JP4732309B2 - Burn-in equipment - Google Patents

Description

  The present invention relates to a burn-in apparatus, and more particularly, to a burn-in apparatus that can simultaneously perform a burn-in test on a plurality of devices under test.

  2. Description of the Related Art A burn-in apparatus is known as an apparatus that performs a burn-in test, which is a kind of screening test for revealing initial defects of electronic parts and the like and removing early-failed products. In this burn-in apparatus, a burn-in board in which a plurality of electronic components that are devices under test (Device Under Test) are mounted is accommodated in the burn-in apparatus, and voltage is applied to the device under test to apply electrical stress. By heating the air inside the thermostatic chamber and applying a thermal stress at a predetermined temperature, the initial failure becomes obvious. Alternatively, instead of heating the air inside the thermostatic chamber, a thermal stress is applied to the device under test by bringing the block heated by the heater into direct contact with the device under test.

  In such a burn-in apparatus, since a long-time burn-in test over several hours to several tens of hours is performed, in order to improve test efficiency, a plurality of devices under test are inserted into one burn-in board, Generally, a plurality of burn-in boards are housed in a burn-in apparatus and a burn-in test is performed.

  However, in reality, even for devices under test such as electronic parts in the same lot, the power consumption of each device under test differs due to inherent defects and manufacturing variations, etc., and the amount of self-heating of the device under test itself Variation will occur. For this reason, even if the air inside the thermostatic chamber is simply heated or a heated block is brought into contact, a uniform thermal stress is applied to a plurality of devices under test that are being tested simultaneously. May be difficult.

  In particular, as semiconductor devices and the like have increased in capacity, function, and speed as in recent years, the amount of self-heating during operation tends to increase. The amount of variation tends to increase. For this reason, there is a strong demand for accurate temperature control of each device under test in the burn-in test.

  In order to satisfy such a requirement, in the burn-in apparatus disclosed in Japanese Patent Application Laid-Open No. 2005-265665 (Patent Document 1), each block under test is individually heated or cooled with a block in direct contact with the device under test. The device temperature is controlled individually.

However, in this burn-in apparatus, since the refrigerant flow path for cooling the block that contacts the device under test is provided in common to the plurality of blocks, it is provided upstream of the refrigerant flow path. There was a difference in cooling capacity between the block and the block provided on the downstream side. Therefore, in practice, it has been difficult to uniformly control the temperature of each device under test in the burn-in test.
JP 2005-265665 A

  The present invention has been made in view of the above problems, and an object thereof is to provide a burn-in apparatus that can easily control the temperature of each device under test in a burn-in test by equalizing the temperature easily.

In order to solve the above-described problem, a burn-in apparatus according to the present invention includes:
A slot into which the burn-in board with the device under test is inserted, and
A temperature adjustment head for contacting the device under test of the burn-in board inserted in the slot and cooling the device under test;
A main pipe for circulating the refrigerant sent from the refrigerant cooling device for cooling the refrigerant and returning the refrigerant to the refrigerant cooling device again;
A branch pipe provided in parallel with the main pipe, supplying the refrigerant to the temperature control head and returning the refrigerant to the main pipe again;
It is characterized by providing.

In this case, the burn-in board can be equipped with a plurality of devices under test,
A plurality of the temperature control heads are provided corresponding to each of a plurality of devices under test,
For each of the temperature control heads, the branch pipe may be provided in parallel to the main pipe.

The branch pipe includes a supply branch pipe that supplies a refrigerant from the main pipe to the temperature control head, and a discharge branch pipe that returns the refrigerant discharged from the temperature control head to the main pipe.
The temperature control head includes a lower block that comes into contact with a device under test,
The refrigerant supplied from the supply branch pipe is supplied to the central portion of the lower block, flows through a flow path formed to flow from the central portion toward the outer peripheral direction of the lower block, and the discharge branch pipe It may be discharged from.

In this case, the flow path is constituted by a circumferential flow path arranged concentrically around the central portion of the lower block,
The refrigerant may flow in the outer circumferential direction of the lower block through an opening connected from the inner circumferential channel to the outer circumferential channel.

  In this case, an opening connected to the outer circumferential channel may be formed at a position opposite to the circumferential direction of the opening in which the refrigerant has flowed from the inner circumferential channel.

The temperature control head is provided with a bypass path through which the refrigerant flows separately from the refrigerant flow path to the lower block, and the refrigerant supplied from the supply branch pipe through the bypass path. Is discharged to the discharge branch,
The temperature adjustment head may further include a control valve that controls a flow of the refrigerant to the bypass path.

  In this case, when the control valve is in the open state, the refrigerant may flow through the flow path to the lower block and also through the bypass path.

Alternatively, the control valve has two states, an open state and a closed state,
When the control valve is in the open state, the refrigerant flows through the flow path to the lower block and also flows through the bypass path.
When the control valve is closed, the refrigerant may flow through the flow path to the lower block but may not flow into the bypass path.

  In addition, a heater may be embedded in the temperature control head, and the device under test that is in contact with the temperature control head may be heated when the heater generates heat.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the embodiments described below do not limit the technical scope of the present invention.

  FIG. 1 is a front view showing the overall configuration of the burn-in apparatus 10 according to the present embodiment, and FIG. 2 is a side view of the burn-in apparatus 10 of FIG. 1 viewed from the right side. FIG. 3 is a plan view for explaining the layout of the burn-in board BIB accommodated in the burn-in apparatus 10.

  As shown in FIGS. 1 and 2, a plurality of burn-in boards BIB are accommodated in the thermostatic chamber 20 of the burn-in device 10. As shown in FIG. 3, the burn-in board BIB is provided with a plurality of sockets 100, into which a semiconductor device as the device under test DUT is inserted. In this embodiment, for example, one burn-in board BIB is provided with 2 rows × 4 columns = 8 sockets 100, and therefore, 8 devices under test DUT can be inserted. However, the number and arrangement of the sockets 100 provided on the burn-in board BIB are arbitrary and can be variously changed.

  As shown in FIGS. 1 and 2, a plurality of slots 30 are provided in the constant temperature bath 20. In this embodiment, for example, the slots 30 are arranged in 16 rows and 2 rows, and a total of 32 burn-in boards BIB can be stored. However, the number and arrangement of the slots 30 in the thermostat 20 are arbitrary and can be variously changed.

  The thermostatic chamber 20 is partitioned by a heat insulating wall or the like, and by closing the door 40, the interior of the thermostatic chamber 20 is a space that is thermally blocked from the surroundings. On the other hand, by opening the door 40, the burn-in board BIB can be inserted into the slot 30 or the burn-in board BIB can be removed from the slot 30.

  An edge connector 110 is provided at the front end of the burn-in board BIB in the insertion direction (see FIG. 3). When the burn-in board BIB is inserted into the slot 30, the edge connector 110 is provided in the burn-in device 10. The burn-in board BIB can be electrically connected to the driver board DRB provided in the burn-in device 10 by being inserted into the connector 50.

  A burn-in controller 200 that performs various controls of the burn-in device 10 is provided on the front right side of the burn-in device 10. Based on the control of the burn-in controller 200, the burn-in apparatus 10 lowers the temperature adjustment board 300 provided at a position facing each burn-in board BIB, and controls the temperature of the device under test DUT inserted into the burn-in board BIB. I do.

  FIG. 4 is a diagram for explaining the overall configuration of the temperature adjustment board 300 provided corresponding to the burn-in board BIB, and shows a plan view of the temperature adjustment board 300 as viewed from above. As shown in FIG. 4, a temperature adjustment head 400 is arranged on the temperature adjustment board 300 corresponding to the device under test DUT. That is, in this embodiment, 2 rows × 4 columns = 8 temperature control heads 400 are arranged.

  As will be described in detail later, the temperature adjustment head 400 has a function of heating or cooling the device under test DUT by directly contacting the device under test DUT. In the present embodiment, the device under test DUT is heated by supplying electric power to a heater 470 (see FIG. 9) provided in the temperature control head 400.

  On the other hand, when the device under test DUT is cooled, the device under test DUT is cooled by the circulating refrigerant supplied from the chiller 500 that is a refrigerant cooling device. That is, the refrigerant sent from the chiller 500 is supplied to the temperature adjustment board 300 from the main pipe P10, returns to the chiller 500 again through the main pipes P12 and P14. Further, a branch pipe P20 is provided in parallel in the main pipe P12, and a part of the refrigerant flowing through the main pipe P12 is supplied to the temperature control head 400 in parallel. More specifically, the refrigerant is supplied from the main pipe P12 to the temperature adjustment head 400 via the supply branch pipe P22, and the refrigerant is discharged from the temperature adjustment head 400 to the main pipe P12 via the discharge branch pipe P24. Since the refrigerant flow in the main pipe P12 and the refrigerant flow in the branch pipe P22 are parallel, for example, even if the flow of the refrigerant stops at one temperature adjustment head 400, the refrigerant flow in the main pipe P12 is stagnant. There will be no.

  Although what kind of refrigerant is used is arbitrary, in this embodiment, for example, Fluorinert (registered trademark) is used as the refrigerant. Fluorinate is a volatile refrigerant, so that even if a leak occurs, the burn-in apparatus 10 and the device under test DUT are not damaged. Of course, it is also possible to use chlorofluorocarbon or cooling water as the refrigerant.

  FIG. 5 is a block diagram for explaining the system configuration of the burn-in apparatus 10 according to the present embodiment. As shown in FIG. 5, the temperature adjustment board 300 rises and falls based on the control signal of the burn-in controller 200. That is, based on the control signal from the burn-in controller 200, the cylinder 60 is driven to raise or lower the temperature adjustment board 300. When the temperature adjustment board 300 is lowered, the temperature adjustment head 400 provided on the temperature adjustment board 300 comes into direct contact with the device under test DUT, and the temperature adjustment head 400 can adjust the temperature of the device under test DUT. At the time of non-test, the temperature adjustment board 300 can be raised to insert or remove the burn-in board BIB with the device under test DUT attached thereto.

  As described above, the refrigerant sent from the chiller 500 as the refrigerant cooling device circulates in the burn-in device 10 and reaches each temperature adjustment head 400 provided on the temperature adjustment board 300, and the temperature adjustment head 400. After cooling, the chiller 500 is returned again.

  The heater power supply 600 is configured to be able to supply power to the heater 470 (see FIG. 9) provided in the temperature control head 400. The amount of power to be supplied can be individually controlled for each temperature adjustment head 400 and is controlled by the burn-in controller 200. That is, the burn-in controller 200 supplies power to the heater power supply 600 to the heater 470 of the temperature control head 400 corresponding to the device under test DUT when there is a device under test DUT whose temperature is to be increased. When it is possible to output a control signal and it is not necessary to raise the temperature of the device under test DUT, the heater power supply 600 stops power to the heater of the temperature adjustment head 400 corresponding to the corresponding device under test DUT. A control signal can be output.

  The non-test device power supply 700 is configured to be able to supply power to the burn-in board BIB via the driver board DRB, the connector 50, and the edge connector 110. Whether power is supplied to the burn-in board BIB and the amount of power to be supplied are controlled based on a control signal from the burn-in controller 200.

  The burn-in controller 200 thus performs various controls in the burn-in test. In addition to the temperature control described above, the control performed by the burn-in controller 200 generates, for example, a test signal to be applied to the device under test DUT, inspects the output of the non-test device DUT during the burn-in test, and outputs an abnormal output. The device under test DUT is judged as a defective product.

  Next, the configuration of the temperature adjustment head 400 provided on the temperature adjustment board 300 will be described in detail.

  6 is a perspective view showing the configuration of the temperature control head 400, FIG. 7 is a plan view of the temperature control head 400 as seen from above, and FIG. 8 is a plan view of the lower block as seen from above. . 9 is a cross-sectional view taken along the line AA in the temperature control head 400 of FIG. 7, and FIG. 10 is a cross-sectional view taken along the line BB of the temperature control head 400 of FIG.

  As shown in these drawings, the temperature adjustment head 400 according to this embodiment includes an upper block 402, a lower block 404, and a valve block 406. In the upper block 402, a piping port 410 connected to the supply branch P22 and a piping port 412 connected to the discharge branch P24 are formed. That is, in the temperature control head 400, the refrigerant is supplied from the piping port 410 and discharged from the piping port 412.

  When the control valve 414 provided in the valve block 406 is in a closed state, the refrigerant supplied from the piping port 410 passes through the cylindrical block 416 extending in the horizontal direction through the upper block 402 and the central portion of the upper block 402. , And flows from the upper side to the lower side through a cylindrical channel 418 extending in the vertical direction in the central portion of the upper block 402 to reach the lower block 404.

  The refrigerant that has reached the lower block 404 flows into the lower block supply port 420 from the flow path 418. In the lower block 404, a flow path of a complicated path is formed so that the refrigerant diffuses and flows in the lower block 404. That is, a circumferential channel 422 is formed outside the lower block supply port 420 so as to surround the lower block supply port 420, and the refrigerant opens from the lower block supply port 420 to the channel 422. Flows through 424.

  A circumferential channel 426 is formed outside the channel 422 so as to surround the channel 422. From the channel 422 to the channel 426, the refrigerant flows through the opening 428. The opening 428 is formed at a position opposite to the opening 424 in the circumferential direction. For this reason, the refrigerant that has flowed into the flow path 422 from the opening 422 flows evenly through the left and right paths of the flow path 422 and reaches the opening 428.

  A circumferential channel 430 is formed outside the channel 426 so as to surround the channel 426. From the flow path 426 to the flow path 430, the refrigerant flows through the opening 432. The opening 432 is formed at a position opposite to the opening 428 in the circumferential direction. For this reason, the refrigerant that has flowed into the flow path 426 from the opening 428 flows evenly through the left and right paths of the flow path 426 and reaches the opening 432.

  A lower block discharge port 434 is formed at a position opposite to the circumferential direction of the opening 432. For this reason, the refrigerant that has flowed into the flow path 430 from the opening 432 flows evenly through the left and right paths of the flow path 430 and reaches the lower block discharge port 434.

  In order to form such a complicated refrigerant flow path, the lower block 404 has circumferential partition walls 440, 442 arranged concentrically around the lower block supply port 420 in the central portion. 444 is formed. An opening 424 is formed in the partition wall 440, an opening 428 is formed in the partition wall 442, and an opening 432 is formed in the partition wall 444. In the present embodiment, the opening 424 and the opening 428 are formed at opposite positions on the circumference, and the opening 428 and the opening 432 are formed at opposite positions on the circumference, and the opening 432 and the lower block discharge are formed. The outlet 434 is formed at the opposite position on the circumference. Further, the flow path 430 is defined by the partition wall 444 and the outer peripheral body 446 of the lower block 404.

  The lower block 404 of the present embodiment is made of a material having excellent thermal conductivity such as aluminum or copper. For this reason, the lower block 404 is cooled until the refrigerant flowing in from the lower block supply port 420 passes through the flow paths 422, 426, and 430 and is discharged from the lower block discharge port 434. The device under test DUT in contact with 404 is also cooled.

  As described above, in the present embodiment, the flow path is arranged so that the cooled refrigerant flows from the central portion of the lower block 404 to the outside in a generally diffused manner. For this reason, the device under test DUT whose center tends to be in a high temperature state can be efficiently cooled.

  The refrigerant that has reached the lower block discharge port 434 flows through the upper block 402 in a cylindrical flow channel 450 extending in the vertical direction from the lower side to the upper side, and passes through the cylindrical flow channel 452 extending in the horizontal direction in the upper block 402. It reaches the piping port 412. As described above, the discharge branch pipe P24 is connected to the piping port 412, and the refrigerant returns to the main pipe P12 again through the discharge branch pipe P24.

  The control valve 414 provided in the valve block 406 is configured by, for example, an electromagnetic valve, and is opened and closed by a valve driving unit 460 configured by a coil. FIG. 11 is an enlarged view showing a sectional view taken along line AA of the temperature control head 400 when the control valve 414 is in a closed state, and FIG. 12 is a view showing the opened state.

  As shown in FIGS. 11 and 12, when the control valve 414 is closed by driving the valve driving unit 460, the valve main body 462 opens the opening 466 of the cylindrical channel 464 extending in the horizontal direction through the upper block 402. Close. This is the state of FIG. In the present embodiment, the valve body 462 is made of an elastic member such as rubber or elastic resin, and is closed to a necessary and sufficient level so that the refrigerant does not flow from the opening 466. On the other hand, when the control valve 414 is opened by driving the valve drive unit 460, the valve body 462 opens the opening 466 of the flow path 464 extending in the horizontal direction through the upper block 402. This is the state of FIG.

  When the control valve 414 is in the closed state, as described above, the refrigerant flows through the flow paths 416, 418, 420, 422, 426, 430, 450, 452, but when the control valve 414 is in the open state, In addition, another path also flows to form a bypass path that is discharged from the discharge branch P24.

  Specifically, as shown in FIG. 12, when the control valve 414 is in an open state, the refrigerant that has flowed through the flow path 416 passes through the cylindrical flow path 468 that extends in the horizontal direction through the upper block 402, and opens 466. Into the flow path 464. That is, it flows not only into the flow path 418 but also into the flow path 464. The refrigerant that has flowed into the flow path 464 joins the refrigerant that has flowed into the flow path 418 in the middle of the flow path 452 described above. Then, the merged refrigerant is discharged from the flow path 452 through the piping port 412 to the discharge branch P24.

  Thus, in the temperature adjustment head 400 according to the present embodiment, when the control valve 414 is in the open state, in addition to the refrigerant path flowing through the lower block 404 that is formed when the control valve 414 is in the closed state, the bypass route Is formed.

  The reason why the bypass path is formed in this manner is to prevent the refrigerant from boiling due to heat generated by the device under test DUT. That is, if the flow of the refrigerant in the temperature adjustment head 400 is completely stopped, the refrigerant in the temperature adjustment head 400 will boil due to the heat generated by the device under test DUT. In order to avoid this, in the present embodiment, the refrigerant in the temperature adjustment head 400 flows even when it is not necessary to lower the temperature of the device under test DUT.

  When the bypass path is formed, the refrigerant having the lowest flow rate also flows into the lower block 404, and the refrigerant flow in the lower block 404 does not stop. Further, since the device under test DUT does not need to be cooled, most of the refrigerant flows through the bypass path and is discharged from the discharge branch P24. Thereby, the cooling capacity to the device under test DUT in the temperature control head 400 can be changed without stopping the flow of the refrigerant in the temperature control head 400.

  Further, by forming the bypass path in this way, it is possible to avoid the device under test DUT from being abnormally overheated when the control valve 414 is damaged. For example, even if the control valve 414 is in an open state and does not operate, the amount of refrigerant flowing through the lower block 404 of the temperature control head 400 does not become zero, so abnormal overheating due to self-heating of the device under test DUT itself is prevented. It can be avoided. For this reason, by providing two paths for the refrigerant, the path to the lower block 404 and the bypass path, it is possible to achieve a safety design when the control valve 414 is damaged.

  Furthermore, a heater 470 is embedded in the lower block 404 of the temperature control head 400 according to the present embodiment. Specifically, two heater insertion holes 472 are formed in the lower block 404 in parallel in the horizontal direction, and the heaters 470 are inserted into the two heater insertion holes 472, respectively.

  As described above, the heater 470 is configured to be able to supply power from the heater power source 600. When power is supplied to the heater 470, the heater 470 generates heat and the lower block 404 is heated. When the device under test DUT is in contact with the lower block 404, the heat of the lower block 404 is transferred to the device under test DUT, and the device under test DUT is also heated.

  Furthermore, a temperature detection unit 480 is embedded in the lower block 404 of the temperature adjustment head 400 according to the present embodiment. Specifically, a sensor insertion hole 482 is formed in the lower block 404 in the horizontal direction, and a temperature sensor 484 is inserted from the sensor insertion hole 482.

  The tip of the temperature sensor 484 is inserted up to the center of the lower block 404. A sensor opening 488 is formed at the center of the lower block 404, and the sensor block 490 is inserted into the sensor opening 488. The sensor block 490 and the temperature sensor 484 constitute a temperature detection unit 480 according to this embodiment.

  A spring 492 is provided on the upper surface of the temperature detection unit 480 as a biasing member for biasing the sensor block 490 of the temperature detection unit 480 downward. Therefore, the sensor block 490 is urged downward, and when the lower block 404 is in contact with the device under test DUT, the sensor block 490 is also in close contact with the device under test DUT. As a result, the temperature of the device under test DUT is transmitted to the sensor block 490 and is detected by the temperature sensor 484.

  The temperature detected by the temperature sensor 484 is transmitted to the burn-in controller 200 as a detected temperature signal. The burn-in controller 200 specifies the temperature of the device under test DUT based on this detected temperature signal, and controls the temperature adjustment head 400. For example, the burn-in controller 200 supplies power to the heater 470 to heat it, and conversely reduces or stops the power supplied to the heater 470. Further, the burn-in controller 200 increases the flow rate of the refrigerant flowing into the lower block 404 with the control valve 414 closed, or conversely decreases the flow rate of the refrigerant flowing into the lower block 404 with the control valve 414 opened. .

  Further, as can be seen from FIGS. 9 and 10, the upper block 402 and the lower block 404 are sealed with a circumferential O-ring 494. That is, when the upper block 402 is fitted to the lower block 404, a circumferential gap 496 is formed between the outer peripheral portion of the upper block 402 and the inner peripheral portion of the lower block 404. By inserting an O-ring 494 into the gap 496, the space between the upper block 402 and the lower block 404 is sealed. The O-ring 494 is made of an elastic member such as rubber or elastic resin, and prevents the refrigerant from leaking from the gap between the upper block 402 and the lower block 404. Thus, since the O-ring 494 is formed in a circumferential shape, the pressure from the inside applied to the O-ring 494 can be evenly distributed, and the amount of crushing of the O-ring 494 can be reduced.

  FIG. 13 shows a graph of temperature change for explaining an example of temperature control performed in the burn-in apparatus 10. In the graph of FIG. 13, the horizontal axis indicates the elapsed time since the start of the burn-in test, and the vertical axis indicates the temperature detected by the temperature detection unit 480.

  As shown in FIG. 13, (1) immediately after the start of the burn-in test, the control valve 414 is closed and the refrigerant is supplied to the temperature control head 400 at a flow rate of 0.75 L / min. This stabilizes the initial temperature of the device under test DUT.

  When the state of the device under test DUT becomes stable, the burn-in apparatus 10 starts (2) power supply to the device under test DUT. When power is supplied to the device under test DUT, (3) the temperature of the device under test DUT rises due to self-heating. In the example of FIG. 13, the device under test DUT rises up to 80 ° C. and is stable. However, some devices under test DUT exceed 80 ° C., and conversely, some devices do not reach 80 ° C. In (3), the control valve 414 remains closed.

  Assuming that the inspection temperature of the burn-in test is, for example, 135 ° C., for the device under test DUT that has reached 80 ° C. or higher, the burn-in apparatus 10 maintains the closed state of the control valve 414 (0.75) The power supply to the heater 470 is started while the refrigerant flow rate of / min is secured, and temperature control by the heater 470 is started. As a result, (5) the temperature of the device under test DUT is raised to 135 ° C. and maintained.

  On the other hand, for the device under test DUT that did not reach 80 ° C., the burn-in apparatus 10 opens the control valve 414 and reduces the flow rate of the refrigerant flowing into the lower block 404 to 0.4 L / min. Power supply to the heater 470 is started, and temperature control by the heater 470 is started. As a result, (5) the temperature of the device under test DUT is raised to 135 ° C. and maintained. That is, when the device under test DUT has not reached 80 ° C., the temperature of the device under test DUT is easily increased by reducing the flow rate of the refrigerant.

As described above, according to the burn-in system 10 according to the present embodiment, the branch pipe P20 in parallel with the main pipe P12 which the refrigerant flows is provided. Thus providing the temperature adjusting head 400 in the middle of the branch pipe P20, and the main pipe P12 The refrigerant can be supplied to the temperature control head 400 in parallel. For this reason, compared with the case where a refrigerant | coolant flows through the temperature control head 400 connected in series sequentially, the deviation of the refrigerant temperature in each temperature control head 400 can be decreased, and the cooling capacity with respect to the device under test DUT is made uniform. Can be planned.

  Further, according to the burn-in device 10 according to the present embodiment, the flow rate of the refrigerant flowing into the lower block 404 of the temperature adjustment head 400 is controlled by controlling the open / closed state of the control valve 414, thereby controlling the flow rate of the refrigerant. Thus, the temperature of the device under test DUT is adjusted. That is, the temperature adjustment is mainly performed by controlling the flow rate of the refrigerant, and the temperature adjustment of the device under test DUT by the on / off control of the heater 470 is subordinate. By adopting such temperature control, it is possible to ensure a wide range of the current amount and the heat generation amount of the device under test DUT that can simultaneously perform the burn-in test. In other words, the device under test DUT in a wide range in which the power band is widened and the current amount and the heat generation amount are different can be burned in at the same time.

  Further, since the temperature of the device under test DUT is adjusted mainly by controlling the flow rate of the refrigerant in this way, the power consumption of the burn-in apparatus 10 can be reduced. That is, since the device under test DUT self-heats, if it is heated using a heater in addition to this self-heating and then cooled by the refrigerant, energy consumption increases. For this reason, if the temperature of the device under test DUT is adjusted by flow control using a refrigerant after utilizing the self-heating of the device under test DUT as in the present embodiment, the energy consumption can be reduced.

  Further, according to the burn-in device 10 according to the present embodiment, a plurality of circumferential flow paths 422, 426, and 430 are formed concentrically around the central portion of the lower block 404. The widths of 422, 426, and 430 can be secured relatively wide. For this reason, the pressure loss of the refrigerant flowing through the flow path can be reduced, and the load on the burn-in device 10 can be reduced.

  Furthermore, since the flow paths formed in the upper block 402 are all cylindrical flow paths in the horizontal direction or cylindrical flow paths extending in the vertical direction, the flow paths are formed in the upper block 402. Cutting can be facilitated.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, the arrangement of the main pipes P10, P12, P14 and the arrangement of the branch pipe P20 are arbitrary, and can be variously modified in order to supply the refrigerant to the temperature adjustment head 400 in parallel.

  The layout of the refrigerant flow path in the temperature control head 400 described above is merely an example, and various changes can be made based on the shape and size of the temperature control head 400.

  Further, the heating function in the temperature control head 400 is not always necessary, and when the device under test DUT has a large amount of self-heating, the heating function by the heater 470 can be omitted.

  In the above-described embodiment, the case where the present invention is applied to the burn-in apparatus 10 has been described as an example. However, the present invention is not limited to the burn-in apparatus 10 and is applied to various temperature control apparatuses having the temperature adjustment head 400. Is possible.

1 is an overall front view of a burn-in device according to an embodiment. The right view in the burn-in apparatus of FIG. The figure which shows an example of the layout of the burn-in board inserted in the burn-in apparatus of FIG. The figure which shows an example of the layout of the temperature control board provided in the burn-in apparatus of FIG. The block diagram explaining the system configuration | structure of the burn-in apparatus of FIG. FIG. 5 is a perspective view of a temperature adjustment head provided on the temperature adjustment board of FIG. 4. The top view of the temperature control head of FIG. The top view of the lower block in the temperature control head of FIG. AA line sectional view in the temperature control head of FIG. FIG. 8 is a sectional view taken along line BB in the temperature control head of FIG. 7. FIG. 10 is an enlarged view of FIG. 9 when the control valve is in a closed state. The enlarged view of FIG. 9 in case a control valve is an open state. The figure which shows an example of the graph of the temperature change at the time of performing a burn-in test with the burn-in apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Burn-in apparatus 20 Constant temperature bath 30 Slot 40 Door 50 Connector 100 Socket 110 Edge connector 200 Burn-in controller 300 Temperature adjustment board 400 Temperature adjustment head 500 Chiller DUT Device under test BIB Burn-in board

Claims (8)

A plurality of burn-in board can be mounted to the device under test is inserted, and the slot,
A plurality of temperature control heads, each provided corresponding to each of the plurality of devices under test of the burn-in board inserted into the slot, contacting the plurality of devices under test, A plurality of temperature control heads for cooling the device under test;
A main pipe for circulating the refrigerant sent from the refrigerant cooling device for cooling the refrigerant and returning the refrigerant to the refrigerant cooling device again;
A plurality of branch pipes provided one by one corresponding to each of the plurality of temperature control heads, each of the plurality of branch pipes being provided in parallel with the main pipe, and supplying the refrigerant from the main pipe to the temperature A plurality of branch pipes for supplying to the adjustment head and returning to the main pipe again;
A burn-in device comprising: The branch pipe is configured to include a supply branch pipe that supplies a refrigerant from the main pipe to the temperature control head, and a discharge branch pipe that returns the refrigerant discharged from the temperature control head to the main pipe.
The temperature control head includes a lower block that comes into contact with a device under test,
The refrigerant supplied from the supply branch pipe is supplied to the central portion of the lower block, flows through a flow path formed to flow from the central portion toward the outer peripheral direction of the lower block, and the discharge branch pipe The burn-in device according to claim 1, wherein the burn-in device is discharged from the vehicle. The flow path is constituted by a circumferential flow path arranged concentrically around the central portion of the lower block,
3. The burn-in according to claim 2 , wherein the refrigerant flows in an outer circumferential direction of the lower block through an opening connected from the inner circumferential channel to the outer circumferential channel. 4. apparatus. Inside the circumferentially opposite positions from the flow path opening that flows into the refrigerant circumferential shape, opening leading to the flow path of the outer circumferential shape is formed, it in claim 3, wherein The burn-in device described. In addition to the refrigerant flow path to the lower block, the temperature adjustment head has a bypass path through which the refrigerant flows.Even through the bypass path, the refrigerant supplied from the supply branch pipe is Being discharged into the discharge branch,
The burn-in device according to any one of claims 2 to 4 , wherein the temperature adjustment head further includes a control valve that controls a flow of the refrigerant to the bypass path. 6. The burn-in device according to claim 5 , wherein when the control valve is in an open state, the refrigerant flows through the flow path to the lower block and also flows through the bypass path. The control valve has two states, an open state and a closed state,
When the control valve is in the open state, the refrigerant flows through the flow path to the lower block and also flows through the bypass path.
When the control valve is closed, the refrigerant flows through the flow path to the lower block, but does not flow into the bypass path.
The burn-in apparatus according to claim 5 . The heater is embedded in the temperature control head, and the device under test in contact with the temperature control head can be heated by generating heat from the heater. The burn-in device according to any one of claims 1 to 7 .

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