CN206260152U - Solder print device - Google Patents

Abstract

The utility model provides a kind of solder print device, by the surface of printing cream-like solder to printed wiring board, has：Solder container, carries cream solder；Workbench, its configuration printed wiring board；Mask member；Platform lifting mechanism, makes the change of the distance between workbench and mask member；Scraper；Scraper drive mechanism；Information processor；Solder container setting table, including identification code reading device；And housing, with inner space, solder container has the identification code of the species for representing cream solder in outer peripheral face, and mask member is the piece with multiple holes, and scraper drive mechanism includes：Upper lower drive mechanism, makes the change of the distance between scraper and mask member surface；Horizontal drive mechanism, scraper is set to be moved up in the side on the surface along mask member, workbench, platform lifting mechanism, mask member, scraper, scraper drive mechanism and information processor are at least accommodated with the inner space of housing, identification code reading device is connected with information processor.

Description

Solder print device

Technical field

The utility model is related to solder print device.

Background technology

Include by the printing process on the solder printing of paste to printed wiring board, by unit in the manufacturing process of circuit board Installation procedure and melt solder is made element and printed wiring board that part is installed on the printed wiring board for being printed with solder With reference to operation.In order that melt solder, uses reflow ovens.Now, the printed wiring board for being provided with element is integrally heated, only There is solder partial melting.

In printing process, by the device on solder printing to printed wiring board, supplied and printing cloth by user The solder of the corresponding species of line plate.In the case where the species to the solder of the unit feeding is changed, user may sometimes Mistake by with should be supplied to the device to the different types of solder of the species of the solder of the unit feeding.But, it is printed with this The printed wiring board of solder will not produce unfavorable condition and be operating normally sometimes.In the situation of printed wiring board regular event Under, it is not easy to detect that the solder has been printed on the printed wiring board by inspection.

Utility model content

The utility model is to complete in view of the foregoing, its problem be offer can suppress by user supply with The solder print device of the different types of solder of species of regulation.

In order to solve at least one of above-mentioned problem, a mode of the present utility model is a kind of solder print device, It is used for the surface of printing cream-like solder to printed wiring board, wherein, the solder print device has：Solder container, its For carrying cream solder；Workbench, the printed wiring board is configured on the workbench；Mask member；Balcony lift Structure, it makes the change of the distance between the workbench and described mask member；Scraper；Scraper drive mechanism；Information processor； Solder container setting table, it includes identification code reading device；And housing, it has inner space, and the solder container is outside Side face has the identification code of the species for representing cream solder, and the mask member is the piece with multiple holes, and the scraper drives Mechanism includes：Upper lower drive mechanism, it makes the change of the distance between the scraper and surface of the mask member；Horizontal drive Mechanism, it makes the scraper be moved up in the side on the surface along the mask member, in the inner space of the housing At least it is accommodated with the workbench, the platform lifting mechanism, the mask member, the scraper, the scraper drive mechanism And described information processing unit, the identification code reading device is connected with described information processing unit.

An implementation method according to illustration of the present utility model, can suppress to be supplied with the species for specifying not by user Congener solder.

Brief description of the drawings

Fig. 1 is the schematic diagram of the circuitboard manufacturing devices of implementation method.

Fig. 2 is the schematic diagram of the dispensing accumulator of implementation method.

Fig. 3 is the figure of of the outward appearance for showing solder print device.

Fig. 4 shows the figure of of the structure from front observation of solder print device.

Fig. 5 is the figure of of the structure from side observation for showing solder print device.

Fig. 6 is other figure of the structure from side observation for showing solder print device.

Fig. 7 is the schematic diagram of the mask member of implementation method.

Fig. 8 is the figure of of the welding for showing implementation method.

Fig. 9 is the figure along the V directions of arrow in Fig. 1.

Figure 10 is the figure along the VI directions of arrow in Fig. 9.

Label declaration

1：Circuitboard manufacturing devices；2：Delivery device；3：Printing equipment；4：Component mounter；5：Reflow ovens；6：Centre storage Glassware；10：Printed wiring board；11：Element；12：Circuit board；20：Deliver accumulator；30h：Hole；5s：Inner space；50：Atmosphere Control device；51：Heater；52：Conveyer in reflow ovens；91：First conveyer；92：Second conveyer；93： 3rd conveyer；94：4th conveyer；101A：First retainer；101B：Second retainer；110A：First air blower； 110B：Second air blower；110C：3rd air blower；300：Solder container；301：Workbench；302：Mask member；303：Work Platform drive mechanism；304：Scraper；305：Scraper drive mechanism；306：Upper lower drive mechanism；307：Horizontal drive mechanism；310：Cover Mould main part；311：Frame；321：First main body portion；322：Second main body portion；400：Information processor；401：Weldering Material container setting table；402：Housing；403：Platform lifting mechanism；405：Identification code reading device；406：Inner space；L：Production Line.

Specific embodiment

Hereinafter, implementation method of the present utility model is illustrated with reference to the accompanying drawings.In the following embodiments, as electricity One of road board manufacturing apparatus, is listed below circuitboard manufacturing devices and illustrates：To dispensing in the production line of manufacture circuit board Printed wiring board, implements multiple manufacturing procedures to manufacture circuit board successively.In the accompanying drawing that the following description is used, in order into To be capable of identify that the size of each component, the engineer's scale to each component has carried out appropriate change.

In the following description, XYZ vertical coordinate systems are set, the position to each component is come with reference to the XYZ vertical coordinate systems The relation of putting is illustrated.If the prescribed direction in horizontal plane is X-direction, if direction vertical with X-direction in the horizontal plane is Y side To if the direction (i.e. vertical direction) being respectively perpendicular with X-direction and Y-direction is Z-direction.

＜ devices entirety ＞

As shown in figure 1, circuitboard manufacturing devices 1 have：Delivery device 2；Solder print device 3；Component mounter 4；Return Stream stove 5；Intermediate hopper 6；Appearance inspection device 7；Product accumulator 8 and conveyer 9.

The grade of printed wiring board 10 (including circuit board 12) is transported along the production line L for extending in the X direction.Hereinafter, exist In production line L etc., using the side of delivery device 2 as " upstream side (-X direction side) ", using the side of product accumulator 8 as " downstream (+X direction side) ".

＜ conveyers ＞

Conveyer 9 has multiple (being for example in the present embodiment 5) (first conveyers of conveyer 91~95 91st, the second conveyer 92, the 3rd conveyer 93, the 4th conveyer 94 and the 5th conveyer 95).In this embodiment party In formula, from upstream side, downstream side is arranged with order：Delivery device 2, the first conveyer 91, solder print device 3, second Conveyer 92, component mounter 4, the 3rd conveyer 93, reflow ovens 5, the 4th conveyer 94, intermediate hopper the 6, the 5th Conveyer 95, appearance inspection device 7 and product accumulator 8.

Specifically, the first conveyer 91 is configured between delivery device 2 and solder print device 3.Second transports dress 92 are put to be configured between solder print device 3 and component mounter 4.3rd conveyer 93 is configured at component mounter 4 and returns Between stream stove 5.4th conveyer 94 extends from reflow ovens 5 towards the opposition side of component mounter 4.4th conveyer 94 is matched somebody with somebody It is placed between reflow ovens 5 and intermediate hopper 6.5th conveyer 95 be configured at intermediate hopper 6 and product accumulator 8 it Between.For example, conveyer 91~95 is ribbon conveyer.Conveyer 91~95 can separately drive.

<Delivery device>

Delivery device 2 is configured at the most upstream side (that is, upstream end) of production line L.Delivery device 2 throws printed wiring board 10 It is put into production line L.The rectangular tabular of printed wiring board 10.Delivery device 2 has delivers fortune in accumulator 20 and delivery device Send device 23.

As shown in Fig. 2 delivering accumulator 20 can receive multiple printed wiring boards 10.There is lifting to fill to deliver accumulator 20 Put 22 and multiple grooves 21.

Groove 21 has the supporting member 21a for extending in X direction.Supporting member 21a can support the Y side of printed wiring board 10 To two ends.The size of the inner space 21s of groove 21 is that can at least receive 1 size of printed wiring board 10.

Lowering or hoisting gear 22 can be such that multiple grooves 21 integratedly lift.Lowering or hoisting gear 22 can to the height of groove 21 (Z-direction Position) carry out step-less adjustment.Lowering or hoisting gear 22 has ball-screw 22a and drive device 22b.The length of ball-screw 22a In Z-direction.Drive device 22b has motor.Ball-screw 22a is converted to along the Z direction the rotary motion of motor Linear motion.

As shown in figure 1, conveyer 23 is configured in the inner space 2s of delivery device 2 in delivery device.Delivery device Interior conveyer 23 can transport printed wiring board 10.For example, conveyer 23 is ribbon conveyer in delivery device.Deliver dress Putting interior conveyer 23 has the transport face 23a (upper tables that extend and can load printed wiring board 10 in the horizontal direction Face).

As shown in Fig. 2 when printed wiring board 10 is transported, lowering or hoisting gear 22 make the height of the supporting member 21a of groove 21 with The height alignment of the transport face 23a (reference picture 1) of conveyer 23 in delivery device.Specifically, the branch of supporting member 21a is made Bearing surface (upper surface) is alignd with the height of the transport face 23a of conveyer in delivery device 23.In the present embodiment, structure is supported Part 21a extends in X direction, also, transport face 23a extends in the horizontal direction, thereby, it is possible to will be accommodated in the printed wiring of groove 21 Plate 10 is successfully delivered to transport face 23a.

＜ solder print devices ＞

As shown in figure 1, solder print device 3 is configured at the downstream of delivery device 2 across the first conveyer 91.

Solder print device 3 is extremely delivered solder printing on the surface of the printed wiring board 10 arrived in production line L.The weldering Material is the solder (cream solder) of paste.Solder print device 3 has：Solder container 300, workbench 301, mask member 302, Conveyer 33, information processor in table-driving mechanism 303, scraper 304, scraper drive mechanism 305, printing equipment 400th, solder container setting table 401 and housing 402.Here, 3~Fig. 6 of reference picture is illustrated to solder print device 3.

Fig. 3 is the figure of of the outward appearance for showing solder print device 3.Fig. 4 be show solder print device 3 from front The figure of of the structure of observation.The front is the face of the +Z direction side in the face that solder print device 3 has.Additionally, Fig. 5 It is the figure of of the structure from side observation for showing solder print device 3.The side is that solder print device 3 is had The face of the -X direction side in face.The state of the solder print device 3 shown in Fig. 5 is that printed wiring board 10 is transported into dress from first Put 91 states for being moved to solder print device 3.Additionally, Fig. 6 is the structure from side observation for showing solder print device 3 Other figure.The side is the face of the -X direction side in the face that solder print device 3 has.Solder print shown in Fig. 6 The state of brush device 3 is solder print device 3 by the state on solder printing to printed wiring board 10.

Solder container 300 is used to carry the solder of paste.That is, solder container 300 is the container for housing the solder.User The solder of the predetermined species (species of regulation) according to printed wiring board 10 can be carried using solder container 300, and Supply to solder print device 3.Additionally, solder container 300 in outer peripheral face there is expression to be contained in the inside of solder container 300 The identification code of the species of the solder.Identification code is in the present embodiment bar code.In addition, identification code can also substitute bar code But colour code etc. represents other codes of the species.

Workbench 301 is the platform of the printed wiring board 10 that configuration is moved to solder print device 3 from the first conveyer 91.

Mask member 302 includes main body portion 310 and keeps the square frame 311 in main body portion 310.Mask master Body portion 310 is the piece with multiple hole 30h.That is, mask member 302 is the piece with multiple hole 30h.Multiple hole 30h represent by Printed patterns when solder printing is on printed wiring board 10.

Main body portion 310 is placed on frame 311.Main body portion 310 can by move frame 311 and and frame 311 move together.Main body portion 310 has rectangular plate shape.Fig. 7 represents main body portion 310.Main body portion 310 have multiple (being for example in the present embodiment 2) main body portions 321 and (the first main body of main body portion 322 Main body portion 322 of portion 321 and second).First main body portion 321 and the second main body portion 322 are adjacent each other.The It is symmetry axis rotation that one main body portion 321 and the second main body portion 322 have with the center 30c in main body portion 310 The symmetrical shape of (2 weight symmetry).Thus, simultaneously can be formed in printing object 2 printed patterns by solder print device 3. That is, solder print device 3 can simultaneously on 2 printed wiring boards 10 printing solder.In addition, in the figure 7, first is surrounded respectively The rectangle in main body portion of main body portion 321 and second represents expression main body portion 310 and printed wiring board 10 Between position relationship and the outer rim of printed wiring board 10 suitably drawn.Be not in this in actual main body portion 310 The rectangle of sample.

Table-driving mechanism 303 has platform lifting mechanism 403 and platform translation mechanism 404.Platform lifting mechanism 403 make the change of the distance between workbench 301 and mask member 302.That is, platform lifting mechanism 403 is in the quilt of printed wiring board 10 It is configured at when on workbench 301, makes on the direction for changing the distance between the surface of printed wiring board 10 and mask member 302 Relative position relation changes.Specifically, platform lifting mechanism 403 makes the position by making frame 311 move in this direction Relationship change.Additionally, platform translation mechanism 404 is when printed wiring board 10 is configured on workbench 301, by making workbench 301 move to become the relative position relation in horizontal direction of the printed wiring board 10 with mask member 302 in the horizontal direction Change.Thus, table-driving mechanism 303 can make the relative position relation of printed wiring board 10 and mask member 302 and regulation Position relationship it is consistent.

Additionally, table-driving mechanism 303 is acted by making platform lifting mechanism 403 and platform translation mechanism 404, energy First state is enough formed with both relative position relations of the second state.First state is mask member 302 and printed wiring board The state of 10 surface contact.Second state is the state that mask member 302 is left from printed wiring board 10.In addition, passing through Table-driving mechanism 303 drives the feelings that workbench 301 is moved and makes mask member 302 be contacted with the surface of printed wiring board 10 Under condition, the surface in main body portion 310 contacts with the surface of the printed wiring board 10.

Scraper 304 is configured at upper direction (+Y direction) side of mask member 302.

Scraper drive mechanism 305 includes：Upper lower drive mechanism 306, its make scraper 304 and mask member 302 surface it Between distance change；And horizontal drive mechanism 307, it makes scraper 304 be moved on the direction on the surface along mask member 302 It is dynamic.

In the present embodiment, the printing that solder print device 3 is carried out on the surface of printed wiring board 10 is screen printing Brush (screen printing).For example, in solder print device 3, workbench 301 is moved by table-driving mechanism 303, make to cover Die component 30 covers the printed wiring board 10 being configured on workbench 301.Then, solder print device 3 carries the solder of paste Mask member 30 is placed in, scraper 304 is moved in the state of the surface with mask member 30 contacts.Thus, the solder of paste Printed wiring board 10 is attached to by the hole 30h that mask member 30 has.As described above, solder print device 3 is by solder It is printed onto on the surface of printed wiring board 10.

Conveyer 33 is configured at the inner space 3s of solder print device 3 in printing equipment.Dress is transported in printing equipment Putting 33 can transport the printed wiring board 10 being moved in the inner space 3s of solder print device 3.Dress is transported in printing equipment Put the 33 downstream side transports of printed wiring board 10 that will be printed with solder.For example, conveyer 33 is defeated belt in printing equipment Send machine.

As shown in figure 3, solder container setting table 401 is configured at the outer peripheral face of housing 402.Thus, the energy of solder print device 3 It is enough that solder container setting table 401 is configured at the easy position that operation is carried out to solder print device 3 of user.The operation is for example It is the operation that solder is supplied to solder print device 3.Additionally, the identification code that the outer peripheral face including solder container 300 has is read Take device 405.More specifically, solder container setting table 401 has recess in center, and has this in the inner side of the recess Identification code reading device 405.Identification code reading device 405 is connected with information processor 400.

In the case where user has been set solder container 300 in the recess that solder container setting table 401 has, Identification code reading device 405 reads the identification code that the outer peripheral face of solder container 300 has.That is, identification code reading device 405 exists It is bar code reader in present embodiment.Identification code reading device 405 would indicate that the information of the identification code for reading is recognized Code information output is to information processor 400.

Information processor 400 is in the present embodiment PC (Personal Computer, personal computer).Whenever When the species of the solder being printed onto by solder print device 3 on printed wiring board 10 is changed, be would indicate that in advance by user Information of identification code registration (storage) of the species of the solder after change is in information processor 400.Solder after the change Species be the solder being printed onto on printed wiring board 10 by solder print device 3 species be changed after the species.

Additionally, information processor 400 obtains information of identification code from identification code reading device 405.Information processor 400 Judge that the identification code represented by the acquired information of identification code is the identification code letter that the first identification code is pre-registered with user Whether the represented identification code of breath is consistent the second identification code.Information processor 400 is in the first identification code and the second identification code In the case of consistent, for example, would indicate that the first identification code presentation of information consistent with the second identification code in display etc..The opposing party Face, information processor 400 the first identification code and the second identification code it is inconsistent in the case of, for example, would indicate that the first identification The code presentation of information inconsistent with the second identification code is in display etc..Additionally, in this case, information processor 400 is from raising Sound device sends the first identification code of expression and the inconsistent alarm of the second identification code (warning).Thus, solder print device 3 can press down User's supply processed and the different types of solder of species for specifying.And, solder print device 3 can be reduced the kind with regulation Possibility on the different types of solder printing of class to printed wiring board 10.

Housing 402 has inner space 406.The driving of workbench 301, workbench is internally at least accommodated with space 406 Platform lifting mechanism 403, mask member 302, scraper 304, scraper drive mechanism 305 and information processing that mechanism 303 has Device 400.

＜ component mounters ＞

Component mounter 4 is configured at the downstream of solder print device 3 across the second conveyer 92.

Element 11 is attached to be printed with component mounter 4 printed wiring board 10 of solder.Component mounter 4 has element Feedway 40, mouth 41, mobile device 42 and conveyer 43 in fitting machine.Component supplying apparatus 40 supply element 11 To the region of regulation.Mouth 41 being capable of absorptive element 11.Mobile device 42 can make mouth 41 in the horizontal direction (XY directions) with And above-below direction (Z-direction) is mobile.For example, mobile device 42 adsorbs the element supplied from component supplying apparatus 40 by mouth 41 11, the element 11 that will be adsorbed is attached to the target location of printed wiring board 10.

Conveyer 43 is configured in the inner space 4s of component mounter 4 in fitting machine.Conveyer 43 in fitting machine The printed wiring board 10 being moved in the inner space 4s of component mounter 4 can be transported.Conveyer 43 will pacify in fitting machine Printed wiring board 10 equipped with element 11 downstream transport by side.For example, conveyer 43 is ribbon conveyer in fitting machine.

＜ reflow ovens ＞

Reflow ovens 5 are configured at the downstream of component mounter 4 across the 3rd conveyer 93.

The printed wiring board 10 that reflow ovens 5 pairs are provided with element 11 is heated, and element 11 is welded with printed wiring board 10 It is connected together and forms circuit board 12.Reflow ovens 5 have transports dress in atmosphere control device 50, heater 51 and reflow ovens Put 52.(hereinafter referred to as " oxygen is dense in reflow ovens by the oxygen concentration in the inner space 5s of reflow ovens 5 for atmosphere control device 50 Degree ".) remain than reflow ovens 5 exterior space (air) in oxygen concentration it is low.For example, oxygen concentration exists in reflow ovens More than 100ppm and below 2000ppm.Oxygen concentration is in more than 100ppm and below 800ppm more preferably in reflow ovens.

Heater 51 by the temperature of the inner space 5s of reflow ovens 5 (hereinafter referred to as " backflow in-furnace temperature ".) remain The temperature of regulation.Heater 51 makes the inner space 5s of reflow ovens 5 turn into optimal Temperature Distribution.Backflow in-furnace temperature according to Solder and it is different.For example, using in the case of lead-free solder, heater 51 is by the entrance (upstream side) of reflow ovens 5 150 degree or so are remained, near exit (downstream) is remained 110 degree or so, by the position as maximum temperature of midway Remain 250 degree or so.

The printed wiring board 10 that heater 51 pairs completes after solder printing and element installation carries out overall heating.Plus Thermal 51 only makes solder partial melting.Thus, heater 51 is by the wiring of the portion of terminal of element 11 and printed wiring board 10 Part is combined by welding (reference picture 8), forms circuit board 12.

Conveyer 52 is configured in the inner space 5s of reflow ovens 5 in reflow ovens.Conveyer 52 can in reflow ovens Transport is moved to the printed wiring board 10 in the inner space 5s of reflow ovens 5.Conveyer 52 is by with can fill in reflow ovens The component of the hot heat resistance of tolerance heater 51 is divided to be formed.For example, the band that conveyer 52 is made of metal in reflow ovens Formula conveyer.

＜ intermediate hoppers ＞

Intermediate hopper 6 is configured at the downstream of reflow ovens 5 across the 4th conveyer 94.That is, intermediate hopper 6 is relative The side opposite with reflow ovens 5 is configured in the 4th conveyer 94.

Intermediate hopper 6 can receive multiple circuit boards 12.Because intermediate hopper 6 is same with above-mentioned dispensing accumulator 20 The structure of sample, therefore, omit detail explanation.

＜ appearance inspection devices ＞

Appearance inspection device 7 is configured at the downstream of intermediate hopper 6 across the 5th conveyer 95.

Appearance inspection device 7 checks the outward appearance of circuit board 12.Appearance inspection device 7 has camera head 70, computer 71 And conveyer 72 in appearance inspection device.Camera head 70 shoots circuit board 12.For example, camera head 70 is camera. Camera head 70 is connected with computer 71.Computer 71 has memory 71a and processor 71b.

For example, the shooting result of camera head 70 is (hereinafter referred to as " shooting image ".) it is exported to computer 71.Computer 71 pairs of benchmark images being stored in memory 71a are contrasted with shooting image, by circuit board 12 be judged to " certified products " or Person's " defective work ".Specifically, difference feelings the threshold value of regulation below of the computer 71 in benchmark image and shooting image Under condition, it is judged to " certified products ".Computer 71 in the case where the difference of benchmark image and shooting image exceedes the threshold value of regulation, It is judged to " defective work ".For example, computer 71 is when that the welding portion in circuit board 12 is present is bad or on the circuit board 12 In the case of being attached with foreign matter, it is judged to " defective work ".Thereby, it is possible to avoid the outflow of defective work.

In addition, the visual examination of circuit board 12 in reflow ovens 5 sometimes for than welding the time long.In the situation Under, it is possible to create between reflow ovens 5 and appearance inspection device 7 the need for the travelling speed of adjustment circuit plate 12.But, according to Present embodiment, due to configuring intermediate hopper 6 between reflow ovens 5 and appearance inspection device 7, therefore, even if in circuit board In the case of 12 visual examination needs for a long time, it is also possible to which the circuit board 12 that will be transported from reflow ovens 5 is accommodated in centre successively In accumulator 6.Therefore, though circuit board 12 visual examination need it is prolonged in the case of, it is not required that reflow ovens 5 with The travelling speed of adjustment circuit plate 12 between appearance inspection device 7, is preferred.

Conveyer 72 is configured in the inner space 7s of appearance inspection device 7 in appearance inspection device.Visual examination is filled Putting interior conveyer 72 can transport the circuit board 12 being moved in the inner space 7s of appearance inspection device 7.Visual examination is filled Put interior conveyer 72 and will be judged to that the circuit board 12 of " certified products " transports downstream side.For example, being transported in appearance inspection device Device 72 is ribbon conveyer.

＜ product accumulators ＞

Product accumulator 8 is configured at the downstream of appearance inspection device 7.Product accumulator 8 can receive multiple circuit boards 12. Because product accumulator 8 is the structure same with above-mentioned dispensing accumulator 20, therefore, omit detail explanation.

The circuit board 12 of " certified products " is judged as in being only accommodated in appearance inspection device 7 in product accumulator 8.Storage Circuit board 12 in product accumulator 8 outside production line L (offline) is made whether that (function is examined for the inspection that normally acts Look into).

＜ cooling bodies ＞

Circuitboard manufacturing devices 1 also have cooling body 100.100 pairs of circuit boards 12 transported from reflow ovens 5 of cooling body Cooled down.Cooling body 100 has：Multiple (being for example in the present embodiment 2) retainer 101A and retainer 101B (the first retainer 101A and the second retainer 101B)；And multiple (being for example in the present embodiment 3) air blower 110A, Air blower 110B and air blower 110C (the first air blower 110A, the second air blower 110B and the 3rd air blower 110C).

＜ retainers ＞

As shown in figure 9, the first retainer 101A, the second retainer 101B are configured along the 4th conveyer 94.First stops Dynamic device 101A is configured to be close to reflow ovens 5 relative to the second retainer 101B.Second retainer 101B is relative to the first retainer 101A is configured at the side opposite with reflow ovens 5.That is, the second retainer 101B is configured to than the first retainer 101A downstream Side.

First retainer 101A, the second retainer 101B can stop the circuit board 12 transported from reflow ovens 5.In this reality Apply in mode, circuit board 12 is singly transported successively from reflow ovens 5.Therefore, in the first retainer 101A, the second stop At device 101B, circuit board 12 singly stops.First retainer 101A, the second retainer 101B can be relative to the 4th fortune The transport path of the circuit board 12 in device 94 is sent to retreat.First retainer 101A, the second retainer 101B have arm 102, E axle supporting portion 103 and drive device 104.

As shown in Figure 10, arm 102 is in L-shaped.E axle supporting portion 103 supports the cardinal extremity of arm 102.E axle supporting portion 103 has There is rotation axis 103a along the X direction.Drive device 104 has can be such that arm 102 turns centered on rotation axis 103a Dynamic motor.

In the transport of circuit board 12, drive device 104 make arm 102 centered on rotation axis 103a clockwise (to The direction of arrow V1) rotate.Thus, the first retainer 101A, the second retainer 101B are from the circuit in the 4th conveyer 94 The transport path of plate 12 is kept out of the way.Therefore, the circuit board 12 for being transported from reflow ovens 5 is transported (reference picture towards intermediate hopper 6 9)。

When circuit board 12 stops, drive device 104 make arm 102 centered on rotation axis 103a counterclockwise (to The direction of the rightabout arrow V2 of arrow V1) rotate.Thus, the first retainer 101A, the second retainer 101B enter the 4th The transport path of the circuit board 12 in conveyer 94.Therefore, the circuit board 12 for transporting from reflow ovens 5 is by the first retainer 101A, the second retainer 101B stop (reference picture 9).

In the stopping of circuit board 12, the end of arm 102 approaches with the part of the +Y direction side of the 4th conveyer 94. Width (length of Y-direction) of the length (from cardinal extremity to the length of the Y-direction of end) of arm 102 than the 4th conveyer 94 It is short.Thus, compared with situation of the length of arm 102 more than the width of the 4th conveyer 94 is made, arm 102 can be made Successfully rotate (that is, the mobility for improving arm 102).Therefore, it is possible to make the first retainer 101A, the second retainer 101B phases Transport path for the circuit board 12 in the 4th conveyer 94 is successfully retreated.

＜ air blowers ＞

As shown in figure 9, the first air blower 110A, the second air blower 110B are configured along the 4th conveyer 94.First drum Blower fan 110A is adjacent with the first retainer 101A.Second air blower 110B is adjacent with the second retainer 101B.First air blower 110A, the second air blower 110B blow towards the circuit board 12 transported from reflow ovens 5.

First air blower 110A, the second air blower 110B and the 3rd air blower 110C have the wind around the rotation of axis 111 Fan 112.Fan 112 is blown on along the direction of axis 111.For example, fan 112 is the aerofoil fans such as propeller type fan.

In the side view of Fig. 9, the first air blower 110A, the conveyer of axis 111 and the 4th of the second air blower 110B 94 transport face 94a intersects.Specifically, the transport of the axis 111 relative to the 4th conveyer 94 of the first air blower 110A Face 94a is inclined.In the side view of Fig. 9, the axis 111 of the first air blower 110A is more leaning on +X direction side then more deflection-Z sides To mode incline.On the other hand, the transport face 94a essence of the conveyer 94 of axis 111 and the 4th of the second air blower 110B It is upper vertical.

In cooling circuit board 12, in addition to stopping the driving of the 4th conveyer 94, also carry out based on the first stop The stopping of device 101A, the second retainer 101B.In cooling circuit board 12, the first air blower 110A is towards by the first retainer The circuit board 12 that 101A stops is blown.On the other hand, the second air blower 110B is towards by the circuit of the second retainer 101B stoppings Plate 12 is blown.

3rd air blower 110C is configured at around intermediate hopper 6.In fig .9, for convenience, only illustrate and be configured at 3rd air blower 110C of the top of intermediate hopper 6.3rd air blower 110C directions are accommodated in the groove of intermediate hopper 6 Circuit board 12 is blown.For example, from from the viewpoint of efficiently cooling circuit board 12, the axis of the 3rd air blower 110C can direction The entrance of groove is inclined.

As described above, the solder print device 3 that the circuitboard manufacturing devices 1 of above-mentioned implementation method have is used In by solder printing to the surface of printed wiring board 10, the solder print device 3 has：Solder container 300, it is used to carry Solder；Workbench 301, printed wiring board 10 is configured on the workbench 301；Mask member 302；Platform lifting mechanism 403, It makes the change of the distance between workbench 301 and mask member 302；Scraper 304；Scraper drive mechanism 305；Information processor 400；Solder container setting table 401, it includes identification code reading device 405；And housing 402, it has inner space 406, Solder container 300 has the identification code of the species for representing solder in outer peripheral face, and mask member 302 is the piece with multiple hole 30h, Scraper drive mechanism 305 includes：Upper lower drive mechanism 306, it makes the distance between surface of scraper 304 and mask member 302 Change；And horizontal drive mechanism 307, it makes scraper 304 be moved up in the side on the surface along mask member 302, in shell At least be accommodated with the inner space 406 of body 402 workbench 301, platform lifting mechanism 403, mask member 302, scraper 304, Scraper drive mechanism 305 and information processor 400, identification code reading device 405 are connected with information processor 400.

Thus, in circuitboard manufacturing devices 1, solder print device 3 can suppress the species of user's supply and regulation Different types of solder.

Additionally, in solder print device 3, solder container setting table 401 is configured at the outer peripheral face of housing 402, solder holds Device setting table 401 has recess in center, and has identification code reading device 405 in the inner side of the recess.

Thus, solder container setting table 401 can be configured at user and easily solder printing is filled by solder print device 3 Putting 3 carries out the position of operation.The operation is, for example, the operation that solder is supplied to solder print device 3.

More than, the implementation method to the utility model has carried out detailed narration referring to the drawings, but specific structure is not limited to The implementation method, without departing from the purport of the utility model, can be changed, replaced, be deleted.

Claims (2)

1. a kind of solder print device, it is used for the surface of printing cream-like solder to printed wiring board, it is characterised in that should Solder print device has：

Solder container, it is used to carry cream solder；

Workbench, the printed wiring board is configured on the workbench；

Mask member；

Platform lifting mechanism, it makes the change of the distance between the workbench and described mask member；

Scraper；

Scraper drive mechanism；

Information processor；

Solder container setting table, it includes identification code reading device；And

Housing, it has inner space,

The solder container has the identification code of the species for representing cream solder in outer peripheral face,

The mask member is the piece with multiple holes,

The scraper drive mechanism includes：Upper lower drive mechanism, it makes between the surface of the scraper and the mask member Distance change；Horizontal drive mechanism, it makes the scraper be moved up in the side on the surface along the mask member,

At least be accommodated with the inner space of the housing workbench, the platform lifting mechanism, the mask member, The scraper, the scraper drive mechanism and described information processing unit,

The identification code reading device is connected with described information processing unit.

2. solder print device according to claim 1, it is characterised in that

The solder container setting table has recess in center, and in the inner side of the recess there is the identification code to read dress Put.