CN208819856U

CN208819856U - A kind of vacuum WAND

Info

Publication number: CN208819856U
Application number: CN201821768321.6U
Authority: CN
Inventors: 孙超; 任红州
Original assignee: Zing Semiconductor Corp
Current assignee: Zing Semiconductor Corp
Priority date: 2018-10-29
Filing date: 2018-10-29
Publication date: 2019-05-03
Anticipated expiration: 2028-10-29

Abstract

The utility model provides a kind of vacuum WAND, silicon wafer is put for inhaling, including hand-held part and sucker, the suction cup sealed is connected on an end face of the hand-held part, the sucker is mantle material, the sucker is recessed inwardly to form a suction tank far from the surface of the hand-held part, an airflow channel being connected with suction tank is offered on the sucker, a venthole is offered on the hand-held part, the inside of the hand-held part offers the gas passage of the connection venthole and the airflow channel.Silicon wafer is adsorbed on sucker by vacuum WAND, the sucker of mantle material is squeezed, air is discharged and forms vacuum or semi-vacuum state in sucker hole, sucker vacuum is controlled with venthole is unclasped by the suction tank of extruding sucker, to achieve the purpose that pipette silicon wafer, realizes the miniaturization of vacuum WAND, operator one hand is operated, production efficiency and easy to use is improved, additional vacuum source is not needed, reduces production cost.

Description

A kind of vacuum WAND

Technical field

The utility model belongs to semiconductor manufacturing equipment, and in particular to a kind of vacuum WAND.

Background technique

Fig. 1 is a kind of structural schematic diagram of vacuum WAND in the prior art, referring to FIG. 1, at present in the polishing of silicon wafer Vacuum WAND used in industrial manufacturing process comprising gas passage pipe portion 1 and be connected with one end of gas passage pipe portion 1 Sucker 2, the other end of gas passage pipe portion 1 connects vacuum source 3, and gas passage pipe portion 1 includes a hand-held part 4, the hand It holds and is provided with one in portion 4 for blocking the button 5 of vacuum.

When silicon wafer carries out twin polishing, need for silicon wafer to be put into the card slot of erratic star wheel.Due to board upper piece and under The vacuum source equipment used when piece is larger, needs the additional vacuum source 3 beside polissoir, and due to vacuum source 3 Position immobilizes, and limits the operating area for leading to operator, impacts to production efficiency.

In addition, operator needs to pay attention to hand-held part 4 when in use cannot contact silicon wafer, operation is bothersome laborious and may be right Silicon wafer causes to damage, and reduces production yield and production efficiency.

Utility model content

One of the purpose of this utility model is to provide a kind of vacuum WAND, be led with solving vacuum WAND in the prior art The low problem of the production efficiency of cause.

The another object of the utility model is to improve the production yield of silicon wafer in polishing process manufacturing process.

In order to solve the above technical problems, the utility model provides a kind of vacuum WAND, silicon wafer is put for inhaling, including hand-held Portion and sucker, the suction cup sealed are connected on an end face of the hand-held part, and the sucker is mantle material, the sucker Surface far from the hand-held part is recessed inwardly to form a suction tank, and the gas being connected with suction tank is offered on the sucker Circulation road offers a venthole on the hand-held part, and the inside of the hand-held part offers the connection venthole and institute State the gas passage of airflow channel.

Preferably, the material of the hand-held part is non-metallic material.

Preferably, the material of the hand-held part is PVC material.

Preferably, the hand-held part is round or oval along the cross sectional shape perpendicular to its length direction.

Preferably, the material of the sucker is antistatic and the mantle material for not hanging dirt.

Preferably, the material of the sucker is silica gel material.

Preferably, the shape of the sucker is sheet or horn-like.

Preferably, the venthole is located on the side wall of the hand-held part.

Preferably, the venthole is located on another end face of the hand-held part.

Preferably, the centerline collineation of the center line of the airflow channel and the gas passage.

Compared with prior art, the utility model provides a kind of vacuum WAND, puts silicon wafer for inhaling, including hand-held part and Sucker, the suction cup sealed are connected on an end face of the hand-held part, and the sucker is mantle material, and the sucker is separate The surface of the hand-held part is recessed inwardly to form a suction tank, and it is logical that the air-flow that one is connected with suction tank is offered on the sucker Road offers a venthole on the hand-held part, and the inside of the hand-held part offers the connection venthole and the gas The gas passage of circulation road.Silicon wafer is adsorbed on sucker by vacuum WAND, and the sucker of mantle material is squeezed, in sucker hole Air is discharged and forms vacuum or semi-vacuum state, by squeezing the suction tank of sucker and to unclasp venthole true to control sucker Sky realizes the miniaturization of vacuum WAND to achieve the purpose that pipette silicon wafer, and operator one hand is operated, Production efficiency and easy to use is improved, additional vacuum source is not needed, reduces production cost.

Further, the material of the hand-held part is non-metallic material, avoids polluting silicon wafer, improves polishing process The production yield of silicon wafer in manufacturing process.

Further, the material of the sucker is antistatic and the mantle material for not hanging dirt, is avoided in the production of the surface of silicon wafer Raw electrostatic, spot and micronic dust, improve the production yield of silicon wafer in polishing process manufacturing process.

Detailed description of the invention

Fig. 1 is a kind of structural schematic diagram of vacuum WAND in the prior art；

Fig. 2 is a kind of structural schematic diagram of vacuum WAND provided by the embodiment of the utility model；

Fig. 3 is the structural schematic diagram of another vacuum WAND provided by the embodiment of the utility model；

Wherein, 1- gas passage pipe portion；2- sucker；3- vacuum source；The hand-held part 4-；5- button；The hand-held part 10-；11- inhales Disk；12- venthole；13- gas passage.

Specific embodiment

Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of vacuum WAND make further specifically It is bright.According to claims and following explanation, will be become apparent from feature the advantages of the utility model.It should be noted that attached drawing is equal Using very simplified form and using non-accurate ratio, only to convenient, lucidly aid illustration the utility model is real Apply the purpose of example.The same or similar appended drawing reference represents the same or similar component in attached drawing.

Fig. 2 is a kind of structural schematic diagram of vacuum WAND provided by the embodiment of the utility model.Referring to FIG. 2, a kind of true Suction pen puts silicon wafer, including hand-held part 10 and sucker 11 for inhaling, and the sucker 11 is sealedly attached to the one of the hand-held part 10 On a end face, the connection type between the sucker 11 and an end face of the hand-held part 10 can carry out glue using jelly It connects, alternatively, the sucker 11 is socketed on an end face of the hand-held part 10, the sucker 11 is mantle material, the suction Disk 11 is recessed inwardly to form a suction tank far from the surface of the hand-held part, offers one on the sucker 11 and is connected with suction tank Logical airflow channel offers a venthole 12 on the hand-held part 10, and the inside of the hand-held part 10 offers a connection institute State the gas passage 13 of venthole 12 and the airflow channel.Silicon wafer is adsorbed on sucker 11 by vacuum WAND, mantle material The sucker 11 of matter is squeezed, and air is discharged and forms vacuum or semi-vacuum state in 11 hole of sucker, by the suction for squeezing sucker 11 Air drain and venthole 12 is unclasped to control 11 vacuum of sucker, to achieve the purpose that pipette silicon wafer, realize the small of vacuum WAND Type operates operator one hand, improves production efficiency and easy to use, does not need additional vacuum Gas source reduces production cost.

Further, the material of the hand-held part 10 is non-metallic material, avoids polluting silicon wafer, improves buffer The production yield of silicon wafer in skill manufacturing process.

Further, the material of the hand-held part 10 is PVC material, effectively prevents polluting silicon wafer, use simultaneously The surface of the hand-held part 10 of PVC material is smooth, it is possible to prevente effectively from abrading silicon wafer when carrying out adsorption operations, improves buffer The production yield of silicon wafer in skill manufacturing process.

Further, the hand-held part 10 is round or oval along the cross sectional shape perpendicular to its length direction, it is round and Ellipse is more conform with ergonomics, so as to agree with the natural form of human body to the greatest extent, reduces the fatigue of operator Sense, to improve production efficiency, it should be appreciated that such restriction be only used for illustrating the hand-held part 10 along perpendicular to The cross sectional shape of its length direction, the cross sectional shape may be the shapes such as subcircular.

Further, the material of the sucker 11 is antistatic and does not hang the mantle material of dirt, the sucker 11 of mantle material by It squeezes, air is discharged and forms vacuum or semi-vacuum state in 11 hole of sucker, avoids and generates electrostatic, spot on the surface of silicon wafer And micronic dust, improve the production yield of silicon wafer in polishing process manufacturing process.

Further, the material of the sucker 11 is silica gel material, avoids causing to damage to silicon wafer, improves polishing process system The production yield of silicon wafer during making.

Further, the shape of the sucker 11 is sheet or horn-like, it should be appreciated that such restriction is only used for illustrating Illustrate that the structure of the sucker 11, the shape of the sucker 11 may be to have that suction tank can be formed inside hemispherical etc. Other structures.

Further, the venthole 12 is located on the side wall of the hand-held part 10, convenient for operating with, to improve production effect Rate, it should be appreciated that such restriction is only used for illustrating the structure of the vacuum WAND, and Fig. 3 is that the utility model is implemented The structural schematic diagram for another vacuum WAND that example provides, referring to FIG. 3, the venthole 12 can also be located at the hand-held part On 10 another end face.

Further, the centerline collineation of the center line of the airflow channel and the gas passage 13, it should be appreciated that this The restriction of sample is only used for illustrating the structure of the vacuum WAND, the center line of the airflow channel and the gas passage 13 Center line may be set to be it is not conllinear.

In conclusion the utility model provides a kind of vacuum WAND, silicon wafer, including hand-held part and sucker are put for inhaling, The suction cup sealed is connected on an end face of the hand-held part, and the sucker is mantle material, and the sucker is far from described The surface of hand-held part is recessed inwardly to form a suction tank, and an airflow channel being connected with suction tank is offered on the sucker, A venthole is offered on the hand-held part, the inside of the hand-held part offers the connection venthole and the air-flow is logical The gas passage in road.Silicon wafer is adsorbed on sucker by vacuum WAND, and the sucker of mantle material is squeezed, air in sucker hole It is discharged and forms vacuum or semi-vacuum state, sucker vacuum is controlled with venthole is unclasped by the suction tank of extruding sucker, from And achieve the purpose that pipette silicon wafer, the miniaturization of vacuum WAND is realized, operator one hand is operated, is improved Production efficiency and easy to use, does not need additional vacuum source, reduces production cost.

Foregoing description is only the description to the utility model preferred embodiment, not to any limit of the scope of the utility model Fixed, any change, the modification that the those of ordinary skill in the utility model field does according to the disclosure above content belong to right and want Seek the protection scope of book.

Claims

1. a kind of vacuum WAND puts silicon wafer for inhaling, which is characterized in that including hand-held part and sucker, the suction cup sealed connection In on an end face of the hand-held part, the sucker is mantle material, and surface of the sucker far from the hand-held part is inside Recess forms a suction tank, offers an airflow channel being connected with suction tank on the sucker, opens up on the hand-held part There is a venthole, the inside of the hand-held part offers the gas passage of the connection venthole and the airflow channel.

2. a kind of vacuum WAND as described in claim 1, which is characterized in that the material of the hand-held part is non-metallic material.

3. a kind of vacuum WAND as claimed in claim 2, which is characterized in that the material of the hand-held part is PVC material.

4. a kind of vacuum WAND as described in claim 1, which is characterized in that the hand-held part is along perpendicular to its length direction Cross sectional shape is round or oval.

5. a kind of vacuum WAND as described in claim 1, which is characterized in that the material of the sucker is antistatic and does not hang dirt Mantle material.

6. a kind of vacuum WAND as described in claim 1, which is characterized in that the material of the sucker is silica gel material.

7. a kind of vacuum WAND as described in claim 1, which is characterized in that the shape of the sucker is sheet or horn-like.

8. a kind of vacuum WAND as described in claim 1, which is characterized in that the venthole is located at the side wall of the hand-held part On.

9. a kind of vacuum WAND as described in claim 1, which is characterized in that the venthole is located at the another of the hand-held part On a end face.

10. a kind of vacuum WAND as described in claim 1, which is characterized in that the center line of the airflow channel and the gas The centerline collineation in body channel.