JP2006344657A - Pickup apparatus for chip and its method of use - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the production yield of an element chip in a pickup apparatus. <P>SOLUTION: The pickup apparatus 10 for a chip is to peel an element chip 15 from a dicing tape 16 with a needle 13 by sticking the needle 13 from the rear side of the dicing tape 16 to a surface side of the same into the element chip 15 separated by dicing a wafer stuck on the surface side of the dicing tape 16. In the apparatus, the shape of the tip end of the needle 13 is made a polygonal cone structure. Consequently, the needle 13 bursts through smoothly the dicing tape 16 to enable the chip 15 to be peeled from the dicing tape 16 without damaging the chip 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip pick-up device that is used when, for example, a semiconductor chip is peeled off from a dicing tape after a wafer on which a large number of semiconductor elements are formed is attached to a dicing tape, and then transferred to the next process. And its usage.

  For example, a large number of semiconductor elements such as a solid-state imaging element are formed on a semiconductor wafer. In order to package individual semiconductor elements, for example, as described in Patent Documents 1 and 2 below, the semiconductor wafer is attached to an elastic adhesive tape (dicing tape), and the dicing tape is completely cut. Individual semiconductor elements are separated by a dicing blade at a depth that is not possible.

  When the dicing tape is extended, the individual semiconductor elements are separated from each other on the dicing tape, and in this state, the suction collet is brought above the semiconductor element chip to be transported. However, since the semiconductor element attached to the dicing tape is not adsorbed only by the adsorbing force of the adsorbing collet, a needle is pierced from under the dicing tape and the semiconductor element is peeled off from the dicing tape by the needle.

  FIG. 3A is a schematic view of the main part of a conventional pickup device, and FIG. 3B is a top view of the tip of a needle used in this pickup device. In this pickup device, a needle (needle) 3 is accommodated in a hole 2 of a base 1, and a dicing tape 6 on which a semiconductor element chip 5 is pasted and stretched is placed on the upper surface of the base 1. .

  Then, the suction collet 8 is arranged above the semiconductor element chip 5 to be transported, the needle 3 is pushed up from below in a state where the inside of the hole 2 is vacuumed and the dicing tape 6 is vacuum-sucked to the hole 2 side, The semiconductor element chip 5 is peeled off from the dicing tape 6 by the needle 3 that has broken through the dicing tape 6 and is adsorbed by the collet 8.

JP-A-9-246293 Japanese Patent Laid-Open No. 64-21938

  In the conventional chip pick-up device described above, when the dicing tape 6 is pierced by the needle 3, the elastic dicing tape 6 cannot be pierced easily. As shown in FIG. Is lifted to some extent on the collet 8 side, and then the dicing tape 6 is suddenly broken.

  For this reason, in the conventional pickup device, when the needle 3 breaks through the dicing tape 6, the needle tip may damage or break the semiconductor element chip 5, which causes a reduction in the manufacturing yield of the semiconductor element chip. There is a problem that. Further, since the dicing tape 6 that has been suddenly pierced vibrates and the semiconductor element chip 5 affixed to the dicing tape 6 bounces, the semiconductor element chip 5 may also be damaged or the collet 8 may be damaged by the semiconductor element chip 5. There is also a problem of causing a positional shift when adsorbing the liquid.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a chip pick-up device and a method of using the same that can easily and stably break through a dicing tape with a needle without damaging the semiconductor element chip and peel the semiconductor element chip from the dicing tape.

  The chip pick-up device of the present invention is configured to insert an element chip separated by dicing a wafer affixed to the front side of a dicing tape from the back side of the dicing tape to the front side so that the element chip is inserted by the needle. In the pick-up device for the chip peeled off from the dicing tape, the shape of the tip of the needle is a polygonal cone.

  In the chip pickup device of the present invention, the polygonal pyramid is a triangular pyramid or a quadrangular pyramid.

  In the chip pickup device of the present invention, the shape of the tip of the needle is not the polygonal pyramid, but a shape in which the sharp side of the side of the polygonal cone is spiral. .

  The method of using the chip pickup device of the present invention is such that the element chip separated by dicing the wafer attached to the front side of the dicing tape is pierced from the back side of the dicing tape to the front side, and the element is used by the needle. In the method of using the chip pickup device for peeling the chip from the dicing tape, a needle having a polygonal pyramid shape is used as the needle.

  In the method for using the chip pickup device of the present invention, the polygonal pyramid is a triangular pyramid or a quadrangular pyramid.

  In the method of using the chip pickup device of the present invention, the shape of the tip of the needle is not the polygonal pyramid, but a shape in which the sharp side of the side of the polygonal cone is spiral. Features.

  According to the present invention, since the needle can smoothly break through the dicing tape, the manufacturing yield of the chip is improved.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1A is a schematic configuration diagram of a chip pickup device according to an embodiment of the present invention. In the pickup device 10 of the present embodiment, a needle 13 is accommodated in the hole 12 of the base 11, and a semiconductor element chip 15 such as a solid-state imaging element chip is attached to the upper surface of the base 11 and stretched. The dicing tape 16 is placed.

  Then, when the semiconductor chip 15 is peeled off from the dicing tape 16 and adsorbed by the collet 18 and transported to the next process (package process) or the like, the adsorbing collet 18 is disposed above the corresponding semiconductor element chip 15 and the inside of the hole 12 is In a state in which the dicing tape 16 is adsorbed to the hole 12 side with a relative negative pressure, the needle 13 is pushed up from the hole 12 to the collet 18 side.

  The needle 13 that has broken through the dicing tape 16 peels the semiconductor element chip 15 from the dicing tape 16, and the semiconductor chip 15 peeled off from the dicing tape 16 is attracted to the collet 18 and transported to the next process.

  In the pickup device 10 of the present embodiment, the tip shape of the needle 13 that breaks through the dicing tape 16 is different from the prior art shown in FIG. The tip of the conventional needle 3 shown in FIGS. 3A and 3B is conical, whereas the needle 13 used in the present embodiment has a polygonal cone at the tip. In the illustrated example, a triangular pyramid is used, but a quadrangular pyramid or a polygonal pyramid shape higher than that may be used. The polygonal pyramid is preferably determined by the thickness and material of the dicing tape 16 and the thickness of the semiconductor element chip 15.

    By forming the needle tip into a polygonal pyramid shape, the sharp three sides 13a in the case of a triangular pyramid and the four sharp sides in the case of a quadrangular pyramid serve as cutting edges, respectively, and elastic dicing. Cut the insertion point of the needle 13 of the tape 16. For this reason, as shown in FIG. 1A, even if the dicing tape 16 that is vacuum-adsorbed to the hole 12 side is pushed up by the needle 13 from below, the dicing tape 16 is not lifted by the needle tip and remains in the horizontal state. The needle 13 penetrates while being held, and the semiconductor element chip 15 is peeled off from the dicing tape 16 by the needle 13.

  In the conventional case, since the tip portion of the needle 3 has a conical shape, even if the dicing tape 6 is broken through at the tip of the needle, the contact resistance between the cone portion of the needle tip and the dicing tape 6 is large. In this embodiment, the tip of the needle 13 is formed into a polygonal pyramid shape, and a blade 13 a for cutting the dicing tape 16 is provided at the needle tip of the needle 13. Therefore, the semiconductor element chip 15 is smoothly peeled off from the dicing tape 16, the manufacturing yield of the semiconductor element chip 15 can be improved, and the semiconductor element chip 15 is peeled off from the dicing tape 16 without misalignment with respect to the collet 18. Can be made.

  In the pickup device of FIG. 1, an example in which only one needle is used has been described. However, if the semiconductor element chip 15 has a large area, a large number of needles are arranged in parallel, and the semiconductor element chip 15 is placed horizontally. It can be peeled off from the dicing tape 16 while being maintained.

  FIG. 2 is a diagram showing a positional relationship between the semiconductor element chip 15 and the five needles 13 when the semiconductor element chip 15 is peeled off by the five needles 13. By forming the tip of each of the five needles 13 in a polygonal pyramid shape, the semiconductor element chip 15 is lifted without the five needles tearing the dicing tape 16 at each position and lifting the dicing tape 16. The semiconductor element chip 15 can be peeled from the dicing tape 16.

  According to the pickup device of the above-described embodiment, as can be seen by comparing FIGS. 1 and 3, only the shape of the needle tip of the needle 13 is formed into a polygonal pyramid shape without modifying the existing pickup device (FIG. 3). This makes it possible to improve the manufacturing yield of the semiconductor element chip.

  In the above-described embodiment, the shape of the tip portion of the needle 13 is a polygonal pyramid shape, but it goes without saying that the shape of the polygonal cone shape may be a spiral shape.

  Since the chip pickup device according to the present invention can improve the manufacturing yield of the chip, it is useful as a pickup device or the like provided during the manufacturing process of a solid-state imaging device or the like.

1A is a schematic configuration diagram of a chip pickup device according to an embodiment of the present invention. FIG. (B) It is a top view of the needle tip shown in FIG. It is a figure which shows the arrangement | positioning relationship between a large-area semiconductor element chip and five needles. (A) It is a schematic block diagram of the conventional chip pick-up apparatus. FIG. 3B is a top view of the needle tip shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Pickup apparatus 11 Base 12 Hole 13 Needle 13a Side of pyramid (blade edge)
15 Semiconductor element chip 16 Dicing tape 18 Adsorption collet

Claims (6)

  Device for picking up a chip, in which an element chip separated by dicing a wafer affixed to the front side of the dicing tape is pierced from the back side of the dicing tape to the front side, and the element chip is peeled off from the dicing tape by the needle The tip pick-up device is characterized in that the shape of the tip of the needle is a polygonal cone.   2. The chip pickup device according to claim 1, wherein the polygonal pyramid is a triangular pyramid or a quadrangular pyramid.   The shape of the tip of the needle is not the polygonal pyramid, but a shape in which the sharp side of the side of the polygonal pyramid is spiral. Chip pickup device.   Device for picking up a chip, in which an element chip separated by dicing a wafer affixed to the front side of the dicing tape is pierced from the back side of the dicing tape to the front side, and the element chip is peeled off from the dicing tape by the needle A method of using a chip pick-up device, wherein a tip having a polygonal pyramid shape is used as the needle.   5. The method of using a chip pickup device according to claim 4, wherein the polygonal pyramid is a triangular pyramid or a quadrangular pyramid.   The shape of the tip of the needle is not the polygonal pyramid, but a shape in which the sharp side of the side surface of the polygonal pyramid is a spiral shape. How to use the chip pickup device.

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