JP2009288086A - Semiconductor tester - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor tester for supplying the stable quantity of dry air to a backside of a DUT board regardless of a position of the DUT board. <P>SOLUTION: The semiconductor tester is mounted on a test board 2, causes the dry air to pass through an interior of a fixing plate 3 for fixing a plurality of the DUT boards 4 so as to prevent the backside of the DUT board 4 from forming a dew condensation, and includes a pipe 7 disposed within the fixing plate 3, sucking the dry air 6 at one end, and blowing the dry air from a blowing hole 71 provided in each DUT board 4 to the backside of the DUT board 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a dry air supply structure for preventing condensation that is mounted on a test board of a memory tester post-processing system.

In general, a semiconductor test apparatus gives a test signal to an IC, LSI, or the like, which is an object to be tested (hereinafter “DUT”), measures the output of the DUT, and determines the quality of the DUT.

FIG. 2 is a schematic configuration diagram showing an example of a memory tester post-process system in a conventional semiconductor test apparatus. Here, the memory tester post-process system refers to a system that tests a DUT composed of a packaged memory with a semiconductor test apparatus. In a semiconductor test apparatus, generally, a DUT and a semiconductor test apparatus main body (not shown) are electrically connected via a test head 1 and a test board 2. When testing a packaged DUT, a plurality of DUT boards 4 are fixed on the test board 2 via a DUT board fixing plate (hereinafter referred to as a fixing plate) 3, and the IC socket on the DUT board 4 is connected to the IC socket. By mounting the DUT, the DUT is connected to the semiconductor test apparatus, and a test is performed.

Here, if dew condensation occurs on the DUT board 4, a leak failure of the device is caused and a large tester down time is generated. This is considered to become a larger problem as the number of devices and density increase in the future.

FIG. 3 is an expanded configuration diagram of the main part in which the portion of the frame A in FIG. 2 is expanded. In order to cope with the above problem, drying for dew condensation countermeasures formed in the fixed plate 3 mounted on the test board 2 is shown. The air supply structure is shown. The fixed plate 3 mounted on the test board 2 is provided with a recess 33, and the recess 33 is divided into a plurality of rooms corresponding to the number of DUT boards 4 by a plurality of partition plates 34. Each partition plate 34 is provided with a passage hole 35 for allowing the dry air 6 to pass therethrough. The DUT board 4 is fixed to the fixing plate 3 by screws or the like through the plurality of mounting holes 41 and 42 and the plurality of mounting holes 31 and 32 provided in the fixing plate 3. The air hose 5 is for supplying the dry air 6 into the fixed plate 3, and guides the dry air from the air hose end 51 to the inside of the recess 33 on the back surface of the DUT board 4. A blowing hole 36 for blowing dry air from the fixed plate 3 to the outside is provided on the side of the recess 33 facing the air hose end 51.

Next, the operation of the semiconductor test apparatus of FIGS. 2 and 3 will be described. The dry air 6 guided from the dry air source (not shown) by the air hose 5 and blown out from the air hose end 51 to the recess 33 space on the back surface of the DUT board 4 passes through the passage holes 35 in the fixed plate 3. And discharged from the blowout hole 36 to the outside of the fixed plate 3. Since the dry air 6 is blown to the back surface of the DUT board 4 in the process in which the dry air 6 flows from the air hose end 51 toward the blowout hole 36, the occurrence of condensation is prevented.

  Prior art documents related to semiconductor test equipment include the following.

JP 2004-347329 A

However, in the above prior art, the partition provided for each DUT board 4 in the fixed plate 3 until the dry air blown out from the air hose end 51 flows to the blowout hole 36 provided on the opposite side. The plate 34 hinders the passage of dry air and reduces the flow rate of dry air. For this reason, since the flow rate of the dry air 6 is different from the vicinity of the air hose end 51 from which the dry air 6 blows out to the vicinity of the blowout hole 36 on the back surface of the DUT board 4, a stable amount of dry air is supplied to each DUT board 4. Difficult to do.

  An object of the present invention is to provide a semiconductor test apparatus capable of supplying a stable amount of dry air to the back surface of each DUT board regardless of the position of the DUT board. And

In order to achieve such a problem, a semiconductor test apparatus according to the invention described in claim 1 is provided.
In a semiconductor test apparatus in which dry air is passed to prevent condensation on the back side of the DUT board in a fixed plate mounted on the test board and to which a plurality of DUT boards are fixed.
It is provided with a tube which is disposed in the fixed plate and blows out dry air blown from one end from a blowing hole provided for each DUT board toward the back surface of the DUT board.

The invention according to claim 2
The semiconductor test apparatus according to claim 1,
The tube is provided with a plurality of holes for each of the DUT boards.

The invention described in claim 3
The semiconductor test apparatus according to claim 1 or 2,
A plurality of the tubes are disposed in the fixed plate.

  As is apparent from the above description, according to the present invention, a semiconductor that allows dry air to pass through a fixed plate mounted on a test board and to which a plurality of DUT boards are fixed to prevent condensation on the back side of the DUT board. In the test apparatus, each DUT is provided with a pipe that is disposed in the fixed plate and blows out the dry air blown from one end from the blowing hole provided for each DUT board toward the back surface of the DUT board. A semiconductor test apparatus capable of supplying a stable amount of dry air to the back surface of the board can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a main part development block diagram showing an example of a semiconductor test apparatus according to an embodiment of the present invention. The same parts as those in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted. The end 51 of the air hose 5 is inserted into one end of the tube 7, and the tube 7 is disposed in the recess 33 through each partition plate 34 a corresponding to each DUT board 4. A spray hole 71 for spraying dry air 6 is provided for each DUT board 4 in a portion of the tube 7 facing the DUT board 4. The other end of the tube 7 is opened to the outside from the fixed plate 3 (not shown).

  1 will now be described. The dry air 6 led from the dry air source by the air hose 5 and blown out from the air hose end 51 into the pipe 7 on the back surface of the DUT board 4 is dried air from each spray hole 71 of the pipe 7 to the back surface of each DUT board 4. 6 is sprayed and discharged from the opening at the other end of the tube 7 to the outside of the fixed plate 3.

According to the semiconductor testing apparatus having the above-described configuration, the back surface of each DUT board 4 is provided by providing one tube 7 having a blowing hole 71 for supplying dry air in the fixed plate 3 for each DUT board 4. Can always be supplied with a stable flow rate of dry air with no variation, thereby preventing condensation. Therefore, no large tester downtime occurs.

In addition, it is possible to stably supply dry air regardless of the increase or decrease in the number of DUT boards.

A plurality of spray holes may be provided in the tube 7 for each DUT board. By appropriately adjusting the positions and diameters of the plurality of spray holes, it is possible to apply dry air to the back surface of the DUT board 4 more evenly.

Further, by providing a plurality of tubes 7 in the fixed plate 3, stable supply of dry air is possible even if the number of DUT boards 4 is greatly increased.

  The DUT is not limited to a semiconductor memory, and can be applied to any packaged IC, LSI or the like in which dew condensation is a problem.

It is a principal part expanded block diagram which shows one Example of the semiconductor test apparatus which concerns on embodiment of this invention. It is a schematic block diagram which shows an example of the memory tester post-process system in the conventional semiconductor test apparatus. It is a principal part expanded block diagram of FIG.

Explanation of symbols

2 Test board 3 Fixing plate 4 DUT board 6 Dry air 7 Pipe 71 Spray hole

Claims (3)

In a semiconductor test apparatus in which dry air is passed to prevent condensation on the back side of the DUT board in a fixed plate mounted on the test board and to which a plurality of DUT boards are fixed.
A semiconductor test apparatus, comprising: a pipe disposed in the fixed plate and for blowing dry air blown from one end toward a back surface of the DUT board from a blowing hole provided for each DUT board.   The semiconductor test apparatus according to claim 1, wherein the tube is provided with a plurality of holes for each of the DUT boards.   The semiconductor test apparatus according to claim 1, wherein a plurality of the tubes are disposed in the fixed plate.

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