TWI578002B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

For example, an electronic component inspection device that inspects electrical characteristics of an electronic component such as an IC component has been known, and an electronic component transfer device (processor) for transporting an IC component to an inspection unit is incorporated in the electronic component inspection device. Such an electronic component transport apparatus requires that the IC components sequentially supplied are accurately transported one by one. However, in the case where the resin sealing body is burred due to the difference in the IC components, the burrs are connected to each other to connect the two IC elements arranged in the front and rear, and there is a problem that the IC element cannot be accurately conveyed.

In order to solve such a problem, Patent Document 1 discloses a separating device that forcibly separates IC elements arranged in front and rear. The separation device of Patent Document 1 includes a guide rail that is horizontally disposed and conveys an IC component, a stopper that is disposed in the middle of the guide rail, and that is caught by the IC component that is transported on the guide rail; and a claw portion that is hung by The block catches the lead of the IC component. Further, by releasing the stopper and moving the claw toward the downstream side, the IC element having the claw portion is forcibly moved to the downstream side, thereby forcibly separating the IC elements before and after.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 60-7800

However, in such a mechanism, a large load is applied to the leads, which results in The damage of IC components. Also, it cannot be applied to leadless electronic parts.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can reduce damage of electronic components during transportation and separate electronic components before and after.

Such an object can be achieved by the present invention described below.

An electronic component conveying apparatus according to the present invention includes: a passage that is inclined with respect to a specific surface to pass a plurality of electronic components; and a first electronic component of the plurality of electronic components that pass through the passage from the first 1 The second electronic component separation mechanism after the electronic component.

Thereby, an electronic component conveying apparatus capable of reducing damage of the electronic components during transportation and separating the electronic components before and after is obtained.

In the electronic component transport apparatus of the present invention, it is preferable that the passage is inclined with respect to a horizontal direction, and the electronic component moves in the passage by gravity.

Thereby, the electronic parts can be accurately transported. Moreover, since it is not necessary to prepare a special mechanism for transporting electronic components, the device configuration is simplified.

In the electronic component transport apparatus of the present invention, the mechanism moves the at least one of the first electronic component and the second electronic component in a direction separating from the other, thereby causing the first electronic component to be The second electronic component is separated.

Thereby, the first electronic component and the second electronic component can be easily and surely separated.

In the electronic component conveying apparatus of the present invention, the passage includes a first passage portion in which the first electronic component is located and a second passage portion in which the second electronic component is located, and the mechanism includes fixing the first electronic component to the first electronic component. a first fixing portion of the first passage portion and a second fixing portion that fixes the second electronic component to the second passage portion; and the mechanism fixes the first electronic component to the first portion by the first fixing portion 1 passage section, After the second electronic component is fixed to the second passage portion by the second fixing portion, at least one of the first passage portion and the second passage portion is moved in a direction separating from the other. Thereby, the first electronic component is separated from the second electronic component.

Thereby, the stress applied to the electronic component can be reduced, so that the damage of the electronic component can be more effectively suppressed.

In the electronic component conveying apparatus of the present invention, the first fixing portion fixes the first electronic component to the first passage portion by pressing the first electronic component against the first passage portion, and the second passage portion The fixing portion fixes the second electronic component to the second passage portion by pressing the second electronic component against the second passage portion.

Thereby, the first and second electronic components can be easily fixed and effectively fixed to the first and second passage portions.

In the electronic component transfer apparatus of the present invention, the electronic component is an IC component sealed by a resin sealing body, and the first fixing portion presses the resin sealing body of the first electronic component against the first via portion. The first electronic component is fixed to the first passage portion, and the second fixing portion fixes the second electronic component by pressing the resin sealing body of the second electronic component against the second passage portion. The second passage portion.

Thereby, the damage of the electronic component can be more effectively suppressed.

In the electronic component transport apparatus of the present invention, the first electronic component is not in contact with the second via portion when the first fixing portion is fixed to the first via portion, and the second electronic component is used in the second component. When the fixing portion is fixed to the second passage portion, the fixing portion does not come into contact with the first passage portion.

When the first and second electronic components are separated by moving at least one of the first and second passage portions, the first electronic component does not rub against the second passage portion or the second electronic component There is no friction with the first passage portion. Therefore, the first and second electrons can be reduced more effectively. Damage to the part.

In the electronic component conveying apparatus of the present invention, the mechanism further includes: a positioning portion that restricts movement of the electronic component so that at least a part of the first electronic component is located in the first passage portion and the second portion At least a part of the electronic component is located in the state of the second passage portion.

Thereby, the separation of the first and second electronic components can be performed more reliably and simply.

In the electronic component transport apparatus of the present invention, the means for maintaining the second electronic component is fixed to the second passage portion by the second fixing portion after the first electronic component is separated from the second electronic component. And releasing the first fixing portion to fix the first electronic component toward the first passage portion.

Thereby, the electronic components from the foremost side can be sequentially flowed to the downstream side one by one, so that the subsequent electronic components can be accurately transported.

An electronic component inspection device according to the present invention includes the electronic component conveying device of the present invention and an inspection portion for inspecting the electronic component.

Thereby, an electronic component inspection apparatus capable of reducing damage of the electronic components during transportation and separating the electronic components before and after is obtained.

1‧‧‧Checking device

1'‧‧‧Electronic parts transporting device

2‧‧‧Supply Department

3‧‧‧Supply side alignment

4‧‧‧Transportation Department

5‧‧‧Inspection Department

6‧‧‧Recycling side alignment

7‧‧Recycling Department

8‧‧‧Control Department

9, 9A, 9B‧‧‧ IC components

11‧‧‧Base

12‧‧‧ Cover

21‧‧‧Loading platform

31‧‧‧Transportation channel

32‧‧‧Separation agency

33‧‧‧ Distribution agencies

34‧‧‧ posture control mechanism

38‧‧‧Apartment

41‧‧‧ Shuttle

42‧‧‧Supply robot

43‧‧‧Check the robot

44‧‧‧Recycling robot

51‧‧‧Check socket

61‧‧‧ posture control mechanism

62‧‧‧Loading platform

65‧‧‧Slope guides

71‧‧‧ Distribution agency

72‧‧‧Connecting Department

90‧‧‧ Containment tube

91‧‧‧Resin seal

92‧‧‧ lead

93‧‧‧Mamma

111‧‧‧Base surface

311‧‧‧1st transport channel

312‧‧‧2nd transport channel

321‧‧ ‧block

322‧‧‧1st fixed department

323‧‧‧2nd Fixing Department

323a‧‧‧jet nozzle

324‧‧‧Direct moving cylinder

324a‧‧‧Axis

325‧‧‧Return spring

331‧‧‧Distribution platform

332, 332A, 332B, 332C, 332D‧‧‧ distribution channels

333‧‧ ‧block

334‧‧ hood

334a‧‧‧Window

341‧‧‧Loading platform

342‧‧‧Base

343‧‧‧ tilting platform

344‧‧‧ Mounting channel

347‧‧‧ Guides

347a‧‧‧Guide

411‧‧‧ recess

421‧‧‧Support framework

422‧‧‧Mobile framework

423‧‧‧Hand unit

431‧‧‧Support framework

432‧‧‧Mobile framework

433‧‧‧Hand unit

441‧‧‧Support framework

442‧‧‧Mobile framework

443‧‧‧Hand unit

621‧‧‧Base

622‧‧‧ tilt platform

623‧‧‧Loading channel

624‧‧‧Axis

625‧‧ ‧block

626‧‧ hood

626a‧‧‧Window

651‧‧‧ guiding slot

711‧‧‧Distribution platform

712, 712A‧‧‧ distribution channel

713‧‧ ‧block

714‧‧ hood

714a‧‧‧Window

721, 721A, 721B, 721C, 721D, 721E, 721F‧‧‧ connection channels

901‧‧‧ openings

J ₂₁ , J ₃₄₃ , J ₆₂₂ ‧ ‧ rotating shaft

S1‧‧‧Loading Department

Fig. 1 is a schematic view showing a preferred embodiment of the electronic component inspection device of the present invention.

Fig. 2 is a view showing a supply tube and a supply portion of the electronic component inspection device shown in Fig. 1;

Fig. 3 is a view showing a supply side array portion of the electronic component inspection device shown in Fig. 1;

Fig. 4 is a view showing a separating mechanism of the supply-side aligning portion shown in Fig. 3;

Fig. 5 is a view showing an example of an electronic component inspected by the electronic component inspection device shown in Fig. 1.

6(a) and 6(b) are diagrams showing the operation of the separating mechanism shown in Fig. 4.

7(a) and 7(b) are diagrams showing the operation of the separating mechanism shown in Fig. 4.

Fig. 8 is a view showing a distribution mechanism of the supply-side aligning portion shown in Fig. 3;

Fig. 9 is a view showing a distribution mechanism of the supply-side aligning portion shown in Fig. 3;

Fig. 10 is a view showing a posture control mechanism of the supply side array portion shown in Fig. 3;

Fig. 11 is a view showing a posture control mechanism of the supply side array portion shown in Fig. 3;

Fig. 12 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1;

Fig. 13 is a view showing a collecting side array portion of the electronic component inspection device shown in Fig. 1;

Fig. 14 is a view showing a collecting side array portion of the electronic component inspection device shown in Fig. 1;

Fig. 15 is a view showing a collecting portion of the electronic component inspection device shown in Fig. 1;

Fig. 16 is a view showing a collecting portion of the electronic component inspection device shown in Fig. 1.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a preferred embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a view showing a supply tube and a supply portion of the electronic component inspection device shown in Fig. 1; Fig. 3 is a view showing a supply side array portion of the electronic component inspection device shown in Fig. 1; Fig. 4 is a view showing a separating mechanism of the supply-side aligning portion shown in Fig. 3; Fig. 5 is a view showing an example of an electronic component inspected by the electronic component inspection device shown in Fig. 1. Fig. 6 is a view for explaining the operation of the separating mechanism shown in Fig. 4. Fig. 7 is a view for explaining the operation of the separating mechanism shown in Fig. 4. Fig. 8 is a view showing a distribution mechanism of the supply-side aligning portion shown in Fig. 3; Fig. 9 is a view showing a distribution mechanism of the supply-side aligning portion shown in Fig. 3; Fig. 10 is a view showing a posture control mechanism of the supply side array portion shown in Fig. 3; Fig. 11 is a view showing a posture control mechanism of the supply side array portion shown in Fig. 3; Fig. 12 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1; Figure 13 is a diagram showing the recycling of the electronic component inspection device shown in Figure 1. A diagram of the side alignment portion. Fig. 14 is a view showing a collecting side array portion of the electronic component inspection device shown in Fig. 1; Fig. 15 is a view showing a collecting portion of the electronic component inspection device shown in Fig. 1; Fig. 16 is a view showing a collecting portion of the electronic component inspection device shown in Fig. 1.

In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Moreover, the "level" mentioned in the specification of the present invention is not limited to a complete level, and as long as it does not hinder the conveyance of the electronic component, it also includes a state in which a certain amount (for example, less than about 5 degrees) is inclined with respect to the horizontal.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used for, for example, an IC device (IC chip), an LCD (Liquid Crystal Display), a CIS (CMOS Image Sensor, CMOS image sensor), or the like. A device that inspects and tests the electrical characteristics of a part (hereinafter referred to as "inspection"). In the following, for convenience of explanation, the case where the IC component is used as the electronic component to be inspected is described as a representative, and this is referred to as "IC component 9".

The inspection apparatus 1 includes a supply unit 2, a supply side array unit 3, a conveyance unit 4, an inspection unit 5, a collection side array unit 6, a collection unit 7, and a control unit 8 that controls the respective units. Further, the inspection apparatus 1 includes a supply unit 2, a supply side array unit 3, a transport unit 4, an inspection unit 5, a base 11 on which the collection side array unit 6 and the collection unit 7 are disposed, and a cover 12 for accommodating the supply side. The array portion 3, the transport portion 4, the inspection portion 5, and the recovery side array portion 6 are placed on the base 11. Further, the base surface (specific surface) 111 which is the upper surface of the base 11 is substantially horizontal, and the supply side array portion 3, the transport portion 4, the inspection portion 5, and the recovery side array portion 6 are disposed on the base surface 111. Form the component. Further, in addition to this, the inspection apparatus 1 may include a heater or a chamber or the like for heating the IC element 9 as needed.

The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC element 9 to the supply side array unit 3, the supply side array unit 3 arranges the supplied IC elements 9, and the transport unit 4 is arranged. The IC element 9 is transported to the inspection unit 5, and the inspection unit 5 inspects the transported IC element 9. The transport unit 4 transports/arranges the IC elements 9 that have been inspected to the recovery side array unit 6, and the collection unit 7 arranges them on the recovery side. The IC component 9 of the part 6 is recovered. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC element 9 can be automatically performed. In addition, the configuration of the inspection device 1 other than the inspection unit 5, that is, the supply unit 2, the supply side array unit 3, the transport unit 4, the recovery side array unit 6, and the recovery unit 7 constitute the IC element 9. The electronic component transport device 1' that has been transported.

Hereinafter, the configuration of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the inspection unit 5, the collection-side arranging unit 6, and the recovery unit 7 will be described in order.

<<Supply Department>>

The supply unit 2 is a unit that supplies the IC element 9 to the supply-side arranging unit 3. Furthermore, as shown in FIG. 2, the IC element 9 is housed in the housing tube (electronic component housing portion) 90 in a plurality of rows. Further, the housing tube 90 has a long tubular shape and has an opening 901 at the distal end. Therefore, the IC elements 9 in the housing tube 90 can be sequentially delivered from the front side from the opening 901. Further, before the inspection, the opening 901 is covered with a lid, whereby the IC element 9 can be stored in the housing tube 90. Further, the IC device 9 is a package type IC device in which an IC wafer is resin-sealed with an epoxy resin sealing material or the like, and includes a resin sealing body 91 and a plurality of leads 92 protruding from the resin sealing body 91. However, the configuration of the IC element 9 is not limited thereto, and for example, the lead 92 may be omitted. In addition, about the lead wire 92, for convenience of description, illustration is abbreviate|omitted except FIG.

As shown in FIG. 2, the supply unit 2 includes a mounting platform 21 on which the storage tube 90 is placed. In the supply unit 2, the mounting table 21 is rotated about the rotation axis J21 while the storage tube 90 is fixed to the mounting platform 21, whereby the storage tube 90 can be horizontal (for example, the base surface 111). tilt. Thereby, the IC component 9 can be sent out from the storage tube 90 by natural sliding. Here, the place The natural sliding means that the IC element 9 moves along the surface in contact with the IC element 9 by gravity.

<<Supply side arrangement>>

The supply-side arranging unit 3 rearranges a plurality of IC elements 9 supplied from the supply unit 2 into a unit arranged in a predetermined manner. As shown in FIG. 3, the supply-side aligning unit 3 includes a transport path (passage) 31 that is inclined with respect to the horizontal, and the IC element 9 supplied from the supply unit 2 is naturally slid and transported; and the separating mechanism (mechanism) 32 The posture control mechanism 34 is provided on the downstream side of the conveyance path 31, and the distribution mechanism 33 is provided between the conveyance path 31 and the posture control mechanism 34.

-Transportation channel -

A housing tube 90 is connected to the upstream side of the conveying path 31, and the IC elements 9 in the housing tube 90 are sequentially sent out to the conveying path 31 from the foremost side. The IC elements 9 that are sent out to the transport path 31 are naturally slid on the transport path 31, respectively. As shown in FIG. 3, the conveyance path 31 includes a second conveyance path (second passage portion) 312 which is located on the upstream side and is fixed to the base 11 and a first conveyance path (first passage portion) 311. It is located on the downstream side of the second conveyance path 312, and is movable (connected/separated) in the extending direction with respect to the second conveyance path 312. Further, the inclination angle with respect to the horizontal direction of the conveyance path 31 is not particularly limited, and may be, for example, about 30 to 60 degrees.

- Separation mechanism -

As shown in FIG. 4, the separating mechanism 32 is for arranging the first IC component (first electronic component) 9A among the plurality of IC elements 9 arranged on the transfer path 31 and one IC component located after the IC component 9A. (Second electronic component) 9B separated unit. As shown in FIG. 5, according to the manufacturing method of the IC element 9, a burr (protrusion of a parting line or the like) 93 may be generated on the front end surface or the base end surface of the resin sealing body 91, and the burr 93 of the adjacent IC element 9 may be present. The situation of being involved in each other. When such a connection occurs, the IC elements 9 before and after are connected, and there is a flaw in the accurate (correct) transfer of the IC elements 9 in the inspection apparatus 1. Therefore, the separation mechanism 32 is provided to separate the adjacent IC elements 9 to release the implicatures, so that the subsequent IC elements 9 can be accurately Transfer.

The separating mechanism 32 includes a stopper (positioning portion) 321, a first fixing portion 322, a second fixing portion 323, a linear motion cylinder 324, and a return spring 325. The stopper 321 , the first fixing portion 322 , and the second fixing portion 323 are located above the conveyance path 31 and are disposed along the conveyance path 31 .

The stopper 321 can be protruded/retracted (falling/rising) in the middle of the conveyance path 31, and becomes a protruding state (a state shown by a chain line in FIG. 4), whereby the IC component 9 on the conveyance path 31 can be restricted. Naturally glide. Thereby, the IC element 9 can be temporarily retained on the transport path 31, and the IC elements 9A and 9B can be easily separated.

In the present embodiment, the IC element 9A is placed on the first transport path 311 while the IC element 9 is retained on the transport path 31, and the IC element 9B is located in the second transport path 312, and further, the IC elements 9A, 9B are The boundary overlaps with the boundary between the first and second transfer paths 311 and 312 (substantially identical). In other words, the IC element 9A is not in contact with the second transfer path, and the IC element 9B is not in contact with the first transfer path 311.

Further, the position of the stopper 321 can be appropriately adjusted according to the type of the IC element 9. Regardless of which type of IC element 9, the boundary between the IC elements 9A and 9B and the first and second transfer can be performed as described above. The IC elements 9 are retained on the transport path 31 in such a manner that the boundaries of the channels 311 and 312 overlap. However, if at least a part of the IC element 9A is located on the first transfer path 311 and at least a part of the IC element 9B is located on the second transfer path 312, the boundaries may be shifted. In other words, for example, the base end side of the IC element 9A may be in contact with the second transfer path 312, and conversely, the front end side of the IC element 9B may be in contact with the first transfer path 311.

The first fixing portion 322 is located on the upstream side of the stopper 321 and is provided to face the IC element 9A on the first conveying path 311. The first fixing portion 322 can be protruded/retracted (falling/rising), and the resin sealing body 91 of the IC element 9A can be pressed against the first conveying path 311 from the upper side by protruding downward, so that the IC component can be mounted. 9A is fixed to the first transport path 311. Conversely, the fixing of the IC element 9A is released by retracting the first fixing portion 322 to the upper side. According to this configuration, the IC component 9A can be made to the first transport path 311 with a simple mechanism. Fixed/released. Further, since the resin sealing body 91 is pressed against it, substantially no stress is applied to the lead wires, and damage of the lead wires 92 can be prevented.

The second fixing portion 323 is located upstream of the first fixing portion 322 and is provided to face the IC element 9B on the second conveying path 312. The second fixing portion 323 can be protruded/retracted (dropped/raised), and the resin sealing body 91 of the IC element 9B can be pressed against the second transfer path 312 from the upper side by protruding downward, so that the IC component can be mounted. 9B is fixed to the second transfer path 312. On the contrary, the fixing of the IC element 9B is released by retracting the second fixing portion 323 to the upper side. According to this configuration, the IC element 9B can be fixed/released with respect to the second transfer path 312 by a simple mechanism. Further, since the resin sealing body 91 is pressed against it, substantially no stress is applied to the lead wires, and damage of the lead wires 92 can be prevented.

The return spring 325 urges the first conveyance path 311 in a direction in which the first conveyance path 311 approaches the second conveyance path. On the other hand, the linear motion cylinder 324 includes the shaft portion 324a, and the first transport passage 311 is pressed by the shaft portion 324a, whereby the first transport passage 311 can be made to oppose the second transport passage 312 against the urging force of the return spring 325. The direction of separation moves. As described above, according to the configuration in which the linear motion cylinder 324 and the return spring 325 are used, the first transport passage 311 can be smoothly moved. Further, the stopper 321 and the first fixing portion 322 are fixed to the first conveyance path 311 and move together with the first conveyance path 311.

The configuration of the separating mechanism 32 has been described above. Such a separating mechanism 32 separates the IC elements 9A, 9B in the following manner. First, before the supply of the IC element 9 from the supply unit 2, the first transfer path 311 is connected to the second transfer path 312, and the stopper 321 is brought into a protruding state. Then, as shown in FIG. 6(a), the plurality of IC elements 9 which are naturally slid on the transport path 31 by the stopper 321 are attached, and then, as shown in FIG. 6(b), the first fixed portion is fixed. The unit 322 fixes the IC element 9A to the first transport path 311, and the second fixed unit 323 fixes the IC element 9B to the second transport path 312. Next, as shown in FIG. 7( a ), the linear motion cylinder 324 is driven to move the first conveyance path 311 toward the downstream side, and is separated from the second conveyance path 312 . Thereby, the IC element 9A fixed to the first transfer path 311 and the second transfer path are fixed. The IC component 9B on 312 is separated. Here, the second fixing portion 323 is provided with an injection nozzle 323a that ejects compressed air (fluid) to the IC element 9A, and ejects compressed air A from the ejection nozzle 323a to the IC element 9A when the first transfer path 311 is moved. The separation of the IC elements 9A, 9B can be assisted.

After the IC elements 9A and 9B are separated, as shown in FIG. 7(b), the first fixing portion 322 is retracted to release the IC element 9A, and the stopper 321 is retracted, and only the IC element 9A is naturally slid and supplied. To the distribution mechanism 33. This step is repeatedly performed, whereby the IC elements 9 located at the forefront of the transport path 31 are naturally slid sequentially one by one and supplied to the distribution mechanism 33. By sequentially transporting the IC elements 9 one by one, it is possible to prevent the burrs 93 of the adjacent IC elements 9 from being re-engaged with each other to cause such connections. Therefore, the subsequent transfer of the IC element 9 can be performed smoothly and correctly (accurately). In addition, the IC element 9A does not start to naturally slide by merely retracting the stopper 321 by the inclination angle of the conveyance path 31 or the sliding resistance of the IC element 9A or the like. Therefore, when the stopper 321 is retracted, the compressed air can be ejected from the injection nozzle 323a to the IC element 9A. Thereby, the IC component 9A can be naturally slid more reliably.

In the present embodiment, as described above, the boundary between the IC elements 9A and 9B overlaps with the boundary between the first and second transfer paths 311 and 312. Therefore, when the first transfer path 311 and the second transfer path 312 are separated, There is no friction between the IC element 9A and the second transfer path 312, and there is no friction between the IC element 9B and the first transfer path 311. Therefore, the damage of the IC elements 9A, 9B can be more effectively suppressed.

The separation mechanism 32 has been described above. In the present embodiment, the second transport path 312 is fixed to the base 11 and the first transport path 311 is movable relative to the second transport path 312. However, the configuration of the separating mechanism 32 is not limited thereto. For example, contrary to the present embodiment, the first transport path 311 may be fixed to the base 11, and the second transport path 312 may be moved relative to the first transport path 311, and the first and second portions may be used. The transport paths 311, 312 move together.

- Distribution agency -

The distribution mechanism 33 is an IC component 9 that naturally slides on the transport path 31, and is distributed to a plurality of channels, and rearranged into a plurality of rows. As shown in Figure 8, such a dispensing mechanism 33 includes a dispensing platform 331.

The distribution platform 331 is located on the downstream side of the transport path 31 and is inclined to the same extent as the transport path 31. Further, the distribution platform 331 can be reciprocated in the X direction by the linear motion guide. The distribution platform 331 is provided with four distribution channels 332 (332A to 332D) arranged side by side in the X direction. Any one of the four distribution channels 332 is connected to the transport path 31, whereby the IC element 9 that can naturally slide on the transport path 31 is introduced into the distribution channel 332.

In order not to disengage the IC component 9 that has been introduced into the distribution channel 332 directly through the distribution channel 332, as shown in FIG. 9, a stopper 333 that can protrude/retract is provided on each of the distribution channels 332. Further, a cover 334 that covers the upper side of the distribution passage 332 is provided on the distribution platform 331, and a window portion 334a that visually recognizes the IC element 9 disposed on the distribution passage 332 is provided on the cover 334.

The distribution mechanism 33 of such a configuration distributes the IC element 9 as follows. That is, first, in a state where the stopper 333 is protruded, as shown in FIG. 9, the distribution passage 332A is connected to the conveyance path 31. Next, the IC element 9 located at the forefront of the conveyance path 31 is naturally slid by the separation mechanism 32, and is introduced to the distribution passage 332A. For the remaining distribution channels 332B to 332D, the IC elements 9 are also introduced one by one to the respective distribution channels 332 by repeatedly performing this step. Thereby, the IC elements 9 passing through the transport path 31 in one line can be rearranged into four lines. When the IC elements 9 are introduced into the respective distribution channels 332 one by one, the distribution platform 331 is connected to the posture control mechanism 34, and the stoppers 333 are retracted, thereby introducing the IC elements 9 on the respective distribution channels 332 toward the posture control mechanism 34. .

- Posture control mechanism -

The posture control mechanism 34 is a unit that causes the IC element 9 introduced from the distribution mechanism 33 to be in a horizontal state. As shown in FIG. 10, the posture control mechanism 34 includes a mounting platform 341 and a guide. 347.

The mounting platform 341 is located on the downstream side of the distribution platform 331. Moreover, the mounting platform 341 includes: a base 342 that is movable in the Y direction by the guidance of the linear guide; and a tilting platform 343 that is rotatably coupled to the X axis (spinning axis J ₃₄₃ ) Substrate 342. Further, four inclined passages 344 which are arranged side by side in the X direction are provided on the inclined platform 343. The guiding member 347 includes a guiding surface 347a inclined with respect to the horizontal direction, and the inclined surface 343 which is moved in the Y direction together with the base 342 is guided by the guiding surface 347a, thereby rotating the inclined platform 343 with respect to the base 342. The moving shaft J _{343 is} rotated to change the inclination of the inclined platform 343.

According to this posture control mechanism 34, the posture of the inclined platform 343 can be inclined at the same extent as the distribution platform 331 with respect to the horizontal inclined platform 343 as shown in FIG. 10 and connected to the inclined state of the distribution platform 331, and The inclined platform 343 shown in Fig. 11 changes between substantially horizontal horizontal states. If the tilting platform 343 is tilted and the stopper 333 is released, the IC component 9 on the distribution channel 332 can be introduced into the mounting channel 344. Further, the mounting channel 344 is provided with an abutting portion 38 that abuts on the IC element 9. The IC device 9 is placed in the correct position on the mounting path 344 by the IC element 9 abutting against the abutting portion 38.

The posture control mechanism 34 of such a configuration operates as follows. That is, first, as shown in FIG. 10, the inclined platform 343 is tilted, and the mounting channel 344 is connected to the distribution channel 332. Next, the stopper 333 provided on the distribution passage 332 is released, and the IC component 9 of the distribution passage 332 is introduced to the placement passage 344. Next, as shown in FIG. 11, the base 342 is moved in the Y direction, and the inclined platform 343 is displaced from the inclined state to the horizontal state, whereby the IC element 9 on the mounting channel 344 is placed horizontally. Further, the IC element 9 in the horizontal state is transported to the inspection unit 5 by the transport unit 4.

<<Transportation Department>>

As shown in FIG. 12, the transport unit 4 transports the IC element 9 disposed on the inclined platform 343 in the horizontal state to the inspection unit 5, and transports the IC elements 9 that have been inspected in the inspection unit 5 to the recovery side. Unit of Part 6. The conveying unit 4 includes a shuttle unit 41 and a supply guide unit. The person 42, the inspection robot 43, and the recovery robot 44.

- Shuttle -

The hooking portion 41 is for transporting the IC element 9 on the inclined platform 343 to the vicinity of the inspection portion 5, and is used to carry the inspected IC element 9 inspected in the inspection portion 5 to the recovery side. Near the Ministry of 6. The hook portion 41 is arranged in the X direction to form four recessed portions 411 for housing the IC element 9. Further, the shuttle portion 41 is guided by the linear motion guide and is reciprocally movable in the X direction by a drive source such as a linear motor.

-Supply robots -

The supply robot 42 is a robot that transports the IC element 9 disposed on the inclined platform 343 in the flat state to the shuttle unit 41. The supply robot 42 includes a support frame 421 supported on the base 11 and a moving frame 422 supported by the support frame 421 and reciprocally movable in the Y direction with respect to the support frame 421; and 4 hand units (holding robots) ) 423, which is supported by the mobile framework 422. Each of the hand units 423 includes an elevating mechanism and a suction nozzle, and can hold and hold the IC element 9.

- Check the robot -

The inspection robot 43 is a robot that transports the IC component 9 housed in the shuttle unit 41 to the inspection unit 5 and transports the IC component 9 that has been inspected from the inspection unit 5 to the shuttle unit 41. Further, when the inspection robot 43 is inspected, the IC element 9 can be pressed against the inspection unit 5, and a specific inspection pressure can be applied to the IC element 9. The inspection robot 43 includes a support frame 431 supported on the base 11 and a moving frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431; and 4 hand units (holding robots) 433, which is supported by the mobile framework 432. Each of the hand units 433 includes a lifting mechanism and a suction nozzle, and can hold and hold the IC component 9.

-Recycling robots -

The recovery robot 44 is a robot that transports the IC elements 9 that have been inspected in the inspection unit 5 to the collection side alignment unit 6 . Such a recycling robot 44 includes: a support frame 441, which Supported by the substrate 11; a moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441; and 4 hand units (holding robots) 443, which are supported by the moving frame 442. Each of the hand units 443 includes a lifting mechanism and a suction nozzle, and can hold and hold the IC component 9.

The transfer unit 4 transports the IC element 9 as follows. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC component 9 on the inclined platform 343 to the shuttle 41 (step 1). Next, the shuttle unit 41 moves toward the center, and the inspection robot 43 transports the IC component 9 on the shuttle unit 41 to the inspection unit 5 (step 2). Next, the inspection robot 43 transports the IC element 9 that has been inspected in the inspection unit 5 to the shuttle unit 41 (step 3). Next, the shuttle unit 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC element 9 on the shuttle unit 41 to the recovery side array unit 6. By repeating the above steps 1 to 3, the IC element 9 can be transported to the recovery side aligning unit 6 via the inspection unit 5.

The configuration of the transport unit 4 has been described above. However, as the configuration of the transport unit 4, the IC element 9 on the inclined platform 343 can be transported to the inspection unit 5, and the IC element 9 that has been inspected can be returned to the recovery side. The arrangement of the array unit 6 is not particularly limited. For example, the shuttle unit 41 may be omitted, and any one of the supply robot 42 , the inspection robot 43 , and the collection robot 44 may be transported from the tilting platform 343 to the inspection unit 5 and from the inspection unit 5 to the collection side. 6 transfer.

<<Inspection Department>>

The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC element 9. As shown in FIG. 12, the inspection unit 5 includes four inspection sockets 51 on which the IC elements 9 are placed. Probe pins (not shown) electrically connected to the terminals of the IC component 9 are provided in the inspection sockets 51. The IC component 9 disposed on the inspection socket 51 is pressed against the probe pin by a specific inspection by the pressing of the inspection robot 43. Thereby, the IC element 9 is connected to the probe pin, and the IC element 9 is inspected via the probe pin. The inspection of the IC component 9 is performed based on the program stored in the control section 8.

<<Recycling side alignment>>

The collection-side arranging unit 6 is a unit that arranges the IC elements 9 that have been inspected in the inspection unit 5 and are transported by the transport unit 4 and that are sent to the collection unit 7 . As shown in FIG. 13, such a recovery side array portion 6 includes a posture control mechanism 61.

The posture control mechanism 61 is a unit that changes the state of the IC element 9 from a horizontal state to a horizontal state and slides it naturally. Such a posture control mechanism 61 includes a mounting platform 62 and an inclined guide 65.

The mounting platform 62 includes a base 621 that is guided by the linear guide and moved in the Y direction, and a tilting platform 622 that is rotatably coupled to the base 621 about the X axis (spinning axis J ₆₂₂ ). Further, the tilting platform 622 is provided with four mounting channels 623 which are arranged side by side in the X direction, and the IC elements 9 which are transported by the collecting robot 44 are placed one by one on the four mounting channels 623. Further, a cover 626 that covers the upper side of the mounting path 623 is provided on the inclined platform 622, and a window portion 626a that visually recognizes the IC element 9 disposed on the mounting path 623 is provided on the cover 626. In order to prevent the IC device 9 from being placed on the mounting path 623, the cover 626 is placed so as to cover the mounting portion S1 of the IC component 9 that is transported by the recovery robot 44, and covers the mounting portion S1. On the downstream side. Further, the inclined platform 622 includes a shaft portion 624 which is located on the downstream side of the rotation axis J ₆₂₂ and protrudes laterally, and the shaft portion 624 is coupled to the inclined guide 65.

The inclined guide 65 includes a guide groove 651 extending in a direction inclined with respect to the horizontal, and a shaft portion 624 is coupled to the guide groove 651. Therefore, if the base 621 is moved in the Y direction, the inclined platform 622 moves on the one hand together with the base 621 in the Y direction, and is guided by the inclined guide 65 on the one hand, whereby the inclined platform 622 revolves around the rotation axis J _622. Rotate so that its inclination changes.

According to this configuration, the posture of the inclined platform 622 can be made horizontal in a state in which the inclined platform 622 shown in FIG. 13 is horizontal, and the inclined platform 622 shown in FIG. 14 is inclined with respect to the horizontal and connected to the collecting portion 7. The tilt state changes. Furthermore, in order to prevent the IC component 9 on the mounting channel 623 from naturally sliding when the tilting platform 622 is in an inclined state, it is self-loaded. The passage 623 is disengaged, and as shown in FIG. 14, a stopper 625 that can protrude/retract is provided on the mounting passage 623.

The configuration of the posture control mechanism 61 has been described above. Such a posture control mechanism 61 is actuated as follows. That is, first, the inclined platform 622 is placed in a horizontal state (the state shown in FIG. 13). Next, after the IC element 9 is placed on the mounting portion S1, the substrate 621 is moved in the Y direction. Thereby, the inclined platform 622 is moved in the Y direction together with the base 621 to increase the inclination angle, and is inclined (state shown in FIG. 14), and is connected to the collecting portion 7. Next, the stopper 625 is released, whereby the IC component 9 on each of the mounting channels 623 is naturally slid and sent to the recovery unit 7.

<<Recycling Department>>

The recovery unit 7 is a unit that recovers the IC elements 9 that have been inspected based on the inspection results. As shown in FIG. 15, the recovery portion 7 includes a connecting portion 72 located on the downstream side of the inclined platform 622 and connected to the empty receiving tube 90, and a dispensing mechanism 71 located at the connecting portion 72 and the inclined platform 622. The IC element 9 supplied from the inclined platform 622 is distributed to a specific housing tube 90.

The connecting portion 72 includes six connecting passages 721 arranged in the X direction, and an empty receiving tube 90 is connected to the connecting passages 721, respectively. The connecting passage 721 is inclined to the same extent as the inclined inclined platform 622, and is also inclined in the same manner as the housing tube 90 connected to the connecting passage 721. Thereby, the IC element 9 can be introduced into the housing tube 90 by natural sliding.

The four connection channels 721 (721A to 721D) of the six connection channels 721 are assigned to the IC element 9 which is inspected by the inspection unit 5 and which satisfies the specific reference and which is judged as "good", and the remaining two connection channels 721 ( 721E and 721F) are assigned IC elements 9 that have been inspected by the inspection unit 5 and cannot satisfy the specific criteria and are judged to be "defective products".

The distribution mechanism 71 receives the IC element 9 from the tilting platform 622, and distributes the received IC element 9 to the unit of the specific connection channel 721 according to the result of the inspection, respectively. As shown in FIGS. 15 and 16, such a distribution mechanism 71 includes a distribution platform 711. Distribution platform 711 is located The oblique platform 622 and the connecting portion 72 can be moved in the X direction by the linear motion guide. Further, the distribution platform 711 is inclined to the same extent as the inclined platform 622 which is in an inclined state. Further, four distribution channels 712 arranged side by side in the X direction are provided on the distribution platform 711. Further, a cover 714 covering the distribution channel 712 is provided on the distribution platform 711, and a window portion 714a that visually recognizes the IC element 9 disposed on the distribution channel 712 is provided on the cover 714.

The distribution channel 712 of such a distribution platform 711 is coupled to the placement channel 623 of the inclined platform 622, whereby the IC component 9 on the placement channel 623 can be introduced into the distribution channel 712. Here, in order to prevent the IC element 9 introduced into the distribution channel 712 from being detached/dropped directly through the distribution channel 712, a stopper 713 that can protrude/retract is provided on each of the distribution channels 712.

The distribution mechanism 71 of such a configuration distributes the IC element 9 as follows. That is, first, after the stopper 713 is in the protruding state, the IC element 9 on the inclined platform 622 is received. Next, the IC elements 9 on the respective distribution channels 712 are sequentially housed in the specific housing tube 90 via the specific connection passages 721. For example, when the IC component 9 located on the distribution channel 712A is to be allocated to the connection channel 721C, first, the distribution platform 711 is moved in the X direction, and the distribution channel 712A is connected to the connection channel 721C (state of FIG. 16). . Next, the stopper 713 of the distribution passage 712A is retracted so that the IC component 9 on the distribution passage 712 naturally slides, thereby being introduced into the housing tube 90 via the connection passage 721C. The above steps are also sequentially performed for the other distribution channels 712, whereby the IC components 9 on the distribution platform 711 are introduced into the specific housing tube 90.

<<Control Department>>

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs inspection of the electrical characteristics of the IC component 9 disposed on the inspection unit 5, for example, based on a program stored in a memory body (not shown). In addition, the drive control unit controls the driving of the IC unit 9 by controlling the driving of each of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the recovery-side arranging unit 6, and the recovery unit 7.

The electronic component transport apparatus and the electric device of the present invention have been described above based on the embodiments shown in the drawings. Although the sub-part inspection device has been described, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, in the present invention, any other constituents may be added.

9, 9A, 9B‧‧‧ IC components

32‧‧‧Separation agency

91‧‧‧Resin seal

311‧‧‧1st transport channel

312‧‧‧2nd transport channel

321‧‧ ‧block

322‧‧‧1st fixed department

323‧‧‧2nd Fixing Department

324‧‧‧Direct moving cylinder

324a‧‧‧Axis

325‧‧‧Return spring

Claims (9)

An electronic component conveying apparatus comprising: a passage inclined with respect to a specific surface and passing a plurality of electronic components; and a first electronic component of the plurality of electronic components passing through the passage from the first a mechanism for separating the second electronic component after the electronic component; and the mechanism moves at least one of the first electronic component and the second electronic component in a direction separating the other in the direction of the path Thereby, the first electronic component is separated from the second electronic component. The electronic component transporting apparatus of claim 1, wherein the passage is inclined with respect to a horizontal direction, and the electronic component moves by the passage by gravity. The electronic component conveying apparatus according to claim 1 or 2, wherein the passage includes a first passage portion in which the first electronic component is located and a second passage portion in which the second electronic component is located; and the mechanism includes the first electronic component a first fixing portion fixed to the first passage portion and a second fixing portion fixing the second electronic component to the second passage portion; and the mechanism fixing the first electronic component by the first fixing portion After the second electronic component is fixed to the second passage portion by the second fixing portion, at least one of the first passage portion and the second passage portion is made to face the other The first electronic component is separated from the second electronic component by moving in the direction of separation. The electronic component transport device of claim 3, wherein The first fixing portion fixes the first electronic component to the first passage portion by pressing the first electronic component against the first passage portion, and the second fixing portion presses the second electronic component The second electronic component is fixed to the second passage portion in response to the second passage portion. The electronic component transfer apparatus according to claim 4, wherein the electronic component is an IC component sealed by a resin sealing body, and the first fixing portion presses the resin sealing body of the first electronic component against the first via portion The first electronic component is fixed to the first passage portion, and the second fixing portion fixes the second electronic component by pressing the resin sealing body of the second electronic component against the second passage portion. The second passage portion. The electronic component conveying apparatus according to claim 3, wherein the first electronic component is not in contact with the second via portion when the first fixing portion is fixed to the first passage portion; and the second electronic component is used in the second component When the fixing portion is fixed to the second passage portion, the first passage portion is not in contact with each other. The electronic component transport apparatus according to claim 3, wherein the mechanism further includes: a positioning portion that restricts movement of the electronic component, so that at least a part of the first electronic component is located in the first passage portion, and the second portion At least a part of the electronic component is located in the state of the second passage portion. The electronic component transport apparatus according to claim 3, wherein the means for maintaining the first electronic component from the second electronic component is maintained by the second fixing portion to fix the second electronic component toward the second via portion, and The first fixing portion is released to fix the first electronic component toward the first passage portion. An electronic component inspection device comprising: the electronic component conveying device according to any one of claims 1 to 8; and an inspection portion for inspecting the electronic component.