CN206181579U - Circuit board manufacturing installation - Google Patents
Circuit board manufacturing installation Download PDFInfo
- Publication number
- CN206181579U CN206181579U CN201621219829.1U CN201621219829U CN206181579U CN 206181579 U CN206181579 U CN 206181579U CN 201621219829 U CN201621219829 U CN 201621219829U CN 206181579 U CN206181579 U CN 206181579U
- Authority
- CN
- China
- Prior art keywords
- printed wiring
- wiring board
- vehicle
- identification code
- reflow ovens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
- 238000009434 installation Methods 0.000 title abstract description 4
- 238000007639 printing Methods 0.000 claims abstract description 44
- 238000003860 storage Methods 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims description 35
- 238000002372 labelling Methods 0.000 claims description 24
- 239000000428 dust Substances 0.000 claims description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 4
- 235000006679 Mentha X verticillata Nutrition 0.000 abstract 2
- 235000002899 Mentha suaveolens Nutrition 0.000 abstract 2
- 235000001636 Mentha x rotundifolia Nutrition 0.000 abstract 2
- 230000032258 transport Effects 0.000 description 23
- 238000007689 inspection Methods 0.000 description 17
- 230000002950 deficient Effects 0.000 description 8
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 230000000007 visual effect Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008034 disappearance Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- RSMUVYRMZCOLBH-UHFFFAOYSA-N metsulfuron methyl Chemical compound COC(=O)C1=CC=CC=C1S(=O)(=O)NC(=O)NC1=NC(C)=NC(OC)=N1 RSMUVYRMZCOLBH-UHFFFAOYSA-N 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a circuit board manufacturing installation, it has: put in the device, put in the printed wiring board in its production line to manufacturing circuit board, the mark device, it is adjacent with the input device to mint -mark identification code on having rendered to the printed wiring board in the production line, printing device, it is adjacent with the mark device to it has the identification code to print the mint -mark with the solder on the printed wiring board, component installation machine, it installs the component on the printed wiring board that the printing has the solder, reflow oven, its printed wiring board to installing the component heats, is in the same place component and printed wiring board welding and the forming circuit board, a conveyor, the 2nd conveyor, and the 3rd conveyor, the mark device has the storage device of storage identification code.
Description
Technical field
This utility model is related to circuitboard manufacturing devices.
Background technology
In the manufacture of circuit board, sometimes require that by same manufacture device manufacture the wiring of printed wiring intralaminar part with
And various circuit boards that the electronic component that uses is different.In this case, when circuit board dispatches from the factory, circuit board group is being loaded on into other
In subsequent handling of device etc., the mistake of circuit board is easily produced.
In the past, in order to avoid the mistake of substrate, would indicate that the labels such as paper, the resin flake of identification code are pasted on printing cloth
On line plate.But, in this case, the patch that label is produced sometimes is wrong.
Utility model content
This utility model is completed in view of the foregoing, and its problem is that offer can avoid being shown in printing
The wrong circuitboard manufacturing devices of the identification code on wiring plate.
Used as the solution of above-mentioned problem, the scheme of an embodiment of illustration of the present utility model is a kind of circuit
Board manufacturing apparatus, it has:Delivery device, it throws in printed wiring board in production line to manufacture circuit board;Labelling apparatus, its
It is adjacent with the delivery device, and mark identification code on the printed wiring board in the production line has been rendered to;Print
Brush device, it is adjacent with the labelling apparatus, and by solder printing to the printed wiring board for being imprinted with the identification code
On;Component mounter, it is installed to element on the printed wiring board for being printed with the solder;Reflow ovens, it is to installing
The printed wiring board for having the element is heated, and the element is welded together with the printed wiring board and is formed
The circuit board;First vehicle, it is configured between the printing equipment and the component mounter;Second transports dress
Put, it is configured between the component mounter and the reflow ovens;And the 3rd vehicle, it is from the reflow ovens direction
The opposition side of the component mounter extends, and the delivery device has the input storage that can receive multiple printed wiring boards
Glassware, the printing equipment has mask member made by the metal for being formed with multiple holes, and the reflow ovens have:Control climate
Device, oxygen concentration in inner space of the reflow ovens is remained the oxygen in the space outerpace than the reflow ovens for it
Concentration is low;Heater, temperature of the inner space is remained the temperature of regulation for it;And vehicle in reflow ovens,
It is configured in the inner space, and can transport the printed wiring board being moved in the inner space, described
Labelling apparatus also have:Storage device, its described identification code of storage;Laser drawing apparatus, it can describe and is stored in described depositing
The identification code of storage device;And cleaning device, it is adjacent with the laser drawing apparatus, and the cleaning device has:Brush,
A part for its at least end can be contacted with the printed wiring board;Driving means, it makes the brush rotation or vibrates;Pipe
Road, its one end is towards the brush opening;And dust collect plant, it is connected with the other end of the pipeline.
According to an embodiment of illustration of the present utility model, the knowledge that be shown on printed wiring board can be avoided
The mistake of other code.
Description of the drawings
Fig. 1 is the schematic diagram of the circuitboard manufacturing devices of embodiment.
Fig. 2 is the schematic diagram of the input accumulator of embodiment.
Fig. 3 is the schematic diagram of the mask member of embodiment.
Fig. 4 is the figure of of the welding for illustrating embodiment.
Fig. 5 is the figure of of the identification code for illustrating embodiment.
Fig. 6 is the figure along the VI directions of arrow in Fig. 1.
Label declaration
1:Circuitboard manufacturing devices;2:Delivery device;3:Printing equipment;4:Component mounter;5:Reflow ovens;10:Printing
Wiring plate;10i:Identification code;11:Element;12:Circuit board;20:Throw in accumulator;30:Mask member;30h:Hole;5s:It is internal
Space;50:Atmosphere control device;51:Heater;52:Vehicle in reflow ovens;91:First vehicle;92:Second
Vehicle;93:3rd vehicle;100:Labelling apparatus;101:Storage device;102:Laser drawing apparatus;103:Cleaning
Device;104:Mark check device;130:Brush;131:Driving means;132:Pipeline;133:Dust collect plant;140:Camera head;
141:Computer;141a:Memorizer;141b:Processor;142:Vehicle in check device;L:Production line.
Specific embodiment
Hereinafter, embodiment of the present utility model illustrated with reference to the accompanying drawings.In the following embodiments, as electricity
One of road board manufacturing apparatus, is listed below circuitboard manufacturing devices and illustrates:Throw in in the production line of manufacture circuit board
Printed wiring board, implements successively multiple manufacturing procedures to manufacture circuit board.In the accompanying drawing that the following description is used, in order to into
To be capable of identify that the size of each component, appropriate change is carried out to the scale of each component.
In the following description, XYZ vertical coordinate systems are set, the position to each component is come with reference to the XYZ vertical coordinate systems
The relation of putting is illustrated.If the prescribed direction in horizontal plane is X-direction, if direction vertical with X-direction in the horizontal plane is Y side
To if the direction (i.e. vertical direction) being respectively perpendicular with X-direction and Y-direction is Z-direction.
<Device entirety>
As shown in figure 1, circuitboard manufacturing devices 1 have:Delivery device 2;Printing equipment 3;Component mounter 4;Reflow ovens
5;Intermediate hopper 6;Appearance inspection device 7;Product accumulator 8 and conveyer 9.
The grade of printed wiring board 10 (including circuit board 12) is transported along the production line L for extending in the X direction.Hereinafter, exist
In production line L etc., using the side of delivery device 2 as " upstream side (-X direction side) ", using the side of product accumulator 8 as
" downstream (+X direction side) ".
<Conveyer>
Conveyer 9 has multiple (being for example in the present embodiment 4) (the first vehicles of vehicle 91~94
91st, the second vehicle 92, the 3rd vehicle 93 and the 4th vehicle 94).In the present embodiment, it is lateral from upstream
Downstream is arranged with order:Delivery device 2, labelling apparatus 100, printing equipment 3, the first vehicle 91, component mounter
4th, the second vehicle 92, reflow ovens 5, the 3rd vehicle 93, intermediate hopper 6, the 4th vehicle 94, visual examination dress
Put 7 and product accumulator 8.
Specifically, the first vehicle 91 is configured between printing equipment 3 and component mounter 4.Second vehicle
92 are configured between component mounter 4 and reflow ovens 5.3rd vehicle 93 extends from reflow ovens 5 towards downstream.That is,
Three vehicles 93 extend relative to reflow ovens 5 towards the opposition side of component mounter 4.3rd vehicle 93 is configured at backflow
Between stove 5 and intermediate hopper 6.4th vehicle 94 is configured between intermediate hopper 6 and product accumulator 8.For example, transport
Device 91~94 is sent to be ribbon conveyer.Vehicle 91~94 can separately drive.
<Delivery device>
Delivery device 2 is configured at the most upstream side (that is, upstream end) of production line L.Delivery device 2 throws printed wiring board 10
In being put into production line L.The rectangular tabular of printed wiring board 10.Delivery device 2 has throws in fortune in accumulator 20 and delivery device
Send device 23.
As shown in Fig. 2 throwing in accumulator 20 can receive multiple printed wiring boards 10.Throw in accumulator 20 and there is lifting dress
Put 22 and multiple grooves 21.
Groove 21 has supporting member 21a for extending in X direction.Supporting member 21a can support the Y side of printed wiring board 10
To two ends.The size of the inner space 21s of groove 21 is the size that can at least receive 1 printed wiring board 10.
Lowering or hoisting gear 22 can be such that multiple grooves 21 lift as a rigid body.Lowering or hoisting gear 22 can be to the height of groove 21
(position of Z-direction) carries out step-less adjustment.Lowering or hoisting gear 22 has ball-screw 22a and driving means 22b.Ball-screw
The length of 22a is in Z-direction.Driving means 22b have motor.The rotary motion of motor is converted to edge by ball-screw 22a
The linear motion of Z-direction.
As shown in figure 1, vehicle 23 is configured in the inner space 2s of delivery device 2 in delivery device.Delivery device
Interior vehicle 23 can transport printed wiring board 10.For example, vehicle 23 is ribbon conveyer in delivery device.Throw in dress
Put interior vehicle 23 and there is the transport face 23a (upper tables that extend and can load printed wiring board 10 in the horizontal direction
Face).
As shown in Fig. 2 when printed wiring board 10 is transported, lowering or hoisting gear 22 make the height of supporting member 21a of groove 21 with
The height alignment of the transport face 23a (with reference to Fig. 1) of vehicle 23 in delivery device.Specifically, propping up for supporting member 21a is made
Bearing surface (upper surface) is alignd with the height of the transport face 23a of vehicle in delivery device 23.In the present embodiment, structure is supported
Part 21a extends in X direction, also, transport face 23a extends in the horizontal direction, thereby, it is possible to the printed wiring by groove 21 is accommodated in
Plate 10 is successfully delivered to transport face 23a.
<Printing equipment>
As shown in figure 1, printing equipment 3 is configured at the downstream of delivery device 2 across labelling apparatus 100.Printing equipment 3
It is adjacent with labelling apparatus 100 (mark check device 104).
Printing equipment 3 is by solder printing to the printed wiring board 10 rendered in production line L.Printing equipment 3 has
Vehicle 33 in mask member 30 (with reference to Fig. 3) and printing equipment.As shown in figure 3, being formed with mask member 30 many
Individual hole 30h.What mask member 30 was made of metal.For example, mask member 30 is made by rustless steel.
Mask member 30 has rectangular plate shape.Multiple hole 30h are configured at and (are installed in printed wiring with element 11
Plate 10) (with reference to Fig. 4) the suitable position of portion of terminal.For example, element 11 is the electronic components such as capacitor.In top view,
The shape rectangular shaped of hole 30h, triangle, pentagon shaped, round-shaped etc. are variously-shaped.
Mask member 30 have multiple (being for example in the present embodiment 2) mask portions 31,32 (the first mask portion 31 with
And the second mask portion 32).First mask portion 31 and the second mask portion 32 are adjacent to each other.First mask portion 31 and the second mask
Portion 32 has with the shape of the center 30c of mask member 30 (2 weight symmetry) rotationally symmetrical as axis of symmetry.Accordingly, for printing
Object, can once form 2 printed patterns.That is, printing of the solder on 2 printed wiring boards 10 can simultaneously be carried out.
In the present embodiment, printing is silk screen printing (screen printing).For example, using mask member 30 as screen cloth covering
Cover as printing object printed wiring board 10, the solder of paste is placed in into mask member 30, make scraper with mask member
Move in the state of 30 surface contact.Thus, the solder of paste is attached to printed wiring board through the hole of mask member 30
10。
As shown in figure 1, vehicle 33 is configured in the inner space 3s of printing equipment 3 in printing equipment.Printing equipment
Interior vehicle 33 can transport the printed wiring board 10 being moved in the inner space 3s of printing equipment 3.Fortune in printing equipment
Downstream side is transported by the printed wiring board 10 for being printed with solder to send device 33.For example, vehicle 33 is band in printing equipment
Formula conveyer.
<Component mounter>
Component mounter 4 is configured at the downstream of printing equipment 3 across the first vehicle 91.
Component mounter 4 is attached to element 11 (with reference to Fig. 4) to be printed with the printed wiring board 10 of solder.Component mounter
4 have vehicle 43 in component supplying apparatus 40, mouth 41, mobile device 42 and fitting machine.Component supplying apparatus 40 will
Element 11 is supplied to the region of regulation.Mouth 41 being capable of absorptive element 11.Mobile device 42 can make mouth 41 in the horizontal direction
(XY directions) and above-below direction (Z-direction) are mobile.For example, the element from the supply of component supplying apparatus 40 is adsorbed by mouth 41
11, the element 11 for being adsorbed is attached to into the target location of printed wiring board 10.
Vehicle 43 is configured in the inner space 4s of component mounter 4 in fitting machine.Vehicle 43 in fitting machine
The printed wiring board 10 being moved in the inner space 4s of component mounter 4 can be transported.Vehicle 43 will pacify in fitting machine
Printed wiring board 10 equipped with element 11 downstream transport by side.For example, vehicle 43 is ribbon conveyer in fitting machine.
<Reflow ovens>
Reflow ovens 5 are configured at the downstream of component mounter 4 across the second vehicle 92.
Reflow ovens 5 pairs are provided with the printed wiring board 10 of element 11 and heat, and element 11 is welded with printed wiring board 10
It is connected together and forms circuit board 12.Reflow ovens 5 have in atmosphere control device 50, heater 51 and reflow ovens transports dress
Put 52.(hereinafter referred to as " oxygen is dense in reflow ovens by the oxygen concentration in the inner space 5s of reflow ovens 5 for atmosphere control device 50
Degree ".) remain than reflow ovens 5 space outerpace (air) in oxygen concentration it is low.For example, oxygen concentration exists in reflow ovens
More than 100ppm and below 2000ppm.Oxygen concentration is in more than 100ppm and below 800ppm more preferably in reflow ovens.
Heater 51 by the temperature of the inner space 5s of reflow ovens 5 (hereinafter referred to as " backflow in-furnace temperature ".) remain
The temperature of regulation.Heater 51 makes the inner space 5s of reflow ovens 5 become optimal Temperature Distribution.Backflow in-furnace temperature according to
Solder and it is different.For example, in the case of using lead-free solder, heater 51 is by the entrance (upstream side) of reflow ovens 5
150 degree or so are remained, near exit (downstream) is remained into 110 degree or so, by the position for becoming maximum temperature of midway
Remain 250 degree or so.
Heater 51 pairs completes solder printing and the printed wiring board 10 after element installation and carries out overall heating.Plus
Thermal 51 only makes solder partial melting.Thus, by the wiring portion of the portion of terminal of element 11 and printed wiring board 10 by weldering
Meet (with reference to Fig. 4) and combine, form circuit board 12.
Vehicle 52 is configured in the inner space 5s of reflow ovens 5 in reflow ovens.The energy of vehicle 23 in delivery device
It is enough to transport the printed wiring board 10 being moved in the inner space 5s of reflow ovens 5.Vehicle 52 is by with can in reflow ovens
Formed substantially resistant to the component of the hot thermostability by heater 51.For example, vehicle 52 is made of metal in reflow ovens
Ribbon conveyer.
<Intermediate hopper>
Intermediate hopper 6 is configured at the downstream of reflow ovens 5 across the 3rd vehicle 93.That is, intermediate hopper 6 is relative
The side contrary with reflow ovens 5 is configured in the 3rd vehicle 93.
Intermediate hopper 6 can receive multiple circuit boards 12.Because intermediate hopper 6 is same with above-mentioned input accumulator 20
The structure of sample, therefore, omit detail explanation.
<Appearance inspection device>
Appearance inspection device 7 is configured at the downstream of intermediate hopper 6 across the 4th vehicle 94.
Appearance inspection device 7 checks the outward appearance of circuit board 12.Appearance inspection device 7 has camera head 70, computer 71
And vehicle 72 in appearance inspection device.Camera head 70 shoots circuit board 12.For example, camera head 70 is photographing unit.
Camera head 70 is connected with computer 71.Computer 71 has memorizer 71a and processor 71b.
For example, the shooting result of camera head 70 is (hereinafter referred to as " shooting image ".) it is exported to computer 71.Computer
71 pairs of benchmark images being stored in memorizer 71a are contrasted with shooting image, by circuit board 12 be judged to " certified products " or
Person's " defective work ".Specifically, difference feelings the threshold value of regulation below of the computer 71 in benchmark image and shooting image
Under condition, it is judged to " certified products ".Computer 71 in the case where the difference of benchmark image and shooting image exceedes the threshold value of regulation,
It is judged to " defective work ".For example, computer 71 is when that the welding portion in circuit board 12 is present is bad or on the circuit board 12
In the case of being attached with foreign body, it is judged to " defective work ".Thereby, it is possible to avoid the outflow of defective work.
In addition, the visual examination of circuit board 12 is sometimes for the time longer than the welding in reflow ovens 5.In the situation
Under, it is possible to create the needs of the travelling speed of adjustment circuit plate 12 between reflow ovens 5 and appearance inspection device 7.But, according to
Present embodiment, due to configuring intermediate hopper 6 between reflow ovens 5 and appearance inspection device 7, therefore, even if in circuit board
In the case of 12 visual examination needs for a long time, it is also possible to which the circuit board 12 transported from reflow ovens 5 is accommodated in successively into centre
In accumulator 6.Therefore, though circuit board 12 visual examination need it is prolonged in the case of, it is not required that reflow ovens 5 with
The travelling speed of adjustment circuit plate 12 between appearance inspection device 7, is preferred.
Vehicle 72 is configured in the inner space 7s of appearance inspection device 7 in appearance inspection device.Visual examination is filled
Putting interior vehicle 72 can transport the circuit board 12 being moved in the inner space 7s of appearance inspection device 7.Visual examination is filled
Put interior vehicle 72 and the circuit board 12 for being judged to " certified products " is transported into downstream side.For example, transport in appearance inspection device
Device 72 is ribbon conveyer.
<Product accumulator>
Product accumulator 8 is configured at the downstream of appearance inspection device 7.Product accumulator 8 can receive multiple circuit boards
12.Because product accumulator 8 is the structure same with above-mentioned input accumulator 20, therefore, omit detail explanation.
Only it is accommodated in product accumulator 8 in appearance inspection device 7 and is judged as the circuit board 12 of " certified products ".Storage
Circuit board 12 in product accumulator 8 (offline) outside production line L is made whether inspection (the function inspection of normally action
Look into).
<Labelling apparatus>
Circuitboard manufacturing devices 1 also have labelling apparatus 100.Labelling apparatus 100 are adjacent with delivery device 2.Labelling apparatus
100 are configured between delivery device 2 and printing equipment 3.Labelling apparatus 100 are by identification code (for example, the identification code shown in Fig. 5
10i) it is imprinted on the printed wiring board 10 rendered in production line L.In the present embodiment, identification code 10i (with reference to Fig. 5)
Comprising the multiple points for being configured to ranks shape.Labelling apparatus 100 have storage device 101, laser drawing apparatus 102, cleaning device
103 and mark check device 104.
<Storage device>
Storage device 101 stores identification code.In the present embodiment, being previously stored with storage device 101 to show
Identification code (for example, the identification code 10i shown in Fig. 5) on printed wiring board 10.Identification code is when in circuitboard manufacturing devices 1
The wiring of the inside of middle manufacture printed wiring board 10 and it is installed on the element 11 (electronic component for using) of printed wiring board 10
Use in the case of the circuit board 12 of different multiple species.
<Laser drawing apparatus>
Laser drawing apparatus 102 is adjacent with delivery device 2.Laser drawing apparatus 102 is configured at the downstream of delivery device 2
Side.Laser drawing apparatus 102 can describe the identification code for being stored in storage device 101.Laser drawing apparatus 102 has laser light
Vehicle 122 in source 120, mobile device 121 and drawing apparatus.LASER Light Source 120 can shine towards printed wiring board 10
Penetrate laser.Multiple laser that LASER Light Source 120 has n rows × m row (being for example in the present embodiment 16 row × 16 row) are projected
Portion.LASER Light Source 120 can be switched on and off according to each laser injection part.
Mobile device 121 can make LASER Light Source 120, and in the horizontal direction (XY directions) and above-below direction (Z-direction) are moved
It is dynamic.For example, after making LASER Light Source 120 be moved to predetermined region 10a of printed wiring board 10 (with reference to Fig. 5), laser light is made
The laser injection part of the regulation ranks (for example, ranks corresponding with the identification code 10i shown in Fig. 5) in source 120 is opened, to printing
The predetermined region 10a irradiating laser of wiring plate 10.Thus, by the rule of identification code 10i (with reference to Fig. 5) markings to printed wiring board 10
In determining region 10a.
Vehicle 122 is configured in the inner space 102s of laser drawing apparatus 102 in drawing apparatus.In drawing apparatus
Vehicle 122 can transport the printed wiring board 10 being moved in the inner space 102s of laser drawing apparatus 102.Describe dress
Downstream side is transported by the printed wiring board 10 for being imprinted with identification code 10i to put interior vehicle 122.For example, fortune in drawing apparatus
Device 122 is sent to be ribbon conveyer.
<Cleaning device>
Cleaning device 103 is adjacent with laser drawing apparatus 102.Cleaning device 103 is configured under laser drawing apparatus 102
Trip side.As shown in fig. 6, cleaning device 103 has brush 130, driving means 131, pipeline 132, dust collect plant 133 and sanitizer cartridge
Put interior vehicle 134.
Brush 130 has axle portion 130b and multiple bristle 130a.A part (that is, multiple bristles of at least end of brush 130
A part of 130a) can contact with printed wiring board 10.The cardinal extremity of bristle 130a is connected with axle portion 130b.Axle portion 130b has
Axis 130c along the Y direction.Driving means 131 make brush 130 rotate or vibrate.Driving means 131 can make brush 130 with axle
Rotate centered on line 130c.For example, driving means 131 are vibrating motors.
Pipeline 132 extends deviously in the cleaning device between the top of vehicle 134 and dust collect plant 133.Pipeline
132 one end is configured at the top of printed wiring board 10.One end of pipeline 132 is open towards brush 130.The other end of pipeline 132
It is connected with dust collect plant 133.Dust collect plant 133 collects the dust on printed wiring board 10 via pipeline 132.
When printed wiring board 10 has been moved to the position of the regulation in the inner space 103s of cleaning device 103, collection
Dirt device 133 starts.That is, in the cleaning of printed wiring board 10, dust collect plant 133 starts.And, in printed wiring board 10
During cleaning, driving means 131 make the rotation (to arrow V1 directions) clockwise centered on axis 130c of brush 130.Thereby, it is possible to logical
The trickle dirt such as the dust produced when crossing brush 130 to brush off and identification code 10i (with reference to Fig. 5) be marked on printed wiring board 10
Angstrom, and these dust are collected via pipeline 132 by dust collect plant 133.Therefore, it is possible to remove the dirt on printed wiring board 10
Angstrom.
Vehicle 134 is configured in the inner space 103s of cleaning device 103 in cleaning device.Transport in cleaning device
Device 134 can transport the printed wiring board 10 being moved in the inner space 103s of cleaning device 103.Transport in cleaning device
Device 134 by the printed wiring board 10 after the cleaning for eliminating dust, downstream transport by side.For example, vehicle in cleaning device
134 is ribbon conveyer.For convenience, in FIG, vehicle 134 is eliminated in cleaning device in cleaning device 103 with
The diagram of outer structural element.
<Mark check device>
As shown in figure 1, mark check device 104 is adjacent with cleaning device 103.Mark check device 104 is relative to cleaning
Device 103 is configured at the side contrary with laser drawing apparatus 102.That is, mark check device 104 is configured at cleaning device 103
Downstream.
The identification code 10i (with reference to Fig. 5) that 104 pairs, mark check device is marked on printed wiring board 10 is checked.Mark
Note check device 104 has vehicle 142 in camera head 140, computer 141 and check device.
Camera head 140 shoots to the printed wiring board 10 on vehicle in check device 142.Camera head
140 couples of identification code 10i (with reference to Fig. 5) marked on printed wiring board 10 shoot.For example, camera head 140 is photograph
Machine.Camera head 140 is connected with computer 141.Computer 141 has memorizer 141a and processor 141b.
For example, the shooting result of camera head 140 is (hereinafter referred to as " shooting identification code ".) it is exported to computer 141.Meter
The benchmark identification code that 141 pairs, calculation machine is stored in memorizer 141a is contrasted with identification code is shot, and printed wiring board 10 is sentenced
It is set to " certified products " or " defective work ".Specifically, computer 141 is in benchmark identification code and the diversity ratio for shooting identification code
In the case that the threshold value of regulation is little, it is judged to " certified products ".Computer 141 is in benchmark identification code and the diversity ratio for shooting identification code
In the case that the threshold value of regulation is big, it is judged to " defective work ".For example, computer 141 identification code a part disappearance or
In the case that the connected situation of 2 adjacent points or point are mistakenly carved, it is judged to " defective work ".The one of identification code
The situation of excalation includes the situation of at least a portion disappearance of point.
Vehicle 142 is configured in the inner space 104s of mark check device 104 in check device.In check device
Vehicle 142 can be conveyed through the printed wiring board 10 of cleaning device 103.That is, the energy of vehicle 142 in check device
It is enough to transport the printed wiring board 10 being moved in the inner space 104s of mark check device 104.Vehicle in check device
The 142 downstream side transports of printed wiring board 10 that will be judged to " certified products ".For example, vehicle 142 is band in check device
Formula conveyer.
As described above, the circuitboard manufacturing devices 1 of above-mentioned embodiment have:Delivery device 2, it is to manufacture
Printed wiring board 10 is thrown in the production line L of circuit board 12;Labelling apparatus 100, it is adjacent with delivery device 2, and throws in
Identification code 10i is marked on the printed wiring board 10 arrived in production line L;Printing equipment 3, it is adjacent with labelling apparatus 100, and
By solder printing to being imprinted with the printed wiring board 10 of identification code 10i;Component mounter 4, element 11 is installed to printing by it
Have on the printed wiring board 10 of solder;Reflow ovens 5, it is heated to the printed wiring board 10 for being provided with element 11, by element
11 weld together and form circuit board 12 with printed wiring board 10;First vehicle 91, it is configured at printing equipment 3 with unit
Between part fitting machine 4;Second vehicle 92, it is configured between component mounter 4 and reflow ovens 5;And the 3rd transport dress
93 are put, it extends from reflow ovens 5 towards the opposition side of component mounter 4, delivery device 2 has can receive multiple printed wirings
The input accumulator 20 of plate 10, printing equipment 3 has mask member 30 made by the metal for being formed with multiple hole 30h, reflow ovens 5
Have:Atmosphere control device 50, oxygen concentration in reflow ovens is remained the oxygen concentration in the space outerpace than reflow ovens 5 for it
It is low;Heater 51, backflow in-furnace temperature is remained the temperature of regulation for it;Vehicle 52 in reflow ovens, it is configured at interior
In the 5s of portion space, and the printed wiring board 10 being moved in the 5s of inner space can be transported, there is labelling apparatus 100 storage to know
The storage device 101 of other code 10i.
According to the structure, there is the storage device 101 of storage identification code 10i by making labelling apparatus 100, will can store
Identification code 10i in storage device 101 is marked on printed wiring board 10.Therefore, it is possible to avoid being shown in printed wiring
The mistake of the identification code 10i on plate 10.Additionally, labelling apparatus 100 are adjacent with delivery device 2, thereby, it is possible in production line L
Upstream side (near upstream end), identification code 10i is marked on printed wiring board 10.Therefore, it is possible to pacify entering to be about to element 11
Before loaded on the operation on printed wiring board 10, identification code 10i is marked on printed wiring board 10.For example, even to peace
Loaded on the situation that the element 11 on printed wiring board 10 is changed, it is also possible to easily carve the identification code for reflecting the situation
Print on printed wiring board 10.
Additionally, according to the structure, labelling apparatus 100 also have can describe the identification code being stored in storage device 101
Laser drawing apparatus 102 and the cleaning device 103 adjacent with laser drawing apparatus 102, cleaning device 103 has:It is at least last
Brush 130 that the part at end can be contacted with printed wiring board 10, the driving means 131, one end for rotating brush 130 or vibrating
Towards the pipeline 132 of the opening of brush 130 and the dust collect plant 133 being connected with the other end of pipeline 132, thus, following effect is obtained
Really.
Dust for producing etc. during due to being brushed off identification code 10i markings by brush 130 on printed wiring board 10
Trickle dust, and these dust are collected via pipeline 132 by dust collect plant 133, therefore, it is possible to remove printed wiring board
Dust on 10.
Additionally, according to the structure, labelling apparatus 100 also have to be configured at relative to cleaning device 103 describes dress with laser
The mark check device 104 of 102 contrary sides is put, mark check device 104 has:Cleaning device can be conveyed through
Vehicle 142 in the check device of 103 printed wiring board 10, to the printed wiring on vehicle in check device 142
Camera head 140 and be connected with camera head 140 and with memorizer 141a and processor 141b that plate 10 is shot
Computer 141, be derived from following effect.
Due to being able to confirm that whether identification code 10i is correctly imprinted with printed wiring board 10, therefore, it is possible to avoid not having
The printed wiring board 10 (defective work) for having correct marking identification code 10i is transported to downstream (subsequent processing).
This utility model is not limited to above-mentioned embodiment, various designs can be carried out in the range of without departing from its purport and is become
More.
For example, in the above-described embodiment, as identification code 10i, list and be made up of the multiple points for being configured to ranks shape
Example be illustrated, but not limited to this.For example, identification code can be word, figure, mark, it is also possible to by word, figure
And at least one of mark combines.
Additionally, in the above-described embodiment, as LASER Light Source 120, the multiple laser with 16 row × 16 row are listed
The example of injection part is illustrated, but not limited to this.For example, the quantity of laser injection part can also be that 15 row × 15 row are following,
Or 17 row × 17 row more than.Laser injection part can according to the appearance of the identification code that should be shown on printed wiring board 10 come
Suitably changed.
Additionally, in the above-described embodiment, in the cleaning of printed wiring board 10, listing driving means 131 makes brush 130
The example turned clockwise centered on axis 130c is illustrated, but not limited to this.For example, in the cleaning of printed wiring board 10
When, vibrate can brush 130, it is also possible to brush 130 is rotated while vibrating.
Claims (2)
1. a kind of circuitboard manufacturing devices, it is characterised in that the circuitboard manufacturing devices have:
Delivery device, it throws in printed wiring board in production line to manufacture circuit board;
Labelling apparatus, it is adjacent with the delivery device, and the printed wiring board in the production line has been rendered to
Upper marking identification code;
Printing equipment, it is adjacent with the labelling apparatus, and by solder printing to the printing for being imprinted with the identification code
On wiring plate;
Component mounter, it is installed to element on the printed wiring board for being printed with the solder;
Reflow ovens, it is heated to the printed wiring board for being provided with the element, by the element and the printing cloth
Line plate weld forms the circuit board together;
First vehicle, it is configured between the printing equipment and the component mounter;
Second vehicle, it is configured between the component mounter and the reflow ovens;And
3rd vehicle, it extends from the reflow ovens towards the opposition side of the component mounter,
The delivery device has the input accumulator that can receive multiple printed wiring boards,
The printing equipment has mask member made by the metal for being formed with multiple holes,
The reflow ovens have:
Atmosphere control device, oxygen concentration in inner space of the reflow ovens is remained the outside than the reflow ovens for it
Oxygen concentration in space is low;
Heater, temperature of the inner space is remained the temperature of regulation for it;And
Vehicle in reflow ovens, it is configured in the inner space, and can be transported and be moved in the inner space
The printed wiring board,
The labelling apparatus have:
Storage device, its described identification code of storage;
Laser drawing apparatus, it can describe the identification code for being stored in the storage device;And
Cleaning device, it is adjacent with the laser drawing apparatus,
The cleaning device has:
Brush a, part for its at least end can be contacted with the printed wiring board;
Driving means, it makes the brush rotation or vibrates;
Pipeline, its one end is towards the brush opening;And
Dust collect plant, it is connected with the other end of the pipeline.
2. circuitboard manufacturing devices according to claim 1, it is characterised in that
The labelling apparatus also have mark check device, and the mark check device is configured at and institute relative to the cleaning device
The contrary side of laser drawing apparatus is stated,
The mark check device has:
Vehicle in check device, it can be conveyed through the printed wiring board of the cleaning device;
Camera head, it shoots to the printed wiring board on vehicle in the check device;And
Computer, it is connected with the camera head, and with memorizer and processor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621219829.1U CN206181579U (en) | 2016-11-11 | 2016-11-11 | Circuit board manufacturing installation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621219829.1U CN206181579U (en) | 2016-11-11 | 2016-11-11 | Circuit board manufacturing installation |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206181579U true CN206181579U (en) | 2017-05-17 |
Family
ID=58684860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621219829.1U Expired - Fee Related CN206181579U (en) | 2016-11-11 | 2016-11-11 | Circuit board manufacturing installation |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206181579U (en) |
-
2016
- 2016-11-11 CN CN201621219829.1U patent/CN206181579U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5751584B2 (en) | Electronic component mounting equipment | |
JPH08206825A (en) | Device for mounting solder ball and method therefor | |
WO2012165276A1 (en) | Board operation assisting device, and board operation assisting method | |
CN107443879A (en) | Printing equipment, solder management system and solder management method | |
CN106133893B (en) | Bare die installation system and bare die installation method | |
JP5860357B2 (en) | Component mounting system | |
CN108430167A (en) | The manufacturing method of the mounting device and display component of electronic component | |
JP4676112B2 (en) | Electric circuit manufacturing method and electric circuit manufacturing system | |
JP5707218B2 (en) | Printing device | |
CN105325070B (en) | Component mounting system and component mounting method | |
CN103153036B (en) | To working machine for circuit board | |
TWI516759B (en) | Method of inspecting printed circuit board for semiconductor package | |
CN206181579U (en) | Circuit board manufacturing installation | |
CN206149602U (en) | Circuit board manufacturing installation | |
JP2008109034A (en) | Solder jetting nozzle and soldering device | |
CN103458672B (en) | Correction value acquisition method in electronic component mounting line and electronic component mounting method | |
JP5819709B2 (en) | Anti-substrate work support apparatus and anti-substrate operation support method | |
CN206181580U (en) | Identification code mark device | |
JP4896855B2 (en) | Component mounting system | |
CN206196149U (en) | Identification code mark device | |
CN206149612U (en) | Circuit board manufacturing installation | |
CN206226846U (en) | Circuitboard manufacturing devices | |
JP4664550B2 (en) | Electric circuit manufacturing apparatus and electric circuit manufacturing method | |
CN206181578U (en) | Circuit board manufacturing installation | |
CN206196162U (en) | Solder printing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170517 Termination date: 20211111 |