TW201612536A - Electronic component conveying device and electronic component testing device - Google Patents

Electronic component conveying device and electronic component testing device

Info

Publication number
TW201612536A
TW201612536A TW104131908A TW104131908A TW201612536A TW 201612536 A TW201612536 A TW 201612536A TW 104131908 A TW104131908 A TW 104131908A TW 104131908 A TW104131908 A TW 104131908A TW 201612536 A TW201612536 A TW 201612536A
Authority
TW
Taiwan
Prior art keywords
electronic component
conveying
positioning unit
gripping
holding
Prior art date
Application number
TW104131908A
Other languages
Chinese (zh)
Other versions
TWI582442B (en
Inventor
Satoshi Nakamura
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201612536A publication Critical patent/TW201612536A/en
Application granted granted Critical
Publication of TWI582442B publication Critical patent/TWI582442B/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

An electronic component conveying device of this invention includes a conveying shuttle used as a conveying part for conveying IC components, a testing robotic arm used as a gripping part for gripping IC components, and a holding part for holding IC components. In the conveying shuttle, a conveying part positioning unit is provided. In the testing robotic arm, a gripping part positioning unit engaged with the conveying part positioning unit is provided. In the holding part, a holding part positioning unit engaged with the gripping part positioning unit is provided. Further, a channel is formed on the conveying shuttle for connecting a fluid ejection part or a fluid suction part.
TW104131908A 2014-09-30 2015-09-25 Electronic parts conveyor and electronic parts inspection device TWI582442B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014200024A JP2016070778A (en) 2014-09-30 2014-09-30 Electronic component conveyance device and electronic component inspection device

Publications (2)

Publication Number Publication Date
TW201612536A true TW201612536A (en) 2016-04-01
TWI582442B TWI582442B (en) 2017-05-11

Family

ID=55789820

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131908A TWI582442B (en) 2014-09-30 2015-09-25 Electronic parts conveyor and electronic parts inspection device

Country Status (4)

Country Link
JP (1) JP2016070778A (en)
KR (1) KR101668723B1 (en)
CN (1) CN106185259B (en)
TW (1) TWI582442B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI674230B (en) * 2016-06-01 2019-10-11 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108414850A (en) * 2017-01-30 2018-08-17 精工爱普生株式会社 Electronic component handling apparatus and electronic component inspection device
JP2019045231A (en) * 2017-08-31 2019-03-22 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
JP2019066221A (en) * 2017-09-29 2019-04-25 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
EP3527994A1 (en) * 2018-02-20 2019-08-21 Rasco GmbH Contactor socket and ic test apparatus
JP2020034368A (en) * 2018-08-29 2020-03-05 セイコーエプソン株式会社 Electronic component conveyance device, unit for electronic component conveyance, and electronic component inspection device
JP7143246B2 (en) * 2019-05-23 2022-09-28 株式会社アドバンテスト Electronic component handling equipment and electronic component testing equipment
CN117054862B (en) * 2023-10-13 2023-12-15 深圳市微特精密科技股份有限公司 Precise detection equipment and detection process for PCB main board

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3494828B2 (en) * 1996-11-18 2004-02-09 株式会社アドバンテスト Horizontal transport test handler
JPH10160797A (en) 1996-12-03 1998-06-19 M C Electron Kk Positioning insertion device of ic to be tested into socket of ic handler
JPH10300815A (en) * 1997-04-25 1998-11-13 Nec Kansai Ltd Inspection device of electronic parts
JP4090117B2 (en) * 1998-06-15 2008-05-28 株式会社アドバンテスト IC adsorption device, IC conveyance device using the same, and IC test device
US6472891B1 (en) 2000-08-10 2002-10-29 Advanced Micro Devices, Inc. Method and apparatus for testing semiconductor packages without damage
JP2002181887A (en) * 2000-12-12 2002-06-26 Advantest Corp Testing device for electronic component
JP2006017738A (en) * 2005-07-28 2006-01-19 Seiko Epson Corp Socket for semiconductor device inspection apparatus
WO2009118855A1 (en) * 2008-03-27 2009-10-01 株式会社アドバンテスト Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature
JP2009288086A (en) * 2008-05-29 2009-12-10 Yokogawa Electric Corp Semiconductor tester
JP2012122774A (en) * 2010-12-06 2012-06-28 Sharp Corp Test socket
JP2013024829A (en) * 2011-07-26 2013-02-04 Seiko Epson Corp Electronic component carrying device and electronic component carrying method
JP2013234912A (en) * 2012-05-09 2013-11-21 Seiko Epson Corp Socket guide, handler, and component inspection device
CN203545064U (en) * 2013-09-05 2014-04-16 产台股份有限公司 Blowback separation device for materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI674230B (en) * 2016-06-01 2019-10-11 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device

Also Published As

Publication number Publication date
CN106185259B (en) 2018-11-27
KR20160038691A (en) 2016-04-07
JP2016070778A (en) 2016-05-09
CN106185259A (en) 2016-12-07
TWI582442B (en) 2017-05-11
KR101668723B1 (en) 2016-10-24

Similar Documents

Publication Publication Date Title
TW201612536A (en) Electronic component conveying device and electronic component testing device
HK1252206A1 (en) An aerosol delivery device with an application specific integrated circuit (asic)
PL3487282T3 (en) Device for picking fruit having an improved robot arm
GB2544671A (en) Band with RFID chip holder and identifying component
MY182356A (en) Pod assembly, dispensing body, and e-vapor apparatus including the same
WO2015184045A3 (en) Device with flexible electronic components on multiple surfaces
EP3492441A4 (en) Bonding body, circuit board and semiconductor device
EP3528861A4 (en) Electronic vacuum regulator device
KR102478638B9 (en) Method for diagnosis and device perfoming the same
TW201611969A (en) Robot
SG11201805655VA (en) Method and device for bonding substrates
MY168456A (en) Method for aligning electronic components
EP3391175A4 (en) Electronic device with cradling function
TW201612090A (en) Electronic parts conveying device and electronic parts checking device
MY172198A (en) A test handler that picks up electronic devices for testing and an orientation-changing apparatus for use in a test handler
MX2016010156A (en) Integrated circuit, driving circuit for motor, motor assembly and application equipment therefor.
SG11201808444VA (en) Method and device for bonding two substrates
EP3336024A4 (en) Electronic component moving device and electronic component conveying device
ZA201905058B (en) Suction pump, negative-pressure retaining device having a suction pump, and method for attaching a negative-pressure retaining device
EP3472749A4 (en) A primary device, an accessory device, and methods for processing operations on the primary device and the accessory device
EP3222692A4 (en) Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic part
EP2911031A3 (en) Electronic device and electronic device included in a cover
HK1222226A1 (en) Electronic component transporting device
MX2016012067A (en) Apparatus for holding an electronic device having a mechanical self-adjusting retention element.
EP3396391A4 (en) Reliability test fixture for flexible display component and online reliability test device for flexible display component

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees