US20110173994A1 - Cooling system for semiconductor manufacturing and testing processes - Google Patents
Cooling system for semiconductor manufacturing and testing processes Download PDFInfo
- Publication number
- US20110173994A1 US20110173994A1 US12/868,578 US86857810A US2011173994A1 US 20110173994 A1 US20110173994 A1 US 20110173994A1 US 86857810 A US86857810 A US 86857810A US 2011173994 A1 US2011173994 A1 US 2011173994A1
- Authority
- US
- United States
- Prior art keywords
- air
- tube
- cold
- vortex
- exhaust tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
- F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect
Definitions
- the present invention generally relates to a cooling system for semiconductor manufacture and/or testing processes, and more particularly to a vortex cooling system for providing desired environmental conditions in manufacturing and/or testing semiconductor devices.
- testing of semiconductor devices is a laborious process. Because of the complexity of the process, a high failure rate may be encountered during the manufacture of the devices. Thus, the devices must be tested extensively to ensure operation within desired parameters. Additionally, testing of the semiconductor device may require not only the testing of the ability of the semiconductor to perform desired operations, but also the ability of the semiconductor to perform the operations in contemplated environmental conditions.
- Semiconductor devices may encounter a wide range of environmental conditions. From extreme heat to cold, and every temperature in between, users desire the operation of the semiconductor within desired parameters for the contemplated environmental conditions. Therefore, it may also be desirable to test the semiconductor devices within the contemplated operational temperature range to ensure the robustness of the device.
- conventional methods used to test a semiconductor device involve a vortex tube for cooling the environment of a desired process, such as testing of a device. Compressed air is directed into the vortex tube such that the cold air exhausts onto the testing and/or manufacturing of semiconductor devices.
- the vortex tube may be encapsulated in insulating material, however, water condensation could still happen even though the vortex tube has been encapsulated by insulation material.
- the object of the present invention is to provide a cooling system for providing a desired environment for the testing and/or manufacturing of semiconductor devices in an efficient and cost-effective manner without moving parts, electricity, refrigerants, and without condensed water pollution and damages.
- a vortex tube in one aspect of the present invention, includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a third air inlet to the heat insulation casing system and exhaust air with the second exhaust of the vortex tube.
- the semiconductor processing device is connected to the second air exhaust of the vortex tube so that the semiconductor processing device receives a cooled air stream from the vortex tube, the cooled air stream providing an environment suitable for enabling the semiconductor processing device to perform the semiconductor processing function.
- the third air conducting to the outer position of the second outlet of the vortex tube serves as a heat insulation layer.
- FIG. 1 is an illustration of an embodiment of the cooling system for semiconductor manufacturing and testing processes in accordance with the present invention.
- a vortex unit 1 suitable for cooling in accordance with the present invention is shown.
- a vortex tube 2 receives a stream of compressed air 3 and separates the stream into a hot air stream 4 and a cool air stream 5 .
- the stream of compressed air 3 is supplied from an air compressor 12 or central compressed air system in the factory.
- the cylindrical generator 6 causes the air to rotate as a first air stream. The rotating air is forced down the end of the tube against the inner walls of the tube.
- a portion of the first air stream at the periphery layers 7 exits the tube, preferably through a controlling valve 14 , and is exhausted as the hot air stream 4 .
- the remaining air returns through the center of the first air stream at the periphery layers 7 as a second air stream at the central layers 8 , and the second air stream at the central layers 8 moves in the opposite direction slower that the first air stream at the periphery layers 7 .
- Heat in the second air stream at the central layers 8 is transferred to the faster moving first air stream at the periphery layers 7 which cools the second air stream at the central layers 8 .
- the second cooled air stream at the central layers 8 passes through the center of the cylindrical generator 6 , and exits through an exhaust port as the cooled air 5 .
- the cooled air 5 exhausts onto the testing and/or manufacturing of semiconductor devices 9 .
- the mechanism of the vortex tube 2 is that the angular velocity in the vortex tube 2 is low at the periphery layers 7 and very high at the central layers 8 . Friction between the central and periphery layers 7 reduces all the air to the same angular velocity as in a solid body. This causes the inner layers to slow down and outer layers to speed up. As a result of that the inner parts lose part of their kinetic energy and their total temperature decrease.
- the periphery layers 7 receive the energy from the central layers 8 . So the cooled air 5 is so formed in the cold air tube 10 .
- the outlet of the cold air tube 10 is connected to the chuck 11 to cool down the environment of the semiconductor device 9 .
- FIG. 1 an embodiment of the present invention is shown wherein the cold air tube 10 of the vortex unit 1 is enclosed with a dry air tube 14 , wherein a dry air 13 is supplied by the air compressor 12 or central compressed air system in the factory.
- the temperature of dry air 13 is between the hot air's 4 and the cold air's 5 .
- the dry air 13 continuously flows surrounding the cold air tube 10 and then is directed out of the cold air tube 10 . Since the dry air 13 continuously flows surrounding the cold air tube 10 , no water will be condensed surrounding the cold air tube 10 to drop down onto the manufacturing and/or testing areas. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested device 9 and the manufacturing and/or testing machines 19 .
- the dry air 13 in the dry air tube 14 becomes a good temperature insulation layer and the dry air tube 14 is so designed as not to interfere the temperature behavior of the cold air tube 10 .
- a controlling valve 15 located in the hot air exhaust of the vortex tube 2 may be used to control the cold fraction.
- the percentage of total input air to the vortex tube 2 that is directed to the cold end 16 is the “Cold Fraction”.
- the vortex tube 2 may supply a variety of atmospheres as desired by a user. Adjusting the hot air outlet sets the flow rate and temperature at the cold end 16 .
- the ON/OFF controller 18 is connected to the air compressor 12 and the manufacturing and/or testing machines 19 to control the operation of the cooling system.
- the controlling valve 15 is connected to the temperature sensor 20 on the manufacturing and/or testing machines 19 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling system for providing a desired environment for a semiconductor manufacturing and/or testing processes includes a vortex unit and a semiconductor processing device suitable for performing a semiconductor processing function. The vortex unit includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a dry air tube enclosing the second air exhaust and connecting to the air compressor unit and the vortex unit. Since the dry air continuously flows surrounding the cold air tube, no water will be condensed around the cold air tube. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested products.
Description
- This application claims the priority benefit of U.S. Provisional Application Ser. No. 61/295,226, filed on Jan. 15, 2010. The full disclosures of the above-identified application are incorporated herein by reference.
- The present invention generally relates to a cooling system for semiconductor manufacture and/or testing processes, and more particularly to a vortex cooling system for providing desired environmental conditions in manufacturing and/or testing semiconductor devices.
- The manufacturing and testing of semiconductor devices is a laborious process. Because of the complexity of the process, a high failure rate may be encountered during the manufacture of the devices. Thus, the devices must be tested extensively to ensure operation within desired parameters. Additionally, testing of the semiconductor device may require not only the testing of the ability of the semiconductor to perform desired operations, but also the ability of the semiconductor to perform the operations in contemplated environmental conditions.
- Semiconductor devices may encounter a wide range of environmental conditions. From extreme heat to cold, and every temperature in between, users desire the operation of the semiconductor within desired parameters for the contemplated environmental conditions. Therefore, it may also be desirable to test the semiconductor devices within the contemplated operational temperature range to ensure the robustness of the device.
- For example, conventional methods used to test a semiconductor device involve a vortex tube for cooling the environment of a desired process, such as testing of a device. Compressed air is directed into the vortex tube such that the cold air exhausts onto the testing and/or manufacturing of semiconductor devices.
- However, because the temperature difference between the environment and the vortex cold air outlet, water may often condense surrounding the outer surface of the vortex cold air outlet tube. The condensed water may drop from the vortex tube to the manufacturing and/or testing areas and cause pollution and even damages to the manufactured or tested products. In general, the vortex tube may be encapsulated in insulating material, however, water condensation could still happen even though the vortex tube has been encapsulated by insulation material.
- Accordingly, the object of the present invention is to provide a cooling system for providing a desired environment for the testing and/or manufacturing of semiconductor devices in an efficient and cost-effective manner without moving parts, electricity, refrigerants, and without condensed water pollution and damages.
- In one aspect of the present invention, a vortex tube includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a third air inlet to the heat insulation casing system and exhaust air with the second exhaust of the vortex tube. The semiconductor processing device is connected to the second air exhaust of the vortex tube so that the semiconductor processing device receives a cooled air stream from the vortex tube, the cooled air stream providing an environment suitable for enabling the semiconductor processing device to perform the semiconductor processing function. The third air conducting to the outer position of the second outlet of the vortex tube serves as a heat insulation layer.
- It is to be understood that both the forgoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed. The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate an embodiment of the invention and together with the general description, serve to explain the principles of the invention.
- Exemplary embodiments will be discussed herein with reference to the accompanying drawings, wherein elements having the same reference numeral designations represent like elements throughout and wherein:
-
FIG. 1 is an illustration of an embodiment of the cooling system for semiconductor manufacturing and testing processes in accordance with the present invention. - In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
- Referring now to
FIG. 1 , avortex unit 1 suitable for cooling in accordance with the present invention is shown. A vortex tube 2 receives a stream of compressed air 3 and separates the stream into a hot air stream 4 and acool air stream 5. The stream of compressed air 3 is supplied from anair compressor 12 or central compressed air system in the factory. The cylindrical generator 6 causes the air to rotate as a first air stream. The rotating air is forced down the end of the tube against the inner walls of the tube. A portion of the first air stream at the periphery layers 7 exits the tube, preferably through a controllingvalve 14, and is exhausted as the hot air stream 4. The remaining air returns through the center of the first air stream at the periphery layers 7 as a second air stream at thecentral layers 8, and the second air stream at thecentral layers 8 moves in the opposite direction slower that the first air stream at the periphery layers 7. Heat in the second air stream at thecentral layers 8 is transferred to the faster moving first air stream at the periphery layers 7 which cools the second air stream at thecentral layers 8. The second cooled air stream at thecentral layers 8 passes through the center of the cylindrical generator 6, and exits through an exhaust port as the cooledair 5. For the cooling purpose, the cooledair 5 exhausts onto the testing and/or manufacturing ofsemiconductor devices 9. The mechanism of the vortex tube 2 is that the angular velocity in the vortex tube 2 is low at the periphery layers 7 and very high at thecentral layers 8. Friction between the central and periphery layers 7 reduces all the air to the same angular velocity as in a solid body. This causes the inner layers to slow down and outer layers to speed up. As a result of that the inner parts lose part of their kinetic energy and their total temperature decrease. The periphery layers 7 receive the energy from thecentral layers 8. So the cooledair 5 is so formed in thecold air tube 10. The outlet of thecold air tube 10 is connected to the chuck 11 to cool down the environment of thesemiconductor device 9. - Referring to
FIG. 1 , an embodiment of the present invention is shown wherein thecold air tube 10 of thevortex unit 1 is enclosed with adry air tube 14, wherein adry air 13 is supplied by theair compressor 12 or central compressed air system in the factory. The temperature ofdry air 13 is between the hot air's 4 and the cold air's 5. Thedry air 13 continuously flows surrounding thecold air tube 10 and then is directed out of thecold air tube 10. Since thedry air 13 continuously flows surrounding thecold air tube 10, no water will be condensed surrounding thecold air tube 10 to drop down onto the manufacturing and/or testing areas. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or testeddevice 9 and the manufacturing and/ortesting machines 19. Thedry air 13 in thedry air tube 14 becomes a good temperature insulation layer and thedry air tube 14 is so designed as not to interfere the temperature behavior of thecold air tube 10. - Additionally, a controlling
valve 15 located in the hot air exhaust of the vortex tube 2 may be used to control the cold fraction. The percentage of total input air to the vortex tube 2 that is directed to thecold end 16 is the “Cold Fraction”. Thus, by using avalve 15 controllable by a user, the vortex tube 2 may supply a variety of atmospheres as desired by a user. Adjusting the hot air outlet sets the flow rate and temperature at thecold end 16. The temperature “rise” at thehot end 17 and temperature “drop” at thecold end 16 of a vortex tube 2 at various input pressures and “Cold Fraction” setting. The more hot air stream 4 out at thehot end 17 and reduces thecold air stream 5, that is to lower the “Cold Fraction”, the cold air's temperature drop more at thecold end 16. The less hot air stream 4 out at thehot end 17 and increase thecold air stream 5, that is to raise the “Cold Fraction”, the cold air's temperature drop less at thecold end 16. In another aspect, change the flow rate or pressure of the inlet compressed air 3 will also change the temperature of thecold air stream 5 and the hot air stream 4. Increase the inlet pressure at lower cold fraction will make cold air's 5 temperature drop more but the hot air stream's 4 temperature raise few. On the contrary, increase the inlet pressure at higher cold fraction will make cold air's 5 temperature drop few but the hot air stream's 4 temperature raise more. The ON/OFF controller 18 is connected to theair compressor 12 and the manufacturing and/ortesting machines 19 to control the operation of the cooling system. The controllingvalve 15 is connected to thetemperature sensor 20 on the manufacturing and/ortesting machines 19. - It is believed that the cooling system of the present invention and many of its attendant advantages will be understood by the forgoing description. It is also believed that it will be apparent that various changes may be made in the form, construction and arrangement of the components thereof without departing from the scope and spirit of the invention or without sacrificing all of its material advantages. The form herein before described being merely an explanatory embodiment thereof. It is the intention of the following claims to encompass and include such changes.
Claims (4)
1. A cooling system for providing a desired environment for a semiconductor manufacturing and testing process, comprising:
a vortex unit having an air inlet for receiving a compressed air;
a hot air exhaust tube for outputting an air stream having a temperature greater than the received compressed air;
a cold air exhaust tube for outputting an air stream having a temperature lower than the received compressed air;
a dry air tube enclosing the cold air exhaust tube, wherein the dry air inside the dry air tube continuously flows surrounding the cold air tube; and
an air compressor system for supplying compressed air to the vortex tube and the dry air tube.
2. A cooling system as described in claim 1 , wherein the vortex unit further comprises a valve constructed on the end of the hot air exhaust tube to control the cold fraction of the hot air in the hot air exhaust tube and the cold air in the cold air exhaust tube.
3. A vortex cooling system for providing a desired environment for a semiconductor manufacturing and testing process, comprising:
a vortex unit having an air inlet for receiving a compressed air;
a hot air exhaust tube for outputting an air stream having a temperature greater than the received compressed air;
a cold air exhaust tube for outputting an air stream having a temperature lower than the received compressed air; and
a dry air tube enclosing the cold air exhaust tube, wherein the dry air inside the dry air tube continuously flows surrounding the cold air tube.
4. A vortex cooling system as described in claim 1 , wherein the vortex unit further comprises a valve constructed on the end of the hot air exhaust tube to control the cold fraction of the hot air in the hot air exhaust tube and the cold air in the cold air exhaust tube.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/868,578 US20110173994A1 (en) | 2010-01-15 | 2010-08-25 | Cooling system for semiconductor manufacturing and testing processes |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29526610P | 2010-01-15 | 2010-01-15 | |
US12/868,578 US20110173994A1 (en) | 2010-01-15 | 2010-08-25 | Cooling system for semiconductor manufacturing and testing processes |
Publications (1)
Publication Number | Publication Date |
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US20110173994A1 true US20110173994A1 (en) | 2011-07-21 |
Family
ID=44087000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/868,578 Abandoned US20110173994A1 (en) | 2010-01-15 | 2010-08-25 | Cooling system for semiconductor manufacturing and testing processes |
Country Status (3)
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US (1) | US20110173994A1 (en) |
CN (1) | CN102080897B (en) |
TW (1) | TWI458034B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106975980A (en) * | 2017-05-25 | 2017-07-25 | 天津商业大学 | Drill bit cooling system based on vortex tube refrigeration |
US20170245403A1 (en) * | 2016-02-18 | 2017-08-24 | Lsis Co., Ltd. | Cooling system for two-dimensional array power converters |
WO2017205919A1 (en) * | 2016-05-31 | 2017-12-07 | Cool Mine Pty Ltd | Cooling device |
US9976972B2 (en) | 2015-12-15 | 2018-05-22 | Thermo Gamma-Metrics Pty Ltd | Thermal control apparatus |
CN108495520A (en) * | 2018-03-13 | 2018-09-04 | 马鞍山钢铁股份有限公司 | Electrical cabinet heating and refrigerating plant and its application method |
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CN103278029B (en) * | 2013-06-03 | 2015-10-21 | 上海华虹宏力半导体制造有限公司 | The heat-exchange system of the board of high temperature semiconductors technique and method |
CN105485803A (en) * | 2014-09-15 | 2016-04-13 | 张奠立 | Fan temperature adjusting device |
JP2018076995A (en) * | 2016-11-08 | 2018-05-17 | 株式会社ナカヤ | Circulation liquid temperature control method using parameter control-by-area type chiller by remote control, and maintenance method |
JP7129261B2 (en) * | 2018-07-27 | 2022-09-01 | キオクシア株式会社 | test equipment |
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2010
- 2010-08-06 TW TW099126208A patent/TWI458034B/en active
- 2010-08-25 US US12/868,578 patent/US20110173994A1/en not_active Abandoned
- 2010-10-19 CN CN201010518221XA patent/CN102080897B/en active Active
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US2731811A (en) * | 1956-01-24 | Vortex type air cooler | ||
US1952281A (en) * | 1931-12-12 | 1934-03-27 | Giration Des Fluides Sarl | Method and apparatus for obtaining from alpha fluid under pressure two currents of fluids at different temperatures |
US2669101A (en) * | 1952-12-31 | 1954-02-16 | James T Shields | Device for heating and cooling vehicles |
US2894371A (en) * | 1956-10-17 | 1959-07-14 | Shell Dev | Preventing condensation inside a vortex tube |
US3233416A (en) * | 1964-02-10 | 1966-02-08 | Jewel G Rainwater | Blow molding system with vortex tube |
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Cited By (7)
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US9976972B2 (en) | 2015-12-15 | 2018-05-22 | Thermo Gamma-Metrics Pty Ltd | Thermal control apparatus |
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US20170245403A1 (en) * | 2016-02-18 | 2017-08-24 | Lsis Co., Ltd. | Cooling system for two-dimensional array power converters |
US9949414B2 (en) * | 2016-02-18 | 2018-04-17 | Lsis Co., Ltd. | Cooling system for two-dimensional array power converters |
WO2017205919A1 (en) * | 2016-05-31 | 2017-12-07 | Cool Mine Pty Ltd | Cooling device |
CN106975980A (en) * | 2017-05-25 | 2017-07-25 | 天津商业大学 | Drill bit cooling system based on vortex tube refrigeration |
CN108495520A (en) * | 2018-03-13 | 2018-09-04 | 马鞍山钢铁股份有限公司 | Electrical cabinet heating and refrigerating plant and its application method |
Also Published As
Publication number | Publication date |
---|---|
CN102080897A (en) | 2011-06-01 |
CN102080897B (en) | 2012-11-21 |
TWI458034B (en) | 2014-10-21 |
TW201125060A (en) | 2011-07-16 |
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AS | Assignment |
Owner name: ADVANCED SEMICONDUCTOR ENGINEERING, INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHANG, HSIU MING;CHUANG, CHING WEN;KUNG, HSIANG HAN;REEL/FRAME:024887/0845 Effective date: 20100812 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |