JP2006294763A - Pickup apparatus of semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a failure to a semiconductor device by pickup by reducing and stabilizing a stress impression with a needle on the rear face of a semiconductor element when the semiconductor element is picked up. <P>SOLUTION: A needle 3 is fixed and the inside of a needle electrode holder 4 is made into vacuum without exfoliating the semiconductor element 1 from an adhesive sheet 2 by raising the semiconductor element 1 with the needle 3, the adhesive area of the semiconductor element 1 and the adhesive sheet 2 is decreased before absorption performance of a collet 7 by attracting the adhesive sheet 2 and the adhesive sheet 2 other than the contacts of the needle 3, and the semiconductor element 1 can be made to exfoliate in general from the adhesive sheet 2. Since the semiconductor device 1 is sucked only with the suction force from the collet 7, the stress impression with the needle 3 is reduced and stabilized to the semiconductor device 1 rear surface, and the failure is reduced to the semiconductor device 1 by the pickup. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor element pick-up apparatus for picking up semiconductor elements that are bonded and aligned on an adhesive sheet one by one with a collet.

A conventional semiconductor device pickup device will be described with reference to FIGS. 5, 6, 7 and 8. FIG.
FIG. 5 is a block diagram showing a main part of a conventional semiconductor device pick-up device, FIG. 6 is a block diagram showing a conventional semiconductor device pick-up device, FIG. 7 is a diagram for explaining an adsorption process in the conventional pick-up device, and FIG. It is a figure explaining the peeling process in the conventional pick-up apparatus.

  In FIG. 5, 1 is a semiconductor element to be picked up and peripheral semiconductor elements, 2 is an adhesive sheet to which the semiconductor element is attached and fixed, 4 is a needle holder having a vacuum suction groove for fixing the adhesive sheet, It is a needle that can move up and down to peel the semiconductor element from the adhesive sheet.

The operation of the conventional semiconductor device pickup device configured as described above will be described below.
In order to pick up the semiconductor elements 1 adhered and arranged in a matrix on the adhesive sheet 2 one by one with the collet 7, the semiconductor element image to be picked up is captured and recognized by the lens 8 and the CCD 9, as shown in FIG. The entire adhesive sheet is moved and positioned on the XYθ stage 11 so that the semiconductor element to be picked up is arranged at the center of the holder 4. After the positioning, the pressure-sensitive adhesive sheet 2 is vacuum-adsorbed and fixed by the suction grooves / holes 12 formed in the upper surface area of the needle holder 4 on which the semiconductor element 1 can mount three columns and three or more rows. At that time, the semiconductor element 1 has a structure that is held on the upper surface of the needle holder 4 via the adhesive sheet 2 so that there is no change in posture. After adhering and fixing the sheet adhesive 2 sheet, the vertically movable needle 3 disposed in the needle holder 4 is raised to the same height as the upper surface of the needle holder 4 as shown in FIG. Next, as shown in FIG. 7B, the collet 7 for picking up the semiconductor element 1 is lowered to the position of 0 mm contact with the semiconductor element 1 while evacuating. After the lowering, as shown in FIG. 7 (c), the collet 7 is sandwiched so that the semiconductor element 1 is not stressed at the same timing as the raising of the needle 3 in the needle holder 4 in order to pick up the semiconductor element 1 by suction. Make a rise. The push-up height of the needle 3 is set to a height at which the semiconductor element 1 can be completely peeled off from the adhesive sheet 2. From this height, the collet 7 is further raised, the needle 3 is moved to a lowering operation, and returned to the standby position. Moreover, peeling from the adhesive sheet 2 of the semiconductor element 1 may break through and peel off the sheet 2 as shown in FIG. Then, as shown in FIG. 8B, the semiconductor element 1 is picked up while being separated from the adhesive sheet 2 while being adsorbed by the collet 7. As described above, the pickup of the semiconductor element 1 from the adhesive sheet 2 sequentially takes out the semiconductor elements on the adhesive sheet by repeating FIGS. 6 to 8B (for example, Patent Document 1 and Patent Document 2). reference).
JP 2001-118862 A Japanese Patent No. 3209736

However, the conventional semiconductor element pickup device has the following two problems.
The first point is that when the back surface of the semiconductor element is pushed up by the needle, in order to improve the peelability of the semiconductor element from the semiconductor element pasting sheet, the needle tip SR diameter is in a small size of 0.03 mm to 0.05 mm, When the needle raising position is raised, scratches on the back surface of the semiconductor element or sticking of the adhesive sheet to the back surface of the semiconductor element due to punching of the sheet by the needle when the needle is pushed up cause defects. In addition, as a second point, particularly when a UV sheet is used as the adhesive sheet, if there is a place where UV irradiation is unstable, the adhesive force may be different at the place where the semiconductor element is attached, In places where the adhesive force is particularly strong, the semiconductor element may not be peeled from the adhesive sheet by pushing up the needle, and the semiconductor element may be destroyed using the needle tip as a fulcrum.

  In order to solve the above problems, an object of the present invention is to reduce and stabilize the stress application by the needle to the back surface of the semiconductor element when picking up the semiconductor element, and to reduce defects in the semiconductor element due to the pickup.

  In order to achieve the above object, a semiconductor device pick-up device according to claim 1 is a semiconductor device pick-up device for individually picking up a plurality of semiconductor elements attached to an adhesive sheet. A needle holder having a cylindrical hole for fixing the pressure-sensitive adhesive sheet, a needle for holding the semiconductor element to be picked up via the pressure-sensitive adhesive sheet, a side pipe for adjusting the needle boulder internal pressure, and the needle. A collet for picking up the semiconductor element, and holding the semiconductor device to be picked up by the needle, by evacuating the needle holder and adsorbing the adhesive sheet from the cylindrical hole After peeling the adhesive sheet other than the part in contact with the Characterized in that to pick up the semiconductor element to be picked up by and.

  According to a second aspect of the present invention, there is provided a pick-up device for a semiconductor element according to the first aspect, wherein the tip shape diameter of the needle is 0.03 mm to 0.25 mm.

  The semiconductor element pick-up device according to claim 3 is the semiconductor element pick-up device according to claim 1 or 2, wherein the size of the cylindrical hole is the top, bottom, left and right of the semiconductor element to be picked up. The area of 30% or more of the semiconductor elements arranged in the size of the semiconductor element is large enough to fit into the cylindrical hole.

  As described above, when picking up the semiconductor element, it is possible to reduce and stabilize the stress application by the needle to the back surface of the semiconductor element, and to reduce defects in the semiconductor element due to the pickup.

  Without removing the semiconductor element from the adhesive sheet by lifting the semiconductor element with the needle, the needle is fixed, the inside of the needle holder is evacuated, and the adhesive sheet other than the contact point between the adhesive sheet and the needle is sucked to absorb the collet Since the adhesive area between the semiconductor element and the adhesive sheet is reduced before operation, the semiconductor element can be generally peeled off from the adhesive sheet, and the semiconductor element can be adsorbed only by the suction force from the collet. It is possible to reduce and stabilize the stress applied by the needle to the semiconductor device, and to reduce defects in the semiconductor element due to the pickup.

Embodiments according to the present invention will be described below with reference to FIGS. 1, 2, 3, and 4. FIG.
FIG. 1 is a block diagram illustrating a main part of a semiconductor element pickup device according to the present invention, FIG. 2 is a block diagram illustrating a semiconductor element pickup device according to the present invention, and FIG. 3 is a diagram illustrating an adsorption process in the pickup device according to the present invention. FIG. 4 is a view for explaining a peeling process in the pickup device of the present invention.

  In FIG. 1, 1 is a semiconductor element to be picked up and peripheral semiconductor elements, 2 is an adhesive sheet to which the semiconductor element is attached and fixed, 4 is a needle holder having a hole for fixing the adhesive sheet and sucking the adhesive sheet Reference numeral 3 denotes a fixed needle for holding and peeling the semiconductor element from the adhesive sheet, and the needle 3 is connected to the semiconductor element via the adhesive sheet 2 without applying an unnecessary load to the adhesive sheet 2 by the height adjusting screw 5. The height is adjusted to hold 1.

The operation of the semiconductor device pickup device of the present invention configured as described above will be described below.
In the configuration as shown in FIG. 1, in order to pick up the semiconductor elements 1 bonded and arranged in a matrix on the adhesive sheet 2 one by one with the collet 7, the semiconductor elements 1 to be picked up as shown in FIG. The image is captured and recognized by the lens 8 and the CCD 9, and the entire adhesive sheet 2 is moved and positioned by the XYθ stage 11 so that the semiconductor element 1 to be picked up is arranged at the center of the needle holder 4. After positioning, the inside of the needle holder 4 is evacuated by the side pipe 6, and the semiconductor elements are formed above the needle 3 on the upper surface of the needle holder 4 on which three or more elements can be mounted vertically and horizontally, and the semiconductor element 1 to be picked up and its The pressure-sensitive adhesive sheet 2 is vacuum-sucked through a hole 13 having a size including the peripheral pressure-sensitive adhesive sheet 2 region. At this time, the semiconductor element 1 to be picked up has a structure that is held at the tip of the needle 3 via the adhesive sheet 2 so that there is no change in posture. The number of needles 3 for holding the semiconductor element 1 is an even number of two or more. Further, the semiconductor element 1 around the semiconductor element 1 to be picked up is pushed down to the suction side in the same manner as the adhesive sheet 2 to be sucked. Immediately after the pressure-sensitive adhesive sheet 2 is sucked, the semiconductor element 1 is pressed through the pressure-sensitive adhesive sheet 2 to the tip of the fixed needle 3 disposed in the needle holder 4 as shown in FIG. Two parts are also aspirated.

  As a result, a stress difference is generated between the semiconductor element 1 to be picked up on the adhesive sheet 2 and the adhesive sheet 2, and the semiconductor element is obtained when (semiconductor element 1 adhesive force) <(peeling force due to deformation of the adhesive sheet 2). 1 and the adhesive sheet 2 are peeled off. Next, in this state, as shown in FIG. 3B, the collet 7 for picking up the semiconductor element 1 descends to a position where the semiconductor element 1 contacts 0 mm while evacuating. At this time, (the vacuum pulling force of the collet 7)> (the adhesive force at the tip of the needle 3) ≠ 0, and the force at the tip of the needle 3 becomes 0 with the passage of time. It peels and is adsorbed on the collet 7 side (shown in FIG. 4 (a)). After the suction, as shown in FIG. 4B, vacuum breaking air is applied from the side pipe 6 in the needle holder to release the sheet suction. At the same time, the collet 7 ascends the semiconductor element 1 in the attracted state. As described above, the pickup of the semiconductor element from the adhesive sheet sequentially takes out the semiconductor elements 1 on the adhesive sheet 2 by repeating FIGS. 2 to 4B.

  As described above, without lifting the semiconductor element with the needle, the needle is fixed and the inside of the needle holder is evacuated without peeling the semiconductor element from the adhesive sheet, and the adhesive sheet other than the contact point between the adhesive sheet and the needle needle is attached. By sucking, the adhesion area between the semiconductor element and the adhesive sheet can be reduced before the collet adsorption operation, and the semiconductor element can be largely separated from the adhesive sheet, and the semiconductor element is adsorbed only by the suction force from the collet. Therefore, stress application by the needle to the back surface of the semiconductor element can be reduced and stabilized, and defects in the semiconductor element due to pickup can be reduced.

  The needle holder has a cylindrical shape, and the size of the hole inside the cylinder varies depending on the size and interval of the semiconductor elements in which the semiconductor elements are stuck in a matrix on the adhesive sheet. On the other hand, it is assumed that at least 30% of the size of the left and right or front and rear semiconductor elements is in the cylindrical hole. The SR diameter at the tip of the needle varies depending on the thickness of the adhesive sheet and the adhesive strength of the sheet, but SR SR of 0.03 to 0.25 mm is used. Regarding the number and interval of needles, 2 to 4 needles are used with respect to the size of the semiconductor element. The needle arrangement interval is set inside the outer size of the semiconductor element. Further, the height of the needle in the vertical direction is provided with a height adjusting mechanism in order to absorb variations in the needle attachment length.

  The pickup device for a semiconductor element according to the present invention reduces and stabilizes the stress applied by the needle to the back surface of the semiconductor element, and can reduce defects to the semiconductor element due to the pickup. This is useful for a pick-up device of a semiconductor element that picks up each element with a collet.

FIG. 2 is a main part configuration diagram showing a semiconductor device pickup device of the present invention. 1 is a block diagram showing a semiconductor device pickup device of the present invention. The figure explaining the adsorption | suction process in the pick-up apparatus of this invention The figure explaining the peeling process in the pick-up apparatus of this invention Main part configuration diagram showing a conventional semiconductor device pickup device Configuration diagram showing a conventional semiconductor device pickup device The figure explaining the adsorption | suction process in the conventional pick-up apparatus The figure explaining the peeling process in the conventional pick-up apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor element 2 ... Adhesive sheet 3 ... Needle 4 ... Needle holder 5 ... Height adjustment screw 6 ... Side pipe 7 ... Collet 8 ... Camera 9 ...・ CCD
11 ... XYθ stage 12 ... Suction groove / hole 13 ... Hole

Claims (3)

A semiconductor device pickup device for individually picking up a plurality of semiconductor elements attached to an adhesive sheet,
A needle holder having a cylindrical hole for fixing the adhesive sheet to the center of the upper surface;
A needle for holding the semiconductor element to be picked up via the adhesive sheet;
A side pipe for adjusting the needle boulder internal pressure;
A collet for picking up the semiconductor element held by the needle, and holding the semiconductor element to be picked up by the needle, the inside of the needle holder is evacuated to adsorb the adhesive sheet from the cylindrical hole Then, after peeling off the adhesive sheet other than the part in contact with the needle, the semiconductor element to be picked up is picked up by the collet.   2. The pick-up device for a semiconductor element according to claim 1, wherein a tip shape diameter of the needle is 0.03 mm to 0.25 mm.   The size of the cylindrical hole is such that an area of 30% or more of the semiconductor elements arranged on the top, bottom, left and right of the semiconductor element to be picked up enters the cylindrical hole. The pickup device for a semiconductor element according to claim 2.

Images