CN107234314B - Electronic component array type hot air welding device and application method thereof - Google Patents
Electronic component array type hot air welding device and application method thereof Download PDFInfo
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- CN107234314B CN107234314B CN201710504826.5A CN201710504826A CN107234314B CN 107234314 B CN107234314 B CN 107234314B CN 201710504826 A CN201710504826 A CN 201710504826A CN 107234314 B CN107234314 B CN 107234314B
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- bin
- hot air
- heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
The invention relates to an electronic component array type hot air welding device and a use method thereof, wherein the device comprises a gas storage bin, a uniform pressure heat preservation bin, a heating bin and a hot air outlet which are sequentially connected from top to bottom and are mutually communicated; the air storage bin, the uniform pressure heat preservation bin and the heating bin are all closed bin bodies, wherein a cold air inlet is formed in one end of the air storage bin and is connected with an external cold air conveying pipeline; the connection parts of the even pressure heat preservation bin and the gas storage bin as well as the heating bin are provided with even flow plates; an armored heating rod is arranged in the heating bin; the hot air outlet is provided with an array type hot air guide hole, and the array type hot air guide hole is matched with the array arrangement form of the welded electronic component body and the pins. According to the invention, cold air is directly blown to the welding point of the electronic component through the sectional decompression, uniform flow and heating from the array guide hole, so that the damage to other equipment is greatly reduced, the longitudinal welding temperature is consistent, and the welding quality can be ensured; the device has simple structure and low manufacturing and using cost.
Description
Technical Field
The invention relates to the technical field of hot air welding, in particular to an electronic component array type hot air welding device and a use method thereof.
Background
Some electronic components (such as various boards used in computers) are soldered to a circuit board by a hot air soldering process, wherein hot air soldering is a process of blowing air or nitrogen heated to a sufficiently high temperature to the circuit board on which the components are already attached, and bonding the solder on both sides of the components with a motherboard after melting.
At present, a tunnel type reflow soldering machine or a drawer type reflow soldering machine is commonly adopted as the internal temperature of a soldering cavity is required to be ensured at all times in the use process of the soldering machine, meanwhile, the electronic components to be soldered pass through a high temperature area, and a matched conveying device is required to bear a severe high temperature environment, so that the device is extremely easy to age; in addition, the intermittent welding process requires a large amount of electric energy, and the production requirement cannot be met when energy conservation and emission reduction are promoted greatly. The tunnel type reflow soldering machine for continuous production has low value, import equipment is up to millions of yuan, the occupied fund amount is large, the maintenance cost is high, and the tunnel type reflow soldering machine is a small burden for electronic component manufacturers. In addition, the temperature gradient of the conventional reflow soldering machine along the length direction of the furnace is not easy to control, and the temperature distribution of each part of the hearth is difficult to control accurately.
Disclosure of Invention
The invention provides an array type hot air welding device for electronic components and a use method thereof, wherein cold air is directly blown to welding points of the electronic components from an array type guide hole after being subjected to sectional decompression, uniform flow and heating, so that the damage to other equipment is greatly reduced, the longitudinal welding temperature is consistent, and the welding quality can be ensured; the device has simple structure and low manufacturing and using cost.
In order to achieve the above purpose, the invention is realized by adopting the following technical scheme:
an electronic component array type hot air welding device comprises a gas storage bin, a uniform pressure heat preservation bin, a heating bin and a hot air outlet which are sequentially connected from top to bottom and are communicated with each other; the air storage bin, the uniform pressure heat preservation bin and the heating bin are all closed bin bodies, wherein a cold air inlet is formed in one end of the air storage bin and is connected with an external cold air conveying pipeline; the connection parts of the even pressure heat preservation bin and the gas storage bin as well as the heating bin are provided with even flow plates; an armored heating rod is arranged in the heating bin; the hot air outlet is provided with an array type hot air guide hole which penetrates up and down, and the array type hot air guide hole is matched with the array arrangement type of the welded electronic component body and the pins.
The gas storage bin, the uniform pressure heat preservation bin, the heating bin and the hot air outlet are all made of stainless steel, and the inner wall of each bin body and the inner wall of the array hot air guide hole are coated with heat-resistant coatings.
And an electromagnetic valve is arranged at the joint of the cold air inlet and the cold air conveying pipeline or on the cold air conveying pipeline.
The uniform flow plate is of a pore plate structure, 1-2 layers of uniform flow plates are respectively arranged at the joints of the uniform pressure heat preservation bin, the gas storage bin and the heating bin, and the holes on the 2 layers of uniform flow plates are arranged in a staggered manner.
The armored heating rod is longitudinally arranged along the heating bin in a through length mode.
The two ends of the gas storage bin, the even pressure heat preservation bin and the heating bin are respectively provided with a detachable end cover, and the cold air inlet is arranged on one side or two side end covers of the gas storage bin; the armored heating rod is fixed in the heating bin through the end cover.
The gas storage bin, the even pressure heat preservation bin, the heating bin and the hot air outlet are detachably connected through bolts.
The application method of the electronic component array type hot air welding device comprises the following steps:
1) Installing an electronic component array type hot air welding device at a welding station of an electronic component automatic welding production line, wherein the electronic component array type hot air welding device is positioned above a conveyor belt for conveying electronic components; after the installation, a cold air inlet on the air storage bin is connected with an external cold air conveying pipeline, and an electromagnetic valve is arranged at the connecting position or on the cold air conveying pipeline; the control ends of the electromagnetic valve and the armored heating rod are respectively connected with an automatic control system of an automatic welding production line of the electronic components;
2) Selecting a hot air outlet with matched array hot air guide holes according to the array arrangement mode of the welded electronic component body and pins, and installing the hot air outlet at the bottom of a heating bin;
3) After the automatic welding production line of the electronic components is started, the automatic control system controls the electromagnetic valve and the armored heating rod to be started timely; the cold air subjected to pressure limitation is sent into a gas storage bin through an electromagnetic valve; cold air entering the air storage bin enters the uniform pressure heat preservation bin after being subjected to primary uniform flow through the upper uniform flow plate, and enters the heating bin after being subjected to secondary uniform flow through the lower uniform flow plate;
4) The electronic components are conveyed to the lower part of the hot air outlet through the conveyor belt and accurately positioned and stopped; the cold air after fully uniform flow is heated in the heating bin and then uniformly blown downwards through each array type hot air guide hole on the hot air outlet, and the connection points of all pins on the electronic component are welded; after the welding is finished, the electromagnetic valve is closed; the electronic components are conveyed to the next station by a conveyor belt;
5) Repeating the steps 3) -4), and completing continuous welding of the similar electronic components; when the type of the welded electronic component is changed, the matched hot air outlet needs to be reselected and installed.
Compared with the prior art, the invention has the beneficial effects that:
1) The cold air is directly blown to the welding points of the electronic components from the array type guide holes after being subjected to sectional decompression, uniform flow and heating, so that the damage to other equipment is greatly reduced, the longitudinal welding temperature is consistent, and the welding quality can be ensured;
2) The device has simple structure and low manufacturing and using cost;
3) The automatic welding device is arranged on an automatic welding production line of electronic components, is simple to control, has high automation degree and saves energy.
Drawings
Fig. 1 is a schematic structural diagram of an array type hot air welding device for electronic components according to the present invention.
Fig. 2 is a view in the direction a in fig. 1.
In the figure: 1. the air storage bin 2, the uniform pressure heat preservation bin 3, the heating bin 4, the hot air outlet 41, the array type hot air guide hole 5, the end cover 6, the cold air inlet 7 and the armored heating rod
Detailed Description
The following is a further description of embodiments of the invention, taken in conjunction with the accompanying drawings:
as shown in fig. 1, the electronic component array type hot air welding device comprises a gas storage bin 1, a uniform pressure heat preservation bin 2, a heating bin 3 and a hot air outlet 4 which are sequentially connected from top to bottom and are mutually communicated; the gas storage bin 1, the uniform pressure heat preservation bin 2 and the heating bin 3 are all closed bin bodies, wherein a cold air inlet 6 is formed at one end of the gas storage bin 1 and is connected with an external cold air conveying pipeline; the connection parts of the even pressure heat preservation bin 2 and the gas storage bin 1 as well as the heating bin 3 are provided with even flow plates; an armored heating rod 7 is arranged in the heating bin 3; the hot air outlet 4 is provided with an array type hot air guiding hole 41 which penetrates up and down, and the array type hot air guiding hole 41 (shown in fig. 2) is matched with the array type arrangement of the welded electronic component body and pins.
The gas storage bin 1, the even pressure heat preservation bin 2, the heating bin 3 and the hot air outlet 4 are all made of stainless steel, and the inner wall of each bin body and the inner wall of the array type hot air guide hole 41 are coated with heat-resistant coatings.
And an electromagnetic valve is arranged at the joint of the cold air inlet 6 and the cold air conveying pipeline or on the cold air conveying pipeline.
The uniform flow plates are of pore plate structures, 1-2 layers of uniform flow plates are respectively arranged at the joints of the uniform pressure heat preservation bin 2, the gas storage bin 1 and the heating bin 3, and the holes on the 2 layers of uniform flow plates are arranged in a staggered manner.
The armored heating rod 7 is longitudinally and generally arranged along the heating bin 3.
The two ends of the gas storage bin 1, the uniform pressure heat preservation bin 2 and the heating bin 3 are respectively provided with a detachable end cover 5, and a cold air inlet 6 is arranged on one side or two side end covers 5 of the gas storage bin 1; the armored heating rod 7 is fixed in the heating bin 3 through the end cover 5.
The gas storage bin 1, the even pressure heat preservation bin 2, the heating bin 3 and the hot air outlet 4 are detachably connected through bolts.
The application method of the electronic component array type hot air welding device comprises the following steps:
1) Installing an electronic component array type hot air welding device at a welding station of an electronic component automatic welding production line, wherein the electronic component array type hot air welding device is positioned above a conveyor belt for conveying electronic components; after the installation, the cold air inlet 6 on the air storage bin 1 is connected with an external cold air conveying pipeline, and an electromagnetic valve is arranged at the connecting position or on the cold air conveying pipeline; the control ends of the electromagnetic valve and the armored heating rod 7 are respectively connected with an automatic control system of an automatic welding production line of electronic components;
2) Selecting a hot air outlet 4 with matched array hot air guide holes 41 according to the array arrangement form of the welded electronic component body and pins, and installing the hot air outlet 4 at the bottom of the heating bin 3;
3) After the automatic welding production line of the electronic components is started, the automatic control system controls the electromagnetic valve and the armored heating rod 7 to be started timely; the cold air with limited pressure is sent into the air storage bin 1 through the electromagnetic valve; cold air entering the air storage bin 1 enters the uniform pressure heat preservation bin 2 after being subjected to primary uniform flow through the upper uniform flow plate, and enters the heating bin 3 after being subjected to secondary uniform flow through the lower uniform flow plate;
4) The electronic components are conveyed to the lower part of the hot air outlet 4 through a conveyor belt and accurately positioned and stopped; the cold air after fully uniform flow is heated in the heating bin 3 and then uniformly blown downwards through each array type hot air guide hole 41 on the hot air outlet 4, and the connection points of all pins on the electronic component are welded; after the welding is finished, the electromagnetic valve is closed; the electronic components are conveyed to the next station by a conveyor belt;
5) Repeating the steps 3) -4), and completing continuous welding of the similar electronic components; when the type of the electronic component to be welded is changed, the matched hot air outlet 4 needs to be reselected and installed.
In the invention, lead-free solder is adopted as a welding material between the electronic component body and the pins; the cold air inlet 6 can be arranged at one side or two sides of the air storage bin 1 according to the requirement of the air inlet quantity.
In the invention, the gas storage bin 1 is used as a buffering decompression bin and can store quantitative low-pressure gas according to the requirement; the uniform pressure heat preservation bin 2 is used for carrying out uniform flow on the stored gas with certain temperature and pressure, so that the pressure and the temperature distribution of the gas along the longitudinal direction are uniform; the heating bin 3 is used for heating gas in an electric heating mode, and after the gas is uniformly heated to a temperature meeting welding requirements in the flowing process from top to bottom, the gas is vertically led out downwards from the array type hot air guide holes 41 for welding.
According to the requirements, the electronic component array type hot air welding device can be connected in series in multiple stages so as to meet the process requirements of different products.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (6)
1. The application method of the electronic component array type hot air welding device is characterized in that the electronic component array type hot air welding device comprises a gas storage bin, a uniform pressure heat preservation bin, a heating bin and a hot air outlet which are sequentially connected from top to bottom and are communicated with each other; the air storage bin, the uniform pressure heat preservation bin and the heating bin are all closed bin bodies, wherein a cold air inlet is formed in one end of the air storage bin and is connected with an external cold air conveying pipeline; the connection parts of the even pressure heat preservation bin and the gas storage bin as well as the heating bin are provided with even flow plates; the uniform flow plates are of pore plate structures, 1-2 layers of uniform flow plates are respectively arranged at the joints of the uniform pressure heat preservation bin, the gas storage bin and the heating bin, and the openings on the 2 layers of uniform flow plates are staggered; an armored heating rod is arranged in the heating bin; the hot air outlet is provided with an array type hot air guide hole which penetrates up and down, and the array type hot air guide hole is matched with the array arrangement type of the welded electronic component body and pins;
the application method of the electronic component array type hot air welding device is characterized by comprising the following steps of:
1) Installing an electronic component array type hot air welding device at a welding station of an electronic component automatic welding production line, wherein the electronic component array type hot air welding device is positioned above a conveyor belt for conveying electronic components; after the installation, a cold air inlet on the air storage bin is connected with an external cold air conveying pipeline, and an electromagnetic valve is arranged at the connecting position or on the cold air conveying pipeline; the control ends of the electromagnetic valve and the armored heating rod are respectively connected with an automatic control system of an automatic welding production line of the electronic components;
2) Selecting a hot air outlet with matched array hot air guide holes according to the array arrangement mode of the welded electronic component body and pins, and installing the hot air outlet at the bottom of a heating bin;
3) After the automatic welding production line of the electronic components is started, the automatic control system controls the electromagnetic valve and the armored heating rod to be started timely; the cold air subjected to pressure limitation is sent into a gas storage bin through an electromagnetic valve; cold air entering the air storage bin enters the uniform pressure heat preservation bin after being subjected to primary uniform flow through the upper uniform flow plate, and enters the heating bin after being subjected to secondary uniform flow through the lower uniform flow plate;
4) The electronic components are conveyed to the lower part of the hot air outlet through the conveyor belt and accurately positioned and stopped; the cold air after fully uniform flow is heated in the heating bin and then uniformly blown downwards through each array type hot air guide hole on the hot air outlet, and the connection points of all pins on the electronic component are welded; after the welding is finished, the electromagnetic valve is closed; the electronic components are conveyed to the next station by a conveyor belt;
5) Repeating the steps 3) -4), and completing continuous welding of the similar electronic components; when the type of the welded electronic component is changed, the matched hot air outlet needs to be reselected and installed.
2. The method of claim 1, wherein the gas storage bin, the uniform pressure heat preservation bin, the heating bin and the hot air outlet are all made of stainless steel, and the inner wall of each bin body and the inner wall of the array type hot air guiding hole are coated with heat-resistant coatings.
3. The method of claim 1, wherein the cold air inlet is connected to or provided with a solenoid valve.
4. The method of claim 1, wherein the sheathed heating rod is disposed along the longitudinal length of the heating chamber.
5. The method for using an array type hot air welding device for electronic components according to claim 1, wherein two ends of the air storage bin, the uniform pressure heat preservation bin and the heating bin are respectively provided with detachable end covers, and the cold air inlet is arranged on one side or two side end covers of the air storage bin; the armored heating rod is fixed in the heating bin through the end cover.
6. The method of claim 1, wherein the air storage bin, the uniform pressure heat preservation bin, the heating bin and the hot air outlet are all detachably connected through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710504826.5A CN107234314B (en) | 2017-06-28 | 2017-06-28 | Electronic component array type hot air welding device and application method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710504826.5A CN107234314B (en) | 2017-06-28 | 2017-06-28 | Electronic component array type hot air welding device and application method thereof |
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| CN107234314A CN107234314A (en) | 2017-10-10 |
| CN107234314B true CN107234314B (en) | 2023-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710504826.5A Active CN107234314B (en) | 2017-06-28 | 2017-06-28 | Electronic component array type hot air welding device and application method thereof |
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| CN113347812B (en) * | 2021-08-09 | 2021-10-08 | 四川英创力电子科技股份有限公司 | Soft-hard combined board and hot-pressing die and manufacturing method thereof |
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2017
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Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06164128A (en) * | 1992-11-17 | 1994-06-10 | Matsushita Electric Ind Co Ltd | Reflow equipment |
| JP2000216532A (en) * | 1999-01-25 | 2000-08-04 | Sony Corp | Hot blast furnace |
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| JP2003069212A (en) * | 2001-08-30 | 2003-03-07 | Matsushita Electric Ind Co Ltd | Reflow soldering device |
| JP2003086934A (en) * | 2001-09-12 | 2003-03-20 | Fuji Electric Co Ltd | Heated-gas blowing nozzle device for soldering electronic component and soldering method |
| JP2003181681A (en) * | 2001-12-11 | 2003-07-02 | Tamura Seisakusho Co Ltd | Preheater for soldering and soldering device |
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| CN107234314A (en) | 2017-10-10 |
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