CN206196162U - Solder printing device - Google Patents
Solder printing device Download PDFInfo
- Publication number
- CN206196162U CN206196162U CN201621219828.7U CN201621219828U CN206196162U CN 206196162 U CN206196162 U CN 206196162U CN 201621219828 U CN201621219828 U CN 201621219828U CN 206196162 U CN206196162 U CN 206196162U
- Authority
- CN
- China
- Prior art keywords
- printed wiring
- wiring board
- mask member
- solder
- conveyer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a solder printing device prints the printed wiring board surface with pasty solder, has: the workstation, it disposes the printed wiring board, the mask component, workstation actuating mechanism makes the relative position relation change in the direction that changes distance between this printed wiring board surface and the mask component, the scraper, with scrape knife driving mechanism, the mask component is the piece that has a plurality of holes, workstation actuating mechanism can form state and mask component from these two kinds of relative position relations of state that the printed wiring board left of the surface contact of mask component and printed wiring board, scrapes knife driving mechanism and includes: actuating mechanism makes the scraper distance surperficial with the mask component from top to bottom, and horizontal drive mechanism, make the scraper in the square rebound on the surface along the mask member, a plurality of holes of mask member include 2 at least diameters for the circular port below the 0.5mm, interval between 2 holes than the diameter in 2 holes with little, the thickness of mask member than the diameter arbitrary in 2 holes is half the little.
Description
Technical field
The utility model is related to solder print device.
Background technology
Included by the printing process on the solder printing of paste to printed wiring board, by unit in the manufacturing process of circuit board
Installation procedure and melt solder is made element and printed wiring board that part is installed on the printed wiring board for being printed with solder
With reference to operation.In order that melt solder, uses reflow ovens.Now, the printed wiring board for being provided with element is integrally heated, only
There is solder partial melting.
In installation procedure, printed solder is mostly square patch shape or wire shaped.It is (outstanding in this case
It is the situation of square patch shape), multiple solder pasters are closer to more possible then in the combination operation in reflow ovens
Cause short circuit because of the unnecessary flowing of solder.
Utility model content
The utility model is to complete in view of the foregoing, and its problem is that offer can suppress to cause in reflow ovens
Heated solder is mutual short-circuit and makes the close solder print device of the allocation position of multiple solders.
In order to solve at least one of above-mentioned problem, a mode of the present utility model is a kind of solder print device, its
For by the surface of printing cream-like solder to printed wiring board, wherein, the solder print device has：Workbench, the print
Brush wiring plate is configured on the workbench；Mask member；Table-driving mechanism, it is configured in the printed wiring board
When on the workbench, relative position relation is set to change the distance between the surface of the printed wiring board and the mask member
Direction on change；Scraper；And scraper drive mechanism, the mask member is the piece with multiple holes, and the workbench drives
Motivation structure can be formed the state that the mask member contacts with the surface of the printed wiring board and the mask member from
The state that the printed wiring board leaves both relative position relations, the scraper drive mechanism includes：Upper lower drive mechanism,
It makes the change of the distance between the scraper and described mask member surface；And horizontal drive mechanism, it makes the scraper exist
Moved up along the side on the surface of the mask member, the multiple hole of the mask member includes at least 2 diameters
It is the circular hole of below 0.5mm, the interval between this 2 holes is smaller than the diameter sum in 2 holes, the mask member
Thickness is smaller than the half of the diameter of any one in 2 holes, and the mask member includes main body portion and keeps this to cover
The square frame of mould main part, the main body portion is piece of the thickness less than 200 μm.
An implementation method according to illustration of the present utility model, can suppress to cause in reflow ovens heating solder that
This is short-circuit and is close to the allocation position of multiple solders.
Brief description of the drawings
Fig. 1 is the schematic diagram of the circuitboard manufacturing devices of implementation method.
Fig. 2 is the schematic diagram of the dispensing accumulator of implementation method.
Fig. 3 is the figure of of the structure from front observation for showing solder print device.
Fig. 4 is the figure of of the structure from side observation for showing solder print device.
Fig. 5 is other figure of the structure from side observation for showing solder print device.
Fig. 6 is the schematic diagram of the mask member of implementation method.
Fig. 7 is the figure of of the welding for showing implementation method.
Fig. 8 is the figure along the V directions of arrow in Fig. 1.
Fig. 9 is the figure along the VI directions of arrow in Fig. 8.
Label declaration
1：Circuitboard manufacturing devices；2：Delivery device；3：Printing equipment；4：Component mounter；5：Reflow ovens；6：Centre storage
Glassware；10：Printed wiring board；11：Element；12：Circuit board；20：Deliver accumulator；30h：Hole；5s：Inner space；50：Atmosphere
Control device；51：Heater；52：Conveyer in reflow ovens；91：First conveyer；92：Second conveyer；93：
3rd conveyer；94：4th conveyer；101A：First retainer；101B：Second retainer；110A：First air blower；
110B：Second air blower；110C：3rd air blower；301：Workbench；302：Mask member；303：Table-driving mechanism；
304：Scraper；305：Scraper drive mechanism；306：Upper lower drive mechanism；307：Horizontal drive mechanism；310：Main body portion；
311：Frame；321：First main body portion；322：Second main body portion；L：Production line.
Specific embodiment
Hereinafter, implementation method of the present utility model is illustrated with reference to the accompanying drawings.In the following embodiments, as electricity
One of road board manufacturing apparatus, is listed below circuitboard manufacturing devices and illustrates：To dispensing in the production line of manufacture circuit board
Printed wiring board, implements multiple manufacturing procedures to manufacture circuit board successively.In the accompanying drawing that the following description is used, in order into
To be capable of identify that the size of each component, the engineer's scale to each component has carried out appropriate change.
In the following description, XYZ vertical coordinate systems are set, the position to each component is come with reference to the XYZ vertical coordinate systems
The relation of putting is illustrated.If the prescribed direction in horizontal plane is X-direction, if direction vertical with X-direction in the horizontal plane is Y side
To if the direction (i.e. vertical direction) being respectively perpendicular with X-direction and Y-direction is Z-direction.
＜ devices entirety ＞
As shown in figure 1, circuitboard manufacturing devices 1 have：Delivery device 2；Solder print device 3；Component mounter 4；Return
Stream stove 5；Intermediate hopper 6；Appearance inspection device 7；Product accumulator 8 and conveyer 9.
The grade of printed wiring board 10 (including circuit board 12) is transported along the production line L for extending in the X direction.Hereinafter, exist
In production line L etc., using the side of delivery device 2 as " upstream side (-X direction side) ", using the side of product accumulator 8 as
" downstream (+X direction side) ".
＜ conveyers ＞
Conveyer 9 has multiple (being for example in the present embodiment 5) (first conveyers of conveyer 91~95
91st, the second conveyer 92, the 3rd conveyer 93, the 4th conveyer 94 and the 5th conveyer 95).In this embodiment party
In formula, from upstream side, downstream side is arranged with order：Delivery device 2, the first conveyer 91, solder print device 3, second
Conveyer 92, component mounter 4, the 3rd conveyer 93, reflow ovens 5, the 4th conveyer 94, intermediate hopper the 6, the 5th
Conveyer 95, appearance inspection device 7 and product accumulator 8.
Specifically, the first conveyer 91 is configured between delivery device 2 and solder print device 3.Second transports dress
92 are put to be configured between solder print device 3 and component mounter 4.3rd conveyer 93 is configured at component mounter 4 and returns
Between stream stove 5.4th conveyer 94 extends from reflow ovens 5 towards the side opposite with component mounter 4.4th conveyer
94 are configured between reflow ovens 5 and intermediate hopper 6.5th conveyer 95 is configured at intermediate hopper 6 and product accumulator 8
Between.For example, conveyer 91~95 is ribbon conveyer.Conveyer 91~95 can separately drive.
<Delivery device>
Delivery device 2 is configured at the most upstream side (that is, upstream end) of production line L.Delivery device 2 throws printed wiring board 10
It is put into production line L.The rectangular tabular of printed wiring board 10.Delivery device 2 has delivers fortune in accumulator 20 and delivery device
Send device 23.
As shown in Fig. 2 delivering accumulator 20 can receive multiple printed wiring boards 10.There is lifting to fill to deliver accumulator 20
Put 22 and multiple grooves 21.
Groove 21 has the supporting member 21a for extending in X direction.Supporting member 21a can support the Y side of printed wiring board 10
To two ends.The size of the inner space 21s of groove 21 is that can at least receive 1 size of printed wiring board 10.
Lowering or hoisting gear 22 can be such that multiple grooves 21 are lifted as a rigid body.Lowering or hoisting gear 22 can be to the height of groove 21
(position of Z-direction) carries out step-less adjustment.Lowering or hoisting gear 22 has ball-screw 22a and drive device 22b.Ball-screw
The length of 22a is in Z-direction.Drive device 22b has motor.The rotary motion of motor is converted to edge by ball-screw 22a
The linear motion of Z-direction.
As shown in figure 1, conveyer 23 is configured in the inner space 2s of delivery device 2 in delivery device.Delivery device
Interior conveyer 23 can transport printed wiring board 10.For example, conveyer 23 is ribbon conveyer in delivery device.Deliver dress
Putting interior conveyer 23 has the transport face 23a (upper tables that extend and can load printed wiring board 10 in the horizontal direction
Face).
As shown in Fig. 2 when printed wiring board 10 is transported, lowering or hoisting gear 22 make the height of the supporting member 21a of groove 21 with
The height alignment of the transport face 23a (reference picture 1) of conveyer 23 in delivery device.Specifically, the branch of supporting member 21a is made
Bearing surface (upper surface) is alignd with the height of the transport face 23a of conveyer in delivery device 23.In the present embodiment, structure is supported
Part 21a extends in X direction, also, transport face 23a extends in the horizontal direction, thereby, it is possible to will be accommodated in the printed wiring of groove 21
Plate 10 is successfully delivered to transport face 23a.
＜ solder print devices ＞
As shown in figure 1, solder print device 3 is configured at the downstream of delivery device 2 across the first conveyer 91.
Solder print device 3 is extremely delivered solder printing on the surface of the printed wiring board 10 arrived in production line L.The weldering
Material is the solder (cream solder) of paste.Solder print device 3 has workbench 301, mask member 302, workbench driving machine
Structure 303, scraper 304, scraper drive mechanism 305 and conveyer 33 in printing equipment.Here, 3~Fig. 5 of reference picture is to solder
Printing equipment 3 is illustrated.
Fig. 3 is the figure of of the structure from front observation for showing solder print device 3.The front is solder printing dress
Put the face of the +Z direction side in 3 faces having.Additionally, Fig. 4 is the structure from side observation for showing solder print device 3
The figure of one.The side is the face of the -X direction side in the face that solder print device 3 has.Solder printing dress shown in Fig. 4
The state for putting 3 is state printed wiring board 10 being moved to from the first conveyer 91 in solder print device 3.Additionally,
Fig. 5 is other figure of the structure from side observation for showing solder print device 3.The side is the institute of solder print device 3
The face of the -X direction side in the face having.The state of the solder print device 3 shown in Fig. 5 is that solder print device 3 prints solder
Brush the state on printed wiring board 10.
Workbench 301 is the printed wiring board 10 that configuration is moved in solder print device 3 from the first conveyer 91
Platform.
Square frame 311 of the mask member 302 comprising main body portion 310 and holding main body portion 310.Mask master
Body portion 310 is the piece with multiple hole 30h.That is, mask member 302 is the piece with multiple hole 30h.Multiple hole 30h are embodied
Printed patterns during by solder printing to printed wiring board 10.
Main body portion 310 is placed on frame 311.Main body portion 310 can by move frame 311 and with frame 311
Move together.Main body portion 310 is rectangle tabular.Fig. 6 represents main body portion 310.Main body portion 310 has multiple
(being for example in the present embodiment 2) main body portion 321, main body portion 322 (the first main body portion 321 and
Two main body portions 322).First main body portion 321 and the second main body portion 322 are adjacent each other.First main body
Main body portion 322 of portion 321 and second has with the center 30c in main body portion 310 that rotationally symmetrical (2 is again right as symmetry axis
Claim) shape.Thus, simultaneously can be formed in printing object 2 printed patterns by solder print device 3.That is, solder printing
Device 3 can simultaneously on 2 printed wiring boards 10 printing solder.In addition, in figure 6, the first main body portion is surrounded respectively
321 and second the rectangle in main body portion represent the position represented between main body portion 310 and printed wiring board 10
Relation and the outer rim of printed wiring board 10 suitably drawn.Be not in such rectangle in actual main body portion 310.
Table-driving mechanism 303 makes relative position relation exist when printed wiring board 10 is configured on workbench 301
Change and change on the surface of printed wiring board 10 and the direction of the distance between mask member 302.Specifically, workbench drives
Mechanism 303 changes the position relationship by making frame 311 move in this direction.Additionally, table-driving mechanism 303 exists
Printed wiring board 10 is configured in when on workbench 301, and printing cloth is made by making workbench 301 move in the horizontal direction
Relative position relation change of the line plate 10 with mask member 302 in the horizontal direction.Thus, table-driving mechanism 303 can
Make the relative position relation of printed wiring board 10 and mask member 302 consistent with the position relationship of regulation.
Additionally, table-driving mechanism 303 can form the shape that mask member 302 is contacted with the surface of printed wiring board 10
State and mask member 302 are left from printed wiring board 10 state both relative position relations.In addition, by workbench
Drive mechanism 303 drive workbench 301 move and in the case of mask member 302 is contacted with the surface of printed wiring board 10,
The surface in main body portion 310 contacts with the surface of the printed wiring board 10.
Scraper 304 is configured at upper direction (+Y direction) side of mask member 302.
Scraper drive mechanism 305 includes：Upper lower drive mechanism 306, its make scraper 304 and mask member 302 surface it
Between distance change；And horizontal drive mechanism 307, it makes scraper 304 be moved on the direction on the surface along mask member 302
It is dynamic.
In the present embodiment, printing of the solder print device 3 on the surface of printed wiring board 10 is silk-screen printing (sieve
Wire mark brush).For example, in solder print device 3, workbench 301 is moved by table-driving mechanism 303, make mask structure
Part 30 covers the printed wiring board 10 being configured on workbench 301.Then, be placed in for the solder of paste by solder print device 3
Mask member 30, makes scraper 304 be moved in the state of the surface with mask member 30 contacts.Thus, the solder of paste passes through
Hole 30h that mask member 30 has and be attached to printed wiring board 10.As described above, solder print device 3 is by solder printing
Onto the surface of printed wiring board 10.
Conveyer 33 is configured at the inner space 3s of solder print device 3 in printing equipment.Dress is transported in printing equipment
Putting 33 can transport the printed wiring board 10 being moved in the inner space 3s of solder print device 3.Dress is transported in printing equipment
Put the 33 downstream side transports of printed wiring board 10 that will be printed with solder.For example, conveyer 33 is defeated belt in printing equipment
Send machine.
＜ mask members ＞
Hereinafter, mask member 302 is carried out more mutually being described in detail than the above.Main body portion 310 is small thickness
In 200 μm of piece.Hereinafter, it is that the situation of piece of the thickness less than 100 μm is illustrated to main body portion 310 as one.Such as
Shown in Fig. 6, multiple hole 30h are formed with main body portion 310.What main body portion 310 was made of metal.For example, mask
Main part 310 is that stainless steel is made.It is in the case that stainless steel is made, in main body portion 310 in main body portion 310
Do not allow to be also easy to produce the saprophage caused by the contact with solder.Even if solder print device 3 is reducing the solder to be printed
In the case of shape, it is also possible to which suppression causes the shape distortion by the saprophage.
Multiple hole 30h that main body portion 310 has are configured at and the element 11 installed on printed wiring board 10
The suitable position of portion of terminal.For example, element 11 is the electronic components such as capacitor.When top view is observed, multiple hole 30h are respective
Shape rectangular shaped, triangle, pentagon shaped, round-shaped etc. are variously-shaped.But, multiple hole 30h include at least 2
The circular hole of individual a diameter of below 0.5mm.2 holes are respective is shaped as circle for this, thus, in solder print device 3, energy
Enough suppress when making mask member 302 leave printing object after by solder printing to printing object, printed solder quilt
Mask member 302 is slided and rubs and peeled off from printing object.Additionally, the interval between 2 holes is smaller than the diameter sum in 2 holes.
For example, the hole h1 and hole h2 shown in Fig. 6 are this 2 the one of hole.Here, the region RA2 shown in Fig. 6 is by mask member 302
Surface region in a part region be region RA1 amplify obtained by region.As shown in fig. 6, hole h1 and hole h2 is each
A diameter of 0.4mm.On the other hand, between hole h1 and hole h2 at intervals of 0.4mm.That is, the interval ratio between hole h1 and hole h2
The diameter of hole h1 is small with the diameter sum of hole h2.Additionally, any one straight of the thickness in main body portion 310 than 2 holes
The half in footpath is small.In addition, the thickness in main body portion 310 shows as the thickness of mask member 302 in the present embodiment.
＜ component mounters ＞
Component mounter 4 is configured at the downstream of solder print device 3 across the second conveyer 92.
Be attached to for element 11 to be printed with the printed wiring board 10 of solder by component mounter 4.Component mounter 4 has unit
Part feedway 40, mouth 41, mobile device 42 and conveyer 43 in fitting machine.Component supplying apparatus 40 supply element 11
To the region of extremely regulation.Mouth 41 being capable of absorptive element 11.Mobile device 42 can make mouth 41 (XY directions) in the horizontal direction
And above-below direction (Z-direction) is mobile.For example, mobile device 42 adsorbs the unit supplied from component supplying apparatus 40 by mouth 41
Part 11, the element 11 that will be adsorbed is attached to the target location of printed wiring board 10.
Conveyer 43 is configured in the inner space 4s of component mounter 4 in fitting machine.Conveyer 43 in fitting machine
The printed wiring board 10 being moved in the inner space 4s of component mounter 4 can be transported.Conveyer 43 will pacify in fitting machine
Printed wiring board 10 equipped with element 11 downstream transport by side.For example, conveyer 43 is ribbon conveyer in fitting machine.
＜ reflow ovens ＞
Reflow ovens 5 are configured at the downstream of component mounter 4 across the 3rd conveyer 93.
The printed wiring board 10 that reflow ovens 5 pairs are provided with element 11 is heated, and element 11 is welded with printed wiring board 10
It is connected together and forms circuit board 12.Reflow ovens 5 have transports dress in atmosphere control device 50, heater 51 and reflow ovens
Put 52.(hereinafter referred to as " oxygen is dense in reflow ovens by the oxygen concentration in the inner space 5s of reflow ovens 5 for atmosphere control device 50
Degree ".) remain than reflow ovens 5 exterior space (air) in oxygen concentration it is low.For example, oxygen concentration exists in reflow ovens
More than 100ppm and below 2000ppm.Oxygen concentration is in more than 100ppm and below 800ppm more preferably in reflow ovens.
Heater 51 by the temperature of the inner space 5s of reflow ovens 5 (hereinafter referred to as " backflow in-furnace temperature ".) remain
The temperature of regulation.Heater 51 makes the inner space 5s of reflow ovens 5 turn into optimal Temperature Distribution.Backflow in-furnace temperature according to
Solder and it is different.For example, using in the case of lead-free solder, heater 51 is by the entrance (upstream side) of reflow ovens 5
150 degree or so are remained, near exit (downstream) is remained 110 degree or so, by the position as maximum temperature of midway
Remain 250 degree or so.
The printed wiring board 10 that heater 51 pairs completes after solder printing and element installation carries out overall heating.Plus
Thermal 51 only makes solder partial melting.Thus, heater 51 is by the wiring of the portion of terminal of element 11 and printed wiring board 10
Part is combined by welding (reference picture 7), forms circuit board 12.
Conveyer 52 is configured in the inner space 5s of reflow ovens 5 in reflow ovens.Conveyer 52 can in reflow ovens
Transport is moved to the printed wiring board 10 in the inner space 5s of reflow ovens 5.Conveyer 52 is by with can fill in reflow ovens
The component of the hot heat resistance of tolerance heater 51 is divided to be formed.For example, the band that conveyer 52 is made of metal in reflow ovens
Formula conveyer.
＜ intermediate hoppers ＞
Intermediate hopper 6 is configured at the downstream of reflow ovens 5 across the 4th conveyer 94.That is, intermediate hopper 6 is relative
The side opposite with reflow ovens 5 is configured in the 4th conveyer 94.
Intermediate hopper 6 can receive multiple circuit boards 12.Because intermediate hopper 6 is same with above-mentioned dispensing accumulator 20
The structure of sample, therefore, omit detail explanation.
＜ appearance inspection devices ＞
Appearance inspection device 7 is configured at the downstream of intermediate hopper 6 across the 5th conveyer 95.
Appearance inspection device 7 checks the outward appearance of circuit board 12.Appearance inspection device 7 has camera head 70, computer 71
And conveyer 72 in appearance inspection device.Camera head 70 shoots circuit board 12.For example, camera head 70 is camera.
Camera head 70 is connected with computer 71.Computer 71 has memory 71a and processor 71b.
For example, the shooting result of camera head 70 is (hereinafter referred to as " shooting image ".) it is exported to computer 71.Computer
71 pairs of benchmark images being stored in memory 71a are contrasted with shooting image, by circuit board 12 be judged to " certified products " or
Person's " defective work ".Specifically, difference feelings the threshold value of regulation below of the computer 71 in benchmark image and shooting image
Under condition, it is judged to " certified products ".Computer 71 in the case where the difference of benchmark image and shooting image exceedes the threshold value of regulation,
It is judged to " defective work ".For example, computer 71 is when that the welding portion in circuit board 12 is present is bad or on the circuit board 12
In the case of being attached with foreign matter, it is judged to " defective work ".Thereby, it is possible to avoid the outflow of defective work.
In addition, the visual examination of circuit board 12 in reflow ovens 5 sometimes for than welding the time long.In the situation
Under, it is possible to create between reflow ovens 5 and appearance inspection device 7 the need for the travelling speed of adjustment circuit plate 12.But, according to
Present embodiment, due to configuring intermediate hopper 6 between reflow ovens 5 and appearance inspection device 7, therefore, even if in circuit board
In the case of 12 visual examination needs for a long time, it is also possible to which the circuit board 12 that will be transported from reflow ovens 5 is accommodated in centre successively
In accumulator 6.Therefore, though circuit board 12 visual examination need it is prolonged in the case of, it is not required that reflow ovens 5 with
The travelling speed of adjustment circuit plate 12 between appearance inspection device 7, is preferred.
Conveyer 72 is configured in the inner space 7s of appearance inspection device 7 in appearance inspection device.Visual examination is filled
Putting interior conveyer 72 can transport the circuit board 12 being moved in the inner space 7s of appearance inspection device 7.Visual examination is filled
Put interior conveyer 72 and will be judged to that the circuit board 12 of " certified products " transports downstream side.For example, being transported in appearance inspection device
Device 72 is ribbon conveyer.
＜ product accumulators ＞
Product accumulator 8 is configured at the downstream of appearance inspection device 7.Product accumulator 8 can receive multiple circuit boards 12.
Because product accumulator 8 is the structure same with above-mentioned dispensing accumulator 20, therefore, omit detail explanation.
The circuit board 12 of " certified products " is judged as in being only accommodated in appearance inspection device 7 in product accumulator 8.Storage
Circuit board 12 in product accumulator 8 outside production line L (offline) is made whether that (function is examined for the inspection that normally acts
Look into).
＜ cooling bodies ＞
Circuitboard manufacturing devices 1 also have cooling body 100.100 pairs of circuit boards 12 transported from reflow ovens 5 of cooling body
Cooled down.Cooling body 100 has：Multiple (being for example in the present embodiment 2) retainer 101A and retainer 101B
(the first retainer 101A and the second retainer 101B)；And multiple (being for example in the present embodiment 3) air blower 110A,
Air blower 110B, air blower 110C (the first air blower 110A, the second air blower 110B and the 3rd air blower 110C).
＜ retainers ＞
As shown in figure 8, the first retainer 101A, the second retainer 101B are configured along the 4th conveyer 94.First stops
Dynamic device 101A is configured to be close to reflow ovens 5 relative to the second retainer 101B.Second retainer 101B is relative to the first retainer
101A is configured in the side opposite with reflow ovens 5.That is, the second retainer 101B is configured to than the first retainer 101A downstream
Side.
First retainer 101A, the second retainer 101B can stop the circuit board 12 transported from reflow ovens 5.In this reality
Apply in mode, circuit board 12 is singly transported from reflow ovens 5 successively.Therefore, in the first retainer 101A, the second stop
At device 101B, circuit board 12 singly stops.First retainer 101A, the second retainer 101B can be relative to the 4th fortune
The transport path of the circuit board 12 in device 94 is sent to retreat.First retainer 101A, the second retainer 101B have arm 102,
E axle supporting portion 103 and drive device 104.
As shown in figure 9, arm 102 is in L-shaped.E axle supporting portion 103 supports the cardinal extremity of arm 102.E axle supporting portion 103 has
Rotation axis 103a along the X direction.Drive device 104 has can be such that arm 102 is rotated centered on rotation axis 103a
Motor.
In the transport of circuit board 12, drive device 104 make arm 102 centered on rotation axis 103a clockwise (to
The direction of arrow V1) rotation.Thus, the first retainer 101A, the second retainer 101B are from the circuit in the 4th conveyer 94
The transport path of plate 12 is kept out of the way.Therefore, the circuit board 12 for being transported from reflow ovens 5 is transported (reference picture towards intermediate hopper 6
8)。
When circuit board 12 stops, drive device 104 make arm 102 centered on rotation axis 103a counterclockwise (to
The direction of the rightabout arrow V2 of arrow V1) rotation.Thus, the first retainer 101A, the second retainer 101B enter the 4th
The transport path of the circuit board 12 in conveyer 94.Therefore, the circuit board 12 for transporting from reflow ovens 5 is by the first retainer
101A, the second retainer 101B stop (reference picture 8).
In the stopping of circuit board 12, the end of arm 102 approaches with the part of the +Y direction side of the 4th conveyer 94.
Width (length of Y-direction) of the length (from cardinal extremity to the length of the Y-direction of end) of arm 102 than the 4th conveyer 94
It is short.Thus, compared with situation of the length of arm 102 more than the width of the 4th conveyer 94 is made, arm 102 can be made
Successfully rotation (that is, improves the mobility of arm 102).Therefore, it is possible to make the first retainer 101A, the second retainer 101B phases
Transport path for the circuit board 12 in the 4th conveyer 94 is successfully retreated.
＜ air blowers ＞
As shown in figure 8, the first air blower 110A, the second air blower 110B are configured along the 4th conveyer 94.First drum
Blower fan 110A is adjacent with the first retainer 101A.Second air blower 110B is adjacent with the second retainer 101B.First air blower
110A, the second air blower 110B blow towards the circuit board 12 transported from reflow ovens 5.
First air blower 110A, the second air blower 110B, the 3rd air blower 110C have the fan around the rotation of axis 111
112.Fan 112 is blown on along the direction of axis 111.For example, fan 112 is the aerofoil fans such as propeller type fan.
In the side view of Fig. 8, the first air blower 110A, the conveyer of axis 111 and the 4th of the second air blower 110B
94 transport face 94a intersects.Specifically, the transport of the axis 111 relative to the 4th conveyer 94 of the first air blower 110A
Face 94a is inclined.In the side view of Fig. 8, the axis 111 of the first air blower 110A is more leaning on +X direction side then more deflection-Z sides
To mode incline.On the other hand, the transport face 94a essence of the conveyer 94 of axis 111 and the 4th of the second air blower 110B
It is upper vertical.
In cooling circuit board 12, in addition to stopping the driving of the 4th conveyer 94, also carry out based on the first stop
The stopping of device 101A, the second retainer 101B.In cooling circuit board 12, the first air blower 110A is towards by the first retainer
The circuit board 12 that 101A stops is blown.On the other hand, the second air blower 110B is towards by the circuit of the second retainer 101B stoppings
Plate 12 is blown.
3rd air blower 110C is configured at around intermediate hopper 6.In fig. 8, for convenience, only illustrate and be configured at
3rd air blower 110C of the top of intermediate hopper 6.3rd air blower 110C directions are accommodated in the groove of intermediate hopper 6
Circuit board 12 is blown.For example, from from the viewpoint of efficiently cooling circuit board 12, the axis of the 3rd air blower 110C can direction
The entrance of groove is inclined.
As described above, the solder print device 3 that the circuitboard manufacturing devices 1 of above-mentioned implementation method have is used
In by printing cream-like solder to the surface of printed wiring board 10, it has：Workbench 301, printed wiring board 10 is configured to
On the workbench 301；Mask member 302；Table-driving mechanism 303, it is configured in workbench 301 in printed wiring board 10
When upper, make relative position relation change the printed wiring board 10 surface and mask member 302 between distance direction on
Change；Scraper 304；And scraper drive mechanism 305, mask member 302 is the piece with multiple hole 30h, workbench driving machine
Structure 303 can form the state that mask member 302 contacts with the surface of printed wiring board 10 and mask member 302 from printing cloth
The state that line plate 10 leaves both relative position relations, scraper drive mechanism 305 includes：Upper lower drive mechanism 306, it makes to scrape
The change of the distance between knife 304 and the surface of mask member 302；And horizontal drive mechanism 307, it makes scraper 304 along covering
The side on the surface of die component 302 moves up, and multiple hole 30h of mask member 302 include at least 2 a diameter of below 0.5mm
Circular hole, the interval between 2 holes is smaller than the diameter sum in 2 holes, and the thickness of mask member 302 is than 2 holes
The diameter of any one half it is small.
Thus, in circuitboard manufacturing devices 1, after solder print device 3 can suppress to cause heating in reflow ovens 5
Solder is electrically short-circuited to each other and is close to the allocation position of multiple solders.That is, solder print device 3 is for example reducing matching somebody with somebody for solder
In the case of putting interval, circle is shaped as by make each solder, it can be ensured that the solder of the amount required for welding and press down
The solder after causing heating in reflow ovens 5 is made to be electrically short-circuited to each other.Its result is that solder print device 3 can suppress in circuit board
Produced in 12 and caused unfavorable condition is electrically short-circuited to each other by solder.
Additionally, in solder print device 3, mask member 302 includes main body portion 310 and keeps main body portion
310 square frame 311, main body portion 310 is piece of the thickness less than 200 μm.It is as thin as being less than by making main body portion 310
200 μm, solder print device 3 can suppress on solder printing more than necessary amount to printing object.That is, solder print device
3 can suppress to cause in reflow ovens 5 solder after heating to be electrically short-circuited to each other and can use with smaller printed patterns
Mask member 302 is by solder printing to printing object.
Additionally, in solder print device 3, main body portion 310 is that stainless steel is made.Thus, filled in solder printing
Put in 3, main body portion 310 is not easy to cause because of saprophage caused by the contact with cream solder.Its result is, even if subtracting
In the case of the shape of the small solder to printing object printing, solder print device 3 can also suppress to be caused by the saprophage
The shape distortion.Its result is, solder print device 3 can further suppress to cause in reflow ovens 5 solder after heating that
This short circuit.
More than, the implementation method to the utility model has carried out detailed narration referring to the drawings, but specific structure is not limited to
The implementation method, without departing from the purport of the utility model, can be changed, replaced, be deleted.
Claims (2)
1. a kind of solder print device, it is used for the surface of printing cream-like solder to printed wiring board, it is characterised in that should
Solder print device has：
Workbench, the printed wiring board is configured on the workbench；
Mask member；
Table-driving mechanism, it makes relative position relation exist when the printed wiring board is configured on the workbench
Change and change on the surface of the printed wiring board and the direction of the distance between the mask member；
Scraper；And
Scraper drive mechanism,
The mask member is the piece with multiple holes,
The table-driving mechanism can be formed state that the mask member contacts with the surface of the printed wiring board with
And state both relative position relations that the mask member is left from the printed wiring board,
The scraper drive mechanism includes：Upper lower drive mechanism, it makes between the surface of the scraper and the mask member
Distance change；And horizontal drive mechanism, it makes the scraper be moved up in the side on the surface along the mask member,
Include at least 2 circular holes of a diameter of below 0.5mm in the multiple hole of the mask member,
Interval between this 2 holes is smaller than the diameter sum in 2 holes,
The thickness of the mask member is smaller than the half of the diameter of any one in 2 holes,
The mask member includes the square frame in main body portion and the holding main body portion,
The main body portion is piece of the thickness less than 200 μm.
2. solder print device according to claim 1, it is characterised in that
The main body portion is that stainless steel is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621219828.7U CN206196162U (en) | 2016-11-11 | 2016-11-11 | Solder printing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621219828.7U CN206196162U (en) | 2016-11-11 | 2016-11-11 | Solder printing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206196162U true CN206196162U (en) | 2017-05-24 |
Family
ID=58735368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621219828.7U Expired - Fee Related CN206196162U (en) | 2016-11-11 | 2016-11-11 | Solder printing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206196162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11589488B1 (en) * | 2021-07-28 | 2023-02-21 | Ableprint Iechnology Co., Ltd. | Warpage suppressing reflow oven |
-
2016
- 2016-11-11 CN CN201621219828.7U patent/CN206196162U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11589488B1 (en) * | 2021-07-28 | 2023-02-21 | Ableprint Iechnology Co., Ltd. | Warpage suppressing reflow oven |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101621019B (en) | Apparatus for checking and repairing solder ball | |
| CN206196162U (en) | Solder printing device | |
| CN206196164U (en) | Solder printing device | |
| CN101112144A (en) | Electronic component mounting system and electronic component mounting method | |
| JP2011161724A (en) | Mesh guard and screen printing machine | |
| CN206196161U (en) | Solder printing device | |
| WO2021240979A1 (en) | Mounting board manufacturing device and mounting board manufacturing method | |
| WO2021220649A1 (en) | Solder pre-coat forming apparatus and mounting substrate manufacturing apparatus | |
| CN206181578U (en) | Circuit board manufacturing installation | |
| CN206136476U (en) | Assembly in middle of circuit board | |
| CN206260152U (en) | Solder print device | |
| CN206728391U (en) | Assembly among circuit board | |
| CN206136477U (en) | Circuit board manufacturing installation | |
| US20130220773A1 (en) | Process machine, in particular for treating and/or inspecting substrates | |
| CN106561071A (en) | Circuit board intermediate assembly body and circuit board manufacturing method | |
| CN206226846U (en) | Circuitboard manufacturing devices | |
| CN206149612U (en) | Circuit board manufacturing installation | |
| CN206196149U (en) | Identification code mark device | |
| US11116121B2 (en) | Mounting target working device | |
| CN206181580U (en) | Identification code mark device | |
| CN108076595A (en) | Assembly and method of manufacturing circuit board among circuit board | |
| CN206181579U (en) | Circuit board manufacturing installation | |
| CN206149602U (en) | Circuit board manufacturing installation | |
| JP5008579B2 (en) | Electronic component mounting method, apparatus and line | |
| JP4440186B2 (en) | Soldering device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170524 Termination date: 20211111 |