JPWO2011135737A1 - Heating device and cooling device - Google Patents

Abstract

It is possible to uniformly and stably heat or cool the entire printed circuit board without causing the temperature of the printed circuit board to rise or fall finely during heating or cooling of the printed circuit board.
The plurality of blowing nozzles 2 are arranged in a staggered manner at a predetermined angle θ (θ is 15 degrees or less) with respect to the conveyance direction E of the printed circuit board, with the adjacent blowing nozzles 2 being separated from each other by the same distance L. . As a result, the gas can be sprayed uniformly over the entire printed circuit board. Thereby, the reflow apparatus 100 can heat or cool the printed circuit board uniformly and stably without causing the temperature of the printed circuit board to rise or fall finely during heating or cooling of the printed circuit board. As a result, the heating efficiency and cooling efficiency of the print can be improved, and the possibility of occurrence of poor soldering can be reduced.

Description

  The present invention has a blowout port that blows out gas heated by a heater or gas cooled by a cooling unit, and a plurality of nozzles and blowout hole plates that blow the gas blown out from the blowout port onto a conveyed object such as a printed circuit board. The present invention relates to a heating device and a cooling device including

  When the solder material is melted and the electronic component is soldered to the printed board, a heating furnace such as a reflow apparatus is used. Such a reflow apparatus has a preheating zone, a main heating zone, and a cooling zone in a tunnel-like muffle, and a heater for heating is provided in the preheating zone and the main heating zone, and a water cooling pipe is provided in the cooling zone. And a cooling mechanism including a cooling fan or the like is provided.

  The heater used for this reflow apparatus includes an infrared heater and a hot air blowing heater. The infrared heater emits infrared rays when the infrared heater is energized. The solder paste applied to the soldering portion is melted by the emitted infrared rays to perform soldering. However, the infrared heater has a problem that it is difficult to sufficiently heat a soldered portion that becomes a shadow of an electronic component because infrared rays have straightness.

  On the other hand, the hot air blowing heater convects the hot air heated by the heater with a fan driven by a motor in the heating zone of the reflow device. For this reason, hot air blowing heaters can heat the entire printed circuit board evenly where hot air is in the shadows of electronic components and narrow gaps (for example, through holes). Adopted in the device.

  As a hot air blowing heater provided in the reflow apparatus, there are a heater that blows hot air from an outlet having a wide opening area, and a heater that blows hot air from many holes. The former heater has a large opening area at the air outlet, so the flow rate of hot air is relatively slow, and the heating efficiency when hot air collides with the printed circuit board is low. On the other hand, in the latter heater, the flow rate of hot air is faster than that of the former heater, and since there are many holes, there is no shortage of hot air flow. For this reason, the latter heater has high heating efficiency. For this reason, the reflow apparatus often uses a heater that blows hot air from a large number of holes. The following description regarding the heater is a hot air blowing heater having a plurality of holes.

  In general, in a reflow apparatus, a large number of hot air blowing heaters are respectively installed on the upper and lower portions of a printed circuit board conveyance section in a preheating zone and a main heating zone. For example, in the case where the preheating zone is composed of 5 zones, a total of 10 hot air blowing heaters are installed, 5 each above and below. If the main heating zone is composed of three zones, a total of six hot air blowing heaters are installed, three on the top and one on the bottom. For this reason, in one reflow apparatus, a total of 16 hot-air blowing heaters are installed in the upper and lower 8 pieces.

  In this zone configuration, the number of heaters to be used is appropriately selected according to the type of electronic component to be soldered to the printed board, that is, according to the temperature profile of the heating object.

  In the preheating zone, the temperature is usually set to be lower than that in the main heating zone or the amount of hot air is reduced. As a result, the printed circuit board is heated slowly, the printed circuit board gets used to heat, and the solvent in the solder paste is volatilized.

  The printed circuit board accustomed to heat by the preheating and the solvent in the solder paste is volatilized is conveyed to the main heating zone of the reflow apparatus and is heated. In the main heating zone, the temperature is usually set higher than that in the preheating zone, or the amount of hot air is increased to heat. As a result, the temperature of the printed circuit board is increased, the soldering is performed by heating the printed circuit board in a short time and melting the solder powder in the solder paste.

  Further, in the preheating zone and the main heating zone, a desired temperature profile suitable for the printed circuit board can be set by controlling the flow rate and temperature of the hot air blown from each hot air blowing heater by the control means. For example, the temperature of the hot air is controlled by a temperature controller, and the flow rate of the heated hot air blown into the muffle is controlled by changing the output of a fan motor that rotates the fan. Incidentally, an inverter motor that can easily control the output of the fan motor is generally used as this motor.

  Patent Document 1 discloses a soldering apparatus that blows hot air from a large number of holes. In this soldering apparatus, a large number of holes are formed in the reflow panel, and hot air heated by a heater blows out from the numerous holes.

  Patent Document 2 discloses an arrangement structure of gas blowing holes. In this array structure, uniform heating is performed by shifting the array in the width direction.

  FIG. 14 shows a conventional reflow device in which the vertical axis is the temperature (° C.) of the printed circuit board and the horizontal axis is the elapsed time (transport time) (seconds) after the printed circuit board is inserted into the reflow device (patent) It is explanatory drawing which shows the temperature profile example of literature 2). As shown in FIG. 14, the printed circuit board passes through the preheating zone A with a transfer time of about 70 seconds to about 230 seconds, passes through the main heating zone B with a transfer time of about 230 seconds to about 280 seconds, Pass the cooling zone C after 280 seconds. In the preheating zone A and the main heating zone B, the temperature of the printed circuit board is finely raised (about 0.5 to several degrees).

Japanese Patent Laid-Open No. 11-307927 JP 2004-214535 A

  Incidentally, in Patent Document 1, as shown in FIG. 15, the printed circuit board includes a first transport guide (hereinafter referred to as “transport guide L <b> 1”) and a second transport guide (hereinafter referred to as “transport guide L <b> 2”). Is conveyed in the conveying direction E indicated by the arrow. The hot air outlet 20 is composed of a plurality of circular holes in a lattice shape in the transport direction E and the direction orthogonal to the transport direction E. A plurality of circular holes are arranged at a pitch N with respect to the conveying direction E, and a plurality of circular holes are also arranged at a predetermined pitch interval in a direction orthogonal to the conveying direction E.

  As described above, when hot air is blown out from the hot air outlet 20 in which a plurality of circular holes are arranged, the printed circuit board is transported in the transport direction E, and hot air is continuously applied to the printed circuit board in the transport direction E. Although there is a portion where the hot air outlet 20 does not exist in a direction orthogonal to the transport direction E, hot air is not blown to a portion corresponding to a portion where the hot air outlet 20 does not exist on the printed circuit board. That is, as the printed board is transported, the density of the hot air blown onto the printed board becomes lighter and darker (difference in the amount of hot air hits), so that the temperature of the printed board in the direction perpendicular to the transport direction E is uniform. There was a problem of not becoming.

  Further, Patent Document 2 discloses a heating device that performs uniform heating by shifting the arrangement in the width direction, but also in this heating device, hot air is blown between the hot air outlet and the hot air outlet. As a result, the strength of the temperature rise of the printed circuit board tends to be strong. As shown in FIG. 14, it can be seen that the temperature of the printed circuit board easily rises and falls due to the shape of the temperature profile of the heating device.

  Although the fine temperature rise and fall of the printed circuit board as shown in FIG. 14 does not pose a big problem when soldering the printed circuit board, it is not completely free from the possibility of soldering failure. In addition, when the printed circuit board is cooled after soldering, the strength of the temperature of the printed circuit board is likely to increase and decrease, and there is a similar problem.

  The present invention solves such problems, and heats or cools the entire printed circuit board uniformly and stably without causing the temperature of the printed circuit board to rise or fall finely during heating or cooling of the printed circuit board. It is an object of the present invention to provide a heating device and a cooling device that can be used.

  In order to solve the above-described problems, a heating device according to the present invention includes a transport unit that transports a transported object in a predetermined transport direction, a heating unit that heats a gas, and a blowout port that blows out the gas heated by the heating unit. And a plurality of nozzles for blowing the gas blown from the blowout outlet onto the conveyed product conveyed by the conveying unit, and the plurality of nozzles are arranged in a staggered manner at a predetermined angle with respect to the conveying direction. It is characterized by this.

  The heating device according to the present invention includes a transport unit that transports the transported object in a predetermined transport direction, a heating unit that heats the gas, and a blowout port that blows out the gas heated by the heating unit. And a plurality of nozzles for blowing the gas blown from the outlet onto the conveyed product conveyed by the conveying unit. On the premise of this, for example, two or four of the adjacent nozzles are spaced apart from each other by the same distance, and are arranged in a staggered manner at a predetermined angle with respect to the conveyance direction of the conveyed product. Thereby, gas can be sprayed now uniformly on the whole conveyed product.

  Moreover, the heating device according to the present invention includes a transport unit that transports the transported object in a predetermined transport direction, a heating unit that heats the gas, and a blowout hole that blows out the gas heated by the heating unit. A blow hole plate that blows the blown gas onto a conveyed product conveyed by the conveyance unit, and the blow holes of the blow hole plate are arranged in a staggered manner at a predetermined angle with respect to the conveyance direction. To do.

  The heating device according to the present invention includes a transport unit that transports the transported object in a predetermined transport direction, a heating unit that heats the gas, and a blowout hole that blows out the gas heated by the heating unit. A blowout hole plate that blows the gas blown out from the holes onto the conveyed product conveyed by the conveyance unit. On the premise of this, the blowing holes of the blowing hole plate are arranged in a staggered manner at a predetermined angle with respect to the transport direction. Thereby, gas can be sprayed now uniformly on the whole conveyed product.

  The cooling device according to the present invention has a transport unit that transports a transported object in a predetermined transport direction, a cooling unit that cools the gas, and a blowout port that blows out the gas cooled by the cooling unit. And a plurality of nozzles for blowing the gas to the conveyed product conveyed by the conveying unit, and the plurality of nozzles are arranged in a staggered manner at a predetermined angle with respect to the conveying direction.

  The cooling device according to the present invention includes a transport unit that transports a transported object in a predetermined transport direction, a cooling unit that cools the gas, and a blowout port that blows out the gas heated by the cooling unit. And a plurality of nozzles for blowing the gas blown from the outlet onto the conveyed product conveyed by the conveying unit. On the premise of this, for example, two or four of the adjacent nozzles are spaced apart from each other by the same distance, and are arranged in a staggered manner at a predetermined angle with respect to the conveyance direction of the conveyed product. Thereby, gas can be sprayed now uniformly on the whole conveyed product.

  Moreover, the cooling device according to the present invention includes a transport unit that transports a transported object in a predetermined transport direction, a cooling unit that cools the gas, and a blowout hole that blows out the gas cooled by the cooling unit. A blow hole plate that blows the blown gas onto a conveyed product conveyed by the conveyance unit, and the blow holes of the blow hole plate are arranged in a staggered manner at a predetermined angle with respect to the conveyance direction. To do.

  The cooling device according to the present invention includes a transport unit that transports a conveyed product in a predetermined transport direction, a cooling unit that cools the gas, and a blowout hole that blows out the gas cooled by the cooling unit. A blowout hole plate that blows the gas blown out from the holes onto the conveyed product conveyed by the conveyance unit. On the premise of this, the blowing holes of the blowing hole plate are arranged in a staggered manner at a predetermined angle with respect to the transport direction. Thereby, gas can be sprayed now uniformly on the whole conveyed product.

  According to the heating device according to the present invention, the uniformly heated gas can be sprayed on the entire conveyed object, so that the temperature of the conveyed object does not rise and fall during the heating of the conveyed object, and the entire conveyed object can be evenly distributed. It can be heated stably. As a result, the heating efficiency can be improved and the possibility of poor soldering can be reduced.

  According to the cooling device of the present invention, the uniformly cooled gas can be sprayed on the entire conveyed object, so that the temperature of the conveyed object does not rise and fall during the cooling of the conveyed object, and the entire conveyed object can be evenly distributed. It can be cooled stably. As a result, the cooling efficiency can be improved, and the possibility of occurrence of poor soldering can be reduced.

  The arrangement of the plurality of air outlets in the present invention in a zigzag pattern means that a plurality of air outlets are arranged (row arrangement) with a predetermined pitch N with respect to the direction of conveyance of the printed circuit board and in the direction of conveyance of the printed circuit board. On the other hand, with respect to the direction orthogonal to the above, the row arrangement shifted by a half pitch (N / 2) in the transport direction is further shifted by a predetermined pitch M in the direction perpendicular to the transport direction of the printed circuit board. It is.

  Therefore, the adjacent row arrangements are arranged with a half-pitch shift, so that the odd-numbered columns and the even-numbered columns are matched with each other, and the odd-numbered and even-numbered columns are arranged with a half-pitch shifted in the transport direction. Become. By such a staggered arrangement, in locations where there are no air outlets, the hot air from the three surrounding air outlets is complemented, so the density of the hot air is also reduced. In addition to this, since the staggered arrangement is made at a predetermined angle with respect to the transport direction, a portion where there is no air outlet, that is, a blank area for heating or cooling disappears as the printed circuit board is transported. The strength of heating or cooling disappears. As a result, the concentration of hot air or cold air blown onto the printed circuit board becomes more uniform, and the temperature of the printed circuit board does not rise and fall finely during heating or cooling of the printed circuit board, so that the entire printed circuit board can be heated or cooled uniformly and stably. can do.

  Furthermore, when the adjacent nozzles are separated from each other by the same distance and are arranged in a staggered manner at a predetermined angle with respect to the transport direction, the hot air or cold air blown to the printed circuit board becomes almost uniform at any location, Heating or cooling can be performed more efficiently.

It is a front sectional view showing an example of composition of reflow device 100 concerning a 1st embodiment. 2 is a perspective view illustrating a configuration example of a nozzle device 1. FIG. 2 is a plan view showing a configuration example of a nozzle device 1. FIG. It is sectional drawing which shows the structural example of the nozzle apparatus 1 cut | disconnected by the DD line. It is a perspective view which shows the structural example of the blowing nozzle. 4 is a cross-sectional perspective view illustrating a configuration example of a blowing nozzle 2. FIG. 3 is an exploded perspective view showing an assembly example of the nozzle device 1. FIG. It is explanatory drawing which shows the temperature profile example of the reflow apparatus. It is explanatory drawing which shows the other example of arrangement | positioning of the blowing nozzle. It is a perspective view which shows the structural example of the blowing hole plate 10 which concerns on 2nd Embodiment. It is a schematic front view which shows the structural example of the flow soldering apparatus 30 which concerns on 3rd Embodiment. 4 is a cross-sectional perspective view showing a configuration example of a preheater section 33. FIG. 3 is a front sectional view showing a configuration example of a preheater section 33. FIG. It is explanatory drawing which shows the temperature profile example of the conventional reflow apparatus. It is explanatory drawing which shows the example of arrangement | positioning of the conventional hot air blower outlet.

  Hereinafter, the reflow apparatus 100 and the flow solder apparatus 30 will be described as examples of the heating apparatus of the present invention with reference to the drawings.

<First Embodiment>
[Configuration Example of Reflow Device 100]
First, a configuration example of the reflow apparatus 100 according to the first embodiment will be described. As shown in FIG. 1, the reflow device 100 is an example of a heating device, and includes a main body 101 and a conveyor 102 that is an example of a transport unit that transports a transported object such as a printed board.

  The main body 101 has three zones: a preheating zone A, a main heating zone B, and a cooling zone C. The printed circuit board to be soldered by the reflow apparatus 100 is conveyed by the conveyor 102 in the order of the preheating zone A, the main heating zone B, and the cooling zone C. The printed circuit board is held between conveyance guides L1 and L2 of a conveyor 102, which will be described later with reference to FIG.

  The preheating zone A is an area for slowly heating the printed circuit board and the electronic components mounted on the printed circuit board to acclimatize to heat, and is an area for volatilizing the solvent in the solder paste. The preheating zone A differs depending on the solder composition, the type of printed circuit board, and the like, but is generally set to 150 to 180 degrees with a lead-free paste. The main heating zone B is an area where the temperature is higher than that of the preheating zone A and is set to 240 degrees with a lead-free paste, and soldering is performed by melting the solder powder in the solder paste. Also. The cooling zone C is an area for cooling the soldered printed circuit board.

  In the preheating zone A, a first heater unit (hereinafter referred to as “heater unit 103”), which is an example of a heating unit, is arranged on each of the five zones above and below the conveyor 102. A nozzle device 1 is provided.

  In the main heating zone B, a second heater unit (hereinafter referred to as “heater unit 104”), which is an example of a heating unit, is arranged in three zones above and below the conveyor 102. A nozzle device 1 is provided.

  The heater units 103 and 104 are an example of a heating unit, and include a heating wire heater (not shown), a fan, a fan motor that rotates the fan, and the like. The heater units 103 and 104 reflow the heated gas by, for example, heating a gas (for example, an inert gas such as air or nitrogen gas) with a heating wire heater and driving a fan motor to rotate the fan. It blows out as hot air into the apparatus 100. The flow rate of hot air blown from the heaters 103 and 104 is controlled by the rotational speed of the fan motor. Usually, the temperature of the heater unit 104 is set higher than the temperature of the heater unit 103.

  In the cooling zone C, a cooling unit 105, which is an example of a cooling device, is arranged on each of the zones above and below the conveyor 102, and each cooling unit 105 is provided with a nozzle device 1.

  The cooling unit 105 includes a cooling mechanism including a water cooling pipe (not shown), a fan, a fan motor that rotates the fan, and the like. For example, the cooling unit 105 cools the gas by flowing water into the pipe of the water-cooled pipe to cool the pipe and bringing the gas into contact with the pipe. Then, the cooling unit 105 drives the fan motor to rotate the fan, and the gas cooled by the pipe is blown out from the nozzle device 1 as cold air into the reflow device 100 to cool the soldered printed circuit board.

  Note that the cooling mechanism may be configured only by air cooling with a fan by removing the water cooling pipe. Further, the number of zones of the preheating zone A and the main heating zone B, the number of heaters of the heater units 103 and 104, and the vertical arrangement of the heaters are not limited to this example, and can be changed as appropriate.

[Configuration Example of Nozzle Device 1]
Next, a configuration example of the nozzle device 1 provided in the heater units 103 and 104 will be described. As shown in FIGS. 2, 3, and 4, the nozzle device 1 includes a plurality of blowing nozzles 2, a nozzle cover 3, a mounting plate 4, and a fixed plate 5.

  A blow-out port 22 that blows out the gas heated by the heaters 103 and 104 described above is provided at the tip of the blow-out nozzle 2, and the blow-out nozzle 2 transports the gas blown from the blow-out port 22 in the transport direction E. Sprayed onto a printed circuit board (not shown). The plurality of blowing nozzles 2 are arranged in a staggered manner with an angle θ with respect to the transport direction E, with the adjacent blowing nozzles 2 being separated from each other by the same distance L. In this case, an equilateral triangle having a distance L on one side is drawn from a line segment connecting adjacent blowing nozzles 2. Thus, when the blower outlet 22 of the blowout nozzle 2 is arranged in an equilateral triangle, the hot air blown to the printed circuit board is almost uniform, and can be heated more efficiently. Further, the angle θ is desirably 15 degrees or less.

  Thereby, since it arrange | positioned at predetermined | prescribed angle (theta) with respect to the conveyance direction E at the predetermined angle (theta), since the location where the blower outlet 22 does not exist, ie, the heating blank zone, disappears with conveyance of a printed circuit board, rapid heating The strength of is lost. As a result, the concentration of the hot air blown onto the printed circuit board becomes more uniform, and the entire printed circuit board can be heated uniformly and stably without the temperature of the printed circuit board rising and falling finely during heating of the printed circuit board.

  Further, when the blowout ports 22 of the adjacent blowout nozzles 2 are arranged so as to form an equilateral triangle as described above, if the adjacent blowout nozzles 2 are divided into a plurality of blocks, the combination of the blocks becomes easy. The manufacturing cost of the blowout nozzle and the assembly cost of the nozzle device can also be reduced.

  A nozzle cover 3 is covered with the blowing nozzle 2. The nozzle cover 3 is provided with a suction port 3a and a blowing nozzle hole 3b close to each other. The blowing nozzle hole 3 b is fitted to the tip of the blowing nozzle 2. The suction port 3a has an oval shape, and sucks gas stored in the muffle or gas that is blown from the blow nozzle 2 and collides with the printed circuit board to be reflected.

  The gas reflected on the printed circuit board may interfere with the high temperature gas blown out from the air outlet 22. When the gas reflected on the printed circuit board is deprived of heat by the printed circuit board and the temperature of the gas is lowered and interferes with the gas blown out from the air outlet 22, the temperature of the gas blown out from the air outlet 22 is lowered. In some cases, the gas blowing direction from the air outlet 22 may be disturbed. Therefore, the suction port 3a is provided, and the gas reflected on the printed board is immediately sucked into the suction port 3a. Thereby, the gas reflected on the printed circuit board does not interfere with the gas blown out from the outlet 22.

  A mounting plate 4 is provided below the blowing nozzle 2 and the nozzle cover 3. The mounting plate 4 is provided with a nozzle mounting hole 4b and a fitting groove 4d. By inserting the blowing nozzle 2 into the nozzle mounting hole 4b and fitting the nozzle cover 3 into the fitting groove 4d, the blowing nozzle 2, the nozzle cover 3 and the mounting plate 4 are integrated.

  In addition, a heater portion attachment hole 4 a is provided in the outer peripheral portion of the attachment plate 4, and a screw device or the like is screwed into the heater portion attachment hole 4 a to attach the nozzle device 1 to the heater portions 103 and 104. Further, suction ports 4 c are provided on both sides of the mounting plate 4. The suction port 4 c is for returning the gas in the muffle sucked by the suction port 3 a to the heater portions 103 and 104.

  A fixed plate 5 is attached to the lower portion of the attachment plate 4 in a state where the blowing nozzle 2 is supported. The fixing plate 5 fixes the blowing nozzle 2 in the blowing nozzle hole 3 b of the nozzle cover 3. The nozzle cover 3 and the mounting plate 4 are fixed by a known method such as screwing. The fixed plate 5 has a fixed plate hole 5 a at a position corresponding to the air outlet 22. The fixed plate hole 5 a is a hole through which the gas heated by the heater units 103 and 104 is passed and supplied to the blowing nozzle 2.

  The nozzle device 1 configured as described above blows the gas heated by the heaters 103 and 104 from the fixed plate hole 5a of the fixed plate 5 into the muffle of the reflow device 100 through the outlet 22 of the nozzle 2. The gas is blown onto the printed circuit board to heat the printed circuit board to a predetermined temperature. Further, the gas sprayed and reflected on the printed circuit board is refluxed to the heater portions 103 and 104 through the suction port 3 a of the nozzle cover 3 and the suction port 4 c of the mounting plate 4. The refluxed gas is heated again by the heaters 103 and 104, and the heated hot air is repeatedly circulated from the blowing nozzle 2 into the muffle.

  Further, in the nozzle device 1, the suction port 3 a is blown out from the blowout port 22 and sucks the gas reflected by colliding with the printed circuit board. Therefore, the gas reflected on the printed circuit board obstructs the gas blown out from the blowout port 22. Can be prevented. As a result, in the nozzle device 1, the gas reflected on the printed circuit board does not interfere with the gas reflected on the printed circuit board by the gas blown out from the air outlet 22, and the temperature of the gas is lowered, or the gas blowing direction is changed. It can prevent being disturbed.

[Configuration example of the blowing nozzle 2]
Next, a configuration example of the blowing nozzle 2 will be described. As shown in FIGS. 5 and 6, the blowout nozzle 2 includes a nozzle body 21 and a blowout port 22. The nozzle body 21 has a convex portion 21a at the lower end, and is formed of a metal material having good thermal conductivity such as aluminum or copper. The convex portion 21 a is for fitting into the nozzle mounting hole 4 b of the mounting plate 4. The nozzle body 21 is provided with a gas flow path 24. The gas flow path 24 flows the gas heated by the heaters 103 and 104 and the gas cooled by the cooling unit 105 to the outlet 22 at the tip of the nozzle.

  The blowout nozzle 2 configured in this manner allows the gas heated by the heaters 103 and 104 and the gas cooled by the cooling unit 105 to flow from the fixed plate hole 5a of the fixed plate 5 to the gas flow path 24 and the blowout nozzle 2. The gas is blown into the muffle of the reflow apparatus 100 through the outlet 22 and blown to the printed circuit board.

[Assembly example of nozzle device 1]
Next, an assembly example of the nozzle device 1 will be described. As shown in FIG. 5, the blowout nozzle 2 is provided with a blowout port 22 in the nozzle body 21. The air outlet 22 may be formed by making the nozzle body 21 by a die casting method or the like and then drilling it with a drill or the like. The nozzle body 21 and the air outlet 22 may be simultaneously formed by a die casting method or the like. You may produce by. In FIG. 7, in order to make the drawing easier to see, some blowout nozzles 2 are omitted.

  The nozzle cover 3 is provided with a blowing nozzle hole 3b and a suction port 3a. The blowout nozzle hole 3 b has a diameter one size larger than that of the blowout port 22 in order to fit so as to surround the blowout port 22. The suction port 3 a has an oval shape, and is formed in the vicinity of the blowing nozzle hole 3 b in order to be positioned in the vicinity of the blowing nozzle 2. The suction port 3a and the blowing nozzle hole 3b may be formed by drilling the nozzle cover 3 with a drill or the like, or may be formed by punching the nozzle cover 3 with a press die. Good.

  The mounting plate 4 is provided with a heater portion mounting hole 4a, a nozzle mounting hole 4b, and a suction port 4c. The nozzle mounting hole 4b is smaller than the outer periphery of the convex portion 21a in order to fix the convex portion 21a at the rear end of the blowing nozzle 2. Further, when the blowing nozzle 2 is inserted into the nozzle mounting hole 4b in a press-fit manner, the blowing nozzle 2 can be temporarily fixed to the mounting plate 4 when the nozzle device 1 is assembled. Work becomes easier when installing.

  The suction port 4 c is for returning the gas sucked from the suction port 3 a of the nozzle cover 3 to the heater units 103 and 104. The heater mounting hole 4a, the nozzle mounting hole 4b, and the suction port 4c may be formed by drilling the mounting plate 4 with a drill as in the nozzle cover 3 described above. It may be formed by punching and punching. The mounting plate 4 is provided with a fitting groove 4d on the outer periphery thereof. The fitting groove 4 d is for fitting the outer peripheral portion of the nozzle cover 3 that covers the upper portion of the mounting plate 4. The nozzle groove 3 can be assembled without being displaced from the mounting plate 4 by the fitting groove 4d.

  A fixing plate hole 5 a is formed in the fixing plate 5. The fixed plate hole 5a is a hole provided to supply the gas heated by the heaters 103 and 104 to the lower part of the outlet 22 and to blow hot air from the outlet 22 into the muffle of the reflow device 100. . The fixed plate hole 5a may be formed by drilling the fixed plate 5 with a drill in the same manner as the nozzle cover 3 and the mounting plate 4 described above, or by punching the fixed plate 5 with a press die. You may form by doing. The production methods of the nozzle cover 3, the mounting plate 4 and the fixing plate 5 can be changed as appropriate.

  Assuming that the blowing nozzle 2, the nozzle cover 3, the mounting plate 4 and the fixing plate 5 are formed as described above, first, the blowing nozzle is inserted into the nozzle mounting hole 4b of the mounting plate 4 as shown in FIG. 2 is attached from the upper side of the blower outlet 22. Then, the protruding portion 21a at the rear end of the blowing nozzle 2 comes into contact with the nozzle mounting hole 4b, and the blowing nozzle 2 and the mounting plate 4 are fitted.

  Next, the fixed plate 5 is attached to the lower part of the blow-off nozzle 2 and the attachment plate 4 fitted. At this time, the fixing plate 5 is attached to the mounting plate 4 in a state of supporting the blowing nozzle 2 by screwing screws into screw holes (not shown) of the fixing plate 5, and the blowing nozzle 2, the mounting plate 4 and the fixing plate 5. Are integrated.

  Finally, the nozzle cover 3 covers the upper part of the blowout nozzle 2, the mounting plate 4, and the fixed plate 5 that are integrated. Since the fitting groove 4 d is provided in the mounting plate 4, the nozzle cover 3 may be displaced from the mounting plate 4 by fitting the outer peripheral portion of the nozzle cover 3 to the mounting plate 4 by the fitting groove 4 d. Absent. The nozzle cover 3 and the mounting plate 4 are fixed by a known method such as screwing. By such a method, the nozzle device 1 is easily assembled.

  Incidentally, you may join the blowing nozzle 2, the attachment plate 4, the fixed plate 5, and the nozzle cover 3 by welding. Further, the mounting plate 4 may be deleted by screwing the blowing nozzle 2 directly to the nozzle cover 3 and fixing the blowing nozzle 2 to the nozzle cover. The assembly method of the nozzle device 1 is not limited to this example, and can be changed as appropriate.

[Temperature profile example of reflow apparatus 100]
Next, an example of the temperature profile of the reflow apparatus 100 will be described. FIG. 8 shows the temperature profile of the reflow apparatus 100 where the vertical axis is the temperature (° C.) of the printed circuit board and the horizontal axis is the elapsed time (transport time) (seconds) after the printed circuit board is inserted into the reflow apparatus. It is explanatory drawing which shows an example. As shown in FIG. 8, the printed circuit board passes through the preheating zone A with a transport time of about 70 seconds to about 230 seconds, passes through the main heating zone B with a transport time of about 230 seconds to about 285 seconds, It passes through the cooling zone C after 285 seconds.

  Compared with the temperature profile example of the conventional reflow apparatus shown in FIG. 14, the conventional reflow apparatus shows a slight increase in the temperature of the printed circuit board in the preheating zone A and the main heating zone B. In the reflow apparatus 100 according to the embodiment, the temperature of the printed circuit board does not rise and fall finely in the preheating zone A and the main heating zone B, and draws a smooth waveform.

  As can be seen from this temperature profile example, the reflow apparatus 100 can prevent the gas blown out from the plurality of blowout nozzles 2 and can uniformly blow the gas over the entire printed circuit board. Thereby, the whole printed circuit board can be heated uniformly and stably. As a result, the heating efficiency of the printed circuit board can be improved, and the possibility of occurrence of poor soldering can be reduced.

  As described above, according to the reflow apparatus 100 according to the first embodiment, the conveyor 102 that transports the printed circuit board in the predetermined transport direction E, and the heater unit that is provided on the upper and lower portions of the conveyor 102 and heats the gas. 103 and 104 and a plurality of blowout nozzles for blowing the gas heated by the heaters 103 and 104 and blowing the gas blown from the blowout port 22 onto the printed circuit board conveyed by the conveyor 102 2 is provided.

  On the premise of this, the plurality of blowing nozzles 2 are arranged in a staggered manner at a predetermined angle θ (θ is 15 degrees or less) with respect to the conveyance direction E of the printed circuit board. As a result, the gas can be sprayed uniformly over the entire printed circuit board.

  Thereby, the reflow apparatus 100 can heat the whole printed circuit board uniformly and stably without the temperature of the printed circuit board rising and falling finely during the heating of the printed circuit board (see FIG. 8). As a result, the heating efficiency of the print can be improved, and the possibility of occurrence of soldering defects can be reduced.

  In the present embodiment, it has been described that adjacent blowing nozzles are spaced apart from each other by the same distance L, and are arranged in a staggered manner at a predetermined angle with respect to the transport direction. However, the present invention is not limited to this. As shown in FIG. 9, they may be arranged in a staggered manner at a predetermined angle θ with respect to the transport direction E. The printed circuit board is held between the conveyance guides L1 and L2 and conveyed in the direction indicated by the conveyance direction E.

  In this case, an isosceles triangle having a distance M1 as a base and a distance M2 as two sides is drawn from a line segment connecting adjacent blowing nozzles. Further, the angle θ is desirably 15 degrees or less. Thereby, like this Embodiment, interference of the gas which blows off from the several blowing nozzle 2 can be prevented, and gas can be sprayed uniformly on the whole printed circuit board.

  In the present embodiment, the reflow apparatus which is an example of the heating apparatus has been described in detail. However, the present invention is not limited to this and can be applied to a cooling apparatus.

<Second Embodiment>
In the second embodiment, a blowout hole plate 10 that can replace the nozzle device 1 described in the first embodiment will be described.

  As shown in FIG. 10, the blowout hole plate 10 includes a plate body portion 11, a blowout hole 12, a suction port 13, and a mounting hole 14. The blowout hole plate 10 is a substitute for the nozzle device 1 shown in the first embodiment described above, and has no nozzle shape. By making the plate shape, the manufacturing cost can be reduced. . For example, instead of the nozzle device 1 attached to the reflow device 100 shown in FIG. 1, the blowout hole plate 10 is attached via the attachment hole 14.

  The plate main body 11 is provided with a blowout hole 12, a suction port 13, and a mounting hole 14. The blowout holes 12 are arranged in a staggered manner at a predetermined angle with respect to the direction in which the conveyor 102 transports the printed circuit board. The gas heated by the heaters 103 and 104 shown in FIG. 1 and the gas cooled by the cooling unit 105 are blown out from the blowout holes 12.

  The gas blown out from the blowout hole 12 collides with, for example, a printed circuit board that has been conveyed directly above or below the blowout hole plate 10. Then, the gas is reflected by the printed circuit board and sucked by the suction port 13. Thereby, the gas reflected from the printed circuit board does not interfere with the gas blown out from the blowout hole 12. Incidentally, the suction port 13 is provided with a net so that particles and the like do not enter the preheater portion 33.

  Thus, according to the blowing hole plate 10 which concerns on 2nd Embodiment, it is the blowing hole plate which has the blowing holes 12 arrange | positioned at a predetermined angle with respect to the conveyance direction instead of the nozzle apparatus 1. By attaching 10 to the reflow apparatus 100, the heated or cooled gas can be sprayed uniformly over the entire printed circuit board. In addition, the manufacturing cost can be reduced as compared with the nozzle device 1 described in the first embodiment.

<Third Embodiment>
In the third embodiment, a flow soldering apparatus 30 including the blowout hole plate 10 described in the second embodiment will be described. Components having the same names and reference numerals as those in the first and second embodiments have the same functions, and thus description thereof is omitted.

[Configuration example of flow soldering apparatus 30]
First, a configuration example of the flow soldering apparatus 30 will be described. As shown in FIG. 11, the flow solder device 30 is an example of a heating device, and includes a main body case 31, a transport unit 32, a preheater unit 33, a jet solder tank 34, and a cooling unit 35.

  The main body case 31 covers the transport section 32, the preheater section 33, the jet solder tank 34, and the cooling section 35, and protects the printed circuit board (not shown) from being contaminated by particles such as dust from the outside.

  The conveyance part 32 conveys a printed circuit board. The conveyance unit 32 conveys the printed circuit board in the order of the pre-heater unit 33, the jet solder tank 34, and the cooling unit 35, and carries it out of the flow soldering device 30.

  The pre-heater unit 33 dries the printed circuit board on which the flux is applied in the fluxer process, which is a process before the printed circuit board is put into the flow soldering apparatus 30, with hot air, and performs soldering in a jet solder bath 34 described later. When performing, the printed circuit board is preheated in order to improve the adhesion force of the solder, which is the degree to which the solder is adhered to the printed circuit board (the preheater portion 33 will be described in detail with reference to FIGS. 12 and 13). .

  The preheater section 33 is provided with the blowout hole plate 10 described in the second embodiment (see FIG. 10). The preheater section 33 blows hot air from the blowout holes 12 formed in a staggered manner at a predetermined angle with respect to the transport direction of the printed circuit board, which is formed in the blowout hole plate 10. Thereby, it becomes possible to blow hot air uniformly over the entire printed circuit board.

  As a result, the preheater section 33 can uniformly and stably heat the entire printed circuit board without causing the temperature of the printed circuit board to rise and fall finely during the heating of the printed circuit board (see FIG. 8). As a result, the heating efficiency of the print can be improved, and the possibility of occurrence of soldering defects can be reduced.

  The pre-heater unit 33 includes first to fourth heaters, and the first to fourth heaters are provided side by side with respect to the conveyance direction of the printed circuit board, and each of the first to fourth heaters is provided. The temperature can be adjusted.

  A jet solder bath 34 is provided adjacent to the preheater portion 33. The jet solder tank 34 sprays solder onto the printed circuit board dried by the pre-heater unit 33 to form solder at predetermined locations on the printed circuit board.

  A cooling part 35 is provided adjacent to the jet solder bath 34. The cooling unit 35 is an example of a cooling device, and sends air blown by a fan (not shown) constituting the cooling unit 35 to the printed circuit board to cool the printed circuit board heated in the preheater unit 33 and the jet solder tank 34. is there. By cooling the printed circuit board with the cooling unit 35, it is possible to prevent cracks and the like generated in the solder adhered to the printed circuit board.

  As with the preheater unit 33, the cooling unit 35 is provided with the blowing hole plate 10 having the blowing holes 12 arranged in a staggered manner at a predetermined angle with respect to the transport direction. The cooling unit 35 blows out cold air from the blowout holes 12 of the blowout hole plate 10. Thereby, it becomes possible to blow cold air uniformly over the entire printed circuit board.

[Configuration Example of Preheater Unit 33]
Next, a configuration example of the preheater unit 33 will be described. As shown in FIGS. 12 and 13, the preheater section 33 includes the blowout hole plate 10, the current plate 331, the heater 332, the fan 333, and the motor 334.

  A blowout hole plate 10 is provided on the top of the preheater portion 33. A rectifying plate 331 and a heater 332 are provided below the blowout hole plate 10 and inside the preheater portion 33. The rectifying plate 331 rectifies the flow of gas blown out from the blowout hole 12. The heater 332 is an example of a heating unit, and heats the gas sucked by the suction port 13 provided in the blowout hole plate 10.

  A fan 333 is provided directly below the heater 332. The fan 333 is a so-called sirocco fan and discharges the gas sucked from the vertical direction in the horizontal direction. The fan 333 is provided with a motor 334. The motor 334 is a power source that pivotally supports the fan 333 and rotates the fan 333 at a desired rotational speed. The number of rotations of the motor 334 and the heating temperature of the heater 332 are controlled by a control unit (not shown), thereby controlling the temperature of the gas blown to the printed circuit board conveyed to the preheater unit 33.

  Thus, according to the flow soldering apparatus 30 according to the third embodiment, the transport unit 32 that transports the printed circuit board in a predetermined transport direction, and the preheater that is provided below the transport unit 32 and heats the gas. And a blowout hole plate 10 that blows the gas blown from the blowout holes 12 onto the printed circuit board conveyed by the conveyance unit 32. Prepare.

  On the premise of this, the blowing holes 12 of the blowing hole plate 10 are arranged in a staggered manner at a predetermined angle with respect to the transport direction of the printed circuit board. Thereby, it becomes possible to blow hot air uniformly over the entire printed circuit board. As a result, the entire printed circuit board can be heated uniformly and stably, the heating efficiency of the print can be improved, and the possibility of defective soldering can be reduced.

  In addition, in this Embodiment, although the flow solder apparatus 30 provided with the blowing hole plate 10 was demonstrated, it is not limited to this, The nozzle apparatus 1 demonstrated in 1st Embodiment instead of the blowing hole plate 10 is used. The above-described effects can be obtained even with the provided flow soldering apparatus.

  Moreover, this invention is not limited only to a reflow apparatus and a flow solder apparatus, It can apply also to the heating apparatus which heats a target object with a hot air, and the cooling device which cools a target object with cold air.

  DESCRIPTION OF SYMBOLS 1 ... Nozzle device, 2 ... Blowing nozzle, 3 ... Nozzle cover, 3a, 4c ... Suction port, 3b ... Hole for blowing nozzle, 4 ... Mounting plate, 5 ... Fixed plate, 10 ... Blow hole plate, 20 ... Hot air outlet, 21 ... Nozzle body part, 22 ... Blower, 30 ... Flow soldering device (heating device), 33 ... Preheater unit, 100 ... reflow device (heating device), 101 ... main body unit, 102 ... conveyor (conveying unit), 103 ... first heater unit (heating unit), 104 ... first 2 heater parts (heating part), 105... Cooling part (cooling device)

[0005]
[0019]
The present invention solves such problems, and heats or cools the entire printed circuit board uniformly and stably without causing the temperature of the printed circuit board to rise or fall finely during heating or cooling of the printed circuit board. It is an object of the present invention to provide a heating device and a cooling device that can be used.
Means for Solving the Problems [0020]
In order to solve the above-described problems, a heating device according to the present invention includes a transport unit that transports a transported object in a predetermined transport direction, a heating unit that heats a gas, and a blowout port that blows out the gas heated by the heating unit. And a plurality of nozzles for blowing the gas blown from the blowout outlet onto the conveyed product conveyed by the conveying unit, and the plurality of nozzles are arranged in a row with a predetermined pitch N with respect to the conveying direction of the conveyed item In addition, the row arrangement shifted by the pitch N / 2 in the transport direction is further arranged in a zigzag pattern shifted by a predetermined pitch M in the direction orthogonal to the transport direction, and more than 0 degrees with respect to the transport direction. It is characterized by being arranged in a staggered manner at an angle of less than or equal to degrees.
[0021]
The heating device according to the present invention includes a transport unit that transports the transported object in a predetermined transport direction, a heating unit that heats the gas, and a blowout port that blows out the gas heated by the heating unit. And a plurality of nozzles for blowing the gas blown from the outlet onto the conveyed product conveyed by the conveying unit. On the premise of this, for example, two or four of the adjacent nozzles are spaced apart from each other by the same distance, and are arranged in a staggered manner at a predetermined angle with respect to the conveyance direction of the conveyed product. Thereby, gas can be sprayed now uniformly on the whole conveyed product.
[0022]
Moreover, the heating device according to the present invention includes a transport unit that transports the transported object in a predetermined transport direction, a heating unit that heats the gas, and a blowout hole that blows out the gas heated by the heating unit. A blow hole plate for blowing the blown gas onto the conveyed product conveyed by the conveyance unit, and the blow holes of the blow hole plate are arranged in a row with a predetermined pitch N in the conveyance direction of the conveyed product, The row arrangement shifted by pitch N / 2 in the transport direction is further arranged in a staggered pattern shifted by a predetermined pitch M in a direction orthogonal to the transport direction, and an angle of more than 0 degrees and less than 15 degrees with respect to the transport direction It is characterized by being arranged in a zigzag pattern.
[0023]
The heating device according to the present invention includes a transport unit that transports the transported object in a predetermined transport direction, a heating unit that heats the gas, and a blowout hole that blows out the gas heated by the heating unit. A blowout hole plate that blows the gas blown out from the holes onto the conveyed product conveyed by the conveyance unit. On the premise of this, the blow holes of the blow hole plate are arranged in a staggered manner at a predetermined angle with respect to the transport direction.

[0006]
. Thereby, gas can be sprayed now uniformly on the whole conveyed product.
[0024]
The cooling device according to the present invention has a transport unit that transports a transported object in a predetermined transport direction, a cooling unit that cools the gas, and a blowout port that blows out the gas cooled by the cooling unit. And a plurality of nozzles for blowing the gas to the conveyed product conveyed by the conveying unit. The plurality of nozzles are arranged in a row with a predetermined pitch N in the conveying direction of the conveyed item, and the pitch N in the conveying direction. / 2 The staggered arrangement of rows shifted by a predetermined pitch M in the direction orthogonal to the transport direction is arranged in a staggered manner at an angle of more than 0 degrees and 15 degrees or less with respect to the transport direction. It is characterized by that.
[0025]
The cooling device according to the present invention includes a transport unit that transports a transported object in a predetermined transport direction, a cooling unit that cools the gas, and a blowout port that blows out the gas heated by the cooling unit. And a plurality of nozzles for blowing the gas blown from the outlet onto the conveyed product conveyed by the conveying unit. On the premise of this, for example, two or four of the adjacent nozzles are spaced apart from each other by the same distance, and are arranged in a staggered manner at a predetermined angle with respect to the conveyance direction of the conveyed product. Thereby, gas can be sprayed now uniformly on the whole conveyed product.
[0026]
Moreover, the cooling device according to the present invention includes a transport unit that transports a transported object in a predetermined transport direction, a cooling unit that cools the gas, and a blowout hole that blows out the gas cooled by the cooling unit. A blow hole plate for blowing the blown gas onto the conveyed product conveyed by the conveyance unit, and the blow holes of the blow hole plate are arranged in a row with a predetermined pitch N in the conveyance direction of the conveyed product, The row arrangement shifted by pitch N / 2 in the transport direction is further arranged in a staggered pattern shifted by a predetermined pitch M in a direction orthogonal to the transport direction, and an angle of more than 0 degrees and less than 15 degrees with respect to the transport direction It is characterized by being arranged in a zigzag pattern.
[0027]
The cooling device according to the present invention includes a transport unit that transports a conveyed product in a predetermined transport direction, a cooling unit that cools the gas, and a blowout hole that blows out the gas cooled by the cooling unit. A blowout hole plate that blows the gas blown out from the holes onto the conveyed product conveyed by the conveyance unit. On the premise of this, the blowing holes of the blowing hole plate are arranged in a staggered manner at a predetermined angle with respect to the transport direction. Thereby, gas can be sprayed now uniformly on the whole conveyed product.
Effects of the Invention [0028]
According to the heating device of the present invention, the uniformly heated gas is blown over the entire conveyed product.

Claims (8)

A transport unit for transporting a transported object in a predetermined transport direction;
A heating unit for heating the gas;
It has a blowout port that blows out the gas heated by the heating unit, and includes a plurality of nozzles that blow the gas blown out from the blowout port onto the conveyed product conveyed by the conveyance unit,
The plurality of nozzles are:
The heating device is arranged in a staggered manner at a predetermined angle with respect to the transport direction. The plurality of nozzles are:
2. The heating apparatus according to claim 1, wherein the adjacent nozzles are spaced apart from each other by the same distance and are arranged in a staggered manner at a predetermined angle with respect to the transport direction. The plurality of nozzles are:
The heating device according to claim 1, wherein the heating device is arranged in a staggered manner at an angle of 15 degrees or less with respect to the transport direction. A transport unit for transporting a transported object in a predetermined transport direction;
A heating unit for heating the gas;
A blow hole that blows out the gas heated by the heating unit, and a blow hole plate that blows the gas blown from the blow hole onto the transported material transported by the transport unit;
The outlet holes of the outlet hole plate are:
The heating device is arranged in a staggered manner at a predetermined angle with respect to the transport direction. A transport unit for transporting a transported object in a predetermined transport direction;
A cooling unit for cooling the gas;
It has a blowout port that blows out the gas cooled by the cooling unit, and includes a plurality of nozzles that blow the gas blown out from the blowout port onto the conveyed product conveyed by the conveyance unit,
The plurality of nozzles are:
The cooling device is arranged in a staggered manner at a predetermined angle with respect to the transport direction. The plurality of nozzles are:
6. The cooling device according to claim 5, wherein each of adjacent nozzles is spaced apart from each other by the same distance and is arranged in a staggered manner at a predetermined angle with respect to the transport direction. The plurality of nozzles are:
The cooling device according to claim 5 or 6, wherein the cooling device is arranged in a staggered manner at an angle of 15 degrees or less with respect to the transport direction. A transport unit for transporting a transported object in a predetermined transport direction;
A cooling unit for cooling the gas;
A blowout hole for blowing out the gas cooled by the cooling unit, and a blowout hole plate for blowing the gas blown out from the blowout hole to a conveyed product conveyed by the conveyance unit;
The outlet hole of the outlet hole plate is
The cooling device is arranged in a staggered manner at a predetermined angle with respect to the transport direction.

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