TW201612536A - Electronic component conveying device and electronic component testing device - Google Patents
Electronic component conveying device and electronic component testing deviceInfo
- Publication number
- TW201612536A TW201612536A TW104131908A TW104131908A TW201612536A TW 201612536 A TW201612536 A TW 201612536A TW 104131908 A TW104131908 A TW 104131908A TW 104131908 A TW104131908 A TW 104131908A TW 201612536 A TW201612536 A TW 201612536A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- conveying
- positioning unit
- gripping
- holding
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Specific Conveyance Elements (AREA)
Abstract
An electronic component conveying device of this invention includes a conveying shuttle used as a conveying part for conveying IC components, a testing robotic arm used as a gripping part for gripping IC components, and a holding part for holding IC components. In the conveying shuttle, a conveying part positioning unit is provided. In the testing robotic arm, a gripping part positioning unit engaged with the conveying part positioning unit is provided. In the holding part, a holding part positioning unit engaged with the gripping part positioning unit is provided. Further, a channel is formed on the conveying shuttle for connecting a fluid ejection part or a fluid suction part.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014200024A JP2016070778A (en) | 2014-09-30 | 2014-09-30 | Electronic component conveyance device and electronic component inspection device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201612536A true TW201612536A (en) | 2016-04-01 |
TWI582442B TWI582442B (en) | 2017-05-11 |
Family
ID=55789820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104131908A TWI582442B (en) | 2014-09-30 | 2015-09-25 | Electronic parts conveyor and electronic parts inspection device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2016070778A (en) |
KR (1) | KR101668723B1 (en) |
CN (1) | CN106185259B (en) |
TW (1) | TWI582442B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI674230B (en) * | 2016-06-01 | 2019-10-11 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108414850A (en) * | 2017-01-30 | 2018-08-17 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
JP2019045231A (en) * | 2017-08-31 | 2019-03-22 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
JP2019066221A (en) * | 2017-09-29 | 2019-04-25 | セイコーエプソン株式会社 | Electronic component conveying device and electronic component inspection device |
EP3527994A1 (en) * | 2018-02-20 | 2019-08-21 | Rasco GmbH | Contactor socket and ic test apparatus |
JP2020034368A (en) * | 2018-08-29 | 2020-03-05 | セイコーエプソン株式会社 | Electronic component conveyance device, unit for electronic component conveyance, and electronic component inspection device |
JP7143246B2 (en) * | 2019-05-23 | 2022-09-28 | 株式会社アドバンテスト | Electronic component handling equipment and electronic component testing equipment |
CN117054862B (en) * | 2023-10-13 | 2023-12-15 | 深圳市微特精密科技股份有限公司 | Precise detection equipment and detection process for PCB main board |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3494828B2 (en) * | 1996-11-18 | 2004-02-09 | 株式会社アドバンテスト | Horizontal transport test handler |
JPH10160797A (en) | 1996-12-03 | 1998-06-19 | M C Electron Kk | Positioning insertion device of ic to be tested into socket of ic handler |
JPH10300815A (en) * | 1997-04-25 | 1998-11-13 | Nec Kansai Ltd | Inspection device of electronic parts |
JP4090117B2 (en) * | 1998-06-15 | 2008-05-28 | 株式会社アドバンテスト | IC adsorption device, IC conveyance device using the same, and IC test device |
US6472891B1 (en) | 2000-08-10 | 2002-10-29 | Advanced Micro Devices, Inc. | Method and apparatus for testing semiconductor packages without damage |
JP2002181887A (en) * | 2000-12-12 | 2002-06-26 | Advantest Corp | Testing device for electronic component |
JP2006017738A (en) * | 2005-07-28 | 2006-01-19 | Seiko Epson Corp | Socket for semiconductor device inspection apparatus |
WO2009118855A1 (en) * | 2008-03-27 | 2009-10-01 | 株式会社アドバンテスト | Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature |
JP2009288086A (en) * | 2008-05-29 | 2009-12-10 | Yokogawa Electric Corp | Semiconductor tester |
JP2012122774A (en) * | 2010-12-06 | 2012-06-28 | Sharp Corp | Test socket |
JP2013024829A (en) * | 2011-07-26 | 2013-02-04 | Seiko Epson Corp | Electronic component carrying device and electronic component carrying method |
JP2013234912A (en) * | 2012-05-09 | 2013-11-21 | Seiko Epson Corp | Socket guide, handler, and component inspection device |
CN203545064U (en) * | 2013-09-05 | 2014-04-16 | 产台股份有限公司 | Blowback separation device for materials |
-
2014
- 2014-09-30 JP JP2014200024A patent/JP2016070778A/en active Pending
-
2015
- 2015-04-03 KR KR1020150047201A patent/KR101668723B1/en active IP Right Grant
- 2015-05-13 CN CN201510243787.9A patent/CN106185259B/en not_active Expired - Fee Related
- 2015-09-25 TW TW104131908A patent/TWI582442B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI674230B (en) * | 2016-06-01 | 2019-10-11 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device |
Also Published As
Publication number | Publication date |
---|---|
CN106185259B (en) | 2018-11-27 |
KR20160038691A (en) | 2016-04-07 |
JP2016070778A (en) | 2016-05-09 |
CN106185259A (en) | 2016-12-07 |
TWI582442B (en) | 2017-05-11 |
KR101668723B1 (en) | 2016-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |