TWI674230B - Electronic component conveying device and electronic component inspection device - Google Patents

Electronic component conveying device and electronic component inspection device Download PDF

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Publication number
TWI674230B
TWI674230B TW106117561A TW106117561A TWI674230B TW I674230 B TWI674230 B TW I674230B TW 106117561 A TW106117561 A TW 106117561A TW 106117561 A TW106117561 A TW 106117561A TW I674230 B TWI674230 B TW I674230B
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Taiwan
Prior art keywords
holding
holding portion
electronic component
light
suction nozzle
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TW106117561A
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Chinese (zh)
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TW201742809A (en
Inventor
清水博之
中村敏
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日商精工愛普生股份有限公司
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Priority to JP2016109812A priority Critical patent/JP6903267B2/en
Priority to JP??2016-109812 priority
Application filed by 日商精工愛普生股份有限公司 filed Critical 日商精工愛普生股份有限公司
Publication of TW201742809A publication Critical patent/TW201742809A/en
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Publication of TWI674230B publication Critical patent/TWI674230B/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]

Abstract

本發明提供一種可根據各固持部彼此之距離而變更固持動作之電子零件搬送裝置及電子零件檢查裝置。該電子零件搬送裝置之特徵在於包括:基部,其可於第1方向移動;第1固持部,其設置於上述基部,且固持電子零件;第2固持部,其設置於上述基部,可相對於上述第1固持部於上述第1方向移動,且固持電子零件;及檢測部,其可檢測上述第1固持部之上述第1方向上之位置、及上述第2固持部之上述第1方向上之位置。The present invention provides an electronic component transfer device and an electronic component inspection device that can change the holding operation according to the distance between the holding portions. The electronic component transporting device is characterized by including a base portion that can be moved in the first direction; a first holding portion that is provided on the base portion and holds the electronic component; a second holding portion that is provided on the base portion and can be opposite to The first holding portion moves in the first direction and holds the electronic component; and a detection portion that can detect a position in the first direction of the first holding portion and a first direction of the second holding portion. Its location.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。The invention relates to an electronic component conveying device and an electronic component inspection device.

先前以來,已知有安裝IC(Integrated Circuit,積體電路)晶片等電子零件之電子零件安裝裝置(例如參照專利文獻1)。專利文獻1記載之電子零件安裝裝置具備可吸附電子零件並進行升降之複數個吸附嘴。而且,該電子零件安裝裝置中,於電子零件之安裝時,可光學性地檢測利用吸附嘴吸附之電子零件之位置、姿勢。[先前技術文獻][專利文獻][專利文獻1]日本專利特開2011-159964號公報Conventionally, there has been known an electronic component mounting apparatus for mounting electronic components such as IC (Integrated Circuit) wafers (see, for example, Patent Document 1). The electronic component mounting device described in Patent Document 1 includes a plurality of suction nozzles capable of sucking and lifting electronic components. In addition, in the electronic component mounting device, when the electronic component is mounted, the position and posture of the electronic component adsorbed by the suction nozzle can be optically detected. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2011-159964

[發明所欲解決之問題] 然而,專利文獻1記載之電子零件安裝裝置中,存在如下情形,即,根據例如使用環境或使用狀態等,而相鄰之吸附嘴彼此之間距與規定值即設計值相比過度變化。於該情形時,較佳為檢測各吸附嘴之位置,計算吸附嘴彼此之間距之變化量,並進行與該計算結果對應之修正,但於專利文獻1中,未對此種構成進行任何揭示。 [解決問題之技術手段] 本發明係為了解決上述問題之至少一部分而完成者,其可作為以下者而實現。本發明之電子零件搬送裝置之特徵在於具有:基部,其可於第1方向移動;第1固持部,其設置於上述基部,且固持電子零件;第2固持部,其設置於上述基部,可相對於上述第1固持部於上述第1方向移動,且固持電子零件;及檢測部,其可檢測上述第1固持部之上述第1方向上之位置、及上述第2固持部之上述第1方向上之位置。藉此,可求出第1固持部與第2固持部之距離,並且可根據該距離而變更第1固持部與第2固持部之動作。由此,例如,可順利地進行第1固持部及第2固持部對電子零件之固持。本發明之電子零件搬送裝置較佳為,上述基部可於與上述第1方向正交之第2方向移動,且上述檢測部可檢測上述第1固持部之上述第2方向上之位置、及上述第2固持部之上述第2方向上之位置。藉此,可基於第1固持部之第2方向上之位置及第2固持部之第2方向上之位置而獲得第2方向上之第1固持部與第2固持部之距離。本發明之電子零件搬送裝置較佳為,上述第1固持部與上述第2固持部可相對於上述基部於與上述第1方向及上述第2方向正交之第3方向上移動,且於基於利用上述檢測部檢測出之上述第1固持部之位置與上述第2固持部之位置所獲得之距離為預設之值以上的情形時,使上述第1固持部與上述第2固持部個別地於上述第3方向移動。藉此,例如可準確地固持電子零件或者準確地釋放所固持之電子零件。本發明之電子零件搬送裝置較佳為,上述第1固持部與上述第2固持部可相對於上述基部於與上述第1方向及上述第2方向正交之第3方向移動,且於基於以上述檢測部檢測出之上述第1固持部之位置與上述第2固持部之位置所獲得之距離未達預設之值的情形時,使上述第1固持部與上述第2固持部同時於上述第3方向移動。藉此,例如可儘可能迅速地固持電子零件或者釋放所固持之電子零件。本發明之電子零件搬送裝置較佳為,上述檢測部具有朝上述第1方向發出光之第1發光部、接收來自上述第1發光部之光之第1受光部、朝上述第2方向發出光之第2發光部、及接收來自上述第2發光部之光之第2受光部。藉此,可基於第1發光部與第1受光部之間之光之透過與遮斷而檢測各固持部之第1方向之位置,並且可基於第2發光部與第2受光部之間之光之透過與遮斷而檢測各固持部之第2方向之位置。本發明之電子零件搬送裝置較佳為,上述檢測部具有包含呈塊狀或板狀之構件之本體部,且上述本體部包括:凹部;小凹部或小凸部,其形成於上述凹部之底部,且俯視時較上述凹部小;第1發光部用插入部,其於上述凹部之側壁部開口,供上述第1發光部插入;第1受光部用插入部,其與上述第1發光部用插入部對向地於上述凹部之側壁部開口,供上述第1受光部插入;第2發光部用插入部,其於上述凹部之側壁部開口,供上述第2發光部插入;及第2受光部用插入部,其與上述第2發光部用插入部對向地於上述凹部之側壁部開口,供上述第2受光部插入。藉此,於可利用成為該本體部之母材進行機械加工而獲得本體部之情形時,發揮如下效果。只要將母材暫且固定於機床,便可維持其固定狀態地使用端銑刀或鑽孔器對凹部、貫通孔、第1發光部用插入部、第1受光部用插入部、第2發光部用插入部、及第2受光部用插入部完成加工。藉此,可獲得所加工之各部之位置關係為高精度之本體部。本發明之電子零件搬送裝置較佳為上述小凹部貫通地形成。藉此,例如可利用相機等攝像裝置清晰地拍攝小凹部。本發明之電子零件搬送裝置較佳為包括將上述電子零件搬送至對電子零件進行檢查之檢查區域之供給區域、及回收已於上述檢查區域經檢查之電子零件之回收區域,且上述檢測部設置於上述供給區域及上述回收區域。藉此,可於進行複數個電子零件之搬送之供給區域及回收區域之雙方,基於例如第1固持部之第1方向上之位置、及第2固持部之第1方向上之位置而獲得第1方向上之第1固持部與第2固持部之距離。本發明之電子零件搬送裝置較佳為包括:第3固持部,其設置於上述基部,可相對於上述第1固持部於第1方向移動,且固持電子零件;及第4固持部,其設置於上述基部,可相對於上述第1固持部於第1方向移動,且固持電子零件;且上述檢測部可檢測上述第3固持部之上述第1方向上之位置、及上述第4固持部之上述第1方向上之位置。藉此,可基於第3固持部之第1方向上之位置、及第4固持部之第1方向上之位置而獲得第1方向上之第3固持部與第4固持部之距離。本發明之電子零件搬送裝置較佳為,上述基部可於與上述第1方向正交之第2方向移動,且上述檢測部可檢測上述第1固持部之上述第2方向上之位置、上述第2固持部之上述第2方向上之位置、上述第3固持部之上述第2方向上之位置、及上述第4固持部之上述第2方向上之位置。藉此,可基於第1固持部之第2方向上之位置、第2固持部之第2方向上之位置、第3固持部之第2方向上之位置、及第4固持部之第2方向上之位置而獲得第2方向上的第1固持部與第2固持部之距離、第2固持部與第3固持部之距離、第3固持部與第4固持部之距離。本發明之電子零件搬送裝置較佳為包括:第5固持部,其設置於上述基部,且相對於上述第1固持部配置於上述第2方向;第6固持部,其設置於上述基部,且相對於上述第2固持部配置於上述第2方向;第7固持部,其設置於上述基部,且相對於上述第3固持部配置於上述第2方向;及第8固持部,其設置於上述基部,且相對於上述第4固持部配置於上述第2方向;且上述檢測部可檢測上述第5固持部之上述第1方向上之位置及上述第2方向上之位置、上述第6固持部之上述第1方向上之位置及上述第2方向上之位置、上述第7固持部之上述第1方向上之位置及上述第2方向上之位置、以及上述第8固持部之上述第1方向上之位置及上述第2方向上之位置。藉此,可藉由第1固持部~第8固持部順利地進行對電子零件之固持。本發明之電子零件檢查裝置之特徵在於包括:基部,其可於第1方向上移動;第1固持部,其設置於上述基部,且固持電子零件;第2固持部,其設置於上述基部,可相對於上述第1固持部於上述第1方向移動,且固持電子零件;檢測部,其可檢測上述第1固持部之上述第1方向上之位置、及上述第2固持部之上述第1方向上之位置;及檢查部,其對由上述第1固持部固持之電子零件、及由上述第2固持部固持之電子零件進行檢查。藉此,可求出第1固持部與第2固持部之距離,並且可根據該距離變更第1固持部與第2固持部之動作。由此,例如可順利地進行第1固持部及第2固持部對電子零件之固持。又,可將電子零件搬送至檢查部,由此,可利用檢查部對該電子零件進行檢查。又,可自檢查部搬送檢查後之電子零件。[Problems to be Solved by the Invention] However, in the electronic component mounting device described in Patent Document 1, there are cases in which the distance between adjacent suction nozzles and a predetermined value are designed according to, for example, a use environment or a use state. The value is excessively changed compared to that. In this case, it is preferable to detect the positions of the suction nozzles, calculate the amount of change in the distance between the suction nozzles, and make corrections corresponding to the calculation results. However, in Patent Document 1, no such disclosure is disclosed. . [Technical Means for Solving the Problem] The present invention has been completed in order to solve at least a part of the problems described above, and it can be implemented as the following. The electronic component transporting device of the present invention is characterized by having a base portion that can be moved in the first direction; a first holding portion that is provided on the base portion and holds the electronic component; and a second holding portion that is provided on the base portion and can be The first holding portion moves in the first direction and holds the electronic component; and the detecting portion detects the position in the first direction of the first holding portion and the first portion of the second holding portion. Directional position. Thereby, the distance between the first holding portion and the second holding portion can be obtained, and the operations of the first holding portion and the second holding portion can be changed according to the distance. Thereby, for example, the electronic components can be smoothly held by the first holding portion and the second holding portion. In the electronic component transporting device of the present invention, it is preferable that the base portion can be moved in a second direction orthogonal to the first direction, and the detection portion can detect a position in the second direction of the first holding portion, and the position of the first holding portion. The position of the second holding portion in the second direction. Thereby, the distance between the first holding portion in the second direction and the second holding portion can be obtained based on the position in the second direction of the first holding portion and the position in the second direction of the second holding portion. In the electronic component transfer device of the present invention, it is preferable that the first holding portion and the second holding portion are movable relative to the base portion in a third direction orthogonal to the first direction and the second direction, and are based on When the distance obtained by the position of the first holding portion and the position of the second holding portion detected by the detecting portion is greater than a preset value, the first holding portion and the second holding portion are individually made. Move in the third direction. Thereby, for example, the electronic parts can be accurately held or the electronic parts held can be accurately released. In the electronic component transfer device of the present invention, it is preferable that the first holding portion and the second holding portion are movable relative to the base portion in a third direction orthogonal to the first direction and the second direction, and based on When the distance between the position of the first holding portion and the position of the second holding portion detected by the detecting portion does not reach a preset value, the first holding portion and the second holding portion are simultaneously located at the above Move in 3rd direction. Thereby, for example, the electronic parts can be held or released as quickly as possible. In the electronic component transporting device of the present invention, it is preferable that the detection unit includes a first light-emitting portion that emits light in the first direction, a first light-receiving portion that receives light from the first light-emitting portion, and emits light in the second direction. A second light emitting unit and a second light receiving unit that receives light from the second light emitting unit. Thereby, the position in the first direction of each holding portion can be detected based on the transmission and blocking of light between the first light-emitting portion and the first light-receiving portion, and the position between the second light-emitting portion and the second light-receiving portion can be detected. The transmission and blocking of light detects the position in the second direction of each holding portion. In the electronic component conveying device of the present invention, it is preferable that the detection section has a main body section including a block-shaped or plate-shaped member, and the main body section includes: a concave portion; a small concave portion or a small convex portion formed on the bottom of the concave portion. And is smaller than the concave portion in plan view; the first light-emitting portion insertion portion is opened in a side wall portion of the concave portion for the first light-emitting portion to be inserted; the first light-receiving portion insertion portion is the same as the first light-emitting portion. The insertion portion is oppositely opened in the side wall portion of the recessed portion for the first light receiving portion to be inserted; the second light emitting portion insertion portion is opened in the side wall portion of the recessed portion to insert the second light emitting portion; and the second light receiving portion The part insertion portion is opened in a side wall portion of the recessed portion so as to face the second light emitting portion insertion portion, and the second light receiving portion is inserted. This makes it possible to obtain the following effects in a case where the main body can be obtained by machining using the base material that becomes the main body. As long as the base material is temporarily fixed to the machine tool, the recessed part, the through hole, the first light-emitting part insertion part, the first light-receiving part insertion part, and the second light-emitting part can be maintained using an end mill or a drill while maintaining the fixed state. Processing is performed by the insertion portion and the insertion portion for the second light receiving portion. Thereby, a main body portion whose positional relationship between the processed portions is highly accurate can be obtained. In the electronic component transfer device of the present invention, it is preferable that the small recessed portion is formed so as to penetrate. Thereby, for example, a small concave portion can be clearly captured by an imaging device such as a camera. The electronic component conveying device of the present invention preferably includes a supply area for conveying the electronic components to an inspection area for inspecting the electronic components, and a recovery area for recovering the electronic components that have been inspected in the inspection area, and the detection section is provided. In the supply area and the recovery area. Thereby, both the supply area and the recovery area where a plurality of electronic parts are transported can be obtained based on, for example, the position in the first direction of the first holding portion and the position in the first direction of the second holding portion. The distance between the first holding portion and the second holding portion in one direction. The electronic component transporting device of the present invention preferably includes: a third holding portion provided on the base portion, movable in a first direction with respect to the first holding portion, and holding the electronic component; and a fourth holding portion, which is provided The base portion is movable in the first direction relative to the first holding portion and holds the electronic component; and the detecting portion can detect the position in the first direction of the third holding portion and the position of the fourth holding portion. The position in the first direction. Thereby, the distance between the third holding portion in the first direction and the fourth holding portion can be obtained based on the position in the first direction of the third holding portion and the position in the first direction of the fourth holding portion. In the electronic component transporting device of the present invention, it is preferable that the base portion can be moved in a second direction orthogonal to the first direction, and the detecting portion can detect a position in the second direction of the first holding portion, and the first portion. The position of the 2 holding portion in the second direction, the position of the third holding portion in the second direction, and the position of the fourth holding portion in the second direction. Thereby, it can be based on the position in the second direction of the first holding portion, the position in the second direction of the second holding portion, the position in the second direction of the third holding portion, and the second direction of the fourth holding portion. The distance between the first holding portion and the second holding portion, the distance between the second holding portion and the third holding portion, and the distance between the third holding portion and the fourth holding portion in the second direction. The electronic component transfer device of the present invention preferably includes: a fifth holding portion provided on the base portion and disposed in the second direction with respect to the first holding portion; a sixth holding portion provided on the base portion; and The seventh holding portion is disposed in the second direction with respect to the second holding portion; the seventh holding portion is disposed in the base portion and is disposed in the second direction with respect to the third holding portion; and the eighth holding portion is disposed in the second direction. The base portion is disposed in the second direction with respect to the fourth holding portion; and the detecting portion can detect a position in the first direction and a position in the second direction of the fifth holding portion, and the sixth holding portion. The position in the first direction and the position in the second direction, the position in the first direction and the position in the second direction of the seventh holding portion, and the first direction in the eighth holding portion And the position in the second direction. Thereby, the electronic component can be smoothly held by the first holding portion to the eighth holding portion. The electronic component inspection device of the present invention is characterized by including: a base portion that can be moved in the first direction; a first holding portion that is provided on the base portion and holds the electronic component; a second holding portion that is provided on the base portion, It can move in the first direction with respect to the first holding portion, and can hold the electronic component. The detecting portion can detect the position in the first direction of the first holding portion, and the first portion of the second holding portion. A position in a direction; and an inspection section that inspects the electronic parts held by the first holding section and the electronic parts held by the second holding section. Thereby, the distance between the first holding portion and the second holding portion can be obtained, and the operations of the first holding portion and the second holding portion can be changed according to the distance. Thereby, for example, the electronic components can be smoothly held by the first holding portion and the second holding portion. In addition, the electronic component can be transported to the inspection unit, so that the electronic component can be inspected by the inspection unit. In addition, electronic parts after inspection can be transported from the inspection section.

以下,基於隨附圖式所示之較佳之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。<第1實施形態>以下,參照圖1~圖33,對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。再者,以下,為了便於說明,而如圖1所示,將相互正交之3個軸設為X軸、Y軸及Z軸。又,包含X軸與Y軸之XY平面為水平,且Z軸為鉛直。又,亦將與X軸平行之方向稱為「X方向(第1方向)」,亦將與Y軸平行之方向稱為「Y方向(第2方向)」,亦將與Z軸平行之方向稱為「Z方向(第3方向)」。又,將各方向之箭頭所朝之方向稱為「正」,將其相反方向稱為「負」。又,本案說明書中言及之「水平」並不限定於完全之水平,只要不妨礙電子零件之搬送,則亦包含相對於水平略微(例如未達5°之程度)傾斜之狀態。又,有時將圖1、圖3~圖10、圖18~圖21、圖24~圖32中之上側稱為「上」或「上方」,並將下側稱為「下」或「下方」。本發明之電子零件搬送裝置10具有:基部75,其可於第1方向即X方向上移動;第1固持部78A,其設置於基部75,並固持電子零件;第2固持部78B,其設置於基部75,且可相對於第1固持部78A於X方向上移動,並固持電子零件;及位置檢測部(檢測部)3,其可檢測第1固持部78A於X方向上之位置、及第2固持部78B於X方向上之位置。藉此,如下所述,可求出第1固持部78A與第2固持部78B之距離,並且可根據該距離變更第1固持部78A與第2固持部78B之動作。由此,例如可順利地進行第1固持部78A及第2固持部78B對電子零件之固持。又,本發明之電子零件檢查裝置1係具有本發明之電子零件搬送裝置10者,且進而具有對由第1固持部78A固持之電子零件、及由第2固持部78B固持之電子零件進行檢查之檢查部16。藉此,可將電子零件搬送至檢查部16,由此,可利用檢查部16對該電子零件進行檢查。又,可自檢查部16搬送檢查後之電子零件。以下,對各部之構成進行說明。如圖1、圖2所示,內置電子零件搬送裝置10之電子零件檢查裝置1係搬送例如作為BGA(Ball Grid Array,球柵陣列)封裝體之IC器件等電子零件並於其搬送過程中對電子零件之電氣特性進行檢查、試驗(以下簡稱為「檢查」)的裝置。再者,以下,為了便於說明,代表性地對使用IC器件作為上述電子零件之情形進行說明,並將此設為「IC器件90」。於本實施形態中,IC器件90成為俯視時呈矩形(正方形)者。又,電子零件檢查裝置1(電子零件搬送裝置10)係預先搭載按照IC器件90之種類進行更換之稱為「更換套件」者而使用。於該更換套件存在載置IC器件90之載置部,作為其載置部,例如,存在下述之溫度調整部12、器件供給部14等。又,作為載置IC器件90之載置部,除如上所述之更換套件以外,亦另外存在使用者準備之板狀之托盤200。該托盤200亦搭載於電子零件檢查裝置1(電子零件搬送裝置10)。該作為載置部之托盤200例如係將作為電子零件之IC器件90裝填至電子零件檢查裝置1(電子零件搬送裝置10)時所使用者。藉此,可於下述之托盤供給區域A1將未檢查狀態之複數個IC器件90連同托盤200一起裝填,由此,操作人員(使用者)可容易地進行其裝填作業。又,托盤200亦於載置已根據檢查結果分類之IC器件90時使用。電子零件檢查裝置1具備托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5,該等區域如下所述利用各壁部而劃分。而且,IC器件90係自托盤供給區域A1至托盤去除區域A5沿箭頭α90 方向依次經由上述各區域,並於途中之檢查區域A3進行檢查。如此,電子零件檢查裝置1具備於各區域搬送IC器件90之作為電子零件搬送裝置10之處置器、於檢查區域A3內進行檢查之檢查部16、及控制部800。又,除此以外,電子零件檢查裝置1亦具備監視器300、信號燈400、及操作面板700。再者,電子零件檢查裝置1以如下方式使用,即,配置有托盤供給區域A1、托盤去除區域A5之側、即圖2中之下側成為正面側,且配置有檢查區域A3之側、即圖2中之上側作為背面側。托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200之供材部。於托盤供給區域A1,可堆積多個托盤200。供給區域A2係將已自托盤供給區域A1搬送之托盤200上之複數個IC器件90分別搬送、供給至檢查區域A3的區域。再者,設置有以跨托盤供給區域A1與供給區域A2之方式將托盤200逐片地沿水平方向搬送之托盤搬送機構11A、11B。托盤搬送機構11A係可使托盤200連同載置於該托盤200之IC器件90一起朝Y方向之正側、即圖2中之箭頭α11A 方向移動的移動部。藉此,可穩定地將IC器件90送入至供給區域A2。又,托盤搬送機構11B係可使空的托盤200朝Y方向之負側、即圖2中之箭頭α11B 方向移動之移動部。藉此,可使空的托盤200自供給區域A2移動至托盤供給區域A1。於供給區域A2設置有溫度調整部(均熱板(英語表述:soak plate、中文表述(一例):均溫板))12、器件搬送頭13、及托盤搬送機構15。溫度調整部12構成為載置複數個IC器件90之載置部,稱為可對該載置之IC器件90統一進行加熱或冷卻之「均熱板」。藉由該均熱板,可預先將利用檢查部16檢查之前之IC器件90加熱或冷卻而調整為適於該檢查(高溫檢查或低溫檢查)之溫度。於圖2所示之構成中,溫度調整部12係於Y方向上配置、固定有2個。而且,已藉由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90被搬送至任一溫度調整部12。再者,該作為載置部之溫度調整部12固定,藉此,可穩定地對該溫度調整部12上之IC器件90進行溫度調整。器件搬送頭13具有能夠於供給區域A2內於X方向及Y方向上移動地被支持、進而亦能夠於Z方向上移動的部分。藉此,器件搬送頭13可負責已自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與下述之器件供給部14之間之IC器件90之搬送。再者,於圖2中,以箭頭α13X 表示器件搬送頭13之X方向之移動,且以箭頭α13Y 表示器件搬送頭13之Y方向之移動。托盤搬送機構15係將已去除所有IC器件90之狀態之空的托盤200於供給區域A2內朝X方向之正側、即箭頭α15 方向搬送的機構。而且,於該搬送後,空的托盤200藉由托盤搬送機構11B而自供給區域A2返回至托盤供給區域A1。檢查區域A3係對IC器件90進行檢查之區域。於該檢查區域A3設置有檢查部16、及器件搬送頭17。又,亦設置有以跨供給區域A2與檢查區域A3之方式移動之器件供給部14、及以跨檢查區域A3與回收區域A4之方式移動之器件回收部18。器件供給部14構成為載置已利用溫度調整部12進行溫度調整之IC器件90之載置部,係可將該IC器件90搬送至檢查部16附近之稱為「供給用梭板」或者簡稱為「供給梭」者。又,該作為載置部之器件供給部14係可於供給區域A2與檢查區域A3之間沿著X方向、即箭頭α14 方向往復移動地被支持。藉此,器件供給部14可將IC器件90自供給區域A2穩定地搬送至檢查區域A3之檢查部16附近,又,於檢查區域A3中由器件搬送頭17取走IC器件90之後可再次返回至供給區域A2。於圖2所示之構成中,器件供給部14係於Y方向上配置有2個,溫度調整部12上之IC器件90被搬送至任一器件供給部14。又,器件供給部14與溫度調整部12同樣地,構成為可將載置於該器件供給部14之IC器件90加熱或冷卻。藉此,可將已利用溫度調整部12進行溫度調整之IC器件90維持其溫度調整狀態地搬送至檢查區域A3之檢查部16附近。器件搬送頭17係固持維持上述溫度調整狀態之IC器件90並將該IC器件90於檢查區域A3內搬送的動作部。該器件搬送頭17係可於檢查區域A3內於Y方向及Z方向往復移動地被支持,成為稱為「分度臂」之機構之一部分。藉此,器件搬送頭17可將已自供給區域A2搬入之器件供給部14上之IC器件90搬送並載置於檢查部16上。再者,於圖2中,以箭頭α17Y 表示器件搬送頭17之Y方向之往復移動。又,器件搬送頭17係可於Y方向往復移動地被支持,但並不限定於此,亦可為亦能夠於X方向往復移動地被支持。又,器件搬送頭17與溫度調整部12同樣地,構成為可將所固持之IC器件90加熱或冷卻。藉此,可自器件供給部14至檢查部16為止持續地維持IC器件90之溫度調整狀態。檢查部16構成為載置作為電子零件之IC器件90並對該IC器件90之電氣特性進行檢查的載置部。於該檢查部16,設置有與IC器件90之端子部電性連接之複數個探針。而且,可藉由IC器件90之端子部與探針電性連接即接觸而進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之測試機所具備之檢查控制部中所記憶之程式而進行。再者,於檢查部16,亦與溫度調整部12同樣地,可將IC器件90加熱或冷卻而將該IC器件90調整為適於檢查之溫度。器件回收部18構成為載置已利用檢查部16完成檢查之IC器件90並且可將該IC器件90搬送至回收區域A4的載置部,稱為「回收用梭板」或者簡稱為「回收梭」。又,器件回收部18係可於檢查區域A3與回收區域A4之間沿著X方向、即箭頭α18 方向往復移動地被支持。又,於圖2所示之構成中,器件回收部18與器件供給部14同樣地,於Y方向上配置有2個,檢查部16上之IC器件90被搬送、載置於任一器件回收部18。該搬送藉由器件搬送頭17進行。回收區域A4係將於檢查區域A3經檢查且其檢查結束之複數個IC器件90予以回收的區域。於該回收區域A4設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又,於回收區域A4亦準備有空的托盤200。回收用托盤19係載置已由檢查部16檢查之IC器件90之載置部,且以於回收區域A4內不移動之方式固定。藉此,即便為配置有相對較多之器件搬送頭20等各種可動部之回收區域A4,於回收用托盤19上亦穩定地載置檢查完畢之IC器件90。再者,於圖2所示之構成中,回收用托盤19沿著X方向配置有3個。又,空的托盤200亦沿著X方向配置有3個。該空的托盤200亦成為載置已由檢查部16檢查之IC器件90之載置部。而且,已移動至回收區域A4之器件回收部18上之IC器件90被搬送、載置於回收用托盤19及空的托盤200中之任一者。藉此,將IC器件90按照檢查結果加以分類、回收。器件搬送頭20具有能夠於回收區域A4內於X方向及Y方向上移動地被支持、進而亦能夠於Z方向上移動的部分。藉此,器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。再者,於圖2中,以箭頭α20X 表示器件搬送頭20之X方向之移動,且以箭頭α20Y 表示器件搬送頭20之Y方向之移動。托盤搬送機構21係將自托盤去除區域A5搬入之空的托盤200於回收區域A4內朝X方向、即箭頭α21 方向搬送的機構。而且,於該搬送後,空的托盤200配置於回收IC器件90之位置,即,可為上述3個空的托盤200中之任一者。托盤去除區域A5係將排列有檢查完畢狀態之複數個IC器件90之托盤200回收、去除的除材部。於托盤去除區域A5,可堆積多個托盤200。又,設置有以跨回收區域A4與托盤去除區域A5之方式將托盤200逐片地沿Y方向搬送的托盤搬送機構22A、22B。托盤搬送機構22A係可使托盤200於Y方向、即箭頭α22A 方向往復移動的移動部。藉此,可將檢查完畢之IC器件90自回收區域A4搬送至托盤去除區域A5。又,托盤搬送機構22B可使用以回收IC器件90之空的托盤200朝Y方向之正側、即箭頭α22B 方向移動。藉此,可使空的托盤200自托盤去除區域A5移動至回收區域A4。控制部800例如可控制托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B各部之作動。操作人員可經由監視器300設定或者確認電子零件檢查裝置1之動作條件等。該監視器300具有例如由液晶畫面構成之顯示畫面301,且配置於電子零件檢查裝置1之正面側上部。如圖1所示,於托盤去除區域A5之圖中之右側設置有載置滑鼠之滑鼠台600。該滑鼠係於對監視器300中顯示之畫面進行操作時使用。又,於相對於監視器300為圖1之右下方配置有操作面板700。操作面板700係與監視器300分開地對電子零件檢查裝置1命令所期望之動作者。又,信號燈400可藉由發光之顏色之組合而報告電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。再者,於電子零件檢查裝置1內置有揚聲器500,亦能夠藉由該揚聲器500報告電子零件檢查裝置1之作動狀態等。電子零件檢查裝置1中,托盤供給區域A1與供給區域A2之間由第1間隔壁231隔開,供給區域A2與檢查區域A3之間由第2間隔壁232隔開,檢查區域A3與回收區域A4之間由第3間隔壁233隔開,且回收區域A4與托盤去除區域A5之間由第4間隔壁234隔開。又,供給區域A2與回收區域A4之間亦由第5間隔壁235隔開。電子零件檢查裝置1係最外裝由外殼覆蓋,且於該外殼存在例如前外殼241、側外殼242、側外殼243、後外殼244、頂部外殼245。如上所述,於供給區域A2內,器件搬送頭13可於X方向及Y方向上移動地被支持。如圖3所示,器件搬送頭13具有基部75。該基部75可於X方向(第1方向)、及與X方向(第1方向)正交之Y方向(第2方向)移動地被支持。此種基部75具有第1基座751、第2基座752、第3基座753、及第4基座754。第1基座751係呈於XY平面擴展且於Z方向具有厚度之板狀之部分。第2基座752係自第1基座751之X方向負側之緣部朝下方(Z方向負側)延伸,呈於YZ平面擴展且於X方向具有厚度之板狀的部分。第3基座753係自第1基座751之Y方向正側之緣部朝下方(Z方向負側)延伸,呈於XZ平面擴展且於Y方向具有厚度之板狀的部分。第4基座754係自第3基座753之X方向負側之緣部朝Y方向正側延伸,呈於YZ平面擴展且於X方向具有厚度之板狀的部分。又,器件搬送頭13具有支持於基部75之第1支持部71、第2支持部72、第3支持部73及第4支持部74。該等4個支持部係自X方向負側朝向X方向正側按照第3支持部73、第2支持部72、第1支持部71、第4支持部74之順序設置。第1支持部71、第2支持部72、第3支持部73、第4支持部74分別呈於YZ平面擴展且於X方向具有厚度之板狀。藉由如此般將各支持部71~74設為於YZ平面擴展之板狀,而能夠將第1支持部71~第4支持部74以更窄之間距於X方向並排設置。因此,可謀求器件搬送頭13之小型化。又,該等4個支持部中之第1支持部71固定於第1基座751。第2支持部72、第3支持部73及第4支持部74分別經由線性導軌(未圖示)支持於第1基座751,且可於X方向上移動。而且,器件搬送頭13具有負責該移動之移動機構76。移動機構76具有兩級皮帶輪761及兩級皮帶輪762、架設於兩級皮帶輪761、兩級皮帶輪762之間之皮帶763及皮帶764、以及使兩級皮帶輪761旋轉之馬達765。該等之中,兩級皮帶輪761、兩級皮帶輪762及馬達765分別支持於第1基座751。兩級皮帶輪761、兩級皮帶輪762可於第1基座751之上表面繞沿Y方向延伸之軸旋轉。又,兩級皮帶輪761、兩級皮帶輪762係於X方向分開地設置。兩級皮帶輪761具有外徑較小之小徑皮帶輪761a、及具有小徑皮帶輪761a之大致2倍之外徑之大徑皮帶輪761b,且該等沿Y方向排列而同心地形成。同樣地,兩級皮帶輪762具有外徑較小之小徑皮帶輪762a、及具有小徑皮帶輪762a之大致2倍之外徑之大徑皮帶輪762b,且該等沿Y方向排列而同心地形成。再者,小徑皮帶輪761a、小徑皮帶輪762a之外徑相互相等,大徑皮帶輪761b、大徑皮帶輪762b之外徑亦相互相等。於小徑皮帶輪761a、小徑皮帶輪762a之間架設有皮帶763。皮帶763係於小徑皮帶輪761a、小徑皮帶輪762a之間具有沿X方向延伸之2個區域763a、區域763b。而且,於區域763a,經由連結構件766而連結、固定有第2支持部72,於區域763b,經由連結構件767而連結、固定有第4支持部74。若兩級皮帶輪761朝一方向旋轉,則例如於區域763a皮帶763朝向X方向負側前進,於區域763b皮帶763朝向X方向正側前進,因此,第2支持部72、第4支持部74相互朝X方向相反側且以大致相等之距離移動。另一方面,於大徑皮帶輪761b、大徑皮帶輪762b之間架設有皮帶764。皮帶764係於大徑皮帶輪761b、大徑皮帶輪762b之間具有沿X方向延伸之2個區域764a、區域764b。於該等2個區域764a、區域764b中當兩級皮帶輪761進行旋轉時與皮帶763之區域763a朝相同方向前進之區域764a,經由連結構件768而連結、固定有第3支持部73。藉此,第2支持部72、第3支持部73相互朝X方向之同側移動。再者,如上所述,大徑皮帶輪761b、762b具有小徑皮帶輪761a、762a之2倍之外徑,因此,第3支持部73之移動距離成為第2支持部72之移動距離之大致2倍。根據此種構成,若藉由馬達765使兩級皮帶輪761旋轉,則第2支持部72、第4支持部74相互朝X方向相反側移動大致相等之距離,並且第3支持部73朝與第2支持部72相同之方向且以第2支持部72之2倍之距離移動。因此,根據移動機構76,可統一變更第3固持部78C之吸附嘴733與第2固持部78B之吸附嘴723之X方向之距離即間距(中心間距離)PX1、吸附嘴723與第1固持部78A之吸附嘴713之X方向之距離即間距(中心間距離)PX2、及吸附嘴713與第4固持部78D之吸附嘴743之X方向之距離即間距(中心間距離)PX3。又,於基部75,經由第1支持部71設置有固持作為電子零件之IC器件90之第1固持部78A,同樣地,經由第2支持部72設置有固持IC器件90之第2固持部78B,經由第3支持部73設置有固持IC器件90之第3固持部78C,經由第4支持部74設置有固持IC器件90之第4固持部78D。藉此,第2固持部78B~第4固持部78D分別可相對於第1固持部78A於X方向上移動。第1固持部78A~第4固持部78D除被支持之部位不同以外,為相同之構成,因此,代表性地對第1固持部78A之構成進行說明。第1固持部78A具有:長桿712,其與Z方向平行地配置,且於下端部支持吸附嘴713;及驅動機構714,其經由長桿712使吸附嘴713於Z方向上移動。此種構成之第1固持部78A可藉由驅動機構714之作動而使吸附嘴713連同長桿712一起相對於基部75於與X方向及Y方向正交之Z方向(第3方向)移動。藉此,可使吸附嘴713下降並利用該吸附嘴713吸附IC器件90,從而固持IC器件90。然後,該被固持之IC器件90如上所述利用檢查部16進行檢查。作為驅動機構714之構成,只要能夠使長桿712相對於第1支持部71於Z方向往復移動,則並無特別限定,於本實施形態中,具有皮帶輪714a及皮帶輪714b、架設於皮帶輪714a、皮帶輪714b之間之皮帶714c、將皮帶714c與長桿712連結、固定之固定部714e、以及使皮帶輪714a旋轉之馬達(未圖示)。以下,存在如下情況,即,於第1固持部78A之吸附嘴713、第2固持部78B之吸附嘴723、第3固持部78C之吸附嘴733、第4固持部78D之吸附嘴743中,按照自X方向負側配置之順序,將吸附嘴733稱為「1號嘴(嘴(1))」,將吸附嘴723稱為「2號嘴(嘴(2))」,將吸附嘴713稱為「3號嘴(嘴(3))」,將吸附嘴743稱為「4號嘴(嘴(4))」。如圖4所示,器件搬送頭13具有作為攝像單元77之相機771及鏡772。相機771係CCD(Charge-Coupled Device,電荷耦合器件)相機。該相機771係相機鏡頭773面向Y方向負側,且固定於基部75之第4基座754。鏡772係相對於相機771配置於Y方向負側,且具有使該相機771之視野方向朝下方折射之鏡面774。藉此,相機771可於器件搬送頭13於XY平面上移動時位於例如供給區域A2內之托盤200或溫度調整部12等之上方而對其等進行拍攝。而且,基於所拍攝到之圖像掌握托盤200或溫度調整部12等之位置,並記憶於控制部800。再者,鏡772固定於基部75之第3基座753或第4基座754。如上所述,於器件搬送頭13,可統一變更吸附嘴733與吸附嘴723之間距PX1、吸附嘴723與吸附嘴713之間距PX2、及吸附嘴713與吸附嘴743之間距PX3。藉此,間距PX1採取最大之大間距PX1max ,且採取小於大間距PX1max 之小間距PX1min 。同樣地,間距PX2採取最大之大間距PX2max ,且採取小於大間距PX2max 之小間距PX2min 。間距PX3採取最大之大間距PX3max ,且採取小於大間距PX3max 之小間距PX3min 。於托盤200,形成有呈矩陣狀地配置複數個IC器件90之凹部201。而且,可使小間距PX1min 、小間距PX2min 、小間距PX3min 分別與該等凹部201之X方向之間距PX201一致。再者,於電子零件檢查裝置1,較佳為成為(大間距PX1max )=(大間距PX2max )=(大間距PX3max )。又,較佳為成為(小間距PX1min )=(小間距PX2min )=(小間距PX3min )。且說,器件搬送頭13存在例如組裝誤差,因此,有實際之大間距PX1max 、大間距PX2max 、大間距PX3max 分別自作為基準值之設計值(以下,將該值稱為「第1基準值」)偏離(偏移)之情形。於該情形時,必須分別對大間距PX1max 、大間距PX2max 、大間距PX3max 進行調整。於該調整時,使用圖5所示之對位治具8。該對位治具8係設置於2個器件供給部14中之例如位於Y方向正側之器件供給部14上而使用。如圖5所示,對位治具8呈平板狀。該對位治具8具有開口形成於上表面81之8個嘴用導孔82。該等嘴用導孔82係配置成於X方向各為4個且於Y方向各為2個之矩陣狀,自位於X方向之最負側且Y方向之最負側之嘴用導孔82起朝向X方向正側依次稱為「嘴用導孔821」、「嘴用導孔822」、「嘴用導孔823」、「嘴用導孔824」、「嘴用導孔825」、「嘴用導孔826」、「嘴用導孔827」、「嘴用導孔828」。於本實施形態中,例如,使用嘴用導孔821、嘴用導孔822、嘴用導孔823、嘴用導孔824。嘴用導孔821與嘴用導孔822之間距PX821成為與大間距PX1max 之第1基準值同等,嘴用導孔822與嘴用導孔823之間距PX822成為與大間距PX2max 之第1基準值同等,嘴用導孔823與嘴用導孔824之間距PX823成為與大間距PX3max 之第1基準值同等。對位治具8具有進行與器件供給部14之定位之2個定位用導孔83。該等定位用導孔83係於X方向儘可能分開地配置。而且,藉由將各定位用導孔83插入至器件供給部14之導銷(未圖示)而進行對位治具8與器件供給部14之定位。又,對位治具8具有維持與器件供給部14之定位狀態之2個螺栓84。該等螺栓84係於Y方向分開地配置。而且,藉由將各螺栓84螺合於器件供給部14,可防止對位治具8自器件供給部14脫離,由此,可維持與器件供給部14之定位狀態。其次,對使用對位治具8分別調整大間距PX1max 、大間距PX2max 、大間距PX3max 之方法進行說明。首先,如圖8所示,於將器件搬送頭13設為大間距PX1max 、大間距PX2max 、大間距PX3max 之狀態下,將作為1號嘴之吸附嘴733配置於對位治具8之嘴用導孔821上,將作為2號嘴之吸附嘴723配置於嘴用導孔822上,將作為3號嘴之吸附嘴713配置於嘴用導孔823上,將作為4號嘴之吸附嘴743配置於嘴用導孔824上。繼而,自圖8所示之狀態使吸附嘴733、吸附嘴723、吸附嘴713、吸附嘴743下降。此時,存在成為例如圖9所示之狀態或圖10所示之狀態之情況。於圖9所示之狀態下,吸附嘴733插入至嘴用導孔821,吸附嘴723插入至嘴用導孔822,吸附嘴713插入至嘴用導孔823,且吸附嘴743插入至嘴用導孔824。此種圖9所示之狀態視為大間距PX1max 、大間距PX2max 、大間距PX3max 分別與第1基準值相等,可直接使電子零件檢查裝置1作動。另一方面,於圖10所示之狀態下,吸附嘴733插入至嘴用導孔821,吸附嘴723插入至嘴用導孔822,吸附嘴713插入至嘴用導孔823,但僅吸附嘴743未插入至嘴用導孔824。其原因在於,大間距PX3max 偏離第1基準值(間距PX823),即,於圖10所示之狀態下,大間距PX3max 大於第1基準值。於該情形時,鬆開將連結構件767(參照圖3)固定於移動機構76之皮帶763之螺栓(未圖示),連同連結構件767在內一起調整第4支持部74之位置。藉此,使吸附嘴743能夠插入至嘴用導孔824。然後,只要實際上吸附嘴743插入至嘴用導孔824,則視為大間距PX3max 成為與第1基準值相等,而可使電子零件檢查裝置1作動。又,於該調整後,再次將上述螺栓擰緊,而將連結構件767固定於皮帶763。再者,亦有對位治具8設置於2個器件回收部18中之例如位於Y方向正側之器件回收部上而使用之情況。其原因在於,於回收區域A4之器件搬送頭20亦必須進行與器件搬送頭13相同之調整。又,亦可如圖6所示,於對位治具8之上表面81,以於X方向各為2個且於Y方向各為2個之方式配置安裝4個高度調整用治具9。安裝於對位治具8之該等高度調整用治具9係於檢查區域A3內使用,用以於該檢查區域A3之器件搬送頭17下降時調整其下降位置之高度。各高度調整用治具9呈塊狀。該高度調整用治具9具有朝向下方突出之2個導銷(未圖示)。各導銷插入至形成於對位治具8之上表面81之高度調整用治具用導孔85。藉此,各高度調整用治具9於對位治具8上定位。又,各高度調整用治具9具有維持與對位治具8之定位狀態之2個螺栓91。各螺栓91可螺合於形成於對位治具8之上表面81之母螺紋86。藉此,可防止各高度調整用治具9自對位治具8脫離,由此,可維持與對位治具8之定位狀態。於器件搬送頭13,存在如下情形,即,即便如上述般將大間距PX1max 、大間距PX2max 、大間距PX3max 分別調整為第1基準值,實際之小間距PX1min 、小間距PX2min 、小間距PX3min 亦會因例如供給區域A2內之溫度變化而分別自作為基準值之設計值(以下,將該值稱為「第2基準值」)偏離(偏移)。而且,根據與第2基準值之差(自第2基準值偏移之程度),會產生器件搬送頭13難以自托盤200固持IC器件90或者難以將所固持之IC器件90載置於溫度調整部12之現象。因此,於電子零件檢查裝置1,必須分別掌握實際之小間距PX1min 、小間距PX2min 、小間距PX3min 。於該掌握時,使用圖7所示之位置檢測部(檢測部)3。如圖2所示,位置檢測部3配置於供給區域A2內,其配置部位較佳為儘可能為供給區域A2之中央附近。又,位置檢測部3亦配置於回收區域A4。如此,位置檢測部(檢測部)3設置於供給區域A2及回收區域A4。其原因在於,於回收區域A4之器件搬送頭20亦會產生與供給區域A2之器件搬送頭13相同之上述現象,可利用回收區域A4之位置檢測部3防止該現象。此處,代表性地對供給區域A2內之位置檢測部3進行說明。再者,如上所述,電子零件檢查裝置1具有將IC器件90搬送至對作為電子零件之IC器件90進行檢查之檢查區域A3之供給區域A2、及回收已於檢查區域A3進行檢查之作為電子零件之IC器件90之回收區域A4。位置檢測部3具有用以於供給區域A2內定位之2個定位用導孔48。該等定位用導孔48係於X方向儘可能分開地配置。而且,於該定位狀態下,位置檢測部3經由2個螺栓35而固定。位置檢測部3係檢測第1固持部78A之吸附嘴713之位置、第2固持部78B之吸附嘴723之位置、第3固持部78C之吸附嘴733之位置、及第4固持部78D之吸附嘴743之位置者。如圖7所示,位置檢測部3具有本體部4、第1發光部5A、第1受光部5B、第2發光部6A、及第2發光部6B。位置檢測部(檢測部)3呈塊狀或板狀(本實施形態中為板狀),具有由俯視時為矩形之構件構成之本體部4。該本體部4具有:凹部42,其形成於上表面41之中央部;貫通孔(小凹部)44,其於凹部42之底部421貫通形成至下表面43;第1發光部用插入部45A,其開口形成至凹部42之側壁部422;第1受光部用插入部45B,其與第1發光部用插入部45A對向地開口形成至凹部42之側壁部423;第2發光部用插入部46A,其開口形成至凹部42之側壁部424;及第2受光部用插入部46B,其與第2發光部用插入部46A對向地開口形成至凹部42之側壁部425。第1發光部用插入部45A係沿著X方向貫通而形成,供第1發光部5A插入。第1發光部5A藉由帶槽之固定螺釘31而於第1發光部用插入部45A內固定。第1受光部用插入部45B係沿著X方向貫通而形成,供第1受光部5B插入。第1受光部5B藉由帶槽之固定螺釘32而於第1受光部用插入部45B內固定。第2發光部用插入部46A係沿著Y方向貫通而形成,供第2發光部6A插入。第2發光部6A藉由帶槽之固定螺釘33而於第2發光部用插入部46A內固定。第2受光部用插入部46B係沿著Y方向貫通而形成,供第2受光部6B插入。第2受光部6B藉由帶槽之固定螺釘34而於第2受光部用插入部46B內固定。藉由本體部4形成此種構成,於對成為該本體部4之母材進行機械加工之情形時,發揮如下效果。只要將母材暫且固定於機床,便可維持其固定狀態地使用端銑刀或鑽孔器對凹部42、貫通孔44、第1發光部用插入部45A、第1受光部用插入部45B、第2發光部用插入部46A、及第2受光部用插入部46B等完成加工。藉此,可獲得所加工之各部之位置關係為高精度之本體部4。再者,較佳為於本體部4形成有用以固定於機床之母螺紋47。第1發光部5A、第1受光部5B、第2發光部6A、第2受光部6B均為光纖感測器。第1發光部5A可朝向X方向正側、即第1受光部5B出射作為雷射光之光LS5。第1受光部5B可接收光LS5。第2發光部6A可朝向Y方向正側、即第2受光部6B出射作為雷射光之光LS6。第2受光部6B可接收光LS6。如此,位置檢測部(檢測部)3具有朝X方向(第1方向)發出光LS5之第1發光部5A、接收來自第1發光部5A之光LS5之第1受光部5B、朝Y方向(第2方向)發出光LS6之第2發光部6A、及接收來自第2發光部6A之光LS6之第2受光部6B。藉此,如下所述,可基於光LS5之透過與遮斷而檢測第1固持部78A之吸附嘴713、第2固持部78B之吸附嘴723、第3固持部78C之吸附嘴733、第4固持部78D之吸附嘴743之X方向之位置。又,可基於光LS6之透過與遮斷而檢測第1固持部78A之吸附嘴713、第2固持部78B之吸附嘴723、第3固持部78C之吸附嘴733、第4固持部78D之吸附嘴743之Y方向之位置。如圖7及圖11所示,第1發光部用插入部45A、第1受光部用插入部45B分別具有狹縫451。藉由光LS5通過狹縫451,可防止該光LS5之擴散,由此,光LS5之指向性提昇。又,第2發光部用插入部46A、第2受光部用插入部46B分別具有狹縫461。藉由光LS6通過狹縫461,可防止該光LS6之擴散,由此,光LS6之指向性提昇。又,於位置檢測部3,貫通孔44係俯視時較底部421小之部分,作為用以使相機771攝像之識別標記發揮功能(參照圖4)。藉由該識別標記,可將俯視時呈圓形之貫通孔44之中心O44 與相機771之攝像中心一致時之器件搬送頭13之座標設為相機771之攝像中心之水平位置(XY座標)。再者,作為識別標記發揮功能之部分亦可為突出形成於底部421且俯視時較底部421小之小凸部,而代替貫通孔(小凹部)44。如圖11所示,貫通孔44之中心O44 係配置於俯視時與光LS5和光LS6交叉之交點OLS 重合之位置。藉此,基於器件搬送頭13之水平位置(XY座標),求出配置於該位置之作為1號嘴之吸附嘴733之中心與相機771之攝像中心之XY座標。據此,求出於同一水平位置(XY座標)配置吸附嘴733之中心之情形、與配置相機771之攝像中心之情形之器件搬送頭13之各個位置之差異,作為吸附嘴733之中心與相機771之攝像中心之間之水平位置之差異。即,根據器件搬送頭13之移動位置,求出安裝於器件搬送頭13之基部75之吸附嘴733之中心與同樣安裝於基部75之相機771之攝像中心之相對位置關係。於本實施形態中,求出相對位置關係作為基於器件搬送頭13之水平位置的吸附嘴733之中心之水平位置(XY座標)與相機771之攝像中心之水平位置(XY座標)之間之差。而且,藉由將如此般求出之相對位置關係設定為相對位置資訊,而於使相機771之攝像中心與IC器件90之中心位置一致時,基於相對位置資訊使器件搬送頭13移動相當於上述差之量,藉此,可使吸附嘴733之中心移動至IC器件90之中心位置。以此方式,較佳地實施吸附嘴733對IC器件90之固持。其次,對利用位置檢測部3進行之、第1固持部78A之吸附嘴713之位置、第2固持部78B之吸附嘴723之位置、第3固持部78C之吸附嘴733之位置、及第4固持部78D之吸附嘴743之位置之檢測進行說明。如圖11所示,位置檢測部3成為自第1發光部5A出射光LS5且於第1受光部5B接收光、並且自第2發光部6A出射光LS6且於第2受光部6B接收光之狀態(導通)。即,於位置檢測部3,光LS5、光LS6皆為透過狀態。繼而,如圖12所示,使器件搬送頭13之作為1號嘴之吸附嘴733移動至與位置檢測部3之中心O44 重合之位置。即,如圖18所示,使器件搬送頭13之作為1號嘴之吸附嘴733移動至較位置檢測部3之上表面41更上方、且貫通孔44之正上方。如上所述之位置係基於以相機771拍攝到之圖像而預先檢測出,且記憶於控制部800。又,如圖12所示,光LS5、光LS6仍為透過狀態。再者,器件搬送頭13中,作為1號嘴之吸附嘴733與作為2號嘴之吸附嘴723之間為小間距PX1min ,作為2號嘴之吸附嘴723與作為3號嘴之吸附嘴713之間為小間距PX2min ,且作為3號嘴之吸附嘴713與作為4號嘴之吸附嘴743之間為小間距PX3min 。繼而,如圖13所示,使吸附嘴733朝Z方向負側移動,且插入至位置檢測部3之凹部42。即,如圖19所示,使吸附嘴733朝向下方移動至不與位置檢測部3之凹部42之底部421抵接之位置。藉此,於位置檢測部3,成為第1受光部5B對光LS5之受光被吸附嘴733遮斷、並且第2受光部6B對光LS6之受光被吸附嘴733遮斷之狀態(斷開)。即,光LS5、光LS6均藉由吸附嘴733而成為遮光狀態。吸附嘴733於位置檢測時,開始自如上所述之位置(圖13所示之位置)朝向X方向、Y方向移動。藉此,可防止吸附嘴733朝X方向、Y方向之任一方向移動均碰撞於凹部42之側壁部422、側壁部423、側壁部424、側壁部425。再者,於光LS5、光LS6均未藉由吸附嘴733成為遮光狀態之情形時,將吸附嘴733之位置微調整至成為遮光狀態之位置。繼而,如圖14所示,使吸附嘴733逐漸朝X方向正側移動並於第2受光部6B成為受光狀態(導通)之位置停止。繼而,該位置(X座標)作為吸附嘴733之「第1X座標(參照圖22)」而記憶於控制部800。繼而,如圖15所示,使吸附嘴733逐漸朝X方向負側移動並於第2受光部6B再次成為受光狀態(導通)之位置停止。繼而,該位置(X座標)作為吸附嘴733之「第2X座標(參照圖22)」而記憶於控制部800。繼而,控制部800檢測(計算)並記憶上述第1X座標與上述第2X座標之間之中央之位置作為吸附嘴733之X方向之中心位置即「中心X座標」(參照圖22)。繼而,使吸附嘴733再次返回至移動開始位置,而如圖16所示,使吸附嘴733逐漸朝Y方向正側移動並於第1受光部5B成為受光狀態(導通)之位置停止。繼而,該位置(Y座標)作為吸附嘴733之「第1Y座標(參照圖23)」而記憶於控制部800。繼而,如圖17所示,使吸附嘴733逐漸朝Y方向負側移動並於第1受光部5B再次成為受光狀態(導通)之位置停止。繼而,該位置(Y座標)作為吸附嘴733之「第2Y座標(參照圖23)」而記憶於控制部800。繼而,控制部800檢測(計算)並記憶上述第1Y座標與上述第2Y座標之間之中央之位置作為吸附嘴733之Y方向之中心位置即「中心Y座標(參照圖23)」。繼而,如圖20所示,使吸附嘴733上升並使器件搬送頭13朝X方向負側移動相當於小間距PX2min 之量。藉此,作為2號嘴之吸附嘴723移動至俯視時與位置檢測部3之中心O44 重合之位置。即,作為2號嘴之吸附嘴723移動至相較位置檢測部3之上表面41更上方且貫通孔44之正上方。繼而,如圖21所示,使吸附嘴723朝Z方向負側移動並插入至位置檢測部3之凹部42。之後,以與求出吸附嘴733之「中心X座標」及「中心Y座標」相同之方式,求出吸附嘴723之「中心X座標」及「中心Y座標」。又,亦可同樣地求出作為3號嘴之吸附嘴713之「中心X座標」及「中心Y座標」、作為4號嘴之吸附嘴743之「中心X座標」及「中心Y座標」。如上所述,基部75可於X方向移動,且亦可於與X方向(第1方向)正交之Y方向(第2方向)移動。於該基部75設置有:第1固持部78A,其固持作為電子零件之IC器件90;第2固持部78B,其可相對於第1固持部78A於X方向(第1方向)移動,並固持作為電子零件之IC器件90;第3固持部78C,其可相對於第1固持部78A於X方向(第1方向)移動,並固持作為電子零件之IC器件90;及第4固持部78D,其可相對於第1固持部78A於X方向(第1方向)移動,並固持作為電子零件之IC器件90。而且,如上所述,位置檢測部3可檢測第1固持部78A之吸附嘴713之X方向(第1方向)上之位置即中心X座標、及該第1固持部78A之吸附嘴713之Y方向(第2方向)上之位置即中心Y座標。同樣地,位置檢測部3可檢測第2固持部78B之吸附嘴723之X方向(第1方向)上之位置即中心X座標、及該第2固持部78B之吸附嘴723之Y方向(第2方向)上之位置即中心Y座標。又,位置檢測部(檢測部)3可檢測第3固持部78C之吸附嘴733之X方向(第1方向)上之位置即中心X座標、及該第3固持部78C之吸附嘴733之Y方向(第2方向)上之位置即中心Y座標。又,位置檢測部(檢測部)3可檢測第4固持部78D之吸附嘴743之X方向(第1方向)上之位置、及該第4固持部78D之吸附嘴743之Y方向(第2方向)上之位置即中心Y座標。基於利用此種構成之位置檢測部3檢測出之檢測結果、即1號嘴~4號嘴之各中心X座標,控制部800可分別運算實際之小間距PX1min 、小間距PX2min 、小間距PX3min 。小間距PX1min 係根據(2號嘴(吸附嘴723)之中心X座標)-(1號嘴(吸附嘴733)之中心X座標)而求出。小間距PX2min 係根據(3號嘴(吸附嘴713)之中心X座標)-(2號嘴(吸附嘴723)之中心X座標)而求出。小間距PX3min 係根據(4號嘴(吸附嘴743)之中心X座標)-(3號嘴(吸附嘴713)之中心X座標)而求出。再者,於本實施形態中,器件搬送頭13係以於X方向配置1號嘴~4號嘴且於該X方向進行間距變換之方式構成,但並不限定於此。例如,亦可以於Y方向上配置1號嘴~4號嘴且於該Y方向進行間距變換之方式構成。於該情形時,於求出小於間距成為最大之大間距之小間距時,使用1號嘴~4號嘴之各中心Y座標。於電子零件檢查裝置1,可根據上述所求出之實際之小間距PX1min 、小間距PX2min 、小間距PX3min 與上述第2基準值之差之程度而變更即切換1號嘴~4號嘴之動作。該動作存在第1模式與第2模式。如上所述,第1固持部78A之吸附嘴713、第2固持部78B之吸附嘴723、第3固持部78C之吸附嘴733、及第4固持部78D之吸附嘴743可相對於基部75於與X方向(第1方向)及Y方向(第2方向)正交之Z方向(第3方向)移動。第1模式係如下動作,即,於基於利用位置檢測部(檢測部)3檢測出之第1固持部78A之吸附嘴713之位置與第2固持部78B之吸附嘴723之位置所獲得之距離(小間距PX2min )、基於第2固持部78B之吸附嘴723之位置與第3固持部78C之吸附嘴733之位置所獲得之距離(小間距PX1min )、及基於第1固持部78A之吸附嘴713之位置與第4固持部78D之吸附嘴743之位置所獲得之距離(小間距PX3min )未達預設之值的情形時,使第1固持部78A、第2固持部78B、第3固持部78C及第4固持部78D同時地即統一地朝Z方向(第3方向)移動。第2模式係如下動作,即,於基於利用位置檢測部(檢測部)3檢測出之第1固持部78A之吸附嘴713之位置與第2固持部78B之吸附嘴723之位置所獲得之距離(小間距PX2min )、基於第2固持部78B之吸附嘴723之位置與第3固持部78C之吸附嘴733之位置所獲得之距離(小間距PX1min )、及基於第1固持部78A之吸附嘴713之位置與第4固持部78D之吸附嘴743之位置所獲得之距離(小間距PX3min )為預設之值以上的情形時,使第1固持部78A、第2固持部78B、第3固持部78C及第4固持部78D個別地即具有時間差地朝Z方向(第3方向)移動。如此,於電子零件檢查裝置1,可根據1號嘴~4號嘴之間距(距離)變更該各固持部之動作。藉此,如下所述,可順利地進行1號嘴~4號嘴對IC器件90之固持等。以下,作為一例,參照圖24~圖26對固持托盤200上之IC器件90時應用第1模式之情形進行說明。此處,作為前提,設為由控制部800判斷出實際之小間距PX1min 、小間距PX2min 、小間距PX3min 中例如小間距PX1min 為最大。而且,設為該小間距PX1min 與第2基準值(=PX201)之差(絕對值)未達預先設定並記憶於控制部800之臨限值。認為只要為如上所述之範圍內,則間距之大小不會影響1號嘴~4號嘴對IC器件90之固持。再者,「臨限值」係指認為間距之大小對1號嘴~4號嘴對IC器件90之固持造成影響的值。如圖24所示,於將器件搬送頭13設為小間距PX1min 、小間距PX2min 、小間距PX3min 之狀態下,將作為1號嘴之吸附嘴733、作為2號嘴之吸附嘴723、作為3號嘴之吸附嘴713、作為4號嘴之吸附嘴743分別配置於托盤200之IC器件90上。繼而,如圖25所示,使作為1號嘴之吸附嘴733~作為4號嘴之吸附嘴743同時下降。藉此,作為1號嘴之吸附嘴733~作為4號嘴之吸附嘴743分別抵接於IC器件90,若於該抵接狀態下進行抽吸,則可吸附該IC器件90。繼而,如圖26所示,使作為1號嘴之吸附嘴733~作為4號嘴之吸附嘴743同時上升。藉此,作為1號嘴之吸附嘴733~作為4號嘴之吸附嘴743可分別固持IC器件90。藉由此種第1模式,可儘可能迅速地固持並搬送IC器件90,由此,可謀求電子零件檢查裝置1之處理量之提昇。其次,作為一例,參照圖27~圖32對固持托盤200上之IC器件90時應用第2模式之情形進行說明。此處,作為前提,設為由控制部800判斷出實際之小間距PX1min 、小間距PX2min 、小間距PX3min 中例如小間距PX1min 為最大。而且,設為該小間距PX1min 與第2基準值(=PX201)之差(絕對值)為上述臨限值以上。認為於如上所述之範圍內之情形時,1號嘴~4號嘴對IC器件90之固持受間距之大小之影響。如圖27所示,於將器件搬送頭13設為小間距PX1min 、小間距PX2min 、小間距PX3min 之狀態下,將作為1號嘴之吸附嘴733配置於托盤200之IC器件90上。繼而,如圖28所示,使作為1號嘴之吸附嘴733下降。藉此,作為1號嘴之吸附嘴733抵接於IC器件90,若於該抵接狀態下進行抽吸,則可吸附該IC器件90。繼而,如圖29所示,使作為1號嘴之吸附嘴733上升。藉此,作為1號嘴之吸附嘴733可固持IC器件90。繼而,如圖30所示,使器件搬送頭13朝X方向負側移動相當於小間距PX1min 之量。藉此,將作為2號嘴之吸附嘴723配置於托盤200之IC器件90上。繼而,如圖31所示,使作為2號嘴之吸附嘴723下降。藉此,作為2號嘴之吸附嘴723抵接於IC器件90,若於該抵接狀態下進行抽吸,則可吸附該IC器件90。繼而,如圖32所示,使作為2號嘴之吸附嘴723上升。藉此,作為2號嘴之吸附嘴723可固持IC器件90。之後,能夠以與作為2號嘴之吸附嘴723固持IC器件90之前之動作相同之方式,亦使作為3號嘴之吸附嘴713、作為4號嘴之吸附嘴743固持IC器件90。藉由此種第2模式,即便於難以利用第1嘴~第4嘴統一固持IC器件90之情形時,亦能夠逐個地具有時間差地準確地固持IC器件90。藉此,可防止產生電子零件檢查裝置1中之卡住或錯誤。再者,第1模式、第2模式均設為與臨限值進行比較者,於本實施形態中,使用小間距PX1min 、小間距PX2min 、小間距PX3min 中之最大者,但並不限定於此。例如,亦可使用小間距PX1min 、小間距PX2min 、小間距PX3min 中之最小者,還可使用最大者及最小者之兩者。其次,基於圖33之流程圖對檢測1號嘴~4號嘴之位置之後至利用各嘴固持IC器件90之前之一系列動作進行說明。再者,執行該流程圖之時點並無特別限定,例如,可設為供給區域A2內之溫度變化為特定值以上時或每隔固定時間。作為檢測位置之對象之吸附嘴,設定1號嘴(步驟S101)。繼而,如上述般檢測1號嘴之中心X座標(步驟S102),並將該中心X座標記憶於控制部800(步驟S103)。繼而,如上述般檢測1號嘴之中心Y座標(步驟S104),並將該中心Y座標記憶於控制部800(步驟S105)。繼而,判斷是否已對4號嘴執行步驟S102~步驟S105(步驟S106)。若於步驟S106中判斷為已對4號嘴執行步驟S102~步驟S105,則進行初始化(步驟S107)。另一方面,於步驟S106中未判斷為已對4號嘴執行步驟S102~步驟S105之情形時,將N(嘴編號)增加1(步驟S108)。執行步驟S107之後,如上述般運算1號嘴與2號嘴之X方向之距離、即小間距PX1min (步驟S109)。繼而,判斷是否已執行至運算3號嘴與4號嘴之X方向之距離、即小間距PX3min (步驟S110)。若於步驟S110中判斷為已執行至運算小間距PX3min ,則檢測小間距PX1min 、小間距PX2min 、小間距PX3min 中之最大者(最大距離)(步驟S111)。另一方面,於步驟S110中未判斷為已執行至運算小間距PX3min 之情形時,將N(嘴編號)增加1(步驟S112)。執行步驟S111之後,運算|最大距離-基準距離(第2基準值)|,並判斷該運算結果是否為臨限值以上(步驟S113)。於步驟S113中未判斷為運算結果為臨限值以上之情形時,選擇第1模式(步驟S114)。另一方面,於步驟S113中判斷為運算結果為臨限值以上之情形時,選擇第2模式(步驟S115)。再者,於本實施形態中,流程圖所示之一系列動作係於器件搬送頭13固持供給區域A2內之托盤200上之IC器件90時進行應用,但並不限定於此。作為其他應用態樣,可列舉例如以下態樣。·器件搬送頭13將IC器件90釋放至溫度調整部12上時。·器件搬送頭13固持溫度調整部12上之IC器件90時。·器件搬送頭13將IC器件90釋放至器件供給部14上時。·器件搬送頭20固持器件回收部18上之IC器件90時。·器件搬送頭20將IC器件90釋放至回收區域A4內之托盤200上時。·器件搬送頭20將IC器件90釋放至回收用托盤19上時。<第2實施形態>以下,參照圖34對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明,但以與上述實施形態之不同點為中心進行說明,而省略相同之事項之說明。本實施形態除固持IC器件之固持部之設置數不同以外,與上述第1實施形態相同。如圖34所示,於本實施形態中,器件搬送頭13除具有第1固持部78A~第4固持部78D以外,進而具有第5固持部78E、第6固持部78F、第7固持部78G、及第8固持部78H。第5固持部78E設置於基部75,且相對於第1固持部78A配置於Y方向正側(第2方向)。第6固持部78F設置於基部75,且相對於第2固持部78B配置於Y方向正側(第2方向)。第7固持部78G設置於基部75,且相對於第3固持部78C配置於Y方向正側(第2方向)。第8固持部78H設置於基部75,且相對於第4固持部78D配置於Y方向正側(第2方向)。位置檢測部(檢測部)3可與對第1實施形態中記載之第1固持部78A~第4固持部78D同樣地,檢測第5固持部78E之吸附嘴791之X方向(第1方向)上之位置(中心X座標)、及Y方向(第2方向)上之位置(中心Y座標)。同樣地,位置檢測部3可檢測第6固持部78F之吸附嘴792之X方向(第1方向)上之位置(中心X座標)、及Y方向(第2方向)上之位置(中心Y座標)。又,位置檢測部3可檢測第7固持部78G之吸附嘴793之X方向(第1方向)上之位置(中心X座標)、及Y方向(第2方向)上之位置(中心Y座標)。位置檢測部3可檢測第8固持部78H之吸附嘴794之X方向(第1方向)上之位置(中心X座標)、及Y方向(第2方向)上之位置(中心Y座標)。若對如上所述之構成之器件搬送頭13應用第1實施形態中記載之流程圖,則可藉由第1固持部78A~第8固持部78H順利地進行對IC器件90之固持。<第3實施形態>以下,參照圖35~圖37對本發明之電子零件搬送裝置及電子零件檢查裝置之第3實施形態進行說明,但以與上述實施形態之不同點為中心進行說明,而省略相同之事項之說明。本實施形態除檢測吸附嘴之位置之方法不同以外,與上述第1實施形態相同。此處,代表性地對檢測作為1號嘴之吸附嘴733之位置之方法進行說明。於檢測吸附嘴733之X方向之中心位置即「中心X座標」時,首先,如圖35所示,使吸附嘴733配置於位置檢測部3之偏離凹部42之上表面41上。此時,吸附嘴733相對於凹部42位於X方向負側。繼而,自吸附嘴733噴出氣體GS,並且使該吸附嘴733朝X方向正側移動(去路PR1),並使其於超過凹部42之位置(參照圖35中之二點鏈線所示之吸附嘴733)停止。於去路PR1,利用與吸附嘴733連通之流量計(未圖示)檢測(測定)之氣體GS之流量之變化成為圖36中之實線所示之曲線圖GR1。根據該曲線圖GR1可知,於吸附嘴733移動之過程中,於超過凹部42之側壁部422時,流量轉為增加。將該流量轉為增加之位置作為「第1X座標」而記憶。繼而,自吸附嘴733噴出氣體GS,並且使該吸附嘴733朝X方向負側移動(反路PR2),並使其於超過凹部42之位置停止。於反路PR2,利用上述流量計檢測之氣體GS之流量之變化成為圖36中之虛線所示之曲線圖GR2。根據該曲線圖GR2可知,於吸附嘴733移動之過程中,於超過凹部42之側壁部423時,流量轉為增加。將該流量轉為增加之位置作為「第2X座標」而記憶。繼而,可檢測上述第1X座標與上述第2X座標之間之中央之位置作為吸附嘴733之X方向之中心位置即「中心X座標」。於檢測吸附嘴733之Y方向之中心位置即「中心Y座標」時,與檢測中心X座標同樣地,使吸附嘴733配置於位置檢測部3之偏離凹部42之上表面41上。此時,吸附嘴733相對於凹部42位於Y方向負側。繼而,自吸附嘴733噴出氣體GS,並且使該吸附嘴733朝Y方向正側移動(去路),並使其於超過凹部42之位置停止。於該去路,利用上述流量計檢測之氣體GS之流量之變化成為圖37中之實線所示之曲線圖GR3。根據該曲線圖GR3可知,於吸附嘴733移動之過程中,於超過凹部42之側壁部424時,流量轉為增加。將該流量轉為增加之位置作為「第1Y座標」而記憶。再者,根據曲線圖GR3可知,於吸附嘴733超過凹部42之側壁部425時,流量轉為減少。繼而,自吸附嘴733噴出氣體GS,並且使該吸附嘴733朝Y方向負側移動(反路),並使其於超過凹部42之位置停止。於該反路,利用上述流量計檢測之氣體GS之流量之變化成為圖37中之虛線所示之曲線圖GR4。根據該曲線圖GR4可知,於吸附嘴733移動之過程中,於超過凹部42之側壁部425時,流量轉為增加。將該流量轉為增加之位置作為「第2Y座標」而記憶。繼而,可檢測上述第1Y座標與上述第2Y座標之間之中央之位置作為吸附嘴733之Y方向之中心位置即「中心Y座標」。<第4實施形態>以下,參照圖38對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行說明,但以與上述實施形態之不同點為中心進行說明,而省略相同之事項之說明。再者,於圖38中,代表性地對1個嘴進行圖示。本實施形態除對吸附嘴之位置進行調整之態樣不同以外,與上述第1實施形態相同。如圖38所示,於本實施形態中,吸附嘴713支持、固定於塊狀之支持部715。又,於長桿712之下端部設置有呈塊狀且連結支持部715之連結部712a。而且,於本實施形態中,經由2個螺栓712b將連結部712a與支持部715連結。再者,2個螺栓712b介隔長桿712相互配置於相反側。藉由此種構成,於例如調整大間距PX2max 之情形時,可將2個螺栓712b分別鬆開。藉此,可對吸附嘴713之位置連同支持部715一起於X方向(或Y方向)進行微調整。繼而,於該調整後,再次將2個螺栓712b分別擰緊。藉此,將經位置調整之吸附嘴713固定於長桿712。以上,針對本發明之電子零件搬送裝置及電子零件檢查裝置對圖示之實施形態進行了說明,但本發明並不限定於此,構成電子零件搬送裝置及電子零件檢查裝置之各部可替換為能夠發揮相同功能之任意之構成者。又,亦可附加任意之構成物。又,本發明之電子零件搬送裝置及電子零件檢查裝置亦可為將上述各實施形態中之任意之2個以上之構成(特徵)組合而成者。又,於上述第1實施形態中,器件搬送頭所具有之固持電子零件之固持部之設置數係沿著X方向為4個,但並不限定於此,例如,亦可為2個、3個或5個以上。又,於上述第2實施形態中,固持部之設置數係分別對應於沿X方向配置之各固持部,亦於Y方向各設置有1個,但並不限定於此,亦可於Y方向設置2個以上。又,於上述各實施形態中,IC器件係俯視時為矩形者,但並不限定於此,例如,亦可為圓形或橢圓形者。於該情形時,電子零件搬送裝置或電子零件檢查裝置較佳為於供給區域及回收區域內具有變更IC器件於水平面內之姿勢、即使IC器件於水平面內繞鉛直軸旋轉之旋轉平台。於該情形時,亦可將上述流程圖所示之一系列動作應用於例如以下態樣。·於供給區域內器件搬送頭將IC器件釋放至旋轉平台上時。·於供給區域內器件搬送頭固持旋轉平台上之IC器件時。·於回收區域內器件搬送頭將IC器件釋放至旋轉平台上時。·於回收區域內器件搬送頭固持旋轉平台上之IC器件時。Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings. <First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 33. In the following, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are X axis, Y axis, and Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis is also referred to as "X direction (first direction)", the direction parallel to the Y axis is also referred to as "Y direction (second direction)", and the direction parallel to the Z axis is also referred to It is called "Z direction (third direction)". The direction to which the arrows in each direction are directed is called "positive", and the opposite direction is called "negative". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than 5 °) with respect to the level. In addition, the upper side in FIG. 1, FIG. 3 to FIG. 10, FIG. 18 to FIG. 21, and FIG. 24 to FIG. ". The electronic component transporting device 10 of the present invention includes a base portion 75 that can be moved in the first direction, that is, the X direction; a first holding portion 78A that is provided on the base portion 75 and holds electronic components; and a second holding portion 78B that is provided with At the base portion 75 and movable in the X direction relative to the first holding portion 78A and holding the electronic component; and the position detecting portion (detection portion) 3 which can detect the position of the first holding portion 78A in the X direction, and The position of the second holding portion 78B in the X direction. Thereby, as described below, the distance between the first holding portion 78A and the second holding portion 78B can be obtained, and the operations of the first holding portion 78A and the second holding portion 78B can be changed according to the distance. Thereby, for example, the electronic components can be smoothly held by the first holding portion 78A and the second holding portion 78B. The electronic component inspection device 1 of the present invention includes the electronic component transfer device 10 of the present invention, and further includes an inspection of the electronic components held by the first holding portion 78A and the electronic parts held by the second holding portion 78B. Of the inspection department 16. Thereby, the electronic component can be transported to the inspection unit 16, and thus the electronic component can be inspected by the inspection unit 16. In addition, electronic components after inspection can be transported from the inspection unit 16. The configuration of each unit will be described below. As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 with the built-in electronic component transfer device 10 transfers electronic components such as IC devices, such as BGA (Ball Grid Array) packages, and transfers the electronic components during the transfer process. A device for inspecting and testing the electrical characteristics of electronic parts (hereinafter referred to as "inspection"). In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component will be representatively described, and this will be referred to as "IC device 90". In this embodiment, the IC device 90 is rectangular (square) in plan view. The electronic component inspection device 1 (electronic component transfer device 10) is used in advance by a person called a "replacement kit" that is replaced in accordance with the type of the IC device 90. A mounting section on which the IC device 90 is mounted is provided in the replacement kit. As the mounting section, for example, there are a temperature adjustment section 12 and a device supply section 14 described below. In addition, as the mounting portion on which the IC device 90 is mounted, in addition to the replacement kit described above, there is also a plate-shaped tray 200 prepared by the user. This tray 200 is also mounted on the electronic component inspection device 1 (electronic component transfer device 10). The tray 200 as a mounting portion is, for example, a user used when the IC device 90 as an electronic component is loaded into the electronic component inspection device 1 (electronic component transfer device 10). Thereby, the plurality of IC devices 90 in an unchecked state can be loaded together with the tray 200 in the tray supply area A1 described below, so that the operator (user) can easily perform the loading operation. The tray 200 is also used when the IC devices 90 classified according to the inspection results are placed. The electronic component inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and a tray removal area A5. The equal areas are divided by the respective wall portions as described below. Further, the IC device 90 follows the arrow α from the tray supply area A1 to the tray removal area A5. 90 The direction passes through the above-mentioned areas in order, and is inspected in the inspection area A3 on the way. As described above, the electronic component inspection apparatus 1 includes a handler as the electronic component transport apparatus 10 that transports the IC device 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700. The electronic component inspection device 1 is used in such a manner that the side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 becomes the front side, and the side where the inspection area A3 is arranged, that is, The upper side in FIG. 2 is regarded as the back side. The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 are arranged in an unchecked state. A plurality of trays 200 can be stacked in the tray supply area A1. The supply area A2 is an area where a plurality of IC devices 90 on the tray 200 that has been transferred from the tray supply area A1 are respectively transferred to and supplied to the inspection area A3. Moreover, tray conveyance mechanisms 11A and 11B are provided which carry the tray 200 horizontally one by one across the tray supply area A1 and the supply area A2. The tray transfer mechanism 11A allows the tray 200 and the IC device 90 placed on the tray 200 to face the positive side of the Y direction, that is, the arrow α in FIG. 2 11A Moving part moving in the direction. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray conveying mechanism 11B allows the empty tray 200 to be directed to the negative side of the Y direction, that is, the arrow α in FIG. 2. 11B Moving part moving in the direction. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1. A temperature adjustment unit (a soaking plate (English expression: soap plate, Chinese expression (one example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided in the supply area A2. The temperature adjustment section 12 is a mounting section on which a plurality of IC devices 90 are mounted, and is referred to as a "soaking plate" that can uniformly heat or cool the mounted IC devices 90. With this soaking plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled to adjust the temperature suitable for the inspection (high-temperature inspection or low-temperature inspection) in advance. In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Further, the IC device 90 on the tray 200 that has been carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment sections 12. In addition, the temperature adjustment section 12 serving as the mounting section is fixed, whereby the temperature of the IC device 90 on the temperature adjustment section 12 can be stably adjusted. The device transfer head 13 has a portion that can be moved in the X direction and the Y direction within the supply area A2 and can also be moved in the Z direction. With this, the device transfer head 13 can be responsible for transferring the IC device 90 between the tray 200 and the temperature adjustment section 12 that have been carried in from the tray supply area A1, and the IC between the temperature adjustment section 12 and the device supply section 14 described below. Transport of device 90. Furthermore, in FIG. 2, the arrow α 13X The X-direction movement of the device transfer head 13 is indicated by the arrow α 13Y The Y-direction movement of the device transfer head 13 is shown. The tray conveying mechanism 15 moves the empty tray 200 in a state where all the IC devices 90 have been removed, to the positive side in the X direction in the supply area A2, that is, the arrow α 15 Directional transport mechanism. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. An inspection section 16 and a device transfer head 17 are provided in the inspection area A3. Also, a device supply unit 14 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves across the inspection area A3 and the recovery area A4 are also provided. The device supply section 14 is a mounting section for mounting the IC device 90 that has been temperature-adjusted by the temperature adjustment section 12. The device supply section 14 is referred to as a “supply shuttle plate” or an abbreviation for carrying the IC device 90 near the inspection section 16. "Supply shuttle". In addition, the device supply section 14 serving as a mounting section may be arranged between the supply area A2 and the inspection area A3 along the X direction, that is, the arrow α. 14 The direction is supported reciprocally. With this, the device supply section 14 can stably transport the IC device 90 from the supply area A2 to the vicinity of the inspection section 16 in the inspection area A3, and return to the IC device 90 again after removing the IC device 90 in the inspection area A3 by the device transfer head 17. Go to supply area A2. In the configuration shown in FIG. 2, two device supply sections 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 12 are transported to any one of the device supply sections 14. The device supply unit 14 is configured to heat or cool the IC device 90 placed on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment section 12 can be transported to the vicinity of the inspection section 16 of the inspection area A3 while maintaining its temperature adjustment state. The device transfer head 17 is an operation unit that holds the IC device 90 that maintains the temperature adjustment state described above and transfers the IC device 90 in the inspection area A3. The device transfer head 17 is supported by reciprocating movements in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called an "indexing arm". Thereby, the device transfer head 17 can transfer and place the IC device 90 on the device supply section 14 that has been carried in from the supply area A2 and place it on the inspection section 16. Furthermore, in FIG. 2, the arrow α 17Y The Y-direction reciprocating movement of the device transfer head 17 is shown. In addition, the device transfer head 17 is supported to be capable of reciprocating in the Y direction, but is not limited thereto, and may be supported to be capable of reciprocating in the X direction. The device transfer head 17 is configured to heat or cool the held IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply section 14 to the inspection section 16. The inspection unit 16 is a mounting unit that mounts the IC device 90 as an electronic component and checks the electrical characteristics of the IC device 90. A plurality of probes electrically connected to the terminal portion of the IC device 90 are provided in the inspection portion 16. In addition, the IC device 90 can be inspected by the terminal portion of the IC device 90 being in electrical contact with the probe. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a testing machine connected to the inspection section 16. In addition, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. The device recovery section 18 is a mounting section that mounts the IC device 90 that has been inspected by the inspection section 16 and can transport the IC device 90 to the recovery area A4, which is called a "recycling shuttle" or simply "recycling shuttle"". In addition, the device recovery unit 18 may be located between the inspection area A3 and the recovery area A4 along the X direction, that is, the arrow α. 18 The direction is supported reciprocally. In the configuration shown in FIG. 2, the device recovery unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC devices 90 on the inspection unit 16 are transported and placed in any of the device recovery units. Department 18. This transfer is performed by the device transfer head 17. The recovery area A4 is an area where a plurality of IC devices 90 that have been inspected in the inspection area A3 and the inspection is completed are recovered. A collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided in the collection area A4. An empty tray 200 is also prepared in the collection area A4. The recovery tray 19 is a mounting portion on which the IC device 90 that has been inspected by the inspection portion 16 is mounted, and is fixed so as not to move within the recovery area A4. Thereby, even if the recovery area A4 in which various movable parts such as a relatively large number of device transfer heads 20 are arranged, the inspected IC devices 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. The empty tray 200 also serves as a mounting section on which the IC device 90 that has been inspected by the inspection section 16 is placed. Then, the IC device 90 on the device recovery section 18 that has moved to the recovery area A4 is transported and placed on any one of the recovery tray 19 and the empty tray 200. Accordingly, the IC devices 90 are classified and recovered according to the inspection results. The device transfer head 20 has a portion that can be supported in the recovery area A4 so as to be movable in the X direction and the Y direction, and can also be moved in the Z direction. Thereby, the device transfer head 20 can transfer the IC device 90 from the device collection part 18 to the collection tray 19 or the empty tray 200. Furthermore, in FIG. 2, the arrow α 20X Indicates the X-direction movement of the device transfer head 20, and the arrow 20Y The Y-direction movement of the device transfer head 20 is shown. The tray transfer mechanism 21 moves the empty tray 200 carried in from the tray removal area A5 toward the X direction, that is, the arrow α in the collection area A4. twenty one Directional transport mechanism. After the transfer, the empty tray 200 is disposed at the position where the IC device 90 is collected, that is, it may be any of the three empty trays 200 described above. The tray removal area A5 is a material removal section that collects and removes the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms 22A and 22B are provided to transfer the tray 200 piece by piece in the Y direction so as to straddle the collection area A4 and the tray removal area A5. The tray conveying mechanism 22A can make the tray 200 in the Y direction, that is, the arrow α 22A A moving part that reciprocates in the direction. Thereby, the inspected IC device 90 can be transferred from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B can be used to collect the empty tray 200 of the IC device 90 toward the positive side of the Y direction, that is, the arrow α 22B Move in the direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4. The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, The operation of each part of the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B. The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 includes a display screen 301 composed of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, a mouse stage 600 on which a mouse is placed is provided on the right side in the drawing of the tray removal area A5. This mouse is used when operating a screen displayed on the monitor 300. An operation panel 700 is disposed at the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 instructs the electronic component inspection apparatus 1 separately from the monitor 300 to a desired operator. In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 1 and the like by a combination of the colors of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. Furthermore, a speaker 500 is built in the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 and the like can be reported through the speaker 500. In the electronic component inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated by a first partition wall 231, the supply area A2 and the inspection area A3 are separated by a second partition wall 232, and the inspection area A3 and the collection area A4 is partitioned by a third partition wall 233, and the collection area A4 and the tray removal area A5 are partitioned by a fourth partition wall 234. The supply area A2 and the recovery area A4 are also separated by a fifth partition wall 235. The outermost part of the electronic component inspection device 1 is covered by a casing, and there are, for example, a front casing 241, a side casing 242, a side casing 243, a rear casing 244, and a top casing 245 in the casing. As described above, in the supply area A2, the device transfer head 13 is supported so as to be movable in the X and Y directions. As shown in FIG. 3, the device transfer head 13 includes a base portion 75. The base portion 75 is supported so as to be movable in the X direction (first direction) and the Y direction (second direction) orthogonal to the X direction (first direction). Such a base portion 75 includes a first base 751, a second base 752, a third base 753, and a fourth base 754. The first base 751 is a plate-shaped portion that extends in the XY plane and has a thickness in the Z direction. The second base 752 is a plate-shaped portion extending from the edge of the negative side in the X direction of the first base 751 downward (negative side in the Z direction) and extending in the YZ plane and having a thickness in the X direction. The third base 753 is a plate-shaped portion extending from the edge portion on the positive side in the Y direction of the first base 751 downward (negative side in the Z direction) and extending in the XZ plane and having a thickness in the Y direction. The fourth base 754 extends from the edge portion on the negative side in the X direction of the third base 753 toward the positive side in the Y direction, and is a plate-shaped portion that expands in the YZ plane and has a thickness in the X direction. The device transfer head 13 includes a first support portion 71, a second support portion 72, a third support portion 73, and a fourth support portion 74 supported by the base portion 75. The four support sections are arranged in the order of the third support section 73, the second support section 72, the first support section 71, and the fourth support section 74 from the negative side in the X direction to the positive side in the X direction. The first support portion 71, the second support portion 72, the third support portion 73, and the fourth support portion 74 are plate-like shapes that extend in the YZ plane and have a thickness in the X direction. By setting the support portions 71 to 74 in a plate shape extending in the YZ plane as described above, the first support portions 71 to 74 can be arranged side by side in the X direction with a narrower distance. Therefore, miniaturization of the device transfer head 13 can be achieved. The first support portion 71 of the four support portions is fixed to the first base 751. The second support portion 72, the third support portion 73, and the fourth support portion 74 are supported by the first base 751 via a linear guide (not shown), respectively, and are movable in the X direction. The device transfer head 13 includes a moving mechanism 76 responsible for the movement. The moving mechanism 76 includes a two-stage pulley 761 and a two-stage pulley 762, a belt 763 and a belt 764 set between the two-stage pulley 761, the two-stage pulley 762, and a motor 765 that rotates the two-stage pulley 761. Among these, the two-stage pulley 761, the two-stage pulley 762, and the motor 765 are supported on the first base 751, respectively. The two-stage pulley 761 and the two-stage pulley 762 can rotate on an upper surface of the first base 751 about an axis extending in the Y direction. The two-stage pulley 761 and the two-stage pulley 762 are provided separately in the X direction. The two-stage pulley 761 has a small-diameter pulley 761a having a smaller outer diameter, and a large-diameter pulley 761b having an outer diameter approximately twice the outer diameter of the small-diameter pulley 761a, and these are arranged concentrically in the Y direction. Similarly, the two-stage pulley 762 has a small-diameter pulley 762a having a smaller outer diameter and a large-diameter pulley 762b having an outer diameter approximately twice that of the small-diameter pulley 762a, and these are arranged concentrically in the Y direction. Furthermore, the outer diameters of the small-diameter pulley 761a and the small-diameter pulley 762a are equal to each other, and the outer diameters of the large-diameter pulley 761b and the large-diameter pulley 762b are also equal to each other. A belt 763 is set up between the small-diameter pulley 761a and the small-diameter pulley 762a. The belt 763 is provided between the small-diameter pulley 761a and the small-diameter pulley 762a and has two regions 763a and 763b extending in the X direction. In the region 763a, the second support portion 72 is connected and fixed via the connection member 766, and in the region 763b, the fourth support portion 74 is connected and fixed via the connection member 767. When the two-stage pulley 761 rotates in one direction, for example, the belt 763 advances in the negative direction of the X direction in the area 763a, and the belt 763 advances in the positive direction of the X direction in the area 763b. Therefore, the second support portion 72 and the fourth support portion 74 face each other. It moves on the opposite side of the X direction at approximately the same distance. On the other hand, a belt 764 is stretched between the large-diameter pulley 761b and the large-diameter pulley 762b. The belt 764 is connected between the large-diameter pulley 761b and the large-diameter pulley 762b and has two regions 764a and 764b extending in the X direction. In the two areas 764a and 764b, when the two-stage pulley 761 rotates, an area 764a that advances in the same direction as the area 763a of the belt 763 is connected and fixed with a third support portion 73 via a connecting member 768. Thereby, the 2nd support part 72 and the 3rd support part 73 mutually move to the same side of an X direction. Furthermore, as described above, the large-diameter pulleys 761b and 762b have twice the outer diameter of the small-diameter pulleys 761a and 762a. Therefore, the moving distance of the third supporting portion 73 is approximately twice the moving distance of the second supporting portion 72. . According to this configuration, when the two-stage pulley 761 is rotated by the motor 765, the second support portion 72 and the fourth support portion 74 are moved substantially equal to each other in the direction opposite to the X direction, and the third support portion 73 is moved toward the first side. The second support portion 72 moves in the same direction and at a distance twice that of the second support portion 72. Therefore, according to the moving mechanism 76, the distance (inter-center distance) PX1 between the suction nozzle 733 of the third holding portion 78C and the suction nozzle 723 of the second holding portion 78B, that is, the distance (center-to-center distance) PX1, and the suction nozzle 723 and the first holding can be uniformly changed The distance in the X direction of the suction nozzle 713 of the portion 78A is the distance (distance between centers) PX2, and the distance in the X direction of the suction nozzle 713 and the suction nozzle 743 of the fourth holding portion 78D is the distance (distance between centers) PX3. Further, the base portion 75 is provided with a first holding portion 78A holding the IC device 90 as an electronic component via the first support portion 71, and similarly, a second holding portion 78B holding the IC device 90 is provided via the second support portion 72. A third holding portion 78C holding the IC device 90 is provided via the third support portion 73, and a fourth holding portion 78D holding the IC device 90 is provided via the fourth support portion 74. Accordingly, the second holding portion 78B to the fourth holding portion 78D can move in the X direction relative to the first holding portion 78A, respectively. The first holding portion 78A to the fourth holding portion 78D have the same configuration except that the supported portions are different. Therefore, the configuration of the first holding portion 78A will be representatively described. The first holding portion 78A includes a long rod 712 that is arranged parallel to the Z direction and supports the suction nozzle 713 at the lower end portion; and a drive mechanism 714 that moves the suction nozzle 713 in the Z direction through the long rod 712. The first holding portion 78A having such a configuration can move the suction nozzle 713 together with the long rod 712 with respect to the base portion 75 in the Z direction (third direction) orthogonal to the X direction and the Y direction by the operation of the driving mechanism 714. Thereby, the suction nozzle 713 can be lowered and the IC device 90 can be suctioned by the suction nozzle 713, thereby holding the IC device 90. Then, the held IC device 90 is inspected by the inspection unit 16 as described above. The configuration of the drive mechanism 714 is not particularly limited as long as the long rod 712 can be reciprocated in the Z direction relative to the first support portion 71. In this embodiment, it includes a pulley 714a, a pulley 714b, and a pulley 714a, A belt 714c between the pulleys 714b, a fixed portion 714e that connects the belt 714c and the long bar 712, and a motor (not shown) that rotates the pulley 714a. Hereinafter, there are cases where the suction nozzle 713 of the first holding portion 78A, the suction nozzle 723 of the second holding portion 78B, the suction nozzle 733 of the third holding portion 78C, and the suction nozzle 743 of the fourth holding portion 78D. In order of arrangement from the negative side in the X direction, the suction nozzle 733 is referred to as "No. 1 nozzle (mouth (1))", the suction nozzle 723 is referred to as "No. 2 nozzle (mouth (2))", and the suction nozzle 713 It is called "Nozzle No. 3 (mouth (3))", and the suction nozzle 743 is called "Nozzle No. 4 (mouth (4))". As shown in FIG. 4, the device transfer head 13 includes a camera 771 and a mirror 772 as an imaging unit 77. The camera 771 is a CCD (Charge-Coupled Device) camera. The camera 771 is a camera lens 773 facing the negative side in the Y direction and is fixed to the fourth base 754 of the base 75. The mirror 772 is disposed on the negative side in the Y direction with respect to the camera 771 and has a mirror surface 774 that refracts the direction of the field of view of the camera 771 downward. This allows the camera 771 to be positioned above, for example, the tray 200 or the temperature adjustment section 12 in the supply area A2 when the device transfer head 13 is moved on the XY plane, and photographs the device. Then, the positions of the tray 200, the temperature adjustment unit 12, and the like are grasped based on the captured images, and stored in the control unit 800. The mirror 772 is fixed to the third base 753 or the fourth base 754 of the base 75. As described above, in the device transfer head 13, the distance PX1 between the suction nozzle 733 and the suction nozzle 723, PX2, the distance between the suction nozzle 723 and the suction nozzle 713, and the distance PX3 between the suction nozzle 713 and the suction nozzle 743 can be uniformly changed. With this, the pitch PX1 adopts the largest large pitch PX1 max And take less than large pitch PX1 max Small pitch PX1 min . Similarly, the pitch PX2 takes the largest pitch PX2 max And take less than large pitch PX2 max Small pitch PX2 min . PX3 with the largest pitch PX3 max And take less than large pitch PX3 max Small pitch PX3 min . In the tray 200, recessed portions 201 in which a plurality of IC devices 90 are arranged in a matrix are formed. Moreover, it can make small pitch PX1 min , Small pitch PX2 min , Small pitch PX3 min The distances from the X direction of the recesses 201 to PX201 are respectively the same. Furthermore, in the electronic component inspection device 1, it is preferable to be (large pitch PX1 max ) = (Large pitch PX2 max ) = (Large pitch PX3 max ). In addition, it is preferable to be (small pitch PX1 min ) = (Small pitch PX2 min ) = (Small pitch PX3 min ). Moreover, there is, for example, an assembly error in the device transfer head 13, and therefore, there is an actual large pitch PX1 max , Large pitch PX2 max , Large pitch PX3 max When the design value (hereinafter referred to as the "first reference value") as the reference value deviates (shifts) from the design value. In this case, the large pitch PX1 must be separately max , Large pitch PX2 max , Large pitch PX3 max Make adjustments. For this adjustment, the alignment jig 8 shown in FIG. 5 is used. This positioning jig 8 is used by being provided on the device supply unit 14 located on the positive side in the Y direction among the two device supply units 14, for example. As shown in FIG. 5, the positioning jig 8 is flat. The positioning jig 8 has eight mouth guide holes 82 formed in the upper surface 81. The mouth guide holes 82 are arranged in a matrix form of four in the X direction and two in the Y direction, from the mouth guide holes 82 on the most negative side in the X direction and the most negative side in the Y direction. It is called "mouth guide hole 821", "mouth guide hole 822", "mouth guide hole 823", "mouth guide hole 824", "mouth guide hole 825", ""Mouth guide hole 826", "Mouth guide hole 827", "Mouth guide hole 828". In this embodiment, for example, a mouth guide hole 821, a mouth guide hole 822, a mouth guide hole 823, and a mouth guide hole 824 are used. The distance between the guide hole 821 for the mouth and the guide hole 822 for the mouth PX821 becomes a large distance PX1 max The first reference value is the same, and the distance between the guide hole 822 for the mouth and the guide hole 823 for the mouth PX822 is equal to the large pitch PX2. max The first reference value is the same. The distance PX823 between the mouth guide hole 823 and the mouth guide hole 824 is equal to the large pitch PX3. max The first reference value is the same. The positioning jig 8 has two positioning guide holes 83 for positioning with the device supply unit 14. These positioning guide holes 83 are arranged as far apart as possible in the X direction. In addition, the positioning jigs 8 and the device supply unit 14 are positioned by inserting each positioning guide hole 83 into a guide pin (not shown) of the device supply unit 14. The positioning jig 8 includes two bolts 84 that maintain the positioning with the device supply unit 14. The bolts 84 are arranged separately in the Y direction. In addition, by screwing each bolt 84 to the device supply unit 14, the positioning jig 8 can be prevented from being detached from the device supply unit 14, and thus the positioning state with the device supply unit 14 can be maintained. Secondly, adjust the large-pitch PX1 separately using the alignment fixture 8. max , Large pitch PX2 max , Large pitch PX3 max The method is explained. First, as shown in FIG. 8, the device transfer head 13 is set to a large pitch PX1. max , Large pitch PX2 max , Large pitch PX3 max In this state, the suction nozzle 733 as the No. 1 nozzle is arranged on the mouth guide hole 821 of the positioning jig 8, and the suction nozzle 723 as the No. 2 nozzle is arranged on the mouth guide hole 822, and it will be No. 3 The suction nozzle 713 of the mouth is arranged on the mouth guide hole 823, and the suction nozzle 743 as the No. 4 nozzle is arranged on the mouth guide hole 824. Then, the suction nozzle 733, the suction nozzle 723, the suction nozzle 713, and the suction nozzle 743 are lowered from the state shown in FIG. At this time, there may be cases such as the state shown in FIG. 9 or the state shown in FIG. 10. In the state shown in FIG. 9, the suction nozzle 733 is inserted into the mouth guide hole 821, the suction nozzle 723 is inserted into the mouth guide hole 822, the suction nozzle 713 is inserted into the mouth guide hole 823, and the suction nozzle 743 is inserted into the mouth Guide hole 824. Such a state shown in FIG. 9 is regarded as a large-pitch PX1 max , Large pitch PX2 max , Large pitch PX3 max Each is equal to the first reference value, and the electronic component inspection device 1 can be directly operated. On the other hand, in the state shown in FIG. 10, the suction nozzle 733 is inserted into the mouth guide hole 821, the suction nozzle 723 is inserted into the mouth guide hole 822, and the suction nozzle 713 is inserted into the mouth guide hole 823. 743 is not inserted into the mouth guide hole 824. The reason is that the large pitch PX3 max Deviation from the first reference value (pitch PX823), that is, a large pitch PX3 in the state shown in FIG. 10 max Greater than the first reference value. In this case, loosen the bolt (not shown) that fixes the connecting member 767 (see FIG. 3) to the belt 763 of the moving mechanism 76, and adjust the position of the fourth support portion 74 together with the connecting member 767. Thereby, the suction nozzle 743 can be inserted into the nozzle guide hole 824. Then, as long as the suction nozzle 743 is actually inserted into the nozzle guide hole 824, it is regarded as a large pitch PX3 max It becomes equal to the first reference value, and the electronic component inspection device 1 can be operated. After the adjustment, the bolts are tightened again to fix the connecting member 767 to the belt 763. In addition, the positioning jig 8 may be used in a device recovery unit located on the positive side in the Y direction among the two device recovery units 18. This is because the device transfer head 20 in the recovery area A4 must also be adjusted in the same manner as the device transfer head 13. In addition, as shown in FIG. 6, four height adjustment jigs 9 may be arranged on the upper surface 81 of the positioning jig 8 so as to have two in the X direction and two in the Y direction. The height adjusting jigs 9 installed on the alignment jig 8 are used in the inspection area A3, and are used to adjust the height of the lowered position when the device transfer head 17 of the inspection area A3 is lowered. Each of the height adjusting jigs 9 has a block shape. The height-adjusting jig 9 includes two guide pins (not shown) protruding downward. Each guide pin is inserted into a guide hole 85 for a jig for height adjustment formed on the upper surface 81 of the positioning jig 8. Thereby, each height adjustment jig 9 is positioned on the counter jig 8. In addition, each height-adjusting jig 9 includes two bolts 91 that maintain and position the jig 8. Each bolt 91 can be screwed to a female thread 86 formed on the upper surface 81 of the positioning jig 8. Thereby, the height adjustment jigs 9 can be prevented from detaching from the positioning jig 8, and thus the positioning state with the positioning jigs 8 can be maintained. In the device transfer head 13, there is a case where the large pitch PX1 is changed as described above. max , Large pitch PX2 max , Large pitch PX3 max Adjusted to the first reference value, the actual small pitch PX1 min , Small pitch PX2 min , Small pitch PX3 min It may also deviate (shift) from a design value (hereinafter, this value is referred to as a "second reference value") as a reference value due to a temperature change in the supply area A2, for example. Furthermore, depending on the difference from the second reference value (the degree of deviation from the second reference value), it may be difficult for the device transfer head 13 to hold the IC device 90 from the tray 200 or to place the held IC device 90 at a temperature adjustment. Department 12 phenomenon. Therefore, in the electronic component inspection device 1, it is necessary to grasp the actual small pitch PX1 separately. min , Small pitch PX2 min , Small pitch PX3 min . For this grasp, a position detection section (detection section) 3 shown in FIG. 7 is used. As shown in FIG. 2, the position detection unit 3 is arranged in the supply area A2, and its location is preferably as close to the center of the supply area A2 as possible. The position detection unit 3 is also disposed in the recovery area A4. In this way, the position detection section (detection section) 3 is provided in the supply area A2 and the recovery area A4. The reason is that the device transfer head 20 in the recovery area A4 also generates the same phenomenon as the device transfer head 13 in the supply area A2, and the position detection unit 3 in the recovery area A4 can prevent this phenomenon. Here, the position detection part 3 in the supply area A2 is demonstrated typically. Furthermore, as described above, the electronic component inspection apparatus 1 includes the supply area A2 that transports the IC device 90 to the inspection area A3 that inspects the IC device 90 that is an electronic component, and recycles the electronics that have been inspected in the inspection area A3 as electronics. Recycling area A4 of the IC device 90 of the part. The position detection unit 3 includes two positioning guide holes 48 for positioning in the supply area A2. These positioning guide holes 48 are arranged as far apart as possible in the X direction. In this positioning state, the position detection unit 3 is fixed via two bolts 35. The position detection unit 3 detects the position of the suction nozzle 713 of the first holding portion 78A, the position of the suction nozzle 723 of the second holding portion 78B, the position of the suction nozzle 733 of the third holding portion 78C, and the suction of the fourth holding portion 78D. Position of mouth 743. As shown in FIG. 7, the position detection section 3 includes a main body section 4, a first light emitting section 5A, a first light receiving section 5B, a second light emitting section 6A, and a second light emitting section 6B. The position detection section (detection section) 3 has a block shape or a plate shape (a plate shape in the present embodiment), and has a main body portion 4 composed of a rectangular member in plan view. The main body portion 4 includes a recessed portion 42 formed at a central portion of the upper surface 41, a through hole (small recessed portion) 44 formed through the bottom portion 421 of the recessed portion 42 to a lower surface 43, and a first light-emitting portion insertion portion 45A. The opening is formed to the side wall portion 422 of the recessed portion 42; the first light receiving portion insertion portion 45B is formed to face the first light emitting portion insertion portion 45A to the side wall portion 423 of the recessed portion 42; the second light emitting portion insertion portion 46A, the opening is formed to the side wall portion 424 of the recessed portion 42; and the second light receiving portion insertion portion 46B is formed to open to the side wall portion 425 of the recessed portion 42 so as to face the second light emitting portion insertion portion 46A. The first light-emitting portion insertion portion 45A is formed so as to penetrate in the X direction, and the first light-emitting portion 5A is inserted. The first light-emitting portion 5A is fixed in the first light-emitting portion insertion portion 45A by a slotted fixing screw 31. The first light receiving portion insertion portion 45B is formed so as to penetrate in the X direction, and the first light receiving portion 5B is inserted. The first light-receiving portion 5B is fixed in the first light-receiving portion insertion portion 45B by a slotted fixing screw 32. The second light-emitting portion insertion portion 46A is formed so as to penetrate in the Y direction, and the second light-emitting portion 6A is inserted. The second light-emitting portion 6A is fixed in the second light-emitting portion insertion portion 46A by a slotted fixing screw 33. The second light receiving portion insertion portion 46B is formed so as to penetrate in the Y direction, and the second light receiving portion 6B is inserted. The second light-receiving portion 6B is fixed in the second light-receiving portion insertion portion 46B by a slotted fixing screw 34. When such a structure is formed by the main body part 4, when the base material which becomes this main body part 4 is machined, the following effects are exhibited. As long as the base material is temporarily fixed to the machine tool, the recessed portion 42, the through hole 44, the first light-emitting portion insertion portion 45A, the first light-receiving portion insertion portion 45B, The second light-emitting portion insertion portion 46A, the second light-receiving portion insertion portion 46B, and the like are completed. Thereby, the body portion 4 having a high positional relationship between the processed portions can be obtained. Furthermore, it is preferable that a female screw 47 for fixing the machine tool to the main body portion 4 is formed. The first light emitting section 5A, the first light receiving section 5B, the second light emitting section 6A, and the second light receiving section 6B are all optical fiber sensors. The first light emitting section 5A can emit light LS5 as laser light toward the positive side in the X direction, that is, the first light receiving section 5B. The first light receiving unit 5B can receive the light LS5. The second light emitting section 6A can emit light LS6 as laser light toward the positive side in the Y direction, that is, the second light receiving section 6B. The second light receiving unit 6B can receive the light LS6. In this way, the position detection section (detection section) 3 has a first light emitting section 5A that emits light LS5 in the X direction (first direction), a first light receiving section 5B that receives light LS5 from the first light emitting section 5A, and faces the Y direction ( (2nd direction) The second light-emitting portion 6A that emits light LS6 and the second light-receiving portion 6B that receives light LS6 from the second light-emitting portion 6A. With this, as described below, the suction nozzle 713 of the first holding portion 78A, the suction nozzle 723 of the second holding portion 78B, the suction nozzle 733 of the third holding portion 78C, and the fourth nozzle can be detected based on the transmission and blocking of the light LS5. The position in the X direction of the suction nozzle 743 of the holding portion 78D. In addition, the adsorption of the suction nozzle 713 of the first holding portion 78A, the suction nozzle 723 of the second holding portion 78B, the suction nozzle 733 of the third holding portion 78C, and the suction of the fourth holding portion 78D can be detected based on the transmission and blocking of the light LS6. Position of the mouth 743 in the Y direction. As shown in FIGS. 7 and 11, each of the first light-emitting portion insertion portion 45A and the first light-receiving portion insertion portion 45B has a slit 451. By the light LS5 passing through the slit 451, it is possible to prevent the light LS5 from being diffused, and thus the directivity of the light LS5 is improved. The second light-emitting portion insertion portion 46A and the second light-receiving portion insertion portion 46B each have a slit 461. By the light LS6 passing through the slit 461, it is possible to prevent the light LS6 from being diffused, thereby improving the directivity of the light LS6. In the position detection unit 3, the through hole 44 is a portion smaller than the bottom portion 421 in a plan view, and functions as an identification mark for capturing an image by the camera 771 (see FIG. 4). With this identification mark, the center O of the through-hole 44 which is circular in plan view can be set. 44 The coordinates of the device transfer head 13 when the imaging center of the camera 771 is the same as the horizontal position (XY coordinates) of the imaging center of the camera 771. In addition, a part that functions as an identification mark may be a small convex portion formed on the bottom portion 421 and smaller than the bottom portion 421 in plan view, instead of the through hole (small concave portion) 44. As shown in FIG. 11, the center O of the through hole 44 44 It is arranged at the intersection point of light LS5 and light LS6 in a plan view. LS Coincident position. With this, based on the horizontal position (XY coordinates) of the device transfer head 13, the XY coordinates of the center of the suction nozzle 733 as the No. 1 nozzle and the imaging center of the camera 771, which are arranged at the positions, are obtained. Based on this, the difference between the positions of the center of the suction nozzle 733 and the position of the device transfer head 13 when the center of the suction nozzle 733 is arranged at the same horizontal position (XY coordinates) as the center of the suction nozzle 733 and the camera are determined. Difference in horizontal position between the camera centers of the 771. That is, the relative positional relationship between the center of the suction nozzle 733 mounted on the base 75 of the device transport head 13 and the imaging center of the camera 771 also mounted on the base 75 is obtained based on the movement position of the device transport head 13. In this embodiment, the difference between the horizontal position (XY coordinates) of the center of the suction nozzle 733 based on the horizontal position of the device transport head 13 and the horizontal position (XY coordinates) of the imaging center of the camera 771 is obtained. . In addition, by setting the relative position relationship thus obtained as relative position information, when the imaging center of the camera 771 and the center position of the IC device 90 are matched, moving the device transport head 13 based on the relative position information is equivalent to the above. By this amount, the center of the suction nozzle 733 can be moved to the center position of the IC device 90. In this manner, the holding of the IC device 90 by the suction nozzle 733 is preferably performed. Next, the position of the suction nozzle 713 of the first holding portion 78A, the position of the suction nozzle 723 of the second holding portion 78B, the position of the suction nozzle 733 of the third holding portion 78C, and the fourth The detection of the position of the suction nozzle 743 of the holding portion 78D will be described. As shown in FIG. 11, the position detection unit 3 becomes a light emitting unit LS5 emitted from the first light emitting unit 5A and receiving light at the first light receiving unit 5B, and a light unit LS6 emitting light from the second light emitting unit 6A and receiving light at the second light receiving unit 6B. Status (Continuity). That is, in the position detection unit 3, both the light LS5 and the light LS6 are in a transmission state. Then, as shown in FIG. 12, the suction nozzle 733 serving as the No. 1 nozzle of the device transfer head 13 is moved to the center O of the position detection unit 3. 44 Coincident position. That is, as shown in FIG. 18, the suction nozzle 733 serving as the No. 1 nozzle of the device transfer head 13 is moved above the upper surface 41 of the position detection section 3 and directly above the through hole 44. The position as described above is detected in advance based on an image captured by the camera 771 and stored in the control unit 800. As shown in FIG. 12, the light LS5 and the light LS6 are still in a transmission state. Moreover, in the device transfer head 13, the small-pitch PX1 is between the suction nozzle 733 serving as the No. 1 nozzle and the suction nozzle 723 serving as the No. 2 nozzle. min The small distance PX2 between the suction nozzle 723 as the No. 2 nozzle and the suction nozzle 713 as the No. 3 nozzle min , And there is a small distance PX3 between the suction nozzle 713 as the No. 3 nozzle and the suction nozzle 743 as the No. 4 nozzle min . Next, as shown in FIG. 13, the suction nozzle 733 is moved toward the negative side in the Z direction, and is inserted into the recessed portion 42 of the position detection unit 3. That is, as shown in FIG. 19, the suction nozzle 733 is moved downward to a position where it does not contact the bottom portion 421 of the recessed portion 42 of the position detection portion 3. As a result, the position detection unit 3 is in a state where the first light receiving unit 5B receives the light LS5 by the suction nozzle 733 and the second light receiving unit 6B receives the light LS6 by the suction nozzle 733 (off). . That is, both the light LS5 and the light LS6 are blocked by the suction nozzle 733. At the time of position detection, the suction nozzle 733 starts moving from the position (position shown in FIG. 13) to the X direction and the Y direction as described above. This prevents the suction nozzle 733 from moving in any of the X direction and the Y direction and colliding with the side wall portion 422, the side wall portion 423, the side wall portion 424, and the side wall portion 425 of the recessed portion 42. When neither the light LS5 nor the light LS6 is in the light-shielded state by the suction nozzle 733, the position of the suction nozzle 733 is finely adjusted to the position in which the light-shielded state is obtained. Next, as shown in FIG. 14, the suction nozzle 733 is gradually moved to the positive side in the X direction and stopped at a position where the second light receiving unit 6B is in a light receiving state (conduction). The position (X coordinate) is then stored in the control unit 800 as the “1X coordinate (see FIG. 22)” of the suction nozzle 733. Next, as shown in FIG. 15, the suction nozzle 733 is gradually moved toward the negative side in the X direction, and stopped at a position where the second light receiving unit 6B is in the light receiving state (conduction) again. The position (X coordinate) is then stored in the control unit 800 as the “2X coordinate (see FIG. 22)” of the suction nozzle 733. Then, the control unit 800 detects (calculates) and memorizes and memorizes the center position between the above-mentioned 1X coordinate and the above-mentioned 2X coordinate as the center position in the X direction of the suction nozzle 733, that is, the "center X coordinate" (see FIG. 22). Then, the suction nozzle 733 is returned to the movement start position again, and as shown in FIG. 16, the suction nozzle 733 is gradually moved to the positive side in the Y direction and stopped at the position where the first light receiving unit 5B is in the light receiving state (conduction). The position (Y coordinate) is then stored in the control unit 800 as the "1Y coordinate (refer to Fig. 23)" of the suction nozzle 733. Subsequently, as shown in FIG. 17, the suction nozzle 733 is gradually moved toward the negative side in the Y direction, and stops at a position where the first light receiving unit 5B is in the light receiving state (conduction) again. The position (Y coordinate) is then stored in the control unit 800 as the "2Y coordinate (see Fig. 23)" of the suction nozzle 733. Then, the control unit 800 detects (calculates) and memorizes the center position between the first Y coordinate and the second Y coordinate as the center position in the Y direction of the suction nozzle 733, that is, the "central Y coordinate (refer to Fig. 23)". Then, as shown in FIG. 20, raising the suction nozzle 733 and moving the device transfer head 13 toward the negative side in the X direction is equivalent to a small pitch PX2 min The amount. Thereby, the suction nozzle 723 which is the No. 2 nozzle is moved to the center O of the position detection unit 3 in a plan view. 44 Coincident position. That is, the suction nozzle 723 as the No. 2 nozzle is moved above the upper surface 41 of the position detection section 3 and directly above the through hole 44. Then, as shown in FIG. 21, the suction nozzle 723 is moved toward the negative side in the Z direction and inserted into the recessed portion 42 of the position detection unit 3. After that, in the same manner as the "central X coordinate" and "central Y coordinate" of the suction nozzle 733, the "central X coordinate" and "central Y coordinate" of the suction nozzle 723 are obtained. The "center X coordinate" and "center Y coordinate" of the nozzle 713 as the nozzle 3, and the "center X coordinate" and "center Y coordinate" of the nozzle 743 as the nozzle 4 can be obtained in the same manner. As described above, the base portion 75 can move in the X direction, and can also move in the Y direction (the second direction) orthogonal to the X direction (the first direction). The base portion 75 is provided with a first holding portion 78A that holds the IC device 90 as an electronic component, and a second holding portion 78B that can be moved in the X direction (first direction) relative to the first holding portion 78A and held. The IC device 90 as an electronic component; the third holding portion 78C is movable in the X direction (the first direction) relative to the first holding portion 78A and holds the IC device 90 as the electronic component; and the fourth holding portion 78D, It is movable in the X direction (first direction) with respect to the first holding portion 78A, and holds the IC device 90 as an electronic component. Further, as described above, the position detection unit 3 can detect the center X coordinate of the position in the X direction (first direction) of the suction nozzle 713 of the first holding portion 78A, and the Y of the suction nozzle 713 of the first holding portion 78A. The position in the direction (second direction) is the center Y coordinate. Similarly, the position detection unit 3 can detect the center X coordinate of the position in the X direction (the first direction) of the suction nozzle 723 of the second holding portion 78B and the Y direction (the first direction) of the suction nozzle 723 of the second holding portion 78B. 2 direction) is the center Y coordinate. The position detection unit (detection unit) 3 can detect the center X coordinate of the position in the X direction (first direction) of the suction nozzle 733 of the third holding portion 78C, and the Y of the suction nozzle 733 of the third holding portion 78C. The position in the direction (second direction) is the center Y coordinate. The position detection unit (detection unit) 3 can detect the position in the X direction (first direction) of the suction nozzle 743 of the fourth holding portion 78D and the Y direction (second direction) of the suction nozzle 743 in the fourth holding portion 78D. Direction) is the center Y coordinate. Based on the detection result detected by the position detection unit 3 using this structure, that is, the X coordinate of each center of the No. 1 to No. 4 nozzles, the control unit 800 can separately calculate the actual small pitch PX1 min , Small pitch PX2 min , Small pitch PX3 min . Small pitch PX1 min It is calculated based on (the center X coordinate of the No. 2 nozzle (suction nozzle 723))-(the center X coordinate of the No. 1 nozzle (suction nozzle 733)). Small PX2 min It is obtained from (the center X coordinate of the No. 3 nozzle (suction nozzle 713))-(the center X coordinate of the No. 2 nozzle (suction nozzle 723)). Small pitch PX3 min It is obtained from (the center X coordinate of the No. 4 nozzle (suction nozzle 743))-(the center X coordinate of the No. 3 nozzle (suction nozzle 713)). Furthermore, in this embodiment, the device transfer head 13 is configured such that nozzles 1 to 4 are arranged in the X direction and pitch conversion is performed in the X direction, but it is not limited to this. For example, a configuration may be adopted in which nozzles 1 to 4 are arranged in the Y direction and pitch conversion is performed in the Y direction. In this case, when obtaining a small pitch smaller than the large pitch with the largest pitch, the Y coordinate of each center of Nos. 1 to 4 is used. In the electronic component inspection device 1, the actual small pitch PX1 obtained according to the above can be obtained. min , Small pitch PX2 min , Small pitch PX3 min When the degree of difference from the above-mentioned second reference value is changed, the operations of Nos. 1 to 4 are switched. This operation has a first mode and a second mode. As described above, the suction nozzle 713 of the first holding portion 78A, the suction nozzle 723 of the second holding portion 78B, the suction nozzle 733 of the third holding portion 78C, and the suction nozzle 743 of the fourth holding portion 78D can be positioned relative to the base portion 75. The Z direction (third direction) is orthogonal to the X direction (first direction) and the Y direction (second direction). The first mode is an operation based on the distance obtained based on the position of the suction nozzle 713 of the first holding portion 78A and the position of the suction nozzle 723 of the second holding portion 78B based on the position detection portion (detection portion) 3. (Small pitch PX2 min ), The distance obtained based on the position of the suction nozzle 723 of the second holding portion 78B and the position of the suction nozzle 733 of the third holding portion 78C (small pitch PX1 min ) And the distance obtained based on the position of the suction nozzle 713 of the first holding portion 78A and the position of the suction nozzle 743 of the fourth holding portion 78D (small pitch PX3 min ) When the preset value is not reached, the first holding portion 78A, the second holding portion 78B, the third holding portion 78C, and the fourth holding portion 78D are simultaneously and uniformly moved in the Z direction (third direction). The second mode is an operation based on the distance obtained based on the position of the suction nozzle 713 of the first holding portion 78A and the position of the suction nozzle 723 of the second holding portion 78B based on the position detection portion (detection portion) 3. (Small pitch PX2 min ), The distance obtained based on the position of the suction nozzle 723 of the second holding portion 78B and the position of the suction nozzle 733 of the third holding portion 78C (small pitch PX1 min ), And the distance obtained based on the position of the suction nozzle 713 of the first holding portion 78A and the position of the suction nozzle 743 of the fourth holding portion 78D (small pitch PX3 min ) Is more than the preset value, the first holding portion 78A, the second holding portion 78B, the third holding portion 78C, and the fourth holding portion 78D are individually moved toward the Z direction (the third direction) with a time difference. . In this way, in the electronic component inspection device 1, the operation of each holding portion can be changed according to the distance (distance) between the No. 1 to No. 4 nozzles. Thereby, as described below, it is possible to smoothly hold the IC device 90 and the like from the No. 1 to No. 4 nozzles. Hereinafter, as an example, a case where the first mode is applied when the IC device 90 on the holding tray 200 is held will be described with reference to FIGS. 24 to 26. Here, it is assumed that the actual small pitch PX1 is determined by the control unit 800 as a premise. min , Small pitch PX2 min , Small pitch PX3 min Small pitch PX1 min For the biggest. And let it be this small pitch PX1 min The difference (absolute value) from the second reference value (= PX201) has not reached a threshold value set in advance and stored in the control unit 800. It is considered that as long as it is within the range described above, the size of the pitch does not affect the holding of the IC device 90 by the No. 1 to No. 4 nozzles. In addition, the "threshold value" refers to a value which is considered to have an influence on the holding of the IC device 90 by the nozzles 1 to 4. As shown in FIG. 24, the device transfer head 13 is set to a small pitch PX1. min , Small pitch PX2 min , Small pitch PX3 min In this state, the suction nozzle 733 as the No. 1 nozzle, the suction nozzle 723 as the No. 2 nozzle, the suction nozzle 713 as the No. 3 nozzle, and the suction nozzle 743 as the No. 4 nozzle are arranged on the IC device 90 of the tray 200, respectively. . Then, as shown in FIG. 25, the suction nozzle 733 as the No. 1 nozzle to the suction nozzle 743 as the No. 4 nozzle are simultaneously lowered. Accordingly, the suction nozzle 733 serving as the No. 1 nozzle to the suction nozzle 743 serving as the No. 4 nozzle abut on the IC device 90 respectively, and if suction is performed in the abutting state, the IC device 90 can be adsorbed. Then, as shown in FIG. 26, the suction nozzle 733 as the No. 1 nozzle to the suction nozzle 743 as the No. 4 nozzle are simultaneously raised. Thereby, the suction nozzle 733 serving as the No. 1 nozzle to the suction nozzle 743 serving as the No. 4 nozzle can respectively hold the IC device 90. With this first mode, the IC device 90 can be held and transported as quickly as possible, and thus the throughput of the electronic component inspection apparatus 1 can be improved. Next, as an example, a case where the second mode is applied when holding the IC device 90 on the holding tray 200 will be described with reference to FIGS. 27 to 32. Here, it is assumed that the actual small pitch PX1 is determined by the control unit 800 as a premise. min , Small pitch PX2 min , Small pitch PX3 min Small pitch PX1 min For the biggest. And let it be this small pitch PX1 min The difference (absolute value) from the second reference value (= PX201) is equal to or more than the aforementioned threshold. It is considered that when the range is as described above, the holding of the IC device 90 by the No. 1 to No. 4 nozzles is affected by the size of the pitch. As shown in FIG. 27, the device transfer head 13 is set to a small pitch PX1. min , Small pitch PX2 min , Small pitch PX3 min In this state, the suction nozzle 733 as the No. 1 nozzle is arranged on the IC device 90 of the tray 200. Then, as shown in FIG. 28, the suction nozzle 733 which is the No. 1 nozzle is lowered. Thereby, the suction nozzle 733 as the No. 1 nozzle abuts against the IC device 90, and if suction is performed in this abutting state, the IC device 90 can be suctioned. Then, as shown in FIG. 29, the suction nozzle 733 which is the No. 1 nozzle is raised. Thereby, the suction nozzle 733 as the No. 1 nozzle can hold the IC device 90. Then, as shown in FIG. 30, moving the device transfer head 13 toward the negative side in the X direction is equivalent to a small pitch PX1 min The amount. Thereby, the suction nozzle 723 as the No. 2 nozzle is arranged on the IC device 90 of the tray 200. Then, as shown in FIG. 31, the suction nozzle 723 which is the No. 2 nozzle is lowered. Thereby, the suction nozzle 723 as the No. 2 nozzle abuts against the IC device 90, and if suction is performed in the abutting state, the IC device 90 can be suctioned. Then, as shown in FIG. 32, the suction nozzle 723 which is the No. 2 nozzle is raised. Thereby, the suction nozzle 723 as the No. 2 nozzle can hold the IC device 90. After that, the IC device 90 can also be held by the suction nozzle 713 as the No. 3 nozzle and the suction nozzle 743 as the No. 4 nozzle in the same manner as the operation before the suction nozzle 723 as the No. 2 nozzle. With this second mode, even when it is difficult to uniformly hold the IC device 90 using the first to fourth nozzles, it is possible to accurately hold the IC device 90 one by one with a time difference. Accordingly, it is possible to prevent a jam or an error in the electronic component inspection device 1 from occurring. In addition, both the first mode and the second mode are set to be compared with a threshold value. In this embodiment, a small pitch PX1 is used. min , Small pitch PX2 min , Small pitch PX3 min The biggest one is not limited to this. For example, a small pitch PX1 can also be used min , Small pitch PX2 min , Small pitch PX3 min The smallest one can use both the largest and the smallest. Next, based on the flowchart of FIG. 33, a series of operations after detecting the positions of the No. 1 to No. 4 nozzles and before holding the IC device 90 by each of the nozzles will be described. In addition, the timing of executing this flowchart is not particularly limited, and for example, it can be set when the temperature change in the supply area A2 is equal to or more than a specific value or every fixed time. As the suction nozzle of the detection position, the No. 1 nozzle is set (step S101). Then, the center X coordinate of the No. 1 mouth is detected as described above (step S102), and the center X coordinate is stored in the control unit 800 (step S103). Then, the center Y coordinate of the No. 1 mouth is detected as described above (step S104), and the center Y coordinate is stored in the control unit 800 (step S105). Then, it is determined whether or not steps S102 to S105 have been performed on the No. 4 mouth (step S106). If it is determined in step S106 that steps S102 to S105 have been performed on the No. 4 mouth, initialization is performed (step S107). On the other hand, when it is not determined in step S106 that steps S102 to S105 have been performed on the No. 4 mouth, N (mouth number) is increased by 1 (Step S108). After executing step S107, calculate the distance in the X direction between nozzle 1 and nozzle 2 as described above, that is, the small distance PX1 min (Step S109). Then, it is judged whether the calculation has been performed to the distance between the No. 3 mouth and the No. 4 mouth in the X direction, that is, the small distance PX3 min (Step S110). If it is determined in step S110 that the calculation has been performed to the small pitch PX3 min , Then detect the small pitch PX1 min , Small pitch PX2 min , Small pitch PX3 min The largest one (maximum distance) (step S111). On the other hand, it is not determined in step S110 that the calculation has been performed to the small pitch PX3. min In this case, N (mouth number) is increased by 1 (step S112). After step S111 is performed, | maximum distance-reference distance (second reference value) | is calculated, and it is determined whether the result of the calculation is greater than a threshold value (step S113). When it is not determined in step S113 that the calculation result is greater than the threshold value, the first mode is selected (step S114). On the other hand, when it is determined in step S113 that the calculation result is greater than or equal to the threshold value, the second mode is selected (step S115). Furthermore, in this embodiment, one of the series of operations shown in the flowchart is applied when the device transfer head 13 holds the IC device 90 on the tray 200 in the supply area A2, but it is not limited to this. As another application aspect, the following aspect is mentioned, for example. When the device transfer head 13 releases the IC device 90 onto the temperature adjustment unit 12. When the device transfer head 13 holds the IC device 90 on the temperature adjustment section 12. When the device transfer head 13 releases the IC device 90 onto the device supply unit 14. When the device transfer head 20 holds the IC device 90 on the device recovery section 18. When the device transfer head 20 releases the IC device 90 onto the tray 200 in the collection area A4. When the device transfer head 20 releases the IC device 90 onto the collection tray 19. <Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 34, but the differences from the above embodiment will be mainly described, and the same matters will be omitted. Description. This embodiment is the same as the first embodiment described above, except that the number of holding portions for holding the IC device is different. As shown in FIG. 34, in this embodiment, in addition to the first holding portion 78A to the fourth holding portion 78D, the device transfer head 13 further includes a fifth holding portion 78E, a sixth holding portion 78F, and a seventh holding portion 78G. And the eighth holding portion 78H. The fifth holding portion 78E is provided on the base portion 75 and is disposed on the positive side (second direction) in the Y direction with respect to the first holding portion 78A. The sixth holding portion 78F is provided on the base portion 75 and is disposed on the positive side (second direction) in the Y direction with respect to the second holding portion 78B. The seventh holding portion 78G is provided on the base portion 75 and is disposed on the positive side (second direction) in the Y direction with respect to the third holding portion 78C. The eighth holding portion 78H is provided on the base portion 75 and is disposed on the positive side (second direction) in the Y direction with respect to the fourth holding portion 78D. The position detection section (detection section) 3 can detect the X direction (first direction) of the nozzle 791 of the fifth holding section 78E in the same manner as the first holding section 78A to the fourth holding section 78D described in the first embodiment. Position (center X coordinate) and position (center Y coordinate) in the Y direction (second direction). Similarly, the position detection unit 3 can detect the position (center X coordinate) in the X direction (first direction) of the suction nozzle 792 of the sixth holding portion 78F, and the position (center Y coordinate) in the Y direction (second direction). ). In addition, the position detection unit 3 can detect the position (center X coordinate) in the X direction (first direction) of the suction nozzle 793 of the seventh holding portion 78G and the position (center Y coordinate) in the Y direction (second direction). . The position detection unit 3 can detect a position (center X coordinate) in the X direction (first direction) of the suction nozzle 794 of the eighth holding portion 78H and a position (center Y coordinate) in the Y direction (second direction). When the flow chart described in the first embodiment is applied to the device transfer head 13 configured as described above, the IC device 90 can be smoothly held by the first holding portion 78A to the eighth holding portion 78H. <Third Embodiment> Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to Figs. 35 to 37, but the differences from the above embodiment will be mainly described and omitted. Explanation of the same matters. This embodiment is the same as the first embodiment except that the method of detecting the position of the suction nozzle is different. Here, a method of detecting the position of the suction nozzle 733 which is the No. 1 nozzle will be representatively described. When detecting the center position of the suction nozzle 733 in the X direction, that is, the “central X coordinate”, first, as shown in FIG. 35, the suction nozzle 733 is arranged on the upper surface 41 of the deviation recess 42 of the position detection section 3. At this time, the suction nozzle 733 is located on the negative side in the X direction with respect to the recessed portion 42. Then, the gas GS is ejected from the suction nozzle 733, and the suction nozzle 733 is moved to the positive side in the X direction (the path PR1), and is made to exceed the recess 42 (refer to the suction shown by the two-dot chain line in FIG. 35) Mouth 733) stop. On the way PR1, the change in the flow rate of the gas GS detected (measured) by a flow meter (not shown) connected to the suction nozzle 733 becomes a graph GR1 shown by a solid line in FIG. 36. It can be known from the graph GR1 that, when the suction nozzle 733 moves, when the side wall portion 422 of the recessed portion 42 is exceeded, the flow rate increases. The position where the flow rate is increased is memorized as the "1X coordinate". Then, the gas GS is ejected from the suction nozzle 733, and the suction nozzle 733 is moved to the negative side in the X direction (reverse path PR2), and stopped at a position exceeding the recessed portion 42. In the reverse path PR2, the change in the flow rate of the gas GS detected by the above flowmeter becomes a graph GR2 shown by a dotted line in FIG. 36. It can be known from the graph GR2 that, when the suction nozzle 733 moves, when the side wall portion 423 of the recessed portion 42 is exceeded, the flow rate increases. The position where the flow rate is increased is memorized as a "2X coordinate". Then, the center position between the above-mentioned 1X coordinate and the above-mentioned 2X coordinate can be detected as the center position in the X direction of the suction nozzle 733, that is, the "central X coordinate". When detecting the center position of the suction nozzle 733 in the Y direction, that is, the “center Y coordinate”, the suction nozzle 733 is arranged on the upper surface 41 of the deviation recess 42 of the position detection section 3 in the same manner as the detection center X coordinate. At this time, the suction nozzle 733 is located on the negative side in the Y direction with respect to the recessed portion 42. Then, the gas GS is ejected from the suction nozzle 733, and the suction nozzle 733 is moved to the positive side in the Y direction (outward path), and stopped at a position exceeding the recessed portion 42. On this route, the change in the flow rate of the gas GS detected by the above flowmeter becomes a graph GR3 shown by a solid line in FIG. 37. It can be seen from the graph GR3 that, when the suction nozzle 733 moves, when the side wall portion 424 of the recessed portion 42 is exceeded, the flow rate increases. The position where the flow rate is increased is memorized as the "1Y coordinate". Furthermore, it can be seen from the graph GR3 that when the suction nozzle 733 exceeds the side wall portion 425 of the recessed portion 42, the flow rate decreases. Then, the gas GS is ejected from the suction nozzle 733, the suction nozzle 733 is moved to the negative side in the Y direction (reverse path), and stopped at a position exceeding the recessed portion 42. In this reverse circuit, the change in the flow rate of the gas GS detected by the above flowmeter becomes a graph GR4 shown by a dotted line in FIG. 37. It can be seen from the graph GR4 that, when the suction nozzle 733 moves, when the side wall portion 425 of the recessed portion 42 is exceeded, the flow rate increases. The position where the flow rate is increased is memorized as the "2Y coordinate". Then, the position of the center between the above-mentioned 1Y coordinate and the above-mentioned 2Y coordinate can be detected as the center position of the suction nozzle 733 in the Y direction, that is, the "central Y coordinate". <Fourth Embodiment> Hereinafter, a fourth embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 38, but the differences from the above embodiment will be mainly described, and the same matters will be omitted. Description. In addition, in FIG. 38, one nozzle is shown typically. This embodiment is the same as the first embodiment except that the position of the suction nozzle is adjusted. As shown in FIG. 38, in this embodiment, the suction nozzle 713 supports and fixes to the block-shaped support part 715. A connecting portion 712 a having a block shape and connecting the supporting portion 715 is provided at the lower end portion of the long rod 712. In the present embodiment, the connection portion 712a and the support portion 715 are connected via two bolts 712b. The two bolts 712b are arranged on opposite sides of each other via the long rod 712. With this configuration, for example, the large pitch PX2 can be adjusted. max In this case, the two bolts 712b can be loosened separately. Thereby, the position of the suction nozzle 713 together with the support portion 715 can be finely adjusted in the X direction (or Y direction). After the adjustment, the two bolts 712b are tightened again. Thereby, the position-adjusted suction nozzle 713 is fixed to the long rod 712. In the above, the illustrated embodiments have been described with respect to the electronic component transfer device and the electronic component inspection device of the present invention, but the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device can be replaced with Any constituent who performs the same function. Moreover, you may add arbitrary structures. The electronic component transfer device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) in each of the embodiments described above. Moreover, in the above-mentioned first embodiment, the number of the holding portions of the holding electronic parts held by the device transfer head is four along the X direction, but it is not limited to this. For example, it may be two, three Or more. Moreover, in the above-mentioned second embodiment, the number of the holding portions corresponds to each of the holding portions arranged in the X direction, and one is provided in the Y direction, but it is not limited to this, and it may be in the Y direction. Set 2 or more. In each of the above-mentioned embodiments, the IC device is rectangular in plan view, but is not limited to this. For example, it may be circular or oval. In this case, it is preferable that the electronic component transfer device or the electronic component inspection device has a rotating platform that changes the posture of the IC device in the horizontal plane in the supply area and the recovery area, even if the IC device rotates about the vertical axis in the horizontal plane. In this case, a series of actions shown in the above flowchart may also be applied to, for example, the following aspects. When the IC device is released onto the rotary table in the device transfer head in the supply area. • When the device transfer head in the supply area holds the IC devices on the rotating platform. When the IC device is released onto the rotating platform in the device transfer head in the recovery area. • When the device transfer head holds the IC device on the rotating platform in the recovery area.

1‧‧‧電子零件檢查裝置1‧‧‧Electronic parts inspection device

3‧‧‧位置檢測部(檢測部) 3‧‧‧Position detection section (detection section)

4‧‧‧本體部 4‧‧‧Body

5A‧‧‧第1發光部 5A‧‧‧The first light-emitting part

5B‧‧‧第1受光部 5B‧‧‧1st light receiving unit

6A‧‧‧第2發光部 6A‧‧‧Second light emitting section

6B‧‧‧第2受光部 6B‧‧‧ 2nd light receiving unit

8‧‧‧對位治具 8‧‧‧ Counterpoint fixture

9‧‧‧高度調整用治具 9‧‧‧ Height adjustment jig

10‧‧‧電子零件搬送裝置 10‧‧‧Electronic parts transfer device

11A‧‧‧托盤搬送機構 11A‧‧‧Tray transfer mechanism

11B‧‧‧托盤搬送機構 11B‧‧‧Tray transfer mechanism

12‧‧‧溫度調整部 12‧‧‧Temperature Adjustment Department

13‧‧‧器件搬送頭 13‧‧‧ device transfer head

14‧‧‧器件供給部 14‧‧‧Device Supply Department

15‧‧‧托盤搬送機構 15‧‧‧pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17‧‧‧器件搬送頭 17‧‧‧ device transfer head

18‧‧‧器件回收部 18‧‧‧Device Recycling Department

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧器件搬送頭 20‧‧‧ device transfer head

21‧‧‧托盤搬送機構 21‧‧‧Tray transfer mechanism

22A‧‧‧托盤搬送機構 22A‧‧‧Tray transfer mechanism

22B‧‧‧托盤搬送機構 22B‧‧‧Tray transfer mechanism

31‧‧‧帶槽之固定螺釘 31‧‧‧Slotted fixing screw

32‧‧‧帶槽之固定螺釘 32‧‧‧Slotted fixing screw

33‧‧‧帶槽之固定螺釘 33‧‧‧Slotted fixing screw

34‧‧‧帶槽之固定螺釘 34‧‧‧Slotted fixing screw

35‧‧‧螺栓 35‧‧‧ Bolt

41‧‧‧上表面 41‧‧‧upper surface

42‧‧‧凹部 42‧‧‧ Recess

43‧‧‧下表面 43‧‧‧ lower surface

44‧‧‧貫通孔 44‧‧‧through hole

45A‧‧‧第1發光部用插入部 45A‧‧‧ 1st light emitting part insertion part

45B‧‧‧第1受光部用插入部 45B‧‧‧ 1st light receiving part insertion part

46A‧‧‧第2發光部用插入部 46A‧‧‧ 2nd light emitting part insertion part

46B‧‧‧第2受光部用插入部 46B‧‧‧ 2nd light receiving part insertion part

47‧‧‧母螺紋 47‧‧‧female thread

48‧‧‧定位用導孔 48‧‧‧ Guide holes for positioning

71‧‧‧第1支持部 71‧‧‧The first support department

72‧‧‧第2支持部 72‧‧‧ 2nd support department

73‧‧‧第3支持部 73‧‧‧ 3rd support department

74‧‧‧第4支持部 74‧‧‧ 4th support department

75‧‧‧基部 75‧‧‧ base

76‧‧‧移動機構 76‧‧‧ mobile agency

77‧‧‧攝像單元 77‧‧‧ camera unit

78A‧‧‧第1固持部 78A‧‧‧The first holding section

78B‧‧‧第2固持部 78B‧‧‧ 2nd Holding Department

78C‧‧‧第3固持部 78C‧‧‧The third holding section

78D‧‧‧第4固持部 78D‧‧‧The fourth holding section

78E‧‧‧第5固持部 78E‧‧‧The fifth holding section

78F‧‧‧第6固持部 78F‧‧‧The 6th holding section

78G‧‧‧第7固持部 78G‧‧‧The 7th holding department

78H‧‧‧第8固持部 78H‧‧‧The 8th holding section

81‧‧‧上表面 81‧‧‧ Top surface

82‧‧‧嘴用導孔 82‧‧‧ Guide hole for mouth

83‧‧‧定位用導孔 83‧‧‧ Guide hole for positioning

84‧‧‧螺栓 84‧‧‧ Bolt

85‧‧‧高度調整用治具用導孔 85‧‧‧ Guide hole for jig for height adjustment

86‧‧‧母螺紋 86‧‧‧female thread

90‧‧‧IC器件 90‧‧‧IC device

91‧‧‧螺栓 91‧‧‧ Bolt

200‧‧‧托盤 200‧‧‧tray

201‧‧‧凹部 201‧‧‧ Recess

231‧‧‧第1間隔壁 231‧‧‧The first partition

232‧‧‧第2間隔壁 232‧‧‧Second partition

233‧‧‧第3間隔壁 233‧‧‧ 3rd partition

234‧‧‧第4間隔壁 234‧‧‧ 4th partition

235‧‧‧第5間隔壁 235‧‧‧ 5th partition

241‧‧‧前外殼 241‧‧‧Front housing

242‧‧‧側外殼 242‧‧‧side shell

243‧‧‧側外殼 243‧‧‧side shell

244‧‧‧後外殼 244‧‧‧ rear shell

245‧‧‧頂部外殼 245‧‧‧Top case

300‧‧‧監視器 300‧‧‧ monitor

301‧‧‧顯示畫面 301‧‧‧display

400‧‧‧信號燈 400‧‧‧ signal light

421‧‧‧底部 421‧‧‧ bottom

422‧‧‧側壁部 422‧‧‧ sidewall

423‧‧‧側壁部 423‧‧‧ sidewall

424‧‧‧側壁部 424‧‧‧Sidewall

425‧‧‧側壁部 425‧‧‧ sidewall

451‧‧‧狹縫 451‧‧‧Slit

461‧‧‧狹縫 461‧‧‧Slit

500‧‧‧揚聲器 500‧‧‧Speaker

600‧‧‧滑鼠台 600‧‧‧Mouse Station

700‧‧‧操作面板 700‧‧‧ operation panel

712‧‧‧長桿 712‧‧‧ long pole

712a‧‧‧連結部 712a‧‧‧Connection Department

712b‧‧‧螺栓 712b‧‧‧bolt

713‧‧‧吸附嘴 713‧‧‧ Nozzle

714‧‧‧驅動機構 714‧‧‧Drive mechanism

714a‧‧‧皮帶輪 714a‧‧‧pulley

714b‧‧‧皮帶輪 714b‧‧‧pulley

714c‧‧‧皮帶 714c‧‧‧belt

714e‧‧‧固定部 714e‧‧‧Fixed section

715‧‧‧支持部 715‧‧‧Support Department

723‧‧‧吸附嘴 723‧‧‧Nozzle

733‧‧‧吸附嘴 733‧‧‧ Nozzle

743‧‧‧吸附嘴 743‧‧‧ Nozzle

751‧‧‧第1基座 751‧‧‧1st base

752‧‧‧第2基座 752‧‧‧Second Base

753‧‧‧第3基座 753‧‧‧3rd base

754‧‧‧第4基座 754‧‧‧4th base

761‧‧‧兩級皮帶輪 761‧‧‧Two-stage pulley

761a‧‧‧小徑皮帶輪 761a‧‧‧small diameter pulley

761b‧‧‧大徑皮帶輪 761b‧‧‧large diameter pulley

762‧‧‧兩級皮帶輪 762‧‧‧Two-stage pulley

762a‧‧‧小徑皮帶輪 762a‧‧‧small diameter pulley

762b‧‧‧大徑皮帶輪 762b‧‧‧large diameter pulley

763‧‧‧皮帶 763‧‧‧Belt

763a‧‧‧區域 763a‧‧‧area

763b‧‧‧區域 763b‧‧‧area

764‧‧‧皮帶 764‧‧‧Belt

764a‧‧‧區域 764a‧‧‧area

764b‧‧‧區域 764b‧‧‧area

765‧‧‧馬達 765‧‧‧Motor

766‧‧‧連結構件 766‧‧‧Connecting member

767‧‧‧連結構件 767‧‧‧Connecting member

768‧‧‧連結構件 768‧‧‧Connecting components

771‧‧‧相機 771‧‧‧ Camera

772‧‧‧鏡 772‧‧‧Mirror

773‧‧‧相機鏡頭 773‧‧‧ Camera lens

774‧‧‧鏡面 774‧‧‧Mirror

791‧‧‧吸附嘴 791‧‧‧ Nozzle

792‧‧‧吸附嘴 792‧‧‧ Nozzle

793‧‧‧吸附嘴 793‧‧‧ Nozzle

794‧‧‧吸附嘴 794‧‧‧ Nozzle

800‧‧‧控制部 800‧‧‧ Control Department

821‧‧‧嘴用導孔 821‧‧‧Guide for mouth

822‧‧‧嘴用導孔 822‧‧‧Guide for mouth

823‧‧‧嘴用導孔 823‧‧‧Guide for mouth

824‧‧‧嘴用導孔 824‧‧‧Guide for mouth

825‧‧‧嘴用導孔 825‧‧‧Guide for mouth

826‧‧‧嘴用導孔 826‧‧‧Guide for mouth

827‧‧‧嘴用導孔 827‧‧‧Guide for mouth

828‧‧‧嘴用導孔 828‧‧‧Guide for mouth

A‧‧‧箭頭 A‧‧‧arrow

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域(供給區域) A2‧‧‧Device supply area (supply area)

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域(回收區域) A4‧‧‧device recycling area (recycling area)

A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area

GR1‧‧‧曲線圖 GR1‧‧‧curve

GR2‧‧‧曲線圖 GR2‧‧‧ Curve

GR3‧‧‧曲線圖 GR3‧‧‧ Graph

GR4‧‧‧曲線圖 GR4‧‧‧ Graph

GS‧‧‧氣體 GS‧‧‧Gas

LS5‧‧‧光 LS5‧‧‧Light

LS6‧‧‧光 LS6‧‧‧Light

O44‧‧‧中心O 44 ‧‧‧ Centre

OLS‧‧‧交點O LS ‧‧‧ Intersection

PR1‧‧‧去路 PR1‧‧‧to

PR2‧‧‧反路 PR2‧‧‧ reverse

PX1‧‧‧間距 PX1‧‧‧Pitch

PX1max‧‧‧大間距PX1 max ‧‧‧Large pitch

PX1min‧‧‧小間距PX1 min ‧‧‧Small pitch

PX2‧‧‧間距 PX2‧‧‧Pitch

PX2max‧‧‧大間距PX2 max ‧‧‧large pitch

PX2min‧‧‧小間距PX2 min ‧‧‧Small pitch

PX3‧‧‧間距 PX3‧‧‧Pitch

PX3max‧‧‧大間距PX3 max ‧‧‧Large pitch

PX3min‧‧‧小間距PX3 min ‧‧‧small pitch

PX201‧‧‧間距 PX201‧‧‧Pitch

PX821‧‧‧間距 PX821‧‧‧Pitch

PX822‧‧‧間距 PX822‧‧‧Pitch

PX823‧‧‧間距 PX823‧‧‧Pitch

S101~S115‧‧‧步驟 S101 ~ S115‧‧‧step

α11A‧‧‧箭頭α 11A ‧‧‧ Arrow

α11B‧‧‧箭頭α 11B ‧‧‧ Arrow

α13X‧‧‧箭頭α 13X ‧‧‧ Arrow

α13Y‧‧‧箭頭α 13Y ‧‧‧ Arrow

α14‧‧‧箭頭α 14 ‧‧‧arrow

α15‧‧‧箭頭α 15 ‧‧‧arrow

α17Y‧‧‧箭頭α 17Y ‧‧‧ Arrow

α18‧‧‧箭頭α 18 ‧‧‧ arrow

α20X‧‧‧箭頭α 20X ‧‧‧ Arrow

α20Y‧‧‧箭頭α 20Y ‧‧‧ Arrow

α21‧‧‧箭頭α 21 ‧‧‧ Arrow

α22A‧‧‧箭頭α 22A ‧‧‧ Arrow

α22B‧‧‧箭頭α 22B ‧‧‧ Arrow

α90‧‧‧箭頭α 90 ‧‧‧ arrow

圖1係自正面側觀察本發明之電子零件檢查裝置之第1實施形態所得的概略立體圖。圖2係表示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。圖3係圖2中之器件供給區域中所設置之器件搬送頭之立體圖。圖4係自圖3中之箭頭A方向觀察所得之圖。圖5係設置於圖1所示之電子零件檢查裝置之對位治具之立體圖。圖6係設置於圖1所示之電子零件檢查裝置之對位治具之立體圖。圖7係設置於圖1所示之電子零件檢查裝置之位置檢測部之立體圖。圖8係表示圖3所示之器件搬送頭之對位狀態之概略部分垂直剖視圖。圖9係表示圖3所示之器件搬送頭之對位狀態之概略部分垂直剖視圖。圖10係表示圖3所示之器件搬送頭之對位狀態之概略部分垂直剖視圖。圖11係依序表示圖3所示之器件搬送頭之位置檢測動作之概略水平剖視圖。圖12係依序表示圖3所示之器件搬送頭之位置檢測動作之概略水平剖視圖。圖13係依序表示圖3所示之器件搬送頭之位置檢測動作之概略水平剖視圖。圖14係依序表示圖3所示之器件搬送頭之位置檢測動作之概略水平剖視圖。圖15係依序表示圖3所示之器件搬送頭之位置檢測動作之概略水平剖視圖。圖16係依序表示圖3所示之器件搬送頭之位置檢測動作之概略水平剖視圖。圖17係依序表示圖3所示之器件搬送頭之位置檢測動作之概略水平剖視圖。圖18係圖12所示之狀態之概略部分垂直剖視圖。圖19係圖13所示之狀態之概略部分垂直剖視圖。圖20係繼圖17之後的依序表示器件搬送頭之位置檢測動作之概略部分垂直剖視圖。圖21係繼圖17之後的依序表示器件搬送頭之位置檢測動作之概略部分垂直剖視圖。圖22係表示圖7所示之位置檢測部中之第1受光部之受光狀態的曲線圖。圖23係表示圖7所示之位置檢測部中之第2受光部之受光狀態的曲線圖。圖24係依序表示圖3所示之器件搬送頭之第1模式下之動作的概略部分垂直剖視圖。圖25係依序表示圖3所示之器件搬送頭之第1模式下之動作的概略部分垂直剖視圖。圖26係依序表示圖3所示之器件搬送頭之第1模式下之動作的概略部分垂直剖視圖。圖27係依序表示圖3所示之器件搬送頭之第2模式下之動作的概略部分垂直剖視圖。圖28係依序表示圖3所示之器件搬送頭之第2模式下之動作的概略部分垂直剖視圖。圖29係依序表示圖3所示之器件搬送頭之第2模式下之動作的概略部分垂直剖視圖。圖30係依序表示圖3所示之器件搬送頭之第2模式下之動作的概略部分垂直剖視圖。圖31係依序表示圖3所示之器件搬送頭之第2模式下之動作的概略部分垂直剖視圖。圖32係依序表示圖3所示之器件搬送頭之第2模式下之動作的概略部分垂直剖視圖。圖33係表示圖3所示之器件搬送頭以第1模式或第2模式之任一模式進行動作之前之控制程式的流程圖。圖34係表示本發明之電子零件檢查裝置(第2實施形態)所具備之器件搬送頭的概略俯視圖。圖35係表示本發明之電子零件檢查裝置(第3實施形態)所具備之器件搬送頭之位置檢測動作的概略部分垂直剖視圖。圖36係表示圖35所示之器件搬送頭之X方向之位置與自器件搬送頭噴出之氣體之流量之關係的曲線圖。。圖37係表示圖35所示之器件搬送頭之Y方向之位置與自器件搬送頭噴出之氣體之流量之關係的曲線圖。圖38係本發明之電子零件檢查裝置(第4實施形態)所具備之吸附嘴及其周邊之立體圖。FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a perspective view of a device transfer head provided in the device supply area in FIG. 2. FIG. 4 is a view viewed from an arrow A direction in FIG. 3. FIG. 5 is a perspective view of an alignment jig provided in the electronic component inspection device shown in FIG. 1. FIG. 6 is a perspective view of an alignment jig provided in the electronic component inspection device shown in FIG. 1. FIG. FIG. 7 is a perspective view of a position detection section provided in the electronic component inspection device shown in FIG. 1. FIG. 8 is a vertical cross-sectional view showing a schematic part of an alignment state of the device transfer head shown in FIG. 3. FIG. FIG. 9 is a vertical cross-sectional view showing a schematic part of an alignment state of the device transfer head shown in FIG. 3. FIG. FIG. 10 is a vertical cross-sectional view of a schematic part showing an alignment state of the device transfer head shown in FIG. 3. FIG. FIG. 11 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head shown in FIG. 3. FIG. 12 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head shown in FIG. 3. FIG. 13 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head shown in FIG. 3. FIG. 14 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head shown in FIG. 3. FIG. 15 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head shown in FIG. 3. FIG. 16 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head shown in FIG. 3. FIG. 17 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head shown in FIG. 3. FIG. 18 is a vertical sectional view of a schematic part of the state shown in FIG. 12. FIG. 19 is a vertical sectional view of a schematic portion of the state shown in FIG. 13. FIG. 20 is a vertical cross-sectional view schematically showing a position detection operation of the device transfer head in order from FIG. 17; FIG. 21 is a vertical cross-sectional view schematically showing a position detection operation of the device transfer head in order from FIG. 17. FIG. 22 is a graph showing a light receiving state of a first light receiving section in the position detecting section shown in FIG. 7. FIG. 23 is a graph showing a light receiving state of a second light receiving section in the position detecting section shown in FIG. 7. FIG. 24 is a vertical cross-sectional view showing the outline of the operation in the first mode of the device transfer head shown in FIG. 3 in order. FIG. 25 is a vertical cross-sectional view showing a schematic part of the operation in the first mode of the device transfer head shown in FIG. 3 in order. FIG. 26 is a vertical cross-sectional view showing a schematic portion of the operation in the first mode of the device transfer head shown in FIG. 3 in order. FIG. 27 is a vertical cross-sectional view showing the outline of the operation in the second mode of the device transfer head shown in FIG. 3 in order. FIG. 28 is a vertical cross-sectional view showing a schematic portion of the operation in the second mode of the device transfer head shown in FIG. 3 in order. FIG. 29 is a vertical cross-sectional view showing a schematic part of the operation in the second mode of the device transfer head shown in FIG. 3 in order. FIG. 30 is a vertical cross-sectional view showing a schematic portion of the operation in the second mode of the device transfer head shown in FIG. 3 in order. FIG. 31 is a vertical cross-sectional view showing a schematic part of the operation in the second mode of the device transfer head shown in FIG. 3 in order. FIG. 32 is a vertical cross-sectional view showing an outline of an operation in the second mode of the device transfer head shown in FIG. 3 in order. FIG. 33 is a flowchart showing a control routine before the device transfer head shown in FIG. 3 operates in either the first mode or the second mode. FIG. 34 is a schematic plan view showing a device transfer head provided in the electronic component inspection apparatus (second embodiment) of the present invention. 35 is a vertical cross-sectional view showing a schematic part of a position detection operation of a device transfer head provided in the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 36 is a graph showing the relationship between the position in the X direction of the device transfer head shown in FIG. 35 and the flow rate of the gas ejected from the device transfer head. . FIG. 37 is a graph showing the relationship between the position in the Y direction of the device transfer head shown in FIG. 35 and the flow rate of gas ejected from the device transfer head. Fig. 38 is a perspective view of a suction nozzle and its periphery provided in the electronic component inspection apparatus (the fourth embodiment) of the present invention.

Claims (10)

一種電子零件搬送裝置,其特徵在於包括:基部,其可於第1方向移動;第1固持部,其設置於上述基部,且固持電子零件;第2固持部,其設置於上述基部,可相對於上述第1固持部於上述第1方向移動,且固持電子零件;及檢測部,其可檢測上述第1固持部之上述第1方向上之位置、及上述第2固持部之上述第1方向上之位置;且上述基部可於與上述第1方向正交之第2方向移動,且上述檢測部可檢測上述第1固持部之上述第2方向上之位置、及上述第2固持部之上述第2方向上之位置;且上述檢測部具有朝上述第1方向發出光之第1發光部、接收來自上述第1發光部之光之第1受光部、朝上述第2方向發出光之第2發光部、及接收來自上述第2發光部之光之第2受光部。An electronic component conveying device is characterized by comprising: a base portion which can move in a first direction; a first holding portion which is provided on the base portion and holds the electronic component; and a second holding portion which is provided on the base portion and can be opposed The first holding portion moves in the first direction and holds the electronic component; and the detection portion can detect the position in the first direction of the first holding portion and the first direction of the second holding portion And the base portion can be moved in a second direction orthogonal to the first direction, and the detection portion can detect the position in the second direction of the first holding portion and the second holding portion A position in the second direction; and the detection portion has a first light emitting portion that emits light toward the first direction, a first light receiving portion that receives light from the first light emitting portion, and a second light emitting portion that emits light toward the second direction A light-emitting part, and a second light-receiving part that receives light from the second light-emitting part. 如請求項1之電子零件搬送裝置,其中上述第1固持部與上述第2固持部可相對於上述基部於與上述第1方向及上述第2方向正交之第3方向上移動,且於基於以上述檢測部檢測出之上述第1固持部之位置與上述第2固持部之位置所獲得之距離為預設之值以上的情形時,使上述第1固持部與上述第2固持部個別地於上述第3方向移動。The electronic component conveying device according to claim 1, wherein the first holding portion and the second holding portion can move relative to the base in a third direction orthogonal to the first direction and the second direction, and based on When the distance between the position of the first holding part and the position of the second holding part detected by the detection part is greater than a preset value, the first holding part and the second holding part are individually made Move in the third direction above. 如請求項1或2之電子零件搬送裝置,其中上述第1固持部與上述第2固持部可相對於上述基部於與上述第1方向及上述第2方向正交之第3方向移動,且於基於以上述檢測部檢測出之上述第1固持部之位置與上述第2固持部之位置所獲得之距離未達預設之值的情形時,使上述第1固持部與上述第2固持部同時於上述第3方向移動。The electronic component conveying device according to claim 1 or 2, wherein the first holding portion and the second holding portion are movable relative to the base in a third direction orthogonal to the first direction and the second direction, and When the distance obtained by the position of the first holding part and the position of the second holding part detected by the detecting part does not reach a preset value, the first holding part and the second holding part are made at the same time Move in the third direction above. 如請求項3之電子零件搬送裝置,其中上述檢測部具有包含呈塊狀或板狀之構件之本體部,且上述本體部具有:凹部;小凹部或小凸部,其形成於上述凹部之底部,且俯視時較上述凹部小;第1發光部用插入部,其於上述凹部之側壁部開口,供上述第1發光部插入;第1受光部用插入部,其與上述第1發光部用插入部對向地於上述凹部之側壁部開口,供上述第1受光部插入;第2發光部用插入部,其於上述凹部之側壁部開口,供上述第2發光部插入;及第2受光部用插入部,其與上述第2發光部用插入部對向地於上述凹部之側壁部開口,供上述第2受光部插入。The electronic part conveying device according to claim 3, wherein the detection part has a body part including a block-shaped or plate-shaped member, and the body part has: a concave part; a small concave part or a small convex part formed at the bottom of the concave part , And the plan view is smaller than the recessed portion; the first light emitting portion inserting portion, which is opened in the side wall portion of the recessed portion, for the first light emitting portion to insert; the first light receiving portion inserting portion, which is used with the first light emitting portion The insertion portion opens oppositely to the side wall portion of the recessed portion for the insertion of the first light-receiving portion; the second light-emitting portion insertion portion opens at the side wall portion of the recessed portion for the insertion of the second light-emitting portion; and the second light-receiving portion An insertion portion for a portion, which opens to the side wall portion of the concave portion opposite to the insertion portion for the second light emitting portion, is provided for insertion of the second light receiving portion. 如請求項4之電子零件搬送裝置,其中上述小凹部貫通地形成。The electronic component conveying device according to claim 4, wherein the small concave portion is formed through. 如請求項1中任一項之電子零件搬送裝置,其包括上述電子零件被搬送至對電子零件進行檢查之檢查區域之供給區域、及回收已於上述檢查區域經檢查之電子零件之回收區域,且上述檢測部設置於上述供給區域及上述回收區域。The electronic part conveying device according to any one of claim 1, which includes a supply area where the electronic parts are transferred to an inspection area where the electronic parts are inspected, and a recovery area where electronic parts that have been inspected in the inspection area are collected, The detection unit is provided in the supply area and the recovery area. 如請求項1中任一項之電子零件搬送裝置,其包括:第3固持部,其設置於上述基部,可相對於上述第1固持部於第1方向移動,且固持電子零件;及第4固持部,其設置於上述基部,可相對於上述第1固持部於第1方向移動,且固持電子零件;且上述檢測部可檢測上述第3固持部之上述第1方向上之位置、及上述第4固持部之上述第1方向上之位置。The electronic component conveying device according to any one of claim 1, comprising: a third holding portion provided on the base portion, movable in the first direction relative to the first holding portion, and holding the electronic component; and the fourth The holding portion, which is provided on the base portion, can move in the first direction relative to the first holding portion, and holds the electronic component; and the detection portion can detect the position in the first direction of the third holding portion, and the above The position in the first direction of the fourth holding portion. 如請求項7之電子零件搬送裝置,其中上述基部可於與上述第1方向正交之第2方向移動,且上述檢測部可檢測上述第1固持部之上述第2方向上之位置、上述第2固持部之上述第2方向上之位置、上述第3固持部之上述第2方向上之位置、及上述第4固持部之上述第2方向上之位置。The electronic component conveying device according to claim 7, wherein the base portion can move in a second direction orthogonal to the first direction, and the detection portion can detect the position in the second direction of the first holding portion, the first 2 The position in the second direction of the holding portion, the position in the second direction of the third holding portion, and the position in the second direction of the fourth holding portion. 如請求項8之電子零件搬送裝置,其包括:第5固持部,其設置於上述基部,且相對於上述第1固持部配置於上述第2方向;第6固持部,其設置於上述基部,且相對於上述第2固持部配置於上述第2方向;第7固持部,其設置於上述基部,且相對於上述第3固持部配置於上述第2方向;及第8固持部,其設置於上述基部,且相對於上述第4固持部配置於上述第2方向;且上述檢測部可檢測上述第5固持部之上述第1方向上之位置及上述第2方向上之位置、上述第6固持部之上述第1方向上之位置及上述第2方向上之位置、上述第7固持部之上述第1方向上之位置及上述第2方向上之位置、以及上述第8固持部之上述第1方向上之位置及上述第2方向上之位置。The electronic component conveying device according to claim 8 includes: a fifth holding portion provided on the base, and arranged in the second direction with respect to the first holding portion; and a sixth holding portion provided on the base, And is arranged in the second direction with respect to the second holding portion; the seventh holding portion is provided in the base portion and is arranged in the second direction with respect to the third holding portion; and the eighth holding portion is provided in The base portion is disposed in the second direction with respect to the fourth holding portion; and the detection portion can detect the position in the first direction and the position in the second direction of the fifth holding portion, and the sixth holding The position in the first direction and the position in the second direction of the portion, the position in the first direction and the position in the second direction of the seventh holding portion, and the position of the first in the eighth holding portion The position in the direction and the position in the second direction described above. 一種電子零件檢查裝置,其特徵在於包括:基部,其可於第1方向移動;第1固持部,其設置於上述基部,且固持電子零件;第2固持部,其設置於上述基部,可相對於上述第1固持部於上述第1方向移動,且固持電子零件;檢測部,其可檢測上述第1固持部之上述第1方向上之位置、及上述第2固持部之上述第1方向上之位置;及檢查部,其對由上述第1固持部固持之電子零件、及由上述第2固持部固持之電子零件進行檢查。An electronic component inspection device is characterized by comprising: a base part which can move in the first direction; a first holding part which is provided on the base part and holds the electronic component; and a second holding part which is provided on the base part and can face each other The first holding portion moves in the first direction and holds the electronic component; the detecting portion can detect the position of the first holding portion in the first direction and the second holding portion in the first direction And the inspection part, which inspects the electronic parts held by the first holding part and the electronic parts held by the second holding part.
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