TW201634941A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

Provided is an electronic component conveyance device that makes it possible to prevent the occurrence of condensation on an electronic component after inspection thereof while limiting increases in costs. Also provided is an electronic component inspection device. An inspection device 1 is provided with: a tray 200 on which it is possible to place an IC device after inspection thereof; and heating units 4a, 4b that are provided so as to be separated from the tray 200 and that heat the IC device 90 placed on the tray 200. In addition, the heat emission direction of each of the heating units 4a, 4b can be changed.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection apparatus for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) component has been known, and an electronic component inspection apparatus is incorporated to hold the IC component to the inspection section. Electronic parts transfer device. When the IC component is inspected, the IC component is placed in the holding portion, and a plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device to be inspected. At this time, the inspection is performed in a state where the IC element is cooled. Moreover, the IC component after the inspection is completed by the component holding device (for example, refer to Patent Document 1).

In the electronic component inspection device described in Patent Document 1, a heater is built in the component holding device, and the IC element in the cooled state after the inspection is heated. Thereby, when the IC element is taken out of the apparatus, dew condensation is suppressed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-228206

However, in the electronic component inspection device described in Patent Document 1, it is necessary to incorporate a heater for each of the component holding devices. Therefore, there is a cost increase.

It is an object of the present invention to provide an increase in cost and prevention of inspection The electronic parts conveying device and the electronic component inspection device for dew condensation after the electronic parts are produced.

This object is achieved by the present invention described below.

[Application Example 1]

An electronic component transporting apparatus according to the present invention includes: a mounting portion for mounting an electronic component; and a heating portion spaced apart from the mounting portion to perform the electronic component placed on the mounting portion heating.

For example, when the inspection is performed in an environment where the temperature is lower than the normal temperature, the electronic component placed on the mounting portion is in a low temperature state lower than the normal temperature. When the electronic component in the low temperature state is taken out from the electronic component conveying device, condensation may occur in the electronic component. According to the invention, since the electronic component in the low temperature state is heated by the heating unit, the temperature at which the electronic component is taken out from the electronic component conveying device can be set to a temperature higher than the low temperature state. Thereby, it is possible to prevent or suppress condensation from occurring in the electronic component. Moreover, it is possible to omit the provision of the heating portion for each of the placing portions as before, and accordingly, it is possible to suppress an increase in cost.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component is subjected to a specific inspection.

Thereby, it is possible to prevent or suppress condensation on the electronic component after the inspection.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit can blow air in the direction of the electronic component.

Thereby, the heating unit can heat the electronic component even if it is away from the mounting portion. Thereby, it is possible to prevent the heating unit from interfering with the operation of transporting the electronic component to the transport unit of the mounting unit, for example.

[Application Example 4]

In the electronic component conveying device of the present invention, the wind-driven warm air is preferable.

Thereby, the heating unit can heat the electronic component even if it is away from the mounting portion.

[Application 5]

In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit has a light-emitting portion that can illuminate light in a direction of the electronic component.

Thereby, the heating unit can heat the electronic component even if it is away from the mounting portion. Thereby, it is possible to prevent the heating unit from interfering with the operation of transporting the electronic component to the transport unit of the mounting unit, for example.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, preferably, in the heating unit, the direction in which the wind or the light is sent out can be changed.

Thereby, the electronic component can be heated without depending on the position at which the mounting portion of the electronic component is placed.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component is disposed at a position different from each other in the mounting portion based on the result, and the heating portion is at least the same. The above electronic parts are heated.

Thereby, for example, an electronic component that can be used as a product can be heated while avoiding heating of an electronic component that cannot be used as a product. Thereby, it is possible to focus on heating the electronic component that can be used as a product. As a result, it is possible to prevent an increase in power consumption.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, preferably, the mounting portion is configured to arrange a plurality of the electronic components in plural, and the heating portion is provided for each unit time of the electronic component to be placed after the mounting. The heat is heated in such a manner as to impart heat per unit time of the above-mentioned electronic component placed first.

The time during which the electronic component placed on the mounting portion is heated is relatively long, and the time during which the electronic component placed on the mounting portion is heated is relatively short. Therefore, there is a tendency that the electronic component placed on the mounting portion is excessively heated, and the heating of the electronic component placed on the mounting portion is insufficient. According to the application example, since the heating is performed so that the heating rate of the electronic component placed on the rear side is increased, the phenomenon as described above can be prevented or suppressed. Thereby, the electronic component can be heated appropriately.

[Application Example 9]

In the electronic component conveying apparatus of the present invention, preferably, the first chamber having the heating unit and the second chamber different from the first chamber are provided; and after being heated by the heating unit for a specific period of time, the mounting is performed The part is discharged from the first chamber to the second chamber.

Thereby, it is possible to prevent the electronic component from being excessively heated.

[Application Example 10]

In the electronic component conveying apparatus of the present invention, it is preferable that the first chamber having the heating unit and the second chamber different from the first chamber are provided, and the mounting portion is moved to the mounting portion based on the electronic component. In the conveyance state, the movement start period from the first chamber to the second chamber is adjusted.

Thereby, the heating time of the electronic component can be extended as much as possible. Thereby, the heating of the electronic component can be sufficiently performed.

[Application Example 11]

An electronic component inspection device according to the present invention includes: an inspection unit that inspects an electronic component; a mounting portion that mounts an electronic component; and a heating portion that is spaced apart from the mounting portion and placed on the mounting portion Above the above placement The electronic parts are heated.

For example, when the inspection is performed in an environment where the temperature is lower than the normal temperature, the electronic component placed on the mounting portion is in a low temperature state lower than the normal temperature. When the electronic component in the low temperature state is taken out from the electronic component inspection device, condensation may occur in the electronic component. According to the invention, since the electronic component in the low temperature state is heated by the heating portion, the temperature at which the electronic component is taken out from the electronic component inspection device can be set to a temperature at a low temperature state. Thereby, it is possible to prevent or suppress condensation from occurring in the electronic component. Moreover, it is possible to omit the provision of the heating portion for each of the placing portions as before, and accordingly, it is possible to suppress an increase in cost.

1‧‧‧Checking device

1A‧‧‧Inspection device

1B‧‧‧Inspection device

3‧‧‧Management unit

4a‧‧‧Heating Department

4b‧‧‧heating department

4c‧‧‧heating department

4d‧‧‧heating department

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature Adjustment Department

13‧‧‧Component transport head

14‧‧‧Component Supply Department

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Component head

18‧‧‧Component Recycling Department

19‧‧‧Recycling tray

20‧‧‧Component head

21‧‧‧Tray transport mechanism

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

31‧‧‧ Temperature Regulation Department

32‧‧‧ Humidity Control Department

41‧‧‧heating body

42‧‧‧fan

43‧‧‧Support components

44‧‧‧Spinning Support

51‧‧‧Baffle

52‧‧‧Baffle

53‧‧‧Baffle

54‧‧‧Baffle

61‧‧‧1st dividing wall

62‧‧‧2nd dividing wall

63‧‧‧3rd dividing wall

64‧‧‧4th dividing wall

65‧‧‧5th dividing wall

66‧‧‧Inside partition wall

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧back cover

75‧‧‧4th door

80‧‧‧Control Department

81‧‧‧Drive Control Department

82‧‧‧Check Control Department

83‧‧‧Memory Department

90‧‧‧IC components

200‧‧‧Tray

200a‧‧‧Tray

200b‧‧‧Tray

200c‧‧‧Tray

641‧‧‧ openings

642‧‧‧ openings

643‧‧‧ openings

644‧‧‧ openings

700‧‧‧ openings

701‧‧‧1st opening and closing

702‧‧‧2nd opening and closing

703‧‧‧1st detection department

704‧‧‧2nd Inspection Department

705‧‧‧Spinning Support

706‧‧‧Spinning Support

707‧‧‧1st door

708‧‧‧2nd door

711‧‧‧1st door

712‧‧‧2nd door

721‧‧‧1st door

722‧‧‧2nd door

731‧‧‧1st door

732‧‧‧2nd door

733‧‧‧3rd door

A‧‧‧ arrow

A1‧‧‧Tray supply area

A2‧‧‧Component supply area

A3‧‧‧ inspection area

A4‧‧‧Component recycling area

A5‧‧‧Tray removal area

L‧‧‧Light

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

Room 4, R4‧‧

S101~S108‧‧‧Steps

W‧‧‧ warm air

X‧‧‧ axis

Y‧‧‧ axis

Z‧‧‧ axis

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1.

Fig. 3 is a view for explaining a heating unit included in the electronic component inspection device shown in Fig. 1;

Fig. 4 is a view as seen from the direction of arrow A in Fig. 3.

Fig. 5 is a view for explaining a second opening and closing door.

Fig. 6 is a flow chart for explaining the control operation of the electronic component inspection device shown in Fig. 1.

Fig. 7 is a view for explaining a heating unit included in a second embodiment of the electronic component inspection device of the present invention.

(a) to (c) of FIG. 8 are views for explaining a second opening and closing door provided in the third embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1. Fig. 3 is a view for explaining a heating unit included in the electronic component inspection device shown in Fig. 1; Fig. 4 is a view as seen from the direction of arrow A in Fig. 3. Fig. 5 is a view for explaining a second opening and closing door. Fig. 6 is a flow chart for explaining the control operation of the electronic component inspection device shown in Fig. 1.

In the following, for convenience of explanation, as shown in FIGS. 1, 3, and 4 (the same applies to FIGS. 7 and 8), the three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the "level" mentioned in the present specification is not limited to the complete level, and includes a state of being slightly inclined (for example, less than 5 degrees) with respect to the horizontal level as long as the electronic component is not hindered from being transported.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used for an IC component such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, and an LCD. A device for inspecting and testing (hereinafter referred to as "inspection") for electrical characteristics of electronic components such as (Liquid Crystal Display) and CIS (CMOS Image Sensor). In the following, for the sake of convenience of explanation, the case where the IC component is used as the electronic component to be inspected is typically described, and this is referred to as "IC component 90".

As shown in Fig. 1, the inspection apparatus 1 is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a component collection area (hereinafter simply referred to as "recovery area") A4. And the tray removal area A5. Further, the IC element 90 is inspected from the tray supply area A1 to the tray removal area A5 in order through the above-described respective areas in the inspection area A3 in the middle. In this way, the inspection apparatus 1 is an electronic component transport apparatus that transports the IC component 90 in each area, and an inspection unit that performs inspection in the inspection area A3. 16. And the control unit 80. In the inspection apparatus 1, the supply area A2 to the collection area A4 from the conveyance IC element 90 from the tray supply area A1 to the tray removal area A5 can also be referred to as a "transport area (transport area)".

In addition, the inspection apparatus 1 is provided with the tray supply area A1, the side of the tray removal area A5 (the lower side in FIG. 1) as the front side, and the opposite side, that is, the side of the inspection area A3 (the one in FIG. 1). The upper side is used as the back side.

The tray supply area A1 is supplied with a supply unit of a tray (mounting unit) 200 in which a plurality of IC elements 90 in an unchecked state are arranged. A plurality of trays 200 can be stacked in the tray supply area A1.

The supply area A2 supplies a plurality of IC elements 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

A temperature adjustment unit (soak plate) 12, a component transfer head 13, and a tray conveyance mechanism (first conveyance device) 15 are provided in the supply area A2.

The temperature adjustment unit 12 is provided with a mounting portion on which a plurality of IC elements 90 are placed, and the plurality of IC elements 90 can be heated or cooled. Thereby, the IC element 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 1, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Further, the IC component 90 on the tray 200 carried in (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any of the temperature adjustment units 12.

The component transfer head 13 is movably supported in the supply area A2. Thereby, the component transfer head 13 can carry the IC component 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC component 90 between the temperature adjustment unit 12 and the component supply unit 14 described below. Transfer.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all the IC elements 90 have been removed in the X direction in the supply region A2. Moreover, after the transfer, the empty tray The disk 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

The inspection area A3 is an area where the IC element 90 is inspected. In the inspection area A3, a component supply unit (supply shuttle) 14, an inspection unit 16, a component transfer head 17, and a component collection unit (recycling shuttle) 18 are provided.

The component supply unit 14 is provided with a mounting portion of the IC element 90 on which the temperature is adjusted, and the IC device 90 can be transported to the vicinity of the inspection unit 16 . The component supply unit 14 is supported to be movable in the X direction between the supply region A2 and the inspection region A3. Further, in the configuration shown in FIG. 1, the component supply unit 14 is disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is carried on any of the component supply units 14.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC component 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC component 90 in a state in which the IC component 90 is held. Further, the terminal of the IC component 90 is electrically connected (contacted) to the probe pin, and the IC component 90 is inspected via the probe pin. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC element 90 can be heated or cooled to adjust the IC element 90 to a temperature suitable for inspection.

The component transfer head 17 is movably supported in the inspection area A3. Thereby, the element transfer head 17 can transport the IC element 90 on the component supply unit 14 carried in from the supply area A2 to the inspection unit 16 to be placed thereon.

The component recovery unit 18 is configured to mount the IC component 90 placed on the mounting portion 16 after the inspection of the inspection unit 16 is completed, and the IC component 90 can be transported to the recovery area A4. The component recovery unit 18 is supported to be movable in the X direction between the inspection region A3 and the recovery region A4. In the configuration shown in FIG. 1, the component recovery unit 18 is similar to the component supply unit 14, and is disposed in the Y direction. The IC component 90 on the inspection unit 16 is transported to any component recovery unit 18. Uploaded. This transfer is performed by the component transfer head 17.

Recycling area (1st room) A4 is a zone of a plurality of IC components 90 after the end of the recycling inspection area. In the collection area A4, a collection tray 19, a component transfer head 20, and a tray conveyance mechanism (second conveyance means) 21 are provided. Further, an empty tray 200 is also prepared in the collection area A4.

The recovery tray 19 is provided with a mounting portion on which the IC element 90 is placed, and is fixed in the recovery area A4. In the configuration shown in FIG. 1, three are arranged in the X direction. Further, the empty tray 200 is also provided with a mounting portion on which the IC component 90 is placed, and three are arranged in the X direction. Further, the IC component 90 on the component recovery unit 18 that has moved to the recovery area A4 is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC component 90 is recovered and classified for each inspection result.

When the three trays 200 are the trays 200a, 200b, and 200c from the left side in FIG. 1, the IC component 90 whose inspection result is "good" is placed on the tray 200a. Moreover, the IC component 90 whose inspection result is "re-inspection product" is placed on the tray 200b. Then, the IC component 90 whose inspection result is "defective product" is placed on the tray 200c.

As described above, in the inspection apparatus 1, the IC element 90 is given a level according to the inspection result, and is disposed separately from the trays 200a to 200c which are different from each other.

The component transfer head 20 is movably supported in the recovery area A4. Thereby, the element transfer head 20 can transport the IC element 90 from the element collection part 18 to the collection tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction in the collection area A4. Further, after the transfer, the empty tray 200 is placed at a position where the IC element 90 is to be collected, that is, it may become one of the above three empty trays 200. As described above, in the inspection apparatus 1, the tray conveyance mechanism 21 is provided in the collection area A4, and the tray conveyance mechanism 15 is provided in the supply area A2. By this, it is possible to improve the throughput (the number of transports of the IC elements 90 per unit time) in comparison with the transport of the empty tray 200 in the X direction by one transport mechanism.

Further, the configuration of the tray transport mechanisms 15 and 21 is not particularly limited, and for example, a configuration including an adsorption member having the adsorption tray 200 and supporting the adsorption can be cited. A support mechanism such as a ball screw that allows the member to move in the X direction.

The tray removing area A5 collects and removes the removing portion of the tray 200 in which the plurality of IC elements 90 in the inspection state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

Further, the tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC component 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC component 90 from the tray removal area A5 to the collection area A4.

In the inspection apparatus 1 as described above, the component transfer head 13, the component supply unit 14, and the component transfer head 17 are configured to be capable of heating or cooling the IC component 90 in addition to the temperature adjustment unit 12 or the inspection unit 16. Thereby, the IC element 90 is maintained at a constant temperature during the conveyance period. Next, a case where the IC element 90 is cooled and inspected in a low temperature environment within a range of, for example, -60 ° C to -40 ° C will be described below.

As shown in Fig. 1, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (separated) by the first partition wall 61, and the second partition wall is provided between the supply area A2 and the inspection area A3. 62 is spaced apart, and the inspection area A3 and the recovery area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. Further, the supply region A2 and the recovery region A4 are also separated by the fifth partition wall 65. The partition walls have a function of maintaining airtightness of the respective regions. Further, the inspection apparatus 1 covers the outermost layer with a cover, and the cover has, for example, a front cover 70, side covers 71 and 72, and a rear cover 73.

Further, the supply region A2 is the first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. In the first chamber R1, a plurality of IC elements 90 in an unchecked state are carried in together with the tray 200.

The inspection area A3 is the second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. Further, in the second chamber R2, the inner side is disposed on the inner side of the rear cover 73. Next door 66.

The collection area A4 is a third chamber (first chamber) R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. In the third chamber R3, a plurality of IC elements 90 after the inspection is completed are carried in from the second chamber R2.

The tray removal area A5 is a fourth chamber (second chamber) R4 defined by the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the front cover 70. In the fourth chamber R4, a plurality of IC elements 90 after completion of the inspection are carried in together with the tray 200 from the third chamber R3.

Further, in the fourth chamber R4, four trays 200 can be arranged in the X direction. On the far left side of FIG. 1 among these, an empty tray 200 is disposed. The empty tray 200 is transported into the third chamber R3 by the tray transport mechanism 22B. Moreover, the trays 200a to 200c conveyed from the third chamber R3 are disposed on the right side of the empty tray 200.

Further, the fourth partition wall 64 is provided with four openings 641, 642, 643 and 644 which penetrate the thickness direction. The openings 641 to 644 are arranged in order from the left side in FIG. The opening 641 is a portion through which the empty tray 200 passes from the fourth chamber R4 toward the third chamber R3. The opening 642 is a portion through which the tray 200a passes from the third chamber toward the fourth chamber R4. The opening 643 is a portion through which the tray 200b passes from the third chamber R3 toward the fourth chamber R4. The opening 644 is a portion through which the tray 200c passes from the third chamber R3 toward the fourth chamber R4.

Further, a baffle 51 is provided in the opening 641, a baffle 52 is provided in the opening 642, a baffle 53 is provided in the opening 643, and a baffle 54 is provided in the opening 644. The baffles (first doors) 51 to 54 are opened and closed independently in the vertical direction (Z direction), and the openings 641 to 644 are independently opened and closed. The baffles 51-54 are electrically connected to the control unit 80, respectively, and the actuation thereof is controlled. Thereby, the flaps 51 to 54 can be switched between the flow state in which the air can flow between the third chamber R3 and the fourth chamber R4, and the non-circulation state in which the air flow is less than the flow state. Therefore, it is possible to set the flow state only when necessary, and to set it to the non-flow state at other times. Therefore, the temperature and humidity change of the fourth chamber R4 can be suppressed as much as possible.

As shown in FIG. 1, the side cover 71 is provided with a first door (left side first door) 711 and a second door (left side). Side 2nd door) 712. By opening the first door 711 or the second door 712, for example, the maintenance in the first chamber R1 or the release of the jam of the IC device 90 can be performed (hereinafter, these are collectively referred to as "jobs"). Further, the first door 711 and the second door 712 are so-called "left and right facing doors" that open and close in opposite directions. Further, during the operation in the first chamber R1, the movable portion such as the component transfer head 13 in the first chamber R1 is stopped.

Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 or the second door 722, for example, the work in the third chamber R3 can be performed. Further, the first door 721 and the second door 722 are also so-called "left and right facing doors" that open and close in opposite directions. Further, during the operation in the third chamber R3, the movable portion such as the component transfer head 20 in the third chamber R3 is stopped.

Further, the rear cover 73 is also provided with a first door (back side first door) 731, a second door (back side second door) 732, and a third door (back side third door) 733. By opening the first door 731, for example, the work in the first chamber R1 can be performed. By opening the third door 733, for example, the work in the third chamber R3 can be performed. Further, a fourth door 75 is provided on the inner partition wall 66. Further, by opening the second door 732 and the fourth door 75, for example, the work in the second chamber R2 can be performed. Further, the first door 731, the second door 732, and the fourth door 75 are opened and closed in the same direction, and the third door 733 is opened and closed in a direction opposite to the doors. Further, during the operation in the second chamber R2, the movable portion such as the component transfer head 17 in the second chamber R2 is stopped.

Further, as shown in FIGS. 1 and 5, the first opening and closing door 701 and the second opening and closing door 702 are provided in the opening 700 of the front cover 70. The first door 701 is provided to be rotatable by a rotation support portion 705 provided at an edge portion of the negative side of the opening portion 700 in the X direction. Further, the second door 702 is provided to be rotatable by a rotation support portion 706 provided at an edge portion of the opening portion 700 on the positive side in the X direction. The first opening/closing door 701 and the second opening/closing door 702 are so-called "left and right facing doors" that open and close in opposite directions.

By opening the first opening and closing door 701, for example, the empty tray 200 and the tray 200a can be replenished or taken out. Further, by opening the second opening and closing door 702, for example, a tray can be performed. Take out the 200b and the tray 200c.

As shown in FIG. 2, the control unit 80 includes a drive control unit 81, an inspection control unit 82, and a storage unit 83.

The drive control unit 81 controls the tray conveyance mechanisms 11A and 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray conveyance mechanism 15, the inspection unit 16, the component transfer head 17, the component collection unit 18, and the component transfer head 20. The drive of each of the tray transport mechanism 21 and the tray transport mechanisms 22A and 22B.

The inspection control unit 82 performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 16 based on the program stored in the storage unit 83.

The memory unit 83 is a volatile memory such as a RAM (Random Access Memory), a nonvolatile memory such as a ROM (Read Only Memory), or an EPROM (Erasable Programmable Read Only Memory). Erasable programmable read-only memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), flash memory, etc. can be overwritten (can be erased, overwritten It is composed of various semiconductor memories (IC memories) such as non-volatile memory.

As shown in FIG. 1, FIG. 3 and FIG. 4, a pair of heating parts 4a and heating parts 4b are provided in the surface of the 5th partition wall 65 of the 3rd chamber R3 on the positive side of the X direction. The heating portions 4a and 4b are arranged in order from the positive side in the Y direction and are arranged to be spaced apart from each other. Further, as shown in FIG. 3, the heights of the heating portions 4a and 4b, that is, the positions in the Z direction are the same.

Since each of the heating portions 4a and 4b has substantially the same configuration, the heating unit 4b will be representatively described below.

The heating unit 4b includes a heating element 41 and a fan 42 that blows air (hereinafter referred to as "warm air W") that is heated by the heating element 41. The heating portion 4b is fixed to the fifth partition wall 65 by a pair of support members 43. Further, the pair of support members 43 have a rotation support portion 44, and the heating portion 4b is rotatably supported and fixed. Therefore, the heating portion 4b can adjust the blowing warm air W direction. That is, the heat supply direction of the heating unit 4b is variable.

As shown in Fig. 3, in the inspection apparatus 1, the heating unit 4b is slightly inclined downward, and faces the trays 200a, 200b, and 200c. Thereby, the warm air W can be blown toward the IC element 90 placed on the trays 200a to 200c. Thereby, the cooled IC element 90 after the inspection can be heated. Therefore, it is possible to prevent the IC element 90 from being discharged to the outside of the apparatus while being cooled. As a result, it is possible to prevent the droplets generated when the cooled IC element 90 is directly discharged to the outside of the inspection apparatus 1 from adhering to the IC element 90, that is, dew condensation.

In particular, in the inspection apparatus 1, since the heating units 4a and 4b are disposed at positions spaced apart from the trays 200a to 200c, it is possible to prevent the operation of the element transfer head 20 from transporting the IC elements 90 to the trays 200a to 200c. Thereby, it is possible to prevent a decrease in productivity and prevent dew condensation from occurring in the IC element 90.

Further, it is possible to omit the provision of the heating portion in each of the mounting portions on which the IC element 90 is placed as described above, and accordingly, it is possible to suppress an increase in cost.

As shown in Fig. 3, the heating portions 4a and 4b face the trays 200a on the sides of the heating portions 4a and 4b among the trays 200a to 200c. Therefore, the warm air W sent from the heating portions 4a, 4b first reaches the IC component 90 of the tray 200a. Then, the warm air W reaching the tray 200a flows directly to the positive side in the X direction, and sequentially reaches the IC component 90 of the tray 200b and the tray 200c.

As described above, the IC component 90 whose inspection result is "good" is placed on the tray 200a, and the IC component 90 whose inspection result is "re-inspection product" is placed on the tray 200b, and the inspection result is "defective product" placed on the tray 200c. IC component 90. Therefore, the heating portions 4a and 4b can be heated in order from the IC element 90 having a higher level of inspection results, that is, preferentially. In this way, it is possible to focus on heating the "good product". Further, since the "defective product" is directly discarded, dew condensation may occur even if the heating is insufficient. Therefore, it is possible to prevent the power consumption of the heating units 4a and 4b from increasing by heating the "good product" and the "re-inspection product".

Here, as shown in FIG. 4, the IC elements 90 are arranged in a matrix on the tray 200a (the same applies to the trays 200b and 200c). At this time, in the inspection apparatus 1, the IC component 90 As shown by the arrows in FIG. 4, a plurality of (three in the present embodiment) are arranged from the upper right in FIG. 4 toward the left side in FIG. 4, and then placed on the lower side of the line from the right side to the left side. . By repeating such placement, the IC elements 90 are placed in a matrix on the tray 200a.

According to such a mounting method, the IC element 90 on the lower side in FIG. 4 disposed later is shorter in heating time by the heating portions 4a and 4b than the IC element 90 on the upper side in FIG. Therefore, there is a tendency that the IC element 90 on the upper side in FIG. 4 which is disposed first is excessively heated according to the inspection condition, and the heating of the IC element 90 on the lower side in FIG. 4 which is disposed later is insufficient. Therefore, in the inspection apparatus 1, the warm air W of the heating unit 4b is configured to have a higher temperature of the warm air W blown by the heating unit 4a. Thereby, the amount of heat per unit time given to the IC element 90 to be rearranged can be made higher than the amount of heat per unit time given to the previously disposed IC element 90. Thereby, it is possible to prevent the IC element 90 disposed first from being excessively heated, and it is possible to sufficiently heat the IC element 90 disposed rearward. Therefore, in the inspection apparatus 1, the IC element 90 can be heated appropriately.

Further, the IC component 90 is previously moved to the fourth chamber R4 immediately after being placed in the tray 200a until the lower left corner of FIG. 4 is reached, that is, after the storage limit of the tray 200a is reached. On the other hand, in the inspection apparatus 1, even if the tray 200a reaches the storage limit, it is restricted to move to the fourth chamber R4 until the tray 200a has to be replaced in order to mount the next IC element 90. Thereby, the heating time of the IC component 90 placed on the tray 200a can be extended as much as possible. Thereby, dew condensation can be prevented from being generated in the IC element 90 more reliably.

As described above, in the inspection apparatus 1, the movement start timing from the third chamber R3 to the fourth chamber R4 is adjusted in accordance with the conveyance state of the IC component 90 to the tray 200a.

In addition, the inspection apparatus 1 is configured such that the measurement time is started after the first IC element 90 is placed on the tray 200a (the same applies to the trays 200b and 200c), and when the measurement time exceeds the threshold value, the tray 200a is moved from the third chamber. R3 moves to the fourth room R4. Thereby, it is possible to prevent the IC element 90 from being excessively heated.

Next, the fourth chamber R4 will be described.

As shown in FIGS. 1 and 2, a management unit 3 having a temperature adjustment unit 31 and a humidity adjustment unit 32 is provided in the fourth chamber R4, and the temperature and humidity in the fourth chamber R4 are managed.

The temperature adjustment unit 31 has a function of adjusting the temperature in the fourth chamber R4, and is controlled by the control unit 80. The humidity adjusting unit 32 has a function of adjusting the humidity in the fourth chamber R4, and is controlled by the control unit 80.

In the inspection apparatus 1, the temperature in the fourth chamber R4 is maintained at about 10 to 35 ° C by the temperature adjustment unit 31, and the humidity in the fourth chamber R4 is maintained at 0 to 20% by the humidity adjustment unit 32. . In the fourth chamber R4 of the environment, by holding the trays 200a to 200c on which the IC device 90 is placed for a predetermined period of time, the IC element 90 in the cooled state after the inspection can be sufficiently immersed in an environment where condensation does not easily occur. Ground heating. Thereby, when the IC element 90 is taken out from the fourth chamber R4 to the outside, dew condensation can be prevented from occurring in the IC element 90.

By the fourth chamber R4, it is possible to mutually complement the heating of the IC element 90 with the above-described heating portions 4a and 4b, and it is possible to more reliably prevent or suppress dew condensation of the IC element 90.

In addition, the "specific time" is a value obtained by experimentally obtaining the time when the IC device 90 stays in the fourth chamber R4 and is taken out from the fourth chamber R4 before the inspection. Further, in the above experiment, it is preferable to carry out the heating by the heating portions 4a and 4b. Thereby, condensation can be prevented or suppressed from being generated in the IC element 90.

In the inspection apparatus 1, for example, when the trays 200a to 200c are sequentially moved from the third chamber to the fourth chamber R4, the tray 200c is moved to the fourth chamber R4, and the measurement of the residence time is started. Thereby, it is possible to prevent dew condensation from occurring in the IC element 90 of the tray 200c which is finally moved.

Further, in the inspection apparatus 1, the movement of the trays 200a to 200c from the third chamber R3 to the fourth chamber R4 is performed after the temperature and humidity in the fourth chamber R4 become within the above numerical range. In other words, when the temperature and humidity in the fourth chamber R4 are outside the above numerical range, the movement of the trays 200a to 200c from the third chamber R3 to the fourth chamber R4 is restricted. Thus, the preparation of the IC component 90 is not easy to produce. After the environment of condensation, the trays 200a to 200c are moved to the fourth chamber R4, whereby condensation on the IC element 90 in the fourth chamber R4 can be prevented or suppressed.

Further, the air pressure in the fourth chamber R4 is equal to or higher than the atmospheric pressure, and is equal to or lower than the air pressure in the third chamber R3. With this configuration, for example, when the shutters 51 to 54 are opened and the third chamber R3 is in communication with the fourth chamber R4, even if the first opening/closing door 701 or the second opening/closing door 702 is opened, external air can be made difficult. Enter into the inspection device 1.

The method of controlling the gas pressure of the fourth chamber R4 is not particularly limited, and examples thereof include introduction of an external gas using a pump, or a method of supplying a gas by a fan, or a method of supplying a gas by connection with a gas storage tank or the like.

Moreover, when the take-out tray 200 is placed, either one of the first opening/closing door 701 and the second opening/closing door 702 is opened, and the work can be performed. By doing this, one of the first opening/closing door 701 and the second opening/closing door 702 that is close to the portion where the tray 200 is to be taken in and taken out is opened, whereby external air can be prevented from entering the fourth place as much as possible. Room R4 comes inside.

Further, the first opening and closing door 701 and the second opening and closing door 702 are freely rotatable, and the degree of opening and closing can be adjusted. Therefore, when the loading and unloading of the tray 200 is performed, the opening degree of the first opening/closing door 701 or the second opening/closing door can be minimized, and the entry of the outside air into the fourth chamber R4 can be suppressed as much as possible.

Further, the front cover 70 is provided with a first detecting unit 703 that detects opening and closing of the first opening and closing door 701, and a second detecting unit 704 that detects opening and closing of the second opening and closing door. Each of the first detecting unit 703 and the second detecting unit 704 is configured by, for example, a magnetic sensor, and is electrically connected to the control unit 80.

The first detecting unit 703 and the second detecting unit 704 can detect opening and closing of the first opening and closing door 701 and the second opening and closing door 702. When the first opening/closing door 701 and the second opening/closing door 702 are in an open state at a certain time in the inspection apparatus 1, the state in which the open state is increased can be reported to the operator by a reporting mechanism (not shown). . As described above, in the inspection apparatus 1, since the opening and closing of the first opening/closing door 701 and the second opening/closing door 702 are managed by time, it is possible to do so. It is possible to suppress the entry of outside air into the fourth chamber R4.

As described above, in the inspection apparatus 1, the IC element 90 after inspection is heated once by the heating portions 4a and 4b, and heated twice in the fourth chamber R4. Therefore, it is possible to effectively prevent or suppress dew condensation of the IC element 90 after being taken out from the inspection apparatus 1.

Next, the control operation of the inspection apparatus 1 will be described using the flowchart shown in FIG. 6.

First, the inspection of the IC component 90 is started (step S101).

The IC element 90 that has been inspected in order through the tray supply area A1, the supply area A2, and the inspection area A3 is placed in any of the trays 200a to 200c of the collection area A4.

Then, by the operation of the heating portions 4a, 4b, the IC element 90 is heated (step S102).

At this time, a timer (not shown) is actuated simultaneously with the start of heating of the heating units 4a and 4b (step S103).

Then, in step S104, it is determined whether or not the predetermined time has been reached. When it is determined in step S104 that the predetermined time has elapsed, it is considered that the heating of the IC element 90 is sufficient, and the IC element 90 is discharged together with the trays 200a to 200c to the tray removal area A5 (step S105).

After the discharge of the trays 200a to 200c is completed, that is, the trays 200a to 200c are stored in the tray removal area A5, a timer (not shown) is actuated (step S106).

Then, in step S107, it is determined whether or not the predetermined time has been reached. When it is determined in step S107 that the predetermined time has elapsed, it is considered that the heating of the IC element 90 is sufficient, and it is reported that the IC element 90 is taken out from the tray removal area A5 (step S108).

As described above, according to the inspection apparatus 1, since the electronic component in the low temperature state is heated by the heating unit, the temperature at which the electronic component is taken out from the electronic component conveying device can be set to a temperature at a low temperature state. Thereby, it is possible to prevent or suppress condensation from occurring in the electronic component.

<Second embodiment>

Figure 7 is a view for explaining the second embodiment of the electronic component inspection device of the present invention; A diagram of the heating section.

In the following, the second embodiment of the electronic component transporting apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings, and the differences from the above-described embodiments will be mainly described, and the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the configuration of the heating unit is different.

As shown in FIG. 7, in the inspection apparatus 1A, the heating unit 4c and the heating unit 4d are configured by a light source that irradiates the light to the IC element 90 placed on the trays 200a to 200c and heats the IC element 90. The light L is not particularly limited as long as it can heat the IC device 90, and for example, infrared rays (far infrared rays) or the like can be used.

According to the heating portions 4c and 4d, the air blowing can be omitted as in the first embodiment. Thereby, it is possible to prevent the IC element 90 from flying or being displaced due to the wind pressure, for example, when heating the IC element 90 having a small mass.

<Third embodiment>

(a) to (c) of FIG. 8 are views for explaining a second opening and closing door provided in the third embodiment of the electronic component inspection device of the present invention.

In the following, the third embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings, and the differences from the above-described embodiments will be mainly described, and the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the configuration of the second opening/closing door is different.

As shown in FIGS. 8(a) to 8(c), in the inspection device 1B, the first opening/closing door 707 and the second opening and closing door 708 are provided in the opening portion 700 of the front cover 70. The first opening/closing door 707 and the second opening and closing door 708 are slidable on a rail portion (not shown) that extends in the X direction. The first opening/closing door 707 and the second opening/closing door 702 are arranged to be shifted from each other in the Y direction. The first opening and closing door 707 is located on the front side (Y-axis negative side), and the second opening/closing door 708 is located on the back side (Y-axis positive side).

In the closed state shown in FIG. 8(a), the first opening and closing door 707 blocks the left side of the opening 700, and the second opening and closing door 708 blocks the right side of the opening 700. In the closed state, for example, when the tray 200 is taken out, as shown in FIG. 8(b), the first opening/closing door 707 is moved to the right side (sliding), and the first opening and closing door 707 is opened. Thereby, the tray 200 can be taken out. In particular, by opening the first opening/closing door 707 only to the extent necessary for taking out the tray 200, it is possible to suppress the outside air from flowing into the fourth chamber R4 as much as possible.

Further, from the state shown in Fig. 8(a), for example, when the tray 200c is taken out, as shown in Fig. 8(c), the second door 708 is moved (slid) to the left side, and the second door 708 is opened. Thereby, the tray 200c can be taken out. In particular, it is possible to suppress the inflow of the outside air into the fourth chamber R4 as much as possible, in the same manner as described above, by the extent that the second door 708 is only required to open the take-out tray 200c.

In the above, the electronic component transport apparatus and the electronic component inspection apparatus of the present invention have been described with respect to the embodiments. However, the present invention is not limited thereto, and the components constituting the electronic component transport apparatus and the electronic component inspection apparatus can be utilized. Any component of the same function is replaced. Further, any constituent may be added.

Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be formed by combining any two or more of the above-described configurations (features).

Further, in each of the above embodiments, the second chamber is detected and the manager is both temperature and humidity. However, the present invention is not limited thereto, and even if it is one of temperature and humidity, it can be prevented or Suppresses condensation on electronic parts.

Further, in each of the above embodiments, two heating units are provided. However, the present invention is not limited thereto, and may be, for example, one or three or more.

1‧‧‧Checking device

3‧‧‧Management unit

4a‧‧‧Heating Department

4b‧‧‧heating department

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature Adjustment Department

13‧‧‧Component transport head

14‧‧‧Component Supply Department

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Component head

18‧‧‧Component Recycling Department

19‧‧‧Recycling tray

20‧‧‧Component head

21‧‧‧Tray transport mechanism

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

31‧‧‧ Temperature Regulation Department

32‧‧‧ Humidity Control Department

51‧‧‧Baffle

52‧‧‧Baffle

53‧‧‧Baffle

54‧‧‧Baffle

61‧‧‧1st dividing wall

62‧‧‧2nd dividing wall

63‧‧‧3rd dividing wall

64‧‧‧4th dividing wall

65‧‧‧5th dividing wall

66‧‧‧Inside partition wall

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧back cover

75‧‧‧4th door

80‧‧‧Control Department

90‧‧‧IC components

200‧‧‧Tray

200a‧‧‧Tray

200b‧‧‧Tray

200c‧‧‧Tray

641‧‧‧ openings

642‧‧‧ openings

643‧‧‧ openings

644‧‧‧ openings

700‧‧‧ openings

701‧‧‧1st opening and closing

702‧‧‧2nd opening and closing

711‧‧‧1st door

712‧‧‧2nd door

721‧‧‧1st door

722‧‧‧2nd door

731‧‧‧1st door

732‧‧‧2nd door

733‧‧‧3rd door

A1‧‧‧Tray supply area

A2‧‧‧Component supply area

A3‧‧‧ inspection area

A4‧‧‧Component recycling area

A5‧‧‧Tray removal area

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

Room 4, R4‧‧

X‧‧‧ axis

Y‧‧‧ axis

Z‧‧‧ axis

Claims (11)

An electronic component transporting apparatus comprising: a mounting portion for mounting an electronic component; and a heating portion spaced apart from the mounting portion to heat the electronic component placed on the mounting portion . The electronic component transporting apparatus of claim 1, wherein the electronic component is subjected to a specific inspection. The electronic component transport apparatus of claim 1 or 2, wherein the heating unit is capable of blowing air in the direction of the electronic component. The electronic component transporting device of claim 3, wherein the wind is hot air. The electronic component transport apparatus according to claim 1 or 2, wherein the heating unit has a light-emitting portion that can illuminate light in a direction of the electronic component. The electronic component conveying apparatus according to any one of claims 3 to 5, wherein, in the heating unit, the direction in which the wind or the light is sent out can be changed. The electronic component conveying apparatus according to any one of claims 1 to 6, wherein the electronic component is provided in a position different from each other in the mounting portion based on the result, and the heating portion is at least The above electronic parts having the higher order are heated. The electronic component transporting apparatus according to any one of claims 1 to 7, wherein the mounting portion is configured to divide a plurality of the electronic components into a plurality of times, and the heating portion is provided for each unit of the electronic component to be placed after the mounting. The heat of time is heated in such a manner as to impart heat per unit time of the above-mentioned electronic component placed first. The electronic component conveying apparatus according to any one of claims 1 to 8, comprising a first chamber in which the heating unit is disposed, and a second chamber different from the first chamber; After being heated by the heating unit for a predetermined period of time, the mounting portion is discharged from the first chamber to the second chamber. The electronic component conveying apparatus according to any one of claims 1 to 9, comprising: a first chamber in which the heating unit is disposed; and a second chamber different from the first chamber; and the mounting portion is based on the electronic component The movement from the first chamber to the second chamber is adjusted from the first chamber to the second storage chamber. An electronic component inspection apparatus comprising: an inspection unit that inspects an electronic component; a mounting portion that mounts an electronic component; and a heating portion that is spaced apart from the mounting portion and placed on the mounting portion The electronic component of the mounting portion is heated.