CN106561071A - Circuit board intermediate assembly body and circuit board manufacturing method - Google Patents
Circuit board intermediate assembly body and circuit board manufacturing method Download PDFInfo
- Publication number
- CN106561071A CN106561071A CN201611040291.2A CN201611040291A CN106561071A CN 106561071 A CN106561071 A CN 106561071A CN 201611040291 A CN201611040291 A CN 201611040291A CN 106561071 A CN106561071 A CN 106561071A
- Authority
- CN
- China
- Prior art keywords
- printed wiring
- circuit board
- wiring board
- vehicle
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims description 78
- 239000006071 cream Substances 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 230000000717 retained effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 7
- 230000004907 flux Effects 0.000 abstract 4
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005276 aerator Methods 0.000 description 29
- 230000032258 transport Effects 0.000 description 26
- 238000007639 printing Methods 0.000 description 21
- 238000007689 inspection Methods 0.000 description 18
- 238000001816 cooling Methods 0.000 description 7
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Abstract
The invention provides a circuit board intermediate assembly body and a circuit board manufacturing method, wherein the circuit board intermediate assembly body is provided with a printed wiring board which is provided with a wiring pattern; paste welding flux which is disposed in a specified region on the surface of the printed wiring board in a coating manner; a plurality of elements which are configured on the surface of the printed wiring board through the paste welding flux; and a cover which covers at least one part of a region, which is not coated with the paste welding flux, on the printed wiring board. The wiring pattern at least comprises a plurality of end parts which are arranged along a part of the edge of the printed wiring board in a parallel manner. The content of lead in the metal part of the paste welding flux is less than 0.1% by weight. The surfaces of a plurality of end parts expose metal, and the cover covers the end parts.
Description
Technical field
The invention is related to assembly and method of manufacturing circuit board in the middle of circuit board.
Background technology
Used as the manufacture method of circuit board, being known to makes the melt solder of paste in reflow ovens, come to being configured at printing
The method welded by electronic component on wiring plate.
Sometimes the electrode for making the printed wiring board be connected with other circuits is provided with printed wiring board.Additionally,
In the case of the melt solder of paste is made in reflow ovens, a part for the solder is dispersed to surrounding sometimes.When in reflow ovens
In in the case that the part dispersed is attached to the electrode, may be in the device that the printed wiring board is electrically connected with the circuit
Produce unfavorable condition.
The content of the invention
The present invention is completed in view of the foregoing, and its problem is to provide when melt solder is made in reflow ovens,
Solder attachment assembly and circuit board fabrication in the middle of the circuit board in the region of the regulation on printed wiring board can be suppressed
Method.
In order to solve at least one of above-mentioned problem, a mode of the present invention is assembly in the middle of a kind of circuit board, should
In the middle of circuit board, assembly has：Printed wiring board, which has wiring pattern；Cream solder, which coats the printed wiring
In the region of the regulation on the surface of plate；Multiple element, which is configured at the printed wiring board by means of the cream solder
On surface；And lid, uncoated on its described printed wiring board of covering have at least in the region of the cream solder
Point, the wiring pattern at least includes multiple ends of the part arrangement of the outer rim along the printed wiring board, the cream
Lead containing ratio in the metal part of shape solder is less than 0.1 weight %, has metal to expose, institute on the surface of the plurality of end
State lid and cover the plurality of end.
One embodiment of illustration of the invention, when melt solder is made in reflow ovens, can suppress solder
In the region of the regulation being attached on printed wiring board.
Description of the drawings
Fig. 1 is the schematic diagram of the circuitboard manufacturing devices of embodiment.
Fig. 2 is the schematic diagram of the input accumulator of embodiment.
Fig. 3 is the figure of of the structure from front observation for illustrating solder print device.
Fig. 4 is the figure of of the structure from side observation for illustrating solder print device.
Fig. 5 is other figure of the structure from side observation for illustrating solder print device.
Fig. 6 A are the figures of that illustrates lid 500.
Fig. 6 B are the figures of that represents printed wiring board 10.
Fig. 6 C are the figures of of assembly 13 in the middle of indication circuit plate.
Fig. 7 is the schematic diagram of the mask member of embodiment.
Fig. 8 is the figure of of the welding for illustrating embodiment.
Fig. 9 is the figure along the V directions of arrow in Fig. 1.
Figure 10 is the figure along the VI directions of arrow in Fig. 9.
Label declaration
1：Circuitboard manufacturing devices；2：Delivery device；3：Printing equipment；4：Component mounter；5：Reflow ovens；6：Middle storage
Glassware；10：Printed wiring board；11：Element；12：Circuit board；13：Assembly in the middle of circuit board；20：Throw in accumulator；30h：
Hole；5s：Inner space；50：Atmosphere control device；51：Heater；52：Vehicle in reflow ovens；91：First transports dress
Put；92：Second vehicle；93：3rd vehicle；94：4th vehicle；101A：First retainer；101B：Second
Retainer；110A：First aerator；110B：Second aerator；110C：3rd aerator；301：Workbench；302：Mask structure
Part；303：Table-driving mechanism；304：Scraper；305：Scraper drive mechanism；306：Upper lower drive mechanism；307：Horizontal drive
Mechanism；310：Main body portion；311：Frame；321：First main body portion；322：Second main body portion；500：Lid；501：
Through hole；502：Through hole；503：Through hole；504：Through hole；505：Bar；506：Bar；507：Bar；508：Bar；601：Insertion
Hole；602：Through hole；603：Through hole；604：Through hole；L：Production line.
Specific embodiment
Hereinafter, with reference to the accompanying drawings embodiments of the present invention are illustrated.In the following embodiments, as circuit board
One of manufacture device, is listed below circuitboard manufacturing devices and illustrates：Printing is thrown in in the production line of manufacture circuit board
Wiring plate, implements multiple manufacturing procedures to manufacture circuit board successively.In the accompanying drawing used by the following description, in order to become energy
The size of each component is enough recognized, appropriate change has been carried out to the scale of each component.
In the following description, XYZ vertical coordinate systems are set, comes the position to each component with reference to the XYZ vertical coordinate systems
The relation of putting is illustrated.If the prescribed direction in horizontal plane is X-direction, if direction vertical with X-direction in the horizontal plane is Y side
To if the direction being respectively perpendicular with X-direction and Y-direction (i.e. vertical direction) is Z-direction.
＜ devices entirety ＞
As shown in figure 1, circuitboard manufacturing devices 1 have：Delivery device 2；Solder print device 3；Component mounter 4；Return
Stream stove 5；Intermediate hopper 6；Appearance inspection device 7；Product accumulator 8 and conveyer 9.
10 grade of printed wiring board (including circuit board 12) is transported along the production line L for extending in the X direction.Hereinafter, exist
In production line L etc., using the side of delivery device 2 as " upstream side (-X direction side) ", using the side of product accumulator 8 as
" downstream (+X direction side) ".
＜ conveyer ＞
Conveyer 9 has multiple (being for example 5 in the present embodiment) 91～95 (the first vehicles of vehicle
91st, the second vehicle 92, the 3rd vehicle 93, the 4th vehicle 94 and the 5th vehicle be 95).In this embodiment party
In formula, from upstream side, downstream side is arranged with order：Delivery device 2, the first vehicle 91, solder print device 3, second
Vehicle 92, component mounter 4, the 3rd vehicle 93, reflow ovens 5, the 4th vehicle 94, intermediate hopper the 6, the 5th
Vehicle 95, appearance inspection device 7 and product accumulator 8.
Specifically, the first vehicle 91 is configured between delivery device 2 and solder print device 3.Second transports dress
Put 92 to be configured between solder print device 3 and component mounter 4.3rd vehicle 93 is configured at component mounter 4 and returns
Between stream stove 5.4th vehicle 94 extends from reflow ovens 5 towards the side contrary with component mounter 4.4th vehicle
94 are configured between reflow ovens 5 and intermediate hopper 6.5th vehicle 95 is configured at intermediate hopper 6 and product accumulator 8
Between.For example, vehicle 91～95 is ribbon conveyer.Vehicle 91～95 separately can drive.
＜ delivery device ＞
Delivery device 2 is configured at the most upstream side (that is, upstream end) of production line L.Printed wiring board 10 is thrown by delivery device 2
It is put in production line L.10 rectangular tabular of printed wiring board.In the present embodiment, the substrate of printed wiring board 10 is glass
Made by fiber-reinforced epoxy.Additionally, printed wiring board 10 has multiple through holes.In the present embodiment, print cloth
It is through hole 601, through hole 602, through hole 603, through hole 604 that line plate 10 has 4 through holes.Delivery device 2 has to be thrown
Put vehicle 23 in accumulator 20 and delivery device.
As shown in Fig. 2 throwing in accumulator 20 can receive multiple printed wiring boards 10.Throw in accumulator 20 and there is lifting dress
Put 22 and multiple grooves 21.
Groove 21 has supporting member 21a for extending in X direction.Supporting member 21a can support the Y side of printed wiring board 10
To two ends.The size of the inner space 21s of groove 21 is the size that can at least receive 1 printed wiring board 10.
Lowering or hoisting gear 22 can be such that multiple grooves 21 integratedly lift.Lowering or hoisting gear 22 can to the height of groove 21 (Z-direction
Position) carry out step-less adjustment.Lowering or hoisting gear 22 has ball-screw 22a and driving means 22b.The length of ball-screw 22a
In Z-direction.Driving means 22b have motor.The rotary motion of motor is converted to along the Z direction by ball-screw 22a
Linear motion.
As shown in figure 1, vehicle 23 is configured in the inner space 2s of delivery device 2 in delivery device.Delivery device
Interior vehicle 23 can transport printed wiring board 10.For example, in delivery device, vehicle 23 is ribbon conveyer.Throw in dress
Put interior vehicle 23 and there is the transport face 23a (upper tables that extend and can load printed wiring board 10 in the horizontal direction
Face).
As shown in Fig. 2 when printed wiring board 10 is transported, lowering or hoisting gear 22 make the height of supporting member 21a of groove 21 with
The height alignment of the transport face 23a (with reference to Fig. 1) of vehicle 23 in delivery device.Specifically, make propping up for supporting member 21a
Bearing surface (upper surface) is alignd with the height of the transport face 23a of vehicle in delivery device 23.In the present embodiment, support structure
Part 21a extends in X direction, also, transport face 23a extends in the horizontal direction, thereby, it is possible to the printed wiring by groove 21 is accommodated in
Plate 10 is successfully delivered to transport face 23a.
＜ solder print device ＞
As shown in figure 1, solder print device 3 is configured at the downstream of delivery device 2 across the first vehicle 91.
Solder print device 3 is by the surface of solder printing to the printed wiring board 10 rendered in production line L.The weldering
Material is the solder (cream solder) of paste.In addition, the lead containing ratio in the metal part of the solder is less than in the present embodiment
0.1 weight %.Solder print device 3 has workbench 301, mask member 302, table-driving mechanism 303, scraper 304, scrapes
Vehicle 33 in knife drive mechanism 305 and printing equipment.Here, solder print device 3 is said with reference to Fig. 3～Fig. 5
It is bright.
Fig. 3 is the figure of of the structure from front observation for illustrating solder print device 3.The front is solder printing dress
Put the face of the +Z direction side in 3 faces having.Additionally, Fig. 4 is the structure from side observation for illustrating solder print device 3
The figure of one.The side is the face of the -X direction side in the face that solder print device 3 has.Solder printing shown in Fig. 4
The state of device 3 is the state that printed wiring board 10 has been moved to solder print device 3 from the first vehicle 91.Additionally,
Fig. 5 is other figure of the structure from side observation for illustrating solder print device 3.The side is 3 institute of solder print device
The face of the -X direction side in the face having.The state of the solder print device 3 shown in Fig. 5 is that solder is printed by solder print device 3
Brush the state on printed wiring board 10.
Workbench 301 is the printed wiring board 10 for being moved to solder print device 3 for configuration from the first vehicle 91
Platform.
Mask member 302 includes main body portion 310 and keeps the square frame 311 in main body portion 310.Mask master
Body portion 310 is the piece with multiple hole 30h.That is, mask member 302 is the piece with multiple hole 30h.Multiple hole 30h represent by
Printed patterns when solder printing is on printed wiring board 10.
Main body portion 310 is placed on frame 311.Main body portion 310 can by move frame 311 and with frame 311
Move together.Main body portion 310 has rectangular plate shape.Fig. 7 represents main body portion 310.Main body portion 310 has
There are multiple (being for example 2 in the present embodiment) main body portions 321 and 322 (the first main body portion 321 of main body portion
And second main body portion 322).First main body portion 321 and the second main body portion 322 are adjacent each other.First covers
Mould main part 321 and the second main body portion 322 are rotationally symmetrical as axis of symmetry with the center 30c with main body portion 310
The shape of (2 weight symmetry).Thus, 2 printed patterns can be formed in printing object by solder print device 3 simultaneously.That is, weld
Material printing apparatus 3 being capable of the simultaneously printing solder on 2 printed wiring boards 10.In addition, in the figure 7, the first mask is surrounded respectively
The rectangle in main part 321 and the second main body portion is represented between expression main body portion 310 and printed wiring board 10
Position relationship and the outer rim of printed wiring board 10 suitably drawn.Be not in such in actual main body portion 310
Rectangle.
Table-driving mechanism 303 is changing printed wiring board when printed wiring board 10 is configured on workbench 301
Change relative position relation on 10 surface and the direction of the distance between mask member 302.Specifically, workbench drives
Mechanism 303 is moved in this direction by making frame 311, changes the position relationship.Additionally, table-driving mechanism 303 exists
When printed wiring board 10 is configured on workbench 301, is moved by making workbench 301 in the horizontal direction, make printing cloth
Line plate 10 is changed with the relative position relation in the horizontal direction of mask member 302.Thus, table-driving mechanism 303 can
Make the relative position relation of printed wiring board 10 and mask member 302 consistent with the position relationship of regulation.
Additionally, table-driving mechanism 303 can form the shape that mask member 302 is contacted with the surface of printed wiring board 10
State both relative position relations left from printed wiring board 10 of 302 printed wiring board 10 of state and mask member.Separately
Outward, the table of mask member 302 and printed wiring board 10 is made driving workbench 301 to move by table-driving mechanism 303
In the case that face contacts, the surface in main body portion 310 is contacted with the surface of the printed wiring board 10.
Scraper 304 is configured at upper direction (+Y direction) side of mask member 302.
Scraper drive mechanism 305 includes：Upper lower drive mechanism 306, its make scraper 304 and mask member 302 surface it
Between distance change；And horizontal drive mechanism 307, which makes scraper 304 move on the direction along the surface of mask member 302
It is dynamic.
In the present embodiment, the printing that solder print device 3 is carried out on the surface of printed wiring board 10 is screen printing
Brush (screen printing).For example, in solder print device 3, move workbench 301 by table-driving mechanism 303, make to cover
Die component 30 covers the printed wiring board 10 being configured on workbench 301.Then, solder print device 3 carries the solder of paste
It is placed in mask member 30 and make scraper 304 to slide.Thus, the solder of paste by hole 30h that mask member 30 has and
It is attached to printed wiring board 10.As described above, solder print device 3 is by the surface of solder printing to printed wiring board 10.
In printing equipment, vehicle 33 is configured in the inner space 3s of solder print device 3.Transport in printing equipment
Device 33 can transport the printed wiring board 10 being moved in the inner space 3s of solder print device 3.Transport in printing equipment
Device 33 by the printed wiring board 10 for being printed with solder, downstream transport by side.For example, in printing equipment, vehicle 33 is belt
Conveyer.
＜ component mounter ＞
Component mounter 4 is configured at the downstream of solder print device 3 across the second vehicle 92.
Element 11 is attached to be printed with the printed wiring board 10 of solder by component mounter 4.Component mounter 4 has element
Vehicle 43 in feedway 40, mouth 41, mobile device 42 and fitting machine.Element 11 is supplied by component supplying apparatus 40
To the region of regulation.Mouth 41 being capable of absorptive element 11.Mobile device 42 can make mouth 41 in the horizontal direction (XY directions) with
And above-below direction (Z-direction) is mobile.For example, mobile device 42 adsorbs the element from the supply of component supplying apparatus 40 by mouth 41
11, the element 11 for being adsorbed is attached to into the target location of printed wiring board 10.
In fitting machine, vehicle 43 is configured in the inner space 4s of component mounter 4.Vehicle 43 in fitting machine
The printed wiring board 10 being moved in the inner space 4s of component mounter 4 can be transported.In fitting machine, vehicle 43 will peace
Printed wiring board 10 equipped with element 11 downstream transport by side.For example, in fitting machine, vehicle 43 is ribbon conveyer.Separately
Outward, element 11 is of element.
Assembly ＞ in the middle of ＜ circuit boards
One of assembly 13 in the middle of Fig. 6 C indication circuit plates.In the present embodiment, pacified by component mounter 4
Printed wiring board 10 equipped with element 11 is mounted vehicle 43 in machine and transports to the 3rd vehicle 93.Then, the printing
Wiring plate 10 is transported to the job position of the regulation between component mounter 4 and reflow ovens 5 by the 3rd vehicle 93.In the work
Lid described later 500 is installed by user in industry position, the printed wiring board 10.Lid 500 is being attached to the printed wiring by user
During plate 10, make the relative position relation of printed wiring board 10 and lid 500 consistent with the position relationship of regulation.Hereinafter, in order to illustrate
Convenient, the printed wiring board 10 that lid 500 will be provided with by user is referred to as in the middle of circuit board assembly 13 to illustrate.Will
The assembly being made up of printed wiring board 10 and the lid 500 on the printed wiring board 10 is referred to as assembly in the middle of circuit board
13。
That is, in the middle of circuit board, assembly 13 has printed wiring board 10, solder, multiple element 11 and lid 500.Fig. 6 B tables
Show printed wiring board 10 one.Wiring diagram of the printed wiring board 10 with more than 1 that multiple element 11 is electrically connected to each other
Case.The wiring pattern at least includes multiple ends 14 of the part arrangement of the outer rim along the printed wiring board 10.It is many at this
The surface of individual end 14 has metal to expose.The solder is the weldering in the region of the regulation on the surface for coat printed wiring board 10
Material.The plurality of element 11 is the multiple element 11 being configured on the surface of printed wiring board 10 by means of the solder.Such as Fig. 6 C
It is shown, in the case where user makes the relative position relation of printed wiring board 10 and lid 500 consistent with the position relationship of regulation,
Lid 500 covers at least a portion for being not coated with being furnished with the region of solder on printed wiring board 10.Specifically, in the situation
Under, lid 500 covers the plurality of end 14.The end 14 is the end for making the printed wiring board 10 electrically connect with other circuit boards
Son.Thus, by using assembly in the middle of circuit board 13, when in reflow ovens 5 melting cream solder, can suppress from molten
The cream solder for melting disperses the solder attachment on the plurality of end 14.Additionally, the printed wiring board 10 have should
The shape of multiple ends 14 and it is configured to the center of the printed wiring board 10 as axis of symmetry rotationally symmetrical (2 weight symmetry).Thus,
When the printed wiring board 10 is rendered in solder print device 3, the probability thrown in the opposite way round can be reduced.
Additionally, lid 500 is equally made of glass reinforced epoxy with printed wiring board 10 in the present embodiment
's.Thus, even if assembly 13 is in the case of heated in reflow ovens 5 in the middle of circuit board, it is also possible to suppress printed wiring
Plate 10 is changed with the relative position relation of lid 500.This is because, as described above, in the present embodiment, printed wiring board 10
It is made by glass reinforced epoxy.
Fig. 6 A are the figures of that illustrates lid 500.As shown in Figure 6A, lid 500 has multiple through holes.In present embodiment
In, it is through hole 501, through hole 502, through hole 503, through hole 504 that lid 500 has 4 through holes.Make in user
In the case that the relative position relation of printed wiring board 10 and lid 500 is consistent with the position relationship of regulation, the center of through hole 501
Axle is consistent with the central shaft of the through hole 601 that printed wiring board 10 has.Additionally, in this case, in through hole 502
Heart axle is consistent with the central shaft of the through hole 602 that printed wiring board 10 has.Additionally, in this case, in through hole 503
Heart axle is consistent with the central shaft of the through hole 603 that printed wiring board 10 has.Additionally, in this case, in through hole 504
Heart axle is consistent with the central shaft of the through hole 604 that printed wiring board 10 has.Additionally, lid 500 is also at least positioned with 2
Bar.In the present embodiment, it is bar 505, bar 506, bar 507, bar 508 that lid 500 also has 4 bars as the locating rod.Specifically
For, for lid 500, bar 505 passes through through hole 501, bar 505 to be fixed to depart from from lid 500.Additionally, for lid
500, bar 506 passes through through hole 502, bar 506 to be fixed to depart from from lid 500.Additionally, for lid 500, bar 507 is passed through
Through hole 503, bar 507 are fixed to depart from from lid 500.Additionally, for lid 500, bar 508 passes through through hole 504, bar
508 are fixed to depart from from lid 500.The locating rod that lid 500 has is through in the through hole of printed wiring board 10
Any one in the through hole of any one and lid 500.Specifically, bar 505 passes through through hole 501 and above-mentioned through hole
Both 601.Additionally, bar 506 passes through both through hole 502 and above-mentioned through hole 602.Additionally, bar 507 passes through 503 He of through hole
Both above-mentioned through holes 603.Additionally, bar 508 passes through both through hole 504 and above-mentioned through hole 604.That is, by the locating rod,
The relative position relation of printed wiring board 10 and mask member 302 can be fixed into by user will not be from the position relationship of regulation
Change.Accordingly, for assembly in the middle of circuit board 13, user can easily cover the surface district of printed wiring board 10
User in domain wants the region of the regulation covered by lid 500.
Additionally, lid 500 is with the shape with the center of lid 500 as axis of symmetry rotationally symmetrical (2 weight symmetry).Thus, circuit
In the middle of plate, assembly 13 can suppress user to mistake the direction that lid 500 is installed to printed wiring board 10.This is because, as above
Described, multiple ends that printed wiring board 10 has are with the center of printed wiring board 10 as rotationally symmetrical (2 weights of axis of symmetry
Shape symmetrically).The plurality of end is described above as the terminal for making printed wiring board 10 electrically connect with other circuit boards.
＜ reflow ovens ＞
Reflow ovens 5 are configured at the downstream of component mounter 4 across the 3rd vehicle 93.
Reflow ovens 5 pairs are provided with the printed wiring board 10 of element 11 and heat, and element 11 is welded with printed wiring board 10
It is connected together and forms circuit board 12.Reflow ovens 5 have in atmosphere control device 50, heater 51 and reflow ovens transports dress
Put 52.(hereinafter referred to as " in reflow ovens, oxygen is dense by the oxygen concentration in the inner space 5s of reflow ovens 5 for atmosphere control device 50
Degree ".) remain than reflow ovens 5 space outerpace (air) in oxygen concentration it is low.For example, in reflow ovens, oxygen concentration exists
More than 100ppm and below 2000ppm.More preferably in reflow ovens, oxygen concentration is in more than 100ppm and below 800ppm.Additionally,
In the present embodiment, in the inner space 5s of reflow ovens 5, oxygen partial pressure is retained as the value lower than atmospheric environment.
Heater 51 by the temperature of the inner space 5s of reflow ovens 5 (hereinafter referred to as " backflow in-furnace temperature ".) remain
The temperature of regulation.Heater 51 makes the inner space 5s of reflow ovens 5 become optimal Temperature Distribution.Backflow in-furnace temperature according to
Solder and it is different.For example, in the case of using lead-free solder, heater 51 is by the entrance (upstream side) of reflow ovens 5
150 degree or so are remained, near exit (downstream) is remained into 110 degree or so, by the position for becoming maximum temperature of midway
Remain 250 degree or so.
Heater 51 pairs completes solder printing and the printed wiring board 10 after element installation and carries out overall heating.Plus
Thermal 51 only makes solder partial melting.Thus, heater 51 is by the wiring of the portion of terminal of element 11 and printed wiring board 10
Part is combined by welding (with reference to Fig. 7), forms circuit board 12.
In reflow ovens, vehicle 52 is configured in the inner space 5s of reflow ovens 5.In reflow ovens, vehicle 52 can
Transport is moved to the printed wiring board 10 in the inner space 5s of reflow ovens 5.In reflow ovens, vehicle 52 is by with can fill
The component of the thermostability of the heat of tolerance heater 51 is divided to be formed.For example, the band that vehicle 52 is made of metal in reflow ovens
Formula conveyer.
In the present embodiment, user prepares assembly 13 in the middle of above-mentioned circuit board, by assembly in the middle of circuit board
13 render in reflow ovens 5, and assembly in the middle of circuit board 13 is taken out from reflow ovens 5, by lid 500 from the middle of circuit board assembly
13 separate.User lid 500 is separated after circuit board in the middle of assembly 13 be foregoing circuit plate 12.
＜ intermediate hoppers ＞
Intermediate hopper 6 is configured at the downstream of reflow ovens 5 across the 4th vehicle 94.That is, intermediate hopper 6 is relative
The side contrary with reflow ovens 5 is configured in the 4th vehicle 94.
Intermediate hopper 6 can receive multiple circuit boards 12.As intermediate hopper 6 is same with above-mentioned input accumulator 20
The structure of sample, therefore, omit detail explanation.
＜ appearance inspection device ＞
Appearance inspection device 7 is configured at the downstream of intermediate hopper 6 across the 5th vehicle 95.
Appearance inspection device 7 checks the outward appearance of circuit board 12.Appearance inspection device 7 has camera head 70, computer 71
And vehicle 72 in appearance inspection device.Camera head 70 shoots circuit board 12.For example, camera head 70 is photographing unit.
Camera head 70 is connected with computer 71.Computer 71 has memorizer 71a and processor 71b.
For example, the shooting result of camera head 70 is (hereinafter referred to as " shooting image ".) it is exported to computer 71.Computer
71 pairs of benchmark images being stored in memorizer 71a are contrasted with shooting image, by circuit board 12 be judged to " certified products " or
Person's " defective work ".Specifically, difference feelings the threshold value of regulation below of the computer 71 in benchmark image and shooting image
Under condition, it is judged to " certified products ".Computer 71 in the case where the difference of benchmark image and shooting image exceedes the threshold value of regulation,
It is judged to " defective work ".Thereby, it is possible to avoid the outflow of defective work.
In addition, the visual examination of circuit board 12 is sometimes for the time longer than the welding in reflow ovens 5.In the situation
Under, it is possible to create the needs of the travelling speed of adjustment circuit plate 12 between reflow ovens 5 and appearance inspection device 7.But, according to
Present embodiment, as intermediate hopper 6 is configured between reflow ovens 5 and appearance inspection device 7, therefore, even if in circuit board
In the case of 12 visual examination needs for a long time, it is also possible to which the circuit board 12 transported from reflow ovens 5 is accommodated in centre successively
In accumulator 6.Therefore, though circuit board 12 visual examination need it is prolonged in the case of, it is not required that reflow ovens 5 with
The travelling speed of adjustment circuit plate 12 between appearance inspection device 7, is preferred.
In appearance inspection device, vehicle 72 is configured in the inner space 7s of appearance inspection device 7.Visual examination is filled
Put interior vehicle 72 and can transport the circuit board 12 being moved in the inner space 7s of appearance inspection device 7.Visual examination is filled
Put interior vehicle 72 and the circuit board 12 for being judged to " certified products " is transported into downstream side.For example, transport in appearance inspection device
Device 72 is ribbon conveyer.
＜ product accumulator ＞
Product accumulator 8 is configured at the downstream of appearance inspection device 7.Product accumulator 8 can receive multiple circuit boards 12.
As product accumulator 8 is the structure same with above-mentioned input accumulator 20, therefore, omit detail explanation.
Be judged as in appearance inspection device 7 being accommodated in only in product accumulator 8 circuit board 12 of " certified products ".Storage
Circuit board 12 in product accumulator 8 (offline) outside production line L is made whether inspection (the function inspection of normally action
Look into).
＜ cooling body ＞
Circuitboard manufacturing devices 1 also have cooling body 100.100 pairs of circuit boards 12 transported from reflow ovens 5 of cooling body
Cooled down.Cooling body 100 has：Multiple (being for example 2 in the present embodiment) retainer 101A and retainer 101B
(the first retainer 101A and the second retainer 101B)；And multiple (being for example 3 in the present embodiment) aerator 110A,
Aerator 110B and aerator 110C (the first aerator 110A, the second aerator 110B and the 3rd aerator 110C).
＜ retainer ＞
As shown in figure 8, the first retainer 101A, the second retainer 101B are configured along the 4th vehicle 94.First stops
Dynamic device 101A is configured near reflow ovens 5 relative to the second retainer 101B.Second retainer 101B is relative to the first retainer
101A is configured in the side contrary with reflow ovens 5.That is, the second retainer 101B is configured to than the first retainer 101A downstream
Side.
First retainer 101A, the second retainer 101B stop can from reflow ovens 5 circuit board 12 for transporting.In this reality
Apply in mode, circuit board 12 is singly transported successively from reflow ovens 5.Therefore, in the first retainer 101A, the second stop
At device 101B, circuit board 12 singly stops.First retainer 101A, the second retainer 101B can be relative to the 4th fortune
The transport path of the circuit board 12 in device 94 is sent to retreat.First retainer 101A, the second retainer 101B have arm 102,
E axle supporting portion 103 and driving means 104.
As shown in figure 9, arm 102 is in L-shaped.E axle supporting portion 103 supports the cardinal extremity of arm 102.E axle supporting portion 103 has
Rotation axiss 103a along the X direction.Driving means 104 have can be such that arm 102 rotates centered on rotation axiss 103a
Motor.
In the transport of circuit board 12, driving means 104 make arm 102 centered on rotation axiss 103a clockwise (to
The direction of arrow V1) rotate.Thus, the circuit of the first retainer 101A, the second retainer 101B from the 4th vehicle 94
The transport path of plate 12 is kept out of the way.Therefore, the circuit board 12 for transporting from reflow ovens 5 is transported (reference picture towards intermediate hopper 6
8)。
When circuit board 12 stops, driving means 104 make arm 102 centered on rotation axiss 103a counterclockwise (to
The direction of the rightabout arrow V2 of arrow V1) rotate.Thus, the first retainer 101A, the second retainer 101B enter the 4th
The transport path of the circuit board 12 in vehicle 94.Therefore, the circuit board 12 for transporting from reflow ovens 5 is by the first retainer
101A, the second retainer 101B stop (with reference to Fig. 8).
In the stopping of circuit board 12, the end of arm 102 is close to the part of the +Y direction side of the 4th vehicle 94.
Width (length of Y-direction) of the length (from the length of the Y-direction of cardinal extremity to end) of arm 102 than the 4th vehicle 94
It is short.Thus, compared with the situation for making the length of arm 102 be up to more than the width of the 4th vehicle 94, arm 102 can be made
(that is, the mobility for improving arm 102) is rotated successfully.Therefore, it is possible to make the first retainer 101A, the second retainer 101B phases
For the transport path of the circuit board 12 in the 4th vehicle 94 is successfully retreated.
＜ aerator ＞
As shown in figure 8, the first aerator 110A, the second aerator 110B are configured along the 4th vehicle 94.First drum
Blower fan 110A is adjacent with the first retainer 101A.Second aerator 110B is adjacent with the second retainer 101B.First aerator
110A, the second aerator 110B blow towards the circuit board 12 transported from reflow ovens 5.
First aerator 110A, the second aerator 110B, the 3rd aerator 110C are with the wind rotated around axis 111
Fan 112.Fan 112 is being blown along on the direction of axis 111.For example, fan 112 is the aerofoil fans such as propeller type fan.
In the side view of Fig. 8, the first aerator 110A, the axis 111 of the second aerator 110B and the 4th vehicle
94 transport face 94a intersects.Specifically, transport of the axis 111 of the first aerator 110A relative to the 4th vehicle 94
Face 94a is inclined.In the side view of Fig. 8, the axis 111 of the first aerator 110A is being more then more partial to-Z sides by +X direction side
To mode incline.On the other hand, the transport face 94a essence of the axis 111 and the 4th vehicle 94 of the second aerator 110B
It is upper vertical.
In cooling circuit board 12, in addition to stopping the driving of the 4th vehicle 94, also carry out based on the first stop
The stopping of device 101A, the second retainer 101B.In cooling circuit board 12, the first aerator 110A is towards by the first retainer
The circuit board 12 that 101A stops is blown.On the other hand, the second aerator 110B is towards the circuit stopped by the second retainer 101B
Plate 12 is blown.
3rd aerator 110C is configured at around intermediate hopper 6.In fig. 8, for convenience, only illustrate and be configured at
3rd aerator 110C of the top of intermediate hopper 6.3rd aerator 110C directions are accommodated in the groove of intermediate hopper 6
Circuit board 12 is blown.For example, from from the viewpoint of efficiently cooling circuit board 12, the axis of the 3rd aerator 110C can direction
The entrance of groove is inclined.
As described above, in the middle of the circuit board of above-mentioned embodiment, assembly 13 has：Printed wiring board 10, its
With wiring pattern；Solder, which is coated in the region of the regulation on the surface of printed wiring board 10；Multiple element 11, they
It is configured at by means of solder on the surface of printed wiring board 10；And lid 500, which covers uncoated on printed wiring board 10
At least a portion having in the region of solder, wiring pattern 10 at least include the part row of the outer rim along printed wiring board 10
Multiple ends of row, the lead containing ratio in the metal part of solder are less than 0.1 weight %, on the plurality of end surface have metal
Expose, lid 500 covers the plurality of end.
Thus, when assembly 13 makes melt solder in reflow ovens 5 in the middle of the circuit board, solder attachment can be suppressed in print
The region of the regulation on brush wiring plate 10.
Additionally, assembly 13 also has at least 2 locating rods in the middle of circuit board, printed wiring board 10 has multiple insertions
Hole, lid 500 have multiple through holes, and the locating rod is through any one in the through hole of printed wiring board 10 and lid 500
Any one in through hole.
Thus, in the circuit board between in assembly 13, user easily can be covered on the surface of printed wiring board 10
Region in user want the region of the regulation covered by lid 500.
Additionally, between in the circuit board in assembly 13, the substrate of printed wiring board 10 is glass reinforced epoxy
Made by, lid 500 is also made by glass reinforced epoxy.
Thus, even if assembly 13 is in the case of heated in reflow ovens 5 in the middle of circuit board, it is also possible to suppress printing
Wiring plate 10 is changed with the relative position relation of lid 500.
Additionally, in the method for manufacturing circuit board of present embodiment, prepare assembly 13 in the middle of circuit board as described above,
Assembly in the middle of circuit board 13 is rendered in reflow ovens 5, assembly in the middle of circuit board 13 is taken out from reflow ovens 5, by lid 500
From in the middle of circuit board, assembly 13 is separated, wherein, the oxygen partial pressure inside reflow ovens 5 is retained as the value lower than atmospheric environment.
Thus, in method of manufacturing circuit board, when melt solder being made in reflow ovens 5, can suppress solder attachment in printed wiring
The region of the regulation on plate 10.
More than, carry out detailed narration referring to the drawings to the embodiment of the invention, but specific structure has been not limited to the reality
Mode is applied, without departing from the purport of the invention, can be carried out changing, replaced, delete.
Claims (3)
1. assembly in the middle of a kind of circuit board, it is characterised in that assembly has in the middle of the circuit board：
Printed wiring board, which has wiring pattern；
Cream solder, which coats the region of the regulation on the surface of the printed wiring board；
Multiple element, which is configured on the surface of the printed wiring board by means of the cream solder；And
Lid, uncoated on its described printed wiring board of covering have at least a portion in the region of the cream solder,
The wiring pattern at least includes multiple ends of the part arrangement of the outer rim along the printed wiring board,
Lead containing ratio in the metal part of the cream solder is less than 0.1 weight %,
On the surface of the plurality of end there is metal to expose,
The lid covers the plurality of end.
2. assembly in the middle of circuit board according to claim 1, it is characterised in that
The substrate of the printed wiring board is made by glass reinforced epoxy,
The lid is also made by glass reinforced epoxy.
3. a kind of method of manufacturing circuit board,
Prepare assembly in the middle of the circuit board described in claim 1 or 2,
Assembly in the middle of the circuit board is rendered in reflow ovens,
Assembly in the middle of the circuit board is taken out from reflow ovens,
The lid is separated from assembly in the middle of the circuit board,
The method of manufacturing circuit board is characterised by,
Oxygen partial pressure inside the reflow ovens is retained as the value lower than atmospheric environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611040291.2A CN106561071A (en) | 2016-11-11 | 2016-11-11 | Circuit board intermediate assembly body and circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611040291.2A CN106561071A (en) | 2016-11-11 | 2016-11-11 | Circuit board intermediate assembly body and circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106561071A true CN106561071A (en) | 2017-04-12 |
Family
ID=58485800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611040291.2A Pending CN106561071A (en) | 2016-11-11 | 2016-11-11 | Circuit board intermediate assembly body and circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106561071A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5292055A (en) * | 1991-12-06 | 1994-03-08 | Electrovert Ltd. | Gas shrouded wave improvement |
| JP2005026559A (en) * | 2003-07-04 | 2005-01-27 | Xanavi Informatics Corp | Mask equipment for printing cream solder, and cream solder printer |
| CN2679969Y (en) * | 2004-02-09 | 2005-02-16 | 正文科技股份有限公司 | Tool for preventing golden finger from soaking tin |
| CN101364115A (en) * | 2008-09-23 | 2009-02-11 | 熊猫电子集团有限公司 | Nitrogen closed-loop control method and system |
| CN103340029A (en) * | 2011-12-22 | 2013-10-02 | 松下电器产业株式会社 | Electronic component mounting line and electronic component mounting method |
-
2016
- 2016-11-11 CN CN201611040291.2A patent/CN106561071A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5292055A (en) * | 1991-12-06 | 1994-03-08 | Electrovert Ltd. | Gas shrouded wave improvement |
| JP2005026559A (en) * | 2003-07-04 | 2005-01-27 | Xanavi Informatics Corp | Mask equipment for printing cream solder, and cream solder printer |
| CN2679969Y (en) * | 2004-02-09 | 2005-02-16 | 正文科技股份有限公司 | Tool for preventing golden finger from soaking tin |
| CN101364115A (en) * | 2008-09-23 | 2009-02-11 | 熊猫电子集团有限公司 | Nitrogen closed-loop control method and system |
| CN103340029A (en) * | 2011-12-22 | 2013-10-02 | 松下电器产业株式会社 | Electronic component mounting line and electronic component mounting method |
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