle
31 slot 150, is able to carry out the positioning of suction nozzle 31 and recess portion 348.Thereby, it is possible to prevent suction nozzle 31 relative to third block portion 34
Rotation.
Pose adjustment portion 5 is being configured with than 3 more top of suction unit.In the state that pose adjustment portion 5 is referred to as shown in Fig. 6
" the compliance unit " that the posture of suction unit 3 is adjusted.Pose adjustment portion 5 has the first adjustment mechanism 51 and second adjustment machine
Structure 52.
The first adjustment mechanism 51 undertakes pose adjustment and attraction of the suction unit 3 around X-axis in the pose adjustment of suction unit 3
Pose adjustment of the portion 3 around Y-axis.
The piston 512 that the first adjustment mechanism 51 has cylinder body 511 and can slide in z-direction relative to cylinder body 511.
Cylinder body 511 has inner cavity 513 in inside.The inside of the insertion of piston 512 inner cavity 513.Piston 512 has flange part 514
And the piston rod 515 of connection flange part 514 and second adjustment mechanism 52.In addition, the peripheral part of flange part 514 has fillet.
The oblique posture of the central axis that its peripheral part with fillet of piston 512 can be changed to piston 512 as a result,.Therefore, living
Plug 512 can change posture in the way of the direction for copying the face of abutting part 162 in inspection portion 16.It should be noted that
It can be omitted the fillet of piston 512, setting and the independent washer of piston 512.In this case, washer is made of i.e. elastomer
Can, as described above, piston 512 can be changed to the oblique posture of central shaft.
In addition, as shown in figure 4, cylinder body 511 is provided with the through hole 516 of perforation inner peripheral portion and peripheral part.Connector 42 is from outer
Side is airtightly connected to the through hole 516.Connector 42 is connect by pipeline 8 (pipeline 82) with working fluid supply unit 85.Pass through
Connector 42 can prevent the leakage of air.
It should be noted that pipeline 8 is configured to from difference on the way be pipeline 81 and pipeline 82.In addition, in point of pipeline 8
Storage tank 83 and the adjuster 84 as pressure-regulating portion are provided between qi point 86 and working fluid supply unit 85.Adjuster 84 is configured at
Than storage tank 83 closer to 85 side of working fluid supply unit.The pressure of the adjustment of adjuster 84 working fluid R.It should be noted that adjusting
Section device 84 can be set as structure same as adjuster 73.
Alternatively, it is also possible to which (compliance unit is used with air spring with (will be provided with second space S2 in the present embodiment respectively
Mechanism be known as air spring)) two or more electropneumatic controllers of installation.
Storage tank 83 can stockpile the working fluid R supplied from working fluid supply unit 85 in inside, as working fluid R's
Spareslots or dashpot function.In addition, its inner space of storage tank 83 is connected to by pipeline 81 with second space S2.That is,
Storage tank 83 is functioned as the third space being connected to second space S2.As a result, due to the movement of suction nozzle 31, even if second is empty
Between S2 pressure oscillation because being connected to storage tank 83, working fluid R is flowed out to storage tank 83 or working fluid R is from third space
Into.Therefore, the internal pressure that can mitigate second space S2 changes.As a result, suction nozzle 31 can steadily press IC equipment 90.
In this way, storage tank 83 is functioned as the easing portion for the pressure oscillation for mitigating second space S2.
Electronic component handling apparatus 10 has the cutting for being set to pipeline 81 and the opening/closing portion (valve) as opening and closing pipeline 81
It uses solenoid valve 88 and judges the judgement of the opening and closing of cutting solenoid valve 88 as the flow detected based on flow sensor 87
The control unit 800 (referring to Fig.1) in portion.Thereby, it is possible to prevent working fluid R from leaking from second space S2.
In addition, can prevent the pressure of the first space S 1 from declining when working fluid R is leaked from second space S2, and it is difficult
The individual difference of electronic component is offset to adjust by the pressure of the working fluid R of the first space S 1.
Further, especially have mechanical spring and (in the present embodiment, will not have second space S2 being changed to
Mechanism be known as mechanical spring) replacement external member when, it is possible to such problems occurs, though as a result, installation have mechanical elastic
The replacement external member of spring can also prevent from leaking due to air, the pressure decline of the first space S 1, so that contact deteriorates.In addition,
The setting mistake of operator can be prevented, carries out stable inspection (contact) always.Flow sensor 87 is also possible to for sentencing
Whether disconnected installed replacement external member is the sensor for having the replacement external member of mechanical spring.
Flow sensor 87 is configured between cutting solenoid valve 88 and the second space S2 of suction unit 3.As a result, due to than
The more front end of cutting solenoid valve 88 is cut off, and can prevent error detection.For example, when installation has the replacement external member of mechanical spring
When, due to being cut off than the cutting more front end of solenoid valve 88, the flow of working fluid R is unchanged.Therefore, without error detection.Separately
Outside, when forgetting installation and replacement external member, the leakage of working fluid R can also be prevented.
The flow sensor 87 of the flow of detection working fluid R is provided in the way of pipeline 81.Flow sensor 87
In in pipeline 81, it is set near cutting solenoid valve 88.Flow sensor 87 is able to detect the connector 41 of pipeline 81 and cuts
The disconnected flow between solenoid valve 88.The flow of working fluid R other detection methods as flow sensor 87, for example, making
Hot-wire flowmeter is used to detect the stream of working fluid R by the configuration of flow sensor 87 in pipeline 81 as flow sensor 87
Amount.
It should be noted that flow sensor 87 is also possible to the maximum sensor for being able to detect 5L/min.It is passed in flow
In the flow detection of sensor 87, non-leak condition is that flow is 0~0.3L/min, or is also possible to 0~0.1L/min.Separately
Outside, flow sensor 87 can also be built in adjuster 84.
The mode of flow sensor 87 is to be able to detect flow, is not particularly limited.Flow sensor 87, such as
It can be electromagnetic type flow meter, vortex-shedding meter, turbine flowmeter, area flowmeter, differential pressure flowmeter, ultrasonic flowmeter
Or coriolis flowmeter.It should be noted that being not limited to flow sensor, for example, it can be for detecting
The pressure sensor etc. of the pressure of the working fluid R of the inner cavity flowing of pipeline.In addition to this, it is also possible to temperature sensor etc.,
It is able to detect the sensor of flow.
The signal of the flow of the expression working fluid R detected by flow sensor 87 is input to control unit 800, control
Grasp the flow of the working fluid R detected using flow sensor 87 in portion 800.It should be noted that as flow sensor 87,
It is able to detect the flow of the working fluid R flowed in pipeline 81, can be the sensor being set in advance in pipeline 81, separately
Outside, it can also be installed later.
When flowing through the flow more than the threshold value of flow sensor 87, cutting solenoid valve 88 can be cut off to suction unit 3
Second space S2 supply working fluid R.
If flow sensor 87 detects the predetermined amount of flow of working fluid R, control unit 800 can export alarm.As a result,
Predetermined amount of flow is able to detect by alarm.It should be noted that in leak test, that is, judging aftermentioned working fluid R's
When whether flow below predetermined value, detect maximum detection flows 80% or more (if maximum detection flows are 5L/min,
In the case where flow for 4L/min), alarm is issued.
Second adjustment mechanism 52 is configured in the lower section of the first adjustment mechanism 51.Second adjustment mechanism 52 has in Z-direction
Two plate components 521 of upper overlapping.Two plate components 521 can be relatively mobile in X/Y plane direction.Second adjustment as a result,
Mechanism 52 in the pose adjustment to suction unit 3, can undertake suction unit 3 the pose adjustment of X-direction, suction unit 3 in the Y direction
Pose adjustment and the pose adjustment that returns about the z axis of suction unit 3.
Keep equipment delivery head 17 whole according to can be in the Y direction in addition, pose adjustment portion 5 is linked to by linking part 171
And the mechanism (not shown) that the mode of Z-direction round-trip supports.
Insulation part 6 is configured between suction unit 3 and pose adjustment portion 5.Insulation part 6 can be prevented or inhibited to come from and is built in
The heat of the heater of first block portion 32 is transferred to pose adjustment portion 5.Prevent pose adjustment portion 5 by described thermally-induced as a result,
Malfunction therefore can work normally, that is, correctly adjust suction unit 3 posture.
In the present embodiment, insulation part 6 is made of the multiple heat insulating members 61 being in the form of a column.The thermal conductivity of each heat insulating member 61
Rate is relatively small, and multiple configurations separated from each other.It should be noted that as heat insulating member 61 constituent material and be not limited,
For example, being able to use the various heat-barrier materials as glass epoxy resin etc..First block portion 32 passes through separated from each other with plate component 521
Heat insulating member 61 connect, and, due to being able to suppress the first block portion 32 and plate component 521 with gap between each heat insulating member 61
Between heat transmitting.
As previously mentioned, being configured with inspection portion 16 in the A3 of inspection area.Inspection portion 16 is mounting electronic component i.e. IC equipment 90
Mounting portion, be the socket checked under its carrying state IC equipment 90.As shown in figs.5 and 6, inspection portion 16 has
Standby inspection portion main body 161, abutting part 162 and probe 163.
The recess of inspection portion main body 161 is formed with the recess portion (low-lying area hole) 165 for loading and accommodating IC equipment 90.It needs to illustrate
, the forming quantity of recess portion 165, although in Fig. 5 and structure shown in fig. 6 being one, but it is not limited to this, can also be with
It is multiple.
The prominent equal number of probe 163 of terminal 901 configured with IC equipment 90 in the bottom of recess portion 165.
In addition, inspection portion (mounting portion) 16 has the electronic component, that is, IC equipment 90 for loading examined portion (mounting portion) 16
To attraction direction α3The electronic component force section 166 of force.The electronic component force section 166 is by being built in the spiral shell of each probe 163
Spring is revolved to constitute.The pressing of IC equipment 90 is combined with from 3 side of suction unit as a result, each terminal of IC equipment 90 can be made
901 come into full contact with each probe 163.Therefore, the inspection to IC equipment 90 can correctly be carried out.
As previously mentioned, the mounting electronic component i.e. mounting portion of IC equipment 90 i.e. inspection portion can be configured in the A3 of inspection area
16.Also, the mounting portion, that is, inspection portion 16 has abutting part 162.Abutting part 162 is made of plate-shaped member, and overlap in
In inspection portion main body 161.Under the third block portion 34 for the suction unit 3 that abutting part 162 can have with equipment delivery head 17 as a result,
Face 342 abuts.In addition, equipment delivery head 17 has the pose adjustment portion 5 for the posture that can adjust suction unit 3.Here, for example,
It is assumed that inspection portion 16 is whole the case where tilting 1 degree relative to X/Y plane (horizontal plane).Even if in this case, such as Fig. 6
It is shown, in the state that suction unit 3 and abutting part 162 abut, also suction unit 3 can be made to copy and examine by pose adjustment portion 5
Look into the posture of 16 same tilt of portion.The pose adjustment of such suction unit 3 facilitates each terminal 901 and each probe of IC equipment 90
163 contact.
Fig. 7~Fig. 9 is when showing that (adsorption plane) is as benchmark below by suction nozzle, even from following to IC equipment
The distance (H90) of each terminal there are the IC equipment of deviation, hang down by state that each terminal and each probe in inspection portion can also contact
Straight cross-sectional view.But in the IC equipment 90 adsorbed by suction nozzle 31, when using below suction nozzle 31 (adsorption plane) 312 as benchmark
When, from following 312 to the distance H90 of each terminal 901, there may be deviations.As the reason, even for example, congener IC
There is different (in design or deviations) in equipment 90, the thickness that can also enumerate IC equipment 90, that is, the error of thickness has and has greatly
Small (referring to Fig. 7 and Fig. 8), in addition, IC equipment 90 generates the individual difference such as bending (referring to Fig. 9).It should be noted that Fig. 7
It is IC equipment 90 itself to be shown there are the states of thickness of different sizes, even Fig. 8 is to show congener IC equipment 90, each other
Between there is also the state of relatively thin IC equipment 90 and thicker IC equipment 90, Fig. 9 is to show the curved state of IC equipment 90 itself.It needs
Illustrate, as shown in fig. 7, generating deviation situation in above-mentioned distance H90 includes: that the upper surface of IC equipment 90 (connects with following 312
Face) the case where (face for being provided with each terminal 901) is inclination below and IC equipment 90 parallel with following (adsorption plane) 312；
The upper surface of IC equipment 90 (face to connect with following 312) inclination and IC equipment 90 below (face for being provided with each terminal 901) with
The parallel situation of (adsorption plane) 312 below；And the upper surface of IC equipment 90 (face to connect with following 312) inclination, IC equipment 90
Below (face for being provided with each terminal 901) inclination the case where.
For example, in each terminal 901, there is the probe 163 that can not reach inspection portion 16 when distance H90 is relatively small
Terminal 901.It in this case, is poor contact, it is difficult to correctly be checked.
In addition, when distance H90 is relatively large, although each terminal 901 can reach and contact the probe in inspection portion 16
163, but there are the terminals 901 that it contacts degree of pressing through.In this case, it is also difficult to correctly be checked.
Here, electronic component inspection device 1 (electronic component handling apparatus 10) of the invention is to be able to solve such show
The structure of elephant.Hereinafter, being illustrated to the structure and effect referring to Fig. 4~Fig. 6.
[1] as shown in figure 4, equipment delivery head 17 is the state that suction unit 3 not yet attracts IC equipment 90.It needs to illustrate
It is, at this point, injector 72 has been attracted.In addition, working fluid R is supplied to the first space S 1 and second space S2, the
One space S 1 and second space S2 become positive pressure.Become positive pressure by second space S2, become the flange part 315 of suction nozzle 31 with
The state that the bottom of the recess portion 348 of third block portion 34 abuts.
[2] then, which can be drawn into the equipment supply unit 14 of inspection area A3 using suction unit 3
On IC equipment 90.Equipment delivery head 17 becomes state shown in fig. 5 as a result,.Under the state shown in fig. 5, IC equipment 90
Since attraction F3 is adsorbed by suction nozzle 31.In addition, as previously mentioned, suction nozzle 31 is than state shown in Fig. 4 when adsorbing IC equipment 90
More (attract direction α to the positive side of Z-direction3) mobile.That is, the flange part 315 of suction nozzle 31 becomes the recess portion 348 from third block portion 34
The separated state in bottom.
Then, by maintaining the state mobile device delivery head 17 of absorption IC equipment 90, the IC that can be adsorbed this is set
The surface of recess portion 165 of standby 90 configuration in inspection portion 16.
[3] after, as shown in fig. 6, equipment delivery head 17 can make the decline of suction unit 3 until abutting with inspection portion 16.By
This, suction unit 3 can copy the posture in inspection portion 16, and IC equipment 90 is pressed and accommodate to the recess portion 165 in inspection portion 16 (with
Under, which is known as " pressing receiving state ").At this point, suction nozzle 31 is via IC equipment 90 by the anti-work for coming self-check portion 16
Firmly, more mobile to the positive side of Z-direction than state shown in fig. 5.That is, in the case where pressing receiving state, with state phase shown in fig. 5
Than, the bottom of the recess portion 348 of the flange part 315 and third block portion 34 of suction nozzle 31 separate at a distance from be further enlarged.
In this way, under pressing receiving state shown in Fig. 6, due to the bottom of suction nozzle 31 and the recess portion 348 of third block portion 34
It separates, by supplying working fluid R further to second space S2, suction nozzle 31 can move in the-z direction.Therefore, can
By suction nozzle 31, to be suitable for that the power checked makes IC equipment 90 moderately exert a force towards inspection portion 16.As a result, for example, such as Fig. 7~figure
Shown in 9, no matter the size of distance H90, each terminal 901 of IC equipment 90 and the probe 163 in inspection portion 16 can be made both not to have
Excessively also without, uniformly in contact with (abutting), therefore, can correctly carry out the inspection to IC equipment 90 in insufficient situation.
Particularly, according to the degree of the individual difference of IC equipment 90 (concaveconvex shape etc. above), the size of attraction F3 '
Different by 90 type of IC equipment, in the case where pressing receiving state, suction nozzle 31 is likely to become and the recess portion 348 of third block portion 34
The state of bottom contact.In this case, by suction nozzle 31 make IC equipment 90 relative to inspection portion 16 recess portion 165 further by
Pressure becomes difficult.In contrast, it in electronic component handling apparatus 10, can adjust to the working fluid R's of second space S2
Supply amount.As a result, in the case where pressing receiving state, can according to make suction nozzle 31 relative to the bottom of the recess portion 348 of third block portion 34
Separated mode adjusts the supply amount of working fluid R.It therefore,, can be relative to inspection by suction nozzle 31 in the case where pressing receiving state
The recess portion 165 for looking into portion 16 further presses IC equipment 90.
In addition, as the second base portion third block portion 34 can with as mounting electronic component, that is, IC equipment 90 ministry of electronics industry
The inspection portion 16 of part mounting portion abuts.Third block portion 34, which presses inspection portion 16, as a result, can be such that the posture of third block portion 34 becomes
Copy the state of the shape of the abutting part 162 in inspection portion 16.Therefore, IC equipment 90 and suction nozzle can be made in the state that this is copied
31 abut.As a result, further can reliably make IC equipment 90 each terminal 901 and inspection portion 16 probe 163 both
Not excessively without, uniformly in contact with (abutting), therefore, can correctly carry out the inspection to IC equipment 90 in insufficient situation yet
It looks into.
In addition, as shown in figure 4, the flange part 514 of the piston 512 as the first sliding part is by the work in the first space S 1
The area for making the first compression face M1 of fluid R is greater than the second sliding part i.e. suction nozzle 31 by the working fluid R in second space S2
The second compression face M2 area.As a result, such as present embodiment, uniform pressure is being supplied to the first space S 1 and second space S2
Working fluid R structure in, the power from working fluid R that the second compression face M2 can be made to be subject to is less than the first compression face M1
The power from working fluid R being subject to.As a result, the power (the second abutting force) that suction nozzle 31 can be made to press IC equipment 90 is less than
The abutting force (the first abutting force) in the pressing of third block portion 34 inspection portion 16.Therefore, the excessively pressing IC equipment of suction nozzle 31 can be prevented
90。
In this way, second sliding part, that is, suction nozzle 31 is connected to electronic component i.e. IC equipment in electronic component handling apparatus 10
90 abutting force (the second abutting force) and a part, that is, third block portion 34 of the second base portion are connected to electronic component mounting portion and examine
The abutting force (the first abutting force) for looking into portion 16 is different.In the present embodiment, as previously described, because the second abutting force is less than first
Abutting force can prevent the excessively pressing IC equipment 90 of suction nozzle 31.
In addition, what the first compression face M1 pressed is more whole than the part i.e. suction unit 3 of the first lower side compression face M1.With
This is opposite, and what the second compression face M2 was pressed is part i.e. a part of suction nozzle 31 than the second compression face M2 more on the lower.Therefore,
It is preferred that the pressing force for making the pressing force of the first compression face M1 be greater than the second compression face M2.To, the first compression face M1 area at
For the area greater than the second compression face M2.
It should be noted that the area of the first compression face M1 is preferably the 2 times or more and 20 of the area of the second compression face M2
Again hereinafter, more preferably 3 times or more and 15 times or less.Thereby, it is possible to more reliably play said effect.
It should be noted that in the present embodiment, as the piston 512 of the first sliding part and the second base portion, that is, third block
Although portion 34 is separately constructed, it can also be formed as one.
Figure 10 is the flow chart for showing the opening and closing process of cutting solenoid valve 88.Firstly, in step slo, control unit 800
Disconnect cutting solenoid valve 88.Control unit 800 cuts off working fluid R.After the completion of the processing of step S10, control unit 800 makes to handle
Advance to step S20.
Next, in step S20, the flow for the working fluid R that the judgement of control unit 800 is detected by flow sensor 87
It whether is 0L/min.When the flow detected by flow sensor 87 is 0L/min, control unit 800 is judged as YES, and makes to locate
Reason advances to step S40.In addition, control unit 800 judges when other than the flow detected by flow sensor 87 being 0L/min
It is no, and processing is made to advance to step S30.
Next, in step s 30, the value of the flow detected by flow sensor 87 is reset to 0L/ by control unit 800
min.After the completion of the processing of step S30, control unit 800 makes processing advance to step S20.
Next, in step s 40, control unit 800 connects cutting solenoid valve 88.Control unit 800 supplies working fluid
R.After the completion of the processing of step S40, control unit 800 makes processing advance to step S50.
Next, in step s 50, the flow for the working fluid R that the judgement of control unit 800 is detected by flow sensor 87
Whether in 0.1L/min or less (leak test).When the flow detected by flow sensor 87 is in 0.1L/min or less, control
Portion 800 processed is judged as YES, and completes to handle.Where it has, control unit 800 also may determine that as No leakage.In addition, when logical
When the flow that overcurrent quantity sensor 87 detects is more than 0.1L/min, control unit 800 is judged as NO, and processing is made to advance to step
S60.In a case of no, control unit 800 also may determine that there is leakage.
Next, control unit 800 disconnects cutting solenoid valve 88 in step S60.800 identification fluid R of control unit
From second space S2 or the leakage of pipeline 81 to disconnect cutting solenoid valve 88.Pass through workflow in detection pipeline 81 as a result,
The flow of body R, is able to detect whether working fluid R leaks from second space S2 and pipeline 81.The processing of step S60 is completed
Afterwards, 800 completion of control unit is handled.
It should be noted that in step s 50, control unit 800 can also be such that working fluid R flows with maximum pressure.Example
Such as, the pressure of working fluid R is set as by 0.5MPa by adjuster 84.Then, usual pressure is returned after leak test.Example
Such as, the pressure of working fluid R is set as by 0.1MPa by adjuster 84.In addition, when the work detected by flow sensor 87
When making the flow of fluid R and being more than 5L/min, control unit 800 also it can be assumed that non-installation and replacement external member and issue alarm.
It is in step s 50 in the case where being, that is, in the case where not leaking, control unit 800 can also further judge
The replacement external member of installation is not to have the replacement external member of mechanical spring.In addition, in the case where being no in step s 50, that is, exist
In the case where leakage, control unit 800 can also further judge that the replacement external member of installation is the replacement set for having mechanical spring
Part.
Furthermore it is also possible to the case where will being in step s 50, i.e. the second abutting force in the case where not leaking, and
The situation for being no in step s 50 is depositing the second abutting force in the case of a leak, is being chosen to be different values.For example,
The second abutting force in the case where not leaking can be selected in based on the size based on cylinder diameter, it can also be based on the first sliding
The size of the cylinder diameter in portion's (piston 512) is selected in the second abutting force deposited in the case of a leak.
At this point, control unit 800 can also select the formula based on cylinder diameter size from multiple formulas, and based on selection
Formula calculate the second abutting force in the case where not leaking and selected, in addition, control unit 800 can also be from multiple values
Middle value of the selection based on cylinder diameter size, to be selected in the second abutting force in the case where not leaking.
In addition, at this point, control unit 800 can also select the cylinder based on the first sliding part (piston 512) from multiple formulas
The formula of body inner diameter size, the formula based on selection are calculated in the second abutting force deposited in the case of a leak and are selected,
In addition, control unit 800 can also select the value of the cylinder diameter size based on the first sliding part (piston 512) from multiple values,
To be selected in the second abutting force deposited in the case of a leak.Above-mentioned multiple formulas are either pre- in storage unit (not shown)
The formula first stored is also possible to from externally input formula, above-mentioned multiple values either pre-stored value in storage unit,
It is also possible to from externally input value.
< second embodiment >
Figure 11 is the diagrammatic partial vertical sectional view of equipment delivery head of the present embodiment.Hereinafter, 1 pair referring to Fig.1
The second embodiment of electronic component handling apparatus and electronic component inspection device of the invention is illustrated, and with it is aforementioned
Embodiment difference centered on be illustrated, and the description thereof will be omitted to same item.
Other than the structure of electronic component, the second base portion and inspection portion is different, present embodiment and described first is in fact
It is identical to apply mode.
In the present embodiment, IC equipment 90 has substrate 902 and is provided projectingly from the face of the side+Z of substrate 902 prominent
Portion 903 out.It should be noted that the face of the side-Z of substrate 902 is provided with multiple terminals 901.In addition, the vertical view of protruding portion 903
The lower end surface of size and suction nozzle 31 is in the same size.
In addition, the recess portion 165 in inspection portion 16, which becomes, can make the entrance of substrate 902 in electronic component handling apparatus 10
Size.
In addition, in the present embodiment, pipeline 81 and pipeline 82 are made of mutual independent flow path, pipeline 81 and pipeline 82
It is connect respectively with storage tank 83, adjuster 84 and working fluid supply unit 85.Thereby, it is possible to the first space S 1 of independent adjustment and the
The pressure of two space Ss 2.That is, flowing to the pressure of the working fluid R (not shown) of the first space S 1 and flowing to the work of second space S2
The pressure for making fluid R can change respectively, and can individually set.Therefore, it can independently adjust suction nozzle 31 and press IC
Power and third block portion 34 the pressing IC equipment 90 of equipment 90 and the power in inspection portion 16.Such structure although not shown, but can
The design for making the ratio between the first compression face M1 and the second compression face M2 become desired numerical value is omitted, advantageously.It needs to illustrate
, can make that the pressure of the first space S 1 and second space S2 is set as operating on monitor 300 shown in Fig. 1
Structure.
In addition, through this structure, the suction nozzle 31 as the second sliding part can be made to be connected to electronic component i.e. IC and set
Standby 90 abutting force and a part, that is, third block portion 34 of the second base portion are connected to the electronic component i.e. abutting force of IC equipment 90 not
Together.As a result, for example, the abutting force to substrate 902 can be made to be weaker than to protruding portion when intending to reduce the load to substrate 902
903 abutting force can be such that the abutting force to protruding portion 903 is weaker than to substrate when intending to reduce the load to protruding portion 903
902 abutting force.
In addition, in electronic component handling apparatus 10, the third block portion 34 of suction unit 3 has from following 342 to -Z direction
Protruding portion 346 outstanding.The protruding portion 346 is in the case where pressing receiving state, into the recess portion 165 in inspection portion 16.In addition, protruding portion
346, in the case where pressing receiving state, abut with the substrate 902 of IC equipment 90.That is, 346 energy of a part, that is, protruding portion of the second base portion
It is enough to be abutted with electronic component, that is, IC equipment 90 a part, that is, substrate 902.Protruding portion 346 can press IC equipment 90 as a result,
Substrate 902.
In addition, the protruding portion 903 of IC equipment 90 enters the through hole 344 of third block portion 34 in the case where pressing receiving state, and
It is pressed by suction nozzle 31.A part of second base portion, that is, third block portion 34 protruding portion 346 and the second sliding part, that is, suction nozzle 31 are opposite
Different positions is connected in electronic component, that is, IC equipment 90.Thereby, it is possible to so that protruding portion 346 is pressed the substrate of IC equipment 90
902, and suction nozzle 31 presses the protruding portion 903 of IC equipment 90.
In addition, pressing receiving state, 342 abut with the abutting part 162 in inspection portion 16 below third block portion 34, inspection portion
16 are pressed by third block portion 34.
In this way, in the present embodiment, suction nozzle 31 presses the protruding portion 903 of IC equipment 90, the protruding portion of third block portion 34
346 press the substrate 902 of IC equipment 90,342 pressing inspection portions 16 below third block portion 34.Even if as a result, such as this embodiment party
The IC equipment 90 with difference of height of formula can also be such that each terminal 901 of IC equipment 90 and the probe 163 in inspection portion 16 is not both having
Have excessively also without, uniformly in contact with (abutting), therefore, can correctly carry out the inspection to IC equipment 90 in insufficient situation.
< third embodiment >
Figure 12 is the diagrammatic partial vertical sectional view of equipment delivery head of the present embodiment.Hereinafter, 2 pairs referring to Fig.1
The third embodiment of electronic component handling apparatus and electronic component inspection device of the invention is illustrated, and with it is aforementioned
Embodiment difference centered on be illustrated, and the description thereof will be omitted to same item.
Other than the structure of electronic component and the second base portion is different, present embodiment and the second embodiment phase
Together.
In the present embodiment, IC equipment 90 is the center S903 of protruding portion 903 and the center S902 of substrate 902 in the side X
To and Y-direction misplace equipment.That is, protruding portion 903 is relative to the eccentric configuration of substrate 902.It should be noted that "center" is
Refer to, in the case that plan view shape is quadrangle, two cornerwise crosspoints.
In addition, in the present embodiment, being matched with the dislocation of center S902 and center S903, relative to third block portion 34
Protruding portion 346 center, through hole 344 X-direction and Y-direction dislocation configuration.That is, through hole 344 is relative to protruding portion
346 eccentric configurations.The suction nozzle 31 slided in through hole 344 as a result, can press the protruding portion 903 of IC equipment 90.
In this way, in the present embodiment, even if the center S903 of protruding portion 903 and the center S902 of substrate 902 are in X-direction
And there is dislocation in Y-direction, the probe 163 of each terminal 901 and inspection portion 16 that can yet make IC equipment 90 was not both having
Degree is also without, uniformly in contact with (abutting), therefore, can correctly carry out the inspection to IC equipment 90 in insufficient situation.
The 4th embodiment > of <
Figure 13 is the diagrammatic partial vertical sectional view of equipment delivery head and movable part of the present embodiment.Hereinafter,
The 4th embodiment of 3 pairs of electronic component handling apparatus and electronic component inspection device of the invention is illustrated referring to Fig.1,
And it is illustrated centered on the difference of embodiment above-mentioned, and the description thereof will be omitted to same item.
Present embodiment is identical as the second embodiment other than the structure in inspection portion is different.As shown in figure 13,
Equipment supply unit 14 is electronic component mounting portion before the electronic component i.e. inspection of IC equipment 90 loaded before checking, equipment recoverer
18 be electronic component mounting portion after the electronic component i.e. inspection of IC equipment 90 loaded after checking.As shown in figure 13, equipment supplies
Portion 14 and equipment recoverer 18 are as can load and the mobile electron component i.e. movable part 30 of IC equipment 90 is unitized.This can
Dynamic portion 30 is also equipped with X-direction mobile mechanism 7 other than equipment supply unit 14 and equipment recoverer 18.
The recess of equipment supply unit 14 is formed with mounting and accommodates the recess portion of IC equipment 90 (low-lying area hole) 141.In present embodiment
In, preferably the forming quantity of recess portion 141 is eight, eight of configuration mode and equipment delivery head 17A, equipment delivery head 17B
The configuration mode of suction unit 3 is identical, that is, configures the state of four, Y-direction configuration four in X-direction.
Equipment recoverer 18 is also recessed the recess portion (low-lying area hole) 181 for being formed with mounting and accommodating IC equipment 90.In this embodiment party
In formula, preferably the forming quantity of recess portion 181 is eight, the configuration of eight suction units 3 of configuration mode and equipment delivery head 17
Mode is identical, that is, configures the state of four, Y-direction configuration four in X-direction.
X-direction mobile mechanism 7 has linear guide 71A and together support apparatus supply unit 14 and equipment recoverer 18
Supporting base 72A.Linear guide 71A has guide rail 711A and two sliding block 712A.Branch is fixed on two sliding block 712A
Hold pedestal 72A.
In addition, electronic component handling apparatus 10 has, to be set to movable part 30 (be in the construction illustrated equipment supply unit
14) and it is able to detect the power test section 9 of power.Power test section 9 configures on the cushion block 73A on equipment supply unit 14.
It as power test section 9 and is not limited, such as it is preferable to use load cells.Strain gauge built in load cell is
The size of power is converted to the converter of electric signal.As a result, it is not using abutting force F90 as design value (calculated value) but makees
For actual measured value, can be detected as correctly as possible.
In addition, the testing result that power test section 9 detects, the i.e. size of abutting force are stored in the storage unit of control unit 800 (not
Diagram).
In addition, the configuration of power test section 9 can be connected to and the second sliding part on the cushion block 73A on equipment supply unit 14
That is electronic component, that is, IC equipment 90 of the abutting of suction nozzle 31 (absorption).
In such present embodiment, for example, as shown in figure 13, make IC equipment 90 become pressing receiving state it
Before, i.e., before being checked, IC equipment 90 is urged to power test section 9, detects its abutting force F90.It then, can be based on detection
The abutting force F90 arrived, carries out the adjustment of pressing force.
In addition, the timing as detection abutting force F90, such as preferably abutted since IC equipment 90 with power test section 9
The position position that starts further to decline in 0.1mm or more and 2.0mm or less range detected.
It should be noted that abutting force detection as described above, can not use IC equipment, and use is big with IC equipment 90
Small identical power detection part.
The 5th embodiment > of <
Figure 14 is the diagrammatic partial vertical sectional view of equipment delivery head of the present embodiment.Hereinafter, 4 pairs referring to Fig.1
5th embodiment of electronic component handling apparatus and electronic component inspection device of the invention is illustrated, and with it is aforementioned
Embodiment difference centered on be illustrated, and the description thereof will be omitted to same item.
Present embodiment is identical as the first embodiment other than the structure of the first sliding part is different.Such as Figure 14
Shown, the inside of cylinder body 511 is provided with flexible diaphragm 53.Diaphragm 53 is set in the way of the Z-direction of cylinder body 511, and
Than through hole 516 closer to the side-Z.The diaphragm 53 531 abuts below with the flange part 514 of piston 512.It needs to illustrate
It is that although not shown, diaphragm 53 is parallel with X-axis and Y-axis in its natural state.In the present embodiment, it is more leaned on than the diaphragm 53
Closely the space of the side+Z is the first space S 1.
As shown in figure 14, piston 512 to the side+Z jack up diaphragm 53 and make diaphragm 53 deform in the state of, piston 512 by
To restore the recuperability of nature to diaphragm 53.As a result, by diaphragm 53, the collimation relative to X/Y plane can be generated.
As a result, third block portion 34 can press inspection portion 16 in the state of generating collimation.
Flow sensor 87 also can be only fitted between cutting solenoid valve 88 and storage tank 83.It is conveyed to other equipment
Second space S2 supply working fluid R etc. of the suction unit 3 of head, pipeline 81 from the way with 80 difference of pipeline in the case where, flow
Sensor 87 also can be set between the branch point 89 and storage tank 83 of pipeline 81.Even if only one flow sensor as a result,
87 the case where, for example, disconnecting (cutting) in the cutting for being set to pipeline 81 solenoid valve 88, and the cutting for being set to pipeline 80 is used
In the case that solenoid valve connects (connection), it is also able to detect the working fluid R leakage for the equipment delivery head connecting with pipeline 80.
< sixth embodiment >
Figure 15 is the diagrammatic partial vertical sectional view of equipment delivery head of the present embodiment.Hereinafter, 5 pairs referring to Fig.1
The sixth embodiment of electronic component handling apparatus and electronic component inspection device of the invention is illustrated, and with it is aforementioned
Embodiment difference centered on be illustrated, and the description thereof will be omitted to same item.
Present embodiment is identical as the first embodiment other than the structure of replacement external member is different.Such as Figure 15 institute
Show have the replacement external member of mechanical spring by installing, in the case where the working fluid R from inner cavity 336 is persistently leaked,
The pressure of first space S 1 can also decline, it is difficult to offset IC equipment by the adjusting of the pressure of the working fluid R of the first space S 1
90 individual difference.
In the present embodiment, the leakage rate of working fluid R is detected by flow sensor 87, and is judged automatically and installed
Whether replacement external member has air spring, is not having air spring, that is to say, that have the feelings of the replacement external member of mechanical spring
Under condition, the supply of working fluid R can be cut off.By cutting solenoid valve 88, the workflow from inner cavity 336 can be prevented
The leakage of body R.
In addition, since the more front end than cutting solenoid valve 88 is cut off, it is unchanged in the flow of flow sensor 87.Cause
This, without error detection.In addition, also working fluid R can be prevented from inner cavity 336 in the case where forgetting installation and replacement external member
Leakage.
More than, embodiment illustrated is directed to electronic component handling apparatus and electronic component inspection device of the invention
It is illustrated, but present invention is not limited to this, constitutes each of electronic component handling apparatus and electronic component inspection device
Portion can be replaced into the arbitrary structures that can play same function.Add arbitrary structures object furthermore it is also possible to pay.Although for example,
It is illustrated using equipment delivery head 17 as delivery section of the invention, but delivery section is the device for conveying IC equipment, this hair
Bright delivery section also can be set in equipment delivery head 13, equipment delivery head 20.
In addition, can also be combined described about electronic component handling apparatus and electronic component inspection device of the invention
Any two or more structure (feature) in each embodiment.
Claims (15)
1. a kind of electronic component handling apparatus, which is characterized in that be delivered to electronic component and check the electrical of the electronic component
The inspection portion of characteristic, the electronic component handling apparatus have:
The electronic component is delivered to the inspection portion by delivery section, and the delivery section has the first component and second component,
The first component has the first base portion, relative to the first sliding part of first base portion sliding and by first base
The first space that portion and first sliding part delimited, the second component have the second base for being installed on first sliding part
Portion is slided and the second sliding part for abutting with electronic component and by second base portion and institute relative to second base portion
State the second space of the second sliding part delimitation；
Pipe section has the flow path for being connected to the second space and supplying working fluid to the second space；
Flow sensor is configured at the flow path, detects the flow of the working fluid；
Pressure-regulating portion adjusts the pressure of the working fluid；And
Control unit makes second sliding part keep the electronic component, make second sliding part by the electronic component by
It is depressed into the inspection portion.
2. electronic component handling apparatus according to claim 1, which is characterized in that
The working fluid flows into first space and the second space.
3. electronic component handling apparatus according to claim 1, which is characterized in that
The electronic component handling apparatus has opening/closing portion, and the opening/closing portion is set to the flow path and opens the flow path
It closes,
The control unit judges the opening and closing of the opening/closing portion based on the flow that the flow sensor detects.
4. electronic component handling apparatus according to claim 3, which is characterized in that
The flow sensor is configured at the flow path between the opening/closing portion and the second space.
5. electronic component handling apparatus according to claim 3, which is characterized in that
If the flow sensor detects the predetermined amount of flow of the working fluid, the control unit output alarm.
6. electronic component handling apparatus according to claim 1, which is characterized in that
The electronic component handling apparatus has the electronic component mounting portion for loading the electronic component,
Second base portion is abutted with the electronic component mounting portion.
7. electronic component handling apparatus according to claim 6, which is characterized in that
Second sliding part presses the power of the electronic component and second base portion presses the electronic component mounting portion
Power is different.
8. electronic component handling apparatus according to claim 1, which is characterized in that
The electronic component handling apparatus has the work that the working fluid is supplied to first space and the second space
Make fluid supply unit.
9. electronic component handling apparatus according to claim 1, which is characterized in that
The electronic component handling apparatus has an easing portion, the easing portion be configured at the pressure-regulating portion and the second component it
Between the flow path, flow into the working fluid from the second space to the easing portion.
10. electronic component handling apparatus according to claim 2, which is characterized in that
First sliding part has the first compression face for receiving the power from the working fluid,
Second sliding part has the second compression face for receiving the power from the working fluid,
The area of first compression face is greater than the area of second compression face.
11. electronic component handling apparatus according to claim 1, which is characterized in that
Second base portion is abutted with the electronic component.
12. electronic component handling apparatus according to claim 11, which is characterized in that
The power that second sliding part presses the electronic component is different from the power that second base portion presses the electronic component.
13. electronic component handling apparatus according to claim 2, which is characterized in that
It flows into the pressure of the working fluid in first space and flows into the pressure of the working fluid of the second space
Power is different.
14. electronic component handling apparatus according to claim 1, which is characterized in that
The electronic component handling apparatus has:
Movable part, mounting and the mobile electronic component；And
Power test section is set to the movable part, for detecting power,
The power test section is abutted with the electronic component.
15. a kind of electronic component inspection device, which is characterized in that have:
Inspection portion checks the electrical characteristic of electronic component；
The electronic component is delivered to the inspection portion by delivery section, and the delivery section has the first component and second component,
The first component has the first base portion, relative to the first sliding part of first base portion sliding and by first base
The first space that portion and first sliding part delimited, the second component have the second base for being installed on first sliding part
Portion is slided and the second sliding part for abutting with electronic component and by second base portion and institute relative to second base portion
State the second space of the second sliding part delimitation；
Pipe section has the flow path for being connected to the second space and supplying working fluid to the second space；
Flow sensor is configured at the flow path, detects the flow of the working fluid；
Pressure-regulating portion adjusts the pressure of the working fluid；And
Control unit makes second sliding part keep the electronic component, make second sliding part by the electronic component by
It is depressed into the inspection portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-248838 | 2017-12-26 | ||
| JP2017248838A JP2019113471A (en) | 2017-12-26 | 2017-12-26 | Electronic component conveying device and electronic component inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110007211A true CN110007211A (en) | 2019-07-12 |
| CN110007211B CN110007211B (en) | 2021-08-17 |
Family
ID=67165215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811592175.0A Expired - Fee Related CN110007211B (en) | 2017-12-26 | 2018-12-25 | Electronic component conveying device and electronic component inspection device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2019113471A (en) |
| CN (1) | CN110007211B (en) |
| TW (1) | TWI706140B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI748577B (en) * | 2020-07-24 | 2021-12-01 | 鴻勁精密股份有限公司 | Detection unit for connecting apparatus and handler having the same |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11145220A (en) * | 1997-10-06 | 1999-05-28 | Samsung Electron Co Ltd | Performance board for semiconductor tester and semiconductor tester with the board |
| JP2000105267A (en) * | 1998-09-29 | 2000-04-11 | Matsushita Electronics Industry Corp | Semiconductor part inspecting device |
| JP2000193716A (en) * | 1998-12-25 | 2000-07-14 | Shinano Electronics:Kk | Ic test handler |
| JP2000340321A (en) * | 1999-05-25 | 2000-12-08 | Nec Corp | Contactor for ic socket |
| JP2003161758A (en) * | 2001-11-28 | 2003-06-06 | Nec Machinery Corp | Contact method for electrode terminal |
| CN1720460A (en) * | 2002-12-04 | 2006-01-11 | 株式会社爱德万测试 | Pressing member and electronic component handling device |
| CN101228448A (en) * | 2005-07-21 | 2008-07-23 | 爱德万测试株式会社 | Pusher, pusher unit as well as semiconductor test device |
| CN101617241A (en) * | 2007-02-23 | 2009-12-30 | 株式会社爱德万测试 | Electronic unit press device and apparatus for electronic device test |
| CN104122462A (en) * | 2013-04-23 | 2014-10-29 | 精工爱普生株式会社 | Handler and inspection apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI524077B (en) * | 2013-12-03 | 2016-03-01 | Tohoku Seiki Ind Co Ltd | IC processor |
| JP2016075550A (en) * | 2014-10-06 | 2016-05-12 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
| TWI603096B (en) * | 2015-06-19 | 2017-10-21 | Seiko Epson Corp | Electronic parts conveying apparatus and electronic parts inspection apparatus |
-
2017
- 2017-12-26 JP JP2017248838A patent/JP2019113471A/en active Pending
-
2018
- 2018-12-22 TW TW107146614A patent/TWI706140B/en not_active IP Right Cessation
- 2018-12-25 CN CN201811592175.0A patent/CN110007211B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11145220A (en) * | 1997-10-06 | 1999-05-28 | Samsung Electron Co Ltd | Performance board for semiconductor tester and semiconductor tester with the board |
| JP2000105267A (en) * | 1998-09-29 | 2000-04-11 | Matsushita Electronics Industry Corp | Semiconductor part inspecting device |
| JP2000193716A (en) * | 1998-12-25 | 2000-07-14 | Shinano Electronics:Kk | Ic test handler |
| JP2000340321A (en) * | 1999-05-25 | 2000-12-08 | Nec Corp | Contactor for ic socket |
| JP2003161758A (en) * | 2001-11-28 | 2003-06-06 | Nec Machinery Corp | Contact method for electrode terminal |
| CN1720460A (en) * | 2002-12-04 | 2006-01-11 | 株式会社爱德万测试 | Pressing member and electronic component handling device |
| CN101228448A (en) * | 2005-07-21 | 2008-07-23 | 爱德万测试株式会社 | Pusher, pusher unit as well as semiconductor test device |
| CN101617241A (en) * | 2007-02-23 | 2009-12-30 | 株式会社爱德万测试 | Electronic unit press device and apparatus for electronic device test |
| CN104122462A (en) * | 2013-04-23 | 2014-10-29 | 精工爱普生株式会社 | Handler and inspection apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI748577B (en) * | 2020-07-24 | 2021-12-01 | 鴻勁精密股份有限公司 | Detection unit for connecting apparatus and handler having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201939043A (en) | 2019-10-01 |
| JP2019113471A (en) | 2019-07-11 |
| CN110007211B (en) | 2021-08-17 |
| TWI706140B (en) | 2020-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI714332B (en) | Environmental control device and chip testing system | |
| JP6790252B2 (en) | Battery unit inspection device and battery unit inspection system | |
| TWI708952B (en) | Detecting apparatus | |
| CN105738793A (en) | Electronic component inspection apparatus and electronic component conveying method | |
| KR20080009186A (en) | Integrated circuit testing apparatus | |
| TW201432268A (en) | Inspection unit, probe card, inspection device, and control system for inspection device | |
| CN109720860A (en) | Electronic component handling apparatus, electronic component inspection device and adsorption element | |
| CN106185301A (en) | Electronic component handling apparatus and electronic component inspection device | |
| TWI701438B (en) | Detecting apparatus | |
| CN110007211A (en) | Electronic component handling apparatus and electronic component inspection device | |
| CN106185259A (en) | Electronic component handling apparatus and electronic component inspection device | |
| JP2016095141A (en) | Inspection unit for semiconductor device | |
| TWI649567B (en) | Electronic component transfer device and electronic component inspection device | |
| TW201842345A (en) | Carrier for electronic component testing device capable of handling high accuracy of positioning of external contact terminals of an electronic component to be examined | |
| CN105905600A (en) | Electronic component conveying apparatus and electronic component inspecting device | |
| TWI738065B (en) | Electronic component conveying device and electronic component inspection device | |
| CN109425908A (en) | Electronic component transmission device and electronic component check device | |
| TWI583972B (en) | Electronic parts handling equipment and electronic parts inspection device | |
| TW201109694A (en) | Test unit and test system | |
| CN208420981U (en) | A kind of IC functional test seat | |
| TWI686277B (en) | Electronic parts conveying device and electronic parts inspection device | |
| JP6790768B2 (en) | Electronic component transfer device and electronic component inspection device | |
| WO2006075391A1 (en) | Electronic component testing apparatus | |
| CN109581182A (en) | Electronic component handling apparatus and electronic component inspection device | |
| TW202015285A (en) | Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210702 Address after: Nagano, Japan Applicant after: North Star Technology Co.,Ltd. Address before: Tokyo, Japan Applicant before: Seiko Epson Corp. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210817 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |