CN106185301A - Electronic component handling apparatus and electronic component inspection device - Google Patents
Electronic component handling apparatus and electronic component inspection device Download PDFInfo
- Publication number
- CN106185301A CN106185301A CN201510243783.0A CN201510243783A CN106185301A CN 106185301 A CN106185301 A CN 106185301A CN 201510243783 A CN201510243783 A CN 201510243783A CN 106185301 A CN106185301 A CN 106185301A
- Authority
- CN
- China
- Prior art keywords
- electronic unit
- maintaining part
- wall
- electronic component
- described electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of electronic component handling apparatus and electronic component inspection device.This electronic component inspection device possesses the handle part holding IC device and the maintaining part keeping IC device.The stream of air flowing it is formed with in maintaining part.And, in this electronic component inspection device, when making IC device fall at handle part release IC device, air is to the direction flowing different from the direction that IC device falls.
Description
Technical field
The present invention relates to electronic component handling apparatus and electronic component inspection device.
Background technology
In the past, the most known electronic unit inspection having the electrical characteristics checking the electronic units such as IC device
Look into device, be assembled with for IC device is delivered to inspection portion in this electronic component inspection device
The electronic component handling apparatus of maintaining part.When the inspection of IC device, IC device is configured at guarantor
Hold portion and relative to maintaining part, IC device positioned, and making to be arranged at multiple spies of maintaining part
Pin (electrode) and each termination contact of IC device.
As the maintaining part that can carry out such location, it is considered to use described in patent documentation 1
Storage instrument.This storage instrument has storage IC device (workpiece) and overlooks the sky in tetragon
Chamber, and it is formed with the suction hole of interior side opening towards this cavity.Suction hole is configured in above-mentioned four
The corner of limit shape, this suction hole attracts, in order to make IC device collide this corner and can enter
Row location.It addition, as carrying out the timing that positions, after IC device arrives the bottom surface of cavity
Carry out.
Patent documentation 1: Japanese Unexamined Patent Publication 11-198988 publication
But, in the storage instrument described in patent documentation 1, the attraction obtained by suction hole
Power maximum is also only atmospheric level, the suction hole before existing according to location and the distance of IC device
The difference of degree and produce the situation that can not carry out positioning.
Summary of the invention
It is an object of the invention to provide and a kind of can easily carry out by electronic unit maintaining part
Electronic component handling apparatus and electronic component inspection device to the location of electronic unit.
Such purpose is realized by the following present invention.
(application examples one)
The electronic component handling apparatus of the present invention is characterised by possessing: electronic unit handle part,
It holds electronic unit；And electronic unit maintaining part, it keeps above-mentioned electronic unit, above-mentioned
Electronic unit maintaining part is formed with the stream of fluid flowing, on above-mentioned electronic unit handle part discharges
When stating electronic unit and make above-mentioned electronic unit fall, above-mentioned fluid falls to above-mentioned electronic unit
Direction different direction flowing.
Thus, carry out by electronic unit maintaining part to the location of electronic unit time, at this electronics
In the whereabouts of parts, fluid can make electronic unit successfully move to the position to be positioned.Logical
Cross this to move, easily carry out the location of electronic unit.
(application examples two)
Preferably in the electronic component handling apparatus of the present invention, arrange in above-mentioned electronic unit maintaining part
Have: recess；And location division, it is configured at above-mentioned recess, and the above-mentioned ministry of electronics industry is passed through in this location division
Part abuts the location carried out above-mentioned electronic unit with it, in the release of above-mentioned electronic unit handle part
When stating electronic unit and make above-mentioned electronic unit fall, above-mentioned fluid is to making above-mentioned electronic unit upwards
State the direction flowing moved location division.
Thus, carry out by electronic unit maintaining part to the location of electronic unit time, at this electronics
In the whereabouts of parts, fluid can make electronic unit successfully move to the position to be positioned.Logical
Cross this to move, carry out the location of electronic unit more easily.
(application examples three)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned electronic unit maintaining part has structure
Becoming the first wall and second wall in the first corner, above-mentioned first wall is with above-mentioned second wall just
Handing over, above-mentioned electronic unit maintaining part has and is configured at above-mentioned first corner and above-mentioned fluid flows through the
One stream, represents that the primary vector of the flowing of the above-mentioned fluid of flowing is respectively in above-mentioned first flow path
Not orthogonal with above-mentioned first wall and above-mentioned second wall.
Thus, in the whereabouts of electronic unit, it is possible to make this electronic unit move to be positioned
Position.
(application examples four)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned electronic unit maintaining part has structure
Becoming the 3rd wall and the 4th wall in the second corner, above-mentioned second corner is arranged in and above-mentioned first
The position at diagonal angle, corner, above-mentioned electronic unit maintaining part has and is configured at above-mentioned second corner and above-mentioned
The second flow path that fluid flows through, represents the flowing of the above-mentioned fluid of flowing in above-mentioned second flow path
Secondary vector is not the most orthogonal with above-mentioned first wall and above-mentioned second wall.
Thus, in the whereabouts of electronic unit, it is possible to make this electronic unit move to be positioned
Position.
(application examples five)
Preferably in the electronic component handling apparatus of the present invention, connect in above-mentioned first flow path and have attraction
, there is the ejection section spraying above-mentioned fluid the suction unit of above-mentioned fluid in the connection of above-mentioned second flow path.
Thus, in the case of the location carrying out electronic unit, it is possible to easily make electronic unit move
Dynamic.
(application examples six)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned electronic unit possess main part,
And it is arranged at multiple terminals in aforementioned body portion, at least of the peristome of above-mentioned second flow path
It is above-mentioned point to be configured in ratio under the state that above-mentioned electronic unit is held in above-mentioned electronic unit maintaining part
The terminal arrangement face being configured with above-mentioned terminal of main part is by below vertical.
Thus, in the case of the location carrying out electronic unit, it is possible to make electronic unit float, energy
Enough electronic unit is easily made to move.
(application examples seven)
Preferably in the electronic component handling apparatus of the present invention, above-mentioned electronic unit maintaining part is checking
Above-mentioned electronic unit is kept in the case of above-mentioned electronic unit.
Thereby, it is possible to stably check electronic unit.
(application examples eight)
Preferably in the electronic component handling apparatus of the present invention, in the holding of above-mentioned electronic unit maintaining part
State electronic unit and be moved to the place of regulation.
Thus, such as can shorten total time of delivery of electronic unit as far as possible.
(application examples nine)
The electronic component inspection device of the present invention is characterised by possessing: electronic unit handle part,
It holds electronic unit；Electronic unit maintaining part, it keeps above-mentioned electronic unit；And inspection portion,
It checks above-mentioned electronic unit, is formed with, in above-mentioned electronic unit maintaining part, the stream that fluid flows through,
Above-mentioned electronic unit handle part discharge above-mentioned electronic unit and in time making above-mentioned electronic unit fall, on
State fluid to the direction flowing different from the direction that above-mentioned electronic unit falls.
Thus, carry out by electronic unit maintaining part to the location of electronic unit time, at this electronics
In the whereabouts of parts, fluid can make electronic unit successfully move to the position to be positioned.Logical
Cross this to move, easily carry out the location of electronic unit.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the first embodiment of the electronic component inspection device representing the present invention.
Fig. 2 is the action etc. in each portion representing that the electronic component inspection device shown in Fig. 1 possesses
Figure.
Fig. 3 is the maintaining part in the inspection portion representing that the electronic component inspection device shown in Fig. 1 possesses
Horizontal cross.
Fig. 4 is the maintaining part representing the inspection portion possessed in the electronic component inspection device shown in Fig. 1
Located the horizontal cross of the state of electronic unit.
Fig. 5 be for explanation in the electronic component inspection device shown in Fig. 1 until by electronic unit
It is positioned the vertical sectional view of action till maintaining part.
Fig. 6 be for explanation in the electronic component inspection device shown in Fig. 1 until by electronic unit
It is positioned the vertical sectional view of action till maintaining part.
Fig. 7 be for explanation in the electronic component inspection device shown in Fig. 1 until by electronic unit
It is positioned the vertical sectional view of action till maintaining part.
Fig. 8 be for explanation in the electronic component inspection device shown in Fig. 1 until by electronic unit
It is positioned the vertical sectional view of action till maintaining part.
Fig. 9 is that to represent that the electronic component inspection device (the second embodiment) of the present invention possesses defeated
Send the horizontal cross of the maintaining part in portion.
Figure 10 is that the electronic component inspection device (the 3rd embodiment) representing the present invention possesses
The horizontal cross of the maintaining part in inspection portion.
Detailed description of the invention
Hereinafter, preferred embodiment the electronic unit of the present invention is carried dress based on shown in the drawings
Put and electronic component inspection device is described in detail.
(the first embodiment)
Fig. 1 is the schematic diagram of the first embodiment of the electronic component inspection device representing the present invention.
Fig. 2 is the figure of the action etc. in each portion representing that the electronic component inspection device shown in Fig. 1 possesses.Figure
3 is that the level of the maintaining part in the inspection portion representing that the electronic component inspection device shown in Fig. 1 possesses is cutd open
View.Fig. 4 is the holding representing the inspection portion possessed in the electronic component inspection device shown in Fig. 1
Portion located the horizontal cross of the state of electronic unit.Fig. 5～Fig. 8 is scheming namely for explanation
Until electronic unit being positioned the action till maintaining part in electronic component inspection device shown in 1
Vertical sectional view.
Additionally, it is following for purposes of illustration only, as it is shown in figure 1, three mutually orthogonal axles are set to X
Axle, Y-axis and Z axis.It addition, include that the X/Y plane of X-axis and Y-axis is level, Z axis
For vertical.It addition, also the direction parallel with X-axis is referred to as " X-direction ", will be parallel with Y-axis
Direction be referred to as " Y-direction ", by the direction parallel with Z axis be referred to as " Z-direction ".It addition, also
The upstream side of the conveying direction of electronic unit is only called " upstream side ", by the conveying of electronic unit
The downstream in direction is only called " downstream ".It addition, " water described in present specification
Flat " be not limited to level completely, as long as not hindering the conveying of electronic unit, also include relative to
The level state that somewhat (e.g., less than about 5 °) tilt.It addition, sometimes by Fig. 5～Fig. 8
Upside be referred to as " on " or " top ", downside is referred to as D score or " lower section ".
It addition, in Fig. 3～Fig. 8, it is illustrated that as four maintaining parts (electronic unit guarantor in inspection portion
Hold portion) in one, it addition, diagram delivery section four hand unit in one.It addition,
In Fig. 3～Fig. 8, maintaining part eliminates the figure of the probe etc. of termination contact with electronic unit
Show.
Inspection device (electronic component inspection device) 1 shown in Fig. 1 is e.g. used for checking, surveying
Examination (hereinafter referred merely to as " checking ") BGA (Ball Grid Array: BGA) encapsulation,
The IC device of LGA (Land Grid Array: contact array) encapsulation etc., LCD (Liquid
Crystal Display: liquid crystal display), CIS (CMOS Image Sensor:CMOS scheme
As sensor) etc. the device of electrical characteristics of electronic unit.Additionally, it is following for purposes of illustration only, represent
Property ground explanation use the situation of IC device as the above-mentioned electronic unit being intended to carry out checking, and by it
It is set to " IC device 9 ".And, below as this IC device 9, enter as a example by BGA package
Row explanation.
First, IC device 9 is illustrated.
As shown in Fig. 5～Fig. 8, IC device 9 is BGA package, have main part 91 and
It is arranged at multiple terminals (electrode) 92 of the outside of main part 91.Although not to main part 91
Shape is particularly limited, but the most plate-shaped, it addition, from its thickness direction (
From Z-direction under the state that IC device 9 is held in maintaining part 51) observe time be tetragon (ginseng
According to Fig. 4).Should illustrate, in the present embodiment, this tetragon is square (or rectangle).
In Fig. 5 of main part 91, the face of downside is terminal arrangement face 93, and multiple terminals 92 are at this end
Sub-configuration face 93 is configured to clathrate (rectangular).It addition, each terminal 92 is hemispherical weldering
Ball.Additionally, the shape of each terminal 92 is not limited to hemispherical certainly.
It follows that to checking that device 1 illustrates.
As it is shown in figure 1, check that device 1 possesses conveyer device (electronic component handling apparatus) 10.
This conveyer device 10 has the carrying out the as shown in Figure 4 detent mechanism to the location of IC device 9
100。
That is, check that device 1 has supply unit 2, supply side aligning section 3, delivery section 4, inspection portion
5, reclaim side aligning section 6, recoverer 7 and carry out the control portion 8 of control in these each portions.
It addition, check that device 1 has configuration supply unit 2, supply side aligning section 3, delivery section 4, checks
Portion 5, reclaim side aligning section 6 and the base station (Base) 11 of recoverer 7 and to receive supply
The mode of side aligning section 3, delivery section 4, inspection portion 5 and recovery side aligning section 6 covers at base
Lid 12 on platform 11.Additionally, the base station face 111 as the upper surface of base station 11 is nearly horizontal,
And be configured with on this base station face 111 supply side aligning section 3, delivery section 4, inspection portion 5 and
Reclaim the structure member of side aligning section 6.It addition, with the exception of this, check that device 1 can also basis
Needs have for heating the heater of IC device 9, combustor etc..
Such inspection device 1 is configured to supply unit 2 and supplies IC device 9 to supply side aligning section 3,
Supply side aligning section 3 arranges the IC device 9 being supplied to, and delivery section 4 is by the IC device after arrangement
9 are delivered to inspection portion 5, and inspection portion 5 checks the IC device 9 carried, and delivery section 4 will terminate
The IC device 9 checked carries/arranges to reclaiming side aligning section 6, and recoverer 7 reclaims arrangement
To the IC device 9 reclaiming side aligning section 6.According to such inspection device 1, it is possible to automatically
Carry out the supply of IC device 9, check, reclaim.Should illustrate, in checking device 1, by
Supply unit 2, supply side aligning section 3, delivery section 4, the part in inspection portion 5, the arrangement of recovery side
Portion 6, recoverer 7 and control portion 8 etc. constitute conveyer device 10.Conveyer device 10 carries out IC
The conveying of device 9, the IC device 9 carried out by detent mechanism 100 holding to inspection portion 5
The location etc. in portion 51.
Hereinafter, the structure of delivery section 4, inspection portion 5 and detent mechanism 100 is illustrated.
Delivery section
As in figure 2 it is shown, delivery section 4 is to be arranged in the mounting action platform 341 of supply side aligning section 3
On IC device 9 be delivered to inspection portion 5, and the IC device of inspection that will finish by inspection portion 5
Part 9 is delivered to reclaim the unit of side aligning section 6.Such delivery section 4 has spindle moving part (shuttle)
41, supply mechanical hand (Robot) 42, inspection mechanical hand 43 and recovery mechanical hand 44.
Spindle moving part
Spindle moving part 41 is for the IC device 9 on mounting action platform 341 is delivered to inspection portion 5
Vicinity, and by checked by inspection portion 5 check complete IC device 9 be delivered to
Reclaim the spindle moving part of the vicinity of side aligning section 6.At such spindle moving part 41, arrange in the X direction
Row are formed with four and (keep for receiving the groove (Pocket) being made up of recess of IC device 9
Portion) 411.It addition, spindle moving part 41 is guided by linear motion guiding piece, it is possible to pass through linear motor
Move back and forth in the X direction in driving source.
Supply mechanical hand
Supply mechanical hand 42 is that the IC device 9 being arranged on mounting action platform 341 is delivered to shuttle
The mechanical hand of moving part 41.Such supply mechanical hand 42 has the bearing support supported by base station 11
421, it is supported by frame 421 to support and can move back and forth in the Y direction relative to bearing support 421
Movable stand 422 and four hand unit (holding mechanical hand) of being supported by movable stand 422
423.Each hand unit 423 possesses elevating mechanism and adsorption mouth, it is possible to held by absorption
IC device 9.
Check mechanical hand
Check that mechanical hand 43 is to the IC device 9 of spindle moving part 41 to inspection portion 5 conveying storage
(with reference to Fig. 5～Fig. 7), and the IC device 9 finishing to check is delivered to shuttle from inspection portion 5 moves
The mechanical hand of part 41.Push it addition, check mechanical hand 43 also to be able to when checking to inspection portion 5
IC device 9, applies the inspection pressure (with reference to Fig. 8) of regulation to IC device 9.Such inspection machine
Tool hands 43 have supported by base station 11 bearing support 431, be supported by frame 431 and support and can phase
Movable stand 432 that bearing support 431 is moved back and forth in the Y direction and by movable stand 432
Four hand unit (holding mechanical hand) (electronic unit handle part) 433 of supporting.
Each hand unit 433 possesses elevating mechanism and adsorption mouth 434 (with reference to Fig. 5), it is possible to logical
Cross absorption and hold (holding) IC device 9.Each hand unit 433 is identical, so below, right
One of them illustrates.
Hand unit 433 when Z-direction (vertical) is observed in following inspection portion 5
The shape of recess 55 correspondence of maintaining part 51.Specifically, hand unit 433 is seen from Z-direction
It is tetragon when examining, and more slightly smaller than the inner peripheral portion of recess 55.Additionally, in the present embodiment,
This tetragon is square (or rectangle).This hand unit 433 is arranged in and makes IC device 9
Relative to maintaining part 51 in the position of the distance of regulation when falling into the recess 55 to maintaining part 51,
Thereby, it is possible to cover recess 55 (with reference to Fig. 5～Fig. 8) by hand unit 433.
The not shown body being connected with suction pump is had, by this it addition, connect in adsorption mouth 434
IC device 9 is adsorbed in the action of suction pump.Additionally, the driving of suction pump is controlled by controlling portion 8
System.
Reclaim mechanical hand
Reclaiming mechanical hand 44 is to be delivered to back by the IC device 9 of the inspection finished by inspection portion 5
Receive the mechanical hand of side aligning section 6.Such recovery mechanical hand 44 has by propping up that base station 11 supports
Bolster 441, it is supported by frame 441 and supports and can be the most reciprocal relative to bearing support 441
The movable stand 442 of movement and four hand unit supported by movable stand 442 (hold machinery
Hands) 443.Each hand unit 443 possesses elevating mechanism and adsorption mouth, it is possible to come by absorption
Hold IC device 9.
Such delivery section 4 carries IC device 9 as follows.First, spindle moving part 41 is to figure
Middle left side is moved, and the IC device 9 on mounting action platform 341 is delivered to shuttle by supply mechanical hand 42
Moving part 41 (STEP1).It follows that spindle moving part 41 is to central mobile, check that mechanical hand 43 will
IC device 9 on spindle moving part 41 is delivered to inspection portion 5 (STEP2).It follows that inspection machine
The IC device 9 of the inspection finished by inspection portion 5 is delivered to spindle moving part 41 by tool hands 43
(STEP3).It follows that spindle moving part 41 right side in figure is mobile, reclaim mechanical hand 44 by shuttle
The complete IC device 9 of inspection on moving part 41 is delivered to reclaim side aligning section 6.By repeatedly this
STEP1～STEP3 of sample, it is possible to be delivered to reclaim side row via inspection portion 5 by IC device 9
Row portion 6.
Above, the structure of delivery section 4 is illustrated, but as the structure of delivery section 4, if
IC device 9 on mounting action platform 341 can be delivered to inspection portion 5, and inspection will be finished
The IC device 9 looked into is delivered to reclaim side aligning section 6, is not particularly limited.The most also may be used
To omit spindle moving part 41, and utilize supply mechanical hand 42, check mechanical hand 43 and reclaim machinery
Any one mechanical hand of hands 44 carry out from mounting action platform 341 to the conveying in inspection portion 5,
And from inspection portion 5 to the conveying reclaiming side aligning section 6.
Inspection portion
Inspection portion 5 is the unit checking, testing the electrical characteristics of IC device 9.As in figure 2 it is shown,
Inspection portion 5 has four maintaining parts 51 of configuration IC device 9.In these maintaining parts 51 respectively
It is provided with the multiple probes (not shown) electrically connected with the terminal of IC device 9.Each probe and control
Portion 8 electrically connects.When the inspection of IC device 9, an IC device 9 configures (holding) in one
Individual maintaining part 51.It is configured at each terminal 92 of IC device 9 of maintaining part 51 respectively by checking
The pressing of the hand unit 433 of mechanical hand 43 and be urged to each probe with the inspection pressure of regulation.
Thus, each terminal 92 of IC device 9 electrically connects (contact) with each probe, carries out via probe
The inspection of IC device 9.The inspection of IC device 9 is carried out based on the program being stored in control portion 8.
Additionally, for maintaining part 51, followed by narration in detail.
Control portion
Control portion 8 such as has inspection control portion and drive control part.Check control portion such as based on
The program being stored in not shown memorizer carries out being configured at the IC device 9 in inspection portion 5
The inspections of electrical characteristics etc. control.It addition, drive control part such as controls supply unit 2, supply side row
Each portion of row portion 3, delivery section 4, inspection portion 5, recovery side aligning section 6 and recoverer 7 drives
Dynamic, carry out the conveying of IC device 9, IC device 9 and control to the location of maintaining part 51 etc..
Detent mechanism
It follows that detent mechanism 100 is illustrated, but the four of inspection portion 5 maintaining parts 51
Each detent mechanism 100 identical, so below one of them being illustrated.
As shown in Fig. 3～Fig. 8, detent mechanism 100 possesses the maintaining part with maintaining part main body 510
51, two bodys 135 and 136, two valves 145 and 146, two pumps 155 and
156 and hand unit 433.The inner chamber of body 135 and 136 is air G (fluid) stream
Dynamic stream.Additionally, body 135 and 136 is inserted into the following of maintaining part main body 510
The position (one end) in wall portion 53 be to maintain the structural elements in portion 51.That is, by maintaining part master
The positions (one end) being inserted into wall portion 53 of body 510 and body 135 and 136 etc. are constituted
Keep the maintaining part 51 of IC device 9.
As shown in Fig. 5～Fig. 8, maintaining part main body 510 possesses: have the guarantor keeping IC device 9
Hold the substrate 54 in face (electronic unit holding face) 52 and to surround holding face 52 on substrate
The wall portion 53 that mode is arranged.Should illustrate, keep face 52 parallel with X/Y plane.
It addition, the shape in wall portion 53 is not particularly limited, but in the present embodiment, wall
The portion 53 frame-shaped in tetragon, and it is formed at the peripheral part of substrate 54.That is, observe from Z-direction
Time, the shape of the inner surface in wall portion 53 and the shape of outer surface are respectively tetragon.Additionally,
In the present embodiment, this tetragon is square or rectangle.Thus, in maintaining part main body
Being formed on 510 when Z-direction is observed is the recess 55 of tetragon.The bottom surface of this recess 55 is for protecting
Hold face 52.
It addition, relative to keeping face 52 to erect four faces that is first wall the 553, second wall arranged
Face the 554, the 3rd wall 555 and the 4th wall 556 constitute the inner surface of recess 55.First wall
The wall adjoined of face 553～the 4th wall 556 is the most orthogonal.And, the first wall 553
With the first corner 551 of the second wall 554 form right angle, the 3rd wall 555 and the 4th wall 556
It is arranged in and the position at the first diagonal angle, corner 551, and the second corner 552 of form right angle.At this
In embodiment, as shown in Figure 4, by the corner 94 in four corners of IC device 9 with
First corner 551 collision abuts and positions.Like this, in maintaining part 51, first jiao
The datum mark that portion 551 is set to carry out the location to IC device 9 in this maintaining part 51 is (fixed
Position portion).
The inclined plane 531 that inner side is lower than outside it is formed with on the top of the inner peripheral portion in wall portion 53.Thus,
When IC device 9 is configured at maintaining part 51, easily IC device 9 is inserted along inclined plane 531
Enter to recess 55, and be arranged on holding face 52.
The one end of body 135,136 is had it addition, connect in the wall portion 53 of maintaining part main body 510.
In the case of Gai, the one end of body 135,136 be respectively arranged at the diagonal angle of tetragon.And,
The opening (peristome) 1351 of the one end of body 135 is configured at the first corner 551 and opens,
The opening (peristome) 1361 of the one end of body 136 is configured at the second corner 552 and opens.
In the present embodiment, by the position (one end) being inserted into wall portion 53 of body 135
Constitute first flow path, be made up of the position (one end) being inserted into wall portion 53 of body 136
Two streams.As shown in Figure 3, Figure 4, the flowing of the air G of flowing in first flow path is represented
Primary vector V1The most not orthogonal with the first wall 553 and the second wall 554.That is, first
Vector V1It is 45 ° with the first wall 553 angulation, primary vector V1With the second wall
554 angulations are also 45 °.It addition, represent the flowing of the fluid of flowing in second flow path
Secondary vector V2Also distinguish not orthogonal with the first wall 553 and the second wall 554.That is,
Secondary vector V2It is 45 ° with the first wall 553 angulation, secondary vector V2With the second wall
Face 554 angulation is also 45 °.As shown in Figure 6, by primary vector V1With second to
Amount V2Respectively like this towards identical direction, it is possible to easily make in the whereabouts of IC device 9
This IC device 9 moves the first side, corner 551 to the datum mark as location.
Should illustrate, IC device 9 vertical view be shaped as foursquare in the case of, first to
Amount V1It is 45 ° with the first wall 553 angulation, but the shape of the vertical view at IC device 9
In the case of the tetragon (such as rectangle) beyond square, primary vector V1With first
Wall 553 angulation is not 45 °, and is diagonal.
As shown in Figure 6, opening 1351,1361 is configured in and is held in maintaining part at IC device 9
Than terminal arrangement face 93 by below Z-direction under the state of 51.By such configuration, it is possible to logical
Crossing the air stream in recess 55 makes IC device 9 float, in the feelings of the location carrying out IC device 9
Under condition, it is possible to make IC device 9 move to the first side, corner 551 fully.
Additionally, in the present embodiment, opening 1351 closes with the position of the Z-direction of opening 1361
System is identical position, but is not limited to this, it is also possible to be different positions.In this case,
Preferably opening 1361 is positioned at above Z-direction than opening 1351.This structure is to be intended to IC device
Effective structure in the case of 9 sides, holding face 52 being urged to recess 55.
It addition, opening 1351 is the most identical with the size of opening 1361, but not
It is defined in this, it is also possible to different.In such a situation it is preferred that opening 1351 is less than opening 1361.
It addition, as shown in Figure 3, Figure 4, it is also possible to by the internal diameter in the downstream of body 135,136
Reduce.
Connect in the other end different from one end of body 135 and have pump 155.It addition, at pipe
The midway of body 135 is provided with valve 145.On the other hand, different from one end at body 136
The other end connect have pump 156.It addition, be provided with valve 146 in the midway of body 136.
Pump 156 is the ejection section of injection air G, and pump 155 is the suction unit attracting air G.If it is logical
The action crossing pump 156 sprays air G from pump 156, then this air G flows in body 136,
And spray to recess 55 from opening 1361.If it addition, by the action of pump 155, pump 155
Attract air G, then the air G in recess 55 is attracted (discharge) from opening 1351, this sky
Gas G flows in body 135 and is expelled to outside.Furthermore it is possible to by the pump of injection air G
Source is produced instead of the compressed air such as compressor, gas cylinder.
It addition, the captivation maximum obtained by opening 1351 exceedes atmospheric pressure, with recess 55
Holding face 52 is unrelated with the size of the friction of IC device 9, it is possible to carry out this IC device 9
Location.
It addition, the inner chamber of opening and closing body 135 can be carried out by the opening and closing of valve 145, it is possible to pass through
The opening and closing of valve 146 carrys out the inner chamber of opening and closing body 136.It addition, as valve 145,146, if
Use can adjust the valve of its aperture, then can be adjusted at body by the adjustment of above-mentioned aperture
135, the flow of the air G of 136 interior flowings.I.e., it is possible to by the tune of the aperture of valve 146
The whole injection pressure adjusting air G or injection flow.It addition, can opening by valve 145
The adjustment of degree adjusts the suction pressure of air G or attracts flow.Therefore, it is made up of valve 146
Adjust injection pressure or the adjustment portion of injection flow of air G, it addition, constituted tune by valve 145
The suction pressure of whole air G or the adjustment portion of attraction flow.
Additionally, the injection pressure of air G can be identical with the suction pressure of air G, it is also possible to different.
In the case of the injection pressure of air G is different from the suction pressure of air G, the preferably spray of air G
The suction pressure penetrating pressure ratio air G is big.
It addition, also be able to be adjusted at body 135,136 by the output of adjustment pump 155,156
The flow of the air G of interior flowing.Additionally, controlled pump 155,156 and valve by control portion 8
145, the driving of 146.
It follows that the action to being positioned by IC device 9 in the case of maintaining part 51 illustrates.
First, as it is shown in figure 5, keep IC device 9 by hand unit 433, and by this IC
Device 9 is inserted into the position of the regulation in the recess 55 of maintaining part 51.In the present embodiment,
The bottom making hand unit 433 is arranged in the upper end in recess 55, and makes hand unit 433
Stop.Thus, recess 55 is covered by this hand unit 433.Thereby, it is possible to suppression air G
From recess 55 internal leakage, fly from recess 55 it addition, be prevented from IC device 9 because of air stream
Go out.
It follows that as shown in Figure 6, discharge IC device 9 from hand unit 433, i.e., make it take off
From.Thus, IC device 9 starts free-falling in recess 55.It addition, as it has been described above, companion
With the hand unit 433 release movement to IC device 9, i.e. Tong Bu with release movement, from body
136 ejection air G, and attract air G from body 135.Thus, IC device 9 times
When falling, air G is to the direction flowing different from the direction that IC device 9 falls, i.e. air G
Even if pushing IC device 9 IC device 9 towards the first corner 551 to towards the first side, corner 551
The direction flowing of side shifting.And, IC device 9 in free-falling by air stream (blast)
It is urged to the first side, corner 551 and makes its corner 94 and the first corner 551 collide, and keep being somebody's turn to do
State ground arrives holding face 52.By above-mentioned action, the location of IC device 9 is terminated (with reference to figure
7)。
Like this, in maintaining part 51, when carrying out the location to IC device 9, at IC device
In the whereabouts of part 9, make to pass through the stream of the air G in the direction in the first corner 551 towards air G
Movable property is raw, thereby, it is possible to make IC device 9 successfully move the datum mark to location.Thus,
Easily carry out the location of IC device 9.
Additionally, as it is shown in fig. 7, preferably the flowing of such air G is at least maintained to IC device
Till part 9 is configured on holding face 52.
It addition, as described above, IC device 9 is floated because of the air stream in recess 55.By
This, it is possible to strive for the hang time of IC device 9, thus, it is possible to make IC device 9 lean on fully
By to the first corner 551, contribute to the location of IC device 9.
It follows that as shown in Figure 8, hand unit 433 is made to decline from the state shown in Fig. 7, and
IC device 9 is pressed downwards by this hand unit 433.By pressing of this hand unit 433
Pressure, each terminal 92 of IC device 9 electrically connects with each probe.Afterwards, IC device 9 is carried out
Check.
(the second embodiment)
Fig. 9 is that to represent that the electronic component inspection device (the second embodiment) of the present invention possesses defeated
Send the horizontal cross of the maintaining part in portion.
Hereinafter, with reference to this figure, electronic component handling apparatus and the electronic unit inspection of the present invention are filled
The second embodiment put illustrates, but enters centered by the difference with above-mentioned embodiment
Row explanation, for identical item, the description thereof will be omitted.
In addition to the equipping position difference of detent mechanism, present embodiment and above-mentioned first embodiment party
Formula is identical.
As it is shown in figure 9, in the present embodiment, it is unchecked that detent mechanism 100 is arranged in holding
IC device 9 also moves it to the vicinity in inspection portion 5, and keeps checking complete IC device 9
And move it to reclaim on the spindle moving part 41 of the vicinity of side aligning section 6.Spindle moving part 41 each recessed
Detent mechanism 100 in groove (Pocket) 411 is identical, so saying one of them below
Bright.
Detent mechanism 100 is connected with spindle moving part 41, and has two bodys connected with groove 411
165 and 166, two valves 175 and 176 and two pumps 185 and 186.Body
The inner chamber of 165 is the first flow path attracting air G, and the inner chamber of body 166 is ejection air G
Second flow path.
When Z-direction is observed, groove 411 square (or rectangle), by as recessed
The first corner 417 that first wall 413 of the inner surface of groove 411 and the second wall 414 are constituted is joined
It is equipped with the opening 1651 of body 165.It addition, by the 3rd wall of the inner surface as groove 411
The second corner 418 that face 415 and the 4th wall 416 are constituted is configured with the opening 1661 of body 166.
Should illustrate, in spindle moving part 41, the first corner 417 is set to carry out in groove 411
Datum mark (location division) to the location of IC device 9.
And, represent the primary vector V of the flowing of the air G of flowing in first flow path1With
One wall 413 angulation is 45 °, primary vector V1With the second wall 414 formed by angle
Degree is also 45 °.It addition, represent the secondary vector of the flowing of the fluid of flowing in second flow path
V2It is 45 ° with the first wall 413 angulation, secondary vector V2With the second wall 414 institute
The angle become also is 45 °.
Should illustrate, IC device 9 vertical view be shaped as foursquare in the case of, first to
Amount V1It is 45 ° with the first wall 413 angulation, but the shape of the vertical view at IC device 9
In the case of the tetragon (such as rectangle) beyond square, primary vector V1With first
Wall 413 angulation is not 45 °, and becomes diagonal.
Even if as it has been described above, by the detent mechanism 100 being configured at spindle moving part 41, it is also possible to
One embodiment almost universally, in the IC device 9 whereabouts in groove 411, easily
This IC device 9 is made to move the first side, corner 417 to the datum mark as location.Thus, energy
Enough location easily carried out IC device 9.
(the 3rd embodiment)
Figure 10 is that the electronic component inspection device (the 3rd embodiment) representing the present invention possesses
The horizontal cross of the maintaining part in inspection portion.
Hereinafter, with reference to this figure, electronic component handling apparatus and the electronic unit inspection of the present invention are filled
The 3rd embodiment put illustrates, but enters centered by the difference with above-mentioned embodiment
Row explanation, for identical item, the description thereof will be omitted.
In addition to the structure difference of detent mechanism, present embodiment and above-mentioned first embodiment phase
With.
As shown in Figure 10, in the present embodiment, detent mechanism 100 has with maintaining part 51 even
131,132,133 and 134, four valves 141,142,143 of four bodys connect and
144 and four pumps 151,152,153 and 154.The inner chamber of body 131～134 is air
The stream that (fluid) flows.It addition, the opening (peristome) of the one end of body 131～134
1311,1321,1331,1341 inner surfacies in wall portion 53 are open.Additionally, by body 131
The position (one end) being inserted into wall portion 53 constitute first flow path, by the insertion of body 132
Position (one end) to wall portion 53 constitutes another first flow path.It addition, by body 133
The position (one end) being inserted into wall portion 53 constitute second flow path, by the insertion of body 134
Position (one end) to wall portion 53 constitutes another second flow path.
In the present embodiment, the one end of body 131 and 132 is arranged in the of recess 55
The vicinity in one corner 551, the one end of body 133 and 134 is arranged in the second of recess 55
The vicinity in corner 552.Further, the one end of body 131 and the inner surface constituting recess 55
First wall 553 is orthogonal, the one end of body 132 and the second of the inner surface constituting recess 55
Wall 554 is orthogonal, the 3rd wall of the inner surface of the one end of body 133 and composition recess 55
555 is orthogonal, the 4th wall 556 of the inner surface of the one end of body 134 and composition recess 55
Orthogonal.
Thus, expression is at the primary vector V of the flowing of the fluid of the one end flowing of body 1311
With the primary vector V of flowing representing the fluid flowed at the one end of body 1321Formed angle
Degree is 90 °.Thus, vector obtained by the vector of synthesis both sides is for making IC device 9 towards first
The vector in the direction in corner 551.It addition, represent the fluid of the one end flowing at body 133
The secondary vector V of flowing2With the flowing representing the fluid flowed at the one end of body 134 the
Two vector V2Angulation is 90 °.Thus, vector obtained by the vector of synthesis both sides is also
Make IC device 9 towards the vector in the direction in the first corner 551.
By the detent mechanism 100 making such vector produce, identical with the first embodiment, energy
IC device 9 in enough causing to fall and break moves the first side, corner 551 to the datum mark as location,
Therefore, it is possible to easily carry out the location to IC device 9.
Additionally, in detent mechanism 100, the path direction of the one end of body 131 and body 132
The path direction of one end intersect, it addition, the path direction of the one end of body 133 with
The path direction of the one end of body 134 is intersected.That is, the one end at body 131 is represented
The primary vector V of the flowing of the fluid of flowing1Stream with the one end flowing represented at body 132
The primary vector V of the flowing of body1Angulation is not 0 ° and 180 °, represents at pipe
The secondary vector V of the flowing of the fluid of the one end flowing of body 1332With expression at body 134
The secondary vector V of the flowing of the fluid of one end flowing2Angulation is not 0 ° and 180 °
?.
Above, based on embodiment illustrated to the electronic component handling apparatus of the present invention and electronics
Parts check that device is illustrated, but the present invention is not limited to this, it is possible to will constitute the ministry of electronics industry
Each portion of part conveyer device and electronic component inspection device is replaced into and can play identical function
Each portion of arbitrary structure.Alternatively, it is also possible to additional arbitrary works.
It addition, the electronic component handling apparatus of the present invention and electronic component inspection device can also be
The device of structure (feature) more than any two being combined with in the respective embodiments described above.
It addition, certainly, the configuration quantity of the groove of spindle moving part and configuration mode, supply mechanical hand
The configuration quantity of hand unit and configuration mode, the configuration number of hand unit of inspection mechanical hand
Amount and configuration mode, the configuration quantity of hand unit of recovery mechanical hand and configuration mode, with
And the configuration quantity of the maintaining part in inspection portion and configuration mode are not limited to the knot shown in Fig. 2
Structure.
It addition, in the respective embodiments described above, electronic unit maintaining part is for having first flow path and
The structure of the both sides of two streams, but it is not limited to this, it is also possible to for eliminating the knot of second flow path
Structure.
It addition, in the respective embodiments described above, employ air as fluid, but in the present invention,
It is not limited to this, such as, can apply nitrogen, argon, carbon dioxide, fluorine type gas, include
The gases such as the various insulating properties gas such as the mixed gas of these gases.
Symbol description: 1 ... inspection device, 10 ... conveyer device, 100 ... detent mechanism, 11 ... base
Platform, 111 ... base station face, 12 ... lid, 2 ... supply unit, 3 ... supply side aligning section, 341 ... mounting
Action platform, 4 ... delivery section, 41 ... spindle moving part, 411 ... groove, 413 ... the first wall, 414 ...
Second wall, 415 ... the 3rd wall, 416 ... the 4th wall, 417 ... the first corner, 418 ... the
Two corners, 42 ... supply mechanical hand, 421 ... bearing support, 422 ... movable stand, 423 ... hand list
Unit, 43 ... inspection mechanical hand, 431 ... bearing support, 432 ... movable stand, 433 ... hand unit,
434 ... adsorption mouth, 44 ... recovery mechanical hand, 441 ... bearing support, 442 ... movable stand, 443 ... hands
Portion's unit, 5 ... inspection portion, 51 ... maintaining part, 510 ... maintaining part main body, 52 ... holding face, 53 ...
Wall portion, 531 ... inclined plane, 54 ... substrate, 55 ... recess, 551 ... the first corner, 552 ... the
Two corners, 553 ... the first wall, 554 ... the second wall, 555 ... the 3rd wall, 556 ... the 4th
Wall, 6 ... recovery side aligning section, 7 ... recoverer, 8 ... control portion, 9 ... IC device, 91 ... main
Body, 92 ... terminal, 93 ... terminal arrangement face, 94 ... corner, 131,132,133,134,
135,136,165,166 ... body, 1311,1321,1331,1341,1351,1361,
1651,1661 ... opening, 141,142,143,144,145,146,175,176 ... valve,
151,152,153,154,155,156,185,186 ... pump, G ... air, V1... first
Vector, V2... secondary vector.
Claims (9)
1. an electronic component handling apparatus, it is characterised in that possess:
Electronic unit handle part, it holds electronic unit；And
Electronic unit maintaining part, it keeps described electronic unit,
It is formed with the stream that fluid flows through in described electronic unit maintaining part,
Discharge described electronic unit at described electronic unit handle part and make described electronic unit fall
Time, described fluid is to the direction flowing different from the direction that described electronic unit falls.
Electronic component handling apparatus the most according to claim 1, it is characterised in that
It is provided with in described electronic unit maintaining part
Recess；And
Location division, it is configured at described recess, and this location division is abutted with it by described electronic unit
Carry out the location to described electronic unit,
When described electronic unit handle part discharges described electronic unit and makes described electronic unit fall,
Described fluid is to the direction flowing making described electronic unit move to described location division.
3. according to the electronic component handling apparatus described in claims 1 or 2, it is characterised in that
Described electronic unit maintaining part has the first wall and the second wall constituting the first corner,
Described first wall is orthogonal with described second wall,
Described electronic unit maintaining part has and is configured at described first corner and described fluid flows through
First flow path,
Represent that the primary vector of the flowing of the described fluid of flowing is the most not in described first flow path
Orthogonal with described first wall and described second wall.
Electronic component handling apparatus the most according to claim 3, it is characterised in that
Described electronic unit maintaining part has the 3rd wall and the 4th wall constituting the second corner,
Described second corner is arranged in and the position at described first diagonal angle, corner,
Described electronic unit maintaining part has and is configured at described second corner and described fluid flows through
Second flow path,
Represent that the secondary vector of the flowing of the described fluid of flowing is the most not in described second flow path
Orthogonal with described first wall and described second wall.
Electronic component handling apparatus the most according to claim 4, it is characterised in that
The suction unit attracting described fluid is had in the connection of described first flow path,
The ejection section spraying described fluid is had in the connection of described second flow path.
6. according to the electronic component handling apparatus described in claim 4 or 5, it is characterised in that
Described electronic unit possesses main part and is arranged at multiple terminals of described main part,
The described electronic unit that is configured at least partially of the peristome of described second flow path keeps
Than the end being configured with described terminal of described main part under the state of described electronic unit maintaining part
Sub-configuration face is by below vertical.
7., according to the electronic component handling apparatus described in any one in claim 1～6, it is special
Levy and be,
Described electronic unit maintaining part keeps described electronics in the case of checking described electronic unit
Parts.
8., according to the electronic component handling apparatus described in any one in claim 1～7, it is special
Levy and be,
Described electronic unit maintaining part keeps described electronic unit and is moved to the place of regulation.
9. an electronic component inspection device, it is characterised in that possess:
Electronic unit handle part, it holds electronic unit；
Electronic unit maintaining part, it keeps described electronic unit；And
Inspection portion, it checks described electronic unit,
It is formed with the stream that fluid flows through in described electronic unit maintaining part,
Discharge described electronic unit at described electronic unit handle part and make described electronic unit fall
Time, described fluid is to the direction flowing different from the direction that described electronic unit falls.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014200023A JP2016070777A (en) | 2014-09-30 | 2014-09-30 | Electronic component conveyance device and electronic component inspection device |
| JP2014-200023 | 2014-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106185301A true CN106185301A (en) | 2016-12-07 |
Family
ID=55789819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510243783.0A Pending CN106185301A (en) | 2014-09-30 | 2015-05-13 | Electronic component handling apparatus and electronic component inspection device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016070777A (en) |
| KR (1) | KR101667312B1 (en) |
| CN (1) | CN106185301A (en) |
| TW (1) | TWI597226B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108414850A (en) * | 2017-01-30 | 2018-08-17 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| CN108508345A (en) * | 2017-02-28 | 2018-09-07 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN109581182A (en) * | 2017-09-29 | 2019-04-05 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| CN110045160A (en) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | A kind of test bench that the top of BGA package picks and places |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107686002A (en) * | 2016-08-05 | 2018-02-13 | 台湾暹劲股份有限公司 | Position correction mechanism and its implement of application |
| US11293976B1 (en) * | 2020-09-25 | 2022-04-05 | Essai, Inc. | Integrated circuit device test tooling with dual angle cavities |
| TWI742934B (en) * | 2020-11-20 | 2021-10-11 | 漢民測試系統股份有限公司 | Probing system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19750949B4 (en) * | 1996-11-18 | 2004-04-15 | Advantest Corp. | Test handling device for horizontal transport |
| JP2006017738A (en) * | 2005-07-28 | 2006-01-19 | Seiko Epson Corp | Socket for semiconductor device inspection apparatus |
| WO2009118855A1 (en) * | 2008-03-27 | 2009-10-01 | 株式会社アドバンテスト | Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature |
| JP2009288086A (en) * | 2008-05-29 | 2009-12-10 | Yokogawa Electric Corp | Semiconductor tester |
| JP2012122774A (en) * | 2010-12-06 | 2012-06-28 | Sharp Corp | Test socket |
| JP2013234912A (en) * | 2012-05-09 | 2013-11-21 | Seiko Epson Corp | Socket guide, handler, and component inspection device |
| CN203545064U (en) * | 2013-09-05 | 2014-04-16 | 产台股份有限公司 | Blowback separation device for materials |
| CN104064507A (en) * | 2013-03-18 | 2014-09-24 | 三星电子株式会社 | Ray For Aligning Semiconductor Packages And Test Handler Using Same, And Method Of Aligning Semiconductor Packages And Test Method Using Same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10300815A (en) * | 1997-04-25 | 1998-11-13 | Nec Kansai Ltd | Inspection device of electronic parts |
| JPH11198988A (en) | 1998-01-12 | 1999-07-27 | Murata Mfg Co Ltd | Storage tool |
| US6472891B1 (en) * | 2000-08-10 | 2002-10-29 | Advanced Micro Devices, Inc. | Method and apparatus for testing semiconductor packages without damage |
| JP2002181887A (en) * | 2000-12-12 | 2002-06-26 | Advantest Corp | Testing device for electronic component |
-
2014
- 2014-09-30 JP JP2014200023A patent/JP2016070777A/en active Pending
-
2015
- 2015-04-03 KR KR1020150047200A patent/KR101667312B1/en active IP Right Grant
- 2015-05-13 CN CN201510243783.0A patent/CN106185301A/en active Pending
- 2015-09-25 TW TW104131907A patent/TWI597226B/en not_active IP Right Cessation
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19750949B4 (en) * | 1996-11-18 | 2004-04-15 | Advantest Corp. | Test handling device for horizontal transport |
| JP2006017738A (en) * | 2005-07-28 | 2006-01-19 | Seiko Epson Corp | Socket for semiconductor device inspection apparatus |
| WO2009118855A1 (en) * | 2008-03-27 | 2009-10-01 | 株式会社アドバンテスト | Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature |
| JP2009288086A (en) * | 2008-05-29 | 2009-12-10 | Yokogawa Electric Corp | Semiconductor tester |
| JP2012122774A (en) * | 2010-12-06 | 2012-06-28 | Sharp Corp | Test socket |
| JP2013234912A (en) * | 2012-05-09 | 2013-11-21 | Seiko Epson Corp | Socket guide, handler, and component inspection device |
| CN104064507A (en) * | 2013-03-18 | 2014-09-24 | 三星电子株式会社 | Ray For Aligning Semiconductor Packages And Test Handler Using Same, And Method Of Aligning Semiconductor Packages And Test Method Using Same |
| CN203545064U (en) * | 2013-09-05 | 2014-04-16 | 产台股份有限公司 | Blowback separation device for materials |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108414850A (en) * | 2017-01-30 | 2018-08-17 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| CN108508345A (en) * | 2017-02-28 | 2018-09-07 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN109581182A (en) * | 2017-09-29 | 2019-04-05 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| CN110045160A (en) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | A kind of test bench that the top of BGA package picks and places |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI597226B (en) | 2017-09-01 |
| JP2016070777A (en) | 2016-05-09 |
| KR101667312B1 (en) | 2016-10-18 |
| KR20160038690A (en) | 2016-04-07 |
| TW201612090A (en) | 2016-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106185301A (en) | Electronic component handling apparatus and electronic component inspection device | |
| CN106185259B (en) | Electronic component handling apparatus and electronic component inspection device | |
| KR100857580B1 (en) | Visual inspection apparatus and carrier for visual inspection apparatus | |
| CN101801645B (en) | Bonding substrate manufacturing apparatus and bonding substrate manufacturing method | |
| CN103112719B (en) | Floating transportation device | |
| CN101743480A (en) | An improved ball mounting apparatus and method | |
| CN101107186A (en) | Stage apparatus and application processing apparatus | |
| CN101295661A (en) | Substrate attracting device and substrate transfer apparatus | |
| CN108008278A (en) | Robot system | |
| US20130015166A1 (en) | Laser processing machine | |
| CN105101772B (en) | Electronic component mounting apparatus | |
| KR20010075601A (en) | Method and apparatus for placing solder balls on a substrate | |
| CN106233828A (en) | Position correcting apparatus and possess its electronic component carrying device | |
| CN107176450A (en) | Electronic unit conveyer and electronic component inspection device | |
| CN103987244B (en) | Electronic component mounting apparatus and electronic component mounting method | |
| CN105905600A (en) | Electronic component conveying apparatus and electronic component inspecting device | |
| TW201814295A (en) | Electronic parts conveying device and electronic parts inspection device in which terminals of each electronic parts uniformly abuts against the respective terminals of the inspection unit when electrical inspection is being performed | |
| TW201420207A (en) | Apparatus for spreading paste | |
| CN103997882B (en) | Electronic part feeder, electronic component mounting apparatus and electronic component supply method | |
| CN106660213B (en) | Inspection method | |
| TWI686277B (en) | Electronic parts conveying device and electronic parts inspection device | |
| TWI706140B (en) | Electronic component conveying device and electronic component inspection device | |
| CN103159028B (en) | Floating transfer unit | |
| JPH08242070A (en) | Solder ball mounting device and its solder ball supply device | |
| JP2017167019A (en) | Electronic component conveyance device, and electronic component inspection apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161207 |
|
| WD01 | Invention patent application deemed withdrawn after publication |