JP2007214426A - Surface mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact surface mounting device even though it comprises a plurality of mounting parts. <P>SOLUTION: The surface mounting device comprises a plurality of mounting units 4 to 7 having a conveying means 23 for conveying a printed-wiring board 3, a number of tape feeders 24, and an electronic component transferring device 26. The means 23 supports the board 3 so that it is movable between the conveying position and the mounting position in an X-direction, and moves it in a Y-direction. The device 26 moves an absorption head 48 having an absorption nozzle in the X and the Y direction. The units 4 to 7 are arranged so that the conveying means 23 in the conveying position are positioned in an identical position in the Y diection, and arranged in the X-direction. The mutually adjacent mounting units are formed in line symmetry with a central focus on a conveying path 51 so that they are positioned in a staggering shape in the flat view. A substrate moving device 14 for moving the board 3 positioned in the path 51 in the X direction is provided. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a surface mounter capable of simultaneously mounting electronic components on a plurality of printed wiring boards.

  Conventionally, as a surface mounter capable of simultaneously mounting electronic components on a plurality of printed wiring boards, there is one disclosed in Patent Document 1, for example. The surface mounter shown in this Patent Document 1 is positioned so as to be parallel to the main conveyor that constitutes a conveyance line that extends from the apparatus that performs the pre-process to the apparatus that performs the post-process. A sub-conveyor connected to the main conveyor via a substrate transfer device, a first mounting portion provided in the middle portion of the main conveyor, a second mounting portion provided in the middle of the sub-conveyor, etc. ing.

  The substrate transfer device is configured so that a printed wiring board can be transferred between the two conveyors, and the transfer direction of the conveyor (hereinafter, a direction parallel to the transfer direction is simply referred to as the X direction). Is composed of a slide mechanism or the like that moves in an intersecting direction (hereinafter, this direction is simply referred to as a Y direction), and is used for carrying in connecting the upstream end portions of the first and second mounting portions. There are two units, one for carrying out and the one for carrying out connecting downstream end parts.

  The first mounting portion and the second mounting portion are configured to mount electronic components on a printed wiring board on one side of the main conveyor or the sub-conveyor. In these mounting parts, a component supply part consisting of a large number of tape feeders arranged along these conveyors on one side of both conveyors, and the printed wiring board is moved in the Y direction between the transport position and the mounting position. A Y-direction moving device to be moved, and an electronic component transfer device for transferring an electronic component from the component supply unit to a printed wiring board at a mounting position. This electronic component transfer apparatus has a structure in which a suction head having a suction nozzle moves only in the X direction.

In the conventional surface mounter configured as described above, the printed wiring board sent from the device in the previous process is transported to one of the main conveyor and the sub-conveyor by the board transport device for carrying in, and the first conveyor by the conveyor. Sent to the first or second mounting unit. The printed wiring board sent to each mounting portion is moved from the transport position to the mounting position by the Y-direction moving device, and positioned in the Y direction so that the part where the electronic component is mounted is positioned below the electronic component transfer device. Is done. At this time, the electronic component is adsorbed by the electronic component transfer device, moved in the X direction from the component supply unit, and transferred to the printed wiring board. That is, in this conventional surface mounter, positioning is performed in the two directions X and Y by the suction head moving in the X direction and the printed wiring board moving in the Y direction.
After component mounting, the printed wiring board is moved to the transfer position by the Y-direction moving device, sent to the unloading substrate transfer device by the main conveyor or the sub-conveyor, and further a device that performs a post-process from the unloading substrate transfer device It is conveyed to.
JP 2001-68898 A

  However, the conventional surface mounting machine described above can be mounted at two mounting parts at the same time, so that high productivity can be obtained. However, since the two mounting parts are connected in parallel, the size becomes large. There was a problem that the exclusive area in the factory became wide.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a compact surface mounter despite having a plurality of mounting portions.

  In order to achieve this object, a surface mounting machine according to the present invention supports a printed wiring board so as to be movable in a first direction consisting of a conveyance direction, and a second direction intersecting the first direction. A transport unit that moves between a transport position and a mounting position separated from each other, an electronic component supply device that is provided at a position adjacent to the transport unit in the second direction, and a suction head that sucks the electronic component. An electronic component transfer device that moves the suction head in the first direction and the second direction to transfer the electronic component from the electronic component supply device to the printed wiring board at the mounting position. A plurality of mounting units having the first direction so that the transport means positioned at the transport position are located at the same position in the second direction and constitute the transport path of the printed wiring board. Lined up Among these mounting units, the mounting units adjacent to each other are formed symmetrically about the transport path so as to be positioned in a staggered pattern in plan view, and the printed wiring board positioned in the transport path is arranged in the first direction. And a substrate moving device for moving the substrate.

  The surface mounting machine according to a second aspect of the present invention is the surface mounting machine according to the first aspect, in which the printed circuit board is the board moving device in a state where the conveying means of each mounting unit is positioned at the conveying position. They are provided at positions close to each other so as to move directly from one transport means to the other transport means by driving.

According to the present invention, since all the mounting units are arranged in the first direction (conveying direction) and there is one conveying path, the entire apparatus can be reduced in size in the second direction. In addition, a part of the adjacent mounting unit can be disposed in a space formed on the opposite side of each mounting unit across the conveyance path. For this reason, even though the plurality of mounting units are arranged in the first direction, the size can be reduced also in the first direction.
Therefore, according to the present invention, it is possible to provide a surface mounter that is highly productive and compact.

According to the second aspect of the present invention, the printed wiring board can be sent directly from the mounting unit located on the upstream side to the mounting unit located on the downstream side. For this reason, in the surface mounter according to the present invention, compared to a surface mounter provided with a member for transferring a printed wiring board between mounting units, it can be formed compactly by the amount of the member, The moving time of the printed wiring board can be shortened by the amount of movement of the printed wiring board on the member.
Therefore, according to the present invention, it is possible to provide a surface mounter with higher productivity and more compactness.

Hereinafter, an embodiment of a surface mounter according to the present invention will be described in detail with reference to FIGS.
FIG. 1 is a plan view showing a schematic configuration of a surface mounter according to the present invention. In FIG. 2 is a plan view of the surface mounter according to the present invention, and FIG. 3 is a sectional view taken along line III-III in FIG.

In these drawings, the reference numeral 1 indicates a surface mounter according to this embodiment, and 2 indicates a surface mounter that performs a pre-process mounting.
The surface mounter 1 according to the present invention sends the printed wiring board 3 from the upstream end adjacent to the surface mounter 2 that performs the pre-process mounting described later toward the downstream end (the other end). Electronic components (not shown) are respectively mounted on the printed wiring board 3 by the first to fourth mounting units 4 to 7 arranged in the transport direction. A direction parallel to the transport direction is hereinafter simply referred to as an X direction, and a direction intersecting the transport direction is simply referred to as a Y direction below. In this embodiment, the X direction is the first direction in the present invention, and the Y direction is the second direction in the present invention.

  A surface mounter 1 according to the present invention includes a base 11 for supporting each device to be described later, the four mounting units 4 to 7 described above, and a surface mounter 2 for mounting in the previous process from a printed wiring board. 3 for receiving the printed wiring board 3 from the carry-in device 12 for receiving 3 and sending it to the first mounting unit 4 located on the most upstream side, and the fourth mounting unit 7 located on the most downstream side, for example, a post-process not shown. An unloading device 13 for unloading the printed wiring board 3 and a substrate moving device 14 for moving the printed wiring board 3 between these devices in the X direction.

  As shown in FIG. 3, the base 11 has a transfer stage 15 formed so as to be relatively low, and first to sixth Y frames 16 to 21 (upwardly projecting from the stage 15). 1). As shown in FIGS. 1 and 2, these first to sixth Y frames 16 to 21 are provided at six locations in the X direction on the base 11 so as to extend in the Y direction. Among these Y frames 16 to 21, the first, third, and fifth Y frames 16, 18, and 20 located first, third, and fifth from the upstream side in the transport direction are One end portion in the Y direction (hereinafter, this end portion is referred to as the front side of the apparatus) extends to the other end side, and the other second, fourth, and sixth Y frames 17, 19, and 21 are in the Y direction on the rear side of the apparatus. It is formed so as to extend from one end of the front side of the apparatus. Further, as shown in FIG. 3, a concave portion 22 for passing the printed wiring board 3 is formed in a portion corresponding to the central portion in the Y direction of the base 11 in the first to sixth Y frames 16 to 21. Has been.

  The four mounting units 4 to 7 are formed to have the same structure except that the mounting position on the base 11 and the arrangement direction of the members are different. Therefore, here, the first mounting unit 4 located on the most upstream side will be described, and the other mounting units 5 to 7 will be assigned the same reference numerals and detailed description thereof will be omitted.

  2 and 3, the mounting unit 4 is provided so as to be adjacent to a conveying means 23 for conveying the printed wiring board 3 and one side (front side of the apparatus) of the conveying means 23. , And an electronic component transfer device 26 for transferring the electronic components from the tape feeder 24 to the printed wiring board 3.

  As shown in FIG. 3, the transport means 23 is supported by a pair of guide rails 31, 31 provided on the transport stage 15 so as to extend in the Y direction, and movably supported by these guide rails 31. A table 32, a Y-direction drive device 33 for moving the table 32 in the Y direction, a conveyor 34 provided on the table 32, and a clamp for restricting the movement of the printed wiring board 3 relative to the table 32. And a mechanism 35.

  The Y-direction drive device 33 includes a ball screw shaft 33a that is rotatably supported by the transfer stage 15 in a state extending in the Y direction, a motor 33b that rotates the ball screw shaft 33a, and a ball screw shaft 33a. A ball nut 33c and the like that are screwed together and rotatably supported by the table 32 in a state where movement in the axial direction is restricted are provided. The Y-direction drive device 33 is configured to reciprocate the table 32 between a transport position indicated by a solid line in FIG. 1 and a mounting position indicated by a two-dot chain line in FIG. . The transport position is positioned at the center of the base 11 in the Y direction, and the mounting position is positioned near the tape feeder 24.

  As shown in FIG. 3, the conveyor 34 is composed of a pair of vertical members 34a erected on the table 32 and a pair of endless belts 34b rotatably provided inside the vertical members 34a. Has been. The endless belt 34b supports both ends of the printed wiring board 3 in the Y direction, and is rotated when the printed wiring board 3 is pressed in the X direction (conveyance direction) by driving a substrate moving device 14 described later. .

A guide surface for restricting the printed wiring board 3 from moving in the Y direction on the endless belt 34b is formed at the upper end of the vertical member 34a.
Of the pair of vertical members 34a, one vertical member 34a adjacent to the tape feeder 24 of the mounting unit 4 is fixed to the table 32, and the other vertical member 34a is attached to the table 32 via a width adjustment mechanism 36. ing. The width adjusting mechanism 36 is for adjusting the position of the other vertical member 34 a in accordance with the width dimension of the printed wiring board 3 in the Y direction, and moves the vertical member 34 a in the Y direction with respect to the table 32. It is configured to be able to. That is, in the conveyor 34, the position of the printed wiring board 3 in the Y direction is determined with reference to the one vertical member 34a adjacent to the tape feeder 24, and the printed wiring board 3 always changes even if the size of the printed wiring board 3 changes. 3 is held close to the tape feeder 24.

  As shown in FIG. 3, the clamp mechanism 35 includes a pair of pressure receiving members 35a and 35a positioned above both ends of the printed wiring board 3 in the Y direction, and the printed wiring board 3 is pushed up from below to receive the pressure receiving member 35a. And a push-up device 35b for pressing against the table 32 and supported by the table 32. Of the pair of pressure receiving members 35a, 35a, the pressure receiving member 35a located on the opposite side of the tape feeder 24 is supported by the table 32 via the width adjusting mechanism 36 described above, and the other vertical member 34a. At the same time, it moves in the Y direction according to the size of the printed wiring board 3.

  As shown in FIGS. 2 and 3, the electronic component transfer device 26 of the first mounting unit 4 is provided at the upper ends of the first and third Y frames 16 and 18 so as to extend in the Y direction. A pair of first guide rails 41, 41, and a support member that is horizontally mounted between the first guide rails 41, 41, extends in the X direction, and is movably supported by the first guide rail 41. 42, a pair of Y-direction drive devices 43, 43 for driving the support member 42, a second guide rail 44 provided on the support member 42 and extending in the X direction, and moved to the second guide rail 44 A head unit 45 that is freely supported, an X-direction drive device 46 that drives the head unit 45, and a plurality of suction heads that are supported by the head unit 45 so as to be movable up and down via a lifting device 47 (see FIG. 3). 4 It is constituted by such. As shown in FIG. 3, the suction head 48 includes a suction nozzle 48 a that sucks electronic components, and a rotation drive device 48 b that rotates the suction nozzle 48 a about the vertical axis.

  The Y-direction drive device 43 includes a motor 43a fixed to one end portion (end portion on the front side of the device) of the first and third Y frames 16 and 18, and one end portion connected to the motor 43a in the Y direction. A ball screw shaft 43b that extends and is rotatably supported by the Y frames 16 and 18, a ball nut 43c (see FIG. 3) that is rotatably supported by the support member 42 and screwed into the ball screw shaft 43b, and the like. It is constituted by.

  The X-direction drive device 46 includes a motor 46a fixed to one end portion in the X direction of the support member 42, and one end portion connected to the motor 46a and extending in the X direction, and is rotatably supported by the support member 42. And a ball nut (not shown) that is rotatably supported by the head unit 45 and screwed to the ball screw shaft 46b.

The electronic component transfer device 26 according to this embodiment transfers the electronic component from the tape feeder 24 to the printed wiring board 3 at the mounting position by moving the suction head 48 in the X direction and the Y direction.
Although not shown, the head unit 45 of the electronic component transfer device 26 is attracted by an imaging device for detecting the position of the printed wiring board 3 positioned at the mounting position and the suction nozzle 48a. And an imaging device for detecting the position of the electronic component. This imaging device can also be provided on the base 11.

  As shown in FIGS. 1 and 2, the four mounting units 4 to 7 configured in this manner are arranged in a staggered pattern on the base 11 from the upstream side to the downstream side in the transport direction in plan view. It is mounted with. More specifically, as shown in FIG. 1, these four mounting units are arranged in the Y direction with the conveyors 34 (printed wiring boards 3) of the respective transport means 23 moved to the transport positions. It is arranged on the base 11 so as to be located at the same position (in a line in the X direction).

  The conveyors 34 of the mounting units 4 to 7 are provided at positions close to each other in a state where the conveyors 34 are positioned at the transfer position. That is, the printed wiring board 3 placed on the conveyor 34 moves directly from the upstream conveyor 34 to the downstream conveyor 34 by being pushed from the upstream side in the transport direction. The printed wiring board 3 is driven by a substrate moving device 14 described later.

In the surface mounter 1 according to this embodiment, as shown in FIG. 1, the X in the center in the Y direction of the base 11 is moved by the conveyor 34 of each mounting unit 4 to 7 moved to the transport position as described above. A conveyance path 51 extending in the direction is configured.
Of the four mounting units 4 to 7, the first mounting unit 4 and the third mounting unit 6, and the second mounting unit 5 and the fourth mounting unit 7 are centered on the conveyance path 51. As shown in FIG.

Furthermore, in a space formed on the opposite side of the tape feeder 24 across the conveyance path 51 in each mounting unit 4 to 7, a part of other mounting units (Y frames 17 to 20 and electronic component transfer device) 26 Y-direction drive devices 43, etc.) are positioned.
In addition, the Y direction driving devices 43 and 43 adjacent to each other in the first mounting unit 4 and the third mounting unit 6 are mounted on the third Y frame 18. Similarly, the Y direction driving devices 48 adjacent to each other in the second mounting unit 5 and the fourth mounting unit 7 are mounted on the fourth Y frame 19.

As shown in FIGS. 2 and 3, the substrate moving device 14 includes a moving device main body 14 a supported at the distal ends of the second to fourth Y frames 17 to 20, and extends downward from the moving device main body 14 a. And a pressing element 14b for each mounting unit.
The moving device body 14a includes an elevating mechanism (not shown) that moves the presser 14b up and down, and a parallel moving mechanism (not shown) that moves the presser 14b in the X direction. As shown in FIG. 3, the elevating mechanism elevates and lowers the presser 14 b between a conveying position where the pressing element 14 b is lowered below the printed wiring board 3 and a retracted position where the pressing element 14 b is elevated above the printed wiring board 3.

  The parallel movement mechanism moves the pressing element 14b lowered to the conveying position to one side in the X direction (downstream in the conveying direction) by a predetermined distance, and the initial pressing element 14b that has moved up to the retracted position after this movement. Return to position.

  As shown in FIG. 2, the pressing element 14b is in the middle of the conveyance path 51 and pushes the upstream end in the conveyance direction of the printed wiring board 3 at the conveyance position in each of the mounting units 4 to 7 to the downstream side. It is arranged at such a position that it can. Note that the moving device main body 14a is not limited to the structure that drives the four pressing elements 14b by a single unit as described above, and may adopt a structure that drives the pressing elements 14b for each mounting unit. .

  The carry-in device 12 and the carry-out device 13 include a table 52 provided on the transfer stage 15 of the base 11 so as to be movable in the Y direction by the same support structure as the transfer means 23 of each of the mounting units 4 to 7 described above. A conveyor 53 mounted on the table 52 and a Y-direction drive device 54 that moves the table 32 in the Y direction are configured. The Y-direction drive device 54 of these carry-in and carry-out devices 12 and 13 includes a carry position located on the carry path 51 and a carry-in / carry-out position spaced from the carry path 51 to the front side of the apparatus (lower side in FIG. 2). The structure which moves the table 52 between is taken.

  The conveyor 53 of the carry-in and carry-out devices 12 and 13 includes endless belts 53a and 53a that support both ends of the printed wiring board 3 in the Y direction, and a driving device (not shown) for rotating the endless belts 53a and 53a. ). Further, the conveyor 53 includes a width adjusting mechanism (not shown) so that the position of the endless belt 53a located on one end side in the Y direction can be changed in accordance with the width of the printed wiring board 3. ing.

  The conveyor 53 is first so that the printed wiring board 3 can move directly between the conveyors 34 of the first or fourth mounting units 4 and 7 adjacent to each other while being located at the transfer position. The fourth mounting units 4 and 7 are disposed at positions close to the conveyor 34 in the X direction.

  As shown in FIG. 1, the carry-in device 12 is configured to be connected to a surface mounter 2 that performs mounting in a previous process while the conveyor 53 is moved to a carry-in position. The conveyor 53 is configured to be connected to a device that performs a post-process with the conveyor 53 moving to the carry-out position.

  As shown in FIG. 1, the surface mounter 2 that performs mounting in the previous process includes a conveyor 61 that extends in the X direction, and two mounting units 62 and 63 that are positioned in the middle of the conveyor 61 and are arranged in the X direction. I have. Each mounting unit 62, 63 of the surface mounting machine 2 includes a large number of tape feeders 24, 24 positioned at both ends in the Y direction, and an electronic component transfer device 65 having two head units 64, respectively. ing.

  Although not shown, the head unit 64 includes a plurality of suction heads having suction nozzles and devices for rotating and raising and lowering the suction heads. On the base 65, the X direction and the Y direction are provided. Configured to move to.

  An operation panel (not shown) is provided on the front side of the surface mounter 2 that performs the pre-process mounting and the front side of the surface mounter 1 according to the present invention. In this embodiment, the surface mounter 2 that performs the pre-process mounting and the surface mounter 1 according to the present invention are positioned so that the end portion on the front side of the apparatus is located at the same position in the Y direction. . For this reason, in both these apparatuses 1 and 2, there is nothing which obstruct | occludes a movement path | route of an operator in operating the operation panel of these both apparatuses 1 and 2.

  In the surface mounter 1 configured as described above, the printed wiring board 3 sent from the surface mounter 2 that performs the pre-process mounting is transported from the transport position to the transport position on the transport path 51 by the transport device 12. Is done. Thus, after the printed wiring board 3 is sent on the conveyance path 51, the conveyor 53 of the carry-in device 12 is in a state where the conveyor 53 of the carry-in device 12 and the conveyor 34 of the first mounting unit 4 are aligned. The printed wiring board 3 is rotated and sent to the conveyor 34 of the first mounting unit 4. Then, after the printed wiring board 3 passes below the presser 14b of the board moving device 14, the presser 14b descends and continues to move in the X direction.

  The printed wiring board 3 is moved from the conveyor 53 of the carry-in device 12 to the conveyor 34 of the first mounting unit 4 by driving the board moving device 14. At this time, the width of the conveyor 34 of the first mounting unit 4 is adjusted in advance to match the size of the printed wiring board 3 in the Y direction, and the center of the width direction (Y direction) is the conveyor 53 of the loading device 12. It is positioned in the Y direction by the Y direction driving device 33 so as to coincide with the center in the width direction.

  After the printed wiring board 3 is transported to the conveyor 34 of the first mounting unit 4, the Y-direction drive device 33 moves the table 32 from the transport position to the mounting position, and the electronic component transfer device 26 transfers the electronic component to the tape feeder. 24 to the printed wiring board 3. After the mounting of the electronic components is completed, the Y-direction drive device 33 moves the table 32 from the mounting position to the transport position.

The printed wiring board 3 thus moved to the transport position is pushed in the X direction by the board moving device 14 and moved to the conveyor 34 of the second mounting unit 5. During this conveyance, the next printed wiring board 3 is simultaneously conveyed from the carry-in device 12 to the first mounting unit 4.
In the second to fourth mounting units 5 to 7, the same mounting operation as the mounting operation of the first mounting unit 4 described above is performed. The printed wiring board 3 that has been mounted in the fourth mounting unit 7 is pushed by the board moving device 14 and moved to the conveyor 53 of the carry-out device 13, and the conveyor 53 is driven to drive a predetermined X-direction in the carry-out device 13. Sent to location. Thereafter, the conveyor 34 of the carry-out device 13 is moved to the carry-out position by driving the Y-direction drive device 54, and further, the printed wiring board 3 is sent to a device that performs a post-process by driving the conveyor 53.

  In the surface mounting machine 1 configured as described above, all the mounting units 4 to 7 are arranged in a staggered pattern in a plan view and arranged in the X direction, and the transport path 51 extending in the X direction is one. Therefore, it is possible to reduce the size in the Y direction. Further, in the surface mounter 1 according to this embodiment, a part of the adjacent mounting unit is disposed in a space formed on the opposite side of each of the mounting units 4 to 7 with the conveyance path 51 interposed therebetween. . For this reason, according to this surface mounting machine 1, although the some mounting units 4-7 have taken the structure located in a line with a X direction, size reduction can be achieved also in a X direction.

Therefore, according to this embodiment, since electronic components can be mounted simultaneously in the four mounting units 4 to 7, high productivity can be obtained and a compact surface mounter 1 can be manufactured. It was.
In the surface mounter 1 according to this embodiment, the printed wiring board 3 can be sent directly from the mounting unit located on the upstream side to the mounting unit located on the downstream side. For this reason, in this surface mounting machine 1, compared with the surface mounting machine provided with the member which delivers a printed wiring board between mounting units, it can form compactly only for the said member, and the said member The moving time of the printed wiring board can be shortened by the amount of movement of the printed wiring board.

  In the surface mounter 1 according to this embodiment, as shown in FIGS. 1 and 2, since the four mounting units 4 to 7 are provided on the base 11 so as to be staggered, Empty spaces 71 and 72 are formed at corners located on the diagonal of the table 11. In the spaces 71 and 72, although not shown, a component supply device other than the tape feeder 24, a device for replacing the suction nozzle 48a, and the like can be disposed. Further, since these spaces 71 and 72 are formed by the transfer stage 15 of the base 11, they can also be used as work tables for maintenance.

  In the above-described embodiment, an example in which four mounting units 4 to 7 are provided is shown. However, the surface mounter 1 according to the present invention can be realized if at least two mounting units are provided. For example, it can be configured by arranging three, five, or six mounting units in a staggered pattern.

Moreover, although the example which connects the surface mounter 1 which concerns on this invention to the surface mounter 2 which performs mounting of a pre-process was shown in embodiment mentioned above, the form which uses the surface mounter 1 which concerns on this invention Is not limited to the form described above.
In addition, in the surface mounter 1 described above, when one of the four mounting units 4 to 7 needs to be stopped for maintenance, for example, the conveyor 34 of this mounting unit is used. When the printed wiring board 3 is passed through the conveyer 34 while being positioned at the transfer position, the mounting can be performed only by the other three mounting units.

It is a top view which shows schematic structure of the surface mounting machine which concerns on this invention. It is a top view of the surface mounting machine concerning the present invention. It is the III-III sectional view taken on the line in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Surface mounter, 3 ... Printed wiring board, 4-7 ... 1st-4th mounting unit, 11 ... Base, 12 ... Carry-in apparatus, 13 ... Carry-out apparatus, 14 ... Substrate moving apparatus, 23 ... Conveyance means , 24 ... Tape feeder, 25 ... Electronic component supply device, 26 ... Electronic component transfer device, 34, 53 ... Conveyor, 51 ... Conveyance path.

Claims (2)

Conveying means for supporting the printed wiring board so as to be movable in a first direction consisting of a conveying direction and moving the printed wiring board between a conveying position and a mounting position separated in a second direction intersecting the first direction; ,
An electronic component supply device provided at a position adjacent to the conveying means in the second direction;
A suction head for sucking an electronic component is provided, and the suction head is moved in the first direction and the second direction to transfer the electronic component from the electronic component supply device to the printed wiring board at the mounting position. A plurality of mounting units each having an electronic component transfer device
These mounting units are
The conveying means positioned at the conveying position are positioned at the same position in the second direction and are arranged in the first direction so as to constitute the conveying path of the printed wiring board,
Among these mounting units, the mounting units adjacent to each other are formed symmetrically about the conveyance path so as to be positioned in a staggered pattern in plan view,
A surface mounting machine comprising a substrate moving device for moving a printed wiring board positioned on the conveyance path in a first direction. The surface mounter according to claim 1,
The transport means of each mounting unit is provided at a position close to each other so that the printed wiring board moves directly from one transport means to the other transport means by driving the substrate moving device in a state where the transport means is positioned at the transport position. Surface mount machine.

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