KR100745032B1 - Burn-In Apparatus - Google Patents

Abstract

Provided is a burn-in apparatus which can reliably adjust the temperatures of a plurality of electronic components having different self-heating amounts to a predetermined temperature at the same time.

On the burn-in board 200, a heater block 420a having a heater 421a, a cooling block 410a having a flow path 411a to 413a through which refrigerant can flow, and a sensor block 430a having a temperature sensor 431a are provided on the burn-in board 200. In the burn-in apparatus which performs burn-in test on the plurality of DUTs simultaneously while contacting a plurality of mounted DUTs, a first accommodation space 415a and a second accommodation space 416a are formed in the cooling block 410a. The heater block 420a is accommodated in the first accommodating space 415a while maintaining a gap between the inner wall surface, and the sensor block 430a is maintained with a gap between the inner wall surface. It is accommodated in the 2nd accommodating space 416a.

Burn-in device

Description

Burn-In Apparatus}

BRIEF DESCRIPTION OF THE DRAWINGS The front view which showed the whole burn-in apparatus which concerns on 1st Embodiment of this invention.

FIG. 2 is a side view of the burn-in device shown in FIG. 1. FIG.

3 is a conceptual diagram showing the system configuration of the burn-in device shown in FIG.

Fig. 4 is a plan view showing the entire burn-in board in which the DUT is mounted in the first embodiment of the present invention.

Fig. 5 is a plan view showing the whole of a temperature adjusting board used in the burn-in apparatus according to the first embodiment of the present invention.

FIG. 6 is a side view of the first temperature adjusting head supported on the temperature adjusting board shown in FIG. 5. FIG.

7 is a top plan view of the first temperature adjusting head shown in FIG. 6;

8 is a bottom plan view of the first temperature adjusting head shown in FIG. 6.

FIG. 9 is a cross-sectional view of the first temperature adjusting head taken along the line VII-VII of FIG. 8. FIG.

FIG. 10 is a cross-sectional view of the first temperature adjusting head taken along the line VII-VII of FIG. 8. FIG.

11 is an electrothermal model of a temperature adjusting head in the first embodiment of the present invention.

12 is a graph showing a temperature adjustable range of the first to third temperature adjusting heads in the burn-in apparatus according to the first embodiment of the present invention.

Fig. 13 is a state diagram for performing temperature adjustment of the DUT by the first temperature adjusting head in the first embodiment of the present invention.

Fig. 14 is a side view showing a second temperature adjusting head used in the burn-in apparatus according to the first embodiment of the present invention.

FIG. 15 is a bottom plan view of the second temperature adjusting head shown in FIG. 14. FIG.

Fig. 16 is a state diagram for performing temperature adjustment of the DUT by the second temperature adjusting head in the first embodiment of the present invention.

It is a side view of the temperature adjusting head in 2nd Embodiment of this invention.

18 is a side view of a temperature adjusting head in a third embodiment of the present invention.

19 is a bottom plan view of the temperature adjusting head shown in FIG. 18;

20 is a schematic view of a refrigerant recovery means of the burn-in device according to the third embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

 1: Burn-in device 100: Burn-in chamber

200: burn-in board 300: temperature control board

301 frame 305 third spring (third pressing means)

400, 400a, 400b, 400 ', 400 ": Temperature adjusting head

410: cooling block 411: inlet flow path

412: interior space 413: exit side flow path

414: bypass 415: the first accommodation space

416: second receiving space 420: heater block (heating block)

421: heater (heating means) 423: first spring (first pressing means)

430: sensor block (measurement block) 431: temperature sensor

433: second spring (second pressurizing means)

600: DUT power supply 700: Heater power supply

800: burn-in controller 900: freezer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in apparatus for performing burn-in tests for removing initial defects of various electronic components such as semiconductor integrated circuits, and more particularly, to a burn-in apparatus for simultaneously performing burn-in tests on a plurality of electronic components.

Burn-in device used for burn-in test, which is a kind of screening test to remove initial defective parts by removing initial defects of electronic parts, and accommodates burn-in boards in which many electronic parts under test are mounted in burn-in chamber. The electrical stress is applied by applying a predetermined voltage, and the air in the burn-in chamber is heated to impart thermal stress to a predetermined temperature, or a heater block is provided instead of heating the air in the burn-in chamber. It is known to perform a burn-in test by applying a heat stress by directly contacting a heater block with an electronic component under test.

Since the burn-in apparatus performs burn-in tests continuously for several hours to several ten hours, burn-in tests are simultaneously performed on a plurality of electronic components to improve test efficiency. It is desirable to test with a uniform thermal stress applied.

However, even in the case of electronic components in the same lot, the power consumption of each electronic component varies due to inherent defects, manufacturing variations, etc., and the self-heating amount of the electronic component itself may vary, so that air in the burn-in chamber is simply changed. Even when heated or in contact with a heater block, it may be difficult to apply uniform thermal stress to a plurality of electronic components tested at the same time.

In particular, in recent years, the amount of self-heating during operation tends to increase according to the increase in capacity, high functionality, and high speed of the IC chip. As a result, the variation of the self-heating amount as described above tends to be large. Further temperature control is required.

An object of the present invention is to provide a burn-in apparatus which can reliably adjust the temperature of a plurality of electronic components having different amounts of self-heating to a predetermined temperature at the same time.

According to a first aspect of the present invention for achieving the above object, there is provided a heating block having a heating means for heating the electronic component under test in a plurality of electronic components under test mounted on a burn-in board and the electronic component under test. A burn-in apparatus for performing a burn-in test on a plurality of electronic components under test simultaneously while contacting a cooling block having a flow path through which a coolant for circulation can be formed, the first apparatus for accommodating the heating block in the cooling block. An accommodating space is formed, and the heating block is provided with a burn-in apparatus accommodated in the first accommodating space with an air layer formed between the cooling block to insulate the cooling block.

In the present invention, a burn-in apparatus for simultaneously performing burn-in test on the electronic component under test while adjusting the temperature of the plurality of electronic components under test mounted on the burn-in board with a heating block and a cooling block, wherein the first accommodating space is provided in the cooling block. And a heating block is accommodated in the first accommodation space while maintaining a clearance.

Accordingly, an air layer is formed between the cooling block for cooling the electronic component under test and the heating block for heating the electronic component under test, the heating block is insulated from the cooling block, and the heating block is cooled. There is no direct heat transfer from the heating block to the cooling block because it is thermally floating relative to the cooling block. Therefore, the electronic parts can be actively or easily heated up by the heating means of the heating block, and the electronic parts can be actively and easily cooled by the refrigerant flowing through the flow path formed in the cooling block. At the same time, it is possible to independently and accurately control the temperature of each electronic component when carrying out a burn-in test on a plurality of electronic components.

Although not specifically limited in the present invention, the heating block is supported to be movable relative to the cooling block, and the end face of the heating block is a line of the cooling block when the heating block is not in contact with the electronic component under test. It is preferable to protrude relatively to the cross section.

When the front end surface of the heating block is in contact with the electronic component under test by protruding from the front end surface of the cooling block, the heating block is in contact with the electronic component under test before the cooling block. As described above, the heating block is supported to be movable relative to the cooling block while maintaining a clearance between the heating block and the inner wall surface of the first accommodating space, that is, the heating block is mechanically supported relative to the cooling block. Since it is in a floating state, the heating block in contact with the electronic component under test before the cooling block performs the matching operation with respect to the electronic component under test. Accordingly, the front end face of the heating block is in close contact with the electronic component under test, so that the electronic component under test can be efficiently heated.

Although it does not specifically limit in the said invention, It is preferable that the 1st pressurizing means which presses the said heating block to the front end side is provided between the said heating block and the said cooling block.

The electronic component under test is provided when the heating block is brought into contact with the electronic component under test by providing a first pressurizing means between the heating block and the cooling block, so that the heating block is pressed against the electronic component under test to be in close contact with the electronic component under test. It is possible to raise the temperature more efficiently.

Although not specifically limited in the present invention, the heating block is pressed toward the contact surface side by the first pressing means in a state where the heating block is not in contact with the electronic component under test, and a part of the heating block is in contact with the cooling block. It is preferable that it is done.

Accordingly, the coolant flowing in the flow path of the cooling block can be heated by using the heat of the heating means of the heating block, and a heater or the like for heating the coolant does not need to be installed separately from the heating means.

Although not specifically limited in the present invention, a measurement block having a measuring means for measuring the temperature of the electronic component under test is further provided, and a second accommodation space for accommodating the measurement block is formed in the cooling block. Preferably, the measuring block is accommodated in the second receiving space in a state in which an air layer is formed between the cooling block to insulate the cooling block.

Accordingly, an air layer is formed between the cooling block for cooling the electronic component under test and the measurement block for measuring the temperature of the electronic component under test, the measurement block is insulated from the cooling block, and the measurement block is a cooling block. Since it floats thermally with respect to, the temperature of the electronic component under test can be accurately measured and the accuracy of temperature adjustment is improved.

In accordance with a second aspect of the present invention for achieving the above object, a cooling block and a blood flow path are formed in a plurality of electronic components under test mounted on a burn-in board, and a flow path capable of circulating refrigerant for cooling the electronic components under test is formed. A burn-in apparatus for carrying out a burn-in test on a plurality of electronic components under test simultaneously while contacting a measuring block having measuring means for measuring the temperature of a test electronic component, wherein the refrigerant flows through the flow path formed in the cooling block. A flow rate variable stage for varying the flow rate is further provided, wherein a second accommodation space for accommodating the measurement block is formed in the cooling block, and the measurement block is spaced between the cooling block so as to be insulated from the cooling block. Provided is a burn-in device accommodated in the second accommodation space with an air layer formed.

In the present invention, the flow rate of the refrigerant flowing through the flow path formed in the cooling block in the burn-in apparatus for performing the burn-in test on the electronic component under test at the same time while adjusting the temperature of the plurality of electronic components under test mounted on the burn-in board. A variable flow rate variable stage is provided and a second accommodating space is formed in the cooling block, and the measurement block is accommodated in the second accommodating space while maintaining a clearance.

Accordingly, the flow rate of the refrigerant can be varied at the variable stage of flow rate without providing heating means such as a heater, thereby reducing or decreasing the cooling thermal resistance in the cooling block, and easily adjusting the temperature of the individual electronic component under test. Therefore, when performing burn-in tests on a plurality of electronic components at the same time, it is possible to independently and accurately control the temperature of each electronic component.

In addition, an air layer is formed between the cooling block for cooling the electronic component under test and the measurement block for measuring the temperature of the electronic component under test, the measurement block is insulated from the cooling block, and the measurement block is a cooling block. Since it floats thermally with respect to, the temperature of the electronic component under test can be accurately measured, and the accuracy of temperature adjustment is improved.

In addition, according to a third aspect of the present invention for achieving the above object, an opening in which a flow path through which a coolant for cooling a plurality of electronic components under test mounted on a burn-in board is allowed to be formed is formed, and the flow path is in communication with the flow path. A measuring block having a cooling block formed on the front end surface, a measuring block for measuring the temperature of the electronic component under test, a flow rate variable stage for varying a flow rate of the refrigerant flowing through the flow path formed in the cooling block, and the flow path At least a refrigerant recovery means for recovering the refrigerant flowing through the cooling block, the second accommodating space for accommodating the measuring block is formed in the cooling block, the measuring block is insulated from the cooling block, It is stored in the second accommodation space with an air layer formed therebetween, and is placed on the electronic component under test mounted on the burn-in board. Press the cooling block and the measuring block to directly contact the surface of the electronic component under test with the refrigerant through the opening, and simultaneously perform the burn-in test on the plurality of electronic components under test; A burn-in apparatus for recovering the coolant by a coolant recovery means is provided.

In the present invention, in the burn-in apparatus which performs burn-in tests on the electronic components under test simultaneously while adjusting the temperatures of the plurality of electronic components under test mounted on the burn-in board, the refrigerant flowing through the flow path formed in the cooling block. A flow rate variable stage for varying the flow rate is provided, and an opening communicating with the flow path is formed in the front end surface of the cooling block. Therefore, when the cooling block is pressed on the electronic component under test, a burn-in test is performed while cooling the electronic component under test by directly contacting the refrigerant supplied through the opening with the surface of the electronic component under test. The refrigerant recovery means recovers the refrigerant from the surface of the electronic component under test.

This makes it possible to directly and easily perform temperature adjustment of individual electronic components under test by varying the flow rate of the refrigerant at variable flow rate stages without installing heating means such as a heater. When the burn-in test is performed, the temperature of each electronic component can be accurately and independently controlled.

Although not specifically limited in the present invention, the measuring block is supported to be movable relative to the cooling block, and the tip end surface of the measuring block is a line of the cooling block when the measuring block is in non-contact with the electronic component under test. It is preferable to protrude relatively to the cross section.

By protruding the leading end face of the measuring block with respect to the leading end face of the cooling block, the measuring block contacts the electronic component under test before the cooling block when contacting the electronic component under test. As described above, the measuring block is supported to be movable relative to the cooling block while maintaining a clearance between the measuring block and the inner wall surface of the second accommodation space, that is, the measuring block is mechanically mounted to the cooling block. Since it is in a floating state, the measuring block in contact with the electronic component under test before the cooling block performs a matching operation with respect to the electronic component under test. Accordingly, since the front end face of the measuring block is in close contact with the electronic component under test, the temperature of the electronic component under test can be measured more accurately.

Although it does not specifically limit in the said invention, It is preferable that the 2nd pressurizing means which presses the said measurement block to the front end surface side between the said measurement block and the said cooling block is provided.

By providing a second pressurizing means between the measuring block and the cooling block, when the measuring block contacts the electronic component under test, the measuring block is properly pressed against the electronic component under test so that it is in close contact with the electronic component under test. The temperature can be measured more accurately.

Although not specifically limited in the present invention, the measuring block is pressed toward the tip side by the second pressing means in a state where the measuring block is not in contact with the electronic component under test, and a part of the measuring block contacts the cooling block. It is preferable that it is done.

By contacting a part of the measuring block with the cooling block before contacting the electronic component under test, it is also possible to monitor the temperature of the cooling block, the operating state of the heating means of the heating block, or the measuring means can perform self-diagnosis.

In the present invention, although not particularly limited, the apparatus further includes a temperature adjusting board which supports the plurality of cooling blocks in a frame, and a burn-in chamber capable of accommodating the burn-in board and having the temperature adjusting board. The control board is preferably installed in the burn-in chamber such that each cooling block faces the electronic component under test mounted on the burn-in board.

The apparatus further includes a temperature adjusting board supporting the plurality of cooling blocks in a frame so as to mechanically float each cooling block with respect to the temperature adjusting board.

Accordingly, it is possible to allow the variation of the height or inclination of each electronic component under test mounted on the burn-in board, so that the cooling block can be closely attached to the electronic component under test, so that the temperature of the electronic component under test can be accurately adjusted.

Although not particularly limited in the present invention, it is preferable that each of the cooling blocks is respectively supported by the frame through third pressing means for pressing the respective cooling blocks toward the opposite burn-in boards in the burn-in chamber. Do.

By providing a third pressurizing means between each cooling block and the frame, when each cooling block comes into contact with the electronic component under test, the respective cooling block is properly pressed against the electronic component under test so as to be in close contact with each other. The temperature of the electronic component under test can be adjusted more accurately.

Although it does not specifically limit in the said invention, It is preferable that at least one part of each flow path formed in the said some cooling block is connected in series.

In this way, by connecting the flow paths in series, an increase in the number of connection points of the pipes on the temperature control board can be suppressed as compared with the case where all of them are connected in parallel, and the reliability of the pipes can be improved.

Although not specifically limited in the said invention, It is preferable that the said cooling block is provided with the bypass path which bypasses the said refrigerant | coolant from the said flow path.

By providing such a bypass path in the cooling block, the flow rate of the refrigerant flowing through the flow path can be adequately secured when the temperature adjustment of the electronic component under test, in which the power consumption is relatively low and the self-heating amount is not large, is secured. The temperature of an electronic component can be adjusted suitably.

Although it does not specifically limit in the said invention, It is preferable that the said flow volume variable stage is provided in the said flow path or the said bypass path. Moreover, although it does not specifically limit in the said invention, It is preferable to further provide the refrigerator which can adjust the temperature and flow volume of the said refrigerant | coolant.

Although not particularly limited in the present invention, the temperature adjusting board preferably has a first cooling block in which the bypass path is formed and a second cooling block in which the bypass path is not formed.

By providing two types of cooling blocks with different cooling performance with or without bypass on the same temperature control board, it is possible to cope with a wide range of self-heating DUTs in the same burn-in apparatus.

Although not particularly limited in the present invention, the bypass chamber has a plurality of temperature adjusting boards, wherein one of the plurality of temperature adjusting boards has a first cooling block in which the bypass passage is formed. It is preferable that the other temperature control board has a second cooling block in which the bypass path is not formed. This makes it possible to cope with a wide range of self-heating DUTs in the same burn-in apparatus.

Although not specifically limited in the above invention, the temperature adjusting board preferably has two or more kinds of cooling blocks having different thermal resistances between the refrigerant and the electronic component under test.

By providing two or more types of cooling blocks with different thermal resistances between the refrigerant and the electronic component under test on the same temperature control board, it is possible to cope with a wide range of self-heating DUTs in the same burn-in apparatus.

Although not specifically limited in the above invention, the burn-in chamber has a plurality of temperature adjusting boards, and between the refrigerant in the cooling block of the temperature adjusting board of one of the plurality of temperature adjusting boards and the electronic component under test. It is preferable that the thermal resistance of and the thermal resistance between the refrigerant in the cooling block of the temperature adjusting board and the electronic component under test are different from each other. This makes it possible to cope with a wide range of self-heating DUTs in the same burn-in apparatus.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described by drawing.

[First embodiment]

1 is a front view showing the entire burn-in apparatus according to the first embodiment of the present invention, FIG. 2 is a side view of the whole burn-in apparatus shown in FIG. 1, FIG. 3 is a conceptual diagram showing the system configuration of the burn-in apparatus shown in FIG. 4 is a plan view showing the entire burn-in board on which the DUT according to the first embodiment of the present invention is mounted.

First, the overall configuration of the burn-in device 1 according to the first embodiment of the present invention will be described. As shown in Figs. 1 to 3, the burn-in device 1 is a test target, for example, an IC chip, or the like. Represented by the DUT (Device Uuder Test, corresponding to the electronic component to be tested in the claims) can accommodate the burn-in board 200 is mounted, the temperature control head 400 is the burn-in board 200 Burn-in chamber 100 having a temperature adjusting board 300 disposed to face the DUT, a DUT power supply 600 for applying a power supply voltage to the DUT, and a temperature adjusting head 400 of the temperature adjusting board 300. A heater power supply 700 for driving a heater of the heater, a burn-in controller 800 for performing temperature control of the DUT and control of a power supply voltage or a signal, and a temperature control head of the temperature control board 300 ( A refrigerator 900 for supplying a coolant to 400 is provided.

The burn-in apparatus 1 presses the temperature adjusting head 400 of the temperature adjusting board 300 to the DUT to adjust the temperature of the DUT by means of a heater and a coolant, applying a thermal stress, and applying a power voltage to the DUT. This is a monitored burn-in device that can monitor the characteristics of the output circuit of the DUT while screening while applying a signal close to the actual operation to the input circuit.

In addition, the burn-in device 1 is a magnetic element such as a medium heat generation type of about 0 to 100 [W], a high heat generation type of about 100 to 200 [W], or an ultra high heat generation type of about 200 to 300 [W]. 640 DUTs with different calorific value can be burned-in at the same time.

The burn-in chamber 100 of the burn-in apparatus 1 which concerns on this embodiment has the inner compartment partitioned by the heat insulation wall etc. as shown in FIG. 1 and FIG. 2, and the door which can be opened and closed in order to put the burn-in board in and out of the said inner chamber. . In addition, the slot 110 for supporting the burn-in board 200 is arranged in two rows of 16 stages in the inner chamber of the burn-in chamber 100, so that a total of 32 burn-in boards 200 can be accommodated. The number and arrangement of slots 110 in this burn-in chamber 100 are not particularly limited in the present invention, but can be set arbitrarily in consideration of test efficiency and the like.

In addition, as shown in FIG. 2, each of the slots 110 is provided with a connector 120 into which an edge connector 202 (see FIGS. 3 and 4) of the burn-in board 200 can be inserted. The connector 120 is electrically connected to the DUT power supply 600 and the burn-in controller 800 as shown in FIG. In addition, although only one set of the burn-in board 200 and the temperature control board 300 are illustrated in FIG. 3, the other 31 sets of the burn-in board 200 and the temperature control board 300 are similarly applied. 600, a heater power supply 700, a burn-in controller 800, and a refrigerator 900. The air in the burn-in chamber 100 is not controlled to the extent that the DUT temperature can be adjusted, but blowing is performed by a fan (not shown) or the like for suppressing the retention of heated air around the DUT.

Here, the burn-in board 200 accommodated in the burn-in chamber 100 is demonstrated. As shown in FIG. 4, the burn-in board 200 includes 20 burn-in sockets 201 capable of mounting a DUT arranged in four rows and five columns on a board having excellent heat resistance. An edge connector 202 is formed which can be inserted into the connector 120 formed in the chamber 100 once. The number and arrangement of the burn-in sockets 201 on the burn-in board 200 are not particularly limited in the present invention, but can be arbitrarily set in consideration of test efficiency and the like.

On the board is a printed wiring (not shown) for electrically connecting between the edge connector 202 and each burn-in socket 201, the edge connector 202 of the burn-in board 200 is burn-in chamber 100 When inserted into the connector 120, each DUT mounted on the burn-in board 200 is electrically connected to the DUT power supply 600 and the burn-in controller 800 through the printed wiring and the burn-in socket 201. In addition, although not shown in particular, the operation of inserting and removing the DUT into each burn-in socket 201 of the burn-in board 200 is performed using, for example, an inserter, an insert remover, a loader unloader, etc. Is performed outside of.

In the burn-in chamber 100, as shown in FIGS. 1 to 3, 32 temperature adjusting boards 300 for performing temperature adjustment of the DUT are supported by the burn-in boards 200 supported in the respective slots 110. Exposed to face The temperature regulating board 300 is capable of raising and lowering in the vertical direction by driving the air cylinder 130 (see FIG. 3) by the control of the burn-in controller 800, and during the burn-in test, the temperature adjusting head 400. Is contacted to the DUT, and the temperature control head 400 can be released from the DUT during the non-test. In addition, the temperature control board 300 will be described later in detail.

As shown in FIG. 3, the power supply 600 for the DUT of the burn-in apparatus 1 according to the present embodiment includes the connector 120 of the burn-in chamber 100, the edge connector 202 of the burn-in board 200, the printer wiring, and the like. The burn-in socket 201 is connected so that a power supply voltage can be applied to each DUT, and is controlled by the burn-in controller 800. In addition, the heater power supply 700 is connected to supply electric power to each heater (described later) installed in each temperature control board 300 in the burn-in chamber 100, as shown in FIG. Is controlled by

In addition to controlling the temperature of the DUT, the voltage applied to the DUT, and the applied signal during the burn-in test, the burn-in controller 800 of the burn-in apparatus 1 according to the present embodiment judges that the DUT having a strange reaction during the burn-in test is defective. For example, the number of slots in the burn-in chamber 100 and the serial number of the DUT corresponding to the position on the burn-in board 200 can be stored to feed back the test results.

The burn-in controller 800 is connected to each temperature sensor (described later) installed in each temperature control board 300 in the burn-in chamber 100 to detect the temperature of each DUT as shown in FIG. The DUT is connected to the power supply 600 and the refrigerator 900 for controlling each DUT temperature. Furthermore, it is connected to the power supply 600 for the DUT so as to control the power supply voltage applied to each DUT.

These DUT power supply 600, heater power supply 700, and burn-in controller 800 are housed in the instrumentation shelf 500 shown in FIG.

The refrigerator 900 of the burn-in apparatus 1 according to the present embodiment is a temperature control board of each cabinet of the burn-in chamber 100 containing refrigerant such as a fluorine-based inert liquid (for example, Fluorinert FC-323 manufactured by Slim Co., Ltd.). While circulating to the cooling block (described later) of 300, the temperature and flow rate of the refrigerant can be adjusted by the control of the burn-in controller 800. In addition, the refrigerant | coolant in this invention is not limited to said liquid, For example, gas may be sufficient.

Hereinafter, the temperature control board 300 used for the burn-in apparatus 1 which concerns on this embodiment is demonstrated in detail.

FIG. 5 is a plan view showing the entire temperature adjusting board used in the burn-in device according to the first embodiment of the present invention, FIG. 6 is a side view of the first temperature adjusting head supported on the temperature adjusting board shown in FIG. 6 is a top plan view of the first temperature control head shown in FIG. 6, FIG. 8 is a bottom plan view of the first temperature control head shown in FIG. 6, and FIG. 9 is a cross-sectional view of the first temperature control head along line IX to IX in FIG. 10 is a cross-sectional view of the first temperature adjusting head taken along the line X-X in FIG. 8, FIG. 11 is an electrothermal model of the temperature adjusting head in the first embodiment of the present invention, and FIG. 12 is the first embodiment of the present invention. Fig. 13 is a graph showing the temperature adjustable range of the first to third temperature regulating heads in the burn-in apparatus, and Fig. 13 is a state diagram in which the temperature adjustment of the DUT is performed by the first temperature regulating head in the first embodiment of the present invention. 14 is used for a burn-in apparatus according to the first embodiment of the present invention. 2 is a side view showing the temperature adjusting head, FIG. 15 is a bottom plan view of the second temperature adjusting head shown in FIG. 14, and FIG. 16 is a state diagram for performing temperature adjustment of the DUT by the second temperature adjusting head in the first embodiment of the present invention. to be.

As shown in FIGS. 5 and 6, the temperature adjusting board 300 according to the present embodiment includes 20 temperature adjusting heads 400 for performing temperature adjustment of the DUT and a frame supporting the temperature adjusting head 400. 301 and a main pipe 302 and a branch pipe 303 for supplying the refrigerant from the refrigerator 900 to the cooling block of each of the temperature adjusting heads 400.

The frame 301 of the temperature control board 300 has a total of four rows and five columns so as to correspond to the arrangement of the DUT mounted on the burn-in board 200 (arrangement of the burn-in socket 201) as described above. It is a flat member formed with twenty openings 3011. As shown in FIG. 6, a temperature adjusting head 400 is inserted into each of the openings 3011, and as shown in FIGS. 9 and 10, each of the temperature adjusting heads 400 has an opposite burn-in board ( The support part 304 of the frame 301 is movably supported with respect to the frame 301 through a third spring 305 (third pressing means) which pushes the temperature adjusting head 400 on the side of 200. .

As described above, the respective temperature adjusting heads 400 are mechanically floated with respect to the temperature adjusting board 300, thereby changing the height or slope of each DUT mounted on the burn-in board 200. 400) is acceptable.

In addition, each temperature control head 400 is supported by the frame 301 through a third spring 305 that pushes the temperature control head 400 toward the burn-in board 200, so that each temperature control head 400 When the contact with the DUT it is possible to push each of the temperature adjustment head 400 with respect to the DUT as appropriate.

The temperature adjusting head 400 in 1st Embodiment of this invention is the 1st temperature adjusting head 400a corresponding to the DUT of the medium heat generation type of about 0-100 [W], for example, and 100-100, for example. A second temperature adjusting head 400b for coping with a high heat generation type DUT of about 200 [W], and a third temperature adjusting head for coping with an ultra high heat generation type DUT of about 200 to 300 [W], In consideration of the self-heating amount of the DUT to be tested, an appropriate one from a total of three types of temperature adjusting heads can be used to cope with a wide range of self-heating DUTs with the same burn-in device 1 (see Fig. 12). In addition, although a 2nd and 3rd temperature adjustment head is demonstrated in detail later, the structure other than the temperature adjustment head in the temperature adjustment board 300 is the same, even if it employs what kind of temperature adjustment head.

As shown in FIG. 6, the first temperature adjusting head 400 includes a cooling block 410a for cooling the DUT, a heater block 420a for heating the DUT, and a sensor block 430a for measuring the temperature of the DUT. ).

The cooling block 410a of the first temperature adjusting head 400a is made of a material having excellent thermal conductivity, such as aluminum or copper, and as shown in FIGS. 6 and 7, a freezer inside the cooling block 410a. An internal space 412a for circulating the refrigerant supplied from 900 is formed. In addition, the inlet side flow passage 411a communicating with the branch pipe 303 and the inner space 412a is formed in the cooling block 410a so as to extend in the inclined lower direction along the direction of travel of the refrigerant, An outlet side flow path 413a which communicates the space 412a and the branch pipe 303 is formed to extend in an upward direction inclined along the traveling direction of the coolant, so that the inner space 412a can be distributed by using the flow of the coolant. It is supposed to be.

In the first temperature adjusting head 400a, the refrigerant supplied from the refrigerator 900 to the cooling block 410a through the main pipe 302 and the branch pipe 303 passes through the inlet-side flow path 411a from the branch pipe 303. By flowing through the internal space 412a, it is possible to cool the DUT in contact with the cooling block 410a.

In addition, between the inlet side passage 411a and the outlet side passage 413a, a branch is formed between the inlet side passage 411a and the outlet side passage 413a to bypass the refrigerant to the internal space 412a. A path 414a is formed.

The medium heat generation type DUT targeted by the first temperature control head 400a has a relatively low self heating value compared to the high heat generation or ultra high heat generation type DUT described above. If a refrigerant having a flow rate equivalent to that of the third temperature regulating head is circulated in the internal space 412a, there is a fear that it is impossible to apply a predetermined heat stress to the DUT. In contrast, in the first temperature adjusting head 400a in the present embodiment, the excess flow rate refrigerant is bypassed in the bypass path 414a to limit the flow rate of the refrigerant flowing through the internal space 412a. Accordingly, when adjusting the temperature of the DUT having a relatively low self-heating amount, the flow rate of the refrigerant flowing through the internal space can be appropriately adjusted, so that the temperature of the DUT can be appropriately adjusted.

The cooling block 410a is formed with a first accommodating space 415a for accommodating the heater block 420a and a second accommodating space 416a for accommodating the sensor block 430a.

As shown in FIGS. 6, 8, and 9, the first accommodating space 415a may secure a predetermined clearance between the accommodated heater block 420a and the inner wall surface of the first accommodating space 415a. The first receiving space 415a is formed to open a surface of the cooling block 410a in contact with the DUT.

Similarly, the second accommodating space 416a also secures a predetermined clearance between the accommodated sensor block 430a and the inner wall surface of the second accommodating space 416a as shown in FIGS. 6, 8, and 10. The second accommodating space 416a is formed to open a surface of the side of the cooling block 410a in contact with the DUT.

Like the cooling block 410a, the heater block 420a of the first temperature adjusting head 400a is made of a material having excellent thermal conductivity, such as aluminum or copper, and has a substantially convex shape as shown in FIG. The convex part 422a which protrudes convexly is formed in the front-end | tip, and the heater 421a of about 100 [W] heat generation, for example, is put inside. This heater 421a is connected so that electric power can be supplied from the above-mentioned heater power supply 700 as shown in FIG.

As shown in FIGS. 6 and 8, the heater block 420a maintains a space between the heater block 420a and the inner wall surface of the first accommodation space 415a of the cooling block 410a. Housed in

Accordingly, the heater block 420a is accommodated with the clearance maintained with respect to the first accommodating space 415a, such that an air layer is formed between the heater block 420a and the cooling block 410a and the cooling block 410a. Since the heater block 420a is insulated from the heater block 420a and the heater block 420a is thermally floating with respect to the cooling block 410a, heat is not directly transmitted from the heater block 420a to the cooling block 410a. .

As shown in FIG. 9, the heater block 420a is supported by the cooling block 410a through first springs 423a (first pressurizing means) at both upper ends thereof, and is supported by the first springs 423a. By pushing downward. Accordingly, when the heater block 420a is not in contact with the DUT, the heater block 420a is pushed by the first spring 423a so that the shoulder 424 of the heater block 420a is pressed against the cooling block 410a. In contact. In addition, the tip surface of the convex portion 422a protrudes relative to the tip surface of the cooling block 410a by pressing the first spring 423a.

As such, when the front end surface of the convex portion 422a of the heater block 420a is protruded relative to the front end surface of the cooling block 410a, the heater block 420 is formed before the cooling block 410a when contacted with the DUT. Contact. In addition, the heater block 420a is movably supported with respect to the cooling block 410a while maintaining a clearance with respect to the inner wall surface of the first accommodation space 415a, that is, the heater block 420a is supported by the cooling block ( By being in a mechanically floating state with respect to 410a, the heater block 420a in contact with the DUT before the cooling block 410a is able to perform a matching operation with respect to the DUT.

Further, by installing a first spring 423a for pushing the heater block 420a to the DUT side between the heater block 420a and the cooling block 410a, the heater block 420a contacts the DUT when the heater block 420a contacts the DUT. 420a can be pushed against the DUT as appropriate.

Like the cooling block 410a, the sensor block 430a of the first temperature adjusting head 400a is made of a material having excellent thermal conductivity such as aluminum and copper, and has a generally convex shape as shown in FIG. The convex part 432a which protrudes convexly is formed in the front-end | tip, and the temperature sensor 431a, such as a platinum sensor, is put inside, for example. This temperature sensor 431a is connected so that the temperature of the detected DUT can be transmitted to the burn-in controller 800 mentioned above as shown in FIG.

As shown in FIGS. 6 and 8, the sensor block 430a is accommodated in the second accommodating space 416a while being spaced apart from an inner wall surface of the second accommodating space 416a of the cooling block 410a. have.

Accordingly, the sensor block 430a is accommodated with a clearance maintained with respect to the second accommodation space 416a, and an air layer is formed between the sensor block 430a and the cooling block 410a, and the sensor block 430a. ) Is insulated from the cooling block 410a, so that the sensor block 430a is thermally floating with respect to the cooling block 410a, and thus heat is not directly transmitted from the cooling block 410a to the sensor block 430a. Therefore, the temperature of the DUT can be measured accurately.

As shown in Fig. 10, the sensor block 430a is supported by the cooling block 410a through second springs 433a (second pressurizing means) at both ends thereof, and is supported by the second springs 433a. By pushing downward. Accordingly, in the state in which the sensor block 430a is not in contact with the DUT, the sensor block 430a is pushed by the second spring 433a so that the shoulder 434 of the sensor block 430a contacts the cooling block 410a. It is. Further, by pressing the second spring 433a, the distal end surface of the convex portion 432a protrudes relative to the distal end surface of the cooling block 410a.

When the front end surface of the convex portion 432a of the sensor block 430a is projected relative to the front end surface of the cooling block 410a, the sensor block 430a is contacted before the cooling block 410a when the DUT is contacted. In addition, the sensor block 430a is movably supported with respect to the cooling block 410a while maintaining a clearance with respect to the inner wall surface of the second accommodation space 416a, that is, the sensor block 430a is supported by the cooling block 410a. The sensor block 430a in contact with the DUT prior to the cooling block 410a is able to perform a matching operation with respect to the DUT.

In addition, by installing a second spring 433a for pushing the sensor block 430a to the DUT side between the sensor block 430a and the cooling block 410a, when the sensor block 430a contacts the DUT, 430a can be pushed against the DUT as appropriate.

Since the heater block 420a floats thermally with respect to the cooling block 410a, the first temperature adjusting head 400a configured as described above shows the amount of heat generated by the DUT that can be expressed in the heat transfer model, as shown in FIG. 11. Hd [W], the temperature of the coolant is Tw [° C.], the amount of heat generated by the heater 421a is Hh [W], and the thermal resistance between the DUT and the coolant is θcw [° C./W]. [° C.] is represented by Tc = Tw + θcw (Hh + Hd). Also in this heat transfer model and equation, the heat flow radiating heat from the heater block 420a having the heater 421a to the surrounding air is very small, and most of the heat generated from the heater block 420a flows to the DUT, thereby heating the heater block 420a. It is understood that the DUT can be actively heated.

In addition, the thermal resistance θcw referred to herein refers to the contact thermal resistance at the contact portion between the cooling block 410a and the DUT surface, the thermal resistance of the cooling block 410a itself, and the refrigerant thermal resistance due to the heat transfer area of the refrigerant. Consists of.

In this regard, in the first temperature adjusting head 400a in the present embodiment, as shown in Fig. 12, when the temperature of the refrigerant is variable in the range of 27 [° C.] ≦ Tw ≦ 80 [° C.], the thermal resistance ( By setting θcw) = 0.6 [° C / W], the temperature Tc of the DUT having a variation in self-heating amount in the range of 0 [W] to 100 [W] is added or subtracted by the heater 421a to reduce the DUT temperature. It can be set in the range of 87 [° C] to about 140 [° C].

The first temperature control head 400a is supported on the frame 301 in four rows and five columns, as shown in FIG. 5, in which the refrigerant from the refrigerator 900 is supplied with each first temperature control head. The main pipe 302 and the branch pipe 303 for supplying to 400a are provided. Five branch pipes 303 branch in parallel from one main pipe 302, and the inner spaces 412a of the four heads 400a lined up in the same row in the frame 301 by each branch pipe 303. It is connected in series. In addition, although not shown in particular, the pressure of a refrigerant | coolant is adjusted by the orifice etc., for example so that the pressure of the refrigerant | coolant in each 1st temperature control head 400a may become substantially uniform.

Thus, by connecting the internal spaces 412a of the respective first temperature adjusting heads 400a in series, the pipes in the temperature adjusting board 300 are compared with the case where all the temperature adjusting heads are connected in parallel. The increase in the number of connection points can be suppressed and the reliability of the pipe can be improved.

Next, the operation of the burn-in apparatus 1 to which the first temperature adjusting head 400a is applied will be described.

The burn-in board 200 in which the DUT is mounted in each slot 110 of each burn-in chamber 100 is accommodated, and the edge connector 202 of each burn-in board 200 is connected to the connector 120 of the burn-in chamber 100. When the door of the burn-in chamber 100 is closed and the burn-in test is started at the same time as pressing the start button (not shown), the air cylinder 130 is driven to descend by the control signal of the burn-in controller 800, Each temperature control board 300 in the burn-in chamber 100 descends with respect to the burn-in board 200 accommodated in the slot 110, and the first temperature control head 400a arranged on the temperature control board 300 is It is in contact with the DUT arranged on the burn-in board 200.

In this contact, the heater block 420a is contacted before the cooling block 410a because the front end surface of the convex portion 422a of the heater block 420a is relatively protruded with respect to the front end surface of the cooling block 410a. Since the heater block 420a is in a mechanically floating state with respect to the cooling block 410a, the heater block 420a contacting the DUT prior to the cooling block 410a performs a matching operation with respect to the DUT. The front end face of the block 420a comes into close contact with the DUT, thereby effectively raising the temperature of the DUT.

In addition, when the first temperature control head 400a contacts the DUT by providing a first spring 423a for pushing the heater block 420a to the DUT side between the heater block 420a and the cooling block 410a. The heater block 420a is pushed in close contact with the DUT so that the heater block 420a can be heated up more efficiently.

Similarly, since the front end surface of the convex portion 432a of the sensor block 430a protrudes relative to the front end surface of the cooling block 410a, the cooling block 410a when the first temperature control head 400a contacts the DUT. The sensor block 430a is contacted before And, since the sensor block 430a is in a mechanically floating state with respect to the cooling block 410a, the sensor block 430a contacting the DUT before the cooling block 410a performs a matching operation with respect to the DUT, and the sensor block ( The tip surface of 430a is in close contact with the DUT, so that the temperature of the DUT can be measured more accurately.

In addition, a second spring 433a is installed between the sensor block 430a and the cooling block 410a, so that the heater block 420a is connected to the DUT when the first temperature adjusting head 400a contacts the DUT. Proper push and close ensures accurate temperature measurements of the DUT.

Furthermore, since each of the first temperature adjusting heads 400a is supported to be movable with respect to the temperature adjusting board 300, the first temperature adjusting heads 400a are mounted on the burn-in board 200 when the first temperature adjusting heads 400a are in contact with the DUT. A variation in height or inclination of each DUT can be allowed in each of the first temperature adjusting heads 400a, and the first temperature adjusting head 400a can be brought into close contact with the DUT. 400a) makes it possible to adjust the temperature of the DUT more accurately.

In addition, each of the first temperature adjusting head 400a is supported by the frame 301 through the third spring 305, so that when the first temperature adjusting head 400a contacts the DUT, 400a) can be pushed against the DUT appropriately to be in close contact with each other, and the temperature of the DUT can be adjusted more accurately by the first temperature adjusting head 400a.

In addition, the heater block 420a contacts the cooling block 410a by the action of the first spring 423a until the first temperature adjusting head 400a contacts the DUT. However, since the temperature of the refrigerant flowing in the flow path of the cooling block 410a can be increased by the heater 421a of the heater block 420a, there is no need to provide a heater or the like for heating the refrigerant in the refrigerator 900.

Similarly, the sensor block 430a is in contact with the cooling block 410a by the action of the second spring 433a until the first temperature adjusting head 400a contacts the DUT. However, this monitors the temperature of the cooling block 410a and the operation of the heater 421a of the heater block 420a, or the temperature sensor 431a itself can perform self-diagnosis.

As shown in FIG. 13, when the first temperature adjusting head 400a contacts the DUT, the burn-in controller 800 monitors the temperature of the DUT by the temperature sensor 431a of the sensor block 430a and applies thermal stress to the DUT. The heater 421a of the heater block 420a is heated to apply a predetermined DUT temperature. This DUT temperature is 125 [° C], for example.

When the temperature of the DUT reaches a predetermined temperature, the burn-in controller 800 passes through the connector 120 of the burn-in chamber 200 and the edge connector 202 of the burn-in board 200 for each DUT. Perform the screen while applying a signal close to the action. Since the DUT self-heats due to the application of this power supply voltage and the temperature of the DUT changes, the temperature of the DUT is adjusted to a predetermined temperature by turning on / off the heater 421a while monitoring the temperature of the DUT by the temperature sensor 431a. .

When applying the heat scare, since the heater block 420a is in a thermally floating state with respect to the cooling block 410a, heat is not directly transmitted from the heater block 420a to the cooling block 410a, so that the heater block ( 420a) allows the individual DUTs to be actively warmed up, and the DUTs can be actively cooled by the cooling block 410a, so that each DUT can be performed simultaneously with the burn-in test for a plurality of DUTs. The temperature of can be controlled independently and accurately.

In addition, when the heat stress is applied, since the sensor block 430a is in a thermally floating state with respect to the cooling block 410a, heat is not directly transferred from the cooling block 410a to the sensor block 430a. The temperature can be measured accurately, which improves the accuracy of temperature control of the DUT.

The burn-in test as described above is continuously performed for several hours to several tens of hours, and the DUT having an abnormal reaction during the burn-in test is judged to be a defective product, for example, the serial number of the DUT is stored in the burn-in controller 800 to test the result. It is possible to feed back.

Next, the second temperature adjusting head 400b for responding to a DUT of high heat generation type of, for example, about 100 to 200 [W] will be described.

As shown in FIGS. 14 to 16, the second temperature adjusting head 400b includes a cooling block 410b for cooling the DUT, a heater block 420b for heating the DUT, and a temperature of the DUT. The sensor block 430b is provided, and a bypass path for bypassing the refrigerant to the internal space is not formed in the cooling block 410b.

The second temperature adjusting head 400b is designed for a high heat generation type DUT having a relatively high heat generation amount of about 100 to 200 [W], and high cooling performance is required compared to the first temperature adjusting head 400a. As shown in the figure, a bypass path such as the first temperature adjusting head 400a described above is not formed, so that the total amount of the refrigerant supplied from the branch pipe 303 through the inlet flow path 411b and the outlet flow path 413b. This internal space 412b flows.

In this second temperature adjusting head 400b, the thermal resistance θcw between the DUT and the refrigerant is set to 0.4 [° C / W], and the thermal resistance θcw is lower than that of the first temperature adjusting head 400a. Improve the cooling efficiency. In addition, as a method of adding or subtracting the thermal resistance (θcw), for example, a method of increasing the pressing force of the temperature adjusting head, forming a cooling block with a material superior in thermal conductivity, or enlarging the heat transfer area of the refrigerant can be exemplified. have.

Accordingly, as shown in FIG. 12, when the temperature of the refrigerant is variable in the range of 27 [° C.] ≤ Tw ≤ 80 [° C.], the DUT has a variation in the self heating value in the range of 100 [W] to 200 [W]. By adding or subtracting the temperature Tc from the heater 421b, the DUT temperature can be arbitrarily set within the range of about 107 [deg.] C to about 160 [deg.] C.

Next, a third temperature adjusting head for responding to a DUT of a super heat generation type of, for example, about 200 to 300 [W] will be described.

Although not specifically shown, this 3rd temperature regulation head is fundamentally the same structure as the 2nd temperature regulation head 400b. However, the third temperature adjusting head is targeted for an ultra-high heat generation type DUT of 200 [W] to 300 [W], and higher cooling performance is required than the second temperature adjusting head 400b.

In the third temperature adjusting head, the thermal resistance θcw between the DUT and the refrigerant is 0.28 [° C / W] so that the thermal resistance θcw is lower than that of the second temperature adjusting head 400c. Improve.

Accordingly, as shown in FIG. 12, when the temperature of the refrigerant is variable in the range of 27 [° C.] ≤ Tw ≤ 80 [° C.], the DUT has a variation in the self heating value in the range of 200 [W] to 300 [W]. By adding or subtracting the temperature Tc from the heater built in the heater block, the DUT temperature can be arbitrarily set within the range of about 111 [° C.] to about 164 [° C.].

In the burn-in apparatus 1 according to the present embodiment, each DUT is selected from the above three types of temperature regulating heads in which the cooling performance is changed by changing the thermal resistance between the DUT and the cooling block. By selecting a suitable one for the self calorific value, the DUT having a wide range of self calorific value of about 0 [W] to 300 [W] can be coped with by the same burn-in apparatus.

Further, the first to third temperature adjusting heads may be mounted in the same temperature adjusting board 300, and the first temperature adjusting head 400a is mounted on one temperature adjusting board 300 and the other temperature adjusting board is mounted. The second temperature regulating head 400b may be mounted at 300, and the third temperature regulating head may be mounted at another temperature regulating board 300.

Second Embodiment

It is a side view of the temperature adjusting head in 2nd Embodiment of this invention.

In the burn-in device according to the second embodiment of the present invention, the structure of the temperature adjusting head is different from that of the burn-in device 1 according to the first embodiment, but other configurations are the same as the burn-in device 1 according to the first embodiment. . Hereinafter, only the difference with the burn-in apparatus 1 which concerns on 1st Embodiment is demonstrated about the burn-in apparatus which concerns on 2nd Embodiment.

In the present embodiment, the temperature adjusting head 400 'is not provided with a heater block as shown in Fig. 17, but instead of the valve 417' (flow rate) in the bypass passage 414 'of the cooling block 410'. The variable means) is different from the first temperature adjusting head 400a in the first embodiment in that the variable means is provided, but the rest of the configuration is the same.

In the first temperature adjusting head 400a of the first embodiment, the temperature is controlled by the heater 421a of the heater block 420a, whereas the temperature of the DUT is controlled by the heater 421a of the first embodiment. Instead, the valve 417 'is opened and closed to adjust the flow rate of the refrigerant flowing in the internal space 412a through the flow paths 411a and 413a, thereby allowing the temperature of the DUT to be adjusted.

Although not shown in particular, the valve 417 'provided in the temperature adjusting head 400' is connected to the burn-in roller so as to be controllable, and the valve 417 'is opened and closed by on / off control of the burn-in controller. The flow rate of the refrigerant flowing through the furnace 414 'is adjusted. The valve 417 'may be provided in the inlet side passage 411' or the outlet side passage 413 'instead of the bypass passage 414'.

As described above, in the burn-in apparatus according to the second embodiment of the present invention, the valve 417 'is provided in the inlet side flow passage 411' formed in the cooling block 410 'of the temperature adjusting head 400' instead of the heater. The flow rate of the coolant is varied by the valve 417 'to reduce or decrease the cooling thermal resistance in the cooling block 410'. Accordingly, since the temperature adjustment of the individual DUTs can be easily performed, the temperature of each DUT can be accurately and independently controlled when the burn-in test is performed on the plurality of DUTs at the same time.

[Third Embodiment]

FIG. 18 is a side view of the temperature adjusting head in the third embodiment of the present invention, FIG. 19 is a bottom plan view of the temperature adjusting head shown in FIG. 18, and FIG. 20 is a refrigerant of the burn-in device according to the third embodiment of the present invention. It is a schematic diagram of a recovery means.

In the burn-in apparatus according to the first and second embodiments described above, the temperature adjustment of the DUT is performed by intermittently cooling the DUT by the refrigerant through a cooling block. In the burn-in apparatus according to the third embodiment of the present invention, the refrigerant is supplied to the DUT. Perform direct temperature adjustment of the DUT by direct contact.

Therefore, the burn-in device 1 according to the first embodiment is different in that the burn-in device according to the third embodiment of the present invention has a different structure of the temperature adjusting head and further includes a coolant recovery means for recovering the coolant after the burn-in test. Although different from this, the other structure is the same as the burn-in apparatus 1 which concerns on 1st Embodiment. Hereinafter, only the difference with the burn-in apparatus 1 which concerns on 1st Embodiment about the burn-in apparatus which concerns on 3rd Embodiment is demonstrated.

First, the temperature adjusting head 400 "according to the present embodiment will be described. As shown in FIGS. 18 and 19, the temperature adjusting head 400" is the second temperature adjusting head 400b according to the first embodiment. 14 to 16, the cooling block 410 " of the temperature adjusting head 400 " corresponds to the lower half of the cooling block 410b of the second temperature adjusting head 400b. This is different from the second temperature regulating head 400b according to the first embodiment in that there is no valve and a valve 417 "(flow rate variable stage) is provided instead of the heater block.

More specifically, the cooling block 410 "of the temperature adjusting head 400" according to the present embodiment cuts the cooling block 410b of the second temperature adjusting head 400b so as to open in its internal space 412b. It has a shape. Accordingly, the inlet side flow passage 411 "communicating with the branch pipe 303 is opened in the inlet opening 4111" formed in the lower end surface of the cooling block 410 ". The outlet side flow path 413 "is also opened in the outlet side opening 4131 formed in the lower surface of the cooling block 410",

In addition, a second accommodating space 416 "is formed in the cooling block 410" of the temperature adjusting head 400 ", and the sensor block 430" in which the temperature sensor 431 "is incorporated maintains the clearance. In one state, it is accommodated in the accommodation space 416 ". Moreover, the temperature adjusting head 400 which concerns on this embodiment is equipped with the heater block incorporating a heater similarly to the temperature adjusting head 400 'which concerns on 2nd Embodiment.

In addition, an annular packing 418 "is mounted on the lower end of the cooling block 410" at the outer periphery and at the periphery of the second accommodation space 416 "in which the sensor block 430" is accommodated.

Therefore, when the temperature adjusting head 400 "according to the present embodiment is in contact with the DUT, as shown in FIG. 18, the lower surface of the temperature adjusting head 400" and the upper surface of the packing 418 "and the DUT are shown. The space 419 "is contoured so that the refrigerant | coolant CL supplied through the inlet opening 4111" of the inlet flow path 411 "enters the space 419", and the refrigerant directly contacts the DUT. I can do it.

Furthermore, the temperature adjusting head 400 "according to the present embodiment has a valve 417" for adjusting the flow rate of the refrigerant, and the valve 417 "has an inlet side flow path formed in the cooling block 410". 411 ". In addition, the attachment position of this valve 417" is not specifically limited in this invention, For example, it may be provided in the exit side flow path.

Although not shown in particular, the valve 417 "provided in the temperature adjusting head 400" is in contact with the burn-in controller so that it can be controlled, the valve 417 "is opened and closed by the on / off control of the burn-in controller, The flow rate of the refrigerant flowing through the side flow passage 411 "is adjusted.

Next, the refrigerant recovery means of the burn-in apparatus according to the present embodiment will be described. As shown in FIG. 20, the refrigerant recovery means in the present embodiment is provided in the refrigerator 900 ", and this refrigerator 900" A pump 901 for circulating the refrigerant, a heat exchanger 902 for cooling the refrigerant by thermally transferring heat of the refrigerant to cooling water of about 20 [° C.] or less, and a tank 903 for storing the recovered refrigerant. ), A compressed gas supply device 904 for recovering the refrigerant, the temperature adjusting head 400 "(more specifically, the flow paths 411" and 413 ") from the pump 901, and the tank 903. And a circulation path that reaches the pump 901 again through the heat exchanger 902.

Two valves S1 and S2 are provided on this circulation path. The first valve S1 is provided between the pump 901 and the temperature regulating head 400 ", and the second valve S2 is provided between the temperature regulating head 400" and the tank 903.

Moreover, the compressed gas supply device 904 is continuous through the third valve S3 in this circulation path. The compressed gas supply device 904 is a device for supplying compressed gas to the circulation path in order to forcibly recover the refrigerant directly in contact with the DUT to the tank 903 after the burn-in test. As a gas supplied by this compressed gas supply apparatus 904, nitrogen gas can be illustrated, for example. In addition, by employing the recovery of the refrigerant using the compressed gas, the fourth valve S4 is provided in the tank 903 to release the pressure by the compressed gas to the atmosphere after the refrigerant recovery. Although not particularly shown, the first to fourth valves S1 to S4 are connected to the burn-in controller so as to be controllable, and the valves S1 to S4 are opened and closed by on / off control of the burn-in controller. .

Next, the recovery method of the refrigerant recovery means provided in the refrigerator 900 '' will be described.

First, when the temperature adjustment of the DUT is performed during the burn-in test, the first and second valves S1 and S2 are opened, and the third and fourth valves S3 and S4 are closed to form a circulation path. Accordingly, in this state, the refrigerant circulates through the circulation path by the action of the pump 901, the refrigerant cooled in the heat exchanger 902 is supplied to the temperature regulating head 400 ″, and the used refrigerant passes through the tank 903. It is cooled again in the heat exchanger 902 via it.

Subsequently, when the burn-in test is completed, the pump 901 is stopped and the valves of the second to fourth valves S2 to S4 are opened. Therefore, in this state, the circulation path is closed at the first valve S1 and instead the temperature regulating head 400 'from the compressed gas supply device 904 by opening the second to fourth valves S2 to S4. A recovery path for reaching the tank 903 via is formed. Then, when supplied from the compressed gas supply device 904 into the recovery path, the refrigerant remaining in the temperature adjusting head 400 "is extruded by the compressed gas and recovered to the tank 903. When recovery of the refrigerant is completed, all The valves S1 to S4 are closed.

As described above, in the burn-in apparatus according to the third embodiment of the present invention, when the cooling block 410 "of the temperature adjusting head 400" is pressed against the DUT, the inlet opening part of the inlet flow path 411 "is pressed. By controlling the opening and closing of the valve 417 "by directly contacting the surface of the DUT with the refrigerant supplied through the 4111", it is possible to directly adjust the temperature of the individual DUTs, and simultaneously perform burn-in tests on the plurality of DUTs. In this case, the temperature of each DUT can be accurately and independently controlled.

In addition, by providing the above-mentioned recovery means in the refrigerator 900 ", the refrigerant which is in direct contact with the DUT can be recovered after the burn-in test is completed.

In addition, embodiment described above was described in order to make understanding of this invention easy, and was not described in order to limit this invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents falling within the technical scope of the present invention.

In the above-described embodiment, the burn-in device is described as a monitored burn-in device. However, the present invention is not particularly limited to this. For example, the screen is applied to the DUT while applying a power supply voltage at constant temperature and applying a signal close to actual operation to the input circuit of the DUT. It may be a dynamic burn-in device which performs a power supply voltage to the DUT by applying a power supply voltage to the DUT under high temperature, and performs a screen by applying temperature and voltage stress to the DUT, and includes a general burn-in device.

Claims (28)

A plurality of electronic components under test mounted on a burn-in board are contacted with a heating block having heating means for heating the electronic components under test and a cooling block having a flow path through which a refrigerant for distributing the electronic components under test can be flown. In the burn-in apparatus for performing a burn-in test on the plurality of electronic components under test at the same time, The first receiving space for accommodating the heating block is formed in the cooling block, And a clearance is formed between the heating block and the inner wall surface of the first accommodation space such that the heating block is insulated from the cooling block. The method of claim 1, A first pressing means is installed between the heating block and the cooling block, The heating block is fluidly supported relative to the cooling block through the first pressurizing means, And the tip end surface of the heating block protrudes relative to the tip end surface of the cooling block while the heating block is in contact with the electronic component under test. The method of claim 2, The first press means means for pressing the heating block to the front end side, characterized in that the burn-in device. The method of claim 3, wherein Burn-in apparatus, characterized in that the heating block is pressed toward the contact surface side by the first pressing means, the heating block is in contact with the electronic component under test, a part of the heating block is in contact with the cooling block. . The method of claim 1, Further comprising a measuring block having a measuring means for measuring the temperature of the electronic component under test, A second accommodation space is formed in the cooling block to accommodate the measurement block, And a clearance is formed between the measurement block and the inner wall surface of the second accommodation space so that the measurement block is insulated from the cooling block. The method of claim 5, A second pressing means is installed between the measuring block and the cooling block, The measuring block is movably supported relative to the cooling block through the second pressing means, In the state where the measuring block is not in contact with the electronic component under test, Burn-in apparatus, characterized in that the front end surface of the measuring block is projected relative to the front end surface of the cooling block. The method of claim 6, The second pressing means presses the measuring block toward the tip end side; The method of claim 7, wherein In the state where the measuring block is not in contact with the electronic component under test, And the measuring block is pressed toward the tip side by the second pressing means so that a part of the measuring block is in contact with the cooling block. A plurality of electronic components under test mounted on a burn-in board are contacted with a heating block having heating means for heating the electronic components under test and a cooling block having a flow path through which a refrigerant for distributing the electronic components under test can be flown. In the burn-in apparatus for performing a burn-in test on the plurality of electronic components under test at the same time, It further includes a flow rate variable stage for varying the flow rate of the refrigerant flowing through the flow path formed in the cooling block A second accommodation space is formed in the cooling block to accommodate the measurement block, And a clearance is formed between the measurement block and the inner wall surface of the second accommodation space so that the measurement block is insulated from the cooling block. The method of claim 9, A second pressing means is installed between the measuring block and the cooling block, The measuring block is movably supported relative to the cooling block through the second pressing means, In the state where the measuring block is not in contact with the electronic component under test, Burn-in apparatus, characterized in that the front end surface of the measuring block is projected relative to the front end surface of the cooling block. The method of claim 10, And said second pressing means presses said measuring block toward the front end face side. The method of claim 11, In the state where the measuring block is not in contact with the electronic component under test, And the measuring block is pressed toward the tip side by the second pressing means so that a part of the measuring block is in contact with the cooling block. A cooling block having a flow path through which a refrigerant for cooling the plurality of electronic components under test mounted on the burn-in board is formed, and an opening communicating with the flow path being formed at the front end surface thereof; A measuring block having measuring means for measuring a temperature of the electronic component under test; A variable flow rate stage for varying a flow rate of the refrigerant flowing through a flow path formed in the cooling block; At least a refrigerant recovery means for recovering the refrigerant flowing through the flow path, A second accommodation space is formed in the cooling block to accommodate the measurement block, Clearance is formed between the measuring block and the inner wall surface of the second accommodation space so that the measuring block is insulated from the cooling block. The cooling block and the measuring block are pressed against the electronic component under test mounted on the burn-in board, and simultaneously with respect to the plurality of electronic components under test while directly contacting the refrigerant through the opening with the surface of the electronic component under test. Perform burn-in tests, And the refrigerant is recovered by the refrigerant recovery means when the burn-in test is completed. The method of claim 13, A second pressing means is installed between the measuring block and the cooling block, The measuring block is movably supported relative to the cooling block through the second pressing means, In the state where the measuring block is not in contact with the electronic component under test, Burn-in apparatus, characterized in that the front end surface of the measuring block is projected relative to the front end surface of the cooling block. The method of claim 14, The second pressing means presses the measuring block toward the tip end side; The method of claim 15, In the state where the measuring block is not in contact with the electronic component under test, And the measuring block is pressed toward the tip side by the second pressing means so that a part of the measuring block is in contact with the cooling block. The method according to any one of claims 1 to 16, A temperature adjusting board which supports the plurality of cooling blocks in a flowable manner to the frame through third pressing means installed between the cooling block and the frame; The burn-in board can accommodate the burn-in board, and further includes a burn-in chamber having the temperature adjusting board. The temperature adjusting board is a burn-in device, characterized in that each cooling block is installed in the burn-in chamber so as to face each of the electronic components under test mounted on the burn-in board. The method of claim 17, The third pressurizing means pressurizes each cooling block toward the burn-in board facing each other in the burn-in chamber. The method of claim 17, Burn-in apparatus, characterized in that the cooling blocks in the same row in each of the flow path formed in the plurality of cooling blocks are connected in series The method of claim 19, And a bypass path for bypassing the refrigerant from the flow path in the cooling block. The method of claim 20, And said flow rate variable stage is provided in said passage or in said bypass passage. The method of claim 20, And the temperature control board has a first cooling block in which the bypass path is formed and a second cooling block in which the bypass path is not formed. The method of claim 20, The burn-in chamber has a plurality of the temperature adjusting board, The temperature control board of one of the plurality of temperature control boards has a first cooling block in which the bypass path is formed, and the other temperature control boards have a second cooling block in which the bypass path is not formed. Featuring a burn-in device. The method of claim 17, And the temperature control board has two or more types of cooling blocks having different thermal resistances between the refrigerant and the electronic component under test. The method of claim 17, The burn-in chamber has a plurality of the temperature adjusting board, Thermal resistance between the refrigerant in the cooling block of the temperature adjusting board of one of the plurality of temperature adjusting boards and the electronic component under test, and the refrigerant in the cooling block of the other temperature adjusting board; Burn-in apparatus, characterized in that the thermal resistance between the electronic component under test is different. A heating block having heating means for heating the electronic component under test, A temperature adjusting head having a cooling block in which a flow path through which a refrigerant for cooling the electronic component under test is circulated is formed, The first receiving space for accommodating the heating block is formed in the cooling block, And a clearance is formed between the heating block and the inner wall surface of the first accommodation space so that the heating block is insulated from the cooling block. The method of claim 26, Further comprising a measuring block having a measuring means for measuring the temperature of the electronic component under test, A second accommodation space is formed in the cooling block to accommodate the measurement block, And a clearance gap is formed between the measurement block and the inner wall surface of the second accommodation space such that the measurement block is insulated from the cooling block. A cooling block having a flow path through which a coolant for cooling the electronic component under test can be passed; A temperature adjusting board having a measuring block having measuring means for measuring a temperature of an electronic component under test, A second accommodation space is formed in the cooling block to accommodate the measurement block, And a clearance gap is formed between the measurement block and the inner wall surface of the second accommodation space such that the measurement block is insulated from the cooling block.

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