KR20210015731A - A semiconductor test equipment - Google Patents

Abstract

The present invention relates to an apparatus for maintaining a predetermined test temperature inside a chamber accommodating a substrate to be tested. Provided is semiconductor test equipment which comprises: a chamber; a heater; a main blower module introducing air into the chamber; and a sub blower module. Sub flow by the sub blower module is configured to flow through one side wall on which the substrate to be tested is mounted.

Description

Semiconductor test equipment {A semiconductor test equipment}

The present invention relates to a semiconductor test equipment, and relates to an apparatus for maintaining a predetermined test temperature in a chamber containing a substrate to be tested.

Semiconductor devices are sold only products that have passed through various tests to ensure their reliability. Such tests are often performed under severe thermal or electrical conditions, and the test equipment is often provided with a high-temperature chamber to create a high-temperature atmosphere.

As an example of a conventional test equipment having a high-temperature chamber, Korean Patent Publication No. 10-2017-0023340 discloses ``a chamber member constituting the entire exterior of the device, a door member formed on one side of the chamber member, and the chamber member. A filter member disposed inside the chamber, a heating member disposed inside the chamber member, an air volume control member for adjusting the amount of air supplied into the chamber member, and an air circulation member installed in the chamber member, A cooling member connected to the chamber member, a support frame member disposed inside the chamber member to support a plurality of receiving frames, and a receiving frame member mounted on the support frame member, wherein the receiving frame member includes a computer The main body is accommodated, the connector part connected to the computer main body protrudes through the front surface of the receiving frame member, and the test target memory is coupled to the connector part, and the air circulation member is a side facing the support frame member. A semiconductor component reliability test apparatus, characterized in that it is installed above the chamber member, is disclosed.

In the semiconductor test equipment disclosed in this regard, the interior of the chamber was heated to a predetermined test temperature through a heating member acting as a heat source for heating the interior of the chamber and an air circulation member that causes air flow around the heating member to circulate into the chamber. .

However, the conventional semiconductor test equipment employs a method in which the interior of the chamber is entirely heated with heated air introduced through one side wall, and thus, there is no means to compensate for this even if the temperature inside the chamber is unevenly distributed. In the case of the above-described published patent, an air volume control member for controlling the amount of air supplied into the chamber member is provided, but the disclosed air volume control member is cumbersome to use by adjusting the size of the vent through manual operation. There was a problem that could not be precisely controlled according to the driving conditions.

Korean Patent Publication No. 10-2017-0023340

The present invention is to solve the problem of such conventional semiconductor test equipment, and an object of the present invention is to provide a semiconductor test equipment capable of improving the temperature distribution uniformity inside the chamber.

In addition, an object of the present invention is to provide a semiconductor test equipment capable of partially controlling the amount of air blown according to the position inside the chamber.

In addition, an object of the present invention is to provide a semiconductor test equipment capable of increasing the amount of air that can be supplied into the chamber and shortening the heating time inside the chamber.

In addition, an object of the present invention is to provide a semiconductor test equipment capable of performing high or low temperature tests on various types of semiconductor devices.

In order to achieve this purpose, the semiconductor test equipment according to the present invention includes a chamber in which a plurality of test target substrates are mounted, a heater that dissipates heat to be supplied into the chamber, and a main flow for introducing air outside the chamber into the chamber. A main blower module for generating, and a sub blower module for generating a sub-flow for introducing air outside the chamber into the chamber, wherein the chamber includes a first side wall provided with a plurality of sockets for mounting a substrate to be tested , A second side wall adjacent to the first side wall, the second side wall has an intake port through which air is introduced by a main flow, and a plurality of through holes through which air by a sub flow is introduced are formed in the first side wall. do.

In addition, the semiconductor test equipment further includes a plurality of through-hole groups consisting of through-holes arranged on the same line in the left-right and lateral direction, and a plurality of pipelines through which a plurality of through-holes belonging to the same through-hole group communicate.

In addition, the semiconductor testing equipment further includes a plurality of nozzles forming an air flow passage from each of the pipelines to the through holes communicating with each of the pipelines, wherein the plurality of nozzles are orthogonal to the first sidewall. It is formed along a direction in which the air flow flowing out of the through holes forms a direction parallel to the substrate under test.

In addition, the plurality of through-hole groups are disposed in the middle between the stacked test target substrates.

In addition, the sub-blowing module includes two or more sub-blowers, and the two or more sub-blowers supply air to different through-hole groups.

In addition, the semiconductor test equipment further includes an inclined wall installed outside the second sidewall and having a variable inclination with an upper end as a rotation axis.

In addition, another semiconductor test equipment according to the present invention for achieving the above object includes a chamber in which a plurality of horizontally placed burn-in boards are stacked at a predetermined interval in the vertical direction, and a plurality of burn-in boards forming a side wall of the chamber are combined. A rear wall provided with a socket of the rear wall, a plurality of through holes disposed between the plurality of sockets on the rear wall to guide air to flow into the space between the adjacent burn-in boards, and dissipating heat to be supplied to the chamber. A heater and a first blowing module supplying air outside the chamber to the plurality of through holes, and the semiconductor test equipment is adjacent to the rear wall and the chamber through another side wall having an area smaller than that of the rear wall. It further includes a second blowing module for supplying air to the inside.

Further, another semiconductor test equipment according to the present invention for achieving the above object includes a chamber in which a plurality of test target SSD memory cards are installed, an upper wall having a plurality of sockets to which the test target SSD memory cards are coupled, and the A plurality of through holes disposed between the plurality of sockets on the upper wall to guide air into the space between adjacent SSD memory cards, a heater dissipating heat to be supplied to the chamber, and air outside the chamber And a main blowing module for supplying air into the chamber through a sub-blowing module supplied to the plurality of through holes, and through another side wall adjacent to the upper wall and having an area smaller than that of the upper wall, and the semiconductor test equipment Further includes a lower wall having an exhaust port through which air inside the chamber is discharged.

The semiconductor test equipment according to the present invention improves the uniformity of the temperature and flow rate distribution inside the chamber by introducing air at a uniform flow rate through the sub-flow supplied from a plurality of through-holes evenly distributed on one side wall to which the substrate to be tested is coupled. You can increase it.

In addition, the semiconductor test equipment according to the present invention is configured to selectively or simultaneously supply the main flow and the sub flow, so that the operation of the device can be precisely controlled, and by enabling a rapid temperature rise inside the chamber, You can shorten the time.

In addition, the semiconductor test equipment according to the present invention can be widely used in various types of high or low temperature reliability test equipment as well as the MBT test and THB test described above.

In addition, the semiconductor test equipment according to the present invention can increase the uniformity of the flow velocity distribution of the main flow by forming an inclined wall on the air flow passage of the main flow.

1 is a schematic diagram showing a semiconductor test equipment according to a first embodiment of the present invention
2 is a perspective view schematically showing a chamber and a peripheral configuration thereof of the semiconductor test equipment according to the first embodiment of the present invention.
3 is a plan view schematically showing a chamber of the semiconductor test equipment according to the first embodiment of the present invention and a part of its surroundings.
4 is a schematic view showing a front part of a rear wall of a chamber of a semiconductor test equipment according to a first embodiment of the present invention.
Fig. 5 is a view showing a part of a cross section taken along line A-A' of Fig. 2;
6 is a schematic diagram showing a semiconductor test equipment according to a second embodiment of the present invention
7 is a perspective view schematically showing a chamber and a peripheral configuration thereof of a semiconductor test equipment according to a second embodiment of the present invention.
8 is a front view schematically showing a chamber of a semiconductor test equipment according to a second embodiment of the present invention and a part of a peripheral configuration thereof.
9 is a schematic view showing a portion of a bottom surface of an upper wall of a chamber of a semiconductor test equipment according to a second embodiment of the present invention.
Fig. 10 is a view showing a part of a cross section taken along line B-B' of Fig. 7;

Hereinafter, various embodiments of the present invention will be described in detail with reference to the drawings. Various modifications may be made to the embodiments described below by those of ordinary skill in the art to which the present invention pertains. The embodiments described below are not described to limit the present invention to the corresponding embodiments. The present invention is to be understood as including various modifications, substitutes, and equivalents within the scope of the technical idea understood from the entire specification as well as the following examples.

It should be understood that expressions such as "include", "consist of" and "have" that may be used hereinafter do not exclude additional elements or functions.

“First… ”, “second… Expressions such as ”, “first”, and “second” should not be construed as limiting the order or importance of elements unless explicitly stated.

It should be understood that expressions such as "combined" and "connected" that may be used below are not only directly combined or connected, but also other components may exist or be intervening, unless explicitly stated otherwise. do.

Hereinafter, in the use of terms, the singular expression should be understood as not excluding the plural expression unless explicitly stated.

In the following description of the through hole (H), the pipeline (P), and the nozzle (N), a number and/or lowercase letters are added after the reference numerals to distinguish a plurality of them.

The present invention relates to an equipment for testing a semiconductor device under a high temperature condition, and to an apparatus configuration for providing high temperature heat inside a chamber in which a device to be tested or a substrate is mounted. The semiconductor test equipment according to the present invention can be used as a test apparatus for various semiconductor devices under high temperature conditions. Hereinafter, embodiments of the semiconductor test equipment according to the present invention will be described.

<First Example>

The semiconductor test equipment according to the present invention may be, for example, a Monitoring Burn-in Test (MBT) equipment. MBT process is a reliability test that removes initial defects by applying thermal and electrical stress to packaged devices. The MBT process is also referred to as a TDBI (Test During Burn-in) process.

1 to 5 show an example of an MBT device according to the present invention. Hereinafter, a semiconductor test equipment according to a first embodiment of the present invention will be described with reference to these drawings. For convenience, the X-axis direction is set to the left, the Y-axis direction is set to the front, and the Z-axis direction is set to the upper direction based on the coordinate system shown in FIG.

The semiconductor test equipment 1 according to the present invention includes a chamber 110 for forming a space in which the substrate 101 to be tested is mounted. The test substrate 101 may be a burn-in board. The burn-in board is equipped with electronic devices to be tested, and provides a function of applying electrical test signals to the devices to be tested. Several substrates to be tested 101 are stacked vertically while having a predetermined interval to be installed in the chamber 110. Outside the chamber 110, a heater 121 and a main blower 122 are configured. The heater 121 emits heat to be supplied to the chamber 110. The main blower 122 generates a flow so that air is introduced into the chamber 110. The airflow formed by the main blower 122 passes around the heater 121 and is supplied into the chamber 110 so that the inside of the chamber 110 rises to a predetermined test temperature.

A flow passage for guiding the airflow formed by the main blower 122 to the chamber 110 is formed around the chamber 110. The heater 121 and the main blower 122 are installed on the upper part of the chamber 110, and the airflow formed by the main blower 122 is introduced through one side wall (right side wall) 111 of the chamber 110 It may be discharged to the opposite side wall (left side wall) 112. Air flowing inside the chamber 110 allows the test substrate 101 to maintain a predetermined test temperature while passing through a space between the plurality of test substrates 101. The right wall 111 may have a plurality of intake ports 111a through which heated air is introduced, and the left wall 112 may have a plurality of exhaust ports 112a through which air is discharged.

The space outside the right wall 111 constitutes a part of the air flow passage. The heated air is introduced from the outside of the right wall 111 over the entire height above and below. There is a concern that the flow rate of the incoming air may vary at the top and bottom due to the pressure difference. That is, the flow rate of air flowing into the upper part may be fast and the flow rate of air flowing into the lower part may be slow. This difference in flow rate may cause uneven temperature distribution inside the chamber 110. To compensate for this, an inclined wall 117 is installed outside the right wall 111. The inclined wall 117 is configured such that its upper end is a rotation axis and its lower part is movable in the left and right lateral directions (see arrow M in FIG. That is, the distance between the right wall 111 and the inclined wall 117 is adjusted so that the air flow rate is uniformly adjusted over the entire height. Although not shown, the movement of the inclined wall 117 may be controlled by a transmission device including an actuator. In the case of the prior art described above, the amount of air inflow is adjusted by changing the size of the vent by manual operation, whereas the present invention adjusts the flow rate of the incoming air according to the position (tilt) of the automatically controlled inclined wall 117. Therefore, there is an advantage that the operation becomes much easier.

The semiconductor test equipment 1 according to the present invention is also configured such that heated air can be introduced into the chamber 110 through the other side wall (rear side wall) 113 adjacent to the right wall 111. As shown in FIG. 4, a plurality of through holes H for inflow of air are formed in the rear wall 113. A number of through holes (H) form a group according to their height. That is, as shown in the figure, the first group of through holes H1a, H1b, H1c,…… located at a predetermined height and the second group of through holes H2a, H2b, H2c,…… located at a different height. ), and a third group of through holes (H3a, H3b, H3c, ...) positioned at different heights, and may be divided into a plurality of groups. And the through holes in the same group are again arranged laterally spaced apart a predetermined distance. 3 and 5 together, the through holes H are communicated by one pipeline P for each group. That is, the first group of through holes H1a, H1b, H1c,.... are connected by the first pipeline P1 outside the rear wall 113, and the second group of through holes H2a, H2b, H2c ,……) are connected by the second pipeline P2, and similarly, the through holes H3a, H3b, H3c,…… of the third group are also connected by the third pipeline P3. Pipeline (P) is a flow path through which heated air flows, and air supplied to each of the pipelines (P1, P2, P3,...) is through holes (H1a, H1b, H1c,...) of each group (H2a) , H2b, H2c,……) is introduced into the chamber 110 through (H3a, H3b, H3c,……). Outside of each pipeline (P1, P2, P3,……), through holes (H1a, H1b, H1c,……) (H2a, H2b, H2c,……) (H3a, H3b, H3c,……) A plurality of nozzles N1a, N1b, N1c, ......) (N2a, N2b, N2c,...) (N3a, N3b, N3c,...) are formed that extend and provide an air flow passage function. These nozzles (N) are formed along the front-rear direction so that the air introduced through the through hole (H) forms an airflow in a horizontal direction, so that it flows horizontally along the test substrate 101.

Each group of through holes H1a, H1b, H1c,……) (H2a, H2b, H2c,……) (H3a, H3b, H3c,……) are arranged in the space between adjacent two test target substrates 101 (See Fig. 4).

Referring to FIG. 3, a system board 102 for inputting and outputting a test signal to the substrate 101 to be tested is configured behind the rear wall 113. Test signals input/output from the system board 102 may be, for example, a data signal, a clock signal, an address signal, or the like. Although not shown, a feedthrough board may be interposed between the test target substrate 101 and the system board 102. The test substrate 101 and the system board 102 are electrically connected through a plurality of sockets S installed on the rear wall 113 (see FIG. 5).

In addition, the semiconductor test equipment 1 may include a sub blower 124 for supplying air to the aforementioned pipelines P (see FIG. 1 ). The sub blower 124 provides a function of supplying a part of air circulating in the equipment 1 to the pipeline P. The sub blower 124 is configured to supply air integrally to the entire pipeline (P), or a sub blower so that several pipelines (P) can be individually supplied to each zone through a single zone ( 124) may be composed of a plurality. For example, when the first pipeline (P1) and the second pipeline (P2) form one zone, and the remaining pipelines (P3,……) form another zone, the two sub-blowers 124 It can be configured to supply air to each zone.

Hereinafter, the flow of air formed by the operation of the main blower 122 is referred to as “main flow” (F1 in FIG. 2), and device configurations that cause the main flow, that is, the main blower 122, the right wall 111 ), the inclined wall 117, and the like are referred to as “main blowing module”. In addition, the air flow formed by the operation of the sub blower 124 is referred to as “sub flow” (F2 in Fig. 2), and device configurations that induce sub flow, that is, the sub blower 124, the rear wall 113, Pipeline (P), nozzle (N), through hole (H), etc. are referred to as "sub-blowing modules".

The main flow creates a right-to-left airflow within the chamber 110. The main flow is configured to have a larger air volume compared to the sub flow, and thus can be mainly used when a rapid temperature increase is required inside the chamber 110 at an early stage of the process. On the other hand, the sub-flow is configured to have a small air volume compared to the main flow, and can be mainly used for uniform temperature distribution in the intermediate process chamber 110. In addition, if necessary, the main flow and the sub flow are simultaneously used to provide a large amount of air inside the chamber at once, thereby enabling rapid temperature rise. The main flow and the sub flow can be supplied selectively or simultaneously.

Air inflow by the main flow is introduced through the intake port (111a) of the right wall 111, and air inflow by the sub-flow is introduced through the through holes (H) of the rear wall (113). The rear wall 113 is one surface occupying the largest area in the rectangular parallelepiped-shaped chamber 110 and has a larger area than the right wall 111. The sub-flow supplied through the through holes H evenly distributed on the wall surface of the rear wall 113 having such a large area may be uniformly distributed and supplied in the space between the substrates to be tested 101.

The MBT process is usually conducted at a high temperature of 125°C for several to tens of hours or longer, and the temperature distribution inside the chamber is uneven due to various causes such as a difference in flow rate at which heated air is introduced during the process, or heat generation from the device under test. This can happen. The semiconductor test equipment 1 according to the present invention has a configuration capable of solving such a temperature distribution unevenness. That is, the air flow by the main blowing module is introduced into the chamber 110 through the right wall 111, and the slope of the inclined wall 117 is so that the incoming air can have a uniform flow velocity distribution over the entire height. Can be adjusted. In addition, the sub-flow supplied through the plurality of through holes H distributed in the rear wall 113 is immediately adjacent around the socket S in which the test substrate 101 is installed, and air with a uniform flow rate can be supplied. . Therefore, the uniformity of the air flow inside the chamber can be maintained during the test.

<Second Example>

The semiconductor test equipment 2 according to the second embodiment of the present invention may be, for example, a THB (Temperature, Humidity, Bias) test equipment. The THB test is a test conducted under conditions that accelerate corrosion of the device. For example, the THB test may be conducted for 1000 hours at a temperature of 85°C and a humidity of 85%.

6 to 10 show an example of a THB test equipment 2 for a solid state drive (SSD). Hereinafter, a semiconductor test equipment according to a second embodiment of the present invention will be described with reference to these drawings. For convenience, the X-axis direction is set to the left, the Y-axis direction is set to the front, and the Z-axis direction is set to the upper direction based on the coordinate system shown in FIG. 7.

As shown in Fig. 6, the semiconductor test equipment 2 according to the present invention includes a chamber 210 that forms a space in which a substrate to be tested 201 is mounted. The test substrate 201 may be, for example, a card-type SSD memory. A plurality of test target substrates 201 are installed on the upper wall 215 forming the upper surface of the chamber 210. A plurality of sockets S for inserting the test substrate 201 are configured on the upper wall 215 (see FIG. 10). A plurality of test target substrates 201 are arranged in a row in the front and rear and left and right directions. A heater 221, a main blower 222, and a humidifying device 223 are configured above the chamber 210. The heater 221 provides a function of dissipating heat to be supplied into the chamber 210. The main blower 222 generates a flow so that the heated air around the heater 221 flows into the chamber 210. A flow path is formed around the chamber 210 to guide air blown by the main blower 222 to be introduced into the chamber 210. The airflow formed in the main blower 222 is introduced through the right side wall 211 of the chamber 210 and discharged through the opposite left side wall 212. The discharged air may be introduced into the chamber 210 again by the main blower 222 and may be circulated. The humidifying device 223 provides moisture so that the inside of the chamber 210 maintains a predetermined set humidity required for testing.

A plurality of intake ports 211a through which heated air is introduced are formed in the right wall 211, and a plurality of exhaust ports 212a through which air passing through the chamber 210 is discharged are formed in the left wall 212. The flowing air forms a flow from the right to the left in the drawing, and passes the space between the substrates to be tested 201 so that the substrate 201 is tested under a predetermined test temperature condition.

As in the first embodiment, an inclined wall 217 is installed outside the right wall 211, and the air flowing through the right wall 211 is introduced at a uniform flow rate over the entire height. The slope is controlled.

A plurality of through holes H for introducing air into the chamber 210 are formed in the upper wall 215 on which the test substrate 201 is installed. The plurality of through holes H form a group at the same distance in the front-rear direction. That is, as shown in Fig. 9, the first group of through holes H1a, H1b, H1c, ... ... located at the same distance in the front-rear direction and the second group of through holes H2a located at another distance. H2b, H2c,……), and a third group of through holes (H3a, H3b, H3c,……) positioned on another distance may be divided into a plurality of groups. The through holes H in the same group are located on the same line in the left and right and lateral directions, and each through hole group is disposed at a predetermined distance apart along the front and rear direction.

Referring to Figs. 8 and 10 together, as in the first embodiment, the through holes H are communicated by one pipeline P for each group. That is, the first pipeline P1 that supplies air to the first group of through holes (H1a, H1b, H1c,...) and the second group of through holes (H2a, H2b, H2c, ...) A second pipeline P2 to be supplied, a third pipeline P3 for supplying air to the third group of through holes H3a, H3b, H3c,... are configured. And outside of each pipeline (P1, P2, P3), each through holes (H1a, H1b, H1c,...) (H2a, H2b, H2c, ...) a plurality of nozzles (N1a, N1b, which become a connection passage) N1c,……) (N2a, N2b, N2c,……) (N3a, N3b, N3c,……) are configured. These nozzles (N) are formed in a vertical direction up and down to form an airflow through which air introduced through the through hole (H) flows in a downward direction, so that it flows side by side along the test target substrate 201.

A plurality of exhaust ports 216a are formed in the lower wall 216 facing the upper wall 215 so that the air introduced through the through hole H can be discharged downward (see FIG. 6).

In addition, the semiconductor test equipment 2 may include a sub blower 224 for supplying air to the above-described pipelines P. The sub blower 224 provides a function of supplying part of the air circulating in the equipment 2 to the pipeline P. The sub blower 224 is configured to supply air integrally to the entire pipeline (P), or a plurality of sub-blowers so that several pipelines (P) can be individually supplied to each zone through one zone. A blower 224 may be provided. For example, when the first pipeline (P1) and the second pipeline (P2) form one zone, and the remaining pipelines (P3,……) form another zone, the two sub-blowers 224 It can be configured to supply air to each zone.

A system board 202 for inputting/outputting a test signal to/from the test target substrate 201 is formed on the upper side outside the upper wall 215.

As in the first embodiment, the semiconductor test equipment 2 according to the present embodiment has device configurations that cause main flow (F1 in FIG. 7), that is, the main blower 222, the right wall 211, and the inclined wall ( 217), etc., and including the main blowing module, which induces sub-flow (F2 in Fig. 7), that is, the sub blower 224, the upper wall 215, the pipeline P, the nozzle N ), and through hole (H).

The main flow creates an airflow in the leftward direction within the chamber 210. The main flow is configured to have a larger air volume than the sub flow, and thus can be mainly used when a rapid temperature increase is required inside the chamber 210 at an early stage of the process. On the other hand, the sub-flow is configured to have a smaller air volume than the main flow, and may be mainly used for a uniform temperature distribution in the intermediate process chamber 210.

Air inflow by the main flow is introduced through the intake port 211a of the right wall 211, and air inflow by the sub-flow is introduced through the through holes H of the upper wall 215. In the semiconductor test equipment 2 according to the present embodiment, the surface formed by the upper wall 215 forms the largest area among the six surfaces forming the chamber 210 in a rectangular parallelepiped shape. In addition, the right wall 211 has a narrower area than the upper wall 215. Accordingly, the sub-flow supplied through the through holes H evenly distributed over the widest area may flow into the substrate 201 to be tested at a uniform flow rate, thereby improving the uniformity of temperature distribution in the chamber 210.

The semiconductor test equipment according to the above two embodiments has been described as an example in which the chamber performs a process under a high temperature condition, but the semiconductor test equipment according to the present invention can be equally applied even when the process is performed under a low temperature condition. That is, by configuring the above-described heater as a cooling device (heat absorption device) capable of supplying cold air to the surrounding air, the semiconductor test equipment according to the present invention can be used as a test equipment under not only high temperature but also low temperature conditions.

In the semiconductor test equipment according to the present invention described in detail above, by introducing air at a uniform flow rate through the sub-flows supplied from a plurality of through-holes evenly distributed on one sidewall to which the substrate to be tested is coupled, Uniformity can be improved.

In addition, the semiconductor test equipment according to the present invention is configured to selectively or simultaneously supply the main flow and the sub flow, so that the operation of the device can be precisely controlled, and by enabling a rapid temperature rise inside the chamber, You can shorten the time.

In addition, the semiconductor test equipment according to the present invention can be widely used in various types of high or low temperature reliability test equipment as well as the MBT test and THB test described above.

In addition, the semiconductor test equipment according to the present invention can increase the uniformity of the flow velocity distribution of the main flow by forming an inclined wall on the air flow passage of the main flow.

1, 2: semiconductor test equipment
101, 201: substrate to be tested
102, 202: system board
110, 210: chamber
117, 217: inclined wall
121, 221: heater
122, 222: main blower
124, 224: sub blower
H: through hole
P: pipeline
N: nozzle

Claims (10)

A chamber in which a number of test target substrates are mounted,
A heater dissipating heat to be supplied into the chamber,
A main blowing module for generating a main flow for introducing air outside the chamber into the chamber,
And a sub-blowing module for generating a sub-flow for introducing air outside the chamber into the chamber,
The chamber includes a first side wall provided with a plurality of sockets for mounting a substrate to be tested, and a second side wall adjacent to the first side wall,
The second sidewall is formed with an intake port through which air is introduced by the main flow, and the first sidewall has a plurality of through holes through which air is introduced by the sub-flow.
The method of claim 1,
The semiconductor testing equipment further comprises a plurality of through-hole groups consisting of through-holes arranged on the same line in a left-right and lateral direction, and a plurality of pipelines through which a plurality of through-holes belonging to the same through-hole group communicate.
The method of claim 2,
The semiconductor test equipment further includes a plurality of nozzles forming an air flow passage from each of the pipelines to the through holes communicated with each of the pipelines,
The plurality of nozzles are formed along a direction orthogonal to the first sidewall, so that the air flow flowing out of the through holes forms a direction parallel to the substrate to be tested.
The method of claim 3,
The plurality of through-hole groups are disposed in the middle between the stacked test target substrates.
The method of claim 4,
The sub-blowing module includes two or more sub-blowers,
The two or more sub blowers supply air to different through-hole groups.
The method of claim 5,
The semiconductor testing equipment further comprises an inclined wall installed outside the second sidewall and having a variable inclination with an upper end as a rotation axis.
A chamber in which a plurality of horizontally placed burn-in boards are stacked at predetermined intervals in the vertical direction,
A rear wall forming one side wall of the chamber and provided with a plurality of sockets to which burn-in boards are coupled,
A plurality of through holes disposed between the plurality of sockets on the rear wall to guide air to flow into the space between adjacent burn-in boards,
A heater dissipating heat to be supplied to the chamber,
Semiconductor testing equipment comprising a first blowing module for supplying air outside the chamber to the plurality of through holes.
The method of claim 7,
The semiconductor testing equipment further comprises a second blowing module for supplying air into the chamber through another side wall adjacent to the rear wall and having an area smaller than that of the rear wall.
A chamber in which a plurality of test target SSD memory cards are installed,
An upper wall provided with a plurality of sockets to which the SSD memory card to be tested is coupled,
A plurality of through holes disposed between the plurality of sockets on the upper wall and guiding air to flow into the space between adjacent SSD memory cards;
A heater dissipating heat to be supplied to the chamber,
A sub-blowing module that supplies air outside the chamber to the plurality of through holes,
A semiconductor testing equipment comprising a main blowing module that is adjacent to the upper wall and supplies air into the chamber through another side wall having an area smaller than that of the upper wall.
The method of claim 9,
The semiconductor test equipment further includes a lower side wall having an exhaust port through which air inside the chamber is discharged.

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