CN206226846U - Circuitboard manufacturing devices - Google Patents

Abstract

The utility model provides a kind of circuitboard manufacturing devices, and it has：Printed wiring board is delivered in delivery device, its production line to manufacture circuit board；Labelling apparatus, it is adjacent with delivery device, and marks out identification code on the printed wiring board delivered in having arrived production line；Printing equipment, it is adjacent with labelling apparatus, and by solder printing to being imprinted with the printed wiring board of identification code；Component mounter, be installed to element on the printed wiring board for being printed with solder by it；Reflow ovens, it is heated to the printed wiring board for being provided with element, and element and printed wiring board are welded together and circuit board is formed；First conveyer, it is configured between printing equipment and component mounter；And reading device, its identification code for reading the printed wiring board on the first conveyer, reading device is configured between printing equipment and component mounter, and is connected with component mounter via fitting machine connecting wiring.

Description

Circuitboard manufacturing devices

Technical field

The utility model is related to circuitboard manufacturing devices.

Background technology

Included by the printing process on the solder printing of paste to printed wiring board, by unit in the manufacturing process of circuit board Installation procedure and melt solder is made element and printed wiring board that part is installed on the printed wiring board for being printed with solder With reference to multiple operations such as operation.In the case where same circuit board is manufactured, in each operation of the manufacturing process of circuit board, dimension Hold turn into the state that the element of same circuit board is processed.

In addition, according to the difference of product scope, sometimes requiring that the circuit board of the slightly different multiple types of manufacture specification.At this In the case of, in the manufacturing process of circuit board, the processing in each operation carried out to printed wiring board becomes different.Therefore, need Reliably to select correct treatment.But, the treatment of mistake can be carried out in the manufacture of circuit board sometimes.

Utility model content

The utility model is to complete in view of the foregoing, and its problem is to provide the manufacture that can suppress in circuit board In carry out mistake treatment circuitboard manufacturing devices.

Used as the solution of above-mentioned problem, the scheme of an implementation method of illustration of the present utility model is a kind of circuit Board manufacturing apparatus, it has：Printed wiring board is delivered in delivery device, its production line to manufacture circuit board；Labelling apparatus, its It is adjacent with the delivery device, and mark out identification code onto the printed wiring board in the production line delivering； Printing equipment, it is adjacent with the labelling apparatus, and by solder printing to the printed wiring for being imprinted with the identification code On plate；Component mounter, be installed to for element on the printed wiring board for being printed with the solder by it；Reflow ovens, it is to peace The printed wiring board equipped with the element is heated, and the element is welded together and shape with the printed wiring board Into the circuit board；First conveyer, it is configured between the printing equipment and the component mounter；Second transports dress Put, it is configured between the component mounter and the reflow ovens；3rd conveyer, it is from the reflow ovens described in The opposition side of component mounter extends；Reading device, its institute for reading the printed wiring board on first conveyer State identification code；And solder appearance inspection device, the outward appearance of its solder to being printed on the printed wiring board carries out Check, the delivery device has the dispensing accumulator that can receive multiple printed wiring boards, the reading device configuration Between the printing equipment and the component mounter, and connect with the component mounter via fitting machine connecting wiring Connect, first conveyer has upstream side conveyer and downstream conveyer, the solder appearance inspection device It is configured between the upstream side conveyer and the downstream conveyer, the reading device has the reading upstream The upstream side reading device of the identification code of the printed wiring board on the conveyer of side, the upstream side reading device warp It is connected with the solder appearance inspection device by appearance inspection device connecting wiring.

An implementation method according to illustration of the present utility model, can suppress to carry out mistake in the manufacture of circuit board Treatment.

Brief description of the drawings

Fig. 1 is the schematic diagram of the circuitboard manufacturing devices of implementation method.

Fig. 2 is the schematic diagram of the dispensing accumulator of implementation method.

Fig. 3 is the schematic diagram of the mask member of implementation method.

Fig. 4 is the figure of of the welding for showing implementation method.

Fig. 5 is the figure of of the identification code for showing implementation method.

Fig. 6 is the figure along the VI directions of arrow in Fig. 1.

Fig. 7 is the side view of the 3rd conveyer.

Fig. 8 is the figure along the VIII arrows of Fig. 7.

Label declaration

1：Circuitboard manufacturing devices；2：Delivery device；3：Printing equipment；4：Component mounter；5：Reflow ovens；10：Printing Wiring plate；10i：Identification code；11：Element；12：Circuit board；20：Deliver accumulator；5s：Inner space；50：Control climate is filled Put；51：Heater；52：Conveyer in reflow ovens；91：First conveyer；91A：Upstream side conveyer；91B：Under Trip side conveyer；92：Second conveyer；93：3rd conveyer；100：Labelling apparatus；106：Reading device；106A： Upstream side reading device；107：Solder appearance inspection device；161：Fitting machine connecting wiring；162：Appearance inspection device connects cloth Line；190：Travel mechanism；191：Retainer；195：Air blower；L：Production line.

Specific embodiment

Hereinafter, implementation method of the present utility model is illustrated with reference to the accompanying drawings.In the following embodiments, as electricity One of road board manufacturing apparatus, is listed below circuitboard manufacturing devices and illustrates：To dispensing in the production line of manufacture circuit board Printed wiring board, implements multiple manufacturing procedures to manufacture circuit board successively.In the accompanying drawing that the following description is used, in order into To be capable of identify that the size of each component, the engineer's scale to each component has carried out appropriate change.

In the following description, XYZ vertical coordinate systems are set, the position to each component is come with reference to the XYZ vertical coordinate systems The relation of putting is illustrated.If the prescribed direction in horizontal plane is X-direction, if direction vertical with X-direction in the horizontal plane is Y side To if the direction (i.e. vertical direction) being respectively perpendicular with X-direction and Y-direction is Z-direction.

<Device entirety>

As shown in figure 1, circuitboard manufacturing devices 1 have：Delivery device 2；Printing equipment 3；Component mounter 4；Reflow ovens 5；Intermediate hopper 6；Appearance inspection device 7；Product accumulator 8 and conveyer 9.

The grade of printed wiring board 10 (including circuit board 12) is transported along the production line L for extending in the X direction.Hereinafter, exist In production line L etc., using the side of delivery device 2 as " upstream side (-X direction side) ", using the side of product accumulator 8 as " downstream (+X direction side) ".

<Conveyer>

Conveyer 9 has multiple (being for example in the present embodiment 4) (first conveyers of conveyer 91~94 91st, the second conveyer 92, the 3rd conveyer 93 and the 4th conveyer 94).In the present embodiment, it is lateral from upstream Downstream is arranged with order：Delivery device 2, labelling apparatus 100, printing equipment 3, the first conveyer 91, component mounter 4th, the second conveyer 92, reflow ovens 5, the 3rd conveyer 93, intermediate hopper 6, the 4th conveyer 94, visual examination dress Put 7 and product accumulator 8.

Specifically, the first conveyer 91 is configured between printing equipment 3 and component mounter 4.Second conveyer 92 are configured between component mounter 4 and reflow ovens 5.3rd conveyer 93 extends from reflow ovens 5 towards downstream.That is, Three conveyers 93 extend relative to reflow ovens 5 towards the opposition side of component mounter 4.3rd conveyer 93 is configured at backflow Between stove 5 and intermediate hopper 6.4th conveyer 94 is configured between intermediate hopper 6 and product accumulator 8.For example, fortune Send device 91~94 (upstream side conveyer 91A specifically, in the first conveyer 91 and downstream conveyer 91B, And the 3rd travel mechanism 190 in conveyer 93) it is ribbon conveyer.Conveyer 91~94 can separately drive It is dynamic.

<Delivery device>

Delivery device 2 is configured at the most upstream side (that is, upstream end) of production line L.Delivery device 2 throws printed wiring board 10 It is put into production line L.The rectangular tabular of printed wiring board 10.Delivery device 2 has delivers fortune in accumulator 20 and delivery device Send device 23.

As shown in Fig. 2 delivering accumulator 20 can receive multiple printed wiring boards 10.There is lifting to fill to deliver accumulator 20 Put 22 and multiple grooves 21.

Groove 21 has the supporting member 21a for extending in X direction.Supporting member 21a can support the Y side of printed wiring board 10 To two ends.The size of the inner space 21s of groove 21 is that can at least receive 1 size of printed wiring board 10.

Lowering or hoisting gear 22 can be such that multiple grooves 21 are lifted as a rigid body.Lowering or hoisting gear 22 can be to the height of groove 21 (position of Z-direction) carries out step-less adjustment.Lowering or hoisting gear 22 has ball-screw 22a and drive device 22b.Ball-screw The length of 22a is in Z-direction.Drive device 22b has motor.The rotary motion of motor is converted to edge by ball-screw 22a The linear motion of Z-direction.

As shown in figure 1, conveyer 23 is configured in the inner space 2s of delivery device 2 in delivery device.Delivery device Interior conveyer 23 can transport printed wiring board 10.For example, conveyer 23 is ribbon conveyer in delivery device.Deliver dress Putting interior conveyer 23 has the transport face 23a (upper tables that extend and can load printed wiring board 10 in the horizontal direction Face).

As shown in Fig. 2 when printed wiring board 10 is transported, lowering or hoisting gear 22 make the height of the supporting member 21a of groove 21 with The height alignment of the transport face 23a (reference picture 1) of conveyer 23 in delivery device.Specifically, the branch of supporting member 21a is made Bearing surface (upper surface) is alignd with the height of the transport face 23a of conveyer in delivery device 23.In the present embodiment, structure is supported Part 21a extends in X direction, also, transport face 23a extends in the horizontal direction, thereby, it is possible to will be accommodated in the printed wiring of groove 21 Plate 10 is successfully delivered to transport face 23a.

<Printing equipment>

As shown in figure 1, printing equipment 3 is configured at the downstream of delivery device 2 across labelling apparatus 100.Printing equipment 3 It is adjacent with labelling apparatus 100 (mark check device 104).

Printing equipment 3 extremely delivers on the printed wiring board 10 arrived in production line L solder printing.Printing equipment 3 has Conveyer 33 in mask member 30 (reference picture 3) and printing equipment.As shown in figure 3, being formed with mask member 30 many Individual hole 30h.What mask member 30 was made of metal.For example, mask member 30 is stainless steel being made.

Mask member 30 has rectangular plate shape.Multiple hole 30h are configured at and (are installed in printed wiring with element 11 Plate 10) (reference picture 4) the suitable position of portion of terminal.For example, element 11 is the electronic components such as capacitor.In top view, The shape rectangular shaped of hole 30h, triangle, pentagon shaped, round-shaped etc. are variously-shaped.

Mask member 30 have multiple (being for example in the present embodiment 2) mask portions 31,32 (the first mask portion 31 with And the second mask portion 32).First mask portion 31 and the second mask portion 32 are adjacent to each other.First mask portion 31 and the second mask Portion 32 has with the shape of the center 30c of mask member 30 (2 weight symmetry) rotationally symmetrical as symmetry axis.Accordingly, for printing Object, can once form 2 printed patterns.That is, printing of the solder on 2 printed wiring boards 10 can simultaneously be carried out.

In the present embodiment, printing is silk-screen printing (screen printing).For example, mask member 30 is covered as screen cloth Cover as printing object printed wiring board 10, the solder of paste is placed in mask member 30, make scraper with mask member Moved in the state of 30 surface contact.Thus, the solder of paste is attached to printed wiring board through the hole of mask member 30 10。

As shown in figure 1, conveyer 33 is configured in the inner space 3s of printing equipment 3 in printing equipment.Printing equipment Interior conveyer 33 can transport the printed wiring board 10 being moved in the inner space 3s of printing equipment 3.Fortune in printing equipment Send the downstream side transport of printed wiring board 10 that device 33 will be printed with solder.For example, conveyer 33 is band in printing equipment Formula conveyer.

<Component mounter>

Component mounter 4 is configured at the downstream of printing equipment 3 across the first conveyer 91.

Element 11 (reference picture 4) is attached to be printed with component mounter 4 printed wiring board 10 of solder.Component mounter 4 have component supplying apparatus 40, mouth 41, mobile device 42 and conveyer 43 in fitting machine.Component supplying apparatus 40 will The region of the supply of element 11 extremely regulation.Mouth 41 being capable of absorptive element 11.Mobile device 42 can make mouth 41 in the horizontal direction (XY directions) and above-below direction (Z-direction) are mobile.For example, adsorbing the element supplied from component supplying apparatus 40 by mouth 41 11, the element 11 that will be adsorbed is attached to the target location of printed wiring board 10.

Conveyer 43 is configured in the inner space 4s of component mounter 4 in fitting machine.Conveyer 43 in fitting machine The printed wiring board 10 being moved in the inner space 4s of component mounter 4 can be transported.Conveyer 43 will pacify in fitting machine Printed wiring board 10 equipped with element 11 downstream transport by side.For example, conveyer 43 is ribbon conveyer in fitting machine.

<Reflow ovens>

Reflow ovens 5 are configured at the downstream of component mounter 4 across the second conveyer 92.

The printed wiring board 10 that reflow ovens 5 pairs are provided with element 11 is heated, and element 11 is welded with printed wiring board 10 It is connected together and forms circuit board 12.Reflow ovens 5 have transports dress in atmosphere control device 50, heater 51 and reflow ovens Put 52.(hereinafter referred to as " oxygen is dense in reflow ovens by the oxygen concentration in the inner space 5s of reflow ovens 5 for atmosphere control device 50 Degree ".) remain than reflow ovens 5 exterior space (air) in oxygen concentration it is low.For example, oxygen concentration exists in reflow ovens More than 100ppm and below 2000ppm.Oxygen concentration is in more than 100ppm and below 800ppm more preferably in reflow ovens.

Heater 51 by the temperature of the inner space 5s of reflow ovens 5 (hereinafter referred to as " backflow in-furnace temperature ".) remain The temperature of regulation.Heater 51 makes the inner space 5s of reflow ovens 5 turn into optimal Temperature Distribution.Backflow in-furnace temperature according to Solder and it is different.For example, using in the case of lead-free solder, heater 51 is by the entrance (upstream side) of reflow ovens 5 150 degree or so are remained, near exit (downstream) is remained 110 degree or so, by the position as maximum temperature of midway Remain 250 degree or so.

The printed wiring board 10 that heater 51 pairs completes after solder printing and element installation carries out overall heating.Plus Thermal 51 only makes solder partial melting.Thus, by the wiring portion of the portion of terminal of element 11 and printed wiring board 10 by weldering Connect (reference picture 4) and combine, form circuit board 12.

Conveyer 52 is configured in the inner space 5s of reflow ovens 5 in reflow ovens.The energy of conveyer 23 in delivery device It is enough to transport the printed wiring board 10 being moved in the inner space 5s of reflow ovens 5.Conveyer 52 is by with can in reflow ovens Component substantially resistant to the hot heat resistance by heater 51 is formed.For example, conveyer 52 is made of metal in reflow ovens Ribbon conveyer.

<Intermediate hopper>

Intermediate hopper 6 is configured at the downstream of reflow ovens 5 across the 3rd conveyer 93.That is, intermediate hopper 6 is relative The side opposite with reflow ovens 5 is configured in the 3rd conveyer 93.

Intermediate hopper 6 can receive multiple circuit boards 12.Because intermediate hopper 6 is same with above-mentioned dispensing accumulator 20 The structure of sample, therefore, omit detail explanation.

<Appearance inspection device>

Appearance inspection device 7 is configured at the downstream of intermediate hopper 6 across the 4th conveyer 94.

Appearance inspection device 7 checks the outward appearance of circuit board 12.Appearance inspection device 7 has camera head 70, computer 71 And conveyer 72 in appearance inspection device.Camera head 70 shoots circuit board 12.For example, camera head 70 is camera. Camera head 70 is connected with computer 71.Computer 71 has memory 71a and processor 71b.

For example, the shooting result of camera head 70 is (hereinafter referred to as " shooting image ".) it is exported to computer 71.Computer 71 pairs of benchmark images being stored in memory 71a are contrasted with shooting image, by circuit board 12 be judged to " certified products " or Person's " defective work ".Specifically, difference feelings the threshold value of regulation below of the computer 71 in benchmark image and shooting image Under condition, it is judged to " certified products ".Computer 71 in the case where the difference of benchmark image and shooting image exceedes the threshold value of regulation, It is judged to " defective work ".For example, computer 71 is when that the welding portion in circuit board 12 is present is bad or on the circuit board 12 In the case of being attached with foreign matter, it is judged to " defective work ".Thereby, it is possible to avoid the outflow of defective work.

In addition, the visual examination of circuit board 12 in reflow ovens 5 sometimes for than welding the time long.In the situation Under, it is possible to create between reflow ovens 5 and appearance inspection device 7 the need for the travelling speed of adjustment circuit plate 12.But, according to Present embodiment, due to configuring intermediate hopper 6 between reflow ovens 5 and appearance inspection device 7, therefore, even if in circuit board In the case of 12 visual examination needs for a long time, it is also possible to which the circuit board 12 that will be transported from reflow ovens 5 is accommodated in centre successively In accumulator 6.Therefore, though circuit board 12 visual examination need it is prolonged in the case of, it is not required that reflow ovens 5 with The travelling speed of adjustment circuit plate 12 between appearance inspection device 7, is preferred.

Conveyer 72 is configured in the inner space 7s of appearance inspection device 7 in appearance inspection device.Visual examination is filled Putting interior conveyer 72 can transport the circuit board 12 being moved in the inner space 7s of appearance inspection device 7.Visual examination is filled Put interior conveyer 72 and will be judged to that the circuit board 12 of " certified products " transports downstream side.For example, being transported in appearance inspection device Device 72 is ribbon conveyer.

<Product accumulator>

Product accumulator 8 is configured at the downstream of appearance inspection device 7.Product accumulator 8 can receive multiple circuit boards 12.Because product accumulator 8 is the structure same with above-mentioned dispensing accumulator 20, therefore, omit detail explanation.

The circuit board 12 of " certified products " is judged as in being only accommodated in appearance inspection device 7 in product accumulator 8.Storage Circuit board 12 in product accumulator 8 outside production line L (offline) is made whether that (function is examined for the inspection that normally acts Look into).

<Labelling apparatus>

Circuitboard manufacturing devices 1 also have labelling apparatus 100.Labelling apparatus 100 are adjacent with delivery device 2.Labelling apparatus 100 are configured between delivery device 2 and printing equipment 3.Labelling apparatus 100 are by identification code (for example, the identification code shown in Fig. 5 10i) it is imprinted on the printed wiring board 10 delivered and arrived in production line L.In the present embodiment, identification code 10i (reference picture 5) Comprising the multiple points for being configured to ranks shape.Labelling apparatus 100 have storage device 101, laser drawing apparatus 102, cleaning device 103 and mark check device 104.

<Storage device>

Storage device 101 stores identification code.In the present embodiment, being previously stored with storage device 101 to show Identification code (for example, the identification code 10i shown in Fig. 5) on to printed wiring board 10.Identification code is when in circuitboard manufacturing devices 1 The wiring of the inside of middle manufacture printed wiring board 10 and it is installed on the element 11 (electronic component for using) of printed wiring board 10 Used in the case of the circuit board 12 of different multiple species.

<Laser drawing apparatus>

Laser drawing apparatus 102 is adjacent with delivery device 2.Laser drawing apparatus 102 is configured at the downstream of delivery device 2 Side.Laser drawing apparatus 102 can describe the identification code for being stored in storage device 101.Laser drawing apparatus 102 has laser light Source 120, mobile device 121 and conveyer 122 in drawing apparatus.LASER Light Source 120 can shine towards printed wiring board 10 Penetrate laser.Multiple laser that LASER Light Source 120 has n rows × m row (being for example in the present embodiment 16 row × 16 row) are projected Portion.LASER Light Source 120 can be switched on and off according to each laser injection part.

Mobile device 121 can make LASER Light Source 120, and (XY directions) and above-below direction (Z-direction) are moved in the horizontal direction It is dynamic.For example, after the predetermined region 10a (reference picture 5) for making LASER Light Source 120 be moved to printed wiring board 10, making laser light The laser injection part of the regulation ranks (for example, ranks corresponding with the identification code 10i shown in Fig. 5) in source 120 is opened, to printing The predetermined region 10a irradiation laser of wiring plate 10.Thus, by the rule of identification code 10i (reference picture 5) markings to printed wiring board 10 In determining region 10a.

Conveyer 122 is configured at the inner space 102s of laser drawing apparatus 102 in drawing apparatus.Fortune in drawing apparatus Sending device 122 can transport the printed wiring board 10 being moved in the inner space 102s of laser drawing apparatus 102.Drawing apparatus Interior conveyer 122 will be imprinted with the downstream side transport of printed wiring board 10 of identification code 10i.For example, being transported in drawing apparatus Device 122 is ribbon conveyer.

<Cleaning device>

Cleaning device 103 is adjacent with laser drawing apparatus 102.Cleaning device 103 is configured under laser drawing apparatus 102 Trip side.As shown in fig. 6, cleaning device 103 has brush 130, drive device 131, pipeline 132, dust collect plant 133 and sanitizer cartridge Put interior conveyer 134.

Brush 130 has axle portion 130b and multiple bristle 130a.A part (that is, multiple bristles of at least end of brush 130 A part of 130a) can be contacted with printed wiring board 10.The cardinal extremity of bristle 130a is connected with axle portion 130b.Axle portion 130b has There is axis 130c along the Y direction.Drive device 131 makes brush 130 rotate or vibrate.Drive device 131 can make brush 130 with Rotated centered on axis 130c.For example, drive device 131 is vibrating motor.

Pipeline 132 extends in the cleaning device deviously between the top of conveyer 134 and dust collect plant 133.Pipeline 132 one end is configured at the top of printed wiring board 10.One end of pipeline 132 is open towards brush 130.The other end of pipeline 132 It is connected with dust collect plant 133.Dust collect plant 133 collects the dust on printed wiring board 10 via pipeline 132.

When the position of the regulation in the inner space 103s that printed wiring board 10 has been moved to cleaning device 103, collection Dirt device 133 starts.That is, in the cleaning of printed wiring board 10, dust collect plant 133 starts.And, in printed wiring board 10 During cleaning, drive device 131 makes the rotation (to arrow V1 directions) clockwise centered on axis 130c of brush 130.Thereby, it is possible to logical Brush 130 is crossed to brush off the trickle dirt such as the dust produced during by identification code 10i (reference picture 5) markings to printed wiring board 10 Angstrom, and these dust are collected via pipeline 132 by dust collect plant 133.Therefore, it is possible to remove the dirt on printed wiring board 10 Angstrom.

Conveyer 134 is configured in the inner space 103s of cleaning device 103 in cleaning device.Transported in cleaning device Device 134 can transport the printed wiring board 10 being moved in the inner space 103s of cleaning device 103.Transported in cleaning device Device 134 will eliminate the printed wiring board 10 after the cleaning of dust, and downstream side is transported.For example, conveyer in cleaning device 134 is ribbon conveyer.For convenience, in Fig. 1, eliminated in cleaning device 103 in cleaning device conveyer 134 with The diagram of outer structural element.

<Mark check device>

As shown in figure 1, mark check device 104 is adjacent with cleaning device 103.Mark check device 104 is relative to cleaning Device 103 is configured at the side opposite with laser drawing apparatus 102.That is, mark check device 104 is configured at cleaning device 103 Downstream.

The identification code 10i (reference picture 5) that 104 pairs, mark check device is marked on printed wiring board 10 is checked.Mark Note check device 104 has camera head 140, computer 141 and conveyer 142 in check device.

Camera head 140 shoots to the printed wiring board 10 on conveyer in check device 142.Camera head 140 couples of identification code 10i (reference picture 5) marked on printed wiring board 10 shoot.For example, camera head 140 is photograph Machine.Camera head 140 is connected with computer 141.Computer 141 has memory 141a and processor 141b.

For example, the shooting result of camera head 140 is (hereinafter referred to as " shooting identification code ".) it is exported to computer 141.Meter The benchmark identification code that 141 pairs, calculation machine is stored in memory 141a is contrasted with identification code is shot, and printed wiring board 10 is sentenced It is set to " certified products " or " defective work ".Specifically, computer 141 is in benchmark identification code and shooting identification code identical feelings Under condition, it is judged to " certified products ".Computer 141 is judged to " not conform in the case where benchmark identification code is different from identification code is shot Lattice product ".For example, computer 141 is wrong in the part missing or the connected situation of 2 adjacent points or point of identification code Carve by mistake in the case of, it is judged to " defective work ".The situation of the part missing of identification code includes at least a portion of point The situation of missing.

Conveyer 142 is configured in the inner space 104s of mark check device 104 in check device.In check device Conveyer 142 can be conveyed through the printed wiring board 10 of cleaning device 103.That is, the energy of conveyer 142 in check device It is enough to transport the printed wiring board 10 being moved in the inner space 104s of mark check device 104.Conveyer in check device The 142 downstream side transports of printed wiring board 10 that will be judged to " certified products ".For example, conveyer 142 is band in check device Formula conveyer.

<Reading device>

Circuitboard manufacturing devices 1 also have reading device 106.Reading device 106 reads the print on the first conveyer 91 The identification code of brush wiring plate 10.Reading device 106 is configured between printing equipment 3 and component mounter 4.

Reading device 106 has multiple (being for example in the present embodiment 2) reading device 106A, 106B (upstream sides Reading device 106A and downstream reading device 106B).

Reading device 106A in upstream side reads the identification code of the printed wiring board 10 on upstream side conveyer 91A.Downstream Reading device 106B in side reads the identification code of the printed wiring board 10 on downstream conveyer 91B.For example, reading device 106A, 106B are cameras.

Reading device 106A, 106B are connected via fitting machine connecting wiring 161 with component mounter 4.For example, according to reading The reading result of device 106A, 106B to identification code is taken, in electronic component with placing graphic pattern and the pattern phase determined by identification code In the case of, component mounter 4 continues to drive.On the other hand, electronic component with placing graphic pattern with determined by identification code In the case of pattern difference, component mounter 4 stops driving.

Upstream side reading device 106A via appearance inspection device connecting wiring 162 with solder appearance inspection device 107 Connection.For example, according to upstream side reading device 106A to the reading result of identification code, solder printed patterns with by identification code In the case of the pattern identical of determination, component mounter 4 continues to drive.On the other hand, solder printed patterns with by recognizing In the case of the pattern difference that code determines, component mounter 4 stops driving.

<Solder appearance inspection device>

Circuitboard manufacturing devices 1 also have solder appearance inspection device 107.Solder appearance inspection device 107 pairs is in printing The outward appearance of the solder printed on wiring plate 10 is checked.Solder appearance inspection device 107 is configured at upstream side conveyer 91A Between downstream conveyer 91B.Solder appearance inspection device 107 has camera head 170, computer 171 and checks Conveyer 172 in device.

Camera head 170 shoots to the printed wiring board 10 on conveyer in check device 172.Camera head 170 pairs of solders printed on printed wiring board 10 shoot.For example, camera head 170 is camera.Camera head 170 It is connected with computer 171.Computer 171 has memory 171a and processor 171b.

For example, the shooting result of camera head 170 (hereinafter referred to as " shoots solder image ".) it is exported to computer 171. The benchmark solder image that 171 pairs, computer is stored in memory 171a is contrasted with solder image is shot, by printed wiring board 10 are judged to " certified products " or " defective work ".Specifically, computer 171 is in benchmark solder image and shooting solder image Difference regulation threshold value below in the case of, be judged to " certified products ".Computer 171 is welded in benchmark solder image with shooting In the case of expecting that the difference of image exceedes the threshold value of regulation, it is judged to " defective work ".For example, computer 171 is the one of solder In the case that the situation or solder that part is peeled off or 2 adjacent solders are connected are printed by mistake, it is judged to " unqualified Product ".The situation that a part for solder is peeled off includes the situation that at least a portion of the printed patterns of solder is peeled off.

Conveyer 172 is configured in the inner space 107s of solder appearance inspection device 107 in check device.Check dress Putting interior conveyer 172 can transport the printed wiring board being moved in the inner space 107s of solder appearance inspection device 107 10.Conveyer 172 will be judged to the downstream side transport of printed wiring board 10 of " certified products " in check device.For example, checking Conveyer 172 is ribbon conveyer in device.

<3rd conveyer>

3rd conveyer 93 has travel mechanism 190, retainer 191 and air blower 195.

<Travel mechanism>

Travel mechanism 190 makes the circuit board 12 transported from reflow ovens 5 be moved to intermediate hopper 6.For example, travel mechanism 190 is ribbon conveyer.

<Retainer>

As shown in fig. 7, retainer 191 and air blower 195 move along mechanism 190 configuring.Retainer 191 can make from The circuit board 12 that reflow ovens 5 are transported stops.In the present embodiment, circuit board 12 is transported successively one by one from reflow ovens 5.Cause This, at retainer 191, circuit board 12 stops one by one.Retainer 191 can be relative to the circuit in travel mechanism 190 The transport path of plate 12 is retreated.Retainer 191 has arm 192, e axle supporting portion 193 and drive device 194.

As shown in figure 8, arm 192 is in L-shaped.E axle supporting portion 193 supports the cardinal extremity of arm 192.E axle supporting portion 193 has Rotation axis 193a along the X direction.Drive device 194 has can be such that arm 192 is rotated centered on rotation axis 193a Motor.

In the transport of circuit board 12, drive device 194 make arm 192 centered on rotation axis 193a clockwise (to The direction of arrow V11) rotation.Thus, retainer 191 is kept out of the way from the transport path of the circuit board 12 in travel mechanism 190.From return The circuit board 12 that stream stove 5 is transported is transported (reference picture 7) towards intermediate hopper 6.

When circuit board 12 stops, drive device 194 make arm 192 centered on rotation axis 193a counterclockwise (to The direction of the rightabout arrow V12 of arrow V11) rotation.Thus, the circuit board 12 that retainer 191 enters in travel mechanism 190 Transport path.The circuit board 12 transported from reflow ovens 5 is stopped device 191 to be stopped (reference picture 7).

When circuit board 12 stops, the end of arm 192 approaches with the part of the +Y direction side of travel mechanism 190.Arm 192 length (from cardinal extremity to the length of the Y-direction of end) is shorter than the width (length of Y-direction) of travel mechanism 190.Thus, Compared with situation of the length of arm 192 more than the width of travel mechanism 190 is made, arm 192 can be made successfully to rotate (that is, improving the mobility of arm 192).Therefore, it is possible to make retainer 191 relative to the circuit board 12 in travel mechanism 190 Transport path is successfully retreated.

<Air blower>

As shown in fig. 7, air blower 195 is adjacent with retainer 191.Air blower 195 is towards the circuit board transported from reflow ovens 5 12 air-supplies.

Air blower 195 has the fan 197 around the rotation of axis 196.Fan 197 send on along the direction of axis 196 Wind.For example, fan 197 is the aerofoil fans such as propeller type fan.

In the side view of Fig. 7, the axis 196 of air blower 195 intersects with the transport face 190a of travel mechanism 190.Specifically For, the axis 196 of air blower 195 is inclined relative to the transport face 190a of travel mechanism 190.In the side view of Fig. 7, air blast The axis 196 of machine 195 is inclined in the way of more leaning on +X direction side to be then more partial to -Z direction.

In cooling circuit board 12, in addition to stopping the driving of travel mechanism 190, also carry out based on retainer 191 Stop.In cooling circuit board 12, air blower 195 is blown towards the circuit board 12 that device 191 stops is stopped.

As described above, the circuitboard manufacturing devices 1 of above-mentioned implementation method have：Delivery device 2, it is to manufacture Printed wiring board 10 is delivered in the production line L of circuit board 12；Labelling apparatus 100, it is adjacent with delivery device 2, and delivers Identification code 10i is marked on the printed wiring board 10 arrived in production line L；Printing equipment 3, it is adjacent with labelling apparatus 100, and By solder printing to being imprinted with the printed wiring board 10 of identification code 10i；Component mounter 4, element 11 is installed to printing by it Have on the printed wiring board 10 of solder；Reflow ovens 5, it is heated to the printed wiring board 10 for being provided with element 11, by element 11 weld together and form circuit board 12 with printed wiring board 10；First conveyer 91, it is configured at printing equipment 3 with unit Between part fitting machine 4；Second conveyer 92, it is configured between component mounter 4 and reflow ovens 5；3rd conveyer 93, It extends from reflow ovens 5 towards the opposition side of component mounter 4；And reading device 106, it is read on the first conveyer 91 Printed wiring board 10 identification code, delivery device 2 has can receive the dispensing accumulator 20 of multiple printed wiring boards 10, read Take device 106 to be configured between printing equipment 3 and component mounter 4, and pacify with element via fitting machine connecting wiring 161 Installation 4 is connected.

According to the structure, reading device 106 is configured between printing equipment 3 and component mounter 4, and via fitting machine Connecting wiring 161 and be connected with component mounter 4, thus, in the upstream side of component mounter 4, be able to confirm that printed wiring board 10 identification code.Therefore, it is possible to suppress to carry out wrong treatment in the manufacture of circuit board 12.Even for example, in element peace Installation 4 in change electronic component with placing graphic pattern in the case of, it is also possible to by printed wiring board 10 be moved to element install Identification code is confirmed before machine 4, therefore, it is possible to suppress to carry out wrong treatment in element is installed.

Additionally, according to the structure, the circuitboard manufacturing devices are also with the solder to being printed on printed wiring board 10 The solder appearance inspection device 107 that outward appearance is checked, the first conveyer 91 has upstream side conveyer 91A and downstream Side conveyer 91B, solder appearance inspection device 107 be configured at upstream side conveyer 91A and downstream conveyer 91B it Between, dress is read in the upstream side that reading device 106 has the identification code for reading the printed wiring board 10 on upstream side conveyer 91A 106A is put, upstream side reading device 106A connects via appearance inspection device connecting wiring 162 with solder appearance inspection device 107 Connect, thus, serve following effect.

Because the outward appearance of solder that can be in the upstream side of component mounter 4 to being printed on printed wiring board 10 is examined Look into, and confirm whether the printed patterns of solder are identical with the pattern determined by identification code, therefore, it is possible to more effectively suppress Element carries out the treatment of mistake in installing.

Additionally, according to the structure, the 3rd conveyer 93 has：Travel mechanism 190, it moves circuit board 12；Stop Device 191, its circuit board 12 for making to be transported from reflow ovens 5 stops, and can be relative to the circuit board 12 in travel mechanism 190 Transport path is retreated；And air blower 195, it is adjacent with retainer 191, therefore, serve following effect.

The circuit board 12 in oxygen (air) that will can be transported from reflow ovens 5 by air blower 195 is rapid cold But.Therefore, it is possible to the oxidation of the metal part of suppression circuit plate 12.Furthermore it is possible to suppress in circuit board 12 produce oxidation with Outer chemical reaction.Therefore, it is possible to suppress the deterioration such as oxidation in circuit board 12.

In addition, it is considered that when making to stop from the circuit board 12 that reflow ovens 5 are transported, as long as stopping travel mechanism 190 Drive.But, only stop the driving of travel mechanism 190, there is the deviation of circuit board 12 target transported from reflow ovens 5 and stop The possibility that stop bit is put.And according to the structure of present embodiment, due to moving along the configuration retainer 191 of mechanism 190, accordingly, it is capable to It is enough easily circuit board 12 is stopped in target stop position by retainer 191.Even if for example, despite should stop Position firmly but circuit board 12 is also in the case of movement, by stopping except the driving of travel mechanism 190 in addition to also carry out Based on the stopping of retainer 191, circuit board 12 can be made to be slided on the transport face 190a of travel mechanism 190 and stopped.

The utility model is not limited to above-mentioned implementation method, carried out in the range of its purport various design changes that can not depart from More.

For example, in the above-described embodiment, as identification code 10i, listing and being made up of the multiple points for being configured to ranks shape Example be illustrated, but not limited to this.For example, identification code can be word, figure, mark, it is also possible to by word, figure And at least one of mark combines.

Additionally, in the above-described embodiment, list reading device 106 be configured at printing equipment 3 and component mounter 4 it Between example illustrate, but not limited to this.For example, reading device 106 can also be configured to lean on upstream side than printing equipment 3. As long as reading device 106 is configured at following location：Even changing matching somebody with somebody for electronic component in the manufacture of circuit board 12 In the case of placing graphic pattern, by confirming identification code before important procedure, it becomes possible to recover.For example, important procedure includes printing Operation and assembly process.

Additionally, in the above-described embodiment, listing when circuit board 12 is cooled down, except the driving of travel mechanism 190 stops Outside only, the example for also carrying out the stopping based on retainer 191 is illustrated, but not limited to this.For example, it is also possible to be, cold But during circuit board 12, travel mechanism 190 is still driving, and only carries out the stopping based on retainer 191.

Additionally, in the above-described embodiment, as LASER Light Source 120, listing the multiple laser with 16 row × 16 row The example of injection part is illustrated, but not limited to this.For example, the quantity of laser injection part can also be that 15 row × 15 row are following, Or 17 row × 17 row more than.Laser injection part can according to the appearance of the identification code that should be shown on printed wiring board 10 come Suitably changed.

Additionally, in the above-described embodiment, in the cleaning of printed wiring board 10, listing drive device 131 makes brush 130 The example turned clockwise centered on axis 130c is illustrated, but not limited to this.For example, in the cleaning of printed wiring board 10 When, can vibrate brush 130, it is also possible to brush 130 is rotated while vibrating.

Claims (3)

1. a kind of circuitboard manufacturing devices, it is characterised in that the circuitboard manufacturing devices have：

Printed wiring board is delivered in delivery device, its production line to manufacture circuit board；

Labelling apparatus, it is adjacent with the delivery device, and delivers to the printed wiring board in the production line On mark out identification code；

Printing equipment, it is adjacent with the labelling apparatus, and by solder printing to the printing for being imprinted with the identification code On wiring plate；

Component mounter, be installed to for element on the printed wiring board for being printed with the solder by it；

Reflow ovens, it is heated to the printed wiring board for being provided with the element, by the element and the printing cloth Line plate weld forms the circuit board together；

First conveyer, it is configured between the printing equipment and the component mounter；

Second conveyer, it is configured between the component mounter and the reflow ovens；

3rd conveyer, it extends from the reflow ovens towards the opposition side of the component mounter；

Reading device, its identification code for reading the printed wiring board on first conveyer；And

Solder appearance inspection device, the outward appearance of its solder to being printed on the printed wiring board checks,

The delivery device has the dispensing accumulator that can receive multiple printed wiring boards,

The reading device is configured between the printing equipment and the component mounter, and via fitting machine connecting wiring And be connected with the component mounter,

First conveyer has upstream side conveyer and downstream conveyer,

The solder appearance inspection device is configured between the upstream side conveyer and the downstream conveyer,

The reading device has the upper of the identification code of the printed wiring board on the reading upstream side conveyer Trip side reading device,

The upstream side reading device is connected via appearance inspection device connecting wiring with the solder appearance inspection device.

2. circuitboard manufacturing devices according to claim 1, it is characterised in that

The reflow ovens have：

Atmosphere control device, oxygen concentration in inner space of the reflow ovens is remained the outside than the reflow ovens for it Oxygen concentration in space is low；

Heater, its temperature that temperature of the inner space is remained regulation；And

Conveyer in reflow ovens, it is configured in the inner space, and can be transported and be moved in the inner space The printed wiring board.

3. circuitboard manufacturing devices according to claim 1, it is characterised in that

3rd conveyer has：

Travel mechanism, it moves the circuit board；

Retainer, its described circuit board for making to be transported from the reflow ovens stops, and can be relative in the travel mechanism The circuit board transport path retreat；And

Air blower, it is adjacent with the retainer.