CN108139440A - Electronic component handling apparatus and electronic component inspection device - Google Patents
Electronic component handling apparatus and electronic component inspection device Download PDFInfo
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- CN108139440A CN108139440A CN201680015718.5A CN201680015718A CN108139440A CN 108139440 A CN108139440 A CN 108139440A CN 201680015718 A CN201680015718 A CN 201680015718A CN 108139440 A CN108139440 A CN 108139440A
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- equipment
- pallet
- electronic component
- room
- electronic unit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention, which provides one kind, to prevent the electronic unit after checking from generating the electronic component handling apparatus and electronic component inspection device of moisture condensation while cost increase is inhibited.Check device 1 includes：Can place check after IC equipment pallet 200, detached with pallet 200 and set and the IC equipment 90 to being placed on pallet 200 heat heating part 4a, 4b.In addition, in heating part 4a, 4b, the transport direction of respective heat can change.
Description
Technical field
The present invention relates to electronic component handling apparatus and electronic component inspection devices.
Background technology
All the time, it is known that the electronic component inspection device of the electrical characteristics of electronic unit such as checking IC equipment, at this
Be incorporated in electronic component inspection device for IC equipment is delivered to inspection portion maintaining part electronic component handling apparatus.
When checking IC equipment, IC equipment is arranged on maintaining part, makes to be arranged on each termination contact of multiple probes of maintaining part and IC equipment,
It is checked.At this point, it is checked in the state of IC equipment is cooled down.Also, the IC equipment after checking is kept by component
Device is kept (for example, referring to patent document 1).
In the electronic component inspection device recorded in patent document 1, having heaters built in part holding device, after inspection
The IC equipment of the state of cooling heated.As a result, when taking out outside IC equipment to device, the generation of moisture condensation can inhibit.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2001-228206 bulletins
Invention content
The technical problems to be solved by the invention
However, in the electronic component inspection device recorded in patent document 1, need built-in for each part holding device
One heater.Therefore, worry that cost can increase.
The purpose of the present invention is to provide one kind to prevent the electronic unit after checking while cost increase is inhibited
Generate the electronic component handling apparatus and electronic component inspection device of moisture condensation.
Solve the means of technical problem
These purposes are realized by following present invention.
[application examples 1]
The electronic component handling apparatus of the present invention is characterized in that having：Place the placement section of electronic unit；It is put with described
Put part from and set and to be placed on the placement section the electronic unit heat heating part.
For example, when having carried out inspection under the temperature environment less than room temperature, being placed on the electronic unit of placement section becomes low
In the low-temperature condition of room temperature.If taking out the electronic equipment of the low-temperature condition from the electronic component handling apparatus, electronics is set sometimes
It is standby to generate moisture condensation.According to the present invention, due to being heated using heating part to the electronic unit of low-temperature condition, therefore, it is possible to make from
Temperature when electronic unit is taken out in the electronic component handling apparatus becomes the temperature higher than low-temperature condition.Therefore, it is possible to prevent
Or the electronic unit taken out from the electronic component handling apparatus is inhibited to generate moisture condensation.Furthermore, it is possible to it omits as prior art
Heating part is set to each placement section, so as to which cost is inhibited to increase.
[application examples 2]
In the electronic component handling apparatus of the present invention, preferably described electronic unit is the portion carried out after regulation checks
Part.
Thereby, it is possible to prevent or inhibit the electronic unit after checking to generate moisture condensation.
[application examples 3]
In the electronic component handling apparatus of the present invention, preferably described heating part can be sent in the direction of the electronic unit
Wind.
Electronic unit can be heated the position for leaving placement section in heating part as a result,.Therefore, it is possible to prevent for example
Electronic unit is delivered to the action of placement section by heating part obstruction delivery section.
[application examples 4]
In the electronic component handling apparatus of the present invention, preferably described wind is hot-air.
Electronic unit can be heated the position for leaving placement section in heating part as a result,.
[application examples 5]
In the electronic component handling apparatus of the present invention, preferably described heating part has can be in the side of the electronic unit
To the illumination region of irradiation light.
Electronic unit can be heated the position for leaving placement section in heating part as a result,.Therefore, it is possible to prevent for example
Electronic unit is delivered to the action of placement section by heating part obstruction delivery section.
[application examples 6]
In the electronic component handling apparatus of the present invention, in preferably described heating part, the submitting side of the wind or the light
To can change.
No matter place as a result, the placement section of electronic unit position where, electronic unit can be heated.
[application examples 7]
In the electronic component handling apparatus of the present invention, preferably described electronic unit is rated based on the result,
And be individually separated being arranged on position different from each other in the placement section, described in the heating part is forward at least described grade
Electronic unit heats.
The electronic unit that can be used as product utilization can for example be heated, avoided sharp to product can not be used as a result,
Electronic unit heats.Therefore, it is possible to be heated to the electronic equipment emphasis that can be used as product utilization.As a result, it is possible to anti-
Only power consumption increases.
[application examples 8]
In the electronic component handling apparatus of the present invention, preferably described placement part repeatedly sets the ministry of electronics industry multiplely
Part, the heating part are first put so that the heat per unit time of the electronic unit that imparting is placed below more than assigning
The mode of the heat per unit time for the electronic unit put is heated.
First be placed on that the time that the electronic unit of placement section is heated is long, after be placed on the electronic unit quilt of placement section
The time of heating is shorter.Therefore, have and be first placed on the electronic unit of placement section and be heated excessively, after be placed on placement section
Electronic unit heats insufficient tendency.According to the application example, due to being " with the heating speed of the electronic unit to rear placement
The mode that rate increases heats ", therefore, it is possible to prevent or inhibit above-mentioned phenomenon.Therefore, it is possible to moderately heating electronic component.
[application examples 9]
In the electronic component handling apparatus of the present invention, preferably there is the first Room for setting the heating part and be different from
The second Room of first Room, the placement section are arranged after the predetermined time is heated by the heating part from first Room
Go out to the second Room.
Thereby, it is possible to electronic unit is prevented to be heated excessively.
[application examples 10]
In the electronic component handling apparatus of the present invention, preferably there is the first Room for setting the heating part and be different from
The second Room of first Room, the situation that the placement section is conveyed according to the electronic unit to the placement section are adjusted from institute
State mobile time started of first Room to the second Room.
Thereby, it is possible to extend the heating time of electronic unit as much as possible.Therefore, it is possible to be sufficiently carried out electronic unit
Heating.
[application examples 11]
The electronic component inspection device of the present invention is characterized in that having：Check the inspection portion of electronic unit；Place electronics
The placement section of component；And with the placement part from and set and to be placed on the placement section the electronic unit heat
Heating part.
For example, when having carried out inspection under the temperature environment less than room temperature, be placed on the electronic unit of placement section become than
The low low-temperature condition of room temperature.If the electronic equipment of the low-temperature condition is taken out from the electronic component inspection device, sometimes electronics
Equipment can generate moisture condensation.According to the present invention, due to being heated by heating part to the electronic unit of low-temperature condition, therefore, it is possible to make
Temperature when electronic unit is taken out from the electronic component inspection device becomes higher than the temperature of low-temperature condition.Therefore, it is possible to anti-
Only or electronic unit is inhibited to generate moisture condensation.Heating part is set to each placement section like that somewhat like the prior art furthermore it is possible to save, from
And cost can be inhibited to increase.
Description of the drawings
Fig. 1 is the diagrammatic top view for the first embodiment for showing the electronic component inspection device of the present invention.
Fig. 2 is the block diagram of electronic component inspection device shown in FIG. 1.
Fig. 3 is for illustrating the figure of heating part that electronic component inspection device shown in FIG. 1 has.
Fig. 4 is from figure seen by the arrow A directions in Fig. 3.
Fig. 5 is the figure for illustrating the second switching door.
Fig. 6 is the flow chart for illustrating the control action of electronic component inspection device shown in FIG. 1.
Fig. 7 is the heating part that has of second embodiment for illustrating the electronic component inspection device of the present invention
Figure.
(a) of Fig. 8 is for illustrating that the third embodiment of the electronic component inspection device of the present invention has to (c)
The figure of second switching door.
Specific embodiment
Hereinafter, based on the preferred of the electronic component handling apparatus and electronic component inspection device that the present invention is shown in the drawings
Embodiment is described in detail.
<First embodiment>
Fig. 1 is the diagrammatic top view for the first embodiment for showing the electronic component inspection device of the present invention.Fig. 2 is Fig. 1
The block diagram of shown electronic component inspection device.Fig. 3 be for illustrating that electronic component inspection device shown in FIG. 1 has plus
The figure in hot portion.Fig. 4 is from figure seen by the arrow A directions in Fig. 3.Fig. 5 is the figure for illustrating the second switching door.Fig. 6 is to use
In the flow chart for the control action for illustrating electronic component inspection device shown in FIG. 1.
In the following, for purposes of illustration only, as Fig. 1,3,4 are (to Fig. 7,8 equally) shown, by three orthogonal axis
As X-axis, Y-axis and Z axis.Also, the X/Y plane including X-axis and Y-axis is horizontal, and Z axis is vertical.It also, will be flat
Row is also referred to as " X-direction " in the direction of X-axis, and the direction for being parallel to Y-axis is also referred to as " Y-direction ", will be parallel to the direction of Z axis
Referred to as " Z-direction ".Also, the upstream side of the conveying direction of electronic unit is simply also known as " upstream side ", simply by under
It swims side and is known as " downstream side ".In addition, " level " mentioned in this specification, is not limited to fully horizontally, as long as not interfering the ministry of electronics industry
The conveying of part also includes the state being slightly inclined relative to level (for example, approximately less than 5 °).
Check device (electronic component inspection device) 1 shown in FIG. 1 is for for example checking and test b GA (ball grid array)
The electronic units such as IC equipment, LCD (liquid crystal display), the CIS (cmos image sensor) such as encapsulation and LGA (grid matrix) encapsulation
Electrical characteristics (hereinafter, being simply referred as " checking ") device.In the following, for purposes of illustration only, using use IC equipment as
The situation of the electronic unit checked illustrates for representative, is called " IC equipment 90 ".
As shown in Figure 1, check device 1 is divided is：Pallet feed region A1, equipment feed region (hereinafter referred to as " supply area
Domain ") A2, inspection area A3, equipment recovery zone (hereinafter referred to as " recovery zone ") A4, pallet removal region A5.Then, IC
Equipment 90 sequentially passes through each region, and region A5 is removed from pallet feed region A1 to pallet, in intermediate inspection area A3
It is checked.So, check device 1 is included in the electronic component handling apparatus of each region conveying IC equipment 90, in test zone
The inspection portion 16 checked in domain and control unit 80.In check device 1, region is being removed from pallet feed region A1 to pallet
Can be referred to as " conveyor zones (delivery area) " from the feed region A2 to recovery zone A4 of conveying IC equipment 90 in A5.
In addition, in check device 1, it is at setting pallet feed region A1, pallet removal region A5 (downside in Fig. 1)
Face side, opposite side, i.e., at setting inspection area A3 (upside in Fig. 1) is used as back side.
Pallet feed region A1 is the pallet (placement section) 200 for multiple IC equipment 90 that supply is arranged with non-inspection state
Material supply portion.In pallet feed region A1, multiple pallets 200 can be stacked.
Multiple IC equipment 90 that feed region A2 is provided on the pallet 200 from pallet feed region A1 are supplied respectively
The region of inspection area A3 should be arrived.In addition, in a manner of across pallet feed region A1 and feed region A2, it is provided with defeated one by one
Send conveyor pallet structure 11A, 11B of pallet 200.
Temperature regulation section (impregnating plate) 12, equipment delivery head 13 and conveyor pallet structure are provided on feed region A2
(the first conveying device) 15.
Temperature regulation section 12 is to place the placement section of multiple IC equipment 90, multiple IC equipment 90 can be heated or
Cooling.Thereby, it is possible to be adjusted to a temperature for being suitable for checking IC equipment 90.In composition shown in Fig. 1, set in the Y direction
And temperature regulation section 12 there are two fixing.Then, by conveyor pallet structure 11A from pallet feed region A1 be sent into (conveying and
Come) pallet 200 on IC equipment 90, conveyed and be placed in some temperature regulation section 12.
Equipment delivery head 13 is movably supported in feed region A2.As a result, equipment delivery head 13 can undertake from
The conveying of IC equipment 90 between pallet 200 and temperature regulation section 12 that pallet feed region A1 is sent into and temperature regulation section
The conveying of IC equipment 90 between 12 and aftermentioned equipment supply department 14.
Conveyor pallet structure 15 is that conveying is removed whole IC equipment state after 90s in X direction in feed region A2
The mechanism of empty pallet 200.Then, after the conveying, empty pallet 200 is returned by conveyor pallet structure 11B from feed region A2
Return pallet feed region A1.
Inspection area A3 is the region for checking IC equipment 90.In inspection area A3, it is provided with (the supply of equipment supply department
Shuttle) 14, inspection portion 16, equipment delivery head 17, equipment recoverer (recycling shuttle) 18.
Equipment supply department 14 is the placement section for placing the IC equipment 90 after being adjusted by temperature, can convey the IC equipment 90
To inspection portion 16.The equipment supply department 14 can be in X direction between feed region A2 and inspection area A3 by bearing
It is mobile.In addition, in composition shown in Fig. 1, there are two equipment supply department 14 is set along Y-direction, the IC in temperature regulation section 12
Equipment 90 is conveyed and is placed in any one equipment supply department 14.
Inspection portion 16 is the unit of the electrical characteristics of inspection and test IC equipment 90.It is provided in inspection portion 16 and IC is being kept to set
The multiple probes being electrically connected in the state of standby 90 with the terminal of the IC equipment 90.Then, the terminal of IC equipment 90 and probe are electrically connected
(contact) is connect, the inspection of IC equipment 90 is carried out by probe.In addition, in inspection portion 16 and temperature regulation section 12 similarly, energy
It is enough that IC equipment 90 is heated or cooled, which is adjusted to the temperature for being suitable for checking.
Equipment delivery head 17 is movably supported in the A3 of inspection area.Equipment delivery head 17 can will be from confession as a result,
The IC equipment 90 in the equipment supply department 14 of region A2 feedings is answered to convey and be placed in inspection portion 16.
Equipment recoverer 18 is to place the placement section for having completed the equipment of the IC after the inspection in inspection portion 16 90, can should
IC equipment 90 is delivered to recovery zone A4.The equipment recoverer 18 can be in X direction in inspection area A3 and recycling by bearing
It is moved between the A4 of region.In addition, in composition shown in Fig. 1, equipment recoverer 18 and equipment supply department 14 similarly, along Y side
To there are two settings, the IC equipment 90 in inspection portion 16 is conveyed and is placed in any setting recoverer 18.The conveying passes through
Equipment delivery head 17 carries out.
Recovery zone (the first Room) A4 is the region for recycling the multiple IC equipment 90 for having completed to check.In recovery zone A4
It is provided with recycling pallet 19, equipment delivery head 20, conveyor pallet structure (the second conveying device) 21.In addition, in recovery zone
A4 also has empty pallet 200.
Recycling pallet 19 is the placement section for placing IC equipment 90, is fixed in the A4 of recovery zone, composition shown in Fig. 1
In, in X direction there are three setting.In addition, empty pallet 200 is also the placement section for placing IC equipment 90, it is provided with three in X direction
It is a.Moreover, the IC equipment 90 being moved on the equipment recoverer 18 of recovery zone A4 is conveyed and is placed on these recycling support
In any one in disk 19 and empty pallet 200.IC equipment 90 can be recovered and classify according to inspection result as a result,.
When by three pallets 200, left side is set to pallet 200a, 200b, 200c respectively from Fig. 1, in pallet 200a
It is upper to place the IC equipment 90 that inspection result is " non-defective unit ".Also, inspection result is placed on pallet 200b as " re-inspection product "
IC equipment 90.Then, the IC equipment 90 that inspection result is " defective products " is placed on pallet 200c.
So, in check device 1, IC equipment 90 is rated according to inspection result, and is separately positioned on difference
Pallet 200a to 200c in.
Equipment delivery head 20 is movably supported in the A4 of recovery zone.Equipment delivery head 20 can set IC as a result,
Standby 90 slave device recoverers 18 are delivered in recycling pallet 19 and empty pallet 200.
Conveyor pallet structure 21 is to convey the empty pallet being sent into from pallet removal region A5 in X direction in the A4 of recovery zone
200 mechanism.Then, after the conveying, empty pallet 200 is the position for being arranged on recycling IC equipment 90, that is to say, that can
Any one in three empty pallets 200 can be become.So, in check device 1, in recovery zone, A4 sets pallet defeated
Mechanism 21 is sent, in addition, being provided with conveyor pallet structure 15 in supply area A2.It compares as a result, and for example passes through a conveying mechanism
The conveying of empty pallet 200 is carried out to X-direction, can more improve handling capacity (the conveying number of IC equipment 90 per unit time).
In addition, the composition as conveyor pallet structure 15,21, is not particularly limited, can enumerate for example, with absorption support
The composition of the supporting devices such as the adsorption element of disk 200 and ball-screw that the adsorption element is movably supported in X-direction.
Pallet removal region A5 is the pallet for recycling and removing the multiple IC equipment 90 for being provided with the state that inspected finishes
200 removal material portion.Pallet removal region A5 can stack multiple pallets 200.
In addition, in a manner of across recovery zone A4 and pallet removal region A5, it is provided with and conveys the defeated of pallet 200 one by one
Send mechanism 22A, 22B.Conveyor pallet structure 22A is will to be placed with the pallet 200 of the IC equipment 90 that inspected finishes from recovery area
Domain A4 is transported to the mechanism of pallet removal region A5.Conveyor pallet structure 22B is will be for recycling the empty pallet 200 of IC equipment 90
The mechanism of recovery zone A4 is delivered to from pallet removal region A5.
In above such check device 1, other than temperature regulation section 12 and inspection portion 16, equipment delivery head 13,
Equipment supply department 14, equipment delivery head 17 are also configured to that IC equipment 90 is heated or cooled.IC equipment 90 is in quilt as a result,
Certain temperature can be maintained during conveying.Then, hereinafter, for not cooled down to IC equipment 90, for example, in 60 DEG C of ﹣ to ﹣
Situation about being checked under the low temperature environment in the range of 40 DEG C illustrates.
As shown in Figure 1, in check device 1, separated between pallet feed region A1 and feed region A2 by first partition 61
(subregion) is separated between feed region A2 and inspection area A3 by second partition 62, inspection area A3 and recovery zone A4 it
Between separated by third partition board 63, recovery zone A4 and pallet removal region A5 between separated by the 4th partition board 64.In addition, for
It answers and separates between region A2 and recovery zone A4 also by the 5th partition board 65.These partition boards have the air-tightness in each region of holding
Function.Moreover, in check device 1, outermost is covered by lid, this is stamped such as protecgulum 70, side cover 71 and 72, rear cover 73.
Then, feed region A2 becomes by first partition 61, second partition 62, the 5th partition board 65, side cover 71 and rear cover 73
Defined first Room R1.In first Room R1, corresponding each pallet 200 is sent into multiple IC equipment 90 of non-inspection state.
Inspection area A3 becomes the second Room R2 defined in second partition 62, third partition board 63 and rear cover 73.Also, the
In two Room R2, than rear cover 73 closer to being provided with inboard partition 66 inside.
Recovery zone A4 becomes to be defined by third partition board 63, the 4th partition board 64, the 5th partition board 65, side cover 72 and rear cover 73
Third room (the first Room) R3.Check that the multiple IC equipment 90 finished are admitted to from second Room R2 in the R3 of third room.
Pallet removal region A5 becomes the 4th defined in the 4th partition board 64, the 5th partition board 65, side cover 72 and protecgulum 70
Room (second Room) R4.Check that the multiple IC equipment 90 finished are admitted to fourth ventricle R4 corresponding to each pallet 200 from third room R3
In.
In addition, in fourth ventricle R4, four pallets 200 can be set in X direction.Wherein, leftmost side setting is free in Fig. 1
Pallet 200.The empty pallet 200 is admitted to by conveyor pallet structure 22B in the R3 of third room.In addition, the right side of empty pallet 200 point
The pallet 200a to 200c conveyed from third room R3 is not set.
In addition, it is provided through four opening portions 641,642,643,644 of the thickness direction in the 4th partition board 64.These
The left side from Fig. 1 of opening portion 641 to 644 is ranked sequentially according to this.Opening portion 641 is empty pallet 200 from fourth ventricle R4 to third
Room R3 by part.Opening portion 642 be empty pallet 200a from third room R3 to fourth ventricle R4 by part.Opening portion 643
Be empty pallet 200b from third room R3 to fourth ventricle R4 by part.Opening portion 644 be empty pallet 200c from third room R3 to
Fourth ventricle R4 by part.
Moreover, shutter 51 in opening portion 641 is set, shutter 52 is set in opening portion 642, shutter is set in opening portion 643
53, opening portion 644 is provided with shutter 54.These shutters (first) 51 to 54 be by vertical direction (Z-direction) up and down
It is mobile, and independently to the door of each 641 to 644 switching action of opening portion.These shutters 51 to 54 are electrically connected respectively with control unit 80
It connects, operation is controlled.Shutter 51 to 54 can circulate air between third room R3 and fourth ventricle R4 as a result,
The circulation of the circulation status and air non-negotiable state slower than circulation status switches over.Therefore, it is possible to only make when needed
Its become circulation status, other when become non-negotiable state.Therefore, it is possible to inhibit the temperature of fourth ventricle R4 and wet as much as possible
Degree variation.
As shown in Figure 1, first (first, left side) 711 and second (second, left side) 712 are provided on side cover 71.
By opening first 711 and second 712, for example safeguarding in such as the first Room R1 or the blocking of IC equipment 90 can be carried out
Releasing etc. (hereinafter, these are referred to as " operating ").In addition, first 711 and second 712 is opened in the opposite directions to each other
It closes, becomes so-called " splitting around ".In addition, during operation in the first Room R1, the equipment delivery head in the R1 of first Room
The movable part of 13 grades stops.
Similarly, first (first, right side) 721 and second (second, right side) 722 are provided on side cover 72.
By opening first 721 and second 722, the operation in such as third room R3 can be carried out.In addition, first 721 and
Become in opposite directions folding, so-called " splitting around door " for two 722.In addition, the operation phase in the R3 of third room
Between, the movable part of 20 grade of equipment delivery head in the R3 of the third room stops.
In addition, first (back side first) 731 and second (back side second) are also equipped on rear cover 73
732 and third door (back side third door) 733.By opening first 731, the operation in such as the first Room R1 can be carried out.
By opening third door 733, the operation in such as third room R3 can be carried out.Moreover, inboard partition 66 is provided with the 4th 75.
Then, by opening second 732 and the 4th 75, the operation in such as second Room R2 can be carried out.In addition, first 731
With second 732 and the 4th 75 in same direction folding, the folding on the direction opposite with these of third door 733.In addition,
During operation in second Room R2, the movable part of 17 grade of equipment delivery head in second Room R2 stops.
Moreover, as shown in Figures 1 and 5, the first folding 701 and the second switching door are provided in the opening portion of protecgulum 70 700
702.The rotating support portion 705 of first 701 edge part by the X-direction negative side for being arranged on opening portion 700 is rotationally set
It puts.In addition, second 702 rotatable by the rotating support portion 706 of the edge part of X-direction positive side for being arranged on opening portion 700
Ground is set.These 701 and second switching doors 702 of the first switching door become folding in directions opposite each other, so-called " left and right
Clamshell doors ".
By opening the first switching door 701, the supplement of such as empty pallet 200 and pallet 200a can be carried out or taking out behaviour
Make.In addition, by opening the second switching door 702, the taking-up operation of pallet 200b and pallet 200c can be for example carried out.
As shown in Fig. 2, control unit 80 has drive control part 81, checks control unit 82, storage part 83.
Drive control part 81 controls conveyor pallet structure 11A, 11B, temperature regulation section 12, equipment delivery head 13, equipment to supply
Answer portion 14, conveyor pallet structure 15, inspection portion 16, equipment delivery head 17, equipment recoverer 18, equipment delivery head 20, pallet defeated
Send the driving in each portion of mechanism 21, conveyor pallet structure 22A, 22B etc..
Control unit 82 is checked based on the program being stored in storage part 83, be configured the IC equipment 90 in inspection portion 16
Inspection of electrical characteristics etc..
Storage part 83 is by the nonvolatile memories such as the volatile memory such as such as RAM, ROM, EPROM, EEPROM, flash memory
Etc. compositions such as nonvolatile memory that can be rewritten and (can eliminate, rewrite) etc., various semiconductor memories (IC memories).
As shown in Fig. 1, Fig. 3 and Fig. 4, in third room, the surface of the X-direction positive side of the 5th partition board 65 of R3 is provided with a pair
Heating part 4a and heating part 4b.Heating part 4a, 4b according to the sequential arrangement and disconnected from each other are set from Y-direction positive side.In addition,
As shown in figure 3, the height of heating part 4a, 4b setting is identical, i.e. the position of Z-direction is identical.
Since each heating part 4a, 4b composition are roughly the same, hereinafter, heating part 4b is typically described.
Heating part 4b has heater 41, blows the wind of air (hereinafter referred to as " hot-air W ") heated by heater 41
Fan 42.Heating part 4b is fixed on the 5th partition board 65 by a pair of support member 43.Also, about heating part 4b, a pair of bearing
Component 43 has rotating support portion 44, rotatably supports and fixes heating part 4b.Therefore, heating part 4b can be adjusted and be blowed heat
The direction of air W.That is, in the 4b of heating part, hot blowing direction is variable.
As shown in figure 3, in check device 1, heating part 4b is the inclined state in slightly downward side, towards pallet 200a,
200b、200c.Thereby, it is possible to blow hot-air W to the IC equipment 90 being placed on pallet 200a to 200c.Therefore, it is possible to right
The IC equipment 90 of cooling after inspection heats.Therefore, it is possible to which IC equipment 90 is prevented to be expelled to the state of cooling the outside of device.
The drop generated during as a result, it is possible to which the IC equipment 90 of cooling being prevented directly to be discharged to the outside of detection device 1 is to IC equipment
That is, 90 attachment, can prevent from condensing.
Particularly, in check device 1, due to be provided in the place detached with pallet 200a to 200c heating part 4a,
4b, therefore, it is possible to prevent from hindering equipment delivery head 20 that IC equipment 90 is delivered to the operation of pallet 200a to 200c.Therefore, energy
Enough while throughput degradation is prevented, prevent from generating moisture condensation in IC equipment 90.
Furthermore, it is possible to the heating part set in the prior art for each placement section for placing IC equipment 90 is omitted, in this way, energy
Enough cost is inhibited to increase.
As shown in figure 3, the pallet 200a of heating part 4a, 4b towards close heating part 4a, 4b in pallet 200a to 200c.
Therefore, the IC equipment 90 of pallet 200a is blown to first from heating part 4a, 4b hot-air W sent out.Then, blow to pallet 200a's
Hot-air W flows directly into X-direction positive side, blows to the IC equipment 90 of pallet 200b, pallet 200c successively.
As described above, pallet 200a places the IC equipment 90 that inspection result is " non-defective unit ", pallet 200b places inspection result
For the IC equipment 90 of " re-inspection product ", pallet 200c places the IC equipment 90 that inspection result is " defective products ".Therefore, heating part
4a, 4b can successively be heated since the high IC equipment 90 of the grade of inspection result, that is, be prioritized to heat.Thereby, it is possible to
It is heated with " non-defective unit " for emphasis.Moreover, " defective products ", due to directly discarded, even if heating is not enough generation, moisture condensation also may be used.Cause
This, as long as heating " non-defective unit " and " re-inspection product ", so as to prevent the power consumption of heating part 4a, 4b from increasing.
Wherein, as shown in figure 4, IC equipment 90 to be arranged on pallet 200a one by one with ranks shape (also same to pallet 200b, 200c
Sample).In this case, in check device 1, IC equipment 90 as shown by the arrows in Figure 4, from Fig. 4 upper right into Fig. 4 left side
Multiple (being 3 in present embodiment) are set, then, left side are placed into from right side in the downside of the row.By as repetition
It places, IC equipment 90 is placed on ranks shape on pallet 200a.
According to such laying method, compared to the IC equipment 90 of upside in the Fig. 4 first set, in the Fig. 4 set below under
The IC equipment 90 of side is shortened by heating part 4a, 4b time heated.Therefore, there is such tendency：Upside in the Fig. 4 first set
IC equipment 90, according to check situation difference, may be heated excessively, and in the Fig. 4 set below downside IC equipment 90
Heating be not enough.Therefore, in check device 1, being configured to the hot-air W temperature that heating part 4b is blowed becomes than heating
The hot-air W highers of portion 4a.Thereby, it is possible to assign the heat per unit time of IC equipment 90 set below higher than tax
The heat per unit time of the IC equipment 90 preliminarily set.Therefore, it is possible to which the IC first set equipment 90 is prevented to be heated excessively,
Meanwhile, it is capable to fully heat the IC equipment 90 set below.As a result, in check device 1, IC equipment can be moderately heated
90。
In addition, in the prior art, if IC equipment 90 is placed the corner of lower-left in Fig. 4 in pallet 200a, i.e.,
Pallet 200a reaches the receiving limit, then can be moved to fourth ventricle R4 immediately.In this regard, in check device 1, even if pallet 200a
Reach the receiving limit, to place next IC equipment 90, before pallet 200a is needed replacing, being moved to fourth ventricle R4 all can be by
To limitation.Thereby, it is possible to extend the heating time of IC equipment 90 being placed on pallet 200a as much as possible.Therefore, it is possible to more
It is reliably prevented IC equipment 90 and generates moisture condensation.
So, in check device 1, situation about can be conveyed according to IC equipment 90 to pallet 200a is adjusted from third
Room R3 is to the mobile time started of fourth ventricle R4.
In addition, check device 1 is configured to pallet 200a (also the same for pallet 200b, 200c), it is initial from placing
90 time started of IC equipment measurement, if time of measuring is more than threshold value, pallet 200a is made to be moved to the from third room R3
Four Room R4.Thereby, it is possible to IC equipment 90 is prevented to be heated excessively.
Next, fourth ventricle R4 is illustrated.
As shown in Figures 1 and 2, fourth ventricle R4 is provided with the administrative unit with temperature regulation section 31 and humidity regulation portion 32
Temperature and humidity in 3, management fourth ventricle R4.
Temperature regulation section 31 has the function of to adjust the temperature in fourth ventricle R4, operates and controlled by control unit 80.Humidity
Adjustment portion 32 has the function of to adjust the humidity in fourth ventricle R4, operates and controlled by control unit 80.
In check device 1, temperature in fourth ventricle R4 maintains such as 10 to 35 DEG C by temperature regulation section 31, and the 4th
Humidity in the R4 of room maintains 0 to 20% by humidity regulation portion 32.By the pallet 200a to 200c for making placement IC equipment 90
The scheduled time in the fourth ventricle R4 of such environment is rested on, it being capable of the abundant heating test in the environment of being difficult to generate moisture condensation
The IC equipment 90 of the state of cooling afterwards.Therefore, when IC equipment 90 is fetched into outside from fourth ventricle R4, IC equipment can be prevented
90 generate moisture condensation.
According to such fourth ventricle R4, in addition described heating part 4a, 4b heat IC equipment 90, can be more reliably prevented from
Or IC equipment 90 is inhibited to generate moisture condensation.
In addition, above-mentioned " predetermined time " is before an examination, IC equipment 90 to be made to rest on fourth ventricle R4, taken from fourth ventricle R4
When going out, the time of moisture condensation is not generated, is by testing obtained value.In addition, in above-mentioned experiment, preferably omit and pass through heating part
The heating that 4a, 4b are carried out.Thereby, it is possible to be prevented more reliably or inhibit IC equipment 90 to condense.
In addition, in check device 1, it is moved to fourth ventricle in the order from third room R3 in such as pallet 200a to 200c
During R4, from pallet 200c is moved to fourth ventricle R4, start the measurement of residence time.Arrive thereby, it is possible to prevent last movement
Pallet 200c IC equipment 90 generate moisture condensation.
In addition, in check device 1, movements of the pallet 200a to 200c from third room R3 to fourth ventricle R4, from fourth ventricle
Temperature and humidity in R4, which reach to rise in above-mentioned numberical range, to be carried out.If that is, temperature and humidity in fourth ventricle R4
Outside above-mentioned numberical range, then movements of the pallet 200a to 200c from third room R3 to fourth ventricle R4 is limited.So, by
Creating makes IC equipment 90 be difficult to pallet 200a to 200c just be made to be moved to fourth ventricle R4, Neng Gou after the environment for generating moisture condensation
IC equipment 90 is prevented or inhibited in fourth ventricle R4 and generates moisture condensation.
In addition, the air pressure of fourth ventricle R4 is more than atmospheric pressure, but below the air pressure of third room R3.As a result, for example, fast
Door 51 to 54 is in an open state, in a state that third room R3 is connected with fourth ventricle R4, even if opening the first switching door 701 or the
Two switching doors 702 can also make extraneous gas be difficult to enter in check device 1.
The method of air pressure as management fourth ventricle R4, is not particularly limited, can enumerate for example：Use the external gas of pump
Method that body imports, supply gas is connect using the air-supply of fan and with gas tank etc. etc..
In addition, when moving in and out pallet 200, any of the first switching door 701 and the second switching door 702 are opened, just
It can carry out the operation.As a result, pallet is carried out close to desired by the first switching door 701 and the second switching door 702, opening
200 part moved in and out is operated, and extraneous air can be inhibited to enter in fourth ventricle R4 as much as possible.
In addition, the first switching door 701 and the second switching door 702 are rotatable, the degree of folding can be adjusted.Therefore,
When moving in and out of pallet 200 is being carried out, is being minimum aperture by controlling the first switching door 701 or the second switching door 702, it can
Extraneous gas is inhibited to enter in fourth ventricle R4 as much as possible.
In addition, the first test section 703 of the folding of the first switching door 701 of detection and detection second are provided in protecgulum 70
Second test section 704 of the folding of switching door 702.These 703 and second test sections 704 of the first test section are passed respectively by such as magnetic
Sensor is formed, and is electrically connected with control unit 80.
By these 703 and second test sections 704 of the first test section, the first switching door 701 and the second folding can be detected
The folding of door 702.Therefore, in check device 1, the first switching door 701 and the second switching door 702 once to the predetermined time,
As open state, it will be able to by notice mechanism (not shown), notify that opening state is longer by operator.So, it is examining
It looks into device 1, since the folding of the first switching door 701 and the second switching door 702 is by time management, therefore, it is possible to as much as possible
Extraneous gas is inhibited to enter in fourth ventricle R4.
As described above, in check device 1, primary heating is carried out to the IC equipment 90 after inspection by heating part 4a, 4b,
And reheating is carried out in fourth ventricle R4.Therefore, it is possible to be effectively prevented or inhibit the IC equipment 90 taken out from check device 1
Generate moisture condensation.
Next, using flow chart shown in fig. 6, the control operation of check device 1 is illustrated.
First, start the inspection (step S101) of IC equipment 90.
90 quilt of IC equipment after checking is completed by the sequence of pallet feed region A1, feed region A2 and inspection area A3
It is placed in any one in the pallet 200a to 200c of recovery zone A4.
Then, by the work of heating part 4a, 4b, IC equipment 90 is heated (step S102).
At this moment, while the heating of heating part 4a, 4b start, make timer work (step S103) (not shown).
Then, in step S104, judge whether that timing finishes.In step S104, if it is determined that timing finishes, then regard
Heating for IC equipment 90 is abundant, and the pallet that IC equipment 90 is expelled to each pallet 200a to 200c removes region A5 (steps
S105)。
After the completion of the discharge of pallet 200a to 200c, i.e. pallet 200a to 200c is accommodated in pallet removal region A5
Afterwards, make timer work (step S106) (not shown).
Then, in step S107, judge whether that timing finishes.In step S107, if it is determined that timing finishes, then regard
Heating for IC equipment 90 is abundant, provides the notice (step S108) that can take out IC equipment 90 from pallet removal region A5.
So, according to check device 1, due to heating the electronic unit of low-temperature condition by heating part, therefore, it is possible to make
Temperature when taking out electronic unit from the electronic component handling apparatus becomes the temperature higher than low-temperature condition.Therefore, it is possible to prevent
Or electronic unit is inhibited to generate moisture condensation.
<Second embodiment>
Fig. 7 is the heating part that has of second embodiment for illustrating the electronic component inspection device of the present invention
Figure.
Hereinafter, with reference to these attached drawings, to the second of electronic component handling apparatus and electronic component inspection device of the invention
Embodiment illustrates, and is illustrated centered on the difference with the above embodiment, identical item is then omitted pair
Its explanation.
It is other identical with the first embodiment other than the composition difference of heating part in present embodiment.
As shown in fig. 7, in check device 1A, heating part 4c and heating part 4d are placed on pallet 200a to 200c by direction
90 irradiation light L of IC equipment and heat IC equipment 90 light source form.As this smooth L, as long as IC equipment 90 can be heated, then
It is not particularly limited, can use for example, infrared ray (far infrared) etc..
According to this heating part 4c, 4d, air-supply can be omitted as first embodiment.As a result, for example, heating
During the small IC equipment 90 of quality, it can prevent IC equipment 90 from being blown the movement of winged or position due to wind pressure.
<Third embodiment>
(a) of Fig. 8 is for illustrating that the third embodiment of the electronic component inspection device of the present invention has to (c)
The figure of second switching door.
Hereinafter, with reference to these attached drawings, the third of electronic component handling apparatus and electronic component inspection device to the present invention
Embodiment illustrates, and is illustrated centered on the difference with the above embodiment, identical item is then omitted pair
Its explanation.
In present embodiment, other than the composition difference of the second switching door, other equal and first embodiment phases
Together.
As shown in Fig. 8 (a) to (c), in check device 1B, the opening portion 700 of protecgulum 70 is provided with the first switching door 707
And second switching door 708.These 707 and second switching doors 708 of the first switching door are slidably disposed on to be prolonged in the X direction each other
On the orbit portion (not shown) stretched.First switching door 707 and the second switching door 702 are set in the Y direction with offseting one from another, and first
Switching door 707 is located at front side (Y-axis negative side), and the second switching door 708 is located at rear side (Y-axis positive side).
In the closed state shown in Fig. 8 (a), the first switching door 707 closes the left side of opening portion 700, the second switching door 708
Close the right side of opening portion 700.From this closed state, such as when taking out pallet 200, as shown in Fig. 8 (b), make first
Switching door 707 moves (slip) to the right, opens the first switching door 707.Thereby, it is possible to take out pallet 200.Wherein, by right
First switching door 707, which is opened, takes out 200 required aperture of pallet, and extraneous gas can be inhibited to flow into fourth ventricle as much as possible
In R4.
In addition, from the closed state shown in Fig. 8 (a), such as during taking-up pallet 200c, as shown in Fig. 8 (c),
Make second 708 to move to the left (slip), open second 708.Thereby, it is possible to take out pallet 200c.Wherein, by
Two 708 open take out the required aperture of pallet 200c and it is above-mentioned similarly, extraneous gas stream can be inhibited as much as possible
Enter in fourth ventricle R4.
More than, pass through diagram, the embodiment of electronic component handling apparatus and electronic component inspection device to the present invention
It is illustrated, however, the present invention is not limited thereto, forms each portion of electronic component handling apparatus and electronic component inspection device
To be formed arbitrarily replacement by can play said function.Object is formed arbitrarily in addition it is also possible to increase.
In addition, the electronic component handling apparatus and electronic component inspection device of the present invention can also be combination each implementation
Device in mode after arbitrary two or more composition (feature).
It is both temperature and humidity second Room is detected and is managed in addition, in each embodiment, but
The present invention is not limited thereto, even one in temperature and humidity, it can also prevent or inhibit electronic unit and generate moisture condensation.
In addition, in each embodiment, there are two heating part settings, however, the present invention is not limited thereto, for example, it is also possible to
It is one or three or more.
Symbol description
1 ... check device, 1A ... check devices, 1B ... check devices, 11A ... conveyor pallets structure,
11B ... conveyor pallets structure, 12 ... temperature adjustment sections, 13 ... equipment delivery heads, 14 ... equipment supply departments, 15 ...
Conveyor pallet structure, 16 ... inspection portions, 17 ... equipment delivery heads, 18 ... equipment recoverers, 19 ... recycling with pallets,
20 ... equipment delivery heads, 21 ... conveyor pallet structures, 22A ... conveyor pallets structure, 22B ... conveyor pallets structure,
3 ... administrative units, 31 ... temperature regulation sections, 32 ... humidity regulation portions, 4a ... heating parts, 4b ... heating parts,
4c ... heating parts, 4d ... heating parts, 41 ... heaters, 42 ... fans, 43 ... bearing parts, 44 ... rotation branch
Bearing portion, 51 ... shutters, 52 ... shutters, 53 ... shutters, 54 ... shutters, 61 ... first partitions, 62 ... second every
Plate, 63 ... third partition boards, 64 ... the 4th partition boards, 641 ... opening portions, 642 ... opening portions, 643 ... opening portions,
644 ... opening portions, 65 ... the 5th partition boards, 66 ... inboard partitions, 70 ... protecgulums, 700 ... opening portions, 701 ...
First switching door, 702 ... second switching doors, 703 ... first test sections, 704 ... second test sections, 705 ... rotations
Supporting part, 706 ... rotating support portions, 707 ... first, 708 ... second, 71 ... side covers, 711 ... first
Door, 712 ... second, 72 ... side covers, 721 ... first, 722 ... second, 73 ... rear covers, 731 ... the
One, 732 ... second, 733 ... third doors, 75 ... the 4th, 80 ... control units, 81 ... drive control parts,
82 ... check control unit, 83 ... storage parts, 90 ... IC equipment, 200 ... pallets, 200a ... pallets, 200b ...
Pallet, 200c ... pallets, A1 ... pallets feed region, A2 ... equipment feed region, A3 ... inspection areas, A4 ...
Equipment recovery zone, A5 ... pallets removal region, the first Room of R1 ..., R2 ... second Rooms, R3 ... thirds room, R4 ...
Fourth ventricle, L ... light, W ... hot-airs.
Claims (11)
1. a kind of electronic component handling apparatus, which is characterized in that have：
Place the placement section of electronic unit；And
With the placement part from and set and the electronic unit to being placed on the placement section heating heating part.
2. electronic component handling apparatus according to claim 1, the electronic unit has been carried out after regulation inspection
Electronic unit.
3. electronic component handling apparatus according to claim 1 or 2, the heating part can be in the side of the electronic unit
To air-supply.
4. electronic component handling apparatus according to claim 3, the wind is hot-air.
5. electronic component handling apparatus according to claim 1 or 2, the heating part has can be in the electronic unit
Direction irradiation light illumination region.
6. electronic component handling apparatus according to any one of claim 3 to 5, in the heating part, the wind or institute
Stating the transport direction of light can change.
7. electronic component handling apparatus according to any one of claim 1 to 6, the electronic unit is based on the result
It is rated, and is individually separated being arranged on position different from each other in the placement section, the heating part is at least described etc.
The forward electronic unit heating of grade.
8. electronic component handling apparatus according to any one of claim 1 to 7, the placement part is repeatedly set multiplely
The electronic unit is put,
It is first put so that the heat per unit time of the electronic unit that imparting is placed below more than assigning the heating part
The mode of the heat per unit time for the electronic unit put is heated.
9. electronic component handling apparatus according to any one of claim 1 to 8 has set the heating part first
Room and the second Room different from first Room,
The placement section is discharged to the second Room after the predetermined time is heated by the heating part from first Room.
10. electronic component handling apparatus according to any one of claim 1 to 9, there is set the heating part the
One Room and the second Room different from first Room,
The situation that the placement section is conveyed according to the electronic unit to the placement section is adjusted from first Room to described
The mobile time started of two Room.
11. a kind of electronic component inspection device, which is characterized in that have：
Check the inspection portion of electronic unit；
Place the placement section of electronic unit；And
With the placement part from and set and to be placed on the placement section the electronic unit heat heating part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-068274 | 2015-03-30 | ||
| JP2015068274A JP2016188782A (en) | 2015-03-30 | 2015-03-30 | Electronic component conveyance device and electronic component inspection device |
| PCT/JP2016/001029 WO2016157711A1 (en) | 2015-03-30 | 2016-02-25 | Electronic component conveyance device and electronic component inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108139440A true CN108139440A (en) | 2018-06-08 |
| CN108139440B CN108139440B (en) | 2020-11-13 |
Family
ID=57004180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680015718.5A Expired - Fee Related CN108139440B (en) | 2015-03-30 | 2016-02-25 | Electronic component conveying device and electronic component inspection device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016188782A (en) |
| CN (1) | CN108139440B (en) |
| TW (2) | TWI639012B (en) |
| WO (1) | WO2016157711A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598120A (en) | 2018-04-27 | 2018-09-28 | 京东方科技集团股份有限公司 | Display base plate and its manufacturing method, display panel and display device |
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| CN101248361A (en) * | 2005-08-25 | 2008-08-20 | 株式会社爱德万测试 | Electronic device testing device and its temperature control method |
| JP5186370B2 (en) * | 2006-07-27 | 2013-04-17 | 株式会社アドバンテスト | Electronic component transfer method and electronic component handling apparatus |
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2015
- 2015-03-30 JP JP2015068274A patent/JP2016188782A/en active Pending
-
2016
- 2016-02-25 WO PCT/JP2016/001029 patent/WO2016157711A1/en active Application Filing
- 2016-02-25 CN CN201680015718.5A patent/CN108139440B/en not_active Expired - Fee Related
- 2016-03-25 TW TW105109533A patent/TWI639012B/en not_active IP Right Cessation
- 2016-03-25 TW TW107114726A patent/TWI647466B/en not_active IP Right Cessation
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| JPH02134579A (en) * | 1988-11-16 | 1990-05-23 | Tokyo Electron Ltd | Transfer method |
| JPH05343490A (en) * | 1992-06-09 | 1993-12-24 | Hitachi Ltd | Method and apparatus for aging |
| JPH10300813A (en) * | 1997-04-30 | 1998-11-13 | Ando Electric Co Ltd | Ic heating device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2016188782A (en) | 2016-11-04 |
| WO2016157711A1 (en) | 2016-10-06 |
| TWI639012B (en) | 2018-10-21 |
| TW201634941A (en) | 2016-10-01 |
| TW201833567A (en) | 2018-09-16 |
| CN108139440B (en) | 2020-11-13 |
| TWI647466B (en) | 2019-01-11 |
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Effective date of registration: 20210630 Address after: Nagano, Japan Patentee after: North Star Technology Co.,Ltd. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
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