CN206181578U - Circuit board manufacturing installation - Google Patents
Circuit board manufacturing installation Download PDFInfo
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- CN206181578U CN206181578U CN201621219585.7U CN201621219585U CN206181578U CN 206181578 U CN206181578 U CN 206181578U CN 201621219585 U CN201621219585 U CN 201621219585U CN 206181578 U CN206181578 U CN 206181578U
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- CN
- China
- Prior art keywords
- conveyer
- printed wiring
- circuit board
- reflow ovens
- wiring board
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Abstract
The utility model provides a circuit board manufacturing installation, it has: put in the device, put in the printed wiring board in its production line to manufacturing circuit board, printing device, it puts in solder printing on the printed wiring board in the production line, component installation machine, it installs the component on the printed wiring board that the printing has the solder, reflow oven, its printed wiring board to installing the component heats, is in the same place component and printed wiring board welding and the forming circuit board, a conveyor, the 2nd conveyor, the 3rd conveyor, fourth conveyor, it follows mutually the toss about extension of reflow oven towards component installation machine, first clog, it disposes along fourth conveyor to make the printed wiring board that transports from reflow oven stop, and first air -blower, it is along fourth conveyor configuration, the transporting the route and can advance and retreat of the circuit board of first clog in for fourth conveyor, and first air -blower is adjacent with first clog.
Description
Technical field
The utility model is related to circuitboard manufacturing devices.
Background technology
Include by the printing process on the solder printing of paste to printed wiring board, by unit in the manufacturing process of circuit board
Installation procedure and make melt solder make element and printed wiring board that part is installed on the printed wiring board for being printed with solder
With reference to operation.In order that melt solder, has used reflow ovens.Now, the printed wiring board for being provided with element is integrally heated,
The only partial melting of solder.Afterwards, printed wiring board is transported to outside from reflow ovens, is cooled down.With regard to cooling, pass through
Printed wiring board is placed into be become target temperature (hereinafter referred to as " letting cool ") to carry out.
Copper that wiring as printed wiring board is used and the solder for the combination of element and printed wiring board compare
It is difficult to be oxidized.Therefore, even if cooling is to let cool, generally, the wiring portion and element and printed wiring in printed wiring board
The bound fraction of plate will not produce oxidation etc..But, the deteriorations such as undesirable oxidation can be produced under rare occasion.Particularly,
In unqualified generation rate low-down to product requirement, need to suppress with deteriorations such as the heating, oxidations in reflow ovens.
Utility model content
The utility model is completed in view of the foregoing, and its problem is that offer can in the circuit board suppress oxidation
Deng the circuitboard manufacturing devices of deterioration.
Used as the solution of above-mentioned problem, the scheme of an embodiment of illustration of the present utility model is a kind of circuit
Board manufacturing apparatus, it has：Delivery device, it throws in printed wiring board in production line to manufacture circuit board；Printing equipment, its
By solder printing to being invested on the printed wiring board in the production line；Component mounter, element is installed to print by it
It is brushed with the printed wiring board of the solder；Reflow ovens, it is carried out to the printed wiring board for being provided with the element
Heating, the element is welded together with the printed wiring board and the circuit board is formed；First conveyer, its configuration
Between the delivery device and the printing equipment；Second conveyer, it is configured at the printing equipment with the element
Between fitting machine；3rd conveyer, it is configured between the component mounter and the reflow ovens；4th conveyer,
It extends from the reflow ovens towards the opposition side of the component mounter；First retainer, it transports dress along the described 4th
Put configuration；And first air blast, it is configured along the 4th conveyer, and the delivery device has can receive multiple
The input accumulator of the printed wiring board, the printing equipment has mask member made by the metal for being formed with multiple holes,
The reflow ovens have：Atmosphere control device, it remains the oxygen concentration in the inner space of the reflow ovens than described
Oxygen concentration in the space outerpace of reflow ovens is low；Heater, temperature of the inner space is remained the temperature of regulation for it
Degree；And conveyer in reflow ovens, it is configured in the inner space, and can be transported and be moved to the inner space
In the printed wiring board, transport road of first retainer relative to the circuit board in the 4th conveyer
Footpath can retreat, and first air blast is adjacent with first retainer, and the circuitboard manufacturing devices also have：Second stop
Device, it is configured at the opposition side of the reflow ovens relative to first retainer, and relative to the 4th conveyer
In the transport path of the circuit board can retreat；And second air blast, it is adjacent with second retainer.
According to an embodiment of illustration of the present utility model, can in the circuit board suppress the deterioration such as oxidation.
Description of the drawings
Fig. 1 is the schematic diagram of the circuitboard manufacturing devices of embodiment.
Fig. 2 is the schematic diagram of the input accumulator of embodiment.
Fig. 3 is the schematic diagram of the mask member of embodiment.
Fig. 4 is the figure of of the welding for illustrating embodiment.
Fig. 5 is the figure along the V directions of arrow in Fig. 1.
Fig. 6 is the figure along the VI directions of arrow in Fig. 5.
Label declaration
1：Circuitboard manufacturing devices；2：Delivery device；3：Printing equipment；4：Component mounter；5：Reflow ovens；6：Centre storage
Glassware；10：Printed wiring board；11：Element；12：Circuit board；20：Throw in accumulator；30：Mask member；30h：Hole；5s：It is internal
Space；50：Atmosphere control device；51：Heater；52：Conveyer in reflow ovens；91：First conveyer；92：Second
Conveyer；93：3rd conveyer；94：4th conveyer；101A：First retainer；101B：Second retainer；
110A：First air blast；110B：Second air blast；L：Production line.
Specific embodiment
Hereinafter, embodiment of the present utility model illustrated with reference to the accompanying drawings.In the following embodiments, as electricity
One of road board manufacturing apparatus, is listed below circuitboard manufacturing devices and illustrates：Throw in in the production line of manufacture circuit board
Printed wiring board, implements successively multiple manufacturing procedures to manufacture circuit board.In the accompanying drawing that the following description is used, in order to into
To be capable of identify that the size of each component, appropriate change is carried out to the engineer's scale of each component.
In the following description, XYZ vertical coordinate systems are set, the position to each component is come with reference to the XYZ vertical coordinate systems
The relation of putting is illustrated.If the prescribed direction in horizontal plane is X-direction, if direction vertical with X-direction in the horizontal plane is Y side
To if the direction (i.e. vertical direction) being respectively perpendicular with X-direction and Y-direction is Z-direction.
<Device entirety>
As shown in figure 1, circuitboard manufacturing devices 1 have：Delivery device 2；Printing equipment 3；Component mounter 4；Reflow ovens
5；Intermediate hopper 6；Appearance inspection device 7；Product accumulator 8 and conveyer 9.
The grade of printed wiring board 10 (including circuit board 12) is transported along the production line L for extending in the X direction.Hereinafter, exist
In production line L etc., using the side of delivery device 2 as " upstream side (-X direction side) ", using the side of product accumulator 8 as
" downstream (+X direction side) ".
<Conveyer>
Conveyer 9 has multiple (being for example in the present embodiment 5) (the first conveyers of conveyer 91~95
91st, the second conveyer 92, the 3rd conveyer 93, the 4th conveyer 94 and the 5th conveyer 95).In this embodiment party
In formula, from upstream side, downstream side is arranged with order：Delivery device 2, the first conveyer 91, printing equipment 3, second are transported
Device 92, component mounter 4, the 3rd conveyer 93, reflow ovens 5, the 4th conveyer 94, intermediate hopper the 6, the 5th are transported
Device 95, appearance inspection device 7 and product accumulator 8.
Specifically, the first conveyer 91 is configured between delivery device 2 and printing equipment 3.Second conveyer 92
It is configured between printing equipment 3 and component mounter 4.3rd conveyer 93 be configured at component mounter 4 and reflow ovens 5 it
Between.4th conveyer 94 extends from reflow ovens 5 towards downstream.That is, the 4th conveyer 94 is relative to reflow ovens 5 towards unit
The opposition side of part fitting machine 4 extends.4th conveyer 94 is configured between reflow ovens 5 and intermediate hopper 6.5th transports dress
Put 95 to be configured between intermediate hopper 6 and product accumulator 8.For example, conveyer 91~95 is ribbon conveyer.Transport dress
Putting 91~95 can separately drive.
<Delivery device>
Delivery device 2 is configured at the most upstream side (that is, upstream end) of production line L.Delivery device 2 throws printed wiring board 10
In being put into production line L.The rectangular tabular of printed wiring board 10.Delivery device 2 has throws in fortune in accumulator 20 and delivery device
Send device 23.
As shown in Fig. 2 throwing in accumulator 20 can receive multiple printed wiring boards 10.Throw in accumulator 20 and there is lifting dress
Put 22 and multiple grooves 21.
Groove 21 has supporting member 21a for extending in X direction.Supporting member 21a can support the Y side of printed wiring board 10
To two ends.The size of the inner space 21s of groove 21 is the size that can at least receive 1 printed wiring board 10.
Lowering or hoisting gear 22 can be such that multiple grooves 21 lift as a rigid body.Lowering or hoisting gear 22 can be to the height of groove 21
(position of Z-direction) carries out step-less adjustment.Lowering or hoisting gear 22 has ball-screw 22a and driving means 22b.Ball-screw
The length of 22a is in Z-direction.Driving means 22b have motor.The rotary motion of motor is converted to edge by ball-screw 22a
The linear motion of Z-direction.
As shown in figure 1, conveyer 23 is configured in the inner space 2s of delivery device 2 in delivery device.Delivery device
Interior conveyer 23 can transport printed wiring board 10.For example, conveyer 23 is ribbon conveyer in delivery device.Throw in dress
Put interior conveyer 23 and there is the transport face 23a (upper tables that extend and can load printed wiring board 10 in the horizontal direction
Face).
As shown in Fig. 2 when printed wiring board 10 is transported, lowering or hoisting gear 22 make the height of supporting member 21a of groove 21 with
The height alignment of the transport face 23a (with reference to Fig. 1) of conveyer 23 in delivery device.Specifically, propping up for supporting member 21a is made
Bearing surface (upper surface) is alignd with the height of the transport face 23a of conveyer in delivery device 23.In the present embodiment, structure is supported
Part 21a extends in X direction, also, transport face 23a extends in the horizontal direction, thereby, it is possible to the printed wiring by groove 21 is accommodated in
Plate 10 is successfully delivered to transport face 23a.
<Printing equipment>
As shown in figure 1, printing equipment 3 is configured at the downstream of delivery device 2 across the first conveyer 91.
Printing equipment 3 is by solder printing to the printed wiring board 10 rendered in production line L.Printing equipment 3 has
Conveyer 33 in mask member 30 (with reference to Fig. 3) and printing equipment.As shown in figure 3, being formed with mask member 30 many
Individual hole 30h.What mask member 30 was made of metal.For example, mask member 30 is made by stainless steel.
Mask member 30 has rectangular plate shape.Multiple hole 30h are configured at and (are installed in printed wiring with element 11
Plate 10) (with reference to Fig. 4) the suitable position of portion of terminal.For example, element 11 is the electronic components such as capacitor.In top view,
The shape rectangular shaped of hole 30h, triangle, pentagon shaped, round-shaped etc. are variously-shaped.
Mask member 30 have multiple (being for example in the present embodiment 2) mask portions 31,32 (the first mask portion 31 with
And the second mask portion 32).First mask portion 31 and the second mask portion 32 are adjacent to each other.First mask portion 31 and the second mask
Portion 32 has with the shape of the center 30c of mask member 30 (2 weight symmetry) rotationally symmetrical as symmetry axis.Accordingly, for printing
Object, can once form 2 printed patterns.That is, printing of the solder on 2 printed wiring boards 10 can simultaneously be carried out.
In the present embodiment, printing is serigraphy (screen printing).For example, using mask member 30 as screen cloth covering
Cover as printing object printed wiring board 10, the solder of paste is placed in into mask member 30, make scraper with mask member
Move in the state of 30 surface contact.Thus, the solder of paste is attached to printed wiring board through the hole of mask member 30
10。
As shown in figure 1, conveyer 33 is configured in the inner space 3s of printing equipment 3 in printing equipment.Printing equipment
Interior conveyer 33 can transport the printed wiring board 10 being moved in the inner space 3s of printing equipment 3.Fortune in printing equipment
Downstream side is transported by the printed wiring board 10 for being printed with solder to send device 33.For example, conveyer 33 is band in printing equipment
Formula conveyer.
<Component mounter>
Component mounter 4 is configured at the downstream of printing equipment 3 across the second conveyer 92.
Component mounter 4 is attached to element 11 (with reference to Fig. 4) to be printed with the printed wiring board 10 of solder.Component mounter
4 have conveyer 43 in component supplying apparatus 40, mouth 41, mobile device 42 and fitting machine.Component supplying apparatus 40 will
Element 11 is supplied to the region of regulation.Mouth 41 being capable of absorptive element 11.Mobile device 42 can make mouth 41 in the horizontal direction
(XY directions) and above-below direction (Z-direction) are mobile.For example, the element from the supply of component supplying apparatus 40 is adsorbed by mouth 41
11, the element 11 for being adsorbed is attached to into the target location of printed wiring board 10.
Conveyer 43 is configured in the inner space 4s of component mounter 4 in fitting machine.Conveyer 43 in fitting machine
The printed wiring board 10 being moved in the inner space 4s of component mounter 4 can be transported.Conveyer 43 will pacify in fitting machine
Printed wiring board 10 equipped with element 11 downstream transport by side.For example, conveyer 43 is ribbon conveyer in fitting machine.
<Reflow ovens>
Reflow ovens 5 are configured at the downstream of component mounter 4 across the 3rd conveyer 93.
Reflow ovens 5 pairs are provided with the printed wiring board 10 of element 11 and heat, and element 11 is welded with printed wiring board 10
It is connected together and forms circuit board 12.Reflow ovens 5 have in atmosphere control device 50, heater 51 and reflow ovens transports dress
Put 52.(hereinafter referred to as " oxygen is dense in reflow ovens by the oxygen concentration in the inner space 5s of reflow ovens 5 for atmosphere control device 50
Degree ".) remain than reflow ovens 5 space outerpace (air) in oxygen concentration it is low.For example, oxygen concentration exists in reflow ovens
More than 100ppm and below 2000ppm.Oxygen concentration is in more than 100ppm and below 800ppm more preferably in reflow ovens.
Heater 51 by the temperature of the inner space 5s of reflow ovens 5 (hereinafter referred to as " backflow in-furnace temperature ".) remain
The temperature of regulation.Heater 51 makes the inner space 5s of reflow ovens 5 become optimal Temperature Distribution.Backflow in-furnace temperature according to
Solder and it is different.For example, in the case of using lead-free solder, heater 51 is by the entrance (upstream side) of reflow ovens 5
150 degree or so are remained, near exit (downstream) is remained into 110 degree or so, by the position for becoming maximum temperature of midway
Remain 250 degree or so.
Heater 51 pairs completes solder printing and the printed wiring board 10 after element installation and carries out overall heating.Plus
Thermal 51 only makes solder partial melting.Thus, by the wiring portion of the portion of terminal of element 11 and printed wiring board 10 by weldering
Meet (with reference to Fig. 4) and combine, form circuit board 12.
Conveyer 52 is configured in the inner space 5s of reflow ovens 5 in reflow ovens.The energy of conveyer 23 in delivery device
It is enough to transport the printed wiring board 10 being moved in the inner space 5s of reflow ovens 5.Conveyer 52 is by with can in reflow ovens
Formed substantially resistant to the component of the hot heat resistance by heater 51.For example, conveyer 52 is made of metal in reflow ovens
Ribbon conveyer.
<Intermediate hopper>
Intermediate hopper 6 is configured at the downstream of reflow ovens 5 across the 4th conveyer 94.That is, intermediate hopper 6 is relative
The side contrary with reflow ovens 5 is configured in the 4th conveyer 94.
Intermediate hopper 6 can receive multiple circuit boards 12.Because intermediate hopper 6 is same with above-mentioned input accumulator 20
The structure of sample, therefore, omit detail explanation.
<Appearance inspection device>
Appearance inspection device 7 is configured at the downstream of intermediate hopper 6 across the 5th conveyer 95.
Appearance inspection device 7 checks the outward appearance of circuit board 12.Appearance inspection device 7 has camera head 70, computer 71
And conveyer 72 in appearance inspection device.Camera head 70 shoots circuit board 12.For example, camera head 70 is camera.
Camera head 70 is connected with computer 71.Computer 71 has memory 71a and processor 71b.
For example, the shooting result of camera head 70 is (hereinafter referred to as " shooting image ".) it is exported to computer 71.Computer
71 pairs of benchmark images being stored in memory 71a are contrasted with shooting image, by circuit board 12 be judged to " certified products " or
Person's " defective work ".Specifically, difference feelings the threshold value of regulation below of the computer 71 in benchmark image and shooting image
Under condition, it is judged to " certified products ".Computer 71 in the case where the difference of benchmark image and shooting image exceedes the threshold value of regulation,
It is judged to " defective work ".For example, computer 71 is when that the welding portion in circuit board 12 is present is bad or on the circuit board 12
In the case of being attached with foreign matter, it is judged to " defective work ".Thereby, it is possible to avoid the outflow of defective work.
In addition, the visual examination of circuit board 12 is sometimes for the time longer than the welding in reflow ovens 5.In the situation
Under, it is possible to create the needs of the travelling speed of adjustment circuit plate 12 between reflow ovens 5 and appearance inspection device 7.But, according to
Present embodiment, due to being configured with intermediate hopper 6 between reflow ovens 5 and appearance inspection device 7, therefore, even if in circuit
In the case of the visual examination of plate 12 needs for a long time, it is also possible to during the circuit board 12 transported from reflow ovens 5 is accommodated in successively
Between in accumulator 6.Therefore, even if in the case of the visual examination of circuit board 12 needs for a long time, it is not required that in reflow ovens 5
The travelling speed of adjustment circuit plate 12 between appearance inspection device 7, is preferred.
Conveyer 72 is configured in the inner space 7s of appearance inspection device 7 in appearance inspection device.Visual examination is filled
Putting interior conveyer 72 can transport the circuit board 12 being moved in the inner space 7s of appearance inspection device 7.Visual examination is filled
Put interior conveyer 72 and the circuit board 12 for being judged to " certified products " is transported into downstream side.For example, transport in appearance inspection device
Device 72 is ribbon conveyer.
<Product accumulator>
Product accumulator 8 is configured at the downstream of appearance inspection device 7.Product accumulator 8 can receive multiple circuit boards
12.Because product accumulator 8 is the structure same with above-mentioned input accumulator 20, therefore, omit detail explanation.
Only it is accommodated in product accumulator 8 in appearance inspection device 7 and is judged as the circuit board 12 of " certified products ".Storage
Circuit board 12 in product accumulator 8 (offline) outside production line L is made whether inspection (the function inspection of normally action
Look into).
<Cooling body>
Circuitboard manufacturing devices 1 also have cooling body 100.100 pairs of circuit boards being carried out from reflow ovens 5 of cooling body
12 are cooled down.Cooling body 100 has：Multiple (being for example in the present embodiment 2) retainer 101A, 101B (first
Retainer 101A and the second retainer 101B)；With multiple (being for example in the present embodiment 3) air blast 110A, 110B,
110C (the first air blast 110A, the second air blast 110B and the 3rd air blast 110C).
<Retainer>
As shown in figure 5, retainer 101A, 101B are configured along the 4th conveyer 94.First retainer 101A is configured at
Near reflow ovens 5.Second retainer 101B is configured at the opposition side of reflow ovens 5 relative to the first retainer 101A.That is, second stops
Dynamic device 101B is configured to than the first retainer 101A downstreams.
Retainer 101A, 101B stop can the circuit board 12 that transported from reflow ovens 5.In the present embodiment, circuit
Plate 12 is transported out in order one by one from reflow ovens 5.Therefore, at retainer 101A, 101B, circuit board 12 1 is made
One stopping.Retainer 101A, 101B can retreat relative to the transport path of the circuit board 12 in the 4th conveyer 94.Only
Dynamic device 101A, 101B have arm 102, e axle supporting portion 103 and driving means 104.
As shown in fig. 6, arm 102 is in L-shaped.E axle supporting portion 103 supports the cardinal extremity of arm 102.E axle supporting portion 103 has
Rotation axis 103a along the X direction.Driving means 104 have the horse for making arm 102 rotate centered on rotation axis 103a
Reach.The motor can also be replaced, using the actuator by drivings such as compressed airs.
When transporting circuit board 12, driving means 104 make arm 102 centered on rotation axis 103a clockwise (to arrow
The direction of V1) rotation.Thus, the transport path of circuit boards 12 of retainer 101A, the 101B from the 4th conveyer 94 is kept out of the way.
The circuit board 12 transported from reflow ovens 5 is transported (with reference to Fig. 5) towards intermediate hopper 6.
When circuit board 12 stops, driving means 104 make arm 102 centered on rotation axis 103a counterclockwise (to arrow
The direction of the rightabout arrow V2 of head V1) rotation.Thus, retainer 101A, 101B is entered in the 4th conveyer 94
In the transport path of circuit board 12.The circuit board 12 transported from reflow ovens 5 stops (reference picture by retainer 101A, 101B
5)。
When circuit board 12 stops, the part of the end of arm 102 near the +Y direction side of the 4th conveyer 94.Arm
102 length (length of the Y-direction from cardinal extremity to end) is shorter than the width (length of Y-direction) of the 4th conveyer 94.By
This, compared with the length of arm 102 is set to into situation about being longer than more than the width of the 4th conveyer 94, can make arm
102 swimmingly rotate (that is, the mobility for lifting arm 102).Therefore, it is possible to make retainer 101A, 101B relative to the 4th fortune
The transport path for sending the circuit board 12 in device 94 is swimmingly retreated.
<Air blast>
As shown in figure 5, air blast 110A, 110B are configured along the 4th conveyer 94.First air blast 110A and first
Retainer 101A is adjacent.Second air blast 110B is adjacent with the second retainer 101B.Air blast 110A, 110B are towards from reflow ovens
5 circuit boards 12 for transporting are blown.
Air blast 110A, 110B, 110C have the fan 112 around the rotation of axis 111.Fan 112 is to along axis 111
Blow in direction.For example, fan 112 is the aerofoil fans such as propeller type fan.
In the side view of Fig. 5, the axis 111 of air blast 110A, 110B and the transport face 94a phases of the 4th conveyer 94
Hand over.Specifically, the axis 111 of the first air blast 110A is inclined relative to the transport face 94a of the 4th conveyer 94.In Fig. 5
Side view in, the axis 111 of the first air blast 110A is inclined in the way of being more located -Z direction toward +X direction side.The opposing party
Face, the transport face 94a substantial orthogonalities of the conveyer 94 of axis 111 and the 4th of the second air blast 110B.
During cooling circuit board 12, except the 4th conveyer 94 driving stop in addition to, also carry out based on retainer 101A,
The stopping of 101B.During cooling circuit board 12, the circuit board that the first air blast 110A stops directed through the first retainer 101A
12 air-supplies.On the other hand, the circuit board 12 that the second air blast 110B stops directed through the second retainer 101B is blown.
3rd air blast 110C is configured at around intermediate hopper 6.In Figure 5 for convenience, illustrate only and be configured at
3rd air blast 110C of the top of intermediate hopper 6.3rd air blast 110C directions are accommodated in the groove of intermediate hopper 6
Circuit board 12 is blown.For example, from from the viewpoint of efficiently cooling circuit board 12, the axis of the 3rd air blast 110C can also court
Incline to the entrance of groove.
As described above, the circuitboard manufacturing devices 1 of above-mentioned embodiment have：Delivery device 2, it is to manufacture
Printed wiring board 10 is thrown in the production line L of circuit board 12；Printing equipment 3, it is by solder printing to being invested in production line L
On printed wiring board 10；Component mounter 4, it is installed to element 11 on the printed wiring board 10 for being printed with solder；Reflow ovens
5, it is heated to the printed wiring board 10 for being provided with element 11, and element 11 and printed wiring board 10 are welded together and shape
Into circuit board 12；First conveyer 91, it is configured between delivery device 2 and printing equipment 3；Second conveyer 92, its
It is configured between printing equipment 3 and component mounter 4；3rd conveyer 93, it is configured at component mounter 4 and reflow ovens 5
Between；4th conveyer 94, it extends from reflow ovens 5 towards the opposition side of component mounter 4；First retainer 101A, its
Configure along the 4th conveyer 94；And the first air blast 110A, it is configured along the 4th conveyer 94, delivery device 2
With the input accumulator 20 that can receive multiple printed wiring boards 10, printing equipment 3 has the metal for being formed with multiple hole 30h
Made by mask member 30, reflow ovens 5 have：Atmosphere control device 50, it remains oxygen concentration in reflow ovens than backflow
Oxygen concentration in the space outerpace of stove 5 is low；Heater 51, backflow in-furnace temperature is remained the temperature of regulation for it；And
Conveyer 52 in reflow ovens, it is configured in the 5s of inner space, and can transport the printing being moved in the 5s of inner space
Wiring plate 10, the first retainer 101A can retreat relative to the transport path of the circuit board 12 in the 4th conveyer 94, the
One air blast 110A is adjacent with the first retainer 101A.
According to the structure, by with the first air blast 110A along the configuration of the 4th conveyer 94, can be by the
One air blast 110A rapidly cools down the circuit board 12 being exposed in oxygen (air) transported from reflow ovens 5.Therefore, it is possible to press down
The oxidation of the metal part of circuit board processed 12.Furthermore it is possible to suppress to produce the chemical reaction beyond oxidation in circuit board 12.Cause
This, can suppress the deterioration such as oxidation in circuit board 12.
In addition, it is considered that when making from the circuit board 12 that reflow ovens 5 are transported to stop, as long as stopping the 4th conveyer 94
Driving.But, the driving for only making the 4th conveyer 94 stops, and there is the circuit board 12 transported from reflow ovens 5 and deviates
The possibility of target stop position.But, according to the structure of present embodiment, due to stopping along the configuration of the 4th conveyer 94 first
Dynamic device 101A, therefore, it is possible to easily by the first retainer 101A make circuit board 12 target stop position stop.For example,
Even if despite the position but circuit board 12 that should be stopped also in the case of movement, by except the 4th transport dress
Also carry out, based on the stopping of the first retainer 101A, circuit board 12 being made in the 4th conveyer outside the driving stopping for putting 94
Slide on 94 transport face 94a and stop.
Additionally, according to the structure, by having：Second retainer 101B, it is configured at relative to the first retainer 101A
The opposition side of reflow ovens 5, and the transport path relative to the circuit board 12 in the 4th conveyer 94 can retreat；And the
Two air blast 110B, it is adjacent with the second retainer 101B, obtains following effect.
After the cooling based on the first air blast 110A, even if the heat inside because of circuit board 12 causes circuit board 12
In the case of surface portion re-heat, by the second air blast 110B also can cooling circuit board 12, therefore, it is possible to further
Suppress the deterioration such as oxidation in circuit board 12.
Additionally, according to the structure, by also having：Intermediate hopper 6, it is configured at back relative to the 4th conveyer 94
The opposition side of stream stove 5, and multiple circuit boards 12 can be received；And the 3rd air blast 110C, it is configured at intermediate hopper 6
Around, obtain following effect.
When interim keeping is from the circuit board 12 that reflow ovens 5 are transported in intermediate hopper 6, due to rousing by the 3rd
Blower fan 110C carrys out cooling circuit board 12, and the temperature therefore, it is possible to suppression circuit plate 12 rises.
The utility model is not limited to above-mentioned embodiment, various designs can be carried out in the range of without departing from its purport and is become
More.
For example, in the above-described embodiment, list as cooling body 100 have two retainers 101A, 101B with
And the example of three air blasts 110A, 110B, 110C is illustrated, but not limited to this.For example, the configuration quantity of retainer
It can be 1 or more than 3.Additionally, the configuration quantity of air blast can also be 1 or 2 or more than 4.
Additionally, in the above-described embodiment, drive when listing cooling circuit board 12, except stopping the 4th conveyer 94
Also carry out being illustrated based on the example of the stopping of retainer 101A, 101B outside dynamic, but not limited to this.For example, can be with
It is during cooling circuit board 12, in the state of the 4th conveyer 94 is driven, only to carry out based on retainer 101A, 101B
Stopping.
Claims (2)
1. a kind of circuitboard manufacturing devices, it is characterised in that the circuitboard manufacturing devices have：
Delivery device, it throws in printed wiring board in production line to manufacture circuit board；
Printing equipment, it is by solder printing to being invested on the printed wiring board in the production line；
Component mounter, it is installed to element on the printed wiring board for being printed with the solder；
Reflow ovens, it is heated to the printed wiring board for being provided with the element, by the element and the printing cloth
Line plate weld forms the circuit board together；
First conveyer, it is configured between the delivery device and the printing equipment；
Second conveyer, it is configured between the printing equipment and the component mounter；
3rd conveyer, it is configured between the component mounter and the reflow ovens；
4th conveyer, it extends from the reflow ovens towards the opposition side of the component mounter；
First retainer, it is configured along the 4th conveyer；And
First air blast, it is configured along the 4th conveyer,
The delivery device has the input accumulator that can receive multiple printed wiring boards,
The printing equipment has mask member made by the metal for being formed with multiple holes,
The reflow ovens have：
Atmosphere control device, oxygen concentration in inner space of the reflow ovens is remained the outside than the reflow ovens for it
Oxygen concentration in space is low；
Heater, temperature of the inner space is remained the temperature of regulation for it；And
Conveyer in reflow ovens, it is configured in the inner space, and can be transported and be moved in the inner space
The printed wiring board,
First retainer can retreat relative to the transport path of the circuit board in the 4th conveyer,
First air blast is adjacent with first retainer,
The circuitboard manufacturing devices also have：
Second retainer, it is configured at the opposition side of the reflow ovens relative to first retainer, and relative to described
The transport path of the circuit board in the 4th conveyer can retreat；And
Second air blast, it is adjacent with second retainer.
2. circuitboard manufacturing devices according to claim 1, it is characterised in that
The circuitboard manufacturing devices also have：
Intermediate hopper, it is configured at the opposition side of the reflow ovens relative to the 4th conveyer, and can receive
Multiple circuit boards；And
3rd air blast, it is configured at around the intermediate hopper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621219585.7U CN206181578U (en) | 2016-11-11 | 2016-11-11 | Circuit board manufacturing installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621219585.7U CN206181578U (en) | 2016-11-11 | 2016-11-11 | Circuit board manufacturing installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206181578U true CN206181578U (en) | 2017-05-17 |
Family
ID=58683575
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621219585.7U Expired - Fee Related CN206181578U (en) | 2016-11-11 | 2016-11-11 | Circuit board manufacturing installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206181578U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112053819A (en) * | 2020-09-02 | 2020-12-08 | 杭州瞳阳科技有限公司 | Production line based on paster electronic components |
-
2016
- 2016-11-11 CN CN201621219585.7U patent/CN206181578U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112053819A (en) * | 2020-09-02 | 2020-12-08 | 杭州瞳阳科技有限公司 | Production line based on paster electronic components |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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| CF01 | Termination of patent right due to non-payment of annual fee |