JP2010101834A - Semiconductor tester - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a semiconductor tester that can improve a dew condensation prevention function and a temperature variation reducing function, and reliable connection in the supply of dry air during a low-temperature prober test. <P>SOLUTION: The semiconductor tester includes a prober having contact rings in contact with a probe card and a tester head having a DUT board in contact with the contact rings. The semiconductor tester has internal diameter holes that pass through the contact rings and are provided in the perpendicular direction, sealing plates that are provided in the internal diameter holes to divide the internal diameter holes into two chambers, an air nozzle provided on the DUT board, and a retractable piping with one end connected to the sealing plate and the other end in contact with the air nozzle. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a semiconductor test apparatus.
More specifically, the present invention relates to an air supply path connection system for supplying dry air into a contact ring and measuring the inside of the contact ring as a simple chamber structure at the time of low temperature measurement in a prober.

  Prior art documents related to semiconductor test equipment include the following.

JP 2000-137058 A

FIG. 3 is an explanatory view showing the structure of a main part of a conventional example that is generally used.
In the figure, the prober 1 has a contact ring 3 in contact with the probe card 2.
The prober top plate 4 supports the contact ring 3.
The tester head 5 has a DUT board 6 in contact with the contact ring 3.
The air nozzle 7 is provided on the DUT board 6.

  In the above configuration, in the state where the DUT board 6 is in pressure contact with the contact ring 3, the air nozzle 7 installed in the tester head 5 passes through the A hole provided in the DUT board 6, and the contact ring 3. Dry air C is sprayed onto the probe card 2 through the B hole provided in the hole 3, preventing condensation of the probe card 2 and reducing temperature change.

As shown in FIG. 4, the connection between the contact ring 3 and the DUT board 6 and the connection between the contact ring 3 and the probe card 2 are performed by the prober 1. While dry air C wants to flow between the two, the flow of dry air C between the contact ring 3 and the DUT board 6 and the inflow of external air, etc. occur, and the dew condensation prevention function and the temperature change mitigation function decrease. Was.
D is a flow path that should flow originally, and E is a flow path that causes deterioration of function.

  In addition, the connection between the contact ring 3 and the DUT board 6 and the connection between the contact ring 3 and the probe card 2 have a dimensional tolerance of each part. In order to absorb, the prober 1 is connected.

Such an apparatus has the following problems.
In addition to the flow path where the dry air C was originally supposed to flow, there was an exhaust of the dry air C and an inflow of external air, etc., resulting in a decrease in the dew condensation prevention function and the temperature change reduction function.
For this reason, the range of the low temperature test temperature has been limited.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems, and to provide a semiconductor test apparatus capable of improving a dew condensation prevention function and a temperature change reduction function in dry air supply during a prober low temperature test.
Further, the dry air connection between the contact ring and the DUT board is to provide a semiconductor test apparatus capable of absorbing a dimensional tolerance between components so as to be surely connected.

In order to achieve such a problem, in the present invention, in the semiconductor test apparatus of claim 1,
In a semiconductor test apparatus comprising a prober having a contact ring in contact with a probe card and a tester head having a DUT board in contact with the contact ring, an inner diameter hole provided in a vertical direction through the contact ring, and the inner diameter A seal plate provided in the hole and dividing the inner diameter hole into two chambers; an air nozzle provided in the DUT board; and a telescopic pipe having one end connected to the seal plate and the other end in contact with the air nozzle. It is characterized by having.

In the semiconductor test apparatus according to claim 2 of the present invention, in the semiconductor test apparatus according to claim 1,
The telescopic pipe is a bellows pipe.

According to claim 1 of the present invention, there are the following effects.
In the dry air connection method for the prober low-temperature test, a seal plate is provided in the inner diameter hole of the contact ring, and the chamber structure is configured by the contact ring and the probe card. By configuring in this manner, a semiconductor test apparatus capable of improving the dew condensation prevention function and the temperature change reduction function can be obtained.

  In addition, there is a difference in the setting value and actual machine in the connection between the contact ring and the DUT board because of the dimensional tolerance of each part. However, the dry air connection between the contact ring and the DUT board is provided with an extendable pipe. Therefore, a semiconductor test apparatus capable of absorbing the dimensional difference and ensuring airtightness is obtained.

According to claim 2 of the present invention, there are the following effects.
Since the bellows pipe is used as the extendable pipe, the bellows pipe has marketability and can be easily obtained at a low cost, so that an inexpensive semiconductor test apparatus can be obtained.

Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory diagram of the main part configuration of one embodiment of the present invention, and FIG. 2 is an explanatory diagram of the main part configuration of FIG.
In the figure, the same symbols as those in FIG.
Only the differences from FIG. 101 will be described below.

In FIG. 1, the seal plate 11 is provided in the inner diameter hole B, and the inner diameter hole B is divided into two chambers 111 and 112.
The air nozzle 7 is provided on the DUT board 6.
The telescopic pipe 13 has one end connected to the seal plate 11 and the other end in contact with the air nozzle 7.
In this case, the bellows pipe is used as the telescopic pipe 13 as shown in FIG.

  In the above configuration, as shown in FIG. 1, a wall is provided in the inner diameter hole (B hole) of the contact ring 3, and the contact ring 3 and the probe card 2 constitute the chamber structure 112. By configuring the exhaust system so that it is exhausted via the road, it is possible to improve the dew condensation prevention function and the temperature change mitigation function.

  In addition, since there is a dimensional tolerance of each part in the connection between the contact ring 3 and the DUT board 6, there is a difference between the set value and the actual machine, so the connection of the dry air C between the contact ring 3 and the DUT board 6 is The telescopic pipe 13 is used.

In this case, a bellows pipe made of an elastically deformable material (rubber material) is provided on the contact ring 3 to absorb the dimensional difference.
As shown in FIG. 2, the bellows pipe 13 is installed so as to be connected in a compressed state so that the dry air C does not leak.

As a result,
In the dry air connection method for the prober low-temperature test, a seal plate 11 is provided in the inner diameter hole B of the contact ring 3, the chamber 112 structure is constituted by the contact ring 3 and the probe card 2, and the flow path where the dry air C should flow originally By configuring so as to be evacuated via, a semiconductor test apparatus capable of improving the dew condensation prevention function and the temperature change reduction function can be obtained.

  Also, in the connection between the contact ring 3 and the DUT board 6, there is a difference between the set value and the actual machine due to the existence of dimensional tolerances of each part. However, the dry air connection between the contact ring 3 and the DUT board 6 is Since the telescopic pipe 13 is provided, a semiconductor test apparatus capable of absorbing a dimensional difference and ensuring airtightness is obtained.

  Since the bellows pipe is used as the telescopic pipe 13, the bellows pipe has marketability and can be easily obtained at a low cost, so that an inexpensive semiconductor test apparatus can be obtained.

The above description merely shows a specific preferred embodiment for the purpose of explanation and illustration of the present invention.
Therefore, the present invention is not limited to the above-described embodiments, and includes many changes and modifications without departing from the essence thereof.

It is principal part structure explanatory drawing of one Example of this invention. It is principal part structure explanatory drawing of FIG. It is structure explanatory drawing of the prior art example generally used conventionally. It is operation | movement explanatory drawing of FIG.

Explanation of symbols

1 prober 2 probe card 3 contact ring 4 prober top plate 5 tester head 6 DUT board 7 air nozzle 11 seal plate 111 chamber 112 chamber 13 telescopic pipe A hole B hole C dry air D original flow path E Road

Claims (2)

In a semiconductor test apparatus comprising a prober having a contact ring in contact with a probe card and a tester head having a DUT board in contact with the contact ring,
An inner diameter hole provided in the vertical direction through the contact ring;
A seal plate provided in the inner diameter hole and dividing the inner diameter hole into two chambers;
An air nozzle provided on the DUT board;
A semiconductor test apparatus comprising: a telescopic pipe having one end connected to the seal plate and the other end contacting the air nozzle. The semiconductor test apparatus according to claim 1, wherein a bellows pipe is used as the telescopic pipe.

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