KR101373489B1 - Test handler - Google Patents

Abstract

A test handler for testing electronic components includes: an upper and a lower test chamber which are stacked in a vertical direction and have a separate space to test a tray where a plurality of electronic components are loaded; an upper and a lower soak chamber which are connected to the upper and the lower test chamber respectively, and the electronic components heated or cooled down in advance; and an upper and a lower de-soak chamber which are connected to the upper and the lower test chamber respectively and controls the temperature of the electronic components of which the testing is completed on the upper and lower test chamber to room temperature. The upper and the lower test chamber are separated by an insulating partition. Accordingly, it is possible to perform test processes under different temperature conditions on the upper and the lower test chamber.

Description

Test handler

Embodiments of the present invention relate to a test handler for inspecting electronic components. More particularly, it relates to a test handler that connects electronic components to test sockets of a tester to inspect electronic components such as semiconductor devices.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be manufactured as a finished product through a dicing process, a bonding process, and a packaging process .

The semiconductor devices manufactured as described above can be judged as good or defective through electrical property inspection. For the electrical characteristic inspection, a test handler for handling the semiconductor elements and a tester for inspecting the semiconductor elements may be used.

The electrical characteristic inspection can be performed through electrical connection with the tester in a state where a plurality of semiconductor elements are housed in a test tray. In particular, the test handler may include a test chamber for performing the inspection process, a test board for electrically connecting the electronic components and the tester, and a test tray in which the electronic components are accommodated. And a pressurizing device for closely contacting the test board, and a device for controlling the temperature of the electronic components.

As an example, the test handler may include upper and lower test chambers to shorten the inspection time, and an inspection process is performed on electronic components housed in the test tray in respective upper and lower test chambers. Can be. In particular, the inspection process for the electronic components may be classified into a high temperature process and a low temperature process, and a temperature control gas may be supplied into the upper and lower test chambers to perform the high temperature process and the low temperature process.

However, in the case of the conventional test handler as described above, since the temperature atmosphere of the upper test chamber and the lower test chamber cannot be controlled separately, the high temperature process and the low temperature process cannot be simultaneously performed, and in particular, the low temperature after the high temperature process is performed. When switching to a process, or vice versa, it may take considerable time to change the temperature atmosphere inside the upper and lower test handlers. As a result, the operation rate of the test handler can be greatly reduced.

Embodiments of the present invention provide a test handler capable of independently controlling the temperature atmosphere inside the test chambers in order to solve the above problems.

The test handler according to the embodiments of the present invention for achieving the above object, the upper and lower test chambers each having a separate space for performing the inspection process for the tray containing a plurality of electronic components are stacked in the vertical direction And upper and lower inner chambers respectively connected to the upper and lower test chambers and for preheating or cooling the electronic components, and the upper and lower test chambers respectively connected to the upper and lower test chambers. In and may include upper and lower desorption chambers for adjusting the temperature of the inspected electronic components to room temperature. Here, the upper and lower test chambers may be isolated from each other by an insulating barrier.

According to embodiments of the present invention, a first shutter for isolating between the upper and lower inner chambers and a second shutter for isolating between the upper and lower lower chambers may be provided.

According to embodiments of the present invention, a third shutter may be provided to isolate between the upper and lower test chambers and the upper and lower di-speed chambers.

According to embodiments of the present disclosure, each of the upper and lower test chambers may include: a match plate provided with pushers for pressing the electronic components to closely contact the electronic components stored in the tray with the test sockets of a tester; A duct disposed at the rear of the match plate may be provided to provide a temperature control gas for controlling the temperature of the electronic components.

According to embodiments of the present invention, a temperature control unit for providing the temperature control gas through the duct may be provided.

According to embodiments of the present invention, the temperature control unit includes an upper heater and an upper cooler connected to the upper duct inside the upper test chamber, and a lower heater and a lower cooler connected to the lower duct inside the lower test chamber. can do.

According to embodiments of the invention, the temperature control unit, the upper fan for supplying the temperature control gas to the upper duct through the upper heater and the upper cooler, and the temperature to the lower duct through the lower heater and the lower cooler It may further include a lower fan for supplying a control gas.

According to embodiments of the present invention, the temperature control unit further includes a common fan for supplying gas for temperature control to the upper duct and the lower duct, respectively, through the upper heater and the upper cooler and the lower heater and the lower cooler. can do.

According to the embodiments of the present invention as described above, the upper and lower test chambers can be thermally isolated by the insulating barrier, so that they can be temperature controlled independently, and thus different temperatures in the upper and lower test chambers. Each inspection process can be carried out under conditions.

As a result, it is not necessary to change the temperature atmosphere inside the upper and lower test chambers to perform the high temperature process and the low temperature process for the electronic components, thereby eliminating the time required for the temperature atmosphere change. . For example, one of the upper and lower test chambers may be used to perform a high temperature process, and the other may be used to perform a low temperature process, so that the operation rate of the test handler may be greatly improved.

1 is a schematic block diagram illustrating a test handler according to an embodiment of the present invention.
FIG. 2 is a schematic side view for explaining the upper and lower inner chambers shown in FIG. 1.
FIG. 3 is a schematic cross-sectional view for describing the upper and lower test chambers shown in FIG. 1.
FIG. 4 is a schematic configuration diagram illustrating a temperature chamber connected to the test chambers and the test chambers shown in FIG. 1.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

1 is a schematic block diagram illustrating a test handler according to an embodiment of the present invention.

Referring to FIG. 1, the test handler 100 according to an embodiment of the present invention may be used for electrical inspection of electronic components 10 such as a memory semiconductor. In particular, the test handler 100 may be used to perform an inspection process on the electronic components 10 with the electronic components 10 stored in a tray 20, for example, a test tray. have.

As illustrated in FIG. 1, the test handler 100 may include upper and lower test chambers 110 and 120 for performing an inspection process on the electronic components 10. The electronic components 10 may be transferred to the upper and lower test chambers 110 and 120 while being accommodated in the tray 20.

The upper and lower test chambers 110 and 120 may have separate spaces for performing an inspection process on the electronic components 10, respectively, and may be stacked in a vertical direction as shown.

Upper and lower inner chambers 140 and 142 may be connected to one side of the upper and lower test chambers 110 and 120 to adjust the temperature of the electronic components 10 in advance. The upper and lower inner chambers 140 and 142 may be used to preheat or cool the electronic components 10, and the electronic components 10 may be stored in the tray 20. It may be provided to the lower test chambers (110, 120), respectively.

In addition, the other side of the upper and lower test chambers (110, 120), the upper and lower dichroic chambers (150, 152) for controlling the temperature of the electronic components 10 inspected in the upper and lower test chambers (110, 120) to room temperature ) May be connected.

The tray 20 in which the electronic components 10 are accommodated is mounted in the vertical direction via the upper and lower test chambers 110 and 120 from the upper and lower inner chambers 140 and 142. It may be sent to the chambers 150, 152. For example, the two trays 20 may be transferred in a first conveying direction, that is, in a direction in which the inner chambers 140 and 142, the test chambers 110 and 120, and the secondary chambers 150 and 152 are arranged. An inspection process may be performed on the electronic components 10 accommodated in the two trays 20 in the upper and lower test chambers 110 and 120.

FIG. 2 is a schematic side view for explaining the upper and lower inner chambers shown in FIG. 1.

Referring to FIG. 2, the trays 20 in which the plurality of electronic components 10 are accommodated may be supplied into the lower inner chamber 142 in a vertical state, and are arranged in a line. As described above, it may be conveyed in a second conveyance direction perpendicular to the first conveyance direction.

One of the trays 20 transported in the second transport direction as described above may be transported in the vertical direction. That is, one of the trays 20 may be transferred to the upper inner chamber 140, and the tray 20 transferred to the upper inner chamber 140 and the subsequent one of the trays 20. The tray 20 may be transferred to the upper and lower test chambers 110 and 120, respectively.

Similarly, after the inspection process is completed in the upper and lower test chambers 110 and 120, the trays 20 may be transferred to the upper and lower dichroic chambers 150 and 152, respectively, and the upper dichroic chamber 150 may be used. The tray 20 transferred to) may be transferred to the lower desorption chamber 152. The inspected trays 20 as described above may be transported in the opposite direction with respect to the second transport direction to be taken out from the lower de-cooled chamber 152.

Although not shown, the test handler 100 may include a plurality of tray transfer devices (not shown) for transferring the trays 20. Examples of the tray conveying apparatuses are Korean Patent Publication Nos. 10-2009-0019401, 10-2009-0122646, 10-2010-0045030, 10-2010-0106096, filed and published by the applicant. 10-2012-0000665 and the like, and since it is well known in the art, further detailed description thereof will be omitted.

Referring back to FIG. 1, the upper and lower test chambers 110 and 120 may each have independent test spaces. For this purpose, the upper and lower test chambers 110 and 120 may be isolated from each other by an insulating barrier 102. Can be.

As a result, since the inspection spaces of the upper and lower test chambers 110 and 120 can be thermally sufficiently isolated by the adiabatic partition 102, the high temperature process and the low temperature process are performed in the upper and lower test chambers 110 and 120. It can be done separately. That is, if necessary, a high temperature process may be performed in one of the upper and lower test chambers 110 and 120, and a low temperature process may be performed in the other, so as to switch between a high temperature process and a low temperature process as in the prior art. This is not necessary, and thus the time required for switching between the high temperature process and the low temperature process can be eliminated.

Meanwhile, a first shutter 144 may be provided to isolate the upper and lower inner chambers 140 and 142 to sufficiently thermally isolate the upper and lower test chambers 110 and 120. A second shutter 154 may be provided between the upper and lower di-speed chambers 150 and 152.

In addition, a third shutter 160 may be provided to isolate between the upper and lower test chambers 110 and 120 and the upper and lower dichroic chambers 150 and 152. In this case, the first, second and third shutters 144, 154, 160 are preferably made of a heat insulating material. As shown, one third shutter 160 is shown, but between the upper test chamber 110 and the upper desorption chamber 150 and the lower test chamber 120 and the lower desorption chamber 152. Each of the third shutters 160 may be provided therebetween.

FIG. 3 is a schematic cross-sectional view for describing the upper and lower test chambers shown in FIG. 1, and FIG. 4 is a schematic for explaining the temperature chambers connected to the test chambers and the test chambers shown in FIG. 1. Phosphorus composition diagram.

3 and 4, according to an embodiment of the present invention, each of the upper and lower test chambers 110 and 120 may be connected to the electronic components 10 to electrically connect the electronic components 10. It can be connected to a tester (city) for inspection. The tester may be connected to a test board 30 provided at one side of the upper and lower test chambers 110 and 120, and the test board 30 may include a plurality of electrical connections for the electronic components 10. Test sockets 32 may be provided.

In addition, each of the upper and lower test chambers 110 and 120 presses the electronic components 10 to closely contact the test sockets 32 with the electronic components 10 stored in the tray 20. Match plate 114 having a plurality of pushers 112 and a duct 116 disposed at the rear of the match plate 114 to provide a temperature control gas for controlling the temperature of the electronic components 10. ) May be provided.

The ducts 116 and 126 and the match plates 114 and 124 disposed in the upper and lower test chambers 110 and 120 may be connected to the driving unit 130 provided outside the upper and lower test chambers 110 and 120. The match plates 114 and 124 may press the electronic components 10 by the driving unit 130. As shown, the ducts 116 and 126 and the match plates 114 and 124 are driven by using a single drive unit 130, but the ducts 116 and 126 and the match plates 114 and 124 are separate drives, respectively. It can also be driven by.

Although not shown in detail, the temperature control gas may control the temperature of the pushers 112, and as a result, the temperature of the electronic components 10 pressurized by the pushers 112 may be adjusted. have.

As described above, the temperature control gas supplied to the upper and lower ducts 116 and 126 disposed in the upper and lower test chambers 110 and 120 may discharge the exhaust holes 118 and 128 provided in the upper and lower ducts 116 and 126. Through the upper and lower test chambers (110, 120) may be provided, and may be discharged from the upper and lower test chambers (110, 120).

Air or an inert gas may be used as the temperature control gas, and may be circulated by the temperature controller 165 connected to the upper and lower test chambers 110 and 120.

As an example, the test handler 100 may include a first temperature controller 170 connected to the upper test chamber 110 and a second temperature controller connected to the lower test chamber 120 as shown in FIG. 4. 180).

The first temperature controller 170 may include an upper heater 171 and an upper cooler 173 connected to the upper duct 116, and the second temperature controller 180 may include the lower duct ( 126 may include a lower heater 181 and a lower cooler 183.

In addition, the first temperature control unit 170 may include an upper fan 175 for circulating the gas for controlling the temperature via the upper duct 116 and the upper test chamber 110, the second The temperature controller 180 may include a lower fan 185 for circulating the gas for controlling temperature via the lower duct 126 and the lower test chamber 120.

The first temperature controller 170 may include a first supply pipe 176 and the first supply pipe 176 connecting the upper duct 116 through the upper fan 175, the upper heater 171, and the upper cooler 173. A first exhaust pipe 177 connecting the upper test chamber 110 and the upper fan 175 may be provided. In particular, the first temperature controller 170 is branched from the first supply pipe 176 and connected to the upper inner chamber 140 to control the temperature inside the upper inner chamber 140. The apparatus may further include a supply pipe 178 and a first branch exhaust pipe 179 connecting the upper inner chamber 140 and the first exhaust pipe 177.

Similar to the above, the second temperature control unit 180 may include a second supply pipe 186 and a second exhaust pipe 187, and also the second branch supply pipe 188 and the second branch exhaust. The pipe 189 may further include.

According to another embodiment of the present invention, the temperature control unit 165 may be implemented using one fan. For example, the temperature control unit 165 may include a common fan (not shown), and the shared fan is temperatured to the upper duct 116 through the upper heater 171 and the upper cooler 173. The control gas may be supplied, and the gas for temperature control may be supplied to the lower duct 126 through the lower heater 181 and the lower cooler 183.

According to an embodiment of the present disclosure, the test handler 100 may include third and fourth temperature controllers 190 and 192 for controlling the temperatures of the upper and lower de-combustion chambers 150 and 152. The third and fourth temperature controllers 190 and 192 have a fan, a heater, and a cooler, respectively, similar to the first and second temperature controllers 170 and 180 to supply the temperature control gas to the upper and lower dichroic chambers 150 and 152. Each can be cycled through. In addition, according to another embodiment of the present invention, the test handler 100 further includes separate fifth and sixth temperature controllers (not shown) for adjusting the temperature of the upper and lower chambers 140 and 142. It may also include.

According to the embodiments of the present invention as described above, since the upper and lower test chambers 110 and 120 are thermally isolated by the adiabatic partition 102, each of the upper and lower test chambers may be independently temperature controlled. In the lower test chambers 110 and 120, an inspection process may be performed at different temperature conditions.

As a result, it is not necessary to change the temperature atmosphere inside the upper and lower test chambers 110 and 120 in order to perform the high temperature process and the low temperature process for the electronic components 10, and thus, it is necessary to change the temperature atmosphere. You can eliminate the time it becomes. For example, since one of the upper and lower test chambers 110 and 120 may be used to perform a high temperature process, and the other may be used to perform a low temperature process, the operation rate of the test handler 100 is greatly increased. Can be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: electronic component 20: tray
30: test board 32: test socket
100: test handler 102: thermal insulation bulkhead
110: upper test chamber 112: pusher
114: match plate 116: upper duct
120: lower test chamber 124: match plate
126: lower duct 130: drive unit
140: upper inner chamber 142: lower inner chamber
144: First Shutter 150: Upper Di-Speed Chamber
152: Lower Dichroic Chamber 154: Second Shutter
160: third shutter 165: temperature control unit
170: first temperature controller 180: second temperature controller
190: third temperature controller 192: fourth temperature controller

Claims (8)

Upper and lower test chambers each having a separate space for performing an inspection process with respect to a tray containing a plurality of electronic components, stacked in a vertical direction;
Upper and lower inner chambers connected to the upper and lower test chambers, respectively, to preheat or cool the electronic components; And
Comprising upper and lower test chambers respectively connected to the upper and lower test chambers for adjusting the temperature of the electronic components tested in the upper and lower test chambers to room temperature,
The upper and lower test chambers are isolated from each other by an insulating barrier,
In each of the upper and lower test chambers,
A match plate provided with pushers for pressing the electronic components in close contact with the test sockets of the tester; And
And a duct disposed at the rear of the match plate and provided with a gas for controlling temperature for controlling the temperature of the electronic components. The test handler of claim 1, further comprising a first shutter for isolating between the upper and lower inner chambers and a second shutter for isolating between the upper and lower lower chambers. The test handler of claim 1, further comprising at least one third shutter for isolating between the upper and lower test chambers and the upper and lower deschedule chambers. delete The test handler of claim 1, further comprising a temperature controller configured to provide the temperature control gas through the duct. The method of claim 5, wherein the temperature control unit,
An upper heater and an upper cooler connected to an upper duct inside the upper test chamber; And
And a lower heater and a lower cooler connected to the lower duct inside the lower test chamber. The method of claim 6, wherein the temperature control unit,
An upper fan for supplying a temperature control gas to the upper duct through the upper heater and the upper cooler; And
And a lower fan for supplying a temperature control gas to the lower duct through the lower heater and the lower cooler. The method of claim 6, wherein the temperature control unit,
And a common fan for supplying a temperature control gas to the upper duct and the lower duct through the upper heater, the upper cooler, and the lower heater and the lower cooler, respectively.

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