CN102080897B - Cooling system for semiconductor manufacturing and testing processes - Google Patents
Cooling system for semiconductor manufacturing and testing processes Download PDFInfo
- Publication number
- CN102080897B CN102080897B CN201010518221XA CN201010518221A CN102080897B CN 102080897 B CN102080897 B CN 102080897B CN 201010518221X A CN201010518221X A CN 201010518221XA CN 201010518221 A CN201010518221 A CN 201010518221A CN 102080897 B CN102080897 B CN 102080897B
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- air
- pipe
- cooling system
- cold
- discharge pipe
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
- F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect
Abstract
A cooling system for providing a desired environment for a semiconductor manufacturing and/or testing processes includes a vortex unit and a semiconductor processing device suitable for performing a semiconductor processing function. The vortex unit includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a dry air tube enclosing the second air exhaust and connecting to the air compressor unit and the vortex unit. Since the dry air continuously flows surrounding the cold air tube, no water will be condensed around the cold air tube. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested products.
Description
Technical field
The present invention relates to a kind of cooling system, be specially adapted to the eddy current cooling system of semiconductor manufacturing or test macro, this system is used to provide the environment temperature that is fit to the semiconductor Computer-Assisted Design, Manufacture And Test.
Background technology
The Computer-Assisted Design, Manufacture And Test of semiconductor element is the work of a cost manpower, because the complexity of making, high failure rate may take place when making element.Therefore, said semiconductor element must be done test widely under setup parameter, and is normal to guarantee running.In addition, semiconductor element test does not just need the performance of measuring semiconductor, also need test the running situation of this performance under different desired temperatures.
Semiconductor element may be operated down at state of temperature very on a large scale, and to low temperature, and the user expects to operate under arbitrary desired temperature environment of said semiconductor element performance from excessive temperature.Therefore, can in said desired temperature range, test said semiconductor element, to guarantee the durability of said semiconductor element.
For example; The method of traditional test semiconductor element comprises vortex tube, and this vortex tube is used for cooling off saidly to be waited to make or semiconductor element to be tested is being made or required environment temperature during test, wherein; Compressed air is imported into vortex tube; At last, cold air can be discharged to be tested and make component ambient, cools off its environment temperature.
Yet; Because the temperature difference of the air cooled tube of vortex tube and environment temperature; Aqueous vapor condense in easily said air cooled tube around; And said aqueous vapor of condensing easily from the air cooled tube of said vortex tube drop onto said wait to make or element to be tested on, thereby cause said to be tested or make component failure easily.General said vortex tube heat-barrier material commonly used is wrapped in its periphery, but condensation of moisture still occurs on the heat-barrier material of said parcel easily.Therefore, then easily said semiconductor Computer-Assisted Design, Manufacture And Test element is polluted and damages.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of cooling system, and the environment temperature of said to be tested and the semiconductor element of making is provided; Said cooling system is effective and low cost method; And, do not need other movable accessory, computer apparatus and refrigerant, and do not have the problem of condensation of moisture.
In the present invention, vortex tube comprises: receive compressed-air actuated inlet; The hot-air discharge pipe, the delivery temperature of this hot-air discharge pipe is higher than the compressed air that is received; The cold air discharge pipe, the delivery temperature of this cold air discharge pipe is lower than the compressed air of said reception; The dry air pipe is connected in said insulation system, and the dry air in the said dry air pipe can arrive the exhaust outlet discharge of the cold air blast pipe of said vortex tube, and said cold air blast pipe is connected to said semiconductor machining element place.So said semiconductor machining element can receive cold air from said vortex tube, this cold air can provide the environment temperature that is fit to said semiconductor Computer-Assisted Design, Manufacture And Test element, to operate its semiconductor function.Said dry air pipe can be used as thermal insulation layer and uses around said cold air blast pipe, so around said cold air discharge pipe, do not have condensation of moisture.Therefore, then can not pollute and damage said semiconductor Computer-Assisted Design, Manufacture And Test element.
Description of drawings
Fig. 1 is the cooling system sketch map that is used for the semiconductor manufacturing tests process of the present invention.
Description of reference numerals
1 cyclone unit, 2 vortex tubes
3 compressed air, 4 thermal currents
5 cold airflows, 6 cylinder vortex generators
7 circumferential layer air-flows, 8 central stratum air-flows
9 semiconductor Computer-Assisted Design, Manufacture And Test elements, 10 cold airflow pipes
11 anchor clamps, 12 compressors
13 flow of dried air, 14 dry air pipes
15 control valves, 16 cold air mouths
17 hot gas mouths, 18 controllers
19 semiconductor Computer-Assisted Design, Manufacture And Test boards, 20 temperature-sensitive stickers
The specific embodiment
With reference to figure 1, it shows that the present invention is used as the sketch map of cooling system with cyclone unit 1.Vortex tube 2 receives compressed air 3 and it is divided into thermal current 4 and cold airflow 5, and this compressed air stream 3 is the central compressed air systems from compressor 12 or manufacturing works.Cylinder vortex generator 6 in the said vortex tube 2 can produce first swirling eddy; This first swirling eddy is sent to the tail end of said vortex tube along the eddy current tube wall; The circumferential layer air-flow 7 of said first swirling eddy part can be discharged with the form of hot-air through control valve 15, and the remainder of said first swirling eddy then refluxes from central pipeline; To form central stratum air-flow 8; The central stratum air-flow 8 of said first swirling eddy to be to flow with respect to said circumferential layer air-flow 7 reverse and slower speed, wherein, can be transferred into the said very fast circumferential layer air-flow 7 that moves in the heat of said central stratum air-flow 8.Therefore, can reduce the temperature of said central stratum air-flow 8, said central stratum air-flow 8 flows through said cylinder vortex generator 6 and discharges from cold airflow pipe 10, to form cold airflow 5.For cooling purpose, said cold air stream 5 is fed on said semiconductor manufacturing or the testing element 9.Wherein, very slow at the angular speed of said circumferential layer air-flow 7, then very fast in said central stratum air-flow 8, this is the operating mechanism of said vortex tube 2.Friction between said circumferential layer air-flow 7 and said central stratum air-flow 8 can make it reduce relative angular speed, to form complete fluid.The angular speed of the central stratum air-flow 8 of internal layer is reduced; And the angular speed of outer field circumferential layer air-flow 7 is increased; The result is exactly that said central stratum air-flow 8 can lose its kinetic energy; And be transferred in the said circumferential layer air-flow 7, the temperature of said central stratum air-flow 8 can reduce, and the temperature of said circumferential layer air-flow 7 can raise.So, can form this cold airflow 5 at said refrigerator pipe 10 places, said cold airflow pipe 10 is being connected on the anchor clamps 11 that are positioned on semiconductor manufacturing or the testing equipment, to be used for cooling off the temperature of said semiconductor element 9.
With reference to shown in Figure 1; Cold airflow pipe 10 external packets of cyclone unit 1 of the present invention are wrapped with dry air pipe 14; In this dry air pipe flow of dried air 13 is arranged; This flow of dried air is from the central compressed air system of compressor 12 or manufacturing works, and the temperature of said flow of dried air 13 is between said thermal current 4 and said cold airflow 5.Said flow of dried air 13 is around the outer flow mistake of said cold airflow pipe 10, and derives from said cold airflow pipe 10.Because said flow of dried air 13 so do not have the outside of condensation of moisture at said cold airflow pipe 10, drops onto above-mentioned manufacturing or test section to such an extent as to condense around said cold airflow pipe 10 outer flow mistakes.Therefore, can not pollute and damage said semiconductor Computer-Assisted Design, Manufacture And Test element 9 and said semiconductor Computer-Assisted Design, Manufacture And Test board 19.Flow of dried air 13 in dry air pipe 14 promptly forms good temperature isolation layer, and said dry air pipe 14 can good design, to such an extent as to can not disturb the temperature characterisitic of said cold air pipe 10.
And the control valve 15 that is positioned at the thermal current outlet of said vortex tube 2 can be used for controlling the ratio of said cold airflow, and the said cold airflow that imports to cold airflow pipe 10 is with respect to the ratio of the compressed air stream of said importing vortex tube 2 ratio for this cold airflow.Therefore, the user through the said control valve 15 of control can controlled vortex flow pipe 2 thermal current 4 and the flow of cold airflow 5, and many different ratios can be provided.The flow of adjusting the hot gas mouth 17 of said heat flow tube outlet can be set the flow and the temperature of said cold air mouth 16; The pressure of the Compressed Gas that receives because of difference when the gas flow temperature of said hot gas mouth 17 changes when raising, and the gas flow temperature of said cold air mouth 16 can descend.This is because when more thermal currents 4 can make the discharge ratio of cold airflow 5 reduce from 17 discharges of hot gas mouth, promptly reduce the ratio of said cold airflow, so can further reduce the temperature of the cold airflow 5 of said cold air mouth 16; When few more thermal current 4 can make the discharge ratio of cold airflow 5 raise from 17 discharges of hot gas mouth, promptly improve the ratio of said cold airflow, the temperature of the cold airflow 5 of cold air mouth 16 can reduce lessly.On the other hand; Change the flow of the said Compressed Gas of sending into 3 or the temperature that pressure also can change said cold airflow 5 and said thermal current 4; It is more that the ratio that increases the pressure of said Compressed Gas 3 and keep lower cold airflow can make the temperature of said cold airflow 5 reduce, and the temperature of said thermal current 4 can't raise too much.On the contrary, it is less that the ratio that increases the pressure of said Compressed Gas 3 and keep higher cold airflow can make the temperature of said cold airflow 5 reduce, and the temperature of said thermal current 4 can raise morely, therefore has sizable operating flexibility.Controller 18 is connected to said compressor 12 and said semiconductor Computer-Assisted Design, Manufacture And Test board 19; To control the running of said cooling system; Said control valve 15 is connected to the temperature-sensitive sticker 20 on said semiconductor Computer-Assisted Design, Manufacture And Test board 19, and connection can be controlled said control valve 15 like this.
Though the present invention discloses with foregoing preferred forms, yet it is not limited to the present invention, any those skilled in the art is not breaking away from the spirit and scope of the present invention, can make various changes and modification to the present invention.Therefore protection scope of the present invention should be as the criterion with what defined in the claim.
Claims (6)
1. cooling system, this cooling system comprises:
The vortex tube unit, this vortex tube unit receives compressed air from air intake;
The hot-air discharge pipe, this hot-air discharge pipe discharge temperature is higher than said compressed-air actuated thermal air current;
Cold air discharge pipe, this cold air discharge pipe discharge temperature are lower than said compressed-air actuated cold air stream;
Dry air pipe, this dry air pipe are wrapped in outside the said cold air discharge pipe, wherein, have in the said dry air pipe from the dry air of said compressed air shunting, this dry air in said dry air pipe along the outer flow mistake of said cold air discharge pipe;
Air compression system, this air compression system provide said compressed air to said vortex tube unit and said dry air pipe.
2. cooling system according to claim 1, wherein, this cooling system is the cooling system that is used for semiconductor Computer-Assisted Design, Manufacture And Test process.
3. cooling system according to claim 1 and 2, wherein, said vortex tube unit also comprises control valve, this control valve is positioned at the end of said hot-air discharge pipe, to control the flow proportional of said thermal air current and said cold air stream.
4. eddy current cooling system, this eddy current cooling system comprises:
The vortex tube unit, this vortex tube unit receives compressed air from air intake;
The hot-air discharge pipe, this hot-air discharge pipe discharge temperature is higher than said compressed-air actuated thermal air current;
Cold air discharge pipe, this cold air discharge pipe discharge temperature are lower than said compressed-air actuated cold air stream;
Dry air pipe, this dry air pipe are wrapped in outside the said cold air discharge pipe, wherein, have in the said dry air pipe from the dry air of said compressed air shunting, this dry air in said dry air pipe along said cold air discharge pipe outer flow mistake.
5. eddy current cooling system according to claim 4, wherein, this eddy current cooling system is the cooling system that is used for semiconductor Computer-Assisted Design, Manufacture And Test process.
6. according to claim 4 or 5 described eddy current cooling systems, wherein, said vortex tube unit also comprises control valve, and this control valve is positioned at the end of said hot-air discharge pipe, to control the flow proportional of said thermal air current and said cold air stream.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29526610P | 2010-01-15 | 2010-01-15 | |
| US61/295,266 | 2010-01-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102080897A CN102080897A (en) | 2011-06-01 |
| CN102080897B true CN102080897B (en) | 2012-11-21 |
Family
ID=44087000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010518221XA Active CN102080897B (en) | 2010-01-15 | 2010-10-19 | Cooling system for semiconductor manufacturing and testing processes |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20110173994A1 (en) |
| CN (1) | CN102080897B (en) |
| TW (1) | TWI458034B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103278029B (en) * | 2013-06-03 | 2015-10-21 | 上海华虹宏力半导体制造有限公司 | The heat-exchange system of the board of high temperature semiconductors technique and method |
| CN105485803A (en) * | 2014-09-15 | 2016-04-13 | 张奠立 | Fan temperature adjusting device |
| US9976972B2 (en) | 2015-12-15 | 2018-05-22 | Thermo Gamma-Metrics Pty Ltd | Thermal control apparatus |
| KR20170097421A (en) * | 2016-02-18 | 2017-08-28 | 엘에스산전 주식회사 | Cooling system for two-dimensional array power converter |
| US20200318863A1 (en) * | 2016-05-31 | 2020-10-08 | Cool Mine Pty Ltd | Cooling device |
| JP2018076995A (en) * | 2016-11-08 | 2018-05-17 | 株式会社ナカヤ | Circulation liquid temperature control method using parameter control-by-area type chiller by remote control, and maintenance method |
| CN106975980A (en) * | 2017-05-25 | 2017-07-25 | 天津商业大学 | Drill bit cooling system based on vortex tube refrigeration |
| CN108495520A (en) * | 2018-03-13 | 2018-09-04 | 马鞍山钢铁股份有限公司 | Electrical cabinet heating and refrigerating plant and its application method |
| JP7129261B2 (en) * | 2018-07-27 | 2022-09-01 | キオクシア株式会社 | test equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6750668B1 (en) * | 2001-10-17 | 2004-06-15 | Lsi Logic Corporation | Vortex unit for providing a desired environment for a semiconductor process |
| CN2747519Y (en) * | 2004-07-29 | 2005-12-21 | 上海海事大学 | Vortex refrigerator with industrial cabinet |
| CN2771760Y (en) * | 2005-01-31 | 2006-04-12 | 陈秩伦 | Heat exchanger structure |
| CN100416179C (en) * | 2007-03-08 | 2008-09-03 | 上海交通大学 | Refrigerating system using swirling flow ejector |
| CN101266084A (en) * | 2008-04-25 | 2008-09-17 | 深圳市力科气动科技有限公司 | Vortex tube |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2731811A (en) * | 1956-01-24 | Vortex type air cooler | ||
| US1952281A (en) * | 1931-12-12 | 1934-03-27 | Giration Des Fluides Sarl | Method and apparatus for obtaining from alpha fluid under pressure two currents of fluids at different temperatures |
| US2669101A (en) * | 1952-12-31 | 1954-02-16 | James T Shields | Device for heating and cooling vehicles |
| US2894371A (en) * | 1956-10-17 | 1959-07-14 | Shell Dev | Preventing condensation inside a vortex tube |
| US3233416A (en) * | 1964-02-10 | 1966-02-08 | Jewel G Rainwater | Blow molding system with vortex tube |
| US3696908A (en) * | 1970-11-09 | 1972-10-10 | Sperry Rand Corp | Capacitive key |
| US3777506A (en) * | 1972-05-08 | 1973-12-11 | Camper Comfort Corp | Portable air conditioner apparatus |
| US3969908A (en) * | 1975-04-29 | 1976-07-20 | Lawless John F | Artificial snow making method |
| US5561982A (en) * | 1995-05-02 | 1996-10-08 | Universal Vortex, Inc. | Method for energy separation and utilization in a vortex tube which operates with pressure not exceeding atmospheric pressure |
| US5660047A (en) * | 1995-09-15 | 1997-08-26 | American Air Liquide, Inc. | Refrigeration system and method for cooling a susceptor using a refrigeration system |
| US6264401B1 (en) * | 1995-12-29 | 2001-07-24 | Shell Oil Company | Method for enhancing the flow of heavy crudes through subsea pipelines |
| US6195372B1 (en) * | 1997-08-19 | 2001-02-27 | David C. Brown | Cryogenically-cooled solid-state lasers |
| US20010048902A1 (en) * | 2000-05-01 | 2001-12-06 | Christopher Hertzler | Treatment system for removing hazardous substances from a semiconductor process waste gas stream |
| US7263836B2 (en) * | 2004-05-18 | 2007-09-04 | Schlumberger Technology Corporation | Vortex tube cooling system |
| KR100765983B1 (en) * | 2006-06-22 | 2007-10-11 | 김영훈 | Cooling apparatus for semiconductor or LCD equipment |
-
2010
- 2010-08-06 TW TW099126208A patent/TWI458034B/en active
- 2010-08-25 US US12/868,578 patent/US20110173994A1/en not_active Abandoned
- 2010-10-19 CN CN201010518221XA patent/CN102080897B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6750668B1 (en) * | 2001-10-17 | 2004-06-15 | Lsi Logic Corporation | Vortex unit for providing a desired environment for a semiconductor process |
| CN2747519Y (en) * | 2004-07-29 | 2005-12-21 | 上海海事大学 | Vortex refrigerator with industrial cabinet |
| CN2771760Y (en) * | 2005-01-31 | 2006-04-12 | 陈秩伦 | Heat exchanger structure |
| CN100416179C (en) * | 2007-03-08 | 2008-09-03 | 上海交通大学 | Refrigerating system using swirling flow ejector |
| CN101266084A (en) * | 2008-04-25 | 2008-09-17 | 深圳市力科气动科技有限公司 | Vortex tube |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102080897A (en) | 2011-06-01 |
| TWI458034B (en) | 2014-10-21 |
| US20110173994A1 (en) | 2011-07-21 |
| TW201125060A (en) | 2011-07-16 |
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