KR102294188B1 - Probe Head And Probe Apparatus Including The Same - Google Patents

Abstract

The present invention relates to a probe head and a probe inspection apparatus including the same, comprising: a stage on which a substrate for temperature detection or an inspection substrate is seated; a fluid ejection means for imparting a specific temperature condition to the temperature detection substrate or the inspection substrate; a temperature sensor contacting the temperature detection substrate to detect a temperature of the temperature detection substrate; and a driving module for moving the temperature sensor; and a probe pin which is in contact with the inspection substrate and performs inspection of the inspection substrate.

Description

A probe head and a probe inspection device including the same

The present invention relates to a probe head and a probe inspection apparatus including the same.

In general, flat panel display (FPD) is a next-generation display device developed to replace the cathode ray tube (CRT) used in TV or computer monitors. Of course, as it has advantages such as relatively small power consumption, it is widely used in various industries.

In recent years, various display devices such as liquid crystal display (LCD), plasma display panel (PDP), organic light-emitting diode (OLED), and field emission display (FED) have been released. It goes through a process of inspecting the appearance and electrical defects of the finished panel in the manufacturing process.

On the other hand, Korean Patent Laid-Open Publication No. 10-2010-0095866 discloses a flat panel display inspection that measures and inspects changes in electrical characteristics according to the effects of temperature and light on a circuit pattern formed on a flat panel display substrate as shown in FIG. 1 . Probe devices are known.

Referring to Figure 1, the conventional flat panel display inspection probe device is in electrical contact with the stage 1 on which the flat panel display substrate (S) is placed and the circuit pattern formed on the substrate (S) to inspect the characteristics of the circuit pattern. A probe head 3 having a probe pin, a linear driving means 4 for moving the probe head 3 along the X-axis and Y-axis directions on the stage 1, and a reference provided in the stage 1 The temperature measurement point (P) and the reference temperature measurement unit (5) for measuring the temperature of the reference temperature measurement point (P) are installed in the probe head (3) and specified by heating or cooling the contact portion between the probe pin and the circuit pattern The substrate (S) by calculating the correlation between the reference temperature of the reference temperature measurement point (P) and the specific temperature by the thermo stream spraying means (6), including the thermo stream spraying means (6) for imparting a temperature condition Outputs the temperature measurement time of

That is, the conventional probe device for flat panel display inspection does not directly measure the temperature of the substrate (S) to be inspected, but rather the reference temperature measured at the reference temperature measurement point (P) provided in the stage (1) and the thermo stream spraying means (6) calculates the temperature measurement time of the substrate (S) through the correlation of the specific temperature.

Accordingly, the conventional probe apparatus for flat panel display inspection has a problem in that it cannot calculate the exact temperature of the substrate S to be inspected.

In particular, in the flat panel display substrate (S), a difference occurs between the specific temperature condition created by the thermo stream spraying means (6) and the actual temperature on the substrate (S) according to the thickness or the formed circuit pattern.

Accordingly, the conventional flat panel display inspection probe apparatus has a problem in that the inspection result is different depending on the thickness of the substrate S to be inspected or the formed circuit pattern.

Republic of Korea Patent Publication No. 10-2010-0095866 (published on September 01, 2010)

An object of the present invention is to provide a probe head capable of accurately calculating the temperature of a substrate even when inspecting display substrates having different thicknesses or formed circuit patterns, and a probe inspection apparatus including the same.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned may be understood by the following description, and will be more clearly understood by the embodiments of the present invention.

Moreover, it will be readily apparent that the objects and advantages of the present invention may be realized by the means and combinations thereof indicated in the claims.

In order to solve the above problems, the present invention provides a probe head capable of calculating an accurate temperature of a display substrate and a probe inspection apparatus including the same.

More specifically, the probe head according to the present invention comprises: a fluid ejection means for imparting a specific temperature condition to a temperature detection substrate or an inspection substrate; and a temperature sensor contacting the temperature detection substrate to detect the temperature of the temperature detection substrate; and a driving module for moving the temperature sensor and a probe pin contacting the inspection substrate to inspect the inspection substrate.

In addition, the fluid ejection means includes a heater provided therein, a fluid supply port and a fluid ejection port formed at the upper and lower ends, respectively, and a fluid temperature sensor for detecting a temperature of the fluid injected into the heater or the fluid ejection port.

In addition, the driving module includes an electromagnet and a slider having a flange formed on the upper side and the temperature sensor coupled to the lower side so as to be movable up and down from the lower side of the electromagnet.

In addition, the temperature sensor is preferably a contact-type temperature sensor of any one of a thermocouple, a resistance temperature detector (RTD), and a thermistor.

In addition, the fluid ejection means may apply the same temperature condition to the probe pin and the substrate for temperature detection or the inspection substrate.

Meanwhile, the probe inspection apparatus according to the present invention includes a stage on which a temperature detection substrate or inspection substrate is seated, and a probe head positioned above the stage and driven.

In this case, as described above, the probe head includes a fluid ejection means for applying a specific temperature condition to the temperature detection substrate or the inspection substrate, and a temperature sensor contacting the temperature detection substrate to detect the temperature of the temperature detection substrate; and a driving module for moving the temperature sensor and a probe pin contacting the inspection substrate to inspect the inspection substrate.

In addition, the stage may include at least one backlight module including an LED, a reflector formed on an outer peripheral surface of the LED, and a diffusion plate formed on an upper side of the LED.

In addition, the probe inspection apparatus according to the present invention is a temperature correlation through the temperature of the heater or the fluid injected to the fluid injection hole detected through the fluid temperature sensor and the temperature of the temperature detection substrate detected through the temperature sensor. It may further include a control unit for calculating and storing.

In addition, the driving module includes an electromagnet and a slider having a flange formed on the upper side and the temperature sensor coupled to the lower side so as to move up and down from the lower side of the electromagnet, and when the inspection substrate is seated on the stage, the slider is in contact with the electromagnet.

The probe head and the probe inspection apparatus including the same according to the present invention can improve the reliability of inspection by accurately calculating the temperature of the substrate even when inspecting display substrates having different thicknesses or formed circuit patterns.

In addition to the above-described effects, the specific effects of the present invention will be described together while describing specific details for carrying out the invention below.

1 is a schematic plan view of a conventional probe apparatus for inspecting a flat panel display.
2 is a front view of a probe head according to an embodiment of the present invention.
3 is a perspective view of a probe inspection apparatus including a probe head according to an embodiment of the present invention.
4 is a flowchart of a substrate inspection method using a probe inspection apparatus including a probe head according to an embodiment of the present invention.
5 is a graph illustrating a temperature correlation calculated using a probe inspection apparatus including a probe head according to an embodiment of the present invention.

The above-described objects, features and advantages will be described below in detail with reference to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the present invention pertains will be able to easily implement the technical idea of the present invention. In describing the present invention, if it is determined that a detailed description of a known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

In the following, that an arbitrary component is disposed on the "upper (or lower)" of a component or "upper (or below)" of a component means that any component is disposed in contact with the upper surface (or lower surface) of the component. Furthermore, it may mean that other components may be interposed between the component and any component disposed on (or under) the component.

Also, when it is described that a component is "connected", "coupled" or "connected" to another component, the components may be directly connected or connected to each other, but other components are "interposed" between each component. It is to be understood that “or, each component may be “connected,” “coupled,” or “connected” through another component.

As used herein, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the present application, terms such as "consisting of" or "comprising" should not be construed as necessarily including all of the various components or various steps described in the specification, some of which components or some steps are It should be construed that it may not include, or may further include additional components or steps.

Throughout the specification, when “A and/or B” is used, it means A, B or A and B, unless specifically stated to the contrary, and when “C to D” is used, it means that there is no specific contrary description. Unless otherwise specified, it means that it is greater than or equal to C and less than or equal to D.

Hereinafter, a probe head and a probe inspection apparatus including the same according to some embodiments of the present invention will be described.

2 is a perspective view and a front view of a probe head according to an embodiment of the present invention.

Referring to FIG. 2 , the probe head 100 according to an embodiment of the present invention is in contact with the fluid ejection means 110 for applying a specific temperature condition to the temperature detection substrate or the inspection substrate and the temperature detection substrate. It includes a temperature sensor 120 for detecting the temperature of the substrate for temperature detection, a driving module 130 for moving the temperature sensor, and a probe pin 140 in contact with the inspection substrate to inspect the inspection substrate.

In this case, the temperature detection substrate is a dummy substrate having the same specification as the inspection substrate, and is for calculating an accurate temperature of the inspection substrate formed through the fluid ejection means 110 .

More specifically, the fluid ejection means 110 includes a fluid supply port 111 and a fluid ejection hole 112 respectively formed at the upper and lower ends, and is formed in a hollow cylindrical shape as a whole.

In addition, the fluid injection means 110 has a heater 113 formed therein, and heats or cools the fluid supplied through a fluid supply pipe (not shown) coupled to the fluid supply port 111 side to heat or cool the fluid injection port ( 112) to the side.

In addition, the fluid ejection means 110 may detect the temperature of the fluid heated or cooled by the heater 113 by the fluid temperature sensor 114 provided inside or outside.

Also, the fluid temperature sensor 114 may detect the temperature of the heater 113 .

Meanwhile, the temperature sensor 120 is preferably a contact type temperature sensor of any one of a thermocouple, a resistance temperature detector (RTD), and a thermistor.

In addition, the temperature sensor 120 may be slid up or down by a motor or a cylinder or may be in contact with the substrate for temperature detection by the driving module 130 that is folded based on a hinge.

In addition, as shown in FIG. 2 , the driving module 130 has an electromagnet 131 and a flange 132a formed on the upper side, and the temperature sensor 120 is coupled to the lower side, so that the electromagnet 131 is vertically positioned at the lower side. It may include a slider 132 that is coupled to be movable.

More specifically, the driving module 130 is formed in a hollow cylindrical shape as a whole.

In addition, the slider 132 is formed of a metal material that responds to magnetic force, and is formed in a round bar shape as a whole.

Accordingly, in the temperature sensor 120, when current is supplied to the electromagnet 131, the slider 132 comes into contact with the electromagnet 131 and moves upward, and when no current is supplied, the temperature sensor ( 120) and the slider 132 may move downward by the load.

In this case, the lower movement range of the slider 132 may be limited by the flange 132a.

On the other hand, the probe pin 140 is formed at the lower end of the probe head 100 to perform the inspection in contact with the circuit pattern formed on the inspection substrate.

More preferably, the probe pin 140 may be formed on the probe card so that the probe card can be detached from the lower end of the probe head 100 .

In addition, the probe pin 140 may be cooled or heated to the same temperature as the temperature detection substrate or the inspection substrate by the fluid ejection means 110 .

Meanwhile, FIG. 3 is a perspective view of a probe inspection apparatus including a probe head according to an embodiment of the present invention.

Referring to FIG. 3 , the probe inspection apparatus including the probe head according to the present invention includes a stage 200 and a transfer unit 300 for transferring the probe head 100 in multiple axes from an upper side of the stage 200 .

The stage 200 may be formed in a plate shape as a whole so that the temperature detection substrate or the inspection substrate is mounted on the upper surface.

More preferably, the stage 200 may be formed by combining a plurality of stage modules 210, which are rectangular parallelepipeds, in the vertical and horizontal directions.

In addition, a part of the stage module 210 includes an LED 221 therein, a reflector 222 formed perpendicular to an outer circumferential surface of the LED 221 , and a diffusion plate 223 formed on an upper surface of the LED 211 . It may include a backlight module 220 including

In addition, in the probe inspection apparatus including the probe head according to the present invention, the temperature of the fluid injected to the heater 113 or the fluid injection hole 112 detected through the fluid temperature sensor 114 and the temperature sensor 120 ) may further include a control unit (not shown) for calculating and storing the temperature correlation through the temperature of the temperature detection substrate detected through.

On the other hand, the transfer means 300 is an X-axis transfer means 310, a Y-axis transfer means 320 and a Z-axis transfer means 330 for transferring the probe head 100 in the X, Y, and Z-axis directions, respectively. includes

In addition, the transfer means 300 may further include a θ-axis rotating means 340 for rotating in a θ-axis direction, which is a direction of rotation on a plane consisting of the X and Y axes, around any one point in space.

More specifically, the X-axis transfer means 310 may reciprocate the probe head 100 along the X-axis along the X-axis guide rails 311 coupled to both sides of the stage.

In addition, the Y-axis transfer means 320 may reciprocate the probe head 100 along the Y-axis along the Y-axis guide rail 312 installed in the X-axis transfer means 310 .

In addition, the Z-axis transfer means 330 may reciprocate the probe head 100 along the Z-axis along the Z-axis guide 321 installed in the Y-axis transfer means 320 .

In addition, the θ-axis rotating means 340 is coupled between the Y-axis transfer means 320 and the Z-axis transfer means 330 , or between the probe head 100 and the Z-axis transfer means 330 . It is coupled to rotate the probe head 100 in the θ-axis direction.

In addition, each of the transport means 300 may be driven by a linear motor, a geared motor, a cylinder, or the like.

More preferably, the probe inspection apparatus including the probe head according to the present invention may include two probe heads 100 .

More specifically, two Y-axis transfer means 320 for reciprocating along the Y-axis along the Y-axis guide rail 312 are provided, and the two Y-axis transfer means 320 are respectively Z-axis transfer means 330 . ) and the θ-axis rotating means 340 and the probe head 100 may be included.

Accordingly, the probe inspection apparatus including the probe head according to the present invention can more rapidly inspect the display substrate.

Meanwhile, FIG. 4 is a flowchart of a method for inspecting a substrate using a probe inspection apparatus including a probe head according to an embodiment of the present invention.

5 is a graph illustrating a temperature correlation calculated using a probe inspection apparatus including a probe head according to an embodiment of the present invention.

4 and 5, the operating method of the probe inspection apparatus including the probe head according to the present invention includes a setting step (S100) and an inspection step (S200).

More specifically, the setting step (S100) includes a substrate preparation step (S110) for temperature detection, a detection step (S120), and a correlation calculation step (S130).

In the temperature detection substrate preparation step (S110), after the temperature detection substrate is seated on the stage 200, the probe head 100 is mounted on the temperature detection substrate by the transfer means 300. It is transferred to the side of the temperature measurement point.

Thereafter, in the detection step (S120), the temperature measurement point is heated or cooled by the fluid injection means 110 .

At this time, the fluid temperature sensor 114 detects the temperature of the fluid continuously or at regular time intervals.

At the same time, the temperature sensor 120 contacts the temperature measurement point by the driving module 130 to detect the temperature of the temperature measurement point continuously or at regular time intervals.

Thereafter, in the correlation calculation step (S130), the correlation between the temperature of the fluid and the temperature of the temperature measurement point is calculated and stored by the controller.

For example, in the correlation calculation step ( S130 ), as shown in FIG. 5 , A, B, C, etc. are divided according to the thickness of the substrate for temperature detection or the formed circuit pattern, and by the fluid ejection means 110 . The temperature change of each of the temperature detection substrates A, B, and C according to the temperature change of the injected fluid may be graphed.

When the setting step (S100) as described above is completed, the inspection step (S200) is performed.

In this case, it is preferable that the slider 132 is maintained in contact with the electromagnet 131 while the inspection step S200 is in progress.

Meanwhile, the inspection step (S200) includes an inspection substrate preparation step (S210), an inspection temperature setting step (S220), and an inspection substrate inspection step (S230).

In the inspection substrate preparation step S210 , the detection temperature substrate seated on the stage 200 is recovered and the inspection substrate is seated on the stage 200 .

Thereafter, in the test temperature setting step (S220), the temperature of the test substrate to be tested is set, and a fluid having a temperature according to the result calculated in the correlation calculation step (S130) is sprayed through the fluid ejection means 110, , the probe pin 140 is in contact with the inspection substrate, and the inspection substrate inspection step (S230) is performed.

For example, when the inspection substrate is a substrate A and the temperature condition of the substrate required for inspection is 50° C., the fluid ejection unit 110 injects a 70° C. fluid to the substrate A and performs the inspection.

Accordingly, in the probe inspection apparatus including the probe head according to the present invention, even when inspecting display substrates having different thicknesses or formed circuit patterns, it is possible to improve the reliability of inspection by applying precise specific temperature conditions to each inspection substrate.

In addition, in the inspection substrate inspection step ( S230 ), the inspection may be performed by irradiating a specific amount of light to the inspection substrate by the backlight module 220 .

In this case, more preferably, the LED 221 may be replaced with an infrared or ultraviolet generating means so that the backlight module 220 can generate not only the visible light spectrum but also the ultraviolet or infrared spectrum.

As described above, the present invention has been described with reference to the illustrated drawings, but the present invention is not limited by the embodiments and drawings disclosed in the present specification. It is obvious that variations can be made. In addition, although the effects according to the configuration of the present invention are not explicitly described and described while describing the embodiments of the present invention, it is natural that the effects predictable by the configuration should also be recognized.

100. probe head
110. Fluid injection means
111. Fluid inlet
112. Fluid Nozzle
113. Heater
114. Fluid temperature sensor
120. Temperature sensor
130. Drive module
131. Electromagnet
132. Slider
132a. flange
140. Probe Pins
200. Stage
210. Stage module
220. Backlight module
221. LED
222. Reflector
223. Diffuser Plate
300. means of transport
310. X-axis transport means
311. X-axis guide rail
312. Y-axis guide rail
320. Y-axis transport means
321. Z-axis guide rail
330. Z-axis transport means
340. θ axis rotation means
S100. setting step
S110. Substrate preparation step for temperature detection
S120. detection stage
S130. Correlation calculation step
S200. inspection stage
S210. Inspection board preparation stage
S220. Inspection temperature setting step
S230. Inspection board inspection step

Claims (10)

a stage on which a temperature detection substrate or an inspection substrate is mounted; and
and a probe head positioned above the stage to inspect the temperature detection substrate or the inspection substrate,
The probe head is
fluid ejection means for imparting a specific temperature condition to the temperature detection substrate or the inspection substrate;
a contact-type temperature sensor in contact with the temperature detection substrate to detect a temperature of the temperature detection substrate;
a driving module for moving the temperature sensor; and
and a probe pin that is in contact with the inspection substrate to perform inspection of the inspection substrate;
The driving module includes an electromagnet and a flange formed on the upper side, the temperature sensor is coupled to the lower side, and a slider coupled to be movable up and down from the lower side of the electromagnet, and the temperature sensor is connected to the inspection board according to the lower side movement. A substrate inspection apparatus which is brought into contact with and has a hollow cylindrical shape.
The method of claim 1,
The fluid ejection means includes a heater provided therein, a fluid supply port and a fluid ejection port formed at upper and lower ends, respectively, and a fluid temperature sensor for detecting a temperature of the fluid injected into the heater or the fluid ejection port.
delete The method of claim 1,
The temperature sensor is a thermocouple (Thermocouple), RTD (Resistance Temperature Detectors), a thermistor (Thermistor) any one of a contact-type temperature sensor of a substrate inspection device.
The method of claim 1,
The fluid ejection means is a substrate inspection apparatus for applying a specific temperature condition to the probe pin. delete delete delete delete delete

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