CN104517876B - Packaging part transports device assembly - Google Patents
Packaging part transports device assembly Download PDFInfo
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- CN104517876B CN104517876B CN201410520635.4A CN201410520635A CN104517876B CN 104517876 B CN104517876 B CN 104517876B CN 201410520635 A CN201410520635 A CN 201410520635A CN 104517876 B CN104517876 B CN 104517876B
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- packaging part
- shell
- device assembly
- linear movement
- electronic component
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 122
- 230000032258 transport Effects 0.000 title claims description 44
- 230000002950 deficient Effects 0.000 description 11
- 238000010276 construction Methods 0.000 description 7
- 230000000007 visual effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000004392 genitalia Anatomy 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000007567 mass-production technique Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A kind of packaging part transport device assembly, including：Linear movement unit；First shell is arranged to surround linear movement unit；Packaging part bracket is connected to first shell, and is at least partly magnetized, to adsorb at least one packaging part；Second shell moves in conjunction with linear movement unit, and with the motion association of linear movement unit, and packaging part bracket is contained in second shell.
Description
This application claims be submitted within 30th Korea Spro 10-2013-0116847 of Korean Intellectual Property Office in September in 2013
State's patent application and the power of the 2014-080279 Japanese patent application of Japanese Patent Office is submitted on April 9th, 2014
The disclosure of benefit, these applications is all incorporated herein by reference.
Technical field
One or more embodiments of the invention are related to a kind of component, more particularly, are related to a kind of packaging part transport
Device assembly.
Background technique
For the miniaturization and performance improvement of electronic device, the technology for manufacturing high-performance microelectronics component is very heavy
It wants.The electronic component of mass production can be separately packaged and list.However, since the company of manufacture electronic device has launched largely
Electronic component is into assembling equipment, therefore a large amount of electronic components can be encapsulated in pallet and list.
During manufacturing and encapsulating a large amount of electronic components, need to remove the defective ministry of electronics industry from electronic component
Part, and while electronic component is precisely aligned by electronic component package in pallet.For this purpose, being sealed using autoelectrinic component
Assembling device.In autoelectrinic component packaging system, product is only chosen without selecting defective product, and will be selected
Electronic component is loaded on pallet.
In general, multiple electronic components are manufactured to electronic component group and to electronic components for mass production electronic component
Group is packaged.Due to may include product and defective product in packaging part, it is therefore desirable to produced for choosing
The operation of product.Such packaging part selection operation includes the operation for transporting packaging part.In order to improve packaging part selection operation
Efficiency, packaging part transport operation in, while packaging part is precisely aligned without deviation transport packaging part be important
's.
Packaging part in the prior art transports in operation, and packaging part is not transported by machine, is transported by people.?
In the case where transporting packaging part by people, it is difficult to transport packaging part while being aligned packaging part, therefore packaging part choosing can be reduced
Select the efficiency of operation.In addition, realign after packaging part transports operation the operation of the packaging part of transport.
It is universal with the reduction of the size of recent electronic component and performance improvement and mass production technique, it needs and uses
In the relevant technology of device and method for transporting packaging part while packaging part is aligned.
Summary of the invention
One or more embodiments of the invention include the encapsulation for transporting packaging part while packaging part is aligned
Part transports device assembly.
Other aspects will carry out the elaboration of part in the following description, will partially be become apparent by the description,
Or it can be understood by the practice of provided embodiment.
According to one or more embodiments of the present invention, a kind of packaging part transport device assembly includes：Linear movement unit；
First shell is arranged to surround linear movement unit；Packaging part bracket is connected to first shell, and at least partly by magnetic
Change, to adsorb at least one packaging part；Second shell is closed in conjunction with linear movement unit, and with the movement of linear movement unit
The movement of connection ground, and packaging part bracket is contained in second shell.
It further includes the guidance unit being arranged between linear movement unit and first shell that the packaging part, which transports device assembly,.
The packaging part bracket includes：First plate, in conjunction with first shell；Second plate hardened merges and at least with first
Part is magnetized.
It further includes the connection unit being arranged between first shell and packaging part bracket that the packaging part, which transports device assembly,.
It further includes the Flexible element being arranged between second shell and packaging part bracket that the packaging part, which transports device assembly,.
The position of the fixed Flexible element of at least one of second shell and packaging part bracket.
Second shell is arranged in position corresponding with packaging part and including nonmagnetic third plate.
If linear movement unit linearly moves, second shell is relative to packaging part support motion.
Detailed description of the invention
By the way that the description of embodiment, these and or other aspects will become obviously, and by more with reference to the accompanying drawing
Adding will be readily understood that, wherein：
Fig. 1 is the signal of the electronic component package device of the packaging part transport device assembly with embodiment according to the present invention
Property perspective view；
Fig. 2 is the perspective view of the mode of operation of the electronic component package device of Fig. 1；
Fig. 3 is the perspective view of another mode of operation of the electronic component package device of Fig. 1；
Fig. 4 is that the packaging part of Fig. 1 transports the perspective schematic view of device assembly；
Fig. 5 is the sectional view that the packaging part intercepted along the line V-V of Fig. 4 transports device assembly；
Fig. 6 is the schematic sectional view for showing the operation of packaging part transport device assembly of Fig. 4.
Specific embodiment
Hereinafter, the present invention will be described more fully with referring to the attached drawing for showing exemplary embodiment of the present invention.So
And the present invention can be implemented in many different forms, and should not be construed as limited to exemplary implementation set forth herein
Example.More precisely, it theses embodiments are provided so that this disclosure will be thorough and complete, and the scope of the present invention is filled
It is communicated to those skilled in the art with dividing.The term used in the present specification is only used for description specific embodiment, and
It is not intended to limit the present invention.The statement of singular includes the expression of plural number, unless clearly showing difference in context
The meaning.In the present specification, it will be appreciated that, the terms such as " comprising " or " having " are intended to refer to disclosed in specification
Feature, quantity, step, movement, the presence of component, components or groups thereof exclude to may be present or addible one without being intended to
A possibility that other a or more features, quantity, step, movement, component, components or groups thereof.Such as although " first ", " the
The terms such as two " can be used for describing various components, but these components are not limited to above-mentioned term.Above-mentioned term is only used for distinguishing a group
Part and another component.The statement of such as "at least one" modifies permutation element when before a series of elements, and non-modified
A series of individual element in elements.
Fig. 1 is the electronic component package device 100 of the packaging part transport device assembly 200 with embodiment according to the present invention
Perspective schematic view.
Electronic component package device 100 according to the embodiment as shown in Figure 1 is such a device：It is big for receiving
It measures separately fabricated electronic component, the defective component of detection, select the electronic component of good quality and in the selected ministry of electronics industry
Selected electronic component is loaded on pallet by part in the case where being accurately aligned.
Electronic component package device 100 can operate by control unit (e.g., including control the computer of software, made
It makes as the central processing unit (CPU) of single semiconductor chip or the printed circuit board including various semiconductor chips
(PCB)) various assemblies controlled.The operation of the component of electronic component package device 100 as described above by control unit come
Control.
Electronic component package device 100 is arranged in along the first guiding piece 102 that the direction parallel with Y direction extends
On pedestal 101.Component load units 104 are arranged on the first guiding piece 102, to move along the first guiding piece 102.Component dress
Carrier unit 104 can be and the driving force provided by the driving unit 103 being mounted on the first guiding piece 102 along the first guidance
Part 102 moves.
Component load units 104 include loading plate 105, and the electronic component supplied from component supplying machine people 107 is loaded in
On loading plate 105.Component supply unit 108 temporarily accommodates the electronic component of multiple manufactures.Manually or it can be led to by worker
It crosses individual supply unit (robot) and electronic component is automatically supplied to component supply unit 108.
Fig. 2 is the perspective view of the mode of operation of the electronic component package device 100 of Fig. 1.
When component supplying machine people 107 adsorbs the electronic component that is contained in component supply unit 108 and by electronic component
When being supplied on the loading plate 105 of component load units 104, component load units 104 along the first guiding piece 102 move to
The corresponding position of first camera 110.
First camera 110 shoots the image of multiple electronic components on the surface of loading plate 105.Electronic component package device
100 control unit can calculate each position and rotation angle θ of multiple electronic components relative to X-direction and Y direction.The
One camera 110 can be moved upwards along the 4th guiding piece 150 in the side parallel with X-direction.
Fig. 3 is the perspective view of another mode of operation of the electronic component package device 100 of Fig. 1.
When each position for obtaining multiple electronic components on loading plate 105 from the image shot by first camera 110
When, second camera 111 moves to the position of the electronic component on loading plate 105 along the second guiding piece 120.Second camera 111
The overhead view image of each electronic component is shot, to carry out the visual examination of the top surface of electronic component.Second camera 111 includes using
In the lighting unit 111a to shine towards electronic component.
Second guiding piece 120 is arranged to extend along the direction parallel with X-direction, and guides 111 He of second camera
Swivel head 130 is moved along the second guiding piece 120.
By utilizing second camera 111, the visual examination of each electronic component can be performed and each electronics can be obtained simultaneously
The center of component.
Swivel head 130 can be moved to along the second guiding piece 120 is located at the position parallel with X-direction, although however, not
It shows, but the second guiding piece 120 is also moveable to the position parallel with Y direction.Therefore, swivel head 130 can by along
The direction parallel with X-direction moves and moves and move to along the direction parallel with Y direction the meter of each electronic component
The position of calculation.
After swivel head 130 moves to the position corresponding with electronic component, the ozzle 131 of swivel head 130
Decline and by the adsorption capacity using compressed air come the electronic component on the loading plate 105 of pick-up part load units 104.Rotation
Rotary head 130 includes circumferentially disposed multiple ozzles 131.After swivel head 130 rotates predetermined angular, ozzle 131
When declining and adsorbing electronic component, the adsorbable electronic component of each ozzle 131 of swivel head 130.
It is confirmed as the electronic component of defective component not by pipe by the visual examination executed by second camera 111
Mouth 131 adsorbs.After adsorbing whole electronic components by swivel head 130, defective FRU collector unit 109 is adsorbable and collects quilt
It is determined as defective component and remains in the electronic component on loading plate 105.
Swivel head 130 ozzle 131 adsorb electronic component after, swivel head 130 along the second guiding piece 120 with X
The parallel direction of axis direction and the side parallel with Y direction move upwards, so that swivel head 130 moves in third camera 112.
Third camera 112 shoots the image for being adsorbed to the electronic component of ozzle 131 of swivel head 130, thereby executing electronic component
The visual examination of bottom surface.As the rotation of swivel head 130 and third camera 112 shoot image, each ozzle 131 can be executed
Visual examination.
After the bottom surface to electronic component checks, swivel head 130 is along the direction parallel with X-direction and and Y
The parallel direction movement of axis direction.Move to that (electronic component will be by with the recess portion 171 of tray supporter component 170 in swivel head 130
It is loaded on the recess portion 171 of tray supporter component 170) behind corresponding position, it can be under the ozzle 131 by making swivel head 130
It drops and discharges compressed air and be inserted into electronic component in the groove of recess portion 171.
By repeatedly make swivel head 130 rotation, make swivel head 130 along X-direction and Y direction move and will under
The electronic component of one ozzle 131 is inserted into next groove of recess portion 171, can be inserted respectively into multiple electronic components recessed
In multiple grooves in portion 171.
It is only just inserted into recess portion 171, and passed through by the electronic component that bottom surface inspection is determined preferably component
The electronic component that bottom surface inspection is confirmed as defective component, which moves to, topples over case 190.Swivel head 130 is moveable to and inclines
The position corresponding of case 190 and makes to fall under defective component and topple in case 190.
When recess portion 171 is loaded full, recess portion 171 is transported on the direction parallel with Y direction along third guiding piece 140
It is dynamic.Third guiding piece 140 can be by the driving force guide recess 171 from driving unit 141 along the side parallel with Y direction
To movement.4th camera 113 can also be moved upwards along the 4th guiding piece 150 in the side parallel with X-direction.
As shown in Figure 2, after recess portion 171 moves to position corresponding with the 4th camera 113, the 4th camera 113
Shoot the image for the whole electronic components being loaded on recess portion 171.By moving recess portion 171 simultaneously along third guiding piece 140
It moves the 4th camera 113 along the direction parallel with X-direction, the image of whole grooves about recess portion 171 can be shot.
By the comprehensive image shot by the 4th camera 113, can get be inserted into it is complete in whole grooves of recess portion 171
The image of portion's electronic component.When there are defective product (the loading condition existing defects for being inserted into the electronic building brick in recess portion)
When, alarm can be provided by the result of outgoing inspection.
In electronic component package device 100 with above-mentioned construction, adsorbed about by the ozzle 131 of swivel head 130
The visual examination of top surface and bottom surface of electronic component successively and can be performed quickly during a series of operation.Cause
This, due to accurately carrying out the top surface and bottom surface about electronic component while electronic component moves in recess portion 171
Visual examination, therefore the speed and reliability of the process for packaged electronic components can be improved.
In addition, after the position that the image by obtaining from first camera 110 accurately identifies each electronic component, rotation
Rotary head 130 can rapidly adsorb each electronic component, and after being checked using third camera 112, be adsorbed with electronics
The swivel head 130 of component moves on recess portion 171.Therefore, component loading operation can be performed quickly.
Based on construction as described above, the distance minimization that swivel head 130 is moved upwards in the side parallel with X-direction.
Therefore, component rapidly can be loaded into recess portion 171, and the overall dimensions of electronic component package device 100 can be made to minimize.
Fig. 4 is that the packaging part of Fig. 1 transports the perspective schematic view of device assembly 200.Fig. 5 is the encapsulation along Fig. 4 line V-V interception
The sectional view of part transport device assembly 200.
Referring to Fig. 4 and Fig. 5, packaging part, which transports device assembly 200, may include linear movement unit 210, first shell 220, draws
Lead unit 230, packaging part bracket 240, second shell 250, Flexible element 260 and position fixed cell 270.
Linear movement unit 210 is with cylinder shape or similar polygon-prism shape shape and is arranged to along axis side
To linearly moving.
First shell 220 includes hollow portion, wherein linear movement unit 210 can be plugged into hollow portion.
Guidance unit 230 is mounted between linear movement unit 210 and first shell 220.Guidance unit 230 may include
One guiding piece 231 and the second guiding piece 232.First guiding piece 231 is arranged in the top of the inner surface of first shell 220, and
Two guiding pieces 232 are arranged in the bottom of the inner surface of first shell 220.Guidance unit 230 is used as lubricating coupler, for ought linearly transport
The friction with first shell 220 is reduced when moving cell 210 is linearly slided relative to first shell 220.In addition, guidance unit
230 make constant holding interval between linear movement unit 210 and first shell 220, to prevent linear movement unit 210 and first
Shell 220 is detached from and makes the minimum vibration between the online genital locomotor stage of linear movement unit 210.
The sliding bearing that guidance unit 230 can be used for reducing the friction during surface contacts.However, the present invention is not
It is limited to this.Any construction in the various constructions for reducing friction can be used in guidance unit 230.
Packaging part is attached to packaging part bracket 240, to maintain to be aligned, wherein packaging part bracket 240 may include multiple plates.
Packaging part bracket 240 is at least partly magnetized, so that magnetic packaging part may be affixed to packaging part bracket 240.
In detail, packaging part bracket 240 may include the first plate 241 and the second plate 242, the first plate 241 and first shell
220 combine, and the second plate 242 is mounted on the lower section of the first plate 241.When linear movement unit 210 and second shell 250 are linearly transported
When dynamic, the first plate 241 guides packaging part bracket 240 to move relative to linear movement unit 210 and second shell 250.Due to
Two plates 242 are magnetized, therefore the packaging part that part is magnetized may be affixed to the second plate 242.
Second shell 250 may include lid 251 and third plate 252.Packaging part bracket 240 is contained in by second shell 250
Wherein and it is integrated to linear movement unit 210.Linear movement unit 210 is arranged in the middle part of lid 251, wherein 251 He of lid
Linear movement unit 210 is fixed by the first fixed cell 253, and the first fixed cell 253 penetrates lid 251 and is connected to linear
Moving cell 210.First fixed cell 253 can be screw, bolt, rivet, nail, pin etc..However, the invention is not limited thereto,
According to the design needs, any part in various parts can be used for fixing lid 251 and linear movement unit 210.
When linear movement unit 210 linearly moves, second shell 250 can be linear with linear movement unit 210 1
Ground movement.In addition, third plate 252 can be formed by non-magnetic material.Lid 251 is combined with third plate 252, to form internal sky
Between.Here, packaging part bracket 240 and Flexible element 260 as described above may be arranged between lid 251 and third plate 252.
Flexible element 260 is arranged between second shell 250 and packaging part bracket 240.Flexible element 260 is by elastic material
It is formed.For example, Flexible element 260 can be formed by spring, rubber, silica gel etc..Although Flexible element 260 is not limited to particular elements,
But for the ease of explaining, the description for assuming that Flexible element 260 is spring is presented below.
At least one of second shell 250 and the first plate 241 may include fixing for fixing the position of Flexible element 260
Unit 270.Position fixed cell 270 is formed as slot or protrusion, so that the end of Flexible element 260 is fixed to the fixed list in position
Member 270.Flexible element 260 is fixed to position fixed cell 270, to prevent Flexible element 260 to be detached from, and makes by following institute
Elastic force caused by the linear movement for the linear movement unit 210 stated effectively is transmitted.
Position fixed cell 270 may include the first position fixed cell 271 being formed at second shell 250 and be formed
Second position fixed cell 272 at the first plate 241.Here, first position fixed cell 271 and second position fixed cell
272 can form similarly as described above.In the following, will be described in detail, to form first position fixed cell 271 and the second position solid
The case where order member 272.
In response to the linear movement of second shell 250, Flexible element 260 is along the side with 250 linear movement of second shell
Restoring force is generated in the opposite direction.It can be by arranging that single Flexible element 260 or multiple Flexible elements 260 adjust elastic force.
Here, if installing single Flexible element 260, Flexible element 260 is mountable in the first plate 241 and second shell 250
Middle part.In addition, if the quantity of the Flexible element 260 of installation is odd number, then a Flexible element in Flexible element 260
The mountable middle part in the first plate 241 and second shell 250, and remaining Flexible element 260 can be around the first plate 241 and the
The middle part of two shells 250 is arranged symmetrically.Here, quantity is that the Flexible element 260 of odd number can be spaced each other constant distance
Or it may be arranged at equal central angles.
If the quantity of the Flexible element 260 of installation is even numbers, quantity is that the Flexible element 260 of even numbers can enclose
Middle part around the first plate 241 and second shell 250 is arranged symmetrically.In addition, the Flexible element 260 that quantity is even numbers can be each other
The distance of alternate constant may be arranged at equal central angles.However, for the ease of explaining, will be described in detail two bullets of arrangement
The case where property unit 260.
Here, Flexible element 260 may include the first Flexible element 261 and be installed to be and the first Flexible element 261 interval
The second Flexible element 262 opened.First Flexible element 261 and the second Flexible element 262 can be symmetrically arranged with one another in the first plate
241 two opposite ends.Here, the distance between the middle part of the first plate 241 and the first Flexible element 261 can be essentially equal to
The distance between the middle part of one plate 241 and the second Flexible element 262.
Connection unit 280 may include circle 281 and the second fixed cell 282, and can make first shell 220 and packaging part branch
Frame 240 is connected with each other.It is formed with hole on the surface of second shell 250, and encloses 281 and is inserted into the hole.Second is fixed
Unit 282 penetrates the first plate 241 and circle 281, and is combined with first shell 220.Second fixed cell 282 can by screw, bolt,
Rivet, nail or pin-shaped at.However, the invention is not limited thereto, and according to the design needs, any part in various parts is available
In fixed first shell 220 and the first plate 241.In addition, multiple second fixed cells 282 and multiple second fixed lists can be arranged
Member 282 can arrange apart from each other.
The operation that device assembly 220 is transported with packaging part constructed as described above is described below.
Fig. 6 is the schematic sectional view for showing the operation of packaging part transport device assembly 200 of Fig. 4.
Referring to Fig. 6, accelerating since the size of electronic component reduces with performance improvement, produce in large quantities now,
It encapsulates and to sell high performance microelectronic component very universal.In order to distinguish component and defective component, referred to by having
The system of motion orientation and specified path executes a kind of operation.In particular, in order to improve such electronic component selection
The efficiency of operation, to transport microelectronic component as described above more important while electronic component alignment.Here, if micro- electricity
The packaging part of subassembly does not maintain the state of alignment, then needs to add realigning operation.As a result, being selected for electronic component
Period consumed by operating will increase and can reduce the efficiency of electronic component selection operation.
Therefore, packaging part can be used to transport device assembly 200 for transporting the multiple electronic components being aligned as described above.
In particular, packaging part, which transports device assembly 200, to be accommodated in luck in component supply unit 108 in packaging part
Turn.Here, component supplying machine people 107, which can operate and packaging part is attached to packaging part, transports device assembly 200.
Packaging part transports device assembly 200 and can manually or automatically operate.Device assembly 200 is transported in packaging part manually to transport
In the case where turning, user can apply driving force to linear movement unit 210.In addition, transporting device assembly 200 automatically in packaging part
In the case where operating, component supplying machine people 107 may include linear drive unit 106.Here, linear drive unit 106 can wrap
It includes the chaining part for being connected to linear movement unit 210, the gear unit for rotating chaining part and is connected to gear unit
Motor.In addition, linear drive unit 106 may include being connected to the axis of linear movement unit 210 and being connected to the axis
Cylinder component (cylinder).
However, the construction of linear drive unit 106 is not limited to above-mentioned construction and may include for making linear movement unit
The 210 whole devices linearly moved and all construction.However, for the ease of explaining, Linear Driving will be described in detail belows
Unit 106 includes the case where axis and cylinder component.
Meanwhile device assembly 200 is transported the packaging part on component supply unit 108 is adsorbed onto packaging part as described above
In the case of, packaging part is located at the lower section of third plate 252.Since the second plate 242 is located at 252 side of third plate, second is come from
The magnetic force of plate 242 can be transmitted by third plate 252 and act on packaging part.
Here, packaging part is by being attached to third plate 252 from the magnetic force of the second plate 242.Packaging part is being attached to
It is alignment before third plate 252.Here, due to the packaging part effect by the magnetic force from the second plate 242 simultaneously, envelope
Piece installing is adsorbed to third plate 252 while maintaining packaging part alignment.
When completing aforesaid operations, packaging part transports device assembly 200 and can move towards loading plate 105.Here, packaging part is transported
It send device assembly 200 that can separate with the packaging part for being attached to third plate 252 and the packaging part accommodated can be made to fall to loading plate 105
On.
In detail, when linear movement unit 210 is forced downward, linear movement unit 210 is moved downward.When linear fortune
When moving cell 210 moves downward, by the first fixed cell 253 be integrated to the second shell 250 of linear movement unit 210 also to
Lower movement.Here, the position of first shell 220, packaging part bracket 240 and connection unit 280 is constant.In particular, first shell
Body 220 is fixed to component supplying machine people 107, and packaging part bracket 240 and connection unit 280 are connected to first shell 220.
When second shell 250 moves downward, the third plate 252 for being connected to second shell 250 is also moved downward.Here,
The distance between second plate 242 and third plate 252 increase.
When the distance between magnetic bodies increases, magnetic force is reduced.Therefore, when between the second plate 242 and third plate 252
When distance increases, the magnetic force for acting on packaging part from the second plate 242 is reduced, therefore packaging part is separated with third plate 252.
In particular, occurring in the increased situation of distance between the second plate 242 as described above and third plate 252
The intensity for the magnetic force for being applied to packaging part by the second plate 242 becomes smaller than the burble point of the weight of packaging part.Here, when second
When the position of plate 242 is reached at the burble point, packaging part is become smaller than by the magnetic force that the second plate 242 is applied to packaging part
Weight.As a result, packaging part can be separated with third plate 252 and be fallen on loading plate 105.
In addition, Flexible element 260 moves downward and packaging part bracket 240 when linear movement unit 210 is forced downward
Position it is constant, therefore compress second shell 250 and the Flexible element 260 interconnected of packaging part bracket 240.Here,
Flexible element 260 generates restoring force along the direction opposite with the direction of motion of second shell 250.
In particular, being stored in Flexible element when the power for being applied to linear movement unit 210 as described above is removed
Restoring force in 260 is applied to packaging part bracket 240, so that packaging part bracket 240 be made to restore to its initial position.
Therefore, packaging part transport device assembly 200 can be by being attached to magnetic packaging part bracket 240 for the packaging part of alignment
The packaging part of alignment is transported, to reduce for the time consumed by electronic component selection operation and improve electronic component choosing
Select the efficiency of operation.
In addition, packaging part, which transports device assembly 200, can rapidly transport packaging part, to improve electronic component package device
100 efficiency.
Although one or more embodiments of the present invention are described with reference to the accompanying drawings, ordinary skill people
Member, can be in form and thin it will be appreciated that in the case where not departing from the spirit and scope of the present invention being defined by the claims
Various changes are made on section.
Claims (7)
1. a kind of packaging part transports device assembly, including：
Linear movement unit；
First shell is arranged to surround linear movement unit；
Packaging part bracket is connected to first shell, and is at least partly magnetized, to adsorb at least one packaging part；
Second shell moves in conjunction with linear movement unit, and with the motion association of linear movement unit, and packaging part branch
Frame is contained in second shell,
Wherein, if linear movement unit linearly moves, second shell is relative to packaging part support motion.
2. packaging part as described in claim 1 transports device assembly, it further includes being arranged in linearly that the packaging part, which transports device assembly,
Guidance unit between moving cell and first shell.
3. packaging part as described in claim 1 transports device assembly, wherein the packaging part bracket includes：
First plate, in conjunction with first shell；
Second plate hardened merge and is at least partly magnetized with first.
4. packaging part as described in claim 1 transports device assembly, it further includes being arranged in first that the packaging part, which transports device assembly,
Connection unit between shell and packaging part bracket.
5. packaging part as described in claim 1 transports device assembly, it further includes being arranged in second that the packaging part, which transports device assembly,
Flexible element between shell and packaging part bracket.
6. packaging part as claimed in claim 5 transports device assembly, wherein at least one of second shell and packaging part bracket
The position of fixed Flexible element.
7. packaging part as described in claim 1 transports device assembly, wherein second shell is arranged in position corresponding with packaging part
It sets and including nonmagnetic third plate.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130116847A KR101864327B1 (en) | 2013-09-30 | 2013-09-30 | Package Carrier Assembly |
| KR10-2013-0116847 | 2013-09-30 | ||
| JP2014080279A JP6357340B2 (en) | 2013-09-30 | 2014-04-09 | Package transport assembly |
| JP2014-080279 | 2014-04-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104517876A CN104517876A (en) | 2015-04-15 |
| CN104517876B true CN104517876B (en) | 2018-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410520635.4A Active CN104517876B (en) | 2013-09-30 | 2014-09-30 | Packaging part transports device assembly |
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| Country | Link |
|---|---|
| CN (1) | CN104517876B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6868471B2 (en) * | 2017-05-31 | 2021-05-12 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and manufacturing method of semiconductor equipment |
| CN116573397B (en) * | 2023-07-12 | 2023-12-08 | 前海晶方云(深圳)测试设备有限公司 | Changing equipment |
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| CN1893009A (en) * | 2005-07-07 | 2007-01-10 | 松下电器产业株式会社 | Component mounting apparatus and component mounting method |
| JP2013038206A (en) * | 2011-08-08 | 2013-02-21 | Panasonic Corp | Electronic component mounting device, electronic component mounting method, and arrangement alteration method of lower receiving pin module |
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| US5882171A (en) * | 1996-10-01 | 1999-03-16 | Balzers Aktiengesellschaft | Transport and transfer apparatus |
| US5999074A (en) * | 1997-02-05 | 1999-12-07 | Ullman Devices Corporation | Magnetic head for magnetic pick-up tool |
| CN1399320A (en) * | 2001-07-17 | 2003-02-26 | 先进自动器材有限公司 | Binding force controlling device and method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104517876A (en) | 2015-04-15 |
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