CN108459257A

CN108459257A - Electronic component handling apparatus and electronic component inspection device

Info

Publication number: CN108459257A
Application number: CN201711210302.1A
Authority: CN
Inventors: 前田政己; 山崎孝
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2016-11-29
Filing date: 2017-11-27
Publication date: 2018-08-28
Also published as: TW201819931A

Abstract

A kind of electronic component handling apparatus of present invention offer and electronic component inspection device, can accurately and efficiently carry out the inspection of electronic unit.Electronic component handling apparatus (10) has：Inspection area (A3), configured with inspection portion (16), inspection portion (16) can carry out after checking with the first of the first temperature check electronic unit (90) and being checked first to check that the second of electronic unit (90) checks different from the second temperature of the first temperature；First mounting region (A1) can configure the first mounting portion (200), the electronic unit (90) before the first inspection of the first mounting portion (200) mounting；And second mounting region (A5), positioned at the position different from the first mounting region (A1), and the second mounting portion (200) can be configured, the electronic unit (90) before the second inspection of the second mounting portion (200) mounting.

Description

Electronic component handling apparatus and electronic component inspection device

Technical field

The present invention relates to electronic component handling apparatus and electronic component inspection devices.

Background technology

All the time, it is known that the electronic component inspection device for checking the electrical characteristics of the electronic unit such as IC devices, Electronic component handling apparatus for conveying IC devices is installed (for example, with reference to patent document in the electronic component inspection device 1)。

In addition, in electronic component inspection device, by the way that multiple IC devices are positioned on pallet, and each pallet is put Enter in device, to which pallet is delivered to the inspection portion checked by delivery section.Then, upon completion of the inspection, IC devices are carried It sets on pallet, each pallet is conveyed by delivery section, and is discharged to outside device.It should be noted that being recorded in patent document 1 Electronic component handling apparatus in, upon completion of the inspection, can directly be retested and (be reexamined).

In addition, in checking the component check device of electrical characteristics of electronic unit, be generally used for pallet on base station and The processing unit of electronic unit between inspection bracket, before conveying inspection, after checking.In such component check device, Electronic unit is first set as 0 DEG C of low temperature below by some, then checks the electrical characteristics of the electronic unit.

Herein, it is known that electronic unit is cooled to the processing unit of low temperature (for example, with reference to patent document 2).In patent In the processing unit that document 2 is recorded, bearing electronics is constituted by the pallet for accommodating multiple electronic units and the shell for loading the pallet The supporting part of component.In addition, the dry air in drying regime as refrigerant is cooled down by using refrigerator, and should Cooling dry air is supplied in the cooling duct for being formed in enclosure interior, to cool down pallet by shell, and passes through this Pallet cools down electronic unit.

Existing technical literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2000-258507 bulletins

Patent document 2：Japanese Unexamined Patent Publication 2004-347329 bulletins

But in electronic component handling apparatus described in Patent Document 1, when the inspection of electronic unit terminates and with difference Temperature when being checked again for, operator needs to be transported to electronic unit on different electronic component handling apparatus.At this moment, Conveying error may occur because of operator.In addition, because operator conveys the time of electronic unit, check that efficiency reduces.

In addition, as processing unit described in Patent Document 2, in the processing unit that electronic unit is cooled to low temperature In, usually dry air by the midway configuration switching dry air of cooling duct pass through the switching valve with cut-out.So And about the judgement of the state (for example whether normal operation, or whether hinder for some reason and stop operating) to the switching valve, patent Document 2 does not provide any enlightenment both without any disclosure yet.

Invention content

Present invention at least part in order to solve the above-mentioned technical problem and complete, can be used as following manner or application examples and It realizes.

Electronic component handling apparatus according to the present invention, which is characterized in that have：Inspection area, can configuration inspection portion, The inspection portion can carry out after checking with the first of the first temperature check electronic unit and being checked described first to be different from The second temperature of first temperature checks that the second of the electronic unit checks；First mounting region, can configure the first load Portion is set, first mounting portion can load the electronic unit before first inspection；And second mounting region, be located at The region different from the first mounting region, and the second mounting portion can be configured, second mounting portion can load described The electronic unit before second inspection.

As a result, after having carried out the first inspection to the electronic unit being placed in first mounting portion in the first mounting region, Second can be carried out to the electronic unit being placed in second mounting portion in the second mounting region to check.I.e., one can be utilized Electronic component handling apparatus is checked into mutually different the first inspection and second of trip temperature.As a result, operator checks first Can be omitted operation electronic unit being transported on the dedicated electronic component handling apparatus of the second inspection afterwards.So as to prevent Error caused by operator, and the first inspection and second can be carried out rapidly and checked.

In the electronic component handling apparatus of the present invention, it is preferable that the electronic unit loads region quilt from described first It is delivered to the inspection area, second mounting region is transported to after the inspection area carries out first inspection, And it is transported to the inspection area from second mounting region, it is defeated after the inspection area carries out second inspection It send to first mounting region.

Thereby, it is possible to by reversely convey terminate first check by be transported to the second mounting region electronic unit this Simple constitute checks to carry out the first inspection and second.Thus, it can successfully start the second inspection after terminating the first inspection It looks into.

In the electronic component handling apparatus of the present invention, it is preferable that the electronic unit is loading region from described first Be transported to the direction being admitted in the first path of the inspection area in the inspection area, with the electronic unit from Second mounting region, which is transported to the direction being admitted in the inspection area on the second path of the inspection area, is Opposite direction.

As a result, when first checks and when second checks, direction that electronic unit is transported to inspection area be it is opposite, It is carrying out the first inspection to which operator just can be easily verified that by range estimation or is being checked carrying out second.

In the electronic component handling apparatus of the present invention, it is preferable that the electronic component handling apparatus has：First temperature Adjustment portion can be transported on the path of the inspection area from first mounting portion described in adjusting in the electronic unit The temperature of electronic unit；And second temperature adjustment portion, it can be transported to from second mounting portion in the electronic unit The temperature of the electronic unit is adjusted on the path of the inspection area.

The temperature that electronic unit can be more reliably carried out before being checked as a result, first is adjusted, and before second checks The temperature that electronic unit can more reliably be carried out is adjusted.

The present invention electronic component handling apparatus in, it is preferable that the inspection portion it is described second check after carry out with The third inspection of electronic unit described in the third temperature check different from first temperature and the second temperature.

Thereby, it is possible to carry out three kinds of inspections using an electronic component handling apparatus.

In the electronic component handling apparatus of the present invention, it is preferable that first mounting region, which can load, is carried out institute State the electronic unit before third checks.

As a result, when third checks, before separately setting supply third inspection can be omitted in except the first mounting region The operation in the region of electronic unit.It is constituted so as to simplify device.

In the electronic component handling apparatus of the present invention, it is preferable that after the inspection area carries out second inspection The electronic unit for being transported to first mounting region is transported to the inspection area from first mounting region, And it is carried out with electronics described in the third temperature check different from first temperature and the second temperature in the inspection area After the third of component checks, it is transported to second mounting region.

Thereby, it is possible to by reversely convey terminate second check by be transported to the first mounting region electronic unit this It is simple to constitute to carry out third inspection.Thus, it can successfully start third inspection after terminating the second inspection.

In the electronic component handling apparatus of the present invention, it is preferable that the electronic unit is from institute under the third checks It states the first mounting region and is transported to direction and the institute being admitted on the third path of the inspection area in the inspection area The electronic unit under the first inspection is stated to be transported in the first path of the inspection area from first mounting region The direction being admitted in the inspection area is the same direction.

As a result, when second checks and when third checks, direction that electronic unit is transported to inspection portion be it is opposite, from And operator just can be easily verified that by range estimation and carry out the second inspection or carry out third inspection.

In the electronic component handling apparatus of the present invention, it is preferable that first temperature is higher than the second temperature.

As a result, under normal circumstances, first check that comparing the second inspection is easier defective work occur.Thus, by making first Temperature carries out the first inspection higher than second temperature first, and the inspection of the defective work in checking first is omitted in being checked second It looks into, so as to improve inspection efficiency.

In the electronic component handling apparatus of the present invention, it is preferable that first temperature is higher than room temperature, the second temperature For room temperature or it is less than room temperature.

Thereby, it is possible to more reliably play said effect, inspection efficiency can be improved.

In the electronic component handling apparatus of the present invention, it is preferable that first temperature is room temperature.

As a result, when carrying out the first inspection, it can omit to being heated or cooled for the part of room temperature state, Neng Goushun Start the first inspection sharply.

In the electronic component handling apparatus of the present invention, it is preferable that first temperature is less than room temperature, the second temperature For room temperature or it is higher than room temperature.

As a result, under normal circumstances, after finishing the low inspection of temperature, if electronic unit is directly expelled to device Outside, then electronic unit is easy condenses.Thus, by into the first low inspection of trip temperature, then carrying out the second inspection again first, So as to prevent or inhibit electronic unit moisture condensation.

In the electronic component handling apparatus of the present invention, it is preferable that the electronic component handling apparatus is with described first The mounting region region different with second mounting region has third and loads region, and third mounting region can configure Third mounting portion, the third mounting portion is for loading the electronic unit.

Thereby, it is possible to supplement third mounting portion to the first mounting region or the second mounting region.It is checked so as to increase The grade being classified afterwards.

In the electronic component handling apparatus of the present invention, it is preferable that be configured at the third in third mounting region Mounting portion can be moved to first mounting portion for being configured at first mounting region or be configured at second mounting In second mounting portion in region.

Electronic component inspection device according to the present invention, which is characterized in that have：Inspection portion can be carried out with the first temperature Degree checks that the first of electronic unit checks and after first inspection with the second temperature inspection different from first temperature The second of the electronic unit checks；Inspection area is configured with the inspection portion；First mounting region, can configure the first load Portion is set, first mounting portion can load the electronic unit before first inspection；And second mounting region, be located at The region different from the first mounting region, and the second mounting portion can be configured, second mounting portion can load described The electronic unit before second inspection.

As a result, after having carried out the first inspection to the electronic unit being placed in first mounting portion in the first mounting region, Second can be carried out to the electronic unit being placed in second mounting portion in the second mounting region to check.That is, one can be utilized Electronic component handling apparatus is checked into mutually different the first inspection and second of trip temperature.As a result, operator is after first checks Can be omitted operation electronic unit being transported on the dedicated electronic component handling apparatus of the second inspection.So as to prevent from grasping Error caused by work person, and the first inspection and second can be carried out rapidly and checked.In addition, electronic unit can be delivered to inspection Portion is looked into, so as to be checked the electronic unit by inspection portion.In addition, the electronics after checking can be conveyed from inspection portion Component.

Electronic component handling apparatus according to the present invention, which is characterized in that have：Delivery section conveys electronic unit；Mounting Portion loads the electronic unit；Supply connection adjusts the fluid of the temperature of the mounting portion to mounting portion supply；Discharge The fluid is discharged from the mounting portion in circuit；At least one switching valve is configured at the supply connection, can switch over, To enable the fluid of the supply connection to pass through using opening state, and stop that the fluid passes through using closed state； Test section is configured at the pumping-out line, the flowing that detection passes through the fluid of the pumping-out line；And control unit, energy Enough control the switching valve, the testing result pair of control information and the test section of the control unit based on the switching valve The state of the switching valve is judged.

The operator of operation electronic component conveying device is able to confirm that the judging result of the state of switching valve as a result, is cutting Change valve running it is normal in the case of, can utilize electronic component handling apparatus carry out electronic unit conveying.On the other hand, when When certain unfavorable condition occurs in the running of switching valve, which can be for example replaced with new switching valve by operator.As a result, Switching valve can normal operation, so as to successfully carry out the conveying of electronic unit using electronic component handling apparatus.

In the electronic component handling apparatus of the present invention, it is preferable that the fluid is the refrigerant of the cooling mounting portion.

Thereby, it is possible to mounting portion is rapidly cooled to desired target temperature.

In the electronic component handling apparatus of the present invention, it is preferable that the mounting portion is fixed.

Thereby, it is possible to steadily be adjusted into trip temperature to the electronic unit in mounting portion.

In the electronic component handling apparatus of the present invention, it is preferable that the mounting portion is supported to move.

Electronic unit can be steadily delivered to another precalculated position from precalculated position by mounting portion as a result,.

In the electronic component handling apparatus of the present invention, it is preferable that the mounting portion is configured to hold the electronics Component.

Mounting portion can lift electronic unit as a result, and can for example be conveyed in this state.

In the electronic component handling apparatus of the present invention, it is preferable that the switching valve includes：First switching valve；And extremely Few second switching valve is configured at the position of the side farther downstream of the first switching valve described in the ratio of the supply connection.

Thereby, it is possible to carry out the control of the appropriately combined such as opening and closing of each switching valve of the first switching valve, the second switching valve.

In the electronic component handling apparatus of the present invention, it is preferable that the supply connection has more described by first than configuring The position branch of the part of switching valve more on the lower is configured at each branch at a plurality of branch line, second switching valve Line.

As a result, by the opening and closing of appropriately combined such as each switching valve of the first switching valve, the second switching valve, can be easy to select It selects and supply fluid is unified to each mounting portion, stops unifying supply fluid, to any of each mounting portion mounting to each mounting portion Portion's supply fluid.

In the electronic component handling apparatus of the present invention, it is preferable that the control unit is by first switching valve and described One of second switching valve is set as closed state, and another one is set as opening state, to carry out the judgement.

Thereby, it is possible to the open and-shut mode according to the first switching valve and the second switching valve, the appropriate fortune for carrying out the first switching valve Make whether the judgement whether running in normal condition or the second switching valve is in normal condition.

In the electronic component handling apparatus of the present invention, it is preferable that first switching valve is set to off by the control unit Second switching valve is set as opening state by closed state, when the detected value of the test section is preset value, is carried out The judgement of the running in normal condition of first switching valve.

The operator of operation electronic component conveying device once confirms that the running of the first switching valve is in normal shape as a result, State can then carry out the conveying of electronic unit using electronic component handling apparatus.On the other hand, judged in contrast to this when making When, the first switching valve can be for example replaced with the first new switching valve by operator.

In the electronic component handling apparatus of the present invention, it is preferable that first switching valve is set as beating by the control unit Second switching valve is set as closed state by open state, when the detected value of the test section is preset value, is carried out The judgement of the running in normal condition of second switching valve.

The operator of operation electronic component conveying device once confirms that the running of the second switching valve is in normal shape as a result, State can then carry out the conveying of electronic unit using electronic component handling apparatus.On the other hand, judged in contrast to this when making When, the second switching valve can be for example replaced with the second new switching valve by operator.

In the electronic component handling apparatus of the present invention, it is preferable that first switching valve is set as beating by the control unit One be configured in second switching valve of each branch line second switching valve is set as open shape by open state Remaining second switching valve is set as closed state by state, when the detected value of the test section is preset value, into Row is set as the judgement of the running in normal condition of second switching valve of the opening state.

In the electronic component handling apparatus of the present invention, it is preferable that the switching valve enter opening state when being powered and The fluid can be made to pass through, enter closed state in no power and stop the fluid.

As a result, for example in the case where entering power failure using the environment of electronic component handling apparatus, fluid is blocked, to It can prevent fluid from being continued to supply in vain.

In the electronic component handling apparatus of the present invention, it is preferable that the test section passes through the pumping-out line by detection The fluid pressure pressure gauge or the detection flowmeter structure that passes through the flow of the fluid of the pumping-out line At.

As a result, by simply constituting, it just can be easily realized by the state of the flowing of the fluid by pumping-out line, i.e., Fluid is flowed with which kind of degree.

Electronic component inspection device according to the present invention, which is characterized in that have：Delivery section conveys electronic unit；Mounting Portion loads the electronic unit；Supply connection adjusts the fluid of the temperature of the mounting portion to mounting portion supply；Discharge The fluid is discharged from the mounting portion in circuit；At least one switching valve is configured at the supply connection, can switch over, To enable the fluid of the supply connection to pass through using opening state, and stop that the fluid passes through using closed state； Test section is configured at the pumping-out line, the flowing that detection passes through the fluid of the pumping-out line；Control unit can be controlled Make the switching valve；And inspection portion, it can check the electronic unit, control letter of the control unit based on the switching valve The testing result of breath and the test section judges the state of the switching valve.

The operator of operation electronic component check device is able to confirm that the judging result of the state of switching valve as a result, is cutting Change valve running it is normal in the case of, can utilize electronic component inspection device carry out electronic unit inspection.On the other hand, when When certain unfavorable condition occurs in the running of switching valve, which can be for example replaced with new switching valve by operator.As a result, Switching valve can normal operation, so as to successfully carry out the inspection of electronic unit using electronic component inspection device.

In addition, electronic unit can be delivered to inspection portion, so as to be examined to the electronic unit by inspection portion It looks into.In addition, the electronic unit after checking can be conveyed from inspection portion.

Description of the drawings

Fig. 1 is the brief vertical of the electronic component inspection device of first embodiment and the 7th embodiment from face side Body figure.

Fig. 2 is the vertical view of electronic component inspection device shown in FIG. 1, shows the state for carrying out room temperature inspection.

Fig. 3 is to show that electronic component inspection device shown in FIG. 1 carries out the vertical view of the state of low temperature inspection.

Fig. 4 is to show that electronic component inspection device shown in FIG. 1 carries out the vertical view of the state of high temperature inspection.

Fig. 5 is the flow chart of the control action for the control unit for showing that electronic component inspection device shown in FIG. 1 has.

Fig. 6 is the sequence diagram for the running for showing each temperature regulation section shown in FIG. 1.

Fig. 7 is the vertical view of the electronic component inspection device of second embodiment, shows the state for carrying out low temperature inspection.

Fig. 8 is the vertical view of electronic component inspection device shown in Fig. 7, shows the state for carrying out high temperature inspection.

Fig. 9 is the flow of the control action for the control unit for showing that the electronic component inspection device of third embodiment has Figure.

Figure 10 is the stream of the control action for the control unit for showing that the electronic component inspection device of the 4th embodiment has Cheng Tu.

Figure 11 is the vertical view of the electronic component inspection device of the 5th embodiment.

Figure 12 is the vertical view of electronic component inspection device shown in Figure 11, shows the state for carrying out room temperature inspection.

Figure 13 is the vertical view of electronic component inspection device shown in Figure 11, shows the state for carrying out room temperature inspection.

Figure 14 is the vertical view of electronic component inspection device shown in Figure 11, shows the state for carrying out room temperature inspection.

Figure 15 is the block diagram of the electronic component inspection device of sixth embodiment.

Figure 16 is to show that the brief of action state of the 7th embodiment, electronic component inspection device shown in FIG. 1 bows View.

Figure 17 is the fluid circuit diagram for the temperature regulation section for showing electronic component inspection device shown in FIG. 1.

Figure 18 is the flow chart of the control program for the control unit for showing electronic component inspection device shown in FIG. 1.

Figure 19 is the flow chart of the control program for the control unit for showing electronic component inspection device shown in FIG. 1.

Figure 20 is the flow chart of the control program for the control unit for showing electronic component inspection device shown in FIG. 1.

Figure 21 is displayed at the pattern (an example) of the monitor of electronic component inspection device shown in FIG. 1.

Figure 22 is displayed at the pattern (an example) of the monitor of electronic component inspection device shown in FIG. 1.

Figure 23 is displayed at the pattern (an example) of the monitor of electronic component inspection device shown in FIG. 1.

Figure 24 is displayed at the pattern (an example) of the monitor of electronic component inspection device shown in FIG. 1.

Figure 25 is displayed at the pattern (an example) of the monitor of electronic component inspection device shown in FIG. 1.

Figure 26 is displayed at the pattern (an example) of the monitor of electronic component inspection device shown in FIG. 1.

Figure 27 is the fluid circuit diagram for the temperature regulation section for showing electronic component inspection device (the 8th embodiment).

Reference sign

1 ... electronic component inspection device；10 ... electronic component handling apparatus；11,11A, 11B ... conveyor pallet structure； 12 ... temperature regulation sections；13 ... device delivery heads；14, the first device of 14A, 14B ... supplies recoverer；15 ... temperature regulation sections； 16 ... inspection portions；17,17A, 17B ... device delivery head；18, the second device of 18A, 18B ... supplies recoverer；19 ... recycling are held in the palm Disk；20 ... device delivery heads；21,22,22A, 22B ... conveyor pallet structure；23 ... heating parts；24 ... cooling ends；25 ... heat pumps； 26,26A, 26B ... device supply department；27 ... conveyor pallet structures；28,28A, 28B ... device recoverer；29 ... delivery sections；31、 32 ... conveyor pallet structures；50 ... storage cases；53 ... test sections；54 ... first switching valves；55 ... holding vessels；56 ... share road Diameter；The first supply path of 57A, 57B ...；58A, 58B ... medium runner；The second switching valve of 59A, 59B ...；60 ... gasification vessels； 61A, 61B ... vaporizer；62A, 62B ... heater；63A, 63B ... temperature sensor；64A, 64B ... discharge path 65 ... connects Portion；66A, 66B ... check-valves；67 ... heat exchangers；68 ... check-valves；69 ... dry air sources of supply；70 ... purification air supplies Path；71 ... purification air supply valves；72 ... air heaters；73 ... check-valves；75, the second supply path of 75A, 75B ...； 76 ... branches；77A, 77B ... interconnecting piece；78 ... elevated temperature gas supply valves；79 ... air heaters；80A, 80B ... check-valves； 90 ... IC devices (electronic unit)；141,141 ... recess portions (recess)；200 ... pallets (the first mounting portion and the second mounting portion)； 231 ... first spaced walls；232 ... second spaced walls；233 ... third spaced walls；234 ... the 4th spaced walls；235 ... the 5th intervals Wall；241 ... protecgulums；242 ... side covers；243 ... side covers；244 ... rear covers；245 ... head covers；300 ... monitors；301 ... display screens Curtain；400 ... signal lamps；500 ... loud speakers；531 ... pressure gauges (pressure sensor)；532 ... flowmeters (flow sensor)； 600 ... Mouse tables；700 ... operation panels；800 ... control units；801 ... storage parts；900 ... cooling units；The first pallets of A1 ... Supply removes region (the first mounting region) (pallet feed region)；The first devices of A2 ... conveyor zones (device feed region)； The inspection areas A3 ...；The second devices of A4 ... conveyor zones (device recovery zone)；The supply of the second pallets of A5 ... removes region (second Load region) (pallet removal region)；A6 ... pallets supplement region；The standby region of A7 ... pallets；BT100 ... key groups； BT101、BT102、BT103、BT104、BT105、BT106、BT107、BT201、BT202、BT203、BT204、BT205、 BT206、BT207、BT208、BT209、BT210、BT211、BT212、BT213、BT214、BT215、BT216、BT351、 BT352, BT353, BT430 ... button；BT440 ... buttons；EnA, EnB ... flow into end；ExA, ExB ... outflow end；FM1、FM2、 FM3, FM4, FM5 ... pattern；IT110 ... first item groups；IT111、IT112、IT113、IT114、IT115、IT116、 IT117, IT118, IT119 ... project；IT120 ... second item groups；IT121、IT122、IT123、IT124、IT125、 IT126 ... projects；IT130 ... third item groups；IT131, IT132 ... project；IT140 ... fourth item groups；IT141、 IT142, IT143, IT144 ... project；IT150 ... fifth item groups；IT151, IT152, IT153, IT154 ... project； IT160 ... sixth item groups；IT161, IT162 ... project；IT310 ... first item groups；IT311, IT312 ... project； IT320 ... second item groups；IT321, IT322, IT323 ... project；IT330 ... third item groups；IT331, IT332 ... item Mesh；IT340 ... fourth item groups；IT341、IT342、IT343、IT410、IT420、IT510、IT520、IT530、IT540、 IT550 ... projects；LO560 ... is laid out；M₁、M₂、M₃... a reference value；P₁、P₂、P₃... pressure value；S101~S103, S201~ S203, S301~S303, S401~S406, S501~S506, S601~S613 ... steps；t₁、t₂... the time；α₁₁、α_11A、 α_11B、α_13X、α_13Y、α₁₄、α₁₅、α_17Y、α₁₈、α_20X、α_20Y、α₂₁、α₂₂、α_22A、α_22B、α₃₁、α₃₂、α₉₀、α₂₀₀... arrow.

Specific implementation mode

In the following, preferred embodiment based on ... shown in the drawings, to the electronic component handling apparatus and electronic unit of the present invention Check device is described in detail.

First embodiment

In the following, referring to figs. 1 to Fig. 6, this reality of electronic component handling apparatus and electronic component inspection device to the present invention The mode of applying illustrates.It should be noted that hereinafter, for convenience of description, (extremely scheming for Fig. 7, Fig. 8, Figure 11 as shown in Figure 1 to Figure 4 14 be also same) shown in, three mutually orthogonal axis are set as X-axis, Y-axis, Z axis.In addition, the X/Y plane comprising X-axis and Y-axis It is horizontal, Z axis is vertical.In addition, the direction for being parallel to X-axis is also referred to as " X-direction (first direction) ", Y will be parallel to The direction of axis is also referred to as " Y-direction (second direction) ", and the direction for being parallel to Z axis is also referred to as " Z-direction (third direction) ".Separately Outside, the direction of court of the arrow of all directions institute is referred to as " just ", by its opposite direction referred to as " negative ".In addition, in present specification Described "horizontal" is not limited to fully horizontally, as long as not interfering the conveying of electronic unit, also include relative to it is horizontal slightly (for example, less than 5 ° or so) inclined state.In addition, the upside of Fig. 1 is referred to as "upper" or " top " sometimes, downside is referred to as "lower" or " lower section ".

Fig. 1 and electronic component handling apparatus shown in Fig. 2 10 have：Inspection area A3, can configuration inspection portion 16, check Portion 16 can carry out first of the IC devices 90 using the first temperature check as electronic unit and check and after the first inspection with not The second temperature for being same as the first temperature checks that the second of IC devices 90 checks；The first pallet as the first mounting region, which is supplied, to be moved Except region A1, the pallet 200 as the first mounting portion that can load the IC devices 90 before the first inspection can be configured；And make The second pallet supply for the second mounting region removes region A5, is located at and is different from the area that the supply of the first pallet removes region A1 Domain, and the pallet 200 as the second mounting portion that can load the IC devices 90 before the second inspection can be configured.

First is being carried out to the IC devices 90 being placed on the pallet 200 that the supply of the first pallet removes region A1 as a result, After inspection, second can be carried out to the IC devices 90 being placed on the pallet 200 of the second pallet supply removal region A5 and checked. That is, just can be checked into mutually different the first inspection and second of trip temperature by an electronic component handling apparatus 10.It is tied Fruit, operator can be omitted after being checked first and IC devices 90 are transported on the dedicated electronic component handling apparatus of the second inspection Operation.Therefore, it is possible to prevent the error of operator, and the first inspection and second can be carried out rapidly and is checked.

In addition, electronic component inspection device 1 has：Inspection area A3 is configured with inspection portion 16, and inspection portion 16 can carry out First of IC devices 90 using the first temperature check as electronic unit check and checked first after to be different from the first temperature Second temperature check that the second of IC devices 90 checks；The first pallet supply as the first mounting region removes region A1, energy Pallet 200 of enough configurations as the first mounting portion of the IC devices 90 before capable of loading the first inspection；And as the second mounting The second pallet supply in region removes region A5, is located at and removes the region of region A1 different from the supply of the first pallet, and can match Set the pallet 200 as the second mounting portion that can load the IC devices 90 before the second inspection.

The electronic component inspection device 1 with above-mentioned electronic component handling apparatus 10 is obtained as a result,.In addition, energy It is enough that IC devices 90 are delivered to inspection portion 16, so as to carry out the inspection to IC devices 90 by inspection portion 16.In addition, can IC devices 90 after conveying checks from inspection portion 16.

In the following, the composition to each section illustrates.

As depicted in figs. 1 and 2, the electronic component inspection device 1 for being built-in with electronic component handling apparatus 10 is conveying conduct Such as BGA (Ball Grid Array：Ball grid array) packaging part IC devices etc. electronic unit, and in the transmission process It checks, the device of the electrical characteristics of test (hereinafter referred to as " checking ") electronic unit.It should be noted that hereinafter, for the ease of Illustrate, to using the case where IC devices are as above-mentioned electronic unit to carry out representative explanation, and is set to " IC devices 90 ".IC Device 90 is in tabular in the present embodiment.

It should be noted that as IC devices, in addition to above-mentioned device, such as " LSI (Large Scale can be also enumerated Integration：Large scale integrated circuit) ", " CMOS (Complementary MOS：Complementary MOS) ", " CCD (Charge Coupled Device：Charge coupled cell) ", by multiple IC devices carry out module encapsulation " module I C " and " crystal member device Part ", " pressure sensor ", " inertial sensor (acceleration transducer) ", " gyro sensor " and " fingerprint sensor " etc..

In addition, (electronic component handling apparatus 10) assembled in advance of electronic component inspection device 1 and use correspondence IC devices 90 Each type and replace, be referred to as the device of " replace external member (change kit) ".The replacement external member has mounting IC devices There is temperature regulation section 12 for example described below, the first device supply recoverer 14 as the mounting portion in the mounting portion of part 90 Deng.In addition, the mounting portion as mounting IC devices 90, other than replacing external member as described above, also user is prepared Inspection portion 16, pallet 200.

Electronic component inspection device 1 has the supply of the first pallet and removes the transported first device conveying of region A1, device Region (hreinafter referred to as " the first device conveyor zones ") A2, inspection area A3, the transported second device conveyor zones of device (hreinafter referred to as " the second device conveyor zones ") A4 and the supply of the second pallet remove region A5, as described below, these areas Domain is separated by each wall portion.In addition, IC devices 90 are supplying removal region A1 to the second pallet supply removal region from the first pallet A5 is along arrow α₉₀Direction is successively via above-mentioned each region, and inspection area A3 on the way is checked.In this way, electronic unit is examined Device 1 is looked into have：As the processing unit of the electronic component handling apparatus 10 in each region conveying IC devices 90, in inspection area The inspection portion 16 checked in A3 and control unit 800.In addition, in addition to this, electronic component inspection device 1 is also equipped with monitoring Device 300, signal lamp 400 and operation panel 700.

It should be noted that in electronic component inspection device 1, configuration the first pallet supply removes region A1 and the second support Disk supply removes the downside in the side of region A5, i.e. Fig. 2 as face side, upper in the side of configuration inspection region A3, i.e. Fig. 2 Side is used as back side.In addition, electronic component inspection device 1 is to carry out the room temperature inspection as the first inspection, checked as second Low temperature inspection and high temperature inspection as third inspection device, but below, using the room temperature checked as first It is illustrated for the state of inspection.

The supply of first pallet removes the pallet 200 that region A1 is multiple IC devices 90 that supply is arranged with non-inspection state Region.It supplies and is removed in the A1 of region in the first pallet, a large amount of pallet 200 can be stacked.

First device conveyor zones A2 is that the multiple IC removed on the pallet 200 that region A1 is conveyed will be supplied from the first pallet Device 90 conveys respectively, supplied to the region of inspection area A3.It should be noted that removing region A1 to be supplied across the first pallet The conveyor pallet structure 11 for conveying pallet 200 one by one in the horizontal direction is provided with the mode of the first device conveyor zones A2. Conveyor pallet structure 11 is can to make the arrow of pallet 200 in the Y direction, i.e. in Fig. 2 together with the IC devices 90 being placed on pallet 200 Head α₁₁The moving portion moved back and forth on direction.Thereby, it is possible to which IC devices 90 are steadily sent into the first device conveyor zones A2, and And empty pallet 200 can be made to be moved to the supply of the first pallet from the first device conveyor zones A2 and remove region A1.

It is provided with temperature regulation section (soak plate in the first device conveyor zones A2：Temperature-uniforming plate) 12 and device conveying First 13.

Temperature regulation section 12 works as the first temperature regulation section, and the first temperature regulation section can be in IC devices (electricity Subassembly) 90 the temperature that IC devices 90 are adjusted on the path of inspection area A3 is transported to from the pallet 200 as the first mounting portion Degree.The temperature regulation section 12 is referred to as " temperature-uniforming plate ", and placed IC devices 90 can uniformly be heated or cooled.Using this The IC devices 90 before being checked using inspection portion 16 can be heated or cooled in warm plate in advance, suitable to be adjusted to Close the temperature checked.Then, by conveyor pallet structure 11 IC removed on the pallet 200 that region A1 is sent into is supplied from the first pallet Device 90 is transported to temperature regulation section 12.It should be noted that by fixing the temperature regulation section 12 for being used as the mounting portion, Steadily IC devices 90 can be adjusted into trip temperature in temperature regulation section 12.

Device delivery head 13 is supported to move in the x-direction and the z-direction in the first device conveyor zones A2, into And also there is the part that can be moved in z-direction.Device delivery head 13 can undertake as a result, is supplying removal from the first pallet To the conveying of IC devices 90 and in temperature regulation section 12 and hereafter between the pallet 200 that region 1 is sent into and temperature regulation section 12 Conveying between the first device supply recoverer 14 to IC devices 90.It should be noted that in fig. 2, using arrow α_13X It indicates the movement of device delivery head 13 in the X direction, uses arrow α_13YIndicate the movement of device delivery head 13 in the Y direction.

Inspection area A3 is the region checked IC devices 90.It is provided with to IC devices 90 in the A3 of the inspection area The inspection portion 16 checked and device delivery head 17.In addition, being additionally provided with across the first device conveyor zones A2 and test zone The first device that the mode of domain A3 moves supplies recoverer 14 and with across inspection area A3's and the second device conveyor zones A4 The second device that mode moves supplies recoverer 18.

First device supply recoverer 14 is configured to the IC devices that mounting carries out excess temperature adjusting by temperature regulation section 12 90 mounting portion is referred to as " shuttle movable plate " or is referred to as " shuttle ", IC devices 90 can be delivered near inspection portion 16.

In addition, the first device supply recoverer 14 as the mounting portion be supported to can in X direction, i.e. arrow α₁₄Side It is moved back and forth between the first device conveyor zones A2 and inspection area A3.The first device supply recoverer 14 can as a result, IC devices 90 are stably delivered to from the first device conveyor zones A2 near the inspection portion 16 of inspection area A3, in addition, examining It looks into the A3 of region after removing IC devices 90 by device delivery head 17, the first device conveyor zones A2 can be returned again to.

In composition shown in Fig. 2, there are two the first devices to supply recoverer 14, temperature regulation section for configuration in the Y direction IC devices 90 on 12 are transported at any one first device supply recoverer 14.In addition, the first device supplies recoverer 14 In the same manner as temperature regulation section 12, it is configured to that the IC devices being placed on the first device supply recoverer 14 are heated or cooled 90.Accordingly, for the IC devices 90 for carrying out excess temperature adjusting by temperature regulation section 12, be able to maintain that its temperature adjustment state and It is transported near the inspection portion 16 of inspection area A3.

Device delivery head 17 is to hold the IC devices 90 for maintaining above-mentioned temperature adjustment state and conveyed in the A3 of inspection area The operating member of IC devices 90.The device delivery head 17 be supported in the A3 of inspection area can in the Y direction with it is reciprocal in Z-direction It is mobile, become a part for the mechanism referred to as " lead arm (index arm) ".Device delivery head 17 can will be from as a result, The IC devices 90 on the first device supply recoverer 14 that one device conveyor zones A2 is sent into are conveyed, are placed in inspection portion 16. It should be noted that in fig. 2, using arrow α_17YIndicate the reciprocating movement of device delivery head 17 in the Y direction.In addition, device is defeated Send first 17 be supported to can in the Y direction with moved back and forth in Z-direction, but not limited to this, and can also be supported to can also It is enough to move back and forth in the X direction.

It should be noted that the device delivery head 17 is segmented into two in the Y direction, from +Y direction side, it is segmented into Device delivery head 17A and device delivery head 17B.The device delivery head 17A and device delivery head 17B can also phase in z-direction Mutually independently move.

In addition, device delivery head 17 is configured to that held IC devices 90 are heated or cooled.As a result, from the first device Part supplies recoverer 14 to the temperature adjustment state that can continue maintenance IC devices 90 between inspection portion 16.

Inspection portion 16 be configured to mounting as electronic unit IC devices 90 and check IC devices 90 electrical characteristics mounting Portion.The multiple probes being electrically connected with the terminal of IC devices 90 are provided in the inspection portion 16.In addition, by making IC devices 90 Terminal and probe electrical connection contact, and can check IC devices 90.The inspection of IC devices 90 is based on being stored in being connected to Program in the inspection control unit that the tester in inspection portion 16 has and carry out.It should be noted that inspection portion 16 also can IC devices 90 are heated or cooled, to which IC devices 90 to be adjusted to the temperature for being suitble to inspection.

Second device supply recoverer 18 be configured to mounting by inspection portion 16 complete check IC devices 90 and can will IC devices 90 are delivered to the mounting portion of the second device conveyor zones A4, are referred to as " recycling shuttle movable plate " or referred to as " recycling Shuttle ".

In addition, the second device supply recoverer 18 be supported to can in X direction, i.e. arrow α₁₈Direction is in inspection area A3 And second move back and forth between device conveyor zones A4.In addition, in composition shown in Fig. 2, the second device supplies recoverer 18 In the same manner as the first device supply recoverer 14, in the Y direction there are two configuration, the IC devices 90 in inspection portion 16 are conveyed, It is placed on any one second device supply recoverer 18.The conveying is carried out by device delivery head 17.

Second device conveyor zones A4 be recycle checked in inspection area A3, the inspection after multiple IC devices 90 region.Device delivery head 20, conveyor pallet structure 22 and temperature is provided in the second device conveyor zones A4 to adjust Portion 15.In addition, being also prepared for free pallet 200 in the second device conveyor zones A4.

Device delivery head 20 is supported to move in the x-direction and the z-direction in the second device conveyor zones A4, into And also there is the part that can be moved in z-direction.Device delivery head 20 can supply IC devices 90 from the second device as a result, Recoverer 18 is delivered to empty pallet 200.It should be noted that in fig. 2, using arrow α_20XIndicate device delivery head 20 in the side X Upward movement, uses arrow α_20YIndicate the movement of device delivery head 20 in the Y direction.

In addition, there are three empty pallets 200 for configuration in X direction.The pallet 200 of the sky is also that mounting has been examined the inspection of portion 16 The mounting portion for the IC devices 90 looked into.In addition, being moved on the second device supply recoverer 18 of the second device conveyor zones A4 IC devices 90 are conveyed, any one of be placed on empty pallet 200 on.IC devices 90 are carried out according to inspection result as a result, Classification, recycling.

Temperature regulation section 15 works as second temperature adjustment portion, and second temperature adjustment portion can be in IC devices (electricity Subassembly) 90 the temperature that IC devices 90 are adjusted on the path of inspection area A3 is transported to from the pallet 200 as the second mounting portion Degree.The temperature regulation section 15 is referred to as " temperature-uniforming plate ", and placed IC devices 90 can uniformly be heated or cooled.Using this Warm plate can pre-cool the IC devices 90 before carrying out described below second by inspection portion 16 and checking, thus by it It is adjusted to the suitable second temperature checked.

It is that recycling and removal are arranged with the multiple IC devices 90 for checking the state that finishes that the supply of second pallet, which removes region A5, The material removal portion of pallet 200.It supplies and is removed in the A5 of region in the second pallet, a large amount of pallet 200 can be stacked.

In addition, being provided in the side Y in a manner of removing region A5 across the second device conveyor zones A4 and the supply of the second pallet Convey the conveyor pallet structure 22 of pallet 200 one by one upwards.Conveyor pallet structure 22 be can make pallet 200 in the Y direction, i.e. arrow Head α₂₂The moving portion moved back and forth on direction.Thereby, it is possible to the IC devices 90 finished will be checked from the second device conveyor zones A4 It is transported to the supply of the second pallet and removes region A5, and empty pallet 200 can be made to supply removal region A5 from the second pallet and moved It moves to the second device conveyor zones A4.

Control unit 800 can control such as conveyor pallet structure 11, temperature regulation section 12, device delivery head 13, the first device Part supply recoverer 14, temperature regulation section 15, inspection portion 16, device delivery head 17, the second device supply recoverer 18, device are defeated Send the running of each section of first 20 and conveyor pallet structure 22 etc..

In addition, as shown in Figure 1, control unit 800 has storage part 801.It is stored with inspection program in the storage part 801 Deng control unit 800 can be checked based on the inspection program.

Such storage part 801 by the nonvolatile memory of volatile memory, the ROM of such as RAM etc. etc., EPROM, Various semiconductor memory (the IC such as rewritable (the erasable, rewritable) nonvolatile memory of EEPROM, flash memory etc. Memory) etc. compositions.

Operator can be arranged by monitor 300 or confirm the operation condition etc. of electronic component inspection device 1.The monitoring Device 300 has the display screen 301 being for example made of LCD screen, and is configured in the face side of electronic component inspection device 1 Portion.As shown in Figure 1, the right side in the second pallet supplies the figure for removing region A5 is provided with the Mouse table 600 of mounting mouse.It should Mouse is used when operation is shown in the picture of monitor 300.First inspection, the second inspection and third inspection described below Selection can be to be arranged when observing the picture of the monitor 300.

In addition, relative to monitor 300, operation panel 700 is configured in the lower right of Fig. 1.Operation panel 700 and monitor 300 is different, and order electronic component inspection device 1 carries out desired action.

In addition, signal lamp 400 can report the running of electronic component inspection device 1 using the combination of sent out color State etc..Signal lamp 400 is configured at the top of electronic component inspection device 1.It should be noted that electronic component inspection device 1 It is built-in with loud speaker 500, the operating state etc. that can also report electronic component inspection device 1 by the loud speaker 500.

As shown in Fig. 2, in electronic component inspection device 1, the supply of the first pallet removes region A1 and the conveying of the first device It is separated by the first spaced walls 231 between the A2 of region, by the second interval between the first device conveyor zones A2 and inspection area A3 Wall 232 separates, and is separated by third spaced walls 233 between inspection area A3 and the second device conveyor zones A4, the second device Conveyor zones A4 and the supply of the second pallet are separated between removing region A5 by the 4th spaced walls 234.In addition, the first device conveys It is also separated by the 5th spaced walls 235 between region A2 and the second device conveyor zones A4.

The outermost layer of electronic component inspection device 1 is covered by outer cover, as shown in Figure 1, outer cover for example has protecgulum 241, side cover 242, side cover 243, rear cover 244 and head cover 245.

In existing electronic component handling apparatus, the inspection of IC devices is being terminated, is then being carried out with different temperature When inspection, operator needs the IC devices 90 after inspection being transported in different electronic component handling apparatus.At this moment, may Conveying error occurs because of operator.In addition, because operator conveys the time of electronic unit, check that efficiency reduces.In this implementation In mode, then this problem can be solved.In the following, being illustrated to the content.

It should be noted that in the present embodiment, the inspection that will be carried out under room temperature (room temperature) is referred to as " room temperature inspection The inspection carried out at low temperature is referred to as " low temperature inspection (second checks) ", the inspection that will be carried out at high temperature by (first checks) " Referred to as " high temperature inspection (third inspection) ".In addition, in the present specification, room temperature refers to 15 DEG C or more and less than 25 DEG C, and low temperature is Refer to -55 DEG C or more and less than 15 DEG C, high temperature refers to 25 DEG C or more 170 DEG C or less.

As illustrated in the flow chart of figure 5, in electronic component handling apparatus 10, it can be carried out continuously room temperature inspection (step successively Rapid S101), low temperature inspection (step S102) and high temperature inspection (step S103).First, room temperature inspection is illustrated.

First, it as shown in Fig. 2, in room temperature inspection (step S101), supplies in removal region A1 and configures in the first pallet Load the pallet 200 of IC devices 90.Then, IC devices 90 are delivered to the first device together with pallet 200 by conveyor pallet structure 11 Part conveyor zones A2.Then, IC devices 90 are transported on the first device supply recoverer 14 by device delivery head 13.

Then, IC devices 90 supply recoverer 14 by the first device and are transported to inspection area A3, and defeated by device First 17 are sent to be placed into inspection portion 16, to carry out room temperature inspection.The IC devices 90 for completing room temperature inspection are conveyed by device First 17 are placed on the second device supply recoverer 18, and are transported to the second device conveyor zones A4.

Then, the IC devices 90 for being transported to the second device conveyor zones A4 are placed by device delivery head 20 On pallet 200 during two device conveyor zones A4 are standby.At this moment, in the second device conveyor zones A4, three pallets 200 are along X Direction is arranged, according to the grade separation of room temperature inspection.It, can as the grade, such as since the pallet 200 of -X direction To be set as " qualification ", " reexamining ", " unqualified " successively.It should be noted that in fig. 2, representative illustration " qualification " IC devices 90.

The IC devices 90 being classified on pallet 200 are conveyed together with corresponding pallet 200 by conveyor pallet structure 22 It is supplied to the second pallet and removes region A5.

Room temperature inspection is illustrated above.

Like this, first check that first temperature of (room temperature inspection) is room temperature.That is, in electronic component handling apparatus 10, It is carried out from room temperature inspection.It, can thereby, it is possible to omit the time for the temperature for adjusting temperature regulation section 12 and temperature regulation section 15 etc. Successfully start the first inspection.So as to improve inspection efficiency.

Then, low temperature inspection (step S102) is illustrated.In the following, being illustrated to low temperature inspection using Fig. 3, scheming In 3, the result of room temperature inspection is typically illustrated as one in the IC devices 90 of " qualification ".It should be noted that classification It can directly be placed in the supply of the second pallet for the IC devices 90 of " reexamining " and " unqualified " and remove region A5, it can also be by Operator is discharged.In addition, in figure 3, using arrow α₉₀Indicate 90 transported path of IC devices.

First, before conveying IC devices 90, by part, i.e. temperature regulation section 15, inspection portion shown in shade in Fig. 3 16, device delivery head 17 and the second device supply recoverer 18 are adjusted to the temperature of suitable low temperature inspection.If temperature has been adjusted At then starting to convey IC devices 90.It should be noted that at this point, as illustrated in the time chart of FIG. 6, being also carried out at the same time to temperature tune Heating (the time t in section portion 12₁)。

As shown in figure 3, in low temperature inspection, the opposite side that IC devices 90 are checked to room temperature conveys.By room temperature inspection And it is conveyed together with corresponding pallet 200 by the IC devices 90 being positioned on the pallet 200 of the second pallet supply removal region A5 To the second device conveyor zones A4.Then, IC devices 90 are placed into temperature regulation section 15, and are suitble to low temperature inspection as temperature The state looked into.

IC devices 90 after temperature is adjusted are placed on the second device supply recoverer 18, and are transported to inspection area A3.Then, it is transported in inspection portion 16 by device delivery head 17, to carry out low temperature inspection.

IC devices 90 after low temperature inspection are placed into the first device by device delivery head 17 and supply recoverer 14 On, and the first device conveyor zones A2 is delivered to by the first device supply recoverer 14.Then, it is transported to the conveying of the first device On the pallet 200 of region A2.

At this moment, in the first device conveyor zones A2, three pallets 200 are arranged in X direction, according to low temperature inspection Grade separation.It as the grade, is checked equally with room temperature, since the pallet 200 of -X direction, can be set as " closing successively Lattice ", " reexamining ", " unqualified ".It should be noted that in figure 3, typically illustrating the IC devices 90 of " qualification ".

Low temperature inspection is illustrated above.

In low temperature inspection, IC devices 90 supply removal region A1 from the first pallet and are transported to inspection area A3, are examining It looks into after region A3 has carried out the first inspection and is transported to the second pallet supply removal region A5, and supplied from the second pallet and remove area Domain A5 is transported to inspection area A3, after inspection area A3 has carried out the second inspection, is transported to the supply of the first pallet and removes Region A1.The IC for removing region A5 thereby, it is possible to be transported to the supply of the second pallet by reversely conveying end first and checking This simple constitutes of device 90 checks to carry out the first inspection and second.Thus, it can be successfully after terminating the first inspection Start second to check.

In addition, being transported to IC devices 90 in the first path of inspection area A3 supplying removal region A1 from the first pallet The direction in the A3 of inspection area is admitted to (with reference to the arrow α in Fig. 2₉₀), with from the second pallet supply remove region A5 it is defeated Send the direction (arrow α in reference Fig. 3 being admitted in the A3 of inspection area to IC devices 90 on the second path of inspection area A3₉₀) It is opposite direction.Operator is by observing IC devices 90 transported directions as a result, can be easily verified that by range estimation be It carries out room temperature inspection and is still carrying out low temperature inspection.

Then, high temperature inspection (step S103) is illustrated.In the following, being illustrated to high temperature inspection using Fig. 4, scheming In 4, the result of low temperature inspection is typically illustrated as one in the IC devices 90 of " qualification ".It should be noted that classification It can directly be placed in the supply of the first pallet for the IC devices 90 of " reexamining " and " unqualified " and remove region A1, it can also be by Operator is discharged.In addition, in Fig. 4, using arrow α₉₀Indicate 90 transported path of IC devices.

First, before conveying IC devices 90, by part, i.e. inspection portion 16, device delivery head 17 shown in shade in Fig. 4 And first device supply recoverer 14 be adjusted to be suitble to the temperature of high temperature inspection.It is completed if temperature is adjusted, starts to convey IC devices Part 90.It should be noted that as described above, at the end of low temperature checks, temperature regulation section 12 becomes suitable for the temperature of high temperature inspection Degree.Recoverer 14 only is supplied by heating test portion 16, device delivery head 17 and the first device as a result, height can be started Temperature detector is looked into.That is, heating that is big to thermal capacitance, needing the temperature regulation section 12 for spending the time to can be only achieved set point of temperature can be omitted, So as to start high temperature inspection rapidly.

In addition, as illustrated in the time chart of FIG. 6, if low temperature inspection terminates, stopping the running (reference of temperature regulation section 15 T in Fig. 6₂).Thereby, it is possible to inhibit power consumption.

As shown in figure 4, in high temperature inspection, the opposite side that IC devices 90 are checked to low temperature conveys.That is, being examined by low temperature The IC devices 90 looked into and be positioned on the pallet 200 of the first pallet supply removal region A1 are defeated together with corresponding pallet 200 It send to the first device conveyor zones A2.Then, IC devices 90 are placed into temperature regulation section 12, and are suitble to high temperature as temperature The state of inspection.

IC devices 90 after temperature is adjusted are transported on the first device supply recoverer 14, and are transported to inspection area A3.Then, it is transported in inspection portion 16 by device delivery head 17, to carry out high temperature inspection.

IC devices 90 after high temperature inspection are transported to the second device by device delivery head 17 and supply recoverer 18 On, and supply recoverer 18 by the second device and be transported to the second device conveyor zones A4.Then, it is transported to the second device On the pallet 200 of conveyor zones A4.

At this moment, in the second device conveyor zones A4, three pallets 200 are arranged in X direction, and according to high temperature inspection Grade be classified.It since the pallet 200 of -X direction, can be set as successively in the same manner as room temperature inspection as the grade " qualification ", " reexamining ", " unqualified ".It should be noted that in Fig. 4, typically illustrating the IC devices of " qualification " 90。

High temperature inspection is illustrated above.

In high temperature inspection, conduct can be loaded by being removed in the A1 of region in the first pallet supply as the first mounting region IC devices (electronic unit) 90 before the high temperature inspection of third inspection.As a result, when high temperature checks, the first pallet can be omitted in Supply removes the operation in the region that the IC devices 90 before supplying high temperature checks separately are arranged except the A1 of region.It is filled so as to simplify Set composition.

In addition, as second check low temperature check after, inspection portion 16 can carry out with room temperature (the first temperature) and The different high temperature of low temperature (second temperature) (third temperature) checks the high temperature as third inspection of IC devices (electronic unit) 90 It checks, therefore three kinds of inspections can be carried out in an electronic component handling apparatus 10, the accuracy of inspection improves.

It is transported to the first pallet supply removal region (the first load after having carried out the second inspection in above-mentioned inspection area A3 Set region) the IC devices 90 of A1 supply from the first pallet and remove region A1 and be transported to inspection area A3, and in inspection area A3 It has inside carried out after being checked with the third of the third temperature check IC devices 90 different from the first temperature and second temperature, has been transported to The supply of second pallet removes region (the second mounting region) A5.Thereby, it is possible to defeated by reversely conveying end second and checking It send to the first pallet and supplies this simple composition of the IC devices 90 for removing region A1 to carry out third inspection.Thus, terminating It can successfully start third inspection after second inspection.

In addition, supplying the third path for removing region A1 and being transported to inspection area A3 from the first pallet in third inspection Upper IC devices 90 be admitted to the direction in the A3 of inspection area, with first check in from the first pallet supply remove region A1 it is defeated It is the same direction to send the direction being admitted in the A3 of inspection area to IC devices 90 in the first path of inspection area A3.Exist as a result, IC devices 90 on the second path of inspection area A3 are transported in second inspection from the second pallet supply removal region A5 to be sent Enter the direction in the A3 of inspection area (with reference to the arrow α in Fig. 3₉₀) and IC devices 90 are admitted to inspection area on third path Direction in A3 is (with reference to the arrow α in Fig. 4₉₀) it is opposite, it is low in progress that operator can easily verify that by visual observation Temperature detector is looked into or is carrying out high temperature inspection.

As described above, according to electronic component handling apparatus 10, can continuously, automatically make not via the hand of operator For the room temperature inspection (first checks), low temperature inspection (second checks) and high temperature inspection (third of the mutually different inspection of temperature It checks).Thereby, it is possible to save somewhat like the prior art like that after terminating an inspection, operator is defeated by the IC devices 90 after inspection The operation being sent on different electronic component handling apparatus.Thus, it is possible to conveying error caused by avoiding operator, and can Omit the time that operator conveys IC devices 90.As a result, it is possible to accurately be checked, and inspection efficiency can be improved.

Second embodiment

In the following, with reference to Fig. 7 and Fig. 8 to the electronic component handling apparatus of the present invention and this implementation of electronic component inspection device Mode illustrates, and is illustrated centered on the distinctive points with the above embodiment, and then the description thereof will be omitted for identical item.

For present embodiment in addition to the composition difference of device delivery head, remaining is identical with first embodiment.

In the present embodiment, in device delivery head 17, as shown in fig. 7, device delivery head 17A is only cooled down, such as Shown in Fig. 8, device delivery head 17B is only heated.

As shown in fig. 7, when low temperature checks, to temperature regulation section 15, inspection portion 16, device delivery head 17A and second Device supply recoverer 18A is cooled down.That is, when low temperature checks, it is omitted to device delivery head 17B and the supply of the second device The cooling of recoverer 18B.Thereby, it is possible to inhibit to be equivalent to the cold of device delivery head 17B and the second device supply recoverer 18B But the power consumption for the amount being omitted.It should be noted that when low temperature checks, such as the arrow α in Fig. 7₉₀It is shown, IC devices 90 Recoverer 18A is supplied via the second device, and is conveyed by device delivery head 17A.

In addition, as shown in figure 8, when high temperature checks, to temperature regulation section 12, the first device supply recoverer 14B, check Portion 16 and device delivery head 17B are heated.That is, when high temperature checks, be omitted to the first device supply recoverer 14A and The heating of device delivery head 17A.Thereby, it is possible to inhibit to be equivalent to supply recoverer 14A and device delivery head 17A to the first device The power consumption of component that is omitted of heating.It should be noted that when high temperature checks, such as the arrow α in Fig. 8₉₀It is shown, IC Device 90 supplies recoverer 14B via the first device, and is conveyed by device delivery head 17B.

Third embodiment

In the following, with reference to Fig. 9 to the electronic component handling apparatus of the present invention and the present embodiment of electronic component inspection device It illustrates, is illustrated centered on the distinctive points with the above embodiment, then the description thereof will be omitted for identical item.

For present embodiment in addition to the sequence difference of each inspection, remaining is identical with first embodiment.

As illustrated in the flow chart of fig. 9, in the present embodiment, the low temperature inspection (step checked as first is carried out successively S201), as the room temperature inspection (step S202) of the second inspection and as the high temperature inspection (step S203) of third inspection. That is, the first the first temperature checked is less than room temperature, the second second temperature checked is room temperature or is higher than room temperature.

By carrying out each inspection in this order, following advantage can be obtained.Under normal circumstances, finishing temperature After spending low inspection, if IC devices 90 to be directly discharged to the outside of device, IC devices 90 are easy moisture condensation.Therefore, pass through First into the first low inspection of trip temperature, then carries out second and check, can prevent IC devices from directly being arranged under low-temperature condition Go out the outside to device.As a result, it is possible to prevent or inhibit IC devices 90 to condense.

4th embodiment

In the following, the present embodiment of 0 pair of electronic component handling apparatus and electronic component inspection device of the invention referring to Fig.1 It illustrates, is illustrated centered on the distinctive points with the above embodiment, then the description thereof will be omitted for identical item.

As shown in the flowchart of fig. 10, in the present embodiment, the high temperature inspection (step checked as first is carried out successively S301), as the room temperature inspection (step S302) of the second inspection and as the low temperature inspection (step S303) of third inspection. That is, the first the first temperature checked is higher than the second second temperature checked.In addition, the first the first temperature checked is higher than room temperature, Second second temperature checked is room temperature or is less than room temperature.Each inspection is carried out by pressing such sequence, can be obtained as follows The advantages of.Under normal circumstances, compared with the case where being checked at low temperature, inspection is carried out at high temperature and is more prone to not conform to Lattice product.Therefore, as in the present embodiment, by carrying out the inspection from high temperature to low temperature successively, can omit to formerly carrying out Inspection in the inspection of the IC devices 90 of " defective work " that occurs.

5th embodiment

In the following, referring to Fig.1 1 to Figure 14 to the present invention electronic component handling apparatus and electronic component inspection device this reality The mode of applying illustrates, and is illustrated centered on the distinctive points with the above embodiment, and then the description thereof will be omitted for identical item.

For present embodiment in addition to being provided with third mounting region, remaining is identical with first embodiment.

As shown in figure 11, in the present embodiment, electronic component inspection device 1 has the first pallet supply removal region A1, the first device conveyor zones A2, inspection area A3, the second device conveyor zones A4, the supply of the second pallet remove region A5, support Disk supplements the region A6 and standby region A7 of pallet.In addition, electronic component inspection device 1 has conveyor pallet structure 31 and pallet Conveying mechanism 32.

Pallet supplement region A6 setting the first pallet supply remove region A1 and the second pallet supply remove region A5 it Between.Pallet supplement region A6 is the third mounting region for the pallet 200 that the empty supplement for not loading IC devices 90 is supplied.Such as This, region (the first mounting region) A1 and the second pallet supply removal region are removed by having to be configured to supply with the first pallet (second mounting region) region different A5 (supply of the first pallet removes region A1 and the supply of the second pallet remove region A5 it Between) and can configure mounting IC devices (electronic unit) 90 the pallet 200 as third mounting portion pallet supplement region (third mounting region) A6 can be supplied to the first pallet as described below and be removed region A1 or the second pallet supply removal area Domain A5 supplements pallet 200.So as to increase the grade being classified after inspection.

The standby region A7 of pallet is arranged between the first device conveyor zones A2 and the second device conveyor zones A4.Pallet waits for Machine region A7 is the region for keeping the pallet 200 supplied from pallet supplement region A6 standby.Region A6 and pallet are supplemented in the pallet In standby region A7, a large amount of pallet 200 can be also stacked.

In addition, being provided with conveyor pallet structure 31 in a manner of across pallet supplement region A6 and the standby region A7 of pallet.It should Conveyor pallet structure 31 is can to make the arrow α of pallet 200 in the Y direction, i.e. in Figure 11₃₁The moving portion moved back and forth on direction. Thereby, it is possible to which pallet 200 to be steadily sent into the standby region A7 of pallet, and pallet 200 can be made from the standby region A7 of pallet It is moved to pallet supplement region A6.

In addition, in a manner of across the first device conveyor zones A2, the standby region A7 of pallet and the second device conveyor zones A4 It is provided with conveyor pallet structure 32.The conveyor pallet structure 32 is the arrow α that can make pallet 200 in X-direction, i.e. Figure 11₃₂ The moving portion moved back and forth on direction.Thereby, it is possible to pallet 200 is steadily sent into the first device conveyor zones A2 or the second device Part conveyor zones A4, and pallet 200 can be made to be moved to from the first device conveyor zones A2 or the second device conveyor zones A4 The standby region A7 of pallet.

According to such electronic component handling apparatus 10, following advantage can be obtained.In the following, about this point, with normal Temperature detector illustrates for looking into.

Figure 12 is to show to complete the IC devices 90 of room temperature inspection together with three pallets in the second device conveyor zones A4 The figure of state of 200 classifications to classify.For example, when according to four grades " qualification 1 ", " qualification 2 ", " reexamining ", When " unqualified " classification, there are three pallets 200 for configuration in the second device conveyor zones A4, lack a pallet 200.It needs It is bright, in fig. 12, as an example, three pallets 200 in the second device conveyor zones A4 will be configured from -X direction side Be set as being classified as successively " qualification 1 ", " qualification 2 ", " reexamining " pallet 200.That is, in the second device conveyor zones A4, Lack the pallet 200 of the IC devices 90 of mounting " unqualified ".

At this moment, such as the arrow α in Figure 13₂₀₀It is shown, it can utilize conveyor pallet structure 32 that will load the IC devices of " unqualified " The support of " qualification 1 " of the pallet 200 of part 90 out of pallet standby region A7 configurations (supplement) to the second device conveyor zones A4 On disk 200.Therefore, as shown in figure 14, the IC devices 90 of " unqualified " can be positioned on supplemented pallet 200 to carry out Classification.

It is then possible to which it is standby that the pallet 200 of " unqualified " from the second device conveyor zones A4 is retracted into pallet again Region A7 can also be configured motionless in the second device conveyor zones A4, the IC devices until conveying next next " qualification 1 " Part 90.

It should be noted that in the composition of diagram, make three pallets 200 are unified to be deviated in the+x direction with pallet one by one Mode move, but two pallets or three pallet generalised displacements can also be made.Alternatively, it is also possible to be only convey a pallet 200 composition.In addition, the pallet 200 of " unqualified use " can be only fitted on the pallet 200 of " qualification 2 ", can also configure On the pallet 200 of " reexamining ".

In addition, can similarly utilize conveyor pallet structure 32 by pallet 200 from support in the case where carrying out second and checking On the standby region A7 configurations (supplement) to any one pallet 200 in the pallet 200 in the first device conveyor zones A2 of disk.

Like this, it is configured at 200 energy of pallet as third mounting portion of pallet supplement region (third mounting region) A6 Enough be moved to be configured at the supply of the first pallet remove region (first mounting region) A1 as the first mounting portion pallet 200 or The supply of the second pallet is configured to remove on the pallet 200 as the second mounting portion of region (the second mounting region) A5.As a result, can It is enough that the first pallet supply removal region A1 or the second pallet supply removal region will be added to as the pallet 200 of third mounting portion In A5.So as to increase the grade being classified after inspection.

Sixth embodiment

In the following, the present embodiment of 5 pairs of electronic component handling apparatus and electronic component inspection device of the invention referring to Fig.1 It illustrates, is illustrated centered on the distinctive points with the above embodiment, then the description thereof will be omitted for identical item.

For present embodiment in addition to being provided with heat pump, remaining is identical with first embodiment.

As shown in figure 15, the electronic component handling apparatus 10 of present embodiment has heating part 23, cooling end 24 and heat pump 25。

The heater that heating part 23 generates heat for example by energization is constituted.Heating part 23 is built in temperature shown in Fig. 2 In adjustment portion 12, device delivery head 13, the first device supply recoverer 14, inspection portion 16 and device delivery head 17, to each section It is heated.

The composition for example by the way that refrigerant is supplied to carry out cooling may be used in cooling end 24.Built in the cooling end 24 It is right in temperature regulation section 15, inspection portion 16, the second device supply recoverer 18, device delivery head 17 and device delivery head 20 Each section is cooled down.

The composition for example with Peltier (Peltier) element may be used in heat pump 25.Heat pump 25 will be right in cooling end 24 The heat extraction generated when each section is cooled down is supplied to heating part 23.As a result, when each section is heated in heating part 23, energy Enough assist the heating.Power consumption when so as to inhibit to be heated.

7th embodiment

In the following, referring to Fig.1 and Figure 16 to Figure 26 to the present invention electronic component handling apparatus and electronic component inspection device Present embodiment illustrate, illustrated centered on the distinctive points with the above embodiment, identical item is then omitted Its explanation.It should be noted that hereinafter, for convenience of description, the positive side of upside, that is, Z-direction in Figure 16 is referred to as "upper" sometimes Or " top ", the negative side of downside, that is, Z-direction in Figure 16 will be referred to as "lower" or " lower section ".

The electronic component handling apparatus 10 of present embodiment is processing unit, is had：As shown in figure 16, delivery section 29, it is defeated Power transmission subassembly；Mounting portion (such as device supply department 26) loads electronic unit；As shown in figure 17, shared path (supply line Road) 56, the fluid for the temperature for adjusting mounting portion is supplied to mounting portion；Discharge path (pumping-out line) 64A, from mounting portion discharge stream Body；At least one switching valve (the first switching valve 54, the second switching valve 59A and the second switching valve 59B), is configured at shared path (supply connection) 56 can switch over, to enable the fluid of shared path (supply connection) 56 to lead to using opening state It crosses, and is passed through using closed state blocking fluid；Test section 53, is configured at discharge path (pumping-out line) 64A, and detection passes through row The flowing of the fluid of outbound path (pumping-out line) 64A；And as shown in Figure 1, control unit 800, can control switching valve, control unit The testing result of 800 control information and test section 53 based on switching valve judges the state of switching valve.

As a result, as described below, the operator of operation electronic component conveying device 10 is able to confirm that the state of switching valve Judging result, and it is normal in the running of switching valve, electronic unit can be carried out using electronic component handling apparatus 10 Conveying.On the other hand, when certain unfavorable condition occurs in the running of switching valve, operator can for example replace the switching valve For new switching valve.As a result, switching valve can normal operation, so as to successfully be carried out using electronic component handling apparatus 10 The conveying of electronic unit.

In addition, as shown in figure 16, the electronic component inspection device 1 of present embodiment has electronic component handling apparatus 10, Also there is the inspection portion 16 for checking electronic unit.That is, the electronic component inspection device 1 of present embodiment has：Delivery section 29, it is defeated Power transmission subassembly；Mounting portion (such as device supply department 26) loads electronic unit；Shared path 56 (supply connection), to mounting Portion's supply adjusts the fluid of the temperature of mounting portion；Fluid is discharged from mounting portion in discharge path (pumping-out line) 64A；It is at least one Switching valve (the first switching valve 54, the second switching valve 59A and the second switching valve 59B), is configured at shared path (supply connection) 56, It can switch over, to enable the fluid of shared path (supply connection) 56 to pass through using opening state, and utilize closing State blocking fluid passes through；Test section 53, is configured at discharge path (pumping-out line) 64A, and detection passes through discharge path (discharge line Road) 64A fluid flowing；Control unit 800 can control switching valve；And inspection portion 16, it can check electronic unit, control The testing result of control information and test section 53 of the portion 800 processed based on switching valve judges the state of switching valve.

The electronic component inspection device 1 with above-mentioned electronic component handling apparatus 10 is obtained as a result,.In addition, energy It is enough that electronic unit is delivered to inspection portion 16, so as to be checked electronic unit by inspection portion 16.In addition, can be from Electronic unit after the conveying inspection of inspection portion 16.

In the following, the composition to each section is described in detail.

In electronic component inspection device 1, side, i.e. Figure 16 of region A5 is removed with tray feed region A1 and pallet In downside be face side, the upside in the side of configuration inspection region A3, i.e. Figure 16 is as back side.

In the electronic component inspection device 1 of present embodiment, the mounting portion setting of mounting IC devices (electronic unit) 90 At multiple positions, such as temperature regulation section 12 described below, device supply department 26 and device recoverer 28.In addition, conduct The mounting portion (mounting portion of mounting IC devices (electronic unit) 90) for replacing external member includes：The holding IC devices of device delivery head 13 90 part (handle part)；The part (handle part) for holding IC devices 90 of device delivery head 17；And device delivery head 20 Hold the part (handle part) of IC devices 90.In addition, replacing except external member as described above, IC devices (electronic unit) are loaded 90 mounting portion also has pallet 200, recycling pallet 19 and the inspection portion 16 that user is prepared.

In the present embodiment, in each pallet 200, multiple recess portions (recess) configure in array-like.It can be by IC devices 90 accommodate, are positioned in each recess portion one by one.

Device feed region A2 be will distinguish from multiple IC devices 90 on the pallet 200 that pallet feed region A1 is conveyed it is defeated It send, supplied to the region of inspection area A3.It should be noted that with the side of across pallet feed region A1 and device feed region A2 Formula is provided with conveyor pallet structure 11A, the 11B for conveying pallet 200 one by one in the horizontal direction.Conveyor pallet structure 11A is defeated The part in portion 29 is sent, and pallet 200 can be made to scheme to the positive side of Y-direction, i.e. together with the IC devices 90 of the pallet 200 are placed in Arrow α in 16_11AIt moves in direction.Thereby, it is possible to IC devices 90 are steadily sent into device feed region A2.In addition, pallet is defeated It is the arrow α that can make empty pallet 200 into the negative side of Y-direction, i.e. Figure 16 to send mechanism 11B_11BThe moving portion of direction movement. Thereby, it is possible to so that empty pallet 200 is moved to pallet feed region A1 from device feed region A2.

It is additionally provided in device feed region A2 and is moved in a manner of across device feed region A2 and inspection area A3 Device supply department 26.

Cooling unit 900, can also be to above-mentioned other than being cooled down to the IC devices 90 placed by temperature regulation section 12 Each mounting portion (such as need the device supply department 26 adjusted into trip temperature, 16 institute of handle part and inspection portion of device delivery head 17 The IC devices 90 of mounting are cooled down.

Temperature regulation section 12 is ground connection (grounded).

In being constituted shown in Figure 16, two temperature regulation sections 12 are configured and fixed in the Y direction.In addition, defeated by pallet Mechanism 11A is sent to be transported to any one temperature regulation section 12 from the IC devices 90 on the pallet 200 that pallet feed region A1 is sent into.

Device delivery head 13 has the handle part for holding IC devices 90, and being supported to can in device feed region A2 It moves in the x-direction and the z-direction, and then is also supported to move in z-direction.The device delivery head 13 is also delivery section 29 part can undertake between the pallet 200 and temperature regulation section 12 being sent into from pallet feed region A1 to IC devices 90 conveying and the conveying between temperature regulation section 12 and device supply department 26 described below to IC devices 90.It needs Illustrate, in figure 16, uses arrow α_13XIt indicates the movement of device delivery head 13 in the X direction, uses arrow α_13YIndicate device The movement of delivery head 13 in the Y direction.

Device supply department 26 is the mounting portion for the IC devices 90 that mounting carries out excess temperature adjusting by temperature regulation section 12, quilt Referred to as " for applying shuttle movable plate " or referred to as " supply shuttle ", IC devices 90 can be delivered near inspection portion 16.The device Supply department 26 can also become a part for delivery section 29.

In addition, the device supply department 26 as mounting portion be supported to can in X direction, i.e. arrow α₁₄Direction is supplied in device Answer reciprocating movement (movement) between region A2 and inspection area A3.Device supply department 26 can be by IC devices 90 from device as a result, Feed region A2 is stably delivered near the inspection portion 16 of inspection area A3, in addition, being conveyed by device in the A3 of inspection area After first 17 remove IC devices 90, device feed region A2 can be returned again to.

In being constituted shown in Figure 16, there are two device supply departments 26 for configuration in the Y direction, sometimes by Y-direction negative side Device supply department 26 is referred to as " device supply department 26A ", and the device supply department 26 of Y-direction positive side is referred to as " device supply department 26B ". In addition, the IC devices 90 in temperature regulation section 12 are transported to device supply department 26A in device feed region A2 or device supplies Answer portion 26B.In addition, device supply department 26, which in the same manner as temperature regulation section 12, is configured to cooling, is positioned in device supply department IC devices 90 on 26.Accordingly, for the IC devices 90 for carrying out excess temperature adjusting by temperature regulation section 12, it is able to maintain that its temperature It spends adjustment state and is transported near the inspection portion 16 of inspection area A3.It should be noted that device supply department 26 and temperature It is same to spend adjustment portion 12, heating IC devices 90 can also be configured to.In addition, device supply department 26 is same with temperature regulation section 12 Sample, and ground connection.

Conveyor pallet structure 27 is that the empty pallet 200 in the state of being removed all IC devices 90 is supplied in device It answers in the A2 of region to the positive side of X-direction, i.e. arrow α₁₅The mechanism of direction conveying.Also, after the conveying, empty pallet 200 is logical It crosses conveyor pallet structure 11B and is back to pallet feed region A1 from device feed region A2.

Device delivery head 17 is a part for delivery section 29, and in the same manner as temperature regulation section 12, is configured to cool down The IC devices 90 held.The device delivery head 17 has handle part (mounting portion).Handle part (mounting portion) is configured to handle Hold IC devices (electronic unit) 90.Device delivery head 17 can hold the IC devices 90 for maintaining above-mentioned temperature adjustment state as a result, And in the case where maintaining above-mentioned temperature adjustment state, IC devices 90 are conveyed in the A3 of inspection area.

Device delivery head 17 can lift IC devices 90 from the device supply department 26 being sent into from device feed region A2, and will It conveys, is placed in inspection portion 16.

It should be noted that in being constituted shown in Figure 16, there are two device delivery heads 17 for configuration in the Y direction, sometimes The device delivery head 17 of Y-direction negative side is referred to as " device delivery head 17A ", the device delivery head 17 of Y-direction positive side is referred to as " device Part delivery head 17B ".Device delivery head 17A can undertake in the A3 of inspection area IC devices 90 from device supply department 26A to inspection The conveying in portion 16, device delivery head 17B can undertake in the A3 of inspection area IC devices 90 from device supply department 26B to inspection portion 16 conveying.

Recycling pallet 19, device delivery head 20 and conveyor pallet structure 21 are provided in the A4 of device recovery zone. In addition, being additionally provided with the device recoverer 28 moved in a manner of across inspection area A3 and device recovery zone A4.In addition, in device Free pallet 200 is also prepared in the A4 of part recovery zone.

The device recoverer 28 can also become a part for delivery section 29.

In addition, device recoverer 28 be supported to can in X direction, i.e. arrow α₁₈Direction is returned in inspection area A3 and device It is moved back and forth between receipts region A4.In addition, in being constituted shown in Figure 16, in the same manner as device supply department 26, match in the Y direction Device recoverer 28 there are two setting, and the device recoverer 28 of Y-direction negative side is referred to as " device recoverer 28A " sometimes, by Y The device recoverer 28 of direction positive side is referred to as " device recoverer 28B ".Also, the IC devices 90 in inspection portion 16 are conveyed, are carried It sets on device recoverer 28A or device recoverer 28B.It should be noted that IC devices 90 are recycled from inspection portion 16 to device The conveying of portion 28A is undertaken by device delivery head 17A, and IC devices 90 are from inspection portion 16 to the conveying of device recoverer 28B by device Delivery head 17B undertakes.In addition, device recoverer 28 and temperature regulation section 12, device supply department 26 are same, and ground connection.

Recycling pallet 19 is to load the mounting portion of the IC devices 90 checked by inspection portion 16, and be fixed in device It is not moved in the A4 of recovery zone.Even if as a result, in the device of the various movable parts configured with more device delivery head 20 etc. In the A4 of recovery zone, the IC devices 90 for completing to check also can be steadily positioned on recycling pallet 19.It should be noted that In being constituted shown in Figure 16, there are three recycling pallets 19 for configuration in X direction.

Conveyor pallet structure 21 is the pallet 200 for the sky that region A5 is sent into will to be removed from pallet in the A4 of device recovery zone To X-direction, i.e. arrow α₂₁The mechanism of direction conveying.Also, after the conveying, empty pallet 200 is configured in recycling IC devices At 90 position, i.e., can become above three sky any one of pallet 200.

It is conveyed one by one in the Y direction in addition, being provided in such a way that across device recovery zone A4 and pallet remove region A5 Conveyor pallet structure 22A, the conveyor pallet structure 22B of pallet 200.Conveyor pallet structure 22A is a part for delivery section 29, is Can make pallet 200 in the Y direction, i.e. arrow α_22AThe moving portion moved back and forth on direction.The IC that thereby, it is possible to will complete to check Device 90 is transported to pallet from device recovery zone A4 and removes region A5.In addition, conveyor pallet structure 22B can be used in recycling The empty pallet 200 of IC devices 90 is to the positive side of Y-direction, i.e. arrow α_22BIt moves in direction.Thereby, it is possible to make empty pallet 200 from Pallet removes region A5 and is moved to device recovery zone A4.

Control unit 800 can control such as conveyor pallet structure 11A, conveyor pallet structure 11B, temperature regulation section 12, device Part delivery head 13, device supply department 26, conveyor pallet structure 27, inspection portion 16, device delivery head 17, device recoverer 28, device The running of part delivery head 20, conveyor pallet structure 21, conveyor pallet structure 22A and conveyor pallet structure 22B.In addition, removing this Except, control unit 800 can also control each section (such as the first switching valve 54, the second switching valve 59A, of cooling unit 900 Two switching valve 59B and test section 53 etc.) running.

As shown in figure 17, electronic component inspection device 1 (electronic component handling apparatus 10) has cooling unit 900.It is cooling Unit 900 is acted as the cooling body (thermoregulation mechanism) for carrying out cooling (temperature adjusting) to mounting portion and IC devices 90 With as the mounting portion, temperature regulation section 12, device supply department 26, the handle part of device delivery head 17 and inspection can be enumerated Look into portion 16.In the following, typically illustrating the cooling in device supply department 26.It should be noted that as an example, device supply department 26 have recess portion (recess) 141 and recess portion (recess) 142.It can one by one accommodate, load respectively in recess portion 141 and recess portion 142 IC devices 90.

In addition, cooling unit 900 both can be to the holding of temperature regulation section 12, device supply department 26, device delivery head 17 All mounting portions in portion and inspection portion 16 are adjusted into trip temperature, and at least one mounting can also be selected from these mounting portions Portion, and selected mounting portion is adjusted into trip temperature.It is each to load in the case where being adjusted into trip temperature to all mounting portions The temperature in portion may be the same or different.

Cooling unit 900 can adjust the temperature for the IC devices 90 being respectively received in recess portion 141 and recess portion 142.For example, Cooling unit 900 can be adjusted to -45 DEG C and be used as first object temperature, which is the temperature of low temperature inspection Degree.In addition, for example, cooling unit 900, which can be adjusted to 18 DEG C (room temperature), is used as the second target temperature, the second target temperature Degree is higher than first object temperature.Certainly, it's not limited to that for each target temperature, but can be arranged to arbitrary temp.

In cooling unit 900, the IC to being positioned in device supply department (mounting portion) 26 is stored in holding vessel 55 Device 90 adjusts the fluid of temperature.The fluid is the refrigerant for cooling down device supply department (mounting portion) 26 together with IC devices 90, As the refrigerant, liquid nitrogen can be used for example.Thereby, it is possible to be rapidly cooled to first object temperature.

The shared path 56 being mainly made of pipeline (liquid pushing tube or snorkel) is connected to holding vessel 55.Shared path 56 is It is supplied to device to supply the refrigerant (fluid) of the temperature for the IC devices 90 that adjusting is positioned in device supply department (mounting portion) 26 Answer the supply connection in portion's (mounting portion) 26.It should be noted that preferably, in shared path 56, the periphery of pipeline is arranged Heat-barrier material (not shown).In addition, the first supply path 57A and the first supply path 57B as described below also with shared path 56 is identical.

It is configured with the first switching valve 54 in the midway of shared path 56.First switching valve 54 be can take opening state and Closed state, the valve that can be opened and closed, and be to allow hand over the supply of refrigerant by the way that it is opened and closed and stop refrigerant The master switch of supply.

Shared path (supply connection) 56 has in the position point than configuring the part of the first switching valve 54 side farther downstream Branch that is, is branched off into the confessions of the first supply path 57A and first at the branched line of a plurality of (being two in being constituted shown in Figure 17) Answer path 57B.

First supply path 57A is connected to the inflow end EnA of medium runner 58A, and medium runner 58A is to pass through recess portion 141 The mode of underface be formed in device supply department 26.It is configured with the second switching valve 59A in the midway of the first supply path 57A, Second switching valve 59A is the valve that can be taken opening state and closed state, can be opened and closed, and is opened and closed and can controlled by it Make the supply to the refrigerant of medium runner 58A.

First supply path 57B is the pipeline with the cross section of fluid channel product roughly equal with the first supply path 57A, and even It is connected to the inflow end EnB of medium runner 58B, medium runner 58B is formed in device confession in a manner of by the underface of recess portion 142 Answer portion 26.It is configured with the second switching valve 59B in the midway of the first supply path 57B, second switching valve 59B is can to take to beat Open state and closed state, the valve that can be opened and closed can control the confession of refrigerant to medium runner 58B by the way that it is opened and closed Ying Liang.

As described above, being configured with multiple switching valves on shared path (supply connection) 56, multiple switching valve is with can Switch refrigerant on the shared path (supply connection) 56 with operated by way of cut-out.Also, the switching valve includes：Energy Enough the first switching valves 54 being opened and closed as described above；And it is configured at the first switching valve of ratio 54 of shared path (supply connection) 56 Farther downstream the position of side, at least one second switching valve that can be opened and closed as described above, i.e., be, in the present embodiment Second switching valve 59A and the second switching valve 59B.

In addition, as described above, shared path (supply connection) 56 have than configure the first switching valve 54 part more lean on The position branch in downstream side at two (a plurality of) branched line.Also, on each branched line, i.e., in the first supply path It is configured with the second switching valve 59A on 57A, the second switching valve 59B is configured on the first supply path 57B.

By such composition, such as pass through appropriately combined first switching valve 54, the second switching valve 59A and the second switching valve The opening and closing of each switching valve of 59B can easily choose to the unified supply refrigerant of both recess portion 141 and recess portion 142, stop to recessed Both portion 141 and recess portion 142 supply refrigerant supply refrigerant to any one of recess portion 141 and recess portion 142.

It should be noted that in being constituted shown in Figure 17, correspond to the quantity of recess portion possessed by device supply department 26 (recess portion 141 and recess portion 142), shared path 56 is branched off into two, and but not limited to this.For example, in 26 institute of device supply department In the case that the quantity for the recess portion having is one, the branch being omitted on shared path 56, and more than the first switching valve 54 The position of downstream configures second switching valve.In addition, the quantity of the recess portion possessed by device supply department 26 is three In the case of above, branch's number on shared path 56 also becomes three or more, in side farther downstream than the first switching valve 54 Position configure the second switching valve of identical as branch's number quantity.

In addition, in the present embodiment, the composition of the fluid circuit in cooling unit 900 is (for example, shared path 56, The configuration mode of each pipeline of one supply path 57A and the first shared path 57B etc., the first switching valve 54, the second switching valve Type, configuration and setting quantity of each switching valve of 59A and the second switching valve 59B etc.) it is not limited to structure shown in Figure 17 At.

First switching valve 54, the second switching valve 59A and the second switching valve 59B be be powered when enter opening state and can Make refrigerant (fluid) by, in no power when enter closed state by cut off so-called " closed type " of refrigerant (fluid) and cut Change valve.As a result, for example in the case where the environment using electronic component inspection device 1 enters power failure, refrigerant is cut off, to It can prevent refrigerant from being continued to supply in vain.

The position of side and first supplies farther downstream for part of the ratio of first supply path 57A configured with the second switching valve 59A The position of the part of the ratio of path 57B configured with the second switching valve 59B side farther downstream is answered to share gasification vessel 60.Gasification vessel Vaporizer 61A and vaporizer of the cross section of fluid channel product more than the first supply path 57A and the first supply path 57B are divided into 60 61B.Vaporizer 61A is flowed by the liquid nitrogen of the first supply path 57A, gasification is flowed by the liquid nitrogen of the first supply path 57B Room 61B.Separately flow into nitrogen of the liquid nitrogen of vaporizer 61A and vaporizer 61B as temperature less than first object temperature and from gas Change container 60 to flow out.Then, medium runner 58A can be flowed into and make cooling in recess portion 141 by becoming the refrigerant of nitrogen, while energy It enough flows into medium runner 58B and makes cooling in recess portion 142.

In addition, in the inside of device supply department 26, having heaters 62A is set in the underface of recess portion 141, in recess portion 142 Underface setting having heaters 62B.Heater 62A can be to heating in recess portion 141, and heater 62B can be to recess portion It is heated in 142.Also, what is carried out using the cooling carried out by the nitrogen by medium runner 58A and by heater 62A is added Heat, in recess portion 141, the IC devices 90 that are placed in recess portion 141 be controlled as first object temperature.Similarly, using by passing through The cooling that the nitrogen of medium runner 58B carries out and the heating carried out by heater 62B, recess portion 142 is interior, is placed in recess portion 142 IC devices 90 be controlled as first object temperature.

In addition, the temperature sensor 63A for the temperature being provided in recess portion 141 in detection recess portion 141, in recess portion 142 It is provided with the temperature sensor 63B of the temperature in detection recess portion 142.

The pumping-out line of refrigerant (fluid) as recess portion 141 side of the discharge from device supply department (mounting portion) 26 Discharge path 64A be connected to the outflow end ExA of medium runner 58A.Discharge path 64A is connected to be supplied as with containment device The storage case 50 of the receiving container in the space in portion 26 is answered, and the refrigerant (nitrogen) being discharged from medium runner 58A is imported and is accommodated Case 50.

In addition, the discharge path of the refrigerant (fluid) of recess portion 142 side of the discharge from device supply department (mounting portion) 26 Diameter (pumping-out line) 64B is connected to the outflow end ExB of medium runner 58B.Discharge path 64B is connected to discharge at interconnecting piece 65 Path 64A, and the refrigerant (nitrogen) being discharged from medium runner 58B is expelled to discharge path 64A.

On discharge path 64A, at the position than the 65 upstream side of interconnecting piece with discharge path 64B, it is configured with Check-valves 66A, check-valves 66A allow gas to be flowed from medium runner 58A to interconnecting piece 65, and prevent refrigerant (nitrogen) from Interconnecting piece 65 is flowed to medium runner 58A.Similarly, on discharge path 64B, than the interconnecting piece 65 with discharge path 64A At the position of upstream side, it is configured with check-valves 66B, check-valves 66B allows refrigerant (nitrogen) from medium runner 58B to even Socket part 65 flows, and refrigerant (nitrogen) is prevented to be flowed from interconnecting piece 65 to medium runner 58B.Pass through non-return as setting Valve 66A and check-valves 66B can prevent the refrigerant being for example discharged from medium runner 58A from being flowed into along discharge path 64B reflux Medium runner 58B and the refrigerant being discharged from medium runner 58B flow into medium runner 58A along discharge path 64A reflux.

In addition, on discharge path 64A, at the position of side farther downstream than the interconnecting piece 65 with discharge path 64B, match It is equipped with the heat exchanger 67 as heating part.Heat exchanger 67 is so-called plate heat exchanger, and with discharge path 64A and purification air Supply path 70 connects, and purification air supply path 70 is supplied as the purification of the dry air from dry air source of supply 69 Air.In heat exchanger 67, flows through the refrigerant of discharge path 64A and flow through the purification air in purification air supply path 70 simultaneously Stream carries out heat exchange between the refrigerant and purification air.

In addition, on discharge path 64A, it is configured with check-valves 68 in the downstream side of heat exchanger 67, check-valves 68 allows gas Body is flowed from heat exchanger 67 to storage case 50, and gas is prevented to flow back from storage case 50 to heat exchanger 67.By being arranged in this way Check-valves 68, can inhibit water content be more than refrigerant (nitrogen) air flowed into from storage case 50 by discharge path 64A Heat exchanger 67, medium runner 58A, medium runner 58B and gasification vessel 60.As a result, when the second switching valve 59A and second is cut Changing valve 59B when secondary control is in an open state again, can be inhibited in changing at the position than 68 upstream side of check-valves It is generated on the circulation path of the refrigerant (nitrogen) of hot device 67, medium runner 58A, medium runner 58B and gasification vessel 60 etc. Moisture condensation freezes.

In addition, in the ratio check-valves 68 farther downstream at the position of side of discharge path (pumping-out line) 64A, configured with detection Portion 53, the detection of test section 53 is by the state of the flowing of the refrigerant (fluid) of discharge path (pumping-out line) 64A (for example, pressure Power, flow etc.).The test section 53 passes through the pressure of the pressure of the refrigerant (fluid) of discharge path (pumping-out line) 64A by detection The flow that power meter (pressure sensor) 531 or detection pass through the flow of the refrigerant (fluid) of discharge path (pumping-out line) 64A (flow sensor) 532 is counted to constitute (with reference to Figure 27).In being constituted shown in Figure 17, test section 53 is made of pressure gauge 531.It is logical Cross just can be easily realized by the flowing of the refrigerant by discharge path 64A using pressure gauge 531 by simply constituting State, i.e., refrigerant with which kind of degree flow.

Dry air source of supply 69 by compressor, drier at, to the air around electronic component inspection device 1 into On the basis of row compression, drying, it is supplied to purification air supply path 70.To the supply in purification air supply path 70 Purification air supply valve 71 by changing the cross section of fluid channel product in purification air supply path 70 controls.Purify air supply path 70 It is connected to storage case 50, the purification air flowed out from heat exchanger 67 is imported into storage case 50.On purification air supply path 70, Air heater 72 configured with heating purification air between purification air supply valve 71 and heat exchanger 67.It is heated by the air The purification air that device 72 heats is provided to heat exchanger 67.

In addition, on purification air supply path 70, check-valves 73, check-valves 73 are configured in the downstream side of heat exchanger 67 Allow gas to be flowed from heat exchanger 67 to storage case 50, and gas is prevented to flow back from storage case 50 to heat exchanger 67.By setting Set such check-valves 73, it is suppressed that the air that water content is more than refrigerant (nitrogen) flows back from storage case 50, can will exchange heat Device 67 and purification air supply path 70 maintain drying regime.

Other than supplying air to above-mentioned purification air supply path 70, dry air source of supply 69 is also by dry air Dry air caused by source of supply 69 is supplied to the second supply path 75 as elevated temperature gas.Second supply path 75 is being divided The second supply path 75A and the second supply path 75B are branched off at branch 76.Second supply path 75A is connected by interconnecting piece 77A It is connected to the first supply path 57A, the second supply path 75B and the first supply path 57B is connected to by interconnecting piece 77B.

At the position of the 76 upstream side of ratio branch of the second supply path 75, configured with the heating as control valve Gas supply valve 78, elevated temperature gas supply valve 78 changes the cross section of fluid channel product of the second supply path 75, to which control is supplied second Answer the supply of the elevated temperature gas in path 75.In addition, the elevated temperature gas supply valve 78 in the second supply path 75 and branch It will heat up gas configured with the air heater 79 as heating part, air heater 79 between 76 and be heated above as second 18 DEG C of predetermined temperature of target temperature, such as 60 DEG C.Shape is closed that is, being in the second switching valve 59A and the second switching valve 59B State and elevated temperature gas supply valve 78 it is in the open state in the case of, temperature flows into the higher than the elevated temperature gas of the second target temperature One supply path 57A and the first supply path 57B, recess portion 141 and recess portion 142 are warmed gas and directly heat.

In addition, allowing to heat up configured with the check-valves 80A as blocking portion, check-valves 80A on the second supply path 75A Gas prevents nitrogen from the first supply path 57A to second from the second supply path 75 to the first supply path 57A flowing Supply path 75 flows.Similarly, configured with the check-valves 80B as blocking portion, check-valves on the second supply path 75B 80B allows elevated temperature gas to be flowed from the second supply path 75 to the first supply path 57B, and prevents nitrogen from the first supply road Diameter 57B is flowed to the second supply path 75.

Cooling unit 900 configured as described is able to carry out while the cooling of cooling device supply department 26 and IC devices 90 It controls (cooling operation) and the state of cooling is made to restore to restore control to the room temperature of room temperature (room temperature resumes operation).

Cooling control is performed as：First switching valve 54 is " opening (OPEN) ", and the second switching valve 59A is " opening (OPEN) ", Second switching valve 59B is " opening (OPEN) ", and elevated temperature gas supply valve 78 is " closing (CLOSE) ", and purification air supply valve 71 is " to open (OPEN) ", heater 62A is " ON ", and heater 62B is " ON ", and air heater 72 is " ON ", and air heater 79 is “OFF”。

Room temperature restores control and is performed as：First switching valve 54 is " closing (CLOSE) ", and the second switching valve 59A is " to close (CLOSE) ", the second switching valve 59B is " closing (CLOSE) ", and elevated temperature gas supply valve 78 is " opening (OPEN) ", purifies air supply Valve 71 is " opening (OPEN) ", and heater 62A is " ON ", and heater 62B is " ON ", and air heater 72 is " ON ", air heating Device 79 is " ON ".

However, the user of electronic component inspection device 1 will separately prepare to store when using electronic component inspection device 1 Tank 55, and it is coupled with the shared path 56 of electronic component inspection device 1.Such as sundries, dust are mixed into holding vessel 55, In addition in the case of the foreign matter for being mixed into metal powder etc., worry that card hangs over the to the foreign matter by shared path 56 together with refrigerant On any one of one switching valve 54, the second switching valve 59A and second switching valve 59B.At this moment, it is envisioned that card hangs with foreign matter Switching valve be difficult to carry out normal on-off action.For example, if switching valve should be closed, but due to card hangs with foreign matter It is kept open, in this way, refrigerant is continued to supply in vain.In addition, since the refrigerant is supplied in vain, caused Degree is cooling and can not be controlled into trip temperature, to occur having to make heater 62A, heater to eliminate sub-cooled The unfavorable condition of 62B excessively running etc..Alternatively, it is also possible to imagine the first switching valve 54, the switchings of the second switching valve 59A and second Valve 59B is difficult to carry out normal on-off action because deteriorating at any time.At this moment also there is same unfavorable condition.

Then, electronic component inspection device 1 is configured to prevent such unfavorable condition.In the following, to this composition and work With illustrating.

Control unit 800 is based on making the first switching valve 54, the second switching valve 59A and the second switching valve (switching valve) 59B respectively The control information (signal for being set to opening state or closed state) of running and the inspection of test section 53 (pressure gauge 531) It surveys as a result, judging the state of above-mentioned each switching valve.In the following, the judgement is referred to as " switching valve condition adjudgement ".It is specific and Speech, " switching valve condition adjudgement " refers to judging whether the running of switching valve normal, i.e., switching valve whether temperature-controllable state Lower running or the running of switching valve are with the presence or absence of abnormal.Then, judged, it is judged as abnormal switching valve in presence In the case of, which can be for example replaced with to new switching valve.As a result, switching valve can normally, i.e. temperature-controllable Running, so as to prevent above-mentioned unfavorable condition.

Control unit 800 can be judged the first switching valve 54, the second switching valve 59A and the second switching valve 59B respectively State these three control.Flow chart based on Figure 18 to Figure 20 illustrates the control program.It should be noted that as being somebody's turn to do The timing of control is not particularly limited, and preferably conveys (inspection) for example before each batch conveying (inspection) starts, in each batch After, every the periodic time etc. of timer setting.

Figure 18 is the flow chart of the first control program.

Control unit 800 will be in the first switching valve 54 and the second switching valve (the second switching valve 59A and the second switching valve 59B) One of be set as closed state, another one is set as opening state, to switch over valve condition adjudgement (judgement).In the first control In processing procedure sequence, the first switching valve 54 is set as closed state (step S401) by control unit 800, by the second switching valve 59A and second Switching valve 59B is set as opening state (step S402).Then, in this state, pressure gauge 531 (test section 53) is made to operate, inspection Pressure measurement force value (detected value) P₁(step S403).Judge the pressure value P₁Whether it is pre-set a reference value M₁(step S404). In step s 404, as pressure value (detected value) P of pressure gauge 531 (test section 53)₁For pre-set a reference value (value) M₁ When, switching valve condition adjudgement (judgement) of the running in normal condition of the first switching valve 54 is carried out, and pass through monitor 300 etc. It is notified (step S405).In addition, when the judgement by step S404, pressure value P is learnt₁Not a reference value M₁(pressure value P₁ More than a reference value M₁) when, there is abnormal switching valve condition adjudgement in the running for carrying out the first switching valve 54, and pass through monitor 300 etc. are notified (step S406).It should be noted that as a reference value M₁, can be set as example executing the first control Atmospheric pressure when program.

Then, once notice in operator's verification step S405 of operation electronic component check device 1, then can pass through Electronic component inspection device 1 checks IC devices 90.On the other hand, once notice in verification step S406, then operate Member can learn that the first switching valve 54 is blocked by foreign matter, and running occurs abnormal.Then, operator can be 54 by the first switching valve Such as it is replaced with the first new switching valve 54.As a result, the first switching valve 54 can normal operation, so as to prevent above-mentioned bad feelings Condition, while IC devices 90 can be checked.

Figure 19 is the flow chart of the second control program.

Control unit 800 will be in the first switching valve 54 and the second switching valve (the second switching valve 59A and the second switching valve 59B) One of be set as closed state, another one is set as opening state, to switch over valve condition adjudgement (judgement).In the second control In processing procedure sequence, the first switching valve 54 is set as opening state (step S501) by control unit 800, by the second switching valve 59A and second Switching valve 59B is set as closed state (step S502).Then, in this state, pressure gauge 531 (test section 53) is made to operate, inspection Pressure measurement force value (detected value) P₂(step S503).Judge the pressure value P₂Whether it is pre-set a reference value M₂(step S504). In step S504, as pressure value (detected value) P of pressure gauge 531 (test section 53)₂For pre-set a reference value (value) M₂ When, switching valve condition adjudgement (judgement) of the running in normal condition of the second switching valve 59A and the second switching valve 59B is carried out, And it is notified (step S505) by monitor 300 etc..In addition, when the judgement by step S504, pressure value P is learnt₂And Non-referenced value M₂(pressure value P₂More than a reference value M₂) when, carry out at least one in the second switching valve 59A and the second switching valve 59B There is abnormal switching valve condition adjudgement in a running, and notified (step S506) by monitor 300 etc..It needs to illustrate , as a reference value M₂, the atmospheric pressure for example when executing the second control program can be set as.

Then, once notice in operator's verification step S505, then can be by electronic component inspection device 1 to IC devices Part 90 is checked.On the other hand, once notice in verification step S506, then operator can learn the second switching valve 59A It is blocked by foreign matter at least one of the second switching valve 59B, running occurs abnormal.Then, operator can be by the second switching Second switching valve of the presence exception in valve 59A and the second switching valve 59B is for example replaced with the second new switching valve.As a result, Two switching valve 59A and the second switching valve 59B can normal operation, so as to prevent above-mentioned unfavorable condition, while can be to IC Device 90 is checked.

Figure 20 is the flow chart of third control program.

First switching valve 54 is set as opening state (step S601) by control unit 800.Then, each branched line will be configured at The second switching valve in a switching valve be set as opening state, remaining second switching valve is set as closed state.That is, will match The the second switching valve 59A for being placed in the first supply path 57A is set as opening state (step S602), will be configured at the first supply path The second switching valve 59B of 57B is set as closed state (step S603).Then, in this state, make 531 (test section of pressure gauge 53) it operates, detects pressure value (detected value) P₃(step S604).Judge the pressure value P₃Whether it is pre-set a reference value M₃ (step S605).In step s 605, as pressure value (detected value) P of pressure gauge 531 (test section 53)₃For pre-set base Quasi- value (value) M₃When, the running for carrying out the second switching valve 59A (the second switching valve in the open state) is in normal condition Switching valve condition adjudgement (judgement), and notified (step S606) by monitor 300 etc..In addition, when passing through step S605 Judgement, learn pressure value P₃Not a reference value M₃(for example, pressure value P₃It is equal to atmospheric pressure) when, carry out the second switching valve 59A Running there is abnormal switching valve condition adjudgement, and notified (step S607) by monitor 300 etc..

Then, the second switching valve 59A is set as closed state (step S608), the second switching valve 59B is set as open shape State (step S609).Then, in this state, so that pressure gauge 531 (test section 53) is operated, detect pressure value P₃(step S610).Judge the pressure value P₃Whether on the basis of value M₃(step S611).In step s 611, work as pressure value P₃On the basis of value M₃ When, carry out switching valve state of the running in normal condition of the second switching valve 59B (the second switching valve in the open state) Judge, and is notified (step S612) by monitor 300 etc..In addition, when the judgement by step S611, pressure value is learnt P₃Not a reference value M₃(for example, pressure value P₃It is equal to atmospheric pressure) when, there is exception in the running for carrying out the second switching valve 59B Switching valve condition adjudgement, and notified (step S613) by monitor 300 etc..It should be noted that a reference value M₃It can be with It is the arbitrary size other than such as atmospheric pressure.

Then, once notice in operator's verification step S606 and step S612, then can pass through electronic unit inspection Device 1 checks IC devices 90.On the other hand, once notice in verification step S607 and step S613, then operator It can learn that the second switching valve 59A and the second switching valve 59B itself for example break down, running occurs abnormal.Then, operator Second switching valve 59A and the second switching valve 59B can be for example replaced with to new the second switching valve 59A and the second switching valve 59B. As a result, the second switching valve 59A and the second switching valve 59B can normal operation, so as to prevent above-mentioned unfavorable condition, while energy It is enough that IC devices 90 are checked.

Program, the second control program and third are controlled by as described above first and controls program, can accurately be judged First switching valve 54, the second switching valve 59A and the second switching valve 59B various states (such as, if normal operation, Huo Zheyun Whether exception is occurred).Thereby, it is possible to prevent above-mentioned unfavorable condition, and electronic component inspection device 1 can be made to operate.

Then, with reference to Figure 21 to Figure 26, an example of the pattern of the execution to switching valve condition adjudgement is arranged and show that it is held An example of the pattern of row result illustrates.It should be noted that " pattern " is sometimes referred to as " picture ", " dialog box (dialog) ", " window " etc..

First, pattern FM1 shown in Figure 21 is shown on monitor 300.Pattern FM1 is key frame.Pattern FM1 packets It includes：Key group BT100, first item group IT110, second item group IT120, third item group IT130, fourth item group IT140, fifth item group IT150 and sixth item group IT160.

Key group BT100 includes：The button BT101 of " terminate (Exit) ", " closing (Shutdown) " button BT102, the button BT103 of " (DeviceSet) is arranged in type ", the button BT104 of " (UnitSet) is arranged in unit ", " dimension Repair (Maintenance) " button BT105, " self-defined (My Pad) " button BT106 and " calculator (Calculator) " button BT107.

First item group IT110 includes：The project IT111, " temperature mould of " user selects (User Select) " setting The project IT112 of formula (Temperature) " setting, the project IT113 of " tester connects (Tester) " setting, " conveying The project IT114 of pattern (Run Mode) " setting, the project IT115, " ring of " starting pattern (Start Mode) " setting (Bin Setting) is arranged in border " the project IT116 of setting, " humidity, the temperature in each region " setting project IT117, The project IT118 of " setting data (Setup Files) " setting, the project of " test position (Test Site) " setting IT119。

Second item group IT120 includes：The project IT121, " temperature-uniforming plate of " supply shuttle (Input Shuttle) " setting The project IT122 of (Soak plate) (temperature regulation section) " setting, the project IT123, " arm 1 of " arm 2 (Arm2) " setting The project IT124 of (Arm 1) " settings, the project IT125, " base vent of " pedestal heats (Socket Heat) " setting The project IT126 of (Socket Air), pedestal cooling (Socket Cool) " setting.

Third item group IT130 includes：The project 131 of " information of the oxygen concentration about each region " display, " oxygen concentration The project 132 of decision content " display.

Fourth item group IT140 is used as " supply/receiving counter (Loading/Setting Counter) ", including " supplies Answer (Loading) " the project IT141 of confirmation, " total (Total) " confirmation project IT142, " certified products (Passed), The project IT143 of defective work (Failed) " and " accommodate 1 (Auto 1) to accommodate 4 (Auto 4), fix 1 (Fixed 1) To fixing 4 (Fixed4) " the project IT144 of confirmation.

Fifth item group IT150 is as " contact counter (contact counter) ", including " total (Total) " is set The project IT152 of the project IT151, " classification (Kind) " setting that set, the project of " classification % (Kind%) " setting The IT153 and project IT154 of " arm 1 (Arm 1), arm 2 (Arm 2) " confirmation.

Sixth item group IT160 is used as " tester type (Tester Category) ", including " arm 2 (Arm 2) " confirms The project IT162 of project IT161 and " arm 1 (Arm 1) " confirmation.

Then, if the button BT105 of operation button group BT100, as shown in figure 22, pattern FM2 and pattern FM1 is stacked Display.Pattern FM2 is Menu.Include in pattern FM2：The button BT201 of " structure (Build) ", " start pattern The button BT202 of (Start Mode) ", the button BT203 of " counter (C.Slect) ", " counter O reset (C.Clear) " button the BT205, " tower lamp (Tower of button BT204, " temperature monitor (Temp.Monitor) " Light the button of the button BT207 of button BT206, " password (Password) ") ", " safety (Security) " The button of BT208, the button BT209 of " production management (Observer) ", " function setting (Configuration) " BT210, the button BT211 of " controller (Controller) ", " DIO be arranged (DIO Setting) " button BT212, The button BT213 of " I/F monitors (I/F Monitor) ", the button BT214 of " low temperature operates (Cold Run) ", " processing The button BT215 of device ID (Handler ID) " and the button BT216 of " Exit ".

Then, if the button BT214 of operation pattern FM2, the picture of low temperature operating setting is shown on monitor 300 Face, i.e. pattern FM3 shown in Figure 23.Include in pattern FM3：First item group IT310, second item group IT320, Section 3 Mesh group IT330 and fourth item group IT340.

First item group IT310 is used as " small window ", includes the item of " opening time alarm (Warning Open Time) " The project IT312 of mesh IT311 and " humidity alarm (Warning Humidity) ".

Second item group IT320 is used as " dew point monitoring (Dew Point Check) ", including " recovery area (offset) The project IT321 of [Output Area (Offset)] ", the project IT322 of "+setting temperature (+Target Temp.) " with And the project IT323 of " emptier area (Unloader Area) ".

Third item group IT330 is used as " uninstall action (Unloading) ", including " stand-by period (the Wait that door is closed Time for Door Closing) " project IT331 and " checkout time (the Purge Time after after unloading Unloading project IT332) ".

Fourth item group IT340 is used as " LN2 valves confirm (LN2Value Check) ", including " when sensor stabilization waits for Between (Sensor stabilization wait time) " project IT341, " periodically confirm LN2 valves.(halted state) [Check the LN2Value at intervals. (Halt state) " project IT342 and " acknowledgement interval The project IT343 of (interval Time) ".Then, by putting on hook-type symbol to project IT342, and " OK " is pressed The execution of switching valve condition adjudgement can be arranged in button BT351.On the contrary, omitting the feelings for marking hook-type symbol to project IT342 Under condition, then cancel the setting of the execution to switching valve condition adjudgement.It should be noted that in fourth item group BT340, in addition to Outside button BT351, further include the button BT353 of the button BT352 and " applying (Apply) " of " cancelling (Cancel) ".Separately Outside, in project IT341, the time needed for the complete loss of refrigerant that can be arranged in shared path 56.Also, if at this It is atmospheric pressure to be arranged in the time by the pressure that pressure gauge 531 detects, then judges the refrigerant complete loss out of shared path 56.

Hook-type symbol is being put on to project IT342, and after pressing the button BT351 of " OK ", once by project The time inputted in IT343 then shows pattern FM4 shown in Figure 24.Pattern FM4 includes：Project IT410, it project IT420, presses Key BT430 and button BT440.

In project IT410, such as display " due to have passed through specified time (12 hours), will execute the action to LN2 valves Confirmation.If immediately begun to, please select " being immediately performed ".If delaying to confirm, it please select " postponement of execution " ".Then, exist In the case of selecting " being immediately performed ", the button BT430 of " being immediately performed " is pressed.On the other hand, in selection " postponement of execution " In the case of, press the button BT440 of " postponement of execution (15 minutes) ".

The time of countdown is shown in project IT420.

Then, after performing switching valve condition adjudgement, in the first switching valve 54, the switchings of the second switching valve 59A and second The running of valve 59B is deposited in an exceptional case, shows pattern FM5 shown in Figure 25 or Figure 26.Include in pattern FM5：Project IT510, project IT520, project IT530, project IT540, project IT550 and layout L O560.

Project IT510 is " error code (Error Code) ".In fig. 25, " 612 " are shown, in fig. 26, display “613”。

Project IT520 is the number of " unit (Unit) ".In Figure 25 and Figure 26, " 15 " are shown.

Project IT530 is " unit name (Unit Name) ".In Figure 25 and Figure 26, " temperature is adjusted for display (Temp.Controller)”。

In project IT540, as " title ", there is abnormal switching valve in display running.In fig. 25, " LN2 master is shown Valve is abnormal.The fault recognition of LN2 valves is turned off with sensor.After selecting RETRY, START " is asked.In fig. 26, " LN2 is controlled for display Valve processed is abnormal.The fault recognition of LN2 valves is turned off with sensor.After selecting RETRY, START " is asked.

In project IT550, as " details ", show there are the details of abnormal switching valve about running.Scheming In 25, display " if reaffirmed, after selecting RETRY, asks START.If stopping cooling, after selecting PAUSE, ask RESET.(1) there is a possibility that LN2 main valve failures.It please close LN2 supply valves ".In fig. 26, show " if reaffirmed, After selecting RETRY, START is asked.If stopping cooling, after selecting PAUSE, RESET is asked.(1) there are any one LN2 controls The possibility of valve failure.It please close LN2 supply valves ".

Layout L O560 shows the layout (configuration) of the major part of electronic component inspection device 1.In fig. 26, to " LN2 " Mark circular mark.

8th embodiment

In the following, with reference to Figure 27 to the electronic component handling apparatus of the present invention and the present embodiment of electronic component inspection device It illustrates, is illustrated centered on the distinctive points with the above embodiment, then the description thereof will be omitted for identical item.

For present embodiment in addition to the composition difference in inspection portion, remaining is identical as the 7th embodiment.

Test section 53 passes through the pressure gauge of the pressure of the refrigerant (fluid) of discharge path (pumping-out line) 64A by detection The flow that (pressure sensor) 531 (referring to Fig.1 7) or detection pass through the refrigerant (fluid) of discharge path (pumping-out line) 64A Flowmeter (flow sensor) 532 constitute.As shown in figure 27, in the present embodiment, test section 53 is by 532 structure of flowmeter At.By using flowmeter 532, by simply constituting, just can be easily realized by through the refrigerant of discharge path 64A The state of flowing, i.e. refrigerant are flowed with which kind of degree.

More than, it is based on embodiment illustrated, to the electronic component handling apparatus and electronic component inspection device of the present invention It is illustrated, but the present invention is not limited to this, but constitutes electronic component handling apparatus and electronic component inspection device Each section can be replaced as that being formed arbitrarily for identical function can be played.Alternatively, it is also possible to add arbitrary component part.

In addition, the electronic component handling apparatus and electronic component inspection device of the present invention can be by the respective embodiments described above Any two more than composition (feature) be composed.

In addition, in the electronic component handling apparatus of the present invention and electronic component inspection device, it can be by room temperature inspection, height Temperature detector is looked into be checked with the sequence of low temperature inspection, can also be carried out by the sequence of low temperature inspection, high temperature inspection and room temperature inspection It checks, can also be checked by the sequence of high temperature inspection, low temperature inspection and room temperature inspection.

Even if can if in the case where at least two in carrying out room temperature inspection, high temperature inspection and low temperature and checking check Play the effect of the present invention.

In addition, in the respective embodiments described above, be illustrated to mounting portion is carried out cooling composition together with IC devices, Used fluid is refrigerant, and but not limited to this, can also be for example to heat mounting portion together with IC devices It constitutes.At this moment, used fluid can be such as water (hot water), oil.

In addition, being not limited to pressure gauge, flow by the test section of the flowing of the fluid of pumping-out line as detection Meter can also be the temperature sensor of such as temperature of detection fluid.In addition, for example can also be only to carry out detection stream with ON/OFF Body by, stop device.

Claims

1. a kind of electronic component handling apparatus, which is characterized in that have：

Inspection area, can configuration inspection portion, the inspection portion can be carried out with the first of the first temperature check electronic unit the inspection Check that the second of the electronic unit checks after looking into and being checked described first with the second temperature different from first temperature；

First mounting region, can configure the first mounting portion, and first mounting portion can load the institute before first inspection State electronic unit；And

Second mounting region, be located at from the different region in the first mounting region, and the second mounting portion can be configured, described the Two mounting portions can load the electronic unit before second inspection.

2. electronic component handling apparatus according to claim 1, which is characterized in that

The electronic unit is transported to the inspection area from first mounting region, described in the progress of the inspection area It is transported to second mounting region after first inspection, and the inspection area is transported to from second mounting region, It is transported to first mounting region after the inspection area carries out second inspection.

3. electronic component handling apparatus according to claim 2, which is characterized in that

The electronic unit is transported in the first path of the inspection area from first mounting region and is admitted to institute It states the direction in inspection area, be transported to the of the inspection area from second mounting region with the electronic unit The direction being admitted on two paths in the inspection area is opposite direction.

4. electronic component handling apparatus according to claim 1 or 2, which is characterized in that

The electronic component handling apparatus has：

First temperature regulation section can be transported to the road of the inspection area in the electronic unit from first mounting portion The temperature of the electronic unit is adjusted on diameter；And

Second temperature adjustment portion can be transported to the road of the inspection area in the electronic unit from second mounting portion The temperature of the electronic unit is adjusted on diameter.

5. electronic component handling apparatus according to claim 1 or 2, which is characterized in that

The inspection portion carries out after being checked described second with the third temperature different from first temperature and the second temperature Degree checks the third inspection of the electronic unit.

6. electronic component handling apparatus according to claim 5, which is characterized in that

First mounting region can load the electronic unit before being carried out the third inspection.

7. electronic component handling apparatus according to claim 2 or 3, which is characterized in that

The inspection area carry out it is described second check after be transported to it is described first mounting region the electronic unit from First mounting region is transported to the inspection area, and the inspection area carry out with first temperature and institute After the third inspection for stating electronic unit described in the different third temperature check of second temperature, it is transported to second mounting area Domain.

8. electronic component handling apparatus according to claim 7, which is characterized in that

The electronic unit is in the third for being transported to the inspection area from first mounting region under the third inspection It is admitted to the direction in the inspection area on path, is loaded from described first with the electronic unit under first inspection It is the same direction that region, which is transported to the direction being admitted in the inspection area in the first path of the inspection area,.

9. electronic component handling apparatus according to claim 1 or 2, which is characterized in that

First temperature is higher than the second temperature.

10. electronic component handling apparatus according to claim 1 or 2, which is characterized in that

First temperature is higher than room temperature, and the second temperature is room temperature or is less than room temperature.

11. electronic component handling apparatus according to claim 1 or 2, which is characterized in that

First temperature is room temperature.

12. electronic component handling apparatus according to claim 1 or 2, which is characterized in that

First temperature is less than room temperature, and the second temperature is room temperature or is higher than room temperature.

13. electronic component handling apparatus according to claim 1 or 2, which is characterized in that

The electronic component handling apparatus has in the region different from the first mounting region and the second mounting region Third loads region, and third mounting region can configure third mounting portion, and the third mounting portion is for loading the electricity Subassembly.

14. electronic component handling apparatus according to claim 13, which is characterized in that

Being configured at the third mounting portion in third mounting region can be moved to and be configured at first mounting region First mounting portion is configured in second mounting portion in second mounting region.

15. a kind of electronic component inspection device, which is characterized in that have：

Inspection portion can carry out after checking with the first of the first temperature check electronic unit and being checked described first to be different from The second temperature of first temperature checks that the second of the electronic unit checks；

Inspection area is configured with the inspection portion；