CN218496970U - Temperature control fluid test seat and electronic element detection equipment with same - Google Patents
Temperature control fluid test seat and electronic element detection equipment with same Download PDFInfo
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- CN218496970U CN218496970U CN202221448706.0U CN202221448706U CN218496970U CN 218496970 U CN218496970 U CN 218496970U CN 202221448706 U CN202221448706 U CN 202221448706U CN 218496970 U CN218496970 U CN 218496970U
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Abstract
The utility model relates to a temperature control fluid test seat and an electronic element detection device with the test seat, wherein the test seat mainly comprises a chip holding tank, a fluid inlet part and a fluid outlet part; wherein the temperature control fluid can be introduced into the chip-containing groove through the fluid inlet portion and can be discharged from the chip-containing groove through the fluid outlet portion. Therefore, the temperature control fluid directly exchanges heat with all components including electronic elements and the like in the chip accommodating groove, so that the components can be heated or cooled and maintained at a specific temperature. In addition, because the temperature control fluid is introduced from the fluid inlet part and is discharged from the fluid outlet part after flowing in the chip accommodating groove, the foreign matters such as dust, debris, tin slag and the like in the chip accommodating groove can be discharged along with the temperature control fluid, and the influence of the foreign matters on the test can be avoided.
Description
Technical Field
The present invention relates to a temperature control fluid testing seat and an electronic device testing apparatus having the same, and more particularly to a testing seat and an electronic device testing apparatus using a temperature control fluid to control the temperature of an electronic device under test.
Background
A common temperature control system in the existing chip detection device is a mode of regulating and controlling the temperature of a chip by a pressure measuring head, that is, a temperature controller is arranged on the pressure measuring head, and the pressure measuring head contacts the chip to enable the temperature controller to heat or cool the chip; for example, taiwan patent publication No. I291564, "cold testing apparatus for IC testing classifier", sets a refrigeration chip on a pressure-bonding mechanism, and uses the refrigeration chip to cool an IC to be tested.
However, since the material of the IC itself has a thermal resistance relationship, the high temperature generated during the testing process of the IC will cause a temperature gradient in the thickness direction. Taking the low temperature test as an example, if the IC testing power is 1000W, and the temperature controller of the probe is set to the testing environment of-40 ℃, that is, the probe of-40 ℃ contacts the upper surface of the IC and cools it, however, the lower surface of the IC may only reach-5 ℃, which forms a considerable temperature difference, and thus the testing accuracy is easily affected.
On the other hand, there is also a means for regulating the temperature of the IC to be tested by using the test socket in the prior art, for example, taiwan patent publication No. I487923 "temperature control module of test socket" in taiwan patent application, which contains the test socket in the fluid chamber filled with the temperature control fluid, so that the test socket is always in a heated or cooled state, thereby the IC to be tested contained in the test socket is also maintained at the same temperature as the test socket. However, this method is ideal, but the thermal conductivity of the socket itself is rather low, and the contact area between the socket and the IC to be tested is limited, so that the waiting time for the IC to be tested to reach the predetermined temperature is long, which may affect the testing efficiency.
In addition, according to the current chip test specification, the test power of a chip with complex functions is often between 800W and 2600W. However, under such high power test conditions, if no good cooling means is provided, the solder ball is easily melted; once the solder ball is melted and stuck on the probe or the solder ball residue is scattered in the test socket, the test will fail, and the serious one will form a short circuit, resulting in the damage of the chip or even the device failure. Accordingly, cleaning within the test socket is also of paramount importance.
Therefore, the test socket and the electronic element detection equipment which can effectively regulate and control the temperature of the chip to be detected, the chip solder ball, the test socket and the probe in real time and can maintain the cleanness in the test socket in real time are greatly desired in the industry.
SUMMERY OF THE UTILITY MODEL
The main object of the present invention is to provide a temperature-controlled fluid testing seat and an electronic component testing apparatus having the same, which can regulate and control the temperature of all components in the testing seat, including the electronic component to be tested, thereby realizing a high-temperature or low-temperature constant-temperature testing environment; and can also remove the foreign matters in the test socket and maintain the cleanness of the test socket.
To achieve the above object, the present invention provides a temperature-controlled fluid testing seat, which mainly comprises a chip accommodating groove, a fluid inlet portion and a fluid outlet portion; the chip accommodating groove is used for accommodating the electronic element and is internally provided with at least one probe; the fluid inlet part is communicated to the chip accommodating groove and is used for allowing the temperature control fluid to enter the chip accommodating groove from the outside of the test seat; the fluid outlet is communicated with the chip accommodating groove and is used for allowing the temperature control fluid to flow out of the test seat from the chip accommodating groove; wherein the temperature control fluid is used for regulating or maintaining the temperature of at least one of the electronic element and the at least one probe.
In other words, the present invention can introduce the temperature control fluid into the chip accommodating groove through the fluid inlet portion, and the temperature control fluid directly exchanges heat with all components including electronic components in the chip accommodating groove, so as to heat up or cool down the components and maintain a specific temperature. In addition, because the temperature control fluid is introduced from the fluid inlet part and flows in the chip accommodating groove and then is discharged from the fluid outlet part, foreign matters such as dust, debris, tin slag and the like in the chip accommodating groove can be discharged along with the temperature control fluid, and the influence of the foreign matters on the test can be avoided.
Preferably, the fluid inlet portion may include a fluid inlet slot and a fluid inlet passage, and the fluid outlet portion may include a fluid outlet slot and a fluid outlet passage; one end of the fluid inlet channel is communicated with the fluid inlet groove, the other end of the fluid inlet channel is communicated with the outside of the test seat and is used for the temperature control fluid to flow in, and the fluid inlet groove is communicated with the chip accommodating groove; one end of the fluid discharge channel is communicated with the fluid outlet groove, the other end of the fluid discharge channel is communicated with the outside of the test seat and is used for the temperature control fluid to flow out, and the fluid outlet groove is communicated with the chip accommodating groove.
Moreover, the fluid inlet groove and the fluid outlet groove can be respectively arranged at the bottoms of two corresponding side walls of the chip accommodating groove; in addition, the bottom surface of the fluid inlet groove can be flush with the bottom surface of the chip accommodating groove; and the bottom surface of the fluid outlet groove may be lower than the bottom surface of the chip-accommodating groove in the thickness direction of the test socket. Therefore, the temperature control fluid can be discharged from the chip accommodating groove more conveniently, and can naturally flow into the fluid outlet groove due to the influence of the gravity and the siphon effect of the temperature control fluid even if the temperature control fluid is left in the chip accommodating groove. In addition, when the electronic element is accommodated in the chip accommodating groove, the lower surface of the electronic element and the chip accommodating groove jointly define a fluid space; the fluid inlet slot and the fluid outlet slot may correspond to two side end faces of the fluid space, respectively.
In addition, the temperature-controlled fluid testing seat of the present invention may further include a butt-joint plate assembly, which may include a fluid inlet channel and a fluid outlet channel, wherein one end of the fluid inlet channel is connected to the fluid inlet channel, and the other end is connected to the outside of the testing seat and allows the temperature-controlled fluid to flow in; one end of the fluid outlet channel is communicated with the fluid discharge channel, and the other end of the fluid outlet channel is communicated with the outside of the test seat and is used for the temperature control fluid to flow out. Therefore, when the process is changed, namely, the object to be tested is changed, only the test seat needs to be replaced, and the butt joint plate can be adapted to all the test seats, thereby being quite beneficial to the refitting and maintenance of equipment.
Furthermore, the butt plate component can comprise a positioning plate, a fluid inlet frame and a fluid outlet frame; the positioning plate group is arranged above the chip accommodating groove, the positioning plate can comprise a square frame opening, and the square frame opening can be over against the chip accommodating groove; the fluid inlet frame and the fluid outlet frame can be respectively arranged on two corresponding sides of the chip accommodating groove, and the fluid inlet channel and the fluid outlet channel are respectively arranged in the fluid inlet frame and the fluid outlet frame; in addition, two corresponding sides of the positioning plate can be respectively provided with positioning pins, are positioned at two sides of the square frame opening and protrude upwards, and can be used for aligning the pressure measuring head.
To achieve the above object, the present invention provides an electronic device testing apparatus, which mainly comprises the temperature-controlled fluid testing seat, the temperature-controlled fluid supply device and the controller described in the previous paragraphs; the temperature control fluid supply device is coupled to the fluid inlet portion of the temperature control fluid test seat, the controller is electrically connected to the temperature control fluid test seat and the temperature control fluid supply device, and the controller controls the temperature control fluid supply device to supply the temperature control fluid to the chip accommodating groove through the fluid inlet portion.
In other words, the electronic component detecting apparatus of the present invention can supply the temperature control fluid to the chip accommodating groove through the temperature control fluid supplying device, and the temperature control fluid can control the temperature of the electronic component, the solder ball, the test socket and the probe at the same time; for example, the components are cooled, so that the situation of tin ball melting caused by high temperature in the test process can be avoided; on the other hand, the temperature control fluid can be used for carrying out temperature regulation on the electronic element, and high-temperature or low-temperature test can be carried out.
In addition, the electronic component detection apparatus of the present invention may further include a temperature-controlled fluid recovery device, which may be coupled to the fluid outlet portion of the temperature-controlled fluid test socket and electrically connected to the controller; and the controller controls the temperature-controlled fluid recovery device to recover the temperature-controlled fluid from the chip accommodating groove through the fluid outlet portion. Therefore, the utility model discloses can still retrieve this temperature control fluid through the suction of temperature control fluid recovery unit to make the temperature control fluid force to flow, can effectively control the temperature of the temperature control fluid and the electronic component in the chip holding tank, in order to realize the constant temperature regulation and control.
Drawings
Fig. 1 is a perspective view of a first embodiment of a temperature controlled fluid test socket of the present invention;
FIG. 2 is an exploded view of a first embodiment of a temperature controlled fluid test socket of the present invention;
FIG. 3 is a cross-sectional view of a first embodiment of a temperature controlled fluid test socket of the present invention;
fig. 4 is a system architecture diagram of a preferred embodiment of the electronic component inspection apparatus of the present invention;
fig. 5 is a perspective view of a second embodiment of a temperature controlled fluid test socket according to the present invention;
figure 6 is a cross-sectional view of a second embodiment of a temperature controlled fluid test socket according to the present invention.
Detailed Description
Before the temperature-controlled fluid testing socket and the electronic component testing apparatus having the same are described in detail in this embodiment, it should be noted that similar components will be denoted by the same reference numerals in the following description. The drawings of the present invention are for illustrative purposes only and are not necessarily to scale, nor are all details thereof presented in the drawings.
Referring to fig. 1, 2 and 3, fig. 1 is a perspective view of a preferred embodiment of a temperature control fluid test socket of the present invention, fig. 2 is an exploded view of the preferred embodiment of the temperature control fluid test socket of the present invention, and fig. 3 is a cross-sectional view of the preferred embodiment of the temperature control fluid test socket of the present invention. As shown in the drawings, the temperature-controlled fluid testing socket 2 of the present embodiment mainly includes a body 20 and a docking plate assembly (docking plate) 6, wherein the body 20 further includes a chip accommodating cavity 3, a fluid inlet portion 4 and a fluid outlet portion 5; the chip accommodating groove 3 is used for accommodating the electronic component C, and the bottom surface 30 of the chip accommodating groove 3 is provided with a plurality of probes 31 for electrically contacting the solder ball contacts on the bottom surface of the electronic component C.
Furthermore, the fluid inlet portion 4 of the present embodiment includes two fluid inlet slots 41 and a fluid inlet channel 42, and one end of the fluid inlet channel 42 is connected to the two fluid inlet slots 41, and the other end is connected to the outside of the body 20 for the temperature control fluid to flow in. Similarly, the fluid outlet portion 5 includes two fluid outlet grooves 51 and a fluid discharge channel 52, one end of the fluid discharge channel 52 is connected to the two fluid outlet grooves 51, and the other end is connected to the outside of the body 20 for flowing out the temperature control fluid.
In addition, the two fluid inlet grooves 41 and the two fluid outlet grooves 51 of the present embodiment are respectively disposed at the bottom of the two corresponding sidewalls of the chip-accommodating groove 3 and are respectively communicated to the chip-accommodating groove 3. It should be noted that the number of the fluid inlet grooves 41 and the fluid outlet grooves 51 of the present invention is not limited to two, and may be one or more; the positions of the fluid inlet groove 41 and the fluid outlet groove 51 are not limited to the bottom of the side wall of the chip-housing groove 3, and may be set at any position on the bottom surface or the side wall of the chip-housing groove 3.
Referring to FIG. 3, in the present embodiment, the bottom surface 410 of the fluid inlet groove 41 is flush with the bottom surface 30 of the chip accommodating groove 3, and the bottom surface 510 of the fluid outlet groove 51 is lower than the bottom surface 30 of the chip accommodating groove 3 in the thickness direction of the temperature-controlled fluid test socket 2. Accordingly, by the gravity effect of the temperature control fluid and the siphon effect of the fluid outlet structure, the temperature control fluid can naturally flow into the fluid outlet groove 51, which is beneficial to discharging the temperature control fluid from the chip accommodating groove 3, thereby greatly reducing the situation that the temperature control fluid remains in the chip accommodating groove 3.
In addition, as shown in fig. 3, when the electronic component C is accommodated in the chip accommodating groove 3, the lower surface of the electronic component C and the chip accommodating groove 3 together define a fluid space SL, and the fluid inlet grooves 41 and the fluid outlet grooves 51 respectively correspond to two side end surfaces of the fluid space SL. In other words, the temperature control fluid enters from the fluid inlet slot 41 on one side end surface of the fluid space SL, flows across the entire lower surface of the electronic component C and all the probes 31, and is discharged from the fluid outlet slot 51 on the other side end surface of the fluid space SL.
Referring to fig. 1 to 3, the docking plate assembly 6 of the present embodiment includes a positioning plate 63, a fluid inlet frame 64, a fluid outlet frame 65, a fluid inlet channel 61 and a fluid outlet channel 62. The positioning plate 63 includes a frame opening 631 facing the chip accommodating groove 3, i.e. the frame opening 631 completely overlaps with the opening of the chip accommodating groove 3 in a top view. Furthermore, two corresponding sides of the positioning plate 63 are respectively provided with positioning pins 632, which are located at two sides of the square opening 631 and protrude upwards, and which can be aligned and engaged by a pressing head (not shown) above.
Referring to fig. 4, which is a system architecture diagram of the preferred embodiment of the electronic device testing apparatus of the present invention, the fluid inlet frame 64 and the fluid outlet frame 65 of the present embodiment are respectively disposed on two corresponding sides of the chip accommodating groove 3, and the fluid inlet channel 61 and the fluid outlet channel 62 are respectively disposed in the fluid inlet frame 64 and the fluid outlet frame 65.
One end of the fluid inlet channel 61 is connected to the fluid inlet channel 42 of the body 20, and the other end is connected to the temperature control fluid supply device 7 outside the body 20; similarly, one end of the fluid outlet passage 62 is communicated to the fluid discharge passage 52 of the body 20, and the other end is communicated to the temperature-controlled fluid recovery device 8 outside the body 20. The temperature-controlled fluid test socket 2, the temperature-controlled fluid supply device 7, and the temperature-controlled fluid recovery device 8 are electrically connected to the controller 1.
The operation principle of the present embodiment is described in detail below; first, after the electronic component C is placed in the chip accommodating groove 3 of the temperature-controlled fluid test socket 2, the controller 1 controls the temperature-controlled fluid supplier 7 to supply the temperature-controlled fluid to the fluid space SL through the fluid inlet passage 61, the fluid inlet passage 42 and the fluid inlet groove 41; on the other hand, the controller 1 controls the temperature-controlled fluid recovery device 8 to suck the temperature-controlled fluid from the fluid space SL through the fluid outlet duct 62, the fluid discharge duct 52, and the fluid outlet tank 51, and forcibly flow the temperature-controlled fluid.
In this embodiment, the temperature-controlled fluid supply device 7 may include a fluid tank and a pump (not shown), and the pump may draw the temperature-controlled fluid from the fluid tank and supply the temperature-controlled fluid to the fluid space SL. On the other hand, the temperature-controlled fluid recovery device 8 of the present embodiment employs a Diaphragm pump (Diaphragm pump) which has a good self-priming capability, and continuously sucks the temperature-controlled fluid and returns the temperature-controlled fluid to the temperature-controlled fluid supply device 7The fluid tank of (1). Additionally, the utility model discloses configuration filter equipment and heat exchange device etc. between temperature control fluid feeding device 7 and temperature control fluid recovery unit 8 can be seen as the condition, and filter equipment is arranged in filtering the foreign matter in the temperature control fluid, and heat exchange device then can be used to regulate and control the fluidic temperature of temperature control. However, the temperature control fluid of this embodiment is a non-conductive heat transfer liquid, such as 3M TM Novec TM An electronic engineering liquid.
Accordingly, the fluid space SL of the present embodiment is used as a holding space for the temperature control fluid, so that the temperature control fluid can flow through the lower surface (including the solder ball contacts) of the electronic component C and the bottom surface (including the probe) of the chip accommodating groove 3, and the electronic component C is immersed in the environment of the constantly flowing temperature control fluid, thereby providing an excellent temperature control effect, and further regulating or maintaining the temperature of the electronic component C and the probe 31. Meanwhile, the flowing temperature control fluid can also take away dust, melted tin ball fragments or other foreign matters, so that the influence of the foreign matters on the test, such as short circuit of a contact or a probe, can be avoided.
Referring to fig. 5 and fig. 6, fig. 5 is a perspective view of a second embodiment of the temperature control fluid test socket of the present invention, and fig. 6 is a cross-sectional view of the second embodiment of the temperature control fluid test socket of the present invention; the main difference between this embodiment and the previous embodiments is that the fluid inlet tank 41 and the fluid outlet tank 51 of this embodiment are both designed in layers. The fluid inlet tank 41 includes two upper inlet sub-tanks 411 and two lower inlet sub-tanks 412, and the fluid outlet tank 51 also includes two upper outlet sub-tanks 511 and two lower outlet sub-tanks 512.
As shown in fig. 6, after the electronic component C is placed in the chip accommodating groove 3, the pressure probe PH descends and presses against the electronic component C to ensure that the electronic component C electrically contacts all the probes 31; at this time, the upper fluid space SL1 and the lower fluid space SL2 are defined by the pressure probe PH, the electronic component C, and the chip housing tank 3, and are bounded by the substrate Cs of the electronic component C. In addition, two upper inlet subslots 411 and two upper outlet subslots 511 are located on two corresponding sides of the upper fluid space SL 1; two lower inlet subslots 412 and two lower outlet subslots 512 are located on two respective sides of the lower fluid space SL 2.
To sum up, according to the utility model discloses a second embodiment will make the temperature control fluid flow through electronic component C's upper and lower surface respectively by force to let the temperature control fluid that constantly flows carry out the heat exchange to chip surface C continuously, if the pressure gauge head PH of arranging again, alright realize the full surface temperature control of electronic component C's upper and lower surface, let the electronic component C in the test immerse in the constant temperature environment of temperature control fluid, in order to realize very excellent temperature control effect.
The above-described embodiments are merely exemplary for convenience of description, and the scope of the claims of the present invention should not be limited to the above-described embodiments.
[ description of symbols ]
1: controller
2: test seat
3: chip holding tank
4: fluid inlet portion
5: fluid outlet
6: butt joint plate assembly
7: temperature-controlled fluid supply device
8: temperature control fluid recovery device
20: noumenon
30: bottom surface of groove
31: probe needle
41: fluid inlet slot
42: fluid inlet channel
51: fluid outlet tank
52: fluid discharge channel
61: fluid inlet channel
62: fluid outlet channel
63: positioning plate
64: fluid inlet frame
65: fluid outlet frame
410: bottom surface of groove
411: upper inlet sub-groove
412: lower inlet sub-groove
510: bottom surface of groove
511: upper outlet sub-tank
512: lower outlet sub-groove
631: opening of square frame
632: locating pin
C: electronic component
Cs: substrate
SL: fluid space
SL1: upper fluid space
And (3) SL2: lower layer fluid room
pH: and (6) pressing the measuring head.
Claims (10)
1. A temperature-controlled fluid test socket, comprising:
a chip accommodating groove for accommodating an electronic component, wherein at least one probe is arranged in the chip accommodating groove;
the fluid inlet part is communicated with the chip accommodating groove and is used for allowing the temperature control fluid to enter the chip accommodating groove from the outside of the test seat; and
a fluid outlet part communicated with the chip accommodating groove and used for allowing the temperature control fluid to flow out of the test seat from the chip accommodating groove;
the temperature control fluid is used for regulating or maintaining the temperature of at least one of the electronic element and the at least one probe.
2. The temperature-controlled fluid test socket according to claim 1, wherein the fluid inlet portion comprises at least one fluid inlet slot and at least one fluid inlet passage, and the fluid outlet portion comprises at least one fluid outlet slot and at least one fluid outlet passage; one end of the at least one fluid inlet channel is communicated with the at least one fluid inlet groove, the other end of the at least one fluid inlet channel is communicated with the outside of the test seat and is used for the temperature control fluid to flow in, and the at least one fluid inlet groove is communicated with the chip accommodating groove; one end of the at least one fluid discharge channel is communicated with the at least one fluid outlet groove, the other end of the at least one fluid discharge channel is communicated with the outside of the test seat and is used for the temperature control fluid to flow out, and the at least one fluid outlet groove is communicated with the chip accommodating groove.
3. The temperature-controlled fluid test socket according to claim 2, wherein the at least one fluid inlet slot and the at least one fluid outlet slot are respectively disposed at the bottom of two corresponding sidewalls of the chip-receiving cavity.
4. The temperature-controlled fluid test socket according to claim 3, wherein the bottom surface of the at least one fluid inlet slot is flush with the bottom surface of the chip-receiving slot; the bottom surface of the at least one fluid outlet groove is lower than the bottom surface of the chip accommodating groove in the thickness direction of the test socket.
5. The temperature-controlled fluid testing socket according to claim 3, wherein when the electronic component is received in the chip-receiving cavity, the lower surface of the electronic component and the chip-receiving cavity together define a fluid space; the at least one fluid inlet slot and the at least one fluid outlet slot correspond to two lateral end faces of the fluid space, respectively.
6. The temperature-controlled fluid test socket according to claim 2, further comprising a docking plate assembly; the butt joint plate assembly comprises a fluid inlet channel and a fluid outlet channel, one end of the fluid inlet channel is communicated with the at least one fluid inlet channel, and the other end of the fluid inlet channel is communicated with the outside of the test seat and is used for the temperature control fluid to flow in; one end of the fluid outlet channel is communicated with the at least one fluid discharge channel, and the other end of the fluid outlet channel is communicated with the outside of the test seat and is used for the temperature control fluid to flow out.
7. The temperature controlled fluid test socket according to claim 6, wherein said docking plate assembly comprises a positioning plate, a fluid inlet housing and a fluid outlet housing; the positioning plate comprises a square frame opening, the positioning plate is assembled above the chip accommodating groove, and the square frame opening is opposite to the chip accommodating groove; the fluid inlet frame and the fluid outlet frame are respectively arranged on two corresponding sides of the chip accommodating groove, and the fluid inlet channel and the fluid outlet channel are respectively arranged in the fluid inlet frame and the fluid outlet frame.
8. The temperature controlled fluid test socket according to claim 7, wherein two corresponding sides of the positioning plate are each provided with a positioning pin and are located at two sides of the opening of the square frame and face upwards Fang Tushen.
9. An electronic component inspection apparatus, comprising:
the temperature controlled fluid test socket according to any one of claims 1 to 8;
a temperature-controlled fluid supply coupled to the fluid inlet portion of the temperature-controlled fluid test socket; and
a controller electrically connected to the temperature-controlled fluid test socket and the temperature-controlled fluid supply device;
wherein, the controller controls the temperature control fluid supply device to supply the temperature control fluid to the chip accommodating groove through the fluid inlet part.
10. The electronic component inspection apparatus of claim 9, further comprising a temperature-controlled fluid recovery device coupled to the fluid outlet portion of the temperature-controlled fluid test socket and electrically connected to the controller; the controller controls the temperature control fluid recovery device to recover the temperature control fluid from the chip accommodating groove through the fluid outlet part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221448706.0U CN218496970U (en) | 2022-06-10 | 2022-06-10 | Temperature control fluid test seat and electronic element detection equipment with same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221448706.0U CN218496970U (en) | 2022-06-10 | 2022-06-10 | Temperature control fluid test seat and electronic element detection equipment with same |
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| Publication Number | Publication Date |
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| CN218496970U true CN218496970U (en) | 2023-02-17 |
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| CN202221448706.0U Active CN218496970U (en) | 2022-06-10 | 2022-06-10 | Temperature control fluid test seat and electronic element detection equipment with same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117805566A (en) * | 2024-02-29 | 2024-04-02 | 深圳市新宇昇电子有限公司 | Electrical strength test equipment for insulating material |
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2022
- 2022-06-10 CN CN202221448706.0U patent/CN218496970U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117805566A (en) * | 2024-02-29 | 2024-04-02 | 深圳市新宇昇电子有限公司 | Electrical strength test equipment for insulating material |
| CN117805566B (en) * | 2024-02-29 | 2024-05-10 | 深圳市新宇昇电子有限公司 | Electrical strength test equipment for insulating material |
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