JP2015061021A - Wafer inspection unit, test head, and wafer inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent, if a refrigerant leaks on one motherboard, the refrigerant that has leaked from leaking out to other test head or the like in a wafer inspection device.SOLUTION: A wafer inspection unit 21 includes an inspection circuit board 44 for inspecting a semiconductor device formed at a wafer W, a refrigerant flow tube 47 which is attached to the inspection circuit board 44 to allow refrigerant to flow inside, and a mother board 43 on an upper surface of which the inspection circuit board 44 is provided upright. In order to detect the refrigerant that has leaked from the refrigerant flow tube 47, a refrigerant detection sensor 45 is disposed on an upper surface of the motherboard 43. A wall part 46 is provided along an outer periphery of the motherboard 43 in order to dam and store the refrigerant that has leaked from the refrigerant flow tube 47 on the motherboard 43.

Description

  The present invention relates to a wafer inspection unit for inspecting electrical characteristics and the like of a semiconductor wafer, a test head including the wafer inspection unit, and a wafer inspection apparatus including a plurality of test heads.

  In order to inspect the electrical characteristics of a large number of semiconductor devices formed on a semiconductor wafer (hereinafter referred to as “wafer”), a prober is used as a wafer inspection apparatus (see, for example, Patent Document 1).

  FIG. 7 is a perspective view showing a schematic structure of a conventional prober 60. The prober 60 of FIG. 7 includes a housing-like main body 61 and a test head 62 that is disposed on the main body 61 so as to be pivotable upward and incorporates an inspection circuit. A probe card (not shown) is mounted on the lower surface of the test head 62, and the wafer W is placed on the stage 63 in the main body 61. In the prober 60, each contact probe of the probe card comes into contact with an electrode pad or a solder bump in the semiconductor device formed on the wafer W, and each electrode pad or each solder bump is passed through each contact probe from the inspection circuit of the test head 62. A conduction state of the electrical circuit of the semiconductor device is inspected by flowing an inspection signal to the electrical circuit of the semiconductor device connected to (see, for example, Patent Document 2).

  When inspecting the electrical characteristics of the semiconductor device, the test circuit generates heat, so that it is necessary to cool the test head 62. However, in the prober 60, the test head 62 is exposed without being covered by other components. Therefore, the test head 62 is cooled by heat radiation from itself.

  On the other hand, in recent years, in order to improve the wafer inspection efficiency, a plurality of test heads equipped with probe cards and pogo frames are provided, and another test is performed while the wafer is being transferred to one test head by the transfer stage. A wafer inspection apparatus capable of inspecting a semiconductor device of another wafer with a head has been developed. In such a wafer inspection apparatus, a plurality of test heads are arranged in a multi-stage stack from the viewpoint of reducing the footprint.

JP 2012-063227 A JP 2009-60037 A

  However, in the wafer inspection apparatus having a plurality of test heads as described above, since one test head is covered with another test head, the efficiency of heat radiation from the test head itself is low, so that each test head is naturally cooled. It ’s difficult. In view of this, it is conceivable to provide a refrigerant pipe in the test head and cool the inspection circuit (substrate) provided in each test head with the refrigerant.

  Each test head of a wafer inspection apparatus having a plurality of test heads described above has a structure in which a plurality of inspection circuit boards are mounted in slots provided on a mother board. Therefore, when providing a cooling refrigerant pipe for each test head, a refrigerant pipe is provided for each of the plurality of test circuit boards, and therefore, there are a plurality of refrigerant pipes on the mother board. In this case, when a refrigerant leak occurs on the mother board, the leaked refrigerant may flow into another test head and destroy the other test head.

  An object of the present invention is to provide a wafer inspection unit capable of preventing the leaked refrigerant from leaking out to another test head or the like when a refrigerant leak occurs on one motherboard, and a test head including the wafer inspection unit. Another object of the present invention is to provide a wafer inspection apparatus including a plurality of test heads.

  To achieve the above object, a wafer inspection unit according to claim 1 includes an inspection circuit board that inspects a semiconductor device formed on a semiconductor wafer, and a refrigerant flow that is attached to the inspection circuit board and into which a refrigerant flows. And a refrigerant detection sensor disposed on the upper surface of the mother board for detecting refrigerant leaking from the refrigerant flow channel pipe, and a motherboard on which the inspection circuit board is erected on the upper surface. And a wall portion erected along the outer periphery of the mother board for retaining and storing the refrigerant leaking from the refrigerant flow pipe on the mother board.

  The wafer inspection unit according to claim 2, further comprising a leakage refrigerant recovery pipe for discharging the leakage refrigerant stored by the wall portion on the mother board to the outside in the wafer inspection unit according to claim 1. And

  According to a third aspect of the present invention, there is provided the wafer inspection unit according to the first or second aspect, wherein a substrate slot in which the inspection circuit board can be attached and detached is provided on the upper surface of the mother board.

  To achieve the above object, a test head according to claim 4 is a test head for inspecting a semiconductor device formed on a semiconductor wafer, and an inspection circuit board for inspecting the semiconductor device formed on the semiconductor wafer. A wafer inspection unit including a refrigerant flow path pipe attached to the inspection circuit board, and a mother board on which the inspection circuit board is erected, and supplies the refrigerant to the refrigerant flow path and supplies the refrigerant. A refrigerant unit that collects the refrigerant supplied to the pipe, wherein the motherboard has a refrigerant detection sensor disposed on an upper surface of the motherboard to detect refrigerant leaked from the refrigerant flow pipe, and the refrigerant flow path A wall portion standing up along the outer periphery of the mother board for retaining and storing the refrigerant leaking from the pipe on the mother board And features.

  The test head according to claim 5 is the test head according to claim 4, wherein the refrigerant unit includes an electromagnetic valve that stops supply of the refrigerant to the refrigerant flow pipe when the refrigerant detection sensor detects the refrigerant. The amount of refrigerant that can be stored on the motherboard by the wall portion has a certain safety factor for the amount of refrigerant that can leak between the time when the refrigerant detection sensor detects refrigerant leakage and the time when the solenoid valve is closed. It is characterized by being set to an expected amount.

  The test head according to claim 6 is the test head according to claim 4 or 5, wherein the height position of the upper surface of the motherboard is the same as or lower than the height position of the bottom of the refrigerant unit. .

  A test head according to claim 7 is the test head according to any one of claims 4 to 6, wherein the leaked refrigerant is collected for discharging the leaked refrigerant stored on the motherboard by the wall portion to the outside. It is provided with piping.

  The test head according to claim 8 is the test head according to any one of claims 4 to 7, wherein a board slot in which the test circuit board can be attached and detached is provided on the upper surface of the mother board. And

  In order to achieve the above object, a wafer inspection apparatus according to claim 9 is a wafer inspection apparatus comprising a casing-shaped main body and a plurality of test heads arranged in multiple stages on the main body. Each includes a test circuit board for inspecting a semiconductor device formed on a semiconductor wafer, a coolant channel pipe attached to the test circuit board, and a mother board on which the test circuit board is erected on a top surface. And a refrigerant unit that supplies the refrigerant to the refrigerant flow pipe and collects the refrigerant supplied to the refrigerant supply pipe, and the motherboard detects the refrigerant leaking from the refrigerant flow pipe A refrigerant detection sensor disposed on an upper surface of the motherboard, and the mother for retaining and storing the refrigerant leaking from the refrigerant channel pipe on the motherboard Characterized in that it comprises a along the outer upright walls of the chromatography mode.

  According to the present invention, a wall portion is provided on the outer periphery of the upper surface of the mother board to constitute a water leakage pan, and the refrigerant leaked when the refrigerant leaks on the mother board is temporarily dammed and stored on the mother board. As a result, it is possible to prevent leakage refrigerant from leaking into the wafer inspection apparatus and destroying other test heads and the like.

1 is a perspective view showing a schematic configuration of a wafer inspection apparatus according to an embodiment of the present invention. It is a side view which shows the schematic structure inside the cell which comprises the wafer inspection apparatus of FIG. It is the figure which looked at the cell tower in the wafer inspection apparatus of FIG. 1 from the maintenance surface side. FIG. 2 is a side view showing a schematic structure of a tester arranged in a cell constituting the wafer inspection apparatus of FIG. 1 and a perspective view showing a schematic structure of a test head provided in the tester. FIG. 5 is a top view and a back view of a motherboard provided in the wafer inspection unit of the test head of FIG. 4. It is a figure which shows typically the flow of the refrigerant | coolant in the test head which comprises the tester of FIG. It is a perspective view which shows the structure of the conventional prober roughly.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  First, a schematic configuration of the wafer inspection apparatus according to the present embodiment will be described. FIG. 1 is a perspective view showing a schematic configuration of a wafer inspection apparatus according to the present embodiment.

  As shown in FIG. 1, a wafer inspection apparatus 10 includes a cell tower 12 (main body) in which a plurality of, for example, 25 inspection chambers (cells) 11 are arranged in multiple stages, and is adjacent to the cell tower 12, and is not shown. And a loader 13 for loading and unloading wafers into and from each cell 11. Each of the cell tower 12 and the loader 13 has a casing shape (for example, a rectangular parallelepiped shape), and the height is, for example, 2.4 m. Further, the cell tower 12 has a heat exchanger 14.

  In the wafer inspection apparatus 10, the opposite side of the surface adjacent to the loader 13 on the side of the cell tower 12 (exposed surface, hereinafter referred to as “maintenance surface”) and the opposite side of the side of the loader 13 adjacent to the cell tower 12. This surface is not covered with other components and is exposed to the atmosphere of the place where the wafer inspection apparatus 10 is installed, for example, the atmosphere in a clean room.

  FIG. 2 is a side view showing a schematic structure inside the cell 11 constituting the wafer inspection apparatus 10. As shown in FIG. 2, inside the cell 11, a chuck plate 29, a test head 20 on which an inspection circuit board 44 (not shown) (see FIG. 4) to be described later is mounted, a probe card 22, a probe card 22, And a pogo frame 23 interposed between the test head 20 and the test head 20. The chuck plate 29, the probe card 22 and the pogo frame 23 are permanently installed inside the cell 11, but the test head 20 can be inserted into and removed from the cell 11 as a tester 40 (see FIG. 4) which will be described later.

  The test head 20 includes a wafer inspection unit 21 and a refrigerant unit 41 (not shown in FIG. 2, refer to FIG. 4) described later. A seal member 31 is disposed between the probe card 22 and the pogo frame 23, and a seal member 32 is disposed between the pogo frame 23 and the wafer inspection unit 21. When the space surrounded by the seal members 31 and 32 is depressurized, the probe card 22 and the pogo frame 23 are attached to the wafer inspection unit 21 by vacuum suction.

  The wafer W carried into the cell 11 by the transfer mechanism (not shown) and placed on the chuck plate 29 rises toward the probe card 22 together with the chuck plate 29. A seal member 33 is disposed on the upper surface of the chuck plate 29, the seal member 33 abuts on the pogo frame 23, and the space surrounded by the seal member 33 is decompressed. The wafer W is drawn toward the card 22, and the wafer W comes into contact with the probe card 22.

  The probe card 22 includes a disk-shaped card body 24, a number of electrodes (not shown) arranged on substantially the entire top surface of the card body 24, and a downward direction (on the side of the chuck plate 29) from the bottom surface of the card body 24. And a contact probe 25 which is a large number of columnar contact terminals arranged so as to protrude. A number of electrodes (not shown) arranged on the upper surface of the card body 24 are electrically connected to the corresponding contact probes 25. Each of the multiple contact probes 25 comes into contact with electrode pads or solder bumps in a semiconductor device (not shown) formed on the wafer W when the wafer W comes into contact with the probe card 22.

  The pogo frame 23 has a substantially flat frame main body 26 and pogo block insertion holes 27 which are a plurality of through holes formed in the frame main body 26, and each pogo block insertion hole 27 has a large number of pogo pins. A pogo block 28 formed in an array is inserted. The pogo block 28 is connected to a later-described mother board 43 (see FIGS. 4 and 5) of the wafer inspection unit 21, and a plurality of pogo blocks 28 provided on the upper surface of the card body 24 in the probe card 22 attached to the pogo frame 23. It contacts an electrode (not shown). Therefore, an inspection signal is sent from the inspection circuit on the inspection circuit board 44 to the semiconductor device on the wafer W via the motherboard 43, the pogo block 28, and a large number of electrodes (not shown) provided on the upper surface of the card body 24 and the contact probe 25. Sent. A response signal to the inspection signal is returned to the inspection circuit through a route opposite to the route through which the inspection signal is sent.

  FIG. 3 is a view of the cell tower 12 as viewed from the maintenance surface side. In FIG. 3, the outer shape of the cell tower 12 is indicated by a broken line, and is drawn in a state where the test head 20 and the like built in the cell tower 12 can be seen through.

  As shown in FIG. 3, the cell tower 12 includes a refrigerant supply pipe 35 that connects the heat exchanger 14 and the plurality of test heads 20. As will be described later with reference to FIG. 6, the refrigerant supply pipe 35 returns the refrigerant from the heat exchanger 14 to the test head 20 and from the test head 20 to the heat exchanger 14. It consists of a refrigerant recovery pipe 35b.

  The refrigerant supply pipe 35 has a refrigerant supply branch pipe 36 that branches so as to be connected to each test head 20. As will be described later with reference to FIG. 6, the refrigerant supply branch pipe 36 includes a refrigerant water supply pipe 36a and a refrigerant recovery branch pipe 36b corresponding to the refrigerant water supply pipe 35a and the refrigerant recovery pipe 35b, respectively. The refrigerant supply branch pipe 36 is connected to the refrigerant unit internal pipe 50 (see FIG. 6) of the refrigerant unit 41 built in the test head 20.

  The heat exchanger 14 cools the refrigerant that has received heat from each test head 20, for example, water, Galden (registered trademark) or Florinart (registered trademark), and supplies the cooled refrigerant to each test head 20. The refrigerant cooled by the heat exchanger 14 is supplied to each test head 20 through the refrigerant water supply pipe 35a, and the refrigerant circulated in each test head 20 is recovered by the heat exchanger 14 through the refrigerant recovery pipe 35b. Thus, the heat of each test head 20 is exhausted by the circulation of the refrigerant to and from the heat exchanger 14.

  FIG. 4A is a side view showing a schematic structure of the tester 40 arranged in the cell 11 constituting the wafer inspection apparatus 10. FIG. 4B is a perspective view showing a schematic structure of the test head 20 provided in the tester 40.

  The tester 40 is generally composed of a test head 20 and an electric machine unit 42 that controls the operation of the test head 20, and the test head 20 is composed of a wafer inspection unit 21 and a refrigerant unit 41. The tester 40 can be inserted into and removed from the cell 11 from the maintenance surface side of the cell tower 12.

  A mother board 43 is disposed on the lower surface of the wafer inspection unit 21. On the upper surface of the mother board 43, a plurality of test circuit boards 44 are mounted upright with respect to the mother board 43 by the board slots 48. Further, on the upper surface of the mother board 43, a first refrigerant detection sensor 45 is disposed, and a wall 46 is erected along the outer periphery. The functions of the first refrigerant detection sensor 45 and the wall 46 will be described later.

  The inspection circuit board 44 has, for example, a structure in which an electronic component (not shown) is mounted on one surface, and a refrigerant channel tube 47 for flowing a refrigerant is attached to the other surface. FIG. 4B illustrates a structure in which one refrigerant channel tube 47 is sandwiched between two test circuit boards 44. However, the arrangement of the refrigerant channel tube 47 with respect to the test circuit board 44 is as follows. It is not limited to such a structure. The refrigerant channel pipe 47 is connected to the refrigerant supply branch pipe 36 (the refrigerant water supply branch pipe 36a and the refrigerant recovery branch pipe 36b) via the refrigerant unit internal pipe 50.

  5A is a top view of the motherboard 43, and FIG. 5A is a back view of the motherboard 43. On the upper surface of the mother board 43, a board slot 48 to which the inspection circuit board 44 is attached and detached is arranged. The board slot 48 is electrically connected to a plurality of electrode pads 49 (terminals) provided on the lower surface of the mother board 43, and the pogo block 28 provided on the pogo frame 23 contacts these electrode pads 49. The inspection circuit board 44 and the pogo block 28 are electrically connected.

  FIG. 6 is a diagram schematically illustrating the flow of the refrigerant in the test head 20. The refrigerant supply pipe 35 includes a refrigerant water supply pipe 35 a that sends a refrigerant from the heat exchanger 14 to the test head 20, and a refrigerant collection pipe 35 b that collects the refrigerant circulated through the test head 20. The refrigerant water supply branch pipe 36a and the refrigerant recovery branch pipe 36b branch from each of the refrigerant water supply pipe 35a and the refrigerant recovery pipe 35b to each test head 20, and the refrigerant water supply branch pipe 36a and the refrigerant recovery branch pipe 36b are both refrigerant units 41. Is connected to the piping 50 in the refrigerant unit.

  The refrigerant water supply branch pipe 36a is provided with the female side of the first ball valve 51 and the first connection coupler 53, and the refrigerant recovery branch pipe 36b is provided with the second ball valve 52 and the second connection coupler 54. The male side is provided. The refrigerant unit internal pipe 50 has a second connection connected to the male side of the first connection coupler 53 and the male side of the second connection coupler 54 connected to the female side of the first connection coupler 53. On the female side of the coupler 54, two electromagnetic valves 55 and a flow meter 56 are provided.

  The first ball valve 51 and the second ball valve 52 control the flow rate of the refrigerant supplied to the refrigerant flow path pipe 47. Since the tester 40 can be inserted into and removed from the cell 11, the refrigerant unit internal pipe 50, the refrigerant water supply branch pipe 36 a, and the refrigerant recovery branch pipe 36 b are connected / separated by the first connection coupler 53 and the first connection coupler 53 that can be connected / separated. 2 connecting couplers 54. When the first connection coupler 53 and the second connection coupler 54 are not connected and when the tester 40 is attached and detached, the first ball valve 51 and the second ball valve 52 are held closed. The electromagnetic valve 55 stops the supply of the refrigerant to the refrigerant passage pipe 47 and the recovery of the refrigerant from the refrigerant passage pipe 47 as necessary. The refrigerant unit internal pipe 50 is connected to a refrigerant flow path pipe 47 attached to the inspection circuit board 44 by a connection coupler (not shown) or the like.

  A second water leakage sensor (not shown) for detecting refrigerant leakage is disposed in the refrigerant unit 41. When the second water leakage sensor detects refrigerant leakage in the refrigerant unit 41, the first ball valve 51 and the second ball valve 52 are closed, and an alarm device (not shown) provided in the wafer inspection apparatus 10 is activated. To do. The refrigerant unit 41 is a box-like body, and even if refrigerant leakage occurs in the refrigerant unit 41, the leaked refrigerant is provided in the cell tower 12 from the bottom or near the bottom of the refrigerant unit 41 through the leaked water drainage branch pipe 57. It flows out into the water leakage drain pipe 58 and is discharged outside. Therefore, even if a refrigerant leak occurs in the refrigerant unit 41 in one test head 20 of the plurality of test heads 20, the leaked refrigerant leaks out to the other test heads 20 and the like, and the other test heads 20 are damaged. There is nothing.

  The refrigerant leakage may also occur on the mother board 43 of the wafer inspection unit 21. That is, there is a possibility that refrigerant leakage may occur from the refrigerant flow path pipe 47 attached to the inspection circuit board 44 attached to the mother board 43. Here, since the mother board 43 has a flat plate shape, it is not known from which part of the mother board 43 the leaked refrigerant starts to flow down when the refrigerant leaks from the refrigerant flow pipe 47. Further, if the refrigerant leaks from the mother board 43, the leaked refrigerant may destroy the probe card 22, the pogo frame 23, and the other test heads 20 that are permanently provided below the refrigerant.

  Therefore, as shown in FIGS. 4 and 5A, when the refrigerant leaks on the mother board 43, the mother board 43 is used to temporarily store and store the leaked refrigerant on the mother board 43. A wall 46 is erected along the outer periphery of the wall. That is, the mother board 43 and the wall portion 46 constitute a water leakage pan that temporarily stores the leakage refrigerant.

  When the first refrigerant detection sensor 45 disposed on the upper surface of the mother board 43 detects refrigerant leakage, a control device (not shown) provided in the electrical unit 42 closes the electromagnetic valve 55 and supplies the refrigerant to the refrigerant passage tube 47. Stop supplying. The amount of refrigerant (V) that can be stored on the mother board 43 by the wall 46 is the amount of refrigerant (E) that can leak from the time when the first refrigerant detection sensor 45 detects refrigerant leakage until the solenoid valve 55 is closed. Is set to an amount that allows for a certain safety factor (α). For example, in the relationship of “V = α × E”, α can be set to about 1.3 to 2.0.

  As a result, it is possible to prevent the leaked refrigerant from passing over the wall 46 and flowing out to the outside, so that the refrigerant flows into the probe card 22, the pogo frame 23, and other test heads 20 and is destroyed. Can be prevented.

  By the way, due to the structure of the tester 40, the height of the mother board 43 in the wafer inspection unit 21 is made higher than the height of the bottom of the refrigerant unit 41 (in other words, the position of the bottom of the refrigerant unit 41 is lower than the height of the mother board 43). Is not preferable because the volume of the refrigerant unit 41 is unnecessarily increased and the wafer inspection apparatus 10 is enlarged. Therefore, the height position of the mother board 43 in the wafer inspection unit 21 is the same as or lower than the height position of the bottom of the refrigerant unit 41. In this case, even if a pipe for flowing the refrigerant to the refrigerant unit 41 is provided so as to open at the wall portion 46 or the mother board 43, the refrigerant on the mother board 43 flows naturally to the refrigerant unit 41 through this pipe and drains the water leakage. It cannot be discharged from the leakage water drain pipe 58 through the liquid branch pipe 57.

  Further, as described above, the tester 40 can be inserted into and removed from the cell 11 from the maintenance surface side of the cell tower 12. Since the wafer inspection unit 21 in which the refrigerant leaks on the mother board 43 cannot be used, the entire tester 40 including the wafer inspection unit 21 needs to be pulled out from the cell 11. At this time, when the tester 40 is pulled out from the cell 11 in a state where the refrigerant is stored on the mother board 43, the test head 20 (wafer inspection unit 21) is shaken during the drawing operation, and the refrigerant on the mother board 43 is changed to the wall portion 46. There is a risk of spilling over.

  Therefore, a leakage refrigerant recovery pipe 59 is provided so that the leakage refrigerant stored on the mother board 43 can be sucked and discharged. The opening on the refrigerant unit 41 side of the leaked refrigerant recovery pipe 59 may be anywhere that can be accessed by an operator before the tester 40 is pulled out, and sucks out the leaked refrigerant using a separately prepared suction device. After removal, the tester 40 is pulled out.

  Before collecting the leaked refrigerant, the leaked refrigerant on the mother board 43 is not allowed to flow naturally through the leaked refrigerant recovery pipe 59, or even if it flows out, the leaked water is discharged through the leaked water drainage branch pipe 57 of the refrigerant unit 41. It is preferable to arrange a leaking refrigerant recovery pipe 59 so as to be discharged from the liquid pipe 58 to the outside.

  As described above, according to the present embodiment, the water pan is configured by providing the wall portion 46 on the outer periphery of the upper surface of the motherboard 43. When a refrigerant leak occurs on the mother board 43, the refrigerant leakage is detected and the supply of the refrigerant is stopped, and the refrigerant leaking on the mother board 43 in the meantime is stored on the mother board 43. Thereby, it is possible to prevent leakage refrigerant from flowing out to the lower side of the mother board 43 and the other test heads 20 and destroying the probe card 22, the pogo frame 23, and the other test heads 20.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment. For example, in the above embodiment, the wall portion 46 is disposed along the outer periphery of the mother board 43. However, the wall portion 46 is disposed on the inner side of the outer periphery as long as the leakage refrigerant from the refrigerant channel tube 47 can be reliably dammed up. May be. Moreover, as the first refrigerant detection sensor 45, an example in which a line-shaped one is arranged at one place as shown in FIGS. 4 and 5A is not limited to this. You may disperse | distribute and arrange | position to a location. Furthermore, in the above-described embodiment, the refrigerant channel pipe 47 for flowing the refrigerant is attached to one surface of the inspection circuit board 44, but the present invention is not limited to this, and the channel pipe through which the refrigerant flows passes. The plate may be configured to be attached to one surface of the inspection circuit board 44, and the form in which the flow path pipe is arranged with respect to the inspection circuit board 44 can be variously changed.

DESCRIPTION OF SYMBOLS 10 Wafer inspection apparatus 11 Cell 20 Test head 21 Wafer inspection unit 41 Refrigerant unit 43 Motherboard 44 Inspection circuit board 45 First refrigerant detection sensor 47 Refrigerant flow path pipe 50 Refrigerant unit internal pipe 55 Electromagnetic valve 59 Leakage refrigerant recovery pipe W Wafer

Claims (9)

An inspection circuit board for inspecting a semiconductor device formed on the semiconductor wafer;
A refrigerant channel tube attached to the inspection circuit board and through which a refrigerant flows;
A motherboard on which the inspection circuit board is erected on the upper surface;
The motherboard is
A refrigerant detection sensor disposed on the upper surface of the mother board for detecting refrigerant leaking from the refrigerant channel tube;
A wafer inspection unit, comprising: a wall portion erected along an outer periphery of the mother board for retaining and storing the refrigerant leaking from the refrigerant channel pipe on the mother board.   2. The wafer inspection unit according to claim 1, further comprising a leakage refrigerant recovery pipe for discharging the leakage refrigerant stored by the wall portion on the mother board to the outside.   3. The wafer inspection unit according to claim 1, wherein a substrate slot in which the inspection circuit board can be attached and detached is provided on an upper surface of the mother board. A test head for inspecting a semiconductor device formed on a semiconductor wafer,
A wafer inspection unit comprising: an inspection circuit board for inspecting a semiconductor device formed on a semiconductor wafer; a refrigerant flow path pipe attached to the inspection circuit board; and a mother board on which the inspection circuit board is erected.
A refrigerant unit that supplies the refrigerant to the refrigerant flow pipe and collects the refrigerant supplied to the refrigerant supply pipe;
The motherboard is
A refrigerant detection sensor disposed on the upper surface of the mother board for detecting refrigerant leaking from the refrigerant channel tube;
A test head, comprising: a wall portion erected along an outer periphery of the mother board for retaining and storing the refrigerant leaking from the refrigerant passage pipe on the mother board. The refrigerant unit has an electromagnetic valve that stops supply of the refrigerant to the refrigerant channel pipe when the refrigerant detection sensor detects the refrigerant,
The amount of refrigerant that can be stored on the motherboard by the wall is an amount that allows for a certain safety factor in the amount of refrigerant that can leak from when the refrigerant detection sensor detects refrigerant leakage until the solenoid valve is closed. The test head according to claim 4, wherein the test head is set as follows.   6. The test head according to claim 4, wherein a height position of an upper surface of the mother board is equal to or lower than a height position of a bottom portion of the refrigerant unit.   7. The test head according to claim 4, further comprising a leakage refrigerant recovery pipe for discharging the leakage refrigerant stored on the motherboard by the wall portion to the outside.   8. The test head according to claim 4, wherein a board slot in which the inspection circuit board can be attached and detached is provided on an upper surface of the mother board. 9. A wafer inspection apparatus comprising a housing-like main body and a plurality of test heads arranged in multiple stages on the main body,
Each of the test heads is
An inspection circuit board for inspecting a semiconductor device formed on a semiconductor wafer, a coolant channel pipe attached to the inspection circuit board, and a wafer inspection unit comprising a motherboard on which the inspection circuit board is erected,
A refrigerant unit that supplies the refrigerant to the refrigerant flow pipe and collects the refrigerant supplied to the refrigerant supply pipe;
The motherboard is
A refrigerant detection sensor disposed on the upper surface of the mother board for detecting refrigerant leaking from the refrigerant channel tube;
A wafer inspection apparatus comprising: a wall portion erected along an outer periphery of the mother board for retaining and storing refrigerant leaking from the refrigerant flow pipe on the mother board.

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