TW201819931A - Electronic parts conveying device and electronic parts inspection device capable of accurately and efficiently inspecting electronic parts - Google Patents

Electronic parts conveying device and electronic parts inspection device capable of accurately and efficiently inspecting electronic parts Download PDF

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Publication number
TW201819931A
TW201819931A TW106140954A TW106140954A TW201819931A TW 201819931 A TW201819931 A TW 201819931A TW 106140954 A TW106140954 A TW 106140954A TW 106140954 A TW106140954 A TW 106140954A TW 201819931 A TW201819931 A TW 201819931A
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TW
Taiwan
Prior art keywords
inspection
area
temperature
electronic component
supply
Prior art date
Application number
TW106140954A
Other languages
Chinese (zh)
Inventor
前田政己
山崎孝
Original Assignee
日商精工愛普生股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP2016230933A external-priority patent/JP2018087735A/en
Priority claimed from JP2017064547A external-priority patent/JP2018169186A/en
Application filed by 日商精工愛普生股份有限公司 filed Critical 日商精工愛普生股份有限公司
Publication of TW201819931A publication Critical patent/TW201819931A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Abstract

The present invention provides an electronic parts conveying apparatus and an electronic parts inspection apparatus that can accurately and efficiently inspect electronic parts. The electronic parts conveying apparatus 10 includes an inspection area A3 provided with an inspection unit 16 capable of performing a first inspection on an electronic part 90 at the first temperature, and a second inspection on the electronic part 90 at the second temperature different from the first temperature after the first inspection; a first carrying area A1, which can be arranged with a first carrying section 200; the first carrying section 200 is used to carry the electronic part 90 before the first inspection; a second carrying area A5, which is located at a position different from the first carrying area A1, and can be arranged with a second carrying section 200. The second carrying section 200 carries the electronic part 90 before the second inspection.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。The invention relates to an electronic component conveying device and an electronic component inspection device.

自先前以來，例如已知有檢查IC(integrated circuit，積體電路)器件等電子零件之電氣特性之電子零件檢查裝置，於該電子零件檢查裝置組入有用以搬送IC器件之電子零件搬送裝置(例如，參照專利文獻1)。又，於電子零件檢查裝置中，藉由將複數個IC器件載置於托盤，並連同托盤一起放入至裝置內，而將托盤藉由搬送部搬送至進行檢查之檢查部。而且，當檢查結束時，將IC器件載置於托盤，藉由搬送部連同托盤一起搬送並排出至裝置外。再者，於專利文獻1所記載之電子零件搬送裝置中，當檢查結束時，能夠直接進行再測試(再檢查)。又，一般而言，於檢查電子零件之電氣特性之零件檢查裝置中，使用有在基台上之托盤與檢查用插口之間搬送檢查前或檢查後之電子零件之處理器。於此種零件檢查裝置中，存在使電子零件為0℃以下之低溫並且檢查該電子零件之電氣特性者。因此，已知有將電子零件冷卻至低溫為止之處理器(例如，參照專利文獻2)。專利文獻2所記載之處理器係藉由收容複數個電子零件之托盤與載置該托盤之盒體而構成支持電子零件的支持部。而且，將作為冷媒之乾燥狀態之乾燥空氣利用冷凍機冷卻，且將該經冷卻之乾燥空氣供給至形成於盒體之內部之冷卻路，藉此經由盒體將托盤冷卻，並經由該托盤將電子零件冷卻。[先前技術文獻][專利文獻][專利文獻1]日本專利特開2000-258507號公報[專利文獻2]日本專利特開2004-347329號公報For example, an electronic component inspection device for inspecting the electrical characteristics of electronic components such as IC (integrated circuit) devices has been known, and the electronic component inspection device incorporates an electronic component transfer device (for transferring IC devices) For example, refer to Patent Document 1). Furthermore, in the electronic component inspection apparatus, a plurality of IC devices are placed on a tray and placed in the apparatus together with the tray, and the tray is transferred to the inspection section that performs inspection by the transfer section. When the inspection is completed, the IC device is placed on a tray, and the transfer unit is transported together with the tray and discharged to the outside of the device. Furthermore, in the electronic component transporting device described in Patent Document 1, when the inspection is completed, retesting (reinspection) can be performed directly. In general, in a part inspection apparatus for inspecting the electrical characteristics of electronic parts, a processor that transports electronic parts before or after inspection between a tray on a base and an inspection socket is used. In such a part inspection device, there are those who make electronic parts at a low temperature of 0 ° C or lower and inspect the electrical characteristics of the electronic parts. Therefore, a processor for cooling electronic components to a low temperature is known (for example, refer to Patent Document 2). The processor described in Patent Document 2 includes a tray that houses a plurality of electronic components and a box on which the tray is placed to constitute a support unit that supports the electronic components. Then, the dry air in a dry state as a refrigerant is cooled by a refrigerator, and the cooled dry air is supplied to a cooling path formed inside the box body, thereby cooling the tray through the box body, and passing the tray through the tray. Electronic parts cool. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2000-258507 [Patent Document 2] Japanese Patent Laid-Open No. 2004-347329

[發明所欲解決之問題]然而，於專利文獻1所記載之電子零件搬送裝置中，於在電子零件之檢查完成後以不同之溫度再次進行檢查之情形時，必須由操作員搬送至不同之電子零件搬送裝置。於該情形時，有時產生操作員之搬送錯誤。又，檢查效率降低操作員搬送電子零件之時間之量。又，如專利文獻2所記載之處理器般，於將電子零件冷卻至低溫為止之處理器中，通常於乾燥空氣通過之冷卻路之中途，配置有切換乾燥空氣之通過與阻斷之切換閥。然而，於專利文獻2中，關於判斷該切換閥之狀態(例如，是正常地作動，或者還是產生故障而作動停止)完全未揭示或提示。[解決問題之技術手段]本發明係為了解決上述問題之至少一部分而完成者，能夠以如下之形態或應用例之格式實現。本發明之電子零件搬送裝置之特徵在於包括：檢查區域，其能夠配置檢查部，該檢查部能夠進行以第1溫度檢查電子零件之第1檢查及於上述第1檢查之後以與上述第1溫度不同之第2溫度檢查上述電子零件之第2檢查；第1載置區域，其能夠配置第1載置部，該第1載置部能夠載置上述第1檢查之前之上述電子零件；及第2載置區域，其位於與上述第1載置區域不同之區域，且能夠配置第2載置部，該第2載置部能夠載置上述第2檢查之前之上述電子零件。藉此，可於對載置於第1載置區域之第1載置部之電子零件進行第1檢查之後，對載置於第2載置區域之第2載置部之電子零件進行第2檢查。即，可利用1個電子零件搬送裝置進行溫度互不相同之第1檢查及第2檢查。其結果，可省略操作員於第1檢查後將電子零件搬送至第2檢查專用之電子零件搬送裝置之作業。因此，可防止由操作員所引起之錯誤，並且可迅速地進行第1檢查及第2檢查。於本發明之電子零件搬送裝置中，較佳為，上述電子零件係自上述第1載置區域搬送至上述檢查區域，於上述檢查區域進行上述第1檢查之後搬送至上述第2載置區域，自上述第2載置區域搬送至上述檢查區域，且於上述檢查區域進行上述第2檢查之後搬送至上述第1載置區域。藉此，利用使結束第1檢查後搬送至第2載置區域之電子零件逆行之簡單構成，可進行第1檢查及第2檢查。因此，可於結束第1檢查後順利地開始第2檢查。於本發明之電子零件搬送裝置中，較佳為，於自上述第1載置區域搬送至上述檢查區域之第1路徑中上述電子零件搬入至上述檢查區域內之方向，與於自上述第2載置區域搬送至上述檢查區域之第2路徑中上述電子零件搬入至上述檢查區域內之方向為相反方向。藉此，於第1檢查時與第2檢查時，電子零件搬送至檢查區域之方向相反，藉此，操作員可利用目視容易地確認是進行第1檢查還是進行第2檢查。於本發明之電子零件搬送裝置中，較佳為具有：第1溫度調整部，其於上述電子零件自上述第1載置部搬送至上述檢查區域之路徑中，能夠調整上述電子零件之溫度；及第2溫度調整部，其於上述電子零件自上述第2載置部搬送至上述檢查區域之路徑中，能夠調整上述電子零件之溫度。藉此，於第1檢查之前，可更確實地進行電子零件之溫度調整，並且於第2檢查之前，可更確實地進行電子零件之溫度調整。於本發明之電子零件搬送裝置中，較佳為，上述檢查部係於上述第2檢查之後，進行以與上述第1溫度及上述第2溫度不同之第3溫度檢查上述電子零件之第3檢查。藉此，可於1個電子零件搬送裝置進行3種檢查。於本發明之電子零件搬送裝置中，較佳為，上述第1載置區域能夠載置上述第3檢查之前之上述電子零件。藉此，於第3檢查時，可省略與第1載置區域不同地另外設置供給第3檢查之前之電子零件之區域。因此，可使裝置構成簡單。於本發明之電子零件搬送裝置中，較佳為，於在上述檢查區域進行上述第2檢查之後，搬送至上述第1載置區域之上述電子零件自上述第1載置區域搬送至上述檢查區域，於上述檢查區域，進行以與上述第1溫度及上述第2溫度不同之第3溫度檢查上述電子零件之第3檢查之後，搬送至上述第2載置區域。藉此，利用使結束第2檢查後搬送至第1載置區域之電子零件逆行之簡單構成可進行第3檢查。因此，可於結束第2檢查後順利地開始第3檢查。於本發明之電子零件搬送裝置中，較佳為，於上述第3檢查中於自上述第1載置區域搬送至上述檢查區域之第3路徑中上述電子零件搬入至上述檢查區域內之方向，與於上述第1檢查中於自上述第1載置區域搬送至上述檢查區域之第1路徑中上述電子零件搬入至上述檢查區域內之方向為相同方向。藉此，於第2檢查時與第3檢查時，電子零件搬送至檢查部之方向相反，藉此，操作員可利用目視容易地確認是進行第2檢查還是進行第3檢查。於本發明之電子零件搬送裝置中，較佳為，上述第1溫度高於上述第2溫度。藉此，一般而言，第1檢查較第2檢查更容易出現不良品。因此，使第1溫度高於第2溫度而先進行第1檢查，於第2檢查中省略第1檢查中之不良品之檢查，藉此可提高檢查效率。於本發明之電子零件搬送裝置中，較佳為，上述第1溫度高於室溫，上述第2溫度為室溫或低於室溫。藉此，可更確實地發揮上述效果，可提高檢查效率。於本發明之電子零件搬送裝置中，較佳為，上述第1溫度為室溫。藉此，於進行第1檢查時，可省略將成為室溫狀態之部分加熱或冷卻，可順利地開始第1檢查。於本發明之電子零件搬送裝置中，較佳為，上述第1溫度低於室溫，上述第2溫度為室溫或高於室溫。藉此，一般而言，若於結束溫度較低之檢查之後，直接將電子零件向裝置之外側排出，則電子零件容易產生冷凝。因此，藉由先進行溫度較低之第1檢查，然後進行第2檢查，可防止或抑制電子零件產生冷凝。於本發明之電子零件搬送裝置中，較佳為具備第3載置區域，該第3載置區域於與上述第1載置區域及上述第2載置區域不同之區域能夠配置載置上述電子零件之第3載置部。藉此，可將第3載置部補充至第1載置區域或第2載置區域。因此，可增加檢查後之分級之等級。於本發明之電子零件搬送裝置中，較佳為，配置於上述第3載置區域之上述第3載置部係能夠於配置於上述第1載置區域之上述第1載置部或配置於上述第2載置區域之上述第2載置部上移動。藉此，可將第3載置部補充至第1載置區域或第2載置區域。因此，可增加檢查後之分級之等級。本發明之電子零件檢查裝置之特徵在於包括：檢查部，其能夠進行以第1溫度檢查電子零件之第1檢查及於上述第1檢查之後以與上述第1溫度不同之第2溫度檢查上述電子零件之第2檢查；檢查區域，其配置有上述檢查部；第1載置區域，其能夠配置第1載置部，該第1載置部能夠載置上述第1檢查之前之上述電子零件；及第2載置區域，其位於與上述第1載置區域不同之區域，且能夠配置第2載置部，該第2載置部能夠載置上述第2檢查之前之上述電子零件。藉此，可於對載置於第1載置區域之第1載置部之電子零件進行第1檢查之後，對載置於第2載置區域之第2載置部之電子零件進行第2檢查。即，可利用1個電子零件搬送裝置，進行溫度互不相同之第1檢查及第2檢查。其結果，可省略操作員於第1檢查後將電子零件搬送至第2檢查專用之電子零件搬送裝置之作業。因此，可防止由操作員所引起之錯誤，並且可迅速地進行第1檢查及第2檢查。又，可將電子零件搬送至檢查部為止，因此，可利用檢查部對該電子零件進行檢查。又，可將檢查後之電子零件自檢查部搬送。本發明之電子零件搬送裝置之特徵在於具有：搬送部，其搬送電子零件；載置部，其載置上述電子零件；供給線，其將調整上述載置部之溫度之流體供給至上述載置部；排出線，其將上述流體自上述載置部排出；至少1個切換閥，其配置於上述供給線，且能夠以藉由打開狀態而能夠使上述供給線通過流體，藉由關閉狀態而將上述流體之通過阻斷之方式切換；檢測部，其配置於上述排出線，且檢測通過上述排出線之上述流體之流動；及控制部，其能夠控制上述切換閥；上述控制部係基於上述切換閥之控制資訊及於上述檢測部之檢測結果，而進行上述切換閥之狀態之判斷。藉此，操作電子零件搬送裝置之操作員於確認切換閥之狀態之判斷結果而得知切換閥之作動正常之情形時，可進行利用電子零件搬送裝置之電子零件之搬送。另一方面，於得知切換閥之作動產生某些不良情況之情形時，操作員可將該切換閥例如更換為新的切換閥。藉此，切換閥可正常地作動，因此，可順利地進行利用電子零件搬送裝置之電子零件之搬送。於本發明之電子零件搬送裝置中，較佳為，上述流體為將上述載置部冷卻之冷媒。藉此，可將載置部迅速地冷卻至所期望之目標溫度為止。於本發明之電子零件搬送裝置中，較佳為，上述載置部固定。藉此，可對載置部上之電子零件穩定地進行溫度調整。於本發明之電子零件搬送裝置中，較佳為，上述載置部係以能夠移動地被支持。藉此，載置部可將電子零件自特定之位置穩定地搬送至其他特定之位置。於本發明之電子零件搬送裝置中，較佳為，上述載置部係以能夠固持上述電子零件之方式構成。藉此，載置部可抬升電子零件，例如可直接搬送。於本發明之電子零件搬送裝置中，較佳為，上述切換閥包含：第1切換閥；及至少1個第2切換閥，其等配置於較上述供給線之上述第1切換閥更靠下游側。藉此，例如可進行將第1切換閥、第2切換閥之各切換閥之開閉適當組合之控制。於本發明之電子零件搬送裝置中，較佳為，上述供給線具有於較配置有上述第1切換閥之部分更靠下游側分支為複數個之分支線，且於上述各分支線配置有上述第2切換閥。藉此，例如藉由將第1切換閥、第2切換閥之各切換閥之開閉適當組合，可容易地選擇對各載置部之流體之一次供給、對各載置部之流體之一次供給停止、向各載置部中之任1個載置部之冷媒之供給。於本發明之電子零件搬送裝置中，較佳為，上述控制部使上述第1切換閥及上述第2切換閥中之一切換閥為關閉狀態，使另一切換閥為打開狀態，而進行上述判斷。藉此，可根據第1切換閥及第2切換閥之開閉狀態，適當進行第1切換閥之作動是否為正常之狀態，或者第2切換閥之作動是否為正常之狀態之判斷。於本發明之電子零件搬送裝置中，較佳為，上述控制部於使上述第1切換閥為關閉狀態，使上述第2切換閥為打開狀態，且於上述檢測部之檢測值為預先設定之值之情形時，進行上述第1切換閥之作動為正常之狀態之上述判斷。藉此，操作電子零件搬送裝置之操作員可於確認第1切換閥之作動為正常之狀態之後，進行利用電子零件搬送裝置之電子零件之搬送。另一方面，於進行與其相反之判斷之情形時，操作員可將第1切換閥例如更換為新的第1切換閥。於本發明之電子零件搬送裝置中，較佳為，上述控制部於使上述第1切換閥為打開狀態，使上述第2切換閥為關閉狀態，且於上述檢測部之檢測值為預先設定之值之情形時，進行上述第2切換閥之作動為正常之狀態之上述判斷。藉此，操作電子零件搬送裝置之操作員可確認第2切換閥之作動為正常之狀態之後，進行利用電子零件搬送裝置之電子零件之搬送。另一方面，於進行與其相反之判斷之情形時，操作員可將第2切換閥例如更換為新的第2切換閥。於本發明之電子零件搬送裝置中，較佳為，上述控制部於使上述第1切換閥為打開狀態，使配置於上述各分支線之上述第2切換閥中之1個上述第2切換閥為打開狀態，使其餘上述第2切換閥為關閉狀態，且於上述檢測部之檢測值為預先設定之值之情形時，進行成為上述打開狀態之上述第2切換閥之作動為正常之狀態之上述判斷。藉此，操作電子零件搬送裝置之操作員可於確認第2切換閥之作動為正常之狀態之後，進行利用電子零件搬送裝置之電子零件之搬送。另一方面，於進行與其相反之判斷之情形時，操作員可將第2切換閥例如更換為新的第2切換閥。於本發明之電子零件搬送裝置中，較佳為，上述切換閥係於通電時成為打開狀態而使上述流體能夠通過，於非通電時成為關閉狀態進行上述流體之阻斷。藉此，例如於使用電子零件搬送裝置之環境成為停電之情形時，流體被阻斷，因此，可防止流體白白地持續供給。於本發明之電子零件搬送裝置中，較佳為，上述檢測部由檢測通過上述排出線之上述流體之壓力之壓力計、或者檢測通過上述排出線之上述流體之流量之流量計而構成。藉此，可利用簡單之構成，容易地掌握通過排出線之流體之流動狀態，即，流體以何種程度流動。本發明之電子零件檢查裝置之特徵在於具有：搬送部，其搬送電子零件；載置部，其載置上述電子零件；供給線，其將調整上述載置部之溫度之流體供給至上述載置部；排出線，其將上述流體自上述載置部排出；至少1個切換閥，其配置於上述供給線，且能夠以藉由打開狀態而能夠使上述供給線通過流體，藉由關閉狀態而將上述流體之通過阻斷之方式切換；檢測部，其配置於上述排出線，且檢測通過上述排出線之上述流體之流動；控制部，其能夠控制上述切換閥；及檢查部，其能夠檢查上述電子零件；上述控制部係基於上述切換閥之控制資訊及於上述檢測部之檢測結果，而進行上述切換閥之狀態之判斷。藉此，操作電子零件檢查裝置之操作員可於確認切換閥之狀態之判斷結果係切換閥之作動正常之情形時，進行利用電子零件檢查裝置之電子零件之檢查。另一方面，於切換閥之作動產生某些不良情況之情形時，操作員可將該切換閥例如更換為新的切換閥。藉此，切換閥可正常地作動，因此，可順利地進行利用電子零件檢查裝置之電子零件之檢查。又，可將電子零件搬送至檢查部，因此，可利用檢查部對該電子零件進行檢查。又，可自檢查部搬送檢查後之電子零件。[Problems to be Solved by the Invention] However, in the electronic component transfer device described in Patent Document 1, when the electronic component is inspected again at a different temperature after the completion of the inspection, the operator must transport it to a different location. Electronic parts transfer device. In this case, an operator's transfer error may occur. In addition, inspection efficiency reduces the amount of time an operator has to transport electronic parts. In addition, like the processor described in Patent Document 2, in a processor that cools electronic parts to a low temperature, a switching valve that switches the passage and blocking of the dry air is usually arranged in the cooling path through which the dry air passes. . However, in Patent Document 2, the state of the switching valve (for example, whether it is operating normally or whether the operation is stopped due to a failure) is not disclosed or suggested at all. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented in the following forms or application example formats. The electronic component conveying device of the present invention is characterized by including an inspection area capable of being provided with an inspection section capable of performing a first inspection for inspecting electronic components at a first temperature and performing the first inspection after A second inspection at which the electronic component is inspected at a different second temperature; a first placement region where a first placement portion can be disposed, and the first placement portion can mount the electronic component before the first inspection; and The 2 placement area is located in an area different from the first placement area, and a second placement portion can be disposed on the second placement portion, and the second placement portion can place the electronic components before the second inspection. Thereby, after performing the first inspection on the electronic parts placed on the first placement section in the first placement area, the electronic parts placed on the second placement section in the second placement area can be subjected to the second inspection. an examination. That is, the first inspection and the second inspection with different temperatures can be performed using one electronic component transfer device. As a result, it is possible to omit the operation of the operator after the first inspection to transfer the electronic parts to the second inspection-dedicated electronic parts transfer device. Therefore, errors caused by the operator can be prevented, and the first inspection and the second inspection can be performed quickly. In the electronic component transfer device of the present invention, preferably, the electronic component is transferred from the first placement area to the inspection area, and after the first inspection is performed in the inspection area, the electronic component is transferred to the second placement area. It is transferred from the said 2nd mounting area to the said inspection area, and after carrying out the said 2nd inspection in the said inspection area, it is transferred to the said 1st mounting area. Thereby, the first inspection and the second inspection can be performed with a simple configuration of retrograde the electronic components that are transported to the second placement area after the first inspection is completed. Therefore, the second inspection can be smoothly started after the first inspection is completed. In the electronic component transfer device of the present invention, it is preferable that the direction in which the electronic component is moved into the inspection area in the first route from the first placement area to the inspection area is the same as that from the second In the second path in which the placement area is transported to the inspection area, the direction in which the electronic components are transported into the inspection area is the opposite direction. This allows the electronic component to be transported to the inspection area in the opposite direction during the first inspection and the second inspection. This allows the operator to easily confirm whether to perform the first inspection or the second inspection by visual inspection. In the electronic component transfer device of the present invention, it is preferable to include a first temperature adjustment unit capable of adjusting the temperature of the electronic component in a path in which the electronic component is transferred from the first placing portion to the inspection area; And a second temperature adjustment unit that can adjust the temperature of the electronic component in a path in which the electronic component is transported from the second placement portion to the inspection area. Thereby, before the first inspection, the temperature of the electronic component can be adjusted more reliably, and before the second inspection, the temperature of the electronic component can be adjusted more reliably. In the electronic component transfer device of the present invention, it is preferable that the inspection unit performs the third inspection for inspecting the electronic component at a third temperature different from the first temperature and the second temperature after the second inspection. . Thereby, three types of inspections can be performed on one electronic component transfer device. In the electronic component transfer device of the present invention, it is preferable that the first mounting area can mount the electronic component before the third inspection. Therefore, in the third inspection, it is possible to omit an area separately provided for the electronic components before the third inspection, which is different from the first placement region. Therefore, the device configuration can be simplified. In the electronic component transfer device of the present invention, it is preferable that the electronic component transferred to the first placement area after the second inspection is performed in the inspection area is transferred from the first placement area to the inspection area. After the third inspection for inspecting the electronic component at a third temperature different from the first temperature and the second temperature in the inspection area, the inspection is carried to the second placement area. Thereby, the third inspection can be performed with a simple configuration that reverses the electronic components that have been transported to the first placement area after the second inspection is completed. Therefore, the third inspection can be smoothly started after the second inspection is completed. In the electronic component transfer device of the present invention, it is preferable that the electronic component is moved into the inspection area in the third route of the third inspection from the first placement area to the inspection area, It is the same direction as the direction in which the electronic component is carried into the inspection area in the first route of the first route from the first placement area to the inspection area in the first inspection. This allows the electronic component to be transported to the inspection section in the opposite direction during the second inspection and the third inspection. This allows the operator to easily confirm whether the second inspection or the third inspection is performed visually. In the electronic component transfer device of the present invention, it is preferable that the first temperature is higher than the second temperature. Therefore, in general, defective products are more likely to occur in the first inspection than in the second inspection. Therefore, the first inspection is performed by making the first temperature higher than the second temperature, and the inspection of defective products in the first inspection is omitted in the second inspection, thereby improving inspection efficiency. In the electronic component transfer device of the present invention, the first temperature is preferably higher than room temperature, and the second temperature is preferably room temperature or lower than room temperature. Thereby, the above-mentioned effect can be exhibited more reliably, and inspection efficiency can be improved. In the electronic component transfer device of the present invention, it is preferable that the first temperature is room temperature. This makes it possible to omit heating or cooling of a portion that becomes a room temperature during the first inspection, and to smoothly start the first inspection. In the electronic component transfer device of the present invention, it is preferable that the first temperature is lower than room temperature, and the second temperature is room temperature or higher. Therefore, in general, if the electronic component is directly discharged to the outside of the device after the inspection at a low temperature is completed, the electronic component is likely to be condensed. Therefore, it is possible to prevent or suppress condensation of the electronic components by performing the first inspection with a lower temperature and then the second inspection. In the electronic component transfer device of the present invention, it is preferable to include a third mounting area, and the third mounting area can be arranged to mount the electronics in a region different from the first mounting area and the second mounting area. The third placement part of the part. With this, the third placement portion can be supplemented to the first placement area or the second placement area. Therefore, the level of classification after inspection can be increased. In the electronic component conveying device of the present invention, it is preferable that the third placement portion disposed in the third placement area is capable of being disposed on the first placement portion or disposed in the first placement area. The second mounting portion in the second mounting area moves on the second mounting portion. With this, the third placement portion can be supplemented to the first placement area or the second placement area. Therefore, the level of classification after inspection can be increased. The electronic component inspection device of the present invention includes an inspection unit capable of performing a first inspection for inspecting electronic components at a first temperature and inspecting the electronics at a second temperature different from the first temperature after the first inspection. The second inspection of the parts; the inspection area, which is provided with the inspection section; the first placement area, which can be provided with the first placement section, which can mount the electronic components before the first inspection; And the second mounting area is located in a region different from the first mounting area, and a second mounting portion can be arranged, and the second mounting portion can mount the electronic components before the second inspection. Thereby, after performing the first inspection on the electronic parts placed on the first placement section in the first placement area, the electronic parts placed on the second placement section in the second placement area can be subjected to the second inspection. an examination. That is, the first inspection and the second inspection with different temperatures can be performed by using one electronic component transfer device. As a result, it is possible to omit the operation of the operator after the first inspection to transfer the electronic parts to the second inspection-dedicated electronic parts transfer device. Therefore, errors caused by the operator can be prevented, and the first inspection and the second inspection can be performed quickly. In addition, since the electronic component can be transported to the inspection section, the electronic component can be inspected by the inspection section. In addition, the inspected electronic parts can be transported from the inspection section. The electronic component transfer device of the present invention is characterized by having a transfer portion that transfers electronic components, a placement portion that mounts the electronic components, and a supply line that supplies a fluid that adjusts the temperature of the placement portion to the placement. A discharge line that discharges the fluid from the placement portion; at least one switching valve that is disposed on the supply line and that can pass the supply line through the fluid in an open state and close the state Switching the passage of the fluid through a blocking mode; a detection section arranged on the discharge line and detecting the flow of the fluid passing through the discharge line; and a control section capable of controlling the switching valve; the control section is based on the above The control information of the switching valve and the detection result in the detection unit are used to judge the state of the switching valve. Therefore, when the operator operating the electronic component transfer device confirms the judgment result of the state of the switching valve and knows that the switching valve operates normally, the electronic component transfer using the electronic component transfer device can be performed. On the other hand, when it is known that the operation of the switching valve causes some undesirable conditions, the operator can replace the switching valve with a new switching valve, for example. Thereby, the switching valve can be normally operated, and therefore, the electronic component transfer using the electronic component transfer device can be smoothly performed. In the electronic component transfer device of the present invention, it is preferable that the fluid is a refrigerant that cools the mounting portion. Thereby, the mounting portion can be quickly cooled to a desired target temperature. In the electronic component transfer device of the present invention, it is preferable that the mounting portion is fixed. Thereby, the temperature of the electronic components on the mounting portion can be stably adjusted. In the electronic component conveying apparatus of the present invention, it is preferable that the placing portion is supported so as to be movable. Thereby, the mounting part can stably transport the electronic component from a specific position to another specific position. In the electronic component conveying device of the present invention, it is preferable that the placing portion is configured to be capable of holding the electronic component. Thereby, the mounting part can lift an electronic component, and can carry it directly, for example. In the electronic parts transfer device of the present invention, preferably, the switching valve includes: a first switching valve; and at least one second switching valve, which are arranged further downstream than the first switching valve of the supply line. side. Thereby, for example, it is possible to perform control for appropriately combining the opening and closing of each switching valve of the first switching valve and the second switching valve. In the electronic component conveying device of the present invention, it is preferable that the supply line includes a plurality of branch lines branched downstream from a portion where the first switching valve is disposed, and the above-mentioned each branch line is provided with the above-mentioned 2nd switching valve. Thus, for example, by appropriately combining the opening and closing of each switching valve of the first switching valve and the second switching valve, it is possible to easily select a primary supply of fluid to each mounting portion and a primary supply of fluid to each mounting portion. The supply of the refrigerant to any one of the placement sections is stopped and stopped. In the electronic parts conveying device of the present invention, it is preferable that the control unit performs one of the first switching valve and the second switching valve in a closed state and the other switching valve in an open state to perform the above-mentioned operation. Judge. This makes it possible to appropriately determine whether the operation of the first switching valve is normal or whether the operation of the second switching valve is normal according to the opened and closed states of the first switching valve and the second switching valve. In the electronic component conveying device of the present invention, it is preferable that the control unit sets the first switching valve to a closed state, sets the second switching valve to an open state, and a detection value in the detection unit is set in advance. In the case of a value, the above judgment is made that the operation of the first switching valve is normal. Thereby, an operator who operates the electronic component transfer device can transfer the electronic components using the electronic component transfer device after confirming that the operation of the first switching valve is normal. On the other hand, in a case where the judgment is contrary to this, the operator may replace the first switching valve with a new first switching valve, for example. In the electronic component conveying device of the present invention, it is preferable that the control unit sets the first switching valve to an open state, sets the second switching valve to a closed state, and a detection value in the detecting unit is set in advance. In the case of a value, the above determination is made that the operation of the second switching valve is normal. Thereby, the operator who operates the electronic component transfer device can confirm that the operation of the second switching valve is normal, and then transfer the electronic components using the electronic component transfer device. On the other hand, in a case where the judgment is made to the contrary, the operator may replace the second switching valve with a new second switching valve, for example. In the electronic parts conveying device of the present invention, it is preferable that the control unit sets the first switching valve to an open state and causes one of the second switching valves among the second switching valves arranged on each branch line When the second switching valve is in an open state and the remaining second switching valve is in a closed state, and when the detection value of the detecting section is a preset value, the operation of the second switching valve that is in the open state is normal. The above judgment. Thereby, an operator who operates the electronic component transfer device can transfer the electronic components using the electronic component transfer device after confirming that the operation of the second switching valve is normal. On the other hand, in a case where the judgment is made to the contrary, the operator may replace the second switching valve with a new second switching valve, for example. In the electronic component conveying device of the present invention, it is preferable that the switching valve is opened to allow the fluid to pass through when the power is turned on, and is shut off to shut off the fluid when the power is turned off. Thereby, for example, when the environment where the electronic component transfer device is used is in a power outage, the fluid is blocked, so that continuous supply of the fluid can be prevented. In the electronic component transfer device of the present invention, it is preferable that the detection unit is configured by a pressure gauge that detects a pressure of the fluid passing through the discharge line or a flow meter that detects a flow rate of the fluid passing through the discharge line. This makes it possible to easily grasp the flow state of the fluid passing through the discharge line with a simple configuration, that is, to what extent the fluid flows. The electronic component inspection device of the present invention is characterized by having a conveying section for conveying electronic components, a placing section for placing the electronic components, and a supply line for supplying a fluid that adjusts the temperature of the placing section to the placing. A discharge line that discharges the fluid from the placement portion; at least one switching valve that is disposed on the supply line and that can pass the supply line through the fluid in an open state and close the state The passage of the fluid is switched by blocking; the detection unit is arranged on the discharge line and detects the flow of the fluid passing through the discharge line; the control unit can control the switching valve; and the inspection unit can inspect The electronic component; the control unit determines the state of the switching valve based on the control information of the switching valve and a detection result in the detecting unit. Accordingly, an operator operating the electronic component inspection device can perform an inspection of the electronic components using the electronic component inspection device when it is confirmed that the judgment result of the state of the switching valve is that the operation of the switching valve is normal. On the other hand, the operator may replace the switching valve with a new switching valve, for example, when the switching valve operates in some undesirable situations. Thereby, the switching valve can be normally operated, and therefore, the inspection of the electronic parts using the electronic parts inspection device can be performed smoothly. In addition, since the electronic component can be transported to the inspection unit, the electronic component can be inspected by the inspection unit. In addition, electronic parts after inspection can be transported from the inspection section.

以下，基於隨附圖式所示之較佳之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置詳細地進行說明。＜第1實施形態＞以下，參照圖1～圖6，對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明。再者，以下，為了方便說明，如圖1～圖4(關於圖7、圖8、圖11～圖14亦相同)所示，將互相正交之3個軸設為X軸、Y軸、Z軸。又，包含X軸與Y軸之XY平面成為水平，Z軸成為鉛垂。又，將與X軸平行之方向亦稱為「X方向(第1方向)」，將與Y軸平行之方向亦稱為「Y方向(第2方向)」，將與Z軸平行之方向亦稱為「Z方向(第3方向)」。又，將各方向之箭頭所朝向之方向稱為「正」，將其相反方向稱為「負」。又，於本案說明書中所言之「水平」並不限定於完全之水平，只要不阻礙電子零件之搬送，亦包含相對於水平傾斜若干(例如，未達5°左右)之狀態。又，有時將圖1之上側稱為「上」或「上方」，將下側稱為「下」或「下方」。圖1及圖2所示之電子零件搬送裝置10包括：檢查區域A3，其能夠配置檢查部16，該檢查部16能夠進行以第1溫度檢查作為電子零件之IC器件90之第1檢查，及於第1檢查之後以與第1溫度不同之第2溫度檢查IC器件90之第2檢查；作為第1載置區域之第1托盤供給去除區域A1，其能夠配置作為第1載置部之托盤200，該托盤200能夠載置第1檢查之前之IC器件90；及作為第2載置區域之第2托盤供給去除區域A5，其位於與第1托盤供給去除區域A1不同之區域，且能夠配置作為第2載置部之托盤200，該托盤200能夠載置第2檢查之前之IC器件90。藉此，可於對載置於第1托盤供給去除區域A1之托盤200之IC器件90進行第1檢查之後，對載置於第2托盤供給去除區域A5之托盤200之IC器件90進行第2檢查。即，可利用1個電子零件搬送裝置10，進行溫度互不相同之第1檢查及第2檢查。其結果，可省略操作員於第1檢查後將IC器件90搬送至第2檢查專用之電子零件搬送裝置之作業。因此，可防止由操作員所引起之錯誤，並且可迅速地進行第1檢查及第2檢查。又，電子零件檢查裝置1包括：檢查區域A3，其配置有檢查部16，該檢查部16能夠進行以第1溫度檢查作為電子零件之IC器件90之第1檢查，及於第1檢查之後以與第1溫度不同之第2溫度檢查IC器件90之第2檢查；作為第1載置區域之第1托盤供給去除區域A1，其能夠配置作為第1載置部之托盤200，該托盤200能夠載置第1檢查之前之IC器件90；及作為第2載置區域之第2托盤供給去除區域A5，其位於與第1托盤供給去除區域A1不同之區域，且能夠配置作為第2載置部之托盤200，該托盤200能夠載置第2檢查之前之IC器件90。藉此，獲得具有上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將IC器件90搬送至檢查部16，因此，可利用檢查部16對IC器件90進行檢查。又，可自檢查部16搬送檢查後之IC器件90。以下，對各部之構成進行說明。如圖1及圖2所示，內置電子零件搬送裝置10之電子零件檢查裝置1例如係搬送作為BGA(Ball Grid Array，球柵陣列)封裝之IC器件等電子零件，且於該搬送過程對電子零件之電氣特性進行檢查、測試(以下僅稱為「檢查」)之裝置。再者，以下，為了方便說明，作為上述電子零件，以使用IC器件之情形為代表進行說明，將其設為「IC器件90」。IC器件90係於本實施形態中呈平板狀者。再者，作為IC器件，除了上述者以外，例如可列舉「LSI(Large Scale Integration，大規模積體電路)」「CMOS(Complementary MOS，互補金氧半導體)」「CCD(Charge Coupled Device，電荷耦合器件)」或將複數個IC器件模組封裝化而成之「模組IC」、又「晶體器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺儀感測器」、及「指紋感測器」等。又，電子零件檢查裝置1(電子零件搬送裝置10)係預先搭載針對IC器件90之每一種類更換之被稱為「更換套組」者而使用。於該更換套組存在載置IC器件90之載置部，作為該載置部，例如存在下述之溫度調整部12、第1器件供給回收部14等。又，作為載置IC器件90之載置部，與如上所述之更換套組不同，亦存在使用者準備之檢查部16或托盤200。電子零件檢查裝置1具備第1托盤供給去除區域A1、搬送有器件之第1器件搬送區域(以下僅稱為「第1器件搬送區域」)A2、檢查區域A3、搬送有器件之第2器件搬送區域(以下僅稱為「第2器件搬送區域」)A4、及第2托盤供給去除區域A5，該等區域如下所述由各壁部劃分。而且，IC器件90係自第1托盤供給去除區域A1至第2托盤供給去除區域A5為止按照箭頭α90 方向依次經過上述各區域，於中途之檢查區域A3進行檢查。如此，電子零件檢查裝置1具備：作為電子零件搬送裝置10之處理器，其於各區域搬送IC器件90；檢查部16，其於檢查區域A3內進行檢查；及控制部800。又，另外，電子零件檢查裝置1具備監視器300、信號燈400、及操作面板700。再者，電子零件檢查裝置1係將配置有第1托盤供給去除區域A1及第2托盤供給去除區域A5之側，即圖2中之下側設為正面側，將配置有檢查區域A3之側，即圖2中之上側設為背面側而使用。又，電子零件檢查裝置1係進行作為第1檢查之常溫檢查、作為第2檢查之低溫檢查、及作為第3檢查之高溫檢查者，以下，列舉進行作為第1檢查之常溫檢查之狀態為例進行說明。第1托盤供給去除區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200之區域。於第1托盤供給去除區域A1中，可堆積多個托盤200。第1器件搬送區域A2係將自第1托盤供給去除區域A1搬送之托盤200上之複數個IC器件90分別搬送、供給至檢查區域A3之區域。再者，以跨第1托盤供給去除區域A1與第1器件搬送區域A2之方式，設置有將托盤200一片片地於水平方向搬送之托盤搬送機構11。托盤搬送機構11係可使托盤200連同載置於托盤200之IC器件90一起於Y方向，即圖2中之箭頭α11 方向往返移動之移動部。藉此，可將IC器件90穩定地送入至第1器件搬送區域A2，並且可使空的托盤200自第1器件搬送區域A2移動至第1托盤供給去除區域A1。於第1器件搬送區域A2，設置有溫度調整部(均溫板(英文表述：soak plate，中文表述(一例)：均溫板))12及器件搬送頭13。溫度調整部12係作為能夠於將IC器件(電子零件)90自作為第1載置部之托盤200搬送至檢查區域A3之路徑中，調整IC器件90之溫度之第1溫度調整部而發揮功能。該溫度調整部12被稱為可將所載置之IC器件90一次加熱或冷卻之「均溫板」。藉由該均溫板，可將於檢查部16進行檢查之前之IC器件90預先加熱或冷卻而調整為適合於檢查之溫度。而且，藉由托盤搬送機構11而自第1托盤供給去除區域A1搬入之托盤200上之IC器件90被搬送至溫度調整部12。再者，藉由作為該載置部之溫度調整部12固定，可於溫度調整部12上對IC器件90穩定地進行溫度調整。器件搬送頭13具有以於第1器件搬送區域A2內能夠於X方向及Y方向移動地被支持，進而亦能夠於Z方向移動之部分。藉此，器件搬送頭13可擔負自第1托盤供給去除區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與下述第1器件供給回收部14之間之IC器件90之搬送。再者，於圖2中，將器件搬送頭13之X方向之移動以箭頭α13X 表示，將器件搬送頭13之Y方向之移動以箭頭α13Y 表示。檢查區域A3係檢查IC器件90之區域。於該檢查區域A3，設置有對IC器件90進行檢查之檢查部16及器件搬送頭17。又，亦設置有以跨第1器件搬送區域A2與檢查區域A3之方式移動之第1器件供給回收部14，及以跨檢查區域A3與第2器件搬送區域A4之方式移動之第2器件供給回收部18。第1器件供給回收部14係作為載置由溫度調整部12進行了溫度調整之IC器件90之載置部而構成，且係被稱為可將IC器件90搬送至檢查部16附近之「梭子板」或僅稱為「梭子」。又，作為該載置部之第1器件供給回收部14係以能夠於第1器件搬送區域A2與檢查區域A3之間沿著X方向，即箭頭α14 方向往返移動地被支持。藉此，第1器件供給回收部14可將IC器件90自第1器件搬送區域A2穩定地搬送至檢查區域A3之檢查部16附近，又，可於在檢查區域A3藉由器件搬送頭17取走IC器件90之後再次返回至第1器件搬送區域A2。於圖2所示之構成中，第1器件供給回收部14係於Y方向配置有2個，溫度調整部12上之IC器件90被搬送至任一第1器件供給回收部14。又，第1器件供給回收部14係與溫度調整部12相同地，以能夠將載置於第1器件供給回收部14之IC器件90加熱或冷卻地構成。藉此，可對由溫度調整部12進行了溫度調整之IC器件90維持其溫度調整狀態搬送至檢查區域A3之檢查部16附近。器件搬送頭17係固持維持上述溫度調整狀態之IC器件90，且將IC器件90於檢查區域A3內搬送之動作部。該器件搬送頭17係以於檢查區域A3內能夠於Y方向及Z方向往返移動地被支持，且成為被稱為「指標桿」之機構之一部分。藉此，器件搬送頭17可將自第1器件搬送區域A2搬入之第1器件供給回收部14上之IC器件90搬送、載置至檢查部16上。再者，於圖2中，將器件搬送頭17之Y方向之往返移動由箭頭α17Y 表示。又，器件搬送頭17以能夠於Y方向及Z方向往返移動地被支持，但並不限定於此，亦能以亦能夠於X方向往返移動地被支持。再者，該器件搬送頭17可於Y方向劃分為2個，可自+Y方向側劃分為器件搬送頭17A及器件搬送頭17B。該等器件搬送頭17A及器件搬送頭17B亦可於Z方向互相獨立地移動。又，器件搬送頭17係以能夠將所固持之IC器件90加熱或冷卻地構成。藉此，可將IC器件90之溫度調整狀態自第1器件供給回收部14持續維持至檢查部16為止。檢查部16係作為載置部而構成，載置作為電子零件之IC器件90而檢查IC器件90之電氣特性。於該檢查部16設置有與IC器件90之端子電性地連接之複數個探針接腳。而且，藉由IC器件90之端子與探針接腳電性地連接，即接觸，可進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之測試機所具備之檢查控制部中所記憶之程式而進行。再者，亦可利用檢查部16將IC器件90加熱或冷卻，調整為適合於檢查IC器件90之溫度。第2器件供給回收部18係作為載置部而構成，被稱為「回收用梭子板」或僅稱為「回收梭子」，其可載置利用檢查部16結束檢查之IC器件90，並將IC器件90搬送至第2器件搬送區域A4為止。又，第2器件供給回收部18係以能夠於檢查區域A3與第2器件搬送區域A4之間沿著X方向，即箭頭α18 方向往返移動地被支持。又，於圖2所示之構成中，第2器件供給回收部18係與第1器件供給回收部14相同地，於Y方向配置有2個，檢查部16上之IC器件90被搬送、載置至任一第2器件供給回收部18。該搬送係藉由器件搬送頭17而進行。第2器件搬送區域A4係將於檢查區域A3中檢查且該檢查結束之複數個IC器件90回收之區域。於該第2器件搬送區域A4設置有器件搬送頭20、托盤搬送機構22、及溫度調整部15。又，於第2器件搬送區域A4亦準備有空的托盤200。器件搬送頭20係具有以於第2器件搬送區域A4內能夠於X方向及Y方向移動地被支持，進而亦能夠於Z方向移動之部分。藉此，器件搬送頭20可將IC器件90自第2器件供給回收部18搬送至空的托盤200。再者，於圖2中，將器件搬送頭20之X方向之移動由箭頭α20X 表示，將器件搬送頭20之Y方向之移動由箭頭α20Y 表示。又，空的托盤200係沿著X方向而配置有3個。該空的托盤200亦成為載置利用檢查部16進行了檢查之IC器件90之載置部。而且，移動至第2器件搬送區域A4之第2器件供給回收部18上之IC器件90被搬送、載置至空的托盤200中之任一者。藉此，IC器件90係針對各檢查結果分類、回收。溫度調整部15係作為能夠於將IC器件(電子零件)90自作為第2載置部之托盤200搬送至檢查區域A3之路徑中調整IC器件90之溫度的第2溫度調整部而發揮功能。該溫度調整部15被稱為可將所載置之IC器件90一次加熱或冷卻之「均溫板」。藉由該均溫板，可將於檢查部16中進行下述第2檢查之前之IC器件90預先冷卻，調整為適合於第2檢查之溫度。第2托盤供給去除區域A5係將排列有檢查完畢狀態之複數個IC器件90之托盤200回收、去除之除材部。於第2托盤供給去除區域A5中可堆積多個托盤200。又，以跨第2器件搬送區域A4與第2托盤供給去除區域A5之方式，設置有將托盤200一片一片地於Y方向搬送之托盤搬送機構22。托盤搬送機構22係可使托盤200於Y方向，即箭頭α22 方向往返移動之移動部。藉此，可將檢查完畢之IC器件90自第2器件搬送區域A4搬送至第2托盤供給去除區域A5，並且可使空的托盤200自第2托盤供給去除區域A5移動至第2器件搬送區域A4。控制部800例如可控制托盤搬送機構11、溫度調整部12、器件搬送頭13、第1器件供給回收部14、溫度調整部15、檢查部16、器件搬送頭17、第2器件供給回收部18、器件搬送頭20、及托盤搬送機構22等各部之作動。又，控制部800如圖1所示，具有記憶部801。於該記憶部801記憶有檢查程式等，控制部800可基於該檢查程式而進行檢查。此種記憶部801例如由RAM(Random Access Memory，隨機存取記憶體)等揮發性記憶體、ROM(Read Only Memory，唯讀記憶體)等非揮發性記憶體、EPROM(erasable programmable read only memory，可抹除可程式化唯讀記憶體)、EEPROM(Electrically Erasable Programmable Read Only Memory，電子可擦可程式化唯讀記憶體)、快閃記憶體等能夠覆寫(能夠刪除、覆寫)之非揮發性記憶體等各種半導體記憶體(IC記憶體)等而構成。操作員可經由監視器300而設定或確認電子零件檢查裝置1之動作條件等。該監視器300例如具有由液晶畫面構成之顯示畫面301，且配置於電子零件檢查裝置1之正面側上部。如圖1所示，於第2托盤供給去除區域A5之圖中之右側設置有載置滑鼠之滑鼠台600。該滑鼠係於對顯示於監視器300之畫面進行操作時使用。下述第1檢查、第2檢查、及第3檢查之選擇係可一面觀察該監視器300之畫面一面設定。又，相對於監視器300而於圖1之右下方配置有操作面板700。操作面板700係與監視器300不同，對電子零件檢查裝置1命令所期望之動作者。又，信號燈400可藉由所發光之顏色之組合而報告電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。再者，於電子零件檢查裝置1內置有揚聲器500，亦可藉由該揚聲器500而報告電子零件檢查裝置1之作動狀態等。電子零件檢查裝置1如圖2所示，第1托盤供給去除區域A1與第1器件搬送區域A2之間藉由第1隔壁231而隔開，第1器件搬送區域A2與檢查區域A3之間藉由第2隔壁232而隔開，檢查區域A3與第2器件搬送區域A4之間藉由第3隔壁233而隔開，第2器件搬送區域A4與第2托盤供給去除區域A5之間藉由第4隔壁234而隔開。又，第1器件搬送區域A2與第2器件搬送區域A4之間亦藉由第5隔壁235而隔開。電子零件檢查裝置1係最外裝由外殼覆蓋，於外殼，如圖1所示例如存在前外殼241、側外殼242、側外殼243、後外殼244、及頂外殼245。且說，於先前之電子零件搬送裝置中，於在IC器件90之檢查完成後以不同之溫度進行檢查之情形時，操作員必須將檢查之後之IC器件90搬送至不同之電子零件搬送裝置。於該情形時，有時會產生由操作員所引起之搬送錯誤。又，檢查效率降低操作員搬送IC器件90之時間之量。於本實施形態中，可解決此種問題。以下，對該情況進行說明。再者，於本實施形態中，將常溫(室溫)下之檢查稱為「常溫檢查(第1檢查)」，將低溫下之檢查稱為「低溫檢查(第2檢查)」，將高溫下之檢查稱為「高溫檢查(第3檢查)」。又，於本說明書中，常溫係指15℃以上且未達25℃，低溫係指-55℃以上且未達15˚ ，高溫係指25℃以上且170℃以下。於電子零件搬送裝置10中，如圖5所示之流程圖所示，可將常溫檢查(步驟S101)、低溫檢查(步驟S102)、及高溫檢查(步驟S103)按照該順序連續地進行。首先，對常溫檢查進行說明。於常溫檢查(步驟S101)中，首先，如圖2所示，於第1托盤供給去除區域A1配置載置有IC器件90之托盤200。然後，將IC器件90藉由托盤搬送機構11而連同托盤200一起搬送至第1器件搬送區域A2。繼而，將IC器件90藉由器件搬送頭13而搬送至第1器件供給回收部14上。繼而，將IC器件90藉由第1器件供給回收部14而搬送至檢查區域A3，藉由器件搬送頭17而載置於檢查部16上進行常溫檢查。將結束了常溫檢查之IC器件90藉由器件搬送頭17而載置於第2器件供給回收部18上，搬送至第2器件搬送區域A4。然後，將搬送至第2器件搬送區域A4之IC器件90藉由器件搬送頭20而載置於在第2器件搬送區域A4等待之托盤200上。此時，於第2器件搬送區域A4，於X方向排列配置有3個托盤200，針對常溫檢查之每一等級而分類。作為該等級，例如可自-X方向之托盤200依次設為「合格」、「再檢查」、「不合格」。再者，於圖2中，代表性地圖示有「合格」之IC器件90。將針對托盤200分類之IC器件90藉由托盤搬送機構22而連同托盤200一起搬送至第2托盤供給去除區域A5。以上，對常溫檢查進行說明。如此，第1檢查(常溫檢查)之第1溫度為室溫。即，於電子零件搬送裝置10中，自常溫檢查進行。藉此，可省略調整溫度調整部12及溫度調整部15等之溫度之時間，從而可順利地開始第1檢查。因此，可提高檢查效率。其次，對低溫檢查(步驟S102)進行說明。以下，使用圖3對低溫檢查進行說明，於圖3中，代表性地圖示有常溫檢查之結果為「合格」之IC器件90中之1個。再者，被分類為「再檢查」及「不合格」之IC器件90既可保持載置於第2托盤供給去除區域A5之狀態，亦可藉由操作員排出。又，於圖3中，將搬送IC器件90之路徑由箭頭α90 表示。首先，於搬送IC器件90之前，將圖3中由影線表示之部分，即溫度調整部15、檢查部16、器件搬送頭17、及第2器件供給回收部18調整為適合於低溫檢查之溫度。若溫度調整完成之後，則開始IC器件90之搬送。再者，此時，如圖6之時序圖所示，亦同時進行溫度調整部12之加熱(時間t1 )。如圖3所示，於低溫檢查中，向與常溫檢查為相反側搬送。經過常溫檢查，載置於第2托盤供給去除區域A5之托盤200上之IC器件90連同托盤200一起搬送至第2器件搬送區域A4。然後，將IC器件90載置於溫度調整部15上，設為溫度適合低溫檢查之狀態。將溫度經調整之IC器件90載置於第2器件供給回收部18上搬送至檢查區域A3。然後，藉由器件搬送頭17而搬送至檢查部16上進行低溫檢查。將低溫檢查完成之IC器件90藉由器件搬送頭17而載置於第1器件供給回收部14上，藉由第1器件供給回收部14而搬送至第1器件搬送區域A2。然後，搬送至第1器件搬送區域A2之托盤200上。此時，於第1器件搬送區域A2，於X方向排列配置有3個托盤200，針對低溫檢查之每一等級而分類。作為該等級，與常溫檢查相同地，可自-X方向之托盤200依次設為「合格」、「再檢查」、「不合格」。再者，於圖3中，代表性地圖示有「合格」之IC器件90。以上，對低溫檢查進行了說明。於低溫檢查中，IC器件90係自第1托盤供給去除區域A1搬送至檢查區域A3，於檢查區域A3中進行第1檢查之後搬送至第2托盤供給去除區域A5，自第2托盤供給去除區域A5搬送至檢查區域A3，於檢查區域A3中進行第2檢查之後，搬送至第1托盤供給去除區域A1。藉此，利用使結束第1檢查後搬送至第2托盤供給去除區域A5之IC器件90逆行之簡單之構成，可進行第1檢查及第2檢查。因此，可結束第1檢查之後順利地開始第2檢查。又，於自第1托盤供給去除區域A1搬送至檢查區域A3之第1路徑中IC器件90搬入至檢查區域A3內之方向(參照圖2中箭頭α90 )，與於自第2托盤供給去除區域A5搬送至檢查區域A3之第2路徑中IC器件90搬入至檢查區域A3內之方向(參照圖3中箭頭α90 )為相反方向。藉此，操作員藉由觀察搬送IC器件90之方向，可利用目視容易地確認是進行常溫檢查還是進行低溫檢查。其次，對高溫檢查(步驟S103)進行說明。以下，使用圖4對高溫檢查進行說明，於圖4中，代表性地圖示有低溫檢查之結果為「合格」之IC器件90中之1個。再者，被分類為「再檢查」及「不合格」之IC器件90既可保持載置於第1托盤供給去除區域A1之狀態，亦可藉由操作員而排出。又，於圖4中，將搬送IC器件90之路徑由箭頭α90 表示。首先，於搬送IC器件90之前，將圖4中由影線表示之部分，即檢查部16、器件搬送頭17、及第1器件供給回收部14調整為適合於高溫檢查之溫度。當溫度調整完成之後，開始IC器件90之搬送。再者，如上所述，於低溫檢查結束時，溫度調整部12成為適合於高溫檢查之溫度。藉此，僅將檢查部16、器件搬送頭17、及第1器件供給回收部14加熱，即可開始高溫檢查。即，可省略熱容較大、達到特定溫度要花費時間之溫度調整部12之加熱，從而可迅速地開始高溫檢查。又，如圖6之時序圖所示，當低溫檢查結束之後，停止溫度調整部15之作動(參照圖6中t2 )。藉此可抑制消耗電力。如圖4所示，於高溫檢查中，向與低溫檢查為相反側搬送。即，經過低溫檢查而載置於第1托盤供給去除區域A1之托盤200上之IC器件90被連同托盤200一起搬送至第1器件搬送區域A2。然後，載置於溫度調整部12上而設為溫度適合於高溫檢查之狀態。將溫度經調整之IC器件90搬送至第1器件供給回收部14上，且搬送至檢查區域A3。然後，藉由器件搬送頭17而搬送至檢查部16上進行高溫檢查。將高溫檢查完成之IC器件90藉由器件搬送頭17而搬送至第2器件供給回收部18上，藉由第2器件供給回收部18而搬送至第2器件搬送區域A4。然後，搬送至第2器件搬送區域A4之托盤200上。此時，於第2器件搬送區域A4，於X方向排列配置有3個托盤200，針對高溫檢查之每一等級而分類。作為該等級，與常溫檢查相同，可自-X方向之托盤200依次設為「合格」、「再檢查」、「不合格」。再者，於圖4中，代表性地圖示有「合格」之IC器件90。以上，對高溫檢查進行了說明。於高溫檢查中，作為第1載置區域之第1托盤供給去除區域A1能夠載置作為第3檢查之高溫檢查之前之IC器件(電子零件)90。藉此，於高溫檢查時，可省略與第1托盤供給去除區域A1不同地另外設置供給高溫檢查之前之IC器件90之區域。因此，可使裝置構成簡單。又，檢查部16能夠於作為第2檢查之低溫檢查之後，進行以與常溫(第1溫度)及低溫(第2溫度)不同之高溫(第3溫度)檢查IC器件(電子零件)90之作為第3檢查之高溫檢查，故而可利用1個電子零件搬送裝置10進行3種檢查，檢查之精度提高。於在上述檢查區域A3中進行第2檢查之後，將搬送至第1托盤供給去除區域(第1載置區域)A1之IC器件90自第1托盤供給去除區域A1搬送至檢查區域A3，於檢查區域A3中，進行以與第1溫度及第2溫度不同之第3溫度檢查IC器件90之第3檢查之後，搬送至第2托盤供給去除區域(第2載置區域)A5。藉此，利用使結束第2檢查之後搬送至第1托盤供給去除區域A1之IC器件90逆行之簡單之構成，可進行第3檢查。因此，可於結束第2檢查之後順利地開始第3檢查。又，於在第3檢查中自第1托盤供給去除區域A1搬送至檢查區域A3之第3路徑中IC器件90搬入至檢查區域A3內之方向，與於在第1檢查中自第1托盤供給去除區域A1搬送至檢查區域A3之第1路徑中IC器件90搬入至檢查區域A3內之方向為相同方向。藉此，於在第2檢查中自第2托盤供給去除區域A5搬送至檢查區域A3之第2路徑中IC器件90搬入至檢查區域A3內之方向(參照圖3中箭頭α90 )，與於第3路徑中IC器件90搬入至檢查區域A3內之方向(參照圖4中箭頭α90 )相反，操作員可利用目視容易地確認是進行低溫檢查還是進行高溫檢查。如以上所說明般，根據電子零件搬送裝置10，可不經過操作員之手而連續地自動地進行互不相同之溫度之檢查即常溫檢查(第1檢查)、低溫檢查(第2檢查)、及高溫檢查(第3檢查)。藉此，可省略如先前般1個檢查結束之後操作員將檢查之後之IC器件90搬送至不同之電子零件搬送裝置。因此，可省略由操作員所引起之搬送錯誤，並且可省略操作員搬送IC器件90之時間。其結果，可準確地進行檢查，並且可提高檢查效率。＜第2實施形態＞以下，參照圖7及圖8對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項則省略其說明。本實施形態除了器件搬送頭之構成不同以外，與第1實施形態相同。於本實施形態中，器件搬送頭17中，如圖7所示器件搬送頭17A僅被施以冷卻，如圖8所示，器件搬送頭17B僅被施以加熱。如圖7所示，於低溫檢查時，將溫度調整部15、檢查部16、器件搬送頭17A、及第2器件供給回收部18A冷卻。即，於低溫檢查時，省略器件搬送頭17B及第2器件供給回收部18B之冷卻。藉此，省略器件搬送頭17B及第2器件供給回收部18B之冷卻，從而可相應地抑制消耗電力。再者，於低溫檢查時，如圖7中箭頭α90 所示，IC器件90係經由第2器件供給回收部18A而藉由器件搬送頭17A而搬送。又，如圖8所示，於高溫檢查時，將溫度調整部12、第1器件供給回收部14B、檢查部16、及器件搬送頭17B加熱。即，於高溫檢查時，省略第1器件供給回收部14A及器件搬送頭17A之加熱。藉此，省略第1器件供給回收部14A及器件搬送頭17A之加熱，從而可相應地抑制消耗電力。再者，於高溫檢查時，如圖8中箭頭α90 所示，IC器件90係經由第1器件供給回收部14B，藉由器件搬送頭17B而搬送。＜第3實施形態＞以下，參照圖9對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項則省略其說明。本實施形態除了各檢查之順序不同以外，與第1實施形態相同。如圖9之流程圖所示，於本實施形態中，將作為第1檢查之低溫檢查(步驟S201)、作為第2檢查之常溫檢查(步驟S202)、及作為第3檢查之高溫檢查(步驟S203)按照該順序進行。即，第1檢查之第1溫度低於室溫，第2檢查之第2溫度為室溫或高於室溫。藉由按照此種順序進行各檢查，可獲得如以下之優點。一般而言，若於結束溫度較低之檢查之後，直接將IC器件90向裝置外側排出，則IC器件90容易產生冷凝。因此，藉由先進行溫度較低之第1檢查，然後進行第2檢查，可防止IC器件90保持低溫狀態向裝置外側排出。其結果，可防止或抑制IC器件90產生冷凝。＜第4實施形態＞以下，參照圖10，對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項則省略其說明。本實施形態除了各檢查之順序不同以外，與第1實施形態相同。如圖10之流程圖所示，於本實施形態中，將作為第1檢查之高溫檢查(步驟S301)、作為第2檢查之常溫檢查(步驟S302)、及作為第3檢查之低溫檢查(步驟S303)按照該順序進行。即，第1檢查之第1溫度高於第2檢查之第2溫度。又，第1檢查之第1溫度高於室溫，第2檢查之第2溫度為室溫或低於室溫。藉由按照此種順序進行各檢查，可獲得如以下之優點。一般而言，以較高之溫度進行檢查者較以較低之溫度進行檢查更容易出現不良品。因此，如本實施形態般，藉由自較高之溫度之檢查依序進行，可省略進行先進行之檢查中之「不良品」之IC器件90之檢查。＜第5實施形態＞以下，參照圖11～圖14，對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項則省略其說明。本實施形態除了設置有第3載置區域以外，與第1實施形態相同。如圖11所示，於本實施形態中，電子零件檢查裝置1具備第1托盤供給去除區域A1、第1器件搬送區域A2、檢查區域A3、第2器件搬送區域A4、第2托盤供給去除區域A5、托盤補充區域A6、及托盤等待區域A7。又，電子零件檢查裝置1具備托盤搬送機構31、托盤搬送機構32。托盤補充區域A6係設置於第1托盤供給去除區域A1與第2托盤供給去除區域A5之間。托盤補充區域A6係供給未載置IC器件90之空的補充用之托盤200之第3載置區域。如此，藉由具備托盤補充區域(第3載置區域)A6，如下所述可將托盤200補充至第1托盤供給去除區域A1或第2托盤供給去除區域A5，該托盤補充區域(第3載置區域)A6配置於與第1托盤供給去除區域(第1載置區域)A1及第2托盤供給去除區域(第2載置區域)A5不同之區域(空間)，能夠配置載置IC器件(電子零件)90之作為第3載置部之托盤200。因此，可增加檢查之後之分級之等級。托盤等待區域A7係設置於第1器件搬送區域A2與第2器件搬送區域A4之間。托盤等待區域A7係預先使自托盤補充區域A6供給之托盤200等待之區域。於該等托盤補充區域A6及托盤等待區域A7中，亦可堆積多個托盤200。又，托盤搬送機構31係以跨托盤補充區域A6及托盤等待區域A7之方式設置。該托盤搬送機構31係可使托盤200於Y方向，即圖11中之箭頭α31 方向往返移動之移動部。藉此，可將托盤200穩定地送入至托盤等待區域A7，並且可使托盤200自托盤等待區域A7移動至托盤補充區域A6。又，托盤搬送機構32係以跨第1器件搬送區域A2、托盤等待區域A7、及第2器件搬送區域A4之方式設置。該托盤搬送機構32係可使托盤200於X方向，即圖11中之箭頭α32 方向往返移動之移動部。藉此，可將托盤200穩定地送入至第1器件搬送區域A2或第2器件搬送區域A4，並且可使托盤200自第1器件搬送區域A2或第2器件搬送區域A4移動至托盤等待區域A7。根據此種電子零件搬送裝置10，可獲得如以下之優點。以下，關於該情況，列舉常溫檢查為例進行說明。圖12係表示將結束了常溫檢查之IC器件90針對第2器件搬送區域A4之3個托盤200進行分級而分類之狀態的圖。例如，於針對4個等級「合格1」、「合格2」、「再檢查」、「不合格」而分類之情形時，於第2器件搬送區域A4配置有3個托盤200，1個托盤200不足。再者，於圖12中，作為一例，將配置於第2器件搬送區域A4之3個托盤200設為自-X方向側依次分類為「合格1」、「合格2」、「再檢查」之托盤200。即，於第2器件搬送區域A4中，載置「不合格」之IC器件90之托盤200不足。於該情形時，如圖13中箭頭α200 所示，可將載置「不合格」之IC器件90之托盤200藉由托盤搬送機構32，而自托盤等待區域A7配置(補充)至第2器件搬送區域A4之「合格1」用之托盤200上。因此，如圖14所示，可將「不合格」之IC器件90載置於所補充托盤200上並分類。然後，既可再次使「不合格」用之托盤200自第2器件搬送區域A4退避至托盤等待區域A7，亦可直接配置於第2器件搬送區域A4直至將下一個「合格1」之IC器件90搬送而來為止。再者，於圖示之構成中，使3片托盤200一次於+X方向，以錯開1片托盤之方式移動，但亦一次錯開2片量或3片量。又，亦可為僅搬送1片托盤200之構成。又，「不合格」用之托盤200既可配置於「合格2」用之托盤200上，亦可配置於「再檢查」用之托盤200上。又，即便於進行第2檢查之情形時，亦相同地，可藉由托盤搬送機構32，而自托盤等待區域A7配置(補充)至第1器件搬送區域A2之托盤200中之任一托盤200上。如此，配置於托盤補充區域(第3載置區域)A6之作為第3載置部之托盤200，能夠移動至配置於第1托盤供給去除區域(第1載置區域)A1之作為第1載置部之托盤200、或配置於第2托盤供給去除區域(第2載置區域)A5之作為第2載置部之托盤200上。藉此，可將作為第3載置部之托盤200補充至第1托盤供給去除區域A1或第2托盤供給去除區域A5。因此，可增加檢查之後之分級之等級。＜第6實施形態＞以下，參照圖15對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項則省略其說明。本實施形態除了設置有熱泵以外，與第1實施形態相同。如圖15所示，本實施形態之電子零件搬送裝置10具有加熱部23、冷卻部24、及熱泵25。加熱部23例如由藉由通電而發熱之加熱器構成。加熱部23係內置於圖2所示之溫度調整部12、器件搬送頭13、第1器件供給回收部14、檢查部16、及器件搬送頭17，且對各部進行加熱。冷卻部24例如可設為藉由供給冷媒而進行冷卻之構成。該冷卻部24係內置於溫度調整部15、檢查部16、第2器件供給回收部18、器件搬送頭17、及器件搬送頭20，且將各部冷卻。熱泵25例如可設為具有珀爾帖元件之構成。熱泵25係將於由冷卻部24進行各部之冷卻時產生之排熱供給至加熱部23者。藉此，於加熱部23對各部進行加熱時，可輔助其加熱。因此，可抑制進行加熱時之消耗電力。＜第7實施形態＞以下，參照圖1及圖16～圖26，對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項則省略其說明。再者，以下，為了方便說明，有時將圖16中之上側即Z方向正側稱為「上」或「上方」，將下側即Z方向負側稱為「下」或「下方」。本實施形態之電子零件搬送裝置10係處理器，且具有：如圖16所示，搬送部29，其搬送電子零件；載置部(例如，器件供給部26)，其載置電子零件；如圖17所示，共通路(供給線)56，其將調整載置部之溫度之流體供給至載置部；排出路(排出線)64A，其將流體自載置部排出；至少1個切換閥(第1切換閥54、第2切換閥59A、及第2切換閥59B)，其配置於共通路(供給線)56，且能夠以藉由打開狀態而使共通路(供給線)56能夠通過流體，藉由關閉狀態而將流體之通過阻斷之方式切換；檢測部53，其配置於排出路(排出線)64A，且檢測通過排出路(排出線)64A之流體之流動；及如圖1所示，控制部800，其能夠控制切換閥；控制部800係基於切換閥之控制資訊及檢測部53中之檢測結果，而進行切換閥之狀態之判斷。藉此，如下所述，操作電子零件搬送裝置10之操作員可於確認切換閥之狀態之判斷結果而切換閥之作動正常之情形時，進行利用電子零件搬送裝置10之電子零件之搬送。另一方面，於切換閥之作動產生某些不良情況之情形時，操作員可將該切換閥例如更換為新的切換閥。藉此，切換閥可正常地作動，因此，可順利地進行利用電子零件搬送裝置10之電子零件之搬送。又，如圖16所示，本實施形態之電子零件檢查裝置1具有電子零件搬送裝置10，進而，具有檢查電子零件之檢查部16。即，本實施形態之電子零件檢查裝置1具有：搬送部29，其搬送電子零件；載置部(例如，器件供給部26)，其載置電子零件；共通路56(供給線)，其將調整載置部之溫度之流體供給至載置部；排出路(排出線)64A，其將流體自載置部排出；至少1個切換閥(第1切換閥54、第2切換閥59A、及第2切換閥59B)，其配置於共通路(供給線)56，且能夠以藉由打開狀態而使共通路(供給線)56能夠通過流體，藉由關閉狀態而將流體之通過阻斷之方式切換；檢測部53，其配置於排出路(排出線)64A，且檢測通過排出路(排出線)64A之流體之流動；控制部800，其能夠控制切換閥；及檢查部16，其能夠檢查電子零件；控制部800係基於切換閥之控制資訊及檢測部53中之檢測結果，而進行切換閥之狀態之判斷。藉此，獲得具有上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將電子零件搬送至檢查部16，因此，可利用檢查部16對電子零件進行檢查。又，可將檢查後之電子零件自檢查部16搬送。以下，對各部之構成詳細地進行說明。電子零件檢查裝置1係將配置有托盤供給區域A1及托盤去除區域A5之側，即圖16中之下側作為正面側，將配置有檢查區域A3之側，即圖16中之上側作為背面側而使用。於本實施形態之電子零件檢查裝置1中，載置IC器件(電子零件)90之載置部係設置於複數個部位，例如有下述之溫度調整部12、器件供給部26、及器件回收部28。又，於作為更換套組之載置部(載置IC器件(電子零件)90之載置部)，包含器件搬送頭13之固持IC器件90之部分(固持部)、器件搬送頭17之固持IC器件90之部分(固持部)、及器件搬送頭20之固持IC器件90之部分(固持部)。又，於載置IC器件(電子零件)90之載置部，與如上所述之更換套組不同，亦存在使用者準備之托盤200、回收用托盤19、及檢查部16。於本實施形態中，於各托盤200矩陣狀地配置有複數個凹部(袋狀體)。可將IC器件90一個一個地收納、載置於各凹部。器件供給區域A2係將自托盤供給區域A1搬送之托盤200上之複數個IC器件90分別搬送、供給至檢查區域A3之區域。再者，以跨托盤供給區域A1與器件供給區域A2之方式，設置有將托盤200一片一片地於水平方向搬送之托盤搬送機構11A、11B。托盤搬送機構11A係搬送部29之一部分，可使托盤200連同載置於該托盤200之IC器件90一起向Y方向之正側，即圖16中之箭頭α11A 方向移動。藉此，可將IC器件90穩定地送入至器件供給區域A2。又，托盤搬送機構11B係可使空的托盤200向Y方向之負側，即圖16中之箭頭α11B 方向移動之移動部。藉此，可使空的托盤200自器件供給區域A2移動至托盤供給區域A1。於器件供給區域A2，亦設置有以跨器件供給區域A2與檢查區域A3之方式移動之器件供給部26。冷卻單元900除了溫度調整部12以外，亦能夠進行上述各載置部(例如，需要溫度調整之器件供給部26、器件搬送頭17之固持部、及檢查部16)所載置之IC器件90之冷卻。溫度調整部12接地(ground)。於圖16所示之構成中，溫度調整部12係於Y方向配置及固定有2個。而且，藉由托盤搬送機構11A而自托盤供給區域A1搬入之托盤200上之IC器件90被搬送至任一溫度調整部12。器件搬送頭13係具有固持IC器件90之固持部，且以於器件供給區域A2內能夠於X方向及Y方向移動地被支持，進而以亦能夠於Z方向移動地被支持。該器件搬送頭13亦係搬送部29之一部分，可擔負自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與下述器件供給部26之間之IC器件90之搬送。再者，於圖16中，將器件搬送頭13之X方向之移動由箭頭α13X 表示，將器件搬送頭13之Y方向之移動由箭頭α13Y 表示。器件供給部26係載置由溫度調整部12進行了溫度調整之IC器件90之載置部，且係被稱為可將IC器件90搬送至檢查部16附近之「供給用梭子板」或僅稱為「供給梭子」。該器件供給部26亦可成為搬送部29之一部分。又，作為載置部之器件供給部26係以能夠於器件供給區域A2與檢查區域A3之間沿著X方向，即箭頭α14 方向而往返移動(能夠移動)地被支持。藉此，器件供給部26可將IC器件90自器件供給區域A2穩定地搬送至檢查區域A3之檢查部16附近，又，可於在檢查區域A3中藉由器件搬送頭17取走IC器件90之後再次返回至器件供給區域A2。於圖16所示之構成中，器件供給部26係於Y方向配置有2個，有時將Y方向負側之器件供給部26稱為「器件供給部26A」，將Y方向正側之器件供給部26稱為「器件供給部26B」。而且，溫度調整部12上之IC器件90係於器件供給區域A2內搬送至器件供給部26A或器件供給部26B。又，器件供給部26係與溫度調整部12相同，以能夠將載置於器件供給部26之IC器件90冷卻地構成。藉此，可對由溫度調整部12進行了溫度調整之IC器件90維持其溫度調整狀態而搬送至檢查區域A3之檢查部16附近。再者，器件供給部26亦與溫度調整部12相同，亦能以能夠對IC器件90進行加熱地構成。又，器件供給部26亦與溫度調整部12相同接地。托盤搬送機構27係將去除了所有IC器件90之狀態之空的托盤200於器件供給區域A2內向X方向之正側，即箭頭α15 方向搬送之機構。而且，於該搬送後，空的托盤200係藉由托盤搬送機構11B而自器件供給區域A2返回至托盤供給區域A1。器件搬送頭17係搬送部29之一部分，且與溫度調整部12相同，以能夠將所固持之IC器件90冷卻地構成。該器件搬送頭17具有固持部(載置部)。固持部(載置部)係以能夠固持IC器件(電子零件)90地構成。藉此，可固持經維持上述溫度調整狀態之IC器件90，維持上述溫度調整狀態而將IC器件90於檢查區域A3內搬送。器件搬送頭17可從自器件供給區域A2搬入之器件供給部26抬升IC器件90，搬送並載置至檢查部16。再者，於圖16所示之構成中，器件搬送頭17係於Y方向配置有2個，有時將Y方向負側之器件搬送頭17稱為「器件搬送頭17A」，將Y方向正側之器件搬送頭17稱為「器件搬送頭17B」。器件搬送頭17A係可擔負於檢查區域A3內IC器件90之自器件供給部26A向檢查部16之搬送，器件搬送頭17B係可擔負於檢查區域A3內IC器件90之自器件供給部26B向檢查部16之搬送。於器件回收區域A4設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又，亦設置有以跨檢查區域A3與器件回收區域A4之方式移動之器件回收部28。又，於器件回收區域A4，亦準備有空的托盤200。該器件回收部28亦可成為搬送部29之一部分。又，器件回收部28係以能夠於檢查區域A3與器件回收區域A4之間沿著X方向，即箭頭α18 方向而往返移動地被支持。又，於圖16所示之構成中，器件回收部28係與器件供給部26相同，於Y方向配置有2個，有時將Y方向負側之器件回收部28稱為「器件回收部28A」，將Y方向正側之器件回收部28稱為「器件回收部28B」。而且，檢查部16上之IC器件90被搬送、載置至器件回收部28A或器件回收部28B。再者，IC器件90之自檢查部16向器件回收部28A之搬送係由器件搬送頭17A擔負，自檢查部16向器件回收部28B之搬送係由器件搬送頭17B擔負。又，器件回收部28亦與溫度調整部12或器件供給部26相同接地。回收用托盤19係載置由檢查部16進行了檢查之IC器件90之載置部，且被以於器件回收區域A4內不移動之方式固定。藉此，即便為相對較多地配置有器件搬送頭20等各種可動部之器件回收區域A4，亦會於回收用托盤19上穩定地載置檢查完畢之IC器件90。再者，於圖16所示之構成中，回收用托盤19係沿著X方向配置有3個。托盤搬送機構21係將自托盤去除區域A5搬入之空的托盤200於器件回收區域A4內向X方向，即箭頭α21 方向搬送之機構。而且，於該搬送後，空的托盤200會配置於回收IC器件90之位置，即，可成為上述3個空的托盤200中之任一者。又，以跨器件回收區域A4與托盤去除區域A5之方式，設置有將托盤200一片一片地於Y方向搬送之托盤搬送機構22A、托盤搬送機構22B。托盤搬送機構22A係搬送部29之一部分，且係可使托盤200於Y方向，即箭頭α22A 方向往返移動之移動部。藉此，可將檢查完畢之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B係可使用以回收IC器件90之空的托盤200向Y方向之正側，即箭頭α22B 方向移動。藉此，可將空的托盤200自托盤去除區域A5移動至器件回收區域A4。控制部800例如可控制托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部26、托盤搬送機構27、檢查部16、器件搬送頭17、器件回收部28、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B之作動。又，控制部800此外亦可控制冷卻單元900之各部(例如，第1切換閥54、第2切換閥59A、第2切換閥59B、及檢測部53等)之作動。如圖17所示，電子零件檢查裝置1(電子零件搬送裝置10)具有冷卻單元900。冷卻單元900係作為將載置部與IC器件90一起冷卻(溫度調整)之冷卻構件(溫度調整構件)而發揮功能，作為該載置部，可列舉溫度調整部12、器件供給部26、器件搬送頭17之固持部、及檢查部16。以下，對於在器件供給部26之冷卻代表性地進行說明。再者，器件供給部26係作為一例，成為具有凹部(袋狀體)141、及凹部(袋狀體)142者。於凹部141與凹部142，可分別收納及載置一片IC器件90。又，冷卻單元900既可進行溫度調整部12、器件供給部26、器件搬送頭17之固持部、及檢查部16中之所有載置部之溫度調整，亦可自該等載置部中選擇至少1個載置部，進行該所選擇之載置部之溫度調整。於進行所有載置部之溫度調整之情形時，各載置部之溫度既可相同，亦可不同。冷卻單元900可調整分別收納於凹部141及凹部142之IC器件90之溫度。例如，冷卻單元900能以作為低溫檢查用之溫度即第1目標溫度成為-45℃之方式進行調整。又，例如，冷卻單元900能以作為高於第1目標溫度之第2目標溫度成為18℃(常溫)之方式進行調整。當然，各目標溫度並不限定於此，可設定為任意之溫度。於冷卻單元900中，於儲藏箱55儲藏有調整載置於器件供給部(載置部)26之IC器件90之溫度之流體。該流體係將器件供給部(載置部)26連同IC器件90一起冷卻之冷媒，作為該冷媒，例如可使用液體氮。藉此，可迅速地冷卻至第1目標溫度。於儲藏箱55連接有主要由管路(送液管或送氣管)而構成之共通路56。共通路56係將調整載置於器件供給部(載置部)26之IC器件90之溫度之冷媒(流體)供給至器件供給部(載置部)26的供給線。再者，共通路56較佳為管路之外周配設有隔熱材料(未圖示)。又，關於以下所述之第1供給路57A及第1供給路57B亦與共通路56相同。於共通路56之中途配置有第1切換閥54。第1切換閥54係可取打開狀態與關閉狀態，即能夠開閉之閥，且係可藉由其開閉而切換冷媒之供給與該供給之停止之總開關。共通路(供給線)56具有於較配置有第1切換閥54之部分更靠下游側，分支為複數個(於圖17所示之構成中為2個)之分支線，即，分支為第1供給路57A與第1供給路57B。第1供給路57A係連接於以通過凹部141之正下方之方式形成於器件供給部26之介質流路58A之流入端EnA。於第1供給路57A之中途配置有第2切換閥59A，該第2切換閥59A係可取打開狀態與關閉狀態，即能夠開閉之閥，且可藉由其開閉而控制冷媒對介質流路58A之供給量。第1供給路57B係具有與第1供給路57A大致相等之流路截面面積之配管，且連接於以通過凹部142之正下方之方式形成於器件供給部26之介質流路58B之流入端EnB。於第1供給路57B之中途配置有第2切換閥59B，該第2切換閥59B係可取打開狀態與關閉狀態，即能夠開閉之閥，且可藉由該開閉而控制冷媒對介質流路58B之供給量。如以上般，於共通路(供給線)56配置有以能夠切換於該共通路(供給線)56中之冷媒(流體)之通過與阻斷地作動的複數個切換閥。而且，該切換閥包含如上所述能夠開閉之第1切換閥54，及配置於較共通路(供給線)56之第1切換閥54更靠下游側，如上所述能夠開閉之至少1個第2切換閥，即，於本實施形態中為第2切換閥59A及第2切換閥59B。又，如上所述，共通路(供給線)56具有於較配置有第1切換閥54之部分更靠下游側分支為2個(複數個)之分支線。而且，於各分支線，即於第1供給路57A配置有第2切換閥59A，於第1供給路57B配置有第2切換閥59B。根據此種構成，藉由適當組合例如第1切換閥54、第2切換閥59A、及第2切換閥59B之各切換閥之開閉，可容易地選擇冷媒對凹部141及凹部142之兩者之一次供給、冷媒對凹部141及凹部142之兩者之一次供給停止、冷媒向凹部141及凹部142中之任一者之供給。再者，共通路56於圖17所示之構成中，與器件供給部26所具有之凹部之數量(凹部141及凹部142)對應而分支為2個，但並不限定於此。例如，於器件供給部26所具有之凹部之數量為1個之情形時，省略共通路56中之分支，於較第1切換閥54更靠下游側配置1個第2切換閥。又，於器件供給部26所具有之凹部之數量為3個以上之情形時，共通路56中之分支數量亦成為3個以上，於較第1切換閥54更靠下游側，配置與分支數量相同數量之第2切換閥。又，於本實施形態中，冷卻單元900中之流體迴路之構成(例如，共通路56、第1供給路57A、及第1供給路57B之各管路等之配置圖案或第1切換閥54、第2切換閥59A、及第2切換閥59B之各切換閥之種類、配置、及設置數量等)並不限定於圖17所示者。第1切換閥54、第2切換閥59A、及第2切換閥(切換閥)59B係成為所謂「常閉型」者，其於通電時成為打開狀態而能夠使冷媒(流體)通過，於非通電時成為關閉狀態而進行冷媒(流體)之阻斷。藉此，於例如使用電子零件檢查裝置1之環境成為停電之情形時，冷媒被阻斷，因此，可防止冷媒白白地持續供給。較第1供給路57A之配置有第2切換閥59A之部分更靠下游側、與較第1供給路57B之配置有第2切換閥59B之部分更靠下游側共有氣化容器60。氣化容器60內被隔開為流路截面面積較第1供給路57A及第1供給路57B更大之氣化室61A與氣化室61B。通過第1供給路57A而來之液體氮流入於氣化室61A，通過第1供給路57B而來之液體氮流入於氣化室61B。分別流入至氣化室61A及氣化室61B之液體氮成為溫度低於第1目標溫度之氮氣而自氣化容器60流出。而且，成為氮氣之冷媒可流入至介質流路58A而將凹部141內冷卻，並且可流入至介質流路58B而將凹部142內冷卻。又，於器件供給部26之內部，於凹部141之正下方設置有加熱器62A，於凹部142之正下方設置有加熱器62B。加熱器62A可將凹部141內加熱，加熱器62B可將凹部142內加熱。而且，藉由利用通過介質流路58A之氮氣之冷卻與利用加熱器62A之加熱，而將凹部141內，即載置於凹部141之IC器件90控制為第1目標溫度。相同地，藉由利用通過介質流路58B之氮氣之冷卻與利用加熱器62B之加熱，而將凹部142內，即載置於凹部142之IC器件90控制為第1目標溫度。又，於凹部141設置有檢測凹部141內之溫度之溫度感測器63A，於凹部142設置有檢測凹部142內之溫度之溫度感測器63B。於介質流路58A之流出端ExA，連接有將來自器件供給部(載置部)26之凹部141側之冷媒(流體)排出之作為排出線之排出路64A。排出路64A係連接於具有收納器件供給部26之空間之作為收納容器之收納盒50，且將自介質流路58A排出之冷媒(氮氣)導入至收納盒50。又，於介質流路58B之流出端ExB，連接有將來自器件供給部(載置部)26之凹部142側之冷媒(流體)排出之排出路(排出線)64B。排出路64B係利用連接部65連接於排出路64A，且將自介質流路58B排出之冷媒(氮氣)排出至排出路64A。於排出路64A，於較與排出路64B之連接部65更靠上游側配置有止回閥66A，該止回閥66A容許氣體自介質流路58A向連接部65之流動，且抑止冷媒(氮氣)自連接部65向介質流路58A之流動。相同地，於排出路64B，於較與排出路64A之連接部65更靠上游側配置有止回閥66B，該止回閥66B容許冷媒(氮氣)自介質流路58B向連接部65之流動，且抑止冷媒(氮氣)自連接部65向介質流路58B之流動。藉由設置此種止回閥66A及止回閥66B，例如可防止自介質流路58A排出之冷媒於排出路64B回流而流入至介質流路58B，與自介質流路58B排出之冷媒於排出路64A回流而流入至介質流路58A。又，於排出路64A，於較與排出路64B之連接部65更靠下游側配置有作為加熱部之熱交換器67。熱交換器67係所謂板式熱交換器，且連接有排出路64A、及供給來自乾燥空氣供給源69之乾燥空氣即淨化空氣之淨化空氣供給路70。於熱交換器67中，於排出路64A流通之冷媒、與於淨化空氣供給路70流通之淨化空氣成為並行流，於該等冷媒與淨化空氣之間進行熱交換。又，於排出路64A，於熱交換器67之下游側配置有止回閥68，該止回閥68容許氣體自熱交換器67向收納盒50之流動，且抑止氣體自收納盒50向熱交換器67之回流。藉由設置此種止回閥68，可抑制水分含量較冷媒(氮氣)更多之空氣自收納盒50通過排出路64A流入至熱交換器67、介質流路58A、介質流路58B、及氣化容器60。其結果，於將第2切換閥59A及第2切換閥59B再次控制為打開狀態時，可抑制於處於較止回閥68更靠上游側之熱交換器67或介質流路58A、介質流路58B、及氣化容器60等冷媒(氮氣)之流通路徑中產生冷凝或結冰。又，於較排出路(排出線)64A之止回閥68更靠下游側，配置有檢測通過排出路(排出線)64A之冷媒(流體)之流動之狀態(例如，壓力或流量等)的檢測部53。該檢測部53由檢測通過排出路(排出線)64A之冷媒(流體)之壓力之壓力計(壓力感測器)531、或檢測通過排出路(排出線)64A之冷媒(流體)之流量之流量計(流量感測器)532(參照圖27)而構成。於圖17所示之構成中，檢測部53由壓力計531構成。藉由使用壓力計531，可利用簡單之構成，容易地掌握通過排出路64A之冷媒之流動之狀態，即，冷媒以何種程度流動。乾燥空氣供給源69係由壓縮機或乾燥機而構成，使處於電子零件檢查裝置1之周邊之空氣壓縮、乾燥後供給至淨化空氣供給路70。對淨化空氣供給路70之供給量係藉由使淨化空氣供給路70之流路截面面積變化之淨化空氣供給閥71而控制。淨化空氣供給路70連接於收納盒50，且將自熱交換器67流出之淨化空氣導入至收納盒50。於淨化空氣供給路70，於淨化空氣供給閥71與熱交換器67之間配置有將淨化空氣加熱之空氣加熱器72。對熱交換器67供給藉由該空氣加熱器72而加熱之淨化空氣。又，於淨化空氣供給路70，於熱交換器67之下游側配置有止回閥73，該止回閥73容許氣體自熱交換器67向收納盒50之流動，且抑止氣體自收納盒50向熱交換器67之回流。藉由設置此種止回閥73，可抑制水分含量較冷媒(氮氣)更多之空氣自收納盒50流入，將熱交換器67及淨化空氣供給路70維持為乾燥狀態。乾燥空氣供給源69除了上述淨化空氣供給路70以外，將乾燥空氣供給源69所產生之乾燥空氣作為升溫氣體而供給至第2供給路75。該第2供給路75係利用分支部76分支為第2供給路75A與第2供給路75B。第2供給路75A係利用連接部77A連接於第1供給路57A，第2供給路75B係利用連接部77B連接於第1供給路57B。於第2供給路75中之較分支部76更靠上游側，配置有使第2供給路75之流路截面面積變化而控制升溫氣體對第2供給路75之供給量的作為控制閥之升溫氣體供給閥78。又，於第2供給路75中之升溫氣體供給閥78與分支部76之間，配置有將升溫氣體加熱至較第2目標溫度即18℃高之特定溫度例如60℃為止的作為加熱部之空氣加熱器79。即，於第2切換閥59A及第2切換閥59B處於關閉狀態，且升溫氣體供給閥78處於打開狀態之情形時，較第2目標溫度高之溫度之升溫氣體流入於第1供給路57A及第1供給路57B，且凹部141及凹部142藉由升溫氣體而直接地加熱。又，於第2供給路75A配置有容許升溫氣體自第2供給路75對第1供給路57A之流動，且抑止氮氣自第1供給路57A向第2供給路75之流動之作為抑止部之止回閥80A。相同地，於第2供給路75B配置有容許升溫氣體自第2供給路75對第1供給路57B之流動，且抑止氮氣自第1供給路57B向第2供給路75之流動之作為抑止部之止回閥80B。如以上般之構成之冷卻單元900係可執行將器件供給部26與IC器件90一起冷卻之冷卻控制(冷卻運轉)，與使冷卻狀態恢復為常溫之常溫恢復控制(常溫恢復運轉)。冷卻控制係使第1切換閥54為「打開(OPEN)」，使第2切換閥59A為「打開(OPEN)」，使第2切換閥59B為「打開(OPEN)」，使升溫氣體供給閥78為「關閉(CLOSE)」，使淨化空氣供給閥71為「打開(OPEN)」，使加熱器62A為「導通」，使加熱器62B為「導通」，使空氣加熱器72為「導通」，及使空氣加熱器79為「截止」而執行。常溫恢復控制係使第1切換閥54為「關閉(CLOSE)」，使第2切換閥59A為「關閉(CLOSE)」，使第2切換閥59B為「關閉(CLOSE)」，使升溫氣體供給閥78為「打開(OPEN)」，使淨化空氣供給閥71為「打開(OPEN)」，使加熱器62A為「導通」，使加熱器62B為「導通」，使空氣加熱器72為「導通」，及使空氣加熱器79為「導通」而執行。且說，於電子零件檢查裝置1之使用者使用電子零件檢查裝置1時，另外準備儲藏箱55並連接於電子零件檢查裝置1之共通路56。於在儲藏箱55內混入有例如垃圾或灰塵及金屬粉等異物之情形時，存在該異物與冷媒一起通過共通路56並卡於第1切換閥54、第2切換閥59A、及第2切換閥59B中之任一者之虞。於該情形時，認為卡有異物之切換閥難以進行正常之開閉動作。例如，當切換閥應為關閉狀態但因卡有異物而保持打開狀態時，冷媒白白地持續供給。又，由於該冷媒之白白供給而產生過度冷卻導致無法進行溫度控制，或為了消除過度冷卻而必須使加熱器62A或加熱器62B過度作動等不良情況。又，亦考慮第1切換閥54、第2切換閥59A、及第2切換閥59B因經時性劣化而難以進行正常之開閉動作之情況。於該情形時亦產生相同之不良情況。因此，於電子零件檢查裝置1中，以可防止此種不良情況之方式構成。以下，對該構成及作用進行說明。控制部800係基於分別使第1切換閥54、第2切換閥59A、及第2切換閥(切換閥)59B作動之控制資訊(是設為打開狀態還是設為關閉狀態之信號)與於檢測部53(壓力計531)之檢測結果，而進行上述各切換閥之狀態之判斷。以下，將該判斷稱為「切換閥狀態判斷」。具體而言，所謂「切換閥狀態判斷」係指切換閥之作動是否正常，即，切換閥是以能夠進行溫度控制之狀態作動，還是切換閥之作動存在異常之判斷。而且，於該判斷之結果，存在判斷為異常之切換閥之情形時，可將該切換閥例如更換為新的切換閥。藉此，切換閥可正常地，即，以能夠進行溫度控制之方式作動，因此，可防止上述不良情況。控制部800係可進行分別判斷第1切換閥54、第2切換閥59A、及第2切換閥59B之狀態之3個控制。基於圖18～圖20之流程圖說明該控制程式。再者，作為進行該控制之時序，並不特別限定，例如，較佳為各批次之搬送(檢查)開始前、各批次之搬送(檢查)結束後、計時器作動之每一定期性時間等。圖18係第1控制程式之流程圖。控制部800係使第1切換閥54及第2切換閥(第2切換閥59A及第2切換閥59B)中之一切換閥為關閉狀態，且使另一切換閥為打開狀態而進行切換閥狀態判斷(判斷)。於第1控制程式中，控制部800係使第1切換閥54為關閉狀態(步驟S401)，且使第2切換閥59A及第2切換閥59B為打開狀態(步驟S402)。然後，於該狀態下，使壓力計531(檢測部53)作動，檢測壓力值(檢測值)P1 (步驟S403)。判斷該壓力值P1 是否為預先設定之基準值M1 (步驟S404)。於步驟S404中，於壓力計531(檢測部53)中之壓力值(檢測值)P1 為預先設定之基準值(值)M1 之情形時，若第1切換閥54之作動為正常之狀態則進行切換閥狀態判斷(判斷)，將該旨意利用監視器300等報告(步驟S405)。又，於步驟S404之判斷之結果，壓力值P1 並非為基準值M1 (壓力值P1 超過基準值M1 )之情形時，若第1切換閥54之作動存在異常則進行切換閥狀態判斷，將該旨意利用監視器300等報告(步驟S406)。再者，作為基準值M1 ，例如可設為執行第1控制程式時之大氣壓。然後，當操作電子零件檢查裝置1之操作員確認步驟S405中之報告之後，可進行利用電子零件檢查裝置1之IC器件90之檢查。另一方面，當確認步驟S406中之報告之後，操作員可知曉於第1切換閥54堵塞有異物，作動產生異常。而且，操作員可將第1切換閥54例如更換為新的第1切換閥54。藉此，第1切換閥54可正常地作動，因此，可防止上述不良情況，且進行IC器件90之檢查。圖19係第2控制程式之流程圖。控制部800係使第1切換閥54及第2切換閥(第2切換閥59A及第2切換閥59B)中之一切換閥為關閉狀態，且使另一切換閥為打開狀態而進行切換閥狀態判斷(判斷)。於第2控制程式中，控制部800係使第1切換閥54為打開狀態(步驟S501)，且使第2切換閥59A及第2切換閥59B為關閉狀態(步驟S502)。然後，於該狀態下，使壓力計531(檢測部53)作動，檢測壓力值(檢測值)P2 (步驟S503)。判斷該壓力值P2 是否為預先設定之基準值M2 (步驟S504)。於步驟S504中，於壓力計531(檢測部53)中之壓力值(檢測值)P2 為預先設定之基準值(值)M2 之情形時，若第2切換閥59A及第2切換閥59B之作動為正常之狀態則進行切換閥狀態判斷(判斷)，將該旨意利用監視器300等報告(步驟S505)。又，於步驟S504之判斷之結果，壓力值P2 並非為基準值M2 (壓力值P2 超過基準值M2 )之情形時，若第2切換閥59A及第2切換閥59B中之至少一者之作動存在異常則進行切換閥狀態判斷，將該旨意利用監視器300等報告(步驟S506)。再者，作為基準值M2 ，例如可設為執行第2控制程式時之大氣壓。然後，當操作員確認步驟S505中之報告之後，可進行利用電子零件檢查裝置1之IC器件90之檢查。另一方面，當確認步驟S506中之報告之後，操作員可知曉於第2切換閥59A及第2切換閥59B中之至少一者堵塞有異物，作動產生異常。而且，操作員可將第2切換閥59A及第2切換閥59B中之存在異常之第2切換閥例如更換為新的第2切換閥。藉此，第2切換閥59A及第2切換閥59B可正常地作動，因此，可防止上述不良情況，且進行IC器件90之檢查。圖20係第3控制程式之流程圖。控制部800使第1切換閥54為打開狀態(步驟S601)。繼而，使配置於各分支線之第2切換閥中之1個第2切換閥為打開狀態，使剩餘之第2切換閥為關閉狀態。即，使配置於第1供給路57A之第2切換閥59A為打開狀態(步驟S602)，使配置於第1供給路57B之第2切換閥59B為關閉狀態(步驟S603)。然後，於該狀態下，使壓力計531(檢測部53)作動，檢測壓力值(檢測值)P3 (步驟S604)。判斷該壓力值P3 是否為預先設定之基準值M3 (步驟S605)。於步驟S605中，於壓力計531(檢測部53)中之壓力值(檢測值)P3 為預先設定之基準值(值)M3 之情形時，若第2切換閥59A(成為打開狀態之第2切換閥)之作動為正常之狀態則進行切換閥狀態判斷(判斷)，將該旨意利用監視器300等報告(步驟S606)。又，於步驟S605之判斷之結果，壓力值P3 並非基準值M3 (例如，壓力值P3 與大氣壓相同)之情形時，若第2切換閥59A之作動存在異常則進行切換閥狀態判斷，將該旨意利用監視器300等報告(步驟S607)。繼而，使第2切換閥59A為關閉狀態(步驟S608)，使第2切換閥59B為打開狀態(步驟S609)。然後，於該狀態下，使壓力計531作動，檢測壓力值P3 (步驟S610)。判斷該壓力值P3 是否為基準值M3 (步驟S611)。於步驟S611中，於壓力值P3 為基準值M3 之情形時，若第2切換閥59B(成為打開狀態之第2切換閥)之作動為正常之狀態則進行切換閥狀態判斷，將該旨意利用監視器300等報告(步驟S612)。又，於步驟S611之判斷之結果，壓力值P3 並非基準值M3 (例如，壓力值P3 與大氣壓相同)之情形時，若第2切換閥59B之作動存在異常則進行切換閥狀態判斷，將該旨意利用監視器300等報告(步驟S613)。再者，基準值M3 例如可設為大氣壓以外之任意之大小。然後，當操作員確認步驟S606及步驟S612中之報告之後，可進行利用電子零件檢查裝置1之IC器件90之檢查。另一方面，當確認步驟S607及步驟S613中之報告之後，操作員可知曉第2切換閥59A及第2切換閥59B本身例如產生故障，作動產生異常。而且，操作員可將第2切換閥59A及第2切換閥59B例如更換為新的第2切換閥59A及第2切換閥59B。藉此，第2切換閥59A及第2切換閥59B可正常地作動，因此，可防止上述不良情況，且進行IC器件90之檢查。藉由如以上般之第1控制程式、第2控制程式、及第3控制程式，可準確地判斷第1切換閥54、第2切換閥59A、及第2切換閥59B之各狀態(例如，是正常地作動，或者，還是作動產生異常)。藉此，可防止上述不良情況，且使電子零件檢查裝置1運轉。其次，參照圖21～圖26對設定切換閥狀態判斷之執行之格式之一例與顯示其執行結果之格式之一例進行說明。再者，「格式」亦有時被稱為「畫面」、「對話」、「窗口」等。首先，於監視器300顯示圖21所示之格式FM1。格式FM1係主畫面。於該格式FM1，包含按鈕群BT100、第1項目群IT110、第2項目群IT120、第3項目群IT130、第4項目群IT140、第5項目群IT150、及第6項目群IT160。於按鈕群BT100，包含「結束」用之按鈕BT101、「關機」用之按鈕BT102、「器件設定」用之按鈕BT103、「單元設定」用之按鈕BT104、「維護」用之按鈕BT105、「使用者定義」用之按鈕BT106、及「計算機」用之按鈕BT107。於第1項目群IT110，包含「使用者選擇」設定用之項目IT111、「溫度模式」設定用之項目IT112、「測試機連接」設定用之項目IT113、「搬送模式」設定用之項目IT114、「開始模式」設定用之項目IT115、「Bin設定」設定用之項目IT116、「各區域之濕度、溫度」顯示用之項目IT117、「設定資料」設定用之項目IT118、及「測試點」設定用之項目IT119。於第2項目群IT120，包含「供給梭子」設定用之項目IT121、「均溫板(溫度調整部)」設定用之項目IT122、「臂2」設定用之項目IT123、「臂1」設定用之項目IT124、「插口加熱器」設定用之項目IT125、及「插口空氣、插口冷卻」設定用之項目IT126。於第3項目群IT130，包含「與各區域之氧濃度相關之資訊」顯示用之項目131、及「氧濃度判定值」顯示用之項目132。第4項目群IT140係作為「供給/收納計數器」，包含「供給」確認用之項目IT141、「合計」確認用之項目IT142、「良品、不良品」用之項目IT143、及「收納1～收納4、固定1～固定4」確認用之項目IT144。第5項目群IT150係作為「接觸計數器」，包含「綜合」設定用之項目IT151、「器件類別」設定用之項目IT152、「器件類別%」設定用之項目IT153、及「臂1、臂2」確認用之項目IT154。第6項目群IT160係作為「測試機範疇」，包含「臂2」確認用之項目IT161、及「臂1」確認用之項目IT162。其次，若操作按鈕群BT100之按鈕BT105，則如圖22所示，格式FM2重疊於格式FM1而顯示。格式FM2為圖標選單。於該格式FM2，包含「構建」用之按鈕BT201、「開始模式」用之按鈕BT202、「計數器」用之按鈕BT203、「計數器清除」用之按鈕BT204、「溫度監視器」用之按鈕BT205、「塔燈」用之按鈕BT206、「密碼」用之按鈕BT207、「安全」用之按鈕BT208、「生產管理」用之按鈕BT209、「功能設定」用之按鈕BT210、「控制器」用之按鈕BT211、「DIO設定」用之按鈕BT212、「I/F監視器」用之按鈕BT213、「低溫運轉」用之按鈕BT214、「處理器ID」用之按鈕BT215、及「結束」用之按鈕BT216。其次，若操作格式FM2之按鈕BT214，則於監視器300顯示低溫運轉設定用之畫面，即，圖23所示之格式FM3。於格式FM3，包含第1項目群IT310、第2項目群IT320、第3項目群IT330、及第4項目群IT340。第1項目群IT310係作為「小窗口」，包含「開放警告時間」用之項目IT311、及「警告濕度」用之項目IT312。第2項目群IT320係作為「露點監視」，包含「回收區域(補償)」用之項目IT321、「+設定溫度」用之項目IT322、及「卸載器區域」用之項目IT323。第3項目群IT330係作為「卸載動作」，包含「門關閉之時間等待」用之項目IT331、「卸載後之淨化時間」用之項目IT332。第4項目群IT340係作為「LN2閥確認」，包含「感測器穩定等待時間」用之項目IT341、「LN2閥定期地確認(停止中)」用之項目IT342、及「確認間隔」用之項目IT343。而且，藉由對項目IT342進行檢查，按下「OK」用之按鈕BT351，可設定切換閥狀態判斷之執行。與其相反，於將對項目IT342之檢查省略之情形時，切換閥狀態判斷之執行之設定被解除。再者，於第4項目群IT340，除了按鈕BT351以外，亦包含「刪除」用之按鈕BT352、及「應用」用之按鈕BT353。又，於項目IT341中，可設定直至共通路56內之冷媒全部通過為止之時間。而且，若於該設定時間內由壓力計531檢測之壓力成為大氣壓，則判斷為冷媒自共通路56內全部通過。若對項目IT342進行檢查，按下「OK」用之按鈕BT351之後經過於項目IT343輸入之時間，則顯示圖24所示之格式FM4。於格式FM4，包含項目IT410、項目IT420、按鈕BT430、及按鈕BT440。於項目IT410，例如顯示為經過「指定時間(12小時)，故而實施LN2閥之動作確認，於馬上開始之情形時，請選擇[馬上執行]，於使確認延期之情形時，請選擇[執行延期]」。而且，於選擇[馬上執行]之情形時，按下「馬上執行」用之按鈕BT430。另一方面，於選擇[執行延期]之情形時，按下「執行延期(15分鐘)」用之按鈕BT440。於項目IT420，顯示倒計時之時間。而且，於執行切換閥狀態判斷之後，於第1切換閥54、第2切換閥59A、及第2切換閥59B之作動存在異常之情形時，顯示圖25或圖26所示之格式FM5。於格式FM5，包含項目IT510、項目IT520、項目IT530、項目IT540、項目IT550、及佈局LO560。項目IT510為「錯誤碼」。於圖25中，顯示為「612」，於圖26中，顯示為「613」。項目IT520為「單元」之編號。於圖25及圖26中，均顯示為「15」。項目IT530為「單元名」。於圖25及圖26中，均顯示為「溫度調整」。項目IT540係作為「題目」，顯示作動存在異常之切換閥。於圖25中，顯示為「LN2主閥異常，LN2閥之故障確認用感測器關閉，請重試，選擇後開始」。於圖26中，顯示為「LN2控制閥異常，LN2閥之故障確認用感測器關閉，請重試，選擇後開始」。項目IT550係作為「詳情」而顯示關於作動存在異常之切換閥之詳細資訊。於圖25中，顯示為「於再次確認之情形時，請選擇重試後開始；於中止冷卻之情形時，請選擇暫停後重置；(1)存在LN2主閥產生故障之可能性，請將LN2供給閥關閉」。於圖26中，顯示為「於再次確認之情形時，請選擇重試後開始；於中止冷卻之情形時，請選擇暫停後重置；(1)存在LN2控制閥之任一產生故障之可能性，請將LN2供給閥關閉」。佈局LO560係顯示電子零件檢查裝置1之主要部之佈局(配置)者。於圖26中，對「LN2」標註圓圈。＜第8實施形態＞以下，參照圖27對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項則省略其說明。本實施形態除了檢測部之構成不同以外，與第7實施形態相同。檢測部53係由檢測通過排出路(排出線)64A之冷媒(流體)之壓力之壓力計(壓力感測器)531(參照圖17)，或檢測通過排出路(排出線)64A之冷媒(流體)之流量之流量計(流量感測器)532而構成。如圖27所示，於本實施形態中，檢測部53係由流量計532而構成。藉由使用流量計532，可利用簡單之構成容易地掌握通過排出路64A之冷媒之流動之狀態，即，冷媒以何種程度流動。以上，基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置進行了說明，但本發明並不限定於此，構成電子零件搬送裝置及電子零件檢查裝置之各部係可置換為可發揮相同之功能之任意構成者。又，亦可附加任意之構成物。又，本發明之電子零件搬送裝置及電子零件檢查裝置亦可為將上述各實施形態中之任意之2個以上之構成(特徵)組合而成者。又，於本發明之電子零件搬送裝置及電子零件檢查裝置中，既可按照常溫檢查、高溫檢查、及低溫檢查之順序進行檢查，亦可按照低溫檢查、高溫檢查、及常溫檢查之順序進行檢查，亦可按照高溫檢查、低溫檢查、及常溫檢查之順序進行檢查。即便於進行常溫檢查、高溫檢查、及低溫檢查中至少2個檢查之情形時，亦可發揮本發明之效果。又，於上述各實施形態中，對將載置部連同IC器件一起冷卻之構成進行敍述，作為所使用之流體，為冷媒，但並不限定於此，例如亦可為將載置部連同IC器件一起加熱之構成。於該情形時，作為所使用之流體，例如亦可為水(熱水)或油。又，作為檢測通過排出線之流體之流動之檢測部，並不限定於壓力計或流量計，例如亦可為檢測流體之溫度之溫度感測器。另外，例如亦可為僅利用導通/截止檢測流體之通過、停止者。Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings. <First Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 6. In the following, for convenience of explanation, as shown in FIGS. 1 to 4 (the same applies to FIGS. 7, 8, and 11 to 14), three axes orthogonal to each other are set as the X axis, the Y axis, and the X axis. Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also It is called "Z direction (third direction)". In addition, the direction to which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the "horizontal" mentioned in the specification of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the horizontal. In addition, the upper side of FIG. 1 may be referred to as "upper" or "upper", and the lower side may be referred to as "lower" or "lower". The electronic component transfer device 10 shown in FIGS. 1 and 2 includes an inspection area A3 that can be provided with an inspection section 16 that can perform a first inspection of the IC device 90 as an electronic component at a first temperature inspection, and After the first inspection, the second inspection of the IC device 90 is performed at a second temperature different from the first temperature. The first tray supply and removal area A1 as the first placement area can be arranged as a tray of the first placement portion. 200, the tray 200 can mount the IC device 90 before the first inspection; and the second tray supply and removal area A5, which is the second loading area, is located in a different area from the first tray supply and removal area A1, and can be arranged As the tray 200 of the second mounting section, the tray 200 can mount the IC device 90 before the second inspection. Thereby, after performing the first inspection on the IC device 90 placed on the tray 200 in the first tray supply and removal area A1, the IC device 90 placed on the tray 200 in the second tray supply and removal area A5 can be subjected to the second inspection. an examination. That is, the first inspection and the second inspection having different temperatures can be performed by using one electronic component transfer device 10. As a result, it is possible to omit the operation of the operator to transfer the IC device 90 to the second-part-specific electronic component transfer device after the first inspection. Therefore, errors caused by the operator can be prevented, and the first inspection and the second inspection can be performed quickly. The electronic component inspection apparatus 1 includes an inspection area A3, which is provided with an inspection section 16. The inspection section 16 can perform a first inspection of the IC device 90, which is an electronic component, using a first temperature inspection. The second inspection of the second temperature inspection IC device 90 different from the first temperature; the first tray supply and removal area A1 as the first placement area can be arranged with the tray 200 as the first placement portion, and the tray 200 can The IC device 90 before the first inspection is placed; and the second tray supply and removal area A5, which is the second placement area, is located in an area different from the first tray supply and removal area A1, and can be disposed as the second placement section The tray 200 can hold the IC devices 90 before the second inspection. Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component transfer apparatus 10 is obtained. Since the IC device 90 can be transported to the inspection unit 16, the inspection of the IC device 90 can be performed by the inspection unit 16. The IC device 90 after the inspection can be transferred from the inspection unit 16. The configuration of each unit will be described below. As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 with the built-in electronic component transfer device 10 transfers, for example, electronic components such as IC devices packaged in a BGA (Ball Grid Array, Ball Grid Array). A device for inspecting and testing the electrical characteristics of parts (hereinafter referred to as "inspection"). In the following, for convenience of explanation, as the above-mentioned electronic component, a case where an IC device is used will be described as a representative, and it will be referred to as "IC device 90". The IC device 90 is a flat plate in this embodiment. In addition, as the IC device, in addition to the above, for example, "LSI (Large Scale Integration)", "CMOS (Complementary MOS)", "CCD (Charge Coupled Device)" (Device) "or" module IC "packaged from a plurality of IC device modules," crystal device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro "Sensor" and "fingerprint sensor". The electronic component inspection device 1 (electronic component transfer device 10) is used in advance by a person called a "replacement kit" for each type of IC device 90 replacement. A mounting section on which the IC device 90 is mounted is provided in the replacement kit, and the mounting section includes, for example, a temperature adjustment section 12 described below, a first device supply and recovery section 14, and the like. In addition, as the mounting portion on which the IC device 90 is mounted, unlike the replacement kit described above, there is also an inspection portion 16 or a tray 200 prepared by the user. The electronic component inspection device 1 includes a first tray supply and removal area A1, a first device transfer area where devices are transported (hereinafter, referred to simply as a "first device transfer area") A2, an inspection area A3, and a second device transfer where devices are transported The area (hereinafter simply referred to as the "second device transfer area") A4 and the second tray supply and removal area A5 are divided by each wall portion as described below. The IC device 90 follows the arrow α from the first tray supply removal area A1 to the second tray supply removal area A1. 90 The direction passes through the above-mentioned areas in order, and inspection is performed in the inspection area A3 in the middle. As described above, the electronic component inspection device 1 includes a processor as the electronic component transfer device 10 that transports IC devices 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal light 400, and an operation panel 700. In addition, the electronic component inspection apparatus 1 is a side where the first tray supply removal area A1 and a second tray supply removal area A5 are arranged, that is, the lower side in FIG. 2 is set as the front side, and the side where the inspection area A3 is arranged That is, the upper side is used as the rear side in FIG. 2. In addition, the electronic component inspection apparatus 1 performs a normal temperature inspection as a first inspection, a low temperature inspection as a second inspection, and a high temperature inspection as a third inspection. Here is an example of a state where the normal temperature inspection is performed as the first inspection. Be explained. The first tray supply and removal area A1 is an area for supplying the tray 200 in which the plurality of IC devices 90 are arranged in an unchecked state. A plurality of trays 200 can be stacked in the first tray supply and removal area A1. The first device transfer area A2 is an area where a plurality of IC devices 90 on the tray 200 transferred from the first tray supply removal area A1 are transferred and supplied to the inspection area A3, respectively. Further, a tray transfer mechanism 11 for transferring the trays 200 one by one in the horizontal direction is provided so as to span the first tray supply removal area A1 and the first device transfer area A2. The tray transfer mechanism 11 enables the tray 200 along with the IC device 90 placed on the tray 200 in the Y direction, that is, the arrow α in FIG. 2 11 Moving part moving in the direction back and forth. Thereby, the IC device 90 can be stably carried into the first device transfer area A2, and the empty tray 200 can be moved from the first device transfer area A2 to the first tray supply removal area A1. In the first device transfer area A2, a temperature adjustment section (a temperature equalizing plate (English expression: soap plate, Chinese expression (one example): temperature equalizing plate)) 12 and a device transfer head 13 are provided. The temperature adjustment unit 12 functions as a first temperature adjustment unit that can adjust the temperature of the IC device 90 on a path that can transfer the IC device (electronic component) 90 from the tray 200 as the first mounting portion to the inspection area A3. . This temperature adjustment section 12 is referred to as a "temperature equalizing plate" that can heat or cool the mounted IC device 90 at a time. With this temperature equalizing plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance to adjust the temperature suitable for the inspection. The IC device 90 on the tray 200 carried in from the first tray supply and removal area A1 by the tray transfer mechanism 11 is transferred to the temperature adjustment unit 12. Furthermore, by fixing the temperature adjustment section 12 as the mounting section, the temperature of the IC device 90 can be stably adjusted by the temperature adjustment section 12. The device transfer head 13 includes a portion that is supported in the first device transfer region A2 so as to be movable in the X direction and the Y direction, and is also capable of moving in the Z direction. Thereby, the device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the first tray supply removal area A1, and the temperature adjustment unit 12 and the first device supply recovery unit 14 described below. Transfer of IC devices 90 between. Furthermore, in FIG. 2, the X-direction movement of the device transfer head 13 is indicated by an arrow α. 13X Indicates that the Y-direction movement of the device transfer head 13 is indicated by an arrow α 13Y Means. The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, an inspection section 16 and a device transfer head 17 for inspecting the IC device 90 are provided. In addition, a first device supply recovery unit 14 that moves across the first device transfer area A2 and the inspection area A3, and a second device supply that moves across the inspection area A3 and the second device transfer area A4 are also provided. Recovering section 18. The first device supply / recovery section 14 is configured as a mounting section on which the IC device 90 whose temperature has been adjusted by the temperature adjustment section 12 is placed. "Board" or simply "shuttle". In addition, the first device supply and recovery unit 14 serving as the mounting portion is configured to be able to move along the X direction between the first device transfer area A2 and the inspection area A3, that is, the arrow α 14 Directions are supported reciprocally. With this, the first device supply and recovery unit 14 can stably transport the IC device 90 from the first device transfer area A2 to the vicinity of the inspection portion 16 in the inspection area A3, and can also be taken in the inspection area A3 by the device transfer head 17 After passing the IC device 90, it returns to the first device transfer area A2 again. In the configuration shown in FIG. 2, two first device supply and recovery sections 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 12 are transported to any of the first device supply and recovery sections 14. The first device supply and recovery unit 14 is configured to be capable of heating or cooling the IC device 90 placed on the first device supply and recovery unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment section 12 can be transported to the vicinity of the inspection section 16 of the inspection area A3 while maintaining its temperature adjustment state. The device transfer head 17 is an operation unit that holds the IC device 90 that maintains the above-mentioned temperature adjustment state, and transfers the IC device 90 in the inspection area A3. This device transfer head 17 is supported so as to be able to move back and forth in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called an "indicator bar". Thereby, the device transfer head 17 can transfer and place the IC device 90 on the first device supply recovery section 14 carried in from the first device transfer area A2 to the inspection section 16. Furthermore, in FIG. 2, the Y-direction reciprocating movement of the device transfer head 17 is indicated by the arrow α 17Y Means. In addition, the device transfer head 17 is supported so as to be able to move back and forth in the Y direction and the Z direction, but is not limited to this, and can also be supported so as to be able to move back and forth in the X direction. The device transfer head 17 can be divided into two in the Y direction, and can be divided into a device transfer head 17A and a device transfer head 17B from the + Y direction side. These device transfer heads 17A and 17B can also be moved independently from each other in the Z direction. The device transfer head 17 is configured to heat or cool the held IC device 90. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the first device supply recovery section 14 to the inspection section 16. The inspection unit 16 is configured as a placement unit, and an IC device 90 as an electronic component is placed to inspect the electrical characteristics of the IC device 90. A plurality of probe pins electrically connected to the terminals of the IC device 90 are provided in the inspection section 16. In addition, the IC device 90 can be inspected by the terminals of the IC device 90 being electrically connected to the probe pins, that is, in contact. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a testing machine connected to the inspection section 16. In addition, the IC device 90 may be heated or cooled by the inspection unit 16 and adjusted to a temperature suitable for inspecting the IC device 90. The second device supply / recovery section 18 is configured as a mounting section, and is called a “recycling shuttle board” or simply a “recycling shuttle”. The IC device 90 is transferred to the second device transfer area A4. In addition, the second device supply and recovery unit 18 is provided so that it can move along the X direction between the inspection area A3 and the second device transfer area A4, that is, the arrow α 18 Directions are supported reciprocally. In the configuration shown in FIG. 2, the second device supply and recovery unit 18 is the same as the first device supply and recovery unit 14, and two of them are arranged in the Y direction. The IC devices 90 on the inspection unit 16 are transported and loaded. It is set to any second device supply and recovery unit 18. This transfer is performed by the device transfer head 17. The second device transfer area A4 is an area to be inspected in the inspection area A3 and the IC devices 90 recovered after the inspection are completed. A device transfer head 20, a tray transfer mechanism 22, and a temperature adjustment unit 15 are provided in the second device transfer area A4. An empty tray 200 is also prepared in the second device transfer area A4. The device transfer head 20 includes a portion that is supported in the second device transfer region A4 so as to be movable in the X and Y directions, and is also capable of moving in the Z direction. Thereby, the device transfer head 20 can transfer the IC device 90 from the second device supply recovery unit 18 to the empty tray 200. Furthermore, in FIG. 2, the X-direction movement of the device transfer head 20 is indicated by the arrow α 20X Indicates that the Y-direction movement of the device transfer head 20 is indicated by the arrow α 20Y Means. In addition, three empty trays 200 are arranged along the X direction. The empty tray 200 also serves as a mounting section on which the IC device 90 inspected by the inspection section 16 is placed. Then, the IC device 90 on the second device supply / recovery section 18 moved to the second device transfer area A4 is transferred and placed on any of the empty trays 200. As a result, the IC device 90 is classified and recovered for each inspection result. The temperature adjustment unit 15 functions as a second temperature adjustment unit capable of adjusting the temperature of the IC device 90 in a path in which the IC device (electronic component) 90 is transported from the tray 200 as the second mounting portion to the inspection area A3. This temperature adjustment unit 15 is referred to as a "temperature equalizing plate" that can heat or cool the mounted IC device 90 at a time. With this temperature equalizing plate, the IC device 90 before the second inspection described below can be cooled in the inspection unit 16 in advance and adjusted to a temperature suitable for the second inspection. The second tray supply and removal area A5 is a material removal section that collects and removes the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. A plurality of trays 200 can be stacked in the second tray supply and removal area A5. In addition, a tray transfer mechanism 22 that transfers the trays 200 one by one in the Y direction so as to straddle the second device transfer area A4 and the second tray supply and removal area A5 is provided. The tray conveying mechanism 22 can make the tray 200 in the Y direction, that is, the arrow α twenty two Moving part moving in the direction back and forth. Thereby, the inspected IC device 90 can be transferred from the second device transfer area A4 to the second tray supply removal area A5, and the empty tray 200 can be moved from the second tray supply removal area A5 to the second device transfer area. A4. The control unit 800 can control, for example, the tray transfer mechanism 11, the temperature adjustment unit 12, the device transfer head 13, the first device supply and recovery unit 14, the temperature adjustment unit 15, the inspection unit 16, the device transfer head 17, and the second device supply and recovery unit 18. The operation of each unit such as the device transfer head 20 and the tray transfer mechanism 22. As shown in FIG. 1, the control unit 800 includes a memory unit 801. An inspection program or the like is stored in the storage unit 801, and the control unit 800 can perform an inspection based on the inspection program. Such a memory unit 801 includes, for example, a volatile memory such as a RAM (Random Access Memory), a nonvolatile memory such as a ROM (Read Only Memory), and an erasable programmable read only memory (EPROM). , Erasable programmable read-only memory), EEPROM (Electrically Erasable Programmable Read Only Memory), flash memory, etc. that can be overwritten (can be deleted, overwritten) It is composed of various semiconductor memories (IC memories) and the like such as nonvolatile memories. The operator can set or confirm the operating conditions and the like of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 includes, for example, a display screen 301 composed of a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, a mouse stage 600 for placing a mouse is provided on the right side of the second tray supply and removal area A5 in the figure. This mouse is used when operating a screen displayed on the monitor 300. The selection of the following first inspection, second inspection, and third inspection can be set while observing the screen of the monitor 300. An operation panel 700 is disposed on the lower right side in FIG. 1 with respect to the monitor 300. Unlike the monitor 300, the operation panel 700 instructs the electronic component inspection apparatus 1 to a desired operator. In addition, the signal lamp 400 can report the operation state and the like of the electronic component inspection device 1 by a combination of the emitted colors. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. Furthermore, a speaker 500 is built in the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 or the like may be reported through the speaker 500. As shown in FIG. 2, the electronic component inspection device 1 is separated from the first tray supply and removal area A1 and the first device transfer area A2 by a first partition wall 231, and the first device transfer area A2 and the inspection area A3 are borrowed. It is separated by the second partition wall 232, the inspection area A3 and the second device transfer area A4 are separated by the third partition wall 233, and the second device transfer area A4 and the second tray supply removal area A5 are separated by the first 4 divided by 234. The first device transfer region A2 and the second device transfer region A4 are also separated by a fifth partition wall 235. The outermost part of the electronic component inspection device 1 is covered by a casing. As shown in FIG. 1, for example, there are a front casing 241, a side casing 242, a side casing 243, a rear casing 244, and a top casing 245. Furthermore, in the previous electronic component transfer device, when the inspection was performed at a different temperature after the inspection of the IC device 90, the operator must transfer the IC device 90 after the inspection to a different electronic component transfer device. In this case, there may be a case where a transfer error is caused by an operator. In addition, the inspection efficiency reduces the amount of time the operator needs to transport the IC device 90. In this embodiment, such a problem can be solved. This case will be described below. In the present embodiment, the inspection at normal temperature (room temperature) is referred to as "normal temperature inspection (first inspection)", the inspection at low temperature is referred to as "low temperature inspection (second inspection)", and The inspection is called "high temperature inspection (third inspection)". In this specification, normal temperature means 15 ° C or higher and less than 25 ° C, low temperature means -55 ° C or higher and less than 15 ° C, and high temperature means 25 ° C or higher and 170 ° C or lower. In the electronic component transfer device 10, as shown in the flowchart shown in FIG. 5, the normal temperature inspection (step S101), the low temperature inspection (step S102), and the high temperature inspection (step S103) can be continuously performed in this order. First, the room temperature inspection will be described. In the normal temperature inspection (step S101), first, as shown in FIG. 2, a tray 200 on which an IC device 90 is placed is arranged in a first tray supply and removal area A1. Then, the IC device 90 is transferred to the first device transfer area A2 by the tray transfer mechanism 11 together with the tray 200. Then, the IC device 90 is transferred to the first device supply / recovery unit 14 by the device transfer head 13. Then, the IC device 90 is transferred to the inspection area A3 by the first device supply and recovery unit 14, and the IC device 90 is placed on the inspection unit 16 by the device transfer head 17 to perform normal-temperature inspection. The IC device 90 that has been subjected to the normal temperature inspection is placed on the second device supply and recovery unit 18 by the device transfer head 17 and is transferred to the second device transfer area A4. Then, the IC device 90 transferred to the second device transfer area A4 is placed on the tray 200 waiting in the second device transfer area A4 by the device transfer head 20. At this time, three trays 200 are arranged in the X direction in the second device transfer area A4, and are classified for each level of the normal temperature inspection. As this level, for example, from the tray 200 in the -X direction, "Pass", "Recheck", and "Fail" can be sequentially set. In addition, in FIG. 2, a “passive” IC device 90 is representatively illustrated. The IC devices 90 classified for the tray 200 are transferred to the second tray supply and removal area A5 together with the tray 200 by the tray transfer mechanism 22. The normal temperature inspection has been described above. In this way, the first temperature of the first inspection (normal temperature inspection) is room temperature. That is, in the electronic component transfer apparatus 10, it performs from a normal temperature inspection. Thereby, the time for adjusting the temperature of the temperature adjustment part 12 and the temperature adjustment part 15, etc. can be omitted, and a 1st inspection can be started smoothly. Therefore, inspection efficiency can be improved. Next, the low-temperature inspection (step S102) will be described. Hereinafter, the low-temperature inspection will be described with reference to FIG. 3. In FIG. 3, one of the IC devices 90 whose result of the normal-temperature inspection is “Pass” is representatively illustrated. Furthermore, the IC devices 90 classified into "re-inspection" and "failure" can be kept in the state of being placed in the second tray supply removal area A5, or they can be discharged by the operator. In FIG. 3, the path for conveying the IC device 90 is indicated by arrow α. 90 Means. First, before transferring the IC device 90, the parts indicated by hatching in FIG. 3, that is, the temperature adjustment section 15, the inspection section 16, the device transfer head 17, and the second device supply recovery section 18 are adjusted to be suitable for low-temperature inspection. temperature. After the temperature adjustment is completed, the transportation of the IC device 90 is started. Moreover, at this time, as shown in the timing chart of FIG. 6, the heating of the temperature adjustment section 12 (time t 1 ). As shown in FIG. 3, during the low-temperature inspection, it is conveyed to the side opposite to the normal-temperature inspection. After the normal temperature inspection, the IC device 90 placed on the tray 200 in the second tray supply and removal area A5 is transferred to the second device transfer area A4 together with the tray 200. Then, the IC device 90 is placed on the temperature adjustment unit 15 and set to a state where the temperature is suitable for the low-temperature inspection. The temperature-adjusted IC device 90 is placed on the second device supply / recovery section 18 and is transported to the inspection area A3. Then, it is transferred to the inspection unit 16 by the device transfer head 17 to perform a low-temperature inspection. The IC device 90 that has undergone the low-temperature inspection is placed on the first device supply and recovery unit 14 by the device transfer head 17, and is transferred to the first device transfer region A2 by the first device supply and recovery unit 14. Then, it is transferred to the tray 200 in the first device transfer area A2. At this time, three trays 200 are arranged in the X direction in the first device transfer area A2, and are classified for each level of the low-temperature inspection. As this level, similarly to the normal temperature inspection, the tray 200 from the -X direction can be set to "Pass", "Recheck", and "Fail" in order. In addition, in FIG. 3, a "pass" IC device 90 is representatively illustrated. The low-temperature inspection has been described above. During the low-temperature inspection, the IC device 90 is transported from the first tray supply removal area A1 to the inspection area A3, and after the first inspection in the inspection area A3, it is moved to the second tray supply removal area A5 and from the second tray supply removal area A5 is transported to the inspection area A3, and after the second inspection is performed in the inspection area A3, it is transported to the first tray supply removal area A1. Thereby, the first inspection and the second inspection can be performed with a simple configuration in which the IC device 90 which is transported to the second tray supply removal area A5 after the first inspection is completed is reversed. Therefore, the second inspection can be smoothly started after the first inspection is completed. The IC device 90 is moved into the inspection area A3 on the first path from the first tray supply and removal area A1 to the inspection area A3 (see arrow α in FIG. 2). 90 ) And the direction in which the IC device 90 is moved into the inspection area A3 in the second path from the second tray supply and removal area A5 to the inspection area A3 (refer to the arrow α in FIG. 3) 90 ) Is the opposite direction. Thereby, by observing the direction in which the IC device 90 is transported, the operator can easily confirm visually whether to perform the normal temperature inspection or the low temperature inspection. Next, a high-temperature inspection (step S103) will be described. Hereinafter, the high-temperature inspection will be described using FIG. 4. In FIG. 4, one of the IC devices 90 whose result of the low-temperature inspection is “passed” is representatively illustrated. Furthermore, the IC devices 90 classified into "re-inspection" and "failure" can be kept in the state of being placed in the first tray supply and removal area A1, or they can be discharged by the operator. In addition, in FIG. 4, the path for conveying the IC device 90 is indicated by an arrow α. 90 Means. First, before the IC device 90 is transferred, the parts indicated by hatching in FIG. 4, that is, the inspection section 16, the device transfer head 17, and the first device supply recovery section 14 are adjusted to a temperature suitable for high-temperature inspection. When the temperature adjustment is completed, the transportation of the IC device 90 is started. In addition, as described above, at the end of the low-temperature inspection, the temperature adjustment unit 12 becomes a temperature suitable for the high-temperature inspection. Thereby, the high-temperature inspection can be started only by heating the inspection unit 16, the device transfer head 17, and the first device supply recovery unit 14. That is, the heating of the temperature adjustment unit 12 which has a large heat capacity and takes time to reach a specific temperature can be omitted, and the high-temperature inspection can be started quickly. As shown in the timing chart in FIG. 6, after the low-temperature inspection is completed, the operation of the temperature adjustment unit 15 is stopped (see t in FIG. 6). 2 ). This can suppress power consumption. As shown in FIG. 4, during the high temperature inspection, it is transported to the side opposite to the low temperature inspection. That is, the IC device 90 placed on the tray 200 in the first tray supply and removal area A1 after the low-temperature inspection is transferred to the first device transfer area A2 together with the tray 200. Then, it is placed on the temperature adjustment unit 12 and is set to a state where the temperature is suitable for high-temperature inspection. The temperature-adjusted IC device 90 is transferred to the first device supply and recovery unit 14 and is transferred to the inspection area A3. Then, it is transferred to the inspection unit 16 by the device transfer head 17 to perform a high-temperature inspection. The IC device 90 that has undergone the high-temperature inspection is transferred to the second device supply and recovery unit 18 by the device transfer head 17, and is transferred to the second device transfer region A4 by the second device supply and recovery unit 18. Then, it is transferred to the tray 200 in the second device transfer area A4. At this time, three trays 200 are arranged in the X direction in the second device transfer area A4, and are classified for each level of the high-temperature inspection. This level is the same as the normal temperature inspection, and can be set to "Pass", "Recheck", and "Fail" in order from the tray 200 in the -X direction. In addition, in FIG. 4, a “pass” IC device 90 is representatively illustrated. The high temperature inspection has been described above. In the high-temperature inspection, the first tray supply and removal area A1 as the first placement region can mount the IC device (electronic component) 90 before the high-temperature inspection as the third inspection. Accordingly, during the high-temperature inspection, it is possible to omit an area separately provided for the IC device 90 before the high-temperature inspection, which is different from the first tray supply removal region A1. Therefore, the device configuration can be simplified. In addition, after the low-temperature inspection as the second inspection, the inspection unit 16 can inspect the IC device (electronic component) 90 at a high temperature (third temperature) different from the normal temperature (first temperature) and the low temperature (second temperature). The third inspection is a high-temperature inspection. Therefore, three types of inspections can be performed with one electronic component transfer device 10, and the inspection accuracy is improved. After the second inspection is performed in the inspection area A3, the IC device 90 transported to the first tray supply and removal area (first placement area) A1 is transported from the first tray supply and removal area A1 to the inspection area A3, and is inspected. In the area A3, after the third inspection of the third temperature inspection IC device 90 at a temperature different from the first temperature and the second temperature, the third inspection of the IC device 90 is carried out, and then it is transferred to the second tray supply removal area (second placement area) A5. Thereby, the third inspection can be performed with a simple configuration in which the IC device 90 that is transported to the first tray supply removal area A1 after the second inspection is completed is reversed. Therefore, the third inspection can be smoothly started after the second inspection is completed. The IC device 90 is moved into the inspection area A3 on the third path from the first tray supply removal area A1 to the inspection area A3 during the third inspection, and is fed from the first tray during the first inspection. In the first path in which the removal area A1 is conveyed to the inspection area A3, the direction in which the IC device 90 is carried into the inspection area A3 is the same direction. Thereby, the direction in which the IC device 90 is carried into the inspection area A3 in the second path from the second tray supply removal area A5 to the inspection area A3 during the second inspection (see arrow α in FIG. 3) 90 ) And the direction in which the IC device 90 is moved into the inspection area A3 in the third path (refer to the arrow α in FIG. 4) 90 ) In contrast, the operator can easily confirm whether to perform a low temperature inspection or a high temperature inspection by visual inspection. As described above, according to the electronic component transporting device 10, it is possible to continuously and automatically perform inspections at different temperatures, that is, normal temperature inspection (first inspection), low-temperature inspection (second inspection), without the operator's hand, and High temperature inspection (third inspection). With this, it is possible to omit the operator to transfer the IC device 90 after the inspection to a different electronic component transporting device after the inspection is completed as before. Therefore, a transfer error caused by the operator can be omitted, and the time for the operator to transfer the IC device 90 can be omitted. As a result, inspection can be performed accurately, and inspection efficiency can be improved. <Second Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 7 and 8. The differences from the above embodiment will be mainly described. The same matters The description is omitted. This embodiment is the same as the first embodiment except that the configuration of the device transfer head is different. In this embodiment, as shown in FIG. 7, the device transfer head 17A is only cooled by the device transfer head 17, and as shown in FIG. 8, the device transfer head 17B is only heated. As shown in FIG. 7, during the low-temperature inspection, the temperature adjustment unit 15, the inspection unit 16, the device transfer head 17A, and the second device supply recovery unit 18A are cooled. That is, during the low-temperature inspection, cooling of the device transfer head 17B and the second device supply and recovery unit 18B is omitted. Thereby, the cooling of the device transfer head 17B and the 2nd device supply recovery part 18B is omitted, and power consumption can be suppressed correspondingly. Moreover, during the low-temperature inspection, as shown by the arrow α in FIG. 7 90 As shown, the IC device 90 is transferred by the device transfer head 17A via the second device supply and recovery unit 18A. As shown in FIG. 8, during the high-temperature inspection, the temperature adjustment unit 12, the first device supply and recovery unit 14B, the inspection unit 16, and the device transfer head 17B are heated. That is, during the high-temperature inspection, heating of the first device supply and recovery unit 14A and the device transfer head 17A is omitted. Accordingly, heating of the first device supply recovery unit 14A and the device transfer head 17A is omitted, and power consumption can be suppressed accordingly. Furthermore, during the high-temperature inspection, as shown by the arrow α in FIG. 8 90 As shown, the IC device 90 is transported by the device transport head 17B via the first device supply recovery unit 14B. <Third Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 9. The differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. . This embodiment is the same as the first embodiment except that the order of each inspection is different. As shown in the flowchart of FIG. 9, in this embodiment, a low-temperature inspection (step S201) as the first inspection, a normal-temperature inspection (step S202) as the second inspection, and a high-temperature inspection (step S202) as the third inspection. S203) Perform in this order. That is, the first temperature of the first inspection is lower than room temperature, and the second temperature of the second inspection is room temperature or higher. By performing the inspections in this order, the following advantages can be obtained. In general, if the IC device 90 is directly discharged to the outside of the device after the inspection at a lower temperature is completed, the IC device 90 is liable to cause condensation. Therefore, it is possible to prevent the IC device 90 from being discharged to the outside of the device while maintaining the low temperature state by performing the first inspection having a lower temperature first and then performing the second inspection. As a result, condensation in the IC device 90 can be prevented or suppressed. <Fourth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 10, and the differences from the above embodiment will be mainly described. The same matters are omitted. Instructions. This embodiment is the same as the first embodiment except that the order of each inspection is different. As shown in the flowchart of FIG. 10, in this embodiment, a high-temperature inspection as a first inspection (step S301), a normal-temperature inspection as a second inspection (step S302), and a low-temperature inspection as a third inspection (step S303) Perform in this order. That is, the first temperature of the first inspection is higher than the second temperature of the second inspection. The first temperature in the first inspection is higher than room temperature, and the second temperature in the second inspection is room temperature or lower. By performing the inspections in this order, the following advantages can be obtained. Generally speaking, inspectors at higher temperatures are more prone to defective products than inspectors at lower temperatures. Therefore, as in this embodiment, the inspection from the higher temperature is performed sequentially, and the inspection of the IC device 90 of the "defective product" in the inspection performed first can be omitted. <Fifth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 11 to 14. The differences from the above embodiment will be mainly described, and the same matters will be described. The description is omitted. This embodiment is the same as the first embodiment except that a third placement area is provided. As shown in FIG. 11, in this embodiment, the electronic component inspection apparatus 1 includes a first tray supply and removal area A1, a first device transfer area A2, an inspection area A3, a second device transfer area A4, and a second tray supply and removal area. A5, the tray replenishment area A6, and the tray waiting area A7. The electronic component inspection apparatus 1 includes a tray transfer mechanism 31 and a tray transfer mechanism 32. The tray replenishment area A6 is provided between the first tray supply and removal area A1 and the second tray supply and removal area A5. The tray replenishment area A6 is a third placement area of the tray 200 for replenishment of the empty space where the IC device 90 is not placed. In this way, by having the tray replenishing area (third placement area) A6, the tray 200 can be replenished to the first tray supply and removal area A1 or the second tray supply and removal area A5 as described below. The placement area) A6 is arranged in an area (space) different from the first tray supply removal area (first placement area) A1 and the second tray supply removal area (second placement area) A5, and an IC device can be placed ( Electronic component) 90 is a tray 200 as a third placement portion. Therefore, the level of classification after inspection can be increased. The tray waiting area A7 is provided between the first device transfer area A2 and the second device transfer area A4. The tray waiting area A7 is an area where the tray 200 supplied from the tray replenishing area A6 is waiting in advance. A plurality of trays 200 may be stacked in the tray replenishing area A6 and the tray waiting area A7. The tray conveyance mechanism 31 is provided so as to straddle the tray replenishing area A6 and the tray waiting area A7. The tray conveying mechanism 31 can make the tray 200 in the Y direction, that is, the arrow α in FIG. 11. 31 Moving part moving in the direction back and forth. Thereby, the tray 200 can be stably fed into the tray waiting area A7, and the tray 200 can be moved from the tray waiting area A7 to the tray replenishing area A6. The tray transfer mechanism 32 is provided so as to span the first device transfer area A2, the tray waiting area A7, and the second device transfer area A4. The tray conveying mechanism 32 can make the tray 200 in the X direction, that is, the arrow α in FIG. 11. 32 Moving part moving in the direction back and forth. Thereby, the tray 200 can be stably fed into the first device transfer area A2 or the second device transfer area A4, and the tray 200 can be moved from the first device transfer area A2 or the second device transfer area A4 to the tray waiting area. A7. According to such an electronic component transfer apparatus 10, the following advantages can be obtained. In the following, this case will be described by taking an ordinary temperature inspection as an example. FIG. 12 is a diagram showing a state in which the IC devices 90 that have undergone the normal temperature inspection are classified into three trays 200 in the second device transfer area A4. For example, in the case of classification for four levels of "Pass 1", "Pass 2", "Re-inspection", and "Fail", three trays 200 and one tray 200 are arranged in the second device transfer area A4. insufficient. Further, in FIG. 12, as an example, the three trays 200 arranged in the second device transfer area A4 are classified as "Pass 1", "Pass 2", and "Recheck" in that order from the -X direction side. Tray 200. That is, in the second device transfer area A4, the tray 200 on which the "failed" IC device 90 is placed is insufficient. In this case, as shown by the arrow α in FIG. 13 200 As shown in the figure, the tray 200 on which the "failed" IC device 90 is placed can be arranged (supplemented) from the tray waiting area A7 to the "pass 1" tray for the second device transfer area A4 by the tray transfer mechanism 32 200 on. Therefore, as shown in FIG. 14, the “failed” IC device 90 can be placed on the supplementary tray 200 and classified. Then, the tray 200 for "failed" can be retreated from the second device transfer area A4 to the tray waiting area A7 again, or it can be directly arranged in the second device transfer area A4 until the next "pass 1" IC device 90 until the arrival. Furthermore, in the configuration shown in the figure, the three-piece tray 200 is moved in the + X direction at a time so as to stagger one tray, but it is also staggered by two pieces or three pieces at a time. It is also possible to have a configuration in which only one tray 200 is conveyed. In addition, the tray 200 for "Failure" may be arranged on the tray 200 for "Pass 2" or may be arranged on the tray 200 for "Re-inspection". In addition, even when the second inspection is performed, any one of the trays 200 from the tray waiting area A7 to the tray 200 of the first device carrying area A2 can be arranged (supplemented) by the tray carrying mechanism 32 in the same manner. on. In this way, the tray 200 as the third placement portion arranged in the tray replenishing area (third placement area) A6 can be moved to the first placement placed in the first tray supply removal area (first placement area) A1. The tray 200 of the placing section or the tray 200 serving as the second placing section is disposed on the second tray supply and removal area (second placing area) A5. This makes it possible to supplement the tray 200 as the third placement portion to the first tray supply removal area A1 or the second tray supply removal area A5. Therefore, the level of classification after inspection can be increased. <Sixth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 15. The differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. . This embodiment is the same as the first embodiment except that a heat pump is provided. As shown in FIG. 15, the electronic component transfer device 10 according to the present embodiment includes a heating section 23, a cooling section 24, and a heat pump 25. The heating unit 23 is configured by, for example, a heater that generates heat by being energized. The heating section 23 is built in the temperature adjustment section 12, the device transfer head 13, the first device supply and recovery section 14, the inspection section 16, and the device transfer head 17 shown in FIG. 2 and heats each section. The cooling unit 24 may be configured to be cooled by supplying a refrigerant, for example. This cooling section 24 is built in the temperature adjustment section 15, the inspection section 16, the second device supply and recovery section 18, the device transfer head 17, and the device transfer head 20, and cools each section. The heat pump 25 can be configured to have a Peltier element, for example. The heat pump 25 is configured to supply exhaust heat generated during cooling of each section by the cooling section 24 to the heating section 23. Thereby, when each part is heated by the heating part 23, heating can be assisted. Therefore, power consumption during heating can be suppressed. <Seventh Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to Figs. 1 and 16 to 26, focusing on differences from the above embodiment. The description of the same matters is omitted. In addition, in the following, for convenience of explanation, the upper side, that is, the positive side in the Z direction, is referred to as "upper" or "upper", and the lower side, that is, the negative side in the Z direction, is referred to as "down" or "lower". The electronic component transfer device 10 of this embodiment is a processor, and includes: as shown in FIG. 16, a transfer section 29 that transfers electronic components; a mounting section (for example, a device supply section 26) that mounts electronic components; such as As shown in FIG. 17, a common path (supply line) 56 supplies fluid to the mounting portion to adjust the temperature of the mounting portion; a discharge path (discharge line) 64A discharges fluid from the mounting portion; at least one switch The valves (the first switching valve 54, the second switching valve 59A, and the second switching valve 59B) are disposed on the common path (supply line) 56 and can enable the common path (supply line) 56 to be in an open state. The fluid is switched by shutting off the passage of the fluid by the closed state; the detection unit 53 is arranged in the discharge path (discharge line) 64A and detects the flow of the fluid through the discharge path (discharge line) 64A; and as As shown in FIG. 1, the control unit 800 can control the switching valve; the control unit 800 judges the state of the switching valve based on the control information of the switching valve and the detection result in the detection unit 53. Thereby, as described below, an operator who operates the electronic component transfer device 10 can perform the transfer of the electronic components using the electronic component transfer device 10 when confirming the judgment result of the state of the switching valve and the operation of the switching valve is normal. On the other hand, the operator may replace the switching valve with a new switching valve, for example, when the switching valve operates in some undesirable situations. Thereby, the switching valve can be normally operated, and therefore, the electronic components can be smoothly transferred by the electronic component transfer device 10. As shown in FIG. 16, the electronic component inspection device 1 according to this embodiment includes an electronic component transfer device 10 and further includes an inspection unit 16 for inspecting electronic components. That is, the electronic component inspection apparatus 1 according to the present embodiment includes a transporting section 29 that transports electronic components, a mounting section (for example, a device supply section 26) for mounting electronic components, and a common path 56 (supply line) for A fluid for adjusting the temperature of the mounting section is supplied to the mounting section; a discharge path (discharge line) 64A, which discharges fluid from the mounting section; at least one switching valve (the first switching valve 54, the second switching valve 59A, and The second switching valve 59B) is arranged in the common path (supply line) 56 and can pass the fluid through the common path (supply line) 56 in an open state and block the passage of the fluid in a closed state. Mode switching; a detection unit 53, which is arranged in the discharge path (discharge line) 64A, and detects the flow of the fluid passing through the discharge path (discharge line) 64A; a control unit 800, which can control a switching valve; and an inspection unit 16, which can Check the electronic parts; the control unit 800 judges the state of the switching valve based on the control information of the switching valve and the detection result in the detecting unit 53. Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component transfer apparatus 10 is obtained. In addition, since the electronic components can be transported to the inspection unit 16, the inspection of the electronic components can be performed by the inspection unit 16. In addition, the electronic components after inspection can be transported from the inspection unit 16. Hereinafter, the configuration of each unit will be described in detail. The electronic component inspection device 1 uses the side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 16 is the front side, and the side where the inspection area A3 is arranged, that is, the upper side in FIG. 16 is the back side. While using. In the electronic component inspection device 1 of the present embodiment, the mounting section on which the IC device (electronic component) 90 is mounted is provided at a plurality of locations, for example, the following temperature adjustment section 12, device supply section 26, and device recovery Department 28. In addition, the mounting portion (the mounting portion on which the IC device (electronic component) 90 is placed) as a replacement kit includes a portion (holding portion) that holds the IC device 90 and a holding portion of the device transfer head 13 A portion (holding portion) of the IC device 90 and a portion (holding portion) of the IC device 90 that holds the IC device 90. In addition, the mounting section on which the IC device (electronic component) 90 is mounted is different from the replacement kit described above, and there are a tray 200, a recycling tray 19, and an inspection section 16 prepared by the user. In this embodiment, a plurality of recesses (bag-shaped bodies) are arranged in a matrix in each tray 200. The IC devices 90 can be stored one by one and placed in each recess. The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 transferred from the tray supply area A1 are respectively transferred and supplied to the inspection area A3. In addition, tray transfer mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided across the tray supply area A1 and the device supply area A2. The tray conveying mechanism 11A is a part of the conveying section 29, and can make the tray 200 together with the IC device 90 placed on the tray 200 to the positive side in the Y direction, that is, the arrow α in FIG. 16 11A Move in the direction. Thereby, the IC device 90 can be stably fed into the device supply area A2. In addition, the tray conveying mechanism 11B can make the empty tray 200 to the negative side of the Y direction, that is, the arrow α in FIG. 16 11B Moving part moving in the direction. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1. The device supply area A2 is also provided with a device supply unit 26 that moves across the device supply area A2 and the inspection area A3. In addition to the temperature adjustment section 12, the cooling unit 900 can also perform the IC devices 90 placed on each of the above-mentioned placement sections (for example, the device supply section 26 requiring temperature adjustment, the holding section of the device transfer head 17, and the inspection section 16). Of cooling. The temperature adjustment section 12 is grounded. In the configuration shown in FIG. 16, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment sections 12. The device transfer head 13 has a holding portion that holds the IC device 90, and is supported so as to be movable in the X direction and the Y direction in the device supply area A2, and is further supported so as to be movable in the Z direction. The device transfer head 13 is also a part of the transfer unit 29, and can transfer IC devices 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and the device supply unit 26 described below. Transfer of IC devices 90 between. Furthermore, in FIG. 16, the X-direction movement of the device transfer head 13 is indicated by the arrow α 13X Indicates that the Y-direction movement of the device transfer head 13 is indicated by the arrow α 13Y Means. The device supply section 26 is a mounting section on which the IC device 90 whose temperature is adjusted by the temperature adjustment section 12 is placed. It is called "supply shuttle". The device supply section 26 may be a part of the transfer section 29. In addition, the device supply section 26 serving as a mounting section is arranged so that it can move along the X direction between the device supply area A2 and the inspection area A3, that is, the arrow α 14 Direction is supported to move back and forth (movable). With this, the device supply section 26 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection section 16 of the inspection area A3, and the IC device 90 can be removed by the device transfer head 17 in the inspection area A3. After that, it returns to the device supply area A2 again. In the configuration shown in FIG. 16, two device supply units 26 are arranged in the Y direction. The device supply unit 26 on the negative side in the Y direction is sometimes referred to as “device supply unit 26A”, and the device on the positive side in the Y direction The supply unit 26 is referred to as a “device supply unit 26B”. The IC device 90 on the temperature adjustment section 12 is transported to the device supply section 26A or the device supply section 26B in the device supply area A2. The device supply unit 26 is the same as the temperature adjustment unit 12 and is configured to cool the IC device 90 placed on the device supply unit 26. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment part 12 can be carried to the vicinity of the inspection part 16 of the inspection area A3, maintaining the temperature adjustment state. It should be noted that the device supply unit 26 is also configured to be capable of heating the IC device 90 similarly to the temperature adjustment unit 12. The device supply section 26 is also grounded in the same manner as the temperature adjustment section 12. The tray transfer mechanism 27 is to remove the empty tray 200 in the state of all the IC devices 90 to the positive side of the X direction in the device supply area A2, that is, the arrow α 15 Directional transport agency. After this transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The device transfer head 17 is a part of the transfer section 29 and is configured similarly to the temperature adjustment section 12 so as to be capable of cooling the held IC device 90. The device transfer head 17 includes a holding portion (mounting portion). The holding portion (mounting portion) is configured to be capable of holding an IC device (electronic component) 90. Thereby, the IC device 90 maintained in the temperature adjustment state can be held, and the IC device 90 can be transported in the inspection area A3 while maintaining the temperature adjustment state. The device transfer head 17 can lift the IC device 90 from the device supply section 26 carried in from the device supply area A2, and transfer and place the IC device 90 to the inspection section 16. In the configuration shown in FIG. 16, two device transfer heads 17 are arranged in the Y direction. The device transfer head 17 on the negative side in the Y direction is sometimes referred to as “device transfer head 17A”, and the Y direction is positive. The device transfer head 17 on the side is referred to as a "device transfer head 17B". The device transfer head 17A is used to transfer the IC device 90 from the device supply section 26A to the inspection section 16 in the inspection area A3, and the device transfer head 17B is used to transfer the IC device 90 from the device supply section 26B to the inspection area A3 Transport by inspection section 16. A recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided in the device collection area A4. A device recovery unit 28 is also provided that moves across the inspection area A3 and the device recovery area A4. An empty tray 200 is also prepared in the device recovery area A4. The device recovery section 28 may be a part of the transport section 29. In addition, the device recovery unit 28 is arranged so that it can move along the X direction between the inspection area A3 and the device recovery area A4, that is, the arrow α. 18 Direction is supported while moving back and forth. In the configuration shown in FIG. 16, the device recovery unit 28 is the same as the device supply unit 26, and two devices are disposed in the Y direction. The device recovery unit 28 on the negative side in the Y direction may be referred to as a “device recovery unit 28A. ", The device recovery unit 28 on the positive side in the Y direction is referred to as" device recovery unit 28B ". Then, the IC device 90 on the inspection section 16 is carried and placed on the device recovery section 28A or the device recovery section 28B. The transfer of the IC device 90 from the inspection section 16 to the device recovery section 28A is performed by the device transfer head 17A, and the transfer from the inspection section 16 to the device recovery section 28B is performed by the device transfer head 17B. The device recovery section 28 is also grounded in the same manner as the temperature adjustment section 12 or the device supply section 26. The recovery tray 19 is a mounting portion on which the IC device 90 inspected by the inspection portion 16 is placed, and is fixed so as not to move within the device recovery area A4. Thereby, even if the device recovery area A4 where various movable parts such as the device transfer head 20 are relatively arranged, the inspected IC devices 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 16, three collection trays 19 are arranged along the X direction. The tray transfer mechanism 21 moves the empty tray 200 carried in from the tray removal area A5 to the X direction in the device recovery area A4, that is, the arrow α twenty one Directional transport agency. After the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be any of the three empty trays 200 described above. In addition, a tray transfer mechanism 22A and a tray transfer mechanism 22B that transfer the trays 200 one by one in the Y direction are provided across the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying section 29, and can make the tray 200 in the Y direction, that is, the arrow α 22A Moving part moving in the direction back and forth. Thereby, the inspected IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B can be used to recover the empty tray 200 of the IC device 90 toward the positive side of the Y direction, that is, the arrow α 22B Move in the direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4. The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 26, the tray transfer mechanism 27, the inspection unit 16, the device transfer head 17, the device recovery unit 28, The operations of the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B. In addition, the control unit 800 may also control operations of various units (for example, the first switching valve 54, the second switching valve 59A, the second switching valve 59B, and the detection unit 53) of the cooling unit 900. As shown in FIG. 17, the electronic component inspection device 1 (electronic component transfer device 10) includes a cooling unit 900. The cooling unit 900 functions as a cooling member (temperature adjustment member) that cools (temperature adjusts) the mounting portion together with the IC device 90. Examples of the mounting portion include the temperature adjustment portion 12, the device supply portion 26, and the device. The holding section and the inspection section 16 of the transfer head 17. Hereinafter, the cooling in the device supply section 26 will be described representatively. In addition, the device supply part 26 is an example which has the recessed part (bag-shaped body) 141, and the recessed part (bag-shaped body) 142. A recessed portion 141 and a recessed portion 142 can respectively store and place a single IC device 90. In addition, the cooling unit 900 can adjust the temperature of all the mounting sections in the temperature adjustment section 12, the device supply section 26, the holding section of the device transfer head 17, and the inspection section 16, or can select from these mounting sections. At least one mounting section is used to adjust the temperature of the selected mounting section. When the temperature of all the mounting parts is adjusted, the temperature of each mounting part may be the same or different. The cooling unit 900 can adjust the temperature of the IC device 90 stored in the recessed portion 141 and the recessed portion 142, respectively. For example, the cooling unit 900 can be adjusted so that the first target temperature, which is the temperature for low-temperature inspection, becomes -45 ° C. In addition, for example, the cooling unit 900 can be adjusted so that the second target temperature which is higher than the first target temperature becomes 18 ° C. (normal temperature). Of course, each target temperature is not limited to this, and can be set to any temperature. In the cooling unit 900, a fluid that adjusts the temperature of the IC device 90 placed on the device supply section (mounting section) 26 is stored in the storage box 55. This flow system is a refrigerant that cools the device supply section (mounting section) 26 together with the IC device 90. As the refrigerant, for example, liquid nitrogen can be used. This allows rapid cooling to the first target temperature. The storage tank 55 is connected to a common path 56 mainly composed of a pipeline (a liquid feeding pipe or an air feeding pipe). The common path 56 is a supply line that supplies a refrigerant (fluid) that adjusts the temperature of the IC device 90 mounted on the device supply section (mounting section) 26 to the device supply section (mounting section) 26. The common passage 56 is preferably provided with a heat insulating material (not shown) on the periphery of the pipeline. The first supply path 57A and the first supply path 57B described below are also the same as the common path 56. A first switching valve 54 is arranged midway in the common path 56. The first switching valve 54 is a valve that can be opened and closed, that is, a valve that can be opened and closed, and is a master switch that can switch the supply of refrigerant and the stop of the supply by opening and closing. The common path (supply line) 56 has a branch line branching into a plurality of (two in the configuration shown in FIG. 17) downstream of the portion where the first switching valve 54 is disposed, that is, the branch is the first The first supply path 57A and the first supply path 57B. The first supply path 57A is connected to an inflow end EnA of a medium flow path 58A formed in the device supply section 26 so as to pass directly below the recessed portion 141. A second switching valve 59A is disposed in the middle of the first supply path 57A. The second switching valve 59A can be opened and closed, that is, a valve that can be opened and closed, and the refrigerant to the medium flow path 58A can be controlled by its opening and closing. Of supply. The first supply path 57B is a pipe having a flow path cross-sectional area approximately equal to that of the first supply path 57A, and is connected to the inflow end EnB of the medium flow path 58B formed in the device supply section 26 so as to pass directly below the recess 142. . A second switching valve 59B is arranged in the middle of the first supply path 57B. The second switching valve 59B can be opened and closed, that is, a valve that can be opened and closed, and the refrigerant to the medium flow path 58B can be controlled by the opening and closing. Of supply. As described above, the common passage (supply line) 56 is provided with a plurality of switching valves that are operated so as to be able to switch the passage and blocking of the refrigerant (fluid) in the common passage (supply line) 56. The switching valve includes the first switching valve 54 that can be opened and closed as described above, and the first switching valve 54 that is disposed further downstream than the first switching valve 54 that is in the common path (supply line) 56. At least one first switching valve that can be opened and closed as described above. The two switching valves, that is, the second switching valve 59A and the second switching valve 59B in this embodiment. As described above, the common passage (supply line) 56 has a branch line branching into two (plurality) further downstream than the portion where the first switching valve 54 is disposed. Furthermore, a second switching valve 59A is arranged on each branch line, that is, a first supply path 57A, and a second switching valve 59B is arranged on the first supply path 57B. According to this configuration, by appropriately combining, for example, the opening and closing of the respective switching valves of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B, it is possible to easily select the refrigerant to both the recessed portion 141 and the recessed portion 142. The primary supply, the primary supply of the refrigerant to both the recessed portion 141 and the recessed portion 142 is stopped, and the supply of the refrigerant to any one of the recessed portion 141 and the recessed portion 142. In addition, the common path 56 is branched into two in accordance with the number of the recessed portions (the recessed portions 141 and 142) included in the device supply portion 26 in the configuration shown in FIG. 17, but it is not limited thereto. For example, in a case where the number of the recessed portions included in the device supply portion 26 is one, the branch in the common path 56 is omitted, and one second switching valve is disposed further downstream than the first switching valve 54. In addition, when the number of the recesses in the device supply section 26 is three or more, the number of branches in the common passage 56 also becomes three or more. The number of the branches and the number of branches is further downstream than the first switching valve 54. Same number of second switching valves. In this embodiment, the configuration of the fluid circuit in the cooling unit 900 (for example, the arrangement pattern of the common passages 56, the first supply path 57A, and the respective lines of the first supply path 57B, or the first switching valve 54 (The type, arrangement, and number of the respective switching valves of the second switching valve 59A and the second switching valve 59B) are not limited to those shown in FIG. 17. The first switching valve 54, the second switching valve 59A, and the second switching valve (switching valve) 59B are so-called "normally closed", and they are opened when energized, and can pass the refrigerant (fluid). When the power is turned on, the refrigerant (fluid) is shut off. Thereby, for example, when the environment where the electronic component inspection device 1 is used is in a power outage, the refrigerant is blocked, and therefore, continuous supply of the refrigerant can be prevented. The gasification vessel 60 is shared more downstream than the portion where the second switching valve 59A is disposed on the first supply path 57A, and further downstream than the portion where the second switching valve 59B is disposed on the first supply path 57B. The inside of the gasification vessel 60 is partitioned into a gasification chamber 61A and a gasification chamber 61B having a larger cross-sectional area than the first supply path 57A and the first supply path 57B. Liquid nitrogen from the first supply path 57A flows into the gasification chamber 61A, and liquid nitrogen from the first supply path 57B flows into the gasification chamber 61B. Liquid nitrogen flowing into the gasification chamber 61A and the gasification chamber 61B, respectively, becomes nitrogen gas having a temperature lower than the first target temperature, and flows out of the gasification container 60. In addition, the refrigerant serving as nitrogen may flow into the medium flow path 58A to cool the inside of the recessed portion 141, and may flow into the medium flow path 58B to cool the inside of the recessed portion 142. A heater 62A is provided immediately below the recessed portion 141 inside the device supply portion 26, and a heater 62B is provided directly below the recessed portion 142. The heater 62A can heat the inside of the recessed portion 141, and the heater 62B can heat the inside of the recessed portion 142. In addition, the IC device 90 placed in the recessed portion 141, that is, the IC device 90 placed in the recessed portion 141 is controlled to the first target temperature by cooling with nitrogen passing through the medium flow path 58A and heating with the heater 62A. Similarly, the IC device 90 placed in the recessed portion 142, that is, the IC device 90 placed in the recessed portion 142 is controlled to the first target temperature by cooling with nitrogen flowing through the medium flow path 58B and heating with the heater 62B. In addition, a temperature sensor 63A that detects the temperature in the recessed portion 141 is provided in the recessed portion 141, and a temperature sensor 63B that detects the temperature in the recessed portion 142 is provided in the recessed portion 142. To the outflow end ExA of the medium flow path 58A, a discharge path 64A is connected as a discharge line for discharging the refrigerant (fluid) from the recessed part 141 side of the device supply section (mounting section) 26. The discharge path 64A is connected to a storage box 50 serving as a storage container having a space containing the storage device supply section 26, and a refrigerant (nitrogen) discharged from the medium flow path 58A is introduced into the storage box 50. Further, a discharge path (discharge line) 64B for discharging the refrigerant (fluid) from the recessed portion 142 side of the device supply section (mounting section) 26 is connected to the outflow end ExB of the medium flow path 58B. The discharge path 64B is connected to the discharge path 64A by the connection portion 65 and discharges the refrigerant (nitrogen) discharged from the medium flow path 58B to the discharge path 64A. In the discharge path 64A, a check valve 66A is disposed upstream of the connection portion 65 with the discharge path 64B. The check valve 66A allows gas to flow from the medium flow path 58A to the connection portion 65, and suppresses the refrigerant (nitrogen ) Flows from the connecting portion 65 to the medium flow path 58A. Similarly, in the discharge path 64B, a check valve 66B is disposed upstream of the connection portion 65 with the discharge path 64A. This check valve 66B allows the refrigerant (nitrogen) to flow from the medium flow path 58B to the connection portion 65. In addition, the flow of the refrigerant (nitrogen) from the connection portion 65 to the medium flow path 58B is suppressed. By providing such a check valve 66A and a check valve 66B, for example, the refrigerant discharged from the medium flow path 58A can be prevented from flowing back into the medium flow path 58B, and the refrigerant discharged from the medium flow path 58B can be prevented from being discharged. The path 64A flows back into the medium flow path 58A. A heat exchanger 67 as a heating portion is disposed on the discharge path 64A further downstream than the connection portion 65 with the discharge path 64B. The heat exchanger 67 is a so-called plate heat exchanger, and is connected to a discharge path 64A and a purified air supply path 70 that supplies dry air from the dry air supply source 69 as purified air. In the heat exchanger 67, the refrigerant flowing through the discharge path 64A and the purified air flowing through the purified air supply path 70 become parallel flows, and heat exchange is performed between the refrigerant and the purified air. In the discharge path 64A, a check valve 68 is disposed on the downstream side of the heat exchanger 67. The check valve 68 allows gas to flow from the heat exchanger 67 to the storage box 50, and suppresses gas from moving from the storage box 50 to heat. The return of the exchanger 67. By providing such a check valve 68, it is possible to prevent air with more moisture content than the refrigerant (nitrogen) from flowing from the storage box 50 into the heat exchanger 67, the medium flow path 58A, the medium flow path 58B, and the air through the discharge path 64A.化 Container 60. As a result, when the second switching valve 59A and the second switching valve 59B are controlled to be opened again, it is possible to suppress the heat exchanger 67, the medium flow path 58A, and the medium flow path that are positioned more upstream than the check valve 68. Condensation or freezing occurs in the flow path of the refrigerant (nitrogen) such as 58B and the gasification container 60. Further, a check valve 68 located downstream of the discharge path (discharge line) 64A is disposed downstream of the non-return valve 68A for detecting the state (for example, pressure or flow rate) of the refrigerant (fluid) flowing through the discharge path (discharge line) 64A. Detector 53. The detection unit 53 includes a pressure gauge (pressure sensor) 531 that detects the pressure of the refrigerant (fluid) passing through the discharge path (discharge line) 64A, or a flow rate of the refrigerant (fluid) that detects the pressure passing through the discharge path (discharge line) 64A. A flow meter (flow sensor) 532 (see FIG. 27) is configured. In the configuration shown in FIG. 17, the detection unit 53 is configured by a pressure gauge 531. By using the pressure gauge 531, a simple configuration can be used to easily grasp the state of the flow of the refrigerant through the discharge path 64A, that is, to what extent the refrigerant flows. The dry air supply source 69 is configured by a compressor or a dryer, and compresses and dries the air around the electronic component inspection device 1 to supply it to the purified air supply path 70. The supply amount to the purified air supply path 70 is controlled by a purified air supply valve 71 that changes the cross-sectional area of the flow path of the purified air supply path 70. The purified air supply path 70 is connected to the storage box 50 and guides the purified air flowing out of the heat exchanger 67 to the storage box 50. An air heater 72 for heating the purified air is disposed between the purified air supply valve 71 and the heat exchanger 67 in the purified air supply path 70. The heat exchanger 67 is supplied with purified air heated by the air heater 72. In the purified air supply path 70, a check valve 73 is disposed downstream of the heat exchanger 67. The check valve 73 allows gas to flow from the heat exchanger 67 to the storage box 50, and suppresses gas from the storage box 50. Return to the heat exchanger 67. By providing such a check valve 73, it is possible to suppress the inflow of air with a higher moisture content than the refrigerant (nitrogen) from the storage box 50, and to maintain the heat exchanger 67 and the purified air supply path 70 in a dry state. The dry air supply source 69 supplies the dry air generated by the dry air supply source 69 to the second supply path 75 in addition to the purified air supply path 70 described above. The second supply path 75 is branched into a second supply path 75A and a second supply path 75B by a branching section 76. The second supply path 75A is connected to the first supply path 57A by a connection portion 77A, and the second supply path 75B is connected to the first supply path 57B by a connection portion 77B. The second supply path 75 is located upstream of the branch portion 76, and is provided with a control valve for increasing the temperature of the second supply path 75 by changing the cross-sectional area of the flow path of the second supply path 75 and controlling the supply amount of the temperature-increasing gas to the second supply path 75.气 Supply valve 78. Further, between the warming gas supply valve 78 and the branch portion 76 in the second supply path 75, a heating portion that heats the warming gas to a specific temperature higher than the second target temperature, which is 18 ° C, for example, 60 ° C, is disposed. Air heater 79. That is, when the second switching valve 59A and the second switching valve 59B are in a closed state and the temperature-rising gas supply valve 78 is in an open state, a temperature-rising gas having a temperature higher than the second target temperature flows into the first supply path 57A and In the first supply path 57B, the recessed portion 141 and the recessed portion 142 are directly heated by the warming gas. Further, the second supply path 75A is provided as a stopper that allows a temperature-rising gas to flow from the second supply path 75 to the first supply path 57A, and suppresses the flow of nitrogen from the first supply path 57A to the second supply path 75. Check valve 80A. Similarly, a stopper is provided in the second supply path 75B to allow the warming gas to flow from the second supply path 75 to the first supply path 57B, and to suppress the flow of nitrogen from the first supply path 57B to the second supply path 75. The check valve 80B. The cooling unit 900 configured as described above can perform cooling control (cooling operation) for cooling the device supply section 26 and the IC device 90 together with normal temperature recovery control (normal temperature recovery operation) for returning the cooling state to normal temperature. The cooling control system sets the first switching valve 54 to "OPEN", the second switching valve 59A to "OPEN", the second switching valve 59B to "OPEN", and the warming gas supply valve 78 is "CLOSE", the purified air supply valve 71 is "OPEN", the heater 62A is "on", the heater 62B is "on", and the air heater 72 is "on" And the air heater 79 is set to "OFF". The normal temperature recovery control system sets the first switching valve 54 to "CLOSE", sets the second switching valve 59A to "CLOSE", sets the second switching valve 59B to "CLOSE", and supplies warming gas. Valve 78 is "OPEN", purified air supply valve 71 is "OPEN", heater 62A is "on", heater 62B is "on", and air heater 72 is "on"", And the air heater 79 is turned on. In addition, when the user of the electronic component inspection device 1 uses the electronic component inspection device 1, a storage box 55 is separately prepared and connected to the common path 56 of the electronic component inspection device 1. When foreign matter such as garbage, dust, and metal powder is mixed in the storage box 55, the foreign matter passes through the common passage 56 with the refrigerant and is caught in the first switching valve 54, the second switching valve 59A, and the second switching. There is a risk of any of the valves 59B. In this case, it is considered that it is difficult to perform the normal opening and closing operation of the switching valve with the foreign matter stuck. For example, when the switching valve should be in a closed state but kept open due to a foreign matter stuck, the refrigerant is continuously supplied in vain. In addition, due to the excessive supply of the refrigerant, excessive cooling may result in failure to perform temperature control, or in order to eliminate excessive cooling, it is necessary to excessively operate the heater 62A or the heater 62B. In addition, a case where the first switching valve 54, the second switching valve 59A, and the second switching valve 59B are difficult to perform normal opening and closing operations due to deterioration with time is also considered. The same bad situation also occurs in this case. Therefore, in the electronic component inspection apparatus 1, it is comprised so that such a malfunction can be prevented. The configuration and effect will be described below. The control unit 800 is based on control information (a signal indicating whether to set the open state or the closed state) to actuate the first switching valve 54, the second switching valve 59A, and the second switching valve (switching valve) 59B. The detection result of the unit 53 (pressure gauge 531) determines the state of each switching valve described above. This determination is hereinafter referred to as "switching valve state determination". Specifically, the "judgment valve state judgment" refers to whether the operation of the switching valve is normal, that is, whether the switching valve is operated in a state capable of temperature control or whether the operation of the switching valve is abnormal. And, as a result of this determination, if there is a case where the switching valve is determined to be abnormal, the switching valve may be replaced with a new switching valve, for example. With this, the switching valve can be normally operated, that is, capable of temperature control, and therefore, the above-mentioned problems can be prevented. The control unit 800 can perform three controls to determine the states of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B, respectively. This control program will be described based on the flowcharts of FIGS. 18 to 20. In addition, the timing for performing this control is not particularly limited. For example, it is preferable to perform each periodicity of the timer operation before the start of transfer (inspection) of each batch, after the end of transfer (inspection) of each batch. Time, etc. Fig. 18 is a flowchart of the first control program. The control unit 800 is to switch one of the first switching valve 54 and the second switching valve (the second switching valve 59A and the second switching valve 59B) to a closed state and to switch the other switching valve to an open state State judgment (judgment). In the first control program, the control unit 800 sets the first switching valve 54 to a closed state (step S401), and sets the second switching valve 59A and the second switching valve 59B to an open state (step S402). Then, in this state, the pressure gauge 531 (detection unit 53) is operated to detect the pressure value (detection value) P 1 (Step S403). Determine the pressure value P 1 Whether it is a preset reference value M 1 (Step S404). In step S404, the pressure value (detection value) P in the pressure gauge 531 (detection unit 53) 1 Is a preset reference value (value) M 1 In this case, if the operation of the first switching valve 54 is normal, a switching valve state determination (judgment) is performed, and the intention is reported using the monitor 300 or the like (step S405). In addition, as a result of the determination in step S404, the pressure value P 1 Not a reference value M 1 (Pressure value P 1 Exceeding the reference value M 1 ), If the operation of the first switching valve 54 is abnormal, the switching valve state is judged, and the intention is reported using the monitor 300 or the like (step S406). Furthermore, as the reference value M 1 , For example, it can be set to the atmospheric pressure when the first control program is executed. Then, after the operator who operates the electronic component inspection device 1 confirms the report in step S405, an inspection using the IC device 90 of the electronic component inspection device 1 can be performed. On the other hand, after confirming the report in step S406, the operator can know that the first switching valve 54 is clogged with a foreign object and an abnormal operation has occurred. The operator may replace the first switching valve 54 with a new first switching valve 54, for example. Thereby, the first switching valve 54 can be normally operated. Therefore, the above-mentioned problems can be prevented, and the inspection of the IC device 90 can be performed. Fig. 19 is a flowchart of the second control program. The control unit 800 is to switch one of the first switching valve 54 and the second switching valve (the second switching valve 59A and the second switching valve 59B) to a closed state, and to switch the other switching valve to an open state. State judgment (judgment). In the second control program, the control unit 800 sets the first switching valve 54 to the open state (step S501), and sets the second switching valve 59A and the second switching valve 59B to the closed state (step S502). Then, in this state, the pressure gauge 531 (detection unit 53) is operated to detect the pressure value (detection value) P 2 (Step S503). Determine the pressure value P 2 Whether it is a preset reference value M 2 (Step S504). In step S504, the pressure value (detection value) P in the pressure gauge 531 (detection unit 53) 2 Is a preset reference value (value) M 2 In this case, if the operation of the second switching valve 59A and the second switching valve 59B is normal, a switching valve state determination (judgment) is performed, and the intention is reported using the monitor 300 or the like (step S505). In addition, as a result of the determination in step S504, the pressure value P 2 Not a reference value M 2 (Pressure value P 2 Exceeding the reference value M 2 ), If there is an abnormality in the operation of at least one of the second switching valve 59A and the second switching valve 59B, the switching valve state is determined, and the intention is reported using the monitor 300 or the like (step S506). Furthermore, as the reference value M 2 , For example, it can be set to the atmospheric pressure when the second control program is executed. Then, after the operator confirms the report in step S505, inspection of the IC device 90 using the electronic component inspection apparatus 1 can be performed. On the other hand, after confirming the report in step S506, the operator can know that at least one of the second switching valve 59A and the second switching valve 59B is clogged with a foreign object and an abnormal operation occurs. The operator may replace the second switching valve having an abnormality in the second switching valve 59A and the second switching valve 59B, for example, with a new second switching valve. With this, the second switching valve 59A and the second switching valve 59B can be normally operated. Therefore, the above-mentioned problems can be prevented, and the inspection of the IC device 90 can be performed. Fig. 20 is a flowchart of the third control program. The control unit 800 sets the first switching valve 54 to an open state (step S601). Then, one of the second switching valves arranged in each branch line is opened, and the remaining second switching valves are closed. That is, the second switching valve 59A disposed in the first supply path 57A is opened (step S602), and the second switching valve 59B disposed in the first supply path 57B is closed (step S603). Then, in this state, the pressure gauge 531 (detection unit 53) is operated to detect the pressure value (detection value) P 3 (Step S604). Determine the pressure value P 3 Whether it is a preset reference value M 3 (Step S605). In step S605, the pressure value (detection value) P in the pressure gauge 531 (detection unit 53) 3 Is a preset reference value (value) M 3 In this case, if the operation of the second switching valve 59A (the second switching valve in the opened state) is normal, the switching valve state is judged (judged), and the intention is reported using the monitor 300 or the like (step S606). In addition, as a result of the determination in step S605, the pressure value P 3 Not the reference value M 3 (E.g. pressure value P 3 In the case of the same atmospheric pressure), if the operation of the second switching valve 59A is abnormal, the switching valve state is judged, and the intention is reported using the monitor 300 or the like (step S607). The second switching valve 59A is then closed (step S608), and the second switching valve 59B is opened (step S609). Then, in this state, the pressure gauge 531 is operated to detect the pressure value P 3 (Step S610). Determine the pressure value P 3 Whether it is the reference value M 3 (Step S611). In step S611, at the pressure value P 3 Is the reference value M 3 In this case, if the operation of the second switching valve 59B (the second switching valve in the opened state) is normal, the switching valve state is judged, and the intention is reported using the monitor 300 or the like (step S612). In addition, as a result of the determination in step S611, the pressure value P 3 Not the reference value M 3 (E.g. pressure value P 3 In the case of the same atmospheric pressure), if the operation of the second switching valve 59B is abnormal, the switching valve state is judged, and the intention is reported using the monitor 300 or the like (step S613). Moreover, the reference value M 3 For example, it can be set to any size other than atmospheric pressure. Then, after the operator confirms the reports in step S606 and step S612, the inspection using the IC device 90 of the electronic component inspection apparatus 1 can be performed. On the other hand, after confirming the reports in step S607 and step S613, the operator can know that the second switching valve 59A and the second switching valve 59B, for example, have malfunctioned, and the operation has been abnormal. The operator can replace the second switching valve 59A and the second switching valve 59B with, for example, new second switching valve 59A and the second switching valve 59B. With this, the second switching valve 59A and the second switching valve 59B can be normally operated. Therefore, the above-mentioned problems can be prevented, and the inspection of the IC device 90 can be performed. With the first control program, the second control program, and the third control program as described above, each state of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B can be accurately determined (for example, Is it operating normally or is it abnormal?) Thereby, the above-mentioned problems can be prevented, and the electronic component inspection apparatus 1 can be operated. Next, an example of a format of execution of setting a switching valve state judgment and an example of a format of displaying an execution result will be described with reference to FIGS. 21 to 26. Furthermore, "format" is sometimes called "screen", "dialog", "window", and so on. First, the format FM1 shown in FIG. 21 is displayed on the monitor 300. Format FM1 is the main screen. This format FM1 includes a button group BT100, a first group IT110, a second group IT120, a third group IT130, a fourth group IT140, a fifth group IT150, and a sixth group IT160. In the button group BT100, there are buttons BT101 for "End", buttons BT102 for "Shutdown", buttons BT103 for "Device Setting", buttons BT104 for "Unit Setting", buttons BT105 for "Maintenance", and "Use" Button BT106 for "definition" and button BT107 for "computer". The first item group IT110 includes the item IT111 for "user selection" setting, the item IT112 for "temperature mode" setting, the item IT113 for "test machine connection" setting, the item IT114 for "transport mode" setting, IT115 for "Start Mode" setting, IT116 for "Bin Setting" setting, IT117 for "Humidity and temperature in each area" display, IT118 for "Setting data" setting, and "Test point" setting IT119. The second item group IT120 includes the item IT121 for setting the "supply shuttle", the item IT122 for setting the "soaking plate (temperature adjustment unit)", the item IT123 for setting the "arm 2", and the setting for "arm 1" Item IT124, item IT125 for "Socket heater" setting, and item IT126 for "Socket air, socket cooling" setting. The third item group IT130 includes an item 131 for displaying "information related to oxygen concentration in each region" and an item 132 for displaying "oxygen concentration determination value". The fourth item group IT140 is a "supply / storage counter", which includes the item IT141 for "supply" confirmation, the item IT142 for "total" confirmation, the item IT143 for "good and defective", and "storage 1 to storage." 4. Fixed IT1 to Fixed 4 "IT144 for confirmation. The fifth item group IT150 is a "contact counter", which includes an item IT151 for "comprehensive" setting, an item IT152 for "device type" setting, an item IT153 for "device type%" setting, and "arm 1, arm 2" Confirmation item IT154. The sixth item group IT160 is a "test machine category" and includes an item IT161 for "arm 2" confirmation and an item IT162 for "arm 1" confirmation. Next, if the button BT105 of the button group BT100 is operated, as shown in FIG. 22, the format FM2 is superimposed on the format FM1 and displayed. The format FM2 is an icon menu. In this format FM2, it includes a button for "building" BT201, a button for "start mode" BT202, a button for "counter" BT203, a button for "counter clear" BT204, a button for "temperature monitor" BT205, BT206 button for "tower lamp", BT207 button for "password", BT208 button for "security", BT209 button for "production management", BT210 button for "function setting", and "controller" button BT211, button for "DIO setting" BT212, button for "I / F monitor" BT213, button for "low temperature operation" BT214, button for "processor ID" BT215, and button for "end" BT216 . Next, if the button BT214 of the format FM2 is operated, a screen for low-temperature operation setting is displayed on the monitor 300, that is, the format FM3 shown in FIG. 23. The format FM3 includes a first project group IT310, a second project group IT320, a third project group IT330, and a fourth project group IT340. The first item group IT310 is a "small window" and includes an item IT311 for "open warning time" and an item IT312 for "warning humidity". The second item group IT320 is used as "dew point monitoring" and includes item IT321 for "recovery area (compensation)", item IT322 for "+ set temperature", and item IT323 for "unloader area". The third item group IT330 is an "unloading operation", and includes an item IT331 for "waiting for door closing time" and an item IT332 for "purifying time after uninstallation". The fourth item group IT340 is used as "LN2 valve confirmation", and includes item IT341 for "sensor stabilization waiting time", item IT342 for "LN2 valve periodic confirmation (stopping)", and "confirmation interval". Item IT343. In addition, by checking the item IT342 and pressing the "OK" button BT351, the execution of the switching valve state judgment can be set. In contrast, when the inspection of item IT342 is omitted, the setting of the execution of the switching valve state judgment is cancelled. In addition, in the fourth item group IT340, in addition to the button BT351, the button BT352 for "delete" and the button BT353 for "application" are included. In the item IT341, the time until the refrigerant in the common path 56 passes completely can be set. When the pressure detected by the pressure gauge 531 becomes the atmospheric pressure within the set time, it is determined that the refrigerant has completely passed through the common passage 56. If the item IT342 is checked and the time for the entry of item IT343 is elapsed after pressing the "OK" button BT351, the format FM4 shown in FIG. 24 is displayed. In format FM4, it includes item IT410, item IT420, button BT430, and button BT440. For item IT410, for example, "Specified time (12 hours) has elapsed. Therefore, the operation confirmation of the LN2 valve is implemented. When starting immediately, please select [Execute Now]. When the confirmation is postponed, please select [Execute extension]". When [Run Now] is selected, press the button BT430 for "Run Now". On the other hand, when [Extension Delay] is selected, the button BT440 for "Extension Delay (15 minutes)" is pressed. At IT420, the countdown time is displayed. After the switching valve state determination is performed, when the operation of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B is abnormal, the format FM5 shown in FIG. 25 or FIG. 26 is displayed. In the format FM5, it includes project IT510, project IT520, project IT530, project IT540, project IT550, and layout LO560. Item IT510 is "error code". In FIG. 25, it is displayed as “612”, and in FIG. 26, it is displayed as “613”. Item IT520 is the number of "unit". In Figs. 25 and 26, "15" is displayed. Item IT530 is "unit name". In Fig. 25 and Fig. 26, both are shown as "temperature adjustment". Item IT540 is a "problem", which shows a switching valve with abnormal operation. In Figure 25, "LN2 main valve is abnormal, and the sensor for confirming the failure of the LN2 valve is closed. Please try again and start after selecting." In Fig. 26, "LN2 control valve is abnormal. The sensor for confirming the failure of the LN2 valve is closed. Please try again and start after selecting." Item IT550 displays detailed information about the switching valve with abnormal operation as "Details". In Figure 25, it is displayed as "In the case of reconfirmation, please choose to start after retrying; In the case of cooling down, please choose to reset after pausing; (1) There is a possibility that the LN2 main valve may fail, Close the LN2 supply valve ". In Figure 26, it is displayed as "In the case of reconfirmation, please choose to start after retrying; In the case of stopping the cooling, please choose to reset after pausing; (1) There is a possibility that any of the LN2 control valves may fail Please close the LN2 supply valve ". The layout LO560 indicates the layout (arrangement) of the main parts of the electronic component inspection device 1. In FIG. 26, "LN2" is marked with a circle. <Eighth Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 27. The differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. . This embodiment is the same as the seventh embodiment except that the configuration of the detection section is different. The detection unit 53 is a pressure gauge (pressure sensor) 531 (see FIG. 17) that detects the pressure of the refrigerant (fluid) passing through the discharge path (discharge line) 64A, or detects the refrigerant (pressure) (64) The flow rate (fluid sensor) 532 of the flow rate of the fluid) is configured. As shown in FIG. 27, in the present embodiment, the detection unit 53 is configured by a flow meter 532. By using the flow meter 532, the state of the flow of the refrigerant through the discharge path 64A can be easily grasped with a simple configuration, that is, to what extent the refrigerant flows. The electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device can be replaced with Any constituent who performs the same function. Moreover, you may add arbitrary structures. The electronic component transfer device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) in each of the embodiments described above. In addition, in the electronic component transfer device and the electronic component inspection device of the present invention, the inspection may be performed in the order of normal temperature inspection, high temperature inspection, and low temperature inspection, and the inspection may be performed in the order of low temperature inspection, high temperature inspection, and normal temperature inspection. It can also be inspected in the order of high temperature inspection, low temperature inspection, and normal temperature inspection. That is, when it is convenient to perform at least two of the normal temperature inspection, the high temperature inspection, and the low temperature inspection, the effects of the present invention can be exhibited. Also, in each of the above embodiments, the configuration in which the mounting portion is cooled together with the IC device is described. The fluid used is a refrigerant, but it is not limited to this. For example, the mounting portion may be combined with the IC. The device is heated together. In this case, the fluid used may be, for example, water (hot water) or oil. The detection unit that detects the flow of the fluid passing through the discharge line is not limited to a pressure gauge or a flow meter, and may be, for example, a temperature sensor that detects the temperature of the fluid. In addition, for example, it is possible to use only the ON / OFF detection of the passage or stop of the fluid.

1‧‧‧電子零件檢查裝置1‧‧‧Electronic parts inspection device

10‧‧‧電子零件搬送裝置10‧‧‧Electronic parts transfer device

11‧‧‧托盤搬送機構11‧‧‧Tray transfer mechanism

11A‧‧‧托盤搬送機構11A‧‧‧Tray transfer mechanism

11B‧‧‧托盤搬送機構11B‧‧‧Tray transfer mechanism

12‧‧‧溫度調整部12‧‧‧Temperature Adjustment Department

13‧‧‧器件搬送頭13‧‧‧ device transfer head

14‧‧‧第1器件供給回收部14‧‧‧The first device supply and recovery department

14A‧‧‧第1器件供給回收部14A‧‧‧The first device supply and recovery department

14B‧‧‧第1器件供給回收部14B‧‧‧The first device supply and recycling department

15‧‧‧溫度調整部15‧‧‧Temperature Adjustment Department

16‧‧‧檢查部16‧‧‧ Inspection Department

17‧‧‧器件搬送頭17‧‧‧ device transfer head

17A‧‧‧器件搬送頭17A‧‧‧device transfer head

17B‧‧‧器件搬送頭17B‧‧‧ Device Transfer Head

18‧‧‧第2器件供給回收部18‧‧‧The second device supply and recovery department

18A‧‧‧第2器件供給回收部18A‧‧‧Second Device Supply Recovery Section

18B‧‧‧第2器件供給回收部18B‧‧‧Second Device Supply Recovery Section

19‧‧‧回收用托盤19‧‧‧Recycling tray

20‧‧‧器件搬送頭20‧‧‧ device transfer head

21‧‧‧托盤搬送機構21‧‧‧Tray transfer mechanism

22‧‧‧托盤搬送機構22‧‧‧Tray transfer mechanism

22A‧‧‧托盤搬送機構22A‧‧‧Tray transfer mechanism

22B‧‧‧托盤搬送機構22B‧‧‧Tray transfer mechanism

23‧‧‧加熱部23‧‧‧Heating section

24‧‧‧冷卻部24‧‧‧ Cooling Department

25‧‧‧熱泵25‧‧‧ heat pump

26‧‧‧器件供給部26‧‧‧Device Supply Department

26A‧‧‧器件供給部26A‧‧‧Device Supply Department

26B‧‧‧器件供給部26B‧‧‧Device Supply Department

27‧‧‧托盤搬送機構27‧‧‧Tray transfer mechanism

28‧‧‧器件回收部28‧‧‧Device Recycling Department

28A‧‧‧器件回收部28A‧‧‧Device Recycling Department

28B‧‧‧器件回收部28B‧‧‧Device Recycling Department

29‧‧‧搬送部29‧‧‧Transportation Department

31‧‧‧托盤搬送機構31‧‧‧pallet transfer mechanism

32‧‧‧托盤搬送機構32‧‧‧Tray transfer mechanism

50‧‧‧收納盒50‧‧‧Storage Box

53‧‧‧檢測部53‧‧‧Testing Department

54‧‧‧第1切換閥54‧‧‧The first switching valve

55‧‧‧儲藏箱55‧‧‧Storage Box

56‧‧‧共通路56‧‧‧ common channel

57A‧‧‧第1供給路57A‧‧‧The first supply road

57B‧‧‧第1供給路57B‧‧‧The first supply road

58A‧‧‧介質流路58A‧‧‧Media flow path

58B‧‧‧介質流路58B‧‧‧Media flow path

59A‧‧‧第2切換閥59A‧‧‧The second switching valve

59B‧‧‧第2切換閥59B‧‧‧The second switching valve

60‧‧‧氣化容器60‧‧‧Gasification container

61A‧‧‧氣化室61A‧‧‧Gasification chamber

61B‧‧‧氣化室61B‧‧‧Gasification chamber

62A‧‧‧加熱器62A‧‧‧heater

62B‧‧‧加熱器62B‧‧‧Heater

63A‧‧‧溫度感測器63A‧‧‧Temperature sensor

63B‧‧‧溫度感測器63B‧‧‧Temperature Sensor

64A‧‧‧排出路64A‧‧‧Exhaust

64B‧‧‧排出路64B‧‧‧Exhaust

65‧‧‧連接部65‧‧‧ Connection Department

66A‧‧‧止回閥66A‧‧‧Check valve

66B‧‧‧止回閥66B‧‧‧Check valve

67‧‧‧熱交換器67‧‧‧Heat exchanger

68‧‧‧止回閥68‧‧‧Check valve

69‧‧‧乾燥空氣供給源69‧‧‧ Dry air supply source

70‧‧‧淨化空氣供給路70‧‧‧purified air supply path

71‧‧‧淨化空氣供給閥71‧‧‧purified air supply valve

72‧‧‧空氣加熱器72‧‧‧Air heater

73‧‧‧止回閥73‧‧‧ check valve

75‧‧‧第2供給路75‧‧‧ 2nd supply road

75A‧‧‧第2供給路75A‧‧‧Second Supply Road

75B‧‧‧第2供給路75B‧‧‧ 2nd Supply Road

76‧‧‧分支部76‧‧‧ Branch

77A‧‧‧連接部77A‧‧‧ Connection

77B‧‧‧連接部77B‧‧‧ Connection Department

78‧‧‧升溫氣體供給閥78‧‧‧Heating gas supply valve

79‧‧‧空氣加熱器79‧‧‧air heater

80A‧‧‧止回閥80A‧‧‧Check valve

80B‧‧‧止回閥80B‧‧‧Check valve

90‧‧‧IC器件(電子零件)90‧‧‧IC devices (electronic parts)

141‧‧‧凹部(袋狀體)141‧‧‧concave (pocket)

142‧‧‧凹部(袋狀體)142‧‧‧concave (pocket)

200‧‧‧托盤(第1及第2載置部)200‧‧‧Tray (1st and 2nd mounting sections)

231‧‧‧第1隔壁231‧‧‧The first next door

232‧‧‧第2隔壁232‧‧‧Next door

233‧‧‧第3隔壁233‧‧‧3 next door

234‧‧‧第4隔壁234‧‧‧Next door 4

235‧‧‧第5隔壁235‧‧‧5th Next Door

241‧‧‧前外殼241‧‧‧Front housing

242‧‧‧側外殼242‧‧‧side shell

243‧‧‧側外殼243‧‧‧side shell

244‧‧‧後外殼244‧‧‧ rear shell

245‧‧‧頂外殼245‧‧‧Top case

300‧‧‧監視器300‧‧‧ monitor

301‧‧‧顯示畫面301‧‧‧display

400‧‧‧信號燈400‧‧‧ signal light

500‧‧‧揚聲器500‧‧‧Speaker

531‧‧‧壓力計(壓力感測器)531‧‧‧ pressure gauge (pressure sensor)

532‧‧‧流量計(流量感測器)532‧‧‧flow meter (flow sensor)

600‧‧‧滑鼠台600‧‧‧Mouse Station

700‧‧‧操作面板700‧‧‧ operation panel

800‧‧‧控制部800‧‧‧ Control Department

801‧‧‧記憶部801‧‧‧Memory Department

900‧‧‧冷卻單元900‧‧‧ cooling unit

A1‧‧‧第1托盤供給去除區域(第1載置區域)(托盤供給區域)A1‧‧‧1st tray supply removal area (first placement area) (tray supply area)

A2‧‧‧第1器件搬送區域(器件供給區域)A2‧‧‧1st device transfer area (device supply area)

A3‧‧‧檢查區域A3‧‧‧ Inspection area

A4‧‧‧第2器件搬送區域(器件回收區域)A4‧‧‧2nd device transfer area (device recycling area)

A5‧‧‧第2托盤供給去除區域(第2載置區域)(托盤去除區域)A5‧‧‧Second tray supply and removal area (second placement area) (tray removal area)

A6‧‧‧托盤補充區域A6‧‧‧ Pallet replenishment area

A7‧‧‧托盤等待區域A7‧‧‧Tray waiting area

BT100‧‧‧按鈕群BT100‧‧‧ Button Group

BT101‧‧‧按鈕BT101‧‧‧ button

BT102‧‧‧按鈕BT102‧‧‧ button

BT103‧‧‧按鈕BT103‧‧‧ button

BT104‧‧‧按鈕BT104‧‧‧ button

BT105‧‧‧按鈕BT105‧‧‧ button

BT106‧‧‧按鈕BT106‧‧‧ button

BT107‧‧‧按鈕BT107‧‧‧ button

BT201‧‧‧按鈕BT201‧‧‧ button

BT202‧‧‧按鈕BT202‧‧‧ button

BT203‧‧‧按鈕BT203‧‧‧button

BT204‧‧‧按鈕BT204‧‧‧ button

BT205‧‧‧按鈕BT205‧‧‧ button

BT206‧‧‧按鈕BT206‧‧‧ button

BT207‧‧‧按鈕BT207‧‧‧ button

BT208‧‧‧按鈕BT208‧‧‧ button

BT209‧‧‧按鈕BT209‧‧‧button

BT210‧‧‧按鈕BT210‧‧‧ button

BT211‧‧‧按鈕BT211‧‧‧ button

BT212‧‧‧按鈕BT212‧‧‧ button

BT213‧‧‧按鈕BT213‧‧‧button

BT214‧‧‧按鈕BT214‧‧‧ button

BT215‧‧‧按鈕BT215‧‧‧ button

BT216‧‧‧按鈕BT216‧‧‧ button

BT351‧‧‧按鈕BT351‧‧‧button

BT352‧‧‧按鈕BT352‧‧‧ button

BT353‧‧‧按鈕BT353‧‧‧button

BT430‧‧‧按鈕BT430‧‧‧ button

BT440‧‧‧按鈕BT440‧‧‧ button

EnA‧‧‧流入端EnA‧‧‧ Inflow

EnB‧‧‧流入端EnB‧‧‧ Inflow

ExA‧‧‧流出端ExA‧‧‧ Outflow

ExB‧‧‧流出端ExB‧‧‧ Outflow

FM1‧‧‧格式FM1‧‧‧format

FM2‧‧‧格式FM2‧‧‧format

FM3‧‧‧格式FM3‧‧‧format

FM4‧‧‧格式FM4‧‧‧format

FM5‧‧‧格式FM5‧‧‧format

IT110‧‧‧第1項目群IT110‧‧‧Project 1

IT111‧‧‧項目IT111‧‧‧Project

IT112‧‧‧項目IT112‧‧‧Project

IT113‧‧‧項目IT113‧‧‧Project

IT114‧‧‧項目IT114‧‧‧Project

IT115‧‧‧項目IT115‧‧‧ Project

IT116‧‧‧項目IT116‧‧‧Project

IT117‧‧‧項目IT117‧‧‧ Project

IT118‧‧‧項目IT118‧‧‧Project

IT119‧‧‧項目IT119‧‧‧ Project

IT120‧‧‧第2項目群IT120‧‧‧Project Group 2

IT121‧‧‧項目IT121‧‧‧Project

IT122‧‧‧項目IT122‧‧‧Project

IT123‧‧‧項目IT123‧‧‧Project

IT124‧‧‧項目IT124‧‧‧Project

IT125‧‧‧項目IT125‧‧‧ Project

IT126‧‧‧項目IT126‧‧‧ Project

IT130‧‧‧第3項目群IT130‧‧‧Project 3

IT131‧‧‧項目IT131‧‧‧ Project

IT132‧‧‧項目IT132‧‧‧ Project

IT140‧‧‧第4項目群IT140‧‧‧Project Group 4

IT141‧‧‧項目IT141‧‧‧Project

IT142‧‧‧項目IT142‧‧‧Project

IT143‧‧‧項目IT143‧‧‧ Project

IT144‧‧‧項目IT144‧‧‧Project

IT150‧‧‧第5項目群IT150‧‧‧Project Group 5

IT151‧‧‧項目IT151‧‧‧Project

IT152‧‧‧項目IT152‧‧‧ Project

IT153‧‧‧項目IT153‧‧‧ Project

IT154‧‧‧項目IT154‧‧‧ Project

IT160‧‧‧第6項目群IT160‧‧‧Project Group 6

IT161‧‧‧項目IT161‧‧‧Project

IT162‧‧‧項目IT162‧‧‧Project

IT310‧‧‧第1項目群IT310‧‧‧Project 1

IT311‧‧‧項目IT311‧‧‧ Project

IT312‧‧‧項目IT312‧‧‧Project

IT320‧‧‧第2項目群IT320‧‧‧Project Group 2

IT321‧‧‧項目IT321‧‧‧Project

IT322‧‧‧項目IT322‧‧‧ Project

IT323‧‧‧項目IT323‧‧‧Project

IT330‧‧‧第3項目群IT330‧‧‧Project Group 3

IT331‧‧‧項目IT331‧‧‧Project

IT332‧‧‧項目IT332‧‧‧ Project

IT340‧‧‧第4項目群IT340‧‧‧Project Group 4

IT341‧‧‧項目IT341‧‧‧ Project

IT342‧‧‧項目IT342‧‧‧Project

IT343‧‧‧項目IT343‧‧‧Project

IT410‧‧‧項目IT410‧‧‧Project

IT420‧‧‧項目IT420‧‧‧ Project

IT510‧‧‧項目IT510‧‧‧ Project

IT520‧‧‧項目IT520‧‧‧Project

IT530‧‧‧項目IT530‧‧‧Project

IT540‧‧‧項目IT540‧‧‧ Project

IT550‧‧‧項目IT550‧‧‧ Project

LO560‧‧‧佈局LO560‧‧‧Layout

M1‧‧‧基準值M 1 ‧‧‧ reference value

M2‧‧‧基準值M 2 ‧‧‧ reference value

M3‧‧‧基準值M 3 ‧‧‧ reference value

P1‧‧‧壓力值P 1 ‧‧‧Pressure value

P2‧‧‧壓力值P 2 ‧‧‧Pressure value

P3‧‧‧壓力值P 3 ‧‧‧Pressure

S101～S103‧‧‧步驟S101 ～ S103‧‧‧step

S201～S203‧‧‧步驟Steps S201 ～ S203‧‧‧‧

S301～S303‧‧‧步驟Steps S301 ～ S303‧‧‧‧

S401～S406‧‧‧步驟S401 ～ S406‧‧‧step

S501～S506‧‧‧步驟S501 ～ S506‧‧‧step

S601～S613‧‧‧步驟S601 ～ S613‧‧‧step

t1‧‧‧時間t 1 ‧‧‧time

t2‧‧‧時間t 2 ‧‧‧time

α11‧‧‧箭頭α 11 ‧‧‧ arrow

α11A‧‧‧箭頭α 11A ‧‧‧ Arrow

α11B‧‧‧箭頭α 11B ‧‧‧ Arrow

α13X‧‧‧箭頭α 13X ‧‧‧ Arrow

α13Y‧‧‧箭頭α 13Y ‧‧‧ Arrow

α14‧‧‧箭頭α 14 ‧‧‧arrow

α15‧‧‧箭頭α 15 ‧‧‧arrow

α17Y‧‧‧箭頭α 17Y ‧‧‧ Arrow

α18‧‧‧箭頭α 18 ‧‧‧ arrow

α20X‧‧‧箭頭α 20X ‧‧‧ Arrow

α20Y‧‧‧箭頭α 20Y ‧‧‧ Arrow

α21‧‧‧箭頭α 21 ‧‧‧ Arrow

α22‧‧‧箭頭α 22 ‧‧‧arrow

α22A‧‧‧箭頭α 22A ‧‧‧ Arrow

α22B‧‧‧箭頭α 22B ‧‧‧ Arrow

α31‧‧‧箭頭α 31 ‧‧‧arrow

α32‧‧‧箭頭α 32 ‧‧‧arrow

α90‧‧‧箭頭α 90 ‧‧‧ arrow

α200‧‧‧箭頭α 200 ‧‧‧arrow

圖1係自正面側觀察第1及第7實施形態之電子零件檢查裝置之概略立體圖。圖2係表示圖1所示之電子零件檢查裝置之俯視圖，且係表示進行常溫檢查之狀態之圖。圖3係表示圖1所示之電子零件檢查裝置進行低溫檢查之狀態之俯視圖。圖4係表示圖1所示之電子零件檢查裝置進行高溫檢查之狀態之俯視圖。圖5係表示圖1所示之電子零件檢查裝置所具備之控制部之控制動作的流程圖。圖6係表示圖1所示之各溫度調整部之作動之時序圖。圖7係表示第2實施形態之電子零件檢查裝置之俯視圖，且係表示進行低溫檢查之狀態之圖。圖8係表示圖7所示之電子零件檢查裝置之俯視圖，且係表示進行高溫檢查之狀態之圖。圖9係表示第3實施形態之電子零件檢查裝置所具備之控制部之控制動作的流程圖。圖10係表示第4實施形態之電子零件檢查裝置所具備之控制部之控制動作的流程圖。圖11係第5實施形態之電子零件檢查裝置之俯視圖。圖12係圖11所示之電子零件檢查裝置之俯視圖，且係表示進行常溫檢查之狀態之圖。圖13係圖11所示之電子零件檢查裝置之俯視圖，且係表示進行常溫檢查之狀態之圖。圖14係圖11所示之電子零件檢查裝置之俯視圖，且係表示進行常溫檢查之狀態之圖。圖15係第6實施形態之電子零件檢查裝置之方塊圖。圖16係表示第7實施形態之圖1所示之電子零件檢查裝置之動作狀態的概略俯視圖。圖17係圖1所示之電子零件檢查裝置之溫度調整部用之流體迴路圖。圖18係表示圖1所示之電子零件檢查裝置之控制部之控制程式的流程圖。圖19係表示圖1所示之電子零件檢查裝置之控制部之控制程式的流程圖。圖20係表示圖1所示之電子零件檢查裝置之控制部之控制程式的流程圖。圖21係顯示於圖1所示之電子零件檢查裝置之監視器之格式(一例)。圖22係顯示於圖1所示之電子零件檢查裝置之監視器之格式(一例)。圖23係顯示於圖1所示之電子零件檢查裝置之監視器之格式(一例)。圖24係顯示於圖1所示之電子零件檢查裝置之監視器之格式(一例)。圖25係顯示於圖1所示之電子零件檢查裝置之監視器之格式(一例)。圖26係顯示於圖1所示之電子零件檢查裝置之監視器之格式(一例)。圖27係電子零件檢查裝置(第8實施形態)之溫度調整部用之流體迴路圖。FIG. 1 is a schematic perspective view of the electronic component inspection apparatus according to the first and seventh embodiments as viewed from the front side. FIG. 2 is a plan view showing the electronic component inspection device shown in FIG. 1, and is a view showing a state where a normal temperature inspection is performed. FIG. 3 is a plan view showing a state in which the electronic component inspection apparatus shown in FIG. 1 performs a low-temperature inspection. FIG. 4 is a plan view showing a state in which the electronic component inspection apparatus shown in FIG. 1 performs a high-temperature inspection. 5 is a flowchart showing a control operation of a control unit provided in the electronic component inspection apparatus shown in FIG. 1. Fig. 6 is a timing chart showing the operation of each temperature adjustment unit shown in Fig. 1. FIG. 7 is a plan view showing an electronic component inspection device according to a second embodiment, and is a view showing a state where a low-temperature inspection is performed. FIG. 8 is a plan view showing the electronic component inspection device shown in FIG. 7, and is a view showing a state where a high-temperature inspection is performed. FIG. 9 is a flowchart showing a control operation of a control unit provided in the electronic component inspection apparatus according to the third embodiment. FIG. 10 is a flowchart showing a control operation of a control unit provided in the electronic component inspection apparatus according to the fourth embodiment. Fig. 11 is a plan view of an electronic component inspection device according to a fifth embodiment. FIG. 12 is a plan view of the electronic component inspection device shown in FIG. 11, and is a diagram showing a state where the normal temperature inspection is performed. FIG. 13 is a plan view of the electronic component inspection device shown in FIG. 11, and is a diagram showing a state where the normal temperature inspection is performed. FIG. 14 is a plan view of the electronic component inspection device shown in FIG. 11, and is a diagram showing a state in which an ordinary temperature inspection is performed. Fig. 15 is a block diagram of an electronic component inspection apparatus according to a sixth embodiment. Fig. 16 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in Fig. 1 according to the seventh embodiment. FIG. 17 is a fluid circuit diagram of a temperature adjustment section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 18 is a flowchart showing a control program of a control unit of the electronic component inspection device shown in FIG. 1. FIG. FIG. 19 is a flowchart showing a control program of a control unit of the electronic component inspection device shown in FIG. 1. FIG. FIG. 20 is a flowchart showing a control program of a control unit of the electronic component inspection device shown in FIG. 1. FIG. FIG. 21 shows a format (an example) of a monitor of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 22 shows a format (an example) of a monitor of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 23 shows a format (an example) of a monitor of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 24 shows a format (an example) of a monitor of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 25 shows a format (an example) of a monitor of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 26 shows a format (an example) of a monitor of the electronic component inspection apparatus shown in FIG. 1. FIG. Fig. 27 is a fluid circuit diagram of a temperature adjustment section of the electronic component inspection device (eighth embodiment).

Claims (15)

一種電子零件搬送裝置，其特徵在於包括：檢查區域，其能夠配置檢查部，該檢查部能夠進行以第1溫度檢查電子零件之第1檢查，及於上述第1檢查之後以與上述第1溫度不同之第2溫度檢查上述電子零件之第2檢查；第1載置區域，其能夠配置第1載置部，該第1載置部能夠載置上述第1檢查之前之上述電子零件；及第2載置區域，其位於與上述第1載置區域不同之區域，且能夠配置第2載置部，該第2載置部能夠載置上述第2檢查之前之上述電子零件。An electronic component transfer device includes an inspection area capable of being provided with an inspection section capable of performing a first inspection for inspecting an electronic component at a first temperature, and performing the first inspection after the first inspection at the same temperature as the first temperature. A second inspection at which the electronic component is inspected at a different second temperature; a first placement region where a first placement portion can be disposed, and the first placement portion can mount the electronic component before the first inspection; and The 2 placement area is located in an area different from the first placement area, and a second placement portion can be disposed on the second placement portion, and the second placement portion can place the electronic components before the second inspection. 如請求項1之電子零件搬送裝置，其中上述電子零件自上述第1載置區域搬送至上述檢查區域，於上述檢查區域進行上述第1檢查之後搬送至上述第2載置區域，自上述第2載置區域搬送至上述檢查區域，於上述檢查區域進行上述第2檢查之後，搬送至上述第1載置區域。For example, the electronic component transfer device according to claim 1, wherein the electronic components are transferred from the first placement area to the inspection area, and after the first inspection is performed in the inspection area, the electronic parts are transferred to the second placement area, from the second placement area. The placement area is transported to the inspection area, and after the second inspection is performed in the inspection area, the placement area is transported to the first placement area. 如請求項2之電子零件搬送裝置，其中於自上述第1載置區域搬送至上述檢查區域之第1路徑中上述電子零件搬入至上述檢查區域內之方向，與於自上述第2載置區域搬送至上述檢查區域之第2路徑中上述電子零件搬入至上述檢查區域內之方向為相反方向。For example, in the electronic component transfer device of claim 2, the direction in which the electronic component is moved into the inspection area in the first path from the first placement area to the inspection area is the same as the direction from the second placement area. In the second path to the inspection area, the direction in which the electronic components are carried into the inspection area is the opposite direction. 如請求項1或2之電子零件搬送裝置，其具有：第1溫度調整部，其於上述電子零件自上述第1載置部搬送至上述檢查區域之路徑中，能夠調整上述電子零件之溫度；及第2溫度調整部，其於上述電子零件自上述第2載置部搬送至上述檢查區域之路徑中，能夠調整上述電子零件之溫度。For example, the electronic component transfer device of claim 1 or 2 includes: a first temperature adjustment unit capable of adjusting the temperature of the electronic component in a path in which the electronic component is transferred from the first placement portion to the inspection area; And a second temperature adjustment unit that can adjust the temperature of the electronic component in a path in which the electronic component is transported from the second placement portion to the inspection area. 如請求項1或2之電子零件搬送裝置，其中上述檢查部係於上述第2檢查之後，進行以與上述第1溫度及上述第2溫度不同之第3溫度檢查上述電子零件之第3檢查。For example, the electronic component transfer device of claim 1 or 2, wherein the inspection unit performs a third inspection to inspect the electronic component at a third temperature different from the first temperature and the second temperature after the second inspection. 如請求項5之電子零件搬送裝置，其中上述第1載置區域能夠載置上述第3檢查之前之上述電子零件。For example, the electronic component transfer device according to claim 5, wherein the first mounting area can mount the electronic components before the third inspection. 如請求項2或3之電子零件搬送裝置，其中於在上述檢查區域進行上述第2檢查之後，搬送至上述第1載置區域之上述電子零件係自上述第1載置區域搬送至上述檢查區域，於上述檢查區域，進行以與上述第1溫度及上述第2溫度不同之第3溫度檢查上述電子零件之第3檢查之後，搬送至上述第2載置區域。For example, the electronic component transfer device of claim 2 or 3, wherein the electronic component transferred to the first placement area after the second inspection in the inspection area is transferred from the first placement area to the inspection area After the third inspection for inspecting the electronic component at a third temperature different from the first temperature and the second temperature in the inspection area, the inspection is carried to the second placement area. 如請求項7之電子零件搬送裝置，其中於上述第3檢查中於自上述第1載置區域搬送至上述檢查區域之第3路徑中上述電子零件搬入至上述檢查區域內之方向，與於上述第1檢查中於自上述第1載置區域搬送至上述檢查區域之第1路徑中上述電子零件搬入至上述檢查區域內之方向為相同方向。For example, the electronic component transfer device of claim 7, wherein the direction in which the electronic component is moved into the inspection area in the third route from the first placement area to the inspection area during the third inspection is the same as that described above. In the first inspection, the direction in which the electronic components are carried into the inspection area in the first path from the first placement area to the inspection area is the same direction. 如請求項1或2之電子零件搬送裝置，其中上述第1溫度高於上述第2溫度。For example, the electronic component transfer device of claim 1 or 2, wherein the first temperature is higher than the second temperature. 如請求項1或2之電子零件搬送裝置，其中上述第1溫度高於室溫，上述第2溫度為室溫或低於室溫。For example, the electronic component transfer device of claim 1 or 2, wherein the first temperature is higher than room temperature, and the second temperature is room temperature or lower than room temperature. 如請求項1或2之電子零件搬送裝置，其中上述第1溫度為室溫。For example, the electronic component transfer device of claim 1 or 2, wherein the first temperature is room temperature. 如請求項1或2之電子零件搬送裝置，其中上述第1溫度低於室溫，上述第2溫度為室溫或高於室溫。For example, the electronic component transfer device of claim 1 or 2, wherein the first temperature is lower than room temperature, and the second temperature is room temperature or higher. 如請求項1或2之電子零件搬送裝置，其具備於與上述第1載置區域及上述第2載置區域不同之區域能夠配置載置上述電子零件之第3載置部之第3載置區域。For example, the electronic component transporting device of claim 1 or 2 includes a third placement in which the third placement portion on which the electronic component is placed can be placed in a region different from the first placement region and the second placement region. region. 如請求項13之電子零件搬送裝置，其中配置於上述第3載置區域之上述第3載置部，能夠移動至配置於上述第1載置區域之上述第1載置部或配置於上述第2載置區域之上述第2載置部上。For example, the electronic component transfer device of claim 13, wherein the third placement section disposed in the third placement area can be moved to the first placement section disposed in the first placement area or disposed in the first placement section. 2 on the second placement portion of the placement area. 一種電子零件檢查裝置，其特徵在於包括：檢查部，其能夠進行以第1溫度檢查電子零件之第1檢查，及於上述第1檢查之後以與上述第1溫度不同之第2溫度檢查上述電子零件之第2檢查；檢查區域，其配置有上述檢查部；第1載置區域，其能夠配置第1載置部，該第1載置部能夠載置上述第1檢查之前之上述電子零件；及第2載置區域，其位於與上述第1載置區域不同之區域，且能夠配置第2載置部，該第2載置部能夠載置上述第2檢查之前之上述電子零件。An electronic component inspection device includes an inspection unit capable of performing a first inspection for inspecting electronic components at a first temperature, and inspecting the electronics at a second temperature different from the first temperature after the first inspection. The second inspection of the parts; the inspection area, which is provided with the inspection section; the first placement area, which can be provided with the first placement section, which can mount the electronic components before the first inspection; And the second mounting area is located in a region different from the first mounting area, and a second mounting portion can be arranged, and the second mounting portion can mount the electronic components before the second inspection.
TW106140954A 2016-11-29 2017-11-24 Electronic parts conveying device and electronic parts inspection device capable of accurately and efficiently inspecting electronic parts TW201819931A (en)

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