WO2023236182A1

WO2023236182A1 - Temperature control system of electronic component test device and method thereof

Info

Publication number: WO2023236182A1
Application number: PCT/CN2022/098107
Authority: WO
Inventors: 曾一士; 欧阳勤一; 蔡译庆; 吴信毅; 吴彦霖
Original assignee: 致茂电子股份有限公司
Priority date: 2022-06-10
Filing date: 2022-06-10
Publication date: 2023-12-14

Abstract

A temperature control system of an electronic component test device and a method thereof, the temperature control system mainly comprising a test socket (2), a temperature control fluid supply device (3), and a temperature control fluid recovery device (4). A temperature control fluid is supplied to a chip accommodation recess (21) of the test socket (2) by means of the temperature control fluid supply device (3), and the temperature control fluid is extracted from the exterior of the chip accommodation recess (21) by means of the temperature control fluid recovery device (4). That is, the system will forcibly allow the temperature control fluid to flow through the chip accommodation recess (21) loaded with an electronic component, so as to perform forced heat exchange on the electronic component and components in the chip accommodation recess (21), thereby achieving the purpose of constant-temperature test; and after the test is completed, the temperature control fluid can be effectively recovered, avoiding contamination of the electronic component or the test device. In addition, the system can also be simply used as a cooling system of the electronic component and of the test socket (2), and can effectively prevent solder ball melting caused by a high temperature.

Description

Temperature control system and method for electronic component testing equipment

Technical field

The present invention relates to a temperature control system and method for electronic component testing equipment, and in particular to a system and method that can perform temperature control on electronic components and testing equipment during testing.

Background technique

As the chip processing or computing function becomes more and more powerful, the number of contacts on the bottom surface of the chip increases, and the number of probes in the test socket of the detection equipment must also increase, and the density of distribution becomes denser and denser. Furthermore, as functions become more complex, the test time is getting longer and longer, and the power required for testing is also increasing. Accordingly, when the chip is tested, high heat will be generated and will be directly conducted to the chip's solder balls and probes.

Generally speaking, the melting point of the solder ball is 180°C, but when the solder ball temperature reaches 120°C, it gradually begins to soften; on the other hand, when the power during the test reaches 900W to 1000W, the solder ball temperature will also reach 120°C. . However, according to today's chip test specifications, for chips with complex functions, the test power often reaches between 800W and 2600W. Therefore, during the test process, it often happens that the solder ball melts and sticks to the probe or the solder ball residue is scattered in the test socket. After a period of time, it may cause the test to fail, or in serious cases, it may cause a short circuit and cause the chip to fail. damage or equipment failure.

In addition, a common temperature control system in existing chip testing equipment uses a pressure probe to control the chip temperature. That is, a temperature controller is set on the pressure probe, and the pressure probe contacts the chip to allow the temperature controller to to heat or cool the chip. However, since the material of the chip itself has thermal resistance, the high temperature generated by the chip during the testing process will cause a temperature gradient in the thickness direction. Take low-temperature testing as an example. If the chip test power is 1000W, and the temperature controller of the pressure probe is set to a test environment of -40°C, the lower surface of the chip may only reach -5°C, resulting in a considerable temperature. Poor, which can easily affect the accuracy of the test.

It can be seen from this that a temperature control system that can effectively and real-time cool chips, chip solder balls, test sockets and probes, and can be used to realize constant temperature control of the full test environment of semiconductor chip test equipment, is indeed what the industry is eagerly looking forward to. .

Contents of the invention

The main purpose of the present invention is to provide a temperature control system and method for electronic component testing equipment, which can control the temperature of electronic components, solder balls, test sockets and probes. In addition to being used to cool solder balls and probes to avoid the occurrence of In addition to the situation of solder ball melting, constant temperature control of the entire test environment can also be achieved.

In order to achieve the above object, the present invention is a temperature control system for electronic component testing equipment, which mainly includes a test seat, a temperature-controlled fluid supply device and a temperature-controlled fluid recovery device; the test seat includes a chip receiving tank, at least one fluid inlet and at least one The fluid outlet part, the fluid inlet part and the fluid outlet part are connected to the chip receiving tank; the temperature control fluid supply device is connected to the fluid inlet part of the test seat; the temperature control fluid recovery device is connected to the fluid outlet part of the test seat. Wherein, when testing the electronic component, the electronic component is accommodated in the chip accommodation tank of the test seat, the temperature control fluid supply device supplies the temperature control fluid to the chip accommodation tank through the fluid inlet part, and the temperature control fluid recovery device automatically collects the temperature control fluid through the fluid outlet part. The temperature-controlled fluid is sucked into the chip holding tank of the test seat.

Accordingly, in the test state, the temperature control system of the electronic component testing equipment of the present invention can supply temperature control fluid to the chip holding tank through the temperature control fluid supply device. The temperature control fluid will be able to simultaneously test electronic components, solder balls, and test components. Temperature control of the socket and probe; for example, cooling these components can avoid the melting of the solder balls caused by high temperature during the test process; on the other hand, the temperature control effect of electronic components can be controlled by the temperature control fluid, that is, Can perform high or low temperature testing. More importantly, the present invention also recovers the temperature-controlled fluid through suction by the temperature-controlled fluid recovery device, which can forcefully flow or even force the temperature-controlled fluid to circulate, and can effectively control the temperature of the temperature-controlled fluid and electronic components in the chip storage tank. , to achieve constant temperature control.

In order to achieve the aforementioned objectives, the present invention provides a temperature control method for electronic component testing equipment, which at least regulates the temperature of electronic components; and the electronic components can be accommodated in the chip receiving slot of the test socket; the temperature control method includes the following main steps: first, The temperature-controlled fluid supply device supplies the temperature-controlled fluid to the chip receiving tank through the fluid inlet of the test socket; furthermore, the temperature-controlled fluid flows through at least part of the upper and lower surfaces of the electronic component; and the temperature-controlled fluid is self-contained in the test socket. Discharge from the outlet.

In other words, according to the temperature control method provided by the present invention, the temperature control fluid will be forced to flow through at least part of the upper and lower surfaces of the electronic components respectively, thereby immersing the electronic components in an environment of continuously flowing temperature control fluid. This allows the continuously flowing temperature control fluid to continuously exchange heat with the chip surface, thereby achieving excellent temperature control effects; at the same time, the continuously flowing temperature control fluid can also take away dust, molten solder ball debris, or other By removing foreign matter, you can keep the chip holding slot and electronic components clean.

In order to achieve the above object, the present invention is a temperature control method for electronic component testing equipment, which includes the following steps: a temperature-controlled fluid supply device supplies temperature-controlled fluid to a chip holding tank of the test seat; and the chip holding tank contains electronic components, And the lower surface of the electronic component and the chip accommodating tank define a flow-containing space; in addition, the temperature-controlled fluid flows through the flow-containing space; and the temperature-controlled fluid recovery device sucks the temperature-controlled fluid from the chip accommodating tank.

In other words, the method provided by the present invention will bring a new type of temperature control method to electronic component testing equipment, which uses a temperature-controlled fluid supply device to supply temperature-controlled fluid to the chip holding tank of the test socket, and utilizes temperature-controlled fluid recovery The device sucks the temperature-controlled fluid from the chip containing tank; that is to say, the method of the present invention will make the temperature-controlled fluid forcibly flow through the chip containing tank loaded with electronic components to protect the electronic components and components in the chip containing tank. Compulsory heat exchange is performed to achieve the purpose of constant temperature testing. After the test is completed, the temperature control fluid can be effectively recycled to avoid foreign matter contaminating electronic components or testing equipment.

Description of the drawings

Figure 1 is a schematic configuration diagram of a preferred embodiment of the temperature control system of the present invention.

Figure 2 is an architectural schematic diagram of a preferred embodiment of the temperature control system of the present invention.

Figure 3A is a perspective view of the first embodiment of the test socket of the present invention.

Figure 3B is an exploded view of the first embodiment of the test socket of the present invention.

Figure 3C is a cross-sectional view of the first embodiment of the test socket of the present invention.

Figure 4A is a graph showing the relationship between time and the inlet and outlet temperature differences of three different temperature-controlled fluid flows when the test load is 400W.

Figure 4B is a graph showing the relationship between time and inlet and outlet temperature differences for three different temperature-controlled fluid flows when the test load is 600W.

Figure 5A is a graph showing the relationship between time and thermal load for three different temperature control fluid flows under a test load of 400W.

Figure 5B is a graph showing the relationship between time and thermal load for three different temperature control fluid flows under a test load of 600W.

Figure 6 is a schematic configuration diagram of another preferred embodiment of the temperature control system of the present invention.

Figure 7A is a perspective view of the second embodiment of the test socket of the present invention.

Figure 7B is a cross-sectional view of the second embodiment of the test socket of the present invention.

Figure 8A is a perspective view of the third embodiment of the test socket of the present invention.

Figure 8B is a cross-sectional view of the third embodiment of the test socket of the present invention.

Detailed ways

Before the temperature control system and method of the electronic component testing equipment of the present invention are described in detail in this embodiment, it should be noted that in the following description, similar components will be represented by the same component symbols. Furthermore, the drawings of the present invention are only for schematic illustration, which are not necessarily drawn to scale, and not all details may be presented in the drawings.

Please refer to Figure 1 and Figure 2 first. Figure 1 is a schematic configuration diagram of a preferred embodiment of the system of the present invention. Figure 2 is a schematic structural diagram of a preferred embodiment of the system of the present invention. As shown in the figure, the temperature control system of this embodiment Mainly includes test seat 2, temperature control fluid supply device 3, temperature control fluid recovery device 4, cleaning gas supply device 5, controller 6, filter module 7, heat exchanger 8, temperature control fluid tank 9, liquid gas solenoid valve 30 And the fluid circulation channel 90; wherein, the test seat 2, the temperature control fluid supply device 3, the temperature control fluid recovery device 4, the cleaning gas supply device 5 and the liquid gas solenoid valve 30 are electrically connected to the controller 6.

Furthermore, the fluid circulation channel 90 is connected between the temperature control fluid supply device 3 and the temperature control fluid recovery device 4 , and the filter module 7 , the heat exchanger 8 and the temperature control fluid tank 9 are connected to the fluid circulation channel 90 . In other words, as shown in Figure 1, the overall equipment constitutes a circulation system of temperature control fluid, that is, after the temperature control fluid supply device 3 supplies the temperature control fluid to the test seat 2, the temperature control fluid recovery device 4 recovers the temperature control fluid from the test seat 2. The temperature-controlled fluid then flows through the filter module 7 along the fluid circulation channel 90 to filter the molten residue of solder balls or other foreign matter, then enters the heat exchanger 8 to further cool down or heat up the temperature-controlled fluid, and finally enters the temperature-controlled fluid tank 9. So that the temperature control fluid supply device 3 draws the temperature control fluid. In addition, the temperature control fluid in this embodiment is a non-conductive heat transfer liquid, such as 3M ^TM Novec ^TM electronic engineering fluid.

In addition, the liquid gas solenoid valve 30 includes two inlet ports 301 and an outlet port 302; the temperature control fluid supply device 3 and the cleaning gas supply device 5 are respectively connected to the two inlet ports 301, and the outlet port 302 is connected to the test seat 2 . That is to say, the liquid-gas solenoid valve 30 is adapted to be switched by the control action of the controller 6 to connect the fluid supply device 3 or the cleaning gas supply device 5 to the test seat 2 .

In this embodiment, the entire circulation system is also provided with a first flow meter F1, a second flow meter F2 and a first fluid pressure meter P1, a second fluid pressure meter P2 and a third fluid pressure meter P3; the first flow meter The meter F1 is disposed between the temperature control fluid supply device 3 and the liquid-gas solenoid valve 30 for measuring the temperature control fluid flow rate supplied by the temperature control fluid supply device 3; the second flow meter F2 is disposed between the heat exchanger 8 and the temperature control fluid solenoid valve 30. between the fluid control tanks 9 for measuring the actual recovered temperature control fluid flow, and by comparing the measurement results of the first flow meter F1 and the second flow meter F2, it can be known whether there is leakage or leakage of the temperature control fluid. The fluid circulation channel 90 is blocked. The first fluid pressure gauge P1 and the second fluid pressure gauge P2 are respectively arranged on both sides of the test seat 2 for monitoring the fluid pressure in and out of the test seat 2 respectively; while the third fluid pressure gauge P3 is used for monitoring the cleaning gas supply device 5 The gas pressure of the supplied purge gas.

Please refer to Figure 3A, Figure 3B and Figure 3C at the same time. Figure 3A is a perspective view of the first embodiment of the test socket of the present invention. Figure 3B is an exploded view of the first embodiment of the test socket of the present invention. Figure 3C is a first embodiment of the test socket of the present invention. Cross-sectional view of the embodiment. The test seat 2 of this embodiment includes a chip receiving slot 21, a fluid inlet part 22 and a fluid outlet part 23; the fluid inlet part 22 includes two fluid inlet slots 221 and a first channel 223, and the fluid outlet part 23 includes two fluid inlet slots 221 and a first channel 223. The outlet groove 231 and the second channel 233; the two fluid inlet grooves 221 and the two fluid outlet grooves 231 are respectively located on corresponding two sides of the chip accommodating groove 21 and are connected to the chip accommodating groove 21. In addition, as shown in detail in FIG. 3C , the groove bottom surface 222 of the fluid inlet groove 221 is flush with the groove bottom surface 210 of the chip receiving groove 21 , while the groove bottom surface 232 of the fluid outlet groove 231 is lower than the chip receiving groove in the thickness direction of the test seat 2 . The groove bottom surface 210 of the groove 21; that is to say, the fluid outlet groove 231 is set slightly lower than the chip containing groove 21, which will help to drain the temperature control fluid in the chip containing groove 21.

In addition, the test seat 2 is also provided with a docking plate 20, which is composed of a positioning piece 24, a fluid inlet frame 25 and a fluid outlet frame 26; the positioning piece 24 is a square frame metal plate, and its opening is opposite to the chip housing. Groove 21; two corresponding sides of the positioning piece 24 are each provided with positioning pins 241, which are used for positioning the pressure measuring head (not shown in the figure). Accordingly, when there is a process conversion, that is, when the object to be tested is changed, only the test socket 2 needs to be replaced, and the docking plate 20 will be adaptable to all test sockets 2, which is very conducive to equipment modification and maintenance.

As shown in the figure, the fluid inlet rack 25 and the fluid outlet rack 26 are respectively located on two corresponding sides of the test seat 2. The fluid inlet rack 25 includes a fluid inlet channel 201, the fluid outlet rack 26 includes a fluid outlet channel 202, and the fluid inlet rack 25 includes a fluid inlet channel 201. The channel 201 is also connected to the fluid inlet groove 221 through the first channel 223 of the fluid inlet part 22 , and the fluid outlet channel 202 is also connected to the fluid outlet groove 231 through the second channel 233 of the fluid outlet part 23 . Accordingly, the temperature control fluid supply device 3 and the cleaning gas supply device 5 can be connected to the chip receiving tank 21 through the fluid inlet channel 201, the first channel 223 and the fluid inlet groove 221; similarly, the temperature control fluid recovery device 4 can Connected to the chip receiving groove 21 through the fluid outlet channel 202, the second channel 233 and the fluid outlet groove 231

The operation of this embodiment will be described below. Please refer to FIGS. 1 to 3C at the same time. First, the electronic component C is placed in the chip receiving slot 21, and the lower surface of the electronic component C and the chip receiving slot 21 define a flow-containing space LC. See Figure 3C; then, the controller 6 controls the liquid gas solenoid valve 30 to conduct the temperature control fluid supply device 3 to the outlet end 302, and controls the temperature control fluid supply device 3 to supply the temperature control fluid to the flow space LC; at the same time, The controller 6 also controls the temperature control fluid recovery device 4 to suck the temperature control fluid from the flow volume space LC. After completing the test of the electronic component C, the controller 6 controls the temperature-controlled fluid supply device 3 to stop supplying the temperature-controlled fluid to the flow space LC. The controller 6 then controls the liquid-gas solenoid valve 30 to conduct the cleaning gas supply device 5 to the outlet. Terminal 302, however, at this time, the temperature control fluid recovery device 4 continues to suck the temperature control fluid from the flow volume space LC.

It can be seen from this that during the testing process of electronic components, on the one hand, the temperature-controlled fluid supply device 3 continues to push the temperature-controlled fluid to the flow-containing space LC, and on the other hand, the temperature-controlled fluid recovery device 4 continues to pump temperature from the flow-containing space LC. Control the fluid, thereby forming a forced circulation of the temperature-controlled fluid, and the temperature-controlled fluid performs heat exchange on the lower surface of the electronic component C, the solder ball, the test seat and the probe in the flow-containing space LC. On the other hand, since the temperature-controlled fluid in the flow-containing space LC is continuously forced to flow, even if there is no sealing mechanism between the four circumferential side walls of the electronic component C and the four circumferential inner walls of the chip accommodating groove 21, the temperature control fluid in the flow-containing space LC is continuously forced to flow. The control fluid will not leak from the gap between the electronic component C and the side wall of the chip receiving groove 21 .

In addition, when the test is completed, the cleaning gas supply device 5 is used to provide cleaning gas to the flow volume space LC. The cleaning gas supply device 5 in this embodiment can be a unified air pressure source in the factory area or an independent air compressor. However, by supplying high-pressure cleaning gas into the fluid pipeline and the chip receiving tank 21, the remaining temperature control fluid can be driven into the recovery pipeline, and the temperature control fluid recovery device 4 will also continue to pump to forcefully recover the temperature. Control fluid.

To further explain, in this embodiment, the temperature control fluid recovery device 4 is set to be normally open. When the temperature control fluid supply device 3 supplies the temperature control fluid to the flow space LC, the forced flow of the temperature control fluid will be ensured. ,cycle. However, after the test is completed, while the purge gas supply device 5 supplies purge gas to the flow space LC, the temperature control fluid recovery device 4 still maintains the operating state. This will ensure that all temperature control fluids in the flow space LC can Recycled in its entirety. In addition, since the temperature-controlled fluid recovery device 4 of this embodiment uses a diaphragm pump, it has good self-priming ability and can naturally and continuously suck away the temperature-controlled fluid, regardless of whether the electronic component C or the chip is accommodated. There will be no residual liquid in the tank 21 .

On the other hand, since the time between the completion of the test of the electronic component C and the replacement of the new electronic component C to be tested is very short, it may even be less than 1 second. For this reason, the present invention provides another variant embodiment, that is, you can also wait After the entire batch of electronic components C is tested, the cleaning gas supply device 5 is started to allow the cleaning gas to forcibly drive away the temperature control fluid from the flow space LC and be recovered by the temperature control fluid recovery device 4 . Therefore, during the testing process of the entire batch of electronic components, the temperature control fluid supply device 3 and the temperature control fluid recovery device 4 are kept normally open.

In addition, in this modified embodiment, since the temperature control fluid recovery device 4 continuously sucks the temperature control fluid, even during the replacement process of the electronic component C and the electronic component to be tested C, the temperature control fluid recovery device 4 can still This effectively prevents the temperature control fluid from overflowing from the chip containing groove 21 . To put it another way, in order to completely avoid the temperature control fluid from splashing out from the chip accommodating tank 21, the temperature control fluid supply device 3 can also be paused when the electronic component C is tested, that is, before the electronic component C is picked up and placed. The temperature control fluid is supplied, and when the next electronic component C to be tested is placed in the chip receiving tank 21, the temperature control fluid supply device 3 is restarted to supply the temperature control fluid; however, in this embodiment, the temperature control fluid recovery device 4 The temperature-controlled fluid is still being pumped continuously.

The following describes the relevant data of the actual operation of this embodiment; without the test socket 2 (By-pass socket), the inlet temperature of the temperature control fluid in the chip holding tank 21 is 22.9°C, and the outlet temperature is 23.1°C. The temperature difference It is only 0.2°C, so the entire temperature control system takes away 2W of heat; the liquid pressure at the inlet of the chip holding tank 21 is 9kPa, and the liquid pressure at the outlet is -32kPa. When the test seat 2 is loaded and the temperature control fluid circulates at a flow rate of 0.17LPM, the inlet temperature of the temperature control fluid in the chip holding tank 21 is 23.1°C, the outlet temperature is 26.6°C, and the temperature difference is 3.5°C; therefore, during the loading test Seat 2, but there is no test load yet, the entire temperature control system takes away 7.8W of heat; the liquid pressure at the inlet of the chip holding tank 21 is 3kPa, and the liquid pressure at the outlet is -10kPa.

Please refer to Figure 4A, Figure 4B, Figure 5A and Figure 5B at the same time. These figures are respectively presented with two different test loads of 400W and 600W and three different traffic conditions of 0.1LPM, 0.2LPM and 0.25LPM. The relationship between time and the temperature difference between the inlet and outlet of the chip holding tank and the relationship between time and heat load. It can be seen from these figures that the smaller the flow rate, the greater the temperature difference, and the smaller the heat taken away by the system; taking a test load of 400W as an example, the flow rate of the temperature control fluid is 0.1LPM, and the temperature difference between the inlet and outlet is close to 8℃, but only takes away about 25W of heat; but if the flow rate of the temperature control fluid is increased to 0.25PM, the temperature difference between the inlet and outlet drops to about 6℃, but only takes away about 50W of heat. In fact, the greater the flow rate, the smaller the temperature difference between the inlet and outlet, and the more heat the system takes away, the more conducive it is to maintaining a constant temperature test environment.

Please refer to Figure 6, which is a schematic configuration diagram of another preferred embodiment of the temperature control system of the present invention; this embodiment is additionally equipped with a pressure measuring head PH, which is arranged above the test seat 2, and the pressure measuring head PH also includes a thermal control unit ( Thermal Control Unit) TCU, and the thermal control unit TCU can be a refrigeration device, an electric heating device, a heat exchanger with an internal temperature-controlled fluid circulation pipeline, or other equivalent devices that can heat or cool. When the electronic component C is to be tested, the pressure probe PH approaches the test seat 2 and presses against the electronic component C, and the thermal control unit TCU regulates the temperature of the electronic component C to a specific temperature, such as -40°C. On the other hand, the temperature of the temperature-controlled fluid circulating in the pipes in the test seat 2 and the flow-containing space LC is also set to the specific temperature, which is -40°C; accordingly, this embodiment will be able to achieve a completely constant temperature. The test environment maintains the electronic component C at a constant test temperature for testing, so accurate test results can be obtained.

Please refer to Figure 7A and Figure 7B at the same time. Figure 7A is a perspective view of the second embodiment of the test socket of the present invention. Figure 7B is a cross-sectional view of the second embodiment of the test socket of the present invention. The main difference between this embodiment and the previous embodiment is that this The temperature control fluid in the embodiment flows through the upper and lower surfaces of the electronic component C, which is sufficient to achieve full surface temperature control of the upper and lower surfaces of the electronic component C, allowing the electronic component C under test to be immersed in the environment of the temperature control fluid, and At the same time, it is combined with the pressure measuring head PH to achieve a constant temperature test environment, thereby achieving extremely excellent temperature control effect.

To further explain, the fluid inlet part 22 of the test seat 2 of this embodiment includes two upper fluid inlet grooves 224 and two lower fluid inlet grooves 225, and the fluid outlet part 23 also includes two upper fluid outlet grooves 234 and two lower fluid inlet grooves 234 and two lower fluid inlet grooves 225. Fluid outlet slot 235. When the electronic component C is accommodated in the chip accommodating groove 21 and the lower surface of the pressure probe PH presses against the semiconductor component Cd of the electronic component C, the lower surface of the pressure probe PH, the upper surface of the substrate Cs of the electronic component C and The peripheral sidewalls of the chip accommodating groove 21 define an upper flow-accommodating space LC1; the lower surface of the substrate Cs of the electronic component C, the peripheral sidewalls of the chip accommodating groove 21 and the bottom surface 210 of the chip accommodating groove 21 define a lower flow-accommodating space LC2. Two upper fluid inlet slots 224 and two upper fluid outlet slots 234 are disposed on two corresponding sides of the upper flow space LC1, that is, corresponding to the upper surface of the electronic component C; the two lower fluid inlet slots 225 and two The lower fluid outlet grooves 235 are disposed on two corresponding sides of the lower flow space LC2 of the electronic component C, that is, corresponding to the lower surface of the electronic component C.

Accordingly, when the temperature control fluid supply device 3 (not shown) supplies the temperature control fluid, it will be supplied to the upper flow space LC1 and the lower flow space respectively through the two upper fluid inlet grooves 224 and the two lower fluid inlet grooves 225 . The temperature control fluid flows through the upper surface and lower surface of the electronic component C and the chip receiving groove 21 in the upper flow space LC1 and the lower flow space LC2 respectively; then, the temperature control fluid flowing through the upper flow space LC1 The temperature control fluid is discharged from the upper fluid outlet slot 234, and the temperature control fluid flowing through the lower flow space LC2 is discharged from the lower fluid outlet slot 235. In this embodiment, the temperature control fluid is also continuously sucked from the upper fluid outlet groove 234 and the lower fluid outlet groove 235 through the temperature control fluid recovery device 4 (not shown in the figure) to form a forced circulation. In addition, this embodiment can also be configured with a cleaning gas supply device 5 (not shown in the figure) to allow the cleaning gas to forcibly drive away the temperature control fluid from the upper flow space LC1 and the lower flow space LC2.

In addition, it is worth mentioning that in this embodiment, the upper fluid outlet groove 234 is arranged slightly lower than the upper surface of the substrate Cs of the electronic component C in the height direction, while the lower fluid outlet groove 235 is slightly lower in the height direction. on the bottom surface 210 of the chip receiving groove 21; thereby, it will be more conducive for the temperature control fluid to be discharged from the upper surface of the electronic component C and the chip receiving groove 21, because even if there is temperature control fluid remaining on the upper surface of the electronic component C or the chip When the tank 21 is accommodated, the temperature-controlled fluid will naturally flow into the upper fluid outlet slot 234 and the lower fluid outlet slot 235 due to the influence of gravity and siphon effect.

It can be seen from the above that this embodiment is used with the pressure measuring head PH to construct an upper flow space LC1 and a lower flow space LC2, so that the temperature control fluid can flow in layers along the upper and lower surfaces of the electronic component C. The head PH is equipped with a thermal control unit (Thermal Control Unit) TCU, so it can achieve full surface temperature control of the upper and lower surfaces of the electronic component C to achieve extremely excellent temperature control effects.

Please refer to Figure 8A and Figure 8B at the same time. Figure 8A is a perspective view of the third embodiment of the test socket of the present invention. Figure 8B is a cross-sectional view of the third embodiment of the test socket of the present invention. The main difference between the third embodiment and the second embodiment is , this embodiment takes the form of a large fluid inlet slot and a large fluid outlet slot. To further explain, in this embodiment, the fluid inlet portion 22 includes two large fluid inlet grooves 226, and the fluid outlet portion 23 includes two large fluid outlet grooves 236; and each large fluid inlet groove 226 and each large fluid outlet groove The height h of 236 is greater than the thickness t of the electronic component C. In other words, in this embodiment, the openings of the large fluid inlet groove 226 and the large fluid outlet groove 236 cover the entire electronic component C in the thickness direction.

Simply put, in the first embodiment, the temperature control fluid only flows on the lower surface of the electronic component C; in the second embodiment, the temperature control fluid flows in layers on and below the upper and lower surfaces of the electronic component C. ; In this embodiment, clear upper and lower layered flow spaces are not defined, so the temperature control fluid will flow through the upper surface, lower surface and outer circumference of the electronic component C, whereby heat exchange can be performed. The surface area of electronic components will be significantly increased, which in turn can also improve heat exchange efficiency.

The above-mentioned embodiments are only examples for convenience of explanation. The scope of rights claimed by the present invention should be determined by the claims and not limited to the above-mentioned embodiments.

【Symbol Description】

2: Test seat

3: Temperature controlled fluid supply device

4: Temperature controlled fluid recovery device

5: Cleaning gas supply device

6: Controller

7: Filter module

8: Heat exchanger

9: Temperature controlled fluid tank

20: docking board

21: Chip receiving slot

22: Fluid inlet part

23: Fluid outlet part

24: Positioning film

25: Fluid inlet rack

26: Fluid outlet rack

30: Liquid gas solenoid valve

90: Fluid circulation channel

201: Fluid Inlet Channel

202: Fluid outlet channel

210: Bottom of groove

221: Fluid inlet slot

222: Groove bottom

223: First channel

224: Upper fluid inlet slot

225: Lower fluid inlet slot

226: Large fluid inlet slot

231: Fluid outlet slot

232: Groove bottom

233: Second channel

234: Upper fluid outlet slot

235: Lower fluid outlet slot

236: Large fluid outlet slot

301: Entry port

302: Exit port

C: Electronic components

Cs: substrate

Cd: semiconductor component

F1: The first flow meter

F2: Second flow meter

h: height

LC: flow capacity space

LC1: upper flow space

LC2: Downflow space

P1: First fluid pressure gauge

P2: Second fluid pressure gauge

P3: Third fluid pressure gauge

PH: pressure probe

t: thickness

TCU: Thermal Control Unit.

Claims

A temperature control system for electronic component testing equipment, which includes:

A test socket, which includes a chip containing groove, at least one fluid inlet part and at least one fluid outlet part; the at least one fluid inlet part and the at least one fluid outlet part are connected to the chip containing groove;

a temperature-controlled fluid supply device connected to the at least one fluid inlet of the test seat; and

a temperature-controlled fluid recovery device connected to the at least one fluid outlet of the test seat;

Wherein, when testing an electronic component, the electronic component is accommodated in the chip receiving slot of the test socket, and the temperature-controlled fluid supply device supplies temperature-controlled fluid to the chip receiving slot through the at least one fluid inlet portion, and the temperature-controlled fluid The recovery device draws the temperature control fluid from the chip containing slot of the test socket through the at least one fluid outlet.
The temperature control system according to claim 1, further comprising a controller electrically connected to the test seat, the temperature control fluid supply device and the temperature control fluid recovery device; wherein when testing the electronic component, the controller The temperature-controlled fluid supply device is controlled to supply the temperature-controlled fluid to the chip holding tank, and the temperature-controlled fluid recovery device is controlled to suck the temperature-controlled fluid from the chip holding tank of the test socket; when the test of the electronic component is completed Then, the controller controls the temperature-controlled fluid supply device to stop supplying the temperature-controlled fluid to the chip containing tank, and controls the temperature-controlled fluid recovery device to continue to suck the temperature-controlled fluid from the chip containing tank of the test seat.
The temperature control system according to claim 2, further comprising a purge gas supply device electrically connected to the controller and connected to the at least one fluid inlet of the test seat; after completing the test of the electronic component, the control The controller controls the temperature-controlled fluid supply device to stop supplying the temperature-controlled fluid to the chip accommodating tank, the controller controls the cleaning gas supply device to supply cleaning gas to the chip accommodating tank, and controls the temperature-controlled fluid recovery device to recover the temperature-controlled fluid from the test seat. The temperature control fluid is continuously pumped into the chip containing tank.
The temperature control system of claim 1, wherein the at least one fluid inlet portion includes at least one upper fluid inlet groove and at least one lower fluid inlet groove, and the at least one fluid outlet portion includes at least one upper fluid outlet groove and at least one Lower fluid outlet slot; when the electronic component is accommodated in the chip receiving slot, the at least one upper fluid inlet slot and the at least one upper fluid outlet slot correspond to the upper surface of the electronic component, and the at least one lower fluid inlet slot The at least one lower fluid outlet slot corresponds to the lower surface of the electronic component.
The temperature control system according to claim 4, further comprising a pressure measuring head; the electronic component includes a substrate and at least one semiconductor component, the at least one semiconductor component is arranged on the upper surface of the substrate; when testing the electronic component, the The lower surface of the pressure probe presses against at least one semiconductor component of the electronic component; the lower surface of the pressure probe, the upper surface of the substrate of the electronic component, and the surrounding side walls of the chip receiving groove define an upper flow space. ; The lower surface of the substrate of the electronic component, the surrounding side walls of the chip accommodating groove and the bottom surface of the groove define a lower flow space; the at least one upper fluid inlet groove and the at least one upper fluid outlet groove are arranged in the upper flow chamber The at least one lower fluid inlet slot and the at least one lower fluid outlet slot are disposed on two corresponding sides of the lower flow space of the electronic component.
The temperature control system according to claim 1, wherein the at least one fluid inlet portion includes at least one fluid inlet groove, the at least one fluid outlet portion includes at least one fluid outlet groove; the groove bottom surface of the at least one fluid inlet groove is in contact with the groove. The bottom surface of the chip accommodating groove is flush, and the groove bottom surface of the at least one fluid outlet groove is lower than the groove bottom surface of the chip accommodating groove in the thickness direction of the test seat.
A temperature control method for electronic component testing equipment, which at least regulates the temperature of the electronic component; the electronic component is accommodated in the chip receiving slot of the test seat; the temperature control method includes the following steps:

(A) The temperature-controlled fluid supply device supplies temperature-controlled fluid to the chip accommodating tank through the fluid inlet of the test socket;

(B) The temperature control fluid flows through at least part of the upper and lower surfaces of the electronic component; and

(C) The temperature control fluid is discharged from the fluid outlet of the test seat.
The temperature control method according to claim 7, wherein the fluid inlet portion includes at least one upper fluid inlet groove and at least one lower fluid inlet groove, and the fluid outlet portion includes at least one upper fluid outlet groove and at least one lower fluid outlet groove. ; In the step (A), the temperature-controlled fluid supply device supplies the temperature-controlled fluid to the chip accommodating tank through the at least one upper fluid inlet slot and the at least one lower fluid inlet slot; in the step (B) , the temperature control fluid flows out from the at least one upper fluid inlet slot and flows through the upper surface of the electronic component, and flows out from the at least one lower fluid inlet slot and flows through the lower surface of the electronic component; in step (C) , the temperature control fluid flowing through the upper surface of the electronic component is discharged from the at least one upper fluid outlet groove, and the temperature control fluid flowing through the lower surface of the electronic component is discharged from the at least one lower fluid outlet groove.
A temperature control method for electronic component testing equipment, which includes the following steps:

(A) The temperature-controlled fluid supply device supplies temperature-controlled fluid to the chip holding tank of the test socket; the chip holding tank contains electronic components, and the lower surface of the electronic component and the chip holding tank define a flow-containing space;

(B) The temperature-controlled fluid flows through the flow volume; and

(C) The temperature control fluid recovery device sucks the temperature control fluid from the chip containing tank.
The temperature control method according to claim 9, further comprising step (D) after step (C), the temperature control fluid supply device stops supplying the temperature control fluid to the chip accommodation tank, and the cleaning gas supply device supplies The gas is purged to the chip holding tank, and the temperature control fluid recovery device continues to suck the temperature control fluid from the chip holding tank.