JPH08105938A - Ic test handler - Google Patents

Abstract

PURPOSE: To enable IC testing at different temperatures in a single IC test handler by providing soak chambers for preheating or precooling the sample IC at respective set temperatures before test chambers. CONSTITUTION: A soak chamber 11 is a constant temperature tank to heat or cool an IC 31 at a first temperature condition to be supplied to a test chamber 12, and a soak chamber 13 is a constant temperature tank to heat or cool the IC at a second temperature condition to be supplied to a test chamber 14. The IC 31 electrically tested in the test chamber 12 under the first temperature condition is supplied to the soak chamber 13. The IC 31 heated or cooled in the soak chamber 13 in the second temperature condition is carried to the test chamber 14, where it is electrically tested in the second temperature condition, and is carried to an unsoak chamber 15. Electric testing can thus be realized in the two temperature conditions by a single IC test handler.

Description

Detailed Description of the Invention

[0001]

The present invention relates to an IC test handler for testing a device under test under a plurality of temperature conditions.
The present invention relates to an IC test handler that enables various electrical tests of C.

[0002]

2. Description of the Related Art A temperature test of a conventional IC test handler will be described with reference to FIGS. As shown in FIG. 4, the configuration of the present apparatus is such that the tray 17, the soak chamber 51, the test chamber A12, the unsoak chamber 15, the test head A18, and the controller 1 are provided.
6 and the IC tester main body 20.

This apparatus conveys trays 17 in sequence and
Test head A18 connected to the C tester body 20
According to the above, various electric tests are performed on the IC 31 under a predetermined temperature condition. The tray 17 is conveyed in a sequential manner from the soak chamber 51 to the unsoak chamber 15. As the conveying means for the tray 17, a combination of a drive source such as a pulse motor and a servo motor, a belt, a gear, and a rotary screw mechanism is used. As shown in FIG. 3, the structure of the tray 17 has a pocket shape in which a plurality of ICs 31 are mounted on the tray 17, and a large number of ICs 31 are placed in each of the pockets and transported.

The soak chamber 51 is a constant temperature bath for heating / cooling the IC 31 placed on the tray 17 to a temperature for testing in the test chamber A12 by using a preheating means or a precooling means, for example, -30 degrees to +125 degrees. Here, a plurality of trays 17 are accommodated and the trays 1
The IC 31 mounted on the No. 7 is heated and cooled to a desired temperature and then supplied to the test chamber A12.

The test chamber A12 is an interface for connecting to the IC tester main body 20 to test the IC 31, and is a constant temperature bath having a small capacity heating / cooling means, and is set to the same temperature as the soak chamber A11. Then, the temperature state of the IC 31 is maintained. Soak chamber 51
After receiving the tray 17 from the
After carrying out various electrical tests using 18 as an interface, it is carried out to the unsaw chamber 15 side.

The unsaw chamber 15 is a constant temperature bath for receiving the IC 31 for which the test is completed and returning the temperature from the test temperature to room temperature, and prevents stress application to the IC due to a sudden temperature change, or prevents dew condensation. It is a unit to prevent. After bringing the temperature to room temperature, the IC 31 is carried out to the outside. The controller 16 controls the temperature of the soak chamber 51, the test chamber A12, the unsoak chamber 15, and the conveyance of the tray 17 as a whole. The test is performed at a predetermined temperature by sequentially performing these operations. However, in the conventional configuration, since the test can be performed only under one temperature condition, the IC31 can be tested under a plurality of temperature conditions.
In order to carry out the test described in (1), the tray 17 discharged from the unsaw chamber 15 is set to an IC with a different temperature setting.
Must be supplied to the test handler for testing.

[0007]

As described above, in the conventional configuration, the test can be conducted only under one temperature condition,
When the IC 31 is to be tested under a plurality of temperature conditions, it is necessary to install a plurality of IC test handlers, carry the trays after each temperature test to the next process and supply the trays for the test. . Therefore, there is an inconvenience that the number of steps for carrying the IC increases. Therefore, the problem to be solved by the present invention is to provide an IC test handler device capable of testing ICs at different temperatures with one IC test handler by providing means for setting the IC under test to a plurality of temperature conditions. The purpose is to

[0008]

FIG. 1 shows a first solution according to the present invention. In order to solve the above problems, in the configuration of the present invention, the IC to be tested is set in front of the test chamber for electrically testing the IC 31 to be tested with an individual temperature setting.
A soak chamber for preheating or precooling 31 is provided, and the soak chamber having the above-described configuration is a constituent means for providing at least two configurations. As a result, an IC test handler device for performing a temperature test by preheating or precooling the IC 31 under test under a plurality of temperature conditions is realized. As a specific configuration, a soak chamber B13 is provided which receives the IC 31 under test from the test chamber A12 and preheats or precools it at different temperatures and supplies it to the test chamber B14. This allows the soak chamber A11 and the test chamber A
12 and a test chamber B14,
An IC test handler device that preheats or precools 31 and performs a temperature test under a plurality of temperature conditions is realized.

FIG. 2 shows a second solution according to the present invention. In order to solve the above problems, in the configuration of the present invention, the IC under test 31 is tested under individual temperature conditions.
31 is provided with a test chamber for preheating or precooling and performing an electrical test, and at least 2
A constituent means for providing the structure is provided. This allows the IC under test to
First preheat or precool to 31 soak chamber A1
1 to realize an IC test handler device for performing a temperature test under a plurality of temperature conditions. As a specific configuration, the first test chamber A that receives an IC 31 under test from the soak chamber A11 and preheats or precools it to perform an electrical test.
12 is provided and receives the IC 31 to be tested from the first test chamber A12, and is provided with a second test chamber B14 for preheating or precooling at different temperatures to perform an electrical test. As a result, the IC test handler device having the soak chamber A11 for first preheating or precooling the IC 31 to be tested, preheating or precooling the IC 31 to be tested, and performing a temperature test under a plurality of temperature conditions is realized.

[0010]

In the first embodiment, two systems of soak chambers and test heads are provided, each of which is heated / cooled to a desired temperature condition and then subjected to an electrical test, so that an IC test can be performed under two temperature conditions. . In the second embodiment, the test of the IC can be executed under the two temperature conditions by providing the test heads of two systems and changing the temperature condition for the electrical test. In addition, the heating / cooling and electrical test configurations of Example 1 or Example 2 are
By providing the system, the temperature test can be executed under the temperature condition of N points.

[0011]

【Example】

(Embodiment 1) An embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, the configuration of this apparatus is as follows: a soak chamber A11, a test chamber A12, a soak chamber B13, a test chamber B14, an unsoak chamber 15, a controller 16, a tray 17, and a test head A18. And a test head B19 and an IC tester main body 20. In this configuration, the soak chamber A11, the test chamber A12, the unsaw chamber 15, the controller 16, and the test head A
The tray 18 and the tray 17 have the same configurations as those of the prior art. This apparatus has a structure in which two systems of temperature application units and test heads for electrical tests are provided to perform various electrical tests under two temperature conditions. Therefore, the IC tester main body 20 side also has the I
Two systems of a test head A18 and a test head B19 are prepared corresponding to the C test handler.

Soak chamber A11 and soak chamber B
13 is the same as the conventional soak chamber 51. The soak chamber A11 is a constant temperature bath that heats and cools the IC 31 under the first temperature condition and then supplies the IC 31 to the test chamber A12. The soak chamber B13 is IC under the second temperature condition.
It is a constant temperature bath for supplying 31 to the test chamber B14 after heating and cooling 31. The test chamber B14 is the same as the test chamber A12 and is a test chamber for testing the IC 31 under the second temperature condition.
It is adjusted to the temperature of 13. The test head B19 is similar to the test head A18, and the test chamber B14
Corresponding to the above, it is interfaced and various electrical tests are carried out.

Test chamber A12 and test chamber B
Reference numeral 14 is a constant temperature bath similar to the conventional test chamber and having a small capacity heating / cooling means. Test chamber A
Reference numeral 12 is a constant temperature bath for conducting an electrical test under the same first temperature condition as the soak chamber A11.
Reference numeral 14 is a constant temperature bath for conducting an electrical test under the same second temperature condition as the soak chamber B13.

The IC 31 electrically tested under the first temperature condition in the test chamber A12 is supplied to the soak chamber B13. The IC 31 heated and cooled in the soak chamber B13 to the second temperature condition is tested by the test chamber B14.
Then, after being electrically tested under the second temperature condition, it is transported to the unsaw chamber 15. As a result, one IC test handler can realize an electrical test under two temperature conditions.

(Embodiment 2) An embodiment of the present invention will be described with reference to FIG. This device has a soak chamber A11.
, Test chamber A12, and test chamber B14
An unsoak chamber 15, a controller 16,
Tray 17, test head A18, test head B
19 and an IC tester main body 20. This configuration is a configuration in which the soak chamber B13 of the first embodiment is deleted. This case is an example of a configuration applicable when the temperature difference between the first temperature condition and the second temperature condition applied to the IC 31 is small, and the test chamber B14 uses the small capacity heating / cooling means. B14
IC31 in the chamber after being transported to
This is a case where the electric test is performed by heating and cooling under the temperature condition of. As a result, the IC test under the two temperature conditions can be performed by one IC test handler. This allows
It can be effectively used in a test form in which the throughput of the IC test is not relatively required.

In the second embodiment described above, the test chamber B14 having a small capacity heating / cooling means is used. However, the test chamber B14 has the same function as the soak chamber A11 and has a large capacity heating / cooling means. The test chamber for accommodating the tray 17 may be used, and it can be carried out under an arbitrary temperature condition as in the case of the first embodiment.

In the first and second embodiments described above, the case of the two-stage configuration in which two temperature conditions can be tested has been described, but it is also possible to have an N-stage configuration in the same manner, and the same implementation is possible.

[0018]

Since the present invention is configured as described above, it has the following effects. In the case of the first embodiment, the electric test can be performed after having two soak chambers and heating / cooling to desired temperature conditions, respectively, and the IC test under the two temperature conditions can be performed by one IC test handler. The effect that can be obtained is obtained. The case of the second embodiment is applicable when the temperature difference between the first temperature condition and the second temperature condition applied to the IC 31 is small, and the second temperature condition is satisfied by the small capacity heating / cooling means included in the test chamber B14. By heating / cooling and conducting an electric test, an effect that an IC test under two temperature conditions can be carried out by one IC test handler is obtained. Further, by providing N systems as in the first or second embodiment, N
The effect that the temperature test can be carried out under the temperature condition of the point is obtained.

[0019]

[Brief description of drawings]

FIG. 1 is a configuration diagram of an IC test handler including two soak chambers and two test chambers according to the present invention.

FIG. 2 is a configuration diagram of an IC test handler including one soak chamber and two test chambers according to the present invention.

FIG. 3 is a top view of a tray for carrying an IC 31 according to the present invention.

FIG. 4 is a configuration diagram of an IC test handler of a conventional technique.

[Explanation of symbols]

 11 Soak Chamber A 12 Test Chamber A 13 Soak Chamber B 14 Test Chamber B 15 Unsaw Chamber 16 Controller 17 Tray 18 Test Head A 19 Test Head B 20 IC Tester Main Body 51 Soak Chamber 31 IC

─────────────────────────────────────────────────── ───Continued from the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 21/66 G 7735-4M

Claims (4)

[Claims] 1. An IC test handler device for preheating or precooling an IC (31) to be tested under a plurality of temperature conditions, wherein individual temperature settings are made in front of a test chamber for electrically testing the IC (31) to be tested. The IC test handler is characterized in that a soak chamber for preheating or precooling the IC under test (31) is provided, and at least two soak chambers having the above-mentioned configuration are provided. 2. A soak chamber A (11), a test chamber A (12), and a test chamber B (14) are provided to preheat or precool an IC (31) to be tested under a plurality of temperature conditions. In the IC test handler device for the temperature test, the IC under test (3) from the test chamber A (12) is tested.
The soak chamber B which receives 1) and is preheated or precooled at different temperatures to be supplied to the test chamber B (14).
An IC test handler including (13) and having the above. 3. An IC test handler device for performing a first preheating or precooling of an IC under test (31) in a soak chamber A (11) and performing a temperature test under a plurality of temperature conditions. An IC test handler characterized in that a test chamber for preheating or precooling under individual temperature conditions for electrical testing is provided, and at least two test chambers having the above configuration are provided. 4. An IC (31) to be tested is provided with a soak chamber A (11) for first preheating or precooling, and the IC (31) to be tested is preheated or precooled to perform a temperature test under a plurality of temperature conditions. In the IC test handler device that operates, the IC under test (3) from the soak chamber A (11) is
In response to 1), a first test chamber A (12) for preheating or precooling and performing an electric test is provided, and the IC to be tested from the first test chamber A (12) is provided.
In response to (31), a second test chamber B (14) for preheating or precooling at different temperatures to carry out an electrical test is provided, and the IC test handler is provided with the above.