KR20160038690A - Electronic component transfer apparatus and electronic component inspection apparatus - Google Patents

Electronic component transfer apparatus and electronic component inspection apparatus Download PDF

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Publication number
KR20160038690A
KR20160038690A KR1020150047200A KR20150047200A KR20160038690A KR 20160038690 A KR20160038690 A KR 20160038690A KR 1020150047200 A KR1020150047200 A KR 1020150047200A KR 20150047200 A KR20150047200 A KR 20150047200A KR 20160038690 A KR20160038690 A KR 20160038690A
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KR
South Korea
Prior art keywords
electronic component
wall surface
holding portion
flow path
inspection
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KR1020150047200A
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Korean (ko)
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KR101667312B1 (en
Inventor
사토시 나카무라
하루히코 미야모토
Original Assignee
세이코 엡슨 가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays

Abstract

The electronic component inspecting apparatus includes a gripper for gripping an IC device and a holding portion for holding the IC device. A passage through which air flows is formed in the holding support portion. In this electronic component inspecting apparatus, air flows in a direction different from the direction in which the IC device falls when the IC device is dropped by releasing the IC device.

Description

TECHNICAL FIELD [0001] The present invention relates to an electronic component transporting apparatus and an electronic component inspecting apparatus.

The present invention relates to an electronic component carrying device and an electronic component testing device.

2. Description of the Related Art An electronic component inspecting apparatus for inspecting the electrical characteristics of an electronic component such as an IC device has been known in the past. The electronic component inspecting apparatus includes an electronic component (not shown) The conveying device is inserted. When the IC device is inspected, the IC device is disposed on the holding portion, and the IC device is positioned with respect to the holding portion, and a plurality of probe pins (electrodes) formed on the holding portion are brought into contact with the respective terminals of the IC device.

As such a positionable retention support portion, it is conceivable to use the retention tool described in Patent Document 1. This receptacle accommodates an IC device (workpiece), has a cavity formed in a rectangular shape in plan view, and has a suction hole (hole) opened toward the inside of the cavity. The suction holes are disposed at the corners of the quadrangle, and the suction holes can be sucked and positioned to cause the IC device to hit the corner. The timing for performing the positioning is performed after the IC device reaches the bottom surface of the cavity.

Japanese Patent Application Laid-Open No. 11-198988

However, in the case described in Patent Document 1, the attraction force obtained from the suction hole is at most about the atmospheric pressure, and there is a case where positioning can not be performed depending on the degree of the distance between the suction hole before positioning and the IC device Occurs.

An object of the present invention is to provide an electronic component carrying apparatus and an electronic component inspecting apparatus which can easily position the electronic component in the electronic component holding section.

This object is achieved by the present invention described below.

[Application Example 1]

An electronic component carrying apparatus of the present invention comprises an electronic component gripping section for gripping an electronic component,

And an electronic component holding portion for holding the electronic component,

A flow path through which fluid flows is formed in the electronic component holding portion,

And the fluid flows in a direction different from a direction in which the electronic component falls when the electronic component is dropped by the electronic component gripping portion releasing the electronic component.

Accordingly, when positioning the electronic component in the electronic component holding portion, the fluid can smoothly move to the position where the electronic component is positioned during the falling of the electronic component. By this movement, positioning of the electronic component is easily performed.

[Application example 2]

In the electronic component carrying apparatus of the present invention,

A concave portion,

A positioning portion which is disposed in the recess and in which the electronic component abuts and is positioned with respect to the electronic component,

It is preferable that the fluid flows in a direction in which the electronic component is moved to the positioning portion when the electronic component is falling by releasing the electronic component.

Accordingly, when positioning the electronic component in the electronic component holding portion, the fluid can smoothly move to the position where the electronic component is positioned during the falling of the electronic component. By this movement, the positioning of the electronic component can be performed more easily.

[Application Example 3]

In the electronic component carrying apparatus of the present invention, the electronic component holding section has a first wall surface and a second wall surface constituting the first corner portion,

Wherein the first wall surface and the second wall surface are orthogonal to each other,

Wherein the electronic component holding portion has a first flow path that is disposed in the first corner portion and through which the fluid flows,

It is preferable that the first vector representing the flow of the fluid flowing through the first flow path is not perpendicular to the first wall surface and the second wall surface.

Thus, the electronic component can be moved to a position where it is positioned during dropping of the electronic component.

[Application example 4]

In the electronic component transporting apparatus of the present invention, the electronic component holding section has a third wall surface and a fourth wall surface constituting a second corner portion arranged at a diagonal position from the first corner portion,

Wherein the electronic component holding portion has a second flow path disposed in the second corner portion and through which the fluid flows,

It is preferable that the second vector representing the flow of the fluid flowing through the second flow path is not orthogonal to the first wall surface and the second wall surface.

Thus, the electronic component can be moved to a position where it is positioned during dropping of the electronic component.

[Application Example 5]

In the electronic component carrying apparatus of the present invention, a suction unit for sucking the fluid is connected to the first flow path,

And the second flow path is connected to a jetting section for jetting the fluid.

Accordingly, when positioning the electronic component, it is possible to easily move the electronic component.

[Application Example 6]

In the electronic component carrying apparatus of the present invention, the electronic component includes a body portion and a plurality of terminals formed on the body portion,

It is preferable that at least a part of the opening portion of the second flow path is arranged downward in the vertical direction relative to the terminal arrangement surface on which the terminal of the main body portion is disposed in a state in which the electronic component is held by the electronic component holding portion.

Accordingly, when positioning the electronic component, the electronic component can be floated,

The electronic component can be easily moved.

[Application Example 7]

In the electronic component carrying apparatus of the present invention, it is preferable that the electronic component holding section holds the electronic component when the electronic component is inspected.

Thus, the electronic component can be stably inspected.

[Application Example 8]

In the electronic component transporting apparatus of the present invention, it is preferable that the electronic component holding section moves to a predetermined place by holding the electronic component.

Thus, for example, the total transportation time of the electronic component can be shortened as much as possible.

[Application Example 9]

An electronic component inspection apparatus of the present invention comprises an electronic component gripping section for gripping an electronic component,

An electronic component holding portion for holding the electronic component;

And an inspection unit for inspecting the electronic component,

A flow path through which fluid flows is formed in the electronic component holding portion,

And the fluid flows in a direction different from a direction in which the electronic component falls when the electronic component is dropped by the electronic component gripping portion releasing the electronic component.

Accordingly, when positioning the electronic component in the electronic component holding portion, the fluid can smoothly move to the position where the electronic component is positioned during the falling of the electronic component. By this movement, positioning of the electronic component is easily performed.

1 is a schematic view showing a first embodiment of an electronic component inspection apparatus according to the present invention.
Fig. 2 is a view showing the operation of each part of the electronic component inspection apparatus shown in Fig.
3 is a horizontal sectional view showing a holding portion of an inspection unit included in the electronic component inspection apparatus shown in Fig.
Fig. 4 is a horizontal sectional view showing a state in which an electronic component is positioned on a holding portion of an inspection portion included in the electronic component inspection apparatus shown in Fig. 1. Fig.
Fig. 5 is a vertical cross-sectional view for explaining the operation of the electronic component inspection apparatus shown in Fig. 1 until the positioning of the electronic component to the holding portion. Fig.
6 is a vertical cross-sectional view for explaining an operation of the electronic component inspection apparatus shown in Fig. 1 until the positioning of the electronic component to the holding portion.
Fig. 7 is a vertical cross-sectional view for explaining the operation up to the positioning of the electronic component to the holding portion in the electronic component testing apparatus shown in Fig. 1. Fig.
Fig. 8 is a vertical cross-sectional view for explaining the operation until the electronic component is positioned to the holding portion in the electronic component testing apparatus shown in Fig. 1. Fig.
9 is a horizontal cross-sectional view showing a holding portion of a carry section provided in an electronic component inspection apparatus (second embodiment) of the present invention.
10 is a horizontal sectional view showing a holding portion of an inspection unit included in the electronic component inspection apparatus (third embodiment) of the present invention.

(Mode for carrying out the invention)

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electronic component transporting apparatus and an electronic component inspecting apparatus of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings.

≪ First Embodiment >

1 is a schematic view showing a first embodiment of an electronic component inspection apparatus according to the present invention. Fig. 2 is a view showing the operation of each part of the electronic component testing apparatus shown in Fig. 1. Fig. Fig. 3 is a horizontal sectional view showing the holding portion of the inspection unit included in the electronic component inspection apparatus shown in Fig. 1. Fig. 4 is a horizontal cross-sectional view showing a state in which the electronic component is positioned on the holding portion of the inspection portion included in the electronic component inspection apparatus shown in Fig. Figs. 5 to 8 are vertical cross-sectional views for explaining the operation up to the positioning of the electronic component to the holding portion in the electronic component testing apparatus shown in Fig. 1. Fig.

Hereinafter, as shown in Fig. 1, for convenience of explanation, three mutually orthogonal axes are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis may be referred to as the "X direction", the direction parallel to the Y axis may be referred to as the "Y direction", and the direction parallel to the Z axis may be referred to as the "Z direction". Further, the upstream side in the conveying direction of the electronic component is simply referred to as the " upstream side ", and the downstream side is also simply referred to as the " downstream side ". The term " horizontal " in the present specification is not limited to a complete horizontal, but includes a state in which the horizontal inclination is slightly (for example, less than 5 deg.) As long as the conveyance of the electronic component is not impeded. 5 to 8 may be referred to as " upper " or " upper " and lower side may be referred to as " lower " or " lower ".

In Figs. 3 to 8, one of the four holding portions (electronic part holding portions) as the checking portion is shown, and one of the four hand units of the carrying portion is shown. In Figs. 3 to 8, the illustration of the probe pins or the like in contact with the terminals of the electronic component in the holding portion is omitted.

1, an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), a CIS (Hereinafter simply referred to as " inspection ") of an electronic component such as a CMOS image sensor. For convenience of explanation, a case of using an IC device as the electronic component to be inspected will be described below as a representative, and this is referred to as " IC device 9 ". In the following, the IC device 9 will be described by taking a BGA package as an example.

First, the IC device 9 will be described.

5 to 8, the IC device 9 is a BGA package and has a main body 91 and a plurality of terminals (electrodes) 92 formed on the outside of the main body 91. As shown in Fig. Although the shape of the main body portion 91 is not particularly limited, it is in the form of a plate in the present embodiment, and its thickness direction (the Z direction in a state in which the IC device 9 is held by the holding portion 51) (See Fig. 4). The square is square (or rectangular) in the present embodiment.

5 is a terminal arrangement surface 93 and the plurality of terminals 92 are arranged on the terminal arrangement surface 93 in a lattice shape (matrix shape). Each of the terminals 92 is a hemispherical solder ball. Needless to say, the shape of each terminal 92 is not limited to a hemispherical shape.

Next, the inspection apparatus 1 will be described.

As shown in Fig. 1, the inspection apparatus 1 is provided with a transport apparatus (electronic component transport apparatus) 10. This carrying apparatus 10 has a positioning mechanism 100 for positioning with respect to the IC device 9 as shown in Fig.

That is, the inspection apparatus 1 includes a supply section 2, a supply side arrangement section 3, a transport section 4, an inspection section 5, a collection side arrangement section 6, a collection section 7, And a control unit 8 for controlling each of these units. The inspection apparatus 1 further includes a base (base) 2 for arranging a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6 and a collection unit 7 And a cover 12 that covers the base 11 to receive the supply side array portion 3, the carry portion 4, the inspection portion 5, and the collection side arrangement portion 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal and the supply side array portion 3, the carry portion 4, the inspection portion 5, And the constituent members of the unit 6 are disposed. The inspection apparatus 1 may further include a heater or a chamber for heating the IC device 9, if necessary.

This inspection apparatus 1 is configured such that the supply section 2 supplies the IC device 9 to the supply side arrangement section 3 and arranges the supplied IC device 9 in the supply side arrangement section 3, The conveying unit 4 returns the device 9 to the inspection unit 5 and the inspected unit 5 inspects the conveyed IC device 9 and the inspected IC device 9 is conveyed to the conveying unit 4 And the IC device 9 arranged on the collection side array portion 6 is collected by the collection portion 7. The IC device 9 is arranged in the collection side array portion 6, According to this inspection apparatus 1, the supply, inspection, and recovery of the IC device 9 can be performed automatically. The inspection apparatus 1 further includes a supply section 2, a supply side arrangement section 3, a transport section 4, a part of the inspection section 5, a collection side arrangement section 6, a collection section 7, 8 constitute a transport apparatus 10. The carrying apparatus 10 carries the IC device 9 and performs positioning of the IC device 9 by the positioning mechanism 100 to the holding section 51 of the examination section 5 and the like.

Hereinafter, the configurations of the carry section 4, the examination section 5, and the positioning mechanism 100 will be described.

&Quot;

2, the carry section 4 carries the IC device 9 arranged on the placement stage 341 of the supply side arrangement section 3 to the inspection section 5, To the collection side array unit 6, the IC device 9 having been inspected of the IC device 9. The transfer section 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

-shuttle-

The shuttle 41 transfers the IC device 9 on the placement stage 341 to the vicinity of the inspection section 5 and further the IC device 9 inspected in the inspection section 5 to the recovery side To the vicinity of the array portion 6. [ In this shuttle 41, four pockets (holding portions) 411 constituted by concave portions for accommodating the IC device 9 are formed in a line in the X direction. The shuttle 41 is guided by a linear guide and can be reciprocated in the X direction by a drive source such as a linear motor.

- Supply robot -

The supply robot 42 is a robot that transports the IC device 9 disposed on the placement stage 341 to the shuttle 41. [ The supply robot 42 includes a support frame 421 supported by the base 11, a movable frame 422 supported by the support frame 421 and reciprocatable in the Y direction with respect to the support frame 421, And four hand units (gripping robots) 423 supported by the moving frame 422. [ Each hand unit 423 includes a lifting mechanism and a suction nozzle, and can be gripped by sucking the IC device 9.

- Inspection Robot -

The inspection robot 43 conveys the IC device 9 stored in the shuttle 41 to the inspection unit 5 (see Figs. 5 to 7) To the shuttle 41, The inspection robot 43 may push the IC device 9 to the inspection section 5 and apply a predetermined inspection pressure to the IC device 9 at the time of inspection (see FIG. 8). The inspection robot 43 includes a support frame 431 supported on the base 11, a movable frame 432 supported on the support frame 431 and capable of reciprocating in the Y direction with respect to the support frame 431, And four hand units (gripping robots) (electronic parts gripping parts) 433 supported by the moving frame 432. [

Each hand unit 433 is provided with a lifting mechanism and a suction nozzle 434 (see Fig. 5), and can grip (hold) by sucking the IC device 9. Since each hand unit 433 is the same, one of them will be described below.

The hand unit 433 has a shape corresponding to the concave portion 55 of the holding portion 51 of the inspection portion 5 to be described later when viewed from the Z direction (vertical direction). Specifically, the hand unit 433 has a rectangular shape when viewed from the Z direction, and is slightly smaller than the inner peripheral portion of the concave portion 55. The square is square (or rectangular) in the present embodiment. The hand unit 433 is disposed at a predetermined distance from the holding portion 51 when the IC device 9 is dropped onto the concave portion 55 of the holding portion 51, The concave portion 55 can be covered by the unit 433 (see Figs. 5 to 8).

A tubular body connected to a suction pump (not shown) is connected to the suction nozzle 434, and the IC device 9 is sucked by the operation of the suction pump. Further, the drive of the suction pump is controlled by the control unit 8.

- Recovery robot -

The recovery robot 44 is a robot that carries the inspected IC device 9 on the inspection unit 5 to the collection side array unit 6. [ The recovery robot 44 includes a support frame 441 supported on the base 11, a movable frame 442 supported on the support frame 441 and capable of reciprocating in the Y direction with respect to the support frame 441, And four hand units (gripping robots) 443 supported by the moving frame 442. [ Each hand unit 443 includes a lifting mechanism and a suction nozzle, and can be gripped by sucking the IC device 9. [

The carry section 4 carries the IC device 9 in the following manner. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transfers the IC device 9 on the placement stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center, and the inspection robot 43 returns the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 returns the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP3). Next, the shuttle 41 moves to the right side in the drawing, and the recovery robot 44 returns the inspected IC device 9 on the shuttle 41 to the collection side array unit 6. [ By repeating these STEP1 to STEP3, the IC device 9 can be transferred to the collection side array unit 6 via the inspection unit 5. [

As the configuration of the carry section 4, the IC device 9 on the placement stage 341 is transferred to the inspection section 5 and the IC device 9 ) To the recovery-side array unit (6) without any particular limitation. For example, the shuttle 41 may be omitted and the robot may be transported from the placement stage 341 to the inspection section 5 by the robot of either the supply robot 42, the inspection robot 43, or the recovery robot 44, The conveyance from the inspection section 5 to the collection side array section 6 may be carried out.

«Inspector»

The inspection unit 5 is a unit for inspecting and testing the electrical characteristics of the IC device 9. [ As shown in Fig. 2, the inspecting section 5 has four holding portions 51 for disposing the IC device 9 therein. A plurality of probe pins (not shown) electrically connected to the terminals of the IC device 9 are formed in these holding portions 51, respectively. Each of the probe pins is electrically connected to the control section 8. At the time of inspection of the IC device 9, one IC device 9 is arranged (held) in one holding portion 51. [ The respective terminals 92 of the IC device 9 arranged on the holding support portion 51 are pushed to the respective probe pins with a predetermined inspection pressure by the pressing of the hand unit 433 of the inspection robot 43 . As a result, each terminal 92 of the IC device 9 and each probe pin are electrically connected (brought into contact with each other), and the IC device 9 is inspected through the probe pins. The inspection of the IC device 9 is performed based on the program stored in the control section 8. [ The holding portion 51 will be described in detail later.

«Control section»

The control unit 8 has, for example, an inspection control unit and a drive control unit. The inspection control unit performs control such as inspection of the electrical characteristics of the IC device 9 arranged in the inspection unit 5 based on a program stored in a memory (not shown), for example. The drive control section is configured to drive each section of the supply section 2, the supply side arrangement section 3, the transport section 4, the inspection section 5, the collection side arrangement section 6 and the collection section 7, And controls the transportation of the IC device 9 and the positioning of the IC device 9 to the holding portion 51. [

«Positioning mechanism»

Next, the positioning mechanism 100 will be described. However, since the positioning mechanism 100 for the four holding portions 51 of the inspection unit 5 is the same, one of them will be described below.

3 to 8, the positioning mechanism 100 includes a holding portion 51 having a holding body 510, two tubes 135 and 136, two valves 145 and 146 Two pumps 155 and 156, and a hand unit 433. [0156] The internal cavities of the tubular members 135 and 136 are flow paths through which air (G) (fluid) flows. The portion (one end portion) of the retaining body main body 510 which is inserted into the wall portion 53 (described later) of the tubular bodies 135 and 136 is a component of the retaining portion 51. That is, the holding portion 51 for holding the IC device 9 is constituted by the holding support body 510 and a portion (one end portion) inserted into the wall portion 53 of the tubes 135 and 136 .

5 to 8, the holding support body 510 includes a substrate 54 having a holding surface (an electronic component holding surface) 52 for holding the IC device 9, And a wall portion 53 formed to surround the holding surface 52. Further, the holding surface 52 is parallel to the XY plane.

Although the shape of the wall portion 53 is not particularly limited, in the present embodiment, the wall portion 53 has a rectangular frame shape and is formed on the outer peripheral portion of the substrate 54. [ That is, the shape of the inner surface of the wall portion 53 and the shape of the outer surface are rectangular when viewed from the Z direction, respectively. The square is square or rectangular in the present embodiment. As a result, the retaining support body 510 is formed with a recess 55 that is rectangular when viewed from the Z direction. The bottom surface of the concave portion 55 is the holding surface 52.

The first wall surface 553, the second wall surface 554, the third wall surface 555 and the fourth wall surface 556 are formed in the concave portion 55 As shown in Fig. The first wall surface 553 to the fourth wall surface 556 have adjacent wall surfaces perpendicular to each other. The first wall surface 553 and the second wall surface 554 constitute a first corner portion 551 at right angles and the third wall surface 555 and the fourth wall surface 556 constitute the first corner portion 551. [ And forms a second corner portion 552 at a right angle. In this embodiment, as shown in Fig. 4, one corner portion 94 of the four corner portions of the IC device 9 abuts against the first corner portion 551 to be positioned. In this way, in the holding portion 51, the first corner portion 551 is set as a reference point (positioning portion) for positioning with respect to the IC device 9 in the holding portion 51.

At an upper portion of the inner peripheral portion of the wall portion 53, an inclined surface 531 whose inner side is lower than the outer side is formed. The IC device 9 is easily inserted into the concave portion 55 along the inclined surface 531 and is held on the holding surface 52 .

One end of each of the tubes 135 and 136 is connected to the wall portion 53 of the holding and supporting body 510. In this case, one ends of the tubes 135 and 136 are arranged at diagonal angles of a square. An opening (opening) 1351 at one end of the tube 135 is disposed and opened at the first corner 551 and an opening (opening) 1361 at one end of the tube 136 is opened Two corner portions 552, and is opened.

In this embodiment, the first channel is formed by the portion (one end) inserted into the wall portion 53 of the tube 135, and the portion of the tube 136 inserted into the wall portion 53 The second flow path is constituted by the second flow path. 3 and 4, the first vector V 1 representing the flow of the air G flowing through the first flow path is not orthogonal to the first wall surface 553 and the second wall surface 554 . That is, the angle formed by the first vector V 1 and the first wall surface 553 is 45 degrees, and the angle between the first vector V 1 and the second wall surface 554 is 45 degrees. In addition, the second vector (V 2 ) representing the flow of the fluid flowing through the second flow path is not perpendicular to the first wall surface 553 and the second wall surface 554, respectively. That is, the angle formed between the second vector V 2 and the first wall surface 553 is 45 degrees, and the angle formed between the second vector V 2 and the second wall surface 554 is 45 degrees. The first vector V 1 and the second vector V 2 are directed in the same direction as described above so that the IC device 9 can be moved in the same direction as shown in FIG. It can be easily moved to the first corner portion 551 side which is the reference point of the positioning.

The angle formed between the first vector V 1 and the first wall surface 553 is 45 degrees when the IC device 9 is viewed from the plane of the IC device 9, The angle formed by the first vector V 1 and the first wall surface 553 does not become 45 degrees but becomes a diagonal direction when the shape when viewed is a quadrangle other than the square (for example, rectangular).

As shown in Fig. 6, the openings 1351 and 1361 are disposed below the terminal placement surface 93 in the Z direction with the IC device 9 held by the holding portion 51. As shown in Fig. With this arrangement, the IC device 9 can be caused to float by the air flow in the concave portion 55, and when the IC device 9 is positioned, the IC device 9 can be positioned at the first corner portion 551).

The positional relationship between the opening 1351 and the opening 1361 in the Z direction is the same in the present embodiment, but the present invention is not limited to this and may be different. In this case, it is preferable that the opening 1361 is located in the upward direction in the Z direction with respect to the opening 1351. This configuration is effective for pushing the IC device 9 toward the holding surface 52 of the concave portion 55. [

The size of the opening 1351 and the size of the opening 1361 are the same in the present embodiment, but the present invention is not limited to this and may be different. In this case, the opening 1351 is preferably smaller than the opening 1361.

3 and 4, the inner diameter of the downstream side of the tubes 135 and 136 may be reduced

A pump 155 is connected to the other end different from the one end of the tubular body 135. A valve 145 is provided in the middle of the tube 135. On the other hand, a pump 156 is connected to the other end different from the one end of the tubular body 136. A valve 146 is provided in the middle of the tube 136. The pump 156 is a jetting section for jetting the air G and the pump 155 is a suction section for sucking the air G. When air G is jetted from the pump 156 by the operation of the pump 156, the air G flows through the tubular body 136 and is jetted from the opening 1361 into the concave portion 55 . When the pump 155 sucks the air G by the operation of the pump 155, the air G in the concave portion 55 is sucked (discharged) from the opening 1351, and the air G flows through the tube 135 and is discharged to the outside. Further, the pump for injecting the air G can be used as a compressed air generating source such as a compressor or a gas cylinder.

The attraction force obtained at the opening 1351 exceeds the atmospheric pressure at the maximum and irrespective of the friction between the holding surface 52 of the concave portion 55 and the IC device 9, 9 can be determined.

It is also possible to open and close the lumen of the tubular body 135 by opening and closing the valve 145 and opening and closing the lumen of the tubular body 136 by opening and closing the valve 146. [ If the valves 145 and 146 can adjust the opening degree, the flow rate of the air G flowing through the tubes 135 and 136 can be adjusted by adjusting the opening degree. That is, by adjusting the opening degree of the valve 146, the injection pressure or the injection flow rate of the air G can be adjusted. Further, by adjusting the opening degree of the valve 145, the suction pressure or suction flow amount of the air G can be adjusted. The valve 145 is provided with an adjusting unit for adjusting the jetting pressure or the jet flow rate of the air G by the valve 146. The valve 145 adjusts the suction pressure or the suction flow rate of the air G .

The injection pressure of the air G and the suction pressure of the air G may be the same or different. It is preferable that the jetting pressure of the air G is larger than the suction pressure of the air G when the jetting pressure of the air G is different from the suction pressure of the air G. [

The flow rate of the air G flowing through the tubes 135 and 136 can also be adjusted by adjusting the output of the pumps 155 and 156. The driving of the pumps 155 and 156 and the valves 145 and 146 is controlled by the control unit 8.

Next, the operation of positioning the IC device 9 on the holding portion 51 will be described.

First, as shown in Fig. 5, the IC device 9 is held by the hand unit 433, and the IC device 9 is held at a predetermined position in the concave portion 55 of the holding portion 51 . In this embodiment, the lower end of the hand unit 433 is disposed at the upper end in the recess 55, and the hand unit 433 is stopped. Thus, the concave portion 55 is covered by the hand unit 433. This prevents the air G from leaking from the inside of the concave portion 55 and prevents the IC device 9 from flying out of the concave portion 55 in the air flow.

Next, as shown in Fig. 6, the IC device 9 is released from the hand unit 433, that is, released. As a result, the IC device 9 starts to fall freely in the concave portion 55. In synchronism with the releasing operation of the IC device 9 by the hand unit 433, the air G is ejected from the tube 136 as described above , And the air (G) is sucked from the tube (135). Accordingly, when the IC device 9 is falling, the IC device 9 is pushed in a direction different from the direction in which the IC device 9 descends, that is, the IC device 9 is directed toward the first corner portion 551 , That is, the direction in which the air G flows. Then, the IC device 9 is pressed from the air flow (wind pressure) toward the first corner portion 551 during the free fall so that the corner portion 94 bumps against the first corner portion 551, (52). Thus, the positioning of the IC device 9 is ended (see Fig. 7).

As described above, when positioning the IC device 9 with respect to the IC device 9, the holding portion 51 is configured such that the air G flows in the direction of passing through the first corner portion 551 (G), so that the IC device 9 can be smoothly moved to the reference point of positioning. Therefore, positioning of the IC device 9 is easily performed.

7, it is preferable that the flow of the air G is maintained at least until the IC device 9 is disposed on the holding surface 52. [

Further, as described above, the IC device 9 is floated by the air flow in the concave portion 55. This makes it possible to make the IC device 9 have a sufficient air gap time so that the IC device 9 can be sufficiently attached to the first corner portion 551, .

Next, as shown in Fig. 8, the hand unit 433 is lowered from the state shown in Fig. 7, and the IC unit 9 is pressed downward by the hand unit 433. Each terminal 92 of the IC device 9 and each probe pin are electrically connected by the pressing of the hand unit 433. [ Then, the inspection of the IC device 9 is performed.

≪ Second Embodiment >

Fig. 9 is a horizontal cross-sectional view showing a holding portion of the carry section provided in the electronic component inspection apparatus (second embodiment) of the present invention. Fig.

Hereinafter, a second embodiment of the electronic component transporting apparatus and the electronic component inspecting apparatus of the present invention will be described with reference to these drawings, but the differences from the above-described embodiments will be mainly described, do.

This embodiment is the same as the first embodiment except that the location of the positioning mechanism is different.

As shown in Fig. 9, in the present embodiment, the positioning mechanism 100 holds the untested IC device 9 and moves it to the vicinity of the inspection section 5, Is arranged in the shuttle 41 which holds the device 9 and moves it to the vicinity of the collection side arrangement portion 6. [ Since the positioning mechanism 100 in each pocket 411 of the shuttle 41 is the same, one of them will be described below.

The positioning mechanism 100 includes two tubes 165 and 166 connected to the shuttle 41 and communicating with the pockets 411 and two valves 175 and 176 and two pumps 185 and 186 ). The lumen of the tubular body 165 is a first flow path through which the air G is drawn and the inner lumen of the tubular body 166 is a second flow path through which the air G is ejected.

The pocket 411 has a square shape (or a rectangular shape) when viewed from the Z direction and has a tube body 165 attached to a first corner portion 417 composed of a first wall surface 413 and a second wall surface 414, And an opening 1651 of the opening 1651 is disposed. An opening 1661 of the tube body 166 is disposed at a second corner portion 418 composed of a third wall surface 415 and a fourth wall surface 416 which are the inner surfaces of the pockets 411. In the shuttle 41, the first corner portion 417 is set as a reference point (positioning portion) for positioning the IC device 9 in the pocket 411.

The angle formed between the first vector V 1 representing the flow of the air G flowing through the first flow path and the first wall surface 413 is 45 degrees and the angle between the first vector V 1 , (414) is 45 degrees. The angle formed between the second vector V 2 representing the flow of the fluid flowing through the second flow path and the first wall surface 413 is 45 degrees and the angle between the second vector V 2 and the second wall surface 414 is 45 degrees. Is 45 degrees.

The angle formed between the first vector V 1 and the first wall surface 413 is 45 degrees. However, in the plane of the IC device 9, The angle formed by the first vector V 1 and the first wall surface 413 does not become 45 degrees but becomes a diagonal direction when the shape when seen is a quadrangle other than the square (for example, rectangular).

The positioning mechanism 100 disposed in the shuttle 41 is capable of positioning the IC device 9 in the falling state of the IC device 9 in the pocket 411 almost similarly to the first embodiment, Can be easily moved toward the first corner portion 417, which is the reference point for positioning. Thus, positioning with respect to the IC device 9 can be easily performed.

≪ Third Embodiment >

10 is a horizontal sectional view showing a holding portion of an inspection unit included in the electronic component inspection apparatus (third embodiment) of the present invention.

Hereinafter, a third embodiment of the electronic component transporting apparatus and the electronic component inspecting apparatus of the present invention will be described with reference to these drawings, but the differences from the above embodiment will be mainly described, and the same description will be omitted do.

The present embodiment is the same as the first embodiment except that the configuration of the positioning mechanism is different.

10, in this embodiment, the positioning mechanism 100 includes four tubes 131, 132, 133, and 134 connected to the holding portion 51, four valves 141, 142, 143, and 144, and four pumps 151, 152, 153, and 154, respectively. The lumens of the tubes 131 to 134 are flow paths through which air (fluid) flows. The openings (openings) 1311, 1321, 1331, and 1341 at one end of the tubes 131 to 134 are opened to the inner surface of the wall 53. The first channel is formed by the portion (one end) inserted into the wall portion 53 of the tube 131 and the first channel is formed by the portion (one end) inserted into the wall portion 53 of the tube 132 So that another first flow path is constituted. The second channel is formed by the portion (one end) inserted into the wall portion 53 of the tube 133 and the second channel is formed by the portion (one end) inserted into the wall portion 53 of the tube 134 Thereby constituting another second flow path.

One end of each of the tubes 131 and 132 is disposed in the vicinity of the first corner 551 of the recess 55 and one end of each of the tubes 133 and 134 is disposed in the vicinity of the end of the recess 55 And is disposed in the vicinity of the second corner portion 552. One end of the tubular body 131 is orthogonal to the first wall surface 553 constituting the inner surface of the recess 55 and one end of the tubular body 132 is made of a material constituting the inner surface of the recess 55 One end of the tubular body 133 is perpendicular to the third wall surface 555 constituting the inner surface of the recess 55 and one end of the tubular body 133 is in contact with the recess 55 And the fourth wall surface 556 constituting the inner surface of the second wall 55.

Accordingly, one end of the first vector (V 1) showing the flow of the parts of the flowing medium, one portion flowing through the angle formed between the first vector (V 1) showing the flow of the fluid in the tube 132 of the tube 131, 90 degrees. Accordingly, the vector obtained by adding the vectors of the both sides is in a direction in which the IC device 9 is directed toward the first corner portion 551. In addition, one end flowing one end flowing the angle formed between the second vector (V2) showing the flow of the fluid of the second vector (V 2), and a tube body 134, showing the flow of the fluid in the tube 133, 90 to be. Accordingly, the vector obtained by adding both the vectors is also the direction that directs the IC device 9 toward the first corner portion 551.

With the positioning mechanism 100 for generating such a vector, the IC device 9 in the falling state can be moved toward the first corner portion 551, which is the reference point for positioning, similarly to the first embodiment, The positioning with respect to the IC device 9 can be easily performed.

In the positioning mechanism 100, the flow direction of the one end of the tubular body 131 and the flow direction of the one end of the tubular body 132 need only to intersect with each other, and the flow direction of one end of the tubular body 133 and the flow direction of the tubular body 134 may intersect with each other. That is, one end of the first vector (V 1) showing the flow of the parts of the flowing medium, one portion flowing through the angle formed between the first vector (V 1) showing the flow of the fluid in the tube 132 of the tube 131, 0 may or degrees and 180 degrees, with the second vector (V 2) representing a second vector (V 2) and, once the flow of parts of the flowing medium in the tube (134) indicating the end flow of the parts of the flowing medium in the tube 133 The angle formed is not necessarily 0 degrees and 180 degrees.

Although the embodiments of the present invention have been described above with reference to the embodiments of the present invention, the present invention is not limited thereto, and each of the components constituting the electronic component transporting apparatus and the electronic component inspecting apparatus, It can be replaced with any structure capable of exhibiting the same function. In addition, an optional component may be added.

The electronic component transporting apparatus and the electronic component inspecting apparatus of the present invention may be a combination of any two or more of the above-described embodiments (features).

Further, the number and arrangement of the pockets of the shuttle, the number and arrangement of the hand units of the supply robot, the number and arrangement of the hand units of the inspection robot, and the arrangement numbers of the hand units of the recovery robot And the arrangement mode of the holding portion of the inspection portion and the arrangement mode of the holding portion of the inspection portion are not limited to the configuration shown in Fig.

In each of the above-described embodiments, the electronic component holding portion has a configuration including both the first flow path and the second flow path, but the present invention is not limited to this configuration, and the configuration may be such that the second flow path is omitted.

Although air is used as the fluid in each of the above embodiments, the present invention is not limited to this. For example, various kinds of gases such as nitrogen, argon, carbon dioxide, fluorine- A gas such as an insulating gas is applicable.

1: Inspection device
10:
100: Positioning mechanism
11: Base
111: Base surface
12: cover
2:
3: Supply side arrangement part
341: witty stage
4:
41: Shuttle
411: Pocket
413: first wall surface
414: second wall surface
415: third wall surface
416: fourth wall surface
417: first corner portion
418: second corner portion
42: Supply robot
421: Support frame
422: Moving frame
423: Hand unit
43: Inspection Robot
431: Support frame
432: Moving frame
433: Hand unit
434: Adsorption nozzle
44: Recovery robot
441: Support frame
442: Moving frame
443: Hand unit
5:
51:
510:
52: Holding face
53: wall portion
531:
54: substrate
55:
551: first corner portion
552: second corner portion
553: first wall surface
554: second wall surface
555: third wall surface
556: fourth wall surface
6:
7:
8:
9: IC device
91:
92: terminal
93: terminal arrangement surface
94:
131, 132, 133, 134, 135, 136, 165, 166:
1311, 1321, 1331, 1341, 1351, 1361, 1651, 1661:
141, 142, 143, 144, 145, 146, 175, 176:
151, 152, 153, 154, 155, 156, 185, 186: pumps
G: Air
V 1 : first vector
V 2 : second vector

Claims (9)

An electronic component gripping portion for gripping the electronic component,
And an electronic component holding portion for holding the electronic component,
A flow path through which fluid flows is formed in the electronic component holding portion,
Wherein the fluid flows in a direction different from a direction in which the electronic component falls when the electronic component gripping portion releases the electronic component and the electronic component falls. The method according to claim 1,
In the electronic component holding portion,
A concave portion,
A positioning portion which is disposed in the recess and in which the electronic component abuts and is positioned with respect to the electronic component,
Wherein the fluid flows in a direction in which the electronic component is moved to the positioning portion when the electronic component is falling by releasing the electronic component by the electronic component holding portion. 3. The method according to claim 1 or 2,
The electronic component holding portion has a first wall surface and a second wall surface constituting the first corner portion,
Wherein the first wall surface and the second wall surface are orthogonal to each other,
Wherein the electronic component holding portion has a first flow path that is disposed in the first corner portion and through which the fluid flows,
Wherein the first vector indicating the flow of the fluid flowing through the first flow path is not orthogonal to the first wall surface and the second wall surface, respectively. The method of claim 3,
The electronic component holding portion has a third wall surface and a fourth wall surface constituting a second corner portion disposed at a diagonal position from the first corner portion,
Wherein the electronic component holding portion has a second flow path disposed in the second corner portion and through which the fluid flows,
And the second vector indicating the flow of the fluid flowing through the second flow path is not orthogonal to the first wall surface and the second wall surface, respectively. 5. The method of claim 4,
A suction unit for sucking the fluid is connected to the first flow path,
And a jetting section for jetting the fluid is connected to the second flow path. The method according to claim 4 or 5,
The electronic component includes a body portion and a plurality of terminals formed on the body portion,
Wherein at least a part of the opening portion of the second flow path is disposed downward in the vertical direction relative to the terminal arrangement surface on which the terminal of the main body portion is disposed in a state in which the electronic component is held by the electronic component holding portion, . 7. The method according to any one of claims 1 to 6,
And the electronic component holding portion holds and retains the electronic component when the electronic component is inspected. 8. The method according to any one of claims 1 to 7,
And the electronic component holding portion holds the electronic component and moves to a predetermined place. An electronic component gripping portion for gripping the electronic component,
An electronic component holding portion for holding the electronic component;
And an inspection unit for inspecting the electronic component,
A flow path through which fluid flows is formed in the electronic component holding portion,
Wherein the fluid flows in a direction different from a direction in which the electronic component falls when the electronic component gripping portion releases the electronic component and the electronic component falls.
KR1020150047200A 2014-09-30 2015-04-03 Electronic component transfer apparatus and electronic component inspection apparatus KR101667312B1 (en)

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JP2016070777A (en) 2016-05-09
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CN106185301A (en) 2016-12-07
TW201612090A (en) 2016-04-01

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