US6750668B1 - Vortex unit for providing a desired environment for a semiconductor process - Google Patents
Vortex unit for providing a desired environment for a semiconductor process Download PDFInfo
- Publication number
- US6750668B1 US6750668B1 US09/981,200 US98120001A US6750668B1 US 6750668 B1 US6750668 B1 US 6750668B1 US 98120001 A US98120001 A US 98120001A US 6750668 B1 US6750668 B1 US 6750668B1
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- US
- United States
- Prior art keywords
- semiconductor
- air
- vortex
- testing
- air stream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime, expires
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 40
- 238000012360 testing method Methods 0.000 claims description 71
- 238000001816 cooling Methods 0.000 claims description 11
- 238000010410 dusting Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 13
- 230000007613 environmental effect Effects 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 8
- 239000007788 liquid Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
- F15D1/00—Influencing flow of fluids
- F15D1/0015—Whirl chambers, e.g. vortex valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
- F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Definitions
- the present invention generally relates to the field of semiconductor manufacture and testing, and particularly to a vortex unit for providing desired environmental conditions in manufacture and/or testing of semiconductor devices.
- testing of semiconductor devices is a laborious process. Because of the complexity of the process, a high failure rate may be encountered during the manufacture of the devices. Thus, the devices must be tested extensively to ensure operation within desired parameters. Additionally, testing of the semiconductor device may require not only the testing of the ability of the semiconductor to perform desired operations, but also the ability of the semiconductor to perform the operations in contemplated environmental conditions.
- Semiconductor devices may encounter a wide range of environmental conditions. From extreme heat to cold, and every temperature in between, users desire the operation of the semiconductor within desired parameters for the contemplated environmental conditions. Therefore, it may also be desirable to test the semiconductor devices within the contemplated operational temperature range to ensure the robustness of the device.
- liquid cooled units are expensive, units may cost several tens of thousands of dollars each, may utilize environmentally undesirable CFC, and are large in size. Thus, the unit may require a large space in a manufacturing facility and may be expensive to maintain, due to a large quantity of complex parts. Further, the units may generate electromagnetic interference with the testing equipment, thereby requiring extensive shielding to ensure accurate test results.
- the present invention is directed to a vortex unit for providing a desired environment in a semiconductor manufacturing and/or testing process.
- a desired environment for the testing and/or manufacture of a semiconductor device may be provided in an efficient and cost-effective manner without encountering electromagnetic interference that limited the implementation of previous environmental systems.
- a vortex unit suitable for providing a desired environmental condition for a semiconductor process includes a vortex tube and a semiconductor processing device suitable for performing a semiconductor processing function.
- the vortex tube includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air.
- the semiconductor processing device is connected to the second air exhaust of the vortex tube so that the semiconductor processing device receives a cooled air stream from the vortex tube, the cooled air stream providing an environment suitable for enabling the semiconductor processing device to perform the semiconductor processing function.
- a vortex unit suitable for providing a desired environmental condition for a testing a semiconductor device includes a vortex tube and a semiconductor testing device suitable for testing at least one function of a semiconductor.
- the vortex tube includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air.
- the semiconductor testing device is connected to the second air exhaust of the vortex tube so that the semiconductor testing device receives a cooled air stream from the vortex tube, the cooled air stream cooling a semiconductor device to a desired testing temperature enabling the semiconductor testing device to perform the test of the at least function of the semiconductor device at the desired temperature.
- a vortex unit suitable for providing a desired environmental condition for testing a semiconductor includes a means for providing a vortex and a means for testing a semiconductor device.
- the vortex means includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air.
- the semiconductor testing means is connected to the second air exhaust of the vortex means so that the semiconductor testing means receives a cooled air stream from the vortex means, the cooled air stream providing an environment suitable for enabling the semiconductor testing means to perform a semiconductor testing function.
- FIG. 1 is an illustration of an embodiment of the present invention in which function of a vortex tube suitable for being employed by the present invention is shown;
- FIG. 2 is an illustration of an embodiment of the present invention in which an exemplary vortex unit utilized in conjunction with a semiconductor processing device is shown.
- FIGS. 1 through 2 exemplary embodiments of the present invention are shown.
- Generation of electromagnetic interference, system cost and size of the units were problems typically encountered through the use of previous environmental systems in semiconductor processes. For instance, liquid cooled environmental units are expensive, may cost several tens of thousands of dollars each, may utilize environmentally undesirable CFCs, and are large in size. Thus, the unit may require a large space in a manufacturing facility and may be expensive to maintain, due to a large quantity of complex parts. Further, the units may generate electromagnetic interference that may hamper operation of testing equipment, thereby requiring extensive shielding to ensure accurate test results.
- the present invention provides a desired environment for the testing and/or manufacture of semiconductor devices in an efficient and cost-effective manner without encountering electromagnetic interference that limited the implementation of previous environmental systems.
- a vortex tube 102 receives a stream of compressed air 104 and separates the stream into two air streams 106 & 108 , a hot air stream and a cool air stream.
- the compressed air 104 enters a cylindrical generator 110 that is proportionally larger than a connected long tube 112 .
- the cylindrical generator 110 causes the air to rotate as a first air stream 106 .
- the rotating air 106 is forced down the end of the tube 112 against the inner walls of the tube 112 .
- a portion of the first air stream 106 exits the tube 112 , preferably through a valve 114 , and is exhausted as hot air.
- the remaining air returns through the center of the first air stream 106 as a second air stream 108 , the second air stream 108 moving in the opposite direction slower that the first air stream 106 .
- Heat in the second air stream 108 is transferred to the faster moving first air stream 106 , which cools the second air stream 108 .
- the second cooled air stream 108 after passing through the center of the cylindrical generator 110 , exits through an exhaust port 116 as cooled air.
- the vortex tube 102 creates two types of vortices, a free vortex, wherein the angular velocity of a fluid particle increases when moved toward the center of the vortex, and a forced vortex, wherein the velocity is directly proportion to the radius of the vortex, wherein the center of the vortex of the forced vortex has a slower velocity.
- the first air stream 106 , or hot outer air stream is a free vortex and the second sir stream 108 , or cold air stream is a forced vortex.
- the second air stream 108 flows inside the first air stream 110 at a velocity that is lower that the first air stream 110 .
- the second air stream loses resultant energy by heat transfer to the first air stream 106 .
- the energy from the second air stream 108 is transferred to the first air stream 106 as heat, thereby cooling the second air stream 108 .
- a cooling apparatus may be provided that does not use refrigerants, does not require moving parts, thereby improving reliability, and does not require electricity, thereby limiting radio frequency interference in the manufacturing and testing process.
- a vortex tube 202 may be connected to a semiconductor-processing machine, such as a tester, assembler, and the like to provide a desired environment.
- the vortex tube 202 is connected to a wafer sort and testing machine 204 to provide a desired environment for testing wafers.
- House compressed air 206 such as that supplied in a manufacturing facility for powering tools and the like, is connected to an “in” port 208 of the vortex tube 202 .
- the vortex tube 202 has three orifices, compressed air in 208 , cooled air exhaust 210 and hot air exhaust 212 .
- An exhaust tube such as a high temperature Teflon tube, may be connected to the hot air exhaust 212 and run to a lower compartment of a machine cabinet, such as a wafer sort machine 204 , to direct hot air away from the desired area, such as a platen area of the machine.
- the percentage of total input air volume 206 released through the cooled air exhaust 210 of the vortex tube 202 is called the Cold Fraction.
- the cold fraction may be a function of how the vortex generator is configured, such as by utilizing a “high cold fraction” or “low cold fraction” generator, as described in FIG. 1 .
- the vortex generator may be configured as desired to alter airflow and temperature ranges produced by the vortex tube 202 as contemplated by a person of ordinary skill in the art.
- a valve 216 located in the hot air exhaust of the vortex tube may be used to control the cold fraction. For example, as previously stated, the lower the amount of released air 214 , the cooler the air.
- the vortex tube 202 may supply a variety of atmospheres as desired by a user.
- a cooled air stream 214 from the vortex tube 202 is directed through a manifold 222 .
- the manifold 222 is connected to a plurality of tubes 224 , 226 & 228 , in this instance three poly tubes having 1 ⁇ 4” inside diameter, 3 ⁇ 8” outside diameter.
- the tubes 224 , 226 & 228 preferable duct the cooled air through three equal size holes in a side panel of a cabinet of the semiconductor-processing machine.
- the size of the ducts, configuration of the manifold, size of the entry holes, position of the entry holes on the device, and the like are configured to provide a desired environmental result as contemplated by a person of ordinary skill in the art.
- cooled air may be directed to the platen area of a prober in order to effectively cool a wafer for testing.
- a wafer may be tested at a desired temperature range, such as at approximately 25 degrees Celsius, 20 to 30 degrees Celsius, below 30 degrees Celsius, and like temperature ranges without departing from the spirit and scope of the present invention.
- the noise table may be lowered, thereby enabling more precise measurements.
- an additional manifold may be provided linking the cold air exhaust 210 and the host air exhaust 212 ports to provide a range of hot and cold temperature in a device, such as a testing device without departing from the spirit and scope of the present invention.
- the vortex tube 202 may be mounted in an enclosure and encapsulated in insulating material, such as expanding insulating foam, to eliminate freezing condensation on the cooled end 210 of the vortex tube 202 .
- insulating material such as expanding insulating foam
- a unit may be produced for approximately $350, versus previous liquid cooled temperature controlled units that cost in the range of $24,000 to $38,000.
- a vortex unit of the present invention may fulfill a long-felt need in the semiconductor industry to provide an inexpensive cooling unit, which does not cause electromagnetic interference, is reliable because it does not require moving parts, and is capable of being utilized in a small space, thereby decreasing the space needed in a manufacturing facility.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (22)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/981,200 US6750668B1 (en) | 2001-10-17 | 2001-10-17 | Vortex unit for providing a desired environment for a semiconductor process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/981,200 US6750668B1 (en) | 2001-10-17 | 2001-10-17 | Vortex unit for providing a desired environment for a semiconductor process |
Publications (1)
Publication Number | Publication Date |
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US6750668B1 true US6750668B1 (en) | 2004-06-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/981,200 Expired - Lifetime US6750668B1 (en) | 2001-10-17 | 2001-10-17 | Vortex unit for providing a desired environment for a semiconductor process |
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US (1) | US6750668B1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7036340B1 (en) * | 2005-09-06 | 2006-05-02 | Pai Lung Machinery Mill Co., Ltd. | Heat dissipating system of high-speed circular knitting machine |
WO2007148850A1 (en) * | 2006-06-22 | 2007-12-27 | Yeong-Hun Kim | Cooling apparatus for semiconductor or lcd manufacturing process |
US20100125377A1 (en) * | 2008-11-17 | 2010-05-20 | Samsung Electronics Co., Ltd. | Apparatus to test semiconductor device and method of testing semiconductor device using the same |
CN102080897A (en) * | 2010-01-15 | 2011-06-01 | 日月光半导体制造股份有限公司 | Cooling system for semiconductor manufacturing and testing processes |
DE202013103995U1 (en) * | 2013-05-31 | 2014-09-01 | Frank Strohmann | Temperature control device and system for gas analysis |
US20190277317A1 (en) * | 2016-01-20 | 2019-09-12 | Soliton Holdings Corporation, Delaware Corporation | Generalized Jet-Effect and Enhanced Devices |
KR20210004139A (en) * | 2019-07-03 | 2021-01-13 | 세메스 주식회사 | A cooling chamber |
CN113739500A (en) * | 2021-09-03 | 2021-12-03 | 北京北方华创微电子装备有限公司 | Exhaust assembly, semiconductor processing equipment and wafer cooling control method |
WO2024021800A1 (en) * | 2022-07-25 | 2024-02-01 | 海拓仪器(江苏)有限公司 | Test head for thermal shock apparatus and thermal shock apparatus |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3019621A (en) * | 1960-10-03 | 1962-02-06 | Maurice O Lawson | High temperature compression heater |
US3173273A (en) * | 1962-11-27 | 1965-03-16 | Charles D Fulton | Vortex tube |
US4848090A (en) * | 1988-01-27 | 1989-07-18 | Texas Instruments Incorporated | Apparatus for controlling the temperature of an integrated circuit package |
US6249132B1 (en) * | 1997-02-12 | 2001-06-19 | Tokyo Electron Limited | Inspection methods and apparatuses |
-
2001
- 2001-10-17 US US09/981,200 patent/US6750668B1/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3019621A (en) * | 1960-10-03 | 1962-02-06 | Maurice O Lawson | High temperature compression heater |
US3173273A (en) * | 1962-11-27 | 1965-03-16 | Charles D Fulton | Vortex tube |
US4848090A (en) * | 1988-01-27 | 1989-07-18 | Texas Instruments Incorporated | Apparatus for controlling the temperature of an integrated circuit package |
US6249132B1 (en) * | 1997-02-12 | 2001-06-19 | Tokyo Electron Limited | Inspection methods and apparatuses |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7036340B1 (en) * | 2005-09-06 | 2006-05-02 | Pai Lung Machinery Mill Co., Ltd. | Heat dissipating system of high-speed circular knitting machine |
WO2007148850A1 (en) * | 2006-06-22 | 2007-12-27 | Yeong-Hun Kim | Cooling apparatus for semiconductor or lcd manufacturing process |
US20100125377A1 (en) * | 2008-11-17 | 2010-05-20 | Samsung Electronics Co., Ltd. | Apparatus to test semiconductor device and method of testing semiconductor device using the same |
TWI458034B (en) * | 2010-01-15 | 2014-10-21 | Advanced Semiconductor Eng | Cooling system for semiconductor manufacturing and testing processes |
CN102080897A (en) * | 2010-01-15 | 2011-06-01 | 日月光半导体制造股份有限公司 | Cooling system for semiconductor manufacturing and testing processes |
US20110173994A1 (en) * | 2010-01-15 | 2011-07-21 | Advanced Semiconductor Engineering, Inc. | Cooling system for semiconductor manufacturing and testing processes |
CN102080897B (en) * | 2010-01-15 | 2012-11-21 | 日月光半导体制造股份有限公司 | Cooling system for semiconductor manufacturing and testing processes |
DE202013103995U1 (en) * | 2013-05-31 | 2014-09-01 | Frank Strohmann | Temperature control device and system for gas analysis |
US20190277317A1 (en) * | 2016-01-20 | 2019-09-12 | Soliton Holdings Corporation, Delaware Corporation | Generalized Jet-Effect and Enhanced Devices |
US11493066B2 (en) * | 2016-01-20 | 2022-11-08 | Soliton Holdings | Generalized jet-effect and enhanced devices |
KR20210004139A (en) * | 2019-07-03 | 2021-01-13 | 세메스 주식회사 | A cooling chamber |
KR102353774B1 (en) | 2019-07-03 | 2022-01-19 | 세메스 주식회사 | A cooling chamber |
CN113739500A (en) * | 2021-09-03 | 2021-12-03 | 北京北方华创微电子装备有限公司 | Exhaust assembly, semiconductor processing equipment and wafer cooling control method |
CN113739500B (en) * | 2021-09-03 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Exhaust assembly, semiconductor processing equipment and wafer cooling control method |
WO2024021800A1 (en) * | 2022-07-25 | 2024-02-01 | 海拓仪器(江苏)有限公司 | Test head for thermal shock apparatus and thermal shock apparatus |
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