TWI621860B - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device that can ensure the safety of workers and improve the work efficiency when performing maintenance and the like.

The electronic component conveying device 100 includes a conveying section 6 capable of conveying electronic components (IC element 90), a cooling section which is cooled by a refrigerant and can be cooled and conveyed electronic components, and a first chamber which is provided as a cooling section A temperature adjustment section 12; and a switching section 860, which can switch the release destination of the refrigerant.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

Electronic component inspection devices for inspecting the electrical characteristics of electronic components such as IC components have been well-known in the past. In this electronic component inspection device, an electronic component transfer device for transferring IC components is incorporated (for example, refer to Patent Documents). 1).

Furthermore, in the electronic component inspection device, a plurality of IC components are placed on a tray and loaded into the device together with the tray, whereby the tray is transferred by the transfer section to the inspection section that performs the inspection. Then, when the inspection is completed, the IC components are placed on a tray, and the tray is transported by the transfer section together with the tray, and discharged to the outside of the device.

In such an electronic component conveying device, a baffle (opening-closing portion) is provided on the outermost cover body. For example, an operator (operator) may open the baffle when pressing the electronic component or performing maintenance. board.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 11-111802

For example, when the cooling device (refrigerant) is filled in the electronic component inspection device, or the internal temperature is relatively high, it is not good for the operator (operator) to open the baffle in this state. Therefore, the operator (operator) must not When the baffle is opened, the work efficiency is not good when, for example, pressing of electronic parts occurs or when performing maintenance.

The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following forms or application examples.

[Application Example 1] The electronic component transfer device of this application example is characterized in that it includes: a transfer section that can transfer electronic components; a cooling section that cools and transfers the above-mentioned electronic components by a refrigerant; and a first room, which The above-mentioned cooling section is arranged; a switching section that can switch the release destination of the refrigerant; and a control section that controls the switching of the switching section.

According to the electronic part transfer device of this application example, the destination of the refrigerant can be switched by the switching unit based on the control of the control unit, so the time taken until the concentration of the refrigerant filled in the first room where the cooling unit is arranged decreases, It is possible to improve work efficiency when, for example, pressing of electronic parts occurs or when performing maintenance.

[Application Example 2] In the electronic component transfer device described in the above application example, it is preferable to include an instruction receiving unit that receives an instruction to switch the release destination of the refrigerant, and if the instruction receiving unit receives the instruction, the control is performed. The unit controls the switching unit to switch the release destination of the refrigerant.

According to this application example, for example, the refrigerant release destination is switched based on an instruction given by the operator (operator) to the instruction receiving unit. Therefore, the switching can be performed more faithfully and reliably.

[Application Example 3] In the electronic component transfer device described in the above application example, it is preferable that the switching unit discharges the refrigerant to the first room when the instruction receiving unit does not receive the instruction, and When the instruction receiving unit receives the instruction, the refrigerant is discharged outside the first room.

According to this application example, the refrigerant can be supplied to the cooling section, and the release destination of the refrigerant can be switched to the outdoor of the first room by the switching section, so the refrigerant can be shortened to the cooling section. The time it takes for the concentration to decrease can improve work efficiency. In addition, since the cooling section does not heat up, the cooling of the electronic components can be continued.

[Application Example 4] In the electronic component transfer device described in the above application example, it is preferable that the refrigerant contains at least one of liquid nitrogen and nitrogen generated from liquid nitrogen.

According to this application example, by using liquid nitrogen that can be easily obtained and nitrogen (cooling gas) that can be generated from liquid nitrogen as a refrigerant, it is possible to easily cool electronic components with a simple structure.

[Application Example 5] In the electronic component transporting device described in the above application example, it is preferable that a second room different from the first room is provided, and the switching unit receives the instruction when the instruction receiving unit receives the instruction, The refrigerant is discharged into the second chamber.

According to this application example, by discharging the refrigerant to the second chamber, the refrigerant can be gradually discharged to the outside of the device, and a large amount of the refrigerant can be prevented from being discharged to the outside of the device collectively.

[Application Example 6] In the electronic component conveying device described in the above application example, it is preferable that the second chamber is disposed above the first chamber in a vertical direction.

According to this application example, the second chamber is arranged to be more vertically upward than the first chamber, thereby suppressing larger air and lighter refrigerant, such as nitrogen, from staying near the floor.

[Application Example 7] In the electronic component transporting device described in the above application example, it is preferable that the electronic component transfer device includes an opening and closing section that opens and closes at least a part of the first room, and the instruction receiving section is disposed near the opening and closing section.

According to this application example, by arranging the instruction receiving section near the opening and closing section, it is possible to operate the instruction receiving section while confirming the condition of the first room, so that it is possible to prevent erroneous operations or improve work efficiency.

[Application Example 8] In the electronic component conveying device described in the above application example, it is preferable that the instruction receiving section is a push button switch.

According to this application example, since the instruction can be performed by pressing a button switch, the instruction can be performed easily and truthfully.

[Application Example 9] In the electronic component transporting device described in the above application example, it is preferable that the notification device is provided, and the notification device reports whether or not the instruction is received to the instruction receiving unit.

According to this application example, the operator (operator) can notice whether or not there is an instruction from the instruction receiving section by notification from the notification device.

[Application Example 10] In the electronic component conveying device described in the above application example, it is preferable that the notification device reports using at least one of light and sound.

According to this application example, the operator (operator) can recognize with high accuracy whether there is an instruction from the instruction receiving section.

[Application Example 11] The electronic component inspection device of this application example is characterized by including: a conveying section that can convey electronic components; a cooling section that is cooled by a refrigerant and can cool the electronic components that are conveyed; and the first room, It is provided with the above-mentioned cooling section; a switching section that can switch the release destination of the refrigerant; a control section that controls the switching of the switching section; and an inspection section that checks the electronic parts.

According to the electronic component inspection device described in this application example, the destination of the refrigerant can be switched by the switching unit based on the control of the control unit, so the time taken until the concentration of the refrigerant filled in the cooling unit decreases can be shortened. For example, work efficiency when pressing electronic parts or performing maintenance.

2‧‧‧Inspection device

2A‧‧‧Inspection device

4‧‧‧ opening and closing department

5‧‧‧Information Department

5A‧‧‧Information Department

6‧‧‧ Transport Department

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧component transfer head

14‧‧‧Component Supply Department

15‧‧‧pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ component transfer head

18‧‧‧Component Recycling Department

19‧‧‧Recycling tray

20‧‧‧component transfer head

21‧‧‧Tray transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

41a‧‧‧side

41b‧‧‧side

41c‧‧‧side

41d‧‧‧side

42‧‧‧Rotation support

43‧‧‧lock member

45a‧‧‧side

45b‧‧‧side

45c‧‧‧side

45d‧‧‧side

46a‧‧‧side

46b‧‧‧side

46c‧‧‧side

46d‧‧‧side

51‧‧‧Monitor

52‧‧‧Identification board

61‧‧‧The first partition

62‧‧‧Second dividing wall

63‧‧‧ 3rd partition

64‧‧‧ 4th partition

65‧‧‧ 5th partition

66‧‧‧Inner partition

70‧‧‧ front cover

70A‧‧‧time front cover

70B‧‧‧time front cover

71‧‧‧side cover

72‧‧‧ side cover

73‧‧‧ rear cover

74‧‧‧ Upper cover

75‧‧‧ 4th bezel

80‧‧‧Control Department

81‧‧‧Drive Control Department

82‧‧‧ Inspection Control Department

83‧‧‧Memory Department

84‧‧‧Refrigerant Control Department

86‧‧‧Flow Path Control Department

87‧‧‧Instruction receiving section

90‧‧‧ IC components as electronic parts

100‧‧‧Electronic parts transfer device

121‧‧‧Liquid nitrogen storage tank

122‧‧‧Heat exchanger

123‧‧‧The first valve

124‧‧‧Second valve

125‧‧‧The first release

126‧‧‧Second Release

200‧‧‧tray

300‧‧‧ monitor

301‧‧‧display

400‧‧‧ signal light

500‧‧‧Speaker

600‧‧‧Mouse Station

700‧‧‧ operation panel

711‧‧‧1st baffle

712‧‧‧Second bezel

713‧‧‧ opening

714‧‧‧handle

721‧‧‧1st bezel

722‧‧‧The second baffle

731‧‧‧1st baffle

732‧‧‧The second baffle

733‧‧‧3rd bezel

737‧‧‧ opening

738‧‧‧ opening

739‧‧‧ opening

740‧‧‧cylinder

740a‧‧‧cylinder rod

800‧‧‧Concentration sensor

860‧‧‧Switching Department

861‧‧‧Front cover

862‧‧‧side cover

863‧‧‧side cover

865‧‧‧ rear cover

866‧‧‧ Upper cover

A1‧‧‧Tray supply area

A2‧‧‧ Supply Area

A3‧‧‧ Inspection area

A4‧‧‧component recycling area

A5‧‧‧Tray removal area

A6‧‧‧Control Area

H‧‧‧ height

H1‧‧‧The first display

H2‧‧‧ 2nd display

M‧‧‧ Setting surface

S100 ~ S106‧‧‧step

X‧‧‧axis

Y‧‧‧axis

Z‧‧‧axis

α _11A ‧‧‧ Arrow

α _11B ‧‧‧ Arrow

α _13X ‧‧‧ Arrow

α _13Y ‧‧‧ Arrow

α ₁₄ ‧‧‧arrow

α ₁₅ ‧‧‧arrow

α _17Y ‧‧‧ Arrow

α ₁₈ ‧‧‧ arrow

α _20X ‧‧‧ Arrow

α _20Y ‧‧‧ Arrow

α ₂₁ ‧‧‧ Arrow

α _22A ‧‧‧ Arrow

α _22B ‧‧‧ Arrow

α ₇₁ ‧‧‧arrow

α ₇₂ ‧‧‧arrow

α ₇₃₁ ‧‧‧arrow

α ₇₃₂ ‧‧‧arrow

α ₇₃₃ ‧‧‧arrow

α ₉₀ ‧‧‧ arrow

Fig. 1 is a schematic perspective view of an electronic component inspection device (first embodiment) of the present invention as viewed from the front side.

FIG. 2 is a top view of the electronic component inspection device shown in FIG. 1. FIG.

FIG. 3 is a block diagram of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 4 is a diagram showing an opening and closing section and a notification section provided in the electronic component inspection apparatus shown in FIG. 1.

Fig. 5 shows the opening and closing section and the notification provided in the electronic component inspection device shown in Fig. 1 Department of Figures.

FIG. 6 is a diagram showing an opening and closing section and a notification section included in the electronic component inspection apparatus shown in FIG. 1.

FIG. 7 is a diagram showing an opening and closing section and a notification section included in the electronic component inspection apparatus shown in FIG. 1.

FIG. 8 is a diagram showing an opening / closing section and an instruction section provided in the electronic component inspection apparatus shown in FIG. 1.

FIG. 9 is a schematic configuration diagram showing switching of a refrigerant release destination of the electronic component inspection device shown in FIG. 1. FIG.

FIG. 10 is a flowchart showing an example of a control operation of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 11 is a diagram showing an opening and closing section and a notification section provided in the electronic component inspection apparatus (second embodiment) of the present invention.

FIG. 12 is a diagram showing an opening and closing section and a notification section included in the electronic component inspection apparatus shown in FIG. 11.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the drawings.

<First Embodiment>

Fig. 1 is a schematic perspective view of an electronic component inspection device (first embodiment) of the present invention as viewed from the front side. FIG. 2 is a top view of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a block diagram of the electronic component inspection apparatus shown in FIG. 1. FIG. 4 to 7 are diagrams showing an opening / closing section and a reporting section provided in the electronic component inspection apparatus shown in FIG. 1. FIG. 8 is a diagram showing an opening / closing section and an instruction section provided in the electronic component inspection apparatus shown in FIG. 1. FIG. 9 is a schematic configuration diagram showing switching of a refrigerant release destination of the electronic component inspection device shown in FIG. 1. FIG. FIG. 10 is a flowchart showing an example of a control operation of the electronic component inspection apparatus shown in FIG. 1. FIG.

Hereinafter, a first embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 10. In addition, for convenience of explanation, as shown in FIGS. 1, 2, and 4 to 8 (the same applies to FIGS. 11 and 12 of the second embodiment), three axes orthogonal to each other are set to X. Axis, Y axis and Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is referred to as "X direction", a direction parallel to the Y axis is referred to as "Y direction", and a direction parallel to the Z axis is referred to as "Z direction". The direction of the arrow in each direction is called "positive", and the opposite direction is called "negative". In addition, the so-called "horizontal" in the description of the present case is not limited to a complete level, and includes a state in which it is inclined slightly (for example, less than 5 °) relative to the level as long as it does not hinder the transportation of electronic parts.

The inspection device 2 (electronic component inspection device) shown in FIG. 1 and FIG. 2 is an electronic component transporting device 100 built in, for example, an electronic component such as a BGA (Ball Grid Array) package, which is an IC component, And it is a device that inspects and tests its electrical characteristics (hereinafter referred to as "inspection" only) during its transportation.

The inspection device 2 includes an electronic parts transfer device 100, an inspection unit 16 that performs inspection of electronic parts, and a control unit 80 that controls the operations. The control unit 80 includes a refrigerant control unit 84 (see FIG. 3) that controls the supply of the refrigerant used in the low-temperature inspection.

The electronic component conveying device 100 includes a conveying section 6 capable of conveying electronic parts, a monitor 300 as a display section capable of displaying the opening / closing section 4 capable of being opened and closed, and an operating state of the conveying section 6, and for notifying whether the opening and closing section 4 can be opened and closed. The notification section 5 of the notification device; the temperature adjustment section 12 which is a cooling section of the electronic parts conveyed by the refrigerant cooling; and an instruction receiving section 87 that inputs a refrigerant flow path switching instruction to the refrigerant control section 84.

In the following, for convenience of explanation, a case where an IC component is used as an electronic component will be described as a representative, and it will be referred to as an "IC element 90". The IC element 90 is placed on a mounting member that is a tray 200.

The inspection device 2 is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as a "supply area") A2, an inspection area A3, a component recovery area A4 (hereinafter simply referred to as a "recycling area"), a tray removal area A5, And a control area A6 provided on the upper side in the vertical direction of the recovery area A4 (the positive side in the Z direction in FIG. 1). In addition, the IC device 90 inspects the inspection area A3 in the middle from the tray supply area A1 to the tray removal area A5 in the direction of the arrow α ₉₀ through the above-mentioned areas in order. As described above, the inspection device 2 includes the following components: an electronic component transfer device 100 (processor) that transports IC components 90 in each area; and an inspection unit 16 that performs inspection in the inspection area A3. In addition, the inspection device 2 includes a signal lamp 400 and an operation panel 700 as an example of a notification device.

In the inspection device 2, the side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side (negative side in the Y direction) in FIG. 2 becomes the front side, and the side where the inspection area A3 is arranged, that is, the figure The upper side (positive side in the Y direction) of 2 is used as the back side.

The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC components 90 are arranged in an unchecked state. A plurality of trays 200 may be stacked on the tray supply area A1.

The supply area A2 is an area where a plurality of IC components 90 on the tray 200 carried from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, tray conveying mechanisms 11A and 11B that convey the trays 200 one by one in the horizontal direction are provided so as to span the tray supply area A1 and the supply area A2. The tray conveying mechanism 11A is a moving part that can move the tray 200 together with the IC components 90 placed on the tray 200 to the positive side in the Y direction, that is, to the arrow α _11A in FIG. 2. Thereby, the IC element 90 can be stably fed into the supply area A2. The tray conveyance mechanism 11B is a moving part that can move the empty tray 200 toward the negative side in the Y direction, that is, the arrow α _11B in FIG. 2. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

In the supply area A2, a temperature adjustment section (a soaking plate (English description: soap plate, Chinese description (one example): soaking plate)) 12, a component transfer head 13, a tray transfer mechanism 15, and a density sensor 800 are provided. .

The temperature adjustment unit 12 is configured to mount a plurality of IC components 90, and the IC components 90 may be integrated. The person who heats or cools in the ground is called a "soaking plate". With this soaking plate, the IC element 90 before the inspection by the inspection unit 16 can be heated or cooled in advance, and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). The temperature adjustment section 12 of this embodiment uses a refrigerant containing at least one of liquid nitrogen and nitrogen generated from the liquid nitrogen, and has a function as a cooling section of the IC device 90 that can be cooled and transported. In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged in the Y direction and two are fixed. Then, the IC components 90 on the tray 200 carried in from the tray supply area A2 by the tray transfer mechanism 11A are transferred to any one of the temperature adjustment sections 12.

The component transfer head 13 is supported in the supply area A2 so as to be movable in the X direction and the Y direction, and further can be moved in the Z direction. With this, the component transfer head 13 can be responsible for transferring the IC components 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC components 90 between the temperature adjustment section 12 and the component supply section 14 described later. Of transportation. In FIG. 2, the movement in the X direction of the element transfer head 13 is displayed by an arrow α _13X , and the movement in the Y direction of the element transfer head 13 is displayed by an arrow α _13Y .

The tray transfer mechanism 15 is a mechanism that transfers all the empty trays 200 with the IC components 90 removed in the supply area A2 toward the positive side in the X direction, that is, in the direction of the arrow α ₁₅ . After this transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The concentration sensor 800 detects a concentration of nitrogen used as a refrigerant in the supply area A2. The density sensor 800 is electrically connected to the control unit 80 and sends the density information detected by the density sensor 800 to the control unit 80.

The inspection area A3 is an area where the IC element 90 is inspected. An inspection unit 16 and a component transfer head 17 are provided in the inspection area A3. A component supply unit 14 is provided to move across the supply area A2 and the inspection area A3, and a component recovery unit 18 is provided to move across the inspection area A3 and the collection area A4.

The component supply section 14 is configured to mount a component whose temperature is adjusted by the temperature adjustment section 12. The IC component 90 can be transported to a mounting section near the inspection section 16, and is also referred to as a “supply shuttle plate” or simply a “supply shuttle”.

Further, the component supply unit 14 between the supply lines so as to be in the region A2 and A3 examination region along the X direction, i.e., [alpha] ₁₄ direction of reciprocating manner is supported by the arrow. In the configuration shown in FIG. 2, two component supply sections 14 are arranged in the Y direction, and IC components 90 on the temperature adjustment section 12 are transferred to any one of the component supply sections 14. The component supply section 14 is the same as the temperature adjustment section 12 and is configured to heat or cool the IC device 90 placed on the component supply section 14. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment section 12 can be transported to the vicinity of the inspection section 16 of the inspection area A3 while maintaining its temperature adjustment state.

The component transfer head 17 is an operation unit that holds the IC component 90 that maintains the above-mentioned temperature adjustment state, and transfers the IC component 90 in the inspection area A3. The component transfer head 17 is supported so as to be able to move back and forth in the Y direction and the Z direction within the inspection area A3, and becomes a part of a mechanism called an "indicator arm". With this, the component transfer head 17 can transfer the IC components 90 on the component supply section 14 carried in from the supply area A2 to the inspection section 16 and place them. In FIG. 2, the Y-direction reciprocating movement of the component transfer head 17 is indicated by an arrow α _17Y . The component transfer head 17 is supported so as to be capable of reciprocating in the Y direction, but is not limited thereto, and may be supported so as to be capable of reciprocating in the X direction.

The component transfer head 17 is also configured to heat or cool the IC device 90 to be held, similarly to the temperature adjustment unit 12. Thereby, the temperature adjustment state of the IC component 90 can be continuously maintained from the component supply portion 14 to the inspection portion 16.

The inspection unit 16 is a mounting unit configured to place an IC component 90 that is an electronic component, and to inspect and test (inspect) the electrical characteristics of the IC element 90. A plurality of probe pins electrically connected to the terminal portion of the IC element 90 are provided in the inspection portion 16. The terminal portion of the IC element 90 is electrically connected to the probe pin. That is, the inspection of the IC element 90 can be performed by contact. The inspection of the IC device 90 is performed based on a program stored in the memory section 83 (see FIG. 3) of the control section 80. In addition, the inspection unit 16 can also heat or cool the IC device in the same manner as the temperature adjustment unit 12 90, and the IC element 90 is adjusted to a temperature suitable for inspection.

The component recovery section 18 is configured to place the IC component 90 that has finished the inspection in the inspection section 16 and transport the IC component 90 to the recovery section A4. This is called a "recycling shuttle" or simply "recycling" shuttle".

The component recovery unit 18 is supported so as to be able to move back and forth in the X direction between the inspection area A3 and the recovery area A4 in the direction of the arrow α ₁₈ . In the configuration shown in FIG. 2, the component recovery section 18 is the same as the component supply section 14, and two components are arranged in the Y direction. The IC components 90 on the inspection section 16 are transported to any one of the component recovery sections 18. . This transfer is performed by the component transfer head 17.

The collection area A4 is an area of the plurality of IC devices 90 after the collection inspection is completed. In the collection area A4, a collection tray 19, a component transfer head 20, and a tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

The collection tray 19 is a mounting portion on which the IC components 90 inspected by the inspection portion 16 are placed, and is fixed so as not to move within the collection area A4. Thereby, even if it is the recovery area A4 in which various movable parts such as a large number of component transfer heads 20 are arranged, the IC components 90 that have been inspected can be stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

Three empty trays 200 are also arranged along the X direction. The empty tray 200 also serves as a placement section on which the IC components 90 inspected by the inspection section 16 are placed. Then, the IC component 90 on the component collection part 18 moved to the collection area A4 is conveyed and placed in any one of the collection tray 19 and the empty tray 200. Thereby, the IC device 90 is classified according to various inspection results, and is collected.

The component transfer head 20 is supported so as to be able to move in the X direction and the Y direction and further in the Z direction within the recovery area A4. Accordingly, the component transfer head 20 can transfer the IC components 90 from the component collection unit 18 to the collection tray 19 or the empty tray 200. In FIG. 2, the movement in the X direction of the element transfer head 20 is displayed by an arrow α _20X , and the movement in the Y direction of the element transfer head 20 is displayed by an arrow α _20Y .

The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the recovery area A4 in the X direction, that is, in the direction of the arrow α ₂₁ . Then, after the transfer, the empty tray 200 is disposed at the position where the IC components 90 are collected, that is, it can be any of the three empty trays 200 described above.

The tray removing area A5 collects and removes the material removal section of the tray 200 in which the plurality of IC components 90 in the inspection completion state are arranged. In the tray removal area A5, a plurality of trays 200 may be overlapped.

In addition, tray transfer mechanisms 22A and 22B are provided so as to straddle the recovery area A4 and the tray removal area A5 one by one in the Y direction. The tray conveying mechanism 22A is a moving part that can move the tray 200 back and forth in the Y direction, that is, in the direction of the arrow α _22A . Thereby, the IC component 90 having been inspected can be transferred from the recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B can move the empty tray 200 for recovering the IC components 90 toward the positive side in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4.

In the inspection device 2, the tray supply area A1 and the supply area A2 are divided by a first partition wall 61, the supply area A2 and the inspection area A3 are divided by a second partition wall 62, and the inspection area A3 and the recovery area A4 are divided by The third partition wall 63 is divided, and the space between the recovery area A4 and the tray removal area A5 is divided by the fourth partition wall 64. The supply area A2 and the recovery area A4 are also divided by a fifth partition wall 65.

The inspection device 2 covers the outermost layer with a cover, and the cover includes, for example, a front cover 70, sub-front covers 70A, 70B, a side cover 71, a side cover 72, a rear cover 73, and an upper cover 74. The first cover is configured by assembling the front cover 70, the side cover 71, the side cover 72, the rear cover 73, and the upper cover 74, and the opening and closing portion 4 is formed in the first housing. In addition, a transport section 6, an inspection section 16, and the like are arranged inside the first case. In the following, a room constituting the supply area A2 and a room constituting the inspection area A3 inside the first casing are referred to as a first room, and a room constituting the recovery area A4 is referred to as a third room. Bright.

Further, on the upper side in the vertical direction of the upper cover 74 (the positive side in the Z direction in FIG. 1), an outermost layer surrounded by a front cover 861, a side cover 862, a side cover 863, a rear cover 865, and an upper cover 866 is disposed as the first The second casing of the two-channel flow control room 86 (control area A6). A piping member (not shown) and the like are arranged in the second casing. In addition, between the recovery area A4 (the first case) and the control area A6 (the second case), it is divided by the upper cover 74.

As shown in FIG. 2, a first baffle 711 and a second baffle 712 are provided on the side cover 71. By opening the first baffle 711 or the second baffle 712, for example, maintenance in the first room or release of the pressure of the IC element 90 can be performed. The first shutter 711 and the second shutter 712 are configured to be opened and closed in the direction of the arrow α ₇₁ in FIGS. 2 and 5.

Similarly, the side cover 72 is provided with a first baffle 721 and a second baffle 722, thereby enabling work in the third room, for example. The first shutter 721 and the second shutter 722 are configured to be opened and closed in the direction of the arrow α ₇₂ in FIG. 2.

Furthermore, a first baffle 731, a second baffle 732, and a third baffle 733 are also provided on the rear cover 73. By opening the first baffle 731, operations in the supply area A2 (the first room) in which, for example, the temperature adjustment section 12, the component transfer head 13, the tray transfer mechanism 15, and the like are arranged can be performed. In addition, by opening the third shutter 733, operations in the recovery area A4 in which, for example, the component recovery unit 18, the recovery tray 19, and the component transfer head 20 are arranged can be performed. A fourth baffle 75 is provided on the inner partition wall 66 of the partition inspection section 16. In addition, by opening the second baffle 732 and the fourth baffle 75, for example, work in the inspection area A3 can be performed.

The first shutter 731 is opened and closed in the direction of arrow α ₇₃₁ in FIG. 2, the second shutter 732 is opened and closed in the direction of arrow α ₇₃₂ in FIG. 2, and the third shutter 733 is opened and closed in arrow α ₇₃₃ in FIG. 2. The fourth shutter 75 is opened and closed in the direction of arrow α ₇₅ in FIG. 2. Then, in the state of closing each baffle, the airtightness or heat insulation of each corresponding room is ensured.

The first baffle 711, the second baffle 712, the first baffle 721, the second baffle 722, the first baffle 731, the second baffle 732, the third baffle 733, and the fourth baffle 75 Openable and closable The opening-and-closing part 4 is comprised.

As shown in FIG. 3, the control unit 80 includes a drive control unit 81, an inspection control unit 82, a storage unit 83, and a refrigerant control unit 84.

The drive control unit 81 controls, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray transfer mechanism 15, the inspection unit 16, and the component transfer head 17 shown in FIG. The operation of each of the component recovery unit 18, the component transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B.

The inspection control unit 82 performs inspections and the like of the electrical characteristics of the IC element 90 arranged in the inspection unit 16 based on a program stored in the memory unit 83.

The memory unit 83 is composed of volatile memory such as RAM, nonvolatile memory such as ROM, EPROM (Erasable Programmable Read Only Memory), and EEPROM (Electrically Erasable Programmable Read-Only Memory: Electrical erasable and programmable read-only memory), flash memory, non-volatile memory (such as erasable, rewriteable), non-volatile memory, and various semiconductor memory (IC memory).

The refrigerant control unit 84 included in the control unit 80 instructs the refrigerant (including liquid nitrogen and nitrogen generated from liquid nitrogen, etc.) to be switched to, for example, the temperature adjustment unit 12 as a cooling unit when the inspection unit 16 performs a low-temperature inspection. The flow path controls the release destination of the refrigerant. When the refrigerant control unit 84 determines that it is necessary to switch the release destination of the refrigerant, for example, the refrigerant control unit 84 may receive a "switch instruction" input to the instruction receiving unit 87, and perform an instruction to switch the release destination of the refrigerant in the switch unit 860.

The control unit 80 is electrically connected to the monitor 300 as a display unit. The monitor 300 is configured to display the operating state of the conveying section 6 or the operating state of other parts of the inspection device 2. As shown in FIG. 2, the transfer unit 6 includes the following components: a tray transfer mechanism 11A, 11B, a component transfer head 13, a component supply unit 14, a tray transfer mechanism 15, The component transfer head 17, the component recovery part 18, the component transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B.

The operator (operator) can set or confirm the operating conditions and the like of the inspection device 2 through the monitor 300. The monitor 300 includes a display screen 301 made of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the inspection device 2. As shown in FIG. 1, a mouse stage 600 is provided on the right side of the tray removal area A5 in the figure, and the mouse stage 600 houses a mouse used when operating a screen displayed on the monitor 300.

An operation panel 700 is disposed on the lower right side of FIG. 1 with respect to the monitor 300. The operation panel 700 is provided separately from the monitor 300, and commands a desired operation to the inspection device 2.

The control unit 80 is electrically connected to the signal lamp 400 as a notification device. The signal lamp 400 can report the operating state of the inspection device 2 and the like by a combination of the colors of light emission. The signal lamp 400 is arranged above the inspection device 2. In addition, a speaker 500 is built in the inspection device 2, and the operation state of the inspection device 2 and the like may be notified through the speaker 500.

Next, the first shutter 711 and the second shutter 712 on the side cover 71 side will be described in detail. Since the first baffle 711 and the second baffle 712 have the same configuration, the first baffle 711 will be representatively described below.

As shown in FIGS. 4 and 5, the first shutter 711 is a shutter that can be opened and closed with respect to the opening portion 713 formed in the side cover 71. Thereby, the opening-closing part 4 can cover one half of the opening part 713 (the left part in the figure) (refer FIG. 4) in a closed state, and can open the opening part 713 (refer FIG. 5) in an open state.

The first baffle 711 is a plate member having a substantially rectangular shape in a plan view. In addition, the size of the first baffle 711 is also close to the size of the inspection device 2. For example, it is preferable that any one of the length in the longitudinal direction (the length in the Z direction) and the length in the lateral direction (the length in the Y direction) is 400 mm or more 600mm or less, more preferably 450mm or more and 550mm or less.

In addition, the first baffle plate 711 having a quadrangular shape is connected to the side cover 71 by the two sides 41a, 41b, 41c, and 41d of the four sides (edge portions) 41a, 41b, 41c, and 41d extending in the vertical direction by the two rotation support portions 42. The two rotation support portions 42 are spaced apart in the Z direction. Each of the rotation support portions 42 is constituted by a hinge that rotatably supports the first shutter 711. Thereby, the first baffle 711 is supported in a manner that it can be rotated in the vertical direction, that is, the first baffle 711 can be an axis parallel to the Z direction as a rotation axis, and can be rotated in the direction of arrow α ₇₁ in FIGS. 2 and 5. In addition, the first shutter 711 can be opened and closed smoothly.

Further, a handle 714 made of a protrusion is provided on each of the first baffle 711 and the second baffle 712. Accordingly, the first shutter 711 and the second shutter 712 can be easily opened and closed.

As shown in FIGS. 6 and 7, the cylinder 740 is fixed near the upper portion of the opening portion 713 of the side cover 71 (for example, 0 mm or more and 50 mm or less). In the cylinder 740, the cylinder rod 740a is freely accessible. In addition, when the cylinder rod 740a protrudes downward (negative side in the Z direction), it can be engaged with the lock member 43 provided on the surface inside (the positive side in the X direction) of the first baffle 711 in FIG. 6. In this way, the cylinder 740 is electrically connected to the control unit 80, and its operation is controlled by the control unit 80.

In the present embodiment, the cylinder 740 can maintain not only the closed state of the first baffle 711 but also the closed state of the second baffle 712. That is, in the cylinder 740, the lock member 43 of the first baffle 711 and the lock member 43 of the second baffle 712 can be integrally engaged with the cylinder rod 740a. Therefore, the closed states of the first shutter 711 and the second shutter 712 can be maintained collectively.

When the cylinder rod 740a is retracted upward, the engagement with the lock member 43 is released, and the first shutter 711 can be opened (see FIG. 7).

As described above, the inspection device 2 includes the cylinder 740 and the lock member 43 as a switch to maintain the closed state of the first flapper 711 and release the closed state. This can prevent the operator (operator) of the inspection device 2 from accidentally opening the first shutter 711 during the transportation of the IC element 90, for example.

In addition, on the surface side of the first baffle 711, that is, the surface on the front side of the paper (negative side in the X direction) in FIG. The notification unit 5 includes a monitor 51 configured by a circular LCD (Liquid Crystal Display). The monitor 51 is electrically connected to the control unit 80 and is controlled by the control unit 80. Act.

The notification unit 5 is provided on the first baffle 711, the first baffle 721, the first baffle 731, the second baffle 732, and the third baffle 733. Hereinafter, the notification unit 5 is provided on the first baffle 711. The notification unit 5 will be described as a representative.

As shown in FIGS. 5 and 7, in a state where the first baffle 711 and the second baffle 712 can be opened, the text “OK” is displayed on the monitor 51. On the other hand, as shown in FIG. 4, in a state where the first shutter 711 and the second shutter 712 are restricted from being opened, the word “NO” is displayed on the monitor 51.

On the monitor 51, it is preferable that the color of the text when "OK" is displayed is different from the color of the text when "NO" is displayed. In the monitor 51, it is preferable that the color of the background of the text when "OK" is displayed is different from the color of the background of the text when "NO" is displayed. With such a configuration, it is possible to make it easy for the operator (operator) to recognize.

In the inspection device 2, the monitor 51 is provided on the opening and closing section 4, that is, the first shutter 711. This allows the operator (operator) to identify the operator (operator) with high accuracy when opening and closing the first flap 711 and the second flap 712.

As shown in FIG. 4, the monitor 51 is preferably disposed at a height H of 600 mm or more and 2000 mm or less from the installation surface on which the inspection device 2 is installed, and more preferably disposed at a height of 900 mm or more and 1700 mm or less. H's position. Thereby, regardless of the height of the operator (operator), the monitor 51 can be easily observed, and the operator (operator) can recognize the monitor 51 with high accuracy.

Next, referring to FIG. 8, instructions are received from the second flap 732, the third flap 733, and the fourth flap 75, and between the second flap 732 and the third flap 733 provided on the rear cover 73 side. Department 87. In addition, a first baffle 731 is also provided on the side of the rear cover 73. Since it has the same structure as the third baffle 733, the description here is omitted.

As shown in FIG. 8, the second baffle 732 provided on the side of the back cover 73 is a baffle that can be opened and closed with respect to the opening portion 738 formed in the back cover 73. A plate member having a substantially rectangular shape in a plan view The second baffle 732 is configured by two sides 45a, 45b, 45c, and 45d of four sides (edge portions) 45a, 45b, 45c, and 45d, which are connected to the rear cover 73 by two rotation support portions 42. The two rotation support portions 42 are spaced apart in the Z direction. Further, an opening portion 739 is provided in the second baffle 732 at a position facing the fourth baffle 75 to be described later to open and close the fourth baffle 75.

Similarly, the third baffle 733 provided on the side of the back cover 73 is a baffle that can be opened and closed with respect to the opening portion 737 formed in the back cover 73. The third baffle 733 composed of a plate member having a substantially rectangular shape in a plan view is a side 45a extending in the vertical direction of the four sides (edge portions) 45a, 45b, 45c, 45d and the rear by two rotation support portions 42. The cover 73 is connected. The two rotation support portions 42 are spaced apart in the Z direction.

Each of the rotation support portions 42 is configured by a hinge that rotatably supports the second shutter 732 and the third shutter 733. Thereby, the second baffle plate 732 and the third baffle plate 733 can be rotatably supported, that is, the second baffle plate 732 and the third baffle plate 733 can be rotated with the axis parallel to the vertical direction (Z direction) as the rotation axis, The second baffle 732 can be turned in the direction of the arrow α ₇₃₂ , and the third baffle 733 can be turned in the direction of the arrow α ₇₃₃ .

The fourth baffle 75 is a baffle that can be opened and closed with respect to an opening (not shown) of the inner partition wall 66 (see FIG. 2) formed on the rear cover 73 side. In a plan view, the fourth baffle plate 75, which is formed by a substantially rectangular plate member smaller than the second baffle plate 732, is composed of two rotation support portions 42 and 4 sides (edge portions) 46a, 46b, 46c, and 46d. A side 46 a extending in the vertical direction is connected to the inner partition wall 66. The two rotation support portions 42 are spaced apart from each other in the Z direction, and rotatably support the fourth baffle plate 75, so that the fourth baffle plate 75 can use the axis parallel to the vertical direction (Z direction) as the rotation axis toward the arrow. α ₇₅ (see Figure 2). The fourth baffle 75 is disposed at a position that is rotatable within the opening portion 739 provided in the second baffle 732.

In addition, the second baffle 732, the third baffle 733, and the fourth baffle 75 are provided with a handle 714 made of a protrusion, respectively. Accordingly, the second shutter 732, the third shutter 733, and the fourth shutter 75 can be easily opened and closed.

As shown in FIG. 8, it is determined that the second baffle 732 and the third baffle are on the side of the rear cover 73. Between 733, for example, when the operator (operator) judges that it is necessary to switch the release destination of the refrigerant, a button switch that inputs an instruction to switch is the instruction receiving unit 87. The second shutter 732 and the third shutter 733 constitute an opening and closing section 4 that opens and closes at least a part of the supply area A2 and the inspection area A3 (the first chamber). As described above, the instruction receiving section 87 is disposed near the opening and closing section 4 that opens and closes at least a part of the supply area A2 and the inspection area A3 (the first room). The instruction receiving unit 87 is electrically connected to the refrigerant control unit 84 and transmits the switching instruction received by the instruction receiving unit 87 to the refrigerant control unit 84.

In this way, by providing the instruction receiving section 87 near the opening and closing section 4, the operator (operator) can confirm the state in the supply area A2 (room 1) or the inspection area A3 (room 1) while facing the instructions. Since the receiving unit 87 operates (instructs), it is possible to prevent erroneous operations and improve work efficiency. In addition, the instruction receiving unit 87 is a push button switch, so that an instruction from an operator (operator) can be easily and faithfully performed.

As described above, the inspection apparatus 2 is a person performing a high-temperature inspection or a low-temperature inspection. In particular, in the case of performing a low-temperature inspection, the temperature adjustment unit 12 or the IC element 90 and the like are cooled to condense or freeze moisture in the atmosphere. If such dew condensation or icing occurs, there is a possibility that, for example, an abnormality occurs in the operation of the component transfer head 17 or the like, or the IC component 90 may not be inspected correctly. In order to cope with this situation, in the inspection device 2, especially in the supply area A2 (the first room) or the inspection area A3 (the first room), in order to reduce the moisture content inside each of the areas A2 and A3 (become dry) State), the nitrogen used as the refrigerant is released as dry air.

Therefore, during cooling of the temperature adjustment unit 12 and the like, particularly in the supply area A2 (the first chamber) or the inspection area A3 (the first chamber), the concentration of nitrogen (cooling gas) becomes high. Therefore, for example, when the electronic parts are pressed or maintained, it is not good for the operator (operator) to open and close the opening / closing unit 4 in this state, and it is necessary to stop the supply of the refrigerant and wait until the concentration of nitrogen decreases. When the supply of the refrigerant is stopped, the temperature of the temperature adjustment unit 12 and the like rises.

Therefore, in this embodiment, it becomes a structure effective for preventing the above-mentioned undesirable phenomenon. to make. Hereinafter, the configuration will be described with reference to FIG. 9. However, a room including the supply area A2 and the inspection area A3 is referred to as a first room, and a room containing the flow path control room 86 (control area A6) is referred to as a second room. Instructions. FIG. 9 is a schematic layout diagram showing the switching destination of the refrigerant release of the electronic components (the inspection device 2 and the electronic component transfer device 100). In the following, a case where the inspection device 2 is temporarily stopped during the low-temperature inspection, and the third baffle 733, the second baffle 732, and the fourth baffle 75 are opened to perform maintenance in the first room will be described. In addition, as shown in FIG. 4, the operation of the inspection device 2 indicates that the opening and closing section 4 of the third flapper 733, the second flapper 732, and the fourth flapper 75 cannot be opened and closed in the notification section 5. "NO" text.

As shown in FIG. 9, the configuration of this embodiment includes an instruction receiving unit 87 that receives an instruction to switch the release destination of the refrigerant, and a refrigerant control unit 84 (control unit 80) that receives an instruction from the instruction receiving unit 87. In this case, indicate the release destination of the refrigerant. Furthermore, the configuration of this embodiment includes a liquid nitrogen storage tank 121 that constitutes a refrigerant flow path; a heat exchanger 122; a temperature adjustment unit 12 that cools and transports the IC element 90; and a switching unit 860 that is based on a refrigerant control unit The instruction of 84 switches the release destination of the refrigerant.

The refrigerant here includes at least one of liquid nitrogen and nitrogen (cooling gas) generated from liquid nitrogen. By using such liquid nitrogen that can be easily obtained as a refrigerant and nitrogen (cooling gas) generated from liquid nitrogen, cooling can be easily performed with a simple structure.

First, during the low-temperature inspection, a portion of the liquid nitrogen supplied from the liquid nitrogen storage tank 121 is cooled and gasified by the heat exchanger 122 and supplied to the temperature adjustment unit 12. The cooling gas (nitrogen) after cooling the temperature adjustment section 12 is used to make the supply area A2 or the inspection area A3 as described above when the instruction receiving section 87 has not received the instruction, that is, in a state of performing a normal low-temperature inspection. The dry air in which the amount of water in the first room is reduced (made dry) is discharged into the first room from the first discharge port 125 provided in the first room through the first valve 123 constituting the switching section 860. At this time, the second valve 124 constituting the switching section 860 is closed.

Next, if it is necessary to open the third shutter 733, or the second shutter 732 and the fourth shutter 75, The maintenance of the first room will be described. In this case, the operator (operator) instructs to switch the release destination of the cooling gas (nitrogen) as the refrigerant of the cooling temperature adjustment unit 12 by pressing the button switch, which is the instruction receiving unit 87. When the instruction receiving unit 87 receives the switching instruction, the first valve 123 of the switching unit 860 is closed and the second valve 124 is opened according to the instruction from the refrigerant control unit 84. As a result, the release destination of the cooling gas (nitrogen) supplied to the temperature adjustment unit 12 is switched from the first discharge outlet 125 in the first room to the second one provided in the outdoor room (a room different from the first room). The second discharge port 126 of the chamber.

In this way, when the instruction receiving unit 87 receives the instruction for switching, the release destination of the cooling gas (nitrogen) is switched from the first room to the second room, but the supply is continued in the temperature adjustment unit 12. Therefore, while maintaining the cooling of the IC element 90 by the temperature adjustment unit 12 and stopping the release of the cooling gas (nitrogen) into the first chamber, the time required to reduce the concentration of the cooling gas (nitrogen) in the first chamber can be shortened. time. In addition, in the case where the abnormality is repaired and the low-temperature inspection is started, it is not necessary to perform a cooling operation of lowering the temperature of the temperature adjustment section 12 from the normal temperature to the low temperature again, which can shorten the time related to the cooling of the IC device 90. This makes it possible to improve work efficiency when, for example, the IC element 90 is pressed or maintenance is performed.

The flow path control room 86 (control area A6) in the second room surrounded by the second casing by the front cover 861, the side cover 862, the side cover 863, the rear cover 865, and the upper cover 866, By releasing the cooling gas (nitrogen), the cooling gas (nitrogen) can be gradually discharged to the outside of the device, and a large amount of cooling gas (nitrogen) can be prevented from being discharged to the outside of the device in an integrated manner.

The second room (flow control room 86 (control area A6)), which is the release destination of the cooling gas (nitrogen) at this time, is disposed on the upper side in the vertical direction of the component recovery area A4 (the positive side in the Z direction in FIG. 1). ), That is, it is more upward in the vertical direction than the first chamber, so it is possible to suppress the larger and lighter cooling gas (nitrogen) from rising upward (in the vertical direction) and staying near the floor.

Hereinafter, the control operation of the control unit 80 will be described based on the flowchart shown in FIG. 10. In the following, a room including a supply area A2 and an inspection area A3 is referred to as a first room, and The room containing the flow path control room 86 (control area A6) will be described as the second room. In the following, a case where the inspection device 2 is temporarily stopped during the low-temperature inspection, and the third shutter 733, the second shutter 732, and the fourth shutter 75 are opened to perform maintenance in the first room will be described. In addition, as shown in FIG. 4, the operation of the inspection device 2 displays a “NO” character on the notification unit 5.

First, in step S100, the operator (operator) operates the operation panel 700 to stop the operation of the inspection device 2, press the button switch of the instruction receiving section 87, and press the release of the engagement of the cylinder 740 and the lock member 43 Button (not shown). As a result, the release destination of the cooling gas (nitrogen) is switched from the first chamber to the second chamber. In addition, the cooling gas (nitrogen) is continuously supplied to the temperature adjustment unit 12 to maintain the cooling state of the temperature adjustment unit 12.

When the button switch of the instruction receiving unit 87 is pressed, it is preferable that the control unit 80 reports whether there is an instruction from the instruction receiving unit 87 using, for example, light or sound. Such notification can be performed by a notification device such as a monitor 51 (notification unit 5) or a signal lamp 400. By performing such notification, the operator (operator) can surely pay attention and recognize the presence or absence of the instruction to the instruction receiving unit 87, that is, whether or not the instruction to switch the release destination has been performed.

Then, in step S101, the concentration N of the cooling gas in the supply region A2 where the release of the cooling gas (nitrogen) is stopped is detected by the concentration sensor 800. Then, in step S102, the time required until the concentration N becomes smaller than the specific value N ₀ memorized in the memory section 83 in advance, that is, the time required to open the first shutter 711 and the second shutter 712 is calculated. Information remaining time. This calculation is carried out based on a calibration curve (not shown) obtained by experimentally measuring the concentration N as the time elapses.

Next, in step S103, the time calculated in step S102 is displayed on the monitor 51 (refer to FIG. 6). In addition, in FIG. 6, the number "15" is displayed on the monitor 51, and the display residual time is 15 seconds. The remaining time displayed on the monitor 51 is counted down with time, and the number displayed gradually decreases.

In this way, the monitor 51 displays (reports) the remaining time until the first shutter 711 and the second shutter 712 can be opened. With this, for example, the operator (operator) can Hold until the first shutter 711 and the second shutter 712 can be opened. Therefore, the operator (operator) can perform other operations until the operation of opening the first baffle 711 and the second baffle 712 is performed, and the work efficiency can be improved.

Then, in step S104, the concentration N of the cooling gas detected by the concentration sensor 800 is compared with a specific value N ₀ stored in the memory section 83. The specific value N ₀ is a value indicating the concentration of the cooling gas, and is a value that is sufficiently low in safety for the operator (operator).

In step S105, when the case is determined to lower the concentration of N N ₀ than a certain value, the cylinder 740 is released and the engagement of the latch member 43 (see FIG. 7). Then, in step S106, it is notified that the first shutter 711 and the second shutter 712 can be opened.

In this embodiment, as shown in FIG. 7, the text “OK” is displayed on the monitor 51. This allows the operator (operator) to recognize that the first shutter 711 and the second shutter 712 can be opened. Therefore, although the decrease in the concentration N of the cooling gas is insufficient, it is possible to prevent the operator (operator) from setting the first flap 711 and the second flap 712 to the open state. Therefore, the safety of the operator (operator) can be ensured.

When the operator (operator) opens the first baffle plate 711 and the second baffle plate 712 in the closed state where the cylinder 740 and the lock member 43 are engaged, the cylinder 740 and the lock member are affected by the engagement force. 43 may be damaged. In the inspection device 2, the engagement between the cylinder 740 and the lock member 43 is released, and the first flapper 711 and the second flapper 712 can be opened, and the notification unit 5 is configured to notify its purpose. This can prevent the cylinder 740 and the lock member 43 from being damaged.

Further, in step S106, not only the main purpose of the state in which the first shutter 711 and the second shutter 712 can be opened is reported by the notification unit 5, but the main theme is also displayed on the monitor 300. That is, the monitor 300 indicates whether or not the first shutter 711 and the second shutter 712 can be opened and closed. This allows the operator (operator) to recognize that the first flap 711 and the second flap can be opened even if the operator (operator) is far away from the first flap 711 and the second flap 712. The purpose of the state of 712.

In addition, in the inspection device 2, the notification unit 5 uses light to notify the operator, so that the operator (operator) can recognize with high accuracy whether the first shutter 711 and the second shutter 712 can be opened and closed.

The first baffle 711 and the second baffle 712 are made of a material having light transparency. Therefore, the operator (operator) can recognize the operating states of the cylinder 740 and the lock member 43. That is, the notification section 5 can be said to have a window section that can recognize the operating states of the cylinder 740 and the lock member 43. With this, even if the configuration of the notification unit 5 is simplified by omitting the monitor 51, for example, the operator (operator) can recognize whether the first baffle 711 and the second baffle 711 can be operated by recognizing the operating states of the cylinder 740 and the lock member 43. The shutter 712 is opened and closed.

According to the electronic component transfer device 100 according to the first embodiment described above, the release destination of liquid nitrogen or cooling gas (nitrogen) as a refrigerant can be switched from the first room to the second room by the switching unit 860. This can shorten the time taken until the concentration of the refrigerant (liquid nitrogen or cooling gas (nitrogen)) filled in the first chamber (supply area A2 or inspection area A3) in which the temperature adjustment section 12 as the cooling section is arranged is reduced. For example, it is possible to improve work efficiency when the IC element 90 is pressed or maintenance is performed.

Further, the switching unit 860 switches the release destination of the refrigerant based on an instruction sent to the instruction receiving unit 87 that receives an instruction to switch the release destination of the refrigerant (liquid nitrogen or cooling gas (nitrogen)). Thereby, for example, the destination of the refrigerant (liquid nitrogen or cooling gas (nitrogen)) can be switched based on the instruction given by the operator (operator) with respect to the instruction receiving unit 87, so that it can be performed more accurately and reliably. Switch.

In addition, with the switching unit 860, when the instruction receiving unit 87 is not received, the refrigerant is discharged to the first room (liquid nitrogen or cooling gas (nitrogen)), and when the instruction receiving unit 87 receives the instruction, the refrigerant is discharged. Refrigerant (liquid nitrogen or cooling gas (nitrogen)) is released outside the first room (the second room). Thereby, the time taken until the refrigerant concentration in the first room such as the supply area A2 or the inspection area A3 where the temperature adjustment section 12 as the cooling section is arranged can be shortened, and the work efficiency can be improved.

In addition, the monitor 51 (notification unit 5) or the signal lamp 400 serving as a notification device enables an operator (operator) to recognize the presence or absence of a switching instruction or whether the opening / closing unit 4 can be opened and closed. Therefore, for example, although the inside of the electronic component transfer apparatus 100 is in a bad state for the operator (operator), the operator (worker) can prevent the opening / closing section 4 from being opened. Therefore, the safety of the operator (operator) can be ensured.

In addition, the inspection device 2 having the electronic component transfer device 100 and the inspection unit 16 also exhibits the same effects as described above.

In addition, in the above, an example has been described and explained in which the release destination of the refrigerant (liquid nitrogen or cooling gas (nitrogen)) after the cooling temperature adjustment unit 12 is switched is not limited to this. When cooling is also performed in, for example, the component supply section 14, the inspection section 16, and the component transfer head 17 having a function of cooling the IC component 90, in addition to the refrigerant used in the temperature adjustment section 12, it can be switched to the component supply section. 14. The destination of the refrigerant (liquid nitrogen or cooling gas (nitrogen)) used for cooling in the inspection unit 16, the component transfer head 17, and the like.

<Second Embodiment>

11 and 12 are diagrams showing an opening / closing section and a reporting section provided in the electronic component inspection apparatus (second embodiment) of the present invention.

Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 11 and 12. The differences from the above-mentioned embodiment will be mainly described, and the same items will be denoted by the same symbols. , And its description is omitted.

In the inspection device 2A, the notification unit 5A includes a first display H2 such as "OK" provided on the first shutter 711 serving as a window portion, a second display H2 such as "NO" provided on the first shutter 711, and An identification plate 52 serving as an identification portion connected to the cylinder rod 740a.

The first display H1 is provided near the corner of the first side of the first baffle 711 in the Z direction and the negative side in the Y direction. The first display H1 is a display in which the first shutter 711 and the second shutter 712 can be turned on.

The second display H2 is located in the negative direction of the Z direction as an example of the different positions of the first display H1. side. The second display H2 is a display-restricted display in which the first bezel 711 and the second bezel 712 are turned on.

The first display H1 and the second display H2 are composed of, for example, an ink print or a sticker. The first display H1 and the second display H2 are, for example, white and relatively light colors.

The identification plate 52 is composed of a plate member fixed to an end portion on the negative side in the Z direction of the cylinder rod 740a. The identification plate 52 has a relatively dark color such as black.

As shown in FIG. 12, the identification plate 52 is in a state where the cylinder rod 740 a is retracted, and may be set to an open state, and is configured to be located at a first position overlapping the first display H1 via the first baffle 711. On the other hand, the identification plate 52 is in a state where the cylinder rod 740a is protruding, that is, in a state where the restriction is set to the open state, and is located at a second position overlapping the second display H2 via the first baffle 711.

In a state where the first display H1 and the identification plate 52 overlap, the first display H1 can be set to be more noticeable than the second display H2 by the identification plate 52. Thereby, an operator (operator) can easily recognize that it can be set to an on state. On the other hand, in a state where the second display H2 and the identification plate 52 do not overlap, the second display H2 can be set to be more noticeable than the first display H1 by the identification plate 52. This allows the operator (operator) to easily recognize that the restriction is set to the on state.

In this way, the identification plate 52 is moved between the first position and the second position in association with the operating state of the cylinder rod 740a, thereby identifying whether the first shutter 711 and the second shutter 712 can be opened and closed.

According to this embodiment, the monitor 51 in the first embodiment can be omitted. Therefore, the configuration of the notification unit 5A can be simplified, and the cost can be reduced.

The illustrated embodiments of the electronic component transfer device and the electronic component inspection device of the present invention have been described above, but the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device may be replaced. To do the same thing An arbitrary constituent. Moreover, you may add arbitrary structures.

The electronic component transfer device and the electronic component inspection device according to the present invention may be a combination (a feature) of any two or more of the above-mentioned embodiments.

In addition, in each of the above embodiments, the notification unit reports whether the opening and closing unit can be opened and closed, that is, both the purpose of opening and the purpose of prohibiting opening are reported, but the present invention is not limited to this, as long as the purpose of opening, And at least one of the purposes of prohibiting opening.

In addition, in the first embodiment described above, the notification unit is notified by light, but is not limited to this, as long as the notification is performed by using at least one of light and sound. That is, the notification by light may be omitted, and only the sound may be notified, or both light and sound may be used for notification.

In each of the above-mentioned embodiments, the notification unit as the notification device is provided at the opening and closing unit, but the present invention is not limited to this, and may be provided at a position deviating from the opening and closing unit such as near the opening and closing unit.

The display section of the notification section may be a display using (Light Emitting Diode).

In each of the above embodiments, the opening / closing section is opened and closed by rotation. However, the present invention is not limited to this. For example, the opening / closing section may be slid in any of the X direction, the Y direction, and the Z direction. And perform the opening and closing operator.

In the first embodiment described above, the notification section displays the remaining time as an example of the information before the opening / closing section can be opened. However, the present invention is not limited to this. For example, it may be displayed by a percentage. Those who know the remaining time.

Claims (9)

An electronic component conveying device, comprising: a conveying section capable of conveying electronic components; a cooling section which is cooled by a refrigerant and can cool the electronic components being conveyed; and a first chamber which is provided with the cooling section A switching unit that can switch the release destination of the refrigerant; a control unit that controls the switching of the change unit; and an instruction receiving unit that receives an instruction to switch the release destination of the refrigerant; and the switching unit is based on the instruction When the receiving unit does not receive the instruction, the refrigerant is released to the first room, and when the receiving unit receives the instruction, the refrigerant is released outside the first room. The electronic component transfer device according to claim 1, wherein the refrigerant contains at least one of liquid nitrogen and nitrogen generated from the liquid nitrogen. For example, if the electronic component transfer device of claim 1 or 2 includes a second room different from the first room, and the switching section releases the refrigerant to the second section when the instruction receiving section receives the instruction. room. For example, the electronic component transfer device of claim 3, wherein the second room is disposed above the first room in a vertical direction. The electronic component transfer device according to claim 1 or 2, further comprising an opening / closing section for opening and closing at least a part of the first room, and the instruction receiving section is arranged near the opening / closing section. The electronic component conveying device according to claim 5, wherein the instruction receiving unit is a button switch. For example, the electronic component transfer device of claim 1 or 2 includes a notification device, and the notification device reports whether there is an instruction to the instruction receiving unit. For example, the electronic component transfer device according to claim 7, wherein the notification device reports using at least one of light and sound. An electronic component inspection device, comprising: a conveying section capable of conveying electronic components; a cooling section which is cooled by a refrigerant and can cool the electronic components being conveyed; and a first room which is provided with the cooling section A switching unit that can switch the release destination of the refrigerant; a control unit that controls the switchover of the changeover unit; an instruction receiving unit that receives an instruction to switch the release destination of the refrigerant; and an inspection unit that checks the electronic parts ; And the switching unit discharges the refrigerant to the first room when the instruction receiving unit does not receive the instruction, and releases the refrigerant to the first room when the instruction receiving unit receives the instruction; 1 room outdoor.