TW201612090A - Electronic parts conveying device and electronic parts checking device - Google Patents
Electronic parts conveying device and electronic parts checking deviceInfo
- Publication number
- TW201612090A TW201612090A TW104131907A TW104131907A TW201612090A TW 201612090 A TW201612090 A TW 201612090A TW 104131907 A TW104131907 A TW 104131907A TW 104131907 A TW104131907 A TW 104131907A TW 201612090 A TW201612090 A TW 201612090A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic parts
- checking device
- conveying device
- grasping
- holding
- Prior art date
Links
Abstract
The electronic parts checking device of the present invention comprises a grasping part grasping an IC element, and a holding part holding the IC element. A flow path formed for flowing the air at the holding part. Besides, as the grasping part releases the IC element and the IC element falls, the electronic parts checking device makes the air flow toward a different direction from where the IC element falls.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014200023A JP2016070777A (en) | 2014-09-30 | 2014-09-30 | Electronic component conveyance device and electronic component inspection device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201612090A true TW201612090A (en) | 2016-04-01 |
TWI597226B TWI597226B (en) | 2017-09-01 |
Family
ID=55789819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104131907A TWI597226B (en) | 2014-09-30 | 2015-09-25 | Electronic parts conveying apparatus and electronic parts inspection apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2016070777A (en) |
KR (1) | KR101667312B1 (en) |
CN (1) | CN106185301A (en) |
TW (1) | TWI597226B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI742934B (en) * | 2020-11-20 | 2021-10-11 | 漢民測試系統股份有限公司 | Probing system |
TWI772038B (en) * | 2020-09-25 | 2022-07-21 | 美商艾賽股份有限公司 | Integrated circuit device test tooling with dual angle cavities |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107686002A (en) * | 2016-08-05 | 2018-02-13 | 台湾暹劲股份有限公司 | Position correction mechanism and its implement of application |
CN108414850A (en) * | 2017-01-30 | 2018-08-17 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
JP2018141699A (en) * | 2017-02-28 | 2018-09-13 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
JP2019066221A (en) * | 2017-09-29 | 2019-04-25 | セイコーエプソン株式会社 | Electronic component conveying device and electronic component inspection device |
CN110045160B (en) * | 2019-05-24 | 2021-06-08 | 安徽鹰龙工业设计有限公司 | Test seat that top of BGA encapsulation usefulness was got and is put |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3494828B2 (en) * | 1996-11-18 | 2004-02-09 | 株式会社アドバンテスト | Horizontal transport test handler |
JPH10300815A (en) * | 1997-04-25 | 1998-11-13 | Nec Kansai Ltd | Inspection device of electronic parts |
JPH11198988A (en) | 1998-01-12 | 1999-07-27 | Murata Mfg Co Ltd | Storage tool |
US6472891B1 (en) * | 2000-08-10 | 2002-10-29 | Advanced Micro Devices, Inc. | Method and apparatus for testing semiconductor packages without damage |
JP2002181887A (en) * | 2000-12-12 | 2002-06-26 | Advantest Corp | Testing device for electronic component |
JP2006017738A (en) * | 2005-07-28 | 2006-01-19 | Seiko Epson Corp | Socket for semiconductor device inspection apparatus |
JP5161870B2 (en) * | 2008-03-27 | 2013-03-13 | 株式会社アドバンテスト | Socket guide, socket unit, electronic component test apparatus, and socket temperature control method |
JP2009288086A (en) * | 2008-05-29 | 2009-12-10 | Yokogawa Electric Corp | Semiconductor tester |
JP2012122774A (en) * | 2010-12-06 | 2012-06-28 | Sharp Corp | Test socket |
JP2013234912A (en) * | 2012-05-09 | 2013-11-21 | Seiko Epson Corp | Socket guide, handler, and component inspection device |
KR102138794B1 (en) * | 2013-03-18 | 2020-07-28 | 삼성전자주식회사 | A Tray for Aligning the Positions of Semiconductor Package, Test Handler Using the Same, A Method for Aligning the Positions of Semiconductor Package and the Test Method Using the Same |
CN203545064U (en) * | 2013-09-05 | 2014-04-16 | 产台股份有限公司 | Blowback separation device for materials |
-
2014
- 2014-09-30 JP JP2014200023A patent/JP2016070777A/en active Pending
-
2015
- 2015-04-03 KR KR1020150047200A patent/KR101667312B1/en active IP Right Grant
- 2015-05-13 CN CN201510243783.0A patent/CN106185301A/en active Pending
- 2015-09-25 TW TW104131907A patent/TWI597226B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI772038B (en) * | 2020-09-25 | 2022-07-21 | 美商艾賽股份有限公司 | Integrated circuit device test tooling with dual angle cavities |
TWI742934B (en) * | 2020-11-20 | 2021-10-11 | 漢民測試系統股份有限公司 | Probing system |
Also Published As
Publication number | Publication date |
---|---|
TWI597226B (en) | 2017-09-01 |
KR20160038690A (en) | 2016-04-07 |
CN106185301A (en) | 2016-12-07 |
JP2016070777A (en) | 2016-05-09 |
KR101667312B1 (en) | 2016-10-18 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |