JP3765818B2 - Burn-in equipment - Google Patents

Description

  The present invention relates to a burn-in apparatus for performing a burn-in test for extracting initial defects of various electronic components such as semiconductor integrated circuits, and more particularly to a burn-in apparatus for performing a burn-in test on a large number of electronic components simultaneously.

  As a burn-in device used in burn-in testing, which is a type of screening test for extracting initial defects in electronic components and removing early-failed products, burn-in boards with a large number of electronic components to be tested are burned in. Instead of heating the air in the burn-in chamber to apply a predetermined voltage and applying thermal stress at a predetermined temperature by applying a predetermined voltage to the chamber, or heating the air in the burn-in chamber There is known a heater block in which a burn-in test is performed by applying a thermal stress by directly contacting the heater block with an electronic component to be tested.

  In such a burn-in apparatus, a burn-in test is performed continuously for a long time from several hours to several tens of hours. Therefore, in order to improve test efficiency, a burn-in test is simultaneously performed on a large number of electronic components. At this time, it is desirable that the test be performed in a state in which as many thermal stresses as possible are applied to the large number of electronic components to be tested.

  However, in reality, even in the case of electronic components in the same lot, the power consumption of each electronic component differs due to inherent defects or manufacturing variations, etc., and there may be variations in the amount of self-heating of the electronic components themselves. Therefore, even if the air in the burn-in chamber is simply heated or the heater block is brought into contact, it may be difficult to apply a uniform thermal stress to a plurality of electronic components being tested at the same time. .

  In particular, there is a tendency for the amount of self-heating during operation to increase as the capacity, functionality, and speed of IC chips increase in recent years, but this also increases the variation in self-heating as described above. Due to the tendency, accurate temperature control of each electronic component in the burn-in test is further required.

An object of the present invention is to provide a burn-in device capable of reliably adjusting the temperature of a large number of electronic components having different self-heat generation amounts to a predetermined temperature at the same time.
In order to achieve the above object, according to a first aspect of the present invention, a heating block having a heating means for heating a plurality of electronic components to be tested mounted on a burn-in board to the electronic components to be tested; A burn-in apparatus that simultaneously performs a burn-in test on the plurality of electronic devices under test while contacting a cooling block formed with a flow path through which a refrigerant can flow in order to cool the electronic devices under test. The cooling block is formed with a first housing space for housing the heating block, and the heating block is insulated from the cooling block so as to be insulated from the cooling block. A burn-in device housed in the first housing space in a state where a layer is formed is provided (see claim 1).

According to the present invention, in the burn-in apparatus that performs the burn-in test on the electronic devices under test at the same time while adjusting the temperatures of the electronic devices under test mounted on the burn-in board by the heating block and the cooling block , 1 accommodation space is formed, and the heating block is accommodated in the first accommodation space with the clearance maintained.

  Thereby, an air layer is formed between the cooling block for cooling the electronic device under test and the heating block for heating the electronic device under test, and the heating block is insulated from the cooling block, Since the heating block is thermally floated with respect to the cooling block, heat is not directly transferred from the heating block to the cooling block. Therefore, the temperature of each electronic component can be positively and easily raised by the heating means of the heating block, and the electronic component is actively and easily cooled by the refrigerant flowing through the flow path formed in the cooling block. Therefore, it is possible to independently and accurately control the temperature of each electronic component when performing a burn-in test on a plurality of electronic components at the same time.

  Although not particularly limited in the above invention, the heating block is supported so as to be swingable with respect to the cooling block, and in the state where the heating block is not in contact with the electronic device under test, the front end surface of the heating block Preferably protrudes relative to the front end surface of the cooling block (see claim 2).

  By projecting the front end surface of the heating block with respect to the front end surface of the cooling block, the heating block comes into contact with the electronic device under test before contacting the electronic device under test. As described above, the heating block is supported so as to be swingable with respect to the cooling block while maintaining a clearance between the heating block and the inner wall surface of the first housing space. Since the cooling block is mechanically in a floating state, the heating block that comes into contact with the electronic device under test prior to the cooling block performs a copying operation on the electronic device under test. Thereby, since the front end surface of the heating block is in close contact with the electronic device under test, the electronic device under test can be efficiently heated.

  Although not particularly limited in the above invention, it is preferable that first urging means for urging the heating block toward the tip side is provided between the heating block and the cooling block. reference).

  By providing the first urging means between the heating block and the cooling block, when the heating block comes into contact with the electronic device under test, the heating block is appropriately pressed against the electronic device under test and comes into close contact with the electronic device under test. Therefore, the temperature of the electronic device under test can be raised more efficiently.

  Although not particularly limited in the above invention, the heating block is urged toward the contact surface by the first urging means in a state where the heating block is not in contact with the electronic device under test. It is preferable that a part is in contact with the cooling block (see claim 4). This makes it possible to increase the temperature of the refrigerant flowing through the flow path of the cooling block using the heat of the heating means of the heating block, and it is necessary to provide a heater or the like for heating the refrigerant separately from the heating means. Disappears.

Although not particularly limited in the above invention, it further comprises a measurement block having a measurement means for measuring the temperature of the electronic device under test, and the cooling block has a second accommodation space for accommodating the measurement block. The measurement block is accommodated in the second accommodation space with an air layer formed between the measurement block and the cooling block so as to be insulated from the cooling block. Preferred (see claim 5).

  As a result, an air layer is formed between the cooling block that cools the electronic device under test and the measurement block that measures the temperature of the electronic device under test, and the measurement block is insulated from the cooling block. Is thermally floated with respect to the cooling block, the temperature of the electronic device under test can be accurately measured, and the accuracy of temperature adjustment is improved.

In order to achieve the above object, according to a second aspect of the present invention, a flow path through which a refrigerant for cooling the electronic device under test can be distributed to a plurality of electronic devices under test mounted on a burn-in board. A burn-in apparatus that simultaneously performs a burn-in test on the plurality of electronic devices to be tested while contacting the cooling block formed with a measuring block having a measuring means for measuring the temperature of the electronic devices to be tested And further comprising flow rate varying means for varying the flow rate of the refrigerant flowing through the flow path formed in the cooling block, and forming a second accommodation space in the cooling block for accommodating the measurement block. being, the measuring block, with the air layer is formed between said cooling block so as to be thermally insulating to the cooling block, the second housing space Burn-in apparatus is provided which is accommodated (see claim 6).

According to the present invention, in a burn-in apparatus that simultaneously performs a burn-in test on an electronic device under test while adjusting the temperature of a plurality of electronic devices under test mounted on the burn-in board with the cooling block, the flow formed in the cooling block is measured. A flow rate varying means for varying the flow rate of the refrigerant flowing through the passage is provided, a second accommodation space is formed in the cooling block , and the measurement block is accommodated in the second accommodation space in a state where the clearance is maintained.

  This makes it possible to adjust the cooling heat resistance in the cooling block by changing the flow rate of the refrigerant by the flow rate changing means without providing a heating means such as a heater, and easily adjust the temperature of each electronic device under test. Therefore, when performing a burn-in test on a plurality of electronic components at the same time, the temperature of each electronic component can be controlled independently and accurately.

  In addition, an air layer is formed between the cooling block for cooling the electronic device under test and the measurement block for measuring the temperature of the electronic device under test, and the measurement block is insulated from the cooling block. Since the measurement block is thermally floated with respect to the cooling block, the temperature of the electronic device under test can be accurately measured, and the accuracy of temperature adjustment is improved.

Furthermore, in order to achieve the above object, according to the third aspect of the present invention, a flow path is formed through which a coolant for cooling a plurality of electronic devices to be tested mounted on the burn-in board can flow. A cooling block in which an opening communicating with the flow path is formed on a front end surface, a measurement block having a measuring means for measuring the temperature of the electronic device under test, and a flow path formed in the cooling block At least a flow rate varying means for varying the flow rate of the refrigerant flowing through the flow path, and a refrigerant collecting means for collecting the refrigerant flowing through the flow path, and a second block for accommodating the measurement block in the cooling block An accommodation space is formed, and the measurement block is accommodated in the second accommodation space with an air layer formed between the measurement block and the cooling block so as to be insulated from the cooling block. Cage, to have been the device under test mounted on the burn-in board, the cooling block and against the measurement block, while the coolant through the opening in direct contact with the surface of the device under test, the A burn-in apparatus is provided that performs a burn-in test on a plurality of electronic devices under test at the same time and, when the burn-in test is completed, recovers the refrigerant by the refrigerant recovery means (see claim 7).

  According to the present invention, in a burn-in apparatus that simultaneously performs a burn-in test on an electronic device under test while adjusting the temperature of a plurality of electronic devices under test mounted on the burn-in board with the cooling block, the flow formed in the cooling block is measured. A flow rate varying means for varying the flow rate of the refrigerant flowing through the passage is provided, and an opening communicating with the flow path is formed on the front end surface of the cooling block. When the cooling block is pressed against the test electronic component, a burn-in test is performed while cooling the electronic device under test by bringing the coolant supplied through the opening into direct contact with the surface of the electronic device under test. After the burn-in test, the refrigerant is recovered from the surface of the electronic device under test by the refrigerant recovery means.

  This makes it possible to directly and easily adjust the temperature of each electronic component under test by varying the flow rate of the refrigerant with the flow rate varying means without providing a heating means such as a heater, and simultaneously controlling a plurality of electronic devices. When performing a burn-in test on a component, the temperature of each electronic component can be accurately controlled independently.

  Although not particularly limited in the above invention, the measurement block is supported so as to be swingable with respect to the cooling block, and the tip of the measurement block is in a state where the measurement block is not in contact with the electronic component to be tested. It is preferable that the surface protrudes relatively to the front end surface of the cooling block (see claim 8).

  By projecting the front end surface of the measurement block with respect to the front end surface of the cooling block, when contacting the electronic device under test, the measurement block contacts the electronic device under test prior to the cooling block. As described above, the measurement block is supported so as to be swingable with respect to the cooling block while maintaining a clearance between the measurement block and the inner wall surface of the second accommodation space. Since it is mechanically floating with respect to the cooling block, the measurement block that contacts the electronic device under test prior to the cooling block performs a copying operation on the electronic device under test. Thereby, since the front end surface of the measurement block is in close contact with the electronic device under test, the temperature of the electronic device under test can be measured more accurately.

  Although not particularly limited in the above invention, it is preferable that second urging means for urging the measurement block toward the front end surface side is provided between the measurement block and the cooling block. 9).

  By providing the second urging means between the measurement block and the cooling block, when the measurement block comes into contact with the electronic device under test, the measurement block is appropriately pressed against the electronic device under test and brought into close contact with the electronic device under test. As a result, the temperature of the electronic device under test can be measured more accurately.

  Although not particularly limited in the above invention, when the measurement block is not in contact with the electronic device under test, the measurement block is urged toward the tip by the second urging means, and one of the measurement blocks is It is preferable that the portion is in contact with the cooling block (see claim 10).

  By contacting a part of the measurement block with the cooling block before contacting the electronic device under test, the temperature of the cooling block and the operating state of the heating means of the heating block can be monitored, or self-diagnosis of the measurement means can be performed. It is also possible to do.

  Although not particularly limited in the above invention, further comprising: a temperature adjustment board that supports a plurality of the cooling blocks swingably on a frame; and a burn-in chamber that can accommodate the burn-in board and has the temperature adjustment board. The temperature adjustment board is preferably provided in the burn-in chamber so that each of the cooling blocks faces the electronic device under test mounted on the burn-in board. reference).

  A temperature adjustment board supporting a plurality of cooling blocks swingably on the frame is further provided, and each cooling block is mechanically floated with respect to the temperature adjustment board.

  As a result, variations in the height and inclination of each electronic device under test mounted on the burn-in board can be allowed, so that the cooling block can be brought into close contact with the electronic device under test. It is possible to adjust the temperature accurately.

  Although not particularly limited in the above invention, each of the cooling blocks is respectively applied to the frame via third urging means that urges the cooling blocks toward the burn-in board facing each other in the burn-in chamber. It is preferably supported (see claim 12).

  By providing the third urging means between each cooling block and the frame, when each cooling block comes into contact with the electronic device under test, the respective cooling block is appropriately pressed against the electronic device under test. Thus, the temperature of the electronic device under test can be adjusted more accurately.

  Although not particularly limited in the above invention, it is preferable that at least a part of each flow path formed in the plurality of cooling blocks is connected in series (see claim 13).

  Thus, by connecting the flow paths in series, it is possible to suppress an increase in the number of pipe connection points on the temperature adjustment board as compared to the case where all are connected in parallel, and the reliability of the pipes. Can be increased.

  Although not particularly limited in the above invention, it is preferable that the cooling block is provided with a bypass passage for bypassing the refrigerant from the passage (see claim 14).

  By providing such a bypass path in the cooling block, when adjusting the temperature of the electronic device under test that consumes relatively little power and does not generate a large amount of self-heating, the flow rate of the refrigerant flowing through the flow path is ensured appropriately. The temperature of the electronic device under test can be adjusted appropriately.

  Although not particularly limited in the above invention, the flow rate varying means is preferably provided in the flow path or in the bypass path (see claim 15). Moreover, although it does not specifically limit in the said invention, It is preferable to further provide the chiller which can adjust the temperature and flow volume of the said refrigerant | coolant.

  Although not particularly limited in the above invention, the temperature adjustment board preferably includes a first cooling block in which the bypass path is formed and a second cooling block in which the bypass path is not formed. Item 16).

  By providing the same temperature adjustment board with two types of cooling blocks having different cooling performance depending on the presence or absence of a bypass path, it is possible to support a wide range of self-heating DUTs with the same burn-in device.

  Although not particularly limited in the above invention, the burn-in chamber has a plurality of the temperature adjustment boards, and among the plurality of temperature adjustment boards, one of the temperature adjustment boards is a first in which the bypass path is formed. It is preferable that the other temperature adjustment board has a second cooling block that has a cooling block and in which the bypass path is not formed (see claim 17). As a result, it is possible to handle a wide range of self-heating DUTs with the same burn-in device.

  Although not particularly limited in the above invention, the temperature adjustment board preferably has two or more types of cooling blocks having different thermal resistances between the refrigerant and the electronic device under test (see claim 18). .

  By providing two or more types of cooling blocks with different thermal resistances between the refrigerant and the electronic device under test on the same temperature control board, the same burn-in device supports a wide range of self-heating DUTs. It becomes possible.

  Although not particularly limited in the above invention, the burn-in chamber has a plurality of the temperature adjustment boards, and among the plurality of temperature adjustment boards, the refrigerant in the cooling block included in one of the temperature adjustment boards and the device under test It is preferable that the thermal resistance between the electronic component and the thermal resistance between the refrigerant and the electronic device under test in the cooling block of the other temperature adjustment board are different from each other (see claim 19). . As a result, it is possible to handle a wide range of self-heating DUTs with the same burn-in device.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
1 is a front view showing the entire burn-in apparatus according to the first embodiment of the present invention, FIG. 2 is a side view of the entire burn-in apparatus shown in FIG. 1, and FIG. 3 is a conceptual diagram showing the system configuration of the burn-in apparatus shown in FIG. FIG. 4 is a plan view showing the entire burn-in board on which the DUT according to the first embodiment of the present invention is mounted.

  First, the overall configuration of the burn-in device 1 according to the first embodiment of the present invention will be described. As shown in FIGS. 1 to 3, the burn-in device 1 is a DUT represented by, for example, an IC chip to be tested. (Device Under Test, which corresponds to the electronic device under test in the claims) can be accommodated, and the temperature adjustment head 400 for adjusting the temperature of the DUT is opposed to the burn-in board 200. A burn-in chamber 100 having a temperature adjustment board 300 arranged, a DUT power supply 600 for applying a power supply voltage to the DUT, and a heater power supply 700 for driving the heater of the temperature adjustment head 400 of the temperature adjustment board 300. , DUT temperature control and control of power supply voltage and signal application, etc. And over down-in controller 800, and a chiller 900 for supplying refrigerant to the temperature adjustment head 400 of the temperature adjustment board 300.

  This burn-in device 1 presses the temperature adjustment head 400 of the temperature adjustment board 300 against the DUT, adjusts the temperature of the DUT with a heater and refrigerant, applies a power supply voltage while applying thermal stress, and actually operates the input circuit of the DUT. This is a monitored burn-in device that can perform screening while applying a signal close to 1 and monitor the characteristics of the output circuit of the DUT.

  The burn-in device 1 is, for example, a medium heat generation type of about 0 to 100 [W], a high heat generation type of about 100 to 200 [W], or an ultra-high heat generation type of about 200 to 300 [W]. 640 DUTs having different self-heat generation amounts can be burned in simultaneously.

  As shown in FIGS. 1 and 2, the burn-in chamber 100 of the burn-in apparatus 1 according to the present embodiment includes an inner chamber partitioned by a heat insulating wall and the like, and an openable / closable door for taking in and out the burn-in board from the inner chamber. And have. In the inner chamber of this burn-in chamber 100, slots 110 for supporting the burn-in board 200 are arranged in 16 rows and 2 rows, and a total of 32 burn-in boards 200 can be accommodated. Yes. The number and arrangement of the slots 110 in the burn-in chamber 100 are not particularly limited in the present invention, and can be arbitrarily set in consideration of test efficiency and the like.

  As shown in FIG. 2, connectors 120 into which the edge connectors 202 (see FIGS. 3 and 4) of the burn-in board 200 can be inserted are provided at the back of each slot 110. This connector 120 is electrically connected to a DUT power source 600 and a burn-in controller 800 as shown in FIG. In FIG. 3, only one set of burn-in board 200 and temperature adjustment board 300 is shown, but the other 31 sets of burn-in board 200 and temperature adjustment board 300 are also connected in the same manner. The heater power source 700, the burn-in controller 800, and the chiller 900 are connected. The air in the burn-in chamber 100 is not controlled to adjust the temperature of the DUT, but is blown by a fan (not shown) or the like in order to prevent the heated air around the DUT from staying. Yes.

  Here, the burn-in board 200 accommodated in the burn-in chamber 100 will be described. As shown in FIG. 4, the burn-in board 200 includes 20 burn-in sockets 201 on which DUTs can be mounted arranged in 4 rows and 5 columns on a board having excellent heat resistance. An edge connector 202 that can be inserted into the connector 120 formed in the burn-in chamber 100 is formed on one side. Note that the number and arrangement of the burn-in sockets 201 on the burn-in board 200 are not particularly limited in the present invention, and can be arbitrarily set in consideration of test efficiency and the like.

  Printed wiring (not shown) for electrically connecting the edge connector 202 and each burn-in socket 201 is provided on the board. The edge connector 202 of the burn-in board 200 is connected to the connector of the burn-in chamber 100. When inserted into 120, each DUT mounted on the burn-in board 200 is electrically connected to the DUT power supply 600 and the burn-in controller 800 via the printed wiring and burn-in socket 201. Although not particularly illustrated, the DUT is inserted into and removed from each burn-in socket 201 of the burn-in board 200, for example, outside the burn-in apparatus 1 using an insertion / extraction machine, an inserter remover, a loader unloader, or the like.

  As shown in FIGS. 1 to 3, in the burn-in chamber 100, 32 temperature adjustment boards 300 for adjusting the temperature of the DUT are arranged so as to face the burn-in boards 200 supported by the slots 110. It is installed. The temperature adjustment board 300 can be vertically moved by driving an air cylinder 130 (see FIG. 3) based on the control of the burn-in controller 800. During the burn-in test, the temperature adjustment head 400 is brought into contact with the DUT, During the non-test, the temperature adjustment head 400 can be moved away from the DUT. The temperature adjustment board 300 will be described in detail later.

  As shown in FIG. 3, the DUT power source 600 of the burn-in apparatus 1 according to the present embodiment includes a connector 120 of the burn-in chamber 100, an edge connector 202 of the burn-in board 200, a printed wiring, and a burn-in socket 201. The DUT is connected so as to be able to apply a power supply voltage, and is controlled by the burn-in controller 800. Further, as shown in FIG. 3, the heater power source 700 is connected so as to be able to supply power to each heater (described later) provided on each temperature adjustment board 300 in the burn-in chamber 100. It is controlled by the burn-in controller 800.

  The burn-in controller 800 of the burn-in apparatus 1 according to this embodiment controls the DUT temperature, the applied voltage to the DUT, and the applied signal during the burn-in test, as well as the DUT that had an abnormal reaction during the burn-in test. For example, it is possible to store the DUT serial number corresponding to the slot number in the burn-in chamber 100 and the position on the burn-in board 200 and feed back the test result.

  As shown in FIG. 3, this burn-in controller 800 is connected to each temperature sensor (described later) provided on each temperature adjustment board 300 in the burn-in chamber 100 so that the temperature of each DUT can be detected. The heater power supply 600 and the chiller 900 are connected so that the temperature of each DUT can be controlled. Further, the power supply voltage applied to each DUT is connected to the DUT power supply 700 so as to be controllable.

  These DUT power supply 600, heater power supply 700, and burn-in controller 800 are accommodated in an instrumentation rack 500 shown in FIG.

  The chiller 900 of the burn-in device 1 according to the present embodiment uses a refrigerant such as a fluorine-based inert liquid (for example, Fluorinert FC-323 manufactured by 3M) as a cooling block for each temperature adjustment board 300 in the burn-in chamber 100 (described later). ) And the temperature and flow rate of the refrigerant can be adjusted based on the control of the burn-in controller 800. In addition, the refrigerant | coolant in this invention is not limited to said liquid, For example, gas may be sufficient.

  Below, the temperature adjustment board 300 used for the burn-in apparatus 1 which concerns on this embodiment is explained in full detail.

  FIG. 5 is a plan view showing the entire temperature adjustment board used in the burn-in apparatus according to the first embodiment of the present invention, and FIG. 6 is a side view of the first temperature adjustment head supported by the temperature adjustment board shown in FIG. 7 is a top plan view of the first temperature control head shown in FIG. 6, FIG. 8 is a bottom plan view of the first temperature control head shown in FIG. 6, and FIG. 9 is taken along the line IX-IX in FIG. FIG. 10 is a sectional view of the first temperature adjusting head taken along line XX of FIG. 8, FIG. 11 is a heat transfer model of the temperature adjusting head in the first embodiment of the present invention, FIG. 12 is a graph showing the temperature adjustable range of the first to third temperature adjustment heads in the burn-in apparatus according to the first embodiment of the present invention, and FIG. 13 is the first temperature adjustment head in the first embodiment of the present invention. FIG. 14 is a diagram showing a state in which the temperature of the DUT is adjusted by FIG. 15 is a side view showing a second temperature adjustment head used in the burn-in apparatus according to the first embodiment of the invention, FIG. 15 is a bottom plan view of the second temperature adjustment head shown in FIG. 14, and FIG. It is a figure which shows the state which is adjusting the temperature of DUT with the 2nd temperature control head in embodiment.

  As shown in FIGS. 5 and 6, the temperature adjustment board 300 in the present embodiment includes 20 temperature adjustment heads 400 for adjusting the temperature of the DUT, a frame 301 that supports the temperature adjustment head 400, and each A main pipe 302 and a branch pipe 303 that supply the refrigerant from the chiller 900 to the cooling block of the temperature adjustment head 400 are provided.

  As shown in FIG. 5, the frame 301 of the temperature adjustment board 300 has a total of 20 in 4 rows and 5 columns so as to correspond to the arrangement of DUTs (the arrangement of burn-in sockets 201) mounted on the burn-in board 200 described above. It is a flat plate member in which a plurality of openings 3011 are formed. As shown in FIG. 6, the temperature adjustment head 400 is inserted into each opening 3011. As shown in FIGS. 9 and 10, each temperature adjustment head 400 is connected to the opposite burn-in board 200 side. The support portion 304 of the frame 301 is swingably supported with respect to the frame 301 via a third spring 305 (third biasing means) that presses the adjustment head 400.

  As described above, the temperature adjustment heads 400 are mechanically brought into a floating state with respect to the temperature adjustment board 300, so that variations in height and inclination of each DUT mounted on the burn-in board 200 can be reduced. Can be tolerated.

  Further, each temperature adjustment head 400 is supported by the frame 301 via a third spring 305 that presses the temperature adjustment head 400 toward the burn-in board 200, so that each temperature adjustment head 400 comes into contact with the DUT. At this time, each temperature adjustment head 400 can be appropriately pressed against and closely attached to the DUT.

  The temperature adjustment head 400 according to the first embodiment of the present invention includes, for example, a first temperature adjustment head 400a corresponding to a medium heating type DUT of about 0 to 100 [W], for example, 100 to 200 [W]. A second temperature adjustment head 400b for accommodating a high-heat generation type DUT of the order, and a third temperature adjustment head for supporting a super-high heat generation type DUT of about 200 to 300 [W]. In consideration of the self-heating amount of the DUT to be tested, by selecting an appropriate one from a total of three types of temperature control heads, a wide range of self-heating DUTs can be handled by the same burn-in device 1 (See FIG. 12). Although the second and third temperature adjustment heads will be described in detail later, the configuration of the temperature adjustment board 300 other than the temperature adjustment head is the same regardless of which temperature adjustment head is employed.

  As shown in FIG. 6, the first temperature adjustment head 400 includes a cooling block 410a for cooling the DUT, a heater block 420a for heating the DUT, and a sensor block 430a for measuring the temperature of the DUT. It has.

  The cooling block 410a of the first temperature control head 400a is made of a material having excellent thermal conductivity such as aluminum or copper. As shown in FIGS. An internal space 412a for circulating the refrigerant supplied from the chiller 900 is formed. In addition, an inlet-side flow path 411a that communicates the branch pipe 303 and the internal space 412a is formed in the cooling block 410a so as to extend obliquely downward along the direction in which the refrigerant travels. The outlet-side flow path 413a that connects the 412a and the branch pipe 303 is formed to extend obliquely upward along the traveling direction of the refrigerant, and the internal space 412a can be circulated using the flow of the refrigerant. It has become.

  In the first temperature adjustment head 400a, the refrigerant supplied from the chiller 900 to the cooling block 410a via the main pipe 302 and the branch pipe 303 flows through the internal space 412a from the branch pipe 303 via the inlet-side flow path 411a. This makes it possible to cool the DUT in contact with the cooling block 410a.

  In addition, a bypass path that branches between the inlet-side channel 411a and the outlet-side channel 413a between the inlet-side channel 411a and the outlet-side channel 413a and bypasses the refrigerant to the internal space 412a. 414a is formed.

  The medium heat generation type DUT targeted by the first temperature adjustment head 400a has a relatively low self-heating amount as compared with the above-described high heat generation or super high heat generation type DUT. If a refrigerant having a flow rate equivalent to that of the target second and third temperature adjustment heads is circulated in the internal space 412a, there is a possibility that predetermined heat stress cannot be applied to the DUT due to overcooling. On the other hand, in the first temperature adjustment head 400a in the present embodiment, the excessive flow rate of refrigerant is bypassed by the bypass passage 414a, and the flow rate of the refrigerant flowing through the internal space 412a is limited. Thereby, when adjusting the temperature of the DUT having a relatively low self-heating value, the flow rate of the refrigerant flowing through the internal space can be made appropriate, and the temperature of the DUT can be adjusted appropriately. .

The cooling block 410a has a first accommodation space 415a for accommodating the heater block 420a and a second accommodation space 416a for accommodating the sensor block 430a.

  As shown in FIGS. 6, 8, and 9, the first accommodation space 415 a is large enough to ensure a predetermined clearance between the accommodated heater block 420 a and the inner wall surface of the first accommodation space 415 a. In addition, the first accommodation space 415a is formed so as to open on the surface of the cooling block 410a on the side in contact with the DUT.

  Similarly, in the second storage space 416a, a predetermined clearance is ensured between the stored sensor block 430a and the inner wall surface of the second storage space 416b, as shown in FIGS. The second housing space 416a is formed so as to open to the surface of the cooling block 410a that contacts the DUT.

  Like the cooling block 410a, the heater block 420a of the first temperature adjustment head 400a is made of a material having excellent thermal conductivity such as aluminum or copper, and has a substantially convex shape as a whole as shown in FIG. A convex portion 422a protruding in a convex shape is formed at the tip, and a heater 421a having a calorific value of about 100 [W], for example, is embedded therein. As shown in FIG. 3, the heater 421a is connected so that electric power can be supplied from the heater power source 700 described above.

  As shown in FIGS. 6 and 8, the heater block 420a is housed in the first housing space 415a in a state where a space is maintained between the heater block 420a and the inner wall surface of the first housing space 415a of the cooling block 410a. ing.

  Therefore, the heater block 420a is accommodated in a state in which a clearance is maintained with respect to the first accommodation space 415a, an air layer is formed between the heater block 420a and the cooling block 410a, and the cooling block 410a becomes the heater block 420a. Since the heater block 420a is thermally floating with respect to the cooling block 410a, heat is not directly transferred from the heater block 420a to the cooling block 410a.

  As shown in FIG. 9, the heater block 420a is supported on the cooling block 410a via first springs 423a (first urging means) at both upper ends thereof. It is pressed downward in the figure by a spring 423a. Thereby, in a state where the heater block 420a is not in contact with the DUT, the heater block 420a is pressed by the first spring 423a, and the shoulder portion 424 of the heater block 420a is in contact with the cooling block 410a. Moreover, the front end surface of the convex part 432a protrudes relatively with respect to the front end surface of the cooling block 410a by the pressing of the first spring 423a.

  As described above, by projecting the front end surface of the convex portion 422a of the heater block 420a relative to the front end surface of the cooling block 410a, the heater block 420 comes into contact before the cooling block 410a when contacting the DUT. . The heater block 420a is supported so as to be swingable with respect to the cooling block 410a while maintaining a clearance with respect to the inner wall surface of the first accommodation space 415a. That is, the heater block 420a is supported by the cooling block 410a. In contrast, the mechanically floating state allows the heater block 420a that contacts the DUT prior to the cooling block 410a to follow the DUT.

  Further, by providing a first spring 423a that presses the heater block 420a to the DUT side between the heater block 420a and the cooling block 410a, when the heater block 420a contacts the DUT, the heater block 420a is connected to the DUT. It is possible to make it press and contact | adhere appropriately.

  Similar to the cooling block 410a, the sensor block 430a of the first temperature adjustment head 400a is made of a material having excellent thermal conductivity such as aluminum or copper. As shown in FIG. A convex portion 432a having a shape and projecting in a convex shape is formed at the tip, and a temperature sensor 431a such as a platinum sensor is embedded therein. As shown in FIG. 3, the temperature sensor 431a is connected so that the detected temperature of the DUT can be transmitted to the burn-in controller 800 described above.

  As shown in FIGS. 6 and 8, the sensor block 430a is accommodated in the second accommodation space 416a in a state where a space is maintained between the sensor block 430a and the inner wall surface of the second accommodation space 416a of the cooling block 410a. ing.

  Therefore, the sensor block 430a is accommodated in a state in which a clearance is maintained with respect to the second accommodation space 416a, an air layer is formed between the sensor block 430a and the cooling block 410a, and the sensor block 430a becomes the cooling block 410a. Since the sensor block 430a is thermally floating with respect to the cooling block 410a, heat is not directly transferred from the cooling block 410a to the sensor block 430a, and the temperature of the DUT is accurately measured. It is possible to do.

  As shown in FIG. 10, the sensor block 430a is supported on the cooling block 410a via second springs 433a (second urging means) at both upper ends thereof. It is pressed downward in the figure by a spring 433a. Thereby, when the sensor block 430a is not in contact with the DUT, the sensor block 430a is pressed by the second spring 433a, and the shoulder portion 434 of the sensor block 430a is in contact with the cooling block 410a. Further, the front end surface of the convex portion 433a protrudes relatively to the front end surface of the cooling block 410a by the pressing of the second spring 433a.

  By projecting the front end surface of the convex portion 432a of the sensor block 430a relative to the front end surface of the cooling block 410a, the sensor block 430a contacts the cooling block before the cooling block 410a. The sensor block 430a is supported so as to be swingable with respect to the cooling block 410a while maintaining a clearance with respect to the inner wall surface of the second accommodation space 416a. That is, the sensor block 430a is supported by the cooling block 410a. As a result, the sensor block 430a that has contacted the DUT prior to the cooling block 410a can follow the DUT.

  Further, by providing a second spring 433a that presses the sensor block 420a to the DUT side between the sensor block 430a and the cooling block 410a, when the sensor block 430a contacts the DUT, the sensor block 430a is connected to the DUT. It is possible to make it press and contact | adhere appropriately.

  Since the heater block 420a is thermally floating with respect to the cooling block 410a, the first temperature adjusting head 400a configured as described above can be expressed by a heat transfer model as shown in FIG. The heat generation amount of the DUT is Hd [W], the temperature of the refrigerant is Tw [° C.], the heat generation amount of the heater 421a is Hh [W], and the thermal resistance between the DUT and the refrigerant is θcw [° C./W]. Then, the temperature Tc [° C.] of the DUT is represented by Tc = Tw + θcw (Hh + Hd). Also from this heat transfer model and equation, the heat flow radiated from the heater block 420a having the heater 421a to the surrounding air is extremely small, and most of the heat generated in the heater block 420a flows to the DUT, so that the heater block 420a It is understood that it is possible to positively increase the temperature of the DUT.

  Note that the thermal resistance θcw referred to here includes a contact thermal resistance at a contact portion between the cooling block 410a and the DUT surface, a thermal resistance of the cooling block 410a itself, a refrigerant thermal resistance based on a heat transfer area of the refrigerant, and the like. Has been.

  Incidentally, in the first temperature adjustment head 400a in the present embodiment, as shown in FIG. 12, when the temperature of the refrigerant is variable in the range of 27 [° C.] ≦ Tw ≦ 80 [° C.], the thermal resistance θcw = By setting the temperature to 0.6 [° C./W], the DUT temperature Tc having a variation in self-heating amount in the range of 0 [W] to 100 [W] is adjusted by the heater 421a, and the DUT temperature is reduced to about It can be set in the range of 87 [° C.] to about 140 [° C.].

  As shown in FIG. 5, the first temperature adjustment head 400a is supported by the frame 301 in four rows and five columns. In the frame 301, the refrigerant from the chiller 900 is supplied to each first temperature adjustment head. A main pipe 302 and a branch pipe 303 for supplying to 400a are provided. From one main pipe 302, five branch pipes 303 branch in parallel, and the internal spaces 412a of the four heads 400a arranged in the same row in the frame 301 are connected in series by each branch pipe 303. Yes. Although not specifically illustrated, the refrigerant pressure is adjusted by, for example, an orifice or the like so that the refrigerant pressure in each first temperature adjustment head 400a is substantially uniform.

  Thus, by connecting the internal spaces 412a of the first temperature adjustment heads 400a in series, the piping of the temperature adjustment board 300 can be compared with the case where all the temperature adjustment heads are connected in parallel. An increase in the number of connection points can be suppressed and the reliability of the piping can be increased.

  Next, the operation of the burn-in apparatus 1 to which the first temperature adjustment head 400a is applied will be described.

  Each slot 110 of the burn-in chamber 100 accommodates a burn-in board 200 mounted with a DUT, the edge connector 202 of each burn-in board 200 is inserted into the connector 120 of the burn-in chamber 100, the door of the burn-in chamber 100 is closed, and the start When a burn-in test is started by pressing a button (not shown) or the like, first, the air cylinder 130 is driven downward based on the control signal of the burn-in controller 800, and each temperature adjustment board 300 in the burn-in chamber 100 is inserted into the slot. The first temperature adjustment head 400 a arranged on the temperature adjustment board 300 comes into contact with the DUT arranged on the burn-in board 200.

  At the time of this contact, the front end surface of the convex portion 422a of the heater block 420a protrudes relative to the front end surface of the cooling block 410a, so that the heater block 420a contacts before the cooling block 410a. Since the heater block 420a is in a mechanically floating state with respect to the cooling block 410a, the heater block 420a that has contacted the DUT prior to the cooling block 410a performs a copying operation on the DUT, so that the heater block Since the front end surface of 420a is in close contact with the DUT, it is possible to efficiently raise the temperature of the DUT.

  Further, since the first spring 423a that presses the heater block 420a toward the DUT side is provided between the heater block 420a and the cooling block 410a, the first temperature adjustment head 400a is brought into contact with the DUT. Since the heater block 420a is appropriately pressed against and closely contacts the DUT, it is possible to raise the temperature of the DUT more efficiently.

  Similarly, since the front end surface of the convex portion 432a of the sensor block 430a protrudes relative to the front end surface of the cooling block 410a, when the first temperature adjustment head 400a contacts the DUT, the cooling block 410a The sensor block 430a contacts first. Since the sensor block 430a is in a mechanically floating state with respect to the cooling block 410a, the sensor block 430a that contacts the DUT before the cooling block 410a performs a copying operation on the DUT, Since the distal end surface of 430a is in close contact with the DUT, the temperature of the DUT can be measured more accurately.

  Further, since the second spring 433a is provided between the sensor block 430a and the cooling block 410a, when the first temperature adjustment head 400a comes into contact with the DUT, the heater block 420a is in contact with the DUT. It is possible to accurately measure the temperature of the DUT because it is pressed and adhered properly.

  Further, since each first temperature adjustment head 400a is swingably supported with respect to the temperature adjustment board 300, each DUT mounted on the burn-in board 200 when contacting the first temperature adjustment head 400aDUT. The first temperature adjustment head 400a can tolerate variations in the height and inclination of the first temperature adjustment head 400a, and the first temperature adjustment head 400a can be brought into close contact with the DUT. 400a makes it possible to adjust the temperature of the DUT more accurately.

  In addition, since each first temperature adjustment head 400a is supported by the frame 301 via the third spring 305, when the first temperature adjustment head 400a contacts the DUT, the first temperature adjustment head 400a is in contact with the DUT. The adjustment head 400a can be pressed and brought into close contact with the DUT appropriately, and the temperature of the DUT can be adjusted more accurately by the first temperature adjustment head 400a.

  Until the first temperature adjustment head 400a comes into contact with the DUT, the heater block 420a is in contact with the cooling block 410a by the shoulder 424 of the heater block 420a due to the action of the first spring 423a. Since the temperature of the refrigerant flowing through the flow path of the cooling block 410a can be raised by the heater 421a of the heater block 420a, it is not necessary to provide a heater or the like for heating the refrigerant in the chiller 900.

  Similarly, until just before the first temperature adjustment head 400a contacts the DUT, the sensor block 430a is in contact with the cooling block 410a by the shoulder 434 of the sensor block 430a due to the action of the second spring 433a. Thus, it is possible to monitor the temperature of the cooling block 410a and the operating state of the heater 421a of the heater block 420a, or the temperature sensor 431a itself can make a self-diagnosis.

  As shown in FIG. 13, when the first temperature adjustment head 400a contacts the DUT, the burn-in controller 800 applies a thermal stress to the DUT while monitoring the temperature of the DUT with the temperature sensor 431a of the sensor block 430a. The heater 421a of the heater block 420a is heated so as to reach the DUT temperature. This DUT temperature is, for example, 125 [° C.].

  When the temperature of the DUT reaches a predetermined temperature, the burn-in controller 800 sends a signal close to the power supply voltage and the actual operation to each DUT via the connector 120 of the burn-in chamber 200 and the edge connector 202 of the burn-in board 200. Screen while applying. Since the DUT self-heats due to the application of the power supply voltage and the temperature of the DUT changes, the temperature of the DUT changes to the predetermined temperature by turning on / off the heater 421a while monitoring the temperature of the DUT by the temperature sensor 431a. It is adjusted to become.

  When this thermal stress is applied, the heater block 420a is in a thermal floating state with respect to the cooling block 410a, so that heat is not directly transferred from the heater block 420a to the cooling block 410a. The DUT can be actively heated, and the cooling block 410a can actively cool the DUT. When performing a burn-in test on a plurality of DUTs simultaneously, each DUT It is possible to accurately and independently control the temperature.

  In addition, since the sensor block 430a is in a thermal floating state with respect to the cooling block 410a when this thermal stress is applied, heat is not directly transferred from the cooling block 410a to the sensor block 430a, and the temperature of the DUT is increased. Accurate measurement is possible, and the accuracy of temperature adjustment of the DUT is improved.

  The burn-in test as described above is continuously performed for several hours to several tens of hours. However, a DUT having an abnormal reaction during the burn-in test is determined as a defective product. For example, the serial number of the DUT The number is stored in the burn-in controller 800, and the test result can be fed back.

  Next, a description will be given of the second temperature adjustment head 400b for dealing with a high heat generation type DUT of about 100 to 200 [W], for example.

  As shown in FIGS. 14 to 16, the second temperature adjusting head 400b includes a cooling block 410b for cooling the DUT, a heater block 420b for heating the DUT, and a temperature for measuring the DUT. Sensor block 430b, and has the same structure as the first temperature adjustment head 400a described above except that the bypass block for bypassing the refrigerant to the internal space is not formed in the cooling block.

  This second temperature adjustment head 400b is intended for a high heat generation type DUT having a relatively large calorific value of about 100 to 200 [W], and requires higher cooling performance than the first temperature adjustment head 400a. Therefore, as shown in the figure, no bypass path is formed as in the first temperature adjustment head 400a described above, and the branch pipe 303 is connected via the inlet-side channel 411b and the outlet-side channel 413b. The total amount of the supplied refrigerant circulates through the internal space 412b.

  In the second temperature adjustment head 400b, the thermal resistance θcw between the DUT and the refrigerant is set to 0.4 [° C./W], and the thermal resistance θcw is lowered from the first temperature adjustment head 400b to reduce the cooling efficiency. Has improved. As a method of reducing the thermal resistance θcw, for example, a method of increasing the pressing force of the temperature adjustment head, configuring a cooling block with a material superior in thermal conductivity, expanding the heat transfer area of the refrigerant, etc. Can be illustrated.

  Thus, as shown in FIG. 12, when the temperature of the refrigerant is variable in the range of 27 [° C.] ≦ Tw ≦ 80 [° C.], the self-heat generation amount is in the range of 100 [W] to 200 [W]. The DUT temperature can be arbitrarily set within the range of about 107 [° C.] to about 160 [° C.] by adjusting the temperature Tc of the DUT having variations with the heater 421b.

  Next, a description will be given of a third temperature adjustment head for dealing with a super heat generation type DUT of about 200 to 300 [W], for example.

  The third temperature adjustment head is basically the same as the second temperature adjustment head 400b, although not particularly shown. However, the third temperature adjustment head is intended for a super high heat generation type DUT of 200 [W] to 300 [W], and the third temperature adjustment head is higher in cooling than the second temperature adjustment head 400b. Performance is required.

  Therefore, in the third temperature adjustment head, the thermal resistance θcw between the DUT and the refrigerant is set to 0.28 [° C./W], and the thermal resistance θcw is lowered from that of the second temperature adjustment head 400c to improve the cooling efficiency. It is further improved.

  Accordingly, as shown in FIG. 12, when the temperature of the refrigerant is variable in the range of 27 [° C.] ≦ Tw ≦ 80 [° C.], the self-heat generation amount is in the range of 200 [W] to 300 [W]. The DUT temperature can be arbitrarily set within a range of about 111 [° C.] to about 164 [° C.] by adjusting the temperature Tc of the DUT having variations with a heater built in the heater block. Yes.

  And, in the burn-in device 1 according to the present embodiment, from among the above three types of temperature adjustment heads that have changed the cooling performance by changing the thermal resistance between the presence or absence of the bypass path and the DUT and the cooling block, By selecting a DUT suitable for the self-heating amount of each DUT, it is possible to handle DUTs having a wide self-heating amount of about 0 [W] to 300 [W] with the same burn-in device.

  The first to third temperature adjustment heads may be mixedly mounted on the same temperature adjustment board 300. The first temperature adjustment head 400a is mounted on one temperature adjustment board 300, and the other temperatures are adjusted. The second temperature adjustment head 400b may be mounted on the adjustment board 300, and the third temperature adjustment head may be mounted on another temperature adjustment board 300.

[Second Embodiment]
FIG. 17 is a side view of the temperature adjustment head in the second embodiment of the present invention.

  The burn-in apparatus according to the second embodiment of the present invention is different from the burn-in apparatus 1 according to the first embodiment in the structure of the temperature adjustment head, but the other configuration is the same as the burn-in apparatus 1 according to the first embodiment. . Only the differences between the burn-in device according to the second embodiment and the burn-in device 1 according to the first embodiment will be described below.

  As shown in FIG. 17, the temperature adjustment head 400 ′ in this embodiment is provided with a valve 417 ′ (flow rate varying means) in the bypass passage 414 ′ of the cooling block 410 ′, instead of being provided with a heater block. However, the configuration is the same as that of the first temperature adjustment head 400a in the first embodiment.

  In the first temperature adjustment head 400a in the first embodiment, the temperature of the DUT is adjusted by the heater 421a of the heater block 420a, whereas in the temperature adjustment head 400 ′ in this embodiment, instead of the heater, The temperature of the DUT can be increased or decreased by opening and closing the valve 417 ′ and adjusting the flow rate of the refrigerant flowing through the internal space 412a via the flow paths 411a and 413a.

  A valve 417 ′ provided in the temperature adjustment head 400 ′ is connected to the burn-in roller so as to be controllable, although not shown in particular, and the valve 417 ′ is opened and closed based on on / off control of the burn-in controller. Then, the flow rate of the refrigerant flowing through the bypass passage 414 ′ is adjusted. The valve 417 ′ may be provided not in the bypass passage 414 ′ but in the inlet side passage 411 ′ or the outlet side passage 413 ′.

  As described above, in the burn-in device according to the second embodiment of the present invention, instead of the heater, the valve 417 ′ is provided in the inlet-side flow path 411 ′ formed in the cooling block 410 ′ of the temperature adjustment head 400 ′. The flow rate of the refrigerant is varied by the valve 417 ′ to adjust the cooling heat resistance in the cooling block 410 ′. As a result, it is possible to easily adjust the temperature of each DUT, so that when performing a burn-in test on a plurality of DUTs simultaneously, the temperature of each DUT can be controlled independently and accurately. .

[Third Embodiment]
18 is a side view of the temperature adjustment head in the third embodiment of the present invention, FIG. 19 is a bottom plan view of the temperature adjustment head shown in FIG. 18, and FIG. 20 is a burn-in according to the third embodiment of the present invention. It is the schematic of the refrigerant | coolant collection | recovery means of an apparatus.

  In the burn-in apparatuses according to the first and second embodiments described above, the temperature of the DUT is adjusted by indirectly cooling the DUT with the refrigerant through the cooling block, but the third embodiment of the present invention. In the burn-in device according to the above, the temperature of the DUT is adjusted by bringing the refrigerant into direct contact with the DUT.

  Therefore, the burn-in apparatus according to the third embodiment of the present invention has a different structure of the temperature adjustment head, and further includes a refrigerant recovery means for recovering the refrigerant after the burn-in test. The other configurations are the same as those of the burn-in device 1 according to the first embodiment. Only the differences between the burn-in device according to the third embodiment and the burn-in device 1 according to the first embodiment will be described below.

  First, the temperature adjustment head 400 ″ according to the present embodiment will be described. As shown in FIGS. 18 and 19, the temperature adjustment head 400 ″ is a second temperature adjustment head 400b according to the first embodiment (FIG. 14). To the cooling block 410 ″ of the temperature adjustment head 400 ″, and there is no portion corresponding to the lower half of the cooling block 410b of the second temperature adjustment head 400b, and the heater block. Is different from the second temperature adjustment head 400b according to the first embodiment in that a valve 417 ″ (flow rate varying means) is provided instead of the second temperature adjustment head 400b.

  More specifically, the cooling block 410 ″ of the temperature adjustment head 400 ″ according to the present embodiment has a shape obtained by cutting the cooling block 410b of the second temperature adjustment head 400b so as to open in the internal space 412b. is doing. Thereby, the inlet-side flow path 411 ″ communicated with the branch pipe 303 is opened by an inlet-side opening 4111 ″ formed in the lower end surface of the cooling block 410 ″. Similarly, the outlet-side flow stream communicated with the branch pipe 303 The passage 413 ″ is also opened by an outlet side opening 4131 formed in the lower end surface of the cooling block 410 ″.

  The cooling block 410 ″ of the temperature adjustment head 400 ″ is provided with a second accommodation space 416 ″, and the sensor block 430 ″ including the temperature sensor 431 ″ maintains the clearance while maintaining the clearance. It is accommodated in the accommodation space 416 ″. Note that the temperature adjustment head 400 according to the present embodiment does not include a heater block incorporating a heater, like the temperature adjustment head 400 ′ according to the second embodiment.

  An annular packing 418 ″ is mounted on the outer peripheral edge of the cooling block 410 ″ and the peripheral edge of the second storage space 416 ″ in which the sensor block 430 ″ is stored.

  Therefore, when the temperature adjustment head 400 ″ according to the present embodiment comes into contact with the DUT, as shown in FIG. 18, a space 419 is formed by the lower end surface of the temperature adjustment head 400 ″, the packing 418 ″, and the upper surface of the DUT. "Is contoured, and the refrigerant CL supplied through the inlet side opening 4111" of the inlet side flow path 411 "enters the space 419", and the refrigerant can directly contact the DUT. ing.

  Further, the temperature adjustment head 400 ″ according to the present embodiment has a valve 417 ″ for adjusting the flow rate of the refrigerant, and the valve 417 ″ is an inlet-side channel 411 formed in the cooling block 410 ″. The mounting position of the valve 417 is not particularly limited in the present invention, and may be provided, for example, in the outlet side flow path.

  The valve 417 ″ provided in the temperature adjustment head 400 ″ is connected to the burn-in controller so as to be controllable, although not shown in particular, and the valve 417 ″ is opened and closed based on on / off control of the burn-in controller. Then, the flow rate of the refrigerant flowing through the inlet-side flow path 411 ″ is adjusted.

  Next, the refrigerant recovery means of the burn-in apparatus according to the present embodiment will be described. As shown in FIG. 20, the refrigerant recovery means in the present embodiment is provided in a chiller 900 ″. A circulating pump 901, a heat exchanger 902 that cools the refrigerant by transferring heat of the refrigerant to, for example, cooling water of about 20 [° C.] or less, a tank 903 that stores the collected refrigerant, and a refrigerant are collected. And a compressed gas supply device 904 for the pump 901 from the pump 901 through the temperature adjustment head 400 ″ (more specifically, the flow paths 411 ″ and 413 ″), the tank 903, and the heat exchanger 902, again. It is possible to form a circulation path leading to

  Two valves S1 and S2 are provided on this circulation path. The first valve S1 is provided between the pump 901 and the temperature adjustment head 400 ″, and the second valve S2 is provided between the temperature adjustment head 400 ″ and the tank 903.

  Further, a compressed gas supply device 904 is connected to this circulation path via a third valve S3. This compressed gas supply device 904 is a device that supplies compressed gas to the circulation path in order to forcibly collect the refrigerant that is in direct contact with the DUT into the tank 903 after the burn-in test. An example of the gas supplied by the compressed gas supply device 904 is nitrogen gas. Along with the adoption of the recovery using the compressed gas, a fourth valve S4 is provided in the tank 903 in order to release the pressure of the compressed gas to the atmosphere after the recovery of the refrigerant. Note that the first to fourth valves S1 to S4 are not particularly illustrated, but are connected to the burn-in controller so as to be controllable. Based on the on / off control of the burn-in controller, the valves S1 to S4 are connected. S4 is opened and closed.

  Next, a recovery method of the refrigerant recovery means provided in the chiller 900 ″ will be described.

  First, when the temperature of the DUT is adjusted during the burn-in test, the first and second valves S1 and S2 are opened, the third and fourth valves S3 and S4 are closed, and the circulation path is Is formed. Therefore, in this state, the refrigerant circulates in the circulation path by the action of the pump 901, the refrigerant cooled by the heat exchanger 902 is supplied to the temperature adjustment head 400 ″, and the used refrigerant passes through the tank 903. Then, it is cooled again by the heat exchanger 902.

  Next, when the burn-in test is completed, the pump 901 is stopped, and the second to fourth valves S2 to S4 are opened. Therefore, in this state, the circulation path is closed by the first valve S1, and instead, the second to fourth valves S2 to S4 are opened, and the compressed gas supply device 904 passes through the temperature adjustment head 400 ″. Then, a recovery path to the tank 903 is formed, and when supplied from the compressed gas supply device 904 into the recovery path, the refrigerant staying in the temperature adjustment head 400 ″ is pushed out by the compressed gas. , Collected in the tank 903. When the recovery of the refrigerant is completed, all the valves S1 to S4 are closed.

  As described above, in the burn-in device according to the third embodiment of the present invention, when the cooling block 410 ″ of the temperature adjustment block 400 ″ is pressed against the DUT, the inlet-side channel 411 ″ passes through the inlet-side opening 4111 ″. It is possible to directly adjust the temperature of individual DUTs by bringing the supplied refrigerant into direct contact with the surface of the DUT and controlling the opening and closing of the valve 417 ″, and simultaneously performing burn-in tests on a plurality of DUTs. In doing so, the temperature of each DUT can be accurately and independently controlled.

  Further, by providing the chiller 900 ″ with the recovery means as described above, the refrigerant in direct contact with the DUT can be recovered after the burn-in test is completed.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  In the above-described embodiment, the burn-in device has been described as a monitored burn-in device. However, the present invention is not particularly limited to this. For example, the power supply voltage is applied to the DUT at a constant temperature, and the DUT input circuit is close to the actual operation. Even a dynamic burn-in device that performs screening while applying a signal, or a static burn-in device that performs screening by applying a power supply voltage to the DUT at a high temperature, passing a current through the DUT, and applying temperature and voltage stress to the DUT. Well, a typical burn-in device is included.

FIG. 1 is a front view showing the entire burn-in apparatus according to the first embodiment of the present invention. FIG. 2 is a side view of the burn-in apparatus shown in FIG. FIG. 3 is a conceptual diagram showing a system configuration of the burn-in apparatus shown in FIG. FIG. 4 is a plan view showing the entire burn-in board on which the DUT according to the first embodiment of the present invention is mounted. FIG. 5 is a plan view showing the entire temperature adjustment board used in the burn-in apparatus according to the first embodiment of the present invention. FIG. 6 is a side view of the first temperature adjustment head supported by the temperature adjustment board shown in FIG. FIG. 7 is a top plan view of the first temperature adjustment head shown in FIG. FIG. 8 is a bottom plan view of the first temperature adjustment head shown in FIG. FIG. 9 is a cross-sectional view of the first temperature adjustment head taken along line IX-IX in FIG. FIG. 10 is a cross-sectional view of the first temperature adjustment head taken along line XX in FIG. FIG. 11 is a heat transfer model of the temperature adjustment head in the first embodiment of the present invention. FIG. 12 is a graph showing the temperature adjustable range of the first to third temperature adjustment heads in the burn-in apparatus according to the first embodiment of the present invention. FIG. 13 is a diagram illustrating a state in which the temperature of the DUT is adjusted by the first temperature adjustment head in the first embodiment of the present invention. FIG. 14 is a side view showing a second temperature adjustment head used in the burn-in apparatus according to the first embodiment of the present invention. FIG. 15 is a bottom plan view of the second temperature adjustment head shown in FIG. FIG. 16 is a diagram illustrating a state in which the temperature adjustment of the DUT is performed by the second temperature adjustment head in the first embodiment of the present invention. FIG. 17 is a side view of the temperature adjustment head in the second embodiment of the present invention. FIG. 18 is a side view of the temperature adjustment head in the third embodiment of the present invention. FIG. 19 is a bottom plan view of the temperature adjustment head shown in FIG. FIG. 20 is a schematic view of the refrigerant recovery means of the burn-in device according to the third embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Burn-in apparatus 100 ... Burn-in chamber 200 ... Burn-in board 300 ... Temperature adjustment board 301 ... Frame 305 ... 3rd spring (3rd biasing means)
400, 400a, 400b, 400 ′, 400 ″... Temperature adjusting head
410 ... Cooling block
411 ... Inlet side channel
412 ... Internal space
413 ... Outlet side flow path
414 ... Bypass road
415 ... 1st accommodation space
416 ... Second accommodation space
420 ... heater block (heating block)
421 ... Heater (heating means)
423 ... 1st spring (1st biasing means)
430 ... Sensor block (measurement block)
431 ... Temperature sensor
433 ... 2nd spring (2nd biasing means)
600 ... Power supply for DUT 700 ... Power supply for heater 800 ... Burn-in controller 900 ... Chiller

Claims (22)

A plurality of electronic components to be tested mounted on a burn-in board have a heating block having heating means for heating the electronic components to be tested, and a flow path through which a refrigerant can be circulated to cool the electronic components to be tested. A burn-in device that simultaneously performs a burn-in test on the plurality of electronic components to be tested while contacting the formed cooling block;
Wherein the cooling block, which is the first accommodation space is formed for accommodating the heating block,
The heating block is a burn-in device that is housed in the first housing space with an air layer formed between the heating block and the cooling block so as to be insulated from the cooling block . The heating block is swingably supported with respect to the cooling block,
2. The burn-in device according to claim 1, wherein a front end surface of the heating block protrudes relatively to a front end surface of the cooling block in a state where the heating block is not in contact with the electronic device under test.   The burn-in device according to claim 2, wherein first urging means for urging the heating block toward the tip side is provided between the heating block and the cooling block.   In a state where the heating block is not in contact with the electronic device under test, the heating block is biased toward the contact surface by the first biasing means, and a part of the heating block comes into contact with the cooling block. The burn-in device according to claim 3. A measuring block having measuring means for measuring the temperature of the electronic device under test;
Wherein the cooling block, which is the second housing space is formed for accommodating the measurement block,
The said measurement block is accommodated in the said 2nd accommodation space in the state in which the air layer was formed between the said cooling blocks so that it might be thermally insulated with respect to the said cooling block. The burn-in device according to the above. A cooling block in which a plurality of electronic components to be tested mounted on a burn-in board are provided with a flow path through which a refrigerant for cooling the electronic components to be tested can be passed, and for measuring the temperature of the electronic components to be tested A burn-in device that simultaneously performs a burn-in test on the plurality of electronic devices to be tested while contacting a measurement block having the measurement means of:
A flow rate varying means for varying the flow rate of the refrigerant flowing through the flow path formed in the cooling block;
Wherein the cooling block, which is the second housing space is formed for accommodating the measurement block,
The measurement block is a burn-in device accommodated in the second accommodation space in a state where an air layer is formed between the measurement block and the cooling block so as to be insulated from the cooling block . A cooling block in which a flow path capable of circulating a refrigerant for cooling a plurality of electronic components to be tested mounted on the burn-in board is formed, and an opening communicating with the flow path is formed on a front end surface; and
A measuring block having measuring means for measuring the temperature of the electronic component under test;
Flow rate varying means for varying the flow rate of the refrigerant flowing through the flow path formed in the cooling block;
A refrigerant recovery means for recovering the refrigerant flowing through the flow path,
The cooling block is formed with a second storage space for storing the measurement block,
The measurement block is housed in the second housing space with an air layer formed between the measurement block and the cooling block so as to be insulated from the cooling block.
The cooling block and the measurement block are pressed against the electronic component to be tested mounted on the burn-in board, and the coolant is brought into direct contact with the surface of the electronic component to be tested through the opening. A burn-in test is performed simultaneously on the electronic components under test,
A burn-in device that recovers the refrigerant by the refrigerant recovery means when the burn-in test is completed. The measurement block is supported to be swingable with respect to the cooling block,
In a state where the measurement block is not in contact with the electronic device under test,
The burn-in device according to any one of claims 5 to 7, wherein a front end surface of the measurement block protrudes relatively to a front end surface of the cooling block.   9. The burn-in apparatus according to claim 8, wherein a second urging unit that urges the measurement block toward the front end surface is provided between the measurement block and the cooling block. In a state where the measurement block is not in contact with the electronic device under test,
The burn-in device according to claim 9, wherein the measurement block is urged toward the distal end side by the second urging means, and a part of the measurement block is in contact with the cooling block. A temperature adjustment board that supports the plurality of cooling blocks swingably on the frame;
A burn-in chamber capable of accommodating the burn-in board and having the temperature adjustment board; and
The temperature adjustment board is provided in the burn-in chamber so that the cooling blocks face the electronic components to be tested mounted on the burn-in board. The burn-in device described in 1.   The said each cooling block is each supported by the said flame | frame via the 3rd urging | biasing means which urges | biases each said cooling block toward the said burn-in board which opposes in the said burn-in chamber. Burn-in equipment.   The burn-in device according to claim 11 or 12, wherein at least a part of each flow path formed in the plurality of cooling blocks is connected in series.   The burn-in device according to claim 13, wherein the cooling block is provided with a bypass path for bypassing the refrigerant from the flow path.   15. The burn-in device according to claim 6, wherein the flow rate varying means is provided in the flow path or the bypass path.   The burn-in device according to claim 14 or 15, wherein the temperature adjustment board includes a first cooling block in which the bypass path is formed and a second cooling block in which the bypass path is not formed. The burn-in chamber has a plurality of the temperature adjustment boards,
Of the plurality of temperature adjustment boards, one of the temperature adjustment boards has a first cooling block in which the bypass path is formed, and the other temperature adjustment boards have no first bypass path. The burn-in device according to claim 14 or 15, comprising two cooling blocks.   The burn-in device according to any one of claims 11 to 17, wherein the temperature adjustment board has two or more types of cooling blocks having different thermal resistances between the refrigerant and the electronic device under test. The burn-in chamber has a plurality of the temperature adjustment boards,
Among the plurality of temperature adjustment boards, thermal resistance between the refrigerant and the electronic device under test in the cooling block included in one of the temperature adjustment boards, and the cooling block included in the other temperature adjustment board The burn-in device according to any one of claims 11 to 17, wherein thermal resistance between the refrigerant and the electronic device under test is different from each other. A heating block having heating means for heating the electronic device under test;
  A cooling block formed with a flow path through which a refrigerant can flow in order to cool the electronic device under test,
  A first accommodation space for accommodating the heating block is formed in the cooling block,
  The temperature adjustment head accommodated in the first accommodation space in a state where an air layer is formed between the heating block and the cooling block so as to be insulated from the cooling block.   A measuring block having measuring means for measuring the temperature of the electronic device under test;
  A second accommodation space for accommodating the measurement block is formed in the cooling block,
  The temperature adjustment according to claim 21, wherein the measurement block is housed in the second housing space in a state where an air layer is formed between the measurement block and the cooling block so as to be insulated from the cooling block. head. A cooling block in which a flow path through which a refrigerant can flow to cool the electronic device under test is formed;
  A temperature adjusting head comprising a measuring block having a measuring means for measuring the temperature of the electronic device under test,
  A second accommodation space for accommodating the measurement block is formed in the cooling block,
  The temperature adjustment head accommodated in the second accommodation space in a state where an air layer is formed between the measurement block and the cooling block so as to be insulated from the cooling block.

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