JP2016188782A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device that can suppress increase of cost and can prevent moisture condensation on an electronic component having been inspected.SOLUTION: An inspection device 1 includes: a tray 200 on which an inspected IC device is to be placed; and heating units 4a and 4b separate from the tray 200 for heating the IC device 90 on the tray 200. The heating units 4a and 4b send heat into a freely changeable direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting an IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with each terminal of the IC device to perform the inspection. At this time, the inspection is performed with the IC device cooled. The IC device that has been inspected is held by a component holding device (see, for example, Patent Document 1).

  In the electronic component inspection apparatus described in Patent Document 1, a heater is built in the component holding device, and the IC device in a cooled state after the inspection is heated. Thereby, it is suppressed that dew condensation occurs when the IC device is taken out of the apparatus.

JP 2001-228206 A

  However, in the electronic component inspection apparatus described in Patent Document 1, it is necessary to incorporate a heater for each component holding device. For this reason, we are anxious about an increase in cost.

  The objective of this invention is providing the electronic component conveying apparatus and electronic component inspection apparatus which can prevent that dew condensation arises in the electronic component after test | inspection, suppressing the increase in cost.

Such an object is achieved by the present invention described below.
[Application Example 1]
The electronic component transport device of the present invention includes a placement unit on which an electronic component is placed;
A heating unit that is provided apart from the mounting unit and that heats the electronic component mounted on the mounting unit.

  For example, when an inspection is performed in an environment where the temperature is lower than normal temperature, the electronic component placed on the placement unit is in a low temperature state lower than normal temperature. When the electronic device in the low temperature state is taken out from the electronic component transport apparatus, condensation may occur on the electronic device. According to the present invention, since the electronic component in a low temperature state is heated by the heating unit, the temperature when the electronic component is taken out from the electronic component transport apparatus can be set higher than that in the low temperature state. Therefore, it is possible to prevent or suppress the occurrence of condensation on the electronic component. In addition, it is possible to omit providing a heating unit for each placement unit as in the past, and it is possible to suppress an increase in cost accordingly.

[Application Example 2]
In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component is a device after a predetermined inspection is performed.
Thereby, it can prevent or suppress that dew condensation arises in the electronic component after an inspection.

[Application Example 3]
In the electronic component transport device of the present invention, it is preferable that the heating unit can send wind in the direction of the electronic component.

  Thereby, the heating unit can heat the electronic component even from a position away from the placement unit. Therefore, it can prevent that a heating part inhibits the action | operation of the conveyance part which conveys an electronic component to a mounting part, for example.

[Application Example 4]
In the electronic component conveying apparatus of the present invention, it is preferable that the wind is hot air.
Thereby, the heating unit can heat the electronic component even from a position away from the placement unit.

[Application Example 5]
In the electronic component transport device of the present invention, it is preferable that the heating unit has a light emitting unit capable of irradiating light in the direction of the electronic component.

  Thereby, the heating unit can heat the electronic component even from a position away from the placement unit. Therefore, it can prevent that a heating part inhibits the action | operation of the conveyance part which conveys an electronic component to a mounting part, for example.

[Application Example 6]
In the electronic component transport device according to the aspect of the invention, it is preferable that the heating unit can change a sending direction of the wind or the light.

  Thereby, an electronic component can be heated irrespective of the position of the mounting part in which the electronic component was mounted.

[Application Example 7]
In the electronic component transport device of the present invention, the electronic components are ranked based on the results, and are arranged separately at different positions in the placement unit,
It is preferable that the heating unit heats the electronic component having at least the higher rank.

  Thereby, for example, an electronic component that can be used as a product can be heated, and heating of an electronic component that cannot be used as a product can be avoided. Therefore, an electronic device that can be used as a product can be intensively heated. As a result, it is possible to prevent the power consumption from increasing.

[Application Example 8]
In the electronic component transport device of the present invention, the placement unit is arranged in a plurality of the electronic components divided into a plurality of times,
The heating unit heats so that the amount of heat per unit time applied to the electronic component placed later is larger than the amount of heat per unit time applied to the electronic component placed earlier. Is preferred.

  The electronic component previously placed on the placement portion is heated for a relatively long time, and the electronic component placed later on the placement portion is heated for a relatively short time. For this reason, the electronic component previously placed on the placement portion is excessively heated, and the electronic component subsequently placed on the placement portion tends to be insufficiently heated. According to this application example, “the heating is performed so as to increase the heating rate for the electronic component placed later”, and thus the above-described phenomenon can be prevented or suppressed. Therefore, the electronic component can be heated without excess or deficiency.

[Application Example 9]
In the electronic component conveying apparatus of the present invention, the electronic component conveying apparatus includes a first chamber in which the heating unit is disposed, and a second chamber different from the first chamber,
After the heating unit is heated for a predetermined time, the mounting unit is preferably discharged from the first chamber to the second chamber.
Thereby, it can prevent that an electronic component is heated too much.

[Application Example 10]
In the electronic component conveying apparatus of the present invention, the electronic component conveying apparatus includes a first chamber in which the heating unit is disposed, and a second chamber different from the first chamber,
It is preferable that the placement section is adjusted to start moving from the first chamber to the second chamber in accordance with the state of conveyance of the electronic component to the placement section.

  Thereby, the heating time of an electronic component can be made as long as possible. Therefore, the electronic component can be sufficiently heated.

[Application Example 11]
The electronic component inspection apparatus of the present invention includes an inspection unit for inspecting an electronic component,
A placement section on which electronic components are placed;
A heating unit that is provided apart from the mounting unit and that heats the electronic component mounted on the mounting unit.

  For example, when an inspection is performed in an environment where the temperature is lower than normal temperature, the electronic component placed on the placement unit is in a low temperature state lower than normal temperature. When the electronic device in the low temperature state is taken out from the electronic component inspection apparatus, condensation may occur in the electronic device. According to the present invention, since the electronic component in the low temperature state is heated by the heating unit, the temperature when the electronic component is taken out from the electronic component inspection apparatus can be set higher than the low temperature state. Therefore, it is possible to prevent or suppress the occurrence of condensation on the electronic component. In addition, it is possible to omit providing a heating unit for each placement unit as in the past, and it is possible to suppress an increase in cost accordingly.

FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 3 is a view for explaining a heating unit provided in the electronic component inspection apparatus shown in FIG. 1. 4 is a view as seen from the direction of arrow A in FIG. FIG. 5 is a diagram for explaining the second opening / closing door. FIG. 6 is a flowchart for explaining the control operation of the electronic component inspection apparatus shown in FIG. FIG. 7 is a view for explaining a heating unit provided in the second embodiment of the electronic component inspection apparatus of the present invention. FIG. 8: is a figure for demonstrating the 2nd opening / closing door with which 3rd Embodiment of the electronic component inspection apparatus of this invention is equipped with (a)-(c).

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 3 is a view for explaining a heating unit provided in the electronic component inspection apparatus shown in FIG. 1. 4 is a view as seen from the direction of arrow A in FIG. FIG. 5 is a diagram for explaining the second opening / closing door. FIG. 6 is a flowchart for explaining the control operation of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIGS. 1, 3, and 4 (the same applies to FIGS. 7 and 8), three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance apparatus that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 80. In the inspection apparatus 1, from the tray supply area A1 to the tray removal area A5, the area from the supply area A2 to which the IC device 90 is conveyed to the collection area A4 can also be referred to as a “conveyance area (conveyance area)”.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are disposed (the lower side in FIG. 1) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is disposed (see FIG. 1). 1 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (mounting unit) 200 in which a plurality of uninspected IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

  The device supply unit 14 is a mounting unit on which the temperature-adjusted IC device 90 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. .

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and can transport the IC device 90 to the collection region A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, like the device supply unit 14, and the IC device 90 on the inspection unit 16 is connected to any one of the device collection units 18. Transported and placed. This transport is performed by the device transport head 17.

  The collection area (first chamber) A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  When the three trays 200 are the trays 200a, 200b, and 200c from the left side in FIG. 1, the IC device 90 whose inspection result is “non-defective” is placed on the tray 200a. Further, the IC device 90 whose inspection result is “re-inspection product” is placed on the tray 200b. Then, the IC device 90 whose inspection result is “defective” is placed on the tray 200c.

  Thus, in the inspection apparatus 1, the IC devices 90 are ranked according to the inspection result, and are arranged separately on the different trays 200a to 200c.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The configurations of the tray transport mechanisms 15 and 21 are not particularly limited. For example, the tray transport mechanisms 15 and 21 include a suction member that sucks the tray 200 and a support mechanism such as a ball screw that supports the suction member so as to be movable in the X direction. Is mentioned.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant while being transported. In the following, the case where the IC device 90 is cooled and inspected in a low temperature environment within a range of, for example, −60 ° C. to −40 ° C. will be described.

  As shown in FIG. 1, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by a first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Further, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, side covers 71 and 72, and a rear cover 73.

  The supply area A2 is a first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

  The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. In the second chamber R2, an inner partition 66 is disposed on the inner side of the rear cover 73.

  The collection area A4 is a third chamber (first chamber) R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 that have been inspected are carried into the third chamber R3 from the second chamber R2.

  The tray removal area A5 is a fourth chamber (second chamber) R4 defined by the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the front cover 70. The plurality of IC devices 90 that have been inspected are carried into the fourth chamber R4 from the third chamber R3 together with the tray 200.

  In the fourth chamber R4, four trays 200 can be arranged along the X direction. Among these, an empty tray 200 is arranged on the leftmost side in FIG. This empty tray 200 is transported into the third chamber R3 by the tray transport mechanism 22B. Further, on the right side of the empty tray 200, trays 200a to 200c conveyed from the third chamber R3 are respectively arranged.

  The fourth partition wall 64 is provided with four openings 641, 642, 643, and 644 that penetrate in the thickness direction. These openings 641 to 644 are arranged in this order from the left side in FIG. The opening 641 is a portion through which the empty tray 200 passes from the fourth chamber R4 toward the third chamber R3. The opening 642 is a part through which the tray 200a passes from the third chamber R3 toward the fourth chamber R4. The opening 643 is a portion through which the tray 200b passes from the third chamber R3 toward the fourth chamber R4. The opening 644 is a portion through which the tray 200c passes from the third chamber R3 toward the fourth chamber R4.

  The opening 641 is provided with the shutter 51, the opening 642 is provided with the shutter 52, the opening 643 is provided with the shutter 53, and the opening 644 is provided with the shutter 54. Yes. The shutters (first doors) 51 to 54 open and close the openings 641 to 644 independently by moving up and down in the vertical direction (Z direction). Each of these shutters 51 to 54 is electrically connected to the control unit 80 and its operation is controlled. Thereby, the shutters 51 to 54 can switch between a circulation state in which air can circulate between the third chamber R3 and the fourth chamber R4 and a non-circulation state in which the air circulation is less than the circulation state. Therefore, it can be in a distribution state only when necessary, and in a non-distribution state at other times. Therefore, changes in the temperature and humidity of the fourth chamber R4 can be suppressed as much as possible.

  As shown in FIG. 1, the side cover 71 is provided with a first door (left first door) 711 and a second door (left second door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, release of jam in the IC device 90, and the like (hereinafter collectively referred to as “operation”) can be performed. . The first door 711 and the second door 712 are so-called “folding doors” that open and close in opposite directions. In addition, when working in the first chamber R1, movable parts such as the device transport head 13 in the first chamber R1 are stopped.

  Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. The first door 721 and the second door 722 are also so-called “folding doors” that open and close in opposite directions. Further, during the work in the third chamber R3, the movable part such as the device transport head 20 in the third chamber R3 stops.

  The rear cover 73 is also provided with a first door (back side first door) 731, a second door (back side second door) 732, and a third door (back side third door) 733. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed. Further, the inner partition 66 is provided with a fourth door 75. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed. The first door 731, the second door 732, and the fourth door 75 open and close in the same direction, and the third door 733 opens and closes in the opposite direction to these doors. Further, during the work in the second chamber R2, the movable parts such as the device transport head 17 in the second chamber R2 are stopped.

  As shown in FIGS. 1 and 5, the opening 700 of the front cover 70 is provided with a first opening / closing door 701 and a second opening / closing door 702. The first door 701 is rotatably installed by a rotation support portion 705 provided at the edge of the opening 700 on the X direction negative side. Further, the second door 702 is rotatably installed by a rotation support portion 706 provided at the edge on the X direction positive side of the opening 700. The first opening / closing door 701 and the second opening / closing door 702 are so-called “double doors” that open and close in opposite directions.

  By opening the first opening / closing door 701, for example, the empty tray 200 and the tray 200a can be replenished or removed. Further, by opening the second opening / closing door 702, for example, the tray 200b and the tray 200c can be taken out.

  As shown in FIG. 2, the control unit 80 includes a drive control unit 81, an inspection control unit 82, and a storage unit 83.

  The drive control unit 81 includes a tray transport mechanism 11A, 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, a device transport head 17, a device recovery unit 18, and a device transport head. 20, the drive of each part, such as tray conveyance mechanism 21, tray conveyance mechanisms 22A and 22B, is controlled.

  The inspection control unit 82 inspects the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on the program stored in the storage unit 83.

  The storage unit 83 is, for example, various semiconductor memories (IC memory) such as volatile memory such as RAM, nonvolatile memory such as ROM, rewritable (erasable and rewritable) nonvolatile memory such as EPROM, EEPROM, and flash memory. Etc.

  As shown in FIGS. 1, 3, and 4, a pair of heating unit 4a and heating unit 4b are provided on the X-direction positive surface of the fifth partition wall 65 of the third chamber R3. The heating units 4a and 4b are arranged in this order from the Y direction positive side and spaced apart from each other. Moreover, as shown in FIG. 3, the heating parts 4a and 4b have the same installed height, that is, the position in the Z direction.

  Since each heating part 4a, 4b is a structure substantially the same, below, the heating part 4b is demonstrated typically.

  The heating unit 4 b includes a heating element 41 and a fan 42 that blows air warmed by the heating element 41 (hereinafter referred to as “warm air W”). The heating unit 4 b is fixed to the fifth partition wall 65 by a pair of support members 43. Further, in the heating unit 4b, the pair of support members 43 includes a rotation support unit 44, and supports and fixes the heating unit 4b so as to be rotatable. For this reason, the heating part 4b can adjust the direction in which the warm air W is blown. That is, the heating unit 4b has a variable heat delivery direction.

  As shown in FIG. 3, in the inspection apparatus 1, the heating unit 4 b is slightly inclined downward and faces the trays 200 a, 200 b, and 200 c. Thereby, the warm air W can be blown toward the IC device 90 placed on the trays 200a to 200c. Therefore, the cooled IC device 90 after inspection can be heated. For this reason, it is possible to prevent the IC device 90 from being discharged outside the apparatus while being cooled. As a result, it is possible to prevent droplets from adhering to the IC device 90, that is, condensation, which occurs when the cooled IC device 90 is discharged to the outside of the inspection apparatus 1 as it is.

  In particular, in the inspection apparatus 1, since the heating units 4a and 4b are arranged at locations separated from the trays 200a to 200c, the device transport head 20 hinders the operation of transporting the IC device 90 to the trays 200a to 200c. Can be prevented. Therefore, it is possible to prevent dew condensation on the IC device 90 while preventing a decrease in throughput.

  Furthermore, it is possible to omit providing a heating unit for each mounting unit on which the IC device 90 is mounted as in the conventional case, and it is possible to suppress an increase in cost accordingly.

  As shown in FIG. 3, the heating units 4 a and 4 b face the tray 200 a on the proximal side of the heating units 4 a and 4 b among the trays 200 a to 200 c. For this reason, the warm air W sent from the heating units 4a and 4b first hits the IC device 90 of the tray 200a. Then, the warm air W hitting the tray 200a flows to the X direction positive side as it is, and hits the IC devices 90 of the tray 200b and the tray 200c in order.

  As described above, the IC device 90 with the inspection result “good” is placed on the tray 200a, and the IC device 90 with the inspection result “re-inspection product” is placed on the tray 200b. The IC device 90 whose inspection result is “defective product” is placed on the tray 200c. For this reason, heating part 4a, 4b can be heated in order from IC device 90 with a high rank of an inspection result, ie, priority. Thereby, the “good product” can be heated preferentially. Furthermore, since the “defective product” is discarded as it is, heating may be insufficient and condensation may occur. Therefore, it is only necessary to heat the “non-defective product” and the “re-inspection product”, and the power consumption of the heating units 4a and 4b can be prevented from increasing.

  Here, as shown in FIG. 4, the IC devices 90 are arranged one by one on the tray 200a (the same applies to the trays 200b and 200c). At this time, in the inspection apparatus 1, a plurality of (three in this embodiment) IC devices 90 are arranged from the upper right in FIG. 4 to the left in FIG. 4, as indicated by arrows in FIG. It is placed from the right side to the left side under the row. By repeating such placement, the IC devices 90 are placed in a matrix on the tray 200a.

  According to such a mounting method, the IC device 90 on the lower side in FIG. 4 arranged later is heated by the heating units 4a and 4b than the IC device 90 on the upper side in FIG. 4 arranged earlier. Time is shortened. For this reason, the IC device 90 on the upper side in FIG. 4 arranged earlier is excessively heated depending on the inspection state, and the IC device 90 on the lower side in FIG. 4 arranged later tends to be insufficiently heated. . Therefore, the inspection apparatus 1 is configured such that the temperature of the warm air W of the heating unit 4b is higher than that of the warm air W blown by the heating unit 4a. As a result, the amount of heat per unit time applied to the IC device 90 disposed later can be made higher than the amount of heat per unit time applied to the IC device 90 disposed earlier. Therefore, it is possible to prevent the IC device 90 disposed earlier from being excessively heated, and to sufficiently heat the IC device 90 disposed later. For these reasons, the inspection device 1 can heat the IC device 90 without excess or deficiency.

  Further, conventionally, when the IC device 90 is placed on the tray 200a to the lower left corner in FIG. 4, that is, when the tray 200a reaches the storage limit, the IC device 90 is immediately moved to the fourth chamber R4. On the other hand, in the inspection apparatus 1, even if the tray 200a reaches the storage limit, the inspection apparatus 1 is restricted from moving to the fourth chamber R4 until the next IC device 90 needs to be replaced in order to place the tray 200a. Has been. Thereby, the heating time of the IC device 90 placed on the tray 200a can be made as long as possible. Therefore, it is possible to prevent condensation from occurring in the IC device 90 more reliably.

  Thus, in the inspection apparatus 1, the movement start time from the third chamber R3 to the fourth chamber R4 is adjusted according to the state of conveyance of the IC device 90 to the tray 200a.

  In the inspection apparatus 1, the time measurement is started after the first IC device 90 is placed on the tray 200a (the same applies to the trays 200b and 200c). It is configured to move from the third chamber R3 to the fourth chamber R4. Thereby, it is possible to prevent the IC device 90 from being heated excessively.

Next, the fourth chamber R4 will be described.
As shown in FIGS. 1 and 2, the fourth chamber R4 is provided with a management unit 3 having a temperature adjustment unit 31 and a humidity adjustment unit 32, and the temperature and humidity in the fourth chamber R4 are managed. Has been.

  The temperature adjustment unit 31 has a function of adjusting the temperature in the fourth chamber R4, and the operation is controlled by the control unit 80. The humidity adjusting unit 32 has a function of adjusting the humidity in the fourth chamber R4, and its operation is controlled by the control unit 80.

  In the inspection apparatus 1, the temperature in the fourth chamber R4 is maintained at, for example, about 10 to 35 ° C. by the temperature adjusting unit 31, and the humidity in the fourth chamber R4 is maintained at about 0 to 20% by the humidity adjusting unit 32. Has been. In such an environment, the trays 200a to 200c on which the IC devices 90 are placed stay in the fourth chamber R4 for a predetermined time, so that the IC devices 90 in the cooled state after the inspection are less likely to cause dew condensation. It can be heated sufficiently. Therefore, when the IC device 90 is taken out from the fourth chamber R4, dew condensation can be prevented from occurring in the IC device 90.

  According to such 4th chamber R4, it can prevent or suppress more reliably that dew condensation arises in IC device 90 combined with heating part 4a, 4b mentioned above heating IC device 90.

  The “predetermined time” is a time during which no condensation occurs when the IC device 90 stays in the fourth chamber R4 and is taken out from the fourth chamber R4 prior to the inspection, and is obtained experimentally. Value. In the experiment, it is preferable to omit the heating by the heating units 4a and 4b. Thereby, it is possible to more reliably prevent or suppress the occurrence of condensation on the IC device 90.

  In the inspection apparatus 1, for example, when the trays 200a to 200c have moved from the third chamber R3 to the fourth chamber R4 in this order, the stay time is measured after the tray 200c has moved to the fourth chamber R4. To start. As a result, it is possible to prevent condensation from forming on the IC device 90 of the tray 200c that has moved last.

  Further, in the inspection apparatus 1, the trays 200a to 200c are moved from the third chamber R3 to the fourth chamber R4 after the temperature and humidity in the fourth chamber R4 are within the above numerical range. That is, if the temperature and humidity in the fourth chamber R4 are outside the above numerical ranges, the movement of the trays 200a to 200c from the third chamber R3 to the fourth chamber R4 is restricted. In this way, by preparing an environment in which condensation is unlikely to occur in the IC device 90, the trays 200a to 200c are moved to the fourth chamber R4 to prevent condensation in the IC device 90 in the fourth chamber R4. Can be suppressed.

  Further, the atmospheric pressure in the fourth chamber R4 is equal to or higher than the atmospheric pressure, and is equal to or lower than the atmospheric pressure in the third chamber R3. Thereby, for example, even if the first opening / closing door 701 or the second opening / closing door 702 is opened in a state where the shutters 51 to 54 are opened and the third chamber R3 and the fourth chamber R4 communicate with each other, the outside air is inspected. It can be made difficult to enter the apparatus 1.

  The method for managing the pressure in the fourth chamber R4 is not particularly limited, and examples thereof include introduction of outside air using a pump, air blowing by a fan, and a method of supplying gas by connecting to a gas cylinder or the like.

  Further, when the tray 200 is taken in and out, one of the first opening / closing door 701 and the second opening / closing door 702 can be opened to perform the operation. As a result, by opening the first opening / closing door 701 and the second opening / closing door 702 that is closer to the portion where the tray 200 is to be taken in and out, the outside air enters the fourth chamber R4. It can be suppressed as much as possible.

  Moreover, the 1st opening / closing door 701 and the 2nd opening / closing door 702 are rotatable, and can adjust the degree of opening / closing. Therefore, when the tray 200 is taken in and out, the opening degree of the first opening / closing door 701 or the second opening / closing door 702 is set to a minimum degree to suppress the outside air from entering the fourth chamber R4 as much as possible. it can.

  In addition, the front cover 70 is provided with a first detection unit 703 that detects opening and closing of the first opening and closing door 701 and a second detection unit 704 that detects opening and closing of the second opening and closing door 702. Each of the first detection unit 703 and the second detection unit 704 includes, for example, a magnet sensor and is electrically connected to the control unit 80.

  The opening / closing of the first opening / closing door 701 and the second opening / closing door 702 can be detected by the first detection unit 703 and the second detection unit 704. Thereby, in the inspection apparatus 1, when the first opening / closing door 701 and the second opening / closing door 702 are in a released state for a predetermined time, a notification mechanism (not shown) notifies the operator that the open state is long. it can. As described above, in the inspection apparatus 1, since the opening / closing of the first opening / closing door 701 and the second opening / closing door 702 is managed by time, it is possible to suppress the outside air from entering the fourth chamber R4 as much as possible. it can.

  As described above, in the inspection apparatus 1, the IC device 90 after the inspection is subjected to primary heating by the heating units 4a and 4b, and secondary heating is performed in the fourth chamber R4. For this reason, it is possible to effectively prevent or suppress the occurrence of condensation on the IC device 90 taken out from the inspection apparatus 1.

Next, the control operation of the inspection apparatus 1 will be described using the flowchart shown in FIG.
First, inspection of the IC device 90 is started (step S101).

  The IC device 90 that has been inspected through the tray supply area A1, the supply area A2, and the inspection area A3 in this order is placed on one of the trays 200a to 200c in the collection area A4.

  And IC device 90 is heated by operation of heating parts 4a and 4b (Step S102).

  At this time, a timer (not shown) is activated simultaneously with the start of heating of the heating units 4a and 4b (step S103).

  In step S104, it is determined whether the time is up. If it is determined in step S104 that the time is up, the IC device 90 is considered to be sufficiently heated, and the IC device 90 is discharged to the tray removal area A5 together with the trays 200a to 200c (step S105).

  When the discharge of the trays 200a to 200c is completed, that is, when the trays 200a to 200c are stored in the tray removal area A5, a timer (not shown) is operated (step S106).

  In step S107, it is determined whether the time is up. If it is determined in step S107 that the time is up, the IC device 90 is considered to be sufficiently heated, and a notification is given that the IC device 90 may be taken out from the tray removal area A5 (step S108).

  Thus, according to the inspection apparatus 1, since the electronic component in a low temperature state is heated by the heating unit, the temperature when the electronic component is taken out from the electronic component transport device can be set higher than the low temperature state. . Therefore, it is possible to prevent or suppress the occurrence of condensation on the electronic component.

Second Embodiment
FIG. 7 is a view for explaining a heating unit provided in the second embodiment of the electronic component inspection apparatus of the present invention.

Hereinafter, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to these drawings. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Description is omitted.
This embodiment is the same as the first embodiment except that the configuration of the heating unit is different.

  As shown in FIG. 7, in the inspection apparatus 1 </ b> A, the heating unit 4 c and the heating unit 4 d are light sources that heat the IC device 90 by irradiating the light L toward the IC devices 90 placed on the trays 200 a to 200 c. It is configured. The light L is not particularly limited as long as the IC device 90 can be heated, and for example, infrared (far infrared) can be used.

  According to such heating units 4c and 4d, it is possible to omit blowing as in the first embodiment. Thereby, for example, when the IC device 90 having a small mass is heated, the IC device 90 can be prevented from being blown by the wind pressure or from being displaced.

<Third Embodiment>
FIG. 8: is a figure for demonstrating the 2nd opening / closing door with which 3rd Embodiment of the electronic component inspection apparatus of this invention is equipped with (a)-(c).

Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to these drawings. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Description is omitted.
This embodiment is the same as the first embodiment except that the configuration of the second opening / closing door is different.

  As shown in FIGS. 8A to 8C, in the inspection apparatus 1 </ b> B, a first opening / closing door 707 and a second opening / closing door 708 are provided in the opening 700 of the front cover 70. The first opening / closing door 707 and the second opening / closing door 708 are slidable on a rail portion (not shown) extending in the X direction. The first opening / closing door 707 and the second opening / closing door 702 are arranged so as to be shifted from each other in the Y direction, the first opening / closing door 707 is located on the near side (Y axis negative side), and the second opening / closing door 708 is located at the back. It is located on the side (Y axis positive side).

  In the closed state shown in FIG. 8A, the first opening / closing door 707 closes the left side of the opening 700, and the second opening / closing door 708 closes the right side of the opening 700. When taking out the tray 200 from this closed state, for example, as shown in FIG. 8B, the first opening / closing door 707 is moved (slid) to the right to open the first opening / closing door 707. Thereby, the tray 200 can be taken out. In particular, by opening the first opening / closing door 707 by an amount necessary for taking out the tray 200, it is possible to suppress the outside air from flowing into the fourth chamber R4 as much as possible.

  Further, when the tray 200c is taken out from the closed state shown in FIG. 8A, for example, the second door 708 is moved (slid) to the left as shown in FIG. Open. Thereby, the tray 200c can be taken out. In particular, by opening the second door 708 as much as necessary to take out the tray 200c, it is possible to suppress the outside air from flowing into the fourth chamber R4 as much as possible as described above.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In each of the above embodiments, the temperature and humidity are detected and managed in the second chamber. However, in the present invention, the present invention is not limited to this. It is possible to prevent or suppress the occurrence of condensation on the parts.

  Moreover, in each said embodiment, although the two heating parts are provided, in this invention, it is not limited to this, For example, one or three or more may be sufficient.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 1A ... Inspection apparatus 1B ... Inspection apparatus 11A ... Tray conveyance mechanism 11B ... Tray conveyance mechanism 12 ... Temperature adjustment part 13 ... Device conveyance head 14 ... Device supply part 15 ... Tray conveyance Mechanism 16... Inspection section 17... Device transport head 18... Device recovery section 19... Recovery tray 20... Device transport head 21 .. Tray transport mechanism 22A. ... management unit 31 ... temperature adjustment part 32 ... humidity adjustment part 4a ... heating part 4b ... heating part 4c ... heating part 4d ... heating part 41 ... heating element 42 ... fan 43 ... support member 44 …… Rotation support 51 …… Shutter 52 …… Shutter 53 …… Shutter 54 …… Shutter 61 …… First partition 62 …… Second partition 63 …… Third partition 64 …… Fourth partition 641 ...... Opening 642 ... Opening 643 ... Opening 644 ... Opening 65 ... Fifth partition 66 ... Inner partition 70 ... Front cover 700 ... Opening 701 ... First opening / closing door 702 ... ... second opening / closing door 703 ... first detection unit 704 ... second detection unit 705 ... rotation support unit 706 ... rotation support unit 707 ... first door 708 ... second door 71 ... side cover 711 …… First door 712 …… Second door 72 …… Side cover 721 …… First door 722 …… Second door 73 …… Rear cover 731 …… First door 732 …… Second door 733 …… Third Door 75... 4th door 80... Control unit 81... Drive control unit 82 .. inspection control unit 83... Storage unit 90 .. IC device 200 .. tray 200a. A1 …… Tray supply area A2 …… Device Area A3 ... Inspection area A4 ... Device collection area A5 ... Tray removal area R1 ... First chamber R2 ... Second chamber R3 ... Third chamber R4 ... Fourth chamber L ... Light W ... Temperature Wind

Claims (11)

A placement section on which electronic components are placed;
An electronic component transport apparatus comprising: a heating unit that is provided apart from the mounting unit and that heats the electronic component mounted on the mounting unit.   The electronic component conveying apparatus according to claim 1, wherein the electronic component is one after a predetermined inspection is performed.   The electronic component conveying apparatus according to claim 1, wherein the heating unit is capable of sending wind in the direction of the electronic component.   The electronic component conveying apparatus according to claim 3, wherein the wind is hot air.   The electronic component transport apparatus according to claim 1, wherein the heating unit includes a light emitting unit capable of irradiating light in a direction of the electronic component.   The electronic component conveying apparatus according to claim 3, wherein the heating unit can change a direction in which the wind or the light is transmitted. The electronic components are ranked based on the results, and are arranged separately at different positions in the placement unit,
The electronic component conveying apparatus according to claim 1, wherein the heating unit heats at least the electronic components having the higher rank. The mounting portion is arranged in a plurality of the electronic components divided into a plurality of times,
The said heating part heats so that the calorie | heat amount per unit time provided to the said electronic component mounted later may become larger than the calorie | heat amount per unit time provided to the said electronic component mounted previously. Item 8. The electronic component conveying apparatus according to any one of Items 1 to 7. A first chamber in which the heating unit is disposed, and a second chamber different from the first chamber;
9. The electronic component carrying apparatus according to claim 1, wherein the placement unit is discharged from the first chamber to the second chamber after being heated by the heating unit for a predetermined time. A first chamber in which the heating unit is disposed, and a second chamber different from the first chamber;
10. The start position of the placement section is adjusted from the first chamber to the second chamber according to a state of conveyance of the electronic component to the placement section. The electronic component conveying apparatus described in 1. An inspection unit for inspecting electronic components;
A placement section on which electronic components are placed;
An electronic component inspection apparatus comprising: a heating unit that is provided apart from the mounting unit and that heats the electronic component mounted on the mounting unit.

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