CN107884700A

CN107884700A - Electronic component conveyer and electronic component check device

Info

Publication number: CN107884700A
Application number: CN201710902573.7A
Authority: CN
Inventors: 中村敏
Original assignee: Seiko Epson Corp
Current assignee: North Star Technology Co ltd
Priority date: 2016-09-29
Filing date: 2017-09-28
Publication date: 2018-04-06
Anticipated expiration: 2037-09-28
Also published as: TWI649567B; TW201814295A; CN107884700B

Abstract

The present invention provides a kind of electronic component conveyer and electronic component check device, such as when carrying out the electric checking to electronic component by inspection portion, it can be such that each terminal of electronic component is equably abutted with each terminal in inspection portion.Electronic component conveyer (10) possesses：First base portion (511)；The first sliding part (512) that can be slided relative to the first base portion (511)；It is configured at the second base portion (32), (33), (34) of the first sliding part (512)；And it can be slided relative to the second base portion (32), (33), (34) and the second sliding part (31) of electronic component can be connected to, wherein, the first space (S1) that can be changed formed with volume between the first base portion (511) and the first sliding part (512), the second space (S2) that can be changed formed with volume between the second base portion (34) and the second sliding part (31).

Description

Electronic component conveyer and electronic component check device

Technical field

The present invention relates to electronic component conveyer and electronic component check device.

Background technology

It is known in the art that there is the test device of the electronic components such as test IC package (referring for example to patent document 1).The test device that patent document 1 is recorded possesses：Propeller, in the state of handle holds electronic component, by the electronics member device Part is pressed into socket for inspection；And pressure sensing cell, link with propeller, detect the propeller and press electronic component It has been pressed onto the pressure (pressing force) when in socket.In addition, in the test device that patent document 1 is recorded, carrying out to electronics member During the test of device, can based on the testing result of pressure sensing cell come detect propeller whether with defined pressure by electronics Component has been pressed into socket.

Patent document 1：Japanese Patent Laid-Open 2003-161758 publications

But in the test device that patent document 1 is recorded, even if propeller is by electronic component with defined pressure It has been pressed into socket, but for example due to the size (thickness), shape (warpage), electronic component mounting portion of electronic component Depth of parallelism of (socket) and propeller etc., the terminal of each solder ball of electronic component and each contact pilotage of socket may not equably connect Touch.In addition, if the terminal of each solder ball and each contact pilotage are not uniformly in contact with can produce to be carried out to electronics exactly The problem of test of component.

In addition, in the case where being provided with multiple propellers, pressure sensing cell also necessarily corresponds to each propeller and set Put.Such composition can cause the construction complication of test device, increase of manufacturing cost etc., turn into practical difficult original Cause.

The content of the invention

The present invention is at least a portion in order to solve the above-mentioned technical problem and made, and can be come in the following manner real It is existing.

The electronic component conveyer of the present invention is characterized in that, possess：First base portion；First sliding part, relative to First base portion can slide；Second base portion, it is configured at first sliding part；And second sliding part, relative to described Second base portion can slide, and can be abutted with electronic component, wherein, in first base portion and first sliding part Between the first space that can be changed formed with volume, formed with volume between second base portion and second sliding part The second space that can be changed.

Thus, can also be by adjusting the first space and second space even electronic component has individual difference The pressure of interior working fluid offsets the difference.Also, such as the electric inspection to electronic component is being carried out by inspection portion When looking into, each terminal of electronic component can be independently set equably to be connected to inspection portion with the individual difference of electronic component Each terminal, so as to carry out its inspection exactly.

The present invention electronic component conveyer in, it is preferable that working fluid can come in and go out first space with And the second space.

It thus, it is possible to slide the first sliding part, and can slide the second sliding part.

In the electronic component conveyer of the present invention, it is preferable that second base portion can be with supplying electronics member The electronic component mounting portion of device mounting abuts.

Thus, it is possible to the posture of the second base portion is set to turn into the state for the shape for imitating electronic component mounting portion.Therefore, exist Under the imitation state, the second sliding part can be connected to electronic component.As a result, for example electronic component mounting portion be into In the case of the capable part to the electric checking of electronic component, do not obtain electronic component mounting portion (socket) even and push away When entering the depth of parallelism of device, it is possibility to have help the abundant contact of each terminal of electronic component and each terminal of mounting portion.

In the electronic component conveyer of the present invention, it is preferable that second sliding part is connected to the electronics member The abutting power that the abutting power of device is connected to the electronic component mounting portion from second base portion is different.

For example, it is connected to electronics member less than the second base portion by making the second sliding part be connected to the abutting power of electronic component The abutting power of device mounting portion, so as to while the effect above is played, prevent from exceedingly pressing electronic component.

In the electronic component conveyer of the present invention, it is preferable that have to first space and second sky Between supply uniform pressure working fluid working fluid supply unit.

By the common working fluid supply unit in the first space of setting and second space, it can form device simple.

In the electronic component conveyer of the present invention, it is preferable that there is the 3rd sky connected with the second space Between.

Thus, with being provided with the 3rd space correspondingly, the variation of the pressure of second space can be suppressed.

In the electronic component conveyer of the present invention, it is preferable that first sliding part bears the working fluid The first compression face area be more than second sliding part bear the working fluid the second compression face area.

Thus, in the case of the pressure identical of the first space and second space is made, can make to put on the first sliding part Power be more than and put on the power of the second sliding part.

In the electronic component conveyer of the present invention, it is preferable that second base portion can be with the electronics member device The local abutting of part.

Thus, such as in the state of the second base portion has pressed the part of electronic component, the second sliding part can press The remainder of electronic component.

In the electronic component conveyer of the present invention, it is preferable that second sliding part is connected to the electronics member The abutting power that the abutting power of device is connected to the electronic component from second base portion is different.

Thus, it is possible to reduce in electronic component the load for the part that the second sliding part abuts with electronic component or The load of the part that the second base portion abuts with electronic component in electronic component can be reduced.I.e., it can correspond to electronics member The position of device and make abutting power different.

In the electronic component conveyer of the present invention, it is preferable that second base portion and second sliding part exist Different positions abuts with the electronic component.

In the electronic component conveyer of the present invention, it is preferable that flow to the working fluid in first space Pressure and the pressure of the working fluid that flows to the second space can be changed respectively.

Thus, it is possible to make the power for putting on the first sliding part different with the power for putting on the second sliding part.

In the electronic component conveyer of the present invention, it is preferable that have：Movable part, the electronics member can be loaded Device moves；And power test section, the movable part is arranged at, and power can be detected, wherein, the power test section can Abutted with the electronic component for being connected to second sliding part.

Thus, can be by handle part institute handle such as in the case where carrying out to the inspection of electronic component by inspection portion Actual abutting power when the electronic component held is connected to inspection portion replaces with the abutting power detected by power test section.And And according to the size of the abutting power detected in power test section abutting power when electronic component checks can be judged for this Whether it is appropriate size for electronic component.

The electronic component check device of the present invention is characterized in that, possess：First base portion；First sliding part, relative to First base portion can slide；Second base portion, it is configured at first sliding part；Second sliding part, relative to described second Base portion can slide, and can be abutted with electronic component；And inspection portion, the electronic component is checked, wherein, in institute The first space that can be changed formed with volume between the first base portion and first sliding part is stated, in second base portion and institute State the second space that can be changed formed with volume between the second sliding part.

The electronic component conveyer of the present invention is characterized in that, possess：Suction unit, electricity can be held by attracting Sub- component, and can be to the attraction direction movement for attracting the electronic component；And force section, can be to the attraction side To opposite direction the suction unit is exerted a force, can be to the attraction also, in the state of the electronic component has been attracted Shrink in direction.

Thus, can also be by the way that electronic component can be being attracted even electronic component has individual difference The difference is offset in the force section shunk under state.Also, such as the electricity to electronic component is being carried out by inspection portion When gas checks, can independently make with the individual difference of electronic component each terminal of electronic component equably with inspection portion Each terminal abuts, and therefore, can carry out its inspection exactly.

In the electronic component conveyer of the present invention, it is preferable that can configure has what is abutted with the suction unit Abutting part and the mounting portion loaded for the electronic component, also, have what is abutted in the suction unit with the abutting part The stance adjustment portion of the posture of the suction unit can be adjusted under state.

Thus, such as in the case where mounting portion is to carry out to the part of the electric checking of electronic component, can help In electronic component each terminal and mounting portion each terminal abundant contact.

In the electronic component conveyer of the present invention, it is preferable that plate-like portion of the abutting part by variable thickness more Part is formed.

Thus, can be with electricity such as in the case where mounting portion is to carry out to the part of the electric checking of electronic component The thickness of sub- component correspondingly makes mounting portion be suitable for the inspection of the electronic component.

In the electronic component conveyer of the present invention, it is preferable that the abutting part has piezoelectric element.

Thus, it is possible to the thickness according to the size for the voltage for putting on piezoelectric element, easily and rapidly change abutting part.

In the electronic component conveyer of the present invention, it is preferable that the mounting portion has to the attraction direction pair It is placed in the electronic component force section of the electronic component force of the mounting portion.

Thus, such as in the case where mounting portion is to carry out to the part of the electric checking of electronic component, electricity can be made Each terminal of sub- component and each terminal of mounting portion fully contact, and therefore, can carry out exactly for electronic component Check.

In the electronic component conveyer of the present invention, it is preferable that the force section is by helical spring (U イ Le バネ) form.

Thus, it is possible to make the composition of force section simple, and the lightweight of force section can be realized.

The present invention electronic component conveyer in, it is preferable that the spring constant of the helical spring be 1N/mm with Upper below 90N/mm.

Thus, in the case where carrying out to the electric checking of electronic component, the electronic component can be assigned and be adapted to In the force of inspection.In addition, can attract to maintain in the state of electronic component in suction unit can be to described for helical spring The state for attracting direction to shrink.

In the electronic component conveyer of the present invention, it is preferable that the external diameter of the helical spring is more than 7mm 20mm Below.

Thus, it is possible to helical spring is set to turn into the size that can be built in predetermined portion.

In the electronic component conveyer of the present invention, it is preferable that the internal diameter of the helical spring is more than 5mm 10mm Below.

In the electronic component conveyer of the present invention, it is preferable that the line footpath of the helical spring is more than 0.3mm Below 2mm.

In the electronic component conveyer of the present invention, it is preferable that the greatest attraction forces of the suction unit are -95kPa Below -30kPa above.

Thus, it is possible to stably attract, hold the electronic component of all size (weight).Furthermore, it is possible to maintain this Transmit electronic component with holding state.Thus, it is possible to prevent electronic component from being dropped in transmit process.

In the electronic component conveyer of the present invention, it is preferable that be configured to change the attraction of the suction unit Power.

In the electronic component conveyer of the present invention, it is preferable that have：It is connected to the electronic component and adsorbs The adsorption nozzle of the electronic component；And the pressure regulating device for the attraction for attracting the electronic component can be changed, its In, by changing the attraction, the pressing force that the adsorption nozzle presses the electronic component can be changed.

The electronic component check device of the present invention is characterized in that, possess：Suction unit, electricity can be held by attracting Sub- component, and can be to the attraction direction movement for attracting the electronic component；Force section, can be to the attraction direction Opposite direction exerts a force to the suction unit, also, in the state of the electronic component has been attracted, can be along the attraction direction Shrink；And inspection portion, check the electronic component.

Thus, can also be by the way that electronic component can be being attracted even electronic component has individual difference The difference is offset in the force section shunk under state.Also, such as the electricity to electronic component is being carried out by inspection portion When gas checks, can independently make with the individual difference of electronic component each terminal of electronic component equably with inspection portion Each terminal abuts, and therefore, can carry out its inspection exactly.Furthermore, it is possible to electronic component is sent to inspection portion, therefore, The inspection to the electronic component can be carried out by inspection portion.Furthermore, it is possible to transmit the electronics member device after checking from inspection portion Part.

The electronic component conveyer of the present invention is characterized in that, possess：The handle part of part can be held；It can carry Put the movable part that electronic component moves；And be arranged at the movable part and the power test section of power can be detected, wherein, energy The part for enough being held the handle part is connected to the power test section.

Thus, such as in the case where carrying out to the inspection of electronic component by inspection portion, handle part institute will can be made Actual abutting power when the electronic component of holding is connected to inspection portion replaces with the abutting power detected by power test section. And it is possible to according to the size of the abutting power detected in power test section, judge abutting power when electronic component checks for Whether it is appropriate size for the electronic component.

In the electronic component conveyer of the present invention, it is preferable that the inspection of the electronic component, institute can be carried out Stating movable part has：Load electronic component mounting portion before the inspection of the electronic component before the inspection；And mounting Electronic component mounting portion after the inspection of the electronic component after the inspection, the power test section are arranged at the inspection After preceding electronic component mounting portion and the inspection between electronic component mounting portion.

Thus, electronic component mounting portion and ensure have for example, between electronic component mounting portion after checking before inspection The sufficient space of one power test section is set.Thus, both can when the design of electronic component conveyer just Power test section is set, again power can also be set to detect after the electronic component conveyer for eliminating power test section is completed Portion, that is to say, that can set and (set up) power test section later.

In the electronic component conveyer of the present invention, it is preferable that electronic component mounting portion and institute before the inspection Electronic component mounting portion can move back and forth in one direction after stating inspection.

Thus, it is possible to by electronic component mounting portion before inspection by the electronic component before inspection from transfer source stably It is sent to transfer destination.Furthermore, it is possible to by electronic component mounting portion after inspection by the electronic component after inspection for example Other transfer destination is stably sent to from other transfer source.

In the electronic component conveyer of the present invention, it is preferable that the handle part can with one to friendship Other sides of fork move up.

Thus, while the electronic component that handle part can in the holding part, in addition, it is sent to it Transfer destination.

In the electronic component conveyer of the present invention, it is preferable that the part for being held the handle part supports The translational speed of handle part when being connected to the power test section is below the 10mm/ seconds.

Thus, even the part and power test section generate impact when abutting, it is also possible to prevent caused by the impact The deformation etc. of the part, power test section.

In the electronic component conveyer of the present invention, it is preferable that the power test section, which can be configured at, overlooks sight On when examining and position that the handle part is overlapping.

In the case where carrying out the inspection of electronic component by inspection portion, in the inspection, electronic component is from top Abut and (be compressed against) in inspection portion.Identically with this, when power detects, power detection part can also be abutted from top and (pressed To) in power test section.Abutting direction when so, due to being detected when checking with power is identical, so as to by " power detection part With the abutting power of power test section " as and " electronic component and the abutting power in inspection portion " equal power treat.

In the electronic component conveyer of the present invention, it is preferable that the power test section is configured at than before the inspection After electronic component mounting portion and the inspection on the high position of electronic component mounting portion.

Thus, handle part for example hold check before electronic component in electronic component mounting portion when, dropping to can To carry out the position of the holding (hereinafter, referred to as " position can be held ") and stop, but examined making power detection be connected to power with part When survey portion is to detect power, stop at higher than the position that can hold position.It is therefore prevented that handle part when power detects is with being present in Other circumferential components of position less than the handle part etc. interfere.

In the electronic component conveyer of the present invention, it is preferable that the part and institute that the handle part is held State power test section be connected to the beginning of the inspection before, provide after the end of the inspection or whenever the handle part is held Carried out during the electronic component of number.

Thus, it is possible to suitably be selected, set from these three opportunitys, therefore, can comply with using electronics member device The requirement of the user of part conveyer.

In the electronic component conveyer of the present invention, it is preferable that be provided with multiple handle parts, can make described The part that each handle part is held independently is connected to the power test section.

Thus, such as the abutting power on multiple handle parts can be detected by a power test section, it is thereby achieved that The simplification of composition.

In the electronic component conveyer of the present invention, it is preferable that the institute for being held the handle part can be adjusted State abutting power when part is connected to the power test section.

Thus, can be with first with electronics when checking such as in the case where carrying out the inspection of electronic component by inspection portion The equal power of abutting power of the device to inspection portion makes the part be connected to power test section.Therefore, it will can support the part The abutting masterpiece for being connected to power test section is and " abutting power of the electronic component to inspection portion " equal power is treated.

In the electronic component conveyer of the present invention, it is preferable that the abutting power is more than 0.3N below 600N.

Such as in the case where carrying out the inspection of electronic component by inspection portion, such number range and electricity when checking Sub- component to the abutting power in inspection portion can value number range it is identical.Thus, it is possible to the part will be made to be connected to power The abutting masterpiece of test section is and " abutting power of the electronic component to inspection portion " equal power is treated.

In the electronic component conveyer of the present invention, it is preferable that can configure for electronic component mounting Mounting portion, also, with can be adjusted when the electronic component for being held the handle part is placed in the mounting portion The stance adjustment portion of the posture of the whole handle part.

The electronic component conveyer of the present invention is characterized in that, possess：The handle part of part can be held；It can carry Put the movable part that electronic component moves；It is arranged at the movable part and the power test section of power can be detected；And it can deposit Store up the storage part for the testing result that the power test section detects.

Thus, such as in the case where carrying out to the inspection of electronic component by inspection portion, handle part institute will can be made Actual abutting power when the electronic component of holding is connected to inspection portion replaces with the abutting power detected by power test section. And it is possible to according to the size of the abutting power detected in power test section, judge abutting power when electronic component checks for Whether it is appropriate size for the electronic component.In addition, the abutting power detected in power test section is stored in storage part.

In addition, as power test section, such as force cell can be used, force cell, which is arranged at, to be relatively easy to ensure that The movable part of its installation space.Thus, it is possible to carry out the detection of power by simply forming.

The electronic component check device of the present invention is characterized in that, possess：The handle part of part can be held；It can carry Put the movable part that electronic component moves；It is arranged at the movable part and the power test section of power can be detected；And check institute The inspection portion of electronic component is stated, wherein, the part that can be held the handle part is connected to the power test section.

Thus, in the case where carrying out to the inspection of electronic component by inspection portion, it can will be held handle part Actual abutting power of electronic component when being connected to inspection portion replace with the abutting power detected by power test section.And And according to the size of the abutting power detected in power test section abutting power when electronic component checks can be judged for this Whether it is appropriate size for electronic component.

Furthermore, it is possible to which electronic component is sent into inspection portion, therefore, can be carried out by inspection portion to the electronics member device The inspection of part.Furthermore, it is possible to transmit the electronic component after checking from inspection portion.

Brief description of the drawings

Fig. 1 is the electronic component check device involved by the first, the 6th and the 8th embodiment from face side Approximate three-dimensional map.

Fig. 2 is the general view for the operating state for showing the electronic component check device shown in Fig. 1.

Fig. 3 is that the outline of the operating state for the device transfer head for showing to be arranged at the inspection area in Fig. 2 successively locally hangs down Straight sectional view.

Fig. 4 is that the outline of the operating state for the device transfer head for showing to be arranged at the inspection area in Fig. 2 successively locally hangs down Straight sectional view.

Fig. 5 is that the outline of the operating state for the device transfer head for showing to be arranged at the inspection area in Fig. 2 successively locally hangs down Straight sectional view.

Fig. 6 is shown using the lower surface (adsorption plane) of adsorption nozzle as during benchmark, even from lower surface to IC devices Each terminal distance (H₉₀) irregular IC devices to differ, the state that each probe in each terminal and inspection portion can also contact Vertical cross-section diagram.

Fig. 7 is shown using the lower surface (adsorption plane) of adsorption nozzle as during benchmark, even from lower surface to IC devices Each terminal distance (H₉₀) irregular IC devices to differ, the state that each probe in each terminal and inspection portion can also contact Vertical cross-section diagram.

Fig. 8 is shown using the lower surface (adsorption plane) of adsorption nozzle as during benchmark, even from lower surface to IC devices Each terminal distance (H₉₀) irregular IC devices to differ, the state that each probe in each terminal and inspection portion can also contact Vertical cross-section diagram.

Fig. 9 is that the outline for the device transfer head that the electronic component check device involved by second embodiment possesses is local Vertical cross-section diagram.

Figure 10 is the outline office for the device transfer head that the electronic component check device involved by the 3rd embodiment possesses Portion's vertical cross-section diagram.

Figure 11 is the device transfer head that the electronic component check device involved by the 4th embodiment possesses and movable The outline partial vertical sectional view in portion.

Figure 12 is the outline office for the device transfer head that the electronic component check device involved by the 5th embodiment possesses Portion's vertical cross-section diagram.

Figure 13 is the operating state for showing the electronic component check device shown in Fig. 1 involved by the 6th embodiment General view.

Figure 14 is that the outline of the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 13 successively is local Vertical cross-section diagram.

Figure 15 is that the outline of the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 13 successively is local Vertical cross-section diagram.

Figure 16 is that the outline of the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 13 successively is local Vertical cross-section diagram.

Figure 17 is the other configuration examples for showing adsorption nozzle that the device transfer head in Figure 14~Figure 16 possesses and its periphery Partial vertical cross-sectional perspective view.

Figure 18 is shown using the lower surface (adsorption plane) of adsorption nozzle as during benchmark, even from lower surface to IC devices Each terminal distance (H₉₀) irregular IC devices to differ, the state that each probe in each terminal and inspection portion can also contact Vertical cross-section diagram.

Figure 19 is shown using the lower surface (adsorption plane) of adsorption nozzle as during benchmark, even from lower surface to IC devices Each terminal distance (H₉₀) irregular IC devices to differ, the state that each probe in each terminal and inspection portion can also contact Vertical cross-section diagram.

Figure 20 is shown using the lower surface (adsorption plane) of adsorption nozzle as during benchmark, even from lower surface to IC devices Each terminal distance (H₉₀) irregular IC devices to differ, the state that each probe in each terminal and inspection portion can also contact Vertical cross-section diagram.

Figure 21 is the inspection for showing to be arranged at the inspection area of the electronic component check device involved by the 7th embodiment Look into the vertical cross-section diagram in portion.

Figure 22 is the inspection for showing to be arranged at the inspection area of the electronic component check device involved by the 7th embodiment Look into the vertical cross-section diagram in portion.

Figure 23 is the operating state for showing the electronic component check device shown in Fig. 1 involved by the 8th embodiment General view.

Figure 24 is the block diagram of the major part of the electronic component check device shown in Fig. 1.

Figure 25 is the outline of the operating state (during inspection) for the device transfer head for showing to be arranged at the inspection area in Figure 23 Partial vertical sectional view.

Figure 26 is the general of the operating state (when power detects) for the device transfer head for showing to be arranged at the inspection area in Figure 23 Slightly partial vertical sectional view.

Figure 27 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 28 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 29 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 30 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 31 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 32 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 33 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 34 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 35 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 36 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 37 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 38 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 39 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 40 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 41 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 42 is the operating state for the device transfer head for showing to be arranged at the inspection area in Figure 23 successively (when power detects) General view.

Figure 43 is the general view of the electronic component check device involved by the 9th embodiment.

Figure 44 is the outline amplification view for the device supply unit for showing the electronic component check device shown in Figure 43.

Figure 45 is the general view of the electronic component check device involved by the tenth embodiment.

Figure 46 is the outline amplification view for the device supply unit for showing the electronic component check device shown in Figure 45.

Description of reference numerals

1 electronic component check device；3 suction units；4 helical springs；5 stance adjustment portions；6 insulations；Move in 7X directions Mechanism；8 pipe arrangements；9 power test sections；9A power test section (the first power test section)；9B power test section (the second power test section)；10 electronics Component conveyer；11A, 11B tray delivery mechanism；12 temperature adjustment portions；13 device transfer heads；14 device supply units；14A Device supply unit (the first device supply unit)；14B devices supply unit (the second device supply unit)；15 tray delivery mechanisms；16 inspections Look into portion；17 device transfer heads；17A devices transfer head (the first device transfer head)；(the second device transmits 17B devices transfer head Head)；18 device recoverers；18A devices recoverer (the first device recoverer)；18B devices recoverer (the second device recoverer)； 19 recovery pallets；20 device transfer heads；21st, 22A, 22B tray delivery mechanism；23 lower ends；24 upper ends；25Z directions moving machine Structure；26 attract source (vacuum generating source)；27 line slideways；28 ball-screws；29 line slideways；30 movable parts；31 adsorption nozzles (the second sliding part)；32 first pieces (second base portions)；33 second pieces (second base portions)；34 the 3rd pieces (second base portion)；35 fillers； 36 connectors；37 fillers；38 guide members；39 pads；40 motors；41st, 42 connector；43 fillers；44 handle parts；45 attract Portion；46 device transfer heads；47 fulcrum bearings；51 first adjustment mechanisms；52 second adjustment mechanisms；53 barrier films；54 connecting members；55 frames Body；56 pulleys；57 connecting members；58 pulleys；59 synchronous cog belts；61 heat insulating members；71 pipe arrangements；71A line slideways；72 injections Device；72A fulcrum bearings；73 adjusters；73A is padded；81st, 82 pipe arrangement；83 casings；84 adjusters；85 working fluid supply units；86 points Fulcrum；90IC devices；90’、90A₁’、90A₂’、90A₃’、90A₄’、90A₅’、90A₆’、90A₇’、90A₈’、90B₁’、90B₂’、 90B₃’、90B₄’、90B₅’、90B₆’、90B₇’、90B₈' power detection part；141 recesses (pouch-shaped portion)；161 inspection portion main bodys； 162 abutting parts；163 probes；164 guiding pins；165 recesses (pouch-shaped portion)；166 electronic component force sections；167 piezoelectric elements； 168 recesses (pouch-shaped portion)；171 connecting portions；181 recesses (pouch-shaped portion)；200 pallets；231 first spaced walls；232 second intervals Wall；233 the 3rd spaced walls；234 the 4th spaced walls；235 the 5th spaced walls；241 protecgulums；242nd, 243 side lid；244 back-covers；245 Top cover；300 monitors；301 display screens；311 upper surfaces；312 lower surfaces；313 inner cavities；314 opening portions (suction port)；315 Flange part；316 grooves；317 notch parts；318 streams；319 lower surfaces；320 sides；321 upper surfaces；322 lower surfaces；323 sides； 324 inner cavities；331 upper surfaces；332 lower surfaces；333 inner cavities；334th, 335 groove；336 inner cavities；341 upper surfaces；342 following tables Face；343 recesses；344 through holes；345 guide holes；346 protuberances；400 signal lamps；421 board members；500 loudspeakers；511 cylinders (the One base portion)；512 pistons (the first sliding part)；513 inner cavities；514 flange parts；515 piston rods；516 through holes；517 tracks； 518 sliding blocks；521 board members；522 nuts；523 thread spindles；531 lower surfaces；532 speed changers；600 Mouse tables；700 operating surfaces Plate；711st, 711A rails；712nd, 712A sliding blocks；800 control units；801CPU；802 storage parts；901 terminals；902 substrates；903 protrude Portion；A1 pallets supply area；A2 devices supply area (supply area)；A3 inspection areas；A4 devices recovery zone (recovery area Domain)；A5 pallets remove region；F₃、F₃' attraction；F₉₀、F₉₀' abut power；H₉₀Distance；The compression faces of M1 first；M2 second is pressurized Face；R working fluids；The spaces of S1 first；S2 second spaces；S₉₀₂、S₉₀₃Center；α₃Attract direction；α_9X、α_9Y、α_11X、α_11Y、α_13X、 α_13Y、α₁₄、α_14Y、α₁₅、α_17Y、α_17Y(+)、α_17Y(-)、α₁₈、α_18Y、α₂₁、α_20X、α_20Y、α_22A、α_22B、α₉₀Arrow；External diameter；Internal diameter；Coil diameter.

Embodiment

Below, electronic component conveyer and the electronics member based on preferred embodiment shown in the drawings to the present invention Device inspection apparatus is described in detail.

(first embodiment)

Below, 1~Fig. 8 of reference picture, to the electronic component conveyer and electronic component check device of the present invention Present embodiment illustrate.It should be noted that below, for convenience of description, as shown in figure 1, by mutually orthogonal three Axle is set to X-axis, Y-axis and Z axis.In addition, the X/Y plane including X-axis and Y-axis is level, Z axis is vertical.In addition, it will be put down with X-axis Capable direction is also referred to as " X-direction (first direction) ", and the direction parallel with Y-axis is also referred to as into " Y-direction (second direction) ", will be with The parallel direction of Z axis is also referred to as " Z-direction (third direction) ".In addition, by the arrow of all directions towards direction be referred to as " just ", will Its opposite direction referred to as " negative ".In addition, " level " described in present specification is not limited to complete level, as long as not The transmission of electronic component is hindered, is also included relative to horizontal how much (being, for example, less than 5 ° or so) inclined states.In addition, also have The upside of (Fig. 9~Figure 11 is also same) in Fig. 1 and Fig. 3~Fig. 8 is referred to as " on " or " top ", downside is referred to as " under " or The situation of " lower section ".

The electronic component conveyer 10 of present embodiment possesses：Cylinder 511 as the first base portion；Relative to cylinder 511 The piston 512 as the first sliding part that can be slided；Be configured at piston 512 as first piece 32 of the second base portion, second Block 33 and the 3rd piece 34；And simultaneously energy and electronic component can be slided relative to first piece 32, second piece 33 and the 3rd piece 34 The adsorption nozzle 31 as the second sliding part of abutting, in the cylinder 511 as the first base portion and the piston as the first sliding part The first space S 1 that can be changed formed with volume between 512, slided as the 3rd piece 34 of the second base portion and conduct second The second space S2 that can be changed formed with volume between the adsorption nozzle 31 in portion.

Thus, can also be empty by the first space S of regulation 1 and second even electronic component has individual difference Between working fluid R in S2 pressure or influx offset the difference.In addition, for example carried out by inspection portion 16 to electronics During the electric checking of component, it can independently make each terminal of electronic component equably with the individual difference of electronic component Each terminal in inspection portion 16 is connected to, so as to carry out the inspection exactly.

In addition, the electronic component check device 1 of present embodiment has the electronic component transmission dress of present embodiment 10 are put, is also equipped with checking the inspection portion 16 of electronic component.I.e., the electronic component check device 1 of present embodiment possesses：Make For the cylinder 511 of the first base portion；The piston 512 as the first sliding part that can be slided relative to cylinder 511；It is configured at piston 512 First piece 32, second piece 33 and the 3rd piece 34 as the second base portion；Relative to first piece 32, second piece 33 and the 3rd piece 34 The adsorption nozzle 31 as the second sliding part that can be slided and can be abutted with electronic component；And check electronic component Inspection portion 16, it can be changed formed with volume in the cylinder 511 as the first base portion and as between the piston 512 of the first sliding part The first space S 1, as the 3rd piece 34 of the second base portion and as between the adsorption nozzle 31 of the second sliding part formed with appearance The second space S2 that product can change.

Thus, the electronic component check device 1 the advantages of with foregoing electronic component conveyer 10 can be obtained. Furthermore, it is possible to which electronic component is sent into inspection portion 16, therefore, can be carried out by inspection portion 16 to the electronic component Check.Furthermore, it is possible to transmit the electronic component after checking from inspection portion 16.

Below, the composition of each several part is illustrated.

As shown in Figure 1 and Figure 2, the electronic component check device 1 of built-in electronic component conveyer 10 is transmission For example, BGA (Ball Grid Array：Ball grid array) encapsulation the electronic component such as IC devices and examined in its transmit process Look into, test the device of the electrical characteristic of (following, referred to as " to check " merely) electronic component.It should be noted that it is following, in order to It is easy to illustrate, typically the situation that IC devices are used as to foregoing electronic component is illustrated, as " IC devices 90”.IC devices 90 are tabular in the present embodiment.In addition, it is configured with the lower surface of IC devices 90 hemispherical more Individual terminal 901.

In addition, as IC devices, in addition to the foregoing, such as " LSI (Large Scale can also be included Interation：Large scale integrated circuit) ", " COMS (Complementary MOS：Complementary metal oxide semiconductor) ", “CCD(Charge Coupled Device：Charge coupled cell) ", by multiple IC device blocks encapsulations " module I C ", " quartz crystal device ", " pressure sensor ", " inertial sensor (acceleration transducer) ", " gyrosensor " and " fingerprint sensing Device " etc..

In addition, electronic component check device 1 (electronic component conveyer 10) is equipped with corresponding to IC devices in advance 90 various types of instrument being changed, being referred to as " test loaded tool (チェ Application ジキット) " is used.The test carries Mounting portion of the tool with mounting IC devices 90, as the mounting portion, such as there are temperature adjustment portion 12 described later and device supply Portion 14 etc..In addition, the mounting portion as mounting IC devices 90, in addition to foregoing test loaded tool, also user prepares Inspection portion 16, pallet 200.

Electronic component check device 1 possesses pallet supply area A1, (below, the simple referred to as " supply of device supply area Region ") A2, inspection area A3, device recovery zone (below, being referred to as " recovery zone " merely) A4 and pallet removal region A5.As described later, these regions are divided by each wall portion.Also, IC devices 90 are from pallet supply area A1 to pallet Region A5 is removed along arrow α₉₀Foregoing each region is passed through in direction successively, and the inspection area A3 in midway is checked.So, Electronic component check device 1 possesses the conveying dress as the electronic component conveyer 10 in each region transmission IC devices 90 The inspection portion 16 put, checked in the A3 of inspection area and control unit 800.In addition, in addition, electronic component inspection Device 1 is also equipped with monitor 300, signal lamp 400 and guidance panel 700.

It should be noted that electronic component check device 1 will be configured with pallet supply area A1 and pallet removes area A domain A5 side, the downside i.e. in Fig. 2 as face side, using the upside being configured with an inspection area A3 side, i.e. Fig. 2 as Rear side is used.

The component that pallet supply area A1 is supplied with the pallet 200 for the multiple IC devices 90 for being arranged with non-inspection state supplies To portion.Multiple pallets 200 can be stacked in the A1 of pallet supply area.

Supply area A2 is that multiple IC devices 90 on the pallet 200 that will come from pallet supply area A1 transmission are respectively transmitted And supply to inspection area A3 region.It should be noted that set in a manner of across pallet supply area A1 and supply area A2 It is equipped with tray delivery mechanism 11A, the 11B for transmitting pallet 200 in the horizontal direction one by one.Tray delivery mechanism 11A is to connect Make arrow α of the pallet 200 into the positive side of Y-direction, i.e. Fig. 2 together with the IC devices 90 for being placed in the pallet 200_11ADirection is moved Dynamic move portion.Thus, it is possible to IC devices 90 are stably sent into supply area A2.In addition, tray delivery mechanism 11B is can be with Make arrow α of the pallet 200 of sky into the minus side of Y-direction, i.e. Fig. 2_11BThe move portion of direction movement.Thus, it is possible to make the support of sky Disk 200 is moved to pallet supply area A1 from supply area A2.

Temperature adjustment portion (ソー Network プレート are provided with the A2 of supply area, and (English is stated：Soakplate, Chinese table State (one)：Temperature-uniforming plate)) 12, device transfer head 13 and tray delivery mechanism 15.

Temperature adjustment portion 12 is configured to load the mounting portion of multiple IC devices 90, referred to as can be to the IC devices of the mounting 90 " temperature-uniforming plates " being heated or cooled in the lump., can be in advance to before being checked in inspection portion 16 by the temperature-uniforming plate IC devices 90 be heated or cooled, be adjusted to the temperature suitable for the inspection (high temperature inspection or low temperature inspection).Shown in Fig. 2 Composition in, temperature adjustment portion 12 configures, is fixed with two in the Y direction.In addition, by tray delivery mechanism 11A from pallet The IC devices 90 on pallet 200 that supply area A1 is sent into are transferred into any one temperature adjustment portion 12.It is it should be noted that logical The temperature adjustment portion 12 for fixing this as mounting portion is crossed, so as to stably enter to the IC devices 90 in the temperature adjustment portion 12 Trip temperature adjusts.

Device transfer head 13 is supported in the A2 of supply area in X direction and Y-direction movement and can also have The part that can be moved along Z-direction.Thus, device transfer head 13 can be responsible for the pallet 200 being sent into from pallet supply area A1 Between the transmission of IC devices 90 between temperature adjustment portion 12 and temperature adjustment portion 12 and device supply unit 14 described later The transmission of IC devices 90.It should be noted that in fig. 2, pass through arrow α_13XMovement of the device transfer head 13 in X-direction is shown, Pass through arrow α_13YThe movement of device transfer head 13 in the Y direction is shown.

Tray delivery mechanism 15 is will to eliminate empty pallet 200 in the state of all IC devices 90 in supply area To the positive side of X-direction, i.e. arrow α in A2₁₅The mechanism of direction transmission.In addition, after the transmission, pass through tray delivery mechanism 11B makes the pallet 200 of sky return to pallet supply area A1 from supply area A2.

Inspection area A3 is the region for checking IC devices 90.In the A3 of the inspection area, it is provided with and IC devices 90 is carried out The inspection portion 16 of inspection and the device transfer head 17 with suction unit 3.In addition, it is additionally provided with across supply area A2 and inspection Device supply unit 14 that region A3 mode moves and the device moved in a manner of across inspection area A3 and recovery zone A4 Recoverer 18.

Device supply unit 14 is configured to the mounting that mounting has carried out the IC devices 90 that temperature adjusts by temperature adjustment portion 12 Portion, the IC devices 90 can be sent near inspection portion 16 by it, be referred to as " supplying with shuttle plate " or referred to as " supply is worn merely Shuttle ".

In addition, this as the device supply unit 14 of mounting portion be supported to can supply area A2 and inspection area A3 it Between in X direction, i.e. arrow α₁₄Direction moves back and forth.Thus, device supply unit 14 can be stably by IC devices 90 from drainage area Domain A2 is sent near inspection area A3 inspection portion 16, in addition, IC devices 90 are by device transfer head 17 in the A3 of inspection area After taking away, supply area A2 can be again returned to.

In the composition shown in Fig. 2, two device supply units 14 are configured with along Y-direction, the IC devices in temperature adjustment portion 12 Part 90 is transferred into any one device supply unit 14.In addition, be similarly configured to can for device supply unit 14 and temperature adjustment portion 12 So that the IC devices 90 for being placed in the device supply unit 14 to be heated or cooled.Enter accordingly, for by temperature adjustment portion 12 The IC devices 90 of temperature of having gone adjustment, be sent to inspection area A3 inspection portion 16 with can maintaining its temperature adjustment state are attached Closely.

Device transfer head 17 is to hold the IC devices 90 for maintaining foregoing temperature adjustment state and the IC devices 90 exist The operating member of transmission in the A3 of inspection area.The device transfer head 17 is supported to can be in inspection area A3 interior edges Y-direction and Z Direction moves back and forth, and is known as a part for the mechanism of " index arm (index arm) ".Thus, device transfer head 17 can be with IC devices 90 on the device supply unit 14 being sent into from supply area A2 are transmitted, are placed in inspection portion 16.Need what is illustrated It is in fig. 2, to pass through arrow α_17YThe moving back and forth in the Y direction of device transfer head 17 is shown.Although in addition, to allow to along Y The mode that direction and Z-direction move back and forth carries device transfer head 17, but is not limited to this, can also support as can also It is enough to move back and forth in X direction.

In addition, device transfer head 17 with temperature adjustment portion 12 is similarly configured to that the IC devices 90 of holding can be added Heat or cooling.Thus, it is possible to the temperature in IC devices 90 is constantly maintained to adjust state from device supply unit 14 to inspection portion 16.

It should be noted that device transfer head 17 is divided for device transfer head 17A and device transfer head 17B, they also may be used To independently move.

Inspection portion 16 is configured to mounting as the IC devices 90 of electronic component and checks the electrical characteristic of the IC devices 90 Mounting portion.Be provided with the inspection portion 16 electrically connected with the terminal of IC devices 90 901 multiple probes 163 (reference picture 4 with And Fig. 5).Then, electrically connected by the terminal 901 and probe 163 of IC devices 90, contacted, the inspection of IC devices 90 can be carried out Look into.The inspection of IC devices 90 be checked based on the tester possessed that is connected with inspection portion 16 program that is stored in control unit come Carry out.In addition, also similarly IC devices 90 are heated or cooled with temperature adjustment portion 12 in inspection portion 16, can incite somebody to action The IC devices 90 are adjusted to the temperature suitable for checking.

Device recoverer 18 is configured to load finishes the IC devices 90 that check and by the IC devices by inspection portion 16 Part 90 is sent to recovery zone A4 mounting portion, and it is referred to as " recovery shuttle plate " or is referred to as " recovery shuttle " merely.

In addition, device recoverer 18 be supported to can between inspection area A3 and recovery zone A4 in X direction, i.e. arrow Head α₁₈Direction moves back and forth.In addition, in the composition shown in Fig. 2, device recoverer 18 is in the same manner as device supply unit 14 in Y side It is configured with two upwards, the IC devices 90 in inspection portion 16 are transmitted, are placed in any one device recoverer 18.Passed by device First 17 are sent to carry out the transmission.

Recovery zone A4 is that recovery is examined in the A3 of inspection area and finishes the area of multiple IC devices 90 of its inspection Domain.Recovery pallet 19, device transfer head 20 and tray delivery mechanism 21 are provided with the A4 of the recovery zone.In addition, Free pallet 200 is ready in the A4 of recovery zone.

Recovery is the mounting portion that loads the IC devices 90 that inspection portion 16 is checked with pallet 19, and it is with recovery zone The mode that will not be moved in A4 and fix.Thus, even being configured with the various movable parts such as device transfer head 20 more Recovery zone A4, can also be in the IC devices 90 that recovery has been checked with stably being loaded on pallet 19.It should be noted that In composition shown in Fig. 2, recovery is configured with three in X direction with pallet 19.

In addition, empty pallet 200 is also to be configured with three in X direction.The empty pallet 200 and mounting inspection portion 16 are entered Gone check IC devices 90 mounting portion.Then, the mobile IC devices 90 come on recovery zone A4 device recoverer 18 Transmitted, be placed in recovery pallet 19 and sky pallet 200 in it is any on.Thus, by each inspection result to IC devices 90 are classified, are reclaimed.

Device transfer head 20 is supported in the A4 of recovery zone in X direction and Y-direction movement and can also have The part that can also be moved along Z-direction.Thus, IC devices 90 can be sent to back by device transfer head 20 from device recoverer 18 Receive with pallet 19, empty pallet 200.It should be noted that in fig. 2, pass through arrow α_20XShow device transfer head 20 in X side To movement, pass through arrow α_20YThe movement of device transfer head 20 in the Y direction is shown.

Tray delivery mechanism 21 be by from pallet remove region A5 feeding empty pallet 200 in the A4 of recovery zone to X Direction, i.e. arrow α₂₁The mechanism of direction transmission.Then, after the transmission, empty pallet 200 is configured at recovery IC devices 90 Position, can turn into three foregoing empty pallets 200 in any one.

Pallet, which removes region A5, to be recovery, removes the pallet 200 for being arranged with the multiple IC devices 90 for checking the state that finishes Removal portion.Multiple pallets 200 can be stacked in pallet removes region A5.

Pallet 200 is passed along Y-direction one by one in addition, being provided with a manner of across recovery zone A4 and pallet remove region A5 Tray delivery mechanism 22A, the 22B sent.Tray delivery mechanism 22A is can to make pallet 200 along Y-direction, i.e. arrow α_22ADirection is past The move portion moved again.Thus, it is possible to it will check that the IC devices 90 finished are sent to pallet from recovery zone A4 and remove region A5. In addition, tray delivery mechanism 22B can be used in the empty pallets 200 of recovery IC devices 90 to the positive side of Y-direction, i.e. arrow α_22BMove in direction.Thus, it is possible to the pallet 200 of sky is removed region A5 from pallet is moved to recovery zone A4.

Control unit 800 can for example control tray delivery mechanism 11A, tray delivery mechanism 11B, temperature adjustment portion 12, device Part transfer head 13, device supply unit 14, tray delivery mechanism 15, inspection portion 16, device transfer head 17, device recoverer 18, device Part transfer head 20, tray delivery mechanism 21, tray delivery mechanism 22A and the action in each portions of tray delivery mechanism 22B.

Operator can set or confirm operation condition of electronic component check device 1 etc. by monitor 300.The prison Control device 300 has the display screen 301 being for example made up of liquid crystal display, and it is configured in the face side of electronic component check device 1 Portion.As shown in figure 1, right side is provided with the Mouse table 600 of mounting mouse in the figure that pallet removes region A5.The mouse is to aobvious It is shown in when the picture of monitor 300 is operated and uses.

In addition, for monitor 300, guidance panel 700 is configured with Fig. 1 lower right.Guidance panel 700 with Order electronic component check device 1 carries out desired action to monitor 300 respectively.

In addition, signal lamp 400 can notify the action of electronic component check device 1 by the combination of luminous color State etc..Signal lamp 400 is configured at the top of electronic component check device 1.It should be noted that loudspeaker 500 is built in In electronic component check device 1, the action shape of electronic component check device 1 can also be notified by the loudspeaker 500 State etc..

In electronic component check device 1, pallet supply area A1 and supply area are separated by the first spaced walls 231 Between A2, separated between supply area A2 and inspection area A3 by the second spaced walls 232, separated by the 3rd spaced walls 233 Between inspection area A3 and recovery zone A4, by the 4th spaced walls 234 separate recovery zone A4 and pallet remove region A5 it Between.In addition, separated between supply area A2 and recovery zone A4 also by the 5th spaced walls 235.

Most external (most exterior) partes tegmentalis of electronic component check device 1 is covered, the cap for example have protecgulum 241, Side cover 242, side cover 243, bonnet 244 and top cover 245.

As it was previously stated, device transfer head 17 is supported to move along Y-direction and Z-direction.Device transfer head 17 exists Transmission IC devices 90 in the A3 of inspection area.As shown in Fig. 3~Fig. 5, device transfer head 17 possess suction unit 3, stance adjustment portion 5 with And insulation 6.

Suction unit 3 is to be configured to that the attraction for the IC devices 90 for being used as electronic component can be held by attraction (absorption) Unit.The suction unit 3 has 32, second piece 33 and the 3rd piece 34 of adsorption nozzle 31, first piece.It should be noted that on The setting quantity of suction unit 3, in the composition shown in Fig. 3~Fig. 5 be one, but be not limited to this or it is multiple.

72 pairs of suction units 3 of injector (エジェクター) as vacuum generating source assign attraction F₃.Pass through injection The action of device 72 produces negative pressure, suitably adjusts pressure by the adjuster 73 for being used as pressure regulating device, passes through pipe arrangement 71, joint 36, inner cavity 324 and inner cavity 333 turn into negative pressure.

Adsorption nozzle 31 can adsorb IC devices 90, by with the inner cavity being open in upper surface 311 and lower surface 312 313 cylinder-like part and form.Inner cavity 313 plays function as the stream that air passes through.Then, inner cavity 324 is passed through And inner cavity 333 turns into negative pressure and the inner cavity 313 that communicates therewith turns into negative pressure, i.e. air in inner cavity 313 upward Flowing, so as to produce attraction F in the opening portion of lower surface 312 (suction port) 314₃.Thus, it is possible to using lower surface 312 as Adsorption plane adsorbs IC devices 90.In addition, inner cavity 313 is flowed into and pressure rises, i.e. air is in inner cavity 313 by air The flowing of flowing or air upward downwards stops, so as to attraction F₃Reduce, and disappear soon, can be under IC devices 90 are discharged and (disengaged it from) by surface 312.It should be noted that in explanation below, IC devices 90 will be attracted by having Direction, i.e. attraction F₃The direction of effect is referred to as " attracting direction α₃" situation.In addition, attract direction α₃Towards Z-direction just Side (reference picture 4).

In addition, attraction F₃Maximum (greatest attraction forces of suction unit 3) be not particularly limited, such as preferably- Below more than 95kPa -30kPa, more preferably more than -90kPa below -50kPa.And then be configured to can be by adjuster 73 Pressure is set to change the attraction F of suction unit 3₃.In addition, as adjuster 73, such as preferably use electropneumatic regulator.By This, can change (adjustment) attraction F without rank (stepless)₃.Pass through such attraction F₃, can adjust and be inhaled by being installed on The vacuum in the region of filler (packing) 35 (such as being o-ring in the present embodiment) sealing of attached nozzle 31.Need to note Meaning, in the present embodiment, the vacuum of adsorption nozzle 31 is set to certain.

In the peripheral part of adsorption nozzle 31, its long side direction midway protrusion formed with the expanding flange part formed of external diameter 315.Flange part 315 abuts with the 3rd piece 34, can prevent adsorption nozzle 31 from being come off (reference picture 3) from suction unit 3.It should be noted , filler 43 is provided between the peripheral part of flange part 315 and the inner peripheral portion of recess 343.Thus, it is possible to keep the second sky Between S2 pressure.

In addition, in the peripheral part of adsorption nozzle 31, than 315 place closer to the top of flange part formed with groove 316.The edge of groove 316 The circumference of adsorption nozzle 31 is formed as ring-type.In addition, the filler 35 of ring-type is configured with the groove 316.Thus, filler 35 is being inhaled Compressed between attached nozzle 31 and second piece 33.

First piece 32 is configured with the top of adsorption nozzle 31.This first piece 32 by with flat upper surface 321 and under The part of the bulk (or tabular) on surface 322 is formed.In addition, have for first piece 32 in lower surface 322 and the opening of side 323 Chamber portion 324.The inner cavity 324 and the inner cavity 313 of adsorption nozzle 31 play function similarly as the stream that air passes through.

In addition, joint 36 is airtightly connected from the side of side 323 with inner cavity 324.Joint 36 passes through pipe arrangement 71 and injector 72 connections.In addition, it is configured with adjuster 73 between the midway of pipe arrangement 71, i.e. joint 36 and injector 72.

In addition, what the IC devices 90 that built-in for example can also be adsorbed in first piece 32 to adsorption nozzle 31 were heated Heater (not shown).

Second piece 33 is configured with first piece 32 of lower section.This second piece 33 by with flat upper surface 331 and following table The part of the bulk (or tabular) in face 332 is formed, and upper surface 331 connects with first piece 32 of lower surface 322.

There is for second piece 33 the inner cavity 333 being open in upper surface 331 and lower surface 332.In inner cavity 333 inserted with The upper part of the ratio flange part 315 of adsorption nozzle 31.Thus, adsorption nozzle 31 can move along Z-direction.

In addition, inner cavity 333, which also serves as the stream that air passes through, plays function, pass through the inner cavity 333, adsorption nozzle 31 Inner cavity 313 connected with first piece 32 of inner cavity 324.Thus, a series of stream that air passes through is formed.

Second piece 33 of the side of upper surface 331, drive the groove 334 in upper surface 331 and be formed as the ring concentric with inner cavity 333 Shape.The filler 37 of ring-type is configured with the groove 334.Thus, filler 37 is compressed between first piece 32 and second piece 33, can To maintain the air-tightness of foregoing a series of stream together with filler 35.

Second piece 33 of the side of lower surface 332, drive the groove 335 in lower surface 332 and be formed as the ring concentric with inner cavity 333 Shape.In addition, the inner cavity 336 of second piece of 33 inner peripheral surface with connectivity slot 335 and second piece 33 of peripheral part.Joint 41 is from outer Side is airtightly connected with the inner cavity 336.Joint 41 is connected by pipe arrangement 8 (pipe arrangement 81) with working fluid supply unit 85.

It is (such as empty that working fluid supply unit 85 to the first space S 1 described later and second space S2 supplies working fluid R Gas).By the common working fluid supply unit of the first space S 1 of setting and second space S2, it can form device simple.Enter And, it is convenient to omit for the first space S 1 and second space S2, special working fluid supply unit is set respectively.Therefore, dress can be made It is more simple to put composition.The first space S 1 and second space S2 further, since working fluid R can come in and go out, so as to such as rear institute State, piston 512 can slide in cylinder 511, also, adsorption nozzle 31 can slide in through hole 344.

Here, the pressure for supplying the working fluid R to the first space S 1 and second space S2 is phase in the present embodiment With pressure but it is also possible to be different pressures.It should be noted that working fluid supply unit 85 remove be operated fluid supply it Outside, can also be attracted (working fluid R recovery).

The 3rd piece 34 is configured with second piece 33 of lower section.3rd piece 34 by with flat upper surface 341 and lower surface The part of 342 bulk (or tabular) is formed, and upper surface 341 connects with second piece 33 of lower surface 332.

The 3rd piece 34 of the side of upper surface 341, formed with drive in upper surface 341 and in top view than adsorption nozzle 31 The bigger recess 343 of flange part 315.In the recess 343, flange part 315 can move along Z-direction.In addition, such as Fig. 3 institutes Show, in the state of flange part 315 abuts with the bottom of recess 343, limit the mobile boundary of the lower position of adsorption nozzle 31, So as to prevent coming off for adsorption nozzle 31.In contrast, abutted in flange part 315 with second piece 33 of lower surface 332 Under state, the mobile boundary of the upper side position of adsorption nozzle 31 is limited.It should be noted that substantially ensure that adsorption nozzle 31 can be with Mobile movable range so that can be corresponding with the thickness of various IC devices 90.In addition, recess 343 connects with groove 335, it is recessed The space of portion 343 and groove 335 altogether plays function as the second space S2 for being supplied to working fluid R.

In addition, in through hole 344 of the bottom of recess 343 formed with insertion to lower surface 342.More leaned on than flange part 315 The part of downside can independently protrude with the position of adsorption nozzle 31 from through hole 344.

Formed with being penetrated from upper surface 341 to the guide hole 345 of lower surface 342 on the 3rd piece 34.Shown in Fig. 3~Fig. 5 Composition in, formed with two guide holes 345.The pilot pin 164 in inspection portion 16 is inserted in each guide hole 345.Thus, in adsorption nozzle When IC devices 90 are pressed into inspection portion 16 by 31 (suction units 3), the positioning in IC devices 90 and inspection portion 16 is carried out.It is fixed by this Position, each terminal 901 of IC devices 90 can contact with each probe 163 in inspection portion 16.

Stance adjustment portion 5 is being configured with than 3 place closer to the top of suction unit.Stance adjustment portion 5 is under the state shown in fig. 5 Adjust the part for being referred to as " complying with unit (U Application プライア Application スユニット) " of the posture of suction unit 3.Stance adjustment portion 5 With the first adjustment mechanism 51 and the second adjustment mechanism 52.

First adjustment mechanism 51 is responsible for stance adjustment in the stance adjustment of suction unit 3, that suction unit 3 is around X-axis and attraction Stance adjustment of the portion 3 around Y-axis.

First adjustment mechanism 51 has cylinder 511 and the piston 512 that can be slided relative to cylinder 511 along Z-direction.Cylinder 511 There is inner cavity 513 in inner side.In the inner side of the inner cavity 513 inserted with piston 512.Piston 512 have flange part 514, with And link the piston rod 515 of the adjustment mechanism 52 of flange part 514 and second.In addition, the peripheral part of flange part 514 carries circularity.By This, its peripheral part with circularity of piston 512 can change posture so that the inclined of piston 512.Therefore, piston 512 Posture can be changed, to imitate the direction in the face of the abutting part 162 in inspection portion 16.It should be noted that piston can also be omitted 512 circularity and the filler with the split of piston 512 is set.In this case, if filler is made up of elastomer, then As described above, piston 512 can change posture so that central shaft tilts.

In addition, as shown in figure 3, the through hole 516 of insertion inner peripheral portion and peripheral part is provided with cylinder 511.Joint 42 from Outside is airtightly connected with the through hole 516.Joint 42 is connected by pipe arrangement 8 (pipe arrangement 82) with working fluid supply unit 85.

It should be noted that pipe arrangement 8 is from the composition for branching into pipe arrangement 81 and pipe arrangement 82 halfway.In addition, pipe arrangement 8, Case 83 and adjuster 84 are provided between branch point 86 and working fluid supply unit 85.Adjuster 84 is configured at the workflow of case 83 The side of body supply unit 85.In addition, adjuster 84 can be the composition same with adjuster 73.

Case 83 can store the working fluid R supplied from working fluid supply unit 85, the storage as working fluid R in inner side Case or baffle-box are deposited to play function.In addition, its inner space of case 83 is connected by pipe arrangement 81 with second space S2.I.e., case 83 Function is played as the 3rd space connected with second space S2.Thus, even making second because of the movement of adsorption nozzle 31 The pressure of space S 2 generates variation, due to being connected with case 83, so as to which working fluid R flows to case 83 or working fluid R from the 3rd Space flows into.Therefore, the variation of second space S2 internal pressure can be relaxed.As a result, adsorption nozzle 31 can be pressed stably IC devices 90.So, case 83 plays function as the easing portion of the variation for the pressure for relaxing second space S2.

The second adjustment mechanism 52 is configured with the lower section of the first adjustment mechanism 51.Second adjustment mechanism 52 has in Z-direction Upper overlapping two panels board member 521.This two panels board member 521 can be moved relatively along X/Y plane direction.Thus, the second adjustment Mechanism 52 can be responsible in the stance adjustment of suction unit 3, suction unit 3 in the stance adjustment of X-direction, suction unit 3 in the Y direction The stance adjustment of stance adjustment and suction unit 3 about the z axis.

In addition, stance adjustment portion 5 by linking part 171 with by whole device transfer head 17 support for can in the Y direction with And the mechanism link (not shown) moved back and forth in Z-direction.

Insulation 6 is configured between suction unit 3 and stance adjustment portion 5.Insulation 6 can be prevented or suppressed from built-in In first piece 32 of foregoing heater heat transfer to stance adjustment portion 5.Thus, it is therefore prevented that stance adjustment portion 5 is because of foregoing heat And trigger malfunction, therefore, stance adjustment portion 5 can normally act, can adjust the posture of suction unit 3 exactly.

In the present embodiment, insulation 6 is made up of the multiple heat insulating members 61 being in the form of a column.The heat of each heat insulating member 61 Conductivity is smaller and multiple heat insulating members configure apart from each other.It should be noted that the composition material as heat insulating member 61 Material, is not particularly limited, such as can use various heat-insulating materials as glass epoxy resin etc..First piece 32 and plate Part 521 is connected by the heat insulating member 61 being separated from each other, also, is space, therefore, first piece between each heat insulating member 61 32 and the heat transfer of board member 521 suppressed.

As it was previously stated, inspection portion 16 is configured with the A3 of inspection area.Inspection portion 16 is that mounting is used as electronic component The mounting portion of IC devices 90, it is the socket that the inspection to IC devices 90 is carried out under its carrying state.As shown in FIG. 4 and 5, Inspection portion 16 has inspection portion main body 161, abutting part 162, probe 163 and pilot pin 164.

The recessed recess (pouch-shaped construction) 165 formed with mounting, collecting IC devices 90 in inspection portion main body 161.Need Illustrate, the quantity of formation of recess 165 is one in the composition shown in Fig. 4 and Fig. 5, but is not limited to this, also may be used To be multiple.

The probe 163 being configured with 901 identical quantity of the terminal of IC devices 90 is protruded in the bottom of recess 165.

In addition, inspection portion (mounting portion) 16 has to attraction direction α₃Conduct electricity to being placed in inspection portion (mounting portion) 16 The electronic component force section 166 that the IC devices 90 of sub- component exert a force.The electronic component force section 166 is by being built in each spy The helical spring of pin 163 is formed.Thus, interact, can make with the pressing for coming from the side of suction unit 3 for IC devices 90 Each terminal 901 and each probe 163 of IC devices 90 fully contact.Therefore, the inspection to IC devices 90 can be carried out exactly.

As it was previously stated, conduct mounting of the mounting as the IC devices 90 of electronic component can be configured in the A3 of inspection area The inspection portion 16 in portion.In addition, this has abutting part 162 as the inspection portion 16 of mounting portion.Abutting part 162 is by plate-shaped member structure Into overlapping in inspection portion main body 161.Thus, the suction unit 3 that abutting part 162 can possess with device transfer head 17 3rd piece 34 of lower surface 342 abuts.In addition, device transfer head 17 has the stance adjustment for the posture that can adjust suction unit 3 Portion 5.Here, such as the entirety of inspection portion 16 of justing think has tilted 1 degree of situation relative to X/Y plane (horizontal plane).Even in such In the case of, as shown in figure 5, in the state of being abutted in suction unit 3 and abutting part 162, suction unit can be made by stance adjustment portion 5 The posture that 3 imitations and the identical of inspection portion 16 have tilted.The stance adjustment of such suction unit 3 contributes to each end of IC devices 90 Sub 901 contacts with each probe 163.

Pilot pin 164 and each guide hole 345 of suction unit 3 are accordingly configured at inspection portion main body 161.Each pilot pin 164 is fixed on Inspection portion main body 161, and protrude upward.In addition, as it was previously stated, entered by the guide hole 345 of the insertion of pilot pin 164 suction unit 3 Row IC devices 90 and the positioning in inspection portion 16.Thus, each terminal 901 of IC devices 90 can be with each probe 163 in inspection portion 16 Contact.

However, in the IC devices 90 that adsorption nozzle 31 is adsorbed, the lower surface (adsorption plane) 312 of adsorption nozzle 31 is made On the basis of when, from lower surface 312 to the distance H of each terminal 901₉₀Irregular differ is produced sometimes.As its reason, can include Following individual differences：Even for example, the IC devices 90 of identical type, the difference in thickness of IC devices 90 is also had (irregular not One), i.e. the error of thickness varies (reference picture 6 and Fig. 7), in addition, IC devices 90 can produce warpage (reference picture 8), etc. Deng.It should be noted that Fig. 6 shows that IC devices 90 itself have the state to vary of thickness, even Fig. 7 show it is identical Also there are thin IC devices 90, the state of thick IC devices 90 between the IC devices 90 of species, Fig. 8 shows itself warpage of IC devices State.

For example, in distance H₉₀In the case of smaller, in each terminal 901 presence can not reach the probe in inspection portion 16 163 terminal 901.In this case, loose contact can be caused, it is difficult to accurately checked.

In addition, in distance H₉₀In the case of bigger, the probe 163 that each terminal 901 can reach inspection portion 16 is connect Touch, but the excessive terminal 901 of its contact be present.In this case, it is also difficult to accurately checked.

Then, in the electronic component check device 1 (electronic component conveyer 10) of present embodiment, using can With the composition of phenomenon as elimination.Below, 3~Fig. 5 of reference picture illustrates to this composition and effect.

[1] as shown in figure 3, device transfer head 17 is the state that IC devices 90 are not attracted to suction unit 3 also.It should be noted , now, injector 72 is being attracted.In addition, positive first space S 1 and second space S2 supply workflows Body R, the first space S 1 and second space S2 have been malleation.Because second space S2 turns into malleation, the flange of adsorption nozzle 31 Portion 315 turns into and the 3rd piece of 34 state abutted.

[2] then, the device transfer head 17 can be drawn into the device supply unit to inspection area A3 by suction unit 3 IC devices 90 on 14.Thus, device transfer head 17 turns into the state shown in Fig. 4.In the state of shown in the Fig. 4, IC devices 90 are attracted power F₃It is adsorbed in adsorption nozzle 31.In addition, as it was previously stated, when adsorbing IC devices 90, adsorption nozzle 31 and Fig. 3 institutes The state shown, which is compared to the positive side of Z-direction, (attracts direction α₃) mobile.I.e., the flange part 315 of adsorption nozzle 31 turns into from the 3rd The state that block 34 leaves.

Also, in the state of IC devices 90 are adsorbed, move device transfer head 17, so as to adsorbed this IC devices 90 are configured at the surface of the recess 165 in inspection portion 16.

[3] after, abutted as shown in figure 5, device transfer head 17 can drop to suction unit 3 with inspection portion 16.Thus, inhale Draw the posture that portion 3 can imitate inspection portion 16 with side, housed while IC devices 90 are pressed into the recess 165 in inspection portion 16 (state below, is referred to as " pressing housed state ").Now, adsorption nozzle 31 is come from inspection portion via IC devices 90 16 reaction force, compared with the state shown in Fig. 4, further moved to the positive side of Z-direction.I.e., in the case where pressing housed state, Compared with the state shown in Fig. 4, the flange part 315 of adsorption nozzle 31 further expands with the 3rd piece 34 of separating distance.

So, under the pressing housed state shown in Fig. 5, adsorption nozzle 31 and the 3rd piece of 34 separation, therefore, by entering one Walk to second space S2 and supply working fluid R, adsorption nozzle 31 can move to -Z direction.Therefore, can be via adsorption nozzle 31 power for being suitable for checking moderately exert a force to inspection portion 16 to IC devices 90.Thus, such as shown in Fig. 6~Fig. 8, can with away from From H₉₀Make the appropriateness of each terminal 901 of IC devices 90 independently from the size and equably contacted with the probe 163 in inspection portion 16 (support Connect), therefore, the inspection to IC devices 90 can be carried out exactly.

Particularly, depending on IC devices 90 individual difference (concaveconvex shape of upper surface etc.) degree, attraction F3's ' Size is different and different with IC devices 90, in the case where pressing housed state, it is possible to as adsorption nozzle 31 and the 3rd piece 34 The state contacted.In which case it is difficult to IC devices 90 are pressed further onto by the recessed of inspection portion 16 by adsorption nozzle 31 Portion 165.This is directed to, in electronic component conveyer 10, the supply of from the working fluid R to second space S2 can be adjusted Amount.Thus, can be with adjustment work fluid R quantity delivered, so that adsorption nozzle 31 and the 3rd piece 34 points in the case where pressing housed state From.Therefore, in the case where pressing housed state, IC devices 90 can be pressed further onto to the recess in inspection portion 16 by adsorption nozzle 31 165。

In addition, the 3rd piece 34 as the second base portion can be with being used as electronics for the mounting of IC devices (electronic component) 90 The inspection portion 16 of component mounting portion abuts.Thus, the 3rd piece of 34 pressing inspection portion 16, can make the 3rd piece 34 of posture turn into Imitate the state of the shape of the abutting part 162 in inspection portion 16.Therefore, it can abut in the state of the imitation adsorption nozzle 31 In IC devices 90.As a result, further can reliably make the appropriateness of each terminal 901 of IC devices 90 and equably with inspection portion 16 Probe 163 contact (abutting), therefore, the inspection to IC devices 90 can be carried out exactly.

In addition, as shown in figure 3, the flange part 514 as the piston 512 of the first sliding part bears the work in the first space S 1 The area for making fluid R the first compression face M1 is more than the work born as the adsorption nozzle 31 of the second sliding part in second space S2 Make fluid R the second compression face M2 area.Thus, as shown in the embodiment, to the first space S 1 and second space S2 In the composition for supplying same amount of working fluid R, power that the second compression face M2 can be made to be subject to from working fluid R be less than first by The power that pressure surface M1 is subject to from working fluid R.As a result, the power of the pressing IC of adsorption nozzle 31 devices 90 can be made (second abuts power) The power (first abuts power) in less than the 3rd piece 34 pressing inspection portion 16.Accordingly it is possible to prevent adsorption nozzle 31 exceedingly presses IC Device 90.

So, in electronic component conveyer 10, the adsorption nozzle 31 as the second sliding part is connected to IC devices The abutting power (the second abutting power) of (electronic component) 90 is connected to conduct with the 3rd piece 34 of the part as the second base portion The abutting power (first abuts power) in the inspection portion 16 of electronic component mounting portion is different.In the present embodiment, as it was previously stated, Two, which abut power, is less than the first abutting power, accordingly it is possible to prevent adsorption nozzle 31 exceedingly presses IC devices 90.

In addition, the first compression face M1 pressings is part, i.e. whole suction unit 3 than the first compression face M1 more on the lower. This is directed to, the second compression face M2 pressings are than a part for the second compression face M2 parts more on the lower, i.e. adsorption nozzle 31. Therefore, it is preferred that the first compression face M1 pressing force is more than the second compression face M2 pressing force.Therefore, the first compression face M1 area More than the second compression face M2 area.

It should be noted that it is preferred that the first compression face M1 area is more than 2 times 20 times of the second compression face M2 area Hereinafter, more preferably less than more than 3 times 15 times.Thus, it is possible to more reliably play the effect above.

In addition, in the present embodiment, the piston 512 as the first sliding part and the 3rd piece 34 points as the second base portion Body is formed, but they can also be integrally formed.

(second embodiment)

Below, reference picture 9 is to the electronic component conveyer of the present invention and this reality of electronic component check device The mode of applying illustrates, but is illustrated around the difference with above-mentioned embodiment, and then the description thereof will be omitted for identical item.

Present embodiment is in addition to the composition difference of electronic component, the second base portion and inspection portion, and remaining is with One embodiment is identical.

In the present embodiment, IC devices 90 have substrate 902 and are provided projectingly on the face of+Z sides of substrate 902 Protuberance 903.In addition, the face of-Z sides of substrate 902 is provided with multiple terminals 901.In addition, protuberance 903 is in top view When size be the size roughly the same with the lower surface of adsorption nozzle 31.

In addition, in electronic component conveyer 10, it is big that the recess 165 in inspection portion 16 is that substrate 902 can enter It is small.

In addition, in the present embodiment, pipe arrangement 81 and pipe arrangement 82 are made up of stream independent of each other, in pipe arrangement 81 and match somebody with somebody Case 83, adjuster 84 and working fluid supply unit 85 are connected on pipe 82.Thus, it is possible to it is independently adjustable the first space S1 and second space S2 pressure.I.e., it can respectively change, can individually set the working fluid for flowing to the first space S 1 R pressure and flow to second space S2 working fluid R pressure.Therefore, adsorption nozzle 31 can be independently adjustable to press The power of IC devices 90 and the power in the 3rd piece of 34 pressing IC device 90 and inspection portion 16.Although not illustrating such composition, It can omit and the ratio between the first compression face M1 and the second compression face M2 are designed as desired numerical value, be favourable.It should be noted It is that the setting that can use the first space S 1 and second space S2 pressure is the structure operated on the monitor 300 shown in Fig. 1 Into.

In addition, by composition as formation, can make to be connected to IC devices as the adsorption nozzle 31 of the second sliding part The abutting power of (electronic component) 90 is connected to IC devices (electronics member device with the 3rd piece 34 of a part as the second base portion Part) 90 abutting power it is different.Thus, such as when wanting to reduce the load for substrate 902, can make for substrate 902 Abutting power is weaker than the abutting power for protuberance 903, when wanting to reduce the load for protuberance 903, can make for prominent The abutting force for spending portion 903 is weaker than abutting power for substrate 902.

In addition, in electronic component conveyer 10, the 3rd piece 34 of suction unit 3 has from lower surface 342 to-Z sides To prominent protuberance 346.The protuberance 346 enters the recess 165 in inspection portion 16 in the case where pressing housed state.It is in addition, prominent Portion 346 abuts in the case where pressing housed state with the substrate 902 of IC devices 90.I.e., as the second base portion a part protuberance 346 can abut with the substrate 902 of the part as IC devices (electronic component) 90.Thus, protuberance 346 can press The substrate 902 of IC devices 90.

In addition, in the case where pressing housed state, the protuberance 903 of IC devices 90 enters the 3rd piece 34 of through hole 344, is inhaled Attached nozzle 31 is pressed.Suction as the 3rd piece 34 of protuberance 346 of a part for the second base portion and as the second sliding part Attached nozzle 31 abuts in different positions with IC devices (electronic component) 90.Thus, protuberance 346 can press IC devices 90 Substrate 902, adsorption nozzle 31 can press the protuberance 903 of IC devices 90.

In addition, in the case where pressing housed state, the 3rd piece 34 of lower surface 342 abuts with the abutting part 162 in inspection portion 16, inspection Portion 16 is looked into by the 3rd piece of 34 pressing.

So, in the present embodiment, adsorption nozzle 31 presses the protuberance 903 of IC devices 90, the 3rd piece 34 of protrusion Portion 346 presses the substrate 902 of IC devices 90, and the 3rd piece 34 of lower surface 342 presses inspection portion 16.Thus, even this implementation The such IC devices 90 with difference of height of mode, can also make IC devices 90 the appropriateness of each terminal 901 and equably with inspection The probe 163 in portion 16 contacts (abutting), therefore, can carry out the inspection to IC devices 90 exactly.

(the 3rd embodiment)

Below, reference picture 10 is to the electronic component conveyer of the present invention and this reality of electronic component check device The mode of applying illustrates, but is illustrated around the difference with above-mentioned embodiment, and then the description thereof will be omitted for identical item.

Present embodiment in addition to the composition difference of electronic component and the second base portion, remaining with the second embodiment party Formula is identical.

In the present embodiment, IC devices 90 are the center S of protuberance 903₉₀₃With the center S of substrate 902₉₀₂In X-direction And the device to stagger in Y-direction.I.e., protuberance 903 configures relative to substrate 902 is eccentric.It should be noted that " " center " is When finger top view is shaped as quadrangle, the intersecting point of two diagonal.

In addition, in the present embodiment, with center S₉₀₂With center S₉₀₃Stagger matchingly, through hole 344 is relative to The center of three piece 34 of protuberance 346 is in staggered configuration in X-direction and Y-direction.I.e., through hole 344 is relative to protuberance 346 Bias configuration.Thus, the adsorption nozzle 31 slided in through hole 344 can press the protuberance 903 of IC devices 90.

So, in the present embodiment, even if the center S of protuberance 903₉₀₃With the center S of substrate 902₉₀₂X-direction with And stagger in Y-direction, the appropriateness of each terminal 901 of IC devices 90 can also be made and equably contacted with the probe 163 in inspection portion 16 (abutting), therefore, the inspection to IC devices 90 can be carried out exactly.

(the 4th embodiment)

Below, reference picture 11 is to the electronic component conveyer of the present invention and this reality of electronic component check device The mode of applying illustrates, but is illustrated around the difference with above-mentioned embodiment, and then the description thereof will be omitted for identical item.

For present embodiment in addition to the composition difference in inspection portion, remaining is identical with second embodiment.

As shown in figure 11, device supply unit 14 be mounting check before IC devices (electronic component) 90 inspection before electronics Component mounting portion, device recoverer 18 be mounting check after IC devices (electronic component) 90 inspection after electronic component Mounting portion.As shown in figure 11, device supply unit 14 and the conduct of device recoverer 18 can load IC devices (electronic component) 90 The movable part 30 that moves and be unitized (ユニットization).The movable part 30 with device supply unit 14 and device except returning Outside receipts portion 18, also with X-direction travel mechanism 7.

Device supply unit 14 is concavely formed mounting, houses the recess (pouch-shaped portion) 141 of IC devices 90.In present embodiment In, the quantity of formation of recess 141 is eight, its configuration preferably with eight on device transfer head 17A, device transfer head 17B The configuration of individual suction unit 3 is identical, becomes and configures four, the shape of each configuration two in the Y direction in the X direction respectively State.

Device recoverer 18 is also concavely formed mounting, houses the recess (pouch-shaped portion) 181 of IC devices 90.In this embodiment party In formula, the quantity of formation of recess 181 is eight, and its configuration is preferably matched somebody with somebody with eight suction units 3 in device transfer head 17 Homomorphosis is put, is become and is configured four in the X direction respectively, configures the state of four in the Y direction.

X-direction travel mechanism 7 has line slideway 71A and in the lump supporting device supply unit 14 and device recoverer 18 Fulcrum bearing 72A.Line slideway 71A has track 711A and two sliding block 712A.Fulcrum bearing 72A is fixed on the two sliding blocks On 712A.

In addition, electronic component conveyer 10 (is device supply in the composition of diagram with movable part 30 is arranged at Portion 14) and can detect the power test section 9 of power.Power test section 9 is configured on the pad on device supply unit 14 (spacer) 73A.

As power test section 9, it is not particularly limited, such as preferably uses force cell (loadcell).Dynamometry Sensor is the converter for being built-in with deformeter and the size of power being converted to electric signal.Thus, it is possible to power F will be abutted₉₀As Measured value rather than design load (calculated value), can be detected as precisely as possible.

In addition, the testing result, the i.e. size of abutting power detected by power test section 9 are stored in the storage of control unit 800 In portion 802 (reference picture 1).

In addition, power test section 9 is configured on the pad 73A on device supply unit 14, can be with abutting (absorption) in work IC devices (electronic component) 90 for the adsorption nozzle 31 of the second sliding part abut.

In such present embodiment, such as shown in figure 11, before IC devices 90 is turned into pressing housed state, Before being checked, IC devices 90 are pressed against power test section 9 to detect it and abut power F₉₀.It is then possible to it is based on detecting Abutting power F₉₀, carry out adjustment of pressing force etc..

In addition, abut power F as detection₉₀Opportunity, such as power test section 9 is preferably being connected to since IC devices 90 Detected the position that position plays after further being declined in more than 0.1mm below 2.0mm scope.

It should be noted that the detection as described above for abutting power can also be without using IC devices 90, but use and IC The size identical power detection part of device 90.

(the 5th embodiment)

Below, reference picture 12 is to the electronic component conveyer of the present invention and this reality of electronic component check device The mode of applying illustrates, but is illustrated around the difference with above-mentioned embodiment, and then the description thereof will be omitted for identical item.

For present embodiment in addition to the composition difference of the first sliding part, remaining is identical with first embodiment.

As shown in figure 12, flexible barrier film 53 is provided with the inner side of cylinder 511.Barrier film 53 is arranged at the Z side of cylinder 511 To midway and be the-Z sides of through hole 516.Its lower surface 531 of the barrier film 53 abuts with the flange part 514 of piston 512.In addition, Though it is not illustrated, barrier film 53 is parallel with X-axis and Y-axis in its natural state.In the present embodiment ,+the Z of the barrier film 53 The space of side is the first space S 1.

As shown in figure 12, piston 512 lift barrier film 53 to+Z sides and make barrier film 53 deform in the state of, piston 512 by The recuperability of return to the nature state is intended to barrier film 53.Thus, it is possible to the depth of parallelism relative to X/Y plane is obtained by barrier film 53.Its As a result, it is possible to by the 3rd piece of 34 pressing inspection portion 16 in the state of the depth of parallelism is obtained.

(the 6th embodiment)

Below, reference picture 1 and Figure 13~Figure 20 are to electronic component conveyer and electronic component of the invention The present embodiment of check device illustrates, but is illustrated around the difference with above-mentioned embodiment, identical item Then the description thereof will be omitted.It should be noted that it is following, for convenience of description, sometimes by (Figure 21 and Figure 22 in Figure 14~Figure 20 And it is same) upside be referred to as " on " or " top ", downside is referred to as " under " or " lower section ".

The electronic component conveyer 10 of present embodiment possesses：Suction unit 3 (adsorption nozzle 31), can pass through attraction To hold electronic component, and can be to the attraction direction α for attracting electronic component₃It is mobile；And the spiral as force section Spring 4, can be to attraction direction α₃Opposite direction to suction unit 3 (adsorption nozzle 31) exert a force, attracting electronic component , can be along attraction direction α under state₃Shrink.

Thus, as described later, can also be by can be even electronic component (IC devices 90) has individual difference The helical spring 4 that has attracted to be shunk in the state of electronic component offsets the difference.Then, such as inspection portion is being passed through 16 when carrying out the electric checking to electronic component, can independently make electronic component with the individual difference of electronic component Each terminal (terminal 901) equably abuts with each terminal (probe 163) in inspection portion 16, therefore, can carry out the inspection exactly Look into.

In addition, the electronic component check device 1 of present embodiment has the electronic component transmission dress of present embodiment 10 are put, is also equipped with checking the inspection portion 16 of electronic component.I.e., the electronic component check device 1 of present embodiment possesses：Inhale Draw portion 3 (adsorption nozzle 31), electronic component can be held by attracting, and can be to the attraction side for attracting electronic component To α₃It is mobile；, can be to attraction direction α as the helical spring 4 of force section₃Opposite direction suction unit 3 (adsorption nozzle 31) is applied Power, can be along attraction direction α in the state of electronic component has been attracted₃Shrink；And inspection portion 16, check electronics member device Part.

Thus, it is possible to obtain electronic component check device the advantages of with foregoing electronic component conveyer 10 1.Furthermore, it is possible to which electronic component is sent into inspection portion 16, therefore, can be carried out by inspection portion 16 to the electronic component Inspection.Furthermore, it is possible to transmit the electronic component after checking from inspection portion 16.

Below, the composition in each portion is illustrated.

As it was previously stated, device transfer head 17 is supported to move along Y-direction and Z-direction.Device transfer head 17 exists Transmission IC devices 90 in the A3 of inspection area.As shown in Figure 14~Figure 16, device transfer head 17 possesses suction unit 3, as force section Helical spring 4, stance adjustment portion 5 and insulation 6.

Injector 72 as vacuum generating source assigns attraction F to suction unit 3₃.Produced by the action of injector 72 Raw negative pressure, suitably adjusts pressure by being used as the adjuster 73 of pressure regulating device, passes through pipe arrangement 71 and joint 36, inner cavity 324 and inner cavity 333 turn into negative pressure.

Attraction F₃Maximum (greatest attraction forces of suction unit 3) be not particularly limited, such as preferably -95kPa Below -30kPa above, more preferably more than -90kPa below -50kPa.And then it is configured to set by the pressure of adjuster 73 It is fixed to change the attraction F of suction unit 3₃.In addition, as adjuster 73, such as preferably use electropneumatic regulator.Thus, may be used To change (adjustment) attraction F without rank (stepless)₃.Pass through such attraction F₃, can adjust to be assemblied in adsorption nozzle 31 The vacuum in region that seals of filler (packing) 35 (such as in the present embodiment by o-ring).Vacuum is to have dragged The power (area × vacuum) of adsorption nozzle 31, but dragged power correspondingly with this, the pressing force of helical spring 4 can be reduced.I.e., By adjusting attraction F₃, the reaction force of helical spring 4 can be adjusted, pressing can be adjusted.Thus it is possible to maintaining its suction In the case of attached state, IC devices 90 are transmitted in the A3 of inspection area.Thus, it is possible to prevent IC devices 90 from falling in transmit process Fall.

In the peripheral part of adsorption nozzle 31, its long side direction midway protrusion formed with the expanding flange part formed of external diameter 315.The flange part 315 plays function as the spring base that the lower end 23 of helical spring 4 abuts.In addition, flange part 315 abuts In the 3rd piece 34, it can prevent adsorption nozzle 31 from being come off (reference picture 14) from suction unit 3.

On second piece 33 of upper surface 331, groove 334 is formed concentrically ring-type with inner cavity 333.In the groove 334 It is configured with the filler 37 of ring-type.Thus, filler 37 is compressed between first piece 32 and second piece 33, can be with filler 35 together Maintain the air-tightness of foregoing a series of stream.

On second piece 33 of lower surface 332, groove 335 is formed concentrically ring-type with inner cavity 333.The bottom of the groove 335 Portion plays function as the spring base that the upper end 24 of helical spring 4 abuts.

On the 3rd piece 34 of upper surface 341, formed with bigger than the flange part 315 of adsorption nozzle 31 in its top view Recess 343.In the recess 343, flange part 315 can move along Z-direction.In addition, as shown in figure 14, in flange part 315 It is connected in the state of the bottom of recess 343, limits the mobile boundary of the lower position of adsorption nozzle 31, accordingly it is possible to prevent Adsorption nozzle 31 comes off.In contrast, in the state of flange part 315 is connected to second piece 33 of lower surface 332, limitation absorption The mobile boundary of the upper side position of nozzle 31.It should be noted that 31 transportable movable range of adsorption nozzle is by fully really Protect, so as to tackle the thickness of various IC devices 90.

Formed with being penetrated from upper surface 341 to the guide hole 345 of lower surface 342 on the 3rd piece 34.In Figure 14~Figure 16 institutes In the composition shown, formed with two guide holes 345.The pilot pin 164 in inspection portion 16 inserts each guide hole 345.Thus, in adsorption nozzle 31 When IC devices 90 are pressed on inspection portion 16 by (suction unit 3), the positioning in IC devices 90 and inspection portion 16 is carried out.By the positioning, Each terminal 901 of IC devices 90 can contact with each probe 163 in inspection portion 16.

As shown in figure 17, suction unit 3 has the guide member 38 of the mobile adsorption nozzle 31 of guiding.Guide member 38 passes through Formed with the bar-shaped part of Z-direction configured in parallel, it is fixed on second piece 33 and the 3rd piece 34.In addition, in adsorption nozzle 31 The notch part 317 that is penetrated formed with guide member 38 of flange part 315.By such guide member 38 and notch part 317 come The anti-rotation mechanism of adsorption nozzle 31 is formed, adsorption nozzle 31 can not rotatably exist relative to second piece 33 and the 3rd piece 34 Stably moved in Z-direction.It should be noted that such anti-rotation mechanism can also be omitted in suction unit 3.

As shown in Figure 14~Figure 16, the helical spring 4 as force section is built in suction unit 3, in the outer of adsorption nozzle 31 The week side of boss configures with one heart with the adsorption nozzle 31.It should be noted that in the state of shown in Figure 14, helical spring 4 is adsorbing Can also be natural length between the flange part 315 of nozzle 31 and second piece 33, but preferably compressive state.

Helical spring 4 is to attraction direction α₃Opposite direction, i.e. the minus side of Z-direction applies to the adsorption nozzle 31 of suction unit 3 The force section of power.So, it is made up of force section helical spring 4, so as to so that the composition of the force section is simple.In addition, , can be using the part for the light weight for being suitable to be built in suction unit 3 as force section.As the constituent material of helical spring 4, not There is special restriction, such as preferably using the metal material that sufficiently elasticity is played as stainless steel etc..

As it was previously stated, adsorption nozzle 31 can move in z-direction along inner cavity 333.In addition, such as Figure 15 and Figure 16 institutes Show, in the state of adsorption nozzle 31 has adsorbed IC devices 90, turn into the state of negative pressure in inner cavity 333, therefore, for absorption Nozzle 31 is generated equivalent to attraction F₃Attraction F₃' (power pulled upward).Attraction F₃' act on absorption spray Mouth 31 itself, to attraction direction α₃(positive side of Z-direction) has dragged adsorption nozzle 31.Now, helical spring 4 shrinks, but not thorough Bottom shrinks, is not reaching to contraction boundary, and being can be further to attraction direction α₃The state of contraction (below, the state is claimed For " contractile state ").

The spring constant of helical spring 4 is preferably more than 1N/mm below 90N/mm, more preferably more than 50N/mm 70N/mm Below.In addition, the external diameter of helical spring 4Preferably more than 7mm below 20mm, more preferably more than 10mm below 15mm. In addition, the internal diameter of helical spring 4Preferably more than 5mm below 10mm, more preferably more than 5mm below 7mm.In addition, spiral shell Revolve the line footpath of spring 4Preferably more than 0.3mm below 2mm, more preferably more than 0.5mm below 1.4mm.Due to spiral Spring 4 meets such condition, so as to which helical spring 4 relatively easily is built in into suction unit 3.Furthermore, it is possible to IC Device 90 assigns the force (pressing force) suitable for checking.In addition, helical spring 4 can maintain contractile state.

First adjustment mechanism 51 is made up of air cylinder, can be responsible in the stance adjustment of suction unit 3, suction unit 3 around X-axis Stance adjustment and suction unit 3 around Y-axis stance adjustment.

In the present embodiment, insulation 6 is made up of the multiple heat insulating members 61 being in the form of a column.Each heat insulating member 61 divides each other Open configuration.In addition, the constituent material as heat insulating member 61, is not particularly limited, such as glass ring oxygen tree can be used Various heat-insulating materials as fat etc..

In addition, inspection portion (mounting portion) 16 has to attraction direction α₃Conduct electricity to being placed in inspection portion (mounting portion) 16 The electronic component force section 166 that the IC devices 90 of sub- component exert a force.The electronic component force section 166 is by being built in each spy The helical spring of pin 163 is formed.Thus, interact, can make with the pressing for coming from the side of suction unit 3 for IC devices 90 Each terminal 901 and each probe 163 of IC devices 90 fully contact.Therefore, the inspection for IC devices 90 can be carried out exactly.

However, in the IC devices 90 that adsorption nozzle 31 is adsorbed, the lower surface (adsorption plane) 312 of adsorption nozzle 31 is made On the basis of when, from lower surface 312 to the distance H of each terminal 901₉₀Irregular differ is produced sometimes.As its reason, can include Following individual differences：Even for example, the IC devices 90 of identical type, the difference in thickness of IC devices 90 is also had (irregular not One), i.e. the error of thickness varies (reference picture 18 and Figure 19), in addition, IC devices 90 can produce warpage (reference picture 20), Etc..It should be noted that Figure 18 shows that IC devices 90 itself have the state to vary of thickness, even Figure 19 is shown Also there are thin IC devices 90, the state of thick IC devices 90 between the IC devices 90 of identical type, Figure 20 shows IC devices itself The state of warpage.

Then, in the electronic component check device 1 (electronic component conveyer 10) of present embodiment, using can With the composition of phenomenon as elimination.Below, 14~Figure 16 of reference picture illustrates to this composition and effect.

[1] as shown in figure 14, device transfer head 17 is the state that IC devices 90 are not attracted to suction unit 3 also.Also, spiral shell Rotation spring 4 is the state extended to greatest extent, and the flange part 315 of adsorption nozzle 31 abuts with the 3rd piece 34.

[2] then, the device transfer head 17 can be drawn into the device supply unit to inspection area A3 by suction unit 3 IC devices 90 on 14.Thus, device transfer head 17 turns into the state shown in Figure 15.In the state of shown in the Figure 15, IC devices Part 90 is attracted power F₃It is adsorbed in adsorption nozzle 31.In addition, as it was previously stated, when adsorbing IC devices 90, adsorption nozzle 31 is with scheming State shown in 14, which is compared to the positive side of Z-direction, (attracts direction α₃) mobile.

[3] after, as shown in figure 16, device transfer head 17 can drop to suction unit 3 and be abutted with inspection portion 16.Thus, Suction unit 3 can imitate the posture in inspection portion 16 with side, be received while IC devices 90 are pressed into the recess 165 in inspection portion 16 Hold.Now, adsorption nozzle 31 via IC devices 90 by the reaction force for coming from inspection portion 16, with the state phase shown in Figure 15 Than further being moved to the positive side of Z-direction.By the movement, helical spring 4 shrinks, but and not up to shrink boundary, to be foregoing Contractile state.In addition, helical spring 4 now also turns into the extending state that can also be extended.

So, helical spring 4 is both contractile state, and extending state, so as to which helical spring 4 can be via absorption The power that nozzle 31 is suitable for checking towards inspection portion 16 moderately exerts a force to IC devices 90.Thus, such as such as Figure 18~Figure 20 institutes Show, can be with distance H₉₀The appropriateness of each terminal 901 and the equably probe with inspection portion 16 that make IC devices 90 independently from the size 163 contacts (abutting), therefore, can carry out the inspection to IC devices 90 exactly.Therefore, helical spring 4 can be used as and offset Distance H₉₀Irregular " buffer part " that differs play function.

(the 7th embodiment)

Below, reference picture 21 and Figure 22 fill to the electronic component conveyer of the present invention and electronic component inspection The present embodiment put is illustrated, but is illustrated around the difference with above-mentioned embodiment, and identical item is then omitted Its explanation.

For present embodiment in addition to the composition difference in inspection portion, remaining is identical with the 6th embodiment.

As shown in Figure 21 and Figure 22, in the present embodiment, abutting part 162 (is served as a contrast by the plate-shaped member for changing thickness Pad) form.The abutting part 162 is the layered product with least one layer of layer being made up of piezoelectric element 167.Thus, it is possible to pass through The size of the voltage of piezoelectric element 167 is put on easily and rapidly to change the thickness of abutting part 162.Thus, such as scheming After having used inspection portion 16 in the state of shown in 21, the IC devices 90 as check object are being changed to thicker device When, inspection portion 16 can be made to turn into the state shown in Figure 22 to be checked.So, in the present embodiment, can correspond to The thickness of IC devices 90, inspection portion 16 is set to be adapted for the inspection of the IC devices 90.

It should be noted that as the scope that thickness can be changed by piezoelectric element 167, it is not particularly limited, example Preferably such as more than 0.1mm below 0.5mm, more preferably more than 0.1mm below 0.3mm.

In addition, the force section to be exerted a force as the minus side to Z-direction to the adsorption nozzle of suction unit, in the respective embodiments described above In be made up of helical spring, but be not limited to this, such as can also be made up of air spring.

In addition, the thickness on changing abutting part, in the 7th embodiment is entered by the action of piezoelectric element It is capable, but be not limited to this, for example, can also overlapping multi-disc 0.1mm shim liner (shim), pass through the increasing of the superimposed sheets number Subtract to carry out.

(the 8th embodiment)

Below, reference picture 1 and Figure 23~Figure 42 are to electronic component conveyer and electronic component of the invention The present embodiment of check device illustrates, but is illustrated around the difference with above-mentioned embodiment, identical item Then the description thereof will be omitted.In addition, below, for convenience of description, sometimes by the upside in Figure 25 and Figure 26 be referred to as " on " or " on Side ", downside is referred to as " under " or " lower section ".In addition, the left side in Figure 23 is referred to as " left side " sometimes, is referred to as on right side " right side ".

The electronic component conveyer 10 of present embodiment possesses：Part (power detection part 90 ') can be held Handle part 44；The movable part 30 that electronic component moves can be loaded；And it is arranged at movable part 30 and detects the power of power Test section 9, the part (power is detected with part 90 ') that handle part 44 is held can be made to be connected to power test section 9.

In addition, the electronic component conveyer 10 of present embodiment possesses：Part (power detection part can be held 90 ') handle part 44；The movable part 30 that electronic component moves can be loaded；It is arranged at movable part 30 and detects power Power test section 9；And the storage part 802 for the testing result that power test section 9 detects can be stored.

As described later, by such electronic component conveyer 10, carried out by inspection portion (socket) 16 to electricity During the inspection of sub- component, the actual when electronic component that handle part 44 is held can will be made to be connected to inspection portion 16 is supported Relay F₉₀Replace with the abutting power F detected in power test section 9₉₀’.Thus it is possible to according to abutting power F₉₀' size judge Abutting power F during inspection₉₀Whether it is appropriate size for electronic component.

In addition, as power test section 9, such as force cell (load cell) can be used, force cell is arranged at Being relatively easy ensures the movable part 30 of its installation space.Thus, it is possible to carry out the detection of power by simply forming.

The electronic component check device 1 of present embodiment possesses：The handle of part (power detection part 90 ') can be held Hold portion 44；The movable part 30 that electronic component moves can be loaded；It is arranged at movable part 30 and detects the power test section of power 9；And the inspection portion 16 of electronic component is checked, wherein it is possible to part (the power detection part for being held handle part 44 90 ') it is connected to power test section 9.

Thus, it is possible to obtain electronic component check device the advantages of with foregoing electronic component conveyer 10 1.Furthermore, it is possible to which electronic component is sent into inspection portion 16, therefore, can be carried out by inspection portion 16 for the electronics member device The inspection of part.Furthermore, it is possible to transmit the electronic component after checking from inspection portion 16.

Below, the composition in each portion is illustrated.

Inspection area A3 is the region for checking IC devices 90.It is provided with the A3 of the inspection area and IC devices 90 is examined The inspection portion 16 looked into and the device transfer head 17 with handle part 44.In addition, it is additionally provided with across supply area A2 and inspection Device supply unit 14 that region A3 mode moves and the device moved in a manner of across inspection area A3 and recovery zone A4 Recoverer 18.

Below, the device supply unit 14 of face side in two device supply units 14 is referred to as " device supply unit (the first device Supply unit) 14A), by the device supply unit 14 of rear side be referred to as " device supply unit (the second device supply unit) 14B).

In the composition shown in Figure 23, link be configured with two device transfer heads 17 in the Y direction.Below, sometimes will In two device transfer heads 17 the device transfer head 17 of face side be referred to as " device transfer head (the first device transfer head) 17A), will The device transfer head 17 of rear side be referred to as " device transfer head (the second device transfer head) 17B).Also, device transfer head 17A can So that the IC devices 90 on device supply unit 14A are sent into inspection portion 16.On the other hand, device transfer head 17B can be by device IC devices 90 on supply unit 14B are sent in inspection portion 16.

In addition, device recoverer 18 be supported to can in X direction, i.e. arrow α₁₈Direction is in inspection area A3 and recovery area Moved back and forth between the A4 of domain.Thus, device recoverer 18 can stably pass the IC devices 90 after inspection from inspection area A3 Recovery zone A4 is delivered to, in addition, in recovery zone A4, after IC devices 90 are taken away by device transfer head 20, can be turned again to Inspection area A3.

In the composition shown in Figure 23, device recoverer 18 is configured with two in the Y direction in the same manner as device supply unit 14 It is individual.Below, the device recoverer 18 of face side in two device recoverers 18 is referred to as " device recoverer (the first device sometimes Part recoverer) 18A), by the device recoverer 18 of rear side be referred to as " device recoverer (the second device recoverer) 18B).Also, IC devices 90 are transmitted from inspection portion 16 to device recoverer 18A by device transfer head 17A.On the other hand, transmitted by device Head 17B transmits IC devices 90 from inspection portion 16 to device recoverer 18B.

As shown in figure 24, control unit 800 has CPU (Central Processing Unit：Central processing unit) 801, with And store the storage that (receiving) is used to make the various programs of the action executing in each portion such as tray delivery mechanism 11A, various data etc. Portion 802.

As it was previously stated, device transfer head 17 is supported by a manner of it can be moved along Y-direction and Z-direction.Device transmits First 17 be the component that IC devices 90 are transmitted in the A3 of inspection area.As shown in figure 25, device transfer head 17 has handle part 44 And stance adjustment portion 5.

Handle part 44 be configured to hold IC devices 90 or in addition substitute IC devices 90 and as aftermentioned handle Hold the holding unit of the power detection part 90 ' used when power detects.The handle part 44 has suction unit 45 and is connected to The joint 36 of suction unit 45.

Suction unit 45 has the stream 318 being open in lower surface 319 and side 320.Stream 318 can pass through air.This Outside, airtightly it is connected with joint 36 from the side of side 320 on stream 318.

The attraction that joint 36 is attracted via pipe arrangement 71 and such as vavuum pump, injector in flow path 318 Source (vacuum generating source) 26 connects.In addition, acted by the attraction source 26, suction unit 45 can using lower surface 319 as Adsorption plane, IC devices 90 or power detection part 90 ' are held by attracting.

It should be noted that in Figure 25 and Figure 26, a handle part 44 is typically depicted, but handle part 44 Quantity is set to be not limited to one or multiple.In the present embodiment, as an example, it is located at device transmission Eight handle parts 44 are respectively arranged with head 17A and device transfer head 17B.This eight handle parts 44 are to distinguish in the X direction Configuration four and the in the Y direction state of each configuration two.

Link in the top of handle part 44 and be configured with stance adjustment portion 5.Stance adjustment portion 5 adjusts in the state of shown in Figure 25 The posture of whole handle part 44, is referred to as " complying with unit ".Stance adjustment portion 5 has the first adjustment mechanism 51 and the second adjustment machine Structure 52.

First adjustment mechanism 51 is made up of air cylinder, can be responsible in the stance adjustment of handle part 44, handle part 44 around X The stance adjustment of the stance adjustment of axle and handle part 44 around Y-axis.

The second adjustment mechanism 52 is configured with the lower section of the first adjustment mechanism 51.Second adjustment mechanism 52 has in Z-direction Upper overlapping two panels board member 421.This two panels board member 421 can be moved relatively along X/Y plane direction.Thus, the second adjustment Mechanism 52 can be responsible in the stance adjustment of handle part 44, handle part 44 in the stance adjustment of X-direction, handle part 44 in Y side To stance adjustment and handle part 44 stance adjustment about the z axis.

As it was previously stated, conduct mounting of the mounting as the IC devices 90 of electronic component can be configured in the A3 of inspection area The inspection portion 16 in portion.In addition, device transfer head 17 has in the IC devices (electricity for being held the handle part 44 of device transfer head 17 Sub- component) 90 can adjust when being placed in inspection portion (mounting portion) 16 handle part 44 posture stance adjustment portion 5.Then, As shown in figure 25, when the IC devices 90 for being held the handle part 44 of device transfer head 17 are placed in inspection portion 16, handle part 44 can be connected to inspection portion 16.Here, such as the entirety of inspection portion 16 of justing think has tilted 1 degree relative to X/Y plane (horizontal plane) Situation.Even if in this case, as shown in figure 25, in the state of handle part 44 and inspection portion 16 have abutted, Ke Yitong Crossing stance adjustment portion 5 makes handle part 44 imitate the posture tilted with the identical of inspection portion 16.The posture of such handle part 44 Adjustment contributes to the terminal of IC devices 90 and the probe contact in inspection portion 16.Thus, it is possible to IC devices 90 are accurately examined Look into.

It should be noted that as shown in figure 25, inspection portion 16 is concavely formed mounting, houses the recess (bag of IC devices 90 Shape portion) 168.In the present embodiment, the quantity of formation of recess 168 is eight, preferably its configuration and device transfer head 17A, the configuration of eight handle parts 44 on device transfer head 17B are identical, become configure in the X direction respectively four with And the state of two is respectively configured in the Y direction.In addition, the terminal being configured with IC devices 90 is protruded in the bottom of each recess 168 The probe of identical quantity.

As shown in figure 25, stance adjustment portion 5 links with Z-direction travel mechanism 25.Z-direction travel mechanism 25 leads with straight line Rail 27, ball-screw 28 and motor 40.

Line slideway 27 has track 517 and the sliding block 518 slided on track 517.Track 517 is via connecting member 54 link with first adjustment mechanism 51 in stance adjustment portion 5, are configured to parallel with Z-direction.Sliding block 518 is fixed on such as test zone Domain A3 wall portion etc..

Ball-screw 28 has thread spindle 523 and the nut 522 slided on thread spindle 523.Thread spindle 523 is via frame Body 55 and be fixed on such as inspection area A3 wall portion.In addition, thread spindle 523 be configured to it is parallel with Z-direction, in its upper end Pulley 56 is installed.Nut 522 links via connecting member 57 and connecting member 54.

Motor 40 is fixed on such as inspection area A3 wall portion.Pulley 58 is installed on the axle 532 of motor 40.The cunning Wheel 58 links via timing belt 59 with being installed on the pulley 56 of ball-screw 28.

In the Z-direction travel mechanism 25 so formed, by the action of motor 40, its power is passed to stance adjustment portion 5.Thus, handle part 44 can be with stance adjustment portion 5 together in Z-direction (the other directions intersected with a direction (X-direction)) Move back and forth.In addition, though it is not illustrated, it is also equipped with making device transfer head 17 (handle part 44 and stance adjustment portion 5) The Y-direction travel mechanism moved in the lump along Y-direction with Z-direction travel mechanism 25.Thus, handle part 44 can also in the Y direction (with One direction (X-direction) intersect other directions) on move back and forth.Then, Z-direction travel mechanism 25 and Y-direction moving machine are passed through Structure, device transfer head 17 can move freely in inspection area A3 interior edges Y-direction and Z-direction.Thus, handle part 44 can be with side Hold IC devices 90 or part 90 ' is used in power detection, while being sent to its transfer destination.

In addition, in electronic component check device 1, the voltage applied to motor 40 can be adjusted.Thus, holding is made The IC devices 90 that portion 44 is held abut (pressing) when inspection portion 16 is checked, can adjust it and abut power F₉₀.IC devices 90 need to correspond to its various species to carry out abutting power F₉₀Adjustment.Therefore, abut power F due to that can adjust₉₀, so as to Enough abutting power F assigned suitable for various IC devices 90₉₀To be checked.Thus, it is possible to accurately checked.

As it was previously stated, device supply unit 14 be mounting check before IC devices (electronic component) 90 inspection before electronics member Device mounting portion, device recoverer 18 be mounting check after IC devices (electronic component) 90 inspection after electronic component carry Put portion.As shown in figure 26, device supply unit 14 and the conduct of device recoverer 18 can load IC devices (electronic component) 90 and enter The mobile movable part 30 of row and be unitized (ユニットization).The movable part 30 is except with device supply unit 14 and device recovery Outside portion 18, also with X-direction travel mechanism 7.

Device supply unit 14 is concavely formed mounting, houses the recess (pouch-shaped portion) 141 of IC devices 90.In present embodiment In, the quantity of formation of recess 141 is eight, its configuration preferably with eight on device transfer head 17A, device transfer head 17B The configuration of individual handle part 44 is identical, becomes and respectively configures four and in the Y direction each configuration two in the X direction State.

Device recoverer 18 is also concavely formed mounting and houses the recess (pouch-shaped portion) 181 of IC devices 90.In this implementation In mode, the quantity of formation of recess 181 is eight, its configuration preferably with device transfer head 17A, device transfer head 17B Eight handle parts 44 configuration it is identical, become and configure four and in the Y direction each configuration two in the X direction respectively Individual state.

X-direction travel mechanism 7 has line slideway 29 and in the lump supporting device supply unit 14 and device recoverer 18 Fulcrum bearing 47.

Line slideway 29 has track 711 and two sliding blocks 712.Fulcrum bearing 47 is fixed on the two sliding blocks 712.

Fulcrum bearing 47 separately carries device supply unit 14 and device recoverer 18 in the X direction.In addition, the energy of fulcrum bearing 47 It is enough to support device supply unit 14 and device recoverer 18 freely to load and unload independently of one another.Fulcrum bearing 47 is via ball-screw (not shown) and motor link (not shown).Then, fulcrum bearing 47 is passed to by the action of the motor, its power.Thus, device Part supply unit (electronic component mounting portion before inspection) 14 and device recoverer (electronic component mounting portion after inspection) 18 can be with Moved back and forth in X-direction (direction).Due to that can move back and forth in this wise, so as to be examined by device supply unit 14 IC devices 90 before looking into are stablized from supply area A2, are promptly sent to inspection area A3.Furthermore, it is possible to pass through device recoverer IC devices 90 after inspection are stablized, are promptly sent to recovery zone A4 by 18 from inspection area A3.

However, being judged as in the inspection through electronic component check device 1 in the IC devices 90 of non-defective unit, have by each batch The secondary device for collecting, for example being dispatched from the factory as the component being installed on automobile.Then, IC devices 90 after mounting, which generate, asks In the case of topic, it is determined that include the batch of the IC devices 90, the problem of taking in the market countermeasure.Even go out as non-defective unit Factory, the reason for also having various generation problems, as one of them, following reason can be enumerated.Its reason is to make holding The IC devices 90 that portion 44 is held abut (pressing) when inspection portion 16, and it abuts power F₉₀It is not to fit for IC devices 90 The size of degree, it is excessive or insufficient.Therefore, accurate inspection result is not obtained.

Then, as long as can ensure to abut power F₉₀It is appropriate size for the IC devices 90, then considering can be from asking At least excluded in the reason for topic " because abutting power F₉₀Immoderation the reason for causing ".(the electronics member device of electronic component check device 1 Part conveyer 10) it is configured to ensure for the IC devices 90 of check object, to the abutting power F in inspection portion 16₉₀It is The size of appropriateness.Below, this composition and effect are illustrated.

As shown in figure 23, electronic component check device 1 (electronic component conveyer 10) possesses the power inspection of detection power Survey portion 9.In the composition shown in the Figure 23, two power test sections 9 are configured with.Below, as shown in figure 23, sometimes by two power The power test section 9 being adjacent in test section 9 on the right side of device supply unit 14A is referred to as " power test section (the first power test section) 9A ", the power test section 9 being adjacent on the right side of device supply unit 14B is referred to as " power test section (the second power test section) 9B ". In addition, the positive side that power test section 9A is inclined to Y-direction relative to device supply unit 14A configures, power test section 9B supplies relative to device Minus side configuration to portion 14B deviation Y-directions.

As shown in figure 26, in the A3 of inspection area, the power detection that handle part 44 is held can be made to be connected to part 90 ' Power test section 9.In addition, abutting power F now is detected by power test section 9₉₀', as with " the inspection for IC devices 90 Look into the abutting power F in portion 16₉₀" equal power treats.In addition, testing result, the i.e. abutting power F that power test section 9 detects₉₀' it is big In the small storage part 802 for being stored in control unit 800.

It should be noted that as power test section 9, it is not particularly limited, it is preferred to use such as force cell (load cell).Force cell is the converter for being built-in with deformeter and the size of power being converted to electric signal.Thus, may be used So that power F will be abutted₉₀' measured value rather than design load (calculated value) are used as, it can be detected as precisely as possible.In addition, conduct Detection abuts power F₉₀' opportunity, such as preferably enter since being connected to the position of power test section 9 power detection part 90 ' Detected position after one step is declined in more than 0.1mm below 2.0mm scope.

In addition, as power detection part 90 ', be not particularly limited, for example, can use with whether be non-defective unit not Virtual device being made up of sheet metal of the independently useless IC devices 90 of non-defective unit and imitation IC devices 90 etc., but they It is central, preferably due to be defective products and useless IC devices 90.

As shown in figure 26, power test section 9 is arranged at movable part 30 together with device supply unit 14, device recoverer 18.By This, can be such that power test section 9 moves back and forth in the X direction, therefore, can abut power F according to whetheing there is₉₀' detection, power is detected Portion 9 is configured at inspection area A3 or supply area A2.

As it was previously stated, electronic component check device 1 (electronic component conveyer 10) is used for IC devices (electronics member device Part) 90 inspection.In addition, movable part 30 has the device supply unit (inspection of the IC devices 90 (electronic component) before mounting inspection Electronic component mounting portion before looking into) 14 and mounting check after the device recoverers of IC devices (electronic component) 90 (check Electronic component mounting portion afterwards) 18.Also, power test section 9 is arranged at device supply unit (electronic component mounting portion before inspection) Between 14 and device recoverer (electronic component mounting portion after inspection) 18.Between device supply unit 14 and device recoverer 18 really Possess the sufficient space that a power test section 9 is set.Thus, both can be from the design of electronic component check device 1 Power test section 9 is just set, can also be after completing to eliminate the electronic component check device 1 of power test section 9 further Power test section 9 is set, you can sets and (set up) power test section 9 later.So, power test section 9 can be relatively easily set.

In addition, power test section 9 is arranged at fulcrum bearing across the pad 39 thicker than device supply unit 14, device recoverer 18 On 47.Thus, power test section 9, which turns into, is configured at than device supply unit (electronic component mounting portion before inspection) 14 and device recovery The state of 18 high position of portion's (electronic component mounting portion after inspection).Thus, handle part 44 is for example holding device supply unit During IC devices 90 on 14, drop to the position (hereinafter, referred to as " position can be held ") that can carry out its holding and stop, but When the power detection is connected to power test section 9 with part 90 ' to detect power, stop at higher than the position that can hold position.Therefore, prevent Stop the handle part 44 when power detects and be present in the interference less than other circumferential components of position of the handle part 44 etc..

In the A3 of inspection area, moved by handle part 44 from inspection portion 16 along Y-direction, so as to which power test section 9 can match somebody with somebody (when from the positive side of Z-direction) and position that handle part 44 is overlapping when being placed at top view.Thus, with IC devices 90 IC devices 90 are abutted and (are compressed against) in inspection portion 16 similarly from top during inspection, and when power detects, part 90 ' is used in power detection It can abut and (be compressed against) from top in power test section 9.So, it is identical due to abutting direction when being detected when checking with power, from And it can will abut power F₉₀' it is used as and abuts power F₉₀Equal power is treated.

In addition, handle part when making the power detection that handle part 44 is held be connected to power test section 9 with part (part) 90 ' 44 translational speed is preferably below the 10mm/ seconds, more preferably below the 3mm/ second above 7mm/ seconds.Thus, even being examined in power Impact is generated when surveying with part 90 ' and the abutting of power test section 9, power detection part 90 ' caused by being also possible to prevent the impact, Deformation of power test section 9 etc..

As it was previously stated, the IC devices 90 that handle part 44 is held are made to abut (pressing) in inspection portion 16 to be checked When, it can be adjusted and abut power F₉₀.Thus, it is possible to carried out corresponding to the various species of IC devices 90 suitable for the IC devices 90 Abut power F₉₀Adjustment.Furthermore, it is possible to realize the adjustment by adjusting the voltage applied to motor 40.

Also, identical with this, the power detection that can adjust is held handle part 44 is connected to power with part (part) 90 ' Abutting power F during test section 9₉₀’.Abut power F₉₀' adjusting range be preferably more than 0.3N below 600N, more preferably 1N with Upper below 300N.Such number range and when checking IC devices 90 and inspection portion 16 abutting power can value number range phase Together.Thus, it is possible to power F will be abutted₉₀' it is used as and abuts power F₉₀Equal power is treated.

It should be noted that power test section 9 testing result not in number range in the case of, preferably for example pass through Monitor 300, loudspeaker 500 notify the situation.Furthermore it is preferred that notify a genuine stopping electronic component inspection with carrying out this The action of device 1.

As described above, electronic component check device 1 (electronic component conveyer 10) is configured to that IC devices can will be made Part 90 is connected to abutting power F during inspection portion 16₉₀Replace with the abutting power F detected by power test section 9₉₀' located Reason.And it is possible to according to abutting power F₉₀' size come judge check when actual abutting power F₉₀For IC devices 90 Whether it is appropriate size.

If for example, will be appropriate abutting power F for IC devices 90₉₀Be sized to " a reference value (threshold value) TH ", then abutting power F₉₀' on the basis of in the case of more than value TH, it can be determined that be " abutting power F during inspection₉₀For IC devices It is appropriate size for part 90 ".In this case, can also even the problem of generating foregoing in the market Excluded the reason for problem " because abutting power F₉₀Immoderation the reason for causing ".

On the other hand, power F is being abutted₉₀' less than in the case of a reference value TH, it can be determined that it is " abutting power F during inspection₉₀ It is not appropriate size for IC devices 90 ".In this case, carry out abutting power F₉₀' adjustment.

In addition, the abutting power F detected in power test section 9₉₀' size (testing result) be stored in storage part 802.By This, can be used using testing result as historical record, when generating foregoing in the market the problem of.

As it was previously stated, on device transfer head 17A and device transfer head 17B, as an example, respectively in X-direction On be provided with four, each in the Y direction two totally eight handle parts 44 be set.In addition, in the state of shown in Figure 27~Figure 34, Turned right successively since the part of the lower-left in figure in eight power detection parts 90 ' that device transfer head 17A is held Referred to as " part 90A is used in power detection₁' ", " power detection use part 90A₂' ", " power detection use part 90A₃' ", " power detection part 90A₄' ", " power detection use part 90A₅' ", " power detection use part 90A₆' ", " power detection use part 90A₇' " and " power detects With part 90A₈’”.In addition, in the state of shown in Figure 35~Figure 42, eight power that device transfer head 17B is held detect It is referred to as " power detection part 90B successively with being turned right in part 90 ' since the part of the lower-left in figure₁' ", " power detection use Part 90B₂' ", " power detection use part 90B₃' ", " power detection use part 90B₄' ", " power detection use part 90B₅' ", " power detect With part 90B₆' ", " power detection use part 90B₇' " and " part 90B is used in power detection₈’”。

Below, 27~Figure 34 of reference picture is to the abutting power F on device transfer head 17A each handle part 44₉₀' detection carry out Illustrate, 35~Figure 42 of reference picture is to the abutting power F on device transfer head 17B each handle part 44₉₀' detection illustrate.

[A1] as shown in figure 27, in device transfer head 17A, in holding strong detection part 90A respectively₁'~ 90A₈' state.The state is maintained to all abutting power F on device transfer head 17A₉₀' detection complete untill.In addition, Device supply unit 14A is moved to inspection area A3, and thus, power test section 9A is located at inspection area A3.Then, first, device is made Transfer head 17A is to arrow α_17Y(-)Direction is moved to the position of its front end, as it was previously stated, making power detection part 90A₁' be connected to Power test section 9A.Thus, detection holds strong detection and uses part 90A₁' handle part 44 abutting power F₉₀’。

[A2] then, makes device transfer head 17A temporarily avoid, and as shown in figure 28, power test section 9A is configured at and is allowed to move Power detection part 90A is moved₁' detected with power and use part 90A₂' distance between centers position.Then, as shown in figure 28, make Device transfer head 17A is to arrow α_17Y(-)Direction is moved to the position of its front end, in the same manner as foregoing, makes power detection part 90A₂' it is connected to power test section 9A.Thus, detection holds strong detection and uses part 90A₂' handle part 44 abutting power F₉₀’。

[A3] then, makes device transfer head 17A avoid again, as shown in figure 29, power test section 9A is configured at and is allowed to move Power detection part 90A is moved₂' detected with power and use part 90A₃' distance between centers position.Then, as shown in figure 29, make Device transfer head 17A is to arrow α_17Y(-)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90A₃' it is connected to power test section 9A.Thus, detection holds strong detection and uses part 90A₃' handle part 44 abutting power F₉₀’。

[A4] then, makes device transfer head 17A avoid again, as shown in figure 30, power test section 9A is configured at and is allowed to move Power detection part 90A is moved₃' detected with power and use part 90A₄' distance between centers position.Then, as shown in figure 30, make Device transfer head 17A is to arrow α_17Y(-)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90A₄' it is connected to power test section 9A.Thus, detection holds strong detection and uses part 90A₄' handle part 44 abutting power F₉₀’。

[A5] then, makes device transfer head 17A avoid again, as shown in figure 31, by power test section 9A be configured at it is foregoing Action [A1] when identical position.Then, as shown in figure 31, device transfer head 17A is made to arrow α_17Y(-)Direction is moved to it The position of front end, and it is foregoing similarly, make power detection part 90A₅' it is connected to power test section 9A.Thus, detection holds strong Part 90A is used in detection₅' handle part 44 abutting power F₉₀’。

[A6] then, makes device transfer head 17A avoid again, as shown in figure 32, power test section 9A is configured at and is allowed to move Power detection part 90A is moved₅' detected with power and use part 90A₆' distance between centers position.Then, as shown in figure 32, make Device transfer head 17A is to arrow α_17Y(-)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90A₆' it is connected to power test section 9A.Thus, detection holds strong detection and uses part 90A₆' handle part 44 abutting power F₉₀’。

[A7] then, makes device transfer head 17A avoid again, and as shown in figure 33, power test section 9A, which is configured at, makes its shifting Power detection part 90A is moved₆' detected with power and use part 90A₇' distance between centers position.Then, as shown in figure 33, make Device transfer head 17A is to arrow α_17Y(-)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90A₇' it is connected to power test section 9A.Thus, detection holds strong detection and uses part 90A₇' handle part 44 abutting power F₉₀’。

[A8] then, makes device transfer head 17A avoid again, and as shown in figure 34, power test section 9A, which is configured at, makes its shifting Power detection part 90A is moved₇' detected with power and use part 90A₈' distance between centers position.Then, as shown in figure 34, make Device transfer head 17A is to arrow α_17Y(-)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90A₈' it is connected to power test section 9A.Thus, detection holds strong detection and uses part 90A₈' handle part 44 abutting power F₉₀’。

Via such action [A1]~[A8], supporting on device transfer head 17A each handle part 44 can be detected successively Relay F₉₀’。

Then, the abutting power F on device transfer head 17B is carried out₉₀' detection.

[B1] as shown in figure 35, in device transfer head 17B, in holding strong detection part 90B respectively₁'~ 90B₈' state.The state is maintained to all abutting power F on device transfer head 17B₉₀' detection complete untill.In addition, Device supply unit 14B is moved to inspection area A3, and thus, power test section 9B is located at inspection area A3.Then, first, device is made Transfer head 17B is to arrow α_17Y(+)Direction is moved to the position of its front end, as it was previously stated, making power detection part 90B₁' be connected to Power test section 9B.Thus, detection holds strong detection and uses part 90B₁' handle part 44 abutting power F₉₀’。

[B2] then, makes device transfer head 17B temporarily avoid, and as shown in figure 36, power test section 9B, which is configured at, makes its shifting Power detection part 90B is moved₁' detected with power and use part 90B₂' distance between centers position.Then, as shown in figure 36, make Device transfer head 17B is to arrow α_17Y(+)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90B₂' it is connected to power test section 9B.Thus, detection holds strong detection and uses part 90B₂' handle part 44 abutting power F₉₀’。

[B3] then, makes device transfer head 17B avoid again, and as shown in figure 37, power test section 9B, which is configured at, makes its shifting Power detection part 90B is moved₂' detected with power and use part 90B₃' distance between centers position.Then, as shown in figure 37, make Device transfer head 17B is to arrow α_17Y(+)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90B₃' it is connected to power test section 9B.Thus, detection holds strong detection and uses part 90B₃' handle part 44 abutting power F₉₀’。

[B4] then, makes device transfer head 17B avoid again, and as shown in figure 38, power test section 9B, which is configured at, makes its shifting Power detection part 90B is moved₃' detected with power and use part 90B₄' distance between centers position.Then, as shown in figure 38, make Device transfer head 17B is to arrow α_17Y(+)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90B₄' it is connected to power test section 9B.Thus, detection holds strong detection and uses part 90B₄' handle part 44 abutting power F₉₀’。

[B5] then, makes device transfer head 17B avoid again, as shown in figure 39, by power test section 9B be configured at it is foregoing Action [B1] when identical position.Then, as shown in figure 39, device transfer head 17B is made to arrow α_17Y(+)Direction is moved to it The position of front end, and it is foregoing similarly, make power detection part 90B₅' it is connected to power test section 9B.Thus, detection holds strong Part 90B is used in detection₅' handle part 44 abutting power F₉₀’。

[B6] then, makes device transfer head 17B avoid again, and as shown in figure 40, power test section 9B, which is configured at, makes its shifting Power detection part 90B is moved₅' detected with power and use part 90B₆' distance between centers position.Then, as shown in figure 40, make Device transfer head 17B is to arrow α_17Y(+)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90B₆' it is connected to power test section 9B.Thus, detection holds strong detection and uses part 90B₆' handle part 44 abutting power F₉₀’。

[B7] then, makes device transfer head 17B avoid again, and as shown in figure 41, power test section 9B, which is configured at, makes its shifting Power detection part 90B is moved₆' detected with power and use part 90B₇' distance between centers position.Then, as shown in figure 41, make Device transfer head 17B is to arrow α_17Y(+)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90B₇' it is connected to power test section 9B.Thus, detection holds strong detection and uses part 90B₇' handle part 44 abutting power F₉₀’。

[B8] then, makes device transfer head 17B avoid again, and as shown in figure 42, power test section 9B, which is configured at, makes its shifting Power detection part 90B is moved₇' detected with power and use part 90B₈' distance between centers position.Then, as shown in figure 42, make Device transfer head 17B is to arrow α_17Y(+)Direction is moved to the position of its front end, and it is foregoing similarly, make power detection part 90B₈' it is connected to power test section 9B.Thus, detection holds strong detection and uses part 90B₈' handle part 44 abutting power F₉₀’。

Via such action [B1]~[B8], supporting on device transfer head 17B each handle part 44 can be detected successively Relay F₉₀’。

As it was previously stated, eight (multiple) handle parts are respectively arranged with device transfer head 17A and device transfer head 17B 44.Also, as act [A1]~[A8], act [B1]~[B8] explanation, can be independently by each handle part 44 The power detection held is connected to power test section 9 with part 90 ' (part).Passed accordingly, for device transfer head 17A and device A 17B is sent, the abutting power F at eight can be detected by a power test section 9 respectively₉₀', it is thereby achieved that the letter formed Change.

In addition, power detection part (part) 90 ' and the abutting of power test section 9 that handle part 44 is held are preferably in IC devices The inspection of part 90 start before, when checking that terminating rear or handle part 44 often holds the IC devices (electronic component) 90 of stipulated number Carry out.In electronic component check device 1, it can suitably be selected, be set from these three opportunitys.Thus, it is possible to Comply with the requirement of the user using electronic component check device 1.

(the 9th embodiment)

Below, reference picture 43 and Figure 44, electronic component conveyer and electronic component inspection to the present invention The present embodiment of device illustrates, but is illustrated around the difference with above-mentioned embodiment, and identical item then saves Slightly its explanation.

For present embodiment mainly in addition to the allocation position difference of device supply unit and device recoverer, remaining is equal It is identical with the 8th embodiment.

As shown in figure 43, in the present embodiment, device supply unit 14 and device recoverer 18 are respectively relative to inspection portion 16 are configured at the minus side of Y-direction.In addition, device supply unit 14 is configured at the positive side of Z-direction relative to device recoverer 18.

It should be noted that device transfer head 17 is configured with one, it is supported to only move back and forth in z-direction.

Device supply unit 14 is supported to can be along Y-direction, i.e. arrow α_14YDirection moves back and forth.Thus, device supply unit 14 can be moved to the IC devices 90 before inspection the upside in the position that device transfer head 17 can be held, i.e. inspection portion 16. In addition, after IC devices 90 are taken away by device transfer head 17, device supply unit 14 can avoid from inspection portion 16.

In addition, as shown in figure 44, on device supply unit 14, power test section 9 be supported to can in X direction, i.e. arrow α_9XDirection moves back and forth.Thus, power test section 9 can be in the abutting power F on each handle part 44 of detection device transfer head 17₉₀’ When, it is moved to the underface of the handle part 44 as detection object.

Device recoverer 18 is supported to can be along Y-direction, i.e. arrow α_18YDirection moves back and forth.Thus, device recoverer 18 can be moved to the IC devices 90 after inspection the position that device transfer head 17 can be loaded, i.e. inspection portion 16 is upper Side.Then, after the IC devices 90 after checking have been loaded, device recoverer 18 can avoid from inspection portion 16.

In addition, in the present embodiment, a device transfer head 46 is used for, is responsible for IC devices 90 being sent to device Supply unit 14 and transmit IC devices 90 from device recoverer 18.

In addition, the upper and lower relation of device supply unit 14 and device recoverer 18 is device supply unit 14 in the present embodiment In upside and device recoverer 18 is in downside, but is not limited to this, for example, it is also possible to be device recoverer 18 in upside and Device supply unit 14 is in downside.

(the tenth embodiment)

Below, reference picture 45 and Figure 46, electronic component conveyer and electronic component inspection to the present invention The present embodiment of device illustrates, but is illustrated around the difference with above-mentioned embodiment, and identical item then saves Slightly its explanation.

For present embodiment mainly in addition to the allocation position difference of device supply unit and device recoverer, remaining is equal It is identical with the 9th embodiment.

As shown in figure 45, in the present embodiment, device supply unit 14 and device recoverer 18 are matched somebody with somebody across inspection portion 16 It is placed in its both sides.Device supply unit 14 is supported in the same manner as the 8th embodiment can be along arrow α₁₄Direction moves back and forth. In addition, be also similarly supported to the 8th embodiment can be along arrow α for device recoverer 18₁₈Direction moves back and forth.

In addition, as shown in figure 46, on device supply unit 14, power test section 9 is supported to can be along Y-direction, i.e. arrow α_9YDirection moves back and forth.Thus, power test section 9 can be in the abutting power F on each handle part 44 of detection device transfer head 17₉₀’ When, it is moved to the underface of the handle part 44 as detection object.

More than, on embodiment illustrated, electronic component conveyer and electronics member device to present embodiment Part check device is illustrated, but the present invention is not limited to this, forms electronic component conveyer and electronics member device Each portion of part check device could be replaced by playing the arbitrary composition of identical function.It is in addition it is also possible to additional arbitrary Construct.

In addition, the electronic component conveyer and electronic component check device of the present invention can also be combined with State the device of composition (feature) more than any two in each embodiment.

In addition, the formation number of the recess of the setting quantity of handle part, the quantity of formation of recess in inspection portion, device supply unit Amount, the quantity of formation of recess of device recoverer are in the respective embodiments described above respectively eight, but are not limited to this, also may be used To be one to seven or more than nine.

In addition, when power detects, its inspection is carried out with part by the detection of handle part hold in the respective embodiments described above Survey, but be not limited to this, power detection part can also be omitted.In such a situation it is preferred to when power detects, make to pass through suction Attract hold detection and be connected to power test section with the edge part of the suction port of the handle part of part etc..

In addition, in the respective embodiments described above, power test section is directly connected to power detection part when power detects, but simultaneously It is not limited to this.For example, it is also possible to be by imitate inspection portion (socket) structure be fixed on power test section, power test section every The structure and be connected to power detection part.

In addition, power test section is provided with one relative to a device transfer head in inspection area, but it is not limited to This, can also be provided with device transfer head possessed by the identical quantity (multiple) of handle part power test section.In such case Under, preferably by multiple power test section blocking (ユニットization), support as that can be moved by each unit.

Claims

1. a kind of electronic component conveyer, it is characterised in that possess：

First base portion；

First sliding part, it can be slided relative to first base portion；

Second base portion, it is configured at first sliding part；And

It second sliding part, can slide, and can be abutted with electronic component relative to second base portion,

The first space that can be changed formed with volume between first base portion and first sliding part,

The second space that can be changed formed with volume between second base portion and second sliding part.

2. electronic component conveyer according to claim 1, it is characterised in that

Working fluid can come in and go out first space and the second space.

3. electronic component conveyer according to claim 1, it is characterised in that

Second base portion can abut with for the electronic component mounting portion of electronic component mounting.

4. electronic component conveyer according to claim 3, it is characterised in that

Second sliding part is connected to the abutting power of the electronic component and second base portion is connected to the electronics member The abutting power of device mounting portion is different.

5. electronic component conveyer according to claim 1, it is characterised in that

The electronic component conveyer has the work that working fluid is supplied to first space and the second space Fluid supply unit.

6. electronic component conveyer according to claim 1, it is characterised in that

The electronic component conveyer has the 3rd space connected with the second space.

7. electronic component conveyer according to claim 2, it is characterised in that

The area that first sliding part bears the first compression face of the working fluid bears institute more than second sliding part State the area of the second compression face of working fluid.

8. electronic component conveyer according to claim 1, it is characterised in that

Second base portion can abut with the part of the electronic component.

9. electronic component conveyer according to claim 8, it is characterised in that

Second sliding part is connected to the abutting power of the electronic component and second base portion is connected to the electronics member The abutting power of device is different.

10. electronic component conveyer according to claim 8 or claim 9, it is characterised in that

Second base portion and second sliding part abut in different positions with the electronic component.

11. electronic component conveyer according to claim 2, it is characterised in that

The pressure of the pressure for flowing to the working fluid in first space and the working fluid for flowing to the second space Power can be changed respectively.

12. electronic component conveyer according to claim 1, it is characterised in that the electronic component transmission dress Putting has：

Movable part, the electronic component can be loaded and moved；And

Power test section, the movable part is arranged at, and power can be detected,

The power test section can abut with being connected to the electronic component of second sliding part.

13. a kind of electronic component check device, it is characterised in that possess：

First base portion；

First sliding part, it can be slided relative to first base portion；

Second base portion, it is configured at first sliding part；

It second sliding part, can slide, and can be abutted with electronic component relative to second base portion；And

Inspection portion, the electronic component is checked,