JP2001051012A - Semiconductor test system and test temperature stably control method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor test system and a test temp. stably control method whereby in a stabilized temp. environment IC devices are selected to improve the IC device selection yield. SOLUTION: In the state where an IC device 12 is housed, a hollow 36 is provided in a contact block 16 for electric connection of a contact pin 34 of a socket 14 and contact pin 34 of the IC device 12, a high temp. control nozzle 18 for jetting a high temp. control liq. 19 and a low temp. control nozzle 20 for jetting a low temp. control liq. 21 are provided in the hollow 36, and a test temp. stably control mechanism is provided for selectively jetting a high temp. or low temp. control liq. 19 or 21 according to the substrate temp. of the IC device 12 on the contact block 16, thereby controlling the temp. of the contact block 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test temperature stabilization control technique in a semiconductor test for selecting (screening) an electronic device such as an IC device, and more particularly to selecting an IC device by selecting an IC device in a stable temperature environment. The present invention relates to a semiconductor test system for improving the yield and a test temperature stability control method.

[0002]

2. Description of the Related Art When an IC device (integrated circuit element) operating at a high frequency is selected (screened), the temperature of the IC device may rise above a specified temperature mainly due to self-heating of the IC device. . This is an IC
This may cause a reduction in device sorting yield. Conventionally, I
A device test apparatus for testing and measuring the electrical characteristics of the C device includes an IC tester and an IC handler. The IC tester includes a test head provided with a socket for connecting an IC device, and a tester main body that processes a signal from the IC device and measures whether or not the IC device operates normally. The IC handler is an IC handler.
The device supplies and sequentially connects to the test head, and constitutes a mechanism for classifying and storing IC devices based on test results.

A test of an IC device is performed not only at a normal temperature but also at a high temperature and a low temperature. For this purpose, a constant temperature bath is used to heat or cool the IC device to a temperature set at the time of the test. In a high-temperature handler for testing an IC device in a high-temperature state, a preheating section and a measuring section for connecting to a test head are provided as a device traveling path in a constant-temperature chamber, and the IC sent into the constant-temperature chamber is provided. After the device is heated to the set temperature by staying in the preheating unit for a predetermined time, the device is moved to the measurement unit and a test is performed. In contrast, a low-temperature handler for testing an IC device in a low-temperature state is provided with a cooling unit and a measuring unit in a constant temperature bath, and the IC device stays in the cooling unit for a predetermined time to lower to a set temperature. After that, the test is transferred to the measuring unit and the test is performed.
In addition, both the high-temperature handler and the low-temperature handler are the same in that the temperature is set at a predetermined temperature by staying at a site where temperature processing is performed, and then the test is performed by moving to a measurement unit. For this reason, a so-called high-low temperature handler that uses a low-temperature handler and a high-temperature handler by installing a heating unit and a cooling unit in a thermostat is also used.

However, when the IC device is tested at a predetermined low temperature by a low-temperature handler or a high-low temperature handler, a refrigerant such as liquid nitrogen is used.
The refrigerant is supplied into the thermostat, but a duct is provided to bring the entire thermostat to a uniform temperature state with the refrigerant, and a fan such as a cross flow fan for circulating cooling air in the duct is installed. A refrigerant supply pipe provided with a plurality of refrigerant outlets is provided on the downstream side. Then, the refrigerant supplied from the refrigerant supply pipe is vaporized when ejected from the refrigerant outlet, and is conveyed to a circulating flow by a fan to circulate in the thermostat. Here, since the coolant supply source is generally provided only at one place, the temperature condition can be made somewhat uniform when the internal space of the constant temperature bath is small. If a multiple handler is configured to test a large number of IC devices at the same time, the internal space of the thermostat becomes large, so that it is extremely difficult to make the whole temperature uniform. In particular, the only way to perform temperature control by using liquid nitrogen as a refrigerant and ejecting liquid nitrogen from a refrigerant outlet formed in a pipe is to control the amount of refrigerant to be injected, and it is difficult to perform fine control by itself. Therefore, there is a problem that it is extremely difficult to control the entire inside of the thermostat so as to accurately reach the set temperature.

As a conventional technique for solving such a problem, there is a temperature stabilization control technique for controlling the temperature of an IC device with a refrigerant, for example, as disclosed in Japanese Patent No. 270.
There is one described in JP-A-5420. That is, in the prior art described in Japanese Patent No. 2705420, a traveling path for an IC device is provided in a thermostat provided with a duct provided with a refrigerant supply unit and a fan for forming a circulating flow. A test head for testing and measuring an IC device is placed at an intermediate position, and a heater is provided at least at a predetermined position upstream of the test head on the traveling path, so that the IC device conveyed along the traveling path is provided at a predetermined position. In the temperature control method of the IC handler, which is connected to a test head and performs test measurement of electrical characteristics, a coolant is supplied from the coolant supply means to test and measure the entire inside of the thermostat. After the temperature is set lower than the set temperature, the traveling path is heated by the heater, so that at least the positions of the cooling unit and the measuring unit on the traveling path reach the set temperature. A temperature control method for low temperature handler that urchin adjustment. In such a low-temperature handler temperature control method, the coolant is supplied from the coolant supply means so that the entire interior of the constant temperature bath is lower than the set temperature at the time of test and measurement, and then the traveling path is heated by the heater. Therefore, at least the position of the cooling unit and the measuring unit on the traveling path is adjusted so as to be at the set temperature, so that the device can be quickly cooled to the set temperature at the start-up of the apparatus, and in a steady state, a constant temperature bath In addition to controlling the internal temperature by controlling only the flow rate of the refrigerant, it is also used in combination with the operation control of the heater. Is disclosed in Japanese Patent Application Laid-Open No. H11-27138, which discloses an effect that the reliability of test and measurement of an IC device can be improved.

[0006]

However, in such a conventional technique, when an IC device is jammed (Jam: transport failure) when the IC device is stored in the socket, the IC device is stored in a proper place. The coolant may be injected in a state where it is not performed, and the coolant may adhere to the contact pins of the socket. As a result, the contact resistance value may be affected and an error may occur in the selection result of the IC device. There was a problem.

The present invention has been made in view of the above problems, and has as its object to select a semiconductor test system in a stable temperature environment to improve the selection yield of IC devices and a semiconductor test system. It is to provide a test temperature stability control method.

[0008]

The gist of the present invention is to select an IC device in a stable temperature environment and to select an IC device.
A semiconductor test system for improving the sorting yield of C devices, wherein a cavity is formed in a contact block for electrically connecting a contact pin of a socket and the contact pin of the IC device with an IC device placed therein. A high-temperature control nozzle for injecting a high-temperature control liquid that is a high-temperature control liquid and a low-temperature control nozzle for injecting a low-temperature control liquid that is a low-temperature control liquid in the cavity. And selectively ejecting the high-temperature control liquid or the low-temperature control liquid toward the contact block according to the substrate temperature of the IC device to the IC device to control the temperature of the contact block. A semiconductor test system is provided with a test temperature stabilization control mechanism for keeping a device at a constant temperature. The gist of the invention described in claim 2 is that the socket having a plurality of the contact pins for making electrical connection with the signal pins of the IC device;
The contact block for placing the C device in contact with the upper surface thereof, and the IC having the upper surface in contact with the upper surface of the IC device when selecting the IC device.
A contact block heater for raising the temperature of the device to a specified temperature, the high temperature control nozzle for injecting the high temperature control liquid to the bottom of the contact block heater to raise the temperature, and contacting the low temperature control liquid with the contact The low-temperature control nozzle for jetting to the bottom of the block heater to lower the temperature, a temperature sensor for measuring the temperature of the IC device base, and input to the contact block heater based on temperature data from the temperature sensor A control unit for controlling the power to be applied, a first liquid circulation mechanism for supplying the high-temperature control liquid to the high-temperature control nozzle, and a second liquid circulation mechanism for supplying the low-temperature control liquid to the low-temperature control nozzle. A liquid circulation mechanism, and the used high-temperature control nozzle in which the high-temperature control nozzle and the low-temperature control nozzle are placed and used It has the cavity for collecting liquid or said cold control liquid resides in a semiconductor test system of claim 1, wherein the. The gist of the invention described in claim 3 is that, when selecting the IC device that operates at a high frequency, the temperature of the IC device becomes higher than a specified temperature mainly due to self-heating of the IC device. And a test temperature stabilization control mechanism for injecting the low-temperature control liquid toward the contact block toward the IC device and controlling the temperature of the contact block to keep the IC device at a constant temperature. Item 1 or 2 is the semiconductor test system. The gist of the invention described in claim 4 is that the test temperature stabilization control mechanism contacts the IC device when a base temperature of the IC device exceeds a specified temperature mainly due to self-heating of the IC device. The temperature of the IC device is detected by referring to the temperature data from the temperature sensor provided on the contact block side, and the low-temperature control nozzle is provided from the low-temperature control nozzle provided in the cavity. 4. The semiconductor test system according to claim 1, wherein a liquid is jetted toward the contact block to cool the contact block. 5. The gist of the invention according to claim 5 is that, when the test temperature stabilization control mechanism selects the IC device at a high temperature, the test temperature stabilization control mechanism controls the contact block from the high temperature control nozzle provided in the cavity of the contact block. Injection of the high-temperature control liquid toward a heater performs a test temperature stabilization control that maintains the contact block at a constant high temperature state and maintains the IC device at a specified high temperature via the contact block. The semiconductor test system according to any one of claims 1 to 4, wherein the semiconductor device is configured to select the IC device while performing the selection. The gist of the invention according to claim 6 is that the test temperature stabilization control mechanism includes
When measuring the C device at a high frequency, when the base temperature of the IC device exceeds a specified temperature mainly due to self-heating of the IC device, the side of the contact block that is in contact with the IC device The temperature of the IC device is detected by referring to the temperature data from the temperature sensor provided in the nozzle, and the low-temperature control liquid is supplied to the contact block from the low-temperature control nozzle provided in the cavity. The semiconductor test system according to any one of claims 1 to 5, wherein the semiconductor test system is configured to execute test temperature stabilization control for injecting the cooling gas toward the contact block to cool the contact block. The gist of the invention according to claim 7 is that, when the test temperature stabilization control mechanism sorts the IC device at a high temperature, the test temperature stabilization control mechanism starts the contact block from the high temperature control nozzle provided in the cavity of the contact block. The high-temperature control liquid is ejected toward a heater, and the high-temperature selection of the IC device is performed in a state where the IC device is raised to a specified temperature via the contact block heater. A semiconductor test system according to any one of claims 1 to 4. The gist of the invention according to claim 8 is that, when selecting the IC device at a low temperature in an electrically connected state, the test temperature stabilization control mechanism controls the low temperature control from the low temperature control nozzle provided in the cavity. 6. The semiconductor test according to claim 1, wherein a liquid for use is sprayed toward the contact block to cool the IC device through the contact block. 7. Exist in the system. The gist of the invention according to claim 9 is a test temperature stabilization control method for selecting an IC device in a stable temperature environment to improve the selection yield of the IC device. Pushing in the socket and inserting it into the socket, and contacting the signal pin of the IC device with the contact pin of the socket to make an electrical connection, and then executing a preset test program to select the IC device. And I is provided near a contact block that contacts the IC device during sorting of the IC device.
A step of monitoring the surface temperature of the IC device as needed by referring to temperature data obtained from a temperature sensor for measuring the temperature of the C device, and a step of selecting the IC device at a high temperature when selecting the IC device at a high temperature. In the state where the upper surface is in contact with the upper surface of the IC device, a high-temperature control nozzle provided in the cavity of the contact block is directed toward a contact block heater for raising the IC device to a specified temperature. Injecting a liquid to maintain the contact block at a constant high temperature state and select the IC device while executing a test temperature stabilization control step of maintaining the IC device at a specified high temperature via the contact block A test temperature stabilization control method characterized by comprising the step of: The gist of the invention described in claim 10 is that the test temperature stabilization control step includes the step of operating at a high frequency.
If the temperature of the IC device rises above a specified temperature mainly due to self-heating of the IC device when selecting the C device, the IC device is provided in the cavity of the contact block toward the contact block. The test according to claim 9, further comprising a step of injecting a low-temperature control liquid from a certain low-temperature control nozzle to the IC device and controlling the temperature of the contact block to keep the IC device at a constant temperature. It is in the temperature stability control method. The gist of the invention described in claim 11 is that the test temperature stabilization control step includes contacting the IC device when a base temperature of the IC device exceeds a specified temperature mainly due to self-heating of the IC device. The temperature of the IC device is detected by referring to the temperature data from the temperature sensor provided on the contact block side, and the low-temperature control nozzle is provided from the low-temperature control nozzle provided in the cavity. The test temperature stabilization control method according to claim 9 or 10, further comprising a step of injecting a liquid toward the contact block to cool the contact block. The gist of the invention according to claim 12 is that the test temperature stabilization control step includes the step of:
When sorting the C devices at a high temperature, the high-temperature control liquid is ejected from the high-temperature control nozzle provided in the cavity of the contact block toward the contact block heater, so that the contact block is fixed. 10. The method according to claim 9, further comprising a step of selecting the IC devices while performing a test temperature stabilization control for maintaining the IC devices at a specified high temperature via the contact block while maintaining the IC devices in a high temperature state. A test temperature stabilization control method according to any one of the eleventh to eleventh aspects. The gist of the invention according to claim 13 is that when the IC device is measured at a high frequency, the test temperature stabilization control step is mainly performed by self-heating of the IC device. When the temperature exceeds a specified temperature, the temperature of the IC device is detected by referring to temperature data from the temperature sensor provided on the contact block side in contact with the IC device, and 10. The method according to claim 9, further comprising the step of: injecting the low-temperature control liquid from the low-temperature control nozzle provided in the cavity toward the contact block to execute a test temperature stabilization control for cooling the contact block. 13. The test temperature stabilization control method according to any one of Items 1 to 12. The gist of the invention according to claim 14 is that, in the test temperature stabilization control step, when the IC device is selected at a high temperature, the contact block is provided from the high-temperature control nozzle provided in the cavity of the contact block. The high-temperature control liquid is ejected toward a heater, and the IC device is heated to a specified temperature via the contact block heater.
The test temperature stabilization control method according to any one of claims 9 to 13, further comprising a step of performing high-temperature sorting of the device. The gist of the invention according to claim 15 is that, in the test temperature stabilization control step, when the IC device is selected at a low temperature in an electrically connected state, the low temperature control is performed from the low temperature control nozzle provided in the cavity. The test temperature stabilization control method according to any one of claims 9 to 14, comprising a step of injecting a liquid for use toward the contact block and cooling the IC device through the contact block. Exists.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS When an electronic device such as an IC device (integrated circuit device) operating at a high frequency is selected (screened), it is mainly due to self-heating of the IC device.
There are cases where the temperature of the C device rises above a specified temperature. This causes a reduction in the sorting yield of IC devices. A feature of each embodiment described below is that an IC
In order to increase the device sorting yield, IC
By providing a test temperature stabilization control mechanism that keeps the device at a constant temperature, it is possible to select IC devices at a stable temperature when selecting IC devices, and to improve the IC device selection yield compared to conventional temperature stabilization control technology. What you can do. That is, a cavity is provided in a contact block for making an electrical connection (contact) between a contact pin of a socket and a contact pin of an IC device in a state where the IC device is placed, and a liquid for controlling a high temperature (for controlling a high temperature). Liquid) and a low-temperature control nozzle for injecting a low-temperature control liquid (low-temperature control liquid) in the cavity, and a high-temperature control liquid or low-temperature By providing a test temperature stabilization control mechanism for executing a test temperature stabilization control for controlling the temperature of the contact block by selectively jetting a control liquid in accordance with the substrate temperature of the IC device, Control the temperature. Less than,
Embodiments of the present invention will be described in detail with reference to the drawings.

(First Embodiment) First, a configuration of a semiconductor test system according to the present embodiment will be described. FIG. 1 is a structural diagram for explaining a semiconductor test system 10 according to one embodiment of the present invention. In FIG. 1, 10 is a semiconductor test system of the present embodiment, 12 is an IC device (integrated circuit element), 14 is a socket, 16 is a contact block, 18 is a high-temperature control nozzle, 19 is a high-temperature control liquid, and 20 is Low-temperature control nozzle, 21 is a low-temperature control liquid,
22 is a contact block heater, 24 is a temperature sensor,
26 is a control unit, 28 is a first liquid circulation mechanism, 30 is a second liquid circulation mechanism, 32 is a signal pin, 34 is a contact pin, and 36 is a cavity.

Referring to FIG. 1, a semiconductor test system 10 of the present embodiment is a main body for executing a test temperature stabilization control method of the present invention, and includes a random access memory (RAM) and an MPU (ultra small arithmetic processing). Device), a socket 14 having a plurality of contact pins 34 for making electrical connection (contact) with the signal pins 32 of the IC device 12, and the upper surface of the IC device 12 (the signal pins 32 are arranged). Contact block 1 that is placed in contact with the lower surface opposite to
6. Contact block heater 2 with high temperature control liquid 19
2 and a high-temperature control nozzle 18 for injecting a predetermined surface (specifically, the bottom) to raise the temperature and a low-temperature control liquid 21 to the predetermined surface (specifically, the bottom) of the contact block heater 22. Low-temperature control nozzle 20 for lowering the temperature
A contact block heater 22 for raising the temperature of the IC device 12 to a specified temperature while the upper surface is in contact with the upper surface of the IC device 12 when selecting the IC device 12;
A temperature sensor 24 for measuring the temperature of the substrate of the IC device 12, a control unit 26 for controlling the power input to the contact block heater 22 based on the temperature data from the temperature sensor 24, and a high-temperature control nozzle 19 A first liquid circulation mechanism 28 for supplying to the
The second liquid circulation mechanism 30 for supplying the low-temperature control liquid 21 to the low-temperature control nozzle 20, the high-temperature control nozzle 18, and the used high-temperature control liquid 19 or the used low-temperature control liquid A cavity 36 for collecting the liquid 21 is provided.

Next, the operation of the semiconductor test system 10 will be described. Referring to FIG. 1, the contact block 16 is a mechanism for pushing the IC device 12 into the socket 14 in an appropriate amount. First, by pushing in the contact block 16 by an appropriate amount from the upper surface of the IC device 12, the signal pins 32 of the IC device 12 and the contact pins 34 of the socket 14 are brought into contact to be electrically connected. A cavity 36 is provided inside the contact block 16. Further, inside the cavity 36, a high-temperature control nozzle 18 and a low-temperature control nozzle 20 are provided.
Both the high-temperature control nozzle 18 and the low-temperature control nozzle 20 are installed toward a predetermined surface (specifically, the bottom) of the contact block heater 22. A temperature sensor 24 is provided at a position where the contact block 16 comes into contact with the IC device 12. When selecting the IC device 12 at a high temperature, the control unit 26 controls the power input to the contact block heater 22 based on the temperature data on the IC device 12 obtained from the temperature sensor 24, and the first liquid circulation mechanism 28 By injecting the high-temperature control liquid 19 from the high-temperature control nozzle 18 toward the contact block heater 22 using the control signal from the control unit 26 while feeding the high-temperature control liquid 19 from the contact block heater 22, The selection of the IC devices 12 is performed in a state where the test temperature stabilization control for raising the IC devices 12 to the specified high temperature is executed.

On the other hand, when the IC device 12 self-heats during selection of the IC device 12 operating at a high frequency and exceeds a specified temperature, a temperature sensor 24 provided on the contact block 16 near the IC device 12 is used. The low-temperature control liquid 21 is sent from the second liquid circulating mechanism 30 using the control signal from the control unit 26 while detecting the temperature of the IC device 12 by using the low-temperature control nozzle 20 provided in the hollow portion 36. By injecting the liquid 21 toward the contact block 16, the IC device 12 is cooled via the contact block 16. As a result, control for returning the IC device 12 to the specified temperature (test temperature stabilization control) can be realized. In the present embodiment, the test temperature stabilization control is repeated during the selection of the IC devices 12 to keep the IC devices 12 at a constant temperature.

Next, a test temperature stabilization control method according to the present embodiment will be described. Referring to FIG. 1, in the present embodiment, in order to select an IC device 12, first, I
The C device 12 is pushed into the socket 14 by an appropriate amount from the upper surface and inserted into the socket 14. Subsequently, the signal pins 32 of the IC device 12 are brought into contact with the contact pins 34 of the socket 14 to make an electrical connection (contact). Thereafter, a test program (for example, a test program for the IC device 12) set in advance is executed to select the IC devices 12. During the sorting of the IC devices 12, the IC devices 12 are provided near the contact blocks 16 that are in contact with the IC devices 12, in other words, through the contact blocks 16 that are in contact with the IC devices 12.
The surface temperature of the IC device 12 is monitored as needed by referring to the temperature data obtained from the temperature sensor 24 for measuring the temperature of the IC device 12.

When sorting the IC devices 12 at a high temperature,
The high-temperature control nozzle 18 provided in the cavity 36 of the contact block 16
Injecting the high-temperature control liquid 19 toward the device, the test temperature stabilization control is performed in which the contact block 16 is maintained at a constant high temperature state and the IC device 12 is maintained at a specified high temperature via the contact block 16. The selection of the IC device 12 is performed while doing so.

On the other hand, when measuring the IC device 12 at a high frequency, when the temperature of the base of the IC device 12 exceeds the specified temperature mainly due to the self-heating of the IC device 12, the IC device 12 comes into contact with the IC device 12. The temperature of the IC device 12 is detected by referring to the temperature data from the temperature sensor 24 provided on the contact block 16 side, and the low-temperature control nozzle 20 provided in the cavity 36 is used for the low-temperature control. The test temperature stabilization control for cooling the contact block 16 by injecting the liquid 21 toward the contact block 16 is executed. Thereby, the IC device 12 can be cooled via the contact block 16.

As described above, according to the first embodiment, when the IC device 12 is selected, the test temperature stabilization control is executed, so that the IC device 12 can be selected at a stable temperature. There is an effect that the sorting yield of the IC devices 12 can be improved as compared with the stable control technique.

(Second Embodiment) Next, a second embodiment of the present invention will be described.
An embodiment will be described. The same parts as those already described in the first embodiment are denoted by the same reference numerals, and the duplicate description will be omitted. Referring to FIG. 1, in the second embodiment having a configuration similar to that of the present embodiment, in order to select an IC device 12, first, an IC device 12 is pushed in from a top surface by an appropriate amount and a socket is inserted. Insert into 14. Subsequently, the IC device 12
The signal pins 32 of the socket 14 and the contact pins 34 of the socket 14 are brought into contact to make electrical connection (contact). In the cavity 36 of the contact block 16, the high-temperature control liquid 19 is provided.
And a low-temperature control liquid 21.

When sorting the IC devices 12 at a high temperature,
The high-temperature control nozzle 18 provided in the cavity 36 of the contact block 16
The high-temperature control liquid 19 is jetted toward the IC device 12, and the IC device 12 is sorted at a high temperature in a state where the IC device 12 is raised to a specified temperature via the contact block heater 22.

On the other hand, when the IC device 12 is selected at a low temperature in the above-mentioned electrical connection (contact) state, the cavity 3
6 from the low-temperature control nozzle 20 provided in the low-temperature control liquid 20.
1 is injected toward the contact block 16 to cool the IC device 12 via the contact block 16.
Thus, in addition to the effects described in the first embodiment,
There is an effect that high-temperature sorting and low-temperature sorting can be realized simultaneously at the time of one contact.

It should be noted that the present invention is not limited to the above embodiments, and it is obvious that the above embodiments can be appropriately modified within the scope of the technical idea of the present invention. Further, the number, position, shape, and the like of the constituent members are not limited to the above-described embodiment, and can be set to numbers, positions, shapes, and the like suitable for carrying out the present invention.

[0022]

Since the present invention is configured as described above, by performing the test temperature stabilization control when selecting (screening) an IC device, the IC device can be selected at a stable temperature. There is an effect that the sorting yield of IC devices can be improved as compared with the temperature stability control technology.

[Brief description of the drawings]

FIG. 1 is a structural diagram for explaining a semiconductor test system according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Semiconductor test system 12 ... IC device 14 ... Socket 16 ... Contact block 18 ... High temperature control nozzle 19 ... High temperature control liquid 20 ... Low temperature control nozzle 21 ... Low temperature control liquid 22 ... Contact block heater 24 ... Temperature sensor 26 ... Control unit 28 ... First liquid circulation mechanism 30 ... Second liquid circulation mechanism 32 ... Signal pin 34 ... Contact pin 36 ... Cavity

Claims (15)

[Claims] 1. A semiconductor test system for selecting an IC device in a stable temperature environment to improve the selection yield of the IC device, wherein a contact pin of a socket and the IC device of the IC device are arranged in a state where the IC device is stored. A cavity is provided in a contact block for making electrical connection with contact pins, and a high-temperature control nozzle for injecting a high-temperature control liquid as a high-temperature control liquid and a low-temperature control as a low-temperature control liquid A low-temperature control nozzle for ejecting a control liquid is provided in the cavity, and the high-temperature control liquid or the low-temperature control liquid is selectively directed toward the contact block according to a base temperature of the IC device. The temperature is controlled by controlling the temperature of the contact block by injecting into the IC device.
A semiconductor test system comprising a test temperature stabilization control mechanism for keeping a C device at a constant temperature. 2. The socket having a plurality of the contact pins for making electrical connection with signal pins of the IC device; the contact block for placing the IC device in contact with an upper surface of the IC device; and the IC device. A contact block heater for raising the temperature of the IC device to a specified temperature in a state where the upper surface is in contact with the upper surface of the IC device at the time of sorting, and the high-temperature control liquid is jetted to the bottom of the contact block heater. The high-temperature control nozzle for raising the temperature; the low-temperature control nozzle for injecting the low-temperature control liquid to the bottom of the contact block heater to lower the temperature; and measuring the temperature of the IC device base. A temperature sensor, and input to the contact block heater based on temperature data from the temperature sensor. A first liquid circulation mechanism for supplying the high-temperature control liquid to the high-temperature control nozzle; and a second liquid supply mechanism for supplying the low-temperature control liquid to the low-temperature control nozzle. A liquid circulating mechanism, comprising the hollow portion for collecting the used high-temperature control liquid or the low-temperature control liquid in which the high-temperature control nozzle and the low-temperature control nozzle are placed and used. The semiconductor test system according to claim 1, wherein: 3. When the temperature of the IC device rises above a specified temperature mainly due to self-heating of the IC device when selecting the IC device operating at a high frequency, the IC block is directed toward the contact block. 3. The test temperature stabilization control mechanism according to claim 1, further comprising: injecting the low-temperature control liquid to the IC device to control a temperature of the contact block to keep the IC device at a constant temperature. 4. Semiconductor test system. 4. The test temperature stabilization control mechanism includes the IC
When the substrate temperature of the IC device exceeds a specified temperature mainly due to self-heating of the device, refer to temperature data from the temperature sensor provided on the contact block side in contact with the IC device. And detecting the temperature of the IC device and cooling the contact block by jetting the low-temperature control liquid toward the contact block from the low-temperature control nozzle provided in the cavity. The semiconductor test system according to claim 1, wherein: 5. The test temperature stabilization control mechanism includes the IC
When the device is sorted at a high temperature, the high-temperature control liquid is ejected from the high-temperature control nozzle provided in the cavity of the contact block toward the contact block heater, so that the contact block is kept at a constant high temperature. The apparatus is configured to select the IC devices while executing a test temperature stabilization control for maintaining the IC devices at a designated high temperature via the contact block while maintaining the state. The semiconductor test system according to any one of claims 1 to 4. 6. The test temperature stabilization control mechanism includes the IC
When measuring the device at a high frequency, when the base temperature of the IC device exceeds a specified temperature mainly due to the self-heating of the IC device, the contact block side in contact with the IC device By referring to the temperature data from the provided temperature sensor,
Detecting the temperature of the IC device and executing a test temperature stabilization control for cooling the contact block by injecting the low-temperature control liquid toward the contact block from the low-temperature control nozzle provided in the cavity. 6. The image forming apparatus according to claim 1, wherein:
A semiconductor test system according to any one of the preceding claims. 7. The test temperature stabilization control mechanism includes the IC
When selecting devices at a high temperature, the high-temperature control liquid is ejected from the high-temperature control nozzle provided in the cavity of the contact block toward the contact block heater, and the IC is passed through the contact block heater. 5. The semiconductor test system according to claim 1, wherein the semiconductor device is configured to perform high-temperature sorting of the IC device while the device is heated to a specified temperature. 6. 8. The test temperature stabilization control mechanism, when selecting the IC device at a low temperature in an electrically connected state, applies the low-temperature control liquid to the contact block from the low-temperature control nozzle provided in the cavity. The semiconductor test system according to any one of claims 1 to 5, wherein the semiconductor test system is configured to inject toward the semiconductor device and cool the IC device through the contact block. 9. A test temperature stability control method for selecting an IC device in a stable temperature environment to improve the selection yield of the IC device, wherein the IC device is pushed into the socket by an appropriate amount from the upper surface and inserted into the socket. Performing a preset test program after the signal pins of the IC device are brought into contact with the contact pins of the socket to perform electrical connection, and selecting the IC devices; and selecting the IC devices. A step of monitoring the surface temperature of the IC device at any time by referring to temperature data obtained from a temperature sensor provided near a contact block that contacts the IC device and measuring the temperature of the IC device; When sorting IC devices at a high temperature, the upper surface of the IC devices is sorted out when sorting the IC devices. Injecting a high-temperature control liquid from a high-temperature control nozzle provided in a cavity of the contact block toward a contact block heater for raising the IC device to a specified temperature while being in contact with the upper surface of the chair. A step of holding the contact block at a constant high temperature state and selecting the IC device while executing a test temperature stabilization control step of maintaining the IC device at a specified high temperature via the contact block. A test temperature stabilization control method characterized in that: 10. The test temperature stabilizing control step includes selecting the IC device operating at a high frequency when selecting the IC device.
When the temperature of the IC device rises above a specified temperature mainly due to the self-heating of the C device, the low-temperature control is performed toward the contact block from a low-temperature control nozzle provided in the cavity of the contact block. 10. The test temperature stabilization control method according to claim 9, further comprising a step of injecting a liquid for use into the IC device and controlling a temperature of the contact block to keep the IC device at a constant temperature. 11. The test temperature stabilization control step includes:
When the base temperature of the IC device exceeds a specified temperature mainly due to the self-heating of the C device, the temperature data from the temperature sensor provided on the contact block side in contact with the IC device is referred to. Detecting the temperature of the IC device and cooling the contact block by injecting the low-temperature control liquid from the low-temperature control nozzle provided in the cavity toward the contact block. The test temperature stabilization control method according to claim 9 or 10, wherein: 12. The test temperature stabilization control step includes the step of:
When sorting the C devices at a high temperature, the high-temperature control liquid is ejected from the high-temperature control nozzle provided in the cavity of the contact block toward the contact block heater, so that the contact block is fixed. 10. The method according to claim 9, further comprising a step of selecting the IC devices while performing a test temperature stabilization control for maintaining the IC devices at a specified high temperature via the contact block while maintaining the IC devices in a high temperature state. 12. The test temperature stability control method according to any one of items 11 to 12. 13. The test temperature stability control step according to claim 1, wherein
When measuring the C device at a high frequency, when the base temperature of the IC device exceeds a specified temperature mainly due to self-heating of the IC device, the side of the contact block that is in contact with the IC device The temperature of the IC device is detected by referring to the temperature data from the temperature sensor provided in the nozzle, and the low-temperature control liquid is supplied to the contact block from the low-temperature control nozzle provided in the cavity. The test temperature stabilization control method according to any one of claims 9 to 12, further comprising a step of performing a test temperature stabilization control of injecting air toward the contact block to cool the contact block. 14. The test temperature stabilization control step includes:
When sorting the C devices at a high temperature, the high-temperature control liquid is ejected from the high-temperature control nozzle provided in the cavity of the contact block toward the contact block heater, and the high-temperature control liquid is injected through the contact block heater. The test temperature stabilization control method according to any one of claims 9 to 13, further comprising a step of performing high-temperature sorting of the IC device while the IC device is raised to a specified temperature. 15. The test temperature stabilization control step includes, when the IC device is selected at a low temperature in an electrically connected state, the low temperature control liquid is supplied to the contact block from the low temperature control nozzle provided in the cavity. The test temperature stabilization control method according to any one of claims 9 to 14, further comprising a step of injecting air toward the IC device and cooling the IC device through the contact block.