KR20160038691A

KR20160038691A - Electronic component transfer apparatus and electronic component inspection apparatus

Info

Publication number: KR20160038691A
Application number: KR1020150047201A
Authority: KR
Inventors: 사토시 나카무라
Original assignee: 세이코 엡슨 가부시키가이샤
Priority date: 2014-09-30
Filing date: 2015-04-03
Publication date: 2016-04-07
Also published as: TWI582442B; JP2016070778A; CN106185259A; CN106185259B; TW201612536A; KR101668723B1

Abstract

To perform accurate inspection on a socket, an electronic component inspection apparatus comprises: a shuttle as a transferring part for transmitting an IC device; an inspection robot as a holding part of holding the IC device; a supporting part of supporting the IC device. The position determination part of the transferring part is formed in the shuttle. The position determination part of the supporting part fitted into the position determination part of the shuttle part is formed in the supporting part. Also, a flow path connected to a fluid injection part or fluid absorption part is formed in the shuttle.

Description

TECHNICAL FIELD [0001] The present invention relates to an electronic component transporting apparatus and an electronic component inspecting apparatus.

The present invention relates to an electronic component carrying device and an electronic component testing device.

2. Description of the Related Art An electronic component inspecting apparatus for inspecting the electrical characteristics of an electronic component such as an IC device has been known in the past and an electronic component transporting apparatus for transporting an IC device to a socket as an inspecting unit is inserted have. The electronic component inspecting apparatus disclosed in Patent Document 1 includes a pallet for transporting the IC device in the horizontal direction to the vicinity of the socket and an attracting arm for moving the IC device from the pallet to the socket, and these serve as an electronic component conveying device.

The electronic component inspecting apparatus disclosed in Patent Document 1 employs a fitting structure in which the suction arm and the pallet are fitted to each other so that positioning is performed between the suction arm and the pallet when the suction arm suctions the IC device from the pallet. Similarly, when the suction arm releases the IC device to the socket, a fitting structure is employed in which the suction arm and the socket are fitted to each other so as to be positioned.

Japanese Patent Application Laid-Open No. 10-160797

However, in the electronic component inspecting apparatus disclosed in Patent Document 1, the positioning is performed only between the positioning of the suction arm and the pallet, and the positioning between the suction arm and the socket, and the position determination between the pallet and the IC device, Positioning of the arm and the IC device, and positioning of the socket and the IC device are not performed. Thus, for example, when the IC device on the pallet is in an incorrect position (in a shifted state) from the correct position in the design, it is transferred to the socket with the incorrect state. As a result, the socket can not be inspected correctly.

An object of the present invention is to provide an electronic component carrying apparatus and an electronic component inspecting apparatus which can easily position the electronic component in the electronic component holding section.

This object is achieved by the present invention described below.

[Application Example 1]

An electronic component carrying apparatus of the present invention comprises an electronic component carrying section for carrying an electronic component,

An electronic component gripping portion for gripping the electronic component;

And an electronic component holding portion for holding the electronic component,

The electronic part conveying section is provided with a conveying section positioning section,

Wherein the electronic part gripping part is provided with a grip part positioning part to be fitted to the carry part positioning part,

Wherein the electronic component holding portion is provided with a holding portion positioning portion for fitting with the grip portion positioning portion,

And a flow path connected to the fluid ejecting portion or the fluid sucking portion is formed in the electronic component conveying portion.

Accordingly, it is possible to first position the electronic component in the electronic component carrying section by injecting or sucking the fluid through the flow path, and thereafter, the electronic component can be carried to the electronic component holding section through the electronic component grip section. In this carrying process, the carry section positioning section and the grip section positioning section are fitted together, and the grip section positioning section and the holding section positioning section are fitted in order. Thus, the positioning state of the electronic component in the electronic component carrying section is easily maintained to the electronic component holding section.

[Application example 2]

In the electronic component carrying apparatus of the present invention, the carry section position determining section includes a first position determining section and a second position determining section,

In the case of carrying the rectangular electronic component having sides of length A and sides of length B,

Wherein a straight line passing through the center of the first positioning portion and the center of the second positioning portion passes through a position of (1/2) x A and a position of (1/2) x B from the edge portion of the electronic component carrying portion .

Thus, when the electronic component is transported from the electronic component carrying portion to the electronic component holding portion, positioning of the electronic component carrying portion, which is the first portion, with the electronic component can be performed as accurately as possible.

[Application Example 3]

In the electronic component carrying apparatus of the present invention, the electronic component carrying section has a first wall surface and a second wall surface constituting the first corner portion,

Wherein the first wall surface and the second wall surface are orthogonal to each other,

Wherein the flow path includes a first flow path disposed in the first corner and through which the fluid flows,

It is preferable that the first vector representing the flow of the fluid flowing through the first flow path is not perpendicular to the first wall surface and the second wall surface.

Thus, for example, during falling of the electronic component, the electronic component can be easily moved to the position where it is positioned.

[Application example 4]

In the electronic component carrying apparatus of the present invention, the electronic component carrying section has a third wall surface and a fourth wall surface which constitute a second corner portion arranged at a diagonal position from the first corner portion,

Wherein the flow path includes a second flow path disposed in the second corner and through which the fluid flows,

It is preferable that the second vector representing the flow of the fluid flowing through the second flow path is not orthogonal to the first wall surface and the second wall surface.

[Application Example 5]

In the electronic component carrying apparatus of the present invention, a suction unit for sucking the fluid is connected to the first flow path,

It is preferable that a jetting section for jetting the fluid is connected to the second flow path.

Accordingly, when positioning the electronic component, it is possible to easily move the electronic component.

[Application Example 6]

In the electronic component carrying apparatus of the present invention, it is preferable that the electronic component holding section holds the electronic component when the electronic component is inspected.

Thus, the electronic component can be stably inspected.

[Application Example 7]

In the electronic component transporting apparatus of the present invention, it is preferable that the electronic component transporting section holds the electronic component and moves to a predetermined place.

Thus, for example, the total transportation time of the electronic component can be shortened as much as possible.

[Application Example 8]

An electronic component inspecting apparatus of the present invention comprises an electronic component conveying section for conveying an electronic component,

An electronic component gripping portion for gripping the electronic component;

The electronic component holding portion has a function as an inspection portion for inspecting the electronic component,

1 is a schematic view showing a first embodiment of an electronic component inspection apparatus according to the present invention.
Fig. 2 is a view showing the operation of each part of the electronic component inspection apparatus shown in Fig.
3 is a horizontal sectional view showing a carry section provided in the electronic component inspection apparatus shown in Fig.
Fig. 4 is a horizontal sectional view showing a state in which an electronic component is positioned in a carry section provided in the electronic component inspection apparatus shown in Fig. 1. Fig.
Fig. 5 is a vertical cross-sectional view for explaining the operation of the electronic component inspection apparatus shown in Fig. 1 until the electronic component is positioned in the carry section. Fig.
Fig. 6 is a vertical cross-sectional view for explaining the operation of the electronic component inspection apparatus shown in Fig. 1 until positioning the electronic component in the carry section; Fig.
Fig. 7 is a vertical cross-sectional view for explaining the operation up to the positioning of the electronic component in the carry section in the electronic component inspection apparatus shown in Fig. 1. Fig.
Fig. 8 is a perspective view for explaining the operation of the electronic component testing apparatus shown in Fig. 1 until the electronic component is moved from the carrying section to the holding section; Fig.
Fig. 9 is a perspective view for explaining the operation of the electronic component inspection apparatus shown in Fig. 1 until the electronic component is moved from the carry section to the holding section; Fig.
10 is a perspective view for explaining the operation of the electronic component inspection apparatus shown in Fig. 1 until the electronic component is moved from the carry section to the holding section; Fig.
Fig. 11 is a perspective view for explaining an operation of the electronic component inspection apparatus shown in Fig. 1 until the electronic component is moved from the carry section to the holding section; Fig.
Fig. 12 is a perspective view for explaining the operation of the electronic component testing apparatus shown in Fig. 1 until the electronic component is moved from the carrying section to the holding section; Fig.
Fig. 13 is a perspective view for explaining the operation of the electronic component inspection apparatus shown in Fig. 1 until the electronic component is moved from the carry section to the holding section; Fig.
FIG. 14 is a flowchart showing a control program until the electronic parts inspection apparatus shown in FIG. 1 carries an electronic part in an untested state and carries the electronic part again after the completion of the inspection.
Fig. 15 is a flowchart showing a control program up to the time when an electronic component in a non-inspected state is transported and the electronic component is transported again after the inspection in the electronic component inspection apparatus (second embodiment) of the present invention is completed.
16 is a horizontal sectional view showing a carry section provided in the electronic component inspection apparatus (third embodiment) of the present invention.

(Mode for carrying out the invention)

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electronic component transporting apparatus and an electronic component inspecting apparatus of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings.

&Lt; First Embodiment >

1 is a schematic view showing a first embodiment of an electronic component inspection apparatus according to the present invention. Fig. 2 is a view showing the operation of each part of the electronic component testing apparatus shown in Fig. 1. Fig. 3 is a horizontal sectional view showing a carry section provided in the electronic component inspection apparatus shown in Fig. 4 is a horizontal cross-sectional view showing a state in which an electronic component is positioned in a carry section provided in the electronic component inspection apparatus shown in Fig. Figs. 5 to 7 are vertical cross-sectional views for explaining the operation up to the positioning of the electronic component in the carry section in the electronic component inspection apparatus shown in Fig. 1. Fig. Figs. 8 to 13 are perspective views for explaining the operation of the electronic component inspection apparatus shown in Fig. 1 until the electronic component is moved from the carry section to the holding section. Fig. Fig. 14 is a flowchart showing a control program until the electronic component inspection apparatus shown in Fig. 1 transports the electronic components in the un-inspected state and carries the electronic components again after the inspection is completed.

Hereinafter, as shown in Fig. 1, for convenience of explanation, three mutually orthogonal axes are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis may be referred to as the "X direction", the direction parallel to the Y axis may be referred to as the "Y direction", and the direction parallel to the Z axis may be referred to as the "Z direction". Further, the upstream side in the conveying direction of the electronic component is simply referred to as the " upstream side ", and the downstream side is also simply referred to as the " downstream side ". The term " horizontal " in the present specification is not limited to a complete horizontal, but includes a state in which the horizontal inclination is slightly (for example, less than 5 deg.) As long as the conveyance of the electronic component is not impeded. 3 to 7, the illustration of the probe pins or the like in contact with the terminals of the electronic component in the carry section is omitted.

1, an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), a CIS (Hereinafter simply referred to as " inspection ") of an electronic component such as a CMOS image sensor. Hereinafter, for convenience of explanation, a case of using an IC device as the electronic component to be inspected will be described as an example, and this is referred to as " IC device 9. " In the following, the IC device 9 will be described by taking a BGA package as an example.

First, the IC device 9 will be described.

5 to 7, the IC device 9 is a BGA package and includes a body 91 and a plurality of terminals (electrodes) 92 provided on the exterior of the body 91. The shape of the main body 91 is not particularly limited, but in the present embodiment, it is in the form of a plate. Further, in the thickness direction (the IC device 9 is arranged on the shuttle (electronic component carrying portion) (In the Z direction in a state of being held), it has a rectangular shape (see FIG. 4). The rectangle is square or rectangular in the present embodiment, having sides of length A along the X direction and sides of length B along the Y direction.

5 is a terminal arrangement surface 93 and the plurality of terminals 92 are arranged on the terminal arrangement surface 93 in a lattice shape (matrix shape). Each of the terminals 92 is a hemispherical solder ball. Needless to say, the shape of each terminal 92 is not limited to the hemispherical shape.

Next, the inspection apparatus 1 will be described.

As shown in Fig. 1, the inspection apparatus 1 is provided with a transport apparatus (electronic component transport apparatus) 10 which is a handler. This carrying apparatus 10 has a positioning mechanism 100 for positioning with respect to the IC device 9 as shown in Fig.

That is, the inspection apparatus 1 includes a supply section 2, a supply side arrangement section 3, a transport section 4, an inspection section 5, a collection side arrangement section 6, a collection section 7, And a control unit 8 for controlling each of these units. The inspection apparatus 1 further includes a base (base) 2 for arranging a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6 and a collection unit 7 And a cover 12 that covers the base 11 to receive the supply side array portion 3, the carry portion 4, the inspection portion 5, and the collection side arrangement portion 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal and the supply side array portion 3, the carry portion 4, the inspection portion 5, And the constituent members of the unit 6 are disposed. The inspection apparatus 1 may further include a heater or a chamber for heating the IC device 9, if necessary.

This inspection apparatus 1 is configured such that the supply section 2 supplies the IC device 9 to the supply side arrangement section 3 and arranges the supplied IC device 9 in the supply side arrangement section 3, The conveying unit 4 returns the device 9 to the inspection unit 5 and the inspected unit 5 inspects the conveyed IC device 9 and the inspected IC device 9 is conveyed to the conveying unit 4 And the IC device 9 arranged on the collection side array portion 6 is collected by the collection portion 7. The IC device 9 is arranged in the collection side array portion 6, According to this inspection apparatus 1, the supply, inspection, and recovery of the IC device 9 can be performed automatically. The inspection apparatus 1 further includes a supply section 2, a supply side arrangement section 3, a transport section 4, a part of the inspection section 5, a collection side arrangement section 6, a collection section 7, 8 constitute a transport apparatus 10. The transfer apparatus 10 transfers the IC device 9 and makes final positioning of the IC device 9 to the holding section (electronic component holding section) 51 of the inspection section 5 by the positioning mechanism 100 .

Hereinafter, the configurations of the carry section 4, the examination section 5, and the positioning mechanism 100 will be described.

&Quot;

2, the carry section 4 carries the IC device 9 arranged on the placement stage 341 of the supply side arrangement section 3 to the inspection section 5, To the collection side array unit 6, the IC device 9 having been inspected of the IC device 9. The transfer section 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

-shuttle-

The shuttle 41 transfers the IC device 9 on the placement stage 341 to the vicinity of the inspection section 5 and further the IC device 9 inspected in the inspection section 5 to the recovery side To the vicinity of the array portion 6. [ In this shuttle 41, four pockets 411 for accommodating the IC device 9 are formed in line in the X direction. The shuttle 41 is guided by a linear guide and can be reciprocated in the X direction by a drive source such as a linear motor. Hereinafter, a position at which the shuttle 41 exchanges the IC device 9 with the supply robot 42 is referred to as a " first position ", and a position at which the shuttle 41 contacts the inspection robot 43 The position at which the IC device 9 is exchanged with the recovery robot 44 is referred to as the " second position ", and the position at which the shuttle 41 transfers the IC device 9 with the recovery robot 44 is referred to as " &Quot;

3 and 4, the shuttle 41 is provided with a first groove 451 extending in the X direction and a second groove 452 extending in the Y direction. One first groove 451 is formed and communicates collectively with the respective pockets 411. Four second grooves 452 are formed and communicate with the pockets 411, respectively. A light-emitting diode (not shown) for emitting light and a photodiode for receiving light from a light-emitting diode (not shown) are disposed at both ends of each groove. When the IC device 9 is disposed in the pocket 411, the light is blocked by the IC device 9 and no light is received by the photodiode. Thus, it can be determined that the IC device 9 is disposed in the pocket 411. [ On the other hand, when the IC device 9 is not disposed in the pocket 411, light is received by the photodiode. As a result, it can be determined that the IC device 9 is not disposed in the pocket 411. In Figs. 2 and 5 to 7, the first groove 451 and the second groove 452 are omitted.

A suction port 453 is formed in the bottom surface of the pocket 411, that is, on the holding surface 47, which will be described later. The suction port 453 is connected to, for example, a suction portion such as a pump. Then, suction force acts on the suction port 453 by the operation of the suction portion, and therefore, the IC device 9 can be fixed in the pocket 411. [

- Supply robot -

The supply robot 42 is a robot that transports the IC device 9 disposed on the placement stage 341 to the shuttle 41. [ The supply robot 42 includes a support frame 421 supported on the base 11, a movable frame 422 supported on the support frame 421 and capable of reciprocating in the Y direction with respect to the support frame 421, And four hand units (gripping robots) 423 supported by the moving frame 422. [ Each of the hand units 423 includes a lifting mechanism and a suction nozzle 424, and can be gripped by suctioning the IC device 9. Since each hand unit 423 is the same, one of them will be described below.

The hand unit 423 has a shape corresponding to the pocket 411 of the shuttle 41 when viewed from the Z direction (vertical direction). Specifically, the hand unit 423 has a quadrangular shape when viewed from the Z direction, and is slightly smaller than the inner peripheral portion of the pocket 411. The square is square or rectangular in the present embodiment. The hand unit 423 is disposed at a predetermined distance from the pocket 411 when the IC device 9 is dropped on the pocket 411. Thus, (See Figs. 5 to 7).

A tubular body connected to a suction pump (not shown) is connected to the suction nozzle 424, and the IC device 9 is sucked by the operation of the suction pump. Further, the drive of the suction pump is controlled by the control unit 8.

- Inspection Robot -

The inspection robot 43 conveys the IC device 9 stored in the shuttle 41 to the inspection unit 5 (see Figs. 9 to 13) To the shuttle 41, The inspection robot 43 may also apply a predetermined inspection pressure to the IC device 9 by pushing the IC device 9 to the inspection unit 5 at the time of inspection. The inspection robot 43 includes a support frame 431 supported on the base 11, a movable frame 432 supported on the support frame 431 and capable of reciprocating in the Y direction with respect to the support frame 431, And four hand units (gripping robots) (electronic parts gripping parts) 433 supported by the moving frame 432. [ Each hand unit 433 includes a lifting mechanism and a suction nozzle, and can grip (hold) by sucking the IC device 9.

- Recovery robot -

The recovery robot 44 is a robot that carries the inspected IC device 9 on the inspection unit 5 to the collection side array unit 6. [ The recovery robot 44 includes a support frame 441 supported on the base 11, a movable frame 442 supported on the support frame 441 and capable of reciprocating in the Y direction with respect to the support frame 441, And four hand units (gripping robots) 443 supported by the moving frame 442. [ Each hand unit 443 includes a lifting mechanism and a suction nozzle, and can be gripped by sucking the IC device 9. [

The carry section 4 carries the IC device 9 in the following manner. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transfers the IC device 9 on the placement stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center, and the inspection robot 43 returns the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 returns the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP3). Next, the shuttle 41 moves to the right in the figure, and the recovery robot 44 transfers the inspected IC device 9 on the shuttle 41 to the collection side array unit 6 (STEP 4). By repeating these STEP1 to STEP4, the IC device 9 can be transferred to the collection side array unit 6 via the inspection unit 5. [

«Inspector»

The inspection unit 5 is a unit for inspecting and testing the electrical characteristics of the IC device 9, and is connected to a tester (not shown). As shown in Fig. 2, the inspecting section 5 has four holding portions 51 for holding the IC device 9. [ Each of the holding portions 51 is constituted by a concave portion and a plurality of probe pins 511 electrically connected to the terminals of the IC device 9 are provided at the bottom portion thereof (see FIG. 12). Each of the probe pins is electrically connected to the control section 8. At the time of inspection of the IC device 9, one IC device 9 is arranged (held) in one holding portion 51. [ The respective terminals 92 of the IC device 9 arranged on the holding support portion 51 are pressed against the respective probe pins with a predetermined inspection pressure by the pressing of the hand unit 433 of the inspection robot 43 . As a result, each terminal 92 of the IC device 9 and each probe pin are electrically connected (brought into contact with each other), and the IC device 9 is inspected through the probe pins. The inspection of the IC device 9 is performed based on the program stored in the control section 8. [

«Control section»

The control unit 8 has, for example, an inspection control unit and a drive control unit. The inspection control unit performs control such as inspection of the electrical characteristics of the IC device 9 arranged in the inspection unit 5 based on a program stored in a memory (not shown), for example. The drive control section is configured to drive each section of the supply section 2, the supply side arrangement section 3, the transport section 4, the inspection section 5, the collection side arrangement section 6 and the collection section 7, And performs control such as conveyance of the IC device 9 and positioning of the IC device 9 to the inspection section 5. [

«Positioning mechanism»

Next, the positioning mechanism 100 will be described, but since the positioning mechanism 100 for each IC device 9 is the same, one of them will be described below.

4 and 8) for positioning the IC device 9 in the pocket 411 of the shuttle 41 and a primary positioning (see Figs. 4 and 8) for positioning the IC device 9 in the pocket 411 of the shuttle 41, There is a secondary positioning (Figs. 9 to 13) for holding the positioning state in positioning to the holding portion 51 of the inspection portion 5. Fig. The primary positioning is performed by the primary positioning mechanism 101 and the secondary positioning is performed by the secondary positioning mechanism 102. [

4, the primary positioning mechanism 101 includes a shuttle 41 having a shuttle body 410, two tubes 161 and 162, two valves 171 and 172, And two pumps 181 and 182. The primary positioning mechanism 101 also has a hand unit 423. The internal cavities of the tubes 161 and 162 are flow paths through which air (G) (fluid) flows. A portion (one end) of the shuttle body 410 inserted into the wall portion 46, which will be described later, of the tubes 161 and 162 is a component of the shuttle 41. That is, the shuttle 41 is configured to hold the IC device 9 by the shuttle main body 410 and a portion (one end portion) inserted into the wall portion 46 of the tubes 161 and 162.

5 to 7, the shuttle main body 410 includes a substrate 48 having a holding surface (an electronic component holding surface) 47 for holding an IC device 9, And a wall portion 46 formed so as to surround the holding surface 47. Further, the holding surface 47 is parallel to the XY plane.

Although the shape of the wall portion 46 is not particularly limited, in the present embodiment, the wall portion 46 has a rectangular frame shape and is formed on the outer peripheral portion of the substrate 48. [ That is, the shape of the inner surface of the wall portion 46 and the shape of the outer surface are respectively rectangular when viewed from the Z direction. The square is square or rectangular in the present embodiment. As a result, the shuttle body 410 is formed with a pocket 411 having a rectangular shape when viewed from the Z direction. The bottom surface of the pocket 411 is the holding surface 47.

4 and 5, four surfaces formed upright with respect to the holding surface 47, that is, a first wall surface 413, a second wall surface 414, a third wall surface 415, Four wall surfaces 416 constitute the inner surface of the pocket 411. In the first wall surface 413 to the fourth wall surface 416, adjacent wall surfaces are orthogonal to each other. The first wall surface 413 and the second wall surface 414 form a first corner portion 417 at a right angle and the third wall surface 415 and the fourth wall surface 416 form a first corner portion 417. [ And forms a second corner portion 418 at a right angle. In the present embodiment, as shown in Fig. 4, one corner portion 94 of the four corner portions of the IC device 9 collides with the first corner portion 417 to be positioned. As described above, in the shuttle 41, the first corner portion 417 is set as a reference point at which positioning is made with respect to the IC device 9 in the shuttle 41. [

At an upper portion of the inner peripheral portion of the wall portion 46, an inclined face 461 whose inner side is lower than the outer side is formed. Thus, when the IC device 9 is placed on the shuttle 41, the IC device 9 is easily inserted into the pocket 411 along the inclined surface 461 and placed on the holding surface 47 do.

One end of the tubular body 161 is connected to the wall portion 46 of the shuttle body 410. In this case, one ends of the tubes 161 and 162 are arranged at diagonal angles of a square. An opening (opening) 1621 at one end of the tube 161 is disposed at the first corner 417 and is opened and an opening (opening) 1621 at one end of the tube 162 is closed Two corner portions 418, and is opened.

In the present embodiment, the first flow path is formed by the portion (one end) inserted into the wall portion 46 of the tube body 161, and the portion of the tube body 162 inserted into the wall portion 46 The second flow path is constituted by the second flow path. The first vector V ₁ indicating the flow of the air G flowing through the first flow path is not perpendicular to the first wall surface 413 and the second wall surface 414 as shown in Fig. That is, the angle formed by the first vector V ₁ and the first wall surface 413 is 45 degrees, and the angle between the first vector V ₁ and the second wall surface 414 is 45 degrees. The second vector (V ₂ ) representing the flow of the fluid flowing through the second flow path is not orthogonal to the first wall surface 413 and the second wall surface 414, respectively. That is, the angle formed between the second vector V ₂ and the first wall surface 413 is 45 degrees, and the angle formed between the second vector V ₂ and the two wall surfaces 414 is 45 degrees. The first vector (V ₁ ) and the second vector (V ₂ ) are directed in the same direction as described above, whereby the IC device 9 is positioned at the first corner portion 417, respectively. In this embodiment, since the case where the IC device 9 is a square is described as an example, the angle formed by the vector and the wall surface is 45 degrees. However, the case where the IC device is rectangular is not limited to this, Is set appropriately. Specifically, it is the angle formed by the diagonal line of the IC device and the wall surface.

The openings 1611 and 1621 are disposed below the terminal placement surface 93 in the Z direction with the IC device 9 held by the shuttle 41 as shown in Figs. With this arrangement, the IC device 9 can be slightly raised by the air flow in the pocket 411, and when positioning the IC device 9, the IC device 9 can be positioned at the first corner portion It can be sufficiently moved to the side of the base 417 side.

The positional relationship between the opening 1611 and the opening 1621 in the Z direction is the same in the present embodiment, but the present invention is not limited to this and may be different. In this case, it is preferable that the opening 1611 is positioned above the opening 1621 in the Z direction. This configuration is effective when pushing the IC device 9 toward the holding surface 47 side of the pocket 411. [

The size of the opening 1611 and the size of the opening 1621 are the same in the present embodiment, but the present invention is not limited to this and may be different. In this case, the opening 1611 is preferably smaller than the opening 1621.

Further, as shown in Figs. 3 and 4, the inner diameter of the downstream side of the tubes 161 and 162 may be reduced.

A pump 181 is connected to the other end different from the one end of the tubular body 161. A valve 171 is provided in the middle of the tubular body 161. On the other hand, a pump 182 is connected to the other end different from the one end of the tubular body 162. A valve 172 is provided in the middle of the tube 162. The pump 182 is a jetting section for jetting the air G and the pump 181 is a jetting section for sucking the air G. [ When the air G is jetted from the pump 182 by the operation of the pump 182, the air G flows in the tubular body 162 and is jetted from the opening 1621 into the pocket 411. When the pump 181 sucks the air G by the operation of the pump 181, the air G in the pocket 411 is sucked (discharged) from the opening 1611, and the air G Flows through the tube 161 and is discharged to the outside.

It is also possible to open and close the lumen of the tubular body 161 by opening and closing the valve 171 and opening and closing the lumen of the tubular body 162 by opening and closing the valve 172. If the valves 171 and 172 can adjust the opening degree, the flow rate of the air G flowing through the tubes 161 and 162 can be adjusted by adjusting the opening degree. That is, by adjusting the opening degree of the valve 172, the injection pressure or the injection flow rate of the air G can be adjusted. Further, by adjusting the opening degree of the valve 171, the suction pressure or the suction flow amount of the air G can be adjusted. The valve 171 is provided with an adjustment section for adjusting the injection pressure or the injection flow rate of the air G by the valve 172. The valve 171 adjusts the suction pressure or the suction flow rate of the air G .

The injection pressure of the air G and the suction pressure of the air G may be the same or different. It is preferable that the jetting pressure of the air G is larger than the suction pressure of the air G when the jetting pressure of the air G is different from the suction pressure of the air G. [

The flow rate of the air G flowing through the tubes 161 and 162 can also be adjusted by adjusting the outputs of the pumps 181 and 182. [ The driving of the pumps 181 and 182 and the valves 171 and 172 is controlled by the control unit 8. [

Next, the operation in the case where the primary positioning mechanism 101 positions the IC device 9 on the shuttle 41 will be described.

5, the hand unit 423 holds the IC device 9 and inserts the IC device 9 to a predetermined position in the pocket 411 of the shuttle 41 . In this embodiment, the lower end of the hand unit 423 is disposed at the upper end in the pocket 411, and the hand unit 423 is stopped. Thus, the pocket 411 is covered by the hand unit 423. This prevents the air G from leaking from the inside of the pocket 411 and prevents the IC device 9 from flying out of the pocket 411 in the air flow.

Next, as shown in Fig. 6, the IC device 9 is detached from the hand unit 423 and dropped. Accordingly, the IC device 9 is inserted into the pocket 411, and is disposed on the holding surface 47.

Next, the valves 171 and 172 are opened, and the pumps 181 and 182 are operated. As a result, the air G is jetted from the pump 182, and the air G flows in the tubular body 162 and is injected from the opening 1621 into the pocket 411 as shown in Fig. The pump 181 sucks the air G and the air G in the pocket 411 is sucked from the opening 1611 and flows through the tube 161 to be discharged to the outside. As a result, the air G flows in the direction in which the IC device 9 is directed toward the first corner portion 417 side. Then, the IC device 9 is pressed from the air flow (wind pressure) toward the first corner portion 417 side so that the corner portion 94 bumps against the first corner portion 417. Thus, the primary positioning is completed (see Figs. 4 and 7).

The first timing for releasing the IC device 9 from the hand unit 423 and the second timing for generating the airflow by the operation of the pumps 181 and 182 are not particularly limited, Or the second timing is the same as the first timing, or the first timing is before the second timing as described above.

If the first timing is later than the second timing, the time for exposing the IC device 9 to the air flow becomes longer, and the IC device 9 may be cooled by the air flow. However, If the timings are the same or the first timing is more than the second timing, it is possible to suppress the IC device 9 from being cooled by the air flow.

When the first timing is before the second timing, it is preferable to generate the air flow before the IC device 9 arrives at the holding surface 47. The air flow is prevented from flowing between the holding surface 47 and each terminal 92 of the IC device 9 and between the holding surface 47 and the terminal placing surface 93 of the IC device 9, And the IC device 9 can be easily raised by the air flow.

As described above, in the inspection apparatus 1, the IC device 9 can be moved by the air flow to be positioned in the shuttle 41. [ Further, since the IC device 9 is moved to the air flow, damage to the IC device 9 can be suppressed. Foreign matter in the vicinity of the terminal 92 of the IC device 9 can be removed by jetting or sucking the air G. [

8 to 13, the secondary positioning mechanism 102 includes a carry section positioning section 49 provided in the shuttle 41 and a grip section positioning section 49 provided in the inspection robot 43. [ (435), and a holding portion positioning portion (56) provided in the examination portion (5). The carry section positioning section 49 and the grip section positioning section 435 are engaged when the IC device 9 is exchanged between the shuttle 41 and the inspection robot 43 (see FIG. 10) . The grip portion positioning portion 435 and the holding portion positioning portion 56 are engaged when the IC device 9 is exchanged between the inspection robot 43 and the inspection portion 5 ).

The carry section position determining section 49 is composed of a first position determining section 491 and a second position determining section 492 (included).

The first positioning portion 491 and the second positioning portion 492 are guide pins which are press-fitted into the shuttle body 410 from above. In addition, a tapered portion 493 having an outer diameter decreasing upward, that is, a tapered shape is formed on the upper portion of the first positioning portion 491 and the second positioning portion 492. [ Accordingly, when the first positioning portion 491 is inserted into the third positioning portion 436 and the second positioning portion 492 is inserted into the fourth positioning portion 437 as described later, Each insertion is easily and smoothly performed.

4, the first positioning portion 491 and the second positioning portion 492 are arranged through the pockets 411. The first positioning portion 491 is provided with the pockets 411, And the second positioning portion 492 is located in the vicinity of the first wall surface 413 of the pocket 411 and the fourth wall surface 416 Is located in the vicinity of the corner portion constituted by the above-mentioned structure. And, the center of the first positioning portion (491) (O ₁₎ and a second position from a straight line (L) a first edge portion (417) passing through the center (O ₂₎ of the determination unit 492 (1 / It is preferable that the first positioning portion 491 and the second positioning portion 492 are disposed so as to pass the position of (1/2) x A and the position of (1/2) xB. As described above, "A" is the length along the X direction of the IC device 9, and "B" is the length along the Y direction of the IC device 9. Since the first positioning portion 491 and the second positioning portion 492 are disposed at such positions, when the IC device 9 is transported from the shuttle 41 to the inspection portion 5, The positioning of the shuttle 41 and the IC device 9 can be performed as accurately as possible.

The grip portion positioning portion 435 includes a third positioning portion 436 and a fourth positioning portion 437. [

The third positioning portion 436 and the fourth positioning portion 437 are ring-shaped (annular) members, and are press-fitted into the moving frame 432 from above. A flange portion 438 having an outer diameter enlarged is formed on the upper portion of the third positioning portion 436 and the fourth positioning portion 437. Accordingly, the press-fit limit of the third positioning portion 436 and the fourth positioning portion 437 is restricted, and the downward deviation of each positioning portion is prevented.

9 and 10, when the IC device 9 is exchanged between the shuttle 41 and the inspection robot 43, the third positioning portion 436 performs the first positioning And the fourth positioning portion 437 is disposed at a position where the second positioning portion 492 is inserted and fitted. The hand unit 433 of the inspecting robot 43 grasps the IC device 9 in such a fit state so that the primary positioning state of the IC device 9 in the pocket 411 of the shuttle 41 is set to , The hand unit 433 can be transferred to the hand unit 433 as secondary position determination.

The holding and supporting portion positioning portion 56 is composed of a fifth positioning portion 561 and a sixth positioning portion 562.

The fifth positioning portion 561 and the sixth positioning portion 562 are guide pins which are press-fitted into the substrate (inspection portion main body) 54 having the holding portion 51 from above. In addition, a tapered portion 563 having an outer diameter tapering upward, that is, a tapered shape is formed on the upper portions of the fifth positioning portion 561 and the sixth positioning portion 562. [ Thus, when the fifth positioning portion 561 is inserted into the third positioning portion 436 and the sixth positioning portion 562 is inserted into the fourth positioning portion 437 as described later, Each insertion is easily and smoothly performed.

The taper angles of the tapered portions 563 of the fifth positioning portion 561 and the sixth positioning portion 562 are the same as the taper angles of the first positioning portion 491 and the second positioning portion 492, The taper angle of each tapered portion 493 may be the same as or different from the taper angle of the tapered portion 493. [

The length (the length in the up-and-down direction) of the tapered portion 563 may be equal to or different from the length (the length in the up-down direction) of the tapered portion 493. When the length of the tapered portion 563 is different from the length of the tapered portion 493, the length of the tapered portion 563 is preferably longer than the length of the tapered portion 493 (see FIGS. 10 and 13).

13, when the IC device 9 is exchanged between the inspection robot 43 and the inspection section 5, the fifth positioning section 561 is inserted into the third positioning section 436 And the sixth positioning portion 562 is inserted into the fourth positioning portion 437 and disposed at the fitting position. By this fitting state, the IC device 9 is maintained in the secondary positioning state even in the holding portion 51 of the examination portion 5. [

Next, the control program until the IC device 9 in an untested state is returned to the shuttle 41 and the IC device 9 is returned to the shuttle 41 after the completion of the inspection, Based on a chart.

The supply robot 42 is operated to transport the IC device 9 gripped by each hand unit 423 of the supply robot 42 onto the shuttle 41 at the first position (step S101) The IC device 9 is released (step S102).

Next, the primary positioning mechanism 101 is activated to cause the corner portion 94 of the IC device 9 to strike against the first corner portion 417 of the pocket 411 as described above , See Fig. 8), and the primary position is determined (step S103).

After the execution of the step S103, the timer built in the control unit 8 is operated (step S104). When the timer is determined to be time-up (step S105), the suction unit connected to the suction port 453 of the pocket 411 is operated And the IC device 9 is fixed in the pocket 411 by vacuum suction (step S106). Further, it is possible to sufficiently secure the time until the primary positioning is performed by time-up in step S105, and therefore, it can be considered that the primary positioning is completed.

Next, the shuttle 41 is moved from the first position to the second position (step S107).

Next, the inspection robot 43 is operated to place each hand unit 433 of the inspection robot 43 on the shuttle 41 at the second position (see Fig. 9), and then the hand unit 433 To drop the IC device 9 by suction (see Fig. 10) (step S108). This lowering causes the first positioning portion 491 and the third positioning portion 436 to be fitted together and the second positioning portion 492 and the fourth positioning portion 437 to be fitted Fit. Thus, as described above, the primary positioning state of the IC device 9 is inherited as the secondary positioning.

After the execution of step S108, the operation of the suction unit connected to the suction port 453 of the pocket 411 is stopped, and the IC device 9 is released from the fixation (step S109).

11), the inspection unit 5 (see Fig. 12) is moved up to the upper side of the inspection unit 5 (see Fig. 12) The device 9 is returned (step S110).

When the IC device 9 comes on the inspection unit 5, each of the hand units 433 of the inspection robot 43 is lowered (see Fig. 13), and the IC device 9 is pushed into the inspection unit 5 S111). This lowering causes the third positioning portion 436 and the fifth positioning portion 561 to be fitted together and the fourth positioning portion 437 and the sixth positioning portion 562 to be fitted Fit. Thus, the secondary positioning state can be maintained as described above, and each terminal 92 of the IC device 9 and each probe pin are accurately electrically connected. As described above, the inspection apparatus 1 is capable of easily positioning the IC device 9 in the inspection unit 5.

Next, the inspection of the IC device 9 is started (step S112). When the inspection is completed (step S113), the inspection robot 43 is operated to return the IC device 9 to the shuttle 41 (Step S114).

After executing step S114, the shuttle 41 is moved from the second position to the third position. Thereafter, the recovery robot 44 is operated to distribute the IC device 9 on the shuttle 41 to the collection side array unit 6 every inspection result.

&Lt; Second Embodiment >

Fig. 15 is a flowchart showing a control program up to the time when an electronic component in a non-inspected state is transported and the electronic component is transported again after the inspection in the electronic component inspection apparatus (second embodiment) of the present invention is completed.

Hereinafter, a second embodiment of the electronic component transporting apparatus and the electronic component inspecting apparatus of the present invention will be described with reference to these drawings, but the differences from the above-described embodiments will be mainly described, do.

This embodiment is the same as the first embodiment except that the timing of the primary positioning is different.

The supply robot 42 is operated to transport the IC device 9 gripped by each hand unit 423 of the supply robot 42 onto the shuttle 41 at the first position (step S201) The IC device 9 is released (step S202).

Next, the shuttle 41 is moved from the first position to the second position (step S203).

Next, the primary positioning mechanism 101 is operated to cause the corner portion 94 of the IC device 9 to strike against the first corner portion 417 of the pocket 411 as described above, (Step S204).

After the execution of step S204, the timer built in the control unit 8 is operated (step S205). When it is determined that the time is up (step S206), the inspection robot 43 is operated, The hand unit 433 is placed on the shuttle 41 in the second position. Thereafter, the hand unit 433 is lowered to grip the IC device 9 by suction (step S207).

Next, each of the hand units 433 of the inspection robot 43 is raised, and the IC device 9 is carried to the inspection unit 5 (step S208). When the IC device 9 comes on the inspection unit 5, each of the hand units 433 of the inspection robot 43 is lowered and the IC device 9 is pushed into the inspection unit 5 (step S209). Accordingly, in this embodiment, like the first embodiment, each terminal 92 of the IC device 9 and each probe pin are accurately electrically connected. Therefore, the inspection apparatus 1 of the present embodiment is also capable of easily determining the position with respect to the IC device 9 in the inspection section 5.

Next, the inspection of the IC device 9 is started (step S210). When the inspection is completed (step S211), the inspection robot 43 is operated to return the IC device 9 to the shuttle 41 (Step S212).

After executing step S212, the shuttle 41 is moved from the second position to the third position. Thereafter, the recovery robot 44 is operated to distribute the IC device 9 on the shuttle 41 to the collection side array unit 6 every inspection result.

&Lt; Third Embodiment >

16 is a horizontal sectional view showing a carry section provided in the electronic component inspection apparatus (third embodiment) of the present invention. In Fig. 16, the first groove and the second groove are omitted.

Hereinafter, a third embodiment of the electronic component transporting apparatus and the electronic component inspecting apparatus of the present invention will be described with reference to these drawings, but the differences from the above embodiment will be mainly described, and the same description will be omitted do.

This embodiment is the same as the first embodiment except that the configuration of the primary positioning mechanism is different.

16, the primary positioning mechanism 101 includes four tubes 131, 132, 133 and 134 connected to the shuttle 41, four valves 141, 142 143, and 144, and four pumps 151, 152, 153, and 154, respectively. The lumens of the tubes 131 to 134 are flow paths through which the air G flows. The openings (openings) 1311, 1321, 1331 and 1341 at one end of the tubes 131 to 134 are opened to the inner surface of the wall portion 46. The first channel is formed by the portion (one end portion) inserted into the wall portion 46 of the tube body 131 and the first channel is formed by the portion (one end portion) inserted into the wall portion 46 of the tube body 132 One first flow path is constituted. The second channel is formed by the portion (one end) inserted into the wall portion 46 of the tube 133. The second channel is formed by the portion (one end) inserted into the wall portion 46 of the tube 134 One second flow path is constituted.

One end of each of the tubes 131 and 132 is disposed in the vicinity of the first corner portion 417 of the pocket 411 and one end of the tubes 133 and 134 is disposed in the vicinity of the second corner 417 of the pocket 411. In this embodiment, And is disposed in the vicinity of the corner portion 418. One end of the tubular body 131 is orthogonal to the first wall surface 413 constituting the inner surface of the pocket 411 and one end of the tubular body 132 is connected to the second wall surface 413 constituting the inner surface of the pocket 411. [ One end of the tubular body 133 is orthogonal to the third wall surface 415 constituting the inner surface of the pocket 411 and one end of the tubular body 134 is perpendicular to the inner surface of the pocket 411 And the fourth wall surface 416 constituting the fourth wall 416.

Accordingly, one end of the first vector (V ₁₎ showing the flow of the parts of the flowing medium, one portion flowing through the angle formed between the first vector (V ₁₎ showing the flow of the fluid in the tube 132 of the tube 131, 90 degrees. Accordingly, the vector obtained by adding the vectors of both sides is in the direction in which the IC device 9 is directed to the first corner portion 417. [ In addition, one end flowing a second angle formed between the vector (V ₂₎ one end showing the flow of the parts of the flowing medium of the second vector (V _2), and a tube body 134, showing the flow of the fluid in the tube 133, 90 . Accordingly, the vector obtained by adding both the vectors is also the direction in which the IC device 9 is directed toward the first corner portion 417. [

The primary positioning mechanism 101 for generating such a vector makes it possible to easily perform primary positioning with respect to the IC device 9.

In the primary positioning mechanism 101, the flow direction of the one end of the tubular body 131 and the flow direction of the one end of the tubular body 132 need only to intersect with each other, and the flow direction of the one end of the tubular body 133 The flow direction of one end of the tubular body 134 may be crossed. That is, one end of the first vector (V ₁₎ showing the flow of the parts of the flowing medium, one portion flowing through the angle formed between the first vector (V ₁₎ showing the flow of the fluid in the tube 132 of the tube 131, 0 may or degrees and 180 degrees, with the second vector (V ₂₎ representing a second vector (V ₂₎ and, once the flow of parts of the flowing medium in the tube (134) indicating the end flow of the parts of the flowing medium in the tube 133 The angle formed is not necessarily 0 degrees and 180 degrees.

Although the embodiments of the present invention have been described above with reference to the embodiments of the present invention, the present invention is not limited thereto, and each of the components constituting the electronic component transporting apparatus and the electronic component inspecting apparatus, It can be replaced with any structure capable of exhibiting the same function. In addition, an optional component may be added.

The electronic component transporting apparatus and the electronic component inspecting apparatus of the present invention may be any combination of any two or more of the above-described embodiments (features).

Further, the number and arrangement of the pockets of the shuttle, the number and arrangement of the hand units of the supply robot, the number and arrangement of the hand units of the inspection robot, and the arrangement numbers of the hand units of the recovery robot And the arrangement mode of the holding portion of the inspection portion and the arrangement mode of the holding portion of the inspection portion are not limited to the configuration shown in Fig.

In the above embodiments, the carry section positioning section and the holding section positioning section are the guide pins (convex sections), and the holding section positioning section is the guide section positioning section, the grip section positioning section and the holding section positioning section, But the present invention is not limited to this, and the carry section positioning portion and the holding portion positioning portion may be a guide hole (concave portion), and the holding portion positioning portion may be a guide pin (convex portion).

In the above-described embodiments, the electronic component carrying section has both the first flow path and the second flow path, but the present invention is not limited to this, and the second flow path may be omitted.

In the present invention, air is used as the fluid in each of the above embodiments. However, the present invention is not limited thereto. For example, various insulating properties such as nitrogen, argon, carbon dioxide, fluorine- Gas or the like is applicable.

1: Inspection device
2:
3: Supply side arrangement part
341: witty stage
4:
41: Shuttle
410: Shuttle body
411: Pocket
413: first wall surface
414: second wall surface
415: third wall surface
416: fourth wall surface
417: first corner portion
418: second corner portion
42: Supply robot
421: Support frame
422: Moving frame
423: Hand unit
424: Adsorption nozzle
43: Inspection Robot
431: Support frame
432: Moving frame
433: Hand unit
435: gripper positioning unit
436: third positioning portion
437: fourth positioning portion
438: flange portion
44: Recovery robot
441: Support frame
442: Moving frame
443: Hand unit
451: First Home
452: Second home
453:
46: wall portion
461:
47: Holding face
48: substrate
49: Carrier section positioning section
491: first positioning portion
492: second positioning portion
493:
5:
51:
511: probe pin
54: substrate
56: Holding portion Positioning portion
561: fifth positioning portion
562: sixth positioning portion
563:
6:
7:
8:
9: IC device
91:
92: terminal
93: terminal arrangement surface
94:
10:
100: Positioning mechanism
101: primary positioning mechanism
102: Secondary positioning mechanism
11: Base
111: Base surface
12: cover
131, 132, 133, 134:
1311, 1321, 1331, 1341: opening
141, 142, 143, 144: valves
151, 152, 153, 154: pumps
161, 162:
1611, 1621: opening
171, 172: valve
181, 182: pump
A, B: Length
G: Air
L: straight line
O ₁ , O ₂ : center
S101 to S114, S201 to S212:
V ₁ : first vector
V ₂ : second vector

Claims

An electronic component carrying section for carrying the electronic component,
An electronic component gripping portion for gripping the electronic component;
And an electronic component holding portion for holding the electronic component,
The electronic part conveying section is provided with a conveying section positioning section,
Wherein the electronic part gripping part is provided with a grip part positioning part to be fitted to the carry part positioning part,
Wherein the electronic component holding portion is provided with a holding portion positioning portion for fitting with the grip portion positioning portion,
Wherein the electronic component carrying section is provided with a flow passage to which a fluid spraying section or a fluid suction section is connected.

The method according to claim 1,
Wherein the carry section position determining section includes a first position determining section and a second position determining section,
In the case of carrying the rectangular electronic component having sides of length A and sides of length B,
Wherein a straight line passing through the center of the first positioning portion and the center of the second positioning portion passes through a position of (1/2) x A and a position of (1/2) x B from the edge portion of the electronic component carrying portion The electronic component carrying device.

3. The method according to claim 1 or 2,
Wherein the electronic component transfer section has a first wall surface and a second wall surface constituting the first corner portion,
Wherein the first wall surface and the second wall surface are orthogonal to each other,
Wherein the flow path includes a first flow path disposed in the first corner and through which the fluid flows,
Wherein the first vector indicating the flow of the fluid flowing through the first flow path is not orthogonal to the first wall surface and the second wall surface, respectively.

The method of claim 3,
Wherein the electronic component carrying section has a third wall surface and a fourth wall surface constituting a second corner portion arranged at a diagonal position from the first corner portion,
Wherein the flow path includes a second flow path disposed in the second corner and through which the fluid flows,
And the second vector indicating the flow of the fluid flowing through the second flow path is not orthogonal to the first wall surface and the second wall surface, respectively.

The method according to claim 3 or 4,
A suction unit for sucking the fluid is connected to the first flow path,
And a jetting section for jetting the fluid is connected to the second flow path.

6. The method according to any one of claims 1 to 5,
And the electronic component holding portion holds and retains the electronic component when the electronic component is inspected.

7. The method according to any one of claims 1 to 6,
Wherein the electronic component carrying section holds the electronic component and moves to a predetermined place.

An electronic component carrying section for carrying the electronic component,
An electronic component gripping portion for gripping the electronic component;
And an electronic component holding portion for holding the electronic component,
The electronic component holding portion has a function as an inspection portion for inspecting the electronic component,
The electronic part conveying section is provided with a conveying section positioning section,
Wherein the electronic part gripping part is provided with a grip part positioning part to be fitted to the carry part positioning part,
Wherein the electronic component holding portion is provided with a holding portion positioning portion for fitting with the grip portion positioning portion,
Wherein an electronic component conveying section is provided with a flow passage to which a fluid ejecting section or a fluid suction section is connected.