TWM253587U - Separating and transporting device for electronic components - Google Patents

Separating and transporting device for electronic components Download PDF

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Publication number
TWM253587U
TWM253587U TW92219788U TW92219788U TWM253587U TW M253587 U TWM253587 U TW M253587U TW 92219788 U TW92219788 U TW 92219788U TW 92219788 U TW92219788 U TW 92219788U TW M253587 U TWM253587 U TW M253587U
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TW
Taiwan
Prior art keywords
slide
sliding groove
electronic components
groove
electronic
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Application number
TW92219788U
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Chinese (zh)
Inventor
Chao-Lia Wan
Original Assignee
Chao-Lia Wan
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Priority to TW92219788U priority Critical patent/TWM253587U/en
Publication of TWM253587U publication Critical patent/TWM253587U/en

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

M253587 四、創作說明(1) 【新型所屬之技術領域j 本創作主要係在提供一種電子 置,更詳而言之,特别係指一 1作分離搬運裝 件有效分離並進入準確之# $將連續排列之晶片電子元 ^ f I位子’且晶片雷早堂从ΤΑ 破損、毁壞之電子零件 < =零件不會造成 【先前技術】 離搬運裝置。 按,一般習知工作分離搬運裝置大多如第一 其主要係利用滑道座板1内有内第圖所不, 時,分離針1〇需往上伸起凸起於 將晶片電子元件ι〇分離,但其缺點當分 ,針10來回上下時’分離針10容易碰觸到晶片電子元件 一’使晶片電子元件1 0 1損壞、變形或破裂,使得晶片電 子元件1 0 1作動時無法滑動順暢,此等設計上的缺失導致 在操作上極為不便也造成使用者之成本亦相對提高。 有鐘於此,本案創作人長久從事各項機械構造之開發 與研究多年,且對於各項機械構造上的優缺點有相當程度 的熟悉了解,其以本著精益求精之精神潛心研究設計,並 歷經多次測試,終於完成了本創作之設計。 【新型内容】 即,本創作之主要目的在於提供一種可滑動順暢、不 易破損、變形且有效分離等優點的工作搬運分離裝置之改 良。 緣是,本創作所述的電子零件之工作分離搬運裝置主M253587 IV. Creation instructions (1) [Technical field of the new type] This creation is mainly to provide an electronic device, more specifically, especially refers to the effective separation and entry of a 1 for separating and moving parts. Continuously arranged wafer electronics ^ f I seats' and the electronic component of the chip Lei Zao Tang that was damaged or destroyed from the TA < == the parts will not cause [prior art] to leave the handling device. According to the general conventional work, the separating and transporting device is mostly the same as that in the first figure. The separation needle 10 needs to be raised upward to bulge the electronic components of the wafer. Separation, but its shortcomings: When the needle 10 is moved up and down, the 'separation needle 10 easily touches the chip electronic components', which damages, deforms or breaks the chip electronic components 101, making the chip electronic components 1 1 unable to slide when they are actuated. Smoothly, the lack of these designs results in extremely inconvenient operation and relatively high costs for users. There is a bell here. The creator of this case has been engaged in the development and research of various mechanical structures for many years, and has a considerable degree of familiarity with the advantages and disadvantages of various mechanical structures. He has devoted himself to research and design in the spirit of excellence. Several tests have finally completed the design of this creation. [New content] That is, the main purpose of this creation is to provide an improved work transport separation device that can slide smoothly, is not easily damaged, deformed, and effectively separates. The reason is that the main work separation and transportation device of the electronic parts described in this creation

M253587 四、創作說明(2) 要構造,其大致自. 晶片電子零件正:滑道座板其上部有一滑行槽,供 件放置之容置槽動、外周設有多數供晶片電子零 分離並位於滑道下:圓盤和可使晶片電子零件 器,i;ί ϊ ί上部滑行槽之分離裝置侧邊裝設-感知 路於滑行槽表面,且在滑行槽中有吸附口連接 L 圓盤之吸附口亦也和真空裝置相連接^ 效將晶片電子零=知放和分離裝置上、下之作動,有 暢,不致破料,更=搬運1正確位置,使之進料時順 【實施方式】更犯達到節省時間、降低成本等優點。 a ^^對於本創作之目㈣、功效及構造、特徵,有更詳翥 日」了解,茲舉一較佳實施例並配合圖示說明如后: =參閱第二圖並配合第三、四圖所示,其分別為本創 作之平面示意圖、剖面圖以及作動圖。 ”、 由第二圖可知,本創作所述工作搬運分離裝置之改良 2 ’、03有一滑道座板20和一旋轉自如之圓盤21,在滑 道座板20上部有一可供晶片電子零件3、30、301、302… 正確排列滑動之滑行槽2〇1和在圓盤21外周設有多數供晶 片電子零件3、30、301、302…放置之容置槽210、211曰、曰 212、213,並在滑道座板2〇之滑行槽2〇1内對向圓盤Η適 當處設置一分離裝置22,可有效使晶片電子零件3、3〇、 3 01、302···分離。 由第二圖可知,在滑道座板2 0之滑行槽2 〇 1内部於分M253587 IV. Creation instructions (2) To be constructed, it is roughly self-contained. Chip electronic components are as follows: the slide seat plate has a sliding groove on the upper part, and the accommodation groove for moving parts is provided. Under the slideway: the disc and the electronic device that can make the chip, i; ί ί The side of the separation device of the upper slide groove is installed on the surface of the slide groove, and there is an adsorption port in the slide groove to connect the L disk. The suction port is also connected to the vacuum device. ^ The electronic zero of the wafer is effectively moved up and down. It is smooth and does not cause material breakage. It also means that the correct position of the conveying 1 is to make the feeding process smooth. 】 More offenses to save time, reduce costs and other advantages. a ^^ I have a more detailed understanding of the purpose, effect, structure, and characteristics of this creation ", I will give a preferred embodiment with illustrations as follows: = Refer to the second picture and cooperate with the third and fourth As shown in the figure, it is a schematic plan view, a sectional view and an action diagram of the creation. As can be seen from the second figure, the improvement 2 ′, 03 of the work conveying and separating device described in this work has a slide base plate 20 and a freely rotatable disc 21. On the upper portion of the slide base plate 20, there are electronic components for chips. 3, 30, 301, 302 ... The sliding grooves 001 that are correctly arranged for sliding and a large number of electronic parts 3, 30, 301, 302 for the wafers are provided on the outer periphery of the disk 21. 210, 211, 212 , 213, and a separating device 22 is provided at an appropriate position in the facing groove 1 of the slide groove 20 of the slideway seat plate 20, which can effectively separate the electronic components 3, 30, 3 01, 302 of the wafer ... As can be seen from the second figure, the inside of the sliding groove 2 001 of the slide seat plate 20 is divided into two parts.

第8頁Page 8

M253587 四、創作說明(3) 離裝置22之外側有-感知器23 ’並顯露於滑行槽2 面’且在滑行槽201中有吸附口2〇2、2〇3、2()4 ^ 吸附口 202、2〇3、204、205為一錐形之態樣’其可防止且友 體不致一下爆衝,使晶片電子零件3、3〇、3〇i 出或彎曲於滑行槽内,再連接一真空裝置24。 坪 另’在圓盤之適當處亦有—吸附口 2m,並對 板20之滑行槽2。1,此吸附口210。連接相同之真空 由圖可知,感知器23感測到晶片電子零 =1;容置細時,真空裝置24迅速作零動件=M253587 IV. Creation instructions (3) There is a sensor 23 outside the device 22 and exposed on the taxiing groove 2 side, and there are adsorption ports 202, 203, 2 () 4 in the sliding groove 201. ^ Adsorption The mouths 202, 203, 204, and 205 are in a conical shape. 'It can prevent and prevent the friendly body from bursting, so that the chip electronic parts 3, 30, and 30i come out or bend in the sliding groove. Connect a vacuum device 24. There is also a suction port 2m at the appropriate place of the disc, and the sliding slot 2.1 of the plate 20 is the suction port 210. Connect the same vacuum. As can be seen from the figure, the sensor 23 senses the electronic zero of the wafer = 1; when the volume is small, the vacuum device 24 quickly moves to zero.

到之晶片電子零件3吸附至容置㈣G中,同 時滑灯中之晶片電子雲:株J ^ ^ ^ ^ a 2 02 ^ 2 ^ ^ Χ24 時分離裝置22内部之分離針22〇往上制吸^而停止滑動,此 愛杜Ίη qni 1丨I刀離針220在上,再次阻止晶片電子 ΓΓ電子零件;fV有效糊 動,而八Μ # € 301做區隔分離,待真空裝置24停止 Ϊ循Ϊ 2内部之分離針220往下時,再做另-次 片電圖可知’該滑道座板20之滑行槽201有數個晶 ’、3°2...滑行,並在靠近圓盤21附 附近之侧3亦!2一2和感知器23,而圓盤21靠近滑道座板2。 不停的運轉日’當開關開啟’圓盤21開始 道座版20 ^邮曰日片電零件3、3〇、301、302…開始在滑 、座〇上4之滑行槽201内有規律的向前滑動;The wafer electronic component 3 is adsorbed into the housing ㈣G, and the wafer electron cloud in the slide lamp is simultaneously strained: strain J ^ ^ ^ ^ a 2 02 ^ 2 ^ ^ × 24 when the separation needle 22 inside the separation device 22 sucks upwards ^ And stop sliding, this love Ί q qni 1 丨 I knife away from the needle 220 on top, once again stop the chip electron ΓΓ electronic parts; fV effectively twitches, and the eight M # € 301 is separated and separated, wait for the vacuum device 24 to stop Ϊ When the separation needle 220 inside the loop 2 goes down, do another-second electrograph to find that 'the slide groove 201 of the slide plate 20 has several crystals', 3 ° 2 ... slide, and close to the disc 21 with nearby side 3 also! 2-2 and the sensor 23, and the disc 21 is close to the slide plate 2. Non-stop operation day 'when the switch is turned on', the disc 21 starts the Dojo version 20 ^ The Japanese electric parts 3, 30, 301, 302 ... began to slide regularly in the sliding groove 201 on the slide and the seat 0 Slide forward

第9頁 M253587Page 9 M253587

當圓盤21之容置槽210和滑道座板20之滑形槽2〇1 時’感知器23感測到晶片電子零件3,,分離裝 離針22 0低於滑行槽2〇1之平面,圓盤21側邊之吸附 立即將電子元件3吸附至容置槽210中,同時間滑行槽2〇1 上之吸附口 202、203、204、205也吸附電子元件⑽ 不向前滑行’分離裝置22之分離針2 20高於滑行座板'2〇之 滑行槽201時,使電子元件301、302、303...能順料_, 再進入另一循環中; 四、創作說明(4) 如此周而復始的作動,使晶片電子零件3、3 〇 ^、 302、3 03…能快速有效分離一個接一個進入單一容置槽 210且晶片電子元件3不會造成破損、毀壞。 曰 依據上述可知,本創作具有如下之優點: 1 ·損壞率降低··係以利用真空裝置藉由吸附口之 吸、放將滑行於滑道座板上部滑行槽内之晶片電子元件有 效吸附,不會因分離裝置之分離針凸於滑行槽表面,而晶 片電子零件受強烈擠壓造成破碎、損壞。 2 ·成本降低··利用本創作之構造,使得滑行於滑道座 板上部滑行槽内之晶片電子元件損壞率降低,滑行更加順 暢,亦即可同時大量快速包裝或檢測產品,包裝或檢測時 間快且因降低折損率進而有效的降低成本。 练合上述,本創作在同類產品中實具有極佳之進步實 用性,同時遍查國内外關於此類結構之技術資料文獻中, 未發現有相同近似之構造存在在先,應已符合『創作 性』、『合於產業利用性』以及『進步性』的專利要件, M253587 四、創作說明(5) 爰依法之提出申請。 唯,以上所述者,僅係本創作之一較佳實施例而已’ 故舉凡應用本創作說明及申請專利範圍所為之等效結構變 化,理應包含在本專利之專利發明内。When the receiving groove 210 of the disc 21 and the sliding groove 2001 of the slide base plate 20 are sensed by the sensor 23, the electronic component 3 of the wafer is separated, and the separation needle 22 is lower than the sliding groove 2101. On the plane, the adsorption of the side of the disc 21 immediately adsorbs the electronic component 3 into the accommodation groove 210, and the adsorption openings 202, 203, 204, and 205 on the sliding groove 201 at the same time also adsorb the electronic components. When the separation needle 2 20 of the separation device 22 is higher than the sliding groove 201 of the sliding seat plate '20, the electronic components 301, 302, 303, etc. can be flown in, and then enter another cycle; 4. Creation instructions ( 4) This cycle of actions makes the chip electronic parts 3, 3 ^, 302, 3 03 ... quickly and effectively separate one by one into the single accommodating slot 210 and the chip electronic component 3 will not be damaged or destroyed. According to the above, this creation has the following advantages: 1 · The damage rate is reduced. · The electronic components that slide in the sliding groove on the upper part of the slide plate are effectively adsorbed by using a vacuum device to suck and release the suction port. The separation pin of the separation device will not protrude from the surface of the sliding groove, and the electronic components of the chip will be broken and damaged due to strong extrusion. 2 · Cost reduction ·· Using the structure of this creation, the damage rate of chip electronic components gliding in the gliding groove on the upper part of the slide plate is reduced, and the gliding is smoother, which means that a large number of rapid packaging or testing products can be made at the same time, packaging or testing time Quickly and effectively reduce costs by reducing the break rate. Combining the above, this creation has excellent progress and practicality among similar products. At the same time, it has not been found that the same approximate structure exists in the technical data of domestic and foreign literature on such structures. "", "Suitable for industrial use" and "progressive" patent requirements, M253587 IV. Creation Instructions (5) Apply according to law. However, the above is only one of the preferred embodiments of this creation ', so the equivalent structural changes that apply the description of this creation and the scope of patent application should be included in the patented invention of this patent.

第11頁 M253587 圖式簡單說明 第一圖係為習知之示意圖 第二圖本創作之平面示意圖 第三圖本創作之剖面圖 第四圖本創作之作動圖。 主要元件編號 滑道座板2 0 ; 吸附 σ202、203、204、205 ; 滑行槽201 ; 圓盤21 ;吸附口2100 ; 容置槽21 0、21 1、21 2、213 ; 分離裝置22 ;分離針220 ; 感知器23 ;真空裝置24。 晶片電子零件3、30、301、3 02 ;Page 11 M253587 Brief description of the drawings The first picture is a conventional schematic diagram The second diagram is a plan view of the creation The third picture is a cross-section view of the creation The fourth picture is an action drawing of the creation. Main component number Slideway seat 20; Adsorption sigma 202, 203, 204, 205; Sliding groove 201; Disk 21; Adsorption opening 2100; Receiving groove 21 0, 21 1, 21 2, 213; Separation device 22; Separation Needle 220; sensor 23; vacuum device 24. Wafer electronic parts 3, 30, 301, 3 02;

第12頁Page 12

Claims (1)

M253587 五、申請專利範圍 1. 一種電子 一滑道座 子 動 一圓盤: 零 對 其特 器,並於 空裝置, 感知器控 有效將晶 時順暢, 點。 2 ·依據申請 置,其中 3·依據申請 置,其中 使用者之 零件之工作搬運裝置,其包含有: 板··係在滑道座板上部有一滑行槽,供晶片電 零件滑動,並在滑行槽内部裝設一可上、下作 將晶片電子零件有效分離之分離裝置; 係可旋轉自如,並在圓盤外周設有供晶片電子 件放置之奋置槽,另在適當處有一吸附口,並 向著滑道座板之滑行槽; 欲在於在π道座板之滑行槽内裝設一感知 滑行槽表且在滑行槽中有吸附口連接一直 制裝置吸、:ί 裝置相連接,利用 片電子零件分離和搬、m 一 了之作動, 不致破“達到節省時間、降低成本等優 專利範圍第1項所述的雷 ,該所述之吸附口可’電子零件之工作搬運裝 專利範園第1項所述的為電一子錐::之態樣 ,該所述之滑行槽中 7之工作I運裝 需求而定。 及附口可為一只以上’以M253587 5. Scope of patent application 1. An electronic slideway holder moves a disc: zero to its special device and an empty device, the sensor control effectively smoothes the crystal time. 2 · Placed according to the application, of which 3 · Placed according to the application, where the user's work handling device includes: Plate · · There is a slide groove on the upper part of the slide plate, which is used to slide the electrical parts of the chip and slide. Inside the tank is installed a separating device that can effectively separate the electronic components of the wafer; it can be rotated freely, and there is a perforated groove on the periphery of the disc for the placement of the electronic components of the wafer, and there is an adsorption port at an appropriate place. It is facing the sliding groove of the slideway seat plate. It is intended to install a sensing slideway surface in the sliding groove of the π track plate and have an adsorption port connected to the sliding groove in the sliding groove. Separation and removal of electronic parts, and the operation of m, do not break the thunder described in the first patent range of "saving time and reducing costs, etc.", said adsorption port can be used for electronic parts working and loading patents. The item 1 is the electric one cone :: state, the operation of the sliding groove 7 in the said I depends on the shipment requirements. And the attachment port can be more than one 'to
TW92219788U 2003-11-07 2003-11-07 Separating and transporting device for electronic components TWM253587U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI578002B (en) * 2014-03-25 2017-04-11 Seiko Epson Corp Electronic parts conveyor and electronic parts inspection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI578002B (en) * 2014-03-25 2017-04-11 Seiko Epson Corp Electronic parts conveyor and electronic parts inspection device

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