TW201814295A

TW201814295A - Electronic parts conveying device and electronic parts inspection device in which terminals of each electronic parts uniformly abuts against the respective terminals of the inspection unit when electrical inspection is being performed

Info

Publication number: TW201814295A
Application number: TW106132521A
Authority: TW
Inventors: 中村敏
Original assignee: 精工愛普生股份有限公司
Priority date: 2016-09-29
Filing date: 2017-09-22
Publication date: 2018-04-16
Also published as: CN107884700B; TWI649567B; CN107884700A

Abstract

The present invention provides an electronic parts conveying device and an electronic parts inspection device which allow terminals of each electronic component to uniformly abut against the respective terminals of the inspection unit when the inspection unit performs an electrical inspection for the electronic parts. The electronic parts conveying device 10 of this invention comprises: a first base part 511; a first sliding part 512 which is slidable with respect to the first base portion 511; and second base parts 32, 33, 34 which are disposed on the first sliding part 512; and the second sliding part 31 which is slidable with respect to the second base parts 32, 33, 34 and is capable of abutting against the electronic partst; and a first space S1 having variable volume is formed between the first base part 511 and the first sliding part 512, a second space S2 having a variable volume is formed between the second base part 34 and the second sliding part 31.

Description

Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。The invention relates to an electronic component conveying device and an electronic component inspection device.

自先前以來，已知有對IC(Integrated Circuit，積體電路)封裝體等電子零件進行測試之測試裝置(例如參照專利文獻1)。專利文獻1所記載之測試裝置具備：推進器，其於固持電子零件之狀態下將該電子零件按壓至測試用插口；及壓力檢測單元，其連結於推進器，對該推進器將電子零件按壓至插口時之壓力(按壓力)進行檢測。而且，於專利文獻1所記載之測試裝置中，於對電子零件進行測試時，可基於壓力檢測單元之檢測結果，偵測推進器是否以特定之壓力將電子零件按壓至插口。[先前技術文獻][專利文獻] [專利文獻1]日本專利特開2003-161758號公報Test devices for testing electronic components such as IC (Integrated Circuit) packages have been known (see, for example, Patent Document 1). The test device described in Patent Document 1 includes a pusher that presses the electronic part to a test socket while holding the electronic part, and a pressure detection unit connected to the pusher and presses the electronic part against the pusher. The pressure (pressing force) when reaching the socket is detected. Furthermore, in the test device described in Patent Document 1, when testing an electronic component, it is possible to detect whether or not the pusher presses the electronic component to the socket with a specific pressure based on a detection result of the pressure detection unit. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2003-161758

[發明所欲解決之問題]然而，於專利文獻1所記載之測試裝置中，即便推進器以特定之壓力將電子零件按壓至插口，根據例如電子零件之大小(厚度)或形狀(翹曲)、電子零件載置部(插口)與推進器之平行度等，電子零件之各焊料球之端子與插口之各接觸插腳亦未必會均勻地接觸。而且，若各焊料球之端子與各接觸插腳未均勻地接觸，則會產生無法準確地進行對電子零件之測試之問題。又，於設置有複數個推進器之情形時，壓力檢測單元亦必須對應於各推進器而設置。此種構成導致測試裝置之構造之複雜化或製造成本之增加等，成為難以實用化之原因。[解決問題之技術手段]本發明係為了解決上述課題之至少一部分而完成者，可作為以下者而實現。本發明之電子零件搬送裝置之特徵在於具備：第1基部；第1滑動部，其可相對於上述第1基部滑動；第2基部，其配置於上述第1滑動部；及第2滑動部，其可相對於上述第2基部滑動，且可抵接於電子零件；且於上述第1基部與上述第1滑動部之間形成有容積可變動之第1空間，於上述第2基部與上述第2滑動部之間形成有容積可變動之第2空間。藉此，即便電子零件存在個體差異，亦可藉由調節第1空間及第2空間內之作動流體之壓力而抵消該差異。而且，例如於利用檢查部進行對電子零件之電性檢查時，無論電子零件之個體差異如何，均可使電子零件之各端子均勻地抵接於檢查部之各端子，由此可準確地進行該檢查。於本發明之電子零件搬送裝置中，較佳為作動流體可於上述第1空間及上述第2空間進出。藉此，可使第1滑動部滑動並且可使第2滑動部滑動。於本發明之電子零件搬送裝置中，較佳為上述第2基部可抵接於載置上述電子零件之電子零件載置部。藉此，可使第2基部之姿勢為模仿電子零件載置部之形狀之狀態。由此，第2滑動部可於該模仿之狀態下抵接於電子零件。其結果為，例如於電子零件載置部為進行對電子零件之電性檢查者之情形時，即便於電子零件載置部(插口)與推進器之平行度欠佳之情形時，亦可有助於電子零件之各端子與載置部之各端子之充分接觸。於本發明之電子零件搬送裝置中，較佳為上述第2滑動部抵接於上述電子零件之抵接力與上述第2基部抵接於上述電子零件載置部之抵接力不同。例如藉由使第2滑動部抵接於電子零件之抵接力小於第2基部抵接於電子零件載置部之抵接力，可發揮上述效果並且防止過度地按壓電子零件。於本發明之電子零件搬送裝置中，較佳為具有對上述第1空間及上述第2空間供給相同壓力之作動流體之作動流體供給部。藉由於第1空間與第2空間設置共用之作動流體供給部，可簡化裝置構成。於本發明之電子零件搬送裝置中，較佳為具有與上述第2空間連通之第3空間。藉此，設置有第3空間，從而可相應地抑制第2空間之壓力之變動。於本發明之電子零件搬送裝置中，較佳為上述第1滑動部承受上述作動流體之第1受壓面之面積大於上述第2滑動部承受上述作動流體之第2受壓面之面積。藉此，於將第1空間與第2空間之壓力設為相同之情形時，可使施加於第1滑動部之力大於施加於第2滑動部之力。於本發明之電子零件搬送裝置中，較佳為上述第2基部可抵接於上述電子零件之一部分。藉此，例如於第2基部按壓電子零件之一部分之狀態下，第2滑動部可按壓電子零件之剩餘部分。於本發明之電子零件搬送裝置中，較佳為上述第2滑動部抵接於上述電子零件之抵接力與上述第2基部抵接於上述電子零件之抵接力不同。藉此，可減少電子零件中第2滑動部與電子零件抵接之部分之負載、或減少電子零件中第2基部與電子零件抵接之部分之負載。即，可對應於電子零件之部位而使抵接力不同。於本發明之電子零件搬送裝置中，較佳為上述第2基部與上述第2滑動部於不同之位置對上述電子零件抵接。藉此，例如於第2基部按壓電子零件之一部分之狀態下，第2滑動部可按壓電子零件之剩餘部分。於本發明之電子零件搬送裝置中，較佳為可分別變更上述作動流體對上述第1空間之壓力與上述作動流體對上述第2空間之壓力。藉此，可使施加於第1滑動部之力與施加於第2滑動部之力不同。於本發明之電子零件搬送裝置中，較佳為具有：可動部，其可載置上述電子零件而移動；及力檢測部，其設置於上述可動部，可對力進行檢測；且上述力檢測部可與抵接於上述第2滑動部之上述電子零件抵接。藉此，例如於利用檢查部進行對電子零件之檢查之情形時，可將使固持於固持部之電子零件抵接於檢查部時之實際抵接力置換為由力檢測部所檢測出之抵接力。而且，根據由力檢測部所檢測出之抵接力之大小，可判斷電子零件檢查時之抵接力是否為對於該電子零件而言恰如其分之大小。本發明之電子零件檢查裝置之特徵在於具備：第1基部；第1滑動部，其可相對於上述第1基部滑動；第2基部，其配置於上述第1滑動部；第2滑動部，其可相對於上述第2基部滑動，且可抵接於電子零件；及檢查部，其對上述電子零件進行檢查；且於上述第1基部與上述第1滑動部之間形成有容積可變動之第1空間，於上述第2基部與上述第2滑動部之間形成有容積可變動之第2空間。藉此，即便電子零件存在個體差異，亦可藉由調節第1空間及第2空間內之作動流體之壓力而抵消該差異。而且，例如於利用檢查部進行對電子零件之電性檢查時，無論電子零件之個體差異如何，均可使電子零件之各端子均勻地抵接於檢查部之各端子，由此可準確地進行該檢查。本發明之電子零件搬送裝置之特徵在於具備：吸引部，其可藉由吸引而固持電子零件，且可於吸引上述電子零件之吸引方向上移動；及施力部，其可將上述吸引部朝與上述吸引方向相反之方向施力，可於吸引上述電子零件之狀態下於上述吸引方向上收縮。藉此，即便電子零件存在個體差異，亦可藉由能夠於吸引電子零件之狀態下收縮之施力部抵消該差異。而且，例如於利用檢查部進行對電子零件之電性檢查時，無論電子零件之個體差異如何，均可使電子零件之各端子均勻地抵接於檢查部之各端子，由此可準確地進行該檢查。於本發明之電子零件搬送裝置中，較佳為具有與上述吸引部抵接之抵接部，可配置載置上述電子零件之載置部，且具有可於上述吸引部與上述抵接部抵接之狀態下調整上述吸引部之姿勢之姿勢調整部。藉此，例如於載置部為進行對電子零件之電性檢查者之情形時，可有助於電子零件之各端子與載置部之各端子之充分接觸。於本發明之電子零件搬送裝置中，較佳為上述抵接部包含厚度可變更之板狀構件。藉此，例如於載置部為進行對電子零件之電性檢查者之情形時，可對應於電子零件之厚度而使載置部成為適於該電子零件之檢查者。於本發明之電子零件搬送裝置中，較佳為上述抵接部具有壓電元件。藉此，可藉由施加於壓電元件之電壓之大小而容易且迅速地變更抵接部之厚度。於本發明之電子零件搬送裝置中，較佳為上述載置部具有將載置於上述載置部之上述電子零件朝上述吸引方向施力之電子零件施力部。藉此，例如於載置部為進行對電子零件之電性檢查者之情形時，可使電子零件之各端子與載置部之各端子充分地接觸，由此可準確地進行對電子零件之檢查。於本發明之電子零件搬送裝置中，較佳為上述施力部包含螺旋彈簧。藉此，可簡化施力部之構成並且實現施力部之輕量化。於本發明之電子零件搬送裝置中，較佳為上述螺旋彈簧之彈簧常數為1 N/mm以上且90 N/mm以下。藉此，於進行對電子零件之電性檢查之情形時，可對該電子零件賦予適於檢查之作用力。又，螺旋彈簧可於吸引部吸引電子零件之狀態下維持可於上述吸引方向上收縮之狀態。於本發明之電子零件搬送裝置中，較佳為上述螺旋彈簧之外徑為7 mm以上且20 mm以下。藉此，可使螺旋彈簧成為能夠內置於特定部位之大小者。於本發明之電子零件搬送裝置中，較佳為上述螺旋彈簧之內徑為5 mm以上且10 mm以下。藉此，可使螺旋彈簧成為能夠內置於特定部位之大小者。於本發明之電子零件搬送裝置中，較佳為上述螺旋彈簧之線徑為0.3 mm以上且2 mm以下。藉此，可使螺旋彈簧成為能夠內置於特定部位之大小者。於本發明之電子零件搬送裝置中，較佳為上述吸引部之最大吸引力為-95 kPa以上且-30 kPa以下。藉此，可穩定地吸引並固持各種大小(重量)之電子零件。而且，可於維持該固持狀態之狀態下搬送電子零件。藉此，可防止電子零件於搬送中掉落。於本發明之電子零件搬送裝置中，較佳為以能夠變更上述吸引部之吸引力之方式構成。藉此，可穩定地吸引並固持各種大小(重量)之電子零件。而且，可於維持該固持狀態之狀態下搬送電子零件。藉此，可防止電子零件於搬送中掉落。於本發明之電子零件搬送裝置中，較佳為具有抵接於上述電子零件並吸附上述電子零件之吸附噴嘴、及可變更吸引上述電子零件之吸引力之調壓機構，且可藉由變更上述吸引力而變更上述吸附噴嘴按壓上述電子零件之按壓力。藉此，可穩定地吸引並固持各種大小(重量)之電子零件。而且，可於維持該固持狀態之狀態下搬送電子零件。藉此，可防止電子零件於搬送中掉落。本發明之電子零件檢查裝置之特徵在於具備：吸引部，其可藉由吸引而固持電子零件，且可於吸引上述電子零件之吸引方向上移動；施力部，其可將上述吸引部朝與上述吸引方向相反之方向施力，且可於吸引上述電子零件之狀態下於上述吸引方向上收縮；及檢查部，其對上述電子零件進行檢查。藉此，即便電子零件存在個體差異，亦可藉由可於吸引電子零件之狀態下收縮之施力部而抵消該差異。而且，例如於利用檢查部進行對電子零件之電性檢查時，無論電子零件之個體差異如何，均可使電子零件之各端子均勻地抵接於檢查部之各端子，由此可準確地進行該檢查。又，可將電子零件搬送至檢查部，由此可利用檢查部進行對該電子零件之檢查。又，可自檢查部搬送檢查後之電子零件。本發明之電子零件搬送裝置之特徵在具備：固持部，其可固持構件；可動部，其可載置電子零件而進行移動；力檢測部，其設置於上述可動部，可對力進行檢測；且可使固持於上述固持部之上述構件抵接於上述力檢測部。藉此，例如於利用檢查部進行對電子零件之檢查之情形時，可將使固持於固持部之電子零件抵接於檢查部時之實際抵接力置換為由力檢測部所檢測出之抵接力。而且，根據由力檢測部所檢測出之抵接力之大小，可判斷電子零件檢查時之抵接力是否為對於該電子零件而言恰如其分之大小。於本發明之電子零件搬送裝置中，較佳為可進行上述電子零件之檢查，上述可動部具有載置上述檢查前之上述電子零件之檢查前電子零件載置部、及載置上述檢查後之上述電子零件之檢查後電子零件載置部，且上述力檢測部設置於上述檢查前電子零件載置部與上述檢查後電子零件載置部之間。藉此，檢查前電子零件載置部與檢查後電子零件載置部之間確保有對於設置例如1個力檢測部而言充分之空間。藉此，既可於設計電子零件搬送裝置時設置力檢測部，亦可於省略力檢測部之電子零件搬送裝置完成後進而設置力檢測部，即，亦可其後附加(增設)力檢測部。於本發明之電子零件搬送裝置中，較佳為上述檢查前電子零件載置部與上述檢查後電子零件載置部可於一方向上往返移動。藉此，可藉由檢查前電子零件載置部將檢查前之電子零件自搬送源穩定地搬送至搬送目的地。又，可藉由檢查後電子零件載置部將檢查後之電子零件自例如其他搬送源穩定地搬送至其他搬送目的地。於本發明之電子零件搬送裝置中，較佳為上述固持部可於與上述一方向交叉之另一方向上移動。藉此，固持部可一面固持上述構件，此外可一面固持電子零件一面將其搬送至其搬送目的地。於本發明之電子零件搬送裝置中，較佳為使固持於上述固持部之上述構件抵接於上述力檢測部時之上述固持部之移動速度為10 mm/秒以下。藉此，即便於上述構件與力檢測部抵接時產生衝擊，亦可防止因該衝擊所導致之上述構件或力檢測部之變形等。於本發明之電子零件搬送裝置中，較佳為上述力檢測部可配置於俯視下與上述固持部重疊之位置。於利用檢查部進行電子零件之檢查之情形時，於該檢查時，電子零件對檢查部自上方抵接(壓抵)。與此同樣地，於力檢測時，力檢測用構件亦可對力檢測部自上方抵接(壓抵)。藉由如此於檢查時與力檢測時抵接方向相同，可將「力檢測用構件向力檢測部之抵接力」與「電子零件向檢查部之抵接力」作為同等者來處理。於本發明之電子零件搬送裝置中，較佳為上述力檢測部配置於高於上述檢查前電子零件載置部及上述檢查後電子零件載置部之位置。藉此，固持部於固持例如檢查前電子零件載置部上之電子零件時，下降至可進行該固持之位置(以下稱為「可固持之位置」)而停止，於使力檢測用構件抵接於力檢測部而對力進行檢測時，停止於較可固持位置高之位置。由此，防止力檢測時之固持部與存在於較該固持部低之位置之其他周邊構件等之干涉。於本發明之電子零件搬送裝置中，較佳為固持於上述固持部之上述構件向上述力檢測部之抵接於上述檢查開始前、上述檢查結束後、或上述固持部每固持上述電子零件特定次數時進行。藉此，可自該等3個時序中適當選擇而設定，由此可適應於使用電子零件搬送裝置之使用者之要求。於本發明之電子零件搬送裝置中，較佳為上述固持部設置有複數個，且可使固持於上述各固持部之上述構件獨立地抵接於上述力檢測部。藉此，例如以1個力檢測部便可檢測出複數個固持部之抵接力，由此可實現構成之簡化。於本發明之電子零件搬送裝置中，較佳為可調整使固持於上述固持部之上述構件抵接於上述力檢測部時之抵接力。藉此，例如於利用檢查部進行電子零件之檢查之情形時，可以與檢查時之電子零件相對於檢查部之抵接力同等之力使上述構件抵接於力檢測部。由此，可將上述構件抵接於力檢測部之抵接力與「電子零件向檢查部之抵接力」作為同等者來處理。於本發明之電子零件搬送裝置中，較佳為上述抵接力為0.3 N以上且600 N以下。例如於利用檢查部進行電子零件之檢查之情形時，此種數值範圍與檢查時之電子零件對檢查部之抵接力可取之數值範圍相同。藉此，可將上述構件抵接於力檢測部之抵接力與「電子零件向檢查部之抵接力」作為同等者來處理。於本發明之電子零件搬送裝置中，較佳為可配置載置上述電子零件之載置部，且具有可於將固持於上述固持部之上述電子零件載置於上述載置部時調整上述固持部之姿勢之姿勢調整部。藉此，例如於載置部為進行對電子零件之電性檢查者之情形時，可有助於電子零件之各端子與載置部之各端子之充分接觸。本發明之電子零件搬送裝置之特徵在於具備：固持部，其可固持構件；可動部，其可載置電子零件而進行移動；力檢測部，其設置於上述可動部，可對力進行檢測；及記憶部，其可記憶上述力檢測部檢測之檢測結果。藉此，例如於利用檢查部進行對電子零件之檢查之情形時，可將使固持於固持部之電子零件抵接於檢查部時之實際抵接力置換為由力檢測部所檢測出之抵接力。而且，根據由力檢測部所檢測出之抵接力之大小，可判斷電子零件檢查時之抵接力是否為對於該電子零件而言恰如其分之大小。又，由力檢測部所檢測出之抵接力記憶於記憶部。又，作為力檢測部，例如可使用荷重元，荷重元設置於可相對較容易確保其設置空間之可動部。藉此，以簡單之構成便可進行力之檢測。本發明之電子零件檢查裝置之特徵在於具備：固持部，其可固持構件；可動部，其可載置電子零件而進行移動；力檢測部，其設置於上述可動部，可對力進行檢測；及檢查部，其對上述電子零件進行檢查；且可使固持於上述固持部之上述構件抵接於上述力檢測部。藉此，於利用檢查部進行對電子零件之檢查之情形時，可將使固持於固持部之電子零件抵接於檢查部時之實際抵接力置換為由力檢測部所檢測出之抵接力。而且，根據由力檢測部所檢測出之抵接力之大小，可判斷電子零件檢查時之抵接力是否為對於該電子零件而言恰如其分之大小。又，可將電子零件搬送至檢查部，由此可利用檢查部進行對該電子零件之檢查。又，可自檢查部搬送檢查後之電子零件。[Problems to be Solved by the Invention] However, in the test device described in Patent Document 1, even if the pusher presses the electronic part to the socket with a specific pressure, the size (thickness) or shape (warpage) of the electronic part is determined by The parallelism of the electronic component mounting part (socket) and the propeller, etc. The terminals of each solder ball of the electronic component and the contact pins of the socket may not evenly contact. In addition, if the terminals of each solder ball and each contact pin are not uniformly contacted, a problem that an electronic component test cannot be accurately performed may occur. When a plurality of thrusters are provided, the pressure detection unit must also be provided corresponding to each thruster. Such a configuration complicates the structure of the test device, increases the manufacturing cost, etc., and becomes a cause of difficulty in practical application. [Technical Solution to Problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented as the following. The electronic component transporting device of the present invention is characterized by comprising: a first base portion; a first sliding portion capable of sliding relative to the first base portion; a second base portion disposed on the first sliding portion; and a second sliding portion, It is slidable with respect to the second base portion, and can abut on electronic parts; and a first space having a variable volume is formed between the first base portion and the first sliding portion, and between the second base portion and the first base portion, A second space having a variable volume is formed between the two sliding portions. Thereby, even if there are individual differences in the electronic parts, the difference can be offset by adjusting the pressure of the working fluid in the first space and the second space. In addition, for example, when performing electrical inspection of electronic parts using the inspection unit, the terminals of the electronic part can be uniformly abutted against the terminals of the inspection unit regardless of the individual differences of the electronic parts. The check. In the electronic component conveying device of the present invention, it is preferable that the working fluid can enter and exit the first space and the second space. Thereby, the first sliding portion can be slid and the second sliding portion can be slid. In the electronic component transfer device of the present invention, it is preferable that the second base portion can be brought into contact with the electronic component placement portion on which the electronic component is placed. Thereby, the posture of the second base portion can be made to imitate the shape of the electronic component placement portion. Thereby, the second sliding portion can be brought into contact with the electronic component in the imitated state. As a result, for example, in a case where the electronic component mounting portion is a person who conducts an electrical inspection of the electronic component, even when the parallelism between the electronic component mounting portion (socket) and the thruster is poor, there may be a case where It helps to make full contact between each terminal of the electronic component and each terminal of the mounting portion. In the electronic component conveying device of the present invention, it is preferable that the contact force with which the second sliding portion abuts against the electronic component is different from the contact force with which the second base portion abuts against the electronic component placing portion. For example, by making the contact force of the second sliding portion abutting the electronic component smaller than the contact force of the second base portion abutting the electronic component placement portion, the above-mentioned effect can be exhibited and the electronic component can be prevented from being pressed excessively. In the electronic component conveying device of the present invention, it is preferable that the electronic component conveying device includes a working fluid supply unit that supplies a working fluid having the same pressure to the first space and the second space. By providing a common working fluid supply unit in the first space and the second space, the device configuration can be simplified. In the electronic component conveying device of the present invention, it is preferable that the third space is provided in communication with the second space. Thereby, the third space is provided, and accordingly, fluctuations in the pressure in the second space can be suppressed accordingly. In the electronic component transfer device of the present invention, it is preferable that an area of the first pressure-receiving surface of the first sliding portion receiving the operating fluid is larger than an area of the second pressure-receiving surface of the second sliding portion receiving the operating fluid. Accordingly, when the pressures in the first space and the second space are the same, the force applied to the first sliding portion can be made larger than the force applied to the second sliding portion. In the electronic component transfer device of the present invention, it is preferable that the second base portion can be abutted to a part of the electronic component. Thereby, for example, in a state where the second base portion presses a part of the electronic component, the second sliding portion can press the remaining portion of the electronic component. In the electronic component transfer device of the present invention, it is preferable that the contact force with which the second sliding portion abuts the electronic component and the contact force with which the second base portion abuts the electronic component are different. Thereby, it is possible to reduce the load on the portion where the second sliding portion and the electronic component abut the electronic component, or reduce the load on the portion where the second base portion and the electronic component abut the electronic component. That is, the contact force can be made different depending on the location of the electronic component. In the electronic component transfer device of the present invention, it is preferable that the second base portion and the second sliding portion abut the electronic component at different positions. Thereby, for example, in a state where the second base portion presses a part of the electronic component, the second sliding portion can press the remaining portion of the electronic component. In the electronic component transfer device of the present invention, it is preferable that the pressure of the working fluid on the first space and the pressure of the working fluid on the second space can be changed separately. Thereby, the force applied to the first sliding portion can be made different from the force applied to the second sliding portion. In the electronic component conveying device of the present invention, it is preferable that the electronic component transfer device includes: a movable portion that can move the electronic component; and a force detection portion that is provided on the movable portion and can detect the force; and the force detection The portion may be in contact with the electronic component that is in contact with the second sliding portion. With this, for example, in the case of inspecting electronic parts using the inspection section, the actual contact force when the electronic parts held in the holding section abut the inspection section can be replaced with the contact force detected by the force detection section. . In addition, based on the magnitude of the abutment force detected by the force detection section, it can be determined whether the abutment force at the time of the inspection of the electronic component is an appropriate size for the electronic component. The electronic component inspection device of the present invention includes: a first base portion; a first sliding portion that is slidable relative to the first base portion; a second base portion that is disposed on the first sliding portion; and a second sliding portion that is It is slidable with respect to the second base portion and can be in contact with an electronic component; and an inspection portion that inspects the electronic component; and a first variable-volume portion is formed between the first base portion and the first sliding portion. The first space is a second space having a variable volume formed between the second base portion and the second sliding portion. Thereby, even if there are individual differences in the electronic parts, the difference can be offset by adjusting the pressure of the working fluid in the first space and the second space. In addition, for example, when performing electrical inspection of electronic parts using the inspection unit, the terminals of the electronic part can be uniformly abutted against the terminals of the inspection unit regardless of the individual differences of the electronic parts. The check. The electronic component transporting device of the present invention is characterized by comprising: a suction portion that can hold the electronic component by suction and can move in a suction direction that attracts the electronic component; and a biasing portion that can move the suction portion toward When the force is applied in a direction opposite to the suction direction, the electronic component can be contracted in the suction direction in a state of being sucked. With this, even if there are individual differences in the electronic parts, the difference can be offset by a force applying part capable of contracting in a state of attracting the electronic parts. In addition, for example, when performing electrical inspection of electronic parts using the inspection unit, the terminals of the electronic part can be uniformly abutted against the terminals of the inspection unit regardless of the individual differences of the electronic parts. The check. In the electronic component conveying device of the present invention, it is preferable that the electronic component transfer device has a contact portion that abuts the suction portion, a mounting portion on which the electronic component can be placed, and has a contact portion that can abut the suction portion on the suction portion The posture adjustment section that adjusts the posture of the suction section in the connected state. Thus, for example, in a case where the mounting portion is an electric inspector of an electronic component, it is possible to facilitate full contact between each terminal of the electronic component and each terminal of the mounting portion. In the electronic component transfer device of the present invention, it is preferable that the abutting portion includes a plate-like member whose thickness can be changed. Thereby, for example, in a case where the mounting portion is an electronic inspector of an electronic component, the mounting portion can be made an inspector suitable for the electronic component according to the thickness of the electronic component. In the electronic component transfer device of the present invention, it is preferable that the abutting portion includes a piezoelectric element. Thereby, the thickness of the contact portion can be easily and quickly changed by the magnitude of the voltage applied to the piezoelectric element. In the electronic component transfer device of the present invention, it is preferable that the mounting portion includes an electronic component biasing portion that biases the electronic component mounted on the mounting portion in the suction direction. With this, for example, in a case where the mounting portion is an electronic inspector of the electronic part, the terminals of the electronic component can be brought into full contact with the terminals of the mounting portion, so that the electronic component can be accurately performed. an examination. In the electronic component transfer device of the present invention, it is preferable that the urging portion includes a coil spring. Thereby, the structure of the urging portion can be simplified and the weight of the urging portion can be reduced. In the electronic component transfer device of the present invention, it is preferable that a spring constant of the coil spring is 1 N / mm or more and 90 N / mm or less. Therefore, when an electrical inspection of an electronic component is performed, a force suitable for the inspection can be given to the electronic component. In addition, the coil spring can maintain a state capable of contracting in the above-mentioned suction direction in a state in which the suction part sucks the electronic component. In the electronic component conveying device of the present invention, the outer diameter of the coil spring is preferably 7 mm or more and 20 mm or less. Thereby, the coil spring can be made into a size which can be built in a specific part. In the electronic component conveying device of the present invention, the inner diameter of the coil spring is preferably 5 mm or more and 10 mm or less. Thereby, the coil spring can be made into a size which can be built in a specific part. In the electronic component conveying device of the present invention, the wire diameter of the coil spring is preferably 0.3 mm or more and 2 mm or less. Thereby, the coil spring can be made into a size which can be built in a specific part. In the electronic component conveying device of the present invention, it is preferable that the maximum attraction force of the attraction portion is -95 kPa or more and -30 kPa or less. Thereby, electronic components of various sizes (weights) can be attracted and held stably. In addition, the electronic components can be transported while the holding state is maintained. This prevents the electronic parts from falling during transportation. In the electronic component conveying apparatus of the present invention, it is preferable to be configured so that the attraction force of the attraction portion can be changed. Thereby, electronic components of various sizes (weights) can be attracted and held stably. In addition, the electronic components can be transported while the holding state is maintained. This prevents the electronic parts from falling during transportation. In the electronic component conveying device of the present invention, it is preferable to have an adsorption nozzle that abuts on the electronic component and adsorbs the electronic component, and a pressure regulating mechanism that can change the attractive force that attracts the electronic component. The attractive force changes the pressing force with which the suction nozzle presses the electronic component. Thereby, electronic components of various sizes (weights) can be attracted and held stably. In addition, the electronic components can be transported while the holding state is maintained. This prevents the electronic parts from falling during transportation. The electronic component inspection device of the present invention is characterized by including: a suction section that can hold the electronic component by suction and can move in a suction direction that attracts the electronic component; and a urging section that can direct the suction section toward the The above-mentioned attraction direction is urged in the opposite direction and can be contracted in the above-mentioned attraction direction in a state in which the above-mentioned electronic component is attracted; and an inspection unit that inspects the above-mentioned electronic component. Thereby, even if there are individual differences in the electronic parts, the difference can be offset by the urging part that can be contracted in a state of attracting the electronic parts. In addition, for example, when performing electrical inspection of electronic parts using the inspection unit, the terminals of the electronic part can be uniformly abutted against the terminals of the inspection unit regardless of the individual differences of the electronic parts. The check. In addition, since the electronic component can be transported to the inspection unit, the inspection of the electronic component can be performed by the inspection unit. In addition, electronic parts after inspection can be transported from the inspection section. The electronic component transporting device of the present invention is characterized by including: a holding portion that can hold a member; a movable portion that can move electronic components on it; and a force detection portion that is provided on the movable portion and can detect a force; In addition, the member held in the holding portion may be brought into contact with the force detection portion. With this, for example, in the case of inspecting electronic parts using the inspection section, the actual contact force when the electronic parts held in the holding section abut the inspection section can be replaced with the contact force detected by the force detection section. . In addition, based on the magnitude of the abutment force detected by the force detection section, it can be determined whether the abutment force at the time of the inspection of the electronic component is an appropriate size for the electronic component. In the electronic component transfer device of the present invention, it is preferable that the above-mentioned electronic component inspection can be performed, and the movable portion includes an electronic component placement portion before inspection for placing the electronic component before the inspection, and an electronic component placement portion after the inspection. The post-inspection electronic component mounting section of the electronic component, and the force detection section is provided between the pre-inspection electronic component mounting section and the post-inspection electronic component mounting section. Thereby, a sufficient space is provided between the pre-inspection electronic component placement portion and the post-inspection electronic component placement portion for installing, for example, one force detection portion. Thus, the force detection section can be provided when designing the electronic component transfer device, or the force detection section can be provided after the completion of the electronic component transfer device omitting the force detection section, that is, the force detection section can be added (added) later . In the electronic component transfer device of the present invention, it is preferable that the electronic component mounting portion before inspection and the electronic component mounting portion after inspection can move back and forth in one direction. Thereby, the electronic components before inspection can be stably transported from the transport source to the transport destination by the electronic component placement section before inspection. In addition, the inspected electronic parts can be used to stably transport the inspected electronic parts from, for example, another transport source to another transport destination. In the electronic component conveying device of the present invention, it is preferable that the holding portion is movable in another direction crossing the one direction. Thereby, the holding portion can hold the above-mentioned member while holding the electronic component, and can also transport it to its transfer destination while holding the electronic component. In the electronic component conveying device of the present invention, it is preferable that the moving speed of the holding portion when the member held by the holding portion abuts against the force detecting portion is 10 mm / sec or less. Thereby, even if an impact occurs when the above-mentioned member comes into contact with the force detection section, deformation of the above-mentioned member or the force detection section due to the impact can be prevented. In the electronic component conveying device of the present invention, it is preferable that the force detection section may be disposed at a position overlapping the holding section in a plan view. When an electronic part is inspected by the inspection part, the electronic part abuts (presses) the inspection part from above at the time of the inspection. In the same manner, the force detecting member may be brought into contact with (abut against) the force detecting section from above when the force is detected. Since the contact direction during the inspection and the force detection is the same, the "contact force of the force detection member to the force detection unit" and the "contact force of the electronic component to the inspection unit" can be treated as equivalent. In the electronic component transfer device of the present invention, it is preferable that the force detection section is disposed at a position higher than the electronic component placement section before inspection and the electronic component placement section after inspection. Thereby, when holding the electronic part on the electronic part mounting part before the inspection, for example, the holding part is lowered to a position where the holding can be performed (hereinafter referred to as a "holding position") and stopped, so that the force detecting member is resisted. When the force detection unit is connected to detect the force, it stops at a position higher than the holding position. Thereby, interference between the holding portion at the time of the force detection and other peripheral members and the like existing at a position lower than the holding portion is prevented. In the electronic component transfer device of the present invention, it is preferable that the abutment of the member held by the holding portion to the force detecting portion is before the start of the inspection, after the end of the inspection, or when the holding portion holds the electronic component specified. Times. Thereby, it can be appropriately selected and set from among these 3 timings, and thus it can be adapted to the requirements of users who use the electronic component transfer device. In the electronic component conveying device of the present invention, it is preferable that the holding portion is provided with a plurality of pieces, and the members held by the holding portions can be independently abutted against the force detecting portion. Thereby, for example, the contact force of a plurality of holding portions can be detected by one force detection portion, thereby simplifying the configuration. In the electronic component conveying device of the present invention, it is preferable that the contact force when the member held in the holding portion is brought into contact with the force detection portion can be adjusted. With this, for example, in the case of inspecting electronic parts using the inspection section, the above-mentioned member can be brought into contact with the force detection section with a force equal to the contact force of the electronic component with respect to the inspection section during the inspection. This makes it possible to treat the contact force between the member and the force detection unit and the "contact force of the electronic component to the inspection unit" as equivalent. In the electronic component conveying device of the present invention, it is preferable that the contact force is 0.3 N or more and 600 N or less. For example, in the case of inspecting electronic parts using the inspection section, the range of such values is the same as the range of values that can be taken by the contact force of the electronic parts to the inspection section during inspection. Thereby, the contact force of the above-mentioned member to the force detection unit and the "contact force of the electronic component to the inspection unit" can be treated as equivalent. In the electronic component conveying device of the present invention, it is preferable that a mounting portion on which the above-mentioned electronic component is placed can be arranged, and that the holding portion can be adjusted when the electronic component held on the holding portion is placed on the placing portion. Posture adjustment section. Thus, for example, in a case where the mounting portion is an electric inspector of an electronic component, it is possible to facilitate full contact between each terminal of the electronic component and each terminal of the mounting portion. The electronic component transporting device of the present invention is characterized by including: a holding portion that can hold a member; a movable portion that can move electronic components on it; a force detection portion that is provided on the movable portion and can detect a force; And a memory unit that can memorize the detection result detected by the force detection unit. With this, for example, in the case of inspecting electronic parts using the inspection section, the actual contact force when the electronic parts held in the holding section abut the inspection section can be replaced with the contact force detected by the force detection section. . In addition, based on the magnitude of the abutment force detected by the force detection section, it can be determined whether the abutment force at the time of the inspection of the electronic component is an appropriate size for the electronic component. The contact force detected by the force detection unit is stored in the memory unit. In addition, as the force detection unit, for example, a load cell can be used, and the load cell is provided in a movable portion that can relatively easily secure its installation space. Thereby, the force can be detected with a simple structure. The electronic component inspection device of the present invention is characterized by including: a holding portion that can hold a member; a movable portion that can move an electronic component on it; a force detection portion that is provided on the movable portion and can detect a force; And an inspection unit that inspects the electronic components; and that the member held in the retaining portion can be brought into contact with the force detecting portion. Therefore, when the inspection of the electronic parts is performed by the inspection section, the actual contact force when the electronic parts held in the holding section abut the inspection section can be replaced with the contact force detected by the force detection section. In addition, based on the magnitude of the abutment force detected by the force detection section, it can be determined whether the abutment force at the time of the inspection of the electronic component is an appropriate size for the electronic component. In addition, since the electronic component can be transported to the inspection unit, the inspection of the electronic component can be performed by the inspection unit. In addition, electronic parts after inspection can be transported from the inspection section.

以下，基於隨附圖式所示之較佳實施形態，對本發明之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。＜第1實施形態＞以下，參照圖1~圖8，對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明。再者，以下為方便說明，如圖1所示，將相互正交之3軸設為X軸、Y軸、及Z軸。又，包含X軸及Y軸之XY平面成為水平，Z軸成為鉛垂。又，亦將與X軸平行之方向稱為「X方向(第1方向)」，亦將與Y軸平行之方向稱為「Y方向(第2方向)」，亦將與Z軸平行之方向稱為「Z方向(第3方向)」。又，將各方向之箭頭朝向之方向稱為「正」，將其相反方向稱為「負」。又，本案說明書中所謂「水平」，並不限定於完全水平，只要不妨礙電子零件之搬送，亦包括相對於水平略微(例如未達5°左右)傾斜之狀態。又，有將圖1及圖3~圖8中(關於圖9~圖11亦相同)之上側稱為「上」或「上方」，將下側稱為「下」或「下方」之情況。本實施形態之電子零件搬送裝置10具備：作為第1基部之缸體511；作為第1滑動部之活塞512，其可相對於缸體511滑動；作為第2基部之第1塊體32、第2塊體33、及第3塊體34，其等配置於活塞512；以及作為第2滑動部之吸附噴嘴31，其可相對於第1塊體32、第2塊體33、及第3塊體34滑動，且可抵接於電子零件；且於作為第1基部之缸體511與作為第1滑動部之活塞512之間形成有容積可變動之第1空間S1，於作為第2基部之第3塊體34與作為第2滑動部之吸附噴嘴31之間形成有容積可變動之第2空間S2。藉此，即便電子零件存在個體差異，亦可藉由調節第1空間S1及第2空間S2內之作動流體R之壓力或流入量而抵消該差異。而且，例如利用檢查部16進行對電子零件之電性檢查時，無論電子零件之個體差異如何，均可使電子零件之各端子均勻地抵接於檢查部16之各端子，由此可準確地進行該檢查。又，本實施形態之電子零件檢查裝置1具有本實施形態之電子零件搬送裝置10，進而具備對電子零件進行檢查之檢查部16。即，本實施形態之電子零件檢查裝置1具備：作為第1基部之缸體511；作為第1滑動部之活塞512，其可相對於缸體511滑動；作為第2基部之第1塊體32、第2塊體33、及第3塊體34，其等配置於活塞512；作為第2滑動部之吸附噴嘴31，其可相對於第1塊體32、第2塊體33、及第3塊體34滑動，且可抵接於電子零件；以及檢查部16，其對電子零件進行檢查；且於作為第1基部之缸體511與作為第1滑動部之活塞512之間形成有容積可變動之第1空間S1，於作為第2基部之第3塊體34與作為第2滑動部之吸附噴嘴31之間形成有容積可變動之第2空間S2。藉此，可獲得具有上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將電子零件搬送至檢查部16，由此，可利用檢查部16進行對該電子零件之檢查。又，可自檢查部16搬送檢查後之電子零件。以下，對各部之構成進行說明。如圖1及圖2所示，內置電子零件搬送裝置10之電子零件檢查裝置1係搬送例如作為BGA(Ball Grid Array，球柵陣列)封裝體之IC器件等電子零件，且於該搬送過程中對電子零件之電氣特性進行檢查、測試(以下簡稱為「檢查」)之裝置。再者，以下為方便說明，以使用IC器件作為上述電子零件之情形為代表進行說明，將其設為「IC器件90」。IC器件90於本實施形態中成為呈平板狀者。又，於IC器件90之下表面配置有半球狀之複數個端子901。再者，作為IC器件，除上述者以外，例如可列舉「LSI(Large Scale Integration，大型積體電路)」「CMOS(Complementary Metal Oxide Semiconductor，互補金屬氧化物半導體)」「CCD(Charge Coupled Device，電荷耦合器件)」、或將複數個IC器件模組封裝化而成之「模組IC」，又，可列舉「晶體器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺儀感測器」及「指紋感測器」等。又，電子零件檢查裝置1(電子零件搬送裝置10)係預先搭載針對IC器件90之每一種類而更換之被稱為「變換套組」者而使用。於該變換套組具有載置IC器件90之載置部，作為該載置部，例如具有後述之溫度調整部12及器件供給部14等。又，作為載置IC器件90之載置部，除如上所述之變換套組以外，亦有使用者準備之檢查部16及托盤200。電子零件檢查裝置1具備托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5，該等區域如後所述般被各壁部分隔開。而且，IC器件90自托盤供給區域A1至托盤去除區域A5沿箭頭α₉₀ 方向依序經過上述各區域，於中途之檢查區域A3進行檢查。如此，電子零件檢查裝置1具備作為於各區域搬送IC器件90之電子零件搬送裝置10之機械手、於檢查區域A3內進行檢查之檢查部16、及控制部800。又，此外，電子零件檢查裝置1具備監視器300、信號燈400及操作面板700。再者，電子零件檢查裝置1係配置有托盤供給區域A1及托盤去除區域A5之方向、即圖2中之下側成為正面側，配置有檢查區域A3之方向、即圖2中之上側成為背面側而使用。托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200的供材部。托盤供給區域A1中可堆疊多個托盤200。供給區域A2係供將自托盤供給區域A1搬送之托盤200上之複數個IC器件90分別搬送及供給至檢查區域A3之區域。再者，設置有以跨越托盤供給區域A1與供給區域A2之方式於水平方向上逐一搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A係可使托盤200連同載置於該托盤200之IC器件90一起朝Y方向正側、即圖2中之箭頭α_11A 方向移動之移動部。藉此，可將IC器件90穩定地送入至供給區域A2。又，托盤搬送機構11B係可使空托盤200朝Y方向負側、即圖2中之箭頭α_11B 方向移動之移動部。藉此，可使空托盤200自供給區域A2移動至托盤供給區域A1。於供給區域A2設置有溫度調整部(均熱板(英文表記：soak plate，中文表記(一例)：均溫板))12、器件搬送頭13及托盤搬送機構15。溫度調整部12係作為載置複數個IC器件90之載置部而構成，可對該載置之IC器件90一次性加熱或冷卻，被稱為「均熱板」。藉由該均熱板，可對利用檢查部16進行檢查之前之IC器件90預先進行加熱或冷卻，而調整為適於該檢查(高溫檢查或低溫檢查)之溫度。於圖2所示之構成中，溫度調整部12於Y方向上配置固定有2個。而且，藉由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90被搬送至任一溫度調整部12。再者，藉由將作為該載置部之溫度調整部12固定，可對該溫度調整部12上之IC器件90穩定地進行溫度調整。器件搬送頭13以可沿X方向及Y方向移動之方式支持於供給區域A2內，進而具有亦可沿Z方向移動之部分。藉此，器件搬送頭13可負責自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14之間之IC器件90之搬送。再者，圖2中，將器件搬送頭13之X方向之移動以箭頭α_13X 表示，將器件搬送頭13之Y方向之移動以箭頭α_13Y 表示。托盤搬送機構15係將所有IC器件90均被去除之狀態之空托盤200於供給區域A2內朝X方向正側、即箭頭α₁₅ 方向搬送之機構。而且，於該搬送後，空托盤200藉由托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。檢查區域A3係對IC器件90進行檢查之區域。於該檢查區域A3設置有對IC器件90進行檢查之檢查部16、及具有吸引部3之器件搬送頭17。又，亦設置有以跨越供給區域A2與檢查區域A3之方式移動之器件供給部14、及以跨越檢查區域A3與回收區域A4之方式移動之器件回收部18。器件供給部14係作為載置利用溫度調整部12進行了溫度調整之IC器件90之載置部而構成，係可將該IC器件90搬送至檢查部16附近之被稱為「供給用梭形板」或簡稱為「供給梭」者。又，作為該載置部之器件供給部14可於供給區域A2與檢查區域A3之間沿X方向、即沿箭頭α₁₄ 方向往返移動地被支持。藉此，器件供給部14可將IC器件90自供給區域A2穩定地搬送至檢查區域A3之檢查部16附近，又，於檢查區域A3藉由器件搬送頭17卸去IC器件90後，可再次返回至供給區域A2。於圖2所示之構成中，器件供給部14於Y方向上配置有2個，溫度調整部12上之IC器件90被搬送至任一器件供給部14。又，器件供給部14係與溫度調整部12同樣地，以可對載置於該器件供給部14之IC器件90進行加熱或冷卻之方式構成。藉此，對於利用溫度調整部12進行了溫度調整之IC器件90，可維持其溫度調整狀態而搬送至檢查區域A3之檢查部16附近。器件搬送頭17係固持維持上述溫度調整狀態之IC器件90並於檢查區域A3內搬送該IC器件90之動作部。該器件搬送頭17可於檢查區域A3內沿Y方向及Z方向往返移動地被支持，成為被稱為「指臂」之機構之一部分。藉此，器件搬送頭17可將自供給區域A2搬入之器件供給部14上之IC器件90搬送並載置於檢查部16上。再者，於圖2中，將器件搬送頭17之Y方向之往返移動以箭頭α_17Y 表示。又，器件搬送頭17可沿Y方向及Z方向往返移動地被支持，但並不限定於此，亦可亦能沿X方向往返移動地被支持。又，器件搬送頭17係與溫度調整部12同樣地以可對所固持之IC器件90進行加熱或冷卻之方式構成。藉此，可將IC器件90之溫度調整狀態自器件供給部14持續維持至檢查部16。再者，器件搬送頭17分為器件搬送頭17A及器件搬送頭17B，該等亦可獨立地移動。檢查部16係作為載置電子零件即IC器件90並對該IC器件90之電氣特性進行檢查之載置部而構成。於該檢查部16設置有與IC器件90之端子901電性連接之複數個探針接腳163(參照圖4及圖5)。而且，藉由IC器件90之端子901與探針接腳163電性連接、即進行接觸，可進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之測試機所具備之檢查控制部中記憶之程式而進行。再者，於檢查部16中，亦可與溫度調整部12同樣地對IC器件90進行加熱或冷卻而將該IC器件90調整為適於檢查之溫度。器件回收部18係作為載置利用檢查部16結束檢查之IC器件90，且可將該IC器件90搬送至回收區域A4之載置部而構成，被稱為「回收用梭形板」或簡稱為「回收梭」。又，器件回收部18可於檢查區域A3與回收區域A4之間沿X方向、即沿箭頭α₁₈ 方向往返移動地被支持。又，於圖2所示之構成中，器件回收部18係與器件供給部14同樣地於Y方向上配置有2個，檢查部16上之IC器件90被搬送並載置於任一器件回收部18。該搬送係由器件搬送頭17進行。回收區域A4係回收於檢查區域A3進行檢查，且該檢查結束之複數個IC器件90之區域。於該回收區域A4設置有回收用托盤19、器件搬送頭20及托盤搬送機構21。又，於回收區域A4亦準備空托盤200。回收用托盤19係載置利用檢查部16檢查後之IC器件90之載置部，以不於回收區域A4內移動之方式固定。藉此，即便為配置有較多之器件搬送頭20等各種可動部之回收區域A4，亦可將檢查完成之IC器件90穩定地載置於回收用托盤19上。再者，於圖2所示之構成中，回收用托盤19沿X方向配置有3個。又，空托盤200亦沿X方向配置有3個。該空托盤200亦成為載置利用檢查部16檢查後之IC器件90之載置部。而且，移動至回收區域A4之器件回收部18上之IC器件90被搬送並載置於回收用托盤19及空托盤200中之任一者。藉此，IC器件90按照每一檢查結果而被分類回收。器件搬送頭20可於回收區域A4內沿X方向及Y方向移動地被支持，進而具有亦可沿Z方向移動之部分。藉此，器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空托盤200。再者，於圖2中，將器件搬送頭20之X方向之移動以箭頭α_20X 表示，將器件搬送頭20之Y方向之移動以箭頭α_20Y 表示。托盤搬送機構21係將自托盤去除區域A5搬入之空托盤200於回收區域A4內沿X方向、即沿箭頭α₂₁ 方向搬送之機構。而且，於該搬送後，空托盤200配置於回收IC器件90之位置，即，可為上述3個空托盤200中之任一者。托盤去除區域A5係將排列有檢查完成狀態之複數個IC器件90之托盤200回收、去除之除材部。托盤去除區域A5中可堆疊多個托盤200。又，設置有以跨越回收區域A4與托盤去除區域A5之方式於Y方向上逐一搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係可使托盤200沿Y方向、即沿箭頭α_22A 方向往返移動之移動部。藉此，可將檢查完成之IC器件90自回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B可使用以回收IC器件90之空托盤200朝Y方向正側、即箭頭α_22B 方向移動。藉此，可使空托盤200自托盤去除區域A5移動至回收區域A4。控制部800可控制例如托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B等各部之作動。操作員可經由監視器300設定及確認電子零件檢查裝置1之動作條件等。該監視器300具有以例如液晶畫面構成之顯示畫面301，配置於電子零件檢查裝置1之正面側上部。如圖1所示，於托盤去除區域A5之圖中之右側設置有載置滑鼠之滑鼠台600。該滑鼠係於操作顯示於監視器300之畫面時使用。又，相對於監視器300，於圖1之右下方配置有操作面板700。操作面板700係與監視器300分開地對電子零件檢查裝置1命令所期望之動作者。又，信號燈400可藉由發光之顏色之組合而報知電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。再者，於電子零件檢查裝置1內置有揚聲器500，亦可藉由該揚聲器500而報知電子零件檢查裝置1之作動狀態等。電子零件檢查裝置1係藉由第1間隔壁231而將托盤供給區域A1與供給區域A2之間隔開，藉由第2間隔壁232而將供給區域A2與檢查區域A3之間隔開，藉由第3間隔壁233而將檢查區域A3與回收區域A4之間隔開，藉由第4間隔壁234而將回收區域A4與托盤去除區域A5之間隔開。又，供給區域A2與回收區域A4之間亦藉由第5間隔壁235而隔開。電子零件檢查裝置1之最外裝由外殼覆蓋，該外殼有例如前外殼241、側外殼242、側外殼243、後外殼244、及頂外殼245。如上所述，器件搬送頭17可沿Y方向及Z方向移動地被支持。器件搬送頭17係於檢查區域A3內搬送IC器件90者。如圖3~圖5所示，器件搬送頭17具備吸引部3、姿勢調整部5及隔熱部6。吸引部3係構成為可藉由吸引(吸附)而固持電子零件即IC器件90之吸引單元。該吸引部3具有吸附噴嘴31、第1塊體32、第2塊體33及第3塊體34。再者，吸引部3之設置數量於圖3~圖5所示之構成中為1個，但並不限定於此，亦可為複數個。作為真空產生源之噴射器72對吸引部3賦予吸引力F₃ 。藉由噴射器72之作動而產生負壓，藉由作為調壓機構之調節器73而適當調整壓力，經由配管71、接頭36而使內腔部324及內腔部333成為負壓。吸附噴嘴31係可吸附IC器件90者，包含具有於上表面311及下表面312開口之內腔部313之圓筒狀構件。內腔部313作為空氣通過之流路發揮功能。而且，內腔部324及內腔部333成為負壓，藉由使與其連通之內腔部313成為負壓，即空氣於內腔部313內朝向上方流動，於下表面312之開口部(吸引口)314產生吸引力F₃ 。藉此，可將下表面312作為吸附面而吸附IC器件90。又，藉由空氣流入內腔部313而壓力上升，即空氣於內腔部313內朝向下方流動、或空氣向上方之流動停止，吸引力F₃ 減少，最終消失，可使IC器件90自下表面312釋放(脫離)。再者，以下有將吸引IC器件90之方向、即吸引力F₃ 作用之方向稱為「吸引方向α₃ 」之情況。又，吸引方向α₃ 朝向Z方向正側(參照圖4)。又，吸引力F₃ 之最大值(吸引部3之最大吸引力)並無特別限定，例如較佳為-95 kPa以上且-30 kPa以下，更佳為-90 kPa以上且-50 kPa以下。進而，構成為可藉由調節器73之壓力設定而變更吸引部3之吸引力F₃ 。再者，作為調節器73，例如較佳為使用電子調節器。藉此，可無階段地變更(調整)吸引力F₃ 。藉由此種吸引力F₃ ，可調整利用安裝於吸附噴嘴31之墊圈35(例如本實施形態中為O形環)予以密封之區域之真空度。再者，於本實施形態中，吸附噴嘴31之真空度設為固定。於吸附噴嘴31之外周部，於其長度方向中途突出地形成有外徑擴大之凸緣部315。凸緣部315可抵接於第3塊體34而防止吸附噴嘴31自吸引部3脫落(參照圖3)。再者，於凸緣部315之外周部與凹部343之內周部之間設置有墊圈43。藉此，可保持第2空間S2之壓力。又，於吸附噴嘴31之外周部，於較凸緣部315靠上方形成有溝槽316。溝槽316沿吸附噴嘴31之圓周方向形成為環狀。而且，於該溝槽316配置有環狀之墊圈35。藉此，墊圈35於吸附噴嘴31與第2塊體33之間被壓縮。於吸附噴嘴31之上方配置有第1塊體32。該第1塊體32包含具有平坦之上表面321及下表面322之塊狀(或板狀)之構件。又，第1塊體32具有於下表面322及側面323開口之內腔部324。該內腔部324係與吸附噴嘴31之內腔部313同樣地作為空氣通過之流路發揮功能。又，於內腔部324自側面323側氣密性地連接有接頭36。接頭36經由配管71而與噴射器72連接。又，於配管71之中途、即接頭36與噴射器72之間配置有調節器73。又，亦可於第1塊體32內置對吸附於例如吸附噴嘴31之IC器件90進行加熱之加熱器(未圖示)。於第1塊體32之下方配置有第2塊體33。該第2塊體33包含具有平坦之上表面331及下表面332之塊狀(或板狀)之構件，上表面331與第1塊體32之下表面322相接。第2塊體33具有於上表面331及下表面332開口之內腔部333。於內腔部333插入有較吸附噴嘴31之凸緣部315靠上側之部分。藉此，吸附噴嘴31可沿Z方向移動。又，內腔部333亦作為空氣通過之流路發揮功能，經由該內腔部333而將吸附噴嘴31之內腔部313與第1塊體32之內腔部324連通。藉此，形成空氣通過之一系列流路。於第2塊體33之上表面331側，於上表面331敞開之溝槽334與內腔部333同心地呈環狀形成。於該溝槽334配置有環狀之墊圈37。藉此，墊圈37於第1塊體32與第2塊體33之間被壓縮，可與墊圈35一起維持上述一系列流路之氣密性。於第2塊體33之下表面332側，於下表面332敞開之溝槽335與內腔部333同心地呈環狀形成。又，第2塊體33具有將溝槽335之內周面與第2塊體33之外周部連通之內腔部336。於該內腔部336自外側氣密性地連接有接頭41。接頭41經由配管8(配管81)連接於作動流體供給部85。作動流體供給部85對後述之第1空間S1及第2空間S2供給作動流體R(例如空氣)。藉由於第1空間S1與第2空間S2設置共用之作動流體供給部，可簡化裝置構成。進而，可省略於第1空間S1與第2空間S2分別設置專用之作動流體供給部。由此，可進一步簡化裝置構成。又，藉由作動流體R可於第1空間S1及第2空間S2進出，如後所述，活塞512可於缸體511內滑動並且吸附噴嘴31可於貫通孔344內滑動。此處，供給至第1空間S1與第2空間S2之作動流體R之壓力於本實施形態中為相同之壓力，但亦可不同。再者，作動流體供給部85除進行作動流體之供給以外，亦可進行吸引(作動流體R之回收)。於第2塊體33之下方配置有第3塊體34。第3塊體34包含具有平坦之上表面341及下表面342之塊狀(或板狀)之構件，上表面341與第2塊體33之下表面332相接。於第3塊體34之上表面341側，形成有於上表面341敞開且於俯視下大於吸附噴嘴31之凸緣部315之凹部343。凸緣部315可於該凹部343內沿Z方向移動。而且，如圖3所示，於凸緣部315抵接於凹部343之底部之狀態下，限制吸附噴嘴31於下側之位置之移動極限，由此可防止吸附噴嘴31之脫落。與此相反，於凸緣部315抵接於第2塊體33之下表面332之狀態下，限制吸附噴嘴31於上側之位置之移動極限。再者，以可對應於各種IC器件90之厚度之方式充分確保吸附噴嘴31之可移動之可動區域。又，凹部343與溝槽335連通，將凹部343與溝槽335對準所得之空間作為供給作動流體R之第2空間S2發揮功能。又，於凹部343之底部形成有貫通至下表面342之貫通孔344。無論吸附噴嘴31之位置如何，較凸緣部315靠下側之部分均可自貫通孔344突出。於第3塊體34形成有自上表面341貫通至下表面342之導孔345。於圖3~圖5所示之構成中，導孔345形成有2個。於各導孔345插入檢查部16之導銷164。藉此，於吸附噴嘴31(吸引部3)將IC器件90按壓至檢查部16時，進行IC器件90與檢查部16之定位。藉由該定位，可使IC器件90之各端子901與檢查部16之各探針接腳163接觸。於較吸引部3靠上方配置有姿勢調整部5。姿勢調整部5係於圖5所示之狀態下調整吸引部3之姿勢之被稱為「順從單元」者。姿勢調整部5具有第1調整機構51及第2調整機構52。第1調整機構51負責吸引部3之姿勢調整中吸引部3之繞X軸之姿勢調整、及吸引部3之繞Y軸之姿勢調整。第1調整機構51具有缸體511及可相對於缸體511沿Z方向滑動之活塞512。缸體511於內側具有內腔部513。於該內腔部513之內側插入有活塞512。活塞512具有凸緣部514、及連結凸緣部514與第2調整機構52之活塞連桿515。又，凸緣部514之外周部帶有弧度。藉此，活塞512之帶有弧度之外周部能以活塞512之中心軸傾斜之方式變更姿勢。由此，活塞512能以模仿檢查部16之抵接部162之面之朝向之方式變更姿勢。再者，亦可省略活塞512之弧度而設置與活塞512分開之墊圈。於此情形時，只要墊圈包含彈性體，則可與上述同樣地，活塞512以其中心軸傾斜之方式變更姿勢。又，如圖3所示，於缸體511設置有貫通內周部與外周部之貫通孔516。於該貫通孔516自外側氣密性地連接有接頭42。接頭42經由配管8(配管82)連接於作動流體供給部85。再者，配管8成為自中途分支為配管81及配管82之構成。又，於配管8之分支點86與作動流體供給部85之間設置有儲箱83及調節器84。調節器84配置於較儲箱83靠作動流體供給部85側。再者，調節器84可設為與調節器73相同之構成。儲箱83係可於內側貯存自作動流體供給部85供給之作動流體R者，作為作動流體R之貯存槽或緩衝槽發揮功能。又，儲箱83之內部空間經由配管81而與第2空間S2連通。即，儲箱83作為與第2空間S2連通之第3空間發揮功能。藉此，即便藉由吸附噴嘴31之移動而使第2空間S2之壓力變動，亦會由於與儲箱83連通而作動流體R逸出至儲箱83或作動流體R自第3空間流入至儲箱83。由此，可緩和第2空間S2之內壓之變動。其結果為，吸附噴嘴31可穩定地按壓IC器件90。如此，儲箱83作為緩和第2空間S2之壓力之變動之緩和部發揮功能。於第1調整機構51之下方配置有第2調整機構52。第2調整機構52具有於Z方向上重疊之2片板構件521。該等2片板構件521可相對地沿XY平面方向移動。藉此，第2調整機構52可負責吸引部3之姿勢調整中吸引部3之X方向之姿勢調整、吸引部3之Y方向之姿勢調整、及吸引部3之繞Z軸之姿勢調整。又，姿勢調整部5係經由連結部171而連結於支持器件搬送頭17整體使之可沿Y方向及Z方向往返移動之機構(未圖示)。於吸引部3與姿勢調整部5之間配置有隔熱部6。隔熱部6可防止或抑制來自內置於第1塊體32之上述加熱器之熱傳遞至姿勢調整部5。藉此，姿勢調整部5防止因上述熱而引起誤動作，由此可正常地作動，即，可準確地調整吸引部3之姿勢。於本實施形態中，隔熱部6包含呈柱狀之複數個隔熱構件61。各隔熱構件61之導熱率相對較小，並且複數個相互隔開而配置。再者，作為隔熱構件61之構成材料，並無特別限定，例如可使用如玻璃環氧樹脂等般之各種隔熱材料。第1塊體32與板構件521由相互隔開之隔熱構件61連接，且由於各隔熱構件61間為空隙，故而抑制第1塊體32與板構件521之導熱。如上所述，於檢查區域A3內配置有檢查部16。檢查部16係載置電子零件即IC器件90之載置部，且係於該載置狀態下進行對IC器件90之檢查之插口。如圖4及圖5所示，檢查部16具有檢查部本體161、抵接部162、探針接腳163、及導銷164。檢查部本體161凹陷形成有載置收納IC器件90之凹部(凹穴)165。再者，凹部165之形成數量於圖4及圖5所示之構成中為1個，但並不限定於此，亦可為複數個。於凹部165之底部突出地配置有與IC器件90之端子901相同數量之探針接腳163。又，檢查部(載置部)16具有將載置於檢查部(載置部)16之電子零件即IC器件90朝吸引方向α₃ 施力之電子零件施力部166。該電子零件施力部166包含內置於各探針接腳163之螺旋彈簧。藉此，可與自吸引部3側對IC器件90之按壓相輔相成地，使IC器件90之各端子901與各探針接腳163充分地接觸。由此，可準確地進行對IC器件90之檢查。如上所述，於檢查區域A3內可配置作為載置部之檢查部16，該檢查部16載置電子零件即IC器件90。而且，作為該載置部之檢查部16具有抵接部162。抵接部162包含板狀構件，重疊地設置於檢查部本體161上。藉此，抵接部162可與器件搬送頭17所具備之吸引部3之第3塊體34之下表面342抵接。又，器件搬送頭17具有可調整吸引部3之姿勢之姿勢調整部5。此處，例如嘗試假定檢查部16整體相對於XY平面(水平面)傾斜1度之情形。於此種情形時，如圖5所示，亦於吸引部3與抵接部162抵接之狀態下，藉由姿勢調整部5使吸引部3模仿與檢查部16相同之傾斜姿勢。此種吸引部3之姿勢調整有助於IC器件90之各端子901與各探針接腳163之接觸。導銷164係對應於吸引部3之各導孔345而配置於檢查部本體161。各導銷164固定於檢查部本體161，朝向上方突出。而且，如上所述，藉由導銷164插入至吸引部3之導孔345，而進行IC器件90與檢查部16之定位。藉此，可使IC器件90之各端子901與檢查部16之各探針接腳163接觸。此外，於吸附於吸附噴嘴31之IC器件90中，將吸附噴嘴31之下表面(吸附面)312作為基準時，有自下表面312至各端子901為止之距離H₉₀ 產生不均之情況。作為其原因，例如可列舉如下個體差異：即便為相同種類之IC器件90，IC器件90之厚度亦存在差異(不均)，即厚度之誤差存在大小(參照圖6及圖7)，或者此外，IC器件90產生翹曲(圖8參照)等。再者，圖6表示IC器件90自身存在厚度之大小之狀態，圖7表示即便為相同種類之IC器件90彼此亦具有較薄之IC器件90或較厚之IC器件90之狀態，圖8表示IC器件90自身翹曲之狀態。例如於距離H₉₀ 相對較小之情形時，有於各端子901中存在無法到達檢查部16之探針接腳163之端子901之情況。於此情形時，變得接觸不良，難以進行準確之檢查。又，於距離H₉₀ 相對較大之情形時，各端子901可到達並接觸於檢查部16之探針接腳163，但有存在該接觸壓力過度之端子901之情況。於此情形時，亦難以進行準確之檢查。因此，本實施形態之電子零件檢查裝置1(電子零件搬送裝置10)成為可消除此種現象之構成。以下，參照圖3~圖5對該構成及作用進行說明。[1]如圖3所示，器件搬送頭17成為IC器件90尚未被吸引至吸引部3之狀態。再者，此時噴射器72進行吸引。又，對第1空間S1及第2空間S2供給作動流體R，第1空間S1及第2空間S2成為正壓。藉由第2空間S2成為正壓，吸附噴嘴31之凸緣部315成為抵接於第3塊體34之狀態。[2]繼而，該器件搬送頭17可利用吸引部3吸引進入檢查區域A3之器件供給部14上之IC器件90。藉此，器件搬送頭17成為圖4所示之狀態。於該圖4所示之狀態下，IC器件90藉由吸引力F₃ 而被吸附至吸附噴嘴31。又，如上所述，吸附IC器件90時，吸附噴嘴31向較圖3所示之狀態更靠Z方向正側(吸引方向α₃ )移動。即，吸附噴嘴31之凸緣部315成為自第3塊體34隔開之狀態。繼而，於吸附IC器件90之狀態下，藉由使器件搬送頭17移動，可將該吸附之IC器件90配置於檢查部16之凹部165之正上方。[3]其後，如圖5所示，器件搬送頭17可下降至吸引部3抵接於檢查部16為止。藉此，吸引部3可一面模仿檢查部16之姿勢一面將IC器件90按壓且收納於檢查部16之凹部165 (以下，將該狀態稱為「按壓收納狀態」)。此時，吸附噴嘴31經由IC器件90而受到來自檢查部16之反作用力，較圖4所示之狀態進一步向Z方向正側移動。即，於按壓收納狀態下，吸附噴嘴31之凸緣部315與第3塊體34之隔開距離較圖4所示之狀態進一步變大。如此，於圖5所示之按壓收納狀態下，吸附噴嘴31與第3塊體34隔開，因此藉由將作動流體R進而供給至第2空間S2，吸附噴嘴31可向-Z方向移動。由此，可經由吸附噴嘴31將IC器件90朝向檢查部16以適於檢查之力適度地施力。藉此，如例如圖6~圖8所示，無論距離H₉₀ 之大小如何，均可使IC器件90之各端子901與檢查部16之探針接腳163恰如其分且均勻地接觸(抵接)，由此可準確地進行對IC器件90之檢查。尤其，根據IC器件90之個體差異(上表面之凹凸形狀等)之程度，吸引力F3'之大小於每一IC器件90不同，於按壓收納狀態下，吸附噴嘴31有成為與第3塊體34接觸之狀態之可能性。於此情形時，難以藉由吸附噴嘴31將IC器件90相對於檢查部16之凹部165進一步按壓。相對於此，於電子零件搬送裝置10中，可調節作動流體R向第2空間S2之供給量。藉此，於按壓收納狀態下，能以吸附噴嘴31相對於第3塊體34離開之方式調節作動流體R之供給量。由此，於按壓收納狀態下，可藉由吸附噴嘴31將IC器件90相對於檢查部16之凹部165進一步按壓。又，作為第2基部之第3塊體34可抵接於作為載置IC器件(電子零件)90之電子零件載置部之檢查部16。藉此，第3塊體34按壓檢查部16，而可使第3塊體34之姿勢成為模仿檢查部16之抵接部162之形狀之狀態。由此，可於該模仿之狀態下使吸附噴嘴31抵接於IC器件90。其結果為，可進一步確實地使IC器件90之各端子901與檢查部16之探針接腳163恰如其分且均勻地接觸(抵接)，由此，可準確地進行對IC器件90之檢查。又，如圖3所示，作為第1滑動部之活塞512之凸緣部514承受第1空間S1內之作動流體R之第1受壓面M1之面積，大於作為第2滑動部之吸附噴嘴31承受第2空間S2內之作動流體R之第2受壓面M2之面積。藉此，如本實施形態所示，於對第1空間S1與第2空間S2供給相同量之作動流體R之構成中，可使第2受壓面M2自作動流體R受到之力小於第1受壓面M1自作動流體R受到之力。其結果為，可使吸附噴嘴31按壓IC器件90之力(第2抵接力)小於第3塊體34按壓檢查部16之力(第1抵接力)。由此，可防止吸附噴嘴31過度地按壓IC器件90。如此，於電子零件搬送裝置10中，作為第2滑動部之吸附噴嘴31抵接於IC器件(電子零件)90之抵接力(第2抵接力)，與作為第2基部之一部分之第3塊體34抵接於作為電子零件載置部之檢查部16之抵接力(第1抵接力)不同。於本實施形態中，如上所述，第2抵接力小於第1抵接力，因此可防止吸附噴嘴31過度地按壓IC器件90。又，第1受壓面M1所按壓者係作為較第1受壓面M1靠下側之部分之吸引部3整體。相對於此，第2受壓面M2所按壓者係作為較第2受壓面M2靠下方之部分之吸附噴嘴31之一部分。因此，較佳為第1受壓面M1之按壓力大於第2受壓面M2之按壓力。因此，第1受壓面M1之面積變得大於第2受壓面M2之面積。再者，第1受壓面M1之面積較佳為第2受壓面M2之面積之2倍以上且20倍以下，更佳為3倍以上且15倍以下。藉此，可更確實地發揮上述效果。再者，於本實施形態中，作為第1滑動部之活塞512與作為第2基部之第3塊體34分開構成，但該等亦可一體形成。＜第2實施形態＞以下，參照圖9對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。本實施形態除電子零件、第2基部、及檢查部之構成不同以外，與第1實施形態相同。本實施形態中，IC器件90具有基板902及於基板902之+Z側之面突出設置之突出部903。再者，於基板902之-Z側之面設置有複數個端子901。又，突出部903之俯視下之大小係與吸附噴嘴31之下端面大致相同之大小。又，於電子零件搬送裝置10中，檢查部16之凹部165成為基板902可進入之大小。又，於本實施形態中，配管81與配管82由相互獨立之流路構成，於配管81與配管82分別連接有儲箱83、調節器84、及作動流體供給部85。藉此，可獨立地調整第1空間S1與第2空間S2之壓力。即，可分別變更作動流體R向第1空間S1之壓力與作動流體R向第2空間S2之壓力，且可分別個別地設定。由此，可獨立地調整吸附噴嘴31按壓IC器件90之力與第3塊體34按壓IC器件90及檢查部16之力。此種構成雖未圖示，但可省略設計第1受壓面M1與第2受壓面M2之比成為所期望之數值，因此有利。再者，第1空間S1與第2空間S2之壓力之設定可設為於圖1所示之監視器300上進行操作之構成。又，藉由設為此種構成，可使作為第2滑動部之吸附噴嘴31抵接於IC器件(電子零件)90之抵接力，與作為第2基部之一部分之第3塊體34抵接於IC器件(電子零件)90之抵接力不同。藉此，例如於欲減小向基板902之負載之情形時，可使向基板902之抵接力弱於向突出部903之抵接力，或於欲減小向突出部903之負載之情形時，可使向突出部903之抵接力弱於向基板902之抵接力。又，於電子零件搬送裝置10中，吸引部3之第3塊體34具有自下表面342向-Z方向突出之突出部346。該突出部346於按壓收納狀態下進入至檢查部16之凹部165。又，突出部346於按壓收納狀態下與IC器件90之基板902抵接。即，作為第2基部之一部分之突出部346可抵接於作為IC器件(電子零件)90之一部分之基板902。藉此，突出部346可按壓IC器件90之基板902。又，於按壓收納狀態下，IC器件90之突出部903進入至第3塊體34之貫通孔344，且藉由吸附噴嘴31進行按壓。作為第2基部之一部分之第3塊體34之突出部346與作為第2滑動部之吸附噴嘴31相對於IC器件(電子零件)90於不同之位置抵接。藉此，突出部346可按壓IC器件90之基板902，吸附噴嘴31可按壓IC器件90之突出部903。又，於按壓收納狀態下，第3塊體34之下表面342與檢查部16之抵接部162抵接，檢查部16被第3塊體34按壓。如此，於本實施形態中，吸附噴嘴31按壓IC器件90之突出部903，第3塊體34之突出部346按壓IC器件90之基板902，第3塊體34之下表面342按壓檢查部16。藉此，即便為如本實施形態之具有階差之IC器件90，亦可使IC器件90之各端子901與檢查部16之探針接腳163恰如其分且均勻地接觸(抵接)，由此可準確地進行對IC器件90之檢查。＜第3實施形態＞以下，參照圖10對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。本實施形態除電子零件及第2基部之構成不同以外，與第2實施形態相同。於本實施形態中，IC器件90係突出部903之中心S₉₀₃ 與基板902之中心S₉₀₂ 於X方向及Y方向上錯開者。即，突出部903相對於基板902偏心配置。再者，所謂「中心」係指於俯視形狀為四邊形之情形時2條對角線相交之點。又，於本實施形態中，對應於中心S₉₀₂ 與中心S₉₀₃ 之錯開，貫通孔344相對於第3塊體34之突出部346之中心於X方向及Y方向上錯開配置。即，貫通孔344相對於突出部346偏心配置。藉此，於貫通孔344內滑動之吸附噴嘴31可按壓IC器件90之突出部903。如此，於本實施形態中，即便突出部903之中心S₉₀₃ 與基板902之中心S₉₀₂ 於X方向及Y方向上錯開，亦可使IC器件90之各端子901與檢查部16之探針接腳163恰如其分且均勻地接觸(抵接)，由此，可準確地進行對IC器件90之檢查。＜第4實施形態＞以下，參照圖11對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。本實施形態除檢查部之構成不同以外，與第2實施形態相同。如圖11所示，器件供給部14係載置檢查前之IC器件(電子零件)90之檢查前電子零件載置部，器件回收部18係載置檢查後之IC器件(電子零件)90之檢查後電子零件載置部。如圖11所示，器件供給部14與器件回收部18作為可載置IC器件(電子零件)90而移動之可動部30而單元化。該可動部30除具有器件供給部14及器件回收部18以外，亦具有X方向移動機構7。器件供給部14凹陷形成有載置收納IC器件90之凹部(凹穴)141。於本實施形態中，凹部141之形成數量成為8個，其配置態樣較佳為與器件搬送頭17A或器件搬送頭17B中之8個吸引部3之配置態樣相同，即，成為分別於X方向配置有4個、於Y方向配置有2個之狀態。器件回收部18亦凹陷形成有載置收納IC器件90之凹部(凹穴)181。於本實施形態中，凹部181之形成數量成為8個，其配置態樣較佳為與器件搬送頭17中之8個吸引部3之配置態樣相同，即，成為分別於X方向配置有4個、於Y方向配置有2個之狀態。X方向移動機構7具有線性導軌71A、及一併支持器件供給部14與器件回收部18之支持基座72A。線性導軌71A具有軌道711A及2個滑塊712A。於該等2個滑塊712A上固定有支持基座72A。又，電子零件搬送裝置10具有設置於可動部30(於圖示之構成中為器件供給部14)，且可對力進行檢測之力檢測部9。力檢測部9配置於器件供給部14上之間隔件73A上。作為力檢測部9並無特別限定，例如較佳為使用荷重元。荷重元係內置有應變計，且將力之大小轉換成電氣信號之轉換器。藉此，能夠以實測值而非設計值(計算值)儘可能準確地檢測出抵接力F₉₀ 。又，力檢測部9檢測之檢測結果、即抵接力之大小記憶於控制部800之記憶部802(參照圖1)。又，力檢測部9配置於器件供給部14上之間隔件73A上，可與抵接於(吸附於)作為第2滑動部之吸附噴嘴31之IC器件(電子零件)90抵接。於此種本實施形態中，例如如圖11所示，於將IC器件90設為按壓收納狀態之前，即進行檢查之前，將IC器件90壓抵於力檢測部9，檢測出其抵接力F₉₀ 。繼而，可基於所檢測出之抵接力F₉₀ 進行按壓力之調整。又，作為檢測抵接力F₉₀ 之時序，例如較佳為於自IC器件90開始抵接於力檢測部9之位置進而於0.1 mm以上且2.0 mm以下之範圍內下降之位置進行檢測。再者，如上所述之抵接力之檢測亦可不使用IC器件90，而使用大小與IC器件90相同之力檢測構件。＜第5實施形態＞以下，參照圖12，對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。本實施形態除第1滑動部之構成不同以外，與第1實施形態相同。如圖12所示，於缸體511之內側設置有具有彈性之隔膜53。隔膜53設置於缸體511之Z方向中途且較貫通孔516靠-Z側。該隔膜53係其下表面531與活塞512之凸緣部514抵接。再者，雖然未圖示，但隔膜53於自然狀態下與X軸及Y軸平行。於本實施形態中，較該隔膜53靠+Z側之空間成為第1空間S1。如圖12所示，於活塞512將隔膜53向+Z側提昇而使隔膜53變形之狀態下，活塞512受到隔膜53欲恢復至自然狀態之恢復力。藉此，可藉由隔膜53而達到相對於XY平面之平行度。其結果為，於達到平行度之狀態下，第3塊體34可按壓檢查部16。＜第6實施形態＞以下，參照圖1及圖13~圖20對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。再者，以下為方便說明，有將圖14~圖20中(關於圖21及圖22亦同樣)之上側稱為「上」或「上方」，將下側稱為「下」或「下方」之情況。本實施形態之電子零件搬送裝置10具備：吸引部3(吸附噴嘴31)，其可藉由吸引而固持電子零件，且可於吸引電子零件之吸引方向α₃ 上移動；及作為施力部之螺旋彈簧4，其可將吸引部3(吸附噴嘴31)朝與吸引方向α₃ 相反之方向施力，且可於吸引電子零件之狀態下於吸引方向α₃ 上收縮。藉此，如後所述，即便電子零件(IC器件90)存在個體差異，亦可藉由可於吸引電子零件之狀態下收縮之螺旋彈簧4抵消該差異。而且，例如於利用檢查部16進行對電子零件之電性檢查時，無論電子零件之個體差異如何，均可使電子零件之各端子(端子901)均勻地抵接於檢查部16之各端子(探針接腳163)，由此可準確地進行該檢查。又，本實施形態之電子零件檢查裝置1係具有本實施形態之電子零件搬送裝置10者，進而具備對電子零件進行檢查之檢查部16。即，本實施形態之電子零件檢查裝置1具備：吸引部3(吸附噴嘴31)，其可藉由吸引而固持電子零件，且可於吸引電子零件之吸引方向α₃ 上移動；作為施力部之螺旋彈簧4，其可將吸引部3(吸附噴嘴31)朝與吸引方向α₃ 相反之方向施力，且可於吸引電子零件之狀態下於吸引方向α₃ 上收縮；及檢查部16，其對電子零件進行檢查。藉此，可獲得具有上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將電子零件搬送至檢查部16，由此，可利用檢查部16進行對該電子零件之檢查。又，可自檢查部16搬送檢查後之電子零件。以下，對各部之構成進行說明。如上所述，器件搬送頭17可沿Y方向及Z方向移動地被支持。器件搬送頭17係於檢查區域A3內搬送IC器件90者。如圖14~圖16所示，器件搬送頭17具有吸引部3、作為施力部之螺旋彈簧4、姿勢調整部5、及隔熱部6。作為真空產生源之噴射器72對吸引部3賦予吸引力F₃ 。藉由噴射器72之作動而產生負壓，藉由作為調壓機構之調節器73適當調整壓力，經由配管71及接頭36使內腔部324及內腔部333成為負壓。吸引力F₃ 之最大值(吸引部3之最大吸引力)並無特別限定，例如較佳為-95 kPa以上且-30 kPa以下，更佳為-90 kPa以上且-50 kPa以下。進而，構成為可藉由調節器73之壓力設定而變更吸引部3之吸引力F₃ 。再者，作為調節器73，例如較佳為使用電子調節器。藉此，可無階段地變更(調整)吸引力F₃ 。藉由此種吸引力F₃ ，可調整利用安裝於吸附噴嘴31之墊圈35(例如本實施形態中為O形環)予以密封之區域之真空度。真空度成為提拉吸附噴嘴31之力(面積×真空度)，可將螺旋彈簧4之按壓力降低該提拉力之量。即，可藉由調整吸引力F₃ 而調整螺旋彈簧4之反作用力，可調整按壓。而且，可於維持該吸附狀態之狀態下於檢查區域A3內搬送IC器件90。藉此，可防止IC器件90於搬送中掉落。於吸附噴嘴31之外周部，於其長度方向之中途突出地形成有外徑擴大之凸緣部315。該凸緣部315作為螺旋彈簧4之下端23抵接之彈簧座發揮功能。又，凸緣部315抵接於第3塊體34而可防止吸附噴嘴31自吸引部3脫落(參照圖14)。於第2塊體33之上表面331，與內腔部333同心地呈環狀形成有溝槽334。於該溝槽334配置有環狀之墊圈37。藉此，墊圈37於第1塊體32與第2塊體33之間被壓縮，可與墊圈35一起維持上述一系列流路之氣密性。於第2塊體33之下表面332，與內腔部333同心地呈環狀形成有溝槽335。該溝槽335之底部作為螺旋彈簧4之上端24抵接之彈簧座發揮功能。於第2塊體33之下方配置有第3塊體34。第3塊體34包含具有平坦之上表面341及下表面342之塊狀(或板狀)之構件，上表面341與第2塊體33之下表面332相接。於第3塊體34之上表面341，形成有俯視下較吸附噴嘴31之凸緣部315大之凹部343。於該凹部343內，凸緣部315可沿Z方向移動。而且，如圖14所示，於凸緣部315抵接於凹部343之底部之狀態下，限制吸附噴嘴31於下側之位置之移動極限，由此可防止吸附噴嘴31之脫落。與此相反，於凸緣部315抵接於第2塊體33之下表面332之狀態下，限制吸附噴嘴31於上側之位置之移動極限。再者，以可對應各種IC器件90之厚度之方式充分確保吸附噴嘴31之可移動之可動區域。又，於凹部343之底部形成有貫通至下表面342之貫通孔344。無論吸附噴嘴31之位置如何，較凸緣部315靠下側之部分均可自貫通孔344突出。於第3塊體34形成有自上表面341貫通至下表面342之導孔345。於圖14~圖16所示之構成中，形成有2個導孔345。於各導孔345插入檢查部16之導銷164。藉此，於吸附噴嘴31(吸引部3)將IC器件90按壓至檢查部16時，進行IC器件90與檢查部16之定位。藉由該定位，IC器件90之各端子901與檢查部16之各探針接腳163可進行接觸。如圖17所示，吸引部3具有引導移動之吸附噴嘴31之引導構件38。引導構件38包含與Z方向平行地配置之棒狀之構件，且被固定於第2塊體33與第3塊體34。又，於吸附噴嘴31之凸緣部315形成有引導構件38貫通之缺口部317。由此種引導構件38及缺口部317構成吸附噴嘴31之防旋轉機構，吸附噴嘴31不會相對於第2塊體33及第3塊體34而旋轉，可沿Z方向穩定地移動。再者，吸引部3中亦可省略此種防旋轉機構。如圖14~圖16所示，作為施力部之螺旋彈簧4內置於吸引部3，與該吸附噴嘴31同心地配置於吸附噴嘴31之外周側。再者，於圖14所示之狀態下，螺旋彈簧4亦可於吸附噴嘴31之凸緣部315與第2塊體33之間成為自然長度，較佳為成為壓縮狀態。螺旋彈簧4係將吸引部3之吸附噴嘴31朝與吸引方向α₃ 相反之方向、即Z方向之負側施力之施力部。藉由如此施力部包含螺旋彈簧4，可簡化該施力部之構成。又，作為施力部，可使用適於內置於吸引部3之輕量者。作為螺旋彈簧4之構成材料，並無特別限定，例如較佳為使用如不鏽鋼等般之發揮充分之彈性之金屬材料。如上所述，吸附噴嘴31可沿內腔部333於Z方向上移動。又，如圖15及圖16所示，於吸附噴嘴31吸附IC器件90之狀態下，內腔部333內成為負壓之狀態，因此相對於吸附噴嘴31產生與吸引力F₃ 相當之吸引力F₃ '(向上方拉伸之力)。該吸引力F₃ '對吸附噴嘴31自身發揮作用，而將吸附噴嘴31向吸引方向α₃ (Z方向之正側)提拉。此時，螺旋彈簧4成為雖然收縮，但未完全收縮，即未達到收縮極限，而可於吸引方向α₃ 進一步收縮之狀態(以下將該狀態稱為「可收縮狀態」)。螺旋彈簧4之彈簧常數較佳為1 N/mm以上且90 N/mm以下，更佳為50 N/mm以上且70 N/mm以下。又，螺旋彈簧4之外徑fD_4-1 較佳為7 mm以上且20 mm以下，更佳為10 mm以上且15 mm以下。又，螺旋彈簧4之內徑fD_4-2 較佳為5 mm以上且10 mm以下，更佳為5 mm以上且7 mm以下。又，螺旋彈簧4之線徑fD_4-3 較佳為0.3 mm以上且2 mm以下，更佳為0.5 mm以上且1.4 mm以下。藉由螺旋彈簧4滿足此種條件，可相對較容易地將螺旋彈簧4內置於吸引部3。又，可對IC器件90賦予適於檢查之作用力(按壓力)。又，螺旋彈簧4能夠維持可收縮狀態。第1調整機構51包含氣缸，可負責吸引部3之姿勢調整中吸引部3之繞X軸之姿勢調整、及吸引部3之繞Y軸之姿勢調整。於本實施形態中，隔熱部6包含呈柱狀之複數個隔熱構件61。各隔熱構件61相互隔開而配置。再者，作為隔熱構件61之構成材料，並無特別限定，例如可使用如玻璃環氧樹脂等之各種隔熱材料。又，檢查部(載置部)16具有將載置於檢查部(載置部)16之電子零件即IC器件90朝吸引方向α₃ 施力之電子零件施力部166。該電子零件施力部166以內置於各探針接腳163之螺旋彈簧構成。藉此，與自吸引部3側對IC器件90之按壓相輔相成地，可使IC器件90之各端子901與各探針接腳163充分地接觸。由此，可準確地進行對IC器件90之檢查。然而，於吸附於吸附噴嘴31之IC器件90中，將吸附噴嘴31之下表面(吸附面)312作為基準時，會有自下表面312至各端子901為止之距離H₉₀ 產生不均之情況。其原因例如可列舉如下個體差異：即便為相同種類之IC器件90，IC器件90之厚度亦存在差異(不均)，即厚度之誤差有大有小(參照圖18及圖19)，或者此外，於IC器件90產生翹曲(參照圖20)等。再者，圖18表示IC器件90自身厚度有大有小之狀態，圖19表示即使是相同種類之IC器件90彼此、亦存在較薄之IC器件90及較厚之IC器件90之狀態，圖20表示IC器件90自身翹曲之狀態。例如於距離H₉₀ 相對較小之情形時，於各端子901中會有無法到達檢查部16之探針接腳163之端子901存在。於此情形時，變得接觸不良，難以進行準確之檢查。又，於距離H₉₀ 相對較大之情形時，各端子901雖可到達並接觸於檢查部16之探針接腳163，但會有存在該接觸壓力過度之端子901存在。於此情形時，亦難以進行準確之檢查。因此，本實施形態之電子零件檢查裝置1(電子零件搬送裝置10)採用可消除此種現象之構成。以下，參照圖14~圖16對該構成及作用進行說明。[1]如圖14所示，器件搬送頭17成為IC器件90尚未被吸引於吸引部3之狀態。又，螺旋彈簧4成為伸長至最大之狀態，吸附噴嘴31之凸緣部315抵接於第3塊體34。[2]繼而，該器件搬送頭17可利用吸引部3吸引進入至檢查區域A3之器件供給部14上之IC器件90。藉此，器件搬送頭17成為圖15所示之狀態。於該圖15所示之狀態下，IC器件90藉由吸引力F₃ 而被吸附於吸附噴嘴31。又，如上所述，於吸附IC器件90時，吸附噴嘴31向較圖14所示之狀態更靠Z方向正側(吸引方向α₃ )移動。繼而，在保持吸附IC器件90之狀態下使器件搬送頭17移動，可將該吸附之IC器件90配置於檢查部16之凹部165之正上方。[3]其後，如圖16所示，器件搬送頭17可下降直到吸引部3抵接於檢查部16。藉此，吸引部3可一面模仿檢查部16之姿勢，一面將IC器件90按壓並收納於檢查部16之凹部165。此時，吸附噴嘴31經由IC器件90而受到來自檢查部16之反作用力，較圖15所示之狀態進一步向Z方向正側移動。藉由該移動，螺旋彈簧4雖然收縮，但未達到收縮極限，成為上述可收縮狀態。又，此時之螺旋彈簧4亦成為亦能伸長之可伸長狀態。藉由如此螺旋彈簧4既為可收縮狀態亦為可伸長狀態，螺旋彈簧4可經由吸附噴嘴31將IC器件90朝向檢查部16以適於檢查之力適度地施力。藉此，例如如圖18~圖20所示，無論距離H₉₀ 之大小如何，均可使IC器件90之各端子901與檢查部16之探針接腳163恰如其分且均勻地接觸(抵接)，由此，可準確地進行對IC器件90之檢查。因此，螺旋彈簧4可作為抵消距離H₉₀ 之不均之「緩衝部」發揮功能。＜第7實施形態＞以下，參照圖21及圖22對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。本實施形態除檢查部之構成不同以外，與第6實施形態相同。如圖21及圖22所示，於本實施形態中，抵接部162包含厚度可變更之板狀構件(間隔件)。該抵接部162係具有至少一層包含壓電元件167之層之積層體。藉此，可藉由施加於壓電元件167之電壓之大小，容易且迅速地變更抵接部162之厚度。藉此，於例如圖21所示之狀態下使用檢查部16後，將成為檢查對象之IC器件90變更為更厚者之情形時，可將檢查部16設為圖22所示之狀態進行檢查。如此，於本實施形態中，可對應於IC器件90之厚度，將檢查部16設為適於該IC器件90之檢查者。再者，作為基於壓電元件167之厚度可變更之範圍，並無特別限定，例如較佳為0.1 mm以上且0.5 mm以下，更佳為0.1 mm以上且0.3 mm以下。再者，作為將吸引部之吸附噴嘴朝Z方向之負側施力之施力部，於上述各實施形態中包含螺旋彈簧，但並不限定於此，例如亦可包含空氣彈簧。又，可變更抵接部之厚度於第7實施形態中係藉由壓電元件之作動而進行，但並不限定於此，例如亦可重疊複數片0.1 mm之填隙片，藉由該重疊片數之增減而進行。＜第8實施形態＞以下，參照圖1及圖23~圖42，對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。再者，以下為方便說明，有將圖25及圖26中之上側稱為「上」或「上方」、將下側稱為「下」或「下方」之情況。又，有將圖23中之左側稱為「左」、將右側稱為「右」之情況。本實施形態之電子零件搬送裝置10具備：固持部44，其可固持構件(力檢測用構件90')；可動部30，其可載置電子零件而進行移動；及力檢測部9，其設置於可動部30，對力進行檢測；且可將固持於固持部44之構件(力檢測用構件90')抵接於力檢測部9。又，本實施形態之電子零件搬送裝置10具備：固持部44，其可固持構件(力檢測用構件90')；可動部30，其可載置電子零件而進行移動；力檢測部9，其設置於可動部30，對力進行檢測；及記憶部802，其可記憶力檢測部9所檢測出之檢測結果。根據此種電子零件搬送裝置10，如後所述，於利用檢查部(插口)16進行對電子零件之檢查之情形時，可將固持於固持部44之電子零件抵接於檢查部16時之實際之抵接力F₉₀ 置換為由力檢測部9所檢測出之抵接力F₉₀ '。而且，根據抵接力F₉₀ '之大小，可判斷檢查時之抵接力F₉₀ 是否為對於電子零件而言恰如其分之大小。又，作為力檢測部9，例如可使用荷重元，荷重元設置於可相對較容易確保其設置空間之可動部30。藉此，以簡單之構成便可進行力之檢測。本實施形態之電子零件檢查裝置1具備：固持部44，其可固持構件(力檢測用構件90')；可動部30，其可載置電子零件而進行移動；力檢測部9，其設置於可動部30，對力進行檢測；及檢查部16，其對電子零件進行檢查；且可使固持於固持部44之構件(力檢測用構件90')抵接於力檢測部9。藉此，可獲得具有上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將電子零件搬送至檢查部16，由此，可利用檢查部16進行對該電子零件之檢查。又，可自檢查部16搬送檢查後之電子零件。以下，對各部之構成進行說明。檢查區域A3係檢查IC器件90之區域。於該檢查區域A3設置有對IC器件90進行檢查之檢查部16、及具有固持部44之器件搬送頭17。又，亦設置有以跨越供給區域A2與檢查區域A3之方式移動之器件供給部14、及以跨越檢查區域A3與回收區域A4之方式移動之器件回收部18。以下，有將2個器件供給部14中之正面側之器件供給部14稱為「器件供給部(第1器件供給部)14A」，將背面側之器件供給部14稱為「器件供給部(第2器件供給部)14B」之情況。於圖23所示之構成中，器件搬送頭17於Y方向上連結配置2個。以下，有將2個器件搬送頭17中之正面側之器件搬送頭17稱為「器件搬送頭(第1器件搬送頭)17A」，將背面側之器件搬送頭17稱為「器件搬送頭(第2器件搬送頭)17B」之情況。而且，器件搬送頭17A可將器件供給部14A上之IC器件90搬送至檢查部16。另一方面，器件搬送頭17B可將器件供給部14B上之IC器件90搬送至檢查部16上。又，器件回收部18可於檢查區域A3與回收區域A4之間沿X方向、即沿箭頭α₁₈ 方向往返移動地被支持。藉此，器件回收部18可將檢查後之IC器件90自檢查區域A3穩定地搬送至回收區域A4，又，於回收區域A4藉由器件搬送頭20卸去IC器件90後，可再次返回至檢查區域A3。於圖23所示之構成中，器件回收部18係與器件供給部14同樣地於Y方向配置有2個。以下，有將2個器件回收部18中之正面側之器件回收部18稱為「器件回收部(第1器件回收部)18A」，將背面側之器件回收部18稱為「器件回收部(第2器件回收部)18B」之情況。而且，藉由器件搬送頭17A將IC器件90自檢查部16搬送至器件回收部18A。另一方面，藉由器件搬送頭17B將IC器件90自檢查部16搬送至器件回收部18B。如圖24所示，控制部800具有CPU(Central Processing Unit，中央處理單元)801、及記憶(儲存)用以使托盤搬送機構11A等各部之動作執行之各種程式或各種資料等之記憶部802。如上所述，器件搬送頭17被支持為可沿Y方向及Z方向移動。器件搬送頭17係於檢查區域A3內搬送IC器件90者。如圖25所示，器件搬送頭17具有固持部44及姿勢調整部5。固持部44係以可固持IC器件90、或此外如後所述般代替IC器件90而可固持力檢測時所使用之力檢測用構件90'之方式構成之固持單元。該固持部44具有吸引部45及連接於吸引部45之接頭36。吸引部45具有於下表面319及側面320開口之流路318。空氣可通過流路318。又，接頭36自側面320側氣密性地連接於流路318。接頭36經由配管71連接於如例如真空泵或噴射器等般之對流路318內進行吸引之吸引源(真空產生源)26。而且，藉由該吸引源26進行作動，吸引部45可將下表面319作為吸附面，藉由吸引而固持IC器件90或力檢測用構件90'。再者，於圖25及圖26中，代表性地描繪有1個固持部44，固持部44之設置數量並不限定於1個，亦可為複數個。於本實施形態中，作為一例，於器件搬送頭17A及器件搬送頭17B分別設置有8個固持部44。該等8個固持部44成為分別於X方向配置有4個及於Y方向配置有2個之狀態。於固持部44之上方連結配置有姿勢調整部5。姿勢調整部5係於圖25所示之狀態下調整固持部44之姿勢之被稱為「順從單元」者。姿勢調整部5具有第1調整機構51及第2調整機構52。第1調整機構51包含氣缸，可負責固持部44之姿勢調整中固持部44之繞X軸之姿勢調整、及固持部44之繞Y軸之姿勢調整。於第1調整機構51之下方配置有第2調整機構52。第2調整機構52具有於Z方向重疊之2片板構件421。該等2片板構件421可相對地於XY平面方向移動。藉此，第2調整機構52可負責固持部44之姿勢調整中固持部44之X方向之姿勢調整、固持部44之Y方向之姿勢調整、及固持部44之繞Z軸之姿勢調整。如上所述，於檢查區域A3內可配置作為載置電子零件即IC器件90之載置部之檢查部16。又，器件搬送頭17具有姿勢調整部5，該姿勢調整部5於將固持於器件搬送頭17之固持部44之IC器件(電子零件)90載置於檢查部(載置部)16時可調整固持部44之姿勢。而且，如圖25所示，於將固持於器件搬送頭17之固持部44之IC器件90載置於檢查部16時，固持部44可抵接於檢查部16。此處，例如嘗試假定檢查部16整體相對於XY平面(水平面)傾斜1度之情形。於此種情形時，亦如圖25所示，於固持部44與檢查部16抵接之狀態下，可藉由姿勢調整部5而使固持部44模仿與檢查部16相同之傾斜姿勢。此種固持部44之姿勢調整有助於IC器件90之端子與檢查部16之探針接腳之接觸。藉此，可對IC器件90進行準確之檢查。再者，如圖25所示，檢查部16凹陷形成有載置收納IC器件90之凹部(凹穴)168。於本實施形態中，凹部168之形成數量成為8個，其配置態樣較佳為與器件搬送頭17A或器件搬送頭17B中之8個固持部44之配置態樣相同，即，成為分別於X方向各配置有4個及於Y方向配置有2個之狀態。又，於各凹部168之底部突出地配置有與IC器件90之端子相同數量之探針接腳。如圖25所示，姿勢調整部5連結於Z方向移動機構25。Z方向移動機構25具有線性導軌27、滾珠螺桿28、及馬達40。線性導軌27具有軌道517及於軌道517上滑動之滑塊518。軌道517經由連結構件54而與姿勢調整部5之第1調整機構51連結，與Z方向平行地配置。滑塊518被固定於例如檢查區域A3之壁部等。滾珠螺桿28具有螺旋軸523、及於螺旋軸523上滑動之螺帽522。螺旋軸523經由框體55而被固定於例如檢查區域A3之壁部等。又，螺旋軸523係與Z方向平行地配置，於其上端部安裝有皮帶輪56。螺帽522經由連結構件57而與連結構件54連結。馬達40被固定於例如檢查區域A3之壁部等。於馬達40之軸532安裝有皮帶輪58。該皮帶輪58經由正時皮帶59而與安裝於滾珠螺桿28之皮帶輪56連結。於此種構成之Z方向移動機構25中，藉由馬達40之作動而將該力傳遞至姿勢調整部5。藉此，固持部44可與姿勢調整部5一起沿Z方向(與一方向(X方向)交叉之另一方向)往返移動。又，雖未圖示，但亦設置有使器件搬送頭17(固持部44及姿勢調整部5)與Z方向移動機構25一併沿Y方向移動之Y方向移動機構。藉此，固持部44亦可沿Y方向(與一方向(X方向)交叉之另一方向)往返移動。而且，藉由Z方向移動機構25及Y方向移動機構，器件搬送頭17可於檢查區域A3內沿Y方向及Z方向自由地移動。藉此，固持部44可一面固持IC器件90或力檢測用構件90'一面將其搬送至其搬送目的地。又，於電子零件檢查裝置1中，可調整對馬達40之施加電壓。藉此，使固持於固持部44之IC器件90抵接(按壓)於檢查部16而進行檢查時，可調整該抵接力F₉₀ 。IC器件90必須按照其每一種類而調整抵接力F₉₀ 。因此，藉由能夠調整抵接力F₉₀ ，可賦予適於各種IC器件90之抵接力F₉₀ 而進行檢查。藉此，檢查變得準確。如上所述，器件供給部14係載置檢查前之IC器件90(電子零件)之檢查前電子零件載置部，器件回收部18係載置檢查後之IC器件(電子零件)90之檢查後電子零件載置部。如圖26所示，器件供給部14與器件回收部18作為可載置IC器件(電子零件)90而進行移動之可動部30而單元化。該可動部30除具有器件供給部14及器件回收部18以外，亦具有X方向移動機構7。器件供給部14凹陷形成有載置收納IC器件90之凹部(凹穴)141。於本實施形態中，凹部141之形成數量成為8個，其配置態樣較佳為與器件搬送頭17A或器件搬送頭17B中之8個固持部44之配置態樣相同，即，成為分別於X方向配置有4個及於Y方向配置有2個之狀態。器件回收部18亦凹陷地形成有載置及收納IC器件90之凹部(凹穴)181。於本實施形態中，凹部181之形成數量成為8個，其配置態樣較佳為與器件搬送頭17A或器件搬送頭17B中之8個固持部44之配置態樣相同，即，成為分別於X方向配置有4個及於Y方向配置有2個之狀態。X方向移動機構7具有線性導軌29、及一併支持器件供給部14與器件回收部18之支持基座47。線性導軌29具有軌道711及2個滑塊712。於該等2個滑塊712上固定有支持基座47。支持基座47係將器件供給部14與器件回收部18於X方向上隔開而支持。又，支持基座47可相互獨立且裝卸自如地支持器件供給部14與器件回收部18。支持基座47經由滾珠螺桿(未圖示)而與馬達(未圖示)連結。而且，藉由該馬達之作動，該力傳遞至支持基座47。藉此，器件供給部(檢查前電子零件載置部)14與器件回收部(檢查後電子零件載置部)18可沿X方向(一方向)往返移動。藉由如此能夠往返移動，可藉由器件供給部14將檢查前之IC器件90自供給區域A2穩定且迅速地搬送至檢查區域A3。又，可藉由器件回收部18將檢查後之IC器件90自檢查區域A3穩定且迅速地搬送至回收區域A4。此外，經過電子零件檢查裝置1之檢查判斷為良品之IC器件90中，有按照每一批次進行彙總，例如作為搭載於汽車之零件而出貨者。而且，於搭載後之IC器件90產生缺陷之情形時，特定出含有該IC器件90之批次，採取市場上之缺陷對策。作為儘管作為良品出貨但產生缺陷之原因，有各種原因，作為其一，可列舉以下原因。其原因可列舉：於使固持於固持部44之IC器件90抵接(按壓)於檢查部16而進行檢查時，該抵接力F₉₀ 未成為對於IC器件90而言適當之大小，即過度或不足。因此，未能獲得準確之檢查結果。因此，認為只要保證抵接力F₉₀ 為對於該IC器件90而言恰如其分之大小，則可自缺陷之原因中至少排除「因抵接力F₉₀ 之過度與不足所致之情況」。電子零件檢查裝置1(電子零件搬送裝置10)係以對於檢查對象之IC器件90而言，可保證對檢查部16之抵接力F₉₀ 為恰如其分之大小之方式構成。以下，對該構成及作用進行說明。如圖23所示，電子零件檢查裝置1(電子零件搬送裝置10)具備對力進行檢測之力檢測部9。於該圖23所示之構成中，配置有2個力檢測部9。以下，如圖23所示，有將2個力檢測部9中鄰接於器件供給部14A之右側而配置之力檢測部9稱為「力檢測部(第1力檢測部)9A」，將鄰接於器件供給部14B之右側而配置之力檢測部9稱為「力檢測部(第2力檢測部)9B」之情況。又，力檢測部9A相對於器件供給部14A偏集存在於Y方向之正側而配置，力檢測部9B相對於器件供給部14B偏集存在於Y方向之負側而配置。如圖26所示，於檢查區域A3內，可使固持於固持部44之力檢測用構件90'抵接於力檢測部9。而且，藉由力檢測部9檢測出此時之抵接力F₉₀ '，作為與「IC器件90對檢查部16之抵接力F₉₀ 」同等者而進行操作。又，力檢測部9檢測之檢測結果、即抵接力F₉₀ '之大小記憶於控制部800之記憶部802。再者，作為力檢測部9，並無特別限定，例如較佳為使用荷重元。荷重元係內置有應變計，且將力之大小轉換成電氣信號之轉換器。藉此，能夠以實測值而非設計值(計算值)儘可能準確地檢測出抵接力F₉₀ '。又，作為檢測抵接力F₉₀ '之時序，例如較佳為於自力檢測用構件90'開始抵接於力檢測部9之位置進而於0.1 mm以上且2.0 mm以下之範圍內下降之位置進行檢測。又，作為力檢測用構件90'，並無特別限定，例如可使用無論良品與否均無用之IC器件90、及包含模仿IC器件90之金屬片之虛設器件等，於該等中，較佳為由於為不良品而無用之IC器件90。如圖26所示，力檢測部9與器件供給部14或器件回收部18一起設置於可動部30。藉此，可使力檢測部9沿X方向往返移動，由此可對應於抵接力F₉₀ '之檢測之有無，而將力檢測部9配置於檢查區域A3或供給區域A2。如上所述，電子零件檢查裝置1(電子零件搬送裝置10)係用於檢查IC器件(電子零件)90者。又，可動部30具有載置檢查前之IC器件90(電子零件)之器件供給部(檢查前電子零件載置部)14、及載置檢查後之IC器件(電子零件)90之器件回收部(檢查後電子零件載置部)18。而且，力檢測部9設置於器件供給部(檢查前電子零件載置部)14與器件回收部(檢查後電子零件載置部)18之間。器件供給部14與器件回收部18之間確保有對於設置1個力檢測部9而言充分之空間。藉此，可自設計電子零件檢查裝置1時設置力檢測部9，亦可於省略力檢測部9之電子零件檢查裝置1完成後進而設置力檢測部9，即，亦可之後附加(增設)力檢測部9。如此，可相對較容易地設置力檢測部9。又，力檢測部9隔著較器件供給部14或器件回收部18厚之間隔件39而設置於支持基座47上。藉此，力檢測部9成為配置於高於器件供給部(檢查前電子零件載置部)14及器件回收部(檢查後電子零件載置部)18之位置之狀態。藉此，固持部44於固持例如器件供給部14上之IC器件90時，下降至可進行該固持之位置(以下稱為「可固持位置」)而停止，於使力檢測用構件90'抵接於力檢測部9而對力進行檢測時，停止於高於可固持位置之位置。由此，防止力檢測時之固持部44與存在於低於該固持部44之位置之其他周邊構件等之干涉。於檢查區域A3內，藉由固持部44自檢查部16上向Y方向移動，力檢測部9可配置於俯視下(自Z方向之正側觀察時)與固持部44重疊之位置。藉此，於檢查IC器件90時，與IC器件90自上方抵接於檢查部16(壓抵)同樣地，於力檢測時，力檢測用構件90'亦可自上方抵接於力檢測部9(壓抵)。藉由如此使抵接方向於檢查時與力檢測時相同，可使抵接力F₉₀ '與抵接力F₉₀ 同等而進行操作。又，使固持於固持部44之力檢測用構件(構件)90'抵接於力檢測部9時之固持部44之移動速度較佳為10 mm/秒以下，更佳為3 mm/秒以上且7 mm/秒以下。藉此，即便力檢測用構件90'與力檢測部9抵接時產生衝擊，亦可防止因該衝擊所導致之力檢測用構件90'或力檢測部9之變形等。如上所述，使固持於固持部44之IC器件90抵接(按壓)於檢查部16進行檢查時，可調整該抵接力F₉₀ 。藉此，可按照IC器件90之每一種類，進行對於該IC器件90而言適宜之抵接力F₉₀ 之調整。再者，該調整亦可藉由調整對馬達40之施加電壓而進行。而且，與此同樣地，亦可調整使固持於固持部44之力檢測用構件(構件)90'抵接於力檢測部9時之抵接力F₉₀ '。抵接力F₉₀ '之調整範圍較佳為0.3 N以上且600 N以下，更佳為1 N以上且300 N以下。此種數值範圍與檢查時之IC器件90對檢查部16之抵接力可取之數值範圍相同。藉此，可使抵接力F₉₀ '與抵接力F₉₀ 同等而進行操作。再者，於力檢測部9之檢測結果偏離數值範圍之情形時，較佳為經由例如監視器300或揚聲器500報知該內容。又，較佳為於該報知之同時停止電子零件檢查裝置1之作動。如上所述，電子零件檢查裝置1(電子零件搬送裝置10)以可將使IC器件90抵接於檢查部16時之抵接力F₉₀ 置換為由力檢測部9檢測出之抵接力F₉₀ '而進行操作之方式構成。而且，根據抵接力F₉₀ '之大小，可判斷檢查時之實際之抵接力F₉₀ 是否為對於IC器件90而言恰如其分之大小。例如若將對於IC器件90而言恰如其分之抵接力F₉₀ 之大小作為「基準值(閾值)TH」，則於抵接力F₉₀ '為基準值TH以上之情形時，可判斷「檢查時之抵接力F₉₀ 為對於IC器件90而言恰如其分之大小」。於此情形時，即便產生上述市場上之缺陷，亦可自該缺陷之原因中排除「因抵接力F₉₀ 之過與不足所導致之情況」。另一方面，於抵接力F₉₀ '未達基準值TH之情形時，可判斷「檢查時之抵接力F₉₀ 並非對於IC器件90而言適當之大小」。於此情形時，進行抵接力F₉₀ '之調整。又，利用力檢測部9檢測出之抵接力F₉₀ '之大小(檢測結果)記憶於記憶部802。藉此，可將檢測結果作為參考，於產生上述市場上之缺陷時加以利用。如上所述，作為一例，於器件搬送頭17A及器件搬送頭17B分別設置有共計8個固持部44，即，分別於X方向上設置有4個，於Y方向上設置有2個。而且，於圖27~圖34所示之狀態下，固持於器件搬送頭17A之8個力檢測用構件90'中自圖中之左下方者朝向右側依序稱為「力檢測用構件90A₁ '」、「力檢測用構件90A₂ '」、「力檢測用構件90A₃ '」、「力檢測用構件90A₄ '」、「力檢測用構件90A₅ '」、「力檢測用構件90A₆ '」、「力檢測用構件90A₇ '」、及「力檢測用構件90A₈ '」。又，於圖35~圖42所示之狀態下，固持於器件搬送頭17B之8個力檢測用構件90'中自圖中之左下方者朝向右側依序稱為「力檢測用構件90B₁ '」、「力檢測用構件90B₂ '」、「力檢測用構件90B₃ '」、「力檢測用構件90B₄ '」、「力檢測用構件90B₅ '」、「力檢測用構件90B₆ '」、「力檢測用構件90B₇ '」、及「力檢測用構件90B₈ '」。其次，參照圖27~圖34對器件搬送頭17A之各固持部44之抵接力F₉₀ '之檢測進行說明，參照圖35~圖42對器件搬送頭17B之各固持部44之抵接力F₉₀ '之檢測進行說明。[A1]如圖27所示，於器件搬送頭17A中，成為分別固持有力檢測用構件90A₁ '~90A₈ '之狀態。該狀態維持至器件搬送頭17A中之所有抵接力F₉₀ '之檢測完成為止。又，器件供給部14A移動至檢查區域A3，藉此，力檢測部9A位於檢查區域A3。而且，首先使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端之位置，如上所述，使力檢測用構件90A₁ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₁ '之固持部44之抵接力F₉₀ '。[A2]其次，暫時使器件搬送頭17A退避，如圖28所示，將力檢測部9A配置於移動力檢測用構件90A₁ '與力檢測用構件90A₂ '之中心距離之量的位置。繼而，如圖28所示，使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90A₂ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₂ '之固持部44之抵接力F₉₀ '。[A3]其次，使器件搬送頭17A再次退避，如圖29所示，將力檢測部9A配置於移動力檢測用構件90A₂ '與力檢測用構件90A₃ '之中心距離之量的位置。繼而，如圖29所示，使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端位置，而與上述同樣地使力檢測用構件90A₃ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₃ '之固持部44之抵接力F₉₀ '。[A4]其次，使器件搬送頭17A再次退避，如圖30所示，將力檢測部9A配置於移動力檢測用構件90A₃ '與力檢測用構件90A₄ '之中心距離之量的位置。繼而，如圖30所示，使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90A₄ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₄ '之固持部44之抵接力F₉₀ '。[A5]其次，使器件搬送頭17A再次退避，如圖31所示，將力檢測部9A配置於與上述動作[A1]時相同之位置。繼而，如圖31所示，使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90A₅ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₅ '之固持部44之抵接力F₉₀ '。[A6]其次，使器件搬送頭17A再次退避，如圖32所示，將力檢測部9A配置於移動力檢測用構件90A₅ '與力檢測用構件90A₆ '之中心距離之量的位置。繼而，如圖32所示，使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90A₆ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₆ '之固持部44之抵接力F₉₀ '。[A7]其次，使器件搬送頭17A再次退避，如圖33所示，將力檢測部9A配置於移動力檢測用構件90A₆ '與力檢測用構件90A₇ '之中心距離之量的位置。繼而，如圖33所示，使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端之位置，與上述同樣地使力檢測用構件90A₇ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₇ '之固持部44之抵接力F₉₀ '。[A8]其次，使器件搬送頭17A再次退避，如圖34所示，將力檢測部9A配置於移動力檢測用構件90A₇ '與力檢測用構件90A₈ '之中心距離之量的位置。繼而，如圖34所示，使器件搬送頭17A沿箭頭α_17Y(-) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90A₈ '抵接於力檢測部9A。藉此，檢測出固持有力檢測用構件90A₈ '之固持部44之抵接力F₉₀ '。藉由經過此種動作[A1]~[A8]，可依序檢測出器件搬送頭17A中之各固持部44之抵接力F₉₀ '。繼而，進行器件搬送頭17B之抵接力F₉₀ '之檢測。[B1]如圖35所示，器件搬送頭17B成為分別固持有力檢測用構件90B₁ '~90B₈ '之狀態。該狀態維持至器件搬送頭17B之所有抵接力F₉₀ '之檢測完成為止。又，器件供給部14B移動至檢查區域A3，藉此，力檢測部9B位於檢查區域A3。繼而，首先使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，如上所述，使力檢測用構件90B₁ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₁ '之固持部44之抵接力F₉₀ '。[B2]其次，使器件搬送頭17B暫時退避，如圖36所示，將力檢測部9B配置於移動力檢測用構件90B₁ '與力檢測用構件90B₂ '之中心距離之量的位置。繼而，如圖36所示，使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90B₂ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₂ '之固持部44之抵接力F₉₀ '。[B3]其次，使器件搬送頭17B再次退避，如圖37所示，將力檢測部9B配置於移動力檢測用構件90B₂ '與力檢測用構件90B₃ '之中心距離之量的位置。繼而，如圖37所示，使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90B₃ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₃ '之固持部44之抵接力F₉₀ '。[B4]其次，使器件搬送頭17B再次退避，如圖38所示，將力檢測部9B配置於移動力檢測用構件90B₃ '與力檢測用構件90B₄ '之中心距離之量的位置。繼而，如圖38所示，使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90B₄ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₄ '之固持部44之抵接力F₉₀ '。[B5]其次，使器件搬送頭17B再次退避，如圖39所示，將力檢測部9B配置於與上述動作[B1]時相同之位置。繼而，如圖39所示，使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90B₅ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₅ '之固持部44之抵接力F₉₀ '。[B6]其次，使器件搬送頭17B再次退避，如圖40所示，將力檢測部9B配置於移動力檢測用構件90B₅ '與力檢測用構件90B₆ '之中心距離之量的位置。繼而，如圖40所示，使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90B₆ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₆ '之固持部44之抵接力F₉₀ '。[B7]其次，使器件搬送頭17B再次退避，如圖41所示，將力檢測部9B配置於移動力檢測用構件90B₆ '與力檢測用構件90B₇ '之中心距離之量的位置。繼而，如圖41所示，使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90B₇ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₇ '之固持部44之抵接力F₉₀ '。[B8]其次，使器件搬送頭17B再次退避，如圖42所示，將力檢測部9B配置於移動力檢測用構件90B₇ '與力檢測用構件90B₈ '之中心距離之量的位置。繼而，如圖42所示，使器件搬送頭17B沿箭頭α_17Y(+) 方向移動至其前端之位置，而與上述同樣地使力檢測用構件90B₈ '抵接於力檢測部9B。藉此，檢測出固持有力檢測用構件90B₈ '之固持部44之抵接力F₉₀ '。藉由經過此種動作[B1]~[B8]，可依序檢測出器件搬送頭17B中之各固持部44之抵接力F₉₀ '。如上所述，於器件搬送頭17A及器件搬送頭17B中分別設置有8個(複數個)固持部44。而且，如關於動作[A1]~[A8]、動作[B1]~[B8]之說明般，可將固持於各固持部44之力檢測用構件90'(構件)獨立地抵接於力檢測部9。藉此，對於器件搬送頭17A及器件搬送頭17B，分別以1個力檢測部9便可檢測出8個部位之抵接力F₉₀ '，由此可實現構成之簡化。又，固持於固持部44之力檢測用構件(構件)90'對力檢測部9之抵接較佳為於IC器件90之檢查開始前、檢查結束後、或固持部44每固持IC器件(電子零件)90特定次數時進行。於電子零件檢查裝置1中，可自該等3個時序中適當選擇而設定。藉此，可適應使用電子零件檢查裝置1之使用者之要求。＜第9實施形態＞以下，參照圖43及圖44對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。本實施形態主要器件供給部及器件回收部之配置部位不同，除此以外，與第8實施形態相同。如圖43所示，於本實施形態中，器件供給部14與器件回收部18分別相對於檢查部16配置於Y方向之負側。又，器件供給部14相對於器件回收部18配置於Z方向之正側。再者，器件搬送頭17配置有1個，且僅可沿Z方向往返移動地被支持。器件供給部14可沿Y方向、即沿箭頭α_14Y 方向往返移動地被支持。藉此，器件供給部14可將檢查前之IC器件90移動至器件搬送頭17可固持之位置、即檢查部16之上側。又，於藉由器件搬送頭17將IC器件90卸去後，器件供給部14可自檢查部16上退避。又，如圖44所示，於器件供給部14，力檢測部9可沿X方向、即沿箭頭α_9X 方向往返移動地被支持。藉此，力檢測部9於檢測器件搬送頭17中之各固持部44之抵接力F₉₀ '時，可移動至成為檢測對象之固持部44之正下方。器件回收部18可沿Y方向、即沿箭頭α_18Y 方向往返移動地被支持。藉此，器件回收部18可將檢查後之IC器件90移動至可載置器件搬送頭17之位置、即檢查部16之上側。而且，於載置檢查後之IC器件90後，器件回收部18可自檢查部16上退避。又，於本實施形態中，1個器件搬送頭46兼顧、即負責IC器件90之至器件供給部14為止之搬送與IC器件90之自器件回收部18之搬送。又，關於器件供給部14與器件回收部18之上下關係，於本實施形態中，器件供給部14成為上側，器件回收部18成為下側，但並不限定於此，例如亦可器件回收部18成為上側，器件供給部14成為下側。＜第10實施形態＞以下，參照圖45及圖46對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。本實施形態主要器件供給部及器件回收部之配置部位不同，除此以外，與第9實施形態相同。如圖45所示，於本實施形態中，器件供給部14與器件回收部18隔著檢查部16而配置於其兩側。器件供給部14係與第8實施形態同樣地可沿箭頭α₁₄ 方向往返移動地被支持。又，器件回收部18亦與第8實施形態同樣地可沿箭頭α₁₈ 方向往返移動地被支持。而且，如圖46所示，於器件供給部14，力檢測部9可沿Y方向、即沿箭頭α_9Y 方向往返移動地被支持。藉此，力檢測部9於檢測器件搬送頭17中之各固持部44之抵接力F₉₀ '時，可移動至成為檢測對象之固持部44之正下方。以上，基於圖示之實施形態對本實施形態之電子零件搬送裝置及電子零件檢查裝置進行了說明，但本發明並不限定於此，構成電子零件搬送裝置及電子零件檢查裝置之各部可置換為能夠發揮相同功能之任意構成者。又，亦可附加任意之構成物。又，本發明之電子零件搬送裝置及電子零件檢查裝置亦可為將上述各實施形態中之任意2個以上之構成(特徵)組合而成者。又，固持部之設置數量、檢查部之凹部之形成數量、器件供給部之凹部之形成數量、器件回收部之凹部之形成數量分別於上述各實施形態中成為8個，但並不限定於此，亦可為1個至7個、或9個以上。又，力檢測時，於上述各實施形態中，固持部固持力檢測用構件而進行該檢測，但並不限定於此，亦可省略力檢測用構件。於此情形時，於力檢測時，較佳為使藉由吸引而固持力檢測用構件等之固持部之吸引口之緣部抵接於力檢測部。又，力檢測部於上述各實施形態中係於力檢測時直接抵接於力檢測用構件，但並不限定於此。例如亦可於力檢測部上固定模仿檢查部(插口)之構造體，經由該構造體而將力檢測部抵接於力檢測用構件。又，力檢測部相對於檢查區域內之1個器件搬送頭設置有1個，但並不限定於此，亦可設置有與器件搬送頭所具有之固持部相同之數量(複數個)。於此情形時，較佳為將複數個力檢測部單元化，且每一該單元被能夠移動地支持。Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiment shown in the accompanying drawings. <First Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 1 to 8. In addition, for convenience of description, as shown in FIG. 1, the three axes orthogonal to each other are the X axis, the Y axis, and the Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis is also referred to as "X direction (first direction)", the direction parallel to the Y axis is also referred to as "Y direction (second direction)", and the direction parallel to the Z axis is also referred to It is called "Z direction (third direction)". The direction in which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". The "horizontal" in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic components, it also includes a state that is slightly inclined (for example, less than about 5 °) with respect to the level. In addition, in FIGS. 1 and 3 to 8 (the same applies to FIGS. 9 to 11), the upper side may be referred to as “up” or “upper”, and the lower side may be referred to as “down” or “lower”. The electronic component transfer device 10 according to this embodiment includes a cylinder 511 as a first base portion, a piston 512 as a first sliding portion that can slide with respect to the cylinder 511, and a first block 32 as a second base portion, The second block 33 and the third block 34 are disposed on the piston 512; and the suction nozzle 31 as the second sliding portion can be opposed to the first block 32, the second block 33, and the third block. The body 34 slides and can abut an electronic component. A first space S1 having a variable volume is formed between the cylinder 511 as the first base and the piston 512 as the first sliding part, and is used as the second base. A second space S2 having a variable volume is formed between the third block 34 and the suction nozzle 31 as a second sliding portion. Thus, even if there are individual differences in the electronic components, the difference can be offset by adjusting the pressure or the inflow amount of the working fluid R in the first space S1 and the second space S2. In addition, for example, when performing an electrical inspection of an electronic component using the inspection unit 16, regardless of individual differences in the electronic components, the terminals of the electronic component can be uniformly abutted against the terminals of the inspection unit 16. Perform this check. The electronic component inspection device 1 according to the present embodiment includes the electronic component transfer device 10 according to the present embodiment, and further includes an inspection unit 16 that inspects the electronic components. That is, the electronic component inspection apparatus 1 according to this embodiment includes a cylinder 511 as a first base, a piston 512 as a first sliding portion that can slide with respect to the cylinder 511, and a first block 32 as a second base. , The second block 33, and the third block 34 are arranged on the piston 512; as the suction nozzle 31 of the second sliding portion, it can be opposite to the first block 32, the second block 33, and the third block The block 34 slides and can abut an electronic component; and the inspection section 16 inspects the electronic component; and a volume is formed between a cylinder 511 as a first base portion and a piston 512 as a first sliding portion. The first space S1 that changes is formed between the third block 34 that is the second base portion and the suction nozzle 31 that is the second sliding portion. The second space S2 is of a variable volume. Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component conveying apparatus 10 can be obtained. In addition, the electronic component can be transported to the inspection unit 16, so that the inspection of the electronic component can be performed by the inspection unit 16. In addition, electronic components after inspection can be transported from the inspection unit 16. The configuration of each unit will be described below. As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 with the built-in electronic component transfer device 10 transfers electronic components such as IC devices such as BGA (Ball Grid Array) packages, and during the transfer process, A device for inspecting and testing the electrical characteristics of electronic parts (hereinafter referred to as "inspection"). In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component will be described as a representative, and it will be referred to as “IC device 90”. The IC device 90 has a flat shape in this embodiment. A plurality of hemispherical terminals 901 are arranged on the lower surface of the IC device 90. In addition, as the IC device, in addition to the above, for example, "LSI (Large Scale Integration)", "CMOS (Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device, Charge-coupled device) "or" module IC "packaged from a plurality of IC device modules, and can also include" crystal device "," pressure sensor "," inertial sensor (acceleration sensor) Device "," gyro sensor "," fingerprint sensor ", etc. In addition, the electronic component inspection device 1 (electronic component transfer device 10) is used in advance by a so-called "conversion kit" that is replaced for each type of the IC device 90. The conversion kit includes a mounting section on which the IC device 90 is mounted, and as the mounting section, for example, a temperature adjustment section 12 and a device supply section 14 described below are provided. In addition, as the mounting section on which the IC device 90 is mounted, in addition to the conversion kit described above, there are also an inspection section 16 and a tray 200 prepared by the user. The electronic component inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and a tray removal area A5. The isoregion is partitioned by each wall portion as described later. Further, the tray 90 is supplied from the IC device area A1 to area A5 tray removed in the arrow direction α ₉₀ sequentially pass through each of the areas, to inspect the examination region A3 halfway. As described above, the electronic component inspection apparatus 1 includes a robot as the electronic component transport apparatus 10 that transports the IC device 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal light 400, and an operation panel 700. The electronic component inspection device 1 is arranged in a direction in which the tray supply area A1 and a tray removal area A5, that is, the lower side in FIG. 2 becomes the front side, and the direction in which the inspection area A3 is arranged, that is, the upper side in FIG. Side by side. The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 are arranged in an unchecked state. A plurality of trays 200 can be stacked in the tray supply area A1. The supply area A2 is an area for transferring and supplying a plurality of IC devices 90 on the tray 200 transferred from the tray supply area A1 to the inspection area A3, respectively. In addition, tray transfer mechanisms 11A and 11B are provided to transfer the tray 200 one by one in the horizontal direction so as to straddle the tray supply area A1 and the supply area A2. The tray conveying mechanism 11A is a moving part that can move the tray 200 along with the IC device 90 placed on the tray 200 toward the positive side in the Y direction, that is, in the direction of the arrow α _11A in FIG. 2. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray conveyance mechanism 11B is a moving part that can move the empty tray 200 toward the negative side in the Y direction, that is, in the direction of the arrow α _11B in FIG. 2. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1. The supply area A2 is provided with a temperature adjustment section (a soaking plate (English: soap plate, Chinese (one example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15. The temperature adjustment section 12 is configured as a mounting section on which a plurality of IC devices 90 are mounted, and the mounted IC devices 90 can be heated or cooled at one time, and is referred to as a "soaking plate". With this soaking plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance, and adjusted to a temperature suitable for the inspection (high-temperature inspection or low-temperature inspection). In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment sections 12. In addition, by fixing the temperature adjustment section 12 serving as the mounting section, the temperature of the IC device 90 on the temperature adjustment section 12 can be stably adjusted. The device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction and the Y direction, and further includes a portion that can also be moved in the Z direction. With this, the device transfer head 13 can be responsible for transferring the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 12 and the device supply section 14 described later. Of transportation. In FIG. 2, the movement in the X direction of the device transfer head 13 is indicated by an arrow α _13X , and the movement in the Y direction of the device transfer head 13 is indicated by an arrow α _13Y . The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 are removed, toward the positive side in the X direction, that is, in the direction of arrow α ₁₅ in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. An inspection section 16 that inspects the IC device 90 and a device transfer head 17 having a suction section 3 are provided in the inspection area A3. A device supply unit 14 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves across the inspection area A3 and the recovery area A4 are also provided. The device supply section 14 is configured as a mounting section on which the IC device 90 whose temperature is adjusted by the temperature adjustment section 12 is placed. The device supply section 14 is called a "supply shuttle shape" for transporting the IC device 90 near the inspection section 16. "Board" or "supply shuttle" for short. The device supply unit 14 serving as the mounting unit is supported so as to be able to move back and forth in the X direction, that is, in the direction of the arrow α ₁₄ between the supply area A2 and the inspection area A3. With this, the device supply section 14 can stably transport the IC device 90 from the supply area A2 to the vicinity of the inspection section 16 of the inspection area A3. After the IC device 90 is removed by the device transfer head 17 in the inspection area A3, it can be carried Return to supply area A2. In the configuration shown in FIG. 2, two device supply sections 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 12 are transported to any of the device supply sections 14. The device supply unit 14 is configured to heat or cool the IC device 90 placed in the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment section 12 can be transported to the vicinity of the inspection section 16 of the inspection area A3 while maintaining its temperature adjustment state. The device transfer head 17 is an operation unit that holds the IC device 90 that maintains the above-mentioned temperature adjustment state and transfers the IC device 90 in the inspection area A3. The device transfer head 17 is supported in a reciprocating manner in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called a "finger arm." Thereby, the device transfer head 17 can transfer and place the IC device 90 on the device supply section 14 carried in from the supply area A2 and place it on the inspection section 16. In FIG. 2, the Y-direction reciprocating movement of the device transfer head 17 is indicated by an arrow α _17Y . In addition, the device transfer head 17 is supported to be capable of reciprocating in the Y direction and the Z direction, but is not limited thereto, and may be supported to be capable of reciprocating in the X direction. The device transfer head 17 is configured to heat or cool the held IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply section 14 to the inspection section 16. Furthermore, the device transfer head 17 is divided into a device transfer head 17A and a device transfer head 17B, and these can also be moved independently. The inspection unit 16 is configured as a placement unit that mounts the IC device 90 that is an electronic component and checks the electrical characteristics of the IC device 90. A plurality of probe pins 163 (see FIGS. 4 and 5) electrically connected to the terminal 901 of the IC device 90 are provided in the inspection section 16. In addition, by the terminal 901 of the IC device 90 and the probe pin 163 being electrically connected, that is, making contact, the inspection of the IC device 90 can be performed. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 16. In addition, in the inspection unit 16, the IC device 90 may be heated or cooled in the same manner as the temperature adjustment unit 12 to adjust the IC device 90 to a temperature suitable for inspection. The device recovery section 18 is an IC device 90 on which the inspection by the use inspection section 16 is placed, and the IC device 90 can be transported to the placement section of the recovery area A4, and is called a "recycling shuttle plate" or simply "Recycling shuttle". The device recovery unit 18 is supported so as to be able to move back and forth between the inspection area A3 and the recovery area A4 in the X direction, that is, in the direction of the arrow α ₁₈ . In the configuration shown in FIG. 2, two device recovery units 18 are arranged in the Y direction in the same manner as the device supply unit 14. The IC devices 90 on the inspection unit 16 are transported and placed in any one of the device recovery units. Department 18. This transfer is performed by the device transfer head 17. The collection area A4 is an area where a plurality of IC devices 90 are collected in the inspection area A3 for inspection, and the inspection is completed. A collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided in the collection area A4. An empty tray 200 is also prepared in the collection area A4. The recovery tray 19 is a mounting portion on which the IC device 90 inspected by the inspection portion 16 is placed, and is fixed so as not to move within the recovery area A4. Thereby, even if it is the recovery area A4 in which various movable parts such as the device transfer head 20 are arranged, the IC devices 90 that have been inspected can be stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting section on which the IC device 90 after the inspection by the inspection section 16 is placed. Then, the IC device 90 on the device recovery section 18 moved to the recovery area A4 is transported and placed on one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and collected for each inspection result. The device transfer head 20 is supported in the recovery area A4 so as to be movable in the X direction and the Y direction, and further includes a portion that can also be moved in the Z direction. Thereby, the device transfer head 20 can transfer the IC device 90 from the device collection part 18 to the collection tray 19 or the empty tray 200. In FIG. 2, the movement in the X direction of the device transfer head 20 is indicated by an arrow α _20X , and the movement in the Y direction of the device transfer head 20 is indicated by an arrow α _20Y . The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the recovery area A4 in the X direction, that is, in the direction of the arrow α ₂₁ . After the transfer, the empty tray 200 is disposed at the position where the IC device 90 is collected, that is, it may be any of the three empty trays 200 described above. The tray removal area A5 is a material removal section that collects and removes the trays 200 in which the plurality of IC devices 90 of the inspection completion state are arranged. A plurality of trays 200 can be stacked in the tray removal area A5. In addition, tray transfer mechanisms 22A and 22B are provided to transfer the tray 200 one by one in the Y direction so as to span the recovery area A4 and the tray removal area A5. The tray conveyance mechanism 22A is a moving part that can move the tray 200 back and forth in the Y direction, that is, in the direction of the arrow α _22A . Thereby, the IC device 90 having been inspected can be transferred from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B can be used to move the empty tray 200 of the recovered IC device 90 toward the positive side in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the recovery area A4. The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, The operation of each unit such as the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B. The operator can set and confirm the operating conditions of the electronic component inspection device 1 and the like via the monitor 300. The monitor 300 includes a display screen 301 composed of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, a mouse stage 600 on which a mouse is placed is provided on the right side in the drawing of the tray removal area A5. This mouse is used when the screen displayed on the monitor 300 is operated. An operation panel 700 is disposed on the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 instructs the electronic component inspection apparatus 1 separately from the monitor 300 to a desired operator. In addition, the signal lamp 400 can report the operating state of the electronic component inspection device 1 and the like by a combination of the colors of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. Furthermore, a speaker 500 is built into the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 and the like may be notified by the speaker 500. The electronic component inspection device 1 separates the tray supply area A1 and the supply area A2 by the first partition wall 231, and separates the supply area A2 and the inspection area A3 by the second partition wall 232. The third partition wall 233 separates the inspection area A3 and the collection area A4, and the fourth partition wall 234 separates the collection area A4 and the tray removal area A5. The supply area A2 and the recovery area A4 are also separated by a fifth partition wall 235. The outermost package of the electronic component inspection device 1 is covered by a casing, which includes, for example, a front casing 241, a side casing 242, a side casing 243, a rear casing 244, and a top casing 245. As described above, the device transfer head 17 is supported so as to be movable in the Y direction and the Z direction. The device transfer head 17 transfers IC devices 90 in the inspection area A3. As shown in FIGS. 3 to 5, the device transfer head 17 includes a suction section 3, a posture adjustment section 5, and a heat insulation section 6. The suction section 3 is configured as a suction unit capable of holding the IC device 90 which is an electronic component by suction (adsorption). The suction unit 3 includes a suction nozzle 31, a first block 32, a second block 33, and a third block 34. The number of the suction units 3 is one in the configuration shown in FIGS. 3 to 5, but it is not limited to this, and may be plural. The ejector 72 as a vacuum generation source applies a suction force F ₃ to the suction portion ₃ . Negative pressure is generated by the operation of the ejector 72, the pressure is appropriately adjusted by the regulator 73 as a pressure regulating mechanism, and the inner cavity portion 324 and the inner cavity portion 333 are brought to negative pressure through the pipe 71 and the joint 36. The suction nozzle 31 is a device capable of sucking the IC device 90, and includes a cylindrical member having an inner cavity portion 313 opened on the upper surface 311 and the lower surface 312. The inner cavity portion 313 functions as a flow path through which air passes. In addition, the inner cavity portion 324 and the inner cavity portion 333 become negative pressure, and the inner cavity portion 313 communicating with the inner cavity portion 313 becomes negative pressure, that is, the air flows upward in the inner cavity portion 313, and is opened in the opening portion of the lower surface 312 (attraction (Port) 314 produces an attractive force F ₃ . Thereby, the IC device 90 can be adsorbed using the lower surface 312 as an adsorption surface. In addition, as the air flows into the inner cavity portion 313 and the pressure rises, that is, the air flows downward in the inner cavity portion 313 or the air flow stops upward, the attractive force F ₃ decreases and eventually disappears, which can make the IC device 90 from below Surface 312 is released (detached). It should be noted that the direction in which the IC device 90 is attracted, that is, the direction in which the attractive force F ₃ acts is hereinafter referred to as “attraction direction α ₃ ”. The suction direction α ₃ faces the positive side of the Z direction (see FIG. 4). The maximum value of the attractive force F ₃ (the maximum attractive force of the attraction portion 3) is not particularly limited, but is preferably -95 kPa or more and -30 kPa or less, more preferably -90 kPa or more and -50 kPa or less. Further, to be configured by setting the pressure regulator 73 and the suction unit 3 changes of attraction F _3. The regulator 73 is preferably an electronic regulator, for example. Thereby, the attractive force F ₃ can be changed (adjusted) steplessly. With such an attractive force F ₃ , the degree of vacuum in the area sealed by the gasket 35 (for example, an O-ring in this embodiment) mounted on the suction nozzle 31 can be adjusted. In this embodiment, the degree of vacuum of the adsorption nozzle 31 is fixed. A flange portion 315 having an enlarged outer diameter is formed on the outer peripheral portion of the suction nozzle 31 so as to protrude halfway in the longitudinal direction. The flange portion 315 can abut against the third block 34 to prevent the suction nozzle 31 from falling off from the suction portion 3 (see FIG. 3). Furthermore, a washer 43 is provided between the outer peripheral portion of the flange portion 315 and the inner peripheral portion of the recessed portion 343. Thereby, the pressure in the second space S2 can be maintained. A groove 316 is formed on the outer peripheral portion of the suction nozzle 31 above the flange portion 315. The groove 316 is formed in a ring shape along the circumferential direction of the adsorption nozzle 31. A ring-shaped gasket 35 is disposed in the groove 316. Thereby, the washer 35 is compressed between the suction nozzle 31 and the second block 33. A first block 32 is disposed above the adsorption nozzle 31. The first block 32 includes a block-shaped (or plate-shaped) member having a flat upper surface 321 and a lower surface 322. In addition, the first block 32 has an inner cavity portion 324 that is opened in the lower surface 322 and the side surface 323. The inner cavity portion 324 functions as a flow path through which air passes, similarly to the inner cavity portion 313 of the adsorption nozzle 31. A joint 36 is hermetically connected to the inner cavity portion 324 from the side surface 323 side. The joint 36 is connected to the ejector 72 via a pipe 71. Further, a regulator 73 is arranged in the middle of the piping 71, that is, between the joint 36 and the injector 72. A heater (not shown) for heating the IC device 90 adsorbed on, for example, the adsorption nozzle 31 may be built in the first block 32. A second block 33 is arranged below the first block 32. The second block 33 includes a block-shaped (or plate-shaped) member having a flat upper surface 331 and a lower surface 332. The upper surface 331 is in contact with the lower surface 322 of the first block 32. The second block 33 has an inner cavity portion 333 that is opened in the upper surface 331 and the lower surface 332. A portion above the flange portion 315 of the suction nozzle 31 is inserted into the inner cavity portion 333. Thereby, the adsorption nozzle 31 can move in a Z direction. The inner cavity portion 333 also functions as a flow path through which air passes, and the inner cavity portion 313 of the adsorption nozzle 31 and the inner cavity portion 324 of the first block 32 are communicated through the inner cavity portion 333. Thereby, a series of flow paths through which air passes are formed. On the upper surface 331 side of the second block 33, a groove 334 opened on the upper surface 331 and the inner cavity portion 333 are formed concentrically in a ring shape. An annular washer 37 is disposed in the groove 334. Thereby, the washer 37 is compressed between the first block 32 and the second block 33, and the airtightness of the above-mentioned series of flow paths can be maintained together with the washer 35. On the side of the lower surface 332 of the second block 33, a groove 335 opened on the lower surface 332 and the inner cavity portion 333 are formed in a ring shape concentrically. The second block 33 has an inner cavity portion 336 that communicates the inner peripheral surface of the groove 335 with the outer peripheral portion of the second block 33. A joint 41 is air-tightly connected to the inner cavity portion 336 from the outside. The joint 41 is connected to the working fluid supply unit 85 via a pipe 8 (pipe 81). The working fluid supply unit 85 supplies a working fluid R (for example, air) to a first space S1 and a second space S2 described later. Since the first space S1 and the second space S2 are provided with a common fluid supply unit, the device configuration can be simplified. Furthermore, it is possible to omit providing dedicated operating fluid supply units in the first space S1 and the second space S2, respectively. This can further simplify the device configuration. In addition, the operating fluid R can be moved in and out in the first space S1 and the second space S2. As described later, the piston 512 can slide in the cylinder 511 and the suction nozzle 31 can slide in the through hole 344. Here, the pressure of the working fluid R supplied to the first space S1 and the second space S2 is the same pressure in this embodiment, but may be different. In addition to the supply of the working fluid, the working fluid supply unit 85 may perform suction (recovery of the working fluid R). A third block 34 is arranged below the second block 33. The third block 34 includes a block-shaped (or plate-shaped) member having a flat upper surface 341 and a lower surface 342. The upper surface 341 is in contact with the lower surface 332 of the second block 33. On the upper surface 341 side of the third block 34, a concave portion 343 that is open on the upper surface 341 and is larger than the flange portion 315 of the adsorption nozzle 31 in a plan view is formed. The flange portion 315 is movable in the Z direction in the concave portion 343. In addition, as shown in FIG. 3, in a state where the flange portion 315 abuts the bottom of the recessed portion 343, the movement limit of the position of the suction nozzle 31 on the lower side is restricted, thereby preventing the suction nozzle 31 from falling off. In contrast, in a state where the flange portion 315 is in contact with the lower surface 332 of the second block 33, the movement limit of the position of the suction nozzle 31 on the upper side is restricted. Furthermore, the movable movable area of the suction nozzle 31 is sufficiently secured so as to correspond to the thickness of various IC devices 90. In addition, the recessed portion 343 communicates with the groove 335, and the space obtained by aligning the recessed portion 343 with the groove 335 functions as the second space S2 to which the working fluid R is supplied. A through hole 344 is formed in the bottom of the recessed portion 343 and penetrates to the lower surface 342. Regardless of the position of the suction nozzle 31, a portion lower than the flange portion 315 may protrude from the through hole 344. A guide hole 345 is formed in the third block 34 and penetrates from the upper surface 341 to the lower surface 342. In the configuration shown in FIGS. 3 to 5, two guide holes 345 are formed. A guide pin 164 of the inspection section 16 is inserted into each guide hole 345. Thereby, when the suction nozzle 31 (suction section 3) presses the IC device 90 to the inspection section 16, the positioning of the IC device 90 and the inspection section 16 is performed. By this positioning, each terminal 901 of the IC device 90 can be brought into contact with each probe pin 163 of the inspection section 16. A posture adjustment section 5 is disposed above the suction section 3. The posture adjustment unit 5 is called a "compliance unit" that adjusts the posture of the suction unit 3 in the state shown in Fig. 5. The posture adjustment unit 5 includes a first adjustment mechanism 51 and a second adjustment mechanism 52. The first adjustment mechanism 51 is responsible for the posture adjustment of the suction section 3 around the X axis and the posture adjustment of the suction section 3 around the Y axis during the posture adjustment of the suction section 3. The first adjustment mechanism 51 includes a cylinder 511 and a piston 512 that can slide in the Z direction relative to the cylinder 511. The cylinder 511 has an inner cavity portion 513 on the inside. A piston 512 is inserted inside the inner cavity portion 513. The piston 512 includes a flange portion 514 and a piston link 515 that connects the flange portion 514 and the second adjustment mechanism 52. The outer peripheral portion of the flange portion 514 is curved. Thereby, the outer peripheral portion of the piston 512 with an arc can change its posture in such a manner that the central axis of the piston 512 is inclined. This allows the piston 512 to change its posture in a manner that mimics the orientation of the surface of the contact portion 162 of the inspection portion 16. Furthermore, the radian of the piston 512 may be omitted and a gasket separated from the piston 512 may be provided. In this case, as long as the washer includes an elastic body, the posture of the piston 512 can be changed such that the center axis thereof is inclined in the same manner as described above. As shown in FIG. 3, the cylinder block 511 is provided with a through hole 516 penetrating the inner peripheral portion and the outer peripheral portion. A joint 42 is air-tightly connected to the through hole 516 from the outside. The joint 42 is connected to the working fluid supply unit 85 via a pipe 8 (pipe 82). In addition, the pipe 8 is configured to branch into a pipe 81 and a pipe 82 from the middle. A storage tank 83 and a regulator 84 are provided between the branch point 86 of the pipe 8 and the working fluid supply unit 85. The regulator 84 is disposed closer to the working fluid supply portion 85 than the tank 83. The regulator 84 may have the same configuration as the regulator 73. The storage tank 83 can store the working fluid R supplied from the working fluid supply unit 85 on the inside, and functions as a storage tank or a buffer tank of the working fluid R. The internal space of the storage tank 83 communicates with the second space S2 via a pipe 81. That is, the storage tank 83 functions as a third space communicating with the second space S2. Thereby, even if the pressure in the second space S2 is changed by the movement of the adsorption nozzle 31, the working fluid R escapes to the storage tank 83 or the working fluid R flows from the third space to the storage due to communication with the storage tank 83 Box 83. As a result, fluctuations in the internal pressure of the second space S2 can be reduced. As a result, the suction nozzle 31 can stably press the IC device 90. In this way, the storage tank 83 functions as a moderating unit that mitigates a change in pressure in the second space S2. A second adjustment mechanism 52 is disposed below the first adjustment mechanism 51. The second adjustment mechanism 52 includes two plate members 521 that overlap in the Z direction. The two plate members 521 are relatively movable in the XY plane direction. With this, the second adjustment mechanism 52 can be responsible for the posture adjustment of the suction section 3 in the X direction, the posture adjustment of the suction section 3 in the Y direction, and the posture adjustment of the suction section 3 around the Z axis. The posture adjustment unit 5 is a mechanism (not shown) that is connected to the entire support device transfer head 17 via the connection portion 171 so that it can move back and forth in the Y direction and the Z direction. A heat insulation section 6 is disposed between the suction section 3 and the posture adjustment section 5. The heat insulation section 6 can prevent or suppress heat from being transmitted from the heater built into the first block 32 to the posture adjustment section 5. Thereby, the posture adjustment part 5 can prevent a malfunction due to the said heat, and can operate normally, namely, can adjust the posture of the suction part 3 accurately. In the present embodiment, the heat insulation section 6 includes a plurality of heat insulation members 61 having a columnar shape. The thermal conductivity of each heat insulating member 61 is relatively small, and a plurality of the heat insulating members 61 are arranged apart from each other. The material of the heat-insulating member 61 is not particularly limited. For example, various heat-insulating materials such as glass epoxy resin can be used. The first block body 32 and the plate member 521 are connected to each other by a heat insulating member 61 spaced apart from each other, and since each heat insulating member 61 is a gap, heat conduction between the first block body 32 and the plate member 521 is suppressed. As described above, the inspection section 16 is arranged in the inspection area A3. The inspection portion 16 is a placement portion on which the electronic component, ie, the IC device 90 is placed, and is a socket for inspecting the IC device 90 in the placed state. As shown in FIGS. 4 and 5, the inspection section 16 includes an inspection section body 161, an abutting section 162, a probe pin 163, and a guide pin 164. The inspection unit main body 161 is recessed to form a recessed portion (recess) 165 on which the IC device 90 is housed. The number of the recessed portions 165 is one in the configuration shown in FIGS. 4 and 5, but it is not limited to this, and may be plural. Protruding to the bottom of the recess 165 are the same number of probe pins 163 as the terminals 901 of the IC device 90. The inspection section (mounting section) 16 includes an electronic component biasing section 166 that biases the IC device 90 that is an electronic component mounted on the inspection section (mounting section) 16 in the suction direction α ₃ . The electronic component biasing portion 166 includes a coil spring built into each probe pin 163. Thereby, each terminal 901 of the IC device 90 and each probe pin 163 can be fully contacted with each other by being pressed against the IC device 90 from the side of the attraction portion 3. Thereby, the inspection of the IC device 90 can be performed accurately. As described above, the inspection section 16 as a mounting section may be disposed in the inspection area A3, and the inspection section 16 mounts the IC device 90, which is an electronic component. The inspection section 16 as the mounting section includes a contact section 162. The abutting portion 162 includes a plate-shaped member and is provided on the inspection portion body 161 in an overlapping manner. Thereby, the abutting part 162 can abut against the lower surface 342 of the third block 34 of the suction part 3 provided in the device transfer head 17. The device transfer head 17 includes a posture adjustment unit 5 that can adjust the posture of the suction unit 3. Here, for example, it is assumed that the entire inspection unit 16 is inclined by 1 degree with respect to the XY plane (horizontal plane). In this case, as shown in FIG. 5, in a state where the suction section 3 is in contact with the abutment section 162, the posture adjustment section 5 causes the suction section 3 to imitate the same inclined posture as the inspection section 16. Such a posture adjustment of the attraction portion 3 facilitates the contact between the terminals 901 of the IC device 90 and the probe pins 163. The guide pins 164 are disposed in the inspection unit body 161 corresponding to the respective guide holes 345 of the suction unit 3. Each guide pin 164 is fixed to the inspection part body 161 and protrudes upward. Further, as described above, the positioning of the IC device 90 and the inspection section 16 is performed by inserting the guide pin 164 into the guide hole 345 of the suction section 3. Thereby, each terminal 901 of the IC device 90 can be brought into contact with each probe pin 163 of the inspection section 16. In addition, in the IC device 90 adsorbed on the adsorption nozzle 31, when the lower surface (suction surface) 312 of the adsorption nozzle 31 is used as a reference, the distance H ₉₀ from the lower surface 312 to each terminal 901 may be uneven. For this reason, for example, the following individual differences can be cited: even for the same type of IC device 90, the thickness of the IC device 90 has a difference (unevenness), that is, there is a large thickness error (see FIGS. 6 and 7), or The IC device 90 is warped (refer to FIG. 8). In addition, FIG. 6 shows a state where the thickness of the IC device 90 itself exists, and FIG. 7 shows a state where the IC devices 90 of the same kind have thinner IC devices 90 or thicker IC devices 90, and FIG. 8 shows A state where the IC device 90 itself is warped. For example, when the distance H _{90 is} relatively small, there may be a case where the terminals 901 of the probe pins 163 of the inspection section 16 cannot be reached in each of the terminals 901. In this case, the contact becomes poor, making it difficult to perform an accurate inspection. When the distance H _{90 is} relatively large, each terminal 901 can reach and contact the probe pin 163 of the inspection section 16, but there may be a case where the contact pressure 901 is excessive. In this case, it is also difficult to perform an accurate inspection. Therefore, the electronic component inspection device 1 (electronic component conveying device 10) of this embodiment has a structure capable of eliminating such a phenomenon. Hereinafter, this configuration and operation will be described with reference to FIGS. 3 to 5. [1] As shown in FIG. 3, the device transfer head 17 is in a state in which the IC device 90 has not been attracted to the suction section 3. In addition, at this time, the ejector 72 performs suction. The working fluid R is supplied to the first space S1 and the second space S2, and the first space S1 and the second space S2 become a positive pressure. When the second space S2 becomes a positive pressure, the flange portion 315 of the suction nozzle 31 is brought into contact with the third block 34. [2] Then, the device transfer head 17 can suck the IC device 90 on the device supply section 14 into the inspection area A3 by the suction section 3. Thereby, the device transfer head 17 is in the state shown in FIG. 4. In the state shown in FIG. 4, the IC device 90 is attracted to the adsorption nozzle 31 by the attractive force F ₃ . As described above, when the IC device 90 is adsorbed, the adsorption nozzle 31 moves toward the positive side in the Z direction (suction direction α ₃ ) than the state shown in FIG. 3. That is, the flange portion 315 of the suction nozzle 31 is in a state of being separated from the third block 34. Then, in a state where the IC device 90 is adsorbed, the adsorbed IC device 90 can be disposed directly above the recessed portion 165 of the inspection portion 16 by moving the device transfer head 17. [3] Thereafter, as shown in FIG. 5, the device transfer head 17 can be lowered until the suction section 3 comes into contact with the inspection section 16. With this, the suction unit 3 can press the IC device 90 and store it in the recessed portion 165 of the inspection unit 16 while imitating the posture of the inspection unit 16 (hereinafter, this state will be referred to as a "pressed storage state"). At this time, the suction nozzle 31 receives a reaction force from the inspection unit 16 via the IC device 90 and moves further toward the positive side in the Z direction than the state shown in FIG. 4. That is, in the pressed storage state, the distance between the flange portion 315 of the suction nozzle 31 and the third block 34 is larger than the state shown in FIG. 4. As described above, in the pressed and stored state shown in FIG. 5, the adsorption nozzle 31 is separated from the third block 34. Therefore, by supplying the operating fluid R to the second space S2, the adsorption nozzle 31 can move in the −Z direction. Accordingly, the IC device 90 can be appropriately urged toward the inspection unit 16 via the suction nozzle 31 with a force suitable for inspection. As a result, as shown in, for example, FIGS. 6 to 8, regardless of the distance H ₉₀ , each terminal 901 of the IC device 90 and the probe pin 163 of the inspection unit 16 can be brought into proper and uniform contact (abutment). Therefore, the inspection of the IC device 90 can be accurately performed. In particular, according to the degree of the individual differences of the IC device 90 (the uneven shape of the upper surface, etc.), the magnitude of the attractive force F3 'is different for each IC device 90. In the pressed storage state, the suction nozzle 31 becomes a third block. 34 Possibility of contact status. In this case, it is difficult to further press the IC device 90 against the recessed portion 165 of the inspection portion 16 by the suction nozzle 31. In contrast, in the electronic component transfer device 10, the supply amount of the working fluid R to the second space S2 can be adjusted. Thereby, the supply amount of the working fluid R can be adjusted so that the adsorption nozzle 31 may move away from the third block 34 in the pressed storage state. Accordingly, in the pressed storage state, the IC device 90 can be further pressed against the recessed portion 165 of the inspection portion 16 by the suction nozzle 31. The third block 34 as the second base portion may be in contact with the inspection portion 16 as the electronic component placement portion on which the IC device (electronic component) 90 is placed. Thereby, the 3rd block 34 presses the inspection part 16, and the posture of the 3rd block 34 can be made to imitate the shape of the contact part 162 of the inspection part 16. Accordingly, the suction nozzle 31 can be brought into contact with the IC device 90 in the simulated state. As a result, each of the terminals 901 of the IC device 90 and the probe pins 163 of the inspection unit 16 can be brought into contact (abutting) appropriately and uniformly, and thus the inspection of the IC device 90 can be performed accurately. As shown in FIG. 3, the area of the flange portion 514 of the piston 512 as the first sliding portion receiving the first pressure-receiving surface M1 of the working fluid R in the first space S1 is larger than the adsorption nozzle serving as the second sliding portion. 31 The area of the second pressure receiving surface M2 receiving the working fluid R in the second space S2. As a result, as shown in this embodiment, in a configuration in which the same amount of the working fluid R is supplied to the first space S1 and the second space S2, the second pressure surface M2 can receive less force from the working fluid R than the first The pressure surface M1 receives a force from the actuating fluid R. As a result, the force (second contact force) with which the suction nozzle 31 presses the IC device 90 can be made smaller than the force (first contact force) with which the third block 34 presses the inspection section 16. This can prevent the suction nozzle 31 from pressing the IC device 90 excessively. As described above, in the electronic component conveying device 10, the contact force (second contact force) of the adsorption nozzle 31 as the second sliding portion abutting against the IC device (electronic component) 90 is the third block that is a part of the second base portion. The abutting force (first abutting force) of the body 34 abutting on the inspection section 16 which is an electronic component placement section is different. In this embodiment, as described above, since the second contact force is smaller than the first contact force, it is possible to prevent the suction nozzle 31 from pressing the IC device 90 excessively. The person pressed by the first pressure-receiving surface M1 is the entire suction portion 3 as a portion lower than the first pressure-receiving surface M1. In contrast, the person pressed by the second pressure receiving surface M2 is a part of the adsorption nozzle 31 which is a portion lower than the second pressure receiving surface M2. Therefore, it is preferable that the pressing force of the first pressure receiving surface M1 is greater than the pressing force of the second pressure receiving surface M2. Therefore, the area of the first pressure receiving surface M1 becomes larger than the area of the second pressure receiving surface M2. The area of the first pressure-receiving surface M1 is preferably 2 times to 20 times the area of the second pressure-receiving surface M2, and more preferably 3 times to 15 times. Thereby, the above-mentioned effect can be exhibited more reliably. Furthermore, in the present embodiment, the piston 512 as the first sliding portion and the third block 34 as the second base portion are configured separately, but these may be integrally formed. <Second Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. . This embodiment is the same as the first embodiment except that the configuration of the electronic component, the second base portion, and the inspection portion is different. In this embodiment, the IC device 90 includes a substrate 902 and a protruding portion 903 protrudingly provided on a surface on the + Z side of the substrate 902. Furthermore, a plurality of terminals 901 are provided on a surface on the -Z side of the substrate 902. The size of the protruding portion 903 in plan view is substantially the same as that of the lower end surface of the suction nozzle 31. Moreover, in the electronic component conveying apparatus 10, the recessed part 165 of the inspection part 16 becomes the magnitude | size which the board | substrate 902 can enter. In this embodiment, the piping 81 and the piping 82 are constituted by independent flow paths, and a storage tank 83, a regulator 84, and an operating fluid supply unit 85 are connected to the piping 81 and the piping 82, respectively. Thereby, the pressure in the first space S1 and the second space S2 can be adjusted independently. That is, the pressure of the actuating fluid R to the first space S1 and the pressure of the actuating fluid R to the second space S2 can be changed separately and can be set individually. Accordingly, the force with which the suction nozzle 31 presses the IC device 90 and the force with which the third block 34 presses the IC device 90 and the inspection section 16 can be independently adjusted. Although this structure is not shown in the figure, it can be omitted to design the ratio of the first pressure receiving surface M1 and the second pressure receiving surface M2 to a desired value, which is advantageous. In addition, the pressure setting of the first space S1 and the second space S2 may be configured to be operated on the monitor 300 shown in FIG. 1. With such a configuration, the contact force of the suction nozzle 31 as the second sliding portion against the IC device (electronic component) 90 and the third block 34 as a part of the second base portion can be brought into contact. The abutting force is different for the IC device (electronic component) 90. Therefore, for example, when it is desired to reduce the load on the substrate 902, the contact force to the substrate 902 can be made weaker than the contact force to the projection 903, or when the load to the projection 903 is to be reduced, The contact force to the protruding portion 903 can be made weaker than the contact force to the substrate 902. Further, in the electronic component conveying device 10, the third block 34 of the suction section 3 has a protruding portion 346 protruding from the lower surface 342 in the -Z direction. The protruding portion 346 enters the recessed portion 165 of the inspection portion 16 in a pressed and stored state. In addition, the protruding portion 346 comes into contact with the substrate 902 of the IC device 90 in a pressed storage state. That is, the protruding portion 346 which is a part of the second base portion may be in contact with the substrate 902 which is a part of the IC device (electronic component) 90. Thereby, the protruding portion 346 can press the substrate 902 of the IC device 90. Moreover, in the pressed storage state, the protruding portion 903 of the IC device 90 enters the through hole 344 of the third block 34 and is pressed by the suction nozzle 31. The protruding portion 346 of the third block 34 as a part of the second base portion and the suction nozzle 31 as the second sliding portion abut against the IC device (electronic component) 90 at different positions. Thereby, the protruding portion 346 can press the substrate 902 of the IC device 90, and the suction nozzle 31 can press the protruding portion 903 of the IC device 90. Moreover, in the pressed storage state, the lower surface 342 of the third block 34 is in contact with the contact portion 162 of the inspection portion 16, and the inspection portion 16 is pressed by the third block 34. In this way, in this embodiment, the suction nozzle 31 presses the protruding portion 903 of the IC device 90, the protruding portion 346 of the third block 34 presses the substrate 902 of the IC device 90, and the lower surface 342 of the third block 34 presses the inspection portion 16 . With this, even if the IC device 90 has a step difference as in this embodiment, each terminal 901 of the IC device 90 and the probe pin 163 of the inspection section 16 can be brought into contact (abutment) appropriately and uniformly. The inspection of the IC device 90 can be performed accurately. <Third Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 10, but the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. . This embodiment is the same as the second embodiment except that the configuration of the electronic component and the second base is different. In the present embodiment, IC device 90 projection center line 903 of the center of the substrate ₉₀₃ S 902 S ₉₀₂ are shifted in the X and Y directions. That is, the protruding portion 903 is eccentrically disposed with respect to the substrate 902. The "center" refers to a point where two diagonal lines intersect when the plan view shape is a quadrangle. In the present embodiment, the through-holes 344 are arranged offset from each other in the X direction and the Y direction with respect to the center of the protruding portion 346 of the third block 34 corresponding to the shift between the center S ₉₀₂ and the center S ₉₀₃ . That is, the through hole 344 is eccentrically disposed with respect to the protruding portion 346. Thereby, the suction nozzle 31 sliding in the through hole 344 can press the protruding portion 903 of the IC device 90. Thus, in the present embodiment, even if the projecting portion 903 of the center ₉₀₃ S 902 S of the center of the substrate ₉₀₂ in the X direction and the Y direction is shifted, the IC can each terminal device 901 and the inspection unit 90 of the contact probe 16 The feet 163 are properly and uniformly contacted (abutted), so that the inspection of the IC device 90 can be performed accurately. <Fourth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 11. However, the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. . This embodiment is the same as the second embodiment except that the configuration of the inspection unit is different. As shown in FIG. 11, the device supply unit 14 is an electronic component placement unit before the IC device (electronic component) 90 on which the inspection is carried, and the device recovery unit 18 is the IC device (electronic part) 90 on which the IC device (the electronic component) 90 after inspection is placed The electronic part mounting section after inspection. As shown in FIG. 11, the device supply unit 14 and the device recovery unit 18 are unitized as a movable unit 30 that can move and mount an IC device (electronic component) 90. The movable unit 30 includes an X-direction moving mechanism 7 in addition to the device supply unit 14 and the device recovery unit 18. The device supply portion 14 is formed with a recessed portion (recess) 141 on which the IC device 90 is housed. In this embodiment, the number of the recessed portions 141 is eight, and the configuration is preferably the same as the configuration of the eight suction portions 3 in the device transfer head 17A or the device transfer head 17B, that is, they are separated from each other. There are four X-directions and two Y-directions. The device recovery portion 18 is also formed with a recess (cavity) 181 on which the IC device 90 is housed. In this embodiment, the number of the recesses 181 formed is eight, and the configuration is preferably the same as that of the eight suction sections 3 in the device transfer head 17, that is, four are arranged in the X direction. There are two states in the Y direction. The X-direction moving mechanism 7 includes a linear guide 71A and a support base 72A that supports the device supply unit 14 and the device recovery unit 18 together. The linear guide 71A includes a track 711A and two sliders 712A. A support base 72A is fixed to the two sliders 712A. The electronic component transporting device 10 includes a force detection unit 9 provided in the movable portion 30 (the device supply portion 14 in the configuration shown in the figure) and capable of detecting a force. The force detection section 9 is disposed on the spacer 73A on the device supply section 14. The force detection unit 9 is not particularly limited, and for example, a load cell is preferably used. The load cell is a converter that has a built-in strain gauge and converts the magnitude of the force into an electrical signal. Thereby, the abutment force F ₉₀ can be detected as accurately as possible using actual measured values instead of design values (calculated values). The detection result detected by the force detection unit 9, that is, the magnitude of the contact force is stored in the memory unit 802 of the control unit 800 (see FIG. 1). The force detection section 9 is arranged on the spacer 73A on the device supply section 14 and can be brought into contact with (IC) an IC device (electronic component) 90 that is in contact with (adsorbed on) the adsorption nozzle 31 as the second sliding section. In this embodiment, for example, as shown in FIG. 11, before the IC device 90 is placed in the pressed storage state, that is, before the inspection is performed, the IC device 90 is pressed against the force detection unit 9 to detect the contact force F. ₉₀ . Then, the pressing force can be adjusted based on the detected abutment force F ₉₀ . In addition, as the timing for detecting the contact force F ₉₀ , for example, it is preferable to perform detection at a position where the IC device 90 comes into contact with the force detection section 9 and then descends within a range of 0.1 mm to 2.0 mm. Furthermore, the detection of the contact force as described above may also be performed without using the IC device 90, but using a force detection member having the same size as the IC device 90. <Fifth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 12, but the differences from the above embodiment will be mainly described, and the same matters are omitted. Instructions. This embodiment is the same as the first embodiment except that the configuration of the first sliding portion is different. As shown in FIG. 12, an elastic diaphragm 53 is provided inside the cylinder 511. The diaphragm 53 is provided midway in the Z direction of the cylinder 511 and is closer to the -Z side than the through hole 516. The diaphragm 53 has its lower surface 531 in contact with the flange portion 514 of the piston 512. Although not shown, the diaphragm 53 is parallel to the X-axis and the Y-axis in a natural state. In this embodiment, the space on the + Z side with respect to the diaphragm 53 becomes the first space S1. As shown in FIG. 12, in a state where the piston 512 lifts the diaphragm 53 to the + Z side and deforms the diaphragm 53, the piston 512 receives the restoring force of the diaphragm 53 to return to the natural state. Thereby, the parallelism with respect to the XY plane can be achieved by the diaphragm 53. As a result, when the parallelism is achieved, the third block 34 can press the inspection section 16. <Sixth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to Figs. 1 and 13 to 20, but the differences from the above embodiment will be mainly described. The description of the same matters is omitted. In addition, for convenience of explanation below, the upper side in FIGS. 14 to 20 (the same applies to FIGS. 21 and 22) is referred to as “up” or “upper”, and the lower side is referred to as “down” or “lower” Situation. The electronic component transporting device 10 according to this embodiment includes a suction section 3 (suction nozzle 31) that can hold the electronic component by suction and can move in the suction direction α ₃ of the suction electronic component; a coil spring 4, which can be suction section 3 (suction nozzles 31) toward the suction direction of the urging direction counter ₃ [alpha], and may be in a state attracted electronic part attracted to the shrinkage direction [alpha] _3. Thereby, as described later, even if there is an individual difference in the electronic component (IC device 90), the difference can be offset by the coil spring 4 which can be contracted in a state where the electronic component is attracted. In addition, for example, when performing electrical inspection of electronic parts using the inspection unit 16, regardless of individual differences in the electronic parts, the terminals (terminals 901) of the electronic parts can be uniformly abutted against the terminals of the inspection unit 16 ( Probe pin 163), so that the inspection can be performed accurately. The electronic component inspection device 1 according to the present embodiment includes an electronic component transfer device 10 according to the present embodiment, and further includes an inspection unit 16 for inspecting electronic components. That is, the electronic component inspection apparatus 1 according to this embodiment includes a suction section 3 (suction nozzle 31) that can hold the electronic component by suction and can move in the suction direction α ₃ of the suction electronic component; and serves as a biasing section. A coil spring 4, which can urge the suction portion 3 (suction nozzle 31) in a direction opposite to the suction direction α ₃ , and can contract in the suction direction α ₃ in a state of attracting electronic parts; and the inspection portion 16, It inspects electronic parts. Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component conveying apparatus 10 can be obtained. In addition, the electronic component can be transported to the inspection unit 16, so that the inspection of the electronic component can be performed by the inspection unit 16. In addition, electronic components after inspection can be transported from the inspection unit 16. The configuration of each unit will be described below. As described above, the device transfer head 17 is supported so as to be movable in the Y direction and the Z direction. The device transfer head 17 transfers IC devices 90 in the inspection area A3. As shown in FIGS. 14 to 16, the device transfer head 17 includes a suction section 3, a coil spring 4 as a biasing section, an attitude adjustment section 5, and a heat insulation section 6. The ejector 72 as a vacuum generation source applies a suction force F ₃ to the suction portion ₃ . Negative pressure is generated by the operation of the ejector 72, the pressure is appropriately adjusted by the regulator 73 as a pressure regulating mechanism, and the inner cavity portion 324 and the inner cavity portion 333 are brought into negative pressure through the pipe 71 and the joint 36. The maximum value of the attraction force F ₃ (the maximum attraction force of the attraction portion 3) is not particularly limited, and is preferably -95 kPa or more and -30 kPa or less, more preferably -90 kPa or more and -50 kPa or less. Further, to be configured by setting the pressure regulator 73 and the suction unit 3 changes of attraction F _3. The regulator 73 is preferably an electronic regulator, for example. Thereby, the attractive force F ₃ can be changed (adjusted) steplessly. With such an attractive force F ₃ , the degree of vacuum in the area sealed by the gasket 35 (for example, an O-ring in this embodiment) mounted on the suction nozzle 31 can be adjusted. The degree of vacuum becomes the force (area × degree of vacuum) for pulling the suction nozzle 31, and the pressing force of the coil spring 4 can be reduced by the amount of the pulling force. That is, the reaction force of the coil spring 4 can be adjusted by adjusting the attractive force F _3, and the pressing force can be adjusted. Furthermore, the IC device 90 can be transported in the inspection area A3 while the suction state is maintained. This prevents the IC device 90 from dropping during transportation. A flange portion 315 having an enlarged outer diameter is formed on the outer peripheral portion of the suction nozzle 31 so as to protrude halfway in the longitudinal direction. The flange portion 315 functions as a spring seat in which the lower end 23 of the coil spring 4 abuts. The flange portion 315 is in contact with the third block 34 to prevent the suction nozzle 31 from falling out of the suction portion 3 (see FIG. 14). A groove 334 is formed on the upper surface 331 of the second block 33 concentrically with the inner cavity portion 333. An annular washer 37 is disposed in the groove 334. Thereby, the washer 37 is compressed between the first block 32 and the second block 33, and the airtightness of the above-mentioned series of flow paths can be maintained together with the washer 35. A groove 335 is formed on the lower surface 332 of the second block 33 concentrically with the inner cavity portion 333. The bottom of the groove 335 functions as a spring seat against which the upper end 24 of the coil spring 4 abuts. A third block 34 is arranged below the second block 33. The third block 34 includes a block-shaped (or plate-shaped) member having a flat upper surface 341 and a lower surface 342. The upper surface 341 is in contact with the lower surface 332 of the second block 33. A concave portion 343 is formed on the upper surface 341 of the third block 34 and is larger than the flange portion 315 of the suction nozzle 31 in a plan view. Within the recessed portion 343, the flange portion 315 is movable in the Z direction. Further, as shown in FIG. 14, in a state where the flange portion 315 abuts the bottom of the recessed portion 343, the movement limit of the position of the suction nozzle 31 on the lower side is restricted, thereby preventing the suction of the suction nozzle 31 from falling off. In contrast, in a state where the flange portion 315 is in contact with the lower surface 332 of the second block 33, the movement limit of the position of the suction nozzle 31 on the upper side is restricted. Furthermore, the movable movable area of the suction nozzle 31 is sufficiently ensured so as to correspond to the thickness of various IC devices 90. A through hole 344 is formed in the bottom of the recessed portion 343 and penetrates to the lower surface 342. Regardless of the position of the suction nozzle 31, a portion lower than the flange portion 315 may protrude from the through hole 344. A guide hole 345 is formed in the third block 34 and penetrates from the upper surface 341 to the lower surface 342. In the configuration shown in FIGS. 14 to 16, two guide holes 345 are formed. A guide pin 164 of the inspection section 16 is inserted into each guide hole 345. Thereby, when the suction nozzle 31 (suction section 3) presses the IC device 90 to the inspection section 16, the positioning of the IC device 90 and the inspection section 16 is performed. By this positioning, each terminal 901 of the IC device 90 and each probe pin 163 of the inspection section 16 can be brought into contact. As shown in FIG. 17, the suction unit 3 includes a guide member 38 that guides the suction nozzle 31 that moves. The guide member 38 includes a rod-shaped member arranged parallel to the Z direction, and is fixed to the second block 33 and the third block 34. A notch portion 317 is formed in the flange portion 315 of the suction nozzle 31 and penetrates the guide member 38. Such a guide member 38 and the cutout portion 317 constitute an anti-rotation mechanism of the suction nozzle 31. The suction nozzle 31 does not rotate with respect to the second block 33 and the third block 34, and can stably move in the Z direction. In addition, such an anti-rotation mechanism may be omitted in the suction section 3. As shown in FIGS. 14 to 16, a coil spring 4 as a biasing portion is built in the suction portion 3 and is disposed concentrically with the suction nozzle 31 on the outer peripheral side of the suction nozzle 31. In addition, in the state shown in FIG. 14, the coil spring 4 may have a natural length between the flange portion 315 of the suction nozzle 31 and the second block 33, and is preferably in a compressed state. The coil spring 4 is a biasing portion that biases the suction nozzle 31 of the suction portion 3 in a direction opposite to the suction direction α ₃ , that is, on the negative side of the Z direction. By including the coil spring 4 in this way, the configuration of the urging portion can be simplified. In addition, as the urging portion, a light weight suitable for being built in the suction portion 3 can be used. The constituent material of the coil spring 4 is not particularly limited, and for example, a metal material exhibiting sufficient elasticity such as stainless steel is preferably used. As described above, the suction nozzle 31 can move in the Z direction along the inner cavity portion 333. As shown in FIG. 15 and FIG. 16, in a state where the suction nozzle 31 suctions the IC device 90, the inner cavity portion 333 becomes a state of negative pressure, so that an attractive force equivalent to the suction force F ₃ is generated with respect to the suction nozzle 31. F ₃ '(stretching force upward). The suction force F ₃ ′ acts on the suction nozzle 31 itself, and pulls the suction nozzle 31 in the suction direction α ₃ (the positive side in the Z direction). At this time, although the coil spring 4 is contracted, it is not fully contracted, that is, the contraction limit is not reached, and the coil spring 4 can be further contracted in the suction direction α ₃ (hereinafter, this state is referred to as a "contractible state"). The spring constant of the coil spring 4 is preferably 1 N / mm or more and 90 N / mm or less, and more preferably 50 N / mm or more and 70 N / mm or less. The outer diameter fD _{4-1 of the} coil spring 4 is preferably 7 mm or more and 20 mm or less, and more preferably 10 mm or more and 15 mm or less. The inner diameter fD _{4-2 of the} coil spring 4 is preferably 5 mm or more and 10 mm or less, and more preferably 5 mm or more and 7 mm or less. The wire diameter fD _{4-3 of the} coil spring 4 is preferably 0.3 mm or more and 2 mm or less, and more preferably 0.5 mm or more and 1.4 mm or less. When the coil spring 4 satisfies such a condition, the coil spring 4 can be built into the suction portion 3 relatively easily. In addition, a force (pressing force) suitable for inspection can be given to the IC device 90. The coil spring 4 can maintain a retractable state. The first adjustment mechanism 51 includes an air cylinder, and can be responsible for the posture adjustment of the suction section 3 about the X axis and the posture adjustment of the suction section 3 about the Y axis during the posture adjustment of the suction section 3. In the present embodiment, the heat insulation section 6 includes a plurality of heat insulation members 61 having a columnar shape. Each heat insulation member 61 is arrange | positioned apart from each other. In addition, as a constituent material of the heat insulation member 61, there is no restriction | limiting in particular, For example, various heat insulation materials, such as glass epoxy resin, can be used. The inspection section (mounting section) 16 includes an electronic component biasing section 166 that biases the IC device 90 that is an electronic component mounted on the inspection section (mounting section) 16 in the suction direction α ₃ . The electronic component urging portion 166 is constituted by a coil spring built into each probe pin 163. Thereby, the terminals 901 of the IC device 90 and the probe pins 163 can be fully brought into contact with each other by complementing the pressing of the IC device 90 from the side of the attraction portion 3. Thereby, the inspection of the IC device 90 can be performed accurately. However, in the IC device 90 adsorbed on the adsorption nozzle 31, if the lower surface (adsorption surface) 312 of the adsorption nozzle 31 is used as a reference, the distance H ₉₀ from the lower surface 312 to each terminal 901 may be uneven. . The reasons include, for example, the following individual differences: even for the same type of IC device 90, the thickness of the IC device 90 has a difference (unevenness), that is, there is a large or small thickness error (refer to FIGS. 18 and 19), or Warpage occurs in the IC device 90 (see FIG. 20). Furthermore, FIG. 18 shows a state in which the thickness of the IC device 90 itself is large or small, and FIG. 19 shows a state in which there are thinner IC devices 90 and thicker IC devices 90 even if the IC devices 90 of the same type are each other. 20 indicates a state in which the IC device 90 itself is warped. For example, when the distance H _{90 is} relatively small, there is a terminal 901 in each terminal 901 that cannot reach the probe pin 163 of the inspection section 16. In this case, the contact becomes poor, making it difficult to perform an accurate inspection. Also, when the distance H _{90 is} relatively large, although each terminal 901 can reach and contact the probe pin 163 of the inspection section 16, there may be a terminal 901 where the contact pressure is excessive. In this case, it is also difficult to perform an accurate inspection. Therefore, the electronic component inspection device 1 (electronic component conveying device 10) of this embodiment has a structure which can eliminate such a phenomenon. Hereinafter, this configuration and operation will be described with reference to FIGS. 14 to 16. [1] As shown in FIG. 14, the device transfer head 17 is in a state where the IC device 90 has not been attracted to the suction section 3. In addition, the coil spring 4 is in a state of being extended to the maximum, and the flange portion 315 of the suction nozzle 31 is in contact with the third block 34. [2] Then, the device transfer head 17 can suck the IC device 90 on the device supply section 14 into the inspection area A3 by the suction section 3. Thereby, the device transfer head 17 is in the state shown in FIG. In the state shown in FIG. 15, the IC device 90 is attracted to the adsorption nozzle 31 by the attractive force F ₃ . As described above, when the IC device 90 is adsorbed, the adsorption nozzle 31 moves closer to the positive side in the Z direction (suction direction α ₃ ) than the state shown in FIG. 14. Then, the device carrying head 17 is moved while the IC device 90 is sucked, and the sucked IC device 90 can be disposed directly above the recessed portion 165 of the inspection portion 16. [3] Thereafter, as shown in FIG. 16, the device transfer head 17 can be lowered until the suction section 3 abuts the inspection section 16. Thereby, the suction part 3 can press and store the IC device 90 in the recessed part 165 of the inspection part 16 while imitating the posture of the inspection part 16. At this time, the suction nozzle 31 receives a reaction force from the inspection unit 16 via the IC device 90 and moves further toward the positive side in the Z direction than the state shown in FIG. 15. By this movement, although the coil spring 4 is contracted, it does not reach the contraction limit, and is brought into the aforementioned contractible state. In addition, the coil spring 4 at this time also becomes an extensible state that can also be extended. Since the coil spring 4 is in both the contractible state and the expandable state, the coil spring 4 can direct the IC device 90 toward the inspection section 16 through the suction nozzle 31 to appropriately apply a force suitable for inspection. With this, for example, as shown in FIG. 18 to FIG. 20, regardless of the distance H ₉₀ , each terminal 901 of the IC device 90 and the probe pin 163 of the inspection unit 16 can be brought into proper and uniform contact (abutment). Therefore, the inspection of the IC device 90 can be performed accurately. Therefore, the coil spring 4 can function as a “buffering portion” that offsets the unevenness in the distance H ₉₀ . <Seventh Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 21 and 22, but the differences from the above embodiment will be mainly described, and the same matters The description is omitted. This embodiment is the same as the sixth embodiment except that the configuration of the inspection unit is different. As shown in FIGS. 21 and 22, in the present embodiment, the contact portion 162 includes a plate-like member (spacer) whose thickness can be changed. The abutting portion 162 is a laminated body including at least one layer including a piezoelectric element 167. This makes it possible to easily and quickly change the thickness of the contact portion 162 by the magnitude of the voltage applied to the piezoelectric element 167. Thus, when the inspection unit 16 is used in the state shown in FIG. 21 and the IC device 90 to be inspected is changed to a thicker one, the inspection unit 16 can be inspected in the state shown in FIG. 22. . As described above, in this embodiment, the inspection unit 16 can be set as an inspector suitable for the IC device 90 in accordance with the thickness of the IC device 90. The range in which the thickness of the piezoelectric element 167 can be changed is not particularly limited. For example, it is preferably 0.1 mm or more and 0.5 mm or less, and more preferably 0.1 mm or more and 0.3 mm or less. In addition, as the urging portion that urges the suction nozzle of the suction portion toward the negative side of the Z direction, a coil spring is included in each of the above embodiments, but it is not limited to this. For example, an air spring may be included. In addition, the thickness of the abutment portion can be changed by the operation of the piezoelectric element in the seventh embodiment, but it is not limited to this. For example, a plurality of 0.1 mm gap filler pieces may be stacked, and the overlap The number of pieces is increased or decreased. <Eighth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to Figs. 1 and 23 to 42. However, the differences from the above embodiment will be mainly described. The description of the same matters is omitted. In addition, for convenience of explanation below, the upper side in FIG. 25 and FIG. 26 may be referred to as “up” or “upper”, and the lower side may be referred to as “down” or “lower”. The left side in FIG. 23 may be referred to as "left" and the right side may be referred to as "right". The electronic component conveying device 10 according to this embodiment includes a holding portion 44 that can hold a member (a force detecting member 90 '), a movable portion 30 that can move an electronic component, and a force detecting portion 9 that is provided with A force is detected at the movable portion 30; and a member (the force detecting member 90 ′) held by the holding portion 44 can be brought into contact with the force detection portion 9. The electronic component transfer device 10 according to this embodiment includes a holding portion 44 that can hold a member (a force detection member 90 '), a movable portion 30 that can move an electronic component, and a force detection portion 9 that It is provided in the movable portion 30 to detect the force; and the memory portion 802 can memorize the detection result detected by the force detection portion 9. According to such an electronic component conveying device 10, as will be described later, when the electronic component is inspected by the inspection portion (socket) 16, the electronic component held by the holding portion 44 can be brought into abutment with the inspection portion 16. The actual contact force F _{90 is} replaced with the contact force F ₉₀ ′ detected by the force detection unit 9. Furthermore, based on the magnitude of the abutting force F ₉₀ ′, it is possible to determine whether the abutting force F ₉₀ at the time of inspection is an appropriate size for an electronic component. In addition, as the force detection unit 9, for example, a load cell can be used, and the load cell is provided in the movable portion 30 that can relatively easily secure its installation space. Thereby, the force can be detected with a simple structure. The electronic component inspection device 1 according to the present embodiment includes a holding portion 44 that can hold a member (a force detecting member 90 '), a movable portion 30 that can move an electronic component, and a force detecting portion 9 that is provided at The movable portion 30 detects a force; and the inspection portion 16 inspects an electronic component; and a member (a force detection member 90 ′) held by the holding portion 44 can be brought into contact with the force detection portion 9. Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component conveying apparatus 10 can be obtained. In addition, the electronic component can be transported to the inspection unit 16, so that the inspection of the electronic component can be performed by the inspection unit 16. In addition, electronic components after inspection can be transported from the inspection unit 16. The configuration of each unit will be described below. The inspection area A3 is an area where the IC device 90 is inspected. An inspection section 16 for inspecting the IC device 90 and a device transfer head 17 having a holding section 44 are provided in the inspection area A3. A device supply unit 14 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves across the inspection area A3 and the recovery area A4 are also provided. Hereinafter, the device supply unit 14 on the front side of the two device supply units 14 is referred to as a “device supply unit (first device supply unit) 14A”, and the device supply unit 14 on the back side is referred to as a “device supply unit (a In the case of the second device supply unit) 14B ". In the configuration shown in FIG. 23, two device transfer heads 17 are connected and arranged in the Y direction. Hereinafter, the device transfer head 17 on the front side of the two device transfer heads 17 is referred to as a "device transfer head (first device transfer head) 17A", and the device transfer head 17 on the back side is referred to as a "device transfer head ( In the case of the second device transfer head) 17B ". Further, the device transfer head 17A can transfer the IC device 90 on the device supply section 14A to the inspection section 16. On the other hand, the device transfer head 17B can transfer the IC device 90 on the device supply section 14B to the inspection section 16. The device recovery unit 18 is supported so as to be able to move back and forth between the inspection area A3 and the recovery area A4 in the X direction, that is, in the direction of the arrow α ₁₈ . With this, the device recovery unit 18 can stably transport the IC device 90 after inspection from the inspection area A3 to the recovery area A4. After the IC device 90 is removed by the device transfer head 20 in the recovery area A4, it can return to Check area A3. In the configuration shown in FIG. 23, two device recovery units 18 are arranged in the Y direction in the same manner as the device supply unit 14. Hereinafter, the device recovery section 18 on the front side of the two device recovery sections 18 is referred to as a “device recovery section (first device recovery section) 18A”, and the device recovery section 18 on the back side is referred to as a “device recovery section ( Second device recovery section) 18B ". Then, the IC device 90 is transferred from the inspection section 16 to the device recovery section 18A by the device transfer head 17A. On the other hand, the IC device 90 is transferred from the inspection section 16 to the device recovery section 18B by the device transfer head 17B. As shown in FIG. 24, the control unit 800 includes a CPU (Central Processing Unit) 801, and a memory unit 802 that stores (stores) various programs or various data for executing operations of each unit such as the tray transport mechanism 11A . As described above, the device transfer head 17 is supported to be movable in the Y direction and the Z direction. The device transfer head 17 transfers IC devices 90 in the inspection area A3. As shown in FIG. 25, the device transfer head 17 includes a holding portion 44 and an attitude adjustment portion 5. The holding unit 44 is a holding unit configured to hold the IC device 90 or to replace the IC device 90 and to hold a force detection member 90 ′ used in the force detection as described later. The holding portion 44 includes a suction portion 45 and a joint 36 connected to the suction portion 45. The suction part 45 has a flow path 318 opened in the lower surface 319 and the side surface 320. Air can pass through the flow path 318. The joint 36 is air-tightly connected to the flow path 318 from the side surface 320 side. The joint 36 is connected to a suction source (vacuum generation source) 26 that sucks in the convection path 318 such as a vacuum pump or an ejector via a pipe 71. Furthermore, by operating the suction source 26, the suction portion 45 can hold the IC device 90 or the force detection member 90 'by using the lower surface 319 as a suction surface. Furthermore, in FIG. 25 and FIG. 26, one holding portion 44 is representatively depicted, and the number of the holding portions 44 is not limited to one, and may be plural. In this embodiment, as an example, eight holding portions 44 are provided in the device transfer head 17A and the device transfer head 17B, respectively. The eight holding portions 44 are in a state where four are arranged in the X direction and two are arranged in the Y direction. A posture adjustment unit 5 is connected and arranged above the holding unit 44. The posture adjustment unit 5 is a so-called “compliance unit” that adjusts the posture of the holding unit 44 in the state shown in FIG. 25. The posture adjustment unit 5 includes a first adjustment mechanism 51 and a second adjustment mechanism 52. The first adjustment mechanism 51 includes an air cylinder, and is responsible for adjusting the posture of the holding portion 44 about the X axis and the posture of the holding portion 44 about the Y axis during the posture adjustment of the holding portion 44. A second adjustment mechanism 52 is disposed below the first adjustment mechanism 51. The second adjustment mechanism 52 includes two plate members 421 that overlap in the Z direction. The two plate members 421 are movable relative to the XY plane direction. Thereby, the second adjustment mechanism 52 can be responsible for the X-direction posture adjustment of the holding portion 44, the Y-direction posture adjustment of the holding portion 44, and the Z-axis posture adjustment of the holding portion 44 during the posture adjustment of the holding portion 44. As described above, the inspection section 16 may be disposed in the inspection area A3 as a mounting section on which the IC device 90 is placed as an electronic component. In addition, the device transfer head 17 includes a posture adjustment unit 5 that can be used when the IC device (electronic component) 90 held by the holding portion 44 of the device transfer head 17 is placed on the inspection unit (mounting unit) 16. The posture of the holding portion 44 is adjusted. As shown in FIG. 25, when the IC device 90 held by the holding portion 44 of the device transfer head 17 is placed on the inspection portion 16, the holding portion 44 may be in contact with the inspection portion 16. Here, for example, it is assumed that the entire inspection unit 16 is inclined by 1 degree with respect to the XY plane (horizontal plane). In this case, as shown in FIG. 25, in a state where the holding portion 44 is in contact with the inspection portion 16, the posture adjustment portion 5 can be used to make the holding portion 44 imitate the same inclined posture as the inspection portion 16. Such posture adjustment of the holding portion 44 facilitates contact between the terminal of the IC device 90 and the probe pin of the inspection portion 16. Thereby, the IC device 90 can be accurately inspected. Further, as shown in FIG. 25, the inspection portion 16 is recessed to form a recessed portion (recess) 168 on which the IC device 90 is housed. In the present embodiment, the number of the recesses 168 formed is eight, and the configuration is preferably the same as the configuration of the eight holding portions 44 in the device transfer head 17A or the device transfer head 17B, that is, they are respectively A state in which four are arranged in the X direction and two are arranged in the Y direction. In addition, the same number of probe pins as the terminals of the IC device 90 are protruded from the bottom of each recess 168. As shown in FIG. 25, the posture adjustment unit 5 is connected to the Z-direction moving mechanism 25. The Z-direction moving mechanism 25 includes a linear guide 27, a ball screw 28, and a motor 40. The linear guide 27 has a rail 517 and a slider 518 sliding on the rail 517. The rail 517 is connected to the first adjustment mechanism 51 of the posture adjustment unit 5 via a connection member 54 and is arranged in parallel with the Z direction. The slider 518 is fixed to, for example, a wall portion of the inspection area A3. The ball screw 28 includes a screw shaft 523 and a nut 522 that slides on the screw shaft 523. The screw shaft 523 is fixed to, for example, a wall portion of the inspection area A3 via the frame 55. The spiral shaft 523 is arranged parallel to the Z direction, and a pulley 56 is attached to an upper end portion thereof. The nut 522 is connected to the connection member 54 via the connection member 57. The motor 40 is fixed to, for example, a wall portion of the inspection area A3. A pulley 58 is attached to a shaft 532 of the motor 40. The pulley 58 is connected to a pulley 56 attached to the ball screw 28 via a timing belt 59. In the Z-direction moving mechanism 25 configured as described above, the force is transmitted to the posture adjustment unit 5 by the operation of the motor 40. Thereby, the holding | maintenance part 44 can reciprocate in the Z direction (the other direction which cross | intersects one direction (X direction)) with the attitude | position adjustment part 5. Also, although not shown, a Y-direction moving mechanism for moving the device transfer head 17 (the holding portion 44 and the posture adjustment unit 5) together with the Z-direction moving mechanism 25 in the Y direction is also provided. Thereby, the holding portion 44 can also move back and forth in the Y direction (the other direction crossing one direction (X direction)). In addition, the Z-direction moving mechanism 25 and the Y-direction moving mechanism allow the device transfer head 17 to move freely in the Y direction and the Z direction within the inspection area A3. Thereby, the holding part 44 can carry the IC device 90 or the force detection member 90 'while carrying it to the carrying destination. Moreover, in the electronic component inspection apparatus 1, the voltage applied to the motor 40 can be adjusted. Thereby, when the IC device 90 held in the holding portion 44 is brought into contact (pressed) with the inspection portion 16 and the inspection is performed, the contact force F ₉₀ can be adjusted. The IC device 90 must adjust the contact force F _{90 for} each type. Therefore, by being able to adjust the contact force F ₉₀ , it is possible to perform the inspection by applying the contact force F ₉₀ suitable for various IC devices 90. Thereby, the inspection becomes accurate. As described above, the device supply unit 14 is an electronic component placement unit before inspection, where the IC device 90 (electronic part) is placed before inspection, and the device recovery unit 18 is after the inspection is placed IC unit (electronic part) 90 after inspection. Electronic parts mounting section. As shown in FIG. 26, the device supply unit 14 and the device recovery unit 18 are unitized as a movable unit 30 that can move and mount an IC device (electronic component) 90. The movable unit 30 includes an X-direction moving mechanism 7 in addition to the device supply unit 14 and the device recovery unit 18. The device supply portion 14 is formed with a recessed portion (recess) 141 on which the IC device 90 is housed. In this embodiment, the number of the recessed portions 141 is eight, and the configuration is preferably the same as the configuration of the eight holding portions 44 in the device transfer head 17A or the device transfer head 17B, that is, they are separated from each other. There are four in the X direction and two in the Y direction. The device recovery portion 18 is also formed with a recessed portion (cavity) 181 on which the IC device 90 is placed and stored. In this embodiment, the number of the recesses 181 formed is eight, and the configuration is preferably the same as the configuration of the eight holding portions 44 in the device transfer head 17A or the device transfer head 17B, that is, they are respectively There are four in the X direction and two in the Y direction. The X-direction moving mechanism 7 includes a linear guide 29 and a support base 47 that supports the device supply unit 14 and the device recovery unit 18 together. The linear guide 29 includes a track 711 and two sliders 712. A support base 47 is fixed to the two sliders 712. The support base 47 supports and separates the device supply unit 14 and the device recovery unit 18 in the X direction. In addition, the support base 47 can independently and detachably support the device supply unit 14 and the device recovery unit 18. The support base 47 is connected to a motor (not shown) via a ball screw (not shown). The force is transmitted to the support base 47 by the operation of the motor. Thereby, the device supply section (electronic component placement section before inspection) 14 and the device recovery section (electronic component placement section after inspection) 18 can move back and forth in the X direction (one direction). By being able to move back and forth in this way, the IC device 90 before inspection can be stably and quickly transferred from the supply area A2 to the inspection area A3 by the device supply unit 14. In addition, the inspected IC device 90 can be stably and quickly transferred from the inspection area A3 to the recovery area A4 by the device recovery unit 18. In addition, the IC devices 90 judged to be good products by the inspection of the electronic component inspection device 1 are summarized for each batch, and are shipped as parts mounted on automobiles, for example. When a defect occurs in the IC device 90 after mounting, a lot containing the IC device 90 is specified, and a countermeasure against the defect in the market is taken. There are various reasons for the defect even though it is shipped as a good product. As one of them, the following reasons can be cited. The reason can be cited as follows: When the IC device 90 held in the holding portion 44 is abutted (pressed) against the inspection portion 16 for inspection, the contact force F _{90 does} not become an appropriate size for the IC device 90, that is, excessive or insufficient. Therefore, accurate inspection results could not be obtained. Therefore, it is considered that as long as the abutment force F ₉₀ is ensured to be an appropriate size for the IC device 90, at least "the situation caused by the excessive and insufficient abutment force F ₉₀ " can be excluded from the cause of the defect. The electronic component inspection device 1 (electronic component transfer device 10) is configured to ensure that the contact force F ₉₀ of the inspection unit 16 to the inspection target IC device ₉₀ is an appropriate size. The configuration and effect will be described below. As shown in FIG. 23, the electronic component inspection device 1 (electronic component transfer device 10) includes a force detection unit 9 that detects a force. In the configuration shown in FIG. 23, two force detection units 9 are arranged. Hereinafter, as shown in FIG. 23, a force detection unit 9 that is disposed adjacent to the right side of the device supply unit 14A of the two force detection units 9 is referred to as a “force detection unit (first force detection unit) 9A”, and The case where the force detection section 9 disposed on the right side of the device supply section 14B is referred to as a "force detection section (second force detection section) 9B". The force detection unit 9A is disposed on the positive side in the Y direction with respect to the device supply unit 14A, and the force detection unit 9B is disposed on the negative side in the Y direction with respect to the device supply unit 14B. As shown in FIG. 26, in the inspection area A3, the force detection member 90 ′ held by the holding portion 44 can be brought into contact with the force detection portion 9. Further, by the force detecting section 9 detects the case of the contact force F ₉₀ ', as a "check IC device 90 pairs of contact portions 16 of the relay F _90" by the same operation. The detection result detected by the force detection unit 9, that is, the magnitude of the contact force F ₉₀ ′ is stored in the storage unit 802 of the control unit 800. The force detection unit 9 is not particularly limited, and for example, a load cell is preferably used. The load cell is a converter that has a built-in strain gauge and converts the magnitude of the force into an electrical signal. Thereby, the contact force F ₉₀ ′ can be detected as accurately as possible using actual measured values instead of design values (calculated values). In addition, as the timing for detecting the contact force F ₉₀ ′, for example, it is preferable to perform detection at a position where the self-force detection member 90 ′ starts to abut the force detection unit 9 and then descend within a range of 0.1 mm to 2.0 mm. . In addition, the force detecting member 90 'is not particularly limited. For example, an IC device 90 that is useless regardless of whether it is a good product or a dummy device including a metal sheet that mimics the IC device 90 can be used. The IC device 90 is useless because it is a defective product. As shown in FIG. 26, the force detection section 9 is provided in the movable section 30 together with the device supply section 14 or the device recovery section 18. Thereby, the force detection portion 9 can be moved back and forth in the X direction, and accordingly, the force detection portion 9 can be arranged in the inspection area A3 or the supply area A2 according to the presence or absence of detection of the contact force F ₉₀ ′. As described above, the electronic component inspection device 1 (electronic component transfer device 10) is used for inspecting 90 IC devices (electronic components). In addition, the movable unit 30 includes a device supply unit (electronic component placement unit before inspection) 14 on which the IC device 90 (electronic component) is placed before inspection, and a device collection unit on which the IC device (electronic component) 90 is placed after inspection. (Electronic component mounting section after inspection) 18. The force detection section 9 is provided between the device supply section (electronic component placement section before inspection) 14 and the device recovery section (electronic component placement section after inspection) 18. A sufficient space is provided between the device supply section 14 and the device recovery section 18 for providing one force detection section 9. Thus, the force detection section 9 can be provided when the electronic component inspection device 1 is designed, or the force detection section 9 can be provided after the electronic component inspection device 1 omitting the force detection section 9 is completed, that is, it can be added (added) later. Force detection section 9. In this way, the force detection section 9 can be provided relatively easily. The force detection unit 9 is provided on the support base 47 via a spacer 39 that is thicker than the device supply unit 14 or the device recovery unit 18. Thereby, the force detection section 9 is placed in a position higher than the device supply section (electronic component placement section before inspection) 14 and the component recovery section (electronic component placement section after inspection) 18. Thereby, when holding the IC device 90 on the device supply unit 14, for example, the holding portion 44 is lowered to a position where the holding can be performed (hereinafter referred to as a "holding position") and stopped, and the force detecting member 90 'is abutted. When the force detection unit 9 is connected to detect the force, it stops at a position higher than the holding position. This prevents interference between the holding portion 44 and other peripheral members existing at a position lower than the holding portion 44 when the force is detected. In the inspection area A3, the holding portion 44 moves from the inspection portion 16 in the Y direction, and the force detection portion 9 can be disposed at a position overlapping the holding portion 44 in a plan view (when viewed from the positive side in the Z direction). Accordingly, when the IC device 90 is inspected, the same as the IC device 90 comes into contact with the inspection section 16 (pressing) from above, the force detection member 90 'can also come into contact with the force detection section from above during force detection. 9 (pressed). By making the contact direction the same during the inspection and the force detection in this way, the contact force F ₉₀ ′ and the contact force F ₉₀ can be operated in the same manner. In addition, the moving speed of the holding portion 44 when the force detecting member (member) 90 'held in the holding portion 44 abuts against the force detecting portion 9 is preferably 10 mm / second or less, more preferably 3 mm / second or more And 7 mm / s or less. Accordingly, even if an impact occurs when the force detection member 90 ′ comes into contact with the force detection unit 9, deformation of the force detection member 90 ′ or the force detection unit 9 caused by the impact can be prevented. As described above, when the IC device 90 held in the holding portion 44 is brought into contact (pressed) with the inspection portion 16 for inspection, the contact force F ₉₀ can be adjusted. Thereby, the adjustment of the abutting force F ₉₀ suitable for the IC device 90 can be performed for each type of the IC device 90. This adjustment can also be performed by adjusting the voltage applied to the motor 40. In addition, similarly, the contact force F ₉₀ ′ when the force detecting member (member) 90 ′ held by the holding portion 44 abuts against the force detecting portion 9 may be adjusted. The adjustment range of the contact force F ₉₀ ′ is preferably 0.3 N or more and 600 N or less, and more preferably 1 N or more and 300 N or less. This range of values is the same as the range of values that can be taken by the contact force of the IC device 90 to the inspection section 16 during inspection. This makes it possible to operate the contact force F ₉₀ ′ equal to the contact force F ₉₀ . When the detection result of the force detection unit 9 deviates from the numerical range, it is preferable to report the content via the monitor 300 or the speaker 500, for example. It is preferable to stop the operation of the electronic component inspection device 1 at the same time as the notification. As described above, the electronic component inspection apparatus 1 (the electronic component transfer apparatus 10) will be to IC device 90 abuts against portion 16 of the relay check F. ₉₀ replaced by the force detecting section 9 detects the contact force F ₉₀ ' And the way of operation is constituted. In addition, based on the magnitude of the abutting force F ₉₀ ′, it can be determined whether the actual abutting force F ₉₀ at the time of inspection is an appropriate size for the IC device 90. The contact time for example, if the size of the IC device 90 appropriately in terms of the contact force F. ₉₀ as "a reference value (threshold) TH" in the contact force F ₉₀ 'less than the reference value TH of the case, it can be determined "Check The relay F ₉₀ is an appropriate size for the IC device 90 ". In this case, even if there is a defect in the market mentioned above, "the situation caused by the excess and deficiency of the contact force F ₉₀ " can be excluded from the cause of the defect. On the other hand, when the contact force F ₉₀ ′ does not reach the reference value TH, it can be determined that “the contact force F ₉₀ at the time of inspection is not an appropriate size for the IC device 90”. In this case, the adjustment of the contact force F ₉₀ ′ is performed. The magnitude (detection result) of the contact force F ₉₀ ′ detected by the force detection unit 9 is stored in the storage unit 802. In this way, the test results can be used as a reference when the above-mentioned defects in the market are used. As described above, as an example, a total of eight holding portions 44 are provided in the device transfer head 17A and the device transfer head 17B, that is, four in the X direction and two in the Y direction. Further, in the state shown in FIGS. 27 to 34, the eight force detection members 90 ′ held on the device transfer head 17A are sequentially referred to as “force detection member 90A ₁ ” from the lower left in the figure toward the right. "", "Force detection member 90A ₂ '", "force detection member 90A ₃ '", "force detection member 90A ₄ '", "force detection member 90A ₅ '", "force detection member 90A ₆ "", "Force detection member 90A ₇ '", and "force detection member 90A ₈ '". Further, in the state shown in FIGS. 35 to 42, the eight force detecting members 90 ′ held on the device transfer head 17B are sequentially referred to as “force detecting member 90B ₁ from the lower left in the figure toward the right. "", "Force detection member 90B ₂ '", "force detection member 90B ₃ '", "force detection member 90B ₄ '", "force detection member 90B ₅ '", "force detection member 90B ₆ "", "Force detection member 90B ₇ '", and "force detection member 90B ₈ '". Next, with reference to FIGS. 27 to 34 each holding portion of the device conveying head 17A of the contact 44 of the relay detects F ₉₀ 'it will be described with reference to FIGS. 35 to 42 for the device conveying the respective retaining portion of the head 17B of the contact 44 of the relay F ₉₀ 'The detection is explained. [A1] As shown in FIG. 27, in the device transfer head 17A, the holding force detection members 90A ₁ 'to 90A ₈ ' are respectively fixed. This state is maintained until the detection of all the contact forces F ₉₀ ′ in the device transfer head 17A is completed. Further, the device supply unit 14A moves to the inspection area A3, whereby the force detection unit 9A is located in the inspection area A3. Then, first, the device transfer head 17A is moved to the position of the front end thereof in the direction of the arrow α _{17Y (-)} , and as described above, the force detection member 90A ₁ ′ is brought into contact with the force detection unit 9A. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₁ ′ is detected. [A2] Secondly, the device transfer head 17A is temporarily retracted. As shown in FIG. 28, the force detection unit 9A is disposed at a position having a distance between the center of the moving force detection member 90A ₁ ′ and the force detection member 90A ₂ ′. Next, as shown in FIG. 28, the device transfer head 17A is moved to the position of the tip in the direction of the arrow α _{17Y (−)} , and the force detection member 90A ₂ ′ is brought into contact with the force detection unit 9A in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₂ ′ is detected. [A3] Next, the device transfer head 17A is retracted again, and as shown in FIG. 29, the force detection unit 9A is disposed at a position having a distance of the center distance between the moving force detection member 90A ₂ ′ and the force detection member 90A ₃ ′. Next, as shown in FIG. 29, the device transfer head 17A is moved to the tip position in the direction of the arrow α _{17Y (−)} , and the force detection member 90A ₃ ′ is brought into contact with the force detection unit 9A in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₃ ′ is detected. [A4] Next, the device transfer head 17A is retracted again. As shown in FIG. 30, the force detection unit 9A is disposed at a position having a distance between the center of the moving force detection member 90A ₃ ′ and the force detection member 90A ₄ ′. Then, as shown in FIG. 30, the device transfer head 17A is moved to the position of the front end in the direction of arrow α _{17Y (-)} , and the force detecting member 90A ₄ ′ is brought into contact with the force detecting section 9A in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₄ ′ is detected. [A5] Next, retreat the device transfer head 17A. As shown in FIG. 31, the force detection unit 9A is arranged at the same position as in the above-mentioned operation [A1]. Next, as shown in FIG. 31, the device transfer head 17A is moved to the position of the front end in the direction of the arrow α _{17Y (-)} , and the force detecting member 90A ₅ ′ is brought into contact with the force detecting section 9A in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₅ ′ is detected. [A6] Next, the device transfer head 17A is retracted again, and as shown in FIG. 32, the force detection unit 9A is disposed at a position having a distance between the center of the moving force detection member 90A ₅ ′ and the force detection member 90A ₆ ′. Then, as shown in FIG. 32, the device transfer head 17A is moved to the position of the front end in the direction of the arrow α _{17Y (-)} , and the force detection member 90A ₆ ′ is brought into contact with the force detection unit 9A in the same manner as described above. As a result, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₆ ′ is detected. [A7] Next, the device transfer head 17A is retracted again, and as shown in FIG. 33, the force detection unit 9A is disposed at a position having a distance of the center distance between the moving force detection member 90A ₆ ′ and the force detection member 90A ₇ ′. Next, as shown in FIG. 33, the device transfer head 17A is moved to the position of the front end in the direction of arrow α _{17Y (-)} , and the force detection member 90A ₇ ′ is brought into contact with the force detection unit 9A in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₇ ′ is detected. [A8] Next, the device transfer head 17A is retracted again, and as shown in FIG. 34, the force detection unit 9A is disposed at a position having a distance between the center of the moving force detection member 90A ₇ 'and the force detection member 90A ₈ '. Next, as shown in FIG. 34, the device transfer head 17A is moved to the front end position in the direction of the arrow α _{17Y (-)} , and the force detection member 90A ₈ ′ is brought into contact with the force detection unit 9A in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90A ₈ ′ is detected. By such operations [A1] to [A8], the contact force F ₉₀ ′ of each holding portion 44 in the device transfer head 17A can be sequentially detected. Then, the abutment force F ₉₀ ′ of the device transfer head 17B is detected. [B1] As shown in FIG. 35, the device transfer head 17B is in a state of each of the holding force detecting members 90B ₁ ′ to 90B ₈ ′. This state is maintained until the detection of all the contact forces F ₉₀ ′ of the device transfer head 17B is completed. Further, the device supply unit 14B moves to the inspection area A3, whereby the force detection unit 9B is located in the inspection area A3. Next, first, the device transfer head 17B is moved to the position of the front end in the direction of the arrow α _{17Y (+)} , and as described above, the force detecting member 90B ₁ ′ is brought into contact with the force detecting section 9B. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90B ₁ ′ is detected. [B2] Secondly, the device transfer head 17B is temporarily retracted, and as shown in FIG. 36, the force detection unit 9B is disposed at a position having a distance between the center of the moving force detection member 90B ₁ ′ and the force detection member 90B ₂ ′. Next, as shown in FIG. 36, the device transfer head 17B is moved to the position of the tip in the direction of the arrow α _{17Y (+)} , and the force detection member 90B ₂ ′ is brought into contact with the force detection unit 9B in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detection member 90B ₂ ′ is detected. [B3] Next, the device transfer head 17B is retracted again, and as shown in FIG. 37, the force detection unit 9B is disposed at a position having a distance between the center of the moving force detection member 90B ₂ ′ and the force detection member 90B ₃ ′. Next, as shown in FIG. 37, the device transfer head 17B is moved to the position of the front end in the direction of arrow α _{17Y (+)} , and the force detecting member 90B ₃ ′ is brought into contact with the force detecting section 9B in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90B ₃ ′ is detected. [B4] Next, the device transfer head 17B is retracted again, and as shown in FIG. 38, the force detection unit 9B is disposed at a position having a distance between the center of the moving force detection member 90B ₃ 'and the force detection member 90B ₄ '. Next, as shown in FIG. 38, the device transfer head 17B is moved to the position of the front end in the direction of the arrow α _{17Y (+)} , and the force detecting member 90B ₄ ′ is brought into contact with the force detecting section 9B in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90B ₄ ′ is detected. [B5] Next, retreat the device transfer head 17B. As shown in FIG. 39, the force detection unit 9B is arranged at the same position as in the above-mentioned operation [B1]. Next, as shown in FIG. 39, the device transfer head 17B is moved to the front end position in the direction of the arrow α _{17Y (+)} , and the force detecting member 90B ₅ ′ is brought into contact with the force detecting section 9B in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90B ₅ ′ is detected. [B6] Next, the device transfer head 17B is retracted again, and as shown in FIG. 40, the force detection unit 9B is disposed at a position having a distance between the center of the moving force detection member 90B ₅ 'and the force detection member 90B ₆ '. Next, as shown in FIG. 40, the device transfer head 17B is moved to the front end position in the direction of the arrow α _{17Y (+)} , and the force detection member 90B ₆ ′ is brought into contact with the force detection unit 9B in the same manner as described above. As a result, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90B ₆ ′ is detected. [B7] Next, the device transfer head 17B is retracted again. As shown in FIG. 41, the force detection unit 9B is disposed at a position having a distance between the center of the moving force detection member 90B ₆ 'and the force detection member 90B ₇ '. Next, as shown in FIG. 41, the device transfer head 17B is moved to the front end position in the direction of the arrow α _{17Y (+)} , and the force detection member 90B ₇ ′ is brought into contact with the force detection unit 9B in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90B ₇ ′ is detected. [B8] Secondly, the device transfer head 17B is retracted again, and as shown in FIG. 42, the force detection unit 9B is disposed at a position having a distance between the center of the moving force detection member 90B ₇ ′ and the force detection member 90B ₈ ′. Next, as shown in FIG. 42, the device transfer head 17B is moved to the position of the tip in the direction of the arrow α _{17Y (+)} , and the force detecting member 90B ₈ ′ is brought into contact with the force detecting section 9B in the same manner as described above. Thereby, the contact force F ₉₀ ′ of the holding portion 44 of the holding force detecting member 90B ₈ ′ is detected. By performing such operations [B1] to [B8], the contact force F ₉₀ ′ of each holding portion 44 in the device transfer head 17B can be sequentially detected. As described above, eight (plural) holding portions 44 are provided in the device transfer head 17A and the device transfer head 17B, respectively. Further, as described with respect to the actions [A1] to [A8] and the actions [B1] to [B8], the force detecting member 90 '(member) held by each holding portion 44 can be independently brought into contact with the force detection. Department 9. Thereby, for the device transfer head 17A and the device transfer head 17B, the abutment force F ₉₀ ′ at eight locations can be detected by one force detection section 9, respectively, and the structure can be simplified. In addition, the contact of the force detection member (member) 90 'held by the holding portion 44 to the force detection portion 9 is preferably before the inspection of the IC device 90 starts, after the inspection is completed, or every time the holding portion 44 holds the IC device ( Electronic parts) 90 times. The electronic component inspection device 1 can be appropriately selected and set from among these three sequences. Thereby, the requirements of a user who uses the electronic component inspection apparatus 1 can be adapted. <Ninth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 43 and 44. However, the differences from the above embodiment will be mainly described, and the same matters will be described. The description is omitted. This embodiment is the same as the eighth embodiment except that the main device supply section and the device recovery section are arranged differently. As shown in FIG. 43, in the present embodiment, the device supply section 14 and the device recovery section 18 are respectively disposed on the negative side in the Y direction with respect to the inspection section 16. The device supply unit 14 is disposed on the positive side in the Z direction with respect to the device recovery unit 18. In addition, one device transfer head 17 is provided, and it is supported only so that it can move back and forth in the Z direction. The device supply unit 14 is supported so as to be able to move back and forth in the Y direction, that is, in the direction of the arrow α _14Y . Thereby, the device supply unit 14 can move the IC device 90 before the inspection to a position where the device transfer head 17 can hold, that is, the upper side of the inspection unit 16. After the IC device 90 is removed by the device transfer head 17, the device supply unit 14 can retreat from the inspection unit 16. As shown in FIG. 44, in the device supply unit 14, the force detection unit 9 is supported so as to be able to move back and forth in the X direction, that is, in the arrow α _9X direction. Thereby, when the contact force F ₉₀ ′ of each of the holding portions 44 in the device carrying head 17 is detected, the force detecting portion 9 can be moved directly below the holding portion 44 which is a detection target. The device recovery unit 18 is supported so as to be able to move back and forth in the Y direction, that is, in the direction of the arrow α _18Y . Thereby, the device recovery part 18 can move the IC device 90 after the inspection to the position where the device transfer head 17 can be placed, that is, the upper side of the inspection part 16. After the IC device 90 after the inspection is placed, the device recovery unit 18 can withdraw from the inspection unit 16. Further, in this embodiment, one device transfer head 46 is responsible for both the transfer of the IC device 90 to the device supply section 14 and the transfer of the IC device 90 from the device recovery section 18. In addition, regarding the up-down relationship between the device supply unit 14 and the device recovery unit 18, in this embodiment, the device supply unit 14 becomes the upper side and the device recovery unit 18 becomes the lower side. 18 is an upper side, and the device supply part 14 is a lower side. <Tenth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 45 and 46. However, the differences from the above embodiment will be mainly described, and the same matters will be described. The description is omitted. This embodiment is the same as the ninth embodiment except that the main device supply section and the device recovery section are arranged differently. As shown in FIG. 45, in this embodiment, the device supply section 14 and the device recovery section 18 are disposed on both sides of the inspection section 16 via the inspection section 16. The device supply unit 14 is supported so as to be able to move back and forth in the direction of the arrow α ₁₄ as in the eighth embodiment. The device recovery unit 18 is supported so as to be able to move back and forth in the direction of the arrow α _{18 in the} same manner as in the eighth embodiment. Further, as shown in FIG. 46, in the device supply section 14, the force detection section 9 is supported so as to be able to move back and forth in the Y direction, that is, in the arrow α _9Y direction. Thereby, when the contact force F ₉₀ ′ of each of the holding portions 44 in the device carrying head 17 is detected, the force detecting portion 9 can be moved directly below the holding portion 44 which is a detection target. The electronic component transfer device and the electronic component inspection device of the present embodiment have been described based on the illustrated embodiment, but the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device can be replaced with Any constituent who performs the same function. Moreover, you may add arbitrary structures. The electronic component transfer device and the electronic component inspection device according to the present invention may be a combination of any two or more configurations (features) in each of the embodiments described above. In addition, the number of the holding portions, the number of the recessed portions of the inspection portion, the number of the recessed portions of the device supply portion, and the number of the recessed portions of the device recovery portion are eight in each of the above embodiments, but they are not limited thereto. , May be 1 to 7, or 9 or more. In the force detection, in each of the embodiments described above, the holding portion holds the force detection member to perform the detection, but the present invention is not limited to this, and the force detection member may be omitted. In this case, during the force detection, it is preferable that the edge portion of the suction opening of the holding portion such as the force detection member is held by the suction to the force detection portion. In addition, in each of the embodiments described above, the force detection unit directly contacts the member for force detection during force detection, but it is not limited to this. For example, a structure that mimics the inspection section (socket) may be fixed to the force detection section, and the force detection section may be brought into contact with the force detection member via the structure. In addition, one force detection unit is provided with respect to one device transfer head in the inspection area, but it is not limited to this, and the same number (a plurality of) as the holding portions of the device transfer head may be provided. In this case, it is preferable to unitize a plurality of force detection sections, and each of the units is movably supported.

1‧‧‧電子零件檢查裝置 1‧‧‧Electronic parts inspection device

3‧‧‧吸引部 3‧‧‧ Attraction

4‧‧‧螺旋彈簧 4‧‧‧ Coil Spring

5‧‧‧姿勢調整部 5‧‧‧ Posture Adjustment Department

6‧‧‧隔熱部 6‧‧‧Insulation

7‧‧‧X方向移動機構 7‧‧‧X-direction moving mechanism

8‧‧‧配管 8‧‧‧Piping

9‧‧‧力檢測部 9‧‧‧ Force detection department

9A‧‧‧力檢測部(第1力檢測部) 9A‧‧‧Force detection section (first force detection section)

9B‧‧‧力檢測部(第2力檢測部) 9B‧‧‧ Force detection section (second force detection section)

10‧‧‧電子零件搬送裝置 10‧‧‧Electronic parts transfer device

11A‧‧‧托盤搬送機構 11A‧‧‧Tray transfer mechanism

11B‧‧‧托盤搬送機構 11B‧‧‧Tray transfer mechanism

12‧‧‧溫度調整部 12‧‧‧Temperature Adjustment Department

13‧‧‧器件搬送頭 13‧‧‧ device transfer head

14‧‧‧器件供給部 14‧‧‧Device Supply Department

14A‧‧‧器件供給部(第1器件供給部) 14A‧‧‧device supply unit (first device supply unit)

14B‧‧‧器件供給部(第2器件供給部) 14B‧‧‧ Device Supply Section (Second Device Supply Section)

15‧‧‧托盤搬送機構 15‧‧‧pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17‧‧‧器件搬送頭 17‧‧‧ device transfer head

17A‧‧‧器件搬送頭(第1器件搬送頭) 17A‧‧‧device transfer head (1st device transfer head)

17B‧‧‧器件搬送頭(第2器件搬送頭) 17B‧‧‧ device transfer head (second device transfer head)

18‧‧‧器件回收部 18‧‧‧Device Recycling Department

18A‧‧‧器件回收部(第1器件回收部) 18A‧‧‧Device Recycling Department (1st Device Recycling Department)

18B‧‧‧器件回收部(第2器件回收部) 18B‧‧‧ Device Recycling Department (Second Device Recycling Department)

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧器件搬送頭 20‧‧‧ device transfer head

21‧‧‧托盤搬送機構 21‧‧‧Tray transfer mechanism

22A‧‧‧托盤搬送機構 22A‧‧‧Tray transfer mechanism

22B‧‧‧托盤搬送機構 22B‧‧‧Tray transfer mechanism

23‧‧‧下端 23‧‧‧ lower end

24‧‧‧上端 24‧‧‧ Top

25‧‧‧Z方向移動機構 25‧‧‧Z direction moving mechanism

26‧‧‧吸引源(真空產生源) 26‧‧‧ Attraction source (vacuum generation source)

27‧‧‧線性導軌 27‧‧‧ linear guide

28‧‧‧滾珠螺桿 28‧‧‧ball screw

29‧‧‧線性導軌 29‧‧‧ linear guide

30‧‧‧可動部 30‧‧‧ Movable section

31‧‧‧吸附噴嘴(第2滑動部) 31‧‧‧ suction nozzle (second sliding part)

32‧‧‧第1塊體(第2基部) 32‧‧‧ first block (second base)

33‧‧‧第2塊體(第2基部) 33‧‧‧ 2nd block (2nd base)

34‧‧‧第3塊體(第2基部) 34‧‧‧ 3rd block (2nd base)

35‧‧‧墊圈 35‧‧‧washer

36‧‧‧接頭 36‧‧‧ connector

37‧‧‧墊圈 37‧‧‧washer

38‧‧‧引導構件 38‧‧‧Guide components

39‧‧‧間隔件 39‧‧‧ spacer

40‧‧‧馬達 40‧‧‧Motor

41‧‧‧接頭 41‧‧‧ connector

42‧‧‧接頭 42‧‧‧ connector

43‧‧‧墊圈 43‧‧‧washer

44‧‧‧固持部 44‧‧‧holding department

45‧‧‧吸引部 45‧‧‧ Attraction

46‧‧‧器件搬送頭 46‧‧‧device transfer head

47‧‧‧支持基座 47‧‧‧ support base

51‧‧‧第1調整機構 51‧‧‧The first adjustment mechanism

52‧‧‧第2調整機構 52‧‧‧The second adjustment mechanism

53‧‧‧隔膜 53‧‧‧ diaphragm

54‧‧‧連結構件 54‧‧‧Connecting components

55‧‧‧框體 55‧‧‧Frame

56‧‧‧皮帶輪 56‧‧‧Pulley

57‧‧‧連結構件 57‧‧‧Connecting components

58‧‧‧皮帶輪 58‧‧‧ pulley

59‧‧‧正時皮帶 59‧‧‧ timing belt

61‧‧‧隔熱構件 61‧‧‧Insulation member

71‧‧‧配管 71‧‧‧Piping

71A‧‧‧線性導軌 71A‧‧‧ Linear Guide

72‧‧‧噴射器 72‧‧‧ Ejector

72A‧‧‧支持基座 72A‧‧‧Support base

73‧‧‧調節器 73‧‧‧ Regulator

73A‧‧‧間隔件 73A‧‧‧ spacer

81‧‧‧配管 81‧‧‧Piping

82‧‧‧配管 82‧‧‧Piping

83‧‧‧儲箱 83‧‧‧Storage tank

84‧‧‧調節器 84‧‧‧ Regulator

85‧‧‧作動流體供給部 85‧‧‧ Actuating fluid supply unit

86‧‧‧分支點 86‧‧‧ branch point

90‧‧‧IC器件 90‧‧‧IC device

90'‧‧‧力檢測用構件 90'‧‧‧Force for force detection

90A₁'‧‧‧力檢測用構件90A ₁ '‧‧‧ Force detection member

90A₂'‧‧‧力檢測用構件90A ₂ '‧‧‧ Force detection member

90A₃'‧‧‧力檢測用構件90A ₃ '‧‧‧ Force detection member

90A₄'‧‧‧力檢測用構件90A ₄ '‧‧‧ Force detection member

90A₅'‧‧‧力檢測用構件90A ₅ '‧‧‧ Force detection member

90A₆'‧‧‧力檢測用構件90A ₆ '‧‧‧ Force detection member

90A₇'‧‧‧力檢測用構件90A ₇ '‧‧‧ Force detection member

90A₈'‧‧‧力檢測用構件90A ₈ '‧‧‧ Force detection member

90B₁'‧‧‧力檢測用構件90B ₁ '‧‧‧ Force detection member

90B₂'‧‧‧力檢測用構件90B ₂ '‧‧‧ Force detection member

90B₃'‧‧‧力檢測用構件90B ₃ '‧‧‧ Force detection member

90B₄'‧‧‧力檢測用構件90B ₄ '‧‧‧ Force detection component

90B₅'‧‧‧力檢測用構件90B ₅ '‧‧‧ Force detection member

90B₆'‧‧‧力檢測用構件90B ₆ '‧‧‧ Force detection member

90B₇'‧‧‧力檢測用構件90B ₇ '‧‧‧ Force detection component

90B₈'‧‧‧力檢測用構件90B ₈ '‧‧‧ Force detection component

141‧‧‧凹部(凹穴) 141‧‧‧concave (concave)

161‧‧‧檢查部本體 161‧‧‧ Inspection Department

162‧‧‧抵接部 162‧‧‧Abutment Department

163‧‧‧探針接腳 163‧‧‧Probe Pin

164‧‧‧導銷 164‧‧‧Guide Pin

165‧‧‧凹部(凹穴) 165‧‧‧concave (concave)

166‧‧‧電子零件施力部 166‧‧‧Electronic force application department

167‧‧‧壓電元件 167‧‧‧Piezoelectric element

168‧‧‧凹部(凹穴) 168‧‧‧concave (concave)

171‧‧‧連結部 171‧‧‧Connection Department

181‧‧‧凹部(凹穴) 181‧‧‧concave (concave)

200‧‧‧托盤 200‧‧‧tray

231‧‧‧第1間隔壁 231‧‧‧The first partition

232‧‧‧第2間隔壁 232‧‧‧Second partition

233‧‧‧第3間隔壁 233‧‧‧ 3rd partition

234‧‧‧第4間隔壁 234‧‧‧ 4th partition

235‧‧‧第5間隔壁 235‧‧‧ 5th partition

241‧‧‧前外殼 241‧‧‧Front housing

242‧‧‧側外殼 242‧‧‧side shell

243‧‧‧側外殼 243‧‧‧side shell

244‧‧‧後外殼 244‧‧‧ rear shell

245‧‧‧頂外殼 245‧‧‧Top case

300‧‧‧監視器 300‧‧‧ monitor

301‧‧‧顯示畫面 301‧‧‧display

311‧‧‧上表面 311‧‧‧upper surface

312‧‧‧下表面 312‧‧‧ lower surface

313‧‧‧內腔部 313‧‧‧ Internal cavity

314‧‧‧開口部(吸引口) 314‧‧‧ opening (suction mouth)

315‧‧‧凸緣部 315‧‧‧ flange

316‧‧‧溝槽 316‧‧‧Trench

317‧‧‧缺口部 317‧‧‧notch

318‧‧‧流路 318‧‧‧flow

319‧‧‧下表面 319‧‧‧ lower surface

320‧‧‧側面 320‧‧‧ side

321‧‧‧上表面 321‧‧‧upper surface

322‧‧‧下表面 322‧‧‧ lower surface

323‧‧‧側面 323‧‧‧side

324‧‧‧內腔部 324‧‧‧Inner cavity

331‧‧‧上表面 331‧‧‧upper surface

332‧‧‧下表面 332‧‧‧ lower surface

333‧‧‧內腔部 333‧‧‧Inner cavity

334‧‧‧溝槽 334‧‧‧Groove

335‧‧‧溝槽 335‧‧‧Trench

336‧‧‧內腔部 336‧‧‧ Internal cavity

341‧‧‧上表面 341‧‧‧ Top surface

342‧‧‧下表面 342‧‧‧lower surface

343‧‧‧凹部 343‧‧‧concave

344‧‧‧貫通孔 344‧‧‧through hole

345‧‧‧導孔 345‧‧‧Guide

346‧‧‧突出部 346‧‧‧ protrusion

400‧‧‧信號燈 400‧‧‧ signal light

421‧‧‧板構件 421‧‧‧ plate member

500‧‧‧揚聲器 500‧‧‧Speaker

511‧‧‧缸體(第1基部) 511‧‧‧cylinder block (1st base)

512‧‧‧活塞(第1滑動部) 512‧‧‧Piston (1st sliding part)

513‧‧‧內腔部 513‧‧‧ Internal cavity

514‧‧‧凸緣部 514‧‧‧ flange

515‧‧‧活塞連桿 515‧‧‧Piston connecting rod

516‧‧‧貫通孔 516‧‧‧through hole

517‧‧‧軌道 517‧‧‧ track

518‧‧‧滑塊 518‧‧‧ slider

521‧‧‧板構件 521‧‧‧ plate member

522‧‧‧螺帽 522‧‧‧nut

523‧‧‧螺旋軸 523‧‧‧Screw shaft

531‧‧‧下表面 531‧‧‧ lower surface

532‧‧‧軸 532‧‧‧axis

600‧‧‧滑鼠台 600‧‧‧Mouse Station

700‧‧‧操作面板 700‧‧‧ operation panel

711‧‧‧軌道 711‧‧‧ track

711A‧‧‧軌道 711A‧‧‧track

712‧‧‧滑塊 712‧‧‧ slider

712A‧‧‧滑塊 712A‧‧‧Slider

800‧‧‧控制部 800‧‧‧ Control Department

801‧‧‧CPU 801‧‧‧CPU

802‧‧‧記憶部 802‧‧‧Memory Department

901‧‧‧端子 901‧‧‧terminal

902‧‧‧基板 902‧‧‧ substrate

903‧‧‧突出部 903‧‧‧ protrusion

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域(供給區域) A2‧‧‧Device supply area (supply area)

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域(回收區域) A4‧‧‧device recycling area (recycling area)

A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area

F₃‧‧‧吸引力F ₃ ‧‧‧ Attraction

F₃'‧‧‧吸引力F ₃ '‧‧‧ Attraction

F₉₀‧‧‧抵接力F ₉₀ ‧‧‧ abutment force

F₉₀'‧‧‧抵接力F ₉₀ '‧‧‧ abutment force

H₉₀‧‧‧距離H ₉₀ ‧‧‧Distance

M1‧‧‧第1受壓面 M1‧‧‧The first pressure surface

M2‧‧‧第2受壓面 M2‧‧‧Second pressure surface

R‧‧‧作動流體 R‧‧‧Motion fluid

S1‧‧‧第1空間 S1‧‧‧The first space

S2‧‧‧第2空間 S2‧‧‧Second Space

S₉₀₂‧‧‧中心S ₉₀₂ ‧‧‧ Centre

S₉₀₃‧‧‧中心S ₉₀₃ ‧‧‧ Centre

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

α₃‧‧‧吸引方向α ₃ ‧‧‧ Attraction direction

α_9X‧‧‧箭頭α _9X ‧‧‧ Arrow

α_9Y‧‧‧箭頭α _9Y ‧‧‧ Arrow

α_11A‧‧‧箭頭α _11A ‧‧‧ Arrow

α_11B‧‧‧箭頭α _11B ‧‧‧ Arrow

α_13X‧‧‧箭頭α _13X ‧‧‧ Arrow

α_13Y‧‧‧箭頭α _13Y ‧‧‧ Arrow

α₁₄‧‧‧箭頭α ₁₄ ‧‧‧arrow

α_14Y‧‧‧箭頭α _14Y ‧‧‧ Arrow

α₁₅‧‧‧箭頭α ₁₅ ‧‧‧arrow

α_17Y‧‧‧箭頭α _17Y ‧‧‧ Arrow

α_17Y(+)‧‧‧箭頭α _{17Y (+)} ‧‧‧ Arrow

α_17Y(-)‧‧‧箭頭α _{17Y (-)} ‧‧‧arrow

α₁₈‧‧‧箭頭α ₁₈ ‧‧‧ arrow

α_18Y‧‧‧箭頭α _18Y ‧‧‧ Arrow

α₂₁‧‧‧箭頭α ₂₁ ‧‧‧ Arrow

α_20X‧‧‧箭頭α _20X ‧‧‧ Arrow

α_20Y‧‧‧箭頭α _20Y ‧‧‧ Arrow

α_22A‧‧‧箭頭α _22A ‧‧‧ Arrow

α_22B‧‧‧箭頭α _22B ‧‧‧ Arrow

α₉₀‧‧‧箭頭α ₉₀ ‧‧‧ arrow

fD_4-1‧‧‧外徑fD _4-1 ‧‧‧ Outer diameter

fD_4-2‧‧‧內徑fD _4-2 ‧‧‧Inner diameter

fD_4-3‧‧‧線徑fD _4-3 ‧‧‧ diameter

圖1係自正面側觀察第1、第6、及第8實施形態之電子零件檢查裝置之概略立體圖。圖2係表示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。圖3係依序表示設置於圖2中之檢查區域之器件搬送頭之作動狀態的概略局部垂直剖視圖。圖4係依序表示設置於圖2中之檢查區域之器件搬送頭之作動狀態的概略局部垂直剖視圖。圖5係依序表示設置於圖2中之檢查區域之器件搬送頭之作動狀態的概略局部垂直剖視圖。圖6係表示即便為以吸附噴嘴之下表面(吸附面)作為基準時，自下表面至IC器件之各端子之距離(H₉₀ )不均之IC器件，該各端子與檢查部之各探針接腳亦可接觸之狀態的垂直剖視圖。圖7係表示即便為以吸附噴嘴之下表面(吸附面)作為基準時，自下表面至IC器件之各端子之距離(H₉₀ )不均之IC器件，該各端子與檢查部之各探針接腳亦可接觸之狀態的垂直剖視圖。圖8係表示即便為以吸附噴嘴之下表面(吸附面)作為基準時，自下表面至IC器件之各端子之距離(H₉₀ )不均之IC器件，該各端子與檢查部之各探針接腳亦可接觸之狀態的垂直剖視圖。圖9係第2實施形態之電子零件檢查裝置所具備之器件搬送頭之概略局部垂直剖視圖。圖10係第3實施形態之電子零件檢查裝置所具備之器件搬送頭之概略局部垂直剖視圖。圖11係第4實施形態之電子零件檢查裝置所具備之器件搬送頭及可動部之概略局部垂直剖視圖。圖12係第5實施形態之電子零件檢查裝置所具備之器件搬送頭之概略局部垂直剖視圖。圖13係表示第6實施形態之圖1所示之電子零件檢查裝置之動作狀態的概略俯視圖。圖14係依序表示設置於圖13中之檢查區域之器件搬送頭之作動狀態的概略局部垂直剖視圖。圖15係依序表示設置於圖13中之檢查區域之器件搬送頭之作動狀態的概略局部垂直剖視圖。圖16係依序表示設置於圖13中之檢查區域之器件搬送頭之作動狀態的概略局部垂直剖視圖。圖17係表示圖14~圖16中之器件搬送頭所具備之吸附噴嘴及其周邊之其他構成例之局部垂直剖面立體圖。圖18係表示即便為以吸附噴嘴之下表面(吸附面)作為基準時，自下表面至IC器件之各端子為止之距離(H₉₀ )不均之IC器件，該各端子與檢查部之各探針接腳亦可接觸之狀態的垂直剖視圖。圖19係表示即便為以吸附噴嘴之下表面(吸附面)作為基準時，自下表面至IC器件之各端子為止之距離(H₉₀ )不均之IC器件，該各端子與檢查部之各探針接腳亦可接觸之狀態的垂直剖視圖。圖20係表示即便為以吸附噴嘴之下表面(吸附面)作為基準時，自下表面至IC器件之各端子為止之距離(H₉₀ )不均之IC器件，該各端子與檢查部之各探針接腳亦可接觸之狀態的垂直剖視圖。圖21係表示設置於第7實施形態之電子零件檢查裝置之檢查區域之檢查部的垂直剖視圖。圖22係表示設置於第7實施形態之電子零件檢查裝置之檢查區域之檢查部的垂直剖視圖。圖23係表示第8實施形態之圖1所示之電子零件檢查裝置之動作狀態的概略俯視圖。圖24係圖1所示之電子零件檢查裝置之主要部之方塊圖。圖25係表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(檢查時)的概略局部垂直剖視圖。圖26係表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略局部垂直剖視圖。圖27係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖28係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖29係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖30係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖31係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖32係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖33係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖34係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖35係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖36係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖37係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖38係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖39係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖40係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖41係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖42係依序表示設置於圖23中之檢查區域之器件搬送頭之作動狀態(力檢測時)的概略俯視圖。圖43係第9實施形態之電子零件檢查裝置之概略俯視圖。圖44係表示圖43所示之電子零件檢查裝置之器件供給部之概略放大俯視圖。圖45係第10實施形態之電子零件檢查裝置之概略俯視圖。圖46係表示圖45所示之電子零件檢查裝置之器件供給部之概略放大俯視圖。FIG. 1 is a schematic perspective view of the electronic component inspection apparatus according to the first, sixth, and eighth embodiments as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a device transfer head provided in the inspection area in FIG. 2. FIG. 4 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a device transfer head provided in the inspection area in FIG. 2. FIG. 5 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a device transfer head provided in the inspection area in FIG. 2. FIG. 6 shows an IC device having an uneven distance (H ₉₀ ) from the lower surface to each terminal of the IC device even when the lower surface (suction surface) of the suction nozzle is used as a reference. A vertical cross-sectional view of a state where the pins are also accessible. FIG. 7 shows an IC device having an uneven distance (H ₉₀ ) from the lower surface to each terminal of the IC device even when the lower surface (suction surface) of the suction nozzle is used as a reference. A vertical cross-sectional view of a state where the pins are also accessible. FIG. 8 shows an IC device having an uneven distance (H ₉₀ ) from the lower surface to each terminal of the IC device even when the lower surface (suction surface) of the suction nozzle is used as a reference. A vertical cross-sectional view of a state where the pins are also accessible. Fig. 9 is a schematic partial vertical cross-sectional view of a device transfer head provided in the electronic component inspection apparatus of the second embodiment. Fig. 10 is a schematic partial vertical cross-sectional view of a device transfer head provided in the electronic component inspection apparatus of the third embodiment. 11 is a schematic partial vertical cross-sectional view of a device transfer head and a movable portion included in an electronic component inspection apparatus according to a fourth embodiment. Fig. 12 is a schematic partial vertical cross-sectional view of a device transfer head provided in an electronic component inspection apparatus according to a fifth embodiment. Fig. 13 is a schematic plan view showing an operating state of the electronic component inspection device shown in Fig. 1 in the sixth embodiment. FIG. 14 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a device transfer head provided in the inspection area in FIG. 13. FIG. 15 is a schematic partial vertical cross-sectional view sequentially showing the operating state of the device transfer head provided in the inspection area in FIG. 13. FIG. 16 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a device transfer head provided in the inspection area in FIG. 13. FIG. 17 is a partial vertical cross-sectional perspective view showing another configuration example of the adsorption nozzle and its surroundings provided in the device transfer head of FIGS. 14 to 16. FIG. 18 shows an IC device in which the distance (H ₉₀ ) from the lower surface to each terminal of the IC device is uneven even when the lower surface (suction surface) of the suction nozzle is used as a reference. A vertical cross-sectional view of the state where the probe pins can also be touched. FIG. 19 shows an IC device in which the distance (H ₉₀ ) from the lower surface to each terminal of the IC device is uneven even when the lower surface (suction surface) of the suction nozzle is used as a reference. A vertical cross-sectional view of the state where the probe pins can also be touched. FIG. 20 shows an IC device in which the distance (H ₉₀ ) from the lower surface to each terminal of the IC device is uneven even when the lower surface (suction surface) of the suction nozzle is used as a reference. A vertical cross-sectional view of the state where the probe pins can also be touched. FIG. 21 is a vertical sectional view showing an inspection section provided in an inspection area of the electronic component inspection apparatus according to the seventh embodiment. 22 is a vertical cross-sectional view showing an inspection section provided in an inspection area of an electronic component inspection apparatus according to a seventh embodiment. Fig. 23 is a schematic plan view showing an operating state of the electronic component inspection device shown in Fig. 1 in the eighth embodiment. FIG. 24 is a block diagram of a main part of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 25 is a schematic partial vertical cross-sectional view showing an operating state (during inspection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 26 is a schematic partial vertical cross-sectional view showing an operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 27 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 28 is a schematic plan view sequentially showing an operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 29 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 30 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 31 is a schematic plan view sequentially showing an operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 32 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 33 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 34 is a schematic plan view showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23 in order. FIG. 35 is a schematic plan view sequentially showing an operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 36 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 37 is a schematic plan view showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23 in order. FIG. 38 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 39 is a schematic plan view showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23 in order. FIG. 40 is a schematic plan view sequentially showing an operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 41 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. FIG. 42 is a schematic plan view sequentially showing the operating state (during force detection) of the device transfer head provided in the inspection area in FIG. 23. Fig. 43 is a schematic plan view of an electronic component inspection apparatus according to a ninth embodiment. FIG. 44 is a schematic enlarged plan view showing a device supply section of the electronic component inspection apparatus shown in FIG. 43. Fig. 45 is a schematic plan view of an electronic component inspection apparatus according to a tenth embodiment. FIG. 46 is a schematic enlarged plan view showing a device supply section of the electronic component inspection apparatus shown in FIG. 45.

Claims

An electronic component conveying device, comprising: a first base portion; a first sliding portion that is slidable relative to the first base portion; a second base portion that is disposed on the first sliding portion; and a second sliding portion that is The first base can be slid relative to the second base and can abut on the electronic component. A first space having a variable volume is formed between the first base and the first sliding part. A second space having a variable volume is formed between the sliding portions.

For example, if the electronic component transfer device of item 1 is requested, the working fluid can enter and exit in the first space and the second space.

For example, the electronic component transfer device according to claim 1, wherein the second base portion may be in contact with the electronic component placement portion on which the electronic component is placed.

For example, in the electronic component transporting device of claim 3, the contact force of the second sliding portion to the electronic component is different from the contact force of the second base portion to the electronic component placement portion.

The electronic component conveying device according to claim 1, further comprising a working fluid supply unit for supplying a working fluid to the first space and the second space.

The electronic component transfer device according to claim 1 has a third space communicating with the second space.

For example, in the electronic component transfer device of claim 2, the area of the first pressure receiving surface of the first sliding portion receiving the working fluid is larger than the area of the second pressure receiving surface of the second sliding portion receiving the working fluid.

For example, the electronic component transfer device according to claim 1, wherein the second base portion may be in contact with a part of the electronic component.

For example, the electronic component conveying device according to claim 8, wherein the contact force of the second sliding portion to the electronic component is different from the contact force of the second base portion to the electronic component.

For example, the electronic component transfer device of claim 8 or 9, wherein the second base portion and the second sliding portion abut on the electronic component at different positions.

For example, in the electronic component transfer device of claim 2, the pressure of the working fluid on the first space and the pressure of the working fluid on the second space can be changed separately.

For example, the electronic component transporting device of claim 1 includes: a movable portion that can move the electronic component as described above; and a force detection portion that is provided on the movable portion and can detect a force; the force detection portion can be connected with The electronic component abutting on the second sliding portion abuts.

An electronic component inspection device includes a first base portion, a first sliding portion that can slide relative to the first base portion, a second base portion that is disposed on the first sliding portion, and a second sliding portion that can It slides with respect to the second base portion and can abut an electronic component; and an inspection portion inspects the electronic component; and a first variable volume is formed between the first base portion and the first sliding portion. A space is formed between the second base portion and the second sliding portion, and a second space having a variable volume is formed.