TW201612090A - Electronic parts conveying device and electronic parts checking device - Google Patents

Electronic parts conveying device and electronic parts checking device

Info

Publication number
TW201612090A
TW201612090A TW104131907A TW104131907A TW201612090A TW 201612090 A TW201612090 A TW 201612090A TW 104131907 A TW104131907 A TW 104131907A TW 104131907 A TW104131907 A TW 104131907A TW 201612090 A TW201612090 A TW 201612090A
Authority
TW
Taiwan
Prior art keywords
electronic parts
checking device
conveying device
grasping
holding
Prior art date
Application number
TW104131907A
Other languages
Chinese (zh)
Other versions
TWI597226B (en
Inventor
Satoshi Nakamura
Haruhiko Miyamoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201612090A publication Critical patent/TW201612090A/en
Application granted granted Critical
Publication of TWI597226B publication Critical patent/TWI597226B/en

Links

Abstract

The electronic parts checking device of the present invention comprises a grasping part grasping an IC element, and a holding part holding the IC element. A flow path formed for flowing the air at the holding part. Besides, as the grasping part releases the IC element and the IC element falls, the electronic parts checking device makes the air flow toward a different direction from where the IC element falls.
TW104131907A 2014-09-30 2015-09-25 Electronic parts conveying apparatus and electronic parts inspection apparatus TWI597226B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014200023A JP2016070777A (en) 2014-09-30 2014-09-30 Electronic component conveyance device and electronic component inspection device

Publications (2)

Publication Number Publication Date
TW201612090A true TW201612090A (en) 2016-04-01
TWI597226B TWI597226B (en) 2017-09-01

Family

ID=55789819

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131907A TWI597226B (en) 2014-09-30 2015-09-25 Electronic parts conveying apparatus and electronic parts inspection apparatus

Country Status (4)

Country Link
JP (1) JP2016070777A (en)
KR (1) KR101667312B1 (en)
CN (1) CN106185301A (en)
TW (1) TWI597226B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI742934B (en) * 2020-11-20 2021-10-11 漢民測試系統股份有限公司 Probing system
TWI772038B (en) * 2020-09-25 2022-07-21 美商艾賽股份有限公司 Integrated circuit device test tooling with dual angle cavities

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107686002A (en) * 2016-08-05 2018-02-13 台湾暹劲股份有限公司 Position correction mechanism and its implement of application
CN108414850A (en) * 2017-01-30 2018-08-17 精工爱普生株式会社 Electronic component handling apparatus and electronic component inspection device
JP2018141699A (en) * 2017-02-28 2018-09-13 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
JP2019066221A (en) * 2017-09-29 2019-04-25 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
CN110045160B (en) * 2019-05-24 2021-06-08 安徽鹰龙工业设计有限公司 Test seat that top of BGA encapsulation usefulness was got and is put

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JP3494828B2 (en) * 1996-11-18 2004-02-09 株式会社アドバンテスト Horizontal transport test handler
JPH10300815A (en) * 1997-04-25 1998-11-13 Nec Kansai Ltd Inspection device of electronic parts
JPH11198988A (en) 1998-01-12 1999-07-27 Murata Mfg Co Ltd Storage tool
US6472891B1 (en) * 2000-08-10 2002-10-29 Advanced Micro Devices, Inc. Method and apparatus for testing semiconductor packages without damage
JP2002181887A (en) * 2000-12-12 2002-06-26 Advantest Corp Testing device for electronic component
JP2006017738A (en) * 2005-07-28 2006-01-19 Seiko Epson Corp Socket for semiconductor device inspection apparatus
JP5161870B2 (en) * 2008-03-27 2013-03-13 株式会社アドバンテスト Socket guide, socket unit, electronic component test apparatus, and socket temperature control method
JP2009288086A (en) * 2008-05-29 2009-12-10 Yokogawa Electric Corp Semiconductor tester
JP2012122774A (en) * 2010-12-06 2012-06-28 Sharp Corp Test socket
JP2013234912A (en) * 2012-05-09 2013-11-21 Seiko Epson Corp Socket guide, handler, and component inspection device
KR102138794B1 (en) * 2013-03-18 2020-07-28 삼성전자주식회사 A Tray for Aligning the Positions of Semiconductor Package, Test Handler Using the Same, A Method for Aligning the Positions of Semiconductor Package and the Test Method Using the Same
CN203545064U (en) * 2013-09-05 2014-04-16 产台股份有限公司 Blowback separation device for materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI772038B (en) * 2020-09-25 2022-07-21 美商艾賽股份有限公司 Integrated circuit device test tooling with dual angle cavities
TWI742934B (en) * 2020-11-20 2021-10-11 漢民測試系統股份有限公司 Probing system

Also Published As

Publication number Publication date
TWI597226B (en) 2017-09-01
KR20160038690A (en) 2016-04-07
CN106185301A (en) 2016-12-07
JP2016070777A (en) 2016-05-09
KR101667312B1 (en) 2016-10-18

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Legal Events

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