WO2019125013A1

WO2019125013A1 - Micro-device transfer method and micro-device transfer apparatus

Info

Publication number: WO2019125013A1
Application number: PCT/KR2018/016357
Authority: WO
Inventors: 황보윤; 윤성욱; 김경식; 김재현; 김광섭; 이학주; 최병익; 박현성; 김정엽; 이승모; 장봉균
Original assignee: 한국기계연구원; 재단법인 파동에너지 극한제어 연구단
Priority date: 2017-12-21
Filing date: 2018-12-20
Publication date: 2019-06-27
Also published as: KR102077049B1; KR20190075541A

Abstract

Disclosed are a micro-device transfer method and a micro-device transfer apparatus. A micro-device transfer method, according to one embodiment of the present invention, comprises: a bonding area reduction step for bending a transfer film to which a bonding portion of a micro-device is bonded with a first bonding area, so that a portion of the micro-device is separated from the transfer film and the bonding portion is reduced to a second bonding area which is smaller than the first bonding area; and a bonding step for bonding, to a target substrate, the micro-device having the second bonding area while being separated from the transfer film.

Description

【Specification】

Title of the Invention

Micro-device transfer method and micro-device transfer device

TECHNICAL FIELD

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro element transfer method, a micro element substrate and a micro element transfer apparatus manufactured thereby, and a micro element transfer method and a micro element transfer apparatus for transferring micro elements to a substrate or the like.

BACKGROUND ART [0002]

High-performance devices using semiconductor processes are implemented on a wafer substrate through various methods such as wafer-based coating, exposure, development, etching, thin-film processing, ion implantation, oxidation, and diffusion.

It has the form of a part through a packaging process such as dicing, die bonding, wire bonding, and molding. Semiconductors, memory chips, etc., which we can see for a long time, are produced through this process.

On the other hand, attempts have been made to fabricate flexible device parts based on printing electronic technology, and examples are being applied mainly to some product groups such as display, RFID, and solar power generation. In printing electronic technology, it is generally performed at a relatively low temperature or at room temperature compared to a semiconductor process. The device is manufactured by a coating process, a printing process, a patterning process, and the like for post- The flexible parts can be obtained through the process.

When a device is actually fabricated using a device, a space having wiring and other uses is required. In other words, a space is required between the device and the device. If all the devices are transferred all at once on the wafer, space between the device and the device can not be formed.

In addition, in the case where the device is composed of a plurality of kinds of elements instead of a single type of element, one element must be transferred and then transferred to another element. As can be seen from this example, 2019/125013 1 »(: 1 ^ 1 {2018/016357

A process of selectively transferring devices in a device transfer process is often required. As an example of transferring technology to a solder on a circuit board, we use a vacuum chuck ( _{1 «} ±) for transferring each micron. However, this approach is based on the constraints,

It may take a long time to produce a display having a large number of pixels.

Also, in this method, the pressure is applied to the micro-scale 1) to be attached to the micro-scale 1) gas solder. In the present development trend, micro-scale 1) there is zero can increase the likelihood of _damage,

DETAILED DESCRIPTION OF THE INVENTION

[Technical Problem]

Embodiments of the present invention provide a micro element transfer method and a micro element transfer apparatus capable of reducing the possibility of breakage of a micro element and improving the transfer process efficiency of the micro element.

[Technical Solution]

A method of transferring a micro-device according to an embodiment of the present invention is a method of transferring a micro-device according to an embodiment of the present invention, wherein a transfer portion of a micro- 1 < / RTI > area smaller than the adhesion area, and an attachment step in which the micro-device having the second adhesion area is attached to the target substrate while being separated from the transfer film.

In the step of reducing the adhesion area, the transfer film may be bent so that one side of the transfer film adhered to the micro device is convex so that the adhesion area of the micro device may be reduced inward from the edge.

In the step of reducing the adhesion area, the transfer film may be bent so that one side of the transfer film adhered to the microfluidic device may be recessed, so that the adhesive site of the microfluidic device may be contracted from the inside to the proximal position.

In the step of reducing the adhesion area, the transfer film has a length direction and a width direction of the transfer film 2019/125013 1 »(: 1 ^ 1 {2018/016357

And may be bent in at least one of the directions.

Meanwhile, the micro-element transfer device according to an embodiment of the present invention may include a supporting portion and a supporting portion, which are formed on one surface of the supporting portion and extended in the width direction of the transferring film, A part of the micro device is dropped from the transfer film by pressing the other surface of the film to bend the one side of the transfer film so as to be convex so that the adhesion area between the micro device and the transfer film is made smaller than the first adhesion area And the pressing portion separates the transfer film from the micro device virtual transfer film adhered to the transfer material film with the second adhesion area so as to be attached to the target substrate, .

The supporting portion is provided in a pair and supports the other surface of the transfer film, the pressing portion is positioned between the pair of supporting portions, and the transfer film is bent and can be bent so as to protrude from the pair of supporting portions toward the target substrate .

The pressing portion is rotatable so that the extending direction is the direction opposite to the direction of the residual film in the width direction of the transfer film, and can be moved in a direction perpendicular to the extending direction of the width direction or the length direction of the transfer film.

Wherein the micro element is disposed on a front end of the pressing part along the flow direction of the transfer film, and the micro element provided on the element providing member is separated from the element providing member, And a transition portion for pressing the other surface of the transfer film toward the element-providing member.

The support portion is disposed at a rear end of the pressing portion along the flow direction and supports the other surface of the transfer film, and the pressing portion is disposed to protrude from the transition portion and the support portion toward the target substrate to bend the transfer film .

A further supporting portion disposed at a rear end of the pressing portion and at a front end of the supporting portion in accordance with the flow direction and supporting the one surface of the transfer film and being further away from the target substrate than the pressing portion and bending the transfer film, You can include it. The element-providing member may be a source substrate or a carrier film on which the micro device is mounted. 2019/125013 1 »(: 1 ^ 1 {2018/016357

Meanwhile, in the micro-element transfer device according to another embodiment of the present invention, the micro-elements are separated from the element-providing member provided with micro-elements, and the transfer film is transferred onto one side of the transfer film, And a second transfer unit which is disposed at a rear end of the fifth transfer unit in accordance with the flow direction of the transfer film and which presses the other surface of the transfer film so that one side of the transfer film is convex Bending a portion of the adhesive portion of the micro element from the transfer film to reduce the adhesive area to a second adhesive area smaller than the first adhesive area, Wherein the microparticle having the adhesive area reduced to the second adhesive area through the pressure- And a transfer unit for pressing the transfer film toward the target substrate so as to be attached to the target substrate while being separated from the film.

A first support provided at a front end of the element providing member along the flow direction to support the transfer film and a rear end of the element providing member so that the transition is positioned between the first support and the first support, And a second supporting part for supporting the transfer film together with the first supporting part, a third supporting part provided at a front end of the target substrate for supporting the transfer film, and a second supporting part provided at the front end of the target substrate, And a fourth support part provided at the rear end and supporting the transfer film together with the third support part.

The second supporting portion and the third supporting portion support the one side of the transfer film and are moved downward to be spaced apart from the transfer film in a state in which the micro element bonded to the image transfer film enters, The film can be moved up so as to be in close contact with the transfer film in a state in which it is passed.

The uppermost portion of the second support portion and the third support portion which are moved upward to be brought into close contact with the transfer film may be positioned higher than the lower end portion of the pressurizing portion.

5 The lower end of the pressing portion can be moved up and down so as to be positioned lower than the uppermost portion of the second supporting portion and the third supporting portion that have been moved up.

【Effects of the Invention】

Embodiments of the present invention reduce the possibility of breakage of the micro- 2019/125013 1 »(: 1 ^ 1 {2018/016357

A transfer method of a micro device and a transfer device of a micro device in which the transfer process efficiency of the transfer device can be improved can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

1 is a flow chart showing a method of transferring a micro element according to a first embodiment of the present invention.

Fig. 2 is an example of the process of Fig. 1. Fig.

FIG. 3 is an exemplary view showing a process that can be applied to the micro-element transfer method according to the first embodiment of the present invention.

4 is a photograph showing an area of adhesion between a micro element and a transfer film to which a micro element transfer method according to the first embodiment of the present invention is applied.

5 is an exemplary view showing a micro-element transferring apparatus according to the first embodiment of the present invention.

6 is a view showing an example of a pressing portion of a micro-device transferring apparatus according to the first embodiment of the present invention.

7 is an exemplary view showing a micro-element transferring apparatus according to a second embodiment of the present invention.

FIG. 8 is a view showing an example of a micro-element transferring apparatus according to the third embodiment of the present invention.

9 is a view showing an example of a micro-element transferring apparatus according to a fourth embodiment of the present invention.

10 is an exemplary view showing a process that can be applied to the microelectronic electronic method according to the second embodiment of the present invention.

_ ^_ Best mode for practicing the invention;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout.

The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, 2019/125013 1 »(: 1 ^ 1 {2018/016357

Parts not related to names are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

In the present specification, duplicate descriptions are omitted for the same constituent elements.

In addition, but also in the present specification, any configuration is the element is, when the "connection is" there or in the states that ^1, itgeo is directly coupled to the other component or or connected to other components iteulsu, another element in between May be present. On the contrary, in this specification, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

Furthermore, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present invention.

Also, in this specification, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.

Also, in this specification, the terms " comprises " or " having ", and the like, are used only to designate the presence of the features, numbers, steps, operations, elements, parts, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof _.

Also, in this specification, the term " ¹ " and / or " includes any combination of a plurality of listed items or any of a plurality of listed items. In the present specification, " or " may include ', ¹ , or both 8 and ¹ .

FIG. 1 is a flow chart showing a method of transferring a micro element according to a first embodiment of the present invention, and FIG. 2 is a process of FIG _. Fig. As shown in FIGS. 1 and 2, the method of transferring a microcrystal may include a step of reducing the adhesion area (and 10) and an attaching step (and 20).

The step of reducing the adhesion area 10 is performed such that the transfer film 210 to which the micro element 200 is bonded by the first adhesion area 230 is bent so as to be convex in the direction in which the micro element 200 is attached, 200 are detached from the transfer film 210, 2019/125013 1 »(: 1 ^ 1 {2018/016357

The bonding area between the crosstalks 200 and the transfer film 210 may be reduced to a second bonding area 235 smaller than the first bonding area 230.

In the adhesion area reduction step 10, the micro element 200 may be supplied while being adhered to one surface 211 of the transfer film 210. Here, the micro element 200 may be adhered to the transfer film 210 with a first adhesive area 230 (see FIG. 2).

And the transfer film 210 may be bent so as to be convex in the direction in which the micro device 200 is attached. The bending of the transfer film 210 may be performed by a pressing portion 240 that can partly press the other surface 212 of the transfer film 210.

When the transfer film 210 is bent to be convex in the direction in which the micro device 200 is attached by the pressing unit 240, some contact surfaces of the micro device 200 may be detached from the transfer film 210.

Thus, the area of adhesion between the microdevice 200 and the transfer film 210 can be reduced to a second bonding area 235 smaller than the first bonding area 230. For example, when the bending portion of the transfer film 210 becomes a central portion of the micro element 200, the transfer film 210 and the micro element 200 are separated from both sides of the micro element 200: (Fig. 2, 0 >)).

The transfer film 210 is bent so that the adhesive portion between the micro element 200 and the transfer film 210 is bonded to the transfer film 210 in a state where the micro element 200 is bonded to the transfer film 210 with the first bonding area 230. [ The microdevice 200 is pressed against the target substrate 250 in the step of attaching the microdevice 200 to the target substrate 250 by making the second bonding area 235 smaller than the first bonding area 230 The pressure can be lowered, so that the possibility of breakage of the micro element 200 can be reduced.

According to an embodiment of the present invention, the area of adhesion between the micro element 200 and the transfer film 210 is reduced by bending the transfer film 210, ) Can be increased.

FIG. 3 is a view illustrating a process that can be applied to the micro-element transfer method according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view of a micro element according to the first embodiment of the present invention, As shown in Fig. 2019/125013 1 »(: 1 ^ 1 {2018/016357

3 ( ₃₎ and FIG. 4 (see FIG. 3) in which the micro element 200 is adhered to the one surface 211 of the transfer film 210 with the first adhesive area 230, The microdevice 200 can be bent together with the transfer film 210 by pressing the other surface 212 of the four-

The bending of the micro element 200 in the state of being bonded to the electrification film 210 can be continuously performed when the adhesion force between the micro element 200 and the transfer film 210 is greater than the stiffness of the micro element 200, At this time, the first bonding area 230 may be maintained (see FIG. 3).

When the degree of bending of the transfer elbow 210 is gradually increased, the adhesion portion between the micro element 200 and the transfer film 210 is deteriorated due to the difference in rigidity between the micro element 200 and the transfer film 210.

That is, when the rigidity of the micro element 200 becomes smaller, the adhesion between the micro element 200 and the transfer film 210 is lowered.

In this case, when the pressing portion 240 is positioned at the center portion of the micro element 200 and the transfer film 210 is bent around the pressing portion 240, the micro element 200 and the transfer film 210 ) Can be reduced inward from both side edges.

Accordingly, the bonding area between the micro element 200 and the transfer film 210 can be reduced to a second bonding area 235 smaller than the first bonding area 230 (see FIG. 3 (and FIG. 4 ).

As a result of the experiment, even though the transfer film 210 returns to its original state after the bonding portion between the micro device 200 and the transfer film 210 is separated, the micro device 200 and the transfer film 210 are bonded It shows the degree of adhesion with small adhesive force.

That is, once the transfer film 210 is bent so that the bonding area between the micro element 200 and the transfer film 210 is reduced, the bonding area can be reduced and the bonding strength can be reduced.

3, the pressing portion 240 is provided so as to extend in the width direction of the transfer film 210, that is, as shown in FIG. 3, and the transfer film 210 is bent on the basis of the V axis. However, The film 210 is bent in the longitudinal direction, i.e., in the X-axis direction 2019/125013 1 »(: 1 ^ 1 {2018/016357

It is possible. In this case, the pressing portion 240 may be provided to extend in the longitudinal direction of the transfer film 210, that is, the X axis direction.

Further, the transfer film 210 may be bent on the basis of the axial direction, and then bent again on the basis of the X-axis direction. In this case, the area of adhesion between the micro- May have a smaller area 236 than area 235

(Fig. 3 (!) And Fig. 4 (cf.)).

The micro device 200 bonded to the transfer film 210 with the first bonding area 230 may be provided on a source substrate (not shown) before the transfer film 210 is picked up). Here, the source substrate

In addition, it can be expanded to include film.

The attachment step (and 20) may be a step in which the micro device is detached from the transfer film and attached to the target substrate. _

Since the area of adhesion of the micro element 200 to the transfer film 210 is small in the attaching step 20, the micro element 200 ) To the target substrate 250 may be less than the pressure conventionally used to press the microspheres to the target substrate.

That is, even if the pressure for pressing the micro element 200 to the target substrate 250 is reduced, since the area of adhesion between the micro element 200 and the transfer film 210 is already small, The film 210 can easily fall off. Accordingly, the possibility of breakage of the micro device 200 can be reduced, and the yield of attaching the micro device 200 to the target substrate 250 can be increased. _,

The target substrate 250 may be a substrate on which the micro device 200 is finally mounted.

As shown in FIG. 1, the target substrate 250 may have an electrode 251 on one side and the micro device 200 may be attached to the electrode 251 of the target substrate 250 so as to be electrically connected. In general, solder may be provided between the electrodes 251 of the micro device 200 and the target substrate 250.

Then, the adhesion area reduction step (step 10) and the adhesion step (step 20) 2019/125013 1 »(: 1 ^ 1 {2018/016357

5 is a view illustrating an example of a micro-element transferring apparatus according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view of the micro- FIG. 2 is a view showing an example of a pressing unit of a micro-device transferring apparatus according to a first embodiment of the present invention. Hereinafter, for the sake of convenience, the transfer film will be described with respect to the feed direction or the flow direction, with the front side in the flow direction defined as the front end / front end and the rear side in the flow direction defined as the rear end / rear end.

As shown in FIGS. 5 and 6, the micro-device transfer device may include supports 301 and 302 and a pusher 340. The supporting portions 301 and 302 may be spaced apart from each other along the longitudinal direction of the transferred transfer film 310.

The micro-elements 300 may be bonded to one side of the transfer film 310 with a first adhesive area. The supporting portions 301 and 302 can closely support the other surface of the transfer film 310. The supports 301 and 302 may be rollers.

The transfer film 310 may be supplied from the supply roller 305 toward the collection roller 306 and the transfer film 310 may be provided with a microcomponent 300 at a point before reaching the pressing portion 340. [ It can be adhered with an adhesive area.

The pressing portion 340 may be provided between the support portions 301 and 302. [ The pressing portion 340 may be formed to extend in the width direction of the transfer film 310 and may be in close contact with the other surface of the transfer film 310. The upper end of the pressing portion 340 is pressed against the supporting portions 301 and 301 to which the transfer film 310 is closely attached so that the transfer film 310 is pressed by the pressing portion 340 and bent in convex shape toward the micrometer 300. [ 302). &Lt; / RTI >

In addition, the pressing unit 340 may be reciprocated in the horizontal direction. To this end, the micro-device transfer apparatus may further include a transfer unit 360 for moving the pressing unit 340 in the horizontal direction.

The transfer unit 360 may have a rotation shaft 361, a horizontal guide 362, and a slider 363.

The rotary shaft 361 can be vertically coupled to the lower center of the pressing portion 340; And can be rotated in the horizontal direction together with the pressing portion 340. Particularly, the pressing portion 340 is formed on the X- 2019/125013 1 »(: 1 ^ 1 {2018/016357

It can be rotated ₉₀ degrees to be parallel to the axis _. That is _, referring to FIG. 6, the pressing portion 340 extending in the width direction of the transfer film 310 may be rotated about the rotation axis so as to be arranged in a shape extending in the longitudinal direction or the feeding direction of the electrification film.

The horizontal guide 362 may be provided in the X axis direction, that is, in the feeding direction of the transfer film 310. The slider 363 may be reciprocated along the horizontal guide 362 and the rotary shaft 361 may be coupled to the slider 363. Accordingly, when the slider 363 is reciprocated along the guide guide 362, the pressing portion 340 can also be reciprocated in the feeding direction of the transfer film 310.

When the pressing portion 340 moves in the longitudinal direction of the transfer film 310 in a state where the pressurizing portion 340 presses the transfer film 310 to bend the transfer film 310 upwardly convexly, 310 may sequentially have a low bonding area at the first bonding area and a low 12 bonding area.

5, the target substrate 350 is provided on the upper side of the micro-device 300, and the pressing portion 350 is provided on the upper side of the micro- The microdevice 300 may be bonded to the target substrate 350 if the virtual orientation of the microdevice 300 is changed to be equal to the bottom height of the target substrate 350 as the transfer film 310 is pressed by the substrate 340 have. That is, the micro device 300 can be separated from the transfer film 310 and attached to the target substrate 350.

The micro-element transfer process using the micro-element transfer process according to this embodiment will be described with reference to FIG.

First, the target substrate 350 may be in a fixed state. The pressing portion 340 may be positioned on the lower left side of the target substrate 350.

Thereafter, when the transfer film 310 is supplied and positioned at a position where the micro element 300 is to be mounted on the target substrate 350 under the target substrate 350, the slider 363 is moved along the horizontal guide 362 Can be moved in the right direction. Then, the pressing portion 340 is moved in the rightward direction while pushing up the transfer film 310 to bend it, and the black element 300 can be sequentially attached to the target substrate 350.

The lower surface of the target substrate 350 is provided with an electrode (not shown) corresponding to an electrode 2019/125013 1 »(: 1 ^ 1 {2018/016357

An electrode (not shown), and a solder for electrically connecting the two electrodes. In addition, a mount 370 for fixing the target substrate 350 may be provided so that the target substrate 350 is stably fixed.

On the other hand, the micro device electronic device according to the present embodiment can further include an additional process together with the above-described transfer process.

That is, the transfer film 310 may be first bent at the front end of the target substrate 350 in a state where the distance between the supporting portions 301 and 302 is longer. At this time, the pressing portion 340 may extend in the X axis direction, that is, the longitudinal direction of the transfer film 310. In this state, the pressing portion 340 can be reciprocated in the axial direction, that is, in the width direction of the transfer film 310.

To this end, the micro-device transfer device includes an additional horizontal guide (not shown) provided to extend in the axial direction to guide the slider 363 to be moved in the axial direction, or a horizontal guide 362 ) In the axial direction.

When the microroson having a reduced contact area through the primary bending of the transfer film 310 arrives at the lower portion of the target substrate 350, secondary bending by the pressing portion 340 can be performed. At this time, the pressing portion 340 may be extended in the axial direction, that is, the width direction of the transfer film 310, and may be reciprocated in the length direction of the transfer film 310. Accordingly, the contact surface area of the micro device 300 can be made smaller, and the adhesion between the micro device 300 and the target substrate 350 can be made more stable.

7 is an exemplary view showing a micro-element transferring apparatus according to a second embodiment of the present invention. 7, the micro-element transfer device according to the present embodiment includes a first support portion 401, a second support portion 402, a transition portion 441, a third support portion 403, a fourth support portion 404, A transfer part 442, and a pressing part 443.

The first supporting part 401 may be provided at the front end of the element providing member on which the micro element 400 is mounted based on the feeding direction of the transferred transfer film 410. In one embodiment of the present invention, the element-providing member corresponds to a means for providing a micro element to the transfer film 410, for example, the source substrate 415 or the carrier film 570 or 670 corresponds to the element-providing member 2019/125013 1 »(: 1 ^ 1 {2018/016357

In this embodiment, a source substrate 415 may be provided as an element-providing member as shown in Fig. _.

The transfer film 410 may be fed from the feed roller 405 to the withdrawal roller 406.

The second support portion 402 may be provided at the rear end of the source substrate 415. The second support portion 402 can support one side of the transfer film 410 together with the first support portion 401 so that the transfer film 410 passes over the upper side of the source substrate 415.

The transition portion 441 may be provided between the first support portion 401 and the second support portion 402. The transition portion 441 may be provided on the upper side of the transfer film 410. The transition element 441 can press the transfer film 410 in the direction of the source substrate 415 so that the micro element 400 of the source substrate 415 has a first adhesion area .

The third support portion 403 may be provided at a front end of the target substrate 450 provided at the rear end of the source substrate 415.

The fourth support part 404 may be provided at the rear end of the target substrate 450. The fourth support part 404 can support one side of the transfer film 410 with the third support part 403 so that the transfer film 410 passes over the upper side of the target substrate 450.

The transfer portion 442 can be provided between the third support portion 403 and the fourth support portion 404. The transfer portion 442 may be provided on the upper side of the transfer film 410. The transfer section 442 can press the transfer film 410 in the direction of the target substrate 450 so that the micro devices 400 bonded to the transfer film 410 are separated from the transfer film 410, (Not shown).

The pressing portion 443 may be provided between the second support portion 402 and the third support portion 403. [ The pressing portion 443 may be provided on the upper side of the transfer film 410. The pressing portion 443 presses the transfer film 410 so that the transfer film 410 is bent so as to be convex in the direction in which the micro device 400 is attached. The contact area between the micro device 400 and the transfer film 410 may be reduced to a second adhesion area smaller than the first adhesion area.

On the other hand, the second support portion 402 and the third support portion 403 can be moved downward and upward 2019/125013 1 »(: 1 ^ 1 {2018/016357

All. The second support portion 402 and the third support portion 403 can move down so that the micro device 400 is not caught when the micro device 400 is inserted therein (see FIG. 7).

Then, the micro-device 400 can move up and down so as to be in close contact with one surface of the transfer film 410. The uppermost portion of the second support portion 402 and the third support portion 403 are positioned higher than the lower end portion of the pressing portion 443 when the second support portion 402 and the third support portion 403 move up .

Further, the pressing portion 443 can move downward or upward. When the second supporting portion 402 and the third supporting portion 403 are lifted up, the lower end of the pressing portion 443 is positioned lower than the uppermost portion of the second supporting portion 402 and the third supporting portion 403 And can be moved in the downward direction as much as possible. The transfer film 410 can be bent so as to be convex in the direction of the microdevice 400 by the pressing portion 443 and the microdevice 400 can be bent between the microdevice 400 and the transfer film 410 The bonding area can be reduced.

8 is an exemplary view showing a micro-element transferring apparatus according to a third embodiment of the present invention. In this embodiment, the step of reducing the area of adhesion between the micro element and the transfer film through the bending of the transfer film and the step of attaching the micro element with the smaller area of adhesion to the target substrate can be performed individually.

As shown in FIG. 8, the micro-device transfer apparatus according to the present embodiment may include a transition portion 541, a transfer portion 542, and a pressurizing portion 543.

The transition portion 541 may be provided to closely support one side of the supplied transfer film 510. The transfer film 510 may be fed from the feed roller 505 toward the collection roller 506. [

The transition portion 541 may be provided below the element-providing member to be supplied. In one embodiment of the present invention, the element providing member corresponds to a means for providing a micro element to the transfer film 410, for example, the source substrate 415 or the carrier film 570 or 670 may correspond to the element providing member In this embodiment, as shown in Fig. 8, a carrier film 570 may be provided as an element providing member.

That is, in this embodiment, the transition portion 541 may be provided below the supplied carrier film 570 and may be provided on the lower surface of the carrier film 570 to the transfer film 510 adhered to the transition portion 541 2019/125013 1 »(: 1 ^ 1 {2018/016357

The transfer film 510 can be pressed toward the micro device 500 so that the attached micro device 500 is adhered.

The micro element 500 attached to the lower surface of the carrier film 570 can be separated from the carrier film 570 and attached to the other surface of the transfer film 510. [ At this time, the micro device 500 may be attached to the transfer film 510 with a first adhesive area.

The transfer portion 542 may be spaced apart from the transition portion 541 along the feeding direction of the transfer film 510. [ A target substrate 550 may be provided below the transfer section 542 and the transfer section 542 may be in close contact with one surface of the transfer film 510 to press the transfer film 510 toward the target substrate 550 have.

The pressing portion 543 may be provided between the transition portion 541 and the transfer portion 542. The pressing portion 543 may press one surface of the transfer film 510 to bend the transfer film 510 so as to be convex in the direction in which the micro device 500 is attached. Pressure section. A part of the contact surface of the micro device 500 is separated from the transfer film 510 so that the adhesion area between the micro device 500 and the transfer film 510 is smaller than the first adhesion area, .

The transferring portion 542 is separated from the microelectronic device 500 supplied from the transferring film 510 in a state in which the transferring film 510 is pressed toward the target substrate 550 and the bonding area of the second bonding surface is reduced It can be attached to the target substrate 550 at the time of overactuation.

At this time, the target substrate 550 can be conveyed in the feeding direction of the transfer film 510 supplied in close contact with the pressing portion 543 and the transfer portion 542, and the transfer speed of the target substrate 550 is The feed rate, and the position where the micro-device 500 is attached to the target organs 550, and the like.

9 is a view showing an example of a micro-element transferring apparatus according to a fourth embodiment of the present invention. In this embodiment, the step of reducing the area of adhesion between the micro element and the transfer film through the bending of the transfer film and the step of adhering the micro element with the smaller area of adhesion to the target substrate can be performed at the same time. 3 embodiment.

First, as shown in _(å 0 of Figure 9, the micro device of the present embodiment before 2019/125013 1 »(: 1 ^ 1 {2018/016357

The capping device may include a transition portion 641, a support portion 601, and a pressing portion 642.

The transition portion 641 may be provided to closely support one surface of the transfer film 610 supplied from the supply roller 605 toward the recovery roller 606. [

The transition portion 641 may be provided below the supplied carrier film 670 and may include a micro element 600 attached to the lower surface of the carrier film 670 to a transfer film 610 which is in close contact with the transition portion 641 The transfer film 610 can be pressed in the direction of the microdevice 600. As shown in FIG.

The micro device 600 attached to the lower surface of the carrier film 670 can be separated from the carrier film 670 and attached to the other surface of the transfer film 610. [ At this time, the micro device 600 may be attached to the transfer film 610 with a first adhesive area.

The supporting portion 601 is moved along the feeding direction of the transfer film 610 with the transition portion 641 and is brought into close contact with the other surface of the transfer film 610 to transfer the transfer film 610 together with the transition portion 641 It can be supported to be fed in a tightly pulled state.

The pressing portion 642 is provided between the transition portion 641 and the supporting portion 601 and presses the other surface of the transfer film 610 so that the transfer film 610 is convexed in the direction in which the micro device 600 is attached. Can be bent.

The pressing portion 642 is brought into close contact with the one surface of the transfer film 610 so as to face the transfer film 610 in the direction of the target substrate 650 Lt; / RTI >

That is, the pressing portion 642 is formed so that a part of the contact surface of the micro device 600 is separated from the transfer film 610, and a bonding area between the micro device 600 and the transfer film 610 is smaller than a first bonding area .

The pushing portion 642 pushes the microdevice 600 toward the target substrate 650 so that the microdevice 600 is detached from the electrification film 610 and attached to the target substrate 650) can do.

9, the pressing portion 642 may be formed with a radius of curvature smaller than that of the pressing portion 642. In this case, an additional pressing portion 642 is provided between the pressing portion 642 and the supporting portion 601. In this case, A support 602 may be provided. Additional support 602 may be provided 2019/125013 1 »(: 1 ^ 1 {2018/016357

Can be positioned above the pressing portion 642 and help the transfer film 610 passing through the pressing portion 642 to bend at a smaller radius of curvature.

The pressing portions 642 and 642 may be realized by appropriately selecting a shape that is a rotating roller shape or a non-rotating shape.

On the other hand, a method of making the area of adhesion between the micro element and the transfer film small at a second adhesion area smaller than the first area of adhesion, as described with reference to FIGS. 1 to 4, And the transfer film may be bent so as to be concave in the direction in which the micro device is attached.

10, in the bonding area reducing step, the transfer film 1210 can be bent so as to be recessed in the direction in which the device 200 is attached. The bending of the transfer film 1210 may be performed by pressing the surface to which the micro element 200 is attached on the transfer film 1210 to a pressing portion (not shown). That is, when the transfer film 1210 is bent by the pressing portion to be recessed in the direction in which the micro device 200 is attached, some contact surfaces of the micro device 200 may be separated from the transfer film 1210. The adhesive area between the micro element 200 and the transfer film 1210 can be reduced to a second adhesive area 1235 smaller than the first adhesive area 1230. [ For example, when the portion bent in the transfer film 1210 becomes the central portion of the micro element 200, the transfer film 1210 and the micro element 200 first fall off from the inside portion of the micro element 200, It can fall in the edge direction.

The pressing portion is located between the micro elements 200 provided in the transfer film 1210 in the form of an array and presses the transfer film 1210 or the outside of the transfer film 1210 where the micro element 200 is not provided So that the transfer film 1210 can be pressed.

By this method, the micro element substrate can be manufactured, and the micro element transfer apparatus can be implemented so that this method is applied. 2019/125013 1 »(: 1 ^ 1 {2018/016357

- Explanation of symbols -

200, 300, 400, 500, 600:

210, 310, 410, 510, 610, 1210: transfer film

230: first bonding area

235: second bonding area

250, 350, 450, 550, 650: target substrate

360:

402: second support portion

403: third support portion

415: source substrate

240, 340, 443, 543, 642, 642 ₃ :

442, 542:

441, 541, 641:

570,670: Carrier film

Claims

2019/125013 1 »(: 1 ^ 1 {2018/016357

Claims:

Claim 11

Wherein the micro-element is bent at a first adhesion area of the micro-element to bend the micro-element so that a part of the micro-element is detached from the transfer film and the adhesion area is reduced to a second bonding area smaller than the first bonding area step; And

And attaching the microdevice having the second bonding area to the target substrate while being separated from the transfer film.

[Claim 2]

The method according to claim 1,

Wherein the transfer film is bent in a convex manner on one side of the transfer film to which the micro device is attached, so that the adhesion area of the micro device is reduced inward from the edge.

[Claim 3]

The method according to claim 1,

In the step of reducing the area of adhesion, the transfer film is bent so that one surface of the transfer film adhered with the micro element is recessed, so that the adhesion portion of the micro element is contracted from the inside to the most major direction.

[4]

The method according to claim 1,

Wherein the transfer film is bent in at least one of a longitudinal direction and a width direction of the transfer film.

[Claim 5]

A supporting section for supporting the transfer film on one surface of which the microdevice is adhered with a first adhesive area; And

And bending the other surface of the transfer film so that the one surface of the transfer film is convex so that a part of the micro device is separated from the transfer film and the micro element and the transfer member A pressing portion that reduces an adhesion area between the films to a second adhesion area smaller than the first adhesion area; 2019/125013 1 »(: 1 ^ 1 {2018/016357

/ RTI >

Wherein the pressing portion presses the transfer film toward the target substrate so that the micro element bonded to the transfer film with the second adhesion area is separated from the transfer film and attached to the target substrate.

[Claim 6]

6. The method of claim 5,

Wherein the supporting portion is provided in a pair and supports the other surface of the transfer film, the pressing portion is positioned between the pair of supporting portions, Transfer device.

[7]

6. The method of claim 5,

Wherein the pressing portion is rotatable so that an extending direction thereof is a direction opposite to a length direction of the transfer film in a width direction of the transfer film and is movable in a direction perpendicular to the extending direction of the width direction or the length direction of the transfer film.

[8]

6. The method of claim 5,

The micro-elements provided on the element-providing member are separated from the element-providing member so that the micro-elements provided on the element-providing member are bonded to the one surface of the transfer film with the first adhesive surface in accordance with the flow direction of the transfer film And a transition part for pressing the other surface of the transfer film toward the element-providing member.

[Claim 9]

9. The method of claim 8,

Wherein the support portion is disposed at a rear end of the pressing portion along the flow direction and supports the other surface of the transfer film,

Wherein the pressing portion is protruded toward the target substrate from the transition portion and the support portion to bend the transfer film. 2019/125013 1 »(: 1 ^ 1 {2018/016357

Claim 10

9. The method of claim 8,

An additional support portion disposed at a rear end of the pressing portion and at a front end of the supporting portion in accordance with the flow direction and supporting the one surface of the transfer film and being further away from the target substrate than the pressing portion to bend the transfer film; Further comprising a microdevice transfer device.

Claim 11

9. The method of claim 8,

Wherein the element providing member is a source substrate or a carrier film having the micro element.

Claim 12

A transition part for pressing the other surface of the transfer film toward the element providing member so that the micro element is separated from the element providing member provided with a micro element and adhered to one surface of the transfer film with an adhesive part having a first adhesive area;

And a bending step of bending the other surface of the transfer film so that the one surface of the transfer film is convex so that a part of the adhesive part of the micro device is transferred to the transfer surface of the transfer film, An abutting portion which is separated from the film and is contracted to a second bonding area smaller than the first bonding area;

Wherein the micro-device is disposed at a rear end of the pressing portion along the flow direction, the micro-device having the bonding portion reduced to the second bonding area through the pressing portion is detached from the transfer film, And a transfer unit which presses the substrate toward the target substrate.

Claim 13

13. The method of claim 12,

A first supporting part provided at a front end of the element providing member along the flow direction to support the transfer film;

A second supporting portion provided at a rear end of the element providing member such that the transition portion is positioned between the first supporting portion and the transfer supporting portion and supporting the transfer film together with the first supporting portion; 2019/125013 1 »(: 1 ^ 1 {2018/016357

A third supporting unit provided at a front end of the target substrate to support the transfer film; And a fourth support portion provided at a rear end of the target substrate such that the transfer portion is positioned between the third support portion and the fourth support portion supporting the transfer film together with the third support portion.

5

14.

14. The method of claim 13,

The second support portion and the third support portion support the one side of the transfer film and are moved downward to be separated from the transfer film in a state where the micro element bonded to the transfer film enters, The film is lifted so as to be in close contact with the transfer 10 film.

15.

15. The method of claim 14,

And the uppermost portion of the second support portion and the third support portion moved upward to be in close contact with the transfer film is positioned higher than the lower end portion of the pressurizing portion.

Claim 16

15. The method of claim 14,

And the lower end of the pressing portion is moved up and down so as to be positioned lower than the uppermost portion of the second supporting portion and the third supporting portion which are moved up.