TWM624906U - Suction nozzle structure - Google Patents

Abstract

A suction nozzle structure comprises: a suction nozzle body, a first film layer and a second film layer. The suction nozzle body is provided with a joint part and an adsorption part, a ventilation pipeline is arranged inside the joint part, the ventilation pipeline is communicated with the adsorption part, and the adsorption part is provided with a contact surface; the first film layer is a fog surface and the second film layer is smooth and arranged on the first film layer. Because the first film layer has a rough matte shape, the nozzle body is not easy to stick to the adsorbed objects such as chips, wafers or glass substrates when in use, and has an anti-sticking effect. The second film layer is smooth, so that the suction nozzle body is not easy to scratch the adsorbed objects such as wafers, wafers or glass substrates when in use.

Description

Nozzle structure

This creation is about a suction nozzle, especially the suction nozzle structure of a vacuum suction nozzle.

A common rubber tip, such as an "adsorber for die-bonding equipment" disclosed in the Republic of China Patent No. M443933, in the first figure of the case, the adsorber includes a body generally in the shape of an inverted cover, with A connecting end and a contacting end, the connecting end is connected to the crystal taking mechanism, the bottom side of the contacting end is provided with a concave and an annular adsorption surface formed on the outer side of the concave. The air suction channel penetrates from the top end of the connection end to the concave and communicates with the vacuum air source. Taking the case of M443933 as an example, the suction parts (ie suction nozzles) are used to suction electronic raw materials such as wafers, semiconductor wafers (Wafer), panels, glass substrates, circuit boards, etc. put action.

However, the material of the suction nozzle is rubber, such as Nitrile Butadiene Rubber (NBR), or other soft materials, such as Silicone, which makes the suction nozzle easy to stick to the object to be adsorbed after being used for a period of time. The dirt particles (Particles) will cause the subsequent adsorption capacity to decrease, and even affect the service life of the nozzle. Or, the contact surface of the suction nozzle is adhered to impurities, such as silicon slag after wafer dicing, or metal pads that are lifted off on the chip, for example. Impurities sticking to the contact surface will cause the nozzle to scratch the wafer or even damage the nozzle when it adsorbs the next wafer, resulting in a complete loss of adsorption capacity.

Therefore, how to improve the above-mentioned deficiencies is what the creator of this case wants to solve. where the technical difficulties lie.

In view of the habit, the purpose of this creation is to solve and improve the problems and deficiencies existing in the habit.

In order to achieve the above purpose, the present invention provides a suction nozzle structure, which includes: a suction nozzle body, a first film layer and a second film layer. The suction nozzle body is provided with a joint part and an adsorption part, a ventilation pipeline is arranged inside the joint part, the ventilation pipeline is communicated with the adsorption part, and the adsorption part is provided with a contact surface; the first film layer is a fog surface and the second film layer is smooth and arranged on the first film layer.

Wherein, the joint portion is cylindrical shape.

Wherein, the adsorption part is in the shape of a funnel.

Wherein, the joint portion and the adsorption portion are integrally formed.

Wherein, the joint portion and the adsorption portion are assembled and formed.

Because the first film layer has a rough matte shape, the nozzle body is not easy to stick to the adsorbed objects such as chips, wafers or glass substrates when in use, and has an anti-sticking effect. The second film layer is smooth, so that the suction nozzle body is not easy to scratch the adsorbed objects such as wafers, wafers or glass substrates when in use.

1: Nozzle body

11: Joint

12: Adsorption part

13: Ventilation line

14: Contact surface

2: The first film layer

3: The second film layer

100: adsorbate

[Fig. 1] is a three-dimensional perspective structural schematic diagram of the structure of the suction nozzle of this creation.

[Fig. 2] is a cross-sectional view of the structure of the nozzle for this creation.

[ Fig. 3 ] is a schematic diagram of a suction nozzle structure for sucking an object to be adsorbed.

In order to make it easier for your examiners to understand the other features and advantages of this creation, as well as the effects achieved, this creation is hereby combined with the attached drawings, and the detailed descriptions are as follows:

Please refer to FIG. 1 and FIG. 2 , the present invention provides a suction nozzle structure, which includes: a suction nozzle body 1 , a first film layer 2 and a second film layer 3 .

Please refer to FIG. 1 and FIG. 2 , the nozzle body 1 is provided with a joint portion 11 and an adsorption portion 12 , and a ventilation pipe 13 is arranged inside the joint portion 11 , and the ventilation pipe 13 is communicated with the adsorption portion 12 . , the adsorption part 12 is provided with a contact surface 14 . Specifically, the nozzle body 1 can be a synthetic rubber material or other soft material, such as Nitrile Butadiene Rubber (NBR), or, for example, Silicone. The combining portion 11 and the adsorption portion 12 may be integrally formed, or the combining portion 11 and the adsorption portion 12 may be assembled and formed. The coupling portion 11 and the adsorption portion 12 may have any shape and appearance. In this case, the coupling portion 11 is cylindrical and the adsorption portion 12 is funnel-shaped, but not limited thereto.

The first film layer 2 is matte (rough) and is provided on the contact surface 14 . A matte surface refers to a surface with a fine structure, meaning that the surface has grain-like depressions. The second film layer 3 is smooth and disposed on the first film layer 2 . The first film layer 2 and the second film layer 3 can be polyethylene terephthalate (PET), or other polyester films, polyimide films, polyimide films, polypropylene Film, polystyrene film, but not limited thereto. The first film layer 2 and the second film layer 3 can be formed by plating.

Please refer to FIG. 3 , the suction nozzle structure of the present invention can be used to absorb an object to be absorbed 100 to perform displacement and placement actions. Wherein, the joint part 11 of the nozzle body 1 can be combined with the machine table, the ventilation pipeline 13 can be communicated with the vacuum generating device of the machine table, and the vacuum generating device can be used as a Vacuum air source.

Through the automatic operation of the machine, the nozzle body 1 is moved to the object to be adsorbed 100, and the contact surface 14 of the adsorption part 12 is in contact with the object to be adsorbed 100, and then the ventilation pipe is generated by a vacuum generating device. The air in the passage 13 is drawn out, and a negative pressure is formed in the ventilation pipe 13, so that the contact surface 14 of the adsorption part 12 adsorbs the adsorbed object 100, and then performs displacement and placement operations. The adsorbed object 100 can be, for example, a wafer, a wafer or a glass substrate.

Wherein, the ventilation line 13 is formed into a negative pressure by a vacuum generating device, so that the contact surface 14 of the adsorption part 12 can adsorb the adsorbed object 100, which is well known to those skilled in the art, and its operation principle is not the technical feature of the present case. It will not be repeated here.

To sum up, in the suction nozzle structure of the present invention, the first film layer 2 is in a rough and foggy shape, so that the contact surface 14 of the suction part 12 is not easy to stick to the chip, crystal when the suction nozzle body 1 is in use. The object 100 to be adsorbed, such as a circle or a glass substrate, has the effect of anti-sticking, and the second film layer 3 is smooth, so that the contact surface 14 of the adsorption part 12 is not easy when the nozzle body 1 is in use. The adsorbed object 100 such as a wafer, a wafer or a glass substrate is scratched.

The above discussion is only a preferred embodiment of this creation, and is not intended to limit the scope of this creation; therefore, the equivalent shape, structure or combination changes made without departing from the spirit and scope of this creation should be Covered within the scope of the patent application for this creation.

1: Nozzle body

11: Joint

12: Adsorption part

13: Ventilation line

14: Contact surface

2: The first film layer

3: The second film layer

Claims (5)

A suction nozzle structure comprising: a suction nozzle body is provided with a joint part and an adsorption part, a ventilation pipeline is arranged inside the joint part, the ventilation pipeline is communicated with the adsorption part, and the adsorption part is provided with a contact surface; a first film layer, which is in the shape of a matte surface, and is disposed on the contact surface; and A second film layer is smooth and disposed on the first film layer. The suction nozzle structure according to claim 1, wherein the joint portion is cylindrical. The suction nozzle structure according to claim 1, wherein the suction portion is in the shape of a funnel. The suction nozzle structure according to claim 1, wherein the joint portion and the suction portion are integrally formed. The suction nozzle structure according to claim 1, wherein the joint portion and the suction portion are assembled and formed.

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