CN106185259A - Electronic component handling apparatus and electronic component inspection device - Google Patents
Electronic component handling apparatus and electronic component inspection device Download PDFInfo
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- CN106185259A CN106185259A CN201510243787.9A CN201510243787A CN106185259A CN 106185259 A CN106185259 A CN 106185259A CN 201510243787 A CN201510243787 A CN 201510243787A CN 106185259 A CN106185259 A CN 106185259A
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- electronic unit
- location division
- delivery section
- electronic component
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- Testing Of Individual Semiconductor Devices (AREA)
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- General Engineering & Computer Science (AREA)
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Abstract
The present invention relates to electronic component handling apparatus and electronic component inspection device.This electronic component handling apparatus possesses the spindle moving part as delivery section of conveying IC device, holds the checking mechanical hand and keeping the maintaining part of IC device as handle part of IC device.Spindle moving part possesses delivery section location division.Check that mechanical hand possesses the handle part location division chimeric with delivery section location division.Maintaining part possesses the maintaining part location division chimeric with handle part location division.It is connected to fluid ejection section or the stream of fluid suction unit it addition, be formed at spindle moving part.
Description
Technical field
The present invention relates to electronic component handling apparatus and electronic component inspection device.
Background technology
In the past, the most known electronic unit inspection having the electrical characteristics checking the electronic units such as IC device
Look into device, be assembled with for IC device is delivered to as inspection in this electronic component inspection device
The electronic component handling apparatus of the socket in portion.Fill in the electronic unit inspection described in patent documentation 1
Put to possess and in the horizontal direction IC device is delivered to the pallet near socket and by IC device
Part is transferred to the absorption arm of socket, pallet and absorption arm from pallet and sends out as electronic component handling apparatus
Wave effect.
In the electronic component inspection device described in this patent documentation 1, in order to adsorb arm from torr
Carry out adsorbing arm and the location of pallet and using the most chimeric mutual chimeric knot during dish absorption IC device
Structure.Equally, in order to carry out when adsorbing arm and discharging IC device to socket adsorbing arm and socket
Position and use the most chimeric embedded structure.
Patent documentation 1: Japanese Unexamined Patent Publication 10-160797 publication
But, in the electronic component inspection device described in patent documentation 1, for location, only
Carry out adsorbing arm and the location of pallet and absorption arm and the location of socket, do not carry out pallet and IC
The location of device, absorption arm and the location of the location of IC device, socket and IC device.Therefore,
The such as IC device on pallet correct position from design is in incorrect position (partially
The state moved) in the case of, transfer load to socket with being kept this incorrect state.Its result,
Can not carry out by the correct inspection of socket.
Summary of the invention
It is an object of the invention to provide and a kind of can easily carry out by electronic unit maintaining part
Electronic component handling apparatus and electronic component inspection device to the location of electronic unit.
Such purpose is realized by the following present invention.
(application examples one)
The electronic component handling apparatus of the present invention is characterised by possessing: electronic unit delivery section,
It carries electronic unit；Electronic unit handle part, it holds above-mentioned electronic unit；And the ministry of electronics industry
Part maintaining part, it keeps above-mentioned electronic unit, and above-mentioned electronic unit delivery section possesses delivery section location
Portion, above-mentioned electronic unit handle part possesses the handle part location chimeric with above-mentioned delivery section location division
Portion, above-mentioned electronic unit maintaining part possesses the maintaining part location chimeric with above-mentioned handle part location division
Portion, is formed in above-mentioned electronic unit delivery section and is connected to fluid ejection section or fluid suction unit
Stream.
Thus, first, it is possible to by spraying via stream or attracting fluid to carry out by the ministry of electronics industry
The location to electronic unit of part delivery section, afterwards, via electronic unit handle part by electronic unit
It is delivered to electronic unit maintaining part.In this course of conveying, carry out in order delivery section location division with
Chimeric and the handle part location division of handle part location division and the Qian He of maintaining part location division.Thus,
Easily will be maintained to electronic unit by the positioning states to electronic unit of electronic unit delivery section
Maintaining part.
(application examples two)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned delivery section location division includes first
Location division and the second location division, have the limit of length A and the rectangle on the limit of length B in conveying
In the case of the above-mentioned electronic unit of shape, by the center and above-mentioned second of above-mentioned first location division
The straight-line pass at the center of location division corner (1/2) × A's away from above-mentioned electronic unit delivery section
Position and the position by corner (the 1/2) × B away from above-mentioned electronic unit delivery section.
Thus, when electronic unit is delivered to electronic unit maintaining part from electronic unit delivery section,
Can try one's best and correctly carry out the location of initial electronic unit delivery section and electronic unit.
(application examples three)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned electronic unit delivery section has structure
Becoming the first wall and second wall in the first corner, above-mentioned first wall is with above-mentioned second wall just
Hand over, the first flow path that above-mentioned stream includes being configured at above-mentioned first corner and above-mentioned fluid flows through, table
Show that the primary vector of the flowing of the above-mentioned fluid of flowing is not respectively with above-mentioned in above-mentioned first flow path
First wall and above-mentioned second wall are orthogonal.
Thus, such as this electronic unit can be easily made to move to desire in the whereabouts of electronic unit
The position of location.
(application examples four)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned electronic unit delivery section has structure
Becoming the 3rd wall and the 4th wall in the second corner, above-mentioned second corner is arranged in and above-mentioned first
The position at diagonal angle, corner, above-mentioned stream includes being configured at above-mentioned second corner and above-mentioned fluid flows through
Second flow path, represents that the secondary vector of the flowing of the above-mentioned fluid of flowing divides in above-mentioned second flow path
The most not orthogonal with above-mentioned first wall and above-mentioned second wall.
Thus, such as this electronic unit can be easily made to move to desire in the whereabouts of electronic unit
The position of location.
(application examples five)
Preferably in the electronic component handling apparatus of the present invention, connect in above-mentioned first flow path and have attraction
, there is the ejection section spraying above-mentioned fluid the suction unit of above-mentioned fluid in the connection of above-mentioned second flow path.
Thus, in the case of the location carrying out electronic unit, it is possible to easily make electronic unit move
Dynamic.
(application examples six)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned electronic unit maintaining part is checking
Above-mentioned electronic unit is kept in the case of above-mentioned electronic unit.
Thereby, it is possible to stably check electronic unit.
(application examples seven)
Preferably in the electronic component handling apparatus of the present invention, in the holding of above-mentioned electronic unit delivery section
State electronic unit and be moved to the place of regulation.
Thus, that such as can shorten electronic unit always carries timing as far as possible.
(application examples eight)
The electronic component inspection device of the present invention is characterised by possessing: electronic unit delivery section,
It carries electronic unit；Electronic unit handle part, it holds above-mentioned electronic unit；And the ministry of electronics industry
Part maintaining part, it keeps above-mentioned electronic unit, and above-mentioned electronic unit maintaining part has the above-mentioned electricity of inspection
The function as inspection portion of subassembly, above-mentioned electronic unit delivery section possesses delivery section location division,
Above-mentioned electronic unit handle part possesses the handle part location division chimeric with above-mentioned delivery section location division, on
State electronic unit maintaining part and possess the maintaining part location division chimeric with above-mentioned handle part location division, upper
State electronic unit delivery section to be formed and be connected to fluid ejection section or the stream of fluid suction unit.
Thus, first, it is possible to by spraying via stream or attracting fluid to carry out by the ministry of electronics industry
The location to electronic unit of part delivery section, afterwards, via electronic unit handle part by electronic unit
It is delivered to electronic unit maintaining part.In this course of conveying, carry out in order delivery section location division with
Chimeric and the handle part location division of handle part location division and the Qian He of maintaining part location division.Thus,
Easily will be maintained to electronic unit by the positioning states to electronic unit of electronic unit delivery section
Maintaining part.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the first embodiment of the electronic component inspection device representing the present invention.
Fig. 2 is the action etc. in each portion representing that the electronic component inspection device shown in Fig. 1 possesses
Figure.
Fig. 3 is the horizontal cross-sectional of the delivery section representing that the electronic component inspection device shown in Fig. 1 possesses
Figure.
Fig. 4 is to represent that the delivery section possessed in the electronic component inspection device shown in Fig. 1 located electricity
The horizontal cross of the state of subassembly.
Fig. 5 be for explanation in the electronic component inspection device shown in Fig. 1 until by electronic unit
It is positioned the vertical sectional view of action till delivery section.
Fig. 6 be for explanation in the electronic component inspection device shown in Fig. 1 until by electronic unit
It is positioned the vertical sectional view of action till delivery section.
Fig. 7 be for explanation in the electronic component inspection device shown in Fig. 1 until by electronic unit
It is positioned the vertical sectional view of action till delivery section.
Fig. 8 is for illustrating in the electronic component inspection device shown in Fig. 1 until making electronic unit
From the axonometric chart of the action that delivery section moves to maintaining part.
Fig. 9 is for illustrating in the electronic component inspection device shown in Fig. 1 until making electronic unit
From the axonometric chart of the action that delivery section moves to maintaining part.
Figure 10 is for illustrating in the electronic component inspection device shown in Fig. 1 until making the ministry of electronics industry
The axonometric chart of the action that part moves to maintaining part from delivery section.
Figure 11 is for illustrating in the electronic component inspection device shown in Fig. 1 until making electronic unit
From the axonometric chart of the action that delivery section moves to maintaining part.
Figure 12 is for illustrating in the electronic component inspection device shown in Fig. 1 until making the ministry of electronics industry
The axonometric chart of the action that part moves to maintaining part from delivery section.
Figure 13 is for illustrating in the electronic component inspection device shown in Fig. 1 until making the ministry of electronics industry
The axonometric chart of the action that part moves to maintaining part from delivery section.
Figure 14 is to represent not check state from conveying in the electronic component inspection device shown in Fig. 1
The flow chart of electronic unit control program to again carrying electronic unit after having checked.
Figure 15 be represent in the electronic component inspection device (the second embodiment) of the present invention from
Conveying does not checks the control to again carrying electronic unit after having checked of the electronic unit of state
The flow chart of processing procedure sequence.
Figure 16 is that the electronic component inspection device (the 3rd embodiment) representing the present invention possesses
The horizontal cross of delivery section.
Detailed description of the invention
Hereinafter, preferred embodiment the electronic unit of the present invention is carried dress based on shown in the drawings
Put and electronic component inspection device is described in detail.
(the first embodiment)
Fig. 1 is the schematic diagram of the first embodiment of the electronic component inspection device representing the present invention.
Fig. 2 is the figure of the action etc. in each portion representing that the electronic component inspection device shown in Fig. 1 possesses.Figure
3 is the horizontal cross of the delivery section representing that the electronic component inspection device shown in Fig. 1 possesses.Figure
4 is to represent that the delivery section possessed in the electronic component inspection device shown in Fig. 1 located electronic unit
The horizontal cross of state.Fig. 5～Fig. 7 is namely for illustrating at the electronic unit shown in Fig. 1
Check the vertical sectional view until the action being positioned by electronic unit till delivery section in device.Figure
8～Figure 13 is for illustrating in the electronic component inspection device shown in Fig. 1 until making electronic unit
From the axonometric chart of the action that delivery section moves to maintaining part.Figure 14 is to represent shown in Fig. 1
Electronic component inspection device in from conveying do not check the electronic unit of state to after having checked again
The flow chart of the control program till secondary conveying electronic unit.
Additionally, it is following for purposes of illustration only, as it is shown in figure 1, three mutually orthogonal axles are set to X
Axle, Y-axis and Z axis.It addition, include that the X/Y plane of X-axis and Y-axis is level, Z axis
For vertical.It addition, also the direction parallel with X-axis is referred to as " X-direction ", will be parallel with Y-axis
Direction be referred to as " Y-direction ", by the direction parallel with Z axis be referred to as " Z-direction ".It addition, also
The upstream side of the conveying direction of electronic unit is only called " upstream side ", by the conveying of electronic unit
The downstream in direction is only called " downstream ".It addition, " water described in present specification
Flat " be not limited to level completely, as long as not hindering the conveying of electronic unit, also include relative to
The level state that somewhat (e.g., less than about 5 °) tilt.It addition, in Fig. 3～Fig. 7,
Delivery section eliminates the diagram of the probe etc. of termination contact with electronic unit.
Inspection device (electronic component inspection device) 1 shown in Fig. 1 is e.g. used for checking, surveying
Examination (hereinafter referred merely to as " checking ") BGA (Ball Grid Array: BGA) encapsulation,
The IC device of LGA (Land Grid Array: contact array) encapsulation etc., LCD (Liquid
Crystal Display: liquid crystal display), CIS (CMOS Image Sensor:CMOS scheme
As sensor) etc. the device of electrical characteristics of electronic unit.Additionally, it is following for purposes of illustration only, represent
Property ground explanation use the situation of IC device as the above-mentioned electronic unit being intended to carry out checking, and by it
It is set to " IC device 9 ".And, below as this IC device 9, enter as a example by BGA package
Row explanation.
First, IC device 9 is illustrated.
As shown in Fig. 5～Fig. 7, IC device 9 is BGA package, have main part 91 and
It is arranged at multiple terminals (electrode) 92 of the outside of main part 91.Although not to main part 91
Shape is particularly limited, but the most plate-shaped, it addition, from its thickness direction (
IC device 9 is configured on spindle moving part (shuttle) (electronic unit delivery section) 41 and is kept
State under from Z-direction) be tetragon (rectangular shape) (with reference to Fig. 4) when observing.Should say
Bright, in the present embodiment, this tetragon is to have the limit of length A in X direction and along Y
The square on the limit of length B in direction or rectangle.
In Fig. 5 of main part 91, the face of downside is terminal arrangement face 93, and multiple terminals 92 are at this end
Sub-configuration face 93 is configured to clathrate (rectangular).It addition, each terminal 92 is hemispherical weldering
Ball.Additionally, the shape of each terminal 92 is not limited to hemispherical certainly.
It follows that to checking that device 1 illustrates.
As it is shown in figure 1, check that device 1 possesses the conveyer device as separator (Handler)
(electronic component handling apparatus) 10.This conveyer device 10 have as shown in Figure 4 carry out right
The detent mechanism 100 of the location of IC device 9.
That is, check that device 1 has supply unit 2, supply side aligning section 3, delivery section 4, inspection portion
5, reclaim side aligning section 6, recoverer 7 and carry out the control portion 8 of control in these each portions.
It addition, check that device 1 has configuration supply unit 2, supply side aligning section 3, delivery section 4, checks
Portion 5, reclaim side aligning section 6 and the base station (Base) 11 of recoverer 7 and to receive supply
The mode of side aligning section 3, delivery section 4, inspection portion 5 and recovery side aligning section 6 covers at base
Lid 12 on platform 11.Additionally, the base station face 111 as the upper surface of base station 11 is nearly horizontal,
And be configured with on this base station face 111 supply side aligning section 3, delivery section 4, inspection portion 5 and
Reclaim the structure member of side aligning section 6.It addition, with the exception of this, check that device 1 can also basis
Needs have for heating the heater of IC device 9, combustor etc..
Such inspection device 1 is configured to supply unit 2 and supplies IC device 9 to supply side aligning section 3,
Supply side aligning section 3 arranges the IC device 9 being supplied to, and delivery section 4 is by the IC device after arrangement
9 are delivered to inspection portion 5, and inspection portion 5 checks the IC device 9 carried, and delivery section 4 will terminate
The IC device 9 checked carries/arranges to reclaiming side aligning section 6, and recoverer 7 reclaims arrangement
To the IC device 9 reclaiming side aligning section 6.According to such inspection device 1, it is possible to automatically
Carry out the supply of IC device 9, check, reclaim.Should illustrate, in checking device 1, by
Supply unit 2, supply side aligning section 3, delivery section 4, the part in inspection portion 5, the arrangement of recovery side
Portion 6, recoverer 7 and control portion 8 etc. constitute conveyer device 10.Conveyer device 10 carries out IC
The conveying of device 9, the IC device 9 carried out by detent mechanism 100 holding to inspection portion 5
The final location etc. in portion's (electronic unit maintaining part) 51.
Hereinafter, the structure of delivery section 4, inspection portion 5 and detent mechanism 100 is illustrated.
Delivery section
As in figure 2 it is shown, delivery section 4 is to be arranged in the mounting workbench 341 of supply side aligning section 3
On IC device 9 be delivered to inspection portion 5, and the IC device of inspection that will finish by inspection portion 5
Part 9 is delivered to reclaim the unit of side aligning section 6.Such delivery section 4 has spindle moving part 41, supplies
To mechanical hand (Robot) 42, check mechanical hand 43 and reclaim mechanical hand 44.
Spindle moving part
Spindle moving part 41 is for the IC device 9 on mounting workbench 341 is delivered to inspection portion 5
Vicinity, and by checked by inspection portion 5 check complete IC device 9 be delivered to
Reclaim the spindle moving part of the vicinity of side aligning section 6.On such spindle moving part 41, in the X direction
Arrangement is formed with four for the groove (Pocket) 411 receiving IC device 9.It addition, shuttle moves
Part 41 is guided by linear motion guiding piece, it is possible to drive source in the X direction by linear motor etc.
Move back and forth.Hereinafter, sometimes IC device will be carried out between spindle moving part 41 and supply mechanical hand 42
The position of the exchange of 9 is referred to as " primary importance ", will enter between spindle moving part 41 and inspection mechanical hand 43
The position of the exchange of row IC device 9 is referred to as " second position ", by spindle moving part 41 and recovery machinery
The position of the exchange carrying out IC device 9 between hands 44 is referred to as " the 3rd position ".
As shown in Figure 3, Figure 4, spindle moving part 41 is formed with the first groove extended in the X direction
451 and the second groove 452 of extending in the Y direction.It is formed with first groove 451, the first groove
451 connect in the lump with each groove 411.It addition, be formed with four the second grooves 452, the second groove 452
Connect with groove 411 respectively.And, the light emitting diode irradiating light it is configured with at the two ends of each groove
(not shown) and acceptance are from the photodiode of the light of light emitting diode (not shown).?
In the case of being configured with IC device 9 in groove 411, light is blocked by this IC device 9 and detects not
To by the light of photodiode.Thereby, it is possible to be judged as being configured with IC device in groove 411
Part 9.On the other hand, in the case of being not configured with IC device 9 on groove 411, light is by light
Electric diode accepts.Thereby, it is possible to be judged as being not configured with IC device 9 in groove 411.
Additionally, eliminate first groove the 451, second groove 452 in Fig. 2, Fig. 5～Fig. 7.
It addition, the holding face 47 the most following in the bottom surface of groove 411 is formed in its substantially central portion
The suction port 453 of opening.Suction port 453 is such as connected with suction units such as pumps.And, by this
The action of suction unit, acts on captivation at suction port 453, thereby, it is possible to solid in groove 411
Determine IC device 9.
Supply mechanical hand
Supply mechanical hand 42 is that the IC device 9 being arranged on mounting workbench 341 is delivered to shuttle
The mechanical hand of moving part 41.Such supply mechanical hand 42 has the bearing support supported by base station 11
421, it is supported by frame 421 to support and can move back and forth in the Y direction relative to bearing support 421
Movable stand 422 and four hand unit (holding mechanical hand) of being supported by movable stand 422
423.Each hand unit 423 possesses elevating mechanism and adsorption mouth 424, it is possible to carry out handle by absorption
Hold IC device 9.Each hand unit 423 is identical, so illustrating one of them below.
Hand unit 423 when Z-direction (vertical) is observed in the groove with spindle moving part 41
The shape of 411 correspondences.Specifically, hand unit 423 is tetragon when Z-direction is observed,
And it is more slightly smaller than the inner peripheral portion of groove 411.Additionally, in the present embodiment, this tetragon is square
Shape or rectangle.This hand unit 423 is arranged in when making IC device 9 fall into groove 411
Relative to groove 411 in the position of the distance of regulation, thereby, it is possible to covered by hand unit 423
Lid groove 411 (with reference to Fig. 5～Fig. 7).
The not shown body being connected with suction pump is had, by this it addition, connect in adsorption mouth 424
IC device 9 is adsorbed in the action of suction pump.Additionally, the driving of suction pump is controlled by controlling portion 8
System.
Check mechanical hand
Check that mechanical hand 43 is to the IC device 9 of spindle moving part 41 to inspection portion 5 conveying storage
(with reference to Fig. 9～Figure 13), and the IC device 9 finishing to check is delivered to shuttle from inspection portion 5
The mechanical hand of moving part 41.Push away it addition, check mechanical hand 43 also to be able to when checking to inspection portion 5
Pressure IC device 9, applies the inspection pressure of regulation to IC device 9.Such inspection mechanical hand 43
Have supported by base station 11 bearing support 431, be supported by frame 431 and support and can be relative to supporting
Movable stand 432 that frame 431 moves back and forth in the Y direction and supported by movable stand 432 four
Individual hand unit (holding mechanical hand) (electronic unit handle part) 433.Each hand unit 433 has
Standby elevating mechanism and adsorption mouth, it is possible to hold (holding) IC device 9 by absorption.
Reclaim mechanical hand
Reclaiming mechanical hand 44 is to be delivered to back by the IC device 9 of the inspection finished by inspection portion 5
Receive the mechanical hand of side aligning section 6.Such recovery mechanical hand 44 has by propping up that base station 11 supports
Bolster 441, it is supported by frame 441 and supports and can be the most reciprocal relative to bearing support 441
The movable stand 442 of movement and four hand unit supported by movable stand 442 (hold machinery
Hands) 443.Each hand unit 443 possesses elevating mechanism and adsorption mouth, it is possible to come by absorption
Hold IC device 9.
Such delivery section 4 carries IC device 9 as follows.First, spindle moving part 41 is to figure
Middle left side is moved, and the IC device 9 on mounting workbench 341 is delivered to shuttle by supply mechanical hand 42
Moving part 41 (STEP1).It follows that spindle moving part 41 is to central mobile, check that mechanical hand 43 will
IC device 9 on spindle moving part 41 is delivered to inspection portion 5 (STEP2).It follows that inspection machine
The IC device 9 of the inspection finished by inspection portion 5 is delivered to spindle moving part 41 by tool hands 43
(STEP3).It follows that spindle moving part 41 right side in figure is mobile, reclaim mechanical hand 44 by shuttle
The complete IC device 9 of inspection on moving part 41 is delivered to reclaim side aligning section 6 (STEP4).
By the most such STEP1～STEP4, it is possible to IC device 9 is carried via inspection portion 5
To reclaiming side aligning section 6.
Inspection portion
Inspection portion 5 is the unit checking, testing the electrical characteristics of IC device 9, and inspection portion 5 connects
Tester (not shown).As in figure 2 it is shown, inspection portion 5 has four guarantors keeping IC device 9
Hold portion 51.These maintaining parts 51 are made up of recess respectively, are provided with and IC device 9 bottom it
Multiple probes 511 (with reference to Figure 12) of terminal electrical connection.Each probe electrically connects with control portion 8.
When the inspection of IC device 9, an IC device 9 configures (holding) in a maintaining part 51.
It is configured at each terminal 92 of IC device 9 of maintaining part 51 respectively by checking the hands of mechanical hand 43
The pressing of portion's unit 433 and be urged to each probe with the inspection pressure of regulation.Thus, IC device 9
Each terminal 92 and each probe electrical connection (contact), carry out the inspection of IC device 9 via probe.
The inspection of IC device 9 is carried out based on the program being stored in control portion 8.
Control portion
Control portion 8 such as has inspection control portion and drive control part.Check control portion such as based on
The program being stored in not shown memorizer carries out being configured at the IC device 9 in inspection portion 5
The inspections of electrical characteristics etc. control.It addition, drive control part such as controls supply unit 2, supply side row
Each portion of row portion 3, delivery section 4, inspection portion 5, recovery side aligning section 6 and recoverer 7 drives
Dynamic, carry out the conveying of IC device 9, IC device 9 and control to the location in inspection portion 5 etc..
Detent mechanism
It follows that detent mechanism 100 is illustrated, but each IC device 9 is positioned
Detent mechanism 100 is identical, so illustrating one of them below.
Location based on this detent mechanism 100 has and carries out IC device in the groove 411 of spindle moving part 41
The one-time positioning of the location of part 9 (with reference to Fig. 4, Fig. 8) and the positioning states of one-time positioning is tieed up
Hold the second positioning (Fig. 9～Figure 13) of the maintaining part 51 to inspection portion 5.One-time positioning passes through one
Secondary detent mechanism 101 is carried out, and second positioning is carried out by second positioning mechanism 102.
As shown in Figure 4, one-time positioning mechanism 101 has: the shuttle possessing spindle moving part main body 410 moves
41, two bodys of part 161 and 162, two valves 171 and 172 and two pumps 181
And 182.It addition, one-time positioning mechanism 101 has hand unit 423.Body 161 and
The inner chamber of 162 is the stream that air G (fluid) flows.Additionally, in body 161 and 162
The position (one end) in the following wall portion 46 being inserted into spindle moving part main body 410 be spindle moving part
The structural elements of 41.That is, spindle moving part main body 410 and body 161 and 162 it is inserted into wall
The positions (one end) in portion 46 etc. constitute the spindle moving part 41 keeping IC device 9.
As shown in Fig. 5～Fig. 7, spindle moving part main body 410 possesses: have the guarantor keeping IC device 9
Hold the substrate 48 in face (electronic unit holding face) 47 and to surround holding face 47 on substrate 48
The wall portion 46 that arranges of mode.Should illustrate, keep face 47 parallel with X/Y plane.
It addition, the shape in wall portion 46 is not particularly limited, but in the present embodiment, wall
The portion 46 frame-shaped in tetragon, and it is formed at the peripheral part of substrate 48.That is, observe from Z-direction
Time, the shape of the inner surface in wall portion 46 and the shape of outer surface are respectively tetragon.Additionally,
In the present embodiment, this tetragon is square or rectangle.Thus, in spindle moving part main body
Being formed on 410 when Z-direction is observed is the groove 411 of tetragon.The bottom surface of this groove 411 is
Holding face 47.
It addition, as shown in Figure 3, Figure 4, erect four faces arranged that is the relative to keeping face 47
One wall the 413, second wall the 414, the 3rd wall 415 and the 4th wall 416 constitute groove
The inner surface of 411.The wall adjoined of the first wall 413～the 4th wall 416 is the most orthogonal.
And, the first wall 413 and the first corner 417 of the second wall 414 form right angle, the 3rd wall
Face 415 and the 4th wall 416 are arranged in and the position at the first diagonal angle, corner 417, and form right angle
The second corner 418.In the present embodiment, as shown in Figure 4, by four of IC device 9
A corner 94 in corner abuts with the first corner 417 and positions.Like this, at shuttle
In moving part 41, the first corner 417 is set to carry out IC device 9 in this spindle moving part 41
The datum mark of location.
The inclined plane 461 that inner side is lower than outside it is formed with on the top of the inner peripheral portion in wall portion 46.Thus,
When IC device 9 is configured at spindle moving part 41, easily IC device 9 is inserted along inclined plane 461
Enter to groove 411, and be arranged on holding face 47.
The one end of body 161,162 is had it addition, connect in the wall portion 46 of spindle moving part main body 410.
In this case, the one end of body 161,162 is respectively arranged at the diagonal angle of tetragon.And,
The opening (peristome) 1611 of the one end of body 161 is configured at the first corner 417 and opens,
The opening (peristome) 1621 of the one end of body 162 is configured at the second corner 418 and opens.
In the present embodiment, by the position (one end) being inserted into wall portion 46 of body 161
Constitute first flow path, be made up of the position (one end) being inserted into wall portion 46 of body 162
Two streams.As shown in Figure 4, represent in first flow path flowing air G flowing first to
Amount V1The most not orthogonal with the first wall 413 and the second wall 414.That is, primary vector V1
It is 45 ° with the first wall 413 angulation, primary vector V1Become with the second wall 414
Angle be also 45 °.It addition, represent in second flow path flowing fluid flowing second to
Amount V2Also distinguish not orthogonal with the first wall 413 and the second wall 414.That is, secondary vector
V2It is 45 ° with the first wall 413 angulation, secondary vector V2With the second wall 414 institute
The angle become also is 45 °.As it is shown in fig. 7, by primary vector V1With secondary vector V2Respectively
Like this towards identical direction, it is possible to easily make IC device 9 move to the base as location
The first side, corner 417 on schedule.It addition, in the present embodiment, owing to IC device 9 being
Be illustrated in case of square, institute so that vector with wall angulation is 45 °,
But it not this restriction in the case of IC device is rectangular, suitably set with rectangular length
The angle that the length ratio of limit and minor face determines.Specifically, it is diagonal and the wall of IC device
Face angulation.
As shown in Fig. 5～Fig. 7, opening 1611,1621 is configured in and is held in shuttle at IC device 9
Than terminal arrangement face 93 by below Z-direction under the state of moving part 41.By such configuration, energy
Enough make IC device 9 somewhat float by the air stream in groove 411, carry out IC device 9
In the case of location, it is possible to make IC device 9 move to the first side, corner 417 fully.
Additionally, in the present embodiment, opening 1611 closes with the position of the Z-direction of opening 1621
System is identical position, but is not limited to this, it is also possible to be different positions.In this case,
Preferably opening 1611 is positioned at above Z-direction than opening 1621.This structure is to be intended to IC device
Effective structure in the case of 9 sides, holding face 47 being urged to groove 411.
It addition, opening 1611 is the most identical with the size of opening 1621, but not
It is defined in this, it is also possible to different.In such a situation it is preferred that opening 1611 is less than opening 1621.
It addition, as shown in Figure 3, Figure 4, it is also possible to by the internal diameter in the downstream of body 161,162
Reduce.
Connect in the other end different from one end of body 161 and have pump 181.It addition, at pipe
The midway of body 161 is provided with valve 171.On the other hand, different from one end at body 162
The other end connect have pump 182.It addition, be provided with valve 172 in the midway of body 162.
Pump 182 is the ejection section of injection air G, and pump 181 is the suction unit attracting air G.If it is logical
The action crossing pump 182 sprays air G from pump 182, then this air G flows in body 162,
And spray to groove 411 from opening 1621.If it addition, by the action of pump 181, pump 181
Attract air G, then the air G in groove 411 is attracted (discharge) from opening 1611, this sky
Gas G flows in body 161 and is expelled to outside.
It addition, the inner chamber of opening and closing body 161 can be carried out by the opening and closing of valve 171, it is possible to pass through
The opening and closing of valve 172 carrys out the inner chamber of opening and closing body 162.It addition, as valve 171,172, if
Use can adjust the valve of its aperture, then can be adjusted at body by the adjustment of above-mentioned aperture
161, the flow of the air G of 162 interior flowings.I.e., it is possible to by the tune of the aperture of valve 172
The whole injection pressure adjusting air G or injection flow.It addition, can opening by valve 171
The adjustment of degree adjusts the suction pressure of air G or attracts flow.Therefore, it is made up of valve 172
Adjust injection pressure or the adjustment portion of injection flow of air G, it addition, constituted tune by valve 171
The suction pressure of whole air G or the adjustment portion of attraction flow.
Additionally, the injection pressure of air G can be identical with the suction pressure of air G, it is also possible to different.
In the case of the injection pressure of air G is different from the suction pressure of air G, the preferably spray of air G
The suction pressure penetrating pressure ratio air G is big.
It addition, also be able to be adjusted at body 161,162 by the output of adjustment pump 181,182
The flow of the air G of interior flowing.Additionally, controlled pump 181,182 and valve by control portion 8
171, the driving of 172.
It follows that IC device 9 to be positioned by one-time positioning mechanism 101 situation of spindle moving part 41
Under action illustrate.
First, as it is shown in figure 5, keep IC device 9 by hand unit 423, and by this IC
Device 9 is inserted into the position of the regulation in the groove 411 of spindle moving part 41.In the present embodiment,
The bottom making hand unit 423 is arranged in the upper end in groove 411, and makes hand unit 423
Stop.Thus, groove 411 is covered by this hand unit 423.Thereby, it is possible to suppression air
G is from groove 411 internal leakage, it addition, be prevented from IC device 9 because of air stream from groove 411
Fly out.
It follows that as shown in Figure 6, IC device 9 is made to depart from from hand unit 423 and fall.
Thus, IC device 9 is inserted in groove 411, and is configured on holding face 47.
It follows that open valve 171,172, and make pump 181,182 action.Thus, from pump
182 injection air G, as it is shown in fig. 7, air G flows in body 162, and from opening 1621
Spray to groove 411.It addition, pump 181 attracts air G, the air G in groove 411 from
Opening 1611 is attracted, and flows in body 161, and is discharged to outside.Thus, empty
Gas G is to making the IC device 9 direction flowing towards (being urged to) first side, corner 417.Then,
IC device 9 is pressed into the first side, corner 417, corner 94 and first jiao by air stream (blast)
Portion 417 abuts.By above action, one-time positioning terminates (with reference to Fig. 4, Fig. 7).
Here, not to make IC device 9 from hand unit 423 depart from first timing and pass through pump
181, the action of 182 produces the second timing of air stream and is particularly limited, but preferably first is fixed
Time the most equal with the second timing, or make that the first timing is regularly more forward than second (to be carried as described above
Before).
If than the second timing more rearward, then IC device 9 exposes the time in the air stream in the first timing
Elongated, exist IC device 9 because of this air stream cooled misgivings, if but the first timing is with the
Two timings are the most equal, or the first timing is regularly more forward than second, then can suppress IC device 9 because of
Air stream and be cooled.
It addition, in the case of the first timing is more forward than the second timing, preferably arrive at IC device 9
Air stream is produced before the holding face of reaching 47.Thus, except keeping face 47 and IC device 9
Produce outside air stream between terminal arrangement face 93, also keeping each of face 47 and IC device 9
Air stream is produced, by this air stream, it is possible to easily make IC device 9 float between terminal 92.
As discussed above, in checking device 1, it is possible to make IC device by air stream
Part 9 is moved and positioned over spindle moving part 41.Further, since make IC device 9 move by air stream,
It is possible to the damage of suppression IC device 9.It addition, the injection of air G, attraction can be passed through
Remove the foreign body of the vicinity of the terminal 92 of IC device 9.
As shown in Fig. 8～Figure 13, the delivery section that second positioning mechanism 102 is possessed by spindle moving part 41
Location division 49, check the handle part location division 435 that possessed of mechanical hand 43 and inspection portion 5
The maintaining part location division 56 possessed is constituted.Delivery section location division 49 and handle part location division 435
Chimeric during IC device 9 (with reference to Figure 10) is joined between spindle moving part 41 with inspection mechanical hand 43.
It addition, handle part location division 435 is checking mechanical hand 43 and inspection portion with maintaining part location division 56
Chimeric during IC device 9 (with reference to Figure 13) is joined between 5.
Delivery section location division 49 is constituted (including) by the first location division 491 and the second location division 492.
First location division 491 and the second location division 492 are directing pin, are pressed into shuttle from upside
In moving part main body 410.It addition, on the first location division 491 and top of the second location division 492
It is formed with the most tapered tapered portion 493 that external diameter is gradually reduced upward.Thus, as following
Like that, the first location division 491 is being inserted into the 3rd location division 436, by the second location division 492
When being inserted into four location divisions 437, easily and successfully carry out each insertion.
As shown in Figure 4, the first location division 491 and the second location division 492 are via groove 411
Configuration, the first location division 491 is positioned at the second wall 414 and the 3rd wall 415 structure of groove 411
The adjacent corner become, the second location division 492 is positioned at the first wall 413 and the 4th wall of groove 411
The adjacent corner that face 416 is constituted.Also, it is preferred that with the center O by the first location division 4911
Center O with the second location division 4922Straight line L by away from the first corner 417 at (1/2) × A
Position and away from the first corner 417, mode in the position of (1/2) × B configures the first location division
491 and second location division 492.Additionally, as it has been described above, " A " be IC device 9 along X
The length in direction, " B " is the length along Y-direction of IC device 9.By by the first location division
491 and second location division 492 be configured at such position, by IC device 9 from spindle moving part
41 when being delivered to inspection portion 5, it is also possible to correctly carry out initial spindle moving part 41 and IC as far as possible
The location of device 9.
Handle part location division 435 is made up of the 3rd location division 436 and the 4th location division 437.
3rd location division 436 and the parts that the 4th location division 437 is ring-type (circular), quilt
It is pressed into movable stand 432 from upside.It addition, in the 3rd location division 436 and the 4th location division
The top of 437 is formed with the flange part 438 of enlarged outside diameter.Thus, the 3rd location division 436 is limited
And the 4th press-in limit of location division 437, prevent the disengaging downwards of each location division.
It addition, as shown in Figure 9, Figure 10, the 3rd location division 436 is configured at spindle moving part 41
The most chimeric with being inserted into the first location division 491 when checking and join IC device 9 between mechanical hand 43
Position, the 4th location division 437 is configured at spindle moving part 41 and checks handing-over between mechanical hand 43
The second location division 492 chimeric position it is inserted into during IC device 9.By making inspection mechanical hand
The hand unit 433 of 43 holds IC device 9 under such chimerism, it is possible to by spindle moving part
The state of the one-time positioning of the IC device 9 in the groove 411 of 41, as second positioning, keeps former
Taken over by this hand unit 433 sample.
Maintaining part location division 56 is made up of the 5th location division 561 and the 6th location division 562.
5th location division 561 and the 6th location division 562 are directing pin, are pressed into tool from upside
Have on the substrate (inspection portion main body) 54 of maintaining part 51.It addition, in the 5th location division 561 with
And the 6th the top of location division 562 be formed with the most tapered cone that external diameter is gradually reduced upward
Shape portion 563.Thus, as described below, it is inserted into the 3rd location division in the 5th location division 561
436, when the 6th location division 562 is inserted into four location divisions 437, easily and successfully enter
The each insertion of row.
Additionally, the cone of each tapered portion 563 in the 5th location division 561 and the 6th location division 562
Shape angle can be with each tapered portion 493 in the first location division 491 and the second location division 492
Angle of taper is identical, it is also possible to different.
It addition, the length of tapered portion 563 (length of above-below direction) can be with tapered portion 493
Length (length of above-below direction) is identical, it is also possible to different.Length and cone in tapered portion 563
In the case of the length difference in shape portion 493, preferably the length of tapered portion 563 is than tapered portion 493
Length length (with reference to Figure 10, Figure 13).
As shown in figure 13, the 5th location division 561 is configured in and is checking mechanical hand 43 and inspection portion
Between 5 join IC device 9 time be inserted into the 3rd location division 436 and be fitted together to position, the 6th
Location division 562 is configured in when checking handing-over IC device 9 between mechanical hand 43 and inspection portion 5
It is inserted into the 4th location division 437 chimeric position.By such chimerism, IC device
Part 9 is also maintained the state of second positioning in the maintaining part 51 in inspection portion 5.
It follows that carry by the IC device 9 not checking state based on the flow chart shown in Figure 14
To spindle moving part 41, and till IC device 9 being delivered to spindle moving part 41 again after having checked
Control program illustrate.
If make supply mechanical hand 42 action, and by each hand unit 423 of this supply mechanical hand 42
The IC device 9 held is delivered to be in (step S101) on the spindle moving part 41 of primary importance,
Then release IC device 9 (step S102).
It follows that make one-time positioning mechanism 101 action, as described above, make IC device 9
Corner 94 abuts (with reference to Fig. 4, Fig. 8) with the first corner 417 of groove 411, carries out once
Location (step S103).
After step S103 performs, it is built in the timer action (step S104) in control portion 8, sentences
Break in the case of arriving for the time (step S105), make the suction port 453 with groove 411 be connected
Suction unit action, in groove 411, fix IC device 9 (step S106) by vac sorb.
Guarantee fully until carrying out one-time positioning furthermore it is possible to arrived by the time of step S105
Till time, complete therefore, it is possible to be considered as one-time positioning.
It follows that spindle moving part 41 is moved to the second position (step S107) from primary importance.
It follows that make inspection mechanical hand 43 action, make each hand list of this inspection mechanical hand 43
(with reference to Fig. 9) after unit 433 is located on the spindle moving part 41 of the second position, make hand unit
433 decline and hold IC device 9 (with reference to Figure 10) (step S108) by absorption.Should
Illustrating, by this decline, the first location division 491 is chimeric with the 3rd location division 436, and second
Location division 492 is chimeric with the 4th location division 437.Thus, as described above, connect with keeping intact
State for the one-time positioning of IC device 9 is used as second positioning.
After step S108 performs, stop the above-mentioned attraction being connected with the suction port 453 of groove 411
The action in portion, releases fixing (step S109) to IC device 9.
It follows that make inspection mechanical hand 43 action, make each hand unit of this inspection mechanical hand 43
433 rise (with reference to Figure 11), afterwards, IC device 9 are delivered to inspection portion 5 (with reference to Figure 12)
Top (step S110).
If IC device 9 is come in inspection portion 5, then make each hand unit 433 of inspection mechanical hand 43
Decline (with reference to Figure 13), and IC device 9 is pressed into inspection portion 5 (step S111).Should say
Bright, by this decline, the 3rd location division 436 is chimeric with the 5th location division 561, and the 4th is fixed
Position portion 437 is chimeric with the 6th location division 562.Thus, as described above, it is possible to maintain secondary fixed
The state of position, makes each terminal 92 of IC device 9 correctly electrically connect with each probe.Like this,
Check that device 1 can easily be carried out by the location to IC device 9 in inspection portion 5.
It follows that start the inspection (step S112) of IC device 9, if this has checked (step
S113), then make inspection mechanical hand 43 action, IC device 9 is returned again to spindle moving part 41 (step
Rapid S114).
After step S114 performs, spindle moving part 41 is moved to the 3rd position from the second position.Afterwards,
Make recovery mechanical hand 44 action, and according to checking that result is by the IC device on spindle moving part 41 9 points
It is assigned to reclaim side aligning section 6.
(the second embodiment)
Figure 15 be represent in the electronic component inspection device (the second embodiment) of the present invention from
Conveying does not checks the control to again carrying electronic unit after having checked of the electronic unit of state
The flow chart of processing procedure sequence.
Hereinafter, with reference to this figure, electronic component handling apparatus and the electronic unit inspection of the present invention are filled
The second embodiment put illustrates, but enters centered by the difference with above-mentioned embodiment
Row explanation, for identical item, the description thereof will be omitted.
Present embodiment is in addition to the timing difference of one-time positioning, with above-mentioned first embodiment phase
With.
If make supply mechanical hand 42 action, and by each hand unit 423 of this supply mechanical hand 42
The IC device 9 held is delivered to be in (step S201) on the spindle moving part 41 of primary importance,
Then release IC device 9 (step S202).
It follows that make spindle moving part 41 move to the second position (step S203) from primary importance.
It follows that make one-time positioning mechanism 101 action, and as described above, make IC device 9
Corner 94 abut with the first corner 417 of groove 411 and carry out one-time positioning (step S204).
After step S204 performs, it is built in the timer action (step S205) in control portion 8,
It is judged as, in the case of time arrival (step S206), making inspection mechanical hand 43 action, making this
Check that each hand unit 433 of mechanical hand 43 is located on the spindle moving part 41 of the second position.It
After, make hand unit 433 decline and hold IC device 9 (step S207) by absorption.
It follows that make each hand unit 433 of inspection mechanical hand 43 increase, and by IC device 9
It is delivered to (step S208) in inspection portion 5.If IC device 9 is come in inspection portion 5, then make
Check that each hand unit 433 of mechanical hand 43 declines, IC device 9 is pressed into inspection portion 5 (step
Rapid S209).Thus, in the present embodiment, also identical with above-mentioned first embodiment, make IC
Each terminal 92 of device 9 correctly electrically connects with each probe.Therefore, the inspection of present embodiment
Device 1 also is able to easily carry out by the location to IC device 9 in inspection portion 5.
It follows that start the inspection (step S210) of IC device 9, if this has checked (step
S211), then make inspection mechanical hand 43 action, IC device 9 is returned again to spindle moving part 41 (step
Rapid S212).
After step S212 performs, spindle moving part 41 is moved to the 3rd position from the second position.Afterwards,
Make recovery mechanical hand 44 action, and according to checking that result is by the IC device on spindle moving part 41 9 points
It is assigned to reclaim side aligning section 6.
(the 3rd embodiment)
Figure 16 is that the electronic component inspection device (the 3rd embodiment) representing the present invention possesses
The horizontal cross of delivery section.Should illustrate, eliminate the first groove, the second groove in figure 16.
Hereinafter, with reference to this figure to the electronic component handling apparatus of the present invention and electronic unit inspection
3rd embodiment of device illustrates, but centered by the difference with above-mentioned embodiment
Illustrating, for identical item, the description thereof will be omitted.
Present embodiment, in addition to the structure difference of one-time positioning mechanism, is implemented with above-mentioned first
Mode is identical.
As shown in figure 16, in the present embodiment, one-time positioning mechanism 101 has and spindle moving part
41 131,132,133 and 134, four valves 141,142,143 of four bodys connected
And 144 and four pumps 151,152,153 and 154.The inner chamber of body 131～134
It it is the stream of air G flowing.It addition, the opening (peristome) of the one end of body 131～134
1311,1321,1331,1341 inner surfacies in wall portion 46 are open.Additionally, by body 131
The position (one end) being inserted into wall portion 46 constitute first flow path, by the insertion of body 132
Position (one end) to wall portion 46 constitutes another first flow path.It addition, by body 133
The position (one end) being inserted into wall portion 46 constitute second flow path, by the insertion of body 134
Position (one end) to wall portion 46 constitutes another second flow path.
In the present embodiment, the one end of body 131 and 132 is arranged in groove 411
The vicinity in the first corner 417, the one end of body 133 and 134 is arranged in the of groove 411
The vicinity in two corners 418.Further, the one end of body 131 and the inner surface constituting groove 411
The first wall 413 orthogonal, the one end of body 132 and the of the inner surface constituting groove 411
Two walls 414 are orthogonal, the 3rd wall of the inner surface of the one end of body 133 and composition groove 411
Face 415 is orthogonal, the 4th wall 416 of the inner surface of the one end of body 134 and composition groove 411
Orthogonal.
Thus, expression is at the primary vector V of the flowing of the fluid of the one end flowing of body 1311、
With the primary vector V of flowing representing the fluid flowed at the one end of body 1321Formed angle
Degree is 90 °.Thus, vector obtained by the vector of synthesis both sides is for making IC device 9 towards first
The vector in the direction in corner 417.It addition, represent the fluid of the one end flowing at body 133
The secondary vector V of flowing2, and represent the flowing of fluid that the one end at body 134 flows
Secondary vector V2Angulation is 90 °.Thus, vector obtained by the vector of synthesis both sides is also
For making IC device 9 towards the vector in the direction in the first corner 417.
By the one-time positioning mechanism 101 making such vector produce, it is possible to it is right easily to carry out
The one-time positioning of IC device 9.
Additionally, in one-time positioning mechanism 101, the path direction of the one end of body 131 with
The path direction of the one end of body 132 is intersected, it addition, the stream of the one end of body 133
Direction, road intersects with the path direction of the one end of body 134.That is, represent at body 131
The primary vector V of flowing of fluid of one end flowing1, and represent in one end of body 132
The primary vector V of the flowing of the fluid of portion's flowing1Angulation is not 0 ° and 180 °
Can, expression is at the secondary vector V of the flowing of the fluid of the one end flowing of body 1332, and table
Show the secondary vector V of flowing of the fluid that the one end at body 134 flows2Angulation is not
It it is 0 ° and 180 °.
Above, based on embodiment illustrated to the electronic component handling apparatus of the present invention and electricity
Subassembly checks that device is illustrated, but the present invention is not limited to this, it is possible to will constitute electronics
Each portion of component conveying apparatus and electronic component inspection device is replaced into and can play identical function
Each portion of arbitrary structures.Alternatively, it is also possible to additional arbitrary works.
It addition, the electronic component handling apparatus of the present invention and electronic component inspection device can also
It it is the device of the arbitrary plural structure (feature) being combined with in the respective embodiments described above.
It addition, certainly, the configuration quantity of the groove of spindle moving part and configuration mode, supply machinery
The configuration quantity of the hand unit of hands and configuration mode, the configuration of hand unit of inspection mechanical hand
Quantity and configuration mode, the configuration quantity of hand unit of recovery mechanical hand and configuration mode,
And the configuration quantity of the maintaining part in inspection portion and configuration mode are not limited to the knot shown in Fig. 2
Structure.
It addition, for delivery section location division, handle part location division and maintaining part location division,
In the respective embodiments described above, delivery section location division and maintaining part location division are directing pin (protuberance),
Maintaining part location division is bullport (recess), but is not limited to this, it is also possible to fixed for delivery section
Position portion and maintaining part location division are bullport (recesses), and maintaining part location division is that directing pin is (convex
Portion).
It addition, in the respective embodiments described above, electronic unit delivery section for have first flow path and
The structure of the both sides of second flow path, but it is not limited to this, it is also possible to for eliminating second flow path
Structure.
It addition, as fluid, employ air in the respective embodiments described above, but in the present invention
In be not limited to this, for instance, it is possible to application nitrogen, argon, carbon dioxide, fluorine type gas,
The gases such as the various insulating properties gas such as the mixed gas including these gases.
Symbol description: 1 ... inspection device, 2 ... supply unit, 3 ... supply side aligning section, 341 ...
Mounting workbench, 4 ... delivery section, 41 ... spindle moving part, 410 ... spindle moving part main body, 411 ... groove,
413 ... the first wall, 414 ... the second wall, 415 ... the 3rd wall, 416 ... the 4th wall, 417 ...
First corner, 418 ... the second corner, 42 ... supply mechanical hand, 421 ... bearing support, 422 ... move
Moving frame, 423 ... hand unit, 424 ... adsorption mouth, 43 ... inspection mechanical hand, 431 ... bearing support,
432 ... movable stand, 433 ... hand unit, 435 ... handle part location division, 436 ... the 3rd location division,
437 ... the 4th location division, 438 ... flange part, 44 ... recovery mechanical hand, 441 ... bearing support, 442 ...
Movable stand, 443 ... hand unit, 451 ... the first groove, 452 ... the second groove, 453 ... suction port,
46 ... wall portion, 461 ... inclined plane, 47 ... holding face, 48 ... substrate, 49 ... delivery section location division,
491 ... the first location division, 492 ... the second location division, 493 ... tapered portion, 5 ... inspection portion, 51 ...
Maintaining part, 511 ... probe, 54 ... substrate, 56 ... maintaining part location division, 561 ... the 5th location division,
562 ... the 6th location division, 563 ... tapered portion, 6 ... recovery side aligning section, 7 ... recoverer, 8 ...
Control portion, 9 ... IC device, 91 ... main part, 92 ... terminal, 93 ... terminal arrangement face, 94 ...
Corner, 10 ... conveyer device, 100 ... detent mechanism, 101 ... one-time positioning mechanism, 102 ... two
Secondary detent mechanism, 11 ... base station, 111 ... base station face, 12 ... lid, 131,132,133,134 ...
Body, 1311,1321,1331,1341 ... opening, 141,142,143,144 ... valve,
151,152,153,154 ... pump, 161,162 ... body, 1611,1621 ... opening, 171,
172 ... valve, 181,182 ... pump, A, B ... length, G ... air, L ... straight line, O1、
O2... center, S101～S114, S201～S212 ... step, V1... primary vector, V2... second to
Amount.
Claims (8)
1. an electronic component handling apparatus, it is characterised in that possess:
Electronic unit delivery section, it carries electronic unit；
Electronic unit handle part, it holds described electronic unit；And
Electronic unit maintaining part, it keeps described electronic unit,
Delivery section location division is possessed in described electronic unit delivery section,
The handle part chimeric with described delivery section location division is possessed fixed at described electronic unit handle part
Position portion,
The maintaining part chimeric with described handle part location division is possessed fixed in described electronic unit maintaining part
Position portion,
It is formed in described electronic unit delivery section and is connected to fluid ejection section or fluid suction unit
Stream.
Electronic component handling apparatus the most according to claim 1, it is characterised in that
Described delivery section location division includes the first location division and the second location division,
There is the described electronic unit of the rectangular shape on the limit of length A and the limit of length B in conveying
In the case of, by the straight line at the center of described first location division Yu the center of described second location division
By the position of corner (the 1/2) × A away from described electronic unit delivery section and by away from described electricity
The position of corner (the 1/2) × B of subassembly delivery section.
3. according to the electronic component handling apparatus described in claims 1 or 2, it is characterised in that
Described electronic unit delivery section has the first wall and the second wall constituting the first corner,
Described first wall is orthogonal with described second wall,
The first flow path that described stream includes being configured at described first corner and described fluid flows through,
Represent that the primary vector of the flowing of the described fluid of flowing is the most not in described first flow path
Orthogonal with described first wall and described second wall.
Electronic component handling apparatus the most according to claim 3, it is characterised in that
Described electronic unit delivery section has the 3rd wall and the 4th wall constituting the second corner,
Described second corner is arranged in and the position at described first diagonal angle, corner,
The second flow path that described stream includes being configured at described second corner and described fluid flows through,
Represent that the secondary vector of the flowing of the described fluid of flowing is the most not in described second flow path
Orthogonal with described first wall and described second wall.
5. according to the electronic component handling apparatus described in claim 3 or 4, it is characterised in that
The suction unit attracting described fluid is had in the connection of described first flow path,
The ejection section spraying described fluid is had in the connection of described second flow path.
6., according to the electronic component handling apparatus described in any one in Claims 1 to 5, it is special
Levy and be,
Described electronic unit maintaining part keeps described electronics in the case of checking described electronic unit
Parts.
7., according to the electronic component handling apparatus described in any one in claim 1～6, it is special
Levy and be,
Described electronic unit delivery section keeps described electronic unit and is moved to the place of regulation.
8. an electronic component inspection device, it is characterised in that possess:
Electronic unit delivery section, it carries electronic unit；
Electronic unit handle part, it holds described electronic unit；And
Electronic unit maintaining part, it keeps described electronic unit,
Described electronic unit maintaining part has the function as inspection portion checking described electronic unit,
Described electronic unit delivery section possesses delivery section location division,
Described electronic unit handle part possesses the handle part location chimeric with described delivery section location division
Portion,
Described electronic unit maintaining part possesses the maintaining part location chimeric with described handle part location division
Portion,
It is formed in described electronic unit delivery section and is connected to fluid ejection section or fluid suction unit
Stream.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-200024 | 2014-09-30 | ||
| JP2014200024A JP2016070778A (en) | 2014-09-30 | 2014-09-30 | Electronic component conveyance device and electronic component inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106185259A true CN106185259A (en) | 2016-12-07 |
| CN106185259B CN106185259B (en) | 2018-11-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510243787.9A Expired - Fee Related CN106185259B (en) | 2014-09-30 | 2015-05-13 | Electronic component handling apparatus and electronic component inspection device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016070778A (en) |
| KR (1) | KR101668723B1 (en) |
| CN (1) | CN106185259B (en) |
| TW (1) | TWI582442B (en) |
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| CN109425908A (en) * | 2017-08-31 | 2019-03-05 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN109581182A (en) * | 2017-09-29 | 2019-04-05 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
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| CN117054862A (en) * | 2023-10-13 | 2023-11-14 | 深圳市微特精密科技股份有限公司 | Precise detection equipment and detection process for PCB main board |
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| JP6903267B2 (en) * | 2016-06-01 | 2021-07-14 | 株式会社Ｎｓテクノロジーズ | Electronic component transfer device and electronic component inspection device |
| CN108414850A (en) * | 2017-01-30 | 2018-08-17 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| EP3527994A1 (en) * | 2018-02-20 | 2019-08-21 | Rasco GmbH | Contactor socket and ic test apparatus |
| JP2020034368A (en) * | 2018-08-29 | 2020-03-05 | セイコーエプソン株式会社 | Electronic component conveyance device, unit for electronic component conveyance, and electronic component inspection device |
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- 2015-05-13 CN CN201510243787.9A patent/CN106185259B/en not_active Expired - Fee Related
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109425908A (en) * | 2017-08-31 | 2019-03-05 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN109581182A (en) * | 2017-09-29 | 2019-04-05 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| CN112067969A (en) * | 2019-05-23 | 2020-12-11 | 株式会社爱德万测试 | Electronic component handling apparatus and electronic component testing apparatus |
| CN112067969B (en) * | 2019-05-23 | 2023-08-29 | 株式会社爱德万测试 | Electronic component processing apparatus and electronic component testing apparatus |
| CN117054862A (en) * | 2023-10-13 | 2023-11-14 | 深圳市微特精密科技股份有限公司 | Precise detection equipment and detection process for PCB main board |
| CN117054862B (en) * | 2023-10-13 | 2023-12-15 | 深圳市微特精密科技股份有限公司 | Precise detection equipment and detection process for PCB main board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201612536A (en) | 2016-04-01 |
| KR101668723B1 (en) | 2016-10-24 |
| TWI582442B (en) | 2017-05-11 |
| KR20160038691A (en) | 2016-04-07 |
| CN106185259B (en) | 2018-11-27 |
| JP2016070778A (en) | 2016-05-09 |
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